JP2003091709A - Ic card and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an inexpensive IC card of high reliability without applying the a thermal stress to an IC module. SOLUTION: This IC card is provided with the IC module formed by bonding and sealing an IC chip to a wiring board, an antenna terminal of the IC module and a connecting terminal of an antenna coil formed on the card board are bonded by mechanically pressing a conductive and adhesive projecting part mounted in advance.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having two different reader / writer interfaces, one of which is a contact type and the other of which is a non-contact type, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, an IC card has both a contact type function and a non-contact type function for convenience in application and function.
C cards have been used in various fields.

Conventionally, in the method of manufacturing an IC card, in particular, the connection between the connection terminal of the antenna coil and the internal electrode terminal of the IC module has been performed by using a conductive adhesive or solder. A general method is to bond the IC module immediately after dropping the conductive adhesive onto the connection terminal, and then place the IC module in a high temperature bath to cure the conductive adhesive. In the latter case, it is common to apply cream solder or place a low-melting-point solder sheet on the connection terminals of the antenna coil, and then subject them to a high-temperature bath treatment for bonding. .

[0004]

At present, the IC modules generally used in the world have a guaranteed temperature range of -50 ° C. to + 150 ° C. of the constituent members, especially the IC chip itself.
Is. Here, in the region outside the lower limit temperature range, the problem is that the characteristic function is abnormal rather than destruction. Further, in a region outside the upper limit temperature range, there are serious problems such as formation of a leak path between the metal wirings of the IC, abnormality of the surface stabilizing layer, and further damage such as deterioration of reliability of the joint portion between the IC chip and the wiring board. Met.

However, in the above-described conventional manufacturing method, when the connection terminals of the antenna coil and the internal electrode terminals of the IC module are joined together, the entire structure including the IC module must be exposed to a high temperature. Unnecessarily temperature is applied to the internal IC chip, increasing the risk of impairing the function and causing a decrease in yield. Further, if the treatment temperature is lowered too much in order to avoid this problem, there is a problem that the time until complete curing becomes enormously long, leading to an increase in cost due to a time factor and the reliability of the joint portion cannot be maintained.

Therefore, an object of the present invention is to provide an IC card which overcomes the above-mentioned inconvenient problems of the prior art, does not apply thermal stress to the IC module, and is low in cost and high in reliability.

[0007]

According to the present invention, in an IC card having both a contact type communication function and a non-contact type communication function, the antenna connection is achieved without introducing any dangerous element into the function of the IC chip itself. The terminal and the antenna terminal of the IC module can be joined together. When joining, unnecessary heating to the IC chip itself is eliminated, and low-cost and highly reliable joining is realized by the following means. It is a thing.

The present invention relates to an IC card comprising an IC chip having both a contact type communication function and a non-contact type communication function, wherein the IC chip is bonded and sealed to a wiring board, and an antenna terminal on the IC module side, Alternatively, at least one of the connection terminals of the antenna coil formed on the card base material is provided with a conductive and adhesive protrusion in advance, and the terminals are aligned and face each other so as to sandwich the protrusion. After that, the terminal portion is mechanically pressed and joined to produce the intended IC card.

Further, in the invention described above, the conductive and adhesive protrusion is a conductive adhesive, and the conductive adhesive is uncured while mechanical pressure and short pressure are applied. It is intended to manufacture an intended IC card, which is characterized by performing local heating for a time.

Further, the present invention is to manufacture the intended IC card, characterized in that the antenna is a covered metal wire.

That is, the present invention is an IC card which has both a contact type communication function and a non-contact type communication function and is composed of an IC module, an antenna coil and a card base material, wherein the IC module is a wiring board. The connection terminal of the antenna terminal of the IC module and the connection terminal of the antenna coil that is joined and sealed and formed on the card base material are mechanically pressed by the conductive and adhesive protrusions provided in advance. It is a bonded IC card.

Further, according to the present invention, the conductive and adhesive protrusion is a conductive adhesive, and the conductive adhesive is uncured while mechanical pressure and short time are applied. This is an IC card that has been locally heated.

The present invention is also an IC card in which the antenna of the IC card is a covered metal wire.

Further, the present invention is an IC comprising an IC chip having both a contact type communication function and a non-contact type communication function.
In the method of manufacturing a card, the IC chip is electrically conductive and bonded in advance to at least one of the IC module side antenna terminal bonded and sealed to the wiring board or the antenna coil connection terminal formed on the card base material. A method for manufacturing an IC card, in which a protruding portion having a property is provided, the connecting terminals are aligned and opposed to each other so as to sandwich the protruding portion, and then the connecting terminal portion is mechanically pressed and joined. is there.

Further, in the present invention, the conductive and adhesive protrusion is a conductive adhesive, and the conductive adhesive is uncured while mechanical pressure and short-time local application are applied. It is a method of manufacturing a type IC card in which heat is dynamically heated.

The present invention is also the method of manufacturing an IC card as described above, wherein the antenna is a covered metal wire.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION An IC card and a method for manufacturing the same according to an embodiment of the present invention will be described below.

FIG. 1 is expressed in a perspective view for explaining the basic structure of the IC card of the present invention. I in FIG.
The C-card has the through-hole 3 into which the antenna coil 2 and its connection terminal 2'are formed in advance on the supporting base material 8 and the resin mold portion 11 of the IC chip module 7 of the IC card is fitted. The inlet sheet 1 is arranged, and further, the surface layer base material 5 in which the through holes 6 having substantially the same size as the wiring board portion 9 of the IC chip module 7 are formed is arranged and integrally laminated.

FIG. 2 is an explanatory diagram of a method of manufacturing an IC card according to the embodiment of the present invention. FIG. 2A shows a surface of a raw-size inlet sheet 1 made of polyethylene terephthalate (PET-G) or vinyl chloride having a plurality of through holes 3 punched out corresponding to the number of cards,
Using a copper wire coated with copper or a urethane resin film, the antenna coil 2 having a predetermined shape is thermocompression-bonded or the like, and a portion having a diameter of about 1/2 to 1/3 is placed inside the inlet sheet 1. The connection terminal portion 2 ′ of the antenna coil 2 is fixedly formed so as to be buried, and the through hole 6 of the surface layer base material 5
FIG. 6 is a schematic cross-sectional view showing a state of being aligned in a state of being exposed so as to be exposed to the portion of FIG.

FIG. 2B shows a state in which the inlet sheet 1 and the surface layer base material 5 are joined by thermocompression bonding or an adhesive.

FIG. 2 (c) shows a region of the antenna terminal 2'exposed in FIG. 2 (b) in which a conductive adhesive 4 is applied to a portion of the IC chip module 7 corresponding to the antenna terminal 10 '.
Is dispensed in a fixed amount by a dispenser, and then I
The C chip module 7 is shown in a state where the wiring board portion 9 and the resin mold portion 11 are aligned with the through hole 6 of the surface layer base material 5 and the through hole 3 of the inlet sheet 1, respectively. In this embodiment, TB3380 manufactured by ThreeBond Co., Ltd. is used as the conductive resin.

FIG. 2 (d) shows the IC in the state of FIG. 2 (c).
Jig 14 for fitting chip module 7 and applying pressure and heating
The IC module 7 is pressed by using the conductive adhesive 4 so that the conductive adhesive 4 comes into contact with both parts of the antenna terminal 10 'of the IC module and the connection terminal 2'of the antenna coil on the inlet sheet side to become familiar with the conductive adhesive 4'. It is in a state of becoming. Subsequently, pressure is applied to the surface (the arrow in the figure) of the IC chip module 7 located directly above the conductive adhesive 4 ′,
A protrusion protruding below the heating jig 14 is applied, and the conductive adhesive 4 ′ is completely cured by locally applying pressure and heating for a short time. In the present embodiment, a heating condition of 180 ° C. × 1 second is adopted under a pressure condition of 100 Newton.

FIG. 3 is a perspective view of a pressing and heating jig according to the method of manufacturing an IC card of the embodiment of the present invention. The lower plate 15 of the pressing / heating jig is the IC chip module 7
This is for pressing the entire surface of the external electrode terminal side so as to be flush with the surface layer base material 5, and is made to act on the pillar 17 fixed to the lower plate 15 of the pressing and heating jig. Through the spring material 18, the entire IC chip module 7 is pushed down as the upper plate 16 of the jig for pressing and heating moves downward. On the other hand, the pressure pin 19 fixed to the upper plate 16 of the pressing / heating jig is used for the upper plate 1 of the pressing / heating jig.
IC corresponding to the conductive adhesive 4 in conjunction with the downward movement of 6
The surface of the chip module 7 is locally pushed by the tip of the pin, and at the same time, the heat of the upper plate 16 of the pressing and heating jig is transferred.

FIG. 2 (e) shows the state of FIG. 2 (d).
An original size support base material 8 made of PET-G, vinyl chloride or the like is attached to the back surface side of the inlet sheet 1 by means of an adhesive or thermocompression to complete the basic structure of the IC card in the original size. It is a thing.

After that, a pattern layer for forming desired patterns, letters, numbers, etc. on the front and back outermost layers of the card is formed by an arbitrary method to complete an original size IC card. In consideration of the thickness of the design layer, the thickness of the surface layer base material 5 is such that the surface of the external electrode terminal 10 of the IC chip module 7 is equal to or slightly higher than the surface of the design layer after completion. It is important to be decided with such a value.

Finally, the IC cards completed in the original size as described above are individually separated by a card punching device. The above is the embodiment of the present invention.

[0027]

By implementing the present invention, the conventional drawbacks described in the section of the prior art and the section of the problem to be solved by the invention can be remarkably improved. That is,
When the connection terminal of the antenna coil and the antenna terminal on the IC module side are joined, the two are aligned and brought into contact with each other, and only that portion is locally pressurized and heated to apply temperature to the IC chip itself. Without it, they can be joined. As a result, it is possible to provide a low-cost and highly reliable IC card and its manufacturing method.

The present invention is not limited to the range described in the embodiments, but can be applied to any type of card or tag that uses both contact type and non-contact type, and of course, all types. It can also be applied to non-contact type cards and tags. Furthermore, as a matter of course, the material and shape of the constituent base material, the conductive adhesive, the antenna coil, etc. are not limited to the embodiment.

[Brief description of drawings]

FIG. 1 is a perspective view for explaining a basic configuration of an IC card according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of an IC card manufacturing method according to an embodiment of the present invention. FIG. 2A is a cross-sectional view showing a state in which the connection terminal portion of the antenna coil is aligned so as to be exposed at the through hole portion of the surface layer base material, and FIG.
FIG. 2B is a view showing a state in which the inlet sheet and the surface layer base material are joined by thermocompression bonding or an adhesive, FIG. 2C.
FIG. 2 is a diagram showing a state in which the wiring board and the resin mold portion are aligned with the through holes of the surface layer base material and the through holes of the inlet sheet of the IC module, respectively, and FIG.
In the state of (c), the IC module is fitted, and the IC module is pressed using a jig, and the conductive adhesive comes into contact with both parts of the antenna terminal on the module side and the antenna connection terminal on the inlet sheet side to become familiar with them. FIG. 2 (e) is a view showing a state in which a conductive adhesive layer is formed, and a raw-size support base made of PET-G, vinyl chloride, or the like is attached to the back surface of the inlet sheet with an adhesive or thermocompression bonding. A figure in which the basic structure of the IC card is completed in the original size by pasting together by means such as.

FIG. 3 is a perspective view of a pressing and heating jig according to the method of manufacturing an IC card according to the embodiment of the present invention.

[Explanation of symbols]

1 Inlet Sheet 2 Antenna Coil 2'Antenna Coil Connection Terminal 3 Through Hole (Filled with Resin Mold of IC Module) 4, 4 ', 13 Conductive Adhesive 5 Surface Layer Base Material 6 Through Hole (IC Module Wiring Board 7 IC chip module 8 Support base material 9 Wiring board part of IC chip module 10 External electrode terminal 10 'of IC module Antenna terminal of IC module 11 Resin mold part of IC module (with built-in IC chip) 14 Pressurization , Heating jig 15 pressure, heating jig lower plate 16 pressure, heating jig upper plate 17 pillar 18 fixed to the lower plate spring material 19 applied to the pillar 19 pressure pin

Claims (6)

[Claims] 1. An IC card having both a contact-type communication function and a non-contact-type communication function, which is composed of an IC module, an antenna coil and a card substrate. In the IC module, an IC chip is bonded to a wiring board. , Sealed,
The antenna terminal of the IC module and the connection terminal of the antenna coil formed on the card base material are provided with a protrusion provided in advance which has conductivity and adhesiveness and is mechanically pressed and joined. IC card. 2. The conductive and adhesive protrusion is a conductive adhesive, and mechanical pressure and short-term local heating are applied while the conductive adhesive is uncured. The IC card according to claim 1, which is performed. 3. The antenna coil of the IC card,
The IC card according to claim 1, wherein the IC card is a coated metal wire. 4. A method of manufacturing an IC card comprising an IC chip having both a contact type communication function and a non-contact type communication function, wherein the IC chip is bonded and sealed to a wiring board, and an antenna terminal on the IC module side, Alternatively, at least one portion of the connection terminals of the antenna coil formed on the card base material is provided with a conductive and adhesive projection in advance, and the connection terminals are aligned with each other so as to sandwich the projection. And then facing each other, and then mechanically pressurizing and joining the connection terminal portions. 5. The conductive and adhesive protrusions are
5. The method for manufacturing an IC card according to claim 4, wherein the IC card is a conductive adhesive, and mechanical pressure and local heating are performed for a short time while the conductive adhesive is uncured. 6. The method of manufacturing an IC card according to claim 4, wherein the antenna is a covered metal wire in the method of manufacturing the IC card.