CN203691746U - Printed circuit board assembly - Google Patents
Printed circuit board assembly Download PDFInfo
- Publication number
- CN203691746U CN203691746U CN201420081708.XU CN201420081708U CN203691746U CN 203691746 U CN203691746 U CN 203691746U CN 201420081708 U CN201420081708 U CN 201420081708U CN 203691746 U CN203691746 U CN 203691746U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- structural member
- board assembly
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 32
- 238000009413 insulation Methods 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract 1
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model provides a printed circuit board assembly including a printed circuit board, insulation pressing material and a structural piece pressed together. The insulation pressing material is disposed between the printed circuit board and the structural piece. According to the utility model, by integrating the structural piece on the printed circuit board through the insulation pressing material, prior functions of the structural piece and the printed circuit board can be kept and strength after the integration is also improved. At the same time, a technical problem that a whole printed circuit board assembly is comparatively large in thickness since a distance is required to keep between a structural piece and a printed circuit board in the prior art is solved and product integral layout becomes high in design freedom degree.
Description
Technical field
The utility model relates to electronic devices and components field, relates in particular to a kind of printed circuit board assembly.
Background technology
In current design of electronic products, generally include circuit and structure two parts, often need in actual applications the requirement of simultaneously considering the two to accept or reject.At printed circuit board assembly (the Printed Circuit Board Assembly of bearer circuit design; PCBA) in; except needs meet printed circuit board (Printed Circuit Board; PCB) circuit function of itself; also need to have certain structural strength to meet its reliability demonstration simultaneously; therefore, in PCBA, must there is independent structural member (Structure) to carry out inner support and outer protection to it, as: foreign object invasion, temperature humidity interference or electromagnetic interference etc. avoided.Pcb board in PCBA and corresponding structural member have separately independently function as different parts in electronic product, and, between the two, generally all can keep certain space to prevent direct contact.
But, pcb board and structural member with and between distance the thickness of whole printed circuit board assembly is increased, be unfavorable for saving the overall space of product.
Utility model content
(1) technical problem that will solve
The utility model provides a kind of printed circuit board assembly, takies more technical problem to solve the overall space to product in prior art.
(2) technical scheme
For solving the problems of the technologies described above, the utility model provides a kind of printed circuit board assembly, comprising:
Printed circuit board, insulation pressing material and structural member that pressing is integrated, described insulation pressing material is between described printed circuit board and described structural member.
Further, described insulation pressing material is resin material or prepreg.
Further, described structural member is ceramic structures or hardware.
Further, the thickness of described printed circuit board is 0.6mm.
Further, the thickness of described structural member is 0.5mm.
Further, the thickness of described insulation pressing material is 0.2mm.
(3) beneficial effect
Visible, in a kind of printed circuit board assembly providing at the utility model embodiment, structural member is further integrated on printed circuit board by insulation pressing material, not only can retain both original functions, also optimized the intensity after integrating, meanwhile, also avoid between structural member and printed circuit board, needing to keep space length in prior art and the larger technical problem of whole printed circuit board assembly thickness that causes, made the integral layout of product have more design freedom.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is embodiment more of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of printed circuit board assembly in prior art;
Fig. 2 is the structural representation of printed circuit board assembly in the utility model embodiment;
Wherein: 1, printed circuit board; 2, structural member; 3, functional module; 4, components and parts; 5, pin; 6, insulation pressing material.
Embodiment
For making object, technical scheme and the advantage of the utility model embodiment clearer, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Fig. 1 is the simplification template of common electronics product, and wherein PCBA, taking structural member 2 as relying on, supports and protect pcb board 1 and functional module (Function) 3, wherein comprises pin 5 below by components and parts 4 comprising above of pcb board 1.If getting pcb board 1 thickness is a=1mm, structural member 2 thickness are c=1mm, intermediate gaps b=0.8mm, and now pcb board 1 and the shared thickness of structural member 2 entirety are a+b+c=2.8mm, space occupied in integral product is larger.
Therefore, the utility model embodiment provides a kind of printed circuit board assembly, referring to Fig. 2, comprising:
Printed circuit board 1, insulation pressing material 6 and structural member 2 that pressing is integrated, wherein insulate pressing material 6 between printed circuit board 1 and structural member 2.
Visible, in a kind of printed circuit board assembly providing at the utility model embodiment, structural member is further integrated on printed circuit board by insulation pressing material, not only can retain both original functions, also optimized the intensity after integrating, meanwhile, also avoid between structural member and printed circuit board, needing to keep space length in prior art and the larger technical problem of whole printed circuit board assembly thickness that causes, made the integral layout of product have more design freedom.
Preferably, can utilize resin material or prepreg as insulation pressing material 6, pcb board 1 and structural member 2 to be bondd.Herein, structural member 2 is considered as to the outermost layer of the non-components and parts one side of pcb board 1, utilize the insulator such as prepreg or resin material under vacuum high-temperature condition, to carry out pressing, insulation pressing material 6 melts and flows, make pcb board 1 and structural member 2 form good contact, three is sticked together after waiting insulation pressing material 6 to solidify hardening.Insulation pressing material 6 not only needs to ensure the adhesion strength between pcb board 1 and structural member 2, also needs to ensure that insulation is to prevent the component's feet electric leakage on pcb board 1.
Preferably, structural member 2 can be ceramic structures or hardware.Because structural member 2 need to carry out high-temperature laminating with pcb board 1 and insulation pressing material 6, need to be therefore exotic material structural member for the structural member 2 of pressing, as pottery, metal material etc.After pressing or before pressing, also need structural member 2 to carry out moulding.For example, in the time that structural member 2 is panel beating material, moulding process can comprise cut, rush/cut/compound, folding, welding, riveted joint, splicing etc.
Due to compared with prior art, pcb board 1 and structural member 2 in the utility model embodiment become one, centre also comprises that insulation pressing material 6 is as binding material bonding, therefore can suitably reduce the thickness of original device and can reach desired materials for support intensity.Preferably, the thickness a '=0.6mm of printed circuit board 1, the thickness c '=0.5mm of structural member 2, the thickness b '=0.2mm of insulation pressing material 6, now thickness and only have a '+b '+c '=1.3mm, required 2.8mm before being significantly smaller than.
Visible, the utlity model has following beneficial effect:
In a kind of printed circuit board assembly providing at the utility model embodiment, structural member is further integrated on printed circuit board by insulation pressing material, not only can retain both original functions, also optimized the intensity after integrating, simultaneously, the larger technical problem of whole printed circuit board assembly thickness of also having avoided needing to keep space length between structural member and printed circuit board in prior art and cause, makes the integral layout of product have more design freedom.
Finally it should be noted that: above embodiment only, in order to the technical solution of the utility model to be described, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of the each embodiment technical scheme of the utility model.
Claims (6)
1. a printed circuit board assembly, is characterized in that, it comprises:
Printed circuit board, insulation pressing material and structural member that pressing is integrated, described insulation pressing material is between described printed circuit board and described structural member.
2. printed circuit board assembly according to claim 1, is characterized in that:
Described insulation pressing material is resin material or prepreg.
3. printed circuit board assembly according to claim 1, is characterized in that:
Described structural member is ceramic structures or hardware.
4. according to the printed circuit board assembly described in any one in claims 1 to 3, it is characterized in that:
The thickness of described printed circuit board is 0.6mm.
5. according to the printed circuit board assembly described in any one in claims 1 to 3, it is characterized in that:
The thickness of described structural member is 0.5mm.
6. according to the printed circuit board assembly described in any one in claims 1 to 3, it is characterized in that:
The thickness of described insulation pressing material is 0.2mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420081708.XU CN203691746U (en) | 2014-02-25 | 2014-02-25 | Printed circuit board assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420081708.XU CN203691746U (en) | 2014-02-25 | 2014-02-25 | Printed circuit board assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203691746U true CN203691746U (en) | 2014-07-02 |
Family
ID=51013594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420081708.XU Expired - Fee Related CN203691746U (en) | 2014-02-25 | 2014-02-25 | Printed circuit board assembly |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203691746U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106659041A (en) * | 2016-11-15 | 2017-05-10 | 智恩电子(大亚湾)有限公司 | Mounting stand for printed circuit board |
-
2014
- 2014-02-25 CN CN201420081708.XU patent/CN203691746U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106659041A (en) * | 2016-11-15 | 2017-05-10 | 智恩电子(大亚湾)有限公司 | Mounting stand for printed circuit board |
CN106659041B (en) * | 2016-11-15 | 2021-02-09 | 智恩电子(大亚湾)有限公司 | Mounting seat for printed circuit board |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 |