KR20130097497A - Laminated and integrated tape for taping the fpcb - Google Patents

Abstract

PURPOSE: An integrated lamination tape for attaching an FPCB improve production rate, to improve waterproofness of an adhesive part and adhesion, and to prevent production from failing. CONSTITUTION: An integrated lamination tape (100) includes a main adhesive sheet (60) which has an accommodation hole accommodating electric contact patterns formed on an object being attached, has adhesions varying with heat; a dome sheet (80) for preventing impurities from flowing to between the object and the main adhesive sheet by being arranged on the upper part of the main adhesive sheet; and a sub-adhesive sheet (70) which is placed between the main adhesive sheet and the dome sheet to couple both. The main adhesive sheet consists of a heat-curable adhesive material.

Description

Laminated and integrated tape for taping the FPCB}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integral laminated tape for FPCB attachment, and more particularly, to an integral laminated tape for FPCB attachment in which the main adhesive sheet adhered to the object to be attached in a heat fusion bonding manner is made of a thermosetting adhesive material. .

In general, flexible printed circuit boards (FPCBs) are flexible printed circuit boards that are more flexible than rigid printed circuit boards (PCBs), and are used in various electronic devices.

A flexible circuit board is an electronic circuit component in which an electrical contact pattern is formed on a flexible thin plate, and includes a single-sided flexible circuit board, a double-sided flexible circuit board, and a multi-layer flexible circuit board according to the number of layers of the electronic circuit.

The flexible printed circuit board may have a plurality of electrical contact patterns formed on the copper plate to form a contact terminal, and a dome type contactor (also called a 'metal dome') may be installed to contact a plurality of patterns on the copper plate. The protective cover film covering the dome type contactor may be stacked on the flexible circuit board.

On the other hand, the flexible circuit board may be provided with a reinforcing plate formed with a plurality of holes for accommodating the dome type contactor between the copper plate and the protective cover film, the flexible circuit board may be bonded to the protective cover film and the reinforcing plate by thermocompression bonding. have.

The protective cover film uses a double-sided tape to place a dome type contactor between one side of the double-sided tape and the upper surface of the flexible circuit board, and then the dome type contactor contacts each of the plurality of contact terminals on which a plurality of electrical contact patterns are formed. The dome-type contactor is attached to the upper surface of the flexible circuit board so that the foreign material is introduced into the contact terminal by attaching a protective film made of PET (Polyethylene resin, Polyethylen terephtanlate) on the other side of the double-sided tape. Prevents.

KR 10-0925155 B1 (2009.10.29.)

The protective cover film according to the prior art is for the circuit protection of the substrate surface, the operator first sets the dome type contactor to the correct position by using a double-sided tape, first bonded to the upper surface of the flexible circuit board and then PET again Since the protective film of the material must be attached, there is a problem that the assembly process time is increased. This problem leads to a decrease in production rate.

On the other hand, the reason for attaching the protective film to the flexible circuit board using the double-sided tape is to prevent the inflow of foreign substances, the protective cover film according to the prior art is dependent on the adhesive strength of the pure double-sided tape bar as the adhesive force over time Reduction, the lifting phenomenon may occur due to the dome shape of the dome type contactor may reduce the waterproofness, there is also a problem that the separation phenomenon of the protective film due to the reduced adhesion.

In addition, the protective cover film according to the prior art, the main purpose of the circuit protection of the electronic device product to be miniaturized, bar must be attempted to adhere to a narrow site during operation, there is a problem that requires a high degree of precision.

On the other hand, in order to solve such a problem in recent years, a technique for attaching a protective cover film by a heat fusion bonding method has been proposed, but the method of heat fusion through a thermoplastic adhesive material as a medium, it is inevitable to work at high temperatures, accordingly Not only does deformation of the compression jig used during welding occur, but also the problem that the failure rate due to the low heat resistance of the adherend (flexible circuit board) increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above technical problems, and improves the production rate, improves the waterproofness and adhesion rate of the adhesive site, and prevents an increase in the defective rate due to heat resistance. To provide that purpose.

The integrated laminated tape for FPCB attachment according to the present invention includes a main adhesive sheet (thermosetting bonding) in which an accommodating hole for accommodating an electrical contact pattern formed on an object to be attached is formed, and the adhesion rate is changed by heat, and the main adhesive A dome sheet (PI) disposed on an upper portion of the sheet to block foreign matter from flowing between the attachment object to which the main adhesive sheet is attached and the main adhesive sheet, and disposed between the main adhesive sheet and the dome sheet, A bonding mediating sub-adhesive sheet (adhesive), wherein the main adhesive sheet is made of a thermosetting adhesive material.

Here, the main adhesive sheet may be a film-type adhesive sheet that is bonded by a thermal fusion bonding method that is thermally pressurized to the surface at a predetermined temperature to attach to the attachment object.

In addition, the sub-adhesive sheet may be made of any one of an acrylic material and a silicon material.

Further, the sub-adhesive sheet is a sheet made of acrylic material when the required value of the adhesive hardness between the main adhesive sheet and the dome sheet is less than or equal to the predetermined value, and the required value of the adhesive hardness between the main adhesive sheet and the dome sheet is the predetermined value. When exceeding may be a sheet made of a silicon material.

In addition, the attachment object may be an FPCB causing electrical contact inside the mobile phone.

In addition, the attachment object may be an FPCB causing electrical contact inside the PMP.

In addition, the attachment object may be an FPCB causing electrical contact inside the navigation.

In addition, a dome type contactor for contacting the electrical contact pattern is disposed in the accommodation hole, and the dome type contactor may have a concave upper surface adhered to the sub adhesive sheet when the dome sheet is bonded to the main adhesive sheet. have.

In addition, the dome sheet may be made of polyimide resin.

The integral laminated tape for FPCB attachment according to the present invention, the main adhesive sheet and the integral laminated tape consisting of the sub-adhesive sheet and the dome sheet are bonded to the FPCB by heat-sealed bonding to protect the electrical contact pattern of the FPCB. Since it is bonded by a simple process to make it has the effect of shortening the assembly process time.

In addition, when the integrated laminate tape is bonded to the FPCB by a thermal fusion bonding method, it has an effect of improving the adhesive strength and water resistance.

In addition, the main adhesive sheet is provided with a thermosetting adhesive material that can be applied at a low temperature thermal fusion bonding method, thereby reducing the defect rate of the adhesive (flexible circuit board) as well as the product when applying the thermal fusion bonding method. It has an effect of preventing thermal deformation of the crimping jig to be fixed.

1 is a perspective view showing an integrated laminated tape for FPCB attachment according to the present invention,
FIG. 2 is an exploded perspective view showing an integrated laminate tape for attaching FPCB of FIG. 1.
3 is a cross-sectional view taken along line AA of FIG. 1.

Hereinafter, a preferred embodiment of the integrated laminate tape for FPCB attachment according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing an integrated laminate tape for attaching FPCB according to the present invention, Figure 2 is an exploded perspective view showing an integrated laminate tape for attaching FPCB of Figure 1, Figure 3 is an AA line of Figure 1 It is a cross section taken according to.

1 to 3, a preferred embodiment of the integrated laminate tape 100 for FPCB attachment according to the present invention includes a main adhesive sheet 60 and a main adhesive sheet in which the adhesion rate is changed by heat. A dome sheet 80 disposed on the upper surface of the main adhesive sheet 60 so as to cover an upper portion of the 60, and a sub-adhesive sheet which mediates the coupling between the main adhesive sheet 60 and the dome sheet 80 ( 70).

The main adhesive sheet 60 may be made of a thermosetting adhesive material as a material whose adhesiveness is changed by heat. The main adhesive sheet 60 may be thermally pressurized to a surface at a predetermined temperature to be attached to an object to be attached (hereinafter, referred to as 'the adherend 10'). It is bonded to the adherend 10 by a heat fusion bonding method to attach.

More specifically, the main adhesive sheet 60 is a thermosetting adhesive, which is bonded to a dome sheet 80 to be described later to form an integrated laminated tape 100 according to the present invention. When the main adhesive sheet 60 is surface-compressed by heat fusion bonding method, the adhesion rate is changed by heat. In order to bond the dome sheet 80 to the surface of the adherend 10 by this heat fusion bonding method. It consists of a thin sheet.

Hot-setting adhesive sheet (60) (Hot-setting adhesive sheet) is an adhesive that is cured at 100 ℃ or more, it is bonded in a short time when heated, it may have a higher adhesive hardness when cured after adhesion, it may have a high heat resistance .

The thermosetting adhesive sheet 60 is preferably a heat-bonding film adhesive sheet such as HBA (Heat-Bonding Adhesive). The thermosetting adhesive sheet 60 may have a thickness of 3 to 5 times the thickness of the dome sheet 80 in consideration of the firm bonding between the surface of the dome sheet 80 and the adherend 10 described later. It may have a thickness of 1.5 to 2.5 times the thickness of the complex 10.

The thermosetting adhesive sheet 60 may have the same size as the dome sheet 80 and the adherend 10. However, it is not necessarily limited to being formed in the same size as the adherend 10, the thermosetting adhesive sheet 60 is a configuration for attaching the dome sheet 80 to the adherend 10, dome sheet The function of 80 is to protect the electrical contact pattern (2) and (4) in consideration of the fact that it covers the electrical contact pattern (2) (4) formed on the adherend 10 to block the inflow of foreign matter. One size doesn't matter.

The thermosetting adhesive sheet 60 may include accommodation holes 66 and 68 that accommodate the dome type contactor 20 to be described later.

On the other hand, in a preferred embodiment of the integral laminated tape 100 for FPCB attachment according to the present invention, the adherend 10 to which the above-described main adhesive sheet 60 is attached is an electrical contact pattern 2 ( Any electronic device provided with a circuit board forming 4 may be applied to the present invention, but the present invention is limited to the FPCB 10 (Flexible Printed Circuit Board) for convenience of description.

In particular, the FPCB 10 is a good example of the FPCB 10 used in mobile phones, notebooks, electronic notebooks, personal digital assistants, digital cameras and navigation, PMP, etc. of the electronic devices having an electrical contact pattern (2) (4) therein Can be.

Detailed description of the FPCB 10 with reference to FIGS. 1 and 2 includes a base 10 having a plurality of electrical contact patterns 2 and 4 on one surface, and a plurality of electrical contact patterns 2 and 4. The upper cover lay 30 having a dome type contactor 20 contacting the contact point, accommodating holes 26 and 28 attached to an upper surface of the base 10 and accommodating the dome type contactor 20. Lower coverlay 40 attached to the lower surface of 10 and the reinforcement board 50 attached to the lower surface of the lower coverlay 40 are included.

The base 10 again includes a body part 6 in which a plurality of electrical contact patterns 2 and 4 are formed, a terminal part 7 connected to the outside, and a neck part 8 connecting the body and the terminal part 7. It may include.

The plurality of electrical contact patterns (2) and (4) may be formed together in the body portion 6, and any one of the plurality of electrical contact patterns (2) and (4) is formed as an outer pattern (2) formed in a ring shape. The other one of the plurality of electrical contact patterns (2) and (4) may be composed of an inner pattern (4) located inside the outer pattern (2).

The dome type contactor 20 is provided to be in contact with the outer pattern 2, and when the concave upper surface of the dome type contactor 20 is pressed by an external force, the dome type contactor 20 is in contact with the inner pattern 4 so that electrical bonding is made. do.

The base 10 is a flexible film with a circuit board including a plurality of electrical contact patterns 2 and 4. More specifically, the base 10 has a top adhesive 12 positioned on an upper surface of a polyimide resin (11), an upper copper layer 13 positioned on the top adhesive 12, and an upper copper layer ( 13, the upper copper plating layer 17 is positioned.

The base 10 has a lower adhesive 15 positioned on a lower surface of the polyimide resin 11, a lower copper layer 16 positioned under the lower adhesive 15, and a lower copper plating layer on the lower copper layer 16. 17) is located. The upper adhesive 12, the upper copper layer 13, and the upper copper plating layer 17 are located only on the body portion 6 and the terminal portion 7 and not on the neck portion 8. The lower surface adhesive 15, the lower copper layer 16, and the lower copper plating layer 17 may be located at the body portion 6, the terminal portion 7, and the neck portion 8.

On the other hand, the dome type contactor 20 may have an open bottom and a space formed therein. The dome type contactor 20 may be formed of a metal dome made of metal. The dome type contactor 20 may be mounted on the upper surface of the base 10 so as to be positioned inside the receiving holes 26, 28, 66, and 68, and the bottom thereof is always in contact with the outer pattern 2 as described above. It may be placed on the outer pattern 2 in contact. When the top surface of the dome type contactor 20 is pressed by an external force, the pressed portion comes into contact with the inner pattern 4 to make electrical contact between the outer pattern 2 and the inner pattern 4.

The upper cover lay 30 is located in the body part 6 and not in the terminal part 7 and the neck part 8. The accommodation holes 26 and 28 may penetrate the upper cover lay 30 in the vertical direction to be opened. The upper cover lay 30 has a lower surface adhesive on the lower surface of the polyimide resin 31. The upper cover lay 30 may have a bottom adhesive adhered to an upper surface of the upper copper plating layers 17 and 17 of the base 10.

The lower cover lay 40 may protect the bottom of the base 10. The lower cover lay 40 is located at the body 6 and the neck 8 and not at the terminal 7. The lower cover lay 40 has an upper surface adhesive on the upper surface of the polyimide resin 41. The lower cover lay 40 may have a top adhesive adhered to a bottom surface of the lower copper plating layers 17 and 17 of the base 10.

The reinforcement plate 50 may be made of KAPTON tape. In the reinforcement plate 50, an upper surface adhesive is positioned on the upper surface of the polyimide resin 51. The reinforcing plate 50 may have a top adhesive adhered to the bottom surface of the polyimide resin 41 of the lower cover lay 40. The reinforcement plate 50 is located in the body part 6 and not in the terminal part 7 and the neck part 8.

As described above, a preferred embodiment of the integrated laminate tape 100 for FPCB attachment according to the present invention is attached to the upper surface of the FPCB 10 having such a configuration, and includes an electrical contact pattern (2) (4). It protects the circuit part.

In a preferred embodiment of the integral laminated tape 100 for FPCB attachment according to the present invention, the dome sheet 80 may form the top surface of the flexible printed circuit board. The dome sheet 80 may be made of a polyimide resin 41. The dome sheet 80 may have the same thickness as the sub-adhesive sheet 70 described later.

On the other hand, in a preferred embodiment of the integral laminated tape 100 for FPCB attachment according to the present invention, the sub-adhesive sheet 70 may adhere the dome type contactor 20 to the dome sheet 80. The thermosetting adhesive sheet 60 may be firmly fixed to the thermosetting adhesive sheet 60 at the time of thermal fusion of the thermosetting adhesive sheet (main adhesive sheet 60).

The sub adhesive sheet 70 may be made of any one of an acrylic material and a silicon material. More specifically, the sub-adhesive sheet 70 is preferably provided with a sheet made of acrylic material when the required value of the adhesion hardness between the main adhesive sheet 60 and the dome sheet 80 is less than or equal to a predetermined value, and the main adhesive sheet When the required value of the adhesive hardness of the 60 and the dome sheet 80 exceeds the predetermined value, it may be provided as a sheet made of silicon material.

Here, the required value of the adhesive hardness is not determined, and the operator can select any one according to the required adhesive hardness according to the type of flexible circuit board to which the integrated multilayer tape 100 for FPCB attachment according to the present invention is applied. It is a number.

The sub-adhesive sheet 70 is firmly attached to the dome sheet 80 and covers the receiving holes 26, 28, 66 and 68 together with the dome sheet 80, (2) (4) or the circuit portion through the through-hole (20).

That is, when the dome sheet 80 is attached to the upper surface of the FPCB 10 by the sub adhesive sheet 70 and the main adhesive sheet 60, the receiving holes 66 and 68 formed in the main adhesive sheet 60 are opened. The dome type contactor 20 is received therethrough, and the dome type contactor 20 is the sub-adhesive sheet 70 when the dome sheet 80 is bonded to the top surface of the FPCB 10 by the main adhesive sheet 60. The concave upper surface is bonded while being fixed.

In operation of the flexible circuit board having the above configuration, first, when the portion of the dome sheet 80 located above the dome type contactor 20 is pressed by an external force, the dome sheet 80 is connected to the dome type contactor ( The concave upper surface of 20) is pressed, and the dome type contactor 20 is elastically deformed while being pressed downward to electrically contact the inner pattern 4 and the outer pattern 2, and then the dome sheet 80. When the external force is removed from the portion located above the dome type contactor 20, the concave upper surface of the dome type contactor 20 that is pressed is raised by the restoring force, and the dome type contactor 20 is pushed up to the inner side. The electrical contact between the pattern 4 and the outer pattern 2 is released.

One preferred embodiment of the integrated laminated tape 100 for FPCB attachment according to the present invention, as described above, in the process of attaching the dome sheet 80 to the upper surface of the FPCB 10 in a heat-sealed bonding method Since the main adhesive sheet 60 is applied to the heat-sealed film type adhesive sheet such as HBA to be attached, there is an advantage that can simplify the assembly process.

In addition, since the main adhesive sheet 60 is made of a thermosetting adhesive material and the dome sheet 80 is made of a polyimide material, the main adhesive sheet 60 has an appropriate heat resistance, so that the application of the heat fusion bonding method is easy.

In addition, as a result of attaching the dome sheet 80 to the adherend 10 using the main adhesive sheet 60 made of a thermosetting adhesive material by a heat fusion bonding method, it is possible to have an effect of improving adhesion and waterproofness.

In addition, a preferred embodiment of the integrated laminated tape 100 for FPCB attachment according to the present invention is a main adhesive sheet for attaching the dome sheet 80 and the dome sheet 80 to the adherend 10 ( 60) and the sub-adhesive sheet 70 may be provided in one piece so that the heat fusion bonding method may be applied as it is, and thus the convenience of delivery of the product may be increased.

The preferred embodiment of the integrated laminate tape for FPCB attachment according to the present invention has been described in detail with reference to the accompanying drawings. However, the embodiment according to the present invention is not limited to the above-described preferred embodiment, and it is natural that various modifications and equivalents can be carried out by those skilled in the art. something to do. Therefore, it is to be understood that the true scope of the present invention is defined by the appended claims.

2,4: Pattern 10: Base
20: dome type contactor 30: upper cover lay
40: lower cover lay 50: gusset
60: main adhesive sheet (thermosetting adhesive sheet)
70: sub adhesive sheet 80: dome sheet
100: integral laminated tape

Claims (9)

A main adhesive sheet having an accommodating hole for accommodating an electrical contact pattern formed on the object to be attached, and whose adhesion rate is changed by heat;
A dome sheet disposed on an upper portion of the main adhesive sheet to block foreign substances from flowing between the object to which the main adhesive sheet is attached and the main adhesive sheet;
A sub-adhesive sheet disposed between the main adhesive sheet and the dome sheet to mediate the bonding between them,
The main adhesive sheet is an integral laminated tape for FPCB attachment made of a thermosetting adhesive material. The method according to claim 1,
The main adhesive sheet is an integral laminated tape for FPCB attachment, which is a film-type adhesive sheet bonded by a thermal fusion bonding method to be thermally pressurized to a surface at a predetermined temperature and attached to the attachment object. The method according to claim 1,
The sub-adhesive sheet is an integral laminated tape for FPCB attachment made of any one of an acrylic material and a silicon material. The method according to claim 3,
The sub adhesive sheet,
When the required value of the adhesion hardness of the main adhesive sheet and the dome sheet is less than a predetermined value is a sheet made of acrylic material,
The integrated laminated tape for FPCB attachment which is a sheet | seat made of a silicone material, when the requested value of the adhesive hardness of the said main adhesive sheet and the dome sheet exceeded the said predetermined value. The method according to claim 1,
The attaching object is an integral laminated tape for FPCB attachment, which is an FPCB causing electrical contact inside the mobile phone. The method according to claim 1,
The attaching object is an integrated laminated tape for FPCB (FPCB) attachment is an FPCB causing electrical contact inside the PMP. The method according to claim 1,
The attaching object is an integrated laminated tape for FPCB (FPCB) attachment that is an FPCB causing electrical contact inside the navigation. The method according to claim 1,
A dome type contactor for contacting the electrical contact pattern is disposed in the accommodation hole,
And the dome type contactor is an integral laminated tape for attaching an FPCB to which the concave upper surface is adhered to the sub adhesive sheet when the dome sheet is adhered to the main adhesive sheet. The method according to claim 1,
The dome sheet is an integral laminated tape for FPCB attachment made of polyimide resin.

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