CN115181510B - Dicing tape for wafer and preparation method and application thereof - Google Patents

Dicing tape for wafer and preparation method and application thereof Download PDF

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CN115181510B
CN115181510B CN202210975580.0A CN202210975580A CN115181510B CN 115181510 B CN115181510 B CN 115181510B CN 202210975580 A CN202210975580 A CN 202210975580A CN 115181510 B CN115181510 B CN 115181510B
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parts
monomer
acrylate
dicing tape
wafer
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CN115181510A (en
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李丹丹
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Qianhui Semiconductor Technology Suzhou Co ltd
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Qianhui Semiconductor Technology Suzhou Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24—Homopolymers or copolymers of amides or imides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention provides a dicing tape for a wafer, a preparation method and application thereof, and relates to the technical field of dicing tapes for wafers, wherein the dicing tape comprises a substrate layer and an adhesive layer; wherein the first monomer in the adhesive layer preparation raw material comprises at least one of isooctyl acrylate, butyl acrylate and butyl methacrylate, the second monomer comprises at least one of methyl acrylate and methyl methacrylate, the third monomer comprises at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, and the fourth monomer comprises at least one of N-methylolacrylamide, lauryl acrylate and lauryl methacrylate. The dicing tape for the wafer can be used as a UV (ultraviolet) adhesive reducing tape or a non-UV adhesive tape, can relieve the problems of flying materials, water seepage, edge breakage, adhesive residues and the like in wafer dicing, and can also meet the requirement of no adhesive tape residue of other semiconductors such as QFN and the like in the dicing process.

Description

Dicing tape for wafer and preparation method and application thereof
Technical Field
The invention relates to the technical field of dicing tapes for wafers, in particular to a dicing tape for wafers, and a preparation method and application thereof.
Background
With the rapid development of semiconductor technology, the sizes of chips and wafers are cut more and less, and various conditions such as material flying, water seepage, edge breakage, residual glue and the like are very easy to occur in the cutting process of the small size, so that the original UV and non-UV protective films on the market can not meet the cutting requirements any more.
Therefore, the dicing tape with good water resistance, no adhesive residue and adhesive layer Qu Xingneng is remarkable, however, the current dicing tape is mainly composed of single non-UV and UV, the base materials are mainly composed of PO, PET, PVC and other materials, and the two-in-one high performance adhesive tape with non-UV and UV visbreaking, which is specially used for dicing semiconductor wafers, is very rare.
In view of this, the present invention has been made.
Disclosure of Invention
One of the purposes of the present invention is to provide a dicing tape for wafer, which can alleviate the problems of material flying, water seepage, edge breakage, adhesive residue and the like which are easily caused in the small-size dicing of wafer.
The second purpose of the invention is to provide a preparation method of the dicing tape for wafer, which has simple process and high efficiency.
The invention further provides an application of the dicing tape for wafers.
In order to achieve the above object of the present invention, the following technical solutions are specifically adopted:
in a first aspect, a dicing tape for a wafer includes a base material layer and an adhesive layer;
the adhesive layer is mainly prepared from a first monomer, a second monomer, a third monomer, a fourth monomer and a crosslinking agent;
the first monomer comprises at least one of isooctyl acrylate, butyl acrylate and butyl methacrylate;
the second monomer comprises at least one of methyl acrylate and methyl methacrylate;
the third monomer comprises at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate;
the fourth monomer comprises at least one of N-methylolacrylamide, lauryl acrylate and lauryl methacrylate.
Further, the cross-linking agent comprises at least one of an epoxy resin curing agent and an isocyanate curing agent, preferably an epoxy resin curing agent;
preferably, the epoxy resin curing agent comprises at least one of AG-602 epoxy curing agent, T31A epoxy curing agent and ZY-S024 polyamide epoxy curing agent, preferably AG-602 epoxy curing agent;
preferably, the isocyanate curing agent comprises at least one of a diisocyanate curing agent, an HDI curing agent and an HDI trimer curing agent.
Further, the preparation raw materials of the adhesive layer further comprise a photoinitiator;
preferably, the photoinitiator comprises at least one of photoinitiator 1173, photoinitiator 184, photoinitiator 754, photoinitiator MBF, photoinitiator 819, photoinitiator 651, and photoinitiator TPO;
preferably, the preparation raw materials of the adhesive layer further comprise multifunctional resin;
preferably, the multifunctional resin includes at least one of a tetrafunctional polymer compound and a hydroxy-containing, hexafunctional resin, preferably a hydroxy-containing, hexafunctional resin.
Further, the adhesive layer is mainly prepared from the following components in parts by weight:
40-160 parts of a first monomer, 5-20 parts of a second monomer, 2-10 parts of a third monomer, 1-10 parts of a fourth monomer and 0.3-2 parts of a crosslinking agent;
preferably, the adhesive layer is mainly prepared from the following components in parts by weight:
120 parts of a first monomer, 5 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer and 1 part of a crosslinking agent;
wherein the cross-linking agent is AG-602 epoxy curing agent.
Further, the adhesive layer is mainly prepared from the following components in parts by weight:
40-160 parts of a first monomer, 5-20 parts of a second monomer, 2-10 parts of a third monomer, 1-10 parts of a fourth monomer, 0.3-2 parts of a cross-linking agent, 1-3 parts of a photoinitiator and 1-40 parts of a multifunctional resin;
preferably, the adhesive layer is mainly prepared from the following components in parts by weight:
115 parts of a first monomer, 10 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer, 1 part of a cross-linking agent, 3 parts of a photoinitiator and 10 parts of a multifunctional resin;
wherein the cross-linking agent is AG-602 epoxy curing agent, and the multifunctional resin is hydroxyl-containing six-functional resin.
Further, the first monomer comprises the following components in parts by weight:
20-80 parts of isooctyl acrylate and 20-80 parts of butyl acrylate and/or butyl methacrylate;
preferably, the fourth monomer comprises the following components in parts by mass:
1-5 parts of N-methylolacrylamide, 1-5 parts of lauryl acrylate and/or lauryl methacrylate.
Further, the substrate layer comprises at least one of a PET film, a PO film and a PVC film;
preferably, the thickness of the PET film is 25-50 mu m, and the PET film is preferably a PET release film;
preferably, the PO film has a thickness of 70-150 μm.
In a second aspect, a method for preparing the dicing tape for a wafer according to any one of the above claims, comprising the steps of:
and mixing and reacting the raw materials of the adhesive layer to obtain glue, coating the glue on the substrate layer, and drying to obtain the dicing tape for the wafer.
Further, the solid content of the glue is 20-25%;
preferably, the solvent of the mixing reaction comprises at least one of ethyl acetate, toluene, xylene and acetone;
preferably, the means of coating comprises blade coating.
In a third aspect, a dicing tape for wafers according to any one of the above claims is used for glass, PET, QFN, LED, BGA and aluminum foil.
Compared with the prior art, the invention has at least the following beneficial effects:
the dicing tape for the wafer comprises a substrate layer and an adhesive layer; the adhesive layer is mainly prepared from a first monomer, a second monomer, a third monomer, a fourth monomer and a crosslinking agent; the first monomer comprises at least one of isooctyl acrylate, butyl acrylate and butyl methacrylate, and has the functions of improving the flexibility of the adhesive layer and promoting film formation; the second monomer comprises at least one of methyl acrylate and methyl methacrylate, and has the function of improving the hardness of the adhesive layer; the third monomer comprises at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate and hydroxypropyl methacrylate, and has the function of introducing functional groups to improve the adhesive force of the adhesive layer; the fourth monomer comprises at least one of N-methylol acrylamide, lauryl acrylate and lauryl methacrylate, and has the functions of improving the water resistance of the adhesive layer and reducing flying materials. According to the invention, the first monomer, the second monomer, the third monomer and the fourth monomer can obtain a synergistic effect through the respective characteristics, an adhesive layer with a specific effect is formed through the effect of the cross-linking agent, and the adhesive layer and the substrate layer form the dicing tape for the wafer, so that the problems of flying materials, water seepage, edge breakage, adhesive residues and the like in wafer dicing can be relieved, and the requirement of other semiconductors such as QFN (quad flat no-lead) on no-adhesive tape residue in the dicing process can be met.
The preparation method of the dicing tape for the wafer has simple and efficient process.
The application of the dicing tape for the wafer has outstanding application effect.
Detailed Description
The technical solutions of the present invention will be clearly and completely described in connection with the embodiments, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
According to a first aspect of the present invention, there is provided a dicing tape for a wafer, comprising a base material layer and an adhesive layer;
the adhesive layer is mainly prepared from a first monomer, a second monomer, a third monomer, a fourth monomer and a crosslinking agent;
in the present invention, the first monomer includes, but is not limited to, at least one of isooctyl acrylate, butyl acrylate, and butyl methacrylate, the second monomer includes, but is not limited to, at least one of methyl acrylate and methyl methacrylate, the third monomer includes, but is not limited to, at least one of hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, and hydroxypropyl methacrylate, and the fourth monomer includes, but is not limited to, at least one of N-methylolacrylamide, lauryl acrylate, and lauryl methacrylate.
According to the invention, the first monomer, the second monomer, the third monomer and the fourth monomer can obtain a synergistic effect through the respective characteristics, an adhesive layer with a specific effect is formed through the effect of the cross-linking agent, and the adhesive layer and the substrate layer form the dicing tape for the wafer, so that the problems of flying materials, water seepage, edge breakage, adhesive residues and the like in wafer dicing can be relieved, and the requirement of other semiconductors such as QFN (quad flat no-lead) on no-adhesive tape residue in the dicing process can be met.
In the invention, the cross-linking agent comprises at least one of epoxy resin curing agent and isocyanate curing agent, which can be more preferably epoxy resin curing agent, thereby being more beneficial to improving the curing effect of the monomer and ensuring the comprehensive performance of the dicing tape for the wafer.
In a preferred embodiment, the epoxy resin curing agent of the present invention includes, but is not limited to, at least one of AG-602 epoxy curing agent, T31A epoxy curing agent and ZY-S024 polyamide epoxy curing agent, and may be further preferably AG-602 epoxy curing agent, which is more advantageous for further improving the curing effect of the monomer and improving the performance after curing.
In a preferred embodiment, the isocyanate-based curing agent of the present invention includes, but is not limited to, at least one of a diisocyanate curing agent, an HDI curing agent, and an HDI trimer curing agent.
In a preferred embodiment, the adhesive layer of the present invention is prepared from a starting material further comprising a photoinitiator.
The specific type or substance of the photoinitiator in the present invention is not particularly limited, and any photoinitiator having a corresponding effect commonly known in the art may be used, for example, one or a mixture of two or more of a photoinitiator 1173, a photoinitiator 184, a photoinitiator 754, a photoinitiator MBF, a photoinitiator 819, a photoinitiator 651, and a photoinitiator TPO, but not limited thereto.
In a preferred embodiment, the adhesive layer of the present invention is prepared from a raw material further comprising a multifunctional resin, wherein the multifunctional resin includes at least one of, but not limited to, a tetrafunctional polymer compound and a hydroxyl-containing hexafunctional resin, preferably a hydroxyl-containing hexafunctional resin.
In the invention, the dosage of the cross-linking agent and the multifunctional resin can be proportioned according to the actual performance requirement, and the expected new effect can be achieved.
In a preferred embodiment, the adhesive layer of the invention is mainly prepared from the following components in parts by weight:
40-160 parts of a first monomer, 5-20 parts of a second monomer, 2-10 parts of a third monomer, 1-10 parts of a fourth monomer and 0.3-2 parts of a crosslinking agent.
In the present invention, typical but non-limiting parts by mass of the first monomer are, for example, 40 parts, 60 parts, 80 parts, 100 parts, 120 parts, 140 parts, 160 parts; typical but non-limiting parts by mass of the second monomer are for example 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts; typical but non-limiting parts by mass of the third monomer are for example 2 parts, 4 parts, 6 parts, 8 parts, 10 parts; typical but non-limiting parts by mass of the fourth monomer are for example 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts; typical but non-limiting parts by weight of the cross-linking agent are for example 0.3 parts, 0.5 parts, 0.8 parts, 1 part, 1.2 parts, 1.4 parts, 1.6 parts, 1.8 parts, 2 parts.
In a preferred embodiment, the adhesive layer of the invention is mainly prepared from the following components in parts by weight:
120 parts of a first monomer, 5 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer and 1 part of a crosslinking agent;
wherein the cross-linking agent is AG-602 epoxy curing agent.
The optimized raw material mass ratio in the invention has the best effect after solidification, and can ensure that the cutting adhesive tape for the wafer has the technical effects of no residual adhesive, good water resistance, no material flying and no edge breakage during application.
In a preferred embodiment, the adhesive layer of the invention is mainly prepared from the following components in parts by weight:
40-160 parts of a first monomer, 5-20 parts of a second monomer, 2-10 parts of a third monomer, 1-10 parts of a fourth monomer, 0.3-2 parts of a cross-linking agent, 1-3 parts of a photoinitiator and 1-40 parts of a multifunctional resin.
Wherein the typical but non-limiting parts by weight of the photoinitiator are for example 1 part, 2 parts, 3 parts; typical but non-limiting parts by mass of the multifunctional resin are, for example, 1 part, 5 parts, 10 parts, 15 parts, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts.
In a preferred embodiment, the adhesive layer of the invention is mainly prepared from the following components in parts by weight:
115 parts of a first monomer, 10 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer, 1 part of a cross-linking agent, 3 parts of a photoinitiator and 10 parts of a multifunctional resin;
wherein the cross-linking agent is AG-602 epoxy curing agent, and the multifunctional resin is hydroxyl-containing hexafunctional resin.
The optimized raw material mass ratio in the invention has the best effect after solidification, and can ensure that the cutting adhesive tape for the wafer has the technical effects of no residual adhesive, good water resistance, no material flying and no edge breakage during application; meanwhile, the space with adjustable UV front-back stripping force is large, so that the UV front-back stripping force is convenient to use in the process and at the end of the process.
In a preferred embodiment, the first monomer of the invention comprises the following components in parts by weight:
20-80 parts of isooctyl acrylate and 20-80 parts of butyl acrylate and/or butyl methacrylate.
Wherein the typical but non-limiting mass ratio of iso-octyl acrylate is for example 20 parts, 40 parts, 60 parts, 80 parts; typical but non-limiting mass ratios of butyl acrylate and/or butyl methacrylate are, for example, 20 parts, 40 parts, 60 parts, 80 parts.
The mass ratio of the components selected in the first monomer is favorable for improving the performance of the dicing tape for the wafer.
In a preferred embodiment, the fourth monomer of the present invention comprises the following components in parts by mass:
1-5 parts of N-methylolacrylamide, 1-5 parts of lauryl acrylate and/or lauryl methacrylate;
wherein the typical but non-limiting mass ratio of N-methylolacrylamide is for example 1 part, 2 parts, 3 parts, 4 parts, 5 parts; typical but non-limiting mass ratios of lauryl acrylate and/or lauryl methacrylate are, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts.
The mass ratio of the components selected in the fourth monomer is favorable for improving the performance of the dicing tape for the wafer.
In a preferred embodiment, the substrate layer of the present invention includes, but is not limited to, at least one of a PET film, a PO film, and a PVC film; among them, the PET film may preferably be a PET release film, and the thickness thereof may be 25 to 50 μm, for example, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, but is not limited thereto; the PO film thickness may be 70-150 μm, for example, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, but is not limited thereto.
The type and thickness of the substrate layer selected by the invention are favorable for combination with the adhesive layer, thereby ensuring the comprehensive performance of the dicing tape for the wafer.
According to a second aspect of the present invention, there is provided a method for preparing dicing tape for wafer, comprising the steps of:
and mixing and reacting the raw materials of the adhesive layer to obtain glue, coating the glue on the substrate layer, and drying to obtain the dicing tape for the wafer.
The preparation method of the dicing tape for the wafer has simple and efficient process.
In a preferred embodiment, the solid content of the glue of the present invention is 20-25%, for example, 20%, 21%, 22%, 23%, 24%, 25%, but not limited thereto, which is advantageous for coating on a substrate layer and drying to obtain dicing tape for wafer, and for ensuring its overall performance.
In a preferred embodiment, the coating of the present invention includes, but is not limited to, knife coating, which facilitates the formation of an adhesive layer and forms a dicing tape for a wafer with a substrate layer.
A typical preparation method of a dicing tape for wafers comprises the following steps:
mixing the raw materials of the adhesive layer with solvents ETAC and toluene to prepare glue with 20-25% of solid content, respectively dissolving the ETAC or toluene with other raw materials, mixing and dissolving the ETAC or toluene, standing for half an hour (defoaming) after the ETAC or toluene is completely dissolved and uniformly stirred to obtain glue, coating the glue on a substrate layer, and drying to obtain the dicing tape for the wafer;
the coating mode is doctor blade coating, specifically, the PET release film with the thickness of 38 mu m is coated with glue, and after drying in an oven, the release film is respectively attached to the PO substrate film corona surface with the thickness of 150 mu m for rolling and curing.
The preparation method of the dicing tape for the wafer has simple and efficient process.
According to a third aspect of the present invention there is provided the use of a dicing tape for wafers as defined in any one of the preceding claims on glass, PET, QFN, LED, BGA and aluminium foil.
The adherend of the dicing tape for a wafer of the present invention can be used for an adherend such as glass, PET, QFN, LED, BGA, or aluminum foil, in addition to a wafer.
The application of the dicing tape for the wafer has outstanding application effect.
The invention is further illustrated by the following examples. The materials in the examples were prepared according to the existing methods or were directly commercially available unless otherwise specified.
Examples 1 to 9
Examples 1-9 provide dicing tapes for wafers, comprising a base material layer and an adhesive layer, wherein the raw materials of the adhesive layer and the parts by weight thereof are shown in table 1, and the performance results are shown in table 1.
Wherein the first monomer is isooctyl acrylate and butyl (methyl) acrylate, and the mass ratio of the isooctyl acrylate to the butyl (methyl) acrylate is 4:6, preparing a base material; the second monomer is methyl (meth) acrylate; the third monomer is hydroxy (propyl) ethyl (meth) acrylate; the fourth monomer is N-methylol acrylamide and lauryl (methyl) acrylate, and the mass ratio of the N-methylol acrylamide to the lauryl (methyl) acrylate is 1:1, a step of;
the photoinitiator is a photoinitiator 184 and a photoinitiator TPO, and the mass ratio of the photoinitiator to the TPO is 5:1.
wherein, the test before UV is according to GB/T2792 method for 180 DEG peel strength test of pressure sensitive adhesive tape;
the test after UV is carried out according to GB/T2792 method for 180 DEG peel strength test of pressure sensitive adhesive tape;
test of Water resistance according to GB/T2792 method for 180 DEG peel Strength test of pressure sensitive adhesive tape, test and comparison of peel force before and after Water resistance test;
the flying material is observed by naked eyes;
the edge breakage is observed by a magnifying glass;
the residual glue is tested by a hundred-knife and opposite-adhesion test.
TABLE 1
Example 10
Embodiment 10 is a method for preparing dicing tape for wafers of embodiments 1-9, comprising the steps of:
mixing the raw materials of the adhesive layer with solvents ETAC and toluene to prepare glue with 20-25% of solid content, respectively dissolving the ETAC or toluene with other raw materials, mixing and dissolving the ETAC or toluene, standing for half an hour (defoaming) after the ETAC or toluene is completely dissolved and uniformly stirred to obtain glue, coating the glue on a substrate layer, and drying to obtain the dicing tape for the wafer;
wherein the coating mode is doctor blade coating.
Examples 11 to 13
Examples 11 to 13 provide dicing tapes for wafers, comprising a base material layer and an adhesive layer, wherein the raw materials of the adhesive layer and the parts by weight thereof are shown in table 2, the performance results are shown in table 2, and the rest are the same as example 1.
TABLE 2
Examples 14 to 16
Examples 14 to 16 provide dicing tapes for wafers, comprising a base material layer and an adhesive layer, wherein the raw materials of the adhesive layer and the parts by weight thereof are shown in table 3, the performance results are shown in table 3, and the rest are the same as example 1.
TABLE 3 Table 3
Comparative examples 1 to 2
Comparative examples 1-2 provide dicing tapes for wafers comprising a base material layer and an adhesive layer, wherein the raw materials of the adhesive layer and the parts by weight thereof are shown in tables 1 and 2, the performance results are shown in tables 1 and 2, and the rest is the same as in example 1.
Comparative example 3
The comparative example differs from example 2 in that the adhesive layer of the comparative example does not contain the second monomer, is complemented with the fourth monomer in the same amount, and the remainder is the same as example 2, to obtain a dicing tape for wafers, which has a disadvantage in that the problem of adhesive residue is liable to occur.
Analysis:
as can be seen from table 1, the raw material formulations of the dicing tape for wafer provided in example 2 (non-UV glue+pvc substrate) and example 7 (UV glue+po substrate) of the present invention are optimal, and can achieve the technical effects of no residual glue, good water resistance, no flying material and no edge chipping.
In table 2, it is understood from the comparison of the performances of the dicing tapes for wafers of comparative example 2 and example 11 that the fourth monomer added in the present invention can improve the performance of the tapes; also, as can be seen from the comparison of the properties of the tapes of example 11 and example 12, the effect of using the trimerized HDI curative is superior to that of the HDI curative.
As is clear from tables 2 and 3, the performance of using an epoxy resin as a curing agent is superior to that of isocyanate, and the curing effect of AG-602 epoxy curing agent is optimal.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (10)

1. The dicing tape for the wafer is characterized by comprising a substrate layer and an adhesive layer;
the adhesive layer is mainly prepared from a first monomer, a second monomer, a third monomer, a fourth monomer and a crosslinking agent;
the first monomer is isooctyl acrylate and butyl (methyl) acrylate, and the mass ratio of the isooctyl acrylate to the butyl (methyl) acrylate is 4:6, preparing a base material;
the second monomer is methyl (meth) acrylate;
the third monomer is hydroxyethyl (meth) acrylate;
the fourth monomer is N-methylol acrylamide and lauryl (methyl) acrylate, and the mass ratio of the N-methylol acrylamide to the lauryl (methyl) acrylate is 1:1, a step of;
the adhesive layer is mainly prepared from the following components in parts by weight:
120 parts of a first monomer, 5 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer and 1 part of a crosslinking agent;
or the adhesive layer is mainly prepared from the following components in parts by weight:
115 parts of a first monomer, 10 parts of a second monomer, 10 parts of a third monomer, 5 parts of a fourth monomer, 1 part of a cross-linking agent, 3 parts of a photoinitiator and 10 parts of a multifunctional resin;
wherein the cross-linking agent is AG-602 epoxy curing agent;
the multifunctional resin is a six-functional resin containing hydroxyl;
the photoinitiator is a photoinitiator 184 and a photoinitiator TPO, and the mass ratio of the photoinitiator to the TPO is 5:1.
2. the dicing tape for a wafer according to claim 1, wherein the base material layer comprises at least one of a PET film, a PO film, and a PVC film.
3. The dicing tape for wafer according to claim 2, wherein the thickness of the PET film is 25 to 50 μm.
4. The dicing tape for a wafer according to claim 3, wherein the PET film is a PET release film.
5. The dicing tape for wafer according to claim 2, wherein the PO film has a thickness of 70 to 150 μm.
6. A method of producing the dicing tape for wafer according to any one of claims 1 to 5, comprising the steps of:
and mixing and reacting the raw materials of the adhesive layer to obtain glue, coating the glue on the substrate layer, and drying to obtain the dicing tape for the wafer.
7. The method according to claim 6, wherein the glue has a solids content of 20-25%.
8. The method according to claim 6, wherein the solvent for the mixing reaction comprises at least one of ethyl acetate, toluene, xylene, and acetone.
9. The method of claim 6, wherein the coating comprises knife coating.
10. Use of dicing tape for wafers according to any one of claims 1 to 5 on glass, PET, QFN, LED, BGA and aluminum foil.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090121254A (en) * 2008-05-20 2009-11-25 주식회사 엘지화학 Pressure-sensitive adhesive film, dicing die bonding film and semiconductor wafer
JP2013152963A (en) * 2012-01-24 2013-08-08 Sumitomo Bakelite Co Ltd Adhesive tape for processing semiconductor wafer
JP5460809B1 (en) * 2012-10-17 2014-04-02 古河電気工業株式会社 Adhesive tape for semiconductor processing
CN114196354A (en) * 2021-12-20 2022-03-18 苏州赛伍应用技术股份有限公司 Carboxyl-containing viscose reducing composition and preparation method and application thereof
CN114517068A (en) * 2020-11-19 2022-05-20 宁波激智科技股份有限公司 Adhesive composition and UV (ultraviolet) viscosity-reducing cutting adhesive tape

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090121254A (en) * 2008-05-20 2009-11-25 주식회사 엘지화학 Pressure-sensitive adhesive film, dicing die bonding film and semiconductor wafer
JP2013152963A (en) * 2012-01-24 2013-08-08 Sumitomo Bakelite Co Ltd Adhesive tape for processing semiconductor wafer
JP5460809B1 (en) * 2012-10-17 2014-04-02 古河電気工業株式会社 Adhesive tape for semiconductor processing
CN114517068A (en) * 2020-11-19 2022-05-20 宁波激智科技股份有限公司 Adhesive composition and UV (ultraviolet) viscosity-reducing cutting adhesive tape
CN114196354A (en) * 2021-12-20 2022-03-18 苏州赛伍应用技术股份有限公司 Carboxyl-containing viscose reducing composition and preparation method and application thereof

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