CN105307427A - Press fit structure for multilayer board with hollow inner layer and making method thereof - Google Patents
Press fit structure for multilayer board with hollow inner layer and making method thereof Download PDFInfo
- Publication number
- CN105307427A CN105307427A CN201510694592.6A CN201510694592A CN105307427A CN 105307427 A CN105307427 A CN 105307427A CN 201510694592 A CN201510694592 A CN 201510694592A CN 105307427 A CN105307427 A CN 105307427A
- Authority
- CN
- China
- Prior art keywords
- central layer
- layer
- groove
- face
- flow prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Abstract
The invention discloses a press fit structure for a multilayer board with a hollow inner layer, which comprises a first core board and a second core board, wherein the first core board comprises an L1 surface and an L2 surface; the second core board comprises an L3 surface and an L4 surface; circuits are printed on the L2 surface and the L3 surface; and the L1 surface and the L4 surface are made in an entire surface exposure mode. The structure also comprises a third core board, a first non-flow glue prepreg located between the L2 surface and the third core board, and a second non-flow glue prepreg located between the L3 surface and the second core board, wherein the third core board comprises a core board hollow groove; the first non-flow glue prepreg comprises a first hollow groove; the second non-flow glue prepreg comprises a second hollow groove; the three hollow grooves are located at the inner layer hollow design place; and the two non-flow glue prepregs cure the first core board and the second core board on two surfaces of the third core board respectively. Flow glue and the hollow height of the inner layer hollow region can be well controlled, and one-time press fit is only needed, the making method is simple and convenient, and promotion is easy.
Description
Technical field
The present invention relates to PCB multilayer board, be specifically related to pressing structure of a kind of internal layer Multi-layer hollow plate and preparation method thereof.
Background technology
21 century is that electronic product strides at a high speed, high frequency, strong signal develops the epoch rapidly, as high speed, high frequency, the printed circuit board of the electronic devices and components in the electronic product of strong signal also needs Developing High-speed, high frequency, the manufacturing technology of strong signal track road plate, pendulum is in considerable status, for promoting the signal strength signal intensity of electronic product, can the printed circuit inner cord of soldering of electronic components be designed to hollow, and conventional art cannot meet the making of this type of printed circuit board, cannot one step press when main manifestations is pressing, internal layer hollow area gummosis is uncontrollable, the problems such as the hollow height of internal layer hollow area is not up to standard.
Summary of the invention
For solving the problem, the present invention discloses a kind of pressing structure of internal layer Multi-layer hollow plate, comprise the first central layer, the second central layer, described first central layer comprise L1 face and L2 face, described second central layer comprises L3 face and L4 face, L2 face and L3 face there is printed wire, described L1 face and L4 face are made by the mode of whole exposure, to protect whole plate copper face not etched, also comprise the 3rd central layer, the first not flow prepreg, the second not flow prepreg between L3 face and the second central layer between L2 face and the 3rd central layer; Described 3rd central layer comprises central layer groove, first not flow prepreg comprise the first groove, second not flow prepreg comprise the second groove, described central layer groove, the first groove, the second groove are positioned at internal layer hollow design position; Described first not flow prepreg and second not flow prepreg respectively the first central layer, the second central layer are solidificated in the two sides of the 3rd central layer, the first groove, that the second groove forms internal layer together with central layer groove is hollow.
Preferably, the tabula rasa formed after described 3rd central layer adopts PCB core plate two sides copper removal.
Preferably, the thickness of described 3rd central layer is 1.5 millimeters.
Preferably, the size of described first groove, the second groove is greater than central layer groove, make central layer groove edge on the 3rd central layer not by first not flow prepreg and second part that flow prepreg covers form gummosis buffering area.
Further, described gummosis buffering area width is 0.4 millimeter.
The present invention also discloses the manufacture method of the pressing structure of above-mentioned internal layer Multi-layer hollow plate, comprises step:
A. preliminary treatment; Printed wire on the L2 face of the first central layer and the L3 face of the second central layer, carries out whole exposure by the L1 face of the first central layer and the L4 face of the second central layer, is not etched to protect whole plate copper face;
B. Xiyanping injection; Respectively the 3rd central layer, first not flow prepreg, second flow prepreg does not mill out central layer groove, the first groove, the second groove by internal layer hollow design position;
C. fold in advance; By first not flow prepreg be placed between L2 face and the 3rd central layer, by second not flow prepreg be placed between L3 face and the second central layer;
D. pressing; By the first central layer, first not flow prepreg, the 3rd central layer, second flow prepreg, the second central layer do not carry out disposable integral pressing.
Preferably, described step a is also comprised and being removed by etching mode by the copper on one piece of PCB core plate two sides, forms tabula rasa, using tabula rasa as the 3rd central layer.
Preferably, the thickness of described 3rd central layer is 1.5 millimeters.
Preferably, in stepb, when carrying out Xiyanping injection, the size of the first groove, the second groove is greater than central layer groove, make central layer groove edge on the 3rd central layer not by first not flow prepreg and second part that flow prepreg covers form gummosis buffering area.
Further, in stepb, when carrying out Xiyanping injection, described gummosis buffering area width control system is 0.4 millimeter.
Pressing structure of internal layer Multi-layer hollow plate provided by the invention and preparation method thereof, can control the gummosis of internal layer hollow area and the hollow height of internal layer hollow area preferably, and it needs one step press, manufacture method is comparatively easy, is easy to promote.
Accompanying drawing explanation
Fig. 1 is the pressing structure schematic diagram of internal layer Multi-layer hollow plate.
Fig. 2 is the manufacture method flow chart of the pressing structure of internal layer Multi-layer hollow plate.
Embodiment
Better understand the present invention for ease of those skilled in the art, be further detailed below in conjunction with accompanying drawing.
The pressing structure of internal layer Multi-layer hollow plate as shown in Figure 1, comprise the first central layer 1, second central layer 2, first central layer 1 comprises L1 face 11 and L2 face 12, second central layer 2 comprises L3 face 21 and L4 face 22, L2 face 12 and L3 face 21 there is printed wire, L1 face 11 and L4 face 22 are made by the mode of whole exposure, to protect whole plate copper face not etched, the pressing structure of internal layer Multi-layer hollow plate also comprises the 3rd central layer 3, the first not flow prepreg 4, the second not flow prepreg 5 between L3 face 21 and the second central layer 2 between L2 face 12 and the 3rd central layer 3, the tabula rasa that 3rd central layer 3 is formed after adopting PCB core plate two sides copper removal, thickness is 1.5 millimeters, 3rd central layer 3 comprises the central layer groove 31 being of a size of 34mm × 34mm, first not flow prepreg 4 comprise the first groove 41, second not flow prepreg 5 comprise the second groove 51, first groove 41, the size of the second groove 51 is 34.4mm × 34.4mm, described central layer groove 31, first groove 41, second groove 51 is positioned at internal layer hollow design position, due to the first groove, the size of the second groove is greater than central layer groove, make central layer groove edge on the 3rd central layer not by first not flow prepreg and second part that flow prepreg covers form gummosis buffering area.First not flow prepreg and second not flow prepreg respectively the first central layer, the second central layer are solidificated in the two sides of the 3rd central layer, the first groove, that the second groove forms internal layer together with central layer groove is hollow.
In actual manufacture process, the concrete size of central layer groove is as the criterion according to customer requirement size, and the width of gummosis buffering area is 4mm.
The manufacture method flow process of the pressing structure of internal layer Multi-layer hollow plate as shown in Figure 2, comprises preliminary treatment, Xiyanping injection, pre-folded, pressing.
When carrying out preliminary treatment, printed wire on the L2 face 12 of the first central layer 1 and the L3 face 21 of the second central layer 2, carries out whole exposure by the L1 face 11 of the first central layer 1 and the L4 face 22 of the second central layer 2, is not etched to protect whole plate copper face; The copper on one piece of PCB core plate two sides is removed by etching mode simultaneously, form tabula rasa, using tabula rasa as the 3rd central layer 3.
When carrying out Xiyanping injection, respectively the 3rd central layer 3, first not flow prepreg 4, second flow prepreg 5 does not mill out central layer groove 31, first groove 41, second groove 51 by internal layer hollow design position, and the size of the first groove 41, second groove 51 is greater than central layer groove 31, make central layer groove 31 edge on the 3rd central layer 3 not by first not flow prepreg 4 and the second part that flow prepreg 5 does not cover form gummosis buffering area, gummosis buffering area width control system is 0.4 millimeter.
Pre-folded be namely by first not flow prepreg 4 be placed between L2 face 12 and the 3rd central layer 3, by second not flow prepreg 5 be placed between L3 face 21 and the second central layer 2.
Finally by the first central layer 1, first not flow prepreg 4, the 3rd central layer 3, second not flow prepreg 5, second central layer 2 carry out disposable integral pressing.
First not flow prepreg 4, second not flow prepreg 5 can adopt the not flow prepreg of SP120N1080RC64%.
After pressing structure completes, can produce internal layer Multi-layer hollow plate by normal double sided board flow process, flow process is as follows: the boring → plate electricity → outer-layer circuit → figure electricity → outer reason in outer inspection → welding resistance → word → surface → shaping → test → become inspection → warehouse-in.
Above-described embodiment is only specific embodiments of the invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (10)
1. the pressing structure of an internal layer Multi-layer hollow plate, comprise the first central layer, the second central layer, described first central layer comprise L1 face and L2 face, described second central layer comprises L3 face and L4 face, L2 face and L3 face there is printed wire, described L1 face and L4 face are made by the mode of whole exposure, to protect whole plate copper face not etched, it is characterized in that: also comprise the 3rd central layer, the first not flow prepreg, the second not flow prepreg between L3 face and the second central layer between L2 face and the 3rd central layer; Described 3rd central layer comprises central layer groove, first not flow prepreg comprise the first groove, second not flow prepreg comprise the second groove, described central layer groove, the first groove, the second groove are positioned at internal layer hollow design position; Described first not flow prepreg and second not flow prepreg respectively the first central layer, the second central layer are solidificated in the two sides of the 3rd central layer, the first groove, that the second groove forms internal layer together with central layer groove is hollow.
2. according to the pressing structure of a kind of internal layer Multi-layer hollow plate described in claim 1, it is characterized in that: the tabula rasa formed after described 3rd central layer adopts PCB core plate two sides copper removal.
3., according to the pressing structure of a kind of internal layer Multi-layer hollow plate described in claim 1, it is characterized in that: the thickness of described 3rd central layer is 1.5 millimeters.
4. according to the pressing structure of a kind of internal layer Multi-layer hollow plate described in claim 1, it is characterized in that: the size of described first groove, the second groove is greater than central layer groove, make central layer groove edge on the 3rd central layer not by first not flow prepreg and second part that flow prepreg covers form gummosis buffering area.
5., according to the pressing structure of a kind of internal layer Multi-layer hollow plate described in claim 4, it is characterized in that: described gummosis buffering area width is 0.4 millimeter.
6., according to a manufacture method for the pressing structure of internal layer Multi-layer hollow plate described in claim 1, comprise step:
A. preliminary treatment; Printed wire on the L2 face of the first central layer and the L3 face of the second central layer, carries out whole exposure by the L1 face of the first central layer and the L4 face of the second central layer, is not etched to protect whole plate copper face;
B. Xiyanping injection; Respectively the 3rd central layer, first not flow prepreg, second flow prepreg does not mill out central layer groove, the first groove, the second groove by internal layer hollow design position;
C. fold in advance; By first not flow prepreg be placed between L2 face and the 3rd central layer, by second not flow prepreg be placed between L3 face and the second central layer;
D. pressing; By the first central layer, first not flow prepreg, the 3rd central layer, second not flow prepreg, the second central layer disposable integral pressing.
7. according to the manufacture method of the pressing structure of internal layer Multi-layer hollow plate described in claim 6, it is characterized in that: described step a is also comprised and being removed by etching mode by the copper on one piece of PCB core plate two sides, forms tabula rasa, using tabula rasa as the 3rd central layer.
8., according to the manufacture method of the pressing structure of internal layer Multi-layer hollow plate described in claim 6, it is characterized in that:
The thickness of described 3rd central layer is 1.5 millimeters.
9. according to the manufacture method of the pressing structure of internal layer Multi-layer hollow plate described in claim 6, it is characterized in that: in stepb, when carrying out Xiyanping injection, the size of the first groove, the second groove is greater than central layer groove, make central layer groove edge on the 3rd central layer not by first not flow prepreg and second part that flow prepreg covers form gummosis buffering area.
10. according to the manufacture method of the pressing structure of internal layer Multi-layer hollow plate described in claim 9, it is characterized in that: in stepb, when carrying out Xiyanping injection, described gummosis buffering area width control system is 0.4 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510694592.6A CN105307427A (en) | 2015-10-21 | 2015-10-21 | Press fit structure for multilayer board with hollow inner layer and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510694592.6A CN105307427A (en) | 2015-10-21 | 2015-10-21 | Press fit structure for multilayer board with hollow inner layer and making method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105307427A true CN105307427A (en) | 2016-02-03 |
Family
ID=55204024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510694592.6A Pending CN105307427A (en) | 2015-10-21 | 2015-10-21 | Press fit structure for multilayer board with hollow inner layer and making method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105307427A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792507A (en) * | 2016-04-25 | 2016-07-20 | 高德（无锡）电子有限公司 | Printed circuit board with cavity and processing method of printed circuit board |
| CN107318232A (en) * | 2017-07-06 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of PCB mechanical blind holes |
| CN107708337A (en) * | 2017-09-07 | 2018-02-16 | 信丰文峰电子科技有限公司 | A kind of circuit board and preparation method thereof |
| CN111112710A (en) * | 2018-10-30 | 2020-05-08 | 胜宏科技（惠州）股份有限公司 | Method for improving groove milling forming tolerance of PCB |
| CN112601342A (en) * | 2020-11-20 | 2021-04-02 | 惠州市三强线路有限公司 | Method for manufacturing embedded cavity of multilayer circuit board |
| CN113543530A (en) * | 2021-06-02 | 2021-10-22 | 深圳市强达电路股份有限公司 | Manufacturing method of PCB with concave steps on side surfaces |
| CN113950205A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Processing method of circuit board, processing method of copper-clad plate and circuit board |
| CN114364168A (en) * | 2022-01-07 | 2022-04-15 | 安捷利（番禺）电子实业有限公司 | Preparation method of circuit board with built-in cavity, circuit board and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368890A (en) * | 2011-10-09 | 2012-03-07 | 东莞生益电子有限公司 | Manufacturing method of PCB with embedded assembly |
| CN102523690A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Manufacturing method of PCB board with blind slot containing IC foot |
| CN102595789A (en) * | 2011-01-08 | 2012-07-18 | 上海美维电子有限公司 | Production method of cavity PCB plate |
| CN104168711A (en) * | 2014-08-29 | 2014-11-26 | 广州美维电子有限公司 | Pressing structure of cavity circuit board and pressing method of cavity circuit board |
| CN104363720A (en) * | 2014-10-21 | 2015-02-18 | 深圳崇达多层线路板有限公司 | Method of forming deep blind groove in printed circuit board (PCB) |
-
2015
- 2015-10-21 CN CN201510694592.6A patent/CN105307427A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595789A (en) * | 2011-01-08 | 2012-07-18 | 上海美维电子有限公司 | Production method of cavity PCB plate |
| CN102368890A (en) * | 2011-10-09 | 2012-03-07 | 东莞生益电子有限公司 | Manufacturing method of PCB with embedded assembly |
| CN102523690A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Manufacturing method of PCB board with blind slot containing IC foot |
| CN104168711A (en) * | 2014-08-29 | 2014-11-26 | 广州美维电子有限公司 | Pressing structure of cavity circuit board and pressing method of cavity circuit board |
| CN104363720A (en) * | 2014-10-21 | 2015-02-18 | 深圳崇达多层线路板有限公司 | Method of forming deep blind groove in printed circuit board (PCB) |
Non-Patent Citations (2)
| Title |
|---|
| 沈阳仪器仪表工艺研究所: "《国外机械工业基本情况 仪器仪表制造技术》", 31 December 1987 * |
| 钱军浩: "《特种印刷技术》", 28 February 2010 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792507A (en) * | 2016-04-25 | 2016-07-20 | 高德（无锡）电子有限公司 | Printed circuit board with cavity and processing method of printed circuit board |
| CN107318232A (en) * | 2017-07-06 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of PCB mechanical blind holes |
| CN107708337A (en) * | 2017-09-07 | 2018-02-16 | 信丰文峰电子科技有限公司 | A kind of circuit board and preparation method thereof |
| CN111112710A (en) * | 2018-10-30 | 2020-05-08 | 胜宏科技（惠州）股份有限公司 | Method for improving groove milling forming tolerance of PCB |
| CN113950205A (en) * | 2020-07-16 | 2022-01-18 | 深南电路股份有限公司 | Processing method of circuit board, processing method of copper-clad plate and circuit board |
| CN113950205B (en) * | 2020-07-16 | 2024-03-22 | 深南电路股份有限公司 | Circuit board processing method, copper-clad plate processing method and circuit board |
| CN112601342A (en) * | 2020-11-20 | 2021-04-02 | 惠州市三强线路有限公司 | Method for manufacturing embedded cavity of multilayer circuit board |
| CN113543530A (en) * | 2021-06-02 | 2021-10-22 | 深圳市强达电路股份有限公司 | Manufacturing method of PCB with concave steps on side surfaces |
| CN114364168A (en) * | 2022-01-07 | 2022-04-15 | 安捷利（番禺）电子实业有限公司 | Preparation method of circuit board with built-in cavity, circuit board and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105307427A (en) | Press fit structure for multilayer board with hollow inner layer and making method thereof | |
| US9601259B2 (en) | Electronic component | |
| US9653209B2 (en) | Method for producing electronic component | |
| US20150041191A1 (en) | Printed circuit board and preparation method thereof | |
| US9504169B2 (en) | Printed circuit board having embedded electronic device and method of manufacturing the same | |
| JP2011187779A (en) | Module | |
| CN202503814U (en) | Heavy copper printed circuit board with inner layer and outer layer | |
| CN104812174A (en) | Prepreg blind hole and slot forming method | |
| CN206077826U (en) | A kind of pcb board structure of optimization power plane channel pressure drop | |
| CN203708620U (en) | Printed circuit board (PCB) with multiple alignment system | |
| CN105101642B (en) | A kind of method and multi-layer PCB board for increasing multi-layer PCB board metal foil area | |
| CN108093569A (en) | A kind of processing method for reducing super thick copper circuit board welding resistance difficulty | |
| CN104735900A (en) | Circuit board with side face metal structure and manufacturing method thereof | |
| CN102365006B (en) | Processing method of multi-layer circuit board | |
| CN104981097A (en) | Processing method of gold finger, and gold finger circuit board | |
| CN104023484A (en) | Manufacturing method of printed circuit board overlaid through hole structure | |
| CN101460020A (en) | Multilayered flexible circuit board | |
| CN104981110A (en) | Processing method of gold finger, and gold finger circuit board | |
| CN108990267B (en) | Manufacturing method of rigid-flex board with outer double flexible boards | |
| CN104902698A (en) | A circuit board golden finger processing method and a circuit board having golden fingers | |
| JP2007088140A (en) | Assembled printed wiring board | |
| CN204031584U (en) | A kind of have convex high printed circuit board (PCB) | |
| CN102762036B (en) | Method for circuit manufacture of ultra-thin inner-layer board | |
| CN209447195U (en) | Bio-identification mould group | |
| CN105205260A (en) | Low cost and anti-interference dual mode laminated design method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160203 |
|
| RJ01 | Rejection of invention patent application after publication |