JP2009081400A - Shield structure of electronic device terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shield structure of an electronic device terminal that not only achieves thickness and weight reduction in addition to space saving but also improves electric shielding effect. <P>SOLUTION: The shield structure of the electronic device includes sheet shaped metal layers 6a, 6b, 6c covering not only external surfaces of the electronic parts 2, 3 disposed on a substrate 1 but also a surface of the substrate therearound, and sheet shaped non-conductive adhesive layers 8a, 8b, 8c for bonding the external surfaces of the electronic parts between the metal layers 6a, 6b, 6c and the electronic parts 2 and 3. Further, the structure includes sheet shaped conductive adhesive layers 7a, 7b, 7c which not only bond the metal layers 6a, 6b, 6c to the substrate surfaces surrounding the electronic parts 2, 3 but also connect the metal layers 6a, 6b, 6c to a ground terminal on the substrate 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a shield structure for an electronic device terminal used in a portable wireless communication device such as a mobile phone or a PHS (Personal Handy-phone System).

  A conventional portable wireless communication device has an electrical shield structure as shown in FIGS. 8 and 9 (see, for example, Patent Document 1). FIG. 8 is a sectional view of a shield structure of a conventional portable wireless communication device, and FIG. 9 is an exploded perspective view.

  8 and 9, 1 is a wiring board, 2 and 3 are electronic components mounted on the wiring board 1, 4 is a shield frame joined to the wiring board 1, and 5 is fitted to the shield frame 4 and a plurality of 2 shows a shield cover that collectively closes electronic components 2 and 3.

  The shield frame 4 and the shield frame 5 that close the high-frequency circuit occupation region are formed of a sheet metal material. In a portable wireless communication device that is required to be thin and lightweight, as shown in FIGS. 8 and 9, when there are differences in the height of components such as the electronic components 2 and 3, the shield frame 4 and the shield frame are used. 5 is provided with opening holes 4a and 5a in the region of the electronic component 2, which is the highest-level component in the high-frequency circuit occupation region.

JP 2006-147917 A (stages 0015 to 0020, FIG. 1)

  However, in the shield structure of the above-described conventional electronic device terminal, the shield effect is insufficient by providing the opening holes 4a and 5a in the shield frame 4 and the shield frame 5 in preference to thin and light portable radio communication devices. There was a problem that there was.

  In addition, when the opening holes 4a and 5a are not provided by giving priority to the effect of the shield, there is a problem that the reduction in thickness and weight is hindered. Furthermore, when a step is provided on the top surface of the shield cover 5 without providing the opening holes 4a, 5a, the sheet metal material is difficult to process.

  An object of the present invention is to provide a shield structure for an electronic device terminal that can reduce the thickness and weight, save space, and improve the effect of an electrical shield.

  The shield structure of the electronic device terminal according to the present invention includes a conductive layer covering the outer surface of the electronic component and the surrounding substrate surface provided on the substrate, and the outer surface of the electronic component bonded between the conductive layer and the electronic component. A non-conductive adhesive layer that adheres to the conductive layer and the substrate surface around the electronic component, and a conductive adhesive layer that connects the conductive layer and the ground terminal on the substrate.

  According to the present invention, an electronic component provided on a substrate is covered with a sheet-like metal layer via a sheet-like non-conductive adhesive layer, and the sheet-like metal layer is covered via a sheet-like conductive adhesive layer. Even when covering electronic components with different heights by adhering to the substrate and electrically connecting to the ground terminal, it can be reliably and easily electrically shielded in a form that follows the shape of each electronic component. . Further, it is possible to reduce the thickness and weight without providing an opening in the shield component.

Hereinafter, various embodiments of a shield structure for an electronic device terminal according to the present invention will be described with reference to the drawings.
Embodiment 1 FIG.
1, 2 and 3 are schematic views showing the configuration of the shield structure of the electronic device terminal according to Embodiment 1 of the present invention. 1 is an external perspective view, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB in FIG.

  2 to 3, reference numeral 100 denotes a sheet-like shield part for closing the electronic parts 2 and 3, 6a, 6b and 6c are sheet-like metal layers having an electric shielding function, and 7a, 7b and 7c are sheet-like parts. The conductive adhesive layers 8a, 8b, and 8c are sheet-like non-conductive adhesive layers.

  The sheet-like shield component 100 is covered with and bonded to the electronic components 2 and 3 with the metal layers 6a, 6b, and 6c through the non-conductive adhesive layers 8a, 8b, and 8c, and closes the electronic components 2 and 3. The wiring board 1 is bonded via the conductive adhesive layers 7a, 7b, 7c, and the ground terminal on the wiring board 1 and the metal layer 6 are electrically connected.

  FIG. 4 is a cross-sectional view of a shielding sheet 50 for forming the sheet-like shield component 100. As shown in FIG. In FIG. 4, the shielding sheet 50 is composed of three layers: a metal layer 6, a conductive adhesive layer 7, and a nonconductive adhesive layer 8.

  The central portion 50e of the shielding sheet 50 is composed of three layers provided with a non-conductive adhesive layer 8 for insulating and bonding the metal layer 6, the conductive adhesive layer 7 and the electronic components 2 and 3 to the end portion. 50d and 50f are composed of two layers in which the non-conductive adhesive layer 8 is removed in order to electrically connect and bond the wiring board 1 and the metal layer 6.

  Next, a method for forming the sheet-like shield component 100 from the shield sheet 50 will be described. First, the top and bottom surfaces of the electronic components 2 and 3 shown in FIG. 1 that are the XY planes and both side surfaces on the YZ plane side are attached and covered with the central portions 50a-e of the shield sheet 50a, and the end portions 50a-d, 50a are covered. -F is attached to the wiring board 1 (see FIG. 2).

  Subsequently, the other side surfaces on the XZ plane side of the electronic components 2 and 3 are respectively attached and covered with the central portion 50b-e of the shielding sheet 50b and the central portion 50c-e of the shielding sheet 50c, and are used for shielding. Affixed to the metal layer 6a side end of the central part 50a-e of the shield sheet 50a attached to the top and side surfaces of the electronic components 2, 3 with one end 50b-d, 50c-d of the sheet 50b, 50c. The other end portions 50b-f and 50c-f of the shielding sheets 50b and 50c are attached to the wiring board 1 (see FIG. 3).

  As described above, the entire surfaces of the electronic components 2 and 3 on the wiring board 1 are covered with the shielding sheets 50a, 50b, and 50c so that there are no exposed portions, whereby the sheet-shaped shielding component 100 is formed. In pasting on the wiring board 1, one of the end portions 50 b-f, 50 c-f, 50 a-d, or 50 a-f electrically connects the ground terminal on the wiring board 1 and the metal layer 6.

  As described above, in the first embodiment, the electronic components 2 and 3 provided on the wiring board 1 are attached to the sheet-like metal layers 6a and 6b via the sheet-like non-conductive adhesive layers 8a, 8b, and 8c. 6c, and the sheet-like metal layers 6a, 6b, 6c are bonded to the wiring board 1 via the sheet-like conductive adhesive layers 7a, 7b, 7c to be electrically connected to the ground terminal. Even when the electronic components having different heights are covered, it is possible to reliably and easily electrically shield the electronic components in a form following the shape of each electronic component. Further, it is possible to reduce the thickness and weight without providing an opening in the shield component.

  In the first embodiment, in order to form the sheet-like shield component 100, a shield sheet 50 including three layers of the metal layer 6, the conductive adhesive layer 7, and the nonconductive adhesive layer 8 is used. As described above, a shielding sheet in which the central portion 51e is composed of two layers of the metal layer 6 and the non-conductive adhesive layer 8 may be used like the shielding sheet 51 shown in FIG.

  6 and 7 are cross-sectional views of the sheet-like shield component 101 formed using the shield sheet 51. FIG. In this case, further reduction in thickness and weight can be realized as compared with the sheet-like shield component 100.

  In the first embodiment, the sheet-shaped shield component 100 is formed by integrally covering the plurality of electronic components 2 and 3, but may be formed by covering them separately. In this case, a sheet-like shield component can be formed in a shape that follows each electronic component, and space saving can be achieved.

It is a perspective view which shows the structure of Embodiment 1 of the shield structure of the electronic device terminal which concerns on this invention. It is sectional drawing which shows the structure of Embodiment 1 of the shield structure of the electronic device terminal which concerns on this invention. It is sectional drawing which shows the structure of Embodiment 1 of the shield structure of the electronic device terminal which concerns on this invention. It is sectional drawing which shows the structure of the sheet | seat for shielding of Embodiment 1 of the shield structure of the electronic device terminal which concerns on this invention. It is sectional drawing which shows the other structure of the sheet | seat for shielding of Embodiment 1 of the shield structure of the electronic device terminal which concerns on this invention. It is sectional drawing which shows the other structure of Embodiment 1 of the shield structure of the electronic device terminal which concerns on this invention. It is sectional drawing which shows the other structure of Embodiment 1 of the shield structure of the electronic device terminal which concerns on this invention. It is sectional drawing which shows the structure of the shield structure of the conventional electronic device terminal. It is a disassembled perspective view which shows the structure of the shield structure of the conventional electronic device terminal.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring board 2, 3 Electronic component 6a, 6b, 6c Metal layer 7a, 7b, 7c Conductive adhesive layer 8a, 8b, 8c Nonelectroconductive adhesive layer 100, 101 Sheet-like shield component

Claims (4)

A conductive layer covering the outer surface of the electronic component provided on the substrate and the surrounding substrate surface;
A non-conductive adhesive layer that adheres to the outer surface of the electronic component between the conductive layer and the electronic component;
A shield structure for an electronic device terminal, comprising: a conductive adhesive layer that bonds the conductive layer and a substrate surface around the electronic component and connects the conductive layer and a ground terminal on the substrate.   2. The electronic device according to claim 1, wherein the conductive layer includes a plurality of regions, and the regions of the conductive layers are electrically connected via a conductive adhesive layer provided at an end of the conductive layer. Terminal shield structure.   3. The shield structure for an electronic device terminal according to claim 1, wherein the conductive layer covering the outer surface of the electronic component is also bonded to the non-conductive adhesive layer.   3. The shield structure for an electronic device terminal according to claim 1, wherein the conductive layer covering the outer surface of the electronic component is adhered to the non-conductive adhesive layer via the conductive adhesive layer.

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