JP2007272748A - Noncontact communication medium and manufacturing method for it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a noncontact communication medium capable of precisely controlling a sealing form and sealing thickness of an IC chip for improvement in a reinforcement function of the IC chip. <P>SOLUTION: In an IC card 11 or an antenna module 14 (a noncontact communication medium), adhesion of reinforcement plates 17A and 17B to the IC chip 13 is carried out via thermosetting adhesive films 16A and 16B, and consequently, evenness of adhesion height and the sealing form of the reinforcement plates 17A and 17B to the IC chip 13 is increased for stabilizing quality. As the adhesion height of the reinforcement plates 17A and 17B can be controlled by the film thickness of the adhesive films 16A and 16B, the sealing thickness of the IC chip 13 can be reduced without damaging the IC chip 13, while the reinforcement function of the IC chip 13 can be improved when the plate thickness of the reinforcement plates 17A and 17B is increased. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a non-contact communication medium represented by a non-contact IC card and a manufacturing method thereof, and more specifically, an insulating substrate on which an antenna circuit is formed, an IC chip mounted on the insulating substrate, and an IC The present invention relates to a non-contact communication medium including a reinforcing plate that reinforces a chip and a manufacturing method thereof.

  As a non-contact communication medium, for example, a non-contact IC card can exchange information simply by placing the card on a reader / writer, or holding it up. It is used in various fields such as systems and electronic payments.

  FIG. 7 shows a schematic configuration of a conventional non-contact IC card (hereinafter simply referred to as “IC card”). An IC card 1 shown in FIG. 1 includes an IC module 4 having an IC chip 3 mounted on one surface of an insulating substrate 2 on which an antenna circuit (not shown) is formed, and an adhesive material layer made of a thermosetting adhesive such as epoxy. 8 is sandwiched between a pair of exterior sheets 5A and 5B.

  The IC chip 3 constituting the IC module 4 is sealed with a sealing resin layer 6A in order to ensure a certain card reliability, and a metal reinforcing plate 7A is interposed through the sealing resin layer 6A. It is glued. A reinforcing plate 7B is bonded to the other surface of the insulating substrate 2 in a region facing the IC chip 3 via a sealing resin layer 6B made of the same material as the sealing resin layer 6A. For the purpose of improving the strength of the IC chip mounting region, fillers such as silica particles and glass fibers may be mixed in the sealing resin layers 6A and 6B.

  8A and 8B are schematic diagrams for explaining a conventional IC chip sealing method described in Patent Document 1 below. After mounting the IC chip 3 on the insulating substrate 2, a predetermined amount of a sealing resin 6 made of a liquid thermosetting resin is applied to the upper surface of the IC chip 2, and a reinforcing plate 7A is attached. The sealing resin 6 is crushed by the reinforcing plate 7A and covers the periphery of the IC chip 3. The reinforcing plate 7B is affixed to the IC chip 3 facing region of the insulating substrate 2 after the same sealing resin 6 is applied to the adhesive surface. Thereafter, the IC module is loaded into a heating furnace, and the sealing resin 6 is heated and cured to form the sealing resin layers 6A and 6B. Thus, the sealing process of the IC chip 3 and the bonding process of the reinforcing plates 7A and 7B are completed.

JP 2000-222549 A

  In the conventional IC card 1 described above, when forming the sealing resin layers 6A and 6B, the liquid sealing resin 6 is applied to the upper surface of the IC chip 3 or to the chip facing region of the insulating substrate 2 by a printing method such as screen printing or coating. Since the supply is performed using the method, there is a problem that variations in the sealing shape and the sealing thickness are large. If the sealing shape and the sealing thickness of the IC chip 3 vary greatly, it becomes difficult to control the quality and yield of the IC card 1.

  Further, the reinforcing plates 7A and 7B bonded to the upper surface of the IC chip 3 can obtain a higher reinforcing function of the IC chip 3 as the thickness increases. However, when the reinforcing plates 7A and 7B are thick, the sealing thickness of the IC chip 3 is increased, and the surface step in the chip mounting region of the IC module 2 is increased. As a result, the flatness of the surface of the produced IC card 1 is deteriorated. In particular, in an IC card on which a reversible thermosensitive recording layer (rewrite layer) is formed, printing omission is caused due to irregularities on the card surface. Cause printing defects.

  On the other hand, by reducing the thickness of the sealing layer between the IC chip and the reinforcing plate, the adhesion height of the reinforcing plate to the IC chip can be lowered, and the thickness of the reinforcing plate can be increased accordingly. It is done. However, as shown in FIGS. 8A and 8B, the relative position with respect to the IC chip 3 is adjusted by crushing the sealing resin 6, so that the height of adhesion of the reinforcing plate 7A to the IC chip 3 is accurately controlled. Is difficult.

  Further, in order to avoid damage to the IC chip 3 due to contact with the reinforcing plate 7A, it is necessary to provide a certain clearance or more between them. Furthermore, when the sealing resin 6 contains a filler, the IC chip 3 may be damaged due to the pressing action of the filler. Therefore, the conventional IC card 1 cannot improve the function of reinforcing the IC chip.

  The present invention has been made in view of the above problems, and provides a non-contact communication medium capable of controlling the sealing shape and sealing thickness of an IC chip with high accuracy and improving the reinforcing function of the IC chip, and a method for manufacturing the same. The task is to do.

  In solving the above problems, a non-contact communication medium of the present invention includes an insulating substrate on which an antenna circuit is formed, an IC chip mounted on one surface of the insulating substrate and electrically connected to the antenna circuit, an IC A reinforcing plate that reinforces the chip, and the reinforcing plate is bonded to the upper surface of the IC chip via a thermosetting adhesive film.

  The non-contact communication medium manufacturing method of the present invention includes a step of mounting an IC chip on an insulating substrate on which an antenna circuit is formed, and a step of bonding a reinforcing plate to the upper surface of the IC chip. In the step of adhering the reinforcing plate to the upper surface, the reinforcing plate is attached to the upper surface of the IC chip via the thermosetting adhesive film, and then the reinforcing plate is heated to cure the thermosetting resin film.

  In the present invention, the adhesion of the reinforcing plate to the IC chip is performed through the thermosetting adhesive film, thereby improving the adhesion height of the reinforcing plate to the IC chip and the uniformity of the sealing shape to stabilize the quality. I am doing so. Moreover, since the adhesive height of the reinforcing plate can be controlled by the film thickness of the adhesive film, the sealing thickness of the IC chip can be reduced without damaging the IC chip, and the thickness of the reinforcing plate is increased. Thus, it becomes possible to improve the reinforcing function of the IC chip.

  On the other hand, a thin plate reinforcing structure in which the IC chip is sandwiched between a pair of reinforcing plates by adhering the reinforcing plate to the other surface of the insulating substrate through a thermosetting adhesive film on a region facing the IC chip. Can be achieved.

  In addition, the non-contact communication medium of the present invention is carded by sandwiching the insulating substrate with a pair of exterior sheets together with an IC chip and a reinforcing plate. At this time, the periphery of the IC chip is sealed by the inner layer material interposed between the exterior sheets. The inner layer material interposed between the outer sheets varies depending on the card manufacturing method. For example, when the outer sheet is bonded using a thermosetting resin such as an epoxy resin, the thermosetting resin is applicable, and a hot press method is used. In this case, it corresponds to a hot melt layer of a thermoplastic sheet interposed between exterior sheets.

  As described above, according to the present invention, the sealing shape and the sealing thickness of the IC chip can be controlled with high accuracy, so that the quality of the non-contact communication medium can be stabilized. In addition, the reinforcing function of the IC chip can be improved.

  Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, an application example to an IC module for a non-contact IC card and a non-contact IC card will be described as a non-contact communication medium according to the present invention. The present invention is not limited to the following embodiments, and various modifications can be made based on the technical idea of the present invention.

  FIG. 1 shows a schematic configuration of a non-contact IC card (hereinafter simply referred to as “IC card”) according to an embodiment of the present invention. The illustrated IC card 11 includes an IC module 14 having an IC chip 13 mounted on one surface of an insulating substrate 12 on which an antenna circuit is formed, and an adhesive material layer 18 made of a thermosetting adhesive such as epoxy. It is configured by being sandwiched between a pair of exterior sheets 15A and 15B.

  FIG. 2 is a schematic cross-sectional view of the main part of the IC module 14. The IC chip 13 is mounted on the surface of the insulating substrate 12 and is electrically connected to the antenna circuit 19. A reinforcing plate 17A is bonded to the upper surface of the IC chip 13 via an adhesive film 16A. In addition, a reinforcing plate 17B is bonded to the back surface of the insulating substrate 12 via an adhesive film 16B in a region facing the IC chip 13. The reinforcing plates 17A and 17B constitute a chip reinforcing structure that protects the IC chip 13 from external stress. Note that it is not always necessary to provide a pair of reinforcing plates 17A and 17B, and it is sufficient that at least only the reinforcing plate 17A is provided.

  As the insulating substrate 12, a known polymer film can be used. Specifically, polyester, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polyethylene, polypropylene, polyvinyl chloride, acrylic resin, polycarbonate, epoxy resin, urea resin, urethane resin, melamine resin, etc. It can be used by appropriately selecting from conventionally used resin films, and is not particularly limited as long as it is insulative.

  The antenna circuit formed on the insulating substrate 12 is configured by an antenna pattern wound in a loop shape on the surface of the insulating substrate 12. The antenna circuit is formed by etching a laminated base material obtained by printing a conductive paste or a laminate of the polymer film and a metal foil such as an aluminum foil or a copper foil into a circuit shape.

  As a method of connecting the IC chip 13 and the antenna circuit 19, as shown in FIG. 2, the projecting electrodes (bumps) 21 formed on the active surface of the IC chip 13 and the antenna circuit 19 are connected to an anisotropic conductive film ( A flip-chip mounting method is employed via the (ACF) 20. The anisotropic conductive film 20 is obtained by dispersing conductive particles in a thermosetting resin material, and is a functional material that can obtain conductivity only in the pressurizing direction. As another method, the IC chip 13 can be mounted by soldering, for example.

  The reinforcing plates 17A and 17B are made of, for example, a stainless steel metal plate, and are bonded to the upper surface of the IC chip 13 and the chip facing region on the back surface of the insulating substrate 12 via the adhesive films 16A and 16B. The size of the reinforcing plates 17A and 17B is not particularly limited, but is preferably configured with a larger area than the IC chip 13 as shown in FIG. As the planar shape of the reinforcing plates 17A and 17B, a shape such as a circle or a rectangle can be adopted, but a rectangle corresponding to the chip shape, for example, a square shape is preferable. The plate thickness of the reinforcing plate 17 is also not particularly limited, but the reinforcing function of the IC chip 13 can be enhanced as the plate thickness increases. If it is too thick, the flatness of the card surface when the card is formed tends to be impaired.

  In the present invention, the reinforcing plates 17A and 17B are bonded using the adhesive films 16A and 16B. The adhesive films 16A and 16B are composed of a thermosetting adhesive film. The adhesive films 16A and 16B have a uniform thickness, and there is almost no variation in thickness before and after bonding. Accordingly, the reinforcing plates 17A and 17B are bonded via the adhesive films 16A and 16B, so that the reinforcing plates can be obtained only by adjusting the film thickness of the adhesive films 16A and 16B as compared with the configuration using the conventional liquid sealing resin. It becomes possible to optimize the bonding height of 17A and 17B with high accuracy and to suppress variations in the sealing thickness and sealing shape of the IC chip 13. It has been confirmed that the variation in sealing thickness can be reduced to about 1/3 or less of the conventional thickness.

  FIG. 3 is a process cross-sectional view schematically showing the process of bonding the reinforcing plate 17A to the IC chip 13.

  Prior to the adhesion of the reinforcing plate 17A, the IC chip 13 is mounted on the insulating substrate 12 (FIG. 3A). The adhesive film 16A is temporarily fixed to the adhesive surface of the reinforcing plate 17A in advance. The size of the resin film 16A is not particularly limited, but in the present embodiment, it is equal to or larger than the IC chip 13 and smaller than the reinforcing plate 17A.

  Next, as shown in FIG. 3B, a reinforcing plate 17A is bonded to the upper surface of the IC chip 13 via a resin film 16A. By configuring the reinforcing plate 17A to be larger than the IC chip 13, the reinforcing plate 17A can be properly bonded to the IC chip 13 and workability can be improved. The reinforcing plate 17A can be attached using an existing mounting device.

  Then, a bonding tool of the reinforcing plate 17A to the IC chip 20 is completed by bringing a heating tool such as a iron into contact with the reinforcing plate 17A to heat and cure the adhesive film 16A. Since the adhesive film 17A has a shorter curing time than a conventional liquid sealing resin, the bonding process of the reinforcing plate 17A can be performed in a short time. In addition, since the adhesive film 16A is spot-heated, the insulating substrate 12 does not require high heat resistance, and for example, an adhesive film having a curing temperature higher than the heat resistance temperature of the insulating substrate 12 is used. Is also possible.

  Further, the anisotropic conductive film 20 can be cured by heating simultaneously with the above-described curing process of the adhesive film 16A. In this case, the number of steps in the manufacturing process of the IC module 14 can be reduced, and productivity can be improved.

  The other reinforcing plate 17B is also bonded to the back side of the insulating substrate 12 using the adhesive film 16B so as to face the IC chip 13 through the same process as described above. The bonding steps of the reinforcing plate 17A and the reinforcing plate 17B are performed in separate steps, but may be performed in the same step.

  The adhesive films 16A and 16B are made of a thermosetting resin film as described above. As such a resin film, a thermosetting insulating film (NCF) or an ACF insulating matrix resin is suitable.

  Specifically, examples of the thermosetting resin include conventionally used epoxy resins, urethane resins, phenol resins, hydroxyl group-containing polyester resins, and condensation type thermosetting resins such as hydroxyl group-containing acrylic resins. Arbitrary resins such as a radical polymerization type using a functional and polyfunctional vinyl monomer, or a mixed type thereof can be used. Moreover, you may use phosphoric acid containing resin like phosphoric acid acrylate. Phosphoric acid acrylate is used to perform a curing reaction by radical polymerization and condensation (ring-opening reaction) by thermocompression using a functional group-containing vinyl monomer such as epoxy acrylate and an organic peroxide. In addition to the thermosetting resins as described above, in order to improve film formability, thermoplastic polymer materials such as phenoxy resins, acrylic resins, polyester resins, rubbers, coupling agents, anti-aging agents, etc. An additive may be included. The adhesive films 16A and 16B may be mixed with fillers such as silica fine particles and glass fibers in order to improve the strength.

  FIG. 4A schematically shows an IC chip peripheral structure of an IC module in a conventional IC card. In the conventional IC module, the sealing resin is supplied by a printing method or a coating method when forming the sealing resin layers 6A and 6B. Therefore, the reinforcing plates 7A and 7B are bonded to each other due to a variation in the amount of the sealing resin applied. Later, the sealing shape and sealing thickness of the IC chip 3 were likely to vary. Further, in order to secure a clearance between the IC chip 3 and the reinforcing plate 7A, the adhesion height S1 of the reinforcing plate 7A to the IC chip 3 can be suppressed to, for example, only 40 μm, and therefore, the module height can be reduced. Furthermore, the thickness T1 of the reinforcing plate 7A was set to 50 μm, for example.

On the other hand, FIG. 4B shows an IC chip peripheral structure of the IC module in the IC card of this embodiment. According to the present embodiment, as described above, since the adhesive films 16A and 16B are used in the bonding process of the reinforcing plates 17A and 17B, only the adjustment of the film thickness of the adhesive films 16A and 16B is compared with the conventional structure. Therefore, it is possible to optimize the bonding height S2 of the reinforcing plates 17A and 17B with high accuracy, and for example, S2 can be suppressed to 15 μm. In addition, since variations in the sealing thickness and sealing shape of the IC chip 13 can be suppressed, the card quality can be stabilized. Furthermore, since the gap S2 between the IC chip 13 and the reinforcing plate 17A can be kept lower than before, the plate thickness T2 of the reinforcing plate 17A can be made thicker (for example, 75 μm) than before. Thus, the reinforcing function of the IC chip 13 can be improved.
Note that the same action as described above can be obtained with respect to the adhesive film 16B and the reinforcing plate 17B adhered to the back side of the insulating substrate 12.

  FIG. 5 is an experimental result showing the strength characteristics of the IC mounting portion according to the present embodiment shown in FIG. 4B in comparison with the conventional structure shown in FIG. 4A. In FIG. 5, “Card static load table” is the static load strength on the card surface side (chip mounting surface) performed by the test method compliant with JISX6303, and “Card static load back” is the same test on the back side of the card. The static load strength performed on the (chip non-mounting surface) side is shown. The “card bending strength table” is the bending strength on the card surface side, which is a test method according to JISK7171, and the “card bending strength back” is the bending load strength, which is the same test on the card back side. .

  In FIG. 5, the solid line represents Sample 1 composed of a combination of a □ 5.5 mm reinforcing plate (SUS) and a □ 5 mm adhesive film (NCF) having a thickness of 15 μm, and the alternate long and short dash line is a □ 5.5 mm Sample 2 comprising a combination of a reinforcing plate and an adhesive film of 5 mm square and 40 μm thick is shown. A two-dot chain line is an IC card having a conventional structure, and shows a sample 3 in which a φ7 mm reinforcing plate is bonded to a sealing resin layer. In all samples 1 to 3, the IC chip is □ 4.4 mm. In FIG. 5, each characteristic is represented by the relative ratio of the samples 2 and 3 to the sample 1.

  As is clear from the results of FIG. 5, the static load strength is higher in the samples 1 and 2 according to the present embodiment than in the sample 3 having the conventional structure. Regarding the bending strength, the thinner the film thickness of the adhesive film, the higher the strength, and Sample 1 having a film thickness of 15 μm has higher bending strength characteristics than the conventional one. The reason why the thinner the adhesive film is, the higher the bending strength characteristics can be obtained. If the adhesive film is thick, the bending resistance to the IC chip cannot be obtained because the adhesive film receives the bending load before the reinforcing plate. it is conceivable that. From the above, the film thickness of the adhesive film is preferably 40 μm or less, particularly preferably 15 μm or less.

Further, according to the present embodiment, it has been confirmed that both the variation in static load strength and the variation in bending load strength after carding are smaller than those of the conventional structure.
Variations in static load strength and bending load strength are strongly related to variations in the sealing thickness and sealing shape of the IC chip. Therefore, according to the present embodiment, the variation in the sealing thickness and the variation in the sealing shape of the IC chip can be reduced as compared with the conventional case. Any variation can be reduced as compared with the conventional structure.

  Next, in the present embodiment, the IC module 14 is carded by being sandwiched between the pair of exterior sheets 15A and 15B, and the inner layer material interposed between the pair of exterior sheets 15A and 15B allows the IC module 14 to have an IC. The periphery of the chip 13 is sealed. As the inner layer material, in the example of FIG. 1, an adhesive material layer 18 for bonding the exterior sheets 15A and 15B corresponds.

  The adhesive material layer 18 is made of a thermosetting resin, and is formed, for example, by curing a two-component epoxy adhesive. The two-component epoxy adhesive generally refers to an adhesive that is bonded by a curing reaction by mixing an epoxy group-containing compound (main agent) with a curing agent containing amines or acid anhydrides. Examples of the compound containing an epoxy group include bisphenol A type, hydrogenated bisphenol A type, novolac type, bisphenol F type, brominated epoxy resin, cycloaliphatic epoxy resin, glycidylamine resin, glycidyl ester resin, and the like. . On the other hand, curing agents containing amines and acid anhydrides include aliphatic primary and secondary amines (triethylenetetramine, dipropyltriamine, etc.), aliphatic tertiary amines (triethanolamine, aliphatic primary and primary amines). Secondary amine and epoxy reaction products), aliphatic polyamines (diethylenetriamine, tetraethylenepentamine, bis (hexamethylene) triamine, etc.), aromatic amines (metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, etc.), amines Examples include adducts (reaction products of polyamines and epoxy groups, etc.), aromatic acid anhydrides (trimellitic anhydride, pyromellitic anhydride, etc.), dicyandiamide and derivatives thereof, and imidazoles. The curing rate of the adhesive composing the adhesive material layer 18 is adjusted to 92% or more and 98% or less, for example.

  On the other hand, as the exterior sheets 15A and 15B, known plastic sheets are used, for example, polyesters such as polyimide, polyester, polyethylene terephthalate and polyethylene naphthalate, polyolefins such as propylene, celluloses such as cellulose triacetate and cellulose diacetate, Acrylonitrile-butadiene-styrene resin, acrylonitrile-styrene resin, polystyrene, polyacrylonitrile, polymethyl acrylate, polymethyl methacrylate, polyethyl acrylate, polyethyl methacrylate, vinyl acetate, polyvinyl alcohol and other vinyl resins, polycarbonates, etc. A single substance or a mixture can be used.

  As a method for manufacturing an IC card for adhering the exterior sheets 15A and 15B via the adhesive material layer 18, a method of continuously laminating and bonding the exterior sheets 15A and 15B in a roll manner is used. In this case, after the long sheet laminate is cut into a strip shape, the adhesive material layer 18 is heat-cured and then cut into a card size to form a card.

  As described above, in the present embodiment, the periphery of the IC chip 13 of the IC module 14 is sealed by the adhesive material layer 18 when sandwiched between the pair of exterior sheets 15A and 15B. Thereby, the protection function of the IC chip 13 is achieved without using a conventional resin sealant. Further, as described above, since the sealing thickness and sealing shape of the IC mounting portion in the IC module 14 can be stabilized, the flatness of the card surface can be kept stable. Therefore, for example, in a rewritable card in which a reversible thermosensitive recording layer is formed on the exterior sheet surface, it is possible to suppress the occurrence of printing defects due to irregularities on the card surface.

  Further, the inner layer material between the exterior sheets 15A and 15B is not limited to the configuration of the adhesive material layer 18 described above. For example, when an IC card is formed by heat-sealing a plurality of thermoplastic plastic sheets, the IC chip 13 can be sealed with a hot-melt layer of these plastic sheets.

  6A and 6B show a schematic configuration of an IC card 25 manufactured by a hot press method. In the illustrated example, the antenna module 14 is sandwiched between a pair of thermoplastic sheets 23A and 23B, and further sandwiched between the pair of exterior sheets 15A and 15B. Through holes 24A and 24B are formed in the plastic sheets 23A and 23B corresponding to the IC mounting portions of the antenna module 14, respectively.

  Specific examples of the thermoplastic sheets 23A and 23B include polyethylene terephthalate, a copolymer of terephthalic acid, cyclohexanedimethanol and ethylene glycol (PET-G), or an alloy of the copolymer and polycarbonate, terephthalic acid. Copolymer of ethylene glycol, acrylonitrile-butadiene-styrene copolymer resin, polystyrene resin, polyacrylonitrile resin, polyvinyl alcohol resin, polymethyl acrylate resin, polymethyl methacrylate resin, vinyl acetate resin, vinyl chloride resin, polycarbonate Resin etc. are mentioned.

  In the IC card 25 configured as described above, the antenna module 14, the thermoplastic sheet 23A, 23B, and the exterior sheets 15A, 15B are heated and pressed with a pair of heat press plates, so that the sheet interface Each sheet is integrated by the fusing action. At this time, the through holes 24A and 24B are closed by thermal melting of the thermoplastic plastic sheet, and the periphery of the IC chip 13 is sealed by the plastic sheet. The produced sheet laminate is then carded by cutting into a card size.

It is sectional drawing which shows schematic structure of the IC card by one Embodiment of this invention. It is a principal part enlarged view of the IC module in the IC card of FIG. It is process sectional drawing explaining one manufacturing method of an IC module. It is a schematic sectional drawing which compares and shows the structure of the IC module of a conventional structure, and the IC module which concerns on this invention. It is a figure which shows an example of the card | curd intensity | strength characteristic by the difference in the film thickness of the adhesive film which comprises an IC module. It is sectional drawing which shows schematic structure of the IC card by other embodiment of this invention. It is sectional drawing which shows schematic structure of the conventional IC card. It is process sectional drawing explaining the IC chip sealing process in the conventional IC card.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11,25 ... IC card, 12 ... Insulating substrate, 13 ... IC chip, 14 ... IC module, 15A, 15B ... Exterior sheet, 16A, 16B ... Adhesive film, 17A, 17B ... Reinforcement plate, 18 ... Adhesive material layer, 19 ... Antenna circuit, 20 ... Anisotropic conductive film (ACF), 21 ... Bump, 22 ... Heating tool, 23A, 23B ... Thermoplastic sheet

Claims (10)

Non-contact communication medium comprising: an insulating substrate on which an antenna circuit is formed; an IC chip mounted on one surface of the insulating substrate and electrically connected to the antenna circuit; and a reinforcing plate for reinforcing the IC chip In
The non-contact communication medium, wherein the reinforcing plate is bonded to the upper surface of the IC chip via a thermosetting adhesive film. The non-contact communication medium according to claim 1, wherein the thermosetting adhesive film is made of an insulating material. The contactless communication medium according to claim 1, wherein a reinforcing plate is bonded to a region facing the IC chip on the other surface of the insulating substrate via a thermosetting adhesive film. The insulating substrate on which the IC chip is mounted is sandwiched between a pair of exterior sheets, and the periphery of the IC chip is sealed with an inner layer material interposed between the exterior sheets. The non-contact communication medium described in 1. The non-contact communication medium according to claim 4, wherein the inner layer material is a thermosetting adhesive material layer. The non-contact communication medium according to claim 4, wherein the inner layer material is a thermoplastic sheet layer. Mounting an IC chip on an insulating substrate on which an antenna circuit is formed;
In a method for manufacturing a non-contact communication medium, including a step of bonding a reinforcing plate to the upper surface of the IC chip,
The step of bonding the reinforcing plate to the upper surface of the IC chip includes:
Manufacturing the non-contact communication medium, wherein the reinforcing plate is attached to the upper surface of the IC chip through a thermosetting adhesive film, and then the reinforcing plate is heated to cure the thermosetting resin film. Method. The contactless communication according to claim 7, further comprising a step of bonding a reinforcing plate to the other surface of the insulating substrate facing the IC chip via a thermosetting adhesive film. A method for manufacturing a medium. The method further comprises a step of sandwiching the insulating substrate together with the IC chip and the reinforcing plate with a pair of plastic sheets via a thermosetting adhesive, and sealing the periphery of the IC chip with the thermosetting adhesive. The manufacturing method of the non-contact communication medium of Claim 7. The insulating substrate is further sandwiched between a pair of exterior sheets via a thermoplastic sheet together with the IC chip and the reinforcing plate, and the periphery of the IC chip is sealed by thermal melting of the plastic sheet. A method for manufacturing a non-contact communication medium according to claim 7.

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