CN105578749A - Circuit board connecting assembly and mobile terminal - Google Patents
Circuit board connecting assembly and mobile terminal Download PDFInfo
- Publication number
- CN105578749A CN105578749A CN201511026227.4A CN201511026227A CN105578749A CN 105578749 A CN105578749 A CN 105578749A CN 201511026227 A CN201511026227 A CN 201511026227A CN 105578749 A CN105578749 A CN 105578749A
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- circuit board
- several
- copper foil
- pads
- layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a circuit board connecting assembly and a mobile terminal. The circuit board connecting assembly comprises a printed circuit board and a flexible circuit board, wherein the printed circuit board comprises at least two copper foil layers and at least one dielectric layer; the at least one dielectric layer is clamped between the at least two copper foil layers; a plurality of first bonding pads and second bonding pads are arranged on the at least two copper foil layers respectively; the plurality of first bonding pads or second bonding pads are used for connecting electronic components; the flexible circuit board is provided with a plurality of third bonding pads corresponding to the plurality of first bonding pads or second bonding pads; and the plurality of third bonding pads are connected with the plurality of first bonding pads or second bonding pads. The circuit board connecting assembly provided by the invention can achieve the targets that devices are arranged on the printed circuit board and then the printed circuit board is connected with the flexible circuit board through the bonding pads. The printed circuit board is the board with at least two layers, so that high-density device arrangement can be carried out; the devices do not need to arrange on the flexible circuit board; and the space of the flexible circuit board is saved. Meanwhile, the flexible circuit board is connected with the printed circuit board; and the flexible circuit board does not need extra reinforcement, so that the production cost can be reduced.
Description
Technical field
The present invention relates to the communications field, particularly relate to a kind of circuit board coupling assembling and mobile terminal.
Background technology
Due to the development of science and technology, the function of intelligent mobile terminal equipment gets more and more, and the wiring on circuit board also becomes increasingly complex.
At present, due to the easy bending characteristic of flexible circuit board itself, usual needs do reinforcement on flexible PCB, make when flexible PCB (FPC) enterprising row wiring like this, owing to connecting up in the position of doing reinforcement, can not be connected with other elements by cloth device, so make the wiring smaller volume in flexible circuit board simultaneously.
But, when flexible PCB carrying out large density wiring to connect electronic devices and components, generally for and meet cabling requirement, the form of many employings Rigid Flex, then simultaneously at flexible PCB and the enterprising row wiring of hardboard, and this measure due to manufacturing procedure comparatively complicated, so cost is higher, be unfavorable for production control cost.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, provides one to meet simple and cost comparatively low circuit plate coupling assembling and the mobile terminal of large density cabling requirement, manufacturing procedure.
To achieve these goals, embodiment of the present invention provides following technical scheme:
First aspect, the invention provides a kind of circuit board coupling assembling, described circuit board coupling assembling comprises printed circuit board (PCB) and flexible PCB, described printed circuit board (PCB) comprises at least two-layer copper foil layer and at least one deck dielectric layer, dielectric layer described in one deck is all clamped between often two-layer in described at least two-layer copper foil layer, two copper foil layers outside being positioned in described at least two-layer copper foil layer are respectively arranged with several first pads and several the second pads, and several first pads described are arranged in order along the bearing of trend of the copper foil layer at its place, several second pads are arranged in order along the bearing of trend of the copper foil layer at its place, several first pads described or the second pad are in order to connect electronic devices and components, on described flexible PCB, corresponding several first pads described or the second pad are provided with several the 3rd pads, several the 3rd pads described are connected with several first pads described or the second pad.
In conjunction with first aspect, in the first possible implementation of first aspect, described copper foil layer is four layers, be respectively the first copper foil layer, the second copper foil layer, the 3rd copper foil layer and the 4th copper foil layer that superpose setting successively, described dielectric layer is three layers, be located in successively between described copper foil layer respectively, and described first copper foil layer be provided with several first pads described, described 4th copper foil layer is provided with several second pads described.
In conjunction with the first possible implementation of first aspect, in the implementation that the second of first aspect is possible, three layers of described dielectric layer are provided with several vias, several vias described are respectively in order to two-layer described copper foil layer that conducting is often adjacent.
In conjunction with the first possible implementation of first aspect or first aspect, in the third possible implementation of first aspect, corresponding several second pads described of described circuit board coupling assembling are provided with several electronic devices and components, together with several electronic devices and components described are mounted on by surface mounting technology with several second pads respectively.
In conjunction with the first possible implementation of first aspect, in the 4th kind of possible implementation of first aspect, several first pads described and the second pad are plated on described first copper foil layer and described 4th copper foil layer respectively.
In conjunction with the first possible implementation of first aspect, in the 5th kind of possible implementation of first aspect, described first copper foil layer is also provided with solder mask, several first pads described are arranged on described solder mask.
In conjunction with first aspect, in the 6th kind of possible implementation of first aspect, described at least one deck dielectric layer is insulating barrier, and the material of described at least one deck dielectric layer is polypropylene.
In conjunction with first aspect, in the 7th kind of possible implementation of first aspect, several first pads described and several the 3rd pads connect respectively by conducting resinl pressing.
In conjunction with first aspect, in the 8th kind of possible implementation of first aspect, described flexible circuit board comprises the substrate layer, the 5th copper foil layer and the cover layer that superpose setting successively, and several the 3rd pads described are located on described 5th copper foil layer.
Second aspect, present invention also offers a kind of mobile terminal, and described mobile terminal comprises body and circuit board coupling assembling described above, and described body is provided with host cavity, and described circuit board coupling assembling is placed in described host cavity.
Circuit board coupling assembling provided by the invention comprises at least two-layer copper foil layer by arranging printed circuit board (PCB) and is located at least one deck dielectric layer between at least two-layer copper foil layer, then some first pads and the second pad are set respectively at least two-layer copper foil layer, this first pad or the second pad can in order to connect electronic devices and components, thus realize carrying out arranging devices on a printed circuit.Then corresponding on flexible PCB several the 3rd pads are set, and the 3rd pad can be connected with the first pad or the second pad, thus realize printed circuit board (PCB) and flexible PCB to couple together.In addition, because printed circuit board (PCB) is at least two-ply, therefore, it is possible to carry out large density wiring and arranging devices, therefore, without the need to arranging devices on flexible PCB, cost savings the space of flexible PCB, simultaneously, also because flexible PCB is connected with printed circuit board (PCB), so flexible PCB is without the need to additionally arranging reinforcement, so can production cost be reduced.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the circuit board coupling assembling that the embodiment of the present invention provides;
Fig. 2 is the structural representation of arranging devices on the circuit board coupling assembling that provides of the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
See also Fig. 1 to Fig. 2, a kind of mobile terminal that the embodiment of the present invention provides, comprise body (not indicating in figure) and circuit board coupling assembling 100, described body is provided with host cavity, described circuit board coupling assembling 100 is placed in described host cavity.
In the present embodiment, described mobile terminal can be but is not limited to mobile phone, flat board, computer or personal digital assistant (PDA) etc.The present invention preferably for described mobile terminal for mobile phone is described.
Described body can be mobile phone body, comprise housing, display module and touch control component etc., described housing is provided with described host cavity, described display module and described touch control component are all contained in described host cavity, and described display module and described touch control component are all electrically connected with described circuit board coupling assembling 100, with the touch controllable function of the Presentation Function and described touch control component that realize described display module.
Described circuit board coupling assembling 100 comprises printed circuit board (PCB) 10 and flexible PCB 20.Described printed circuit board (PCB) 10 comprises at least two-layer copper foil layer 12 and at least one deck dielectric layer 13.Dielectric layer 13 described in one deck is all clamped between often two-layer in described at least two-layer copper foil layer 12.Two copper foil layers 12 being positioned at outside in described at least two-layer copper foil layer 12 are respectively arranged with several first pads 121 and several the second pads 122, and several first pads 121 described are arranged in order along the bearing of trend of the copper foil layer 12 at its place.Several second pads 122 described are arranged in order setting along the bearing of trend of the copper foil layer 12 at its place.Several first pads 121 described or the second pad 122 are in order to connect electronic devices and components.On described flexible PCB 20, corresponding several first pads 121 described or the second pad 122 are provided with several the 3rd pads 21, and several the 3rd pads 21 described are connected with several first pads 121 described or the second pad 122.
Circuit board coupling assembling 100 provided by the invention, by printed circuit board (PCB) 10 being arranged to the structure of at least two-ply, then two copper foil layers 12 outside being positioned at least two-layer copper foil layer 12 of printed circuit board (PCB) 10 arrange the first pad 121 and the second pad 122 respectively, described first pad 121 or the second pad 122 in order to be connected with electronic devices and components, thus can realize arranging electronic components and parts on the printed circuit board 10.Simultaneously, the first pad 121 or the second pad 122 is utilized to be connected with the 3rd pad 21 on flexible PCB 20, thus flexible PCB 20 and printed circuit board (PCB) 10 can be made to realize being electrically connected, and then arranging electronic components and parts can be carried out on the printed circuit board 10, then by the connection of printed circuit board (PCB) 10 with flexible PCB 20, thus electronic devices and components are made also can to realize being connected with flexible PCB 20.Thus without the need at the enterprising row wiring of flexible PCB 20 or arranging electronic components and parts, while saving the wiring space of flexible PCB 20, also without the need to arranging reinforcement on flexible PCB 20, cost savings making processing cost.
Particularly, described printed circuit board (PCB) 10 is hardboard, and described printed circuit board (PCB) 10 is at least doubling plate.Preferably, described printed circuit board (PCB) 10 is four laminates, namely comprises four layers of described copper foil layer 12.Because described printed circuit board (PCB) 10 adopts the design of at least doubling plate, thus more wiring space can be had than lamina, when needs carry out large density arranging electronic components and parts, also can meet enough arrangement space requirements.Be understandable that, in other embodiments, described printed circuit board (PCB) 10 also can be doubling plate, six laminates or eight laminates etc., depending on concrete wiring and arranging electronic components and parts requirement and select to arrange.
Further, described printed circuit board (PCB) 10 is platelet, and namely the length of described printed circuit board (PCB) 10 is less than the length of described flexible PCB 10.Preferably, the length of described printed circuit board (PCB) 10 can be 1/4th or 1/3rd of described flexible PCB 20, thus while can being connected with described flexible PCB 20 meeting described printed circuit board (PCB) 10, described printed circuit board (PCB) 10 taking up room on described flexible PCB 20 can also be reduced.In addition, because described printed circuit board (PCB) 10 is platelet, when described circuit board coupling assembling 100 is installed on the body interior of described mobile terminal, also can reduce described circuit board assemblies 100 taking up room on the mainboard of body, thus the thickness being conducive to mobile terminal does thin.
In the present embodiment, described copper foil layer 12 is four layers, is respectively the first copper foil layer 12a, the second copper foil layer 12b, the 3rd copper foil layer 12c and the 4th copper foil layer 12d that superpose setting successively.Particularly, as shown in Figure 1, see from the bottom up according to paper direction, described first copper foil layer 12a ground floor from the bottom up, described 4th copper foil layer 12d is from the bottom up the 4th layer.Described first copper foil layer 12a is provided with described first pad 121, described 4th copper foil layer 12d is provided with described second pad 122, thus described first pad 121 can be convenient to be connected with described flexible PCB 20, described second pad 20 is connected with electronic devices and components.Be understandable that, in other embodiments, also described second pad 122 can be set on described first copper foil layer 12a, described 4th copper foil layer 12d arranges described first pad 121, described first pad 121 can in order to connect electronic devices and components or to be connected with flexible PCB 20, and described second pad 122 also can connect flexible PCB 20 or connect electronic devices and components.
Further, in order to ensure described first pad 121 and the adhesive ability of the second pad 122 respectively on described first copper foil layer 12a and the 4th copper foil layer 12d, prevent described first pad 121 and the second pad 122 from coming off, described first pad 121 and the second pad 122 are plated on described first copper foil layer 12a and the 4th copper foil layer 12d respectively.Be understandable that, in other embodiments, described first pad 121 and the second pad 122 also can be welded on described first copper foil layer 12a and the 4th copper foil layer 12d, as adopted soldering etc.
Several first pads 121 described are evenly distributed along the bearing of trend of described first copper foil layer 12a, and several second pads 122 described are evenly distributed along the bearing of trend of described 4th copper foil layer 12d.In the present embodiment, described on described first copper foil layer 12a, the arrangement position of several the first pads 121 is consistent with the arrangement position of several the second pads 122 on described 4th copper foil layer 12d, namely, on described first copper foil layer 12a and the 4th copper foil layer 12d, described first pad 121 is arranged with described second pad 122 relative symmetry.Be understandable that, in other embodiments, described first pad 121 also can be asymmetric setting with described second pad 122.
In order to improve further, described first copper foil layer 12a is provided with solder mask 123, several first pads 121 described are arranged on described solder mask 123.By described first pad 121 is welded on described solder mask 123, the welding characteristic of described solder mask 123 can be utilized, described first pad 121 is made to be welded on described solder mask 123 firmly, thus make described first pad 121 follow-up when the 3rd pad 21 pressing with described flexible PCB 20, can not come off from described solder mask 123 easily.
In the present embodiment, described dielectric layer 13 is three layers, is located in successively respectively between every two-layer described copper foil layer 12.Particularly, described dielectric layer 13 is respectively first medium layer 13a, second dielectric layer 13b and the 3rd dielectric layer 13c.Described first medium layer 13a is located between described first copper foil layer 12a and described second copper foil layer 12b, described second dielectric layer 13b is located between described second copper foil layer 12b and described 3rd copper foil layer 12c, and described 3rd dielectric layer 13c is located between described 3rd copper foil layer 12c and the 4th copper foil layer 12d.And preferably, in order to ensure between adjacent two-layer described copper foil layer 12 can mutual conduction, described three layers of dielectric layer 13 are provided with several vias 131, several vias 131 described are respectively in order to two-layer described copper foil layer 12 that conducting is often adjacent, thus when needing to carry out cabling connection on adjacent two-layer copper foil layer 12, carry out cabling extraction or connection by described via 131.Be understandable that, in other embodiments, the number of plies of described dielectric layer 13 also can adjust according to the actual design situation of described printed circuit board (PCB) 10, if between every two-layer copper foil layer 12 dielectric layer 13 described in sandwiched one deck.
In addition, in other embodiments, also via 131 described in several can be set on described first medium layer 13a, and make via 131 described in several directly run through described second dielectric layer 13b and described 3rd dielectric layer 13c, thus without the need to additionally arranging described via 131 between described second dielectric layer 13b and the 3rd dielectric layer 13c, be convenient to processing.Certainly, also directly via 131 described in several can be set on described second dielectric layer 13b or the 3rd dielectric layer 13c, then run through other dielectric layer.
Further, described dielectric layer 13 is insulating barrier, and the material of described dielectric layer 13 is polypropylene.That is, described three layers of dielectric layer 13 are insulating barrier, to prevent from occurring short circuit phenomenon between adjacent two-layer copper foil layer 12.Be understandable that, in other embodiments, described dielectric layer 13 also can adopt epoxy glass cloth laminated board (FR4).
Described flexible PCB 20 comprises the substrate layer 22, the 5th copper foil layer 23 and the cover layer 24 that superpose setting successively, and several the 3rd pads 21 described are located on described 5th copper foil layer 23.In the present embodiment, described flexible PCB 20 can be lamina or doubling plate, selects according to the adjustment of actual design situation.For the ease of the connection of described 3rd pad 21 with described first pad 121, on described cover layer 24, the corresponding position of the 3rd pad 21 described in each is provided with opening (not indicating in figure), each described opening can be square, waveform or circle etc., to be exposed by described 3rd pad 21.
Several the 3rd pads 21 described are connected with several the first pad 121 pressings described respectively.In the present embodiment, several the 3rd pads 21 described are connected by conducting resinl pressing with several first pads 121 respectively, thus realize the connection between described printed circuit board (PCB) 10 and described flexible PCB 20.Adopt the mode that conducting resinl pressing connects, can ensure described first pad 121 and described 3rd pad 21 fixing while, can also solve to connect to adopt between the large density pad that adopts at present and be welded with the problem of faulty soldering that may cause.In addition, adopt the mode that conducting resinl pressing connects, operation is welded comparatively simple relatively, thus can convenient operation and reduce production cost.
Further, corresponding several second pads 122 described of described circuit board coupling assembling 100 are provided with several electronic devices and components 30, together with several electronic devices and components 30 described are mounted on by surface mounting technology (SMT) with the second pad 122 described in several respectively.By by described electronic devices and components 30SMT in described second pad 122, thus can to realize on hardboard (namely, described printed circuit board (PCB) 10) carry out connecting up and arranging devices, then utilize the connection between printed circuit board (PCB) 10 and flexible PCB 20, realize the object of the connection between electronic devices and components 30 and flexible PCB 20.Thus instead of existing employing and directly carry out arranging that components and parts need the problem of reinforcement on flexible PCB 20, or on flexible PCB 20 and printed circuit board (PCB) 10, carry out layout components and parts and cause complex procedures, the problem that cost is higher simultaneously.While cost savings the wiring space of flexible PCB 20, also simplify manufacturing procedure, greatly reduce production cost.
Circuit board coupling assembling provided by the invention comprises at least two-layer copper foil layer by arranging printed circuit board (PCB) and is located at least one deck dielectric layer between at least two-layer copper foil layer, then some first pads and the second pad are set respectively at least two-layer copper foil layer, this first pad or the second pad can in order to connect electronic devices and components, thus realize carrying out arranging devices on a printed circuit.Then corresponding on flexible PCB several the 3rd pads are set, and the 3rd pad can be connected with the first pad or the second pad, thus realize printed circuit board (PCB) and flexible PCB to couple together.In addition, because printed circuit board (PCB) is at least two-ply, therefore, it is possible to carry out large density wiring and arranging devices, therefore, without the need to arranging devices on flexible PCB, cost savings the space of flexible PCB, simultaneously, also because flexible PCB is connected with printed circuit board (PCB), so flexible PCB is without the need to additionally arranging reinforcement, so can production cost be reduced.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a circuit board coupling assembling, it is characterized in that, described circuit board coupling assembling comprises printed circuit board (PCB) and flexible PCB, described printed circuit board (PCB) comprises at least two-layer copper foil layer and at least one deck dielectric layer, dielectric layer described in one deck is all clamped between often two-layer in described at least two-layer copper foil layer, two copper foil layers outside being positioned in described at least two-layer copper foil layer are respectively arranged with several first pads and several the second pads, and several first pads described are arranged in order along the bearing of trend of the copper foil layer at its place, several second pads described are arranged in order along the bearing of trend of the copper foil layer at its place, several first pads described or the second pad are in order to connect electronic devices and components, on described flexible PCB, corresponding several first pads described or the second pad are provided with several the 3rd pads, several the 3rd pads described are connected with several first pads described or the second pad.
2. circuit board coupling assembling as claimed in claim 1, it is characterized in that, described copper foil layer is four layers, be respectively the first copper foil layer superposing setting successively, second copper foil layer, 3rd copper foil layer and the 4th copper foil layer, described dielectric layer is three layers, be located between every two-layer described copper foil layer respectively successively, and described first copper foil layer is provided with several first pads described, described 4th copper foil layer is provided with several second pads described, several first pads described are in order to be connected with several the 3rd pads described, several second pads described are in order to be connected with electronic devices and components.
3. circuit board coupling assembling as claimed in claim 2, is characterized in that, three layers of described dielectric layer are provided with several vias, and several vias described are respectively in order to two-layer described copper foil layer that conducting is often adjacent.
4. circuit board coupling assembling as claimed in claim 1 or 2, it is characterized in that, corresponding several second pads described of described circuit board coupling assembling are provided with several electronic devices and components, together with several electronic devices and components described are mounted on by surface mounting technology with several second pads respectively.
5. as the circuit board coupling assembling that claim 2 is stated, it is characterized in that, several first pads described and the second pad are plated on described first copper foil layer and described 4th copper foil layer respectively.
6. circuit board coupling assembling as claimed in claim 2, it is characterized in that, described first copper foil layer is also provided with solder mask, several first pads described are arranged on described solder mask.
7. circuit board coupling assembling as claimed in claim 1, it is characterized in that, described at least one deck dielectric layer is insulating barrier, and the material of described at least one deck dielectric layer is polypropylene.
8. circuit board coupling assembling as claimed in claim 1, it is characterized in that, several first pads described and several the 3rd pads connect respectively by conducting resinl pressing.
9. circuit board coupling assembling as claimed in claim 1, it is characterized in that, described flexible circuit board comprises the substrate layer, the 5th copper foil layer and the cover layer that superpose setting successively, and several the 3rd pads described are located on described 5th copper foil layer.
10. a mobile terminal, is characterized in that, described mobile terminal comprises body and the circuit board coupling assembling as described in claim 1 to 9 any one, and described body is provided with host cavity, and described circuit board coupling assembling is placed in described host cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026227.4A CN105578749B (en) | 2015-12-29 | 2015-12-29 | Circuit board connection component and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026227.4A CN105578749B (en) | 2015-12-29 | 2015-12-29 | Circuit board connection component and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578749A true CN105578749A (en) | 2016-05-11 |
| CN105578749B CN105578749B (en) | 2018-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511026227.4A Active CN105578749B (en) | 2015-12-29 | 2015-12-29 | Circuit board connection component and mobile terminal |
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| Country | Link |
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| CN (1) | CN105578749B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106295518A (en) * | 2016-07-28 | 2017-01-04 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and mobile terminal |
| CN106973499A (en) * | 2017-05-26 | 2017-07-21 | 上海中航光电子有限公司 | A kind of module and its manufacture method including printed circuit board (PCB) and flexible PCB |
| WO2021189491A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114698231A (en) * | 2022-03-18 | 2022-07-01 | 武汉华星光电半导体显示技术有限公司 | Circuit board and display module |
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| US4997377A (en) * | 1990-02-22 | 1991-03-05 | Amp Incorporated | Adaptor for computers |
| CN102933025A (en) * | 2012-11-13 | 2013-02-13 | 加弘科技咨询(上海)有限公司 | Printed circuit board and coupling subassembly of printed circuit board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4997377A (en) * | 1990-02-22 | 1991-03-05 | Amp Incorporated | Adaptor for computers |
| CN102933025A (en) * | 2012-11-13 | 2013-02-13 | 加弘科技咨询(上海)有限公司 | Printed circuit board and coupling subassembly of printed circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106295518A (en) * | 2016-07-28 | 2017-01-04 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and mobile terminal |
| CN106973499A (en) * | 2017-05-26 | 2017-07-21 | 上海中航光电子有限公司 | A kind of module and its manufacture method including printed circuit board (PCB) and flexible PCB |
| WO2021189491A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Display module and display device |
| US11980069B2 (en) | 2020-03-27 | 2024-05-07 | Boe Technology Group Co., Ltd. | Display and display device |
| CN114698231A (en) * | 2022-03-18 | 2022-07-01 | 武汉华星光电半导体显示技术有限公司 | Circuit board and display module |
| CN114698231B (en) * | 2022-03-18 | 2024-01-23 | 武汉华星光电半导体显示技术有限公司 | Circuit board and display module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578749B (en) | 2018-07-06 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee before: Guangdong OPPO Mobile Communications Co., Ltd. |
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