JP3483352B2 - Non-contact IC card - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an IC module and an I module.
The present invention relates to a non-contact IC card that is connected to a C module and has a built-in receiving / transmitting coil for receiving and transmitting signals in a non-contact manner with an external device. A card module for receiving and transmitting is mounted to form a board module, and the board module is mounted in a board module mounting hole provided in a card base material, thereby facilitating the assembly of the card, and at the same time, the IC module and the coil for receiving and transmitting are combined. The present invention relates to a non-contact IC card that facilitates connection and has a good card surface appearance.

[0002]

2. Description of the Related Art Conventionally, as a non-contact IC card having a built-in IC module and a coil for receiving and transmitting which is connected to the IC module and which transmits and receives signals to and from an external device in a non-contact manner, a thin plate-shaped ferrite core is used. A coil is wound around the material to form a coil for reception and transmission, the winding start point and the winding end point of the winding of the reception and transmission coil are extended and connected to the connection terminals of the IC module, and the reception and transmission coil and the IC module are connected, After mounting the IC module and the transmitting / receiving coil in the mounting hole of the card base material, the plastic surface sheet was covered by thermocompression bonding from both sides.

In this case, since the diameter of the winding of the receiving / transmitting coil is about 0.1 mm, the winding of the receiving / transmitting coil is I.
Not only is it time-consuming to connect to the connection terminals of the C module, but there is a risk of disconnection at the connecting portion of the winding when the receiving / transmitting coil and the IC module are mounted in the mounting holes provided in the card base material. It is difficult to handle, and since the winding connection part is slack, the winding sticks out from the mounting hole provided in the card base, and if the plastic surface sheet is covered by thermocompression bonding from both sides as it is, the winding connection part Appears as a step on the surface of the card, and there is a problem that the appearance is damaged.

[0004]

SUMMARY OF THE INVENTION The present invention is intended to solve the above problems, and its gist is to provide an IC module and
In a non-contact IC card that is connected to the IC module and has a built-in coil for receiving and transmitting signals in a non-contact manner with an external device, a coil is wound around a thin ferrite core material to form a coil for receiving and transmitting. Coil mounting hole and IC
The coil for receiving and transmitting and the IC module are mounted on the substrate having the module mounting hole, and the coil for receiving and transmitting and the IC module are connected through the wiring formed on the substrate to form a substrate module, and the substrate module is provided on the card base material. Mounted on the board module mounting hole and covered on both sides with a plastic surface sheet, more preferably the thickness of the coil for transmission and reception is
Make it thinner than the thickness of the board, or on both sides of the coil for receiving and transmitting,
By interposing a cushioning material, the card can be easily assembled, the IC module and the transmitting / receiving coil can be easily connected, the appearance of the card surface can be improved, and the electrical characteristics of the receiving / transmitting coil are impaired. This is a non-contact IC card that is prevented from being damaged.

[0005]

Embodiments of the present invention will be specifically described below with reference to the drawings. 1 is a plan view showing a non-contact IC card of the present invention, FIG. 2 is an exploded perspective view showing a substrate module of the non-contact IC card of the present invention, and FIG. 3 is a process of manufacturing a substrate of the non-contact IC card of the present invention. FIG. 4 is a cross-sectional view showing a non-contact IC card of the present invention, FIGS. 5 and 6 show another non-contact IC card of the present invention, FIG. 5 is before thermocompression bonding, and FIG. 6 is thermocompression bonding. 7 and 8 show another non-contact IC card of the present invention. FIG. 7 is a sectional view showing a state before thermocompression bonding and FIG. 8 is a sectional view showing a state after thermocompression bonding.

As shown in the plan view of FIG. 1, the non-contact IC card 100 has an outer diameter of about 86 mm in a horizontal dimension, about 54 mm in a vertical dimension, and a thickness of about 0.8 mm. The non-contact IC card 100 includes a region A for processing a magnetic stripe, a region B for incorporating an IC module and a coil for receiving and transmitting, and a region C for processing embossing. The region B contains a substrate module 200. I am doing it.

As shown in the exploded perspective view of FIG. 2, the substrate module 200 includes a substrate 210 and an IC module 220.
And the coil for receiving and transmitting 230, the IC module 220 and the coil for receiving and transmitting 230 are mounted in the IC module mounting hole 211 and the coil for receiving and transmitting mounting 212 formed in the substrate 210, respectively. Transmission / reception coil 230
Insulation-coated copper wire is wound around the surface of a thin plate-shaped ferrite core 231 (not shown) to form an insulation-coated copper wire winding portion 232, and a step is formed at a position where the insulation-coated copper wire is not wound. The adjustment layer 233 is formed. As a result, the surface of the transmitting / receiving coil 230 is flush.

Connection terminal 221 of IC module 220
Is connected to the connection terminal 213 formed on the substrate 210,
In addition, the connecting portion 234 of the receiving / transmitting coil 230 is connected to the substrate 2
10 is connected to the connection terminal 214 formed. Board 21
The connection terminals 213 and 214 formed in 0 are connected via printed wirings 215 and 216, and the connection terminal 221 of the IC module 220 and the reception / transmission coil 230 are connected.
The connection terminals 234 of the printed wirings 215 and 216.
Connected via. As a result, the IC module 22
0 and the coil 230 for receiving and transmitting are connected to the substrate module 20.
It can be carried out inside 0, and there is no disconnection or slack at the connection line as in the conventional case, and it is easy to handle. Information stored in the IC module 220 is transmitted and received to and from the external device in a contactless manner by the external device and electromagnetic induction. A rectifying circuit (not shown) provided in the IC module 220 rectifies the alternating current excited in the receiving / transmitting coil 230 to be used as the power source of the IC module 220. Therefore, it is not necessary to incorporate a battery separately.

The embossed area C is the IC module 2
20 is formed so as to avoid the region B in which the substrate module 200 having the 20 and the transmitting / receiving coil 230 mounted therein is embedded.
Thus, if the embossed area C is formed avoiding the area B, even if the embossed area C is embossed,
The IC module 220 and the transmitting / receiving coil 230 are less affected, which is preferable.

As described above, the substrate 210 has the IC module mounting hole 211, the transmitting / receiving coil mounting hole 212, and the IC.
The connection terminal 213 of the module 220 and the connection terminal 214 of the reception / transmission coil 230 are formed.
A process of manufacturing 10 will be described with reference to FIG.

First, as shown in the plan view of FIG.
The connection terminal 213 of the IC module 220 and the connection terminal 214 of the reception / transmission coil 230 are formed by etching the copper-clad printed board 217 made of glass epoxy or polyethylene terephthalate having a thickness of about 0.1 mm. The printed wirings 215 and 216 are formed to connect the connection terminal 213 of the IC module 220 and the connection terminal 214 of the reception / transmission coil 230.

Next, as shown in the plan view of FIG.
A substrate 218 made of glass epoxy or polyethylene terephthalate having a thickness of about 0.3 mm is prepared, and a punching hole 218A for forming an IC module mounting hole 211 and I
A punching hole 218B for exposing the connection terminal 213 of the C module 220 is punched. At the same time, a punching hole 218C for forming the receiving / transmitting coil mounting hole 212
Then, a punching hole 218D for exposing the connection terminal 214 of the receiving and transmitting coil 230 is punched. Then, the substrate 218 having the punched holes 218A to 218D is superposed on the substrate 217, and the substrates 217 and 218 are integrated by adhering them through an adhesive layer previously applied to the lower surface of the substrate 218. The thickness of the adhesive layer may be about 0.1 mm. Thus, as shown in FIG. 3C, the connection terminal 213 of the IC module 220 is exposed from the punching hole 218B, and the connection terminal 214 of the receiving and transmitting coil 230 is exposed from the punching hole 218D.

Next, a punching hole 218A for forming the IC module mounting hole 211 and a punching hole 218C for forming the receiving and transmitting coil mounting hole 212 are punched out on the lower substrate 217. As shown in FIG. 3D, the IC module mounting hole 211 and the transmitting / receiving coil mounting hole 212 are formed.

FIG. 4 shows a contactless IC card 100 of the present invention.
The cross-sectional view of FIG. 2 is shown, and the board module 200 having the IC module 220 and the transmitting / receiving coil 230 mounted therein is mounted in the board module mounting hole 111 provided in the card substrate 110 made of polyvinyl chloride resin or the like. As shown in FIG. 2, the connection terminals 221 of the IC module 220 are connected to the substrate 2
10 is connected to the connection terminal 213 formed on the substrate 10, and the connection portion 234 of the reception / transmission coil 230 is connected to the connection terminal 214 formed on the substrate 210. The connection terminal 234 of the coil 230 is connected via the printed wirings 215 and 216. As a result, the IC module 220
And the coil for receiving and transmitting 230 are connected to the board module 200.
It is easy to handle because there is no disconnection or slack at the connecting line as in the conventional case.

The transmitting / receiving coil 230 has a thickness of about 0.2.
mm on the surface of a ferrite core 231 in the form of a thin plate,
An insulating layer 235 having a thickness of 25 to 0.05 mm is formed, and an insulating coated copper wire 236 having a diameter of about 0.1 mm is wound on the insulating layer 235 and has a thickness of about 0.5 mm. The insulating layer 2 is formed on the surface of the thin ferrite core 231.
Forming 35 is preferable because the insulation between the thin plate-shaped ferrite core 231 and the insulating coated copper wire 236 is ensured, and the thin plate-shaped ferrite core 231 is reinforced by the insulating layer 236. The insulating layer 236 is formed by winding an insulating tape or applying an insulating resin.

In the transmitting / receiving coil 230, a step adjusting layer 233 is formed at a position where the insulating coated copper wire 236 is not wound, and the surface of the transmitting / receiving coil 230 is flush. To form the step adjustment layer 233,
It is formed by winding an insulating tape. Further, when forming the step adjusting layer 233, first, an insulating tape is wound to form an insulating tape layer having a thickness of about 0.045 mm, and then a hot melt resin sheet-shaped adhesive sheet layer is formed by about 0.03 mm. When the step adjusting layer 233 is formed to have a thickness of 2 mm, the card base 110 and the plastic surface sheet 300 are sandwiched between the plastic surface sheets 300 made of polyvinyl chloride resin and the like, and then thermocompression bonded together. , The hot melt resin layer having a softening temperature lower than 300 is melted, and the coil receiving / transmitting coil mounting hole 212 is formed.
This is preferable because it fills the gap at the boundary between the receiving and transmitting coil 230. The IC module 220 has a thickness of 0.5 mm, which is almost equal to the thickness of the transmitting / receiving coil 230, and the IC module 220 and the transmitting / receiving coil 230 are mounted in mounting holes 211 and 212 formed in the base material 210.

Adhesive sheets 400, 4 wider than the board module 200 are provided on both sides of the board module 200 on which the IC module 220 and the transmitting / receiving coil 230 are mounted.
00 is interposed. As the adhesive sheets 400, 400, hot-melt resin in a sheet form of 0.03 m
An adhesive sheet having a thickness of m can be preferably used. The adhesive sheets 400 and 400 are melted during thermocompression bonding, and have irregularities on the surface of the coil for receiving and transmitting 230, gaps between the board module mounting hole 111 and the board module 200, and the IC module 220 and the transceiver. The gap between the coil for use 230 and the substrate 210 is filled. This allows
Unevenness of the surface of the coil 230 for transmitting and receiving appears on the outer surface of the plastic surface sheets 300, 300, the boundary line between the board module mounting hole 111 and the board module 200 appears, or the IC module 220 and the board for transmitting and receiving. It is possible to prevent the boundary line between the coil 230 and the substrate 210 from appearing.

Further, the plastic surface sheets 300, 300 having the hot-melt resin layer 310 formed thereon are sandwiched from both sides, and then thermocompression bonded to be integrated. The thickness of the plastic surface sheets 300, 300 is about 0.1 mm, and the thickness of the hot melt resin layers 310, 310 is about 0.03 mm. When the hot melt resin layers 310, 310 are formed on the plastic surface sheets 300, 300, the hot melt resin layers 310, 310 of the plastic surface sheets 300, 300 are bonded to the hot melt resin layers during heating and pressure bonding. The sheets 400, 400 are melted to secure the adhesion of the plastic surface sheets 300, 300, and are melted when the hot melt resin layers 310, 310 are thermocompression-bonded to be filled with the adhesive sheets 400, 400. There were no fine irregularities in the hot melt resin layer 31.
Since 0 and 310 are filled, unevenness on the surface of the coil for receiving and transmitting 230 appears on the surface of the contactless card 100, a boundary line between the board module mounting hole 111 and the board module 200 appears, or the IC module 220. This is preferable because it is possible to prevent the boundary line between the receiving / transmitting coil 230 and the substrate 210 from appearing.

When the card substrate 110 and the plastic surface sheets 300, 300 are made of polyvinyl chloride resin, the temperature at the time of thermocompression bonding is about 90 ° C. Card substrate 110 and plastic surface sheets 300, 300
Polyvinyl chloride can be preferably used as the material of the above, but a thermoplastic resin other than polyvinyl chloride may be used.

5 and 6 are sectional views showing another embodiment of the present invention. The thickness of the transmitting and receiving coil 230 is set to the substrate 210
Is thinner than the thickness of. Transmission / reception coil 230
The thickness is the same as that shown in FIG. 4 except that the thickness of the substrate is thinner than the thickness of the substrate 210, and the description thereof will be omitted. When the plastic surface sheets 300, 300 are sandwiched from both sides and then heat-pressed to be integrated, a coil 2 for receiving and transmitting
The stress applied to 30 becomes small, and the coil for receiving and transmitting 23
It is prevented that the electrical characteristics of 0 change. Plastic surface sheet 30 having hot melt resin layer 310 formed
It is sandwiched from both sides with 0 and 300, and thermocompression-bonded to be integrated.
00 hot melt resin layers 310, 310 are melted,
As shown in FIG. 6, the transmitting / receiving coil 230 and the substrate 210
The non-contact IC has a good appearance and does not appear as a step because it flows into and fills the stepped portion of
You get a card. The thickness of the IC module 220 is set to the substrate 2
If it is formed thinner than 10, the stress applied to the IC module 220 during thermocompression bonding and integration can be reduced, and damage to the IC module 220 and disconnection at the connection point can be prevented, which is preferable. Is.

7 and 8 are sectional views showing still another embodiment of the present invention. A cushioning material 500 is interposed on both sides of the transmitting / receiving coil 230. The description is omitted because it is the same as that shown in FIG. 4 except that the cushioning material 500 is provided on both sides of the receiving and transmitting coil 230. When sandwiched by the plastic surface sheets 300, 300 from both sides, and thermocompression-bonded to be integrated, the stress applied to the transmitting / receiving coil 230 becomes small. Therefore, it is possible to prevent the electrical characteristics of the reception / transmission coil 230 from changing. Hot melt resin layer 3
Plastic surface sheet 300, 300 forming 10
It is sandwiched from both sides with thermocompression bonding to be integrated, but during thermocompression bonding, the hot melt resin layers 310, 310 of the plastic surface sheets 300, 300 are melted, and as shown in FIG. A non-contact IC that has a good appearance because it does not appear as a step in appearance because it flows into the stepped portion formed by interposing and fills the stepped portion.
You get a card. The thickness of the IC module 220 is set to the substrate 2
If it is formed thinner than the thickness of 10, the stress applied to the IC module 220 during thermocompression bonding and integration can be reduced, and damage to the IC module 220 and disconnection at the connection point can be prevented, which is preferable. Is.

The cushioning material 500 has a thickness of about 0.1 m.
m polystyrene foam sheet, polyurethane resin foam sheet, silicone resin foam sheet, polypropylene resin foam sheet, ABS resin foam sheet, polyvinyl chloride resin foam sheet, nylon resin foam sheet, EVA resin foam sheet, acrylic resin foam sheet, phenol A resin foam sheet, a urea resin foam sheet, and an epoxy resin foam sheet can be preferably used. Although the cushioning material 500 is illustrated as having substantially the same size as the IC module substrate 200, the cushioning material 500 may have substantially the same size as the receiving and transmitting coil 230 so as to cover only the receiving and transmitting coil 230.

[0023]

As described above, according to the present invention, a coil is wound around a thin plate-shaped ferrite core material to form a receiving / transmitting coil, and the receiving / transmitting is performed on a substrate on which a receiving / transmitting coil mounting hole and an IC module mounting hole are formed. And the IC module are mounted, and the coil for receiving and transmitting and the IC module are connected via the printed wiring formed on the board to form a board module.
The board module is mounted in the board module mounting hole provided in the card base material, and both surfaces are covered with the plastic surface sheet to facilitate the assembly of the card and
There are advantages such as facilitating the connection between the C module and the transmitting / receiving coil, and having a good appearance of the card surface.
Also, by making the thickness of the receiving and transmitting coil thinner than the thickness of the substrate, or by interposing a cushioning material on both sides of the receiving and transmitting coil, it is possible to prevent the electrical characteristics of the receiving and transmitting coil from changing. There is.

[Brief description of drawings]

FIG. 1 is a plan view showing a non-contact IC card of the present invention.

FIG. 2 is an exploded perspective view showing a substrate module of a non-contact IC card of the present invention.

FIG. 3 is a plan view showing a process of manufacturing a substrate of the non-contact IC card of the present invention.

FIG. 4 is a sectional view showing a non-contact IC card of the present invention.

FIG. 5 is a sectional view showing a state before thermocompression bonding of another non-contact IC card of the present invention.

FIG. 6 is a sectional view showing a state of another non-contact IC card of the present invention after thermocompression bonding.

FIG. 7 is a sectional view showing a state before thermocompression bonding of still another non-contact IC card of the present invention.

FIG. 8 is a sectional view showing a state of another non-contact IC card of the present invention after thermocompression bonding.

[Explanation of symbols]

100 non-contact IC card 110 card base material 111 Board module mounting hole 200 board module 210 substrate 211 IC module mounting hole 212 Transmission / reception coil mounting hole 213 IC module connection terminal 214 Terminal for coil connection for receiving and transmitting 215 printed wiring 216 Printed wiring 220 IC module 230 coil for sending and receiving 231 Thin ferrite core 232 Winding part 233 Step adjustment layer 300 plastic surface sheet 310 Hot melt resin layer 400 Adhesive sheet 500 cushioning material

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Claims (3)

(57) [Claims] 1. A non-contact IC card having a built-in IC module and a coil for receiving and transmitting which is connected to the IC module and which transmits and receives signals in a non-contact manner with an external device, wherein a coil is wound around a thin ferrite core material. As a coil for receiving and transmitting, the coil for receiving and transmitting and the IC module are mounted on a substrate on which a coil mounting hole for receiving and transmitting and an IC module mounting hole are formed, and the coil for receiving and transmitting and I
A non-contact IC card characterized in that a C module is connected to form a board module, the board module is mounted in a board module mounting hole provided in a card base material, and both surfaces are covered with a plastic surface sheet. 2. The contactless IC card according to claim 1, wherein the thickness of the coil for receiving and transmitting is smaller than that of the substrate. 3. The non-contact IC card according to claim 1, wherein a cushioning material is provided on both sides of the receiving and transmitting coil.