CN115181510A - Dicing tape for wafer and preparation method and application thereof - Google Patents

Dicing tape for wafer and preparation method and application thereof Download PDF

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Publication number
CN115181510A
CN115181510A CN202210975580.0A CN202210975580A CN115181510A CN 115181510 A CN115181510 A CN 115181510A CN 202210975580 A CN202210975580 A CN 202210975580A CN 115181510 A CN115181510 A CN 115181510A
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monomer
curing agent
photoinitiator
acrylate
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CN115181510B (en
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李丹丹
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Qianhui Semiconductor Technology Suzhou Co ltd
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Qianhui Semiconductor Technology Suzhou Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24—Homopolymers or copolymers of amides or imides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention provides a cutting adhesive tape for a wafer and a preparation method and application thereof, and relates to the technical field of cutting adhesive tapes for wafers, wherein the cutting adhesive tape comprises a base material layer and an adhesive layer; the first monomer in the raw materials for preparing the adhesive layer comprises at least one of isooctyl acrylate, butyl acrylate and butyl methacrylate, the second monomer comprises at least one of methyl acrylate and methyl methacrylate, the third monomer comprises at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, and the fourth monomer comprises at least one of N-methylolacrylamide, lauryl acrylate and lauryl methacrylate. The cutting adhesive tape for the wafer can be used as a UV (ultraviolet) adhesive reduction adhesive tape or a non-UV adhesive tape, can relieve the problems of material flying, water seepage, edge breakage, adhesive residue and the like in wafer scribing, and can meet the requirement that no adhesive tape residue exists in the cutting process of other semiconductors such as QFN (quad flat no-lead) and the like.

Description

Dicing tape for wafer and preparation method and application thereof
Technical Field
The invention relates to the technical field of dicing tapes for wafers, in particular to a dicing tape for a wafer and a preparation method and application thereof.
Background
With the rapid development of semiconductor technology, the sizes of chips and wafers are smaller and smaller, and various conditions such as material flying, water seepage, edge breakage, adhesive residue and the like are easily caused in the cutting process of small sizes, so that the original UV and non-UV protective films on the market can no longer meet the cutting requirements.
Therefore, the dicing adhesive tape with good water resistance, adhesive residue resistance and adhesive layer flexibility can be obtained, however, the existing dicing adhesive tape basically mainly uses single non-UV and UV, the base material is also mostly PO, PET, PVC and other materials, and the non-UV and UV anti-adhesion two-in-one high-performance adhesive tape specially aiming at semiconductor wafer dicing is very rare.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
An object of the present invention is to provide a dicing tape for a wafer, which can alleviate the problems of material flying, water seepage, edge chipping, and adhesive residue, etc. that are likely to occur during small-sized dicing of the wafer.
The second objective of the present invention is to provide a method for preparing a dicing tape for a wafer, which has a simple process and high efficiency.
The third objective of the present invention is to provide an application of the dicing tape for wafer.
In order to achieve the above purpose of the present invention, the following technical solutions are adopted:
in a first aspect, a dicing tape for a wafer comprises a substrate layer and an adhesive layer;
the adhesive layer is mainly prepared from a first monomer, a second monomer, a third monomer, a fourth monomer and a cross-linking agent;
the first monomer comprises at least one of isooctyl acrylate, butyl acrylate and butyl methacrylate;
the second monomer comprises at least one of methyl acrylate and methyl methacrylate;
the third monomer comprises at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate;
the fourth monomer includes at least one of N-methylolacrylamide, lauryl acrylate, and lauryl methacrylate.
Further, the cross-linking agent comprises at least one of an epoxy resin curing agent and an isocyanate curing agent, preferably an epoxy resin curing agent;
preferably, the epoxy resin curing agent comprises at least one of AG-602 epoxy curing agent, T31A epoxy curing agent and ZY-S024 polyamide epoxy curing agent, and preferably AG-602 epoxy curing agent;
preferably, the isocyanate-based curing agent includes at least one of a diisocyanate curing agent, an HDI curing agent, and an HDI trimer curing agent.
Further, the raw materials for preparing the adhesive layer also comprise a photoinitiator;
preferably, the photoinitiator comprises at least one of photoinitiator 1173, photoinitiator 184, photoinitiator 754, photoinitiator MBF, photoinitiator 819, photoinitiator 651, and photoinitiator TPO;
preferably, the adhesive layer is prepared from raw materials which also comprise multifunctional resin;
preferably, the multifunctional resin comprises at least one of a tetrafunctional polymer compound and a hydroxyl group-containing hexafunctional resin, preferably a hydroxyl group-containing hexafunctional resin.
Further, the adhesive layer is mainly prepared from the following components in parts by weight:
40-160 parts of a first monomer, 5-20 parts of a second monomer, 2-10 parts of a third monomer, 1-10 parts of a fourth monomer and 0.3-2 parts of a cross-linking agent;
preferably, the adhesive layer is mainly prepared from the following components in parts by weight:
120 parts of a first monomer, 5 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer and 1 part of a cross-linking agent;
wherein the cross-linking agent is AG-602 epoxy curing agent.
Further, the adhesive layer is mainly prepared from the following components in parts by weight:
40-160 parts of a first monomer, 5-20 parts of a second monomer, 2-10 parts of a third monomer, 1-10 parts of a fourth monomer, 0.3-2 parts of a cross-linking agent, 1-3 parts of a photoinitiator and 1-40 parts of a multifunctional resin;
preferably, the adhesive layer is mainly prepared from the following components in parts by weight:
115 parts of a first monomer, 10 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer, 1 part of a cross-linking agent, 3 parts of a photoinitiator and 10 parts of a multifunctional resin;
the cross-linking agent is AG-602 epoxy curing agent, and the multifunctional resin is hydroxyl-containing six-functional-group resin.
Further, the first monomer comprises the following components in parts by mass:
20-80 parts of isooctyl acrylate and 20-80 parts of butyl acrylate and/or butyl methacrylate;
preferably, the fourth monomer comprises the following components in parts by mass:
1-5 parts of N-hydroxymethyl acrylamide and 1-5 parts of lauryl acrylate and/or lauryl methacrylate.
Further, the substrate layer comprises at least one of a PET film, a PO film and a PVC film;
preferably, the thickness of the PET film is 25-50 μm, and the PET film is preferably a PET release film;
preferably, the PO membrane has a thickness of 70 to 150 μm.
In a second aspect, a method for preparing the dicing tape for wafers according to any one of the above aspects includes the following steps:
and mixing and reacting the raw materials of the adhesive layer to obtain glue, coating the glue on the substrate layer, and drying to obtain the cutting adhesive tape for the wafer.
Further, the solid content of the glue is 20-25%;
preferably, the solvent of the mixed reaction includes at least one of ethyl acetate, toluene, xylene, and acetone;
preferably, the coating means comprises knife coating.
In a third aspect, a dicing tape for a wafer according to any one of the above is applied to glass, PET, QFN, LED, BGA, and aluminum foil.
Compared with the prior art, the invention at least has the following beneficial effects:
the cutting adhesive tape for the wafer comprises a base material layer and an adhesive layer; the adhesive layer is mainly prepared from a first monomer, a second monomer, a third monomer, a fourth monomer and a cross-linking agent; the first monomer comprises at least one of isooctyl acrylate, butyl acrylate and butyl methacrylate, and the first monomer is used for improving the flexibility of the adhesive layer and promoting film formation; the second monomer comprises at least one of methyl acrylate and methyl methacrylate, and the function of the second monomer is to improve the hardness of the adhesive layer; the third monomer comprises at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, and has the function of introducing functional groups to improve the adhesive force of the adhesive layer; the fourth monomer comprises at least one of N-methylol acrylamide, lauryl acrylate and lauryl methacrylate, and the fourth monomer has the functions of improving the water resistance of the glue layer and reducing flying materials. The first monomer, the second monomer, the third monomer and the fourth monomer can obtain a synergistic matching effect through respective characteristics, the adhesive layer with a specific effect is formed under the action of the cross-linking agent, and the adhesive layer and the substrate layer form the cutting adhesive tape for the wafer, so that the problems of material flying, water seepage, edge breakage, adhesive residue and the like in wafer scribing can be relieved, and the requirement that no adhesive tape residue exists in the cutting process of other semiconductors such as QFN and the like can be met.
The preparation method of the dicing tape for the wafer, provided by the invention, has the advantages of simple process and high efficiency.
The dicing tape for the wafer provided by the invention has an outstanding application effect.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
According to a first aspect of the present invention, there is provided a dicing tape for a wafer, comprising a substrate layer and an adhesive layer;
the adhesive layer is mainly prepared from a first monomer, a second monomer, a third monomer, a fourth monomer and a cross-linking agent;
in the present invention, the first monomer includes, but is not limited to, at least one of isooctyl acrylate, butyl acrylate, and butyl methacrylate, the second monomer includes, but is not limited to, at least one of methyl acrylate and methyl methacrylate, the third monomer includes, but is not limited to, at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, and hydroxypropyl methacrylate, and the fourth monomer includes, but is not limited to, at least one of N-methylolacrylamide, lauryl acrylate, and lauryl methacrylate.
The first monomer, the second monomer, the third monomer and the fourth monomer can obtain a synergistic effect through respective characteristics, the adhesive layer with a specific effect is formed under the action of the cross-linking agent, and the adhesive layer and the substrate layer form the cutting adhesive tape for the wafer, so that the problems of material flying, water seepage, edge breakage, adhesive residue and the like in wafer scribing can be solved, and the requirement that no adhesive tape residue exists in the cutting process of other semiconductors such as QFN (quad flat no-lead) and the like can be met.
In the invention, the cross-linking agent includes but is not limited to at least one of epoxy resin curing agent and isocyanate curing agent, and the epoxy resin curing agent can be further optimized, which is more favorable for improving the curing effect of the monomer and ensuring the comprehensive performance of the wafer cutting adhesive tape.
In a preferred embodiment, the epoxy resin curing agent of the present invention includes, but is not limited to, at least one of AG-602 epoxy curing agent, T31A epoxy curing agent, and ZY-S024 polyamide epoxy curing agent, and AG-602 epoxy curing agent may be more preferred, which is more advantageous for further improving the curing effect of the monomer and improving the performance after curing.
In a preferred embodiment, the isocyanate-based curing agent of the present invention includes, but is not limited to, at least one of a diisocyanate curing agent, an HDI curing agent, and an HDI trimer curing agent.
In a preferred embodiment, the adhesive layer of the present invention further comprises a photoinitiator as a raw material.
The specific type or substance of the photoinitiator in the present invention is not particularly limited, and any photoinitiator having a corresponding effect may be used as is commonly used in the art, and may be one or a mixture of two or more of, for example, photoinitiator 1173, photoinitiator 184, photoinitiator 754, photoinitiator MBF, photoinitiator 819, photoinitiator 651, and photoinitiator TPO, but is not limited thereto.
In a preferred embodiment, the raw materials for preparing the adhesive layer of the present invention further include a multifunctional resin, wherein the multifunctional resin includes, but is not limited to, at least one of a tetrafunctional polymer and a hydroxyl-containing hexafunctional resin, preferably a hydroxyl-containing hexafunctional resin.
In the invention, the dosage of the cross-linking agent and the polyfunctional resin can be matched according to the requirement of actual performance, and the expected new effect can be achieved.
In a preferred embodiment, the adhesive layer of the present invention is mainly prepared from the following components in parts by mass:
40-160 parts of first monomer, 5-20 parts of second monomer, 2-10 parts of third monomer, 1-10 parts of fourth monomer and 0.3-2 parts of cross-linking agent.
In the present invention, typical but not limiting parts by mass of the first monomer are, for example, 40 parts, 60 parts, 80 parts, 100 parts, 120 parts, 140 parts, 160 parts; typical but non-limiting parts by mass of the second monomer are, for example, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts; typical but non-limiting parts by mass of the third monomer are for example 2 parts, 4 parts, 6 parts, 8 parts, 10 parts; typical but non-limiting parts by mass of the fourth monomer are, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts; typical but non-limiting parts by mass of the crosslinking agent are, for example, 0.3 part, 0.5 part, 0.8 part, 1 part, 1.2 parts, 1.4 parts, 1.6 parts, 1.8 parts, 2 parts.
In a preferred embodiment, the adhesive layer of the invention is mainly prepared from the following components in parts by weight:
120 parts of a first monomer, 5 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer and 1 part of a cross-linking agent;
wherein the cross-linking agent is AG-602 epoxy curing agent.
The optimal raw material mass ratio is optimal after curing, and the cutting adhesive tape for the wafer can achieve the technical effects of no adhesive residue, good water resistance, no material flying and no edge breakage when being applied.
In a preferred embodiment, the adhesive layer of the invention is mainly prepared from the following components in parts by mass:
40-160 parts of first monomer, 5-20 parts of second monomer, 2-10 parts of third monomer, 1-10 parts of fourth monomer, 0.3-2 parts of cross-linking agent, 1-3 parts of photoinitiator and 1-40 parts of polyfunctional resin.
Wherein, typical but non-limiting mass parts of the photoinitiator are 1 part, 2 parts and 3 parts; typical but not limiting parts by mass of the multifunctional resin are, for example, 1 part, 5 parts, 10 parts, 15 parts, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts.
In a preferred embodiment, the adhesive layer of the invention is mainly prepared from the following components in parts by weight:
115 parts of a first monomer, 10 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer, 1 part of a cross-linking agent, 3 parts of a photoinitiator and 10 parts of a multifunctional resin;
wherein the cross-linking agent is AG-602 epoxy curing agent, and the multi-functional group resin is six-functional group resin containing hydroxyl.
The optimized raw material mass ratio has the best effect after curing, and the cutting adhesive tape for the wafer can achieve the technical effects of no adhesive residue, good water resistance, no material flying and no edge breakage when being applied; meanwhile, the space for adjusting the peeling force before and after UV is large, so that the UV peeling machine is convenient to use in the process and at the end of the process.
In a preferred embodiment, the first monomer of the present invention comprises the following components in parts by mass:
20-80 parts of isooctyl acrylate and 20-80 parts of butyl acrylate and/or butyl methacrylate.
Typical but not limiting mass ratios of the isooctyl acrylate are, for example, 20 parts, 40 parts, 60 parts, 80 parts; typical but not limiting mass ratios of butyl acrylate and/or butyl methacrylate are, for example, 20 parts, 40 parts, 60 parts, 80 parts.
The mass ratio of the selected components in the first monomer is beneficial to improving the performance of the cutting adhesive tape for the wafer.
In a preferred embodiment, the fourth monomer of the present invention comprises the following components in parts by mass:
1-5 parts of N-hydroxymethyl acrylamide and 1-5 parts of lauryl acrylate and/or lauryl methacrylate;
wherein the typical but non-limiting mass ratio of N-methylolacrylamide is, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts; typical but not limiting mass ratios of lauryl acrylate and/or lauryl methacrylate are for example 1 part, 2 parts, 3 parts, 4 parts, 5 parts.
The mass ratio of the selected components in the fourth monomer is favorable for improving the performance of the dicing tape for the wafer.
In a preferred embodiment, the substrate layer of the present invention includes, but is not limited to, at least one of a PET film, a PO film, and a PVC film; among them, the PET film may be preferably a PET release film, and the thickness thereof may be 25 to 50 μm, for example, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, but is not limited thereto; the thickness of the PO film may be 70 to 150. Mu.m, such as 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, but is not limited thereto.
The type and the thickness of the substrate layer selected by the invention are beneficial to combination with the adhesive layer, so that the comprehensive performance of the cutting adhesive tape for the wafer is ensured.
According to a second aspect of the present invention, there is provided a method for preparing a dicing tape for a wafer, comprising the steps of:
and mixing and reacting the raw materials of the adhesive layer to obtain glue, coating the glue on the substrate layer, and drying to obtain the cutting adhesive tape for the wafer.
The preparation method of the dicing tape for the wafer, provided by the invention, has the advantages of simple process and high efficiency.
In a preferred embodiment, the glue of the present invention has a solid content of 20-25%, for example, 20%, 21%, 22%, 23%, 24%, 25%, but not limited thereto, which is beneficial for obtaining a dicing tape for wafer after coating on a substrate layer and drying, and ensuring the overall performance thereof.
In a preferred embodiment, the coating mode of the invention includes, but is not limited to, knife coating, which is beneficial to the formation of an adhesive layer and forms a dicing tape for wafer together with a substrate layer.
A typical preparation method of a dicing tape for a wafer comprises the following steps:
mixing the raw materials of the adhesive layer with solvents ETAC and toluene to prepare glue with solid content of 20-25%, wherein ETAC or toluene can be dissolved in other raw materials respectively and then mixed and dissolved together, standing for half an hour (defoaming) after complete dissolution and uniform stirring to obtain glue, coating the glue on a substrate layer, and drying to obtain the wafer cutting tape;
the coating method is scraper coating, specifically, coating glue on a PET release film with a thickness of 38 μm, drying in an oven, and respectively adhering a PO substrate film corona surface with a thickness of 150 μm to the release film for rolling and curing.
The preparation method of the dicing tape for the wafer, provided by the invention, has the advantages of simple process and high efficiency.
According to a third aspect of the present invention, there is provided a dicing tape for a wafer according to any one of the above, wherein the dicing tape is used for glass, PET, QFN, LED, BGA, and aluminum foil.
The object to be bonded with the dicing tape for wafer of the present invention can be used for glass, PET, QFN, LED, BGA, aluminum foil, and the like, in addition to the wafer.
The dicing tape for the wafer provided by the invention has an outstanding application effect.
The invention is further illustrated by the following examples. The materials in the examples are prepared according to known methods or are directly commercially available, unless otherwise specified.
Examples 1 to 9
Embodiments 1 to 9 provide a dicing tape for a wafer, including a substrate layer and an adhesive layer, where the raw materials and the parts by mass of the adhesive layer are shown in table 1, and the performance results are shown in table 1.
Wherein the first monomer is isooctyl acrylate and butyl (methyl) acrylate, and the mass ratio of the isooctyl acrylate to the butyl (methyl) acrylate is 4:6; the second monomer is methyl (meth) acrylate; the third monomer is (methyl) acrylic acid hydroxyl (propyl) ethyl ester; the fourth monomer is N-hydroxymethyl acrylamide and lauryl (meth) acrylate, and the mass ratio of the N-hydroxymethyl acrylamide to the lauryl (meth) acrylate is 1:1;
the photoinitiator is composed of photoinitiator 184 and photoinitiator TPO, and the mass ratio of the photoinitiator to the photoinitiator TPO is 5:1.
wherein, the test before UV is carried out according to GB/T2792 '180-degree peeling strength test method of pressure-sensitive adhesive tapes';
the post-UV test is carried out according to GB/T2792 test method for 180-degree peel strength of the pressure-sensitive adhesive tape;
the water resistance is tested according to GB/T2792 'test method for 180-degree peel strength of pressure-sensitive adhesive tape', and the peel force test before and after the water resistance test is compared;
the condition of flying materials is observed by naked eyes;
the condition of edge breakage is observed by a magnifying glass;
the residual glue test was a pass of the hundred grid knife and the double stick test.
TABLE 1
Figure BDA0003798190250000101
Figure BDA0003798190250000111
Example 10
Embodiment 10 is a method of preparing the dicing tape for wafers of embodiments 1 to 9, comprising the steps of:
mixing the raw materials of the adhesive layer with solvents ETAC and toluene to prepare glue with solid content of 20-25%, wherein ETAC or toluene can be dissolved in other raw materials respectively and then mixed and dissolved together, standing for half an hour (defoaming) after complete dissolution and uniform stirring to obtain glue, coating the glue on a substrate layer, and drying to obtain the wafer cutting tape;
wherein, the coating mode is doctor blade coating.
Examples 11 to 13
Embodiments 11 to 13 provide a dicing tape for a wafer, including a substrate layer and an adhesive layer, where the raw materials and the parts by mass of the adhesive layer are shown in table 2, the performance results are shown in table 2, and the rest are the same as those in embodiment 1.
TABLE 2
Figure BDA0003798190250000112
Figure BDA0003798190250000121
Examples 14 to 16
Embodiments 14 to 16 provide a dicing tape for a wafer, including a substrate layer and an adhesive layer, in which the raw materials and the parts by mass of the adhesive layer are shown in table 3, the performance results are shown in table 3, and the rest are the same as those in embodiment 1.
TABLE 3
Figure BDA0003798190250000122
Comparative examples 1 to 2
Comparative examples 1 to 2 provide a dicing tape for a wafer, which includes a base material layer and an adhesive layer, wherein the raw materials and the parts by mass of the adhesive layer are shown in tables 1 and 2, the performance results are shown in tables 1 and 2, and the rest are the same as those in example 1.
Comparative example 3
The difference between the comparative example and the example 2 is that the adhesive layer of the comparative example does not contain the second monomer, the fourth monomer with the same amount is used for filling, and the rest is the same as the example 2, so that the dicing tape for the wafer is obtained, and the defect is that the problem of adhesive residue is easy to occur.
And (3) analysis:
as can be seen from table 1, the dicing tapes for wafers provided in examples 2 (non-UV glue + PVC substrate) and 7 (UV glue + PO substrate) according to the present invention have the best raw material formulation, and can achieve the technical effects of no residual glue, good water resistance, no flash, and no edge chipping.
In table 2, as can be seen from comparison between the properties of the dicing tapes for wafers of comparative example 2 and example 11, the fourth monomer added in the present invention can improve the properties of the tapes; meanwhile, as can be seen from the comparison of the performances of the tapes of example 11 and example 12, the effect of using the trimeric HDI curing agent is superior to that of the HDI curing agent.
As can be seen from tables 2 and 3, the performance of using the epoxy resin as the curing agent is superior to that of isocyanate, and the curing effect of the AG-602 epoxy curing agent is the best.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A dicing tape for a wafer is characterized by comprising a substrate layer and an adhesive layer;
the adhesive layer is mainly prepared from a first monomer, a second monomer, a third monomer, a fourth monomer and a cross-linking agent;
the first monomer comprises at least one of isooctyl acrylate, butyl acrylate and butyl methacrylate;
the second monomer comprises at least one of methyl acrylate and methyl methacrylate;
the third monomer comprises at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate;
the fourth monomer includes at least one of N-methylolacrylamide, lauryl acrylate, and lauryl methacrylate.
2. The dicing tape for wafers according to claim 1, wherein the crosslinking agent comprises at least one of an epoxy-based curing agent and an isocyanate-based curing agent, preferably an epoxy-based curing agent;
preferably, the epoxy resin curing agent comprises at least one of AG-602 epoxy curing agent, T31A epoxy curing agent and ZY-S024 polyamide epoxy curing agent, and preferably AG-602 epoxy curing agent;
preferably, the isocyanate-based curing agent includes at least one of a diisocyanate curing agent, an HDI curing agent, and an HDI trimer curing agent.
3. The dicing tape for wafers according to claim 1, wherein the raw material for preparing the adhesive layer further comprises a photoinitiator;
preferably, the photoinitiator comprises at least one of photoinitiator 1173, photoinitiator 184, photoinitiator 754, photoinitiator MBF, photoinitiator 819, photoinitiator 651, and photoinitiator TPO;
preferably, the adhesive layer is prepared from raw materials which also comprise multifunctional resin;
preferably, the multifunctional resin comprises at least one of a tetrafunctional polymer compound and a hydroxyl group-containing hexafunctional resin, preferably a hydroxyl group-containing hexafunctional resin.
4. The dicing tape for wafers according to any one of claims 1 to 3, wherein the adhesive layer is mainly prepared from the following components in parts by mass:
40-160 parts of a first monomer, 5-20 parts of a second monomer, 2-10 parts of a third monomer, 1-10 parts of a fourth monomer and 0.3-2 parts of a cross-linking agent;
preferably, the adhesive layer is mainly prepared from the following components in parts by weight:
120 parts of a first monomer, 5 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer and 1 part of a cross-linking agent;
wherein the cross-linking agent is AG-602 epoxy curing agent.
5. The dicing tape for wafers according to any one of claims 1 to 3, wherein the adhesive layer is mainly prepared from the following components in parts by mass:
40-160 parts of first monomer, 5-20 parts of second monomer, 2-10 parts of third monomer, 1-10 parts of fourth monomer, 0.3-2 parts of cross-linking agent, 1-3 parts of photoinitiator and 1-40 parts of polyfunctional resin;
preferably, the adhesive layer is mainly prepared from the following components in parts by weight:
115 parts of a first monomer, 10 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer, 1 part of a cross-linking agent, 3 parts of a photoinitiator and 10 parts of a multifunctional resin;
the cross-linking agent is AG-602 epoxy curing agent, and the multifunctional resin is hydroxyl-containing six-functional-group resin.
6. The dicing tape for wafers according to any one of claims 1 to 3, wherein the first monomer comprises the following components in parts by mass:
20-80 parts of isooctyl acrylate and 20-80 parts of butyl acrylate and/or butyl methacrylate;
preferably, the fourth monomer comprises the following components in parts by mass:
1-5 parts of N-hydroxymethyl acrylamide and 1-5 parts of lauryl acrylate and/or lauryl methacrylate.
7. The dicing tape for wafers according to any one of claims 1 to 3, wherein the base material layer comprises at least one of a PET film, a PO film and a PVC film;
preferably, the thickness of the PET film is 25-50 μm, and the PET film is preferably a PET release film;
preferably, the PO membrane has a thickness of 70 to 150 μm.
8. A method for preparing a dicing tape for wafers according to any one of claims 1 to 7, characterized by comprising the steps of:
and mixing and reacting the raw materials of the adhesive layer to obtain glue, coating the glue on the substrate layer, and drying to obtain the cutting adhesive tape for the wafer.
9. The preparation method of claim 8, wherein the glue has a solid content of 20-25%;
preferably, the solvent of the mixed reaction includes at least one of ethyl acetate, toluene, xylene, and acetone;
preferably, the coating means comprises knife coating.
10. Use of the dicing tape for wafer according to any one of claims 1 to 7 for glass, PET, QFN, LED, BGA, and aluminum foil.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090121254A (en) * 2008-05-20 2009-11-25 주식회사 엘지화학 Pressure-sensitive adhesive film, dicing die bonding film and semiconductor wafer
JP2013152963A (en) * 2012-01-24 2013-08-08 Sumitomo Bakelite Co Ltd Adhesive tape for processing semiconductor wafer
JP5460809B1 (en) * 2012-10-17 2014-04-02 古河電気工業株式会社 Adhesive tape for semiconductor processing
CN114196354A (en) * 2021-12-20 2022-03-18 苏州赛伍应用技术股份有限公司 Carboxyl-containing viscose reducing composition and preparation method and application thereof
CN114517068A (en) * 2020-11-19 2022-05-20 宁波激智科技股份有限公司 Adhesive composition and UV (ultraviolet) viscosity-reducing cutting adhesive tape

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090121254A (en) * 2008-05-20 2009-11-25 주식회사 엘지화학 Pressure-sensitive adhesive film, dicing die bonding film and semiconductor wafer
JP2013152963A (en) * 2012-01-24 2013-08-08 Sumitomo Bakelite Co Ltd Adhesive tape for processing semiconductor wafer
JP5460809B1 (en) * 2012-10-17 2014-04-02 古河電気工業株式会社 Adhesive tape for semiconductor processing
CN114517068A (en) * 2020-11-19 2022-05-20 宁波激智科技股份有限公司 Adhesive composition and UV (ultraviolet) viscosity-reducing cutting adhesive tape
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