JP2000207519A - Contact/noncontact type bifunctional ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacture method for reinforcing the bonding strength of an IC module and a card substrate in the manufacture method of a contact/ noncontact bifunctional IC card. SOLUTION: The manufacture method of a contact/noncontact type bifunctional IC card includes, at the time of installing an IC module for contact/ noncontact type IC module in a recessed part for IC module installation 18 in a substrate where an antenna coil 13 and the antenna coil connection terminal 14 are buried, processes of two different thermal sealing conditions, namely, a process for thermally sealing conduction adhesive 19 part by using a heater block 31 having a pin point-like heating part and connecting a substrate-side antenna coil terminal 14 and an IC side antenna coil connection terminal 114 and a process for thermally sealing an insulating adhesive part by using a flat heater block 32. Thus, the characteristics of conduction adhesive and insulating adhesive can sufficiently be utilized and high bonding strength is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention realizes, with a single IC chip, the functions of a contact type IC card which performs communication via an external device connection terminal and a non-contact type IC card which performs non-contact communication by electromagnetic induction. The present invention relates to a method for manufacturing a contact-type non-contact type shared IC card, in which heat sealing of an IC module is performed under two different conditions.

[0002]

2. Description of the Related Art IC cards are classified into a contact type IC card which performs data communication with an external device through a connection terminal and a non-contact type IC card which performs communication by electromagnetic induction through a coil. The card is used for settlement, and the non-contact type IC card is used for gate access control of a transportation system or the like. In recent years, an IC chip having both the function of a contact IC card and the function of a non-contact IC card in one IC chip has been developed. Conventionally, in manufacturing a contact-type non-contact type shared IC card having both a function of a contact-type IC card and a function of a non-contact type IC card using the IC chip, a contact / non-contact type shared IC unit is integrated with an antenna. rear,
A method 1 in which a card is formed by laminating with a substrate such as vinyl chloride or a method 2 in which a contact / non-contact common IC portion is embedded in a card with an antenna and integrated therewith are used.

FIG. 7 is a diagram showing an embodiment (method 1) of a conventional contact-type non-contact common IC card, and FIG. 8 is a diagram showing another embodiment of a contact-type non-contact common IC card (method 2). FIG. In the case of method 1, first, as shown in FIG.
An IC module-mounted board 521 on which an IC module 51, an antenna coil 53 and an antenna coil connection terminal 54 are integrated is prepared, and the board is divided into a core sheet 522 in which an IC mounting opening 58 is formed, and a core sheet 522. Are laminated with the oversheets 523 and 524 for protecting them, and are formed into the integrated card base 52 by applying pressure and heating with a press machine with or without an adhesive (FIG. 7).
(B)). In this case, there is an advantage that there is no detachment of the connection terminal surface. However, since the IC is mounted and then formed into a card by a hot press, the IC is subjected to heat and pressure load applied during card processing.
There is a problem that the malfunction of the device easily occurs. In addition, there are problems that it is difficult to provide various additional functions necessary for the card and that the mass productivity is poor. FIG. 7C is a plan view of the card shown in FIG. 7B.

In the case of method 2, as shown in FIG. 8A, first, a center core sheet 621 on which an antenna coil 63 and an antenna coil connection terminal 64 are formed is prepared, and oversheets 623 and 624 are provided thereon. They are laminated and formed on an integrated card base 62 with or without an adhesive (FIG. 8 (B)), and thereafter, a concave portion 68 for mounting the IC module 61 is cut to form an antenna coil connection terminal in the card base. The connection terminals 614 provided on the IC chip mounting board and the antenna coil connection terminals 64 on the base side are connected with a conductive adhesive such as solder, and the portions other than the connection terminal portions are exposed. After applying an insulating adhesive to the bonding area, the IC module 61 is loaded, and the connection and bonding are performed by a single heating by the heater block, and the contact type and the non-contact type are shared. To produce a C card (Figure 8
(D)). FIG. 8E is a plan view of the card of FIG. 8D. However, in this case, since the antenna coil connection terminal 64 is on the IC module bonding surface, the bonding of the IC module and the connection of the antenna coil are performed by one heat. It is necessary to meet the conditions, which has a problem that the appearance of the front and back surfaces is also adversely affected, and that the adhesive strength of the hot melt adhesive is reduced.

[0005]

Therefore, in the present invention,
IC with both contact / non-contact IC card functions
An object of the present invention is to provide a manufacturing method in which a card has sufficient adhesion of an IC module to a card base, does not cause separation of the module or disconnection of an antenna coil, and easily provides various additional functions required for the card.

[0006]

According to a first aspect of the present invention, there is provided an external device connection terminal, an antenna coil embedded in a card base, and an antenna coil connection terminal. An antenna coil connection terminal and an antenna coil connection terminal on the IC module side are connected by fitting and mounting an IC module having both functions of a contact type and a non-contact type in an IC module mounting concave portion. In the method of manufacturing a common IC card,
When mounting the contact-type and non-contact-type common IC module in the module mounting concave portion, the conductive adhesive portion is heat-sealed using a heater block having a pinpoint-shaped heating portion, and the base-side antenna coil connection terminal is formed. The process is performed in two steps of different heat sealing conditions: a step of connecting the IC side antenna coil connection terminal, and a step of heat sealing the insulating adhesive portion using a planar heater block. Manufacturing method of contact type non-contact type shared IC card,
It is in. Because of this manufacturing method, a manufacturing method that uses both a conductive adhesive and an insulating adhesive to prevent peeling of an IC module and disconnection of an antenna coil against a bending load on a card and to easily provide an additional function. It can be.

A second aspect of the present invention for solving the above problems has an external device connection terminal, an antenna coil embedded inside a card base, and an antenna coil connection terminal.
The antenna coil connection terminal and the antenna coil connection terminal on the IC module side are connected by fitting and mounting an IC module having both functions of a contact type and a non-contact type in the recess for mounting the IC module. In the method for manufacturing a contact-type shared IC card, a step of cutting a first recess into a card base in which an antenna coil and an antenna coil connection terminal are embedded so that the external device connection terminal of the IC module can be mounted therein; Cutting the second concave portion to a depth at which the mold resin portion of the IC module can be embedded by further cutting between the connection terminals of the two antenna coils; and the antenna coil connection terminal of the card base around the second concave portion. Excavating the third recess to a depth reaching the connection terminal surface above, filling the third recess with a conductive adhesive, A step of applying an insulating adhesive or temporarily placing an insulating adhesive sheet in either the outer first concave portion or the bonding portion of the IC module; and providing an IC module having both contact and non-contact functions. Temporarily placing the IC module in the concave portion for mounting the IC module, and heating and pressing only the conductive adhesive portion of the third concave portion using a heater block having two pinpoint heating portions; and an external device of the IC module. After heating and pressurizing the entire surface of the connection terminal using a heater block, further cooling the portion,
And a method of manufacturing a contact-type non-contact type shared IC card. Because of this manufacturing method, a manufacturing method that uses both a conductive adhesive and an insulating adhesive to prevent peeling of an IC module and disconnection of an antenna coil against a bending load on a card and to easily provide an additional function. It can be.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing the manufacturing method of the present invention, an example of a contact-type non-contact type shared IC card that can be manufactured by the manufacturing method will be described with reference to the drawings. FIG. 1 is a plan view showing one embodiment of a contact type non-contact type shared IC card. FIG. 2 is a partially enlarged sectional view taken along line AA of FIG. In the plan view of FIG. 1, the external device connection terminal 112 is provided on the card surface because it is a contact-type non-contact type shared IC card, but the terminal pattern shape and the like are omitted. The appearance of a chain line around the card indicates that the antenna coil 13 exists inside the card. The antenna coil connection terminal 14 is connected to both ends of the antenna coil and I
IC for connecting the connection terminals 114 of the C module substrate
It is formed so as to face the module mounting recess 18.

As shown in FIG. 2, in the contact-type non-contact type common IC card, the IC-side antenna coil connection terminal 114 and the card base-side antenna coil connection terminal 14 have a small-diameter recess excavated in the IC module mounting recess 18. The inside is filled with a conductive adhesive 19, whereby conduction is achieved. A portion other than the two connection terminals is bonded by applying a normal insulating adhesive 20 or temporarily placing an adhesive sheet. In addition, in the contact type non-contact type common IC card 10 of FIG. 2, in order to reduce the bending stress applied to the IC module bonding portion and to prevent the IC module from peeling or falling off,
Although the stress absorbing groove 184 is provided on the outer periphery of the concave portion for mounting the IC module, it is not essential.

In the contact-type non-contact type shared IC card 10 shown in FIG. 2, the antenna coil 13 is formed on the core sheet 121, and the core sheet 122, 123, 1
24, and overlaid with oversheets 125 and 126, and is composed of six layers of base sheet. The core sheet 122 plays a role of adjusting the card thickness.
5,126. Although FIG. 2 shows an example in which the card base is formed of a six-layer base sheet, the card base is not limited to six layers and may have a structure of two to five layers.

FIG. 3 is a diagram showing an example of a recess for mounting an IC module. FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along line AA of FIG. The concave portion 18 for the IC module mounting portion is formed at two levels, and the first concave portion 181 is formed at a depth at which the external device connection terminal 112 can be embedded and an adhesive can be applied or laid. The second recess 1 has a size and depth substantially at the center of the first recess so that 115 parts of the mold resin of the IC module can be accommodated.
82 is formed by cutting. Further, in the outer peripheral region of the first concave portion, the stress absorbing groove 184 can be formed by excavation so as not to reach the antenna coil connection terminal. Further, a small-diameter third concave portion 183 for connecting an antenna coil connection terminal is formed by excavation at two places in the first concave portion and around the second concave portion. This depth is a depth at which the surface of the antenna coil connection terminal 14 is exposed and does not penetrate. As described above, the third concave portion 183 is filled with the conductive adhesive,
The conduction between the C-side connection terminal and the card base-side connection terminal is achieved. Although the third concave portion 183 is shown in a circular shape in FIG. 3, the shape is not limited to the circular shape but may be a rectangular shape or a square shape, or may be a shape connected to the second concave portion.

FIG. 4 is a diagram showing an example of an IC module using a contact-type non-contact type common IC chip. FIG. 4 (A)
FIG. 4B is a diagram showing a substrate surface of an external device connection terminal, FIG.
Is a view showing the back surface of the substrate, and FIG. 4C is a cross-sectional view along the bonding wires 113 of the IC module. As shown in FIG. 4A, the surface of the external device connection terminal 112 has an IS
Eight terminals C1 to C8 are formed based on the O standard. Of these, the terminals C4 and C8 are for future use and are not actually used at present. Each terminal is separated by a separation groove. The module side terminal connected to the antenna is usually provided separately from C1 to C8, C9,
It is formed at the terminal of C10. However, in the case of a non-contact type IC module with a board, C1
It does not have the terminal pattern of C8. The external device connection terminals are usually formed in a rectangular shape as shown in FIG. 4A, and are arranged such that the long sides of the card and the terminals are parallel as shown in FIG.

As shown in FIG. 4 (B), C for antenna connection is used.
9 and C10 terminals are connected to the I
It is connected to the C-side antenna coil connection terminal 114.
If there are C1 to C8 terminals, they are similarly connected to the board surface side terminal plate by wire bonding, through holes, etc., but their details are omitted in FIG. After bonding, IC chip 111, bonding wire 1
The portion 13 is covered and protected by the mold resin 115 (FIG. 4C).

The terminal board of such an IC module is
Paste copper foil on both sides of an insulating substrate such as glass epoxy, polyimide, polyester, BT resin, etc., use etching or other processing on the copper foil, draw external device contact terminals on the front surface, and coil connection terminals on the rear surface , And then plating with nickel, copper, gold, etc. The IC chip 111 is mounted on this substrate, and the connection between the IC chip and the connection wiring provided in the substrate is performed by a bonding wire 113 such as a gold wire. Further, the periphery of the IC chip is sealed using a mold resin 115 such as an epoxy resin.

It is preferable that the metal material of the terminal 114 connected to the antenna coil of the IC module and the metal material of the base-side antenna coil connection terminal 14 be the same material. This is because if the same material is used, the material selection range of the conductive adhesive is widened, and a material that can be strongly bonded can be used.
In general, a material obtained by plating a copper material with nickel under plating and gold plating is preferably used.

Next, a method for manufacturing the contact-type non-contact type shared IC card of the present invention will be described. FIG. 5 is a diagram illustrating the steps of the method for manufacturing a contact-type non-contact type shared IC card according to the present invention. FIG. 5 illustrates the case of a four-card structure. Although the manufacturing method of the present invention is basically based on the above-mentioned conventional method 2, there is a feature which is not present in the conventional method in the formation of the concave portion for mounting the IC module and the mounting method of the IC module, particularly the heat sealing method.

First, the antenna coil 13 and the antenna coil connection terminal 14 are formed on a core sheet 121 made of vinyl chloride, polyethylene terephthalate (PET) or the like, which is drawn by photoetching or printing with conductive ink or the like, a core sheet 122, and an oversheet 125. , 126 are laminated to form an integrated card base (FIG. 5A). At this time, a print such as a pattern for decorating the card or a necessary display may be printed on the front surface of the core sheet 122 in advance, and the print may be provided on the back surface of the core sheet 121 before forming the antenna coil. Further, it is preferable to print registration marks for alignment on the core sheet 121, all the other core sheets, and the oversheet. It is also preferable that the core sheet 124 be provided with a mark indicating a position for cutting the concave portion for mounting an IC module and a hitting rule indicating a punching position of the card.

As shown in FIG. 2, in the case of a six-layer structure, if a vinyl chloride material is used for the core sheets 123 and 124 on the front and back surfaces, ordinary printing and various special printing described later can be performed. Oversheet 1 when transferring magnetic tape
After the transfer to the 26 surfaces, if the material is a vinyl chloride material, the card base material can be integrated by hot-pressing. If the material is not a vinyl chloride material, it is bonded using an adhesive material.
In addition to the above, the antenna coil is formed by transferring the transfer foil on which the antenna pattern is formed to the core sheet, embedding the winding coil, and drawing while fusing the conductor with the coated resin to the base material with a weld bonder. And the like.

After hot pressing, punching is performed into individual card shapes based on the hitting rule. Then, the concave portion 18 for mounting the IC module 11 is provided with the first concave portion 181, the second concave portion 182, the third concave portion 183, and the concave portion 18 having the stress absorbing groove 184 if necessary.
It is formed by cutting and excavating by processing or the like. The bottom surface of the third concave portion should be excavated to just expose the surface of the antenna coil connection terminal 14 in the card base, and should not penetrate therethrough (FIG. 5B). When the stress absorbing groove 184 is provided, it is necessary that the depth does not reach the depth of the third concave portion. When the depth is larger than the third concave portion, the antenna coil 13 or the connection terminal 14 may be used.
Is likely to be cut.

Next, the third concave portion 183 is filled with the conductive adhesive 19, and the other portion of the first concave portion where the IC module contacts the card base is coated with a normal insulating adhesive. Alternatively, an insulating adhesive sheet cut into a predetermined shape is temporarily placed on the IC module substrate side. The adhesive sheet may be either temporarily placed in the first concave portion or temporarily placed on the IC module side. The die-cut shape of the adhesive sheet can be, for example, as shown in FIG.
In this shape, the mold resin portion 115h and the third concave portion 183
An opening is formed in the portion of h. Opening 18 of third recess
3h is for conducting the antenna coil connection terminal.

The conductive adhesive may be a thermosetting or hot-melt adhesive in which conductive metal particles or the like are dispersed in a resin, or may be a solder paste, a silver paste, or a metal solder melted by heat. . The IC module 11 is temporarily placed in the mounting recess so that the antenna coil connection terminal 114 of the IC module 11 contacts the third recess filled with these materials, and module sealing is performed.

The module sealing is performed in two stages. This step may be performed first, but FIG. 5 illustrates an example in which the terminal connection is performed by first heating the conductive adhesive filled portion of the third concave portion. To this end, for example, using a heater block 31 having a two-point pinpoint heating section in the portion, for example, at 200 ° C. for 10 seconds,
Hot pressing is performed under a relatively high temperature condition of ² kgf / cm ² (FIG. 5D). As a result, the conductive adhesive such as solder paste is melted, and the antenna coil connection terminals are connected. Subsequently, for example, using a heater block 32 of a module substrate size to bond the insulating adhesive,
Hot pressing is performed under relatively low conditions of 50 ° C., 5 sec, and 2 kgf / cm ² (FIG. 5E). Finally, cooling is performed using a cooling press 33 having an area larger than the substrate size (FIG. 5F).

Conventionally, this heat sealing step is performed in one step, so that it is necessary to set the temperature at a high temperature suitable for the conductive adhesive. However, there is a problem that the heat history adversely affects the adhesive strength, and the heat seal divided into two optimum conditions can sufficiently exhibit the properties of both adhesives. In addition, this sealing method can efficiently transmit heat to the conductive adhesive that needs to be connected at a high temperature, and minimize the amount of heat transmitted to other parts. The appearance of the front and back surfaces of the card can be improved small. further,
Various additional functions such as transfer of a sign panel or a hologram foil and formation of a thermal rewrite layer can be easily provided.

(Examples of Other Materials) <Card substrate> Various materials other than vinyl chloride resin and PET can be used for the card substrate. For example, PET-G, polypropylene resin, polycarbonate resin, acrylic resin Resins, polystyrene resins, ABS resins, polyamide resins, polyacetal resins, and the like. <Conductive adhesive> As the conductive adhesive, a solder paste or a silver paste can be used as described above, and a conductive adhesive sheet, a paste of silver, copper, carbon, or the like, metal solder, anisotropic conductive A conductive film or the like can be used. <Insulating Adhesive> As the insulating adhesive, various hot-melt or thermosetting adhesives such as an epoxy-based or polyester-based adhesive or an adhesive sheet can be used. Further, an adhesive sheet, cold glue, or the like may be used. The application of the adhesive or the temporary placement of the adhesive sheet is performed on the IC even if the IC card is on the card substrate side.
It may be on the chip side.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a contact-type non-contact type shared IC card according to the present invention will be described below with reference to FIGS. (Example) As shown in FIG.
As 1, a base material in which a 35 μm thick copper foil is laminated on a 180 μm thick white rigid vinyl chloride sheet,
The antenna coil 13 and the antenna coil connection terminal 14 were formed by using a photoetching technique. This core sheet is used as a core sheet 122 for thickness adjustment.
μm white hard vinyl chloride sheet and printed white hard vinyl chloride sheets 123 and 124 with a thickness of 1
Use two 80 μm pieces, and oversheet 125,
A transparent vinyl chloride sheet 2 having a thickness of 50 μm as 126
The sheets are laminated on the top and bottom of the core sheet and hot-pressed (150 °
C, 20 kgf / cm ² , 30 minutes) to produce a card base 12 with an antenna coil embedded therein. The antenna coil 13 had a line width of 300 μm and was formed so as to be wound substantially four times around the outer periphery of the card base.

After the hot press, punching was performed for each card size based on the hitting rule provided in advance. next,
The first concave portion 181 was cut to a depth corresponding to the thickness of the external device connection terminal of the IC module and the adhesive sheet by NC cutting of the IC module mounting portion of the card base having the coil embedded therein. At this stage, the size of the first concave portion is 1
3 mm x 11.8 mm (corner radius of curvature 2.5 mm),
The depth was 200 μm. Subsequently, the second concave portion 182 is cut by cutting the space between both antenna coil connection terminals so as to have a size of approximately 8 mm × 8 mm and a depth of 600 μm.
The depth was set so that 115 parts of the mold resin of the C module could be embedded. Further, a third concave portion having a diameter of 2 mm was drilled at a depth of 420 μm around the second concave portion and two places on the antenna coil connecting terminal 14 of the card base so that the surface of the antenna coil connecting terminal appeared. Further, the entire periphery of the first concave portion was excavated with the same size and curvature as the first concave portion and with a width of 0.5 mm to form a stress absorption groove 184 having a depth of 350 μm (FIG. 3B).

On the other hand, an IC chip 111 having a common function of a contact type and a non-contact type and a 150 μm-thick glass epoxy substrate (size: 13 mm × 12 mm (curvature radius of corners: 2.5 mm)) with copper foil on both sides. Was prepared. An antenna coil connection terminal 114 is formed on the IC chip side of the substrate, nickel and gold plating is applied to the terminal portion, and a contact type non-contact type common IC chip is mounted on the substrate. The connection with the device connection terminal was performed, and the wire bonding with the antenna coil connection terminal was performed using a gold wire. Further, the periphery of the IC chip was sealed with epoxy resin 115 (FIG. 4).
(C)).

Third concave portion 18 of the concave portion for mounting the IC module
3 was potted with solder paste. First
A polyester resin-based hot-melt insulating adhesive sheet was temporarily placed on the bottom portion of the concave portion except for the third concave portion. As shown in FIG. 6, this adhesive sheet has a size such that its outer shape enters the first concave portion, and
A sheet previously punched into a shape provided with 15 h and a conduction hole 183 h was used.

Next, the I prepared as described above is
After the C module 11 was fitted and temporarily placed, module sealing was performed. First, in order to connect the terminals by heating the solder paste filled portion of the third concave portion, a heater block 31 having a two-point pinpoint-shaped heating portion in the portion is used at 200 ° C. for 30 seconds. , 1k
The hot press was performed under the condition of gf / cm ² (FIG. 5).
(D)). Subsequently, in order to perform hot pressing of the adhesive sheet, hot pressing was performed at 150 ° C., 5 sec, and 3 kgf / cm ² using a heater block 32 having a module substrate size (FIG. 5E). Finally, using a cooling press 33 having an area larger than the substrate size, 20 °
The cooling was performed under the conditions of C, 5 sec and 2 kgf / cm ² (FIG. 5 (F)). Thereby, the I of the card thickness 820 μm
A contact-type non-contact type common IC card having excellent surface properties and physical strength with a C card and high IC module adhesive strength was obtained.

[0030]

According to the method of manufacturing a contact-type and non-contact type common-use IC card of the present invention, when mounting an IC module, module sealing is performed in two steps, and a conductive adhesive and an insulating adhesive are respectively applied. Since you can select the optimal heat sealing conditions,
The performance of both adhesives can be fully exhibited. Furthermore, in the manufacturing method of the present invention, heat is efficiently transmitted to the conductive adhesive which requires connection at a high temperature, and the amount of heat transmitted to other parts is minimized by reducing the area of the heat-pressure part. be able to. Therefore, there is an advantage that the appearance of the front and back surfaces is improved and various additional functions necessary for the card can be easily provided.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a contact type non-contact type shared IC card.

FIG. 2 is a partially enlarged cross-sectional view taken along line AA of FIG.

FIG. 3 is a view showing an IC module mounting recess.

FIG. 4 is a diagram illustrating an example of an IC module using a contact-type non-contact type common IC chip.

FIG. 5 is a diagram illustrating a manufacturing process of the contact type non-contact type common IC card of the present invention.

FIG. 6 is a diagram illustrating a die-cut shape of an adhesive sheet.

FIG. 7 is a view showing an embodiment (method 1) of a conventional contact-type non-contact type shared IC card.

FIG. 8 is a diagram showing another embodiment (method 2) of a contact-type non-contact type shared IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 IC card 11 IC module 12 Card base 13 Antenna coil 14 Antenna coil connection terminal 18 IC module mounting concave part 19 Conductive adhesive 20 Adhesive 31 Heater block 32 Heater block 33 Cooling press 51, 61 IC module 52, 62 Card base 53, 63 Antenna coil 54, 64 Antenna coil connection terminal

Claims (3)

[Claims] 1. An external device connection terminal, an antenna coil embedded inside a card base, and an antenna coil connection terminal, wherein the antenna coil connection terminal and the IC module side antenna coil connection terminal are in non-contact with a contact type. A method of manufacturing a contact-type non-contact type shared IC card which is connected by fitting and mounting an IC module having a mold and both functions in an IC module mounting concave portion, wherein a contact type non-contact is provided in the IC module mounting concave portion. Type common IC
A step of connecting the substrate-side antenna coil connection terminal and the IC-side antenna coil connection terminal by heat-sealing the conductive adhesive portion using a heater block having a pinpoint-shaped heating portion when mounting the module; A method for manufacturing a contact-type non-contact type shared IC card, which is performed in two steps of heat-sealing an insulating adhesive portion using a planar heater block and heat-sealing conditions different from each other. 2. An external device connection terminal, an antenna coil embedded inside the card base, and an antenna coil connection terminal, wherein the antenna coil connection terminal and the IC module side antenna coil connection terminal are not in contact with the contact type. A method for manufacturing a contact-type non-contact type shared IC card which is connected by fitting and mounting an IC module having a mold and both functions in a recess for mounting an IC module, the card having an antenna coil and an antenna coil connection terminal embedded therein. A step of cutting the first recess to a depth at which the external device connection terminal of the IC module can be mounted on the base; and further cutting between the connection terminals of both antenna coils in the first recess to form a mold resin portion of the IC module. Cutting the second recess to a depth that can be buried; and surrounding the second recess and on the antenna coil connection terminal of the card base. Excavating the third recess to a depth reaching the connection terminal surface, filling the third recess with a conductive adhesive, and bonding the first recess other than the third recess or the bonding portion of the IC module. Applying an insulating adhesive or temporarily placing an insulating adhesive sheet on one of the IC modules; and an IC module having both contact-type and non-contact-type functions.
A step of temporarily heating and pressing only the conductive adhesive portion of the third concave portion using a heater block having two pinpoint heating sections after temporarily placing the module in the concave portion for mounting the C module; A step of heating and pressurizing the entire surface of the connection terminal using a heater block, and further cooling the portion, the method comprising the steps of: 3. The method according to claim 2, wherein the insulating adhesive sheet is cut into a predetermined shape.