JP3879363B2 - ID card manufacturing method - Google Patents

Description

次に、離型層１８Ｂ上に以下の紫外線硬化型の組成物を順次、ワイヤーバーにより塗布し乾燥させた。硬化後の膜厚が０．４μｍ，０．５μｍ，１．５μｍ，２．０μｍ，３．０μｍ，４．５μｍ，５．０μｍになるように組成物の塗布量を調整した。

その後、離型層１８Ｂ上の塗布物に紫外線を照射（８０Ｗ／cm：５ｍ／秒）して硬化することにより、硬化型保護層（転写箔）１２を形成した。
【０１５３】
次に、硬化型保護層１２上に中間層１９及びプライマー層２０として以下の組成物を順次、ワイヤーバーにより塗布し乾燥した。
中間層 乾燥膜厚 ０．５μｍ
ポリビニルブチラール ７０部
イソシアネート ３０部
メチルエチルケトン ７００部
プライマー層 乾燥膜厚 ０．５μｍ
ポリビニルブチラール ５０部
ＳＥＢＳエラストマー ５０部
メチルエチルケトン ３５０部
トルエン ３５０部
その後、プライマー層２０上に以下の接着部材をワイヤーバーにより塗布し乾燥して接着層１４を形成した。
接着層 乾燥膜厚 １μｍ
ウレタン変成オレフィン樹脂（東邦化学工業製：ハイテックＳ８５２９）１００部
これにより、熱転写シート２００を得た。
【０１５４】
▲２▼ 顔画像及び文字記録画像を有するカード基板の作成例
図２に示した支持体１１Ｃとして３５０μｍのポリエチレンテレフタレートの両面に、クッション層１１Ｂ及び１１Ｄとして５０μｍの白色ポリプロピレン（三菱油化製：ナープレンＦＬ２５ＨＡ）から成る白色ポリプロピレン層を熱有着して４５０μｍの複合支持体１１Ｂ〜１１Ｄを得た。また、裏面側には以下の組成物からなる筆記層１１Ａを乾燥膜厚４０μｍになるようにワイヤーバー塗布により設けた。
コロイダルシリカ ２．５部
ゼラチン ７．２部
ジクロルトリアジン硬化剤 ０．３部
水 １００部
更に、表面側にはポリビニールブチラール（積水化学製：ＢＸ１）１０部、メチルエチルケトン９０部からなる熱昇華型受像層１１Ｅを乾燥膜厚５μｍとなるように、ワイヤーバー塗布して形成し、熱昇華型受像シート付きのカード基板を形成した。この熱昇華型受像シートに市販の熱昇華型カラーインクシートを用いてサーマルヘッドプリンタにより顔画像及び氏名等の文字記録画像を印字して顔画像と文字記録画像を表面に有する顔画像入りのカード基板１１を作成した。
【０１５５】
▲３▼ 硬化型保護層付きのＩＤカード１００の作成例
以上のように作成したカード基板１１の表面側と熱転写シート２００の接着層１４側とを対面させ、転写箔裏面側から加熱するようにして熱ヒートローラ２７（転写温度１９０℃、搬送速度５ｃｍ／分、圧力１０ｋｇ）を通過させ、熱圧着後に熱転写シート２００から支持体１６を剥離することで、硬化型保護層付きの顔画像入りのＩＤカード１００を得た。
【０１５６】
▲４▼ 硬化型保護部材１２の加工性とカード基板の表面保護の両立性の評価
この例では上記の製造条件で作成した７種類の膜厚の硬化型保護部材１２を以下の剥離条件でカード基板１１に転写してＩＤカード１００を作成した。このときの硬化型保護層１２の膜厚と硬度との関係において、カード基板表面の耐擦過性及びバリの発生の有無を評価した。
剥離条件： 剥離角θ＝３０°
この際のＩＤカード１００の耐擦過性に関しては、カード表面の硬化型保護層１２をカナキン３号白布を用いて１ｋｇ／ｃｍ2 の荷重で１０００回擦り、耐擦過性を評価した。バリに関しては、ＩＤカード１００の端部から凹凸状の転写箔残留片がはみ出しているか否かを目視評価によって行った。
【０１５７】
この結果、図２８に示す表図が得られた。図２８は硬化型保護部材１２のバリの発生有無とカード基板の表面保護の両立性の評価例を示す表図である。図２８において、二重マル印は「耐擦過性及びバリに関して全く問題なし」、丸印は「ほぼ問題なし」、三角印は「バリが発生するが支障はない」、及び、×印は「傷やバリが発生する」を示している。
【０１５８】
この実験結果によれば、硬化型保護層１２の膜厚ＴｈがＴｈ＜０．５μｍときはバリが発生するが支障はない。しかしながら、Ｔｈ＜０．５μｍときは硬度Ｂ〜４Ｈに関していずれも耐擦過性が劣化し、カード表面に傷が残ったり、剥離時に顔画像形成領域などにダメージを与える原因となる。
【０１５９】
また、膜厚ＴｈがＴｈ≧５．０μｍときは硬度Ｂを除いて耐擦過性にはほぼ問題がないが、硬度ＨＢ〜４Ｈに関して例えば３００μｍ以上のバリが発生し、バリ除去のための別途な工程を導入しなければならない。
【０１６０】
従って、硬化型保護層１２の膜厚Ｔｈを０．５μｍ＜Ｔｈ＜５．０μｍに規定することにより、その保護部材形成時における加工性を悪化させることなく、しかも、カード基板上の表面保護性に優れ、かつ、耐擦過性（耐摩耗性）に優れたＩＤカード１００を提供できることが明らかになった。
【０１６１】
▲５▼ 硬化型保護部材１２の膜厚Ｔｈと転写温度Ｔｘとの関係評価
この例では上記の製造条件において、以下の５種の転写温度Ｔｘを変えて作成した硬度３Ｈの７種類の膜厚Ｔｈの硬化型保護部材１２を上述の剥離条件でカード基板１１に転写してＩＤカード１００を作成した。このときの硬化型保護層１２の膜厚と転写温度との関係において、カード基板表面の膜付き性及びバリの発生の有無を評価した。
【０１６２】
転写温度Ｔｘ： ９０℃，１００℃，１９０℃，２３０℃，２５０℃
この際のＩＤカード１００の膜付き性に関しては、カード表面の硬化型保護層１２をカッターナイフで２ｍｍ間隔に傷を付け、表面を粘着テープ（ニチバン＃４０５）を接着させ、剥離角度１８０°で硬化型保護層１２を素早く剥離を行いカード表面を目視評価した。バリの評価方法に関しては上述した通りである。
【０１６３】
この結果、図２９に示す表図が得られた。図２９は硬化型保護部材１２の膜厚Ｔｈと転写温度Ｔｘとの関係評価例を示す表図である。図２９において、二重マル印は「膜付き性及びバリに関して全く問題なし」、丸印は「ほぼ問題なし」、三角印は「バリが発生するが支障はない」、及び、×印は「剥離容易及びバリが発生する」を示している。
【０１６４】
この実験結果によれば、硬化型保護層１２の膜厚ＴｈがＴｈ＜０．５μｍときはバリが発生するが支障はない。しかしながら、Ｔｈ＜０．５μｍときは転写温度Ｔｘ関して９０℃，１００℃，１９０℃，２３０℃，２５０℃のいずれの場合も膜付き性が劣化し、カード表面から硬化型保護層１２が容易に剥がれてしまったり、転写時に支持体が変形する原因となる。
【０１６５】
また、膜厚ＴｈがＴｈ≧５．０μｍときは転写温度９０℃及び２５０℃を除いて膜付き性はほぼ問題がないが、転写温度Ｔｘ関して９０℃，１００℃，１９０℃，２３０℃，２５０℃のいずれの場合も、例えば３００μｍ以上のバリが発生し、バリ除去のための別途な工程を導入しなければならない。
【０１６６】
従って、硬化型保護層１２の膜厚Ｔｈを０．５μｍ＜Ｔｈ＜５．０μｍに規定すると共に、転写温度Ｔｘを９０℃＜Ｔｘ＜２５０℃に規定することにより、その保護部材形成時における加工性を悪化させることなく、しかも、カード基板上の表面保護性に優れ、かつ、高膜付き性に優れたＩＤカード１００を提供できることが明らかになった。
【０１６７】
▲６▼ 硬化型保護部材１２の膜厚Ｔｈと支持体１６への接着力（剥離力）Ｆｂとの関係評価
この例では上記の製造条件において接着層１４の厚みを調整すると共に、硬化型保護部材１２の膜厚Ｔｈと５つの接着力Ｆｂとの関係を調整し、硬度３Ｈの７種類の膜厚の硬化型保護部材１２を以下の剥離条件でカード基板１１に転写してＩＤカード１００を作成した。このときの硬化型保護層１２の膜厚Ｔｈと接着力Ｆｂとの関係において、カード基板端面のバリの発生の有無を評価した。
剥離条件： 剥離角θ＝１３５°
接着力： ０．５ｇ／cm，２．５ｇ／cm，５．０ｇ／cm，１０ｇ／cm
２５ｇ／cm
この際のＩＤカード１００のバリの発生有無の評価方法に関しては上述した通りである。この結果、図３０に示す表図が得られた。図３０は硬化型保護部材１２の膜厚Ｔｈと支持体１６への接着力（剥離力）Ｆｂとの関係評価例を示す表図である。図３０において、二重マル印は「バリに関して全く問題なし」、丸印は「ほぼ問題なし」、三角印は「バリが発生するが支障はない」、×印は「バリが発生する」、及び、黒三角印は「転写不能」を示している。
【０１６８】
この実験結果によれば、硬化型保護層１２の膜厚ＴｈがＴｈ＝０．５μｍときは、接着力Ｆｂ＝０．５ｇ／cm及び２５ｇ／cmを除いてほぼ「問題なし」である。しかしながら、膜厚ＴｈがＴｈ＜０．５μｍときは接着力Ｆｂ＝０．５ｇ／cm及び２．５ｇ／cmでややバリが発生し、接着力Ｆｂ＝５ｇ／cm、１０ｇ／cm及び２５ｇ／cmで転写不良となる。
【０１６９】
また、膜厚ＴｈがＴｈ≧５．０μｍときは、ほぼ接着力Ｆｂが０．５ｇ／cm，２．５ｇ／cm，５．０ｇ／cm，１０ｇ／cm，２５ｇ／cmのいずれの場合も、例えば３００μｍ以上のバリが発生し、バリ除去のための別途な工程を導入しなければならない。
【０１７０】
従って、硬化型保護層１２の膜厚Ｔｈを０．５μｍ＜Ｔｈ＜５．０μｍに規定すると共に、接着力Ｆｂを０．５ｇ／cm＜Ｆｂ＜２５ｇ／cmに規定することにより、その保護部材形成時における加工性を悪化させることなく、しかも、カード基板上の表面保護性に優れ、かつ、耐擦過性（耐摩耗性）に優れたＩＤカード１００を提供できることが明らかになった。
【０１７３】
【発明の効果】
以上説明したように、本発明のＩＤカードの製造方法によれば、記録画像が形成された面のカード基板上にほぼ透明性の硬化型保護部材を転写することにより、膜厚が０．５μｍ乃至５．０μｍに規定され、その接着力Ｆｂが０．５ｇ／ cm ＜Ｆｂ＜２５ｇ／ cm に規定された硬化型保護層をカード基板上に形成するようになされる。
【０１７４】
この構成によって、カード基板上の表面保護性を低下させることなく、硬化型保護層のカード外端部でのバリの発生を無くすことができる。これにより、耐擦過性に優れたＩＤカードを歩留まり良くかつ再現性良く製造することができる。
【０１７７】
この発明は偽変造防止等が要求される接触式又は非接触式の電子カードや磁気カードに適用して極めて好適である。
【図面の簡単な説明】
【図１】実施形態としてのＩＤカード１００の構造例を示す斜視図である。
【図２】顔画像入りカード１０１の積層構造例を示す断面図である。
【図３】Ａ及びＢは、他の顔画像入りカード１０２及び１０３の積層構造例を示す断面図である。
【図４】Ａは、ＩＤカード１００の硬化型保護層１２の平面及びＢはその断面の構成例（その１）を示すイメージ図である。
【図５】Ａは、ＩＤカード１００の硬化型保護層１２の平面、及び、Ｂはその断面の構成例（その２）を示すイメージ図である。
【図６】他の顔画像入りカード１０４の硬化型保護層１２の平面の構成例を示すイメージ図である。
【図７】実施形態としての熱転写シート２００の積層構造例を示す断面図である。
【図８】熱転写シート２００のハーフカット例を示す概念図である。
【図９】Ａ〜Ｃは、実施形態としての熱転写シート２００の形成例を示す工程図である。
【図１０】Ａは、ホットスタンプフィルム３２の形成工程例を示す斜視図、Ｂは、ホログラム像形成時の構成例を示す一部断面図である。
【図１１】Ａは、ラミネートフィルム３３の形成工程例（その１）を示す斜視図、Ｂは、ホログラム像形成時の構成例を示す一部断面図である。
【図１２】ラミネートフィルム３３の形成工程例（その２）を示す斜視図である。
【図１３】Ａ〜Ｃは、実施形態としてのＩＤカード１００の形成工程例を示す断面図である。
【図１４】カード基板１１と熱転写シート２００との位置合わせ例を示す概念図である。
【図１５】実施形態としてのＩＤカードの製造装置３００の構成例を示す概念図である。
【図１６】実施形態としての転写用カートリッジ４００の構成例を示す斜視図である。
【図１７】ホットスタンプ装置５００の構成例を示す概念図である。
【図１８】他の転写用のカートリッジ４０１の構成例を示す断面図である。
【図１９】Ａ及びＢは他の転写用のカートリッジ４０２の折曲げ機構５０の構成例を示す断面図である。
【図２０】Ａ及びＢは他の転写用カートリッジ４０３の折曲げ機構７０の構成例を示す断面である。
【図２１】Ａ及びＢは他の転写用カートリッジ４０４の折曲げ機構８０の構成例を示す断面図である。
【図２２】他の折曲げ機構９０の構成例を示す概念図である。
【図２３】Ａ及びＢは他の折曲げ機構９０の動作例を示す概念図である。
【図２４】２台のホットスタンプ装置５０Ａ及び５０Ｂによる処理例（直列）を示す概念図である。
【図２５】熱転写シート２００の積層例を示す工程図である。
【図２６】２台のホットスタンプ装置５０Ａ及び５０Ｂによる処理例（並列）を示す概念図である。
【図２７】各実施例に係る熱転写シート２００の積層例を示す断面図である。
【図２８】硬化型保護部材１２の加工性とカード基板の表面保護の両立性の評価例を示す表図である。
【図２９】硬化型保護部材１２の膜厚Ｔｈと転写温度Ｔｘとの関係評価例を示す表図である。
【図３０】硬化型保護部材１２の膜厚Ｔｈと支持体１６への接着力（剥離力）Ｆｂとの関係評価例を示す表図である。
【符号の説明】
１１ カード基板
１２ 硬化型保護層（硬化型保護部材）
１３ ホログラム像
１４ 接着層（接着シート）
１６ 支持体
２１ テープ収容部（筐体）
２２ 従動ローラ部（棒状体）
２４ カード浮上防止板（突出部）
３１ ベースフィルム
３２ ホットスタンプフィルム
３３ ラミネートフィルム
４１，４９ 搬送ベルト装置
４２ 生カード供給部
４３ 画像形成部
４６ 画像チェック部
５１ 転写箔コア（部材供給部）
５２ 真空熱プレス装置
５４ 裁断装置
６０ カード供給手段
１００ ＩＤカード
２００ 熱転写シート
３００ ＩＤカードの製造装置
３０１ 画像形成装置（画像形成手段）
３０２ 熱転写装置
４００ 熱転写シート用のカートリッジ（転写用カートリッジ）
５００ ホットスタンプ装置[0001]
BACKGROUND OF THE INVENTION
  The present invention is an ID card suitable for application to a card with a face image with an image protection layer that requires prevention of forgery and alteration.Made ofHow to makeTo the lawIt is related.
[0002]
[Prior art]
In recent years, in the service industry fields such as government offices, banks, companies, medical institutions and schools, identification documents, passports, alien registration cards, library use cards, cash cards, credit cards, licenses such as automobile licenses, employees, etc. ID cards such as personal identification cards, employee ID cards, membership cards, medical cards, and student ID cards are widely used. In this type of ID card, a face image for identity verification and character information images such as characters and symbols concerning the owner are recorded. For this reason, printing for the purpose of preventing falsification of ID cards is often performed.
[0003]
This face image is usually formed by a full-color image having multiple gradations, for example, by a sublimation thermal transfer recording method, a silver halide color photographic method, or the like. The character information image is composed of a binary image, and is formed by, for example, a melt type thermal transfer recording system, a sublimation type thermal transfer recording system, a silver halide color photographic system, an electrophotographic system, an ink jet system, or the like. Further, for the purpose of preventing forgery and alteration, holograms, fine patterns, etc. are employed. In addition, standard format printing is performed on the ID card as necessary.
[0004]
In order to protect these images, a protective layer is provided on the surface of the ID card as necessary. As a protective layer provided on the ID card, for example, as described in JP-A-6-222535, JP-A-6-222536, and JP-A-6-222537, an ultraviolet curable resin is applied to the card surface, and then ultraviolet rays are applied. A method of providing a protective layer by irradiating and curing, a method of providing a laminate protective layer as described in JP-A-2-139551, a heat-cured protective layer after applying an isocyanate compound on a photographic surface of silver halide And a method of transferring a curable transfer foil member and providing a transfer protective layer as disclosed in JP-A-8-224982.
[0005]
[Problems to be solved by the invention]
By the way, according to the conventional method of manufacturing an ID card using a curable transfer foil member, since this type of transfer foil member has a property of being cured by ultraviolet rays, the thicker the curable transfer foil member is, The surface protection on the card substrate is improved. On the other hand, it has been found that if the film thickness is too thick, the workability at the time of forming the transfer foil member deteriorates. For example, a so-called visible burr is generated at the end of the ID card. Thereafter, the protective layer that protrudes outward beyond the outer peripheral edge of the card board is referred to as an outer burr, and the inner burr is generated when the protective layer is not properly formed in the vicinity of the outer peripheral edge of the card board. .
[0006]
When this type of burr occurs, the following problems occur. When an external burr occurs, it takes time to remove the above-mentioned protruding protective layer, that is, a member residual piece, and when an internal burr and an external burr occur, both cause the protective layer to peel off. I found out that sometimes
[0007]
Further, it has been found that if the curable transfer foil member is thinned, the generation of burrs during formation of the transfer foil member can be suppressed, but the surface protection property is lowered. For example, if the recorded image after card completion is rubbed strongly, scratches will occur on the curable transfer foil member (hereinafter also referred to as curable protective member), and the scratches will remain on the recorded image. I found it.
[0008]
  Accordingly, the present invention solves the above-described problems, and when a card substrate on which a face image or a character recording image is formed is protected by providing a curable protection member, the workability at the time of forming the protection member is improved. An ID car that can ensure surface protection on the card substrate without deterioratingMade ofHow to makeThe lawThe purpose is to provide.
[0010]
[Means for Solving the Problems]
In order to solve the above problems,The present inventors conducted an experiment to find an optimum film thickness value of the curable protective member with respect to the surface protective property on the card substrate and the workability when forming the protective member. According to this experimental result, when covering and protecting a transparent curable protective member on the card substrate on the recording image forming surface side, the film thickness of the curable protective member isTheSpecified to 0.5 μm to 5.0 μm, andAdhesive force Fb
0.5g / cm <Fb <25g / cm
Stipulated inIt is clear that it is possible to provide an ID card that does not deteriorate the workability at the time of forming the protective member, has excellent surface protection on the card substrate, and has excellent scratch resistance (wear resistance). Became.
[0011]
  The method for producing an ID card of the present invention includes a step of forming a recorded image on a card substrate, and a curable protective layer formed by transferring a substantially transparent curable protective member onto the card substrate on the surface on which the recorded image is formed. And forming a process,The curable protective member is a transfer foil provided with an ultraviolet curable layer and an adhesive layer on a support, and when the curable protective layer is formed on the card substrate,BranchWhen the adhesive force between the holder and the UV curable layer is Fb,
0.5g / cm <Fb <25g / cm
Stipulated in
  When the thickness of the curable protective layer is Th,
0.5 μm ≦ Th <5.0 μm
Stipulated inIt is characterized by this.
[0012]
  According to the ID card manufacturing method of the present invention, the film thicknessTheSpecified to 0.5 μm to 5.0 μmAndThatAdhesive force Fb
0.5g / cm <Fb <25g / cm
Specified inSince the curable protective layer is formed on the card substrate, it is possible to eliminate the occurrence of burrs at the outer peripheral edge of the card of the curable protective layer without deteriorating the surface protection on the card substrate. Thereby, an ID card excellent in scratch resistance (wear resistance) can be manufactured with good reproducibility.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, an ID car as an embodiment of the present invention will be described with reference to the drawings.DeManufacturing methodTo the lawExplain about it.
[0017]
  (1) ID card
  FIG. 1 shows an embodiment of the present invention.Formed by manufacturing method2 is a perspective view showing a structural example of an ID card 100. FIG.
[0018]
In this embodiment, when a transparent curable protective member is provided on the card substrate on the surface on which the face image or the character recording image is formed, the film thickness, processing temperature, adhesive thickness of the member is protected. Providing an ID card that does not deteriorate the workability when forming a protective member, has excellent surface protection on the card substrate, and has excellent scratch resistance (wear resistance) It is something that can be done.
[0019]
The ID card 100 according to the present invention includes an ID card, passport, alien registration card, library card, cash card, credit card, driver's license such as a car license, employee ID card, employee ID card, membership ID card, medical card Applicable to cards and student ID cards. The ID card 100 has a card substrate 11 shown in FIG. 1, and personal information of the card user is written therein. Personal information refers to address, name, date of birth, permanent address, date of issuance of an employee ID card, expiration date, etc. The ID card 100 includes a non-contact type electronic card having an IC chip and an antenna built therein. In the case of an electronic card, personal information is recorded on an IC chip or the like.
[0020]
In this example, a recorded image such as a face image or a character recorded image is formed on the card substrate 11. The employee ID as the ID card 100 in FIG. 1 has, for example, a vertical length of about 6 cm, a horizontal length of about 9 cm, and a thickness of about 0.5 to 1.0 mm. The face image of the card user is formed in the face image forming area P1 of the employee ID, and character record information and the like are printed in the other areas. The character record information includes, for example, “XXX employee ID”, “personal identification number”, “name”, “issue date”, and the like.
[0021]
A transparent sheet-like curable protective layer (hereinafter also referred to as a curable protective member) 12 is provided on the card substrate 11 to protect the card substrate surface. As the curable protective member 12, a curable transfer foil member having an ultraviolet curable layer and an adhesive layer is used. This type of curable transfer foil member is used because this ultraviolet curable transfer foil has glass-like properties, so even when an impact force is applied to the card substrate from the outside. This is because the face image and the like can be protected from scratches caused by friction at that time.
[0022]
In this example, a hologram image 13 having an uneven pattern is provided on the substrate surface side of the curable protective layer 12. The hologram image 13 is a special image having a hexagonal star shape in a circle, for example. Of course, the hologram image 13 is not limited to a geometric pattern such as a hexagonal star shape, and may be any shape as long as it is difficult to imitate.
[0023]
The card substrate 11 and the curable protective layer 12 are bonded together via an adhesive layer 14. For the adhesive layer 14, it is preferable to use a hot melt resin or a resin melt softening point formed in a film shape at a temperature of about 130 ° C. or slightly higher.
[0024]
FIG. 2 is a cross-sectional view showing an example of a laminated structure of the face image card 101 as the ID card 100. A curable protective layer (image protective layer) 12 having a film thickness Th is provided on the face image card 101 shown in FIG. Here, when the film thickness of the curable protective layer 12 shown in FIG.
0.5μm ≦ Th ≦ 5.0μm
Stipulated in Although it depends on the material of the curable protective member 12 and the support 16, the ideal value is preferably 3 μm.
[0025]
The reason why the film thickness Th is defined is to achieve both the workability at the time of transfer of the curable protective member 12 and the surface protection after completion of the card. By defining the film thickness of the curable protective layer 12 to 0.5 μm to 5.0 μm, it is possible to suppress the occurrence of a visible uneven member residue called a burr at the end of the ID card 100. Further, even if the recorded image after completion of the card is rubbed to some extent, the generation of scratches on the curable protective layer 12 is suppressed, and no visible scars remain on the recorded image.
[0026]
The curable protective layer 12 forms a curable protective member on the card substrate using photocurability, thermosetting, or the like. For details, JP-A Nos. 54-92404, 56-144994, 56-148580, 56-155789, 56-166090, 59-49993, 59-76290, 59- No. 103788, No. 60-112441, No. 60-239277, No. 60-254175, No. 62-83177, No. 63-293099, JP-A-1-18698, No. 1-80598, No. 1-180400 No. 2-93893, 3-121884, 3-45391, 3-0665400, 4-69286, W91 / 1223, etc. describe a method for forming a protective member.
[0027]
The curing time of the curable protective layer 12 formed by this type of protective member may be either before or after transfer, but is preferably before transfer, and the curable protective layer 12 is cured in advance before transfer. If placed, the curing step after transfer can be omitted.
[0028]
Further, the hardness of the curable protective member 12 is HB or more in terms of pencil hardness. Here, the pencil hardness means the hardness of the carbon core of a pencil (6B to B, HB, H, 2H to 6H) according to JIS K5400. The hardest layer of the curable protective member 12 has an elastic modulus of 350 kg / mm.²The breaking elongation is preferably 20% or less, more preferably 400 kg / mm.²As described above, the breaking elongation is preferably 15% or less. In this example, the hologram forming layer 3 is formed on the back surface of the curable protective layer 12 to form a hologram image 13. This forming method will be described with reference to FIGS.
[0029]
Further, the card substrate 11 and the curable protective layer 12 are thermally bonded by an adhesive layer 14. Here, when the thickness of the adhesive layer 14 shown in FIG.
0.1 μm <t <20 μm
Stipulated in When the thickness t is defined in this way, it is possible to prevent the curable protective layer 12 from being peeled off from the card substrate 11 due to insufficient adhesive force.
[0030]
The card substrate 11 shown in FIG. 2 is formed by laminating a writing layer 11A, a cushion layer 11B, a support 11C, a cushion layer 11D, a thermal sublimation image receiving layer 11E, and the like in order from the bottom. In this example, the adhesive layer 14 is made of a gel-like epoxy resin generally called B-stage epoxy. Examples of the hot melt resin include polyamide-based hot melt resins such as the Macromelt series manufactured by Henkel, Calflex TR and Quinton series manufactured by Shell Chemical Co., Ltd., Tufrene manufactured by Asahi Kasei Co., Ltd., Tufden manufactured by Firestone Synthetic Rubber and Latex, Thermoreversible elastomeric hot melt resins such as the Sorprene 400 series manufactured by Phillips Petroleum are preferred.
[0031]
In addition, Sumitomo Chemical's Sumic, Chisso Petrochemical's Bistack, Mitsubishi Yuka's Yucatak, Henkel's Macromelt Series, Mitsui Petrochemical's Toughmer, Ube Lexen's APAO, Eastman Polyolefin hot melt resins such as Eastman Bond manufactured by Chemical Company and A-FAX manufactured by Hercules are preferred. Furthermore, TE030 and TE100 manufactured by Sumitomo 3M Co., Ltd., Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., and Kanebo NS Co., Ltd. are used. Hot melt resins such as Bond Master 170 series manufactured by Henkel and Macroplast QR3460 manufactured by Henkel are preferable, and hot melt resins based on ethylene / vinyl acetate copolymers and polyester hot melt resins are preferable. Hot melt resins have the property of absorbing moisture after curing and curing.
[0032]
The softening point of the card substrate 11 or a part thereof after completion of the card is defined to be 130 ° C. or less. This softening point is below 130 ° C. ID card, passport, alien registration card, library card, cash card, credit card, driver's license such as car license, employee ID, employee ID, membership ID When it is assumed that medical cards and student ID cards are placed in a parked car under hot weather, it has been found from experience that the temperature in the car reaches 90 ° C. This is to prevent the curable protective member 12 from peeling off.
[0033]
3A and 3B are cross-sectional views showing examples of laminated structures of other cards 102 and 103 with face images. Another face image card 102 shown in FIG. 3A has a card substrate 11. A recorded image is formed on the card substrate 11, and a transparent curable protective layer 12 is provided so as to cover the recorded image forming surface side.
[0034]
The face image card 102 has a multiple structure in which a plurality of curable protective members 12 of the same type or different types having a predetermined film thickness are stacked. For example, the card 102 with a face image is formed by laminating two layers of curable protective members 12A and 12B having a predetermined film thickness on the card substrate 11 and two layers of forgery / alteration preventing foil. Also in this example, a curable transfer foil similar to the face image card 101 is used for the curable protective members 12A and 12B.
[0035]
In this example, when the film thickness of one curable protective layer 12A or 12B is Th, 0.5 μm ≦ Th ≦ 5.0 μm is specified. This film thickness Th is defined in order to achieve both the workability during transfer of the curable protection members 12A and 12B and the surface protection after completion of the card. Generation of burrs can be further suppressed by transferring the curable protective members 12A and 12B in two steps.
[0036]
  At the same time, the surface protection after completion of the card is improved as compared with the other face image-containing card 103 shown in FIG. 3B. The card 103 with a face image shown in FIG. 3B includes a falsification preventing foil 13A for the hologram image 13 and a curable protective layer 12 in each layer.One by oneFormed. The multiple layers are not limited to the curable protective layer 12 but may be multilayered by combining the curable protective layer 12 having a predetermined thickness and the falsification preventing foil 13A.
[0037]
As described above, it is possible to protect the face image and the character recording image formed on the card surface more firmly than when the single curable protective layer 12 is provided. Moreover, when the curable protective member 12 is transferred, the surface of the curable protective member 12 can be transferred without deteriorating the surface protection on the card substrate 11 as compared with the case where the single type of curable protective member 12 is provided thicker. The occurrence of burrs at the outer peripheral edge of the card can be extremely reduced. Thereby, the ID card 100 excellent in scratch resistance can be provided.
[0038]
4A is a plan view of the curable protective layer 12 on the ID card 100, and FIG. 4B is an image diagram showing a configuration example (part 1) of the cross section. FIG. 5A is a curable protective layer on the ID card 100. 12 planes and FIG. 5B are image diagrams showing a configuration example (part 2) of the cross section. Also in this example, a curable transfer foil similar to the face image card 101 is used for the curable protective members 12A and 12B.
[0039]
In the ID card 100 shown in FIG. 4A, a recorded image including a fixed format such as a frame line or a frame line is formed on the card substrate 11. In this example, an area B (hereinafter referred to as an image forming area) B in which a recorded image shown in FIG. 4A is formed is defined as an inner side from the outer peripheral edge of the card substrate 11 based on the size of the ID card 100 shown in FIG. Is arranged at a position where β = 1.5 mm or more. A transparent curable protective layer 12 is also provided on the card substrate 11 so as to cover the recording image forming surface 1. Here, the card substrate area on the recording image forming surface side is A, the image forming area is B, the area where the curable protective layer 12 is provided (hereinafter referred to as image protective area) is C, and the curable protective layer 12 is the card. When the protruding area when covered beyond the substrate area A is α, the equation (1), that is,
A + α⊇C⊃B (1)
It is made to have a relationship. Regarding this protrusion area α, when the protrusion distance of the curable protective layer 12 protruding outward from the outer peripheral edge of the card substrate 11 shown in FIGS. 5A and 5B is δ,
0 ≦ δ ≦ 300μm
Stipulated in In this manner, at least the image forming area B is protected by the curable protective layer 12, and the curable protective layer 12 is covered not only from the image forming area B but also beyond the card substrate area A as shown in FIG. 5A. In this case, the protruding distance δ shown in FIG. 5B can be suppressed to within 300 μm. As a result, the occurrence of problems due to the occurrence of external burrs during transfer of the curable protective layer 12 is suppressed, and the ID card has excellent surface protection on the card substrate 11 and excellent scratch resistance (wear resistance). 100 can be provided.
[0040]
As for the inner burr that protrudes from the outer peripheral edge of the card to the image forming region B side when the curable protective member 12 is transferred, the card substrate shown in FIG. 4A is an example of the ID card 100 of FIG. 11 is a distance between the outer peripheral edge of the image protection area C and the outer peripheral edge of the image protection area C,
0mm ≦ γ ≦ 0.8mm
Stipulated in If defined in this way, the image forming area B is protected by the curable protective layer 12, and the occurrence of problems due to the occurrence of internal burrs during the transfer of the curable protective layer 12 is suppressed, and the surface protection on the card substrate 11 is improved. It is possible to provide the ID card 100 which is excellent and has excellent scratch resistance (wear resistance).
[0041]
In this example, a curable transfer layer 15 for adjusting the thickness is provided in an outer peripheral region D surrounding the image forming region B shown in FIG. 4B. By providing the curable transfer layer 15, the thickness can be made equal to the thickness of the image forming region B, so that the ID card 100 without a step can be configured.
[0042]
FIG. 6 is an image diagram showing a planar configuration example of the curable protective layer 12 of another face image card 105. In the face image card 105, the fixed format is not provided along the outer peripheral portion of the card substrate 11 like the ID card 100 shown in FIGS. 4A and 5A. The fixed format printed on the ID card 100 is not necessarily provided along the outer peripheral portion of the card substrate 11 as shown in FIGS. 4A and 5A.
[0043]
Depending on the use of the ID card 100, the face image forming area P1, the personal information writing area P2, and the fixed format area P3 are distributed and assigned to the card board area A shown in FIG. Also in this case, the relational expression of A + α⊇C⊃B shown in the above equation (1) and the outer periphery of the card substrate 11 and the outer periphery of the image protection area C shown in FIG. The distance γ is defined as 0 mm ≦ γ ≦ 0.8 mm. In this case, the image forming area B includes a face image forming area P1, a personal information writing area P2, and a fixed format area P3.
[0044]
If defined in this way, the face image forming area P1, the personal information writing area P2, and the standard format area P3 are protected by the curable protective layer 12, and there is a problem of occurrence of external burrs and internal burrs when the curable protective layer 12 is transferred. Generation of the face image card 105 with excellent surface protection on the card substrate 11 and excellent scratch resistance (wear resistance) can be provided.
[0045]
(2) Thermal transfer sheet
FIG. 7 is a cross-sectional view illustrating a laminated structure example of the thermal transfer sheet 200 as an embodiment. In this embodiment, the curable protective member 12 is defined in advance to have a size that forms the outer shape of the card substrate 11.
[0046]
A thermal transfer sheet 200 shown in FIG. A curable protective member 12 having a predetermined film thickness is provided on the support 16. For this curable protective member 12, an ultraviolet curable layer and a falsification preventing foil are used. Here, when the film thickness of the curable protective layer 12 shown in FIG.
0.5μm ≦ Th ≦ 5.0μm
Stipulated in A hologram forming layer 3 is formed on the upper surface of the curable protective member 12, and a hologram image 13 is formed. An adhesive layer 14 having a predetermined film thickness is formed on the hologram forming layer 3. Here, when the thickness of the adhesive layer 14 shown in FIG.
0.1 μm <t <20 μm
Stipulated in The reason for these regulations is as described above.
[0047]
  FIG. 8 is a conceptual diagram showing a half cut example of the thermal transfer sheet 200. In this example, a cut that replicates the outer shape of the card substrate 11 is formed on the curable protective member 12.Applied. This cut is applied to the adhesive layer 14, the hologram forming layer 3, and the curable protective layer 12, and is not formed on the support 16. This is because the original support function of the support 16 is impaired.
[0048]
  This incision is sharply formed using a cutter or the like that replicates the shape of the card substrate, and is smaller than the actual card substrate 11 with respect to the curable protective member 12 of the thermal transfer sheet 200 shown in FIG.Applied. This is to eliminate the outer burr and the inner burr. Thereby, the curable protective member 12 can be defined in a size that forms the outer shape of the card substrate 11.
[0049]
As described above, according to the thermal transfer sheet 200 according to the present embodiment, the curable protection member 12 having a predetermined film thickness provided on the support 16 has a size that forms the outer shape of the card substrate 11 to be bonded in advance. Therefore, the occurrence of burrs at the outer peripheral edge of the card of the curable protective layer 12 can be extremely reduced during the transfer. Thereby, the ID card 100 excellent in scratch resistance (wear resistance) can be manufactured with good yield and good reproducibility.
[0050]
(3) Manufacturing method of thermal transfer sheet
9A to 9C are process diagrams showing an example of forming the thermal transfer sheet 200 as an embodiment. In this embodiment, a case is assumed in which a curable protective member 12 with an adhesive having a predetermined thickness, which is defined in a size having the same outer shape as the card substrate 11, is formed on a sheet-like support 16. The width of the thermal transfer sheet 200 is wider than the width of the card substrate 11 so that a margin can be maintained on both sides of the card substrate. By forming it widely, transfer errors can be prevented.
[0051]
First, in FIG. 9A, a curable protective member 12 having a thickness Th of about 0.5 μm ≦ Th ≦ 5.0 μm is formed on the support pair 16. For the support 16, a polyethylene film of about several tens of μm is used. For the curable protective member 12, an ultraviolet curable composition such as epoxy acrylate, hydroxy acrylate, tetrahydrofluacrylate, and a photopolymerization initiator benzophenone is used. These ultraviolet curing members are coated on the support 16 with a wire bar, and then irradiated with ultraviolet rays having a predetermined energy.
[0052]
Thereafter, in FIG. 9B, the hologram forming layer 3 with a hologram image is formed on the curable protective member 12. For example, the reflective hologram forming layer 3 is formed at a predetermined position on the curable protective member 12 by a conventional method. The reflection hologram forming layer 3 is formed by forming a resin layer 3A on the curable protective member 12 and then applying a metal vapor deposition layer 3B. Thereby, a falsification preventing foil is formed under the curable protective layer 12 at the time of card substrate transfer. Printing for the purpose of preventing forgery / alteration is preferably present between the cured protective layer 12 and the card substrate 11 in a state of being transferred to the ID card 100.
[0053]
In addition to holograms, printing for the purpose of preventing falsification includes a composition containing at least one selected from a fine pattern, a watermark, and {reflective beads, ultraviolet absorbers, infrared absorbers, fluorescent brighteners}. Examples of known methods for printing layers, magnetic recording layers, and barcodes formed from materials may be mentioned, but these may be used alone or in combination of two or more thereof. For example, a method using reflective beads is described in JP-A-6-507737.
[0054]
Thereafter, in FIG. 9C, an adhesive member is applied on the hologram forming layer 3 to form the adhesive layer 14. For the adhesive member, reactive hot melt resin, urethane modified olefin resin, or the like is used. At this time, the adhesive member is applied with a wire bar so that the thickness t of the adhesive layer 14 is 0.1 μm <t <20 μm. Thereafter, a cutter 17 or the like that replicates the shape of the card substrate is used to make a cut. Thereby, the thermal transfer sheet 200 with an adhesive having a pencil hardness of HB or higher is completed.
[0055]
As described above, according to the method for producing a thermal transfer sheet of the present invention, the curable protective member 12 having a predetermined film thickness defined as the size forming the outer shape of the card substrate 11 is formed on the sheet-like support 16. Therefore, when the curable protective member 12 is transferred, it is possible to extremely reduce the occurrence of uneven member remaining pieces that protrude from the curable protective layer 12 of the card substrate 11 to the outer peripheral edge of the card.
[0056]
FIG. 10A is a perspective view illustrating an example of a process for forming a hot stamp film 32 as the thermal transfer sheet 200, and FIG. 10B is a partial cross-sectional view illustrating an example of a configuration when forming a hologram image. The hot stamp film 32 is used as a sheet-like thermal transfer sheet 200. The hot stamp film 32 includes the curable protective member 12 having a thickness Th of about 0.5 μm ≦ Th ≦ 5.0 μm. The curable protective member 12 is a transfer foil having an ultraviolet curable layer and an adhesive layer. For example, the hot stamp film 32 is formed by sticking to the base film 31 shown in FIG. 10A what is cut in advance to be approximately the same size as the ID card 100 or smaller.
[0057]
Also in this case, the relational expression of A + α · C · B shown in the above equation (1) and the outer periphery of the card substrate 11 and the outer periphery of the image protection area C shown in FIG. The distance γ is defined as 0 mm ≦ γ ≦ 0.8 mm. This base film 31 is peeled off during the laminating coating process.
[0058]
In this example, positioning apertures 37 are provided at both ends of the base film (support) 31 at regular intervals, and the hologram images 13 and the like are formed using the apertures 37. The opening 37 is also used when positioning the card substrate 11 and the thermal transfer sheet 200 such as the hot stamp film 32.
[0059]
For example, when forming the hologram image 13 using the hologram image creating means 34 shown in FIG. 10B, the mold 35 by the hologram image creating means 34 is pressed down to the hot stamp film 32 as if the stamp is pressed. Form a hexagonal star pattern. Thereby, the hologram image 13 can be formed on the hot stamp film 32 with good reproducibility.
[0060]
At this time, positioning pins 38A and 38B are inserted from the hologram image creating means 34 into the opening portions 37 on both sides of the base film 31, and the mold 35 is placed at a predetermined position of the hot stamp film 32 on the base film 31. Can be pressed. In this case, the mold 35 may be authenticated by a card issuing organization. Hereinafter, the thermal transfer sheet 200 with such authentication is also referred to as an authentication protection sheet. Thereafter, the base film 31 having the hologram image 13 is wound up in a roll shape. In this example, it is not limited to a roll shape, the base film 31 is cut so as to match the size of one ID card 100, and the base film 31 including the hologram image is stocked in a cut sheet shape and packed. You may do it.
[0061]
FIG. 11A is a perspective view illustrating an example (part 1) of forming a laminate film 33 as the thermal transfer sheet 200, and FIG. 11B is a partial cross-sectional view illustrating a configuration example when forming a hologram image. FIG. 12 is a perspective view showing an example (part 2) of forming the laminate film 33. In this example, an uneven hexagonal star pattern or the like is formed on the long sheet-like laminate film 33 shown in FIG. 11A to be the thermal transfer sheet 200 by pressing the mold 35 of the hologram image creating means 34 shown in FIG. 11B. Is. The laminate film 33 is made of the curable protective member 12 having a thickness Th of about 0.5 μm ≦ Th ≦ 5.0 μm. The curable protective member 12 is a transfer foil having an ultraviolet curable layer and an adhesive layer.
[0062]
Of course, the surface on which the hologram image 13 is formed is the side to be brought into contact with the surface of the ID card 100. In this example, an adhesive sheet 14 having a film thickness t of about 0.1 μm <t <20 μm is laminated on the surface on which the hologram image 13 is formed on the hologram forming layer 3 of the hot stamp film 32 and the laminate film 33. Since both sides of the adhesive sheet 14 have adhesiveness like a so-called double-sided adhesive tape, the adhesiveness is maintained on one side by a paper sheet that is not shown and can be easily peeled.
[0063]
At the time of bonding of the adhesive sheet 14, the laminate film 33 and the like are pressure-applied while being heated using the heating rollers 36 </ b> A and 36 </ b> B. Thereafter, the laminate film 33 having the hologram image 13 is wound up in a roll shape. The roll-shaped laminate film 33 is accommodated in a cartridge or packaged.
[0064]
When these thermal transfer sheets 200 are accommodated in a cartridge or the like, replacement work in the thermal transfer apparatus can be easily performed, the work load is reduced, and work efficiency is improved. By drawing out the hot stamp film 32 and the laminate film 33 from the cartridge, the transparent curable protective layer 12 can be protected on the card substrate 11.
[0065]
(4) ID card manufacturing method
FIG. 13A to FIG. 13C are cross-sectional views showing an example of forming the ID card 100 as an embodiment. FIG. 14 is a conceptual diagram showing an example of alignment between the card substrate 11 and the thermal transfer sheet 200.
[0066]
In this embodiment, a recorded image is formed on the card substrate 11 in advance, and then the substantially transparent curable protective member 12 is transferred onto the card substrate 11 on the surface on which the recorded image is formed. It is assumed that a curable protective layer 12 having a film thickness of 0.5 μm to 5.0 μm is formed thereon. Regarding the transparent curable protective member 12, the above-described thermal transfer sheet 200 with an adhesive is prepared in advance, and the optimum transfer conditions of the curable protective member 12 are described in "(7) Examples". It is assumed that they are found by their experimental examples.
[0067]
Based on these assumptions, in FIG. 13A, the curable protective member 12 is brought into contact with the card substrate 11 by applying heat. At this time, when Fc is a pressing force for contacting the curable protective member 12 on the card substrate 11,
0g <Fc <20kg
Stipulated in When Fc> 20 kg, the curable protective member 12 is crushed, which causes an internal burr and an external burr at the time of peeling. When the processing temperature (hereinafter also referred to as transfer temperature) at the time of contact is Tx,
90 ° C <Tx <250 ° C
Stipulated in
[0068]
The transfer temperature Tx is defined in this way because when Tx <90 ° C. and Tx> 250 ° C., the peelability of the curable protective member 12 deteriorates under the condition that the thermal transfer sheet 200 and the card substrate 11 are moved together. This is because it causes internal and external burrs. By defining the transfer temperature Tx at the time of contact as 90 ° C. <Tx <250 ° C., it is possible to prevent the curable protective member 12 from being peeled off from the card substrate 11 due to heat melting after completion of the card. It is possible to prevent the curable protective member 12 from being peeled off from the card substrate 11 due to insufficient adhesive force.
[0069]
In this example, the thermal transfer sheet 200 is provided with a positioning opening 37 shown in FIG. 14 in advance, and the card substrate 11 and the notch of the thermal transfer sheet 200 are aligned using the opening 37. For example, alignment pins 39A and 39B are inserted into the opening 37 of the thermal transfer sheet 200 from a thermal transfer device (not shown). The curable protective member 12 that is cut into the shape of the card substrate is positioned with respect to the outer peripheral end portion of the card substrate 11. Thereby, the curable protective member 12 corresponding to the width can be brought into contact with the card substrate 11.
[0070]
Thereafter, in FIG. 13B, the thermal transfer sheet 200 or the card substrate 11 is moved in a certain direction based on the previously found transfer conditions. This is because an actual thermal transfer apparatus employs a system in which the thermal transfer sheet 200 and the card substrate 11 are simultaneously moved in a certain direction in order to increase the throughput. In the case of adopting the latter in this example, when the card substrate 11 is also in a moving state, and the force that pulls the thermal transfer sheet (support 16) 200 in a certain direction is the tension Fa,
200g <Fa <1.5kg
Stipulated in Although it depends on the material of the curable protective member 12 and the support 16, the ideal value is preferably 600 g.
[0071]
The tension Fa is defined in this way because, when Fa <200 g and Fa> 1.5 kg, the peelability of the curable protective member 12 deteriorates under the condition that the thermal transfer sheet 200 and the card substrate 11 are both moved. This is because it causes burrs and external burrs. By defining the tension Fa during movement to 200 g <Fa <1.5 kg, it is possible to suppress the occurrence of internal burrs and external burrs during peeling. In that case, when the moving speed of the thermal transfer sheet 200 is V1, and the moving speed of the card substrate 11 is V2,
V1 <V2
Stipulated in
[0072]
For example, the moving speed V2 of the card substrate 11 with respect to the moving speed V1 of the thermal transfer sheet 200 is
1.02 ・ V1 <V2 <1.4 ・ V1
Stipulated in That is, the speed difference Vε between the moving speed V1 of the thermal transfer sheet 200 and the moving speed V2 of the card substrate 11 is defined to be 2% to 40%. The speed difference Vε is defined in this way because when Vε <2% and Vε> 40%, the peelability of the curable protective member 12 is deteriorated under the condition that the thermal transfer sheet 200 and the card substrate 11 are both moved. This is because it causes internal and external burrs. By defining the speed difference Vε during movement to 2% <Vε <40%, it is possible to suppress the occurrence of internal burrs and external burrs during peeling. For example, the curable protective member 12 can be instantaneously cut from the thermal transfer sheet 200 at the end portion of the card substrate 11.
[0073]
In this example, when the thermal transfer sheet 200 and the card substrate 11 are in a moving state, the size of the outer peripheral shape of the card substrate 11 is determined using a mechanism as described in the cartridge described later before the support 16 is peeled off. Alternatively, the curable protective member 12 may be creased by a folding mechanism or the like so that the transfer area is defined so as to have the size of the outer peripheral shape of the card substrate 11.
[0074]
Thereafter, in FIG. 13C, the curable protective member 12 having a size covering the card substrate 11 is peeled from the support 16 to form the curable protective layer 12 on the card substrate 11. In this example, when the adhesive force between the support 16 and the curable protective layer 12 is Fb,
0.5g / cm <Fb <25g / cm
Stipulated in Although depending on the material of the curable protective member 12 and the support 16, the ideal value is preferably 10 g. Here, the adhesive force Fb is a peeling force per unit centimeter width when an adhesive tape (Nichiban # 405 or the like) is attached to the curable protective layer 12 and peeling is performed at a peeling angle θ = 180 °.
[0075]
The adhesive force Fb is defined in this way because when Fb <0.5 g / cm and Fb> 25 g / cm, the peeling of the curable protective member 12 is performed under the condition that the thermal transfer sheet 200 and the card substrate 11 are moved together. This is because the properties deteriorate and cause internal and external burrs. By defining the adhesive force Fb at the time of peeling to 0.5 g / cm <Fb <25 g / cm, the generation of internal burrs and external burrs can be suppressed.
[0076]
In this example, when the heat transfer sheet 200 after the curable protective member 12 is transferred, that is, the angle at which the support 16 is pulled from the card substrate 11 in a certain direction is the peeling angle θ,
10 ° <θ <150 °
Stipulated in Although it depends on the material of the curable protective member 12 and the support 16, the ideal value of the peel angle θ is preferably 75 °.
[0077]
The peel angle θ is defined in this way because when θ <10 ° and θ> 150 °, the peelability of the curable protective member 12 deteriorates under the condition that the thermal transfer sheet 200 and the card substrate 11 are both moved. This is because it causes internal and external burrs. Of course, the peel angle θ of the curable protective member 12 may be changed between the front end portion and the end portion of the card substrate 11.
[0078]
By defining the peel angle θ as 10 ° <θ <150 °, the curable protective member 12 can be transferred from the support 16 to the card substrate 11 without any internal or external burrs and with good reproducibility. As a result, the ID card 100 in which an image or a shape for preventing falsification is applied to the adhesive surface side of the curable protective layer 12 and the face image and the character recording image are protected by the transparent curable protective layer 12 is provided. Complete.
[0079]
Note that the curable protective member 12 covering the card substrate 11 is not limited to one layer, and another curable protective member 12 having the same size as the card substrate 11 is once again peeled from the thermal transfer sheet 200 and the same card substrate. Two or more layers may be stacked on 11. That is, the same type or different types of curable protective members 12 having a predetermined film thickness are formed on the same card substrate 11 in multiple layers.
[0080]
Further, when transferring the curable protective layer 12 to the card substrate 11, the direction in which the rear end of the card substrate 11 is separated from the curable protective member 12 immediately before the rear end in the transport direction of the card substrate 11 is separated from the curable protective member 12. It is better to bend it. This is because the curable protective member 12 is easily cut along the rear edge of the card substrate 11 when the curable protective member 12 is peeled off from the support 16, and the card outer end of the curable protective layer 12 is cut off. This is because the generation of burr can be eliminated.
[0081]
Furthermore, the curable protective member 12 is gradually peeled off from the support 16 and the card portion onto which the curable protective member 12 has been gradually transferred is removed on the planes such as the upper and lower rollers and the roller and stage during the peeling. It is good to hold it. This is because vibration of the card substrate 11 that has been peeled off can be prevented, and generation of burrs at the end portion on the card side can be suppressed by suppressing this vibration.
[0082]
Thus, according to the method of manufacturing the ID card 100 of the present invention, the film thickness of the curable protective member 12 found in advance, the transfer temperature of the card substrate 11, the thickness t of the adhesive 14 of the thermal transfer sheet 200, and the like. Since the curable protective layer 12 having a film thickness of 0.5 μm to 5.0 μm is formed on the card substrate 11 based on the optimal transfer conditions, the face image and character recording formed on the card surface Images and the like can be well protected. Moreover, it is possible to eliminate the occurrence of burrs at the card outer end of the curable protective layer 12 without deteriorating the surface protection on the card substrate 11.
[0083]
Moreover, according to this embodiment, the curable protective member 12 is peeled off from the support 16 on which the curable protective member 12 with a peelable adhesive is formed, and two or more are stacked on the same card substrate 11. Therefore, the burrs at the outer peripheral edge of the card of the curable protective layer 12 can be reduced without deteriorating the surface protection on the card substrate 11 as compared with the case where the single type of curable protective member 12 is formed thicker at one time. Can be extremely reduced. Thereby, the ID card 100 excellent in scratch resistance (wear resistance) can be manufactured with good yield and reproducibility.
[0084]
  (5) ID card manufacturing equipment
  FIG. 15 shows an embodiment.Manufacturing method is appliedIt is a conceptual diagram which shows the structural example of the manufacturing apparatus 300 of ID card. In this embodiment, the image forming apparatus 301 and the thermal transfer apparatus 400 are separately configured with respect to the manufacturing apparatus 300, and after the face image and character recording information are formed on the sheet-like card substrate 11, the thermal transfer sheet 200 is transferred. Assume a case.
[0085]
The ID card manufacturing apparatus 300 according to the present invention transfers a transparent curable protective member 12 onto a card substrate 11 to provide an identification card, passport, alien registration card, library card, cash card, credit card, automobile. It manufactures ID cards 100 such as licenses such as licenses, employee cards, employee cards, membership cards, medical cards and student cards.
[0086]
An ID card manufacturing apparatus 300 shown in FIG. 15 includes an image forming apparatus (image forming means) 301 and a thermal transfer apparatus 302. The image forming apparatus 301 has a conveyance belt device 41. A raw card supply unit 42 is provided at one upper end of the conveyor belt device 41. In the raw card supply unit 42, a plurality of card substrates 11 cut in a sheet shape in advance for writing the card user's personal information are stocked with the face for developing a face photograph facing upward.
[0087]
  A sign panel or a writing layer for a driver's license may be provided on the back surface of the card substrate 11. In this example, one card board 11 is used.One by oneIt is automatically supplied from the raw card supply unit 42 so as to be dropped onto the conveyor belt device 41.
[0088]
The card board 11 on the conveyor belt device 41 after the automatic supply is conveyed from the left side to the right side. An image forming unit (printer) 43 is provided on the conveyor belt device 41. While the card substrate 11 is moved from the left side to the right side, a photo of the card user is displayed in the face image forming area P1 of the card substrate 11. The name of the card user, the card issuance date, and the like are recorded in the developed or other character recording area. As the image forming means at this time, a sublimation type thermal transfer recording system, a silver halide color photographic system, an electrophotographic system, an ink jet system or the like is used.
[0089]
In the image forming apparatus 301, when the card substrate 11 adopts an electronic card structure, an information writing unit 44 and an information checking unit 48 are provided in addition to the image forming unit 43. For example, an information writing unit 44 indicated by a wavy line is provided on the downstream side of the conveyor belt device 41 so that the personal information of the card user is written on an IC chip or the like in the card substrate 11. In the information writing unit 44, a magnetic code, a bar code, or the like may be used together when writing personal information.
[0090]
Further, an image check unit 46 is provided on the downstream side of the information writing unit 44 with the first drive roller 45 interposed therebetween, and a user's face photograph formed by the image forming unit 43, a name, a card issuance date, and the like. It is checked for mistakes. When the information writing unit 44 described above is provided, an information check unit 48 is further provided on the downstream side of the image check unit 46 with the second drive roller 47 interposed therebetween, and the personal information written by the information writing unit 44 is stored. You may check for mistakes. A card discharge port (not shown) is provided on the downstream side of the information check unit 48, and the card substrate 11 on which a face image or the like is formed is discharged.
[0091]
The image forming apparatus 301 is combined with a thermal transfer device (transfer means) 302, and the transparent curable protective member 12 peeled from the thermal transfer sheet 200 is thermally transferred onto the card substrate 11 containing the face image. As the thermal transfer device 302, a hot stamp device or the like is used. The thermal transfer device 302 is provided with a conveyance belt device 49 as a conveyance means, and the card substrate 11 with which the curable protective member 12 is in contact is conveyed in a certain direction while regulating the position. In this example, the card substrate 11 on which personal information is written is conveyed from the left side to the right side. On the conveyor belt device 49, a thermal transfer sheet cartridge (hereinafter referred to as a transfer cartridge) 400 is provided. The transfer cartridge 400 is provided with a thermal transfer sheet core (hereinafter referred to as a transfer foil core) 51 as a member supply means, and a hologram made of, for example, an uneven hexagonal star pattern on the side to be in contact with the card substrate 11. A tape-shaped thermal transfer sheet 200 having an image 13 is supplied.
[0092]
In this example, a thermal transfer sheet 200 in which a tape-like laminate film 33 or the like is wound in a roll shape is used. The thermal transfer sheet 200 is wound in advance in a transfer cartridge 400, and the transfer cartridge 400 is used as a thermal transfer device. Loaded. Of course, the laminate film 33 has the hologram image 13 on one surface and the adhesive layer 14 on the same surface.
[0093]
Further, the thermal transfer sheet 200 is not limited to the laminate film 33, and a roll of the hot stamp film 32 or a laminate of the hot stamp film 32 in a cut sheet shape may be used. Good. As the hot stamp film 32, a film having the hologram image 13 on one surface and the adhesive layer 14 on the same surface is used.
[0094]
The transfer cartridge 400 is provided with a vacuum hot press device 52 as a contact means (bonding means), and the thermal transfer sheet 200 from the transfer foil core 51 is applied to the card substrate 11 discharged from the image forming apparatus 301. The card substrate 11 and the curable protective member 12 of the thermal transfer sheet 200 are bonded to each other through the adhesive layer 14. At this time, the paper sheet on the adhesive layer 14 is peeled off and wound up as a waste paper.
[0095]
The vacuum heat press device 52 has a flat press portion disposed on the conveyance path, and a predetermined pressure is applied from above the thermal transfer sheet 200. Therefore, the press part can be moved in the vertical direction. The press section is provided with an electric heater (not shown) so as to heat the thermal transfer sheet 200 and the card substrate 11 to a predetermined temperature.
[0096]
In this example, although depending on the kind of the adhesive layer 14, the heating temperature is about 90 ° C. to 250 ° C., and the heating time is about 10 seconds to 120 seconds. The adhesive layer 14 melts when heat is applied and solidifies when it cools. The apparatus for heating and laminating the heat transfer sheet 200 is not limited to the vacuum heat press apparatus 52, and may be a heat press such as a normal thermal head or a heat roller apparatus.
[0097]
Moreover, the cooling part 53 is provided in the downstream of the vacuum hot press apparatus 52, and the card substrate 11 bonded by heating is cooled. As a result, a transparent curable protective layer 12 having a thickness of approximately 0.5 μm to 5.0 μm is formed on the surface of the card substrate 11 on which the recorded image is formed by the image forming apparatus 301 by the thermal transfer apparatus 302. Can be transferred.
[0098]
Next, the operation of the ID card manufacturing apparatus 300 will be described. In this example, description will be made on the assumption that the curable protective member 12 having the size of the card substrate 11 is peeled off from the roll-shaped thermal transfer sheet 200 on one card substrate 11 and transferred onto the card substrate 11. First, one card substrate 11 is taken out from the raw card supply unit 42, and the card substrate 11 is transported from the left side to the right side on the transport belt device 41. During this time, the image forming unit 43 records the card user's face photo, name, date of issue, and the like. Thereafter, depending on the type of the card substrate 11, for example, in the case of an electronic card, the information writing unit 44 writes the user's personal information on the IC chip. In the case of the magnetic card 103, personal information of the card user is written on the magnetic tape.
[0099]
Thereafter, the card substrate 11 is moved from the information writing unit 44 to the image check unit 46 by the driving roller 45. The image check unit 46 checks images such as the card user's face photo, name, and issue date. Of course, the card substrate 11 having only “good” in the check result is sent to the downstream side. The “defective” card substrate 11 is picked up. Thereafter, the card substrate 11 is moved from the image check unit 46 to the information check unit 48 by the drive roller 47. In the case of an electronic card, the information check unit 48 checks the stored information in the IC chip. The card substrate 11 whose check result is “good” is discharged from the image forming apparatus 301.
[0100]
When the card substrate 11 with the face image is transferred to the thermal transfer device 302, in the transfer cartridge 400, for example, a sheet-like thermal transfer sheet 200 having the hologram image 13 is fed out from the transfer foil core 51 and vacuum hot pressed. It is supplied to the card substrate 11 on the device 52.
[0101]
In the vacuum heat press device 52, the card substrate 11 and the thermal transfer sheet 200 are aligned so that the card substrate surface and the hologram image forming surface face each other at a predetermined position, and the card substrate 11 and the thermal transfer sheet 200 are aligned. Is heat-pressed through the adhesive layer 14. Thereafter, the card substrate 11 is cooled to the normal temperature by the cooling unit 53.
[0102]
A mechanism for bending the rear end in a direction away from the curable protective member 12 or a mechanism for preventing card vibration immediately before the rear end in the conveying direction of the card substrate 11 is separated from the curable protective member 12. Is preferably provided immediately before the cooling unit 53. Thereby, the ID card 100 containing the face image with the hologram image protected by the curable protective layer 12 is completed.
[0103]
As described above, according to the ID card manufacturing apparatus 300 according to the present embodiment, when a recorded image is formed on the card substrate 11 by the image forming apparatus 301, the surface of the card substrate 11 on which the recorded image is formed is formed. The substantially transparent curable protective member 12 is transferred by the thermal transfer device 302, and the curable protective layer 12 having a thickness of 0.5 μm to 5.0 μm is formed on the card substrate 11.
[0104]
Therefore, since the curable protective layer 12 can be formed on the card substrate 11, it is possible to protect face images, character recording images, and the like. Moreover, it is possible to eliminate the occurrence of burrs at the card outer end of the curable protective layer 12 without deteriorating the surface protection on the card substrate 11. Thereby, the ID card 100 with a face image excellent in abrasion resistance (abrasion resistance) can be manufactured.
[0105]
(6) Cartridge for thermal transfer sheet
FIG. 16 is a perspective view illustrating a configuration example of a transfer cartridge 400 as an embodiment. In this example, a peeling rod-like body is attached to a predetermined position of the transfer cartridge 400, and the curable protective member 12 having a size forming the outer shape of the card substrate 11 is peeled from the thermal transfer sheet 200 fed out from the transfer foil core 51. Thus, at the time of this transfer, only the curable protective member 12 corresponding to the size of the outer shape of the card substrate 11 can be peeled from the thermal transfer sheet 200, and at the outer peripheral edge of the curable protective layer 12. The generation of burr can be reduced.
[0106]
The transfer cartridge 400 shown in FIG. 16 has a U-shaped tape accommodating portion 21 as a housing. The tape accommodating portion 21 has a divided structure that can be separated into an upper half 21A and a lower half 21B. A bobbin-shaped transfer foil core 51 is movably attached as a member supply section to the tape housing section 21, and a tape-shaped thermal transfer sheet 200 provided with a curable protective member 12 with an adhesive is transferred to the U-shaped section 23. It is paid out.
[0107]
  Also in this example, the thermal transfer sheet 200 is provided with a transfer foil having an ultraviolet curable layer and a falsification preventing foil, and the curable protective member 12 is defined in advance to a size that forms the outer shape of the card substrate 11. A cut that replicates the outer shape of the objectGivenWith a smaller dimension than the actual card substrate 11GivenAnd those provided with positioning apertures 37 are used.
[0108]
The rotational power of the transfer cartridge 400 to the transfer foil core 51 is supplied from the main body of the thermal transfer device 302. This transfer foil core 51 has an original winding core 51A around which a thermal transfer sheet 200 before use is wound and a winding core 51B for winding up the support 16 after transfer peeling. A driven roller portion 22 is attached to a predetermined position of the tape housing portion 21 as a peeling rod-like body. For the driven roller portion 22, a member that does not apply a load to the curable protective member 12, for example, a cylindrical plastic having an outer diameter of about 5 mmφ is used. Preferably, when the thermal transfer sheet 200 is peeled up from the card substrate 11, it is desirable to move along an R shape having a radius of 1.5 mm or more.
[0109]
This driven roller portion 22 is a lower portion of the side surface of the tape accommodating portion 21 shown in FIG. Provided. In this example, the driven roller portion 22 has a shaft portion 22 </ b> A in a direction perpendicular to the conveying direction of the card substrate 11, and this shaft portion 22 </ b> A is movably attached to the tape housing portion 21. The driven roller portion 22 is rotated by the movement of the thermal transfer sheet 200 in a state where the adhesive surface side of the curable protective member 12 is in contact with the card substrate 11, and is removed from the card substrate 11 from the thermal transfer sheet 200 fed out from the original winding core 51A. The curable protective member 12 having a shape is peeled off.
[0110]
The peeling rod-like body is not limited to the driven roller portion 22 and may be a non-rotating body made of a member having a small friction coefficient with respect to the thermal transfer sheet 200. For example, a non-rotating body such as a round metal bar such as stainless steel or brass may be used. The winding torque of the thermal transfer device can be reduced by reducing the frictional resistance of the peeling rod.
[0111]
Furthermore, in this example, a card floating prevention plate 24 is provided as a protruding part for preventing card floating on the side surface of the tape accommodating portion 21 at a position adjacent to the driven roller portion 22, and particularly when the curable protective member 12 is peeled off. When the terminal portion of the card substrate 11 is peeled off, the jumping of the terminal portion of the card substrate 11 is suppressed. The occurrence of burrs can be suppressed by suppressing the jumping of the end portion.
[0112]
FIG. 17 is a conceptual diagram illustrating a configuration example of a hot stamp apparatus 500 as an example of the thermal transfer apparatus 302. In this example, the transfer cartridge 400 is detachably attached to the hot stamp apparatus 500. FIG. 17 shows a state in which the transfer cartridge 400 is loaded in the hot stamp apparatus 500.
[0113]
A hot stamp device 500 shown in FIG. 17 is provided with a card paper supply port 25 and a card discharge port 26, and a heat roller device 27 is attached in place of the vacuum hot press device 52 described in FIG. In this example, the thermal transfer sheet 200 defined as 0.5 g / cm <Fb <25 g / cm with respect to the adhesive force Fb between the curable protective member 12 and the support 16 is fed out from the original winding core 51A of the transfer cartridge 400. It is.
[0114]
For example, the thermal transfer sheet 200 is guided by a guide member 28A in the tape accommodating portion 21 and passes from the U-shaped portion 23 through the lower portion of the heat roller device 27 via the driven roller portion 22 to the other in the tape accommodating portion 21. The guide member 28B is guided to reach the take-up core 51B. Further, the tension Fa when the thermal transfer sheet 200 is wound by the winding core 51B is defined in a range of 200 g <Fa <1.5 kg.
[0115]
Therefore, when the card substrate 11 is inserted from the card paper supply port 25, the card substrate 11 is moved below the heat roller device 27 by the conveyor belt device 49 or the like. At this time, when the moving speed of the thermal transfer sheet 200 by the winding core 51B is V1, and the moving speed of the card substrate 11 by the conveyor belt device 49 is V2, V1 <V2. For example, the moving speed V2 of the card substrate 11 by the transport belt device 49 with respect to the moving speed V1 of the thermal transfer sheet 200 is defined as 1.02 · V1 <V2 <1.4 · V1.
[0116]
When the card substrate 11 and the thermal transfer sheet 200 are aligned so that the card substrate surface and the hologram image forming surface face each other at a predetermined position, the thermal roller device 27 causes the card substrate 11 and the thermal transfer sheet 200 to Is heat-pressed through the adhesive layer 14. At this time, the curable protective member 12 is brought into contact with the card substrate 11 by the heat roller device 27 in the range of 0 g <Fc <20 kg with respect to the applied pressure Fc. Regarding the transfer temperature Tx at this time, heat is applied from the heat roller device to the curable protective member 12 on the card substrate 11 within a range of 90 ° C. <Tx <250 ° C.
[0117]
Also during the heating, when the driven roller portion 22 for peeling is rotated by the movement of the thermal transfer sheet 200, the moving direction of the thermal transfer sheet 200 changes by the peeling angle θ with respect to the moving direction of the card substrate 11. The curable protective member 12 is peeled off from the support 16 by the driven roller portion 22. At the time of peeling, the card floating prevention plate 24 suppresses the jumping of the end portion of the card substrate 11. Thereby, the ID card 100 containing the face image protected by the curable protective layer 12 is discharged from the card outlet 26.
[0118]
Thus, according to the transfer cartridge 400 according to the present embodiment, the thermal transfer sheet 200 provided with the curable protective member 12 with an adhesive is fed out from the original winding core 51A, and the adhesive surface of the curable protective member 12 is attached. When the side is brought into contact with the card substrate 11, the curable protective member 12 having a size forming the outer shape of the card substrate 11 is peeled from the thermal transfer sheet 200 by the driven roller portion 22 attached to the side surface of the tape housing portion 21. .
[0119]
Accordingly, since only the curable protection member 12 corresponding to the size of the outer shape of the card substrate 11 is easily transferred from the thermal transfer sheet 200 to the card substrate 11, the card substrate 11 is transferred when the curable protection member 12 is transferred. Occurrence of uneven burrs (member residual pieces) protruding from the curable protective layer 12 to the outer peripheral edge can be extremely reduced. Thereby, the face image, character recording image, etc. on the card | curd board | substrate 11 can be favorably protected by the curable protective member 12 peeled from the support body 16. FIG.
[0120]
FIG. 18 is a cross-sectional view showing a configuration example of another transfer cartridge 401 and shows the vicinity of the peeling portion of the tape housing portion 21. In this example, an angle at which the thermal transfer sheet (support 16) 200 is pulled in a certain direction from the card substrate 11 is specified, and a card terminal floating prevention mechanism 60 is provided.
[0121]
The card end floating prevention mechanism (contact means) 60 shown in FIG. 18 includes a driven roller portion 29 for pressing in addition to the driven roller portion 22 for peeling, and is attached adjacent to the driven roller portion 22. It is applied to the upper surface of the substrate 11. A pressing plate 61 is mounted between the driving rollers 49A and 49B constituting the above-described conveyor belt device 49 so as to be vertically movable, and is pressed against the driven roller portion 29 so as to push up the card substrate 11. For example, the pressing plate 61 is provided with engaging screws 62A, 62B, and the like. A spring body 63A is fitted into the screw portion 62A, and a spring body 63B is fitted into the screw portion 62B. It is urged to push up. Thereby, the card substrate 11 and the curable protective member 12 can be brought into close contact with each other by the driven roller portion 29 and the pressing plate 61.
[0122]
In this example, when the peeling angle θ is an angle at which the thermal transfer sheet (support 16) 200 is pulled from the card substrate 11 in a certain direction by the winding core 51B, that is, the angle formed by the thermal transfer sheet 200 and the card substrate surface is
10 ° <θ <150 °
Stipulated in The peel angle θ is defined in this way because when θ <10 ° and θ> 150 °, the peelability of the curable protective member 12 deteriorates under the condition that the thermal transfer sheet 200 and the card substrate 11 are both moved. This is because it causes internal and external burrs. Preferably, the peel angle θ is set to 74.8 °. By setting the peel angle θ to 74.8 °, the curable protective member 12 can be transferred from the thermal transfer sheet 200 to the card substrate 11 without any internal burrs and external burrs with good reproducibility.
[0123]
In this example, a driven roller portion 62 for setting a peeling angle is provided adjacent to the driven roller portion 22 for peeling so that the peeling angle can be freely adjusted. Of course, the driven roller portion 62 may be a non-rotating rod-like body. The transfer cartridge 401 is provided with a member holding portion 63, and both ends of the driven roller portions 22, 29 and 62 are movably held. The member holding portion 63 is movably attached to the tape housing portion 21.
[0124]
For example, after the adjustment of the peel angle θ, the member holding portion 63 is fixed to the tape housing portion 21 by the engaging screws 64A and 64B. With this configuration, the face image and the character recording image on the card substrate 11 can be well protected by the curable protective member 12 peeled from the thermal transfer sheet 200.
[0125]
FIGS. 19A and 19B are cross-sectional views showing a configuration example of a folding mechanism 50 of another transfer cartridge 402. In this example, the folding mechanism 50 is provided on the transfer cartridge 402 side, and the crease reflecting both side edges of the card substrate is applied to the curable protection member 12.
[0126]
The transfer cartridge 402 shown in FIG. 19A has an elastic body pressure roller 55 as member deformation means. As the elastic body pressure roller 55, a soft pinch roller or the like is used. The elastic body pressure roller 55 has at least a pressing portion 55 </ b> A having a length L <b> 1 that is larger than the width W of the card substrate 11. The elastic body pressure roller 55 is provided with shaft portions 56A and 56B, and the shaft portions 56A and 56B are movably attached to a bearing portion such as a tape housing portion 21 (not shown). The bending mechanism 50 is constituted by the elastic body pressure roller 55, the shaft portions 56A and 56B, the bearing portion, and the like.
[0127]
In this example, when the thermal transfer sheet 200 is covered on the card substrate 11 and pressed by the elastic body pressure roller 55 from above the thermal transfer sheet 200, a crease reflecting both ends of the card substrate is applied to the curable protection member 12. By this fold, the transfer region of the curable protective member 12 to be peeled off in the thermal transfer sheet 200 can be defined. With this configuration, the face image and the character recording image on the card substrate 11 can be well protected by the curable protective member 12 peeled from the thermal transfer sheet 200.
[0128]
20A and 20B are cross-sectional views showing a configuration example of the bending mechanism 70 of another transfer cartridge 403. In this example, a folding mechanism 70 is provided on the transfer cartridge 403 side, and a crease reflecting both side edges of the card substrate is applied to the curable protection member 12.
[0129]
A transfer cartridge 403 shown in FIG. 20A has a plate-like elastic body (hereinafter referred to as a blade pad) 71 as member deformation means. The blade pad 71 has at least a pressing portion 71A having a length difference L2 larger than the width W of the card substrate 11. The blade pad 71 is provided with an attachment portion 72, and the attachment portion 72 is fixed to the tape accommodating portion 21 or the like. A bending mechanism 70 is configured by the blade pad 71 and the attachment portion 72.
[0130]
In this example, when the thermal transfer sheet 200 is covered on the card substrate 11 and pressed by the blade pad 71 from above the thermal transfer sheet 200, a crease reflecting both ends of the card substrate is applied to the curable protection member 12. By this fold, the transfer region of the curable protective member 12 to be peeled off in the thermal transfer sheet 200 can be defined. With this configuration, the face image and the character recording image on the card substrate 11 can be well protected by the curable protective member 12 peeled from the thermal transfer sheet 200.
[0131]
FIGS. 21A and 21B are cross-sectional views showing a configuration example of a bending mechanism 80 of another transfer cartridge 404. In this example, a folding mechanism 80 is provided on the transfer cartridge 404 side, and a crease is applied to the curable protective member 12 on the tip portion of the card substrate 11.
[0132]
The transfer cartridge 404 shown in FIG. 21A has a plate-like spring body (hereinafter referred to as a deformed plate spring) 81 as member deforming means. The deformed leaf spring 81 has at least a pressing portion 81A having a length L3 larger than the width W of the card substrate 11 and a bending portion 81B in the moving direction of the card substrate 11. The deformable leaf spring 81 is provided with an attaching portion 82, and the attaching portion 82 is fixed to the tape accommodating portion 21 or the like. A bending mechanism 80 is constituted by the deformed leaf spring 81, the attachment portion 82, and the like.
[0133]
In this example, when the thermal transfer sheet 200 is covered on the card substrate 11 and the card substrate 11 in this state is moved in the direction of the deformable plate spring 81, the leading end portion of the card substrate 11 is pressed by the bent portion 81B. Accordingly, a crease is applied to the curable protective member 12 on the tip portion of the card substrate 11. This crease can define the start line of the transfer region of the curable protective member 12 to be peeled off in the thermal transfer sheet 200. With this configuration, the face image and the character recording image on the card substrate 11 can be well protected by the curable protective member 12 peeled from the thermal transfer sheet 200.
[0134]
FIG. 22 is a conceptual diagram illustrating a configuration example of another folding mechanism 90 according to the hot stamp apparatus 500. In this example, the apparatus main body is provided with a member bending damper 91 and a rear end detection unit 92, and when the rear end of the card substrate 11 is detected, the damper unit 91 causes the rear of the card substrate 11 to be detected. The curable protective member 12 at the end is folded.
[0135]
A bending mechanism 90 shown in FIG. 22 includes a damper 91 for bending a member, a detection unit 92 for detecting a rear end, and a control device 93. The damper portion 91 has a stage 94 and a dumping drive portion 95, and is provided on the downstream side of the above-described driven roller portion 22 for peeling. The stage 94 has a width corresponding to one card substrate 11, and its home position HP is a horizontal position with respect to the card substrate 11 transport direction.
[0136]
A shaft portion 94A is provided at one end of the stage 94, and is movably engaged with a bearing portion provided in an apparatus main body (not shown). Near the entrance (left end) of the stage 94, a detection unit 92 for detecting the rear end is provided, the rear end of the card substrate 11 is detected, and a position detection signal S1 is output to the control device 93. The detection unit 92 is a reflective optical sensor such as a photocoupler.
[0137]
A controller 93 is connected to the detector 92, and it is determined whether or not the card substrate 11 has been transferred onto the stage 94 based on the position detection signal S1. Regarding the determination at that time, for example, the peak value of the position detection signal S1 is compared with a preset reference value, and when the position detection signal S1 exceeding the reference value is detected, the “end of the card substrate 11” is determined. "The card board 11 has not been reached" while the position detection signal S1 below the reference value is detected.
[0138]
In addition, a dump drive unit 95 is provided at the lower right end of the stage 94, and the stage 94 is moved up and down based on the shaft 94A described above based on the drive control signal S2. The drive unit 95 is preferably a solenoid or the like that can instantaneously shift the position of the stage 94. Here, if the angle formed between the home position HP of the stage 94 and the surface of the stage 94 after being lowered is the stage inclination angle θd, the stage inclination angle θd is set to 10 ° to 30 °. The reason why the stage inclination angle θd is defined in this way is that when θd <10 ° and θ> 30 °, the cutting property of the curable protective member 12 is deteriorated, which causes generation of internal burrs and external burrs. The stage inclination angle θd is preferably set to 15 ° to 25 °.
[0139]
Subsequently, an operation example of the bending mechanism of the hot stamp apparatus 500 will be described. 23A and 23B are conceptual diagrams showing an operation example of another folding mechanism 90. FIG. In this example, the end portion of the card substrate 11 reaches the stage 94 in the home position immediately before the end of the peeling by the follower roller portion 22 for the card substrate 11 with which the curable protective member 12 is in contact. Assuming
[0140]
On the premise of this, when the card substrate 11 to which the curable protective member 12 shown in FIG. 23A is bonded has reached the stage, the rear end portion thereof is detected by the detection unit 92. The position detection signal S1 is output to the control device 93. The controller 93 determines that the card substrate 11 has been transferred onto the stage 94, and outputs a drive control signal S 2 to the drive unit 95.
[0141]
Based on the drive control signal S2, the stage 94 shown in FIG. 23B is dropped downward from the hope position HP with the shaft 94A as a reference. Thereby, the stage 94 is inclined by the stage inclination angle θd, and the curable protective member 12 at the end of the card substrate can be instantaneously bent in a state where the card substrate 11 is placed on the stage. Therefore, the curable protective member 12 can be transferred from the thermal transfer sheet 200 to the card substrate 11 with good reproducibility without any internal and external burrs.
[0142]
In addition, a shaft drive unit 96 is provided on the shaft portion 94A of the stage 94, and at the same time as the stage 94 is dropped downward, a drive control signal S3 is output from the control device 93 to the drive unit 96. Drive control may be performed so that the axis center of the When configured in this manner, an upward pressing force acts when the curable protective member 12 is bent, and the curable protective member 12 at the end of the card substrate is placed between the left end of the stage and the driven roller portion 22 for peeling. It is possible to cut with higher accuracy.
[0143]
Next, a case where a transfer process is performed using a plurality of hot stamp apparatuses 500 will be described. FIG. 24 is a conceptual diagram showing a processing example (in series) performed by two hot stamp apparatuses 50A and 50B. FIG. 25A and FIG. 25B are process diagrams showing a lamination example of the thermal transfer sheet 200.
[0144]
In this example, two hot stamp devices 50A and 50B are prepared in advance, and the curable protective member 12 having a size covering the card substrate 11 is peeled off from the thermal transfer sheet 200 and transferred onto the card substrate 11 in an overlapping manner. To be made. The hot stamping apparatus 500 described above is used for the hot stamping apparatuses 50A and 50B, and the detachable transfer processing of the curable protective member 12 is executed in series.
[0145]
When serial processing is performed in this way, after the first curable protective member 12A is transferred onto the card substrate 11 shown in FIG. 25A by the hot stamp device 50A, the hot stamp device 50B is placed on the curable protective member 12A shown in FIG. 25B. Thus, the second curable protective member 12B can be transferred.
[0146]
Thereby, generation | occurrence | production of a burr | flash is further suppressed by transferring the hardening type protection members 12A and 12B in two steps. At the same time, it is possible to provide the ID card 100 having surface protection after completion of the card, which is superior to the card 103 with face image shown in FIG.
[0147]
FIG. 26 is a conceptual diagram showing another processing example (parallel) by the two hot stamp apparatuses 50A and 50B. In this example, two hot stamp devices 50A and 50B are prepared, and the process of peeling the curable protective member 12 having a size covering the card substrate 11 from the thermal transfer sheet 200 and transferring it onto the card substrate 11 is performed in parallel. Made.
[0148]
The hot stamp apparatus 500 described above is used for the hot stamp apparatuses 50A and 50B. If the parallel processing is performed in this way, the throughput is improved as compared with the case where the transfer processing is performed by one unit, and when the thermal transfer sheet 200 or the like is lost in one apparatus 50A, the transfer cartridge 400 is replaced by the apparatus. Since the transfer process can be continued with the other apparatus 50B while the printer is on, continuous operation is possible without stopping the peeling transfer process.
[0149]
This allows you to obtain identification cards, passports, alien registration cards, library cards, cash cards, credit cards, licenses such as automobile licenses, employee ID cards, employee ID cards, membership cards, medical cards and student ID cards. Ideal for processing large quantities at once.
[0150]
(7) Examples
The present inventors find out the optimum film thickness Th, hardness, transfer temperature Tx, and adhesive force (peeling force) Fb of the curable protective member 12 with respect to the surface protection on the card substrate and the workability when forming the protective member. I experimented as much as possible. Hereinafter, these experimental results will be described with reference to FIGS.
[0151]
(1) Preparation example of thermal transfer sheet 200
FIG. 27 is a cross-sectional view showing a structural example of the thermal transfer sheet 200 according to each embodiment. The thermal transfer sheet 200 employed in this experiment is obtained by sequentially laminating first and second release layers 18A and 18B, a curable protective member 12, an intermediate layer 19, a primer layer 20, and an adhesive layer 14 on a support 16. It is.
[0152]
In this example, on the 25 μm polyethylene terephthalate film as the support 16, a composition composed of the following compounds as the first and second release layers 18 </ b> A and 18 </ b> B was sequentially applied with a wire bar and dried.

Next, the following ultraviolet curable compositions were sequentially applied onto the release layer 18B with a wire bar and dried. The coating amount of the composition was adjusted so that the film thickness after curing was 0.4 μm, 0.5 μm, 1.5 μm, 2.0 μm, 3.0 μm, 4.5 μm, and 5.0 μm.

Thereafter, the coating on the release layer 18B was cured by irradiating with ultraviolet rays (80 W / cm: 5 m / sec) to form a curable protective layer (transfer foil) 12.
[0153]
Next, the following compositions as an intermediate layer 19 and a primer layer 20 were sequentially applied onto the curable protective layer 12 by a wire bar and dried.
Intermediate layer Dry film thickness 0.5μm
70 parts polyvinyl butyral
Isocyanate 30 parts
700 parts of methyl ethyl ketone
Primer layer Dry film thickness 0.5μm
Polyvinyl butyral 50 parts
SEBS elastomer 50 parts
350 parts of methyl ethyl ketone
350 parts of toluene
Thereafter, the following adhesive member was applied on the primer layer 20 with a wire bar and dried to form the adhesive layer 14.
Adhesive layer Dry film thickness 1μm
100 parts urethane modified olefin resin (manufactured by Toho Chemical Industry: Hitech S8529)
Thereby, the thermal transfer sheet 200 was obtained.
[0154]
(2) Example of creating a card substrate having a face image and a character recording image
A white polypropylene layer made of 50 μm white polypropylene (manufactured by Mitsubishi Oil Chemical Co., Ltd .: Naprene FL25HA) is thermally attached to both sides of 350 μm polyethylene terephthalate as the support 11C shown in FIG. 2 and 450 μm composite support. Body 11B-11D was obtained. Moreover, the writing layer 11A which consists of the following compositions was provided in the back surface side by wire bar application | coating so that it might become a dry film thickness of 40 micrometers.
Colloidal silica 2.5 parts
7.2 parts of gelatin
Dichlorotriazine curing agent 0.3 parts
100 parts of water
Further, a heat sublimation type image receiving layer 11E composed of 10 parts of polyvinyl butyral (manufactured by Sekisui Chemical Co., Ltd .: BX1) and 90 parts of methyl ethyl ketone is formed on the surface side by applying a wire bar so as to have a dry film thickness of 5 μm. A card substrate with a mold image-receiving sheet was formed. A card with a face image having a face image and a character recorded image on the surface by printing a face image and a character recorded image such as a name by a thermal head printer using a commercially available heat sublimation color ink sheet on the heat sublimated image receiving sheet A substrate 11 was prepared.
[0155]
(3) Example of making ID card 100 with a curable protective layer
The heat heat roller 27 (transfer temperature of 190 ° C., transfer speed of 5 cm / second) is made so that the surface side of the card substrate 11 prepared as described above faces the adhesive layer 14 side of the thermal transfer sheet 200 and is heated from the back side of the transfer foil. And the pressure card 10 kg) was passed, and the support 16 was peeled off from the thermal transfer sheet 200 after thermocompression bonding, thereby obtaining an ID card 100 with a face image with a curable protective layer.
[0156]
(4) Evaluation of compatibility between processability of curable protective member 12 and surface protection of card substrate
In this example, the ID card 100 was prepared by transferring the curable protective member 12 having seven kinds of film thicknesses created under the above manufacturing conditions to the card substrate 11 under the following peeling conditions. The relationship between the film thickness and the hardness of the curable protective layer 12 at this time was evaluated for the scratch resistance on the card substrate surface and the presence or absence of burrs.
Peeling condition: Peeling angle θ = 30 °
Regarding the scratch resistance of the ID card 100 at this time, the curable protective layer 12 on the card surface was rubbed 1000 times with a load of 1 kg / cm @ 2 using Kanakin No. 3 white cloth to evaluate the scratch resistance. Regarding burr, whether or not the uneven transfer foil residue protruded from the end of the ID card 100 was evaluated by visual evaluation.
[0157]
As a result, the table shown in FIG. 28 was obtained. FIG. 28 is a table showing an evaluation example of the compatibility between the occurrence of burrs in the curable protective member 12 and the surface protection of the card substrate. In FIG. 28, the double mark is “no problem with respect to scratch resistance and burr”, the circle is “almost no problem”, the triangle is “burr is generated but there is no problem”, and the x is “ Scratches and burrs occur ”.
[0158]
According to the experimental result, when the film thickness Th of the curable protective layer 12 is Th <0.5 μm, burrs are generated but there is no problem. However, when Th <0.5 μm, the scratch resistance is deteriorated with respect to the hardness B to 4H, and scratches remain on the card surface or cause damage to the face image forming area or the like at the time of peeling.
[0159]
In addition, when the film thickness Th is Th ≧ 5.0 μm, there is almost no problem with the scratch resistance except for the hardness B, but for the hardness HB to 4H, burrs of, for example, 300 μm or more are generated. A process must be introduced.
[0160]
Therefore, by defining the film thickness Th of the curable protective layer 12 to 0.5 μm <Th <5.0 μm, the workability at the time of forming the protective member is not deteriorated, and the surface protective property on the card substrate is improved. It was revealed that the ID card 100 can be provided with excellent resistance to abrasion and abrasion resistance.
[0161]
(5) Evaluation of relationship between film thickness Th of curable protective member 12 and transfer temperature Tx
In this example, under the manufacturing conditions described above, the curable protective member 12 having seven types of film thickness Th having a hardness of 3H, which was prepared by changing the following five types of transfer temperatures Tx, was transferred to the card substrate 11 under the above-described peeling conditions. An ID card 100 was created. The relationship between the film thickness of the curable protective layer 12 at this time and the transfer temperature was evaluated for the film adhesion on the card substrate surface and the presence or absence of burrs.
[0162]
Transfer temperature Tx: 90 ° C, 100 ° C, 190 ° C, 230 ° C, 250 ° C
In this case, the ID card 100 is coated with a film, and the curable protective layer 12 on the card surface is scratched with a cutter knife at intervals of 2 mm, and the surface is adhered with adhesive tape (Nichiban # 405), and the peeling angle is 180 °. The curable protective layer 12 was quickly peeled off and the card surface was visually evaluated. The evaluation method for burrs is as described above.
[0163]
As a result, the table shown in FIG. 29 was obtained. FIG. 29 is a table showing a relationship evaluation example between the film thickness Th of the curable protective member 12 and the transfer temperature Tx. In FIG. 29, the double circle mark is “no problem with film attachment and burr”, the circle mark is “almost no problem”, the triangle mark is “burr is generated but there is no problem”, and the x mark is “ Easy peeling and burrs occur ”.
[0164]
  According to the experimental result, when the film thickness Th of the curable protective layer 12 is Th <0.5 μm, burrs are generated but there is no problem. However, when Th <0.5 μm, film transferability deteriorates at 90 ° C., 100 ° C., 190 ° C., 230 ° C., and 250 ° C. with respect to the transfer temperature Tx, and the curable protective layer 12 can be easily formed from the card surface. Peeling offTheThis may cause the support to be deformed during transfer.
[0165]
Further, when the film thickness Th is Th ≧ 5.0 μm, there is almost no problem with the film adhesion except for the transfer temperatures of 90 ° C. and 250 ° C. However, the transfer temperature Tx is 90 ° C., 100 ° C., 190 ° C., 230 ° C., In any case of 250 ° C., for example, burrs of 300 μm or more are generated, and a separate process for removing burrs must be introduced.
[0166]
Therefore, the thickness Th of the curable protective layer 12 is defined as 0.5 μm <Th <5.0 μm, and the transfer temperature Tx is defined as 90 ° C. <Tx <250 ° C. It has been clarified that the ID card 100 can be provided without deteriorating the property, and with excellent surface protection on the card substrate and excellent film adhesion.
[0167]
(6) Evaluation of relationship between film thickness Th of curable protective member 12 and adhesive force (peeling force) Fb to support 16
In this example, the thickness of the adhesive layer 14 is adjusted under the manufacturing conditions described above, and the relationship between the film thickness Th of the curable protective member 12 and the five adhesive forces Fb is adjusted to cure seven types of film thicknesses of hardness 3H. The mold protection member 12 was transferred to the card substrate 11 under the following peeling conditions to produce an ID card 100. At this time, the presence / absence of burrs on the end face of the card substrate was evaluated in relation to the film thickness Th of the curable protective layer 12 and the adhesive force Fb.
Peeling condition: Peeling angle θ = 135 °
Adhesive strength: 0.5 g / cm, 2.5 g / cm, 5.0 g / cm, 10 g / cm
25g / cm
The evaluation method for the presence or absence of burrs on the ID card 100 at this time is as described above. As a result, the table shown in FIG. 30 was obtained. FIG. 30 is a table showing an example of evaluating the relationship between the film thickness Th of the curable protective member 12 and the adhesive force (peeling force) Fb to the support 16. In FIG. 30, the double mark is “no problem with burr”, the circle is “almost no problem”, the triangle is “burr is generated but there is no problem”, and the x is “burr is generated”, The black triangle mark indicates “untransferable”.
[0168]
According to this experimental result, when the film thickness Th of the curable protective layer 12 is Th = 0.5 μm, it is almost “no problem” except for the adhesive force Fb = 0.5 g / cm and 25 g / cm. However, when the film thickness Th is Th <0.5 μm, slight burrs are generated at the adhesive force Fb = 0.5 g / cm and 2.5 g / cm, and the adhesive force Fb = 5 g / cm, 10 g / cm and 25 g / cm. Transfer failure.
[0169]
When the film thickness Th is Th ≧ 5.0 μm, the adhesive force Fb is almost 0.5 g / cm, 2.5 g / cm, 5.0 g / cm, 10 g / cm, or 25 g / cm. For example, burrs of 300 μm or more are generated, and a separate process for removing burrs must be introduced.
[0170]
Therefore, by defining the thickness Th of the curable protective layer 12 to 0.5 μm <Th <5.0 μm and the adhesive force Fb to 0.5 g / cm <Fb <25 g / cm, the protective member It has become clear that the ID card 100 can be provided without deteriorating the workability at the time of formation, and excellent in surface protection on the card substrate and excellent in scratch resistance (wear resistance).
[0173]
【The invention's effect】
As explained above,According to the ID card manufacturing method of the present invention, the film thickness is regulated to 0.5 μm to 5.0 μm by transferring a substantially transparent curable protective member onto the card substrate on the surface on which the recorded image is formed. IsThe adhesive force Fb is 0.5 g / cm <Fb <25g / cm Stipulated inTo form a curable protective layer on the card substrateDone.
[0174]
With this configuration, it is possible to eliminate the occurrence of burrs at the card outer end of the curable protective layer without deteriorating the surface protection on the card substrate. Thereby, an ID card excellent in scratch resistance can be manufactured with good yield and good reproducibility.
[0177]
The present invention is extremely suitable when applied to contact-type or non-contact-type electronic cards and magnetic cards that require prevention of forgery and alteration.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a structural example of an ID card 100 as an embodiment.
FIG. 2 is a cross-sectional view showing an example of a laminated structure of a card 101 with a face image.
FIGS. 3A and 3B are cross-sectional views showing an example of a laminated structure of cards 102 and 103 with other face images. FIGS.
4A is an image view showing a configuration example (No. 1) of a cross section of the plane of the curable protective layer 12 of the ID card 100 and B. FIG.
FIG. 5A is a plan view of the curable protective layer 12 of the ID card 100, and B is an image diagram showing a configuration example (part 2) of the cross section.
FIG. 6 is an image diagram showing a configuration example of a plane of the curable protective layer 12 of another face image card 104.
FIG. 7 is a cross-sectional view showing an example of a laminated structure of a thermal transfer sheet 200 as an embodiment.
FIG. 8 is a conceptual diagram illustrating a half cut example of a thermal transfer sheet 200.
9A to 9C are process diagrams showing an example of forming a thermal transfer sheet 200 as an embodiment.
FIG. 10A is a perspective view showing an example of a process for forming a hot stamp film 32, and FIG. 10B is a partial cross-sectional view showing an example of a configuration when forming a hologram image.
FIG. 11A is a perspective view illustrating an example of a process for forming a laminate film 33 (part 1), and FIG. 11B is a partial cross-sectional view illustrating an example of a configuration when forming a hologram image.
12 is a perspective view showing an example (part 2) of forming a laminate film 33. FIG.
FIGS. 13A to 13C are cross-sectional views illustrating an example of a process for forming an ID card 100 as an embodiment. FIGS.
14 is a conceptual diagram showing an example of alignment between the card substrate 11 and the thermal transfer sheet 200. FIG.
FIG. 15 is a conceptual diagram showing a configuration example of an ID card manufacturing apparatus 300 as an embodiment.
FIG. 16 is a perspective view showing a configuration example of a transfer cartridge 400 as an embodiment.
FIG. 17 is a conceptual diagram showing a configuration example of a hot stamp apparatus 500.
18 is a cross-sectional view showing a configuration example of another transfer cartridge 401. FIG.
FIGS. 19A and 19B are cross-sectional views illustrating a configuration example of a folding mechanism 50 of another transfer cartridge 402; FIGS.
FIGS. 20A and 20B are cross sections showing a configuration example of a folding mechanism 70 of another transfer cartridge 403; FIGS.
FIGS. 21A and 21B are cross-sectional views showing a configuration example of a folding mechanism 80 of another transfer cartridge 404; FIGS.
22 is a conceptual diagram showing a configuration example of another bending mechanism 90. FIG.
FIGS. 23A and 23B are conceptual diagrams showing an operation example of another folding mechanism 90. FIGS.
FIG. 24 is a conceptual diagram showing a processing example (in series) performed by two hot stamp apparatuses 50A and 50B.
FIG. 25 is a process diagram illustrating an example of stacking of thermal transfer sheets 200.
FIG. 26 is a conceptual diagram showing a processing example (parallel) by two hot stamp apparatuses 50A and 50B.
FIG. 27 is a cross-sectional view showing a lamination example of a thermal transfer sheet 200 according to each example.
FIG. 28 is a table showing an evaluation example of compatibility between workability of the curable protective member 12 and surface protection of the card substrate.
FIG. 29 is a table showing a relationship evaluation example between the film thickness Th of the curable protective member 12 and the transfer temperature Tx.
30 is a table showing an example of evaluating the relationship between the film thickness Th of the curable protective member 12 and the adhesive force (peeling force) Fb to the support 16; FIG.
[Explanation of symbols]
11 Card board
12 Curable protective layer (Curable protective member)
13 Hologram image
14 Adhesive layer (adhesive sheet)
16 Support
21 Tape housing (housing)
22 Driven roller (rod-like body)
24 Card levitation prevention plate (protrusion)
31 Base film
32 Hot stamp film
33 Laminate film
41, 49 Conveyor belt device
42 Raw card supply department
43 Image forming unit
46 Image check section
51 Transfer foil core (component supply unit)
52 Vacuum heat press equipment
54 Cutting device
60 Card supply means
100 ID card
200 Thermal transfer sheet
300 ID card manufacturing equipment
301 Image forming apparatus (image forming means)
302 Thermal transfer device
400 Thermal transfer sheet cartridge (transfer cartridge)
500 hot stamping equipment

Claims (5)

Forming a recorded image on the card substrate;
Forming a curable protective layer by transferring a substantially transparent curable protective member onto the card substrate on the surface on which the recorded image is formed,
The curable protective member is
It is a transfer foil provided with an ultraviolet curable layer and an adhesive layer on a support,
When forming the curable protective layer on the card substrate,
When the adhesive strength of the supporting lifting member and the UV cured layer was set to Fb,
0.5 g / cm <Fb <25 g / cm
Stipulated in
When the thickness of the curable protective layer is Th,
0.5 μm ≦ Th < 5.0 μm
Defined ID card manufacturing method characterized by and Turkey on. When the thickness of the adhesive layer is t,
0.1 μm <t <20 μm
The method of manufacturing an ID card according to claim 1 , wherein The method of manufacturing an ID card according to claim 1 or 2 , wherein the hardness of the ultraviolet curable layer is HB or more in terms of pencil hardness. When the processing temperature when transferring the curable protective member onto the card substrate is Tx,
90 ° C <Tx <250 ° C
The method of manufacturing an ID card according to claim 1, wherein the ID card is defined as follows.   5. The method for manufacturing an ID card according to claim 1, wherein an image or a shape for preventing falsification is applied to an adhesive surface side of the curable protective member.

Images