JP2007291147A - Adhesive, adhesive sheet using the same and method for producing electronic component using adhesive sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an adhesive and an adhesive sheet using the same and to provide a method for producing an electronic component using the adhesive sheet. <P>SOLUTION: The adhesive comprises a (meth) acrylic acid ester copolymer, a urethane (meth) acrylate oligomer containing four or more vinyl groups, a radiation-polymerizable (meth) acrylate monomer containing four or more vinyl groups and a tackifier resin. When an electronic component assembly attached to the adhesive or the adhesive sheet is diced to give a chip-like electronic component, since the adhesive and the adhesive sheet control scattering of electronic component and scraping-up of paste to an electronic component side and perform a control effect on release and fall of electronic component during expansion, the adhesive and the adhesive sheet are preferably used for producing electronic components in a dicing process, etc. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet.

An electronic component assembly (work) formed by forming a circuit pattern on a semiconductor wafer or circuit board material is fixed to an adhesive sheet and diced with a dicing blade equipped with abrasive grains such as diamond to form a chip-shaped electronic component An electronic component manufacturing method is known (see Patent Documents 1 to 3, etc.).

As an electronic component assembly, for example, a sealing resin package sealed with an epoxy resin, specifically, a ball grid array (BGA), a chip size package (CSP), a stack memory module, a system Examples thereof include an electronic component assembly formed by forming a circuit pattern on an on-module, a semiconductor wafer, or a circuit board material.

As a pressure-sensitive adhesive for pressure-sensitive adhesive sheets used when dicing an electronic component assembly, a radiation-polymerizable material having two or more unsaturated bonds in a copolymer of (meth) acrylic acid ester and a hydroxyl group-containing polymerizable monomer A method using a compound is known (see Patent Document 4).

As acrylic pressure-sensitive adhesives, those containing acrylic compounds having various functional groups having a weight average molecular weight of 200,000 or more and a Tg (glass transition temperature) of −60 to −30 ° C., oligomers of urethane acrylate, and the like are known. (See Patent Document 5).

In recent years, with the spread of small electronic devices such as PDAs, mobile phones, and flash memories, the chip size tends to be miniaturized. Chip skipping during dicing, glue scraping to the side of the chip, chip peeling off during expansion The requirements for each of these characteristics have become strict, and it has been required to achieve these characteristics in a balanced manner with a microchip.

JP 09-328663 A JP 2003-007654 A JP 2003-257893 A Japanese Patent No. 3410202 JP 11-293201 A

The present invention provides an adhesive, an adhesive sheet using the adhesive, and an electronic component manufacturing method using the adhesive sheet.

The present invention relates to a pressure-sensitive adhesive containing a (meth) acrylic acid ester copolymer, a urethane (meth) acrylate oligomer having 4 or more vinyl groups, and a radiation polymerizable (meth) acrylate monomer having 4 or more vinyl groups. It is.

The present invention suppresses scattering of electronic components and suppresses scraping of glue on the side surfaces of electronic components when dicing an electronic component assembly attached to an adhesive or an adhesive sheet into a chip-shaped electronic component. In addition, the electronic component has an effect of suppressing peeling and dropping at the time of expansion.

In this specification, (meth) acrylate is a general term for acrylate and methacrylate. Similarly, a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”.

In the present specification, the monomer unit means a structural unit derived from a monomer. Unless otherwise indicated, parts and% in this specification are based on mass.

The present invention relates to a pressure-sensitive adhesive containing a (meth) acrylic acid ester copolymer, a urethane (meth) acrylate oligomer having 4 or more vinyl groups, and a radiation polymerizable (meth) acrylate monomer having 4 or more vinyl groups. Is characterized by the use of

((Meth) acrylic acid ester copolymer)
The (meth) acrylic acid ester copolymer used in the present invention is a copolymer of a (meth) acrylic acid ester main monomer and other vinyl compound monomers. The vinyl compound monomer includes a functional group consisting of hydroxyl group, carboxyl group, epoxy group, amide group, amino group, methylol group, sulfonic acid group, sulfamic acid group, and (phosphite) group. It is preferable to use a functional group-containing monomer having the above.

Examples of (meth) acrylic acid ester-based main monomers include butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, Examples include myristyl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, and benzyl (meth) acrylate.

Examples of the functional group-containing monomer include vinyl compounds having a hydroxyl group, a carboxyl group, an epoxy group, an amide group, an amino group, a methylol group, a sulfonic acid group, a sulfamic acid group, and a (phosphite) ester group as the functional group. Can be mentioned.

Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.

Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.

Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.

Examples of the monomer having an amide group include (meth) acrylamide.

Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.

Examples of the monomer having a methylol group include N-methylolacrylamide.

When the cutting water used for dicing is an alkaline aqueous solution such as triethanolamine, a monomer having an organic acid group such as a carboxyl group, a sulfonic acid group, a sulfamic acid group, or a (phosphite) group is preferably used. Used.

A vinyl compound monomer other than those described above may be used for the (meth) acrylic acid ester copolymer. Examples of the vinyl compound monomer include vinyl compounds such as ethylene, styrene, vinyl toluene, allyl acetate, vinyl propionate, vinyl butyrate, vinyl versatate, vinyl ethyl ether, vinyl propyl ether, (meth) acrylonitrile, vinyl isobutyl ether, and the like. Etc.

Although it does not specifically limit as a (meth) acrylic acid ester copolymer except the point containing a (meth) acrylic acid ester main monomer unit, (meth) acrylic acid ester main monomer unit 50-99 mass parts A copolymer containing 50 to 1 part by mass of a functional group-containing monomer unit is preferably used.

A (meth) acrylic acid ester copolymer having a Tg in the range of −40 to −10 ° C. is preferably used. If the Tg is low, the pressure-sensitive adhesive may be too soft and the glue may be scraped up during dicing. When Tg is high, the pressure-sensitive adhesive becomes hard and chip skipping may occur.

(Urethane (meth) acrylate oligomer having 4 or more vinyl groups)
A urethane (meth) acrylate oligomer having 4 or more vinyl groups (hereinafter also simply referred to as “urethane acrylate oligomer”) is a (meth) acrylate oligomer having 4 or more vinyl groups and having a urethane bond in the molecule. If there is no particular limitation.

The method for producing the urethane acrylate oligomer is not particularly limited. For example, a urethane acrylate is prepared by reacting a (meth) acrylate compound containing a hydroxyl group and a plurality of (meth) acrylate groups with a compound having a plurality of isocyanate groups (for example, a diisocyanate compound). An example is an oligomer method. A compound having a plurality of isocyanate groups (for example, a diisocyanate compound) is added to and reacted with a polyol oligomer having a plurality of hydroxyl ends to form an oligomer having a plurality of isocyanate ends, and further a hydroxyl group and a plurality of (meth) acrylate groups. It is good also as a urethane acrylate oligomer by making it react with the (meth) acrylate compound containing, for example, hydroxy (meth) acrylate etc.

Examples of the (meth) acrylate compound containing a hydroxyl group and a plurality of (meth) acrylate groups include, for example, hydroxypropylated trimethylolpropane triacrylate, pentaerythritol triacrylate, dipentaerythritol-droxy-pentaacrylate, and bis (pentaerythritol). -Tetraacrylate, tetramethylolmethane-triacrylate, glycidol-diacrylate, and compounds having a methacrylate group as a part or all of these acrylate groups.

Examples of the isocyanate having a plurality of isocyanate groups include aromatic diisocyanates, alicyclic diisocyanates, and aliphatic diisocyanates. Of these isocyanates, aromatic diisocyanates or alicyclic diisocyanates having a plurality of isocyanate groups are preferably used. As the form of the isocyanate component, there are a monomer, a dimer, and a trimer, and a trimer is preferably used.

Examples of the aromatic diisocyanate include aromatic diisocyanates such as tolylene diisocyanate, 4,4-diphenylmethane diisocyanate, and xylylene diisocyanate.

Examples of the alicyclic diisocyanate include isophorone diisocyanate and methylene bis (4-cyclohexyl isocyanate). An alicyclic diisocyanate trimer formed by trimerizing isophorone diisocyanate or the like is preferably used.

Examples of the aliphatic diisocyanate include hexamethylene diisocyanate and trimethylhexamethylene diisocyanate.

Examples of the polyol component include poly (propylene oxide) diol, poly (propylene oxide) triol, copoly (ethylene oxide-propylene oxide) diol, poly (tetramethylene oxide) diol, ethoxylated bisphenol A, and ethoxylated bisphenol S spiroglycol. , Caprolactone-modified diol, carbonate diol, and the like.

If the number of vinyl groups in the urethane (meth) acrylate oligomer having 4 or more vinyl groups is small, the pressure-sensitive adhesive sheet after irradiation is not easily peeled from the electronic component, and the chip pick-up property may be lowered.

The number average molecular weight of the urethane (meth) acrylate oligomer having 4 or more vinyl groups is not particularly limited, but is preferably 3,000 or less. If the number average molecular weight of the urethane (meth) acrylate oligomer having 4 or more vinyl groups is high, the conformability to the adherend is poor and chip fly may occur. The number average molecular weight is a value measured as an average molecular weight in terms of polystyrene by gel permeation chromatography (GPC).

Although the compounding quantity of the urethane (meth) acrylate oligomer which has 4 or more vinyl groups is not specifically limited, It is preferable to set it as 20-200 mass parts with respect to 100 mass parts of (meth) acrylic acid ester copolymers. If the blending amount of the urethane (meth) acrylate oligomer having 4 or more vinyl groups is small, the pressure-sensitive adhesive sheet is not easily peeled off from the adherend after irradiation, which may cause a problem in chip pickup properties. When it mixes excessively, the glue may be scraped up during dicing.

(Radiation polymerizable (meth) acrylate monomer having 4 or more vinyl groups)
Examples of the radiation polymerizable (meth) acrylate monomer having 4 or more vinyl groups include trimethylolpropane triacrylate, polyethylene glycol dimethacrylate dipentaerythritol hexaacrylate, dipentaerythritol hydroxypentaacrylate, ditrimethylolpropane tetraacrylate, Examples thereof include pentaerythritol ethoxytetraacrylate, pentaerythritol tetraacrylate, and compounds in which a part or all of the acrylate groups of these compounds are methacrylate groups.

The blending amount of the radiation-polymerizable (meth) acrylate monomer having 4 or more vinyl groups is preferably 0.5 to 50 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer. If the blending amount of the radiation-polymerizable (meth) acrylate monomer having 4 or more vinyl groups is small, chip skipping may occur during dicing, and excessive amount may cause scraping of the glue during dicing.

(Tackifying resin)
Examples of the tackifying resin having a softening point of 50 ° C. or lower used in the present invention include terpene resins, rosin resins, petroleum resins, and other tackifying resins.

Examples of the terpene resin include α-pinene, β-pinene, hydrogenated terpene, aromatic copolymer type, and terpene phenol.

Examples of the rosin resin include rosin, disproportionated rosin, rosin ester, and hydrogenated rosin.

Examples of petroleum resins include C5 petroleum resins, C9 petroleum resins, C5 / C9 petroleum resins, and dicyclopentadiene petroleum resins.

Examples of other tackifier resins include terpene phenol resins, hydrogenated petroleum resins, alkylphenol resins, xylene resins, styrene resins, α-methylstyrene resins, coumarone resins, coumarone indene resins, and the like.

A terpene phenol-based resin is preferably used as a tackifying resin because it has high compatibility with each component of the pressure-sensitive adhesive.

(Softening point)
The softening point of the tackifying resin is preferably 50 ° C. or less. When the softening point is high, the adhesion to the adherend may be lowered. The softening point is preferably a tackifier resin having a temperature of 40 to 10 ° C. The softening point is a value determined by a reflux method (JIS K 2531).

(Hydroxyl number)
Although the hydroxyl value of tackifying resin is not specifically limited, When it has a hydroxyl group, it is preferable that it is 50-150 KOHmg / g. Chip jumps may occur outside the above range. The hydroxyl value is a value determined by a neutralization titration method (JIS K 0070).

It is preferable that the compounding quantity of tackifying resin shall be 1-50 mass parts with respect to 100 mass parts of (meth) acrylic acid ester copolymers, and 3-20 mass parts is more preferable. If the compounding amount of the tackifying resin is small, a great effect on the chip holding property cannot be obtained, and chip skipping may occur during dicing, and if it is excessive, glue scraping may occur.

Various additives such as a curing agent, a crosslinking agent, a polymerization initiator, a softening agent, an anti-aging agent, a filler, an ultraviolet absorber, and a light stabilizer may be added to the adhesive.

The thickness and type of the substrate are not particularly limited, and examples thereof include resin films such as polyvinyl chloride, polyethylene, polypropylene, polyester, ethylene vinyl alcohol, and ionomer. A lubricant such as silicone oil or silicone-based graft polymer may be applied to the substrate, and a plasticizer, a lubricant, an antistatic agent, or the like may be kneaded into the raw material resin when the substrate film is formed. The base material layer may be subjected to an anchor coat process or a textured process.

The method for applying the adhesive, antistatic agent, lubricant, etc. to the base material layer is not particularly limited, and for example, it is applied to the base material layer with a coater such as a gravure coater, comma coater, bar coater, knife coater, or roll coater. And a method of printing on the base material layer by convex printing, concave printing, flat printing, flexographic printing, offset printing, screen printing, or the like.

(Electronic component manufacturing method)
Although the adherend of an adhesive sheet is not specifically limited, For example, the electronic component assembly called a common work can be used suitably as an adherend. When used for fixing an electronic component, the electronic component assembly is used as an adherend and is diced.

Examples of the electronic component assembly include a circuit pattern formed on an insulating circuit board or a semiconductor wafer.

Examples of the insulator circuit substrate include a BGA (ball grid array) substrate, a glass substrate, an epoxy substrate, and a liquid crystal polymer substrate. Examples of the semiconductor wafer include a silicon wafer and gallium arsenide.

(Dicing)
The method of manufacturing an electronic component by using an adhesive sheet and dicing is not particularly limited. For example, after the adhesive sheet is attached to an electronic component assembly and fixed, the electronic component (chip) is diced with a rotating round blade. The method is preferably used.

The method for collecting the electronic components after dicing is not particularly limited, but a method of irradiating radiation is preferably used. Examples of a method for recovering electronic components by irradiating radiation include the following procedures.
(1) Irradiate ultraviolet rays and / or radiation from the substrate side of the adhesive sheet.
(2) The adhesive sheet is expanded (enlarged) radially, and the element pieces (electronic parts) are spread out at regular intervals, and then the element pieces (electronic parts) are pushed up with a needle or the like.
(3) Pick up the element pieces by suction using vacuum collector, air tweezers, etc.
(4) A method of mounting a picked-up element piece on a lead frame is mentioned.

The light source of ultraviolet rays and / or radiation is not particularly limited. Examples of the ultraviolet light source include a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, and a metal halide lamp. Examples of the radiation source include an electron beam source, a radioisotope (such as Co ⁶⁰ ) that emits α rays, β rays, and γ rays.

A method for producing the pressure-sensitive adhesive and pressure-sensitive adhesive sheet according to Experiment No. 1-1 is shown below. Other experimental examples are the same as those in Experiment No. 1-1 except for the matters described in Tables 1 to 4.

(Materials used)
(Meth) acrylic acid ester copolymer A: 75% by mass of butyl acrylate, 20% by mass of methyl methacrylate, and 5% by mass of 2-hydroxyethyl acrylate. Glass transition temperature Tg = −32.8 ° C., synthetic product.

Urethane acrylate oligomer A: A monomer of hexamethylene diisocyanate whose isocyanate component is an aliphatic diisocyanate, and a urethane acrylate oligomer whose acrylate component containing a hydroxyl group is dipetaerythritol pentaacrylate. The number average molecular weight (Mn) is 2,500, and the number of vinyl groups is 10 per molecule.

Urethane acrylate oligomer B: A urethane acrylate oligomer in which the trimer of isophorone diisocyanate whose isocyanate component is an alicyclic diisocyanate and the acrylate component containing a hydroxyl group is pentaerythritol triacrylate. The number average molecular weight (Mn) is 2,500, and the number of vinyl groups is 9 per molecule.

Urethane acrylate oligomer C: A urethane acrylate oligomer in which the isocyanate component is a monomer of isophorone diisocyanate whose alicyclic diisocyanate is used, and the acrylate component containing a hydroxyl group is pentaerythritol triacrylate. The number average molecular weight (Mn) is 600 and the number of vinyl groups is 6 per molecule, which is a commercial product.

Urethane acrylate oligomer D: A urethane acrylate oligomer in which the trimer of isophorone diisocyanate whose isocyanate component is an alicyclic diisocyanate and the acrylate component containing a hydroxyl group is dipentaerythritol pentaacrylate. The number average molecular weight (Mn) is 3,500 and the number of vinyl groups is 15 per molecule, which is a commercial product.

Urethane acrylate oligomer E:
A terminal acrylate oligomer obtained by further reacting dipetaerythritol pentaacrylate with a terminal isocyanate oligomer obtained by reacting a trimer of isophorone diisocyanate (alicyclic diisocyanate) with a terminal of poly (propylene oxide) diol. Number average molecular weight (Mn) is 2,900, 15 acrylate functional groups, commercially available.

Urethane acrylate oligomer F: a terminal acrylate oligomer obtained by reacting a terminal isocyanate oligomer obtained by reacting a trimer of isophorone diisocyanate (alicyclic diisocyanate) with a poly (ethylene oxide) diol end, and further dipetaerythritol pentaacrylate. . Number average molecular weight (Mn) is 3,800, 10 acrylate functional groups per molecule, commercial product.

Urethane acrylate oligomer G: A terminal acrylate oligomer obtained by further reacting 2-hydroxyethyl acrylate with a terminal isocyanate oligomer obtained by reacting hexamethylene diisocyanate with the end of poly (propylene oxide) diol. Number average molecular weight (Mn) is 3,400, the number of vinyl groups is 2 per molecule, commercially available.

Radiation-polymerizable (meth) acrylate monomer A having 4 or more vinyl groups A: Mainly commercially available pentaerythritol tetraacrylate.

Tackifying resin A: terpene phenol resin, softening point 30 ° C., hydroxyl value 100, commercial product.
Photopolymerization initiator: 1-hydroxycyclohexyl phenyl ketone, commercially available product.
Curing agent: Tolylene diisocyanate adduct of trimethylolpropane, synthetic product.
Base material: 150 μm thick polyethylene sheet, commercial product.

(Adhesive)
The pressure-sensitive adhesive is 100 parts by mass of a (meth) acrylic acid ester copolymer, 100 parts by mass of a urethane (meth) acrylate oligomer having 4 or more vinyl groups, and a radiation polymerizable (meth) acrylate monomer having 4 or more vinyl groups. 1 mass part of a body, 3 mass parts of photoinitiators, 10 mass parts of tackifying resin, and 5 mass parts of hardening | curing agents are mix | blended.

(Adhesive sheet)
An adhesive was applied to one side of the substrate to provide an adhesive layer with a thickness of 25 μm.

(Evaluation methods)
Dicing property (chip skipping): The pressure-sensitive adhesive sheet was attached to a semiconductor member molded with a mold resin for package molding, and diced to 2 mm × 2 mm after being left for 10 minutes. This is the ratio of chip skipping to the total number of chips when this operation is repeated five times.

Scrape of glue: The pressure-sensitive adhesive sheet was attached to a semiconductor member, allowed to stand for 10 minutes, then diced to 2 mm × 2 mm, and this operation was repeated 5 times. This is the rate at which glue was scraped up on the side surface of the chip when observed with a 200 × optical microscope.

Dispersion of peripheral chips at the time of pick-up: Adhesive sheet is stuck on a semiconductor member, left to stand for 10 minutes, then diced to 2 mm x 2 mm, and irradiated with ultraviolet rays for 15 seconds using a high pressure mercury lamp of 80 W / cm ² from a distance of 10 cm from the substrate surface. Irradiated to cure the adhesive layer. The tip was pushed up by 1.5 mm from the bottom of the substrate, and 100 chips were picked up by a vacuum collet. The chip where the disturbance and scattering of the chip around the pickup location were not recognized was good, and the chip which was recognized was not acceptable.

Pickup suitability: Adhesive sheet is stuck on a semiconductor member molded with mold resin for package molding so that no air bubbles enter, and after standing for 10 minutes, it is diced to 2 mm × 2 mm, and is 80 W / cm ² from a distance of 10 cm from the substrate surface. The pressure-sensitive adhesive layer was cured by irradiating with ultraviolet rays for 15 seconds using a high-pressure mercury lamp. And it pushed up 1.5 mm with the needle from the lower part of the base material, picked up 100 chips | tips with the vacuum collet, and measured the number which could not be picked up.

Each experimental example is the same as Experiment No. 1-1 except for the portions mentioned in Tables 1 to 4.

(Meth) acrylate copolymer B: 60% by mass of butyl acrylate, 35% by mass of methyl methacrylate, and 5% by mass of 2-hydroxyethyl acrylate (glass) copolymer (glass transition temperature Tg = -14. 7 ° C), synthetic product.

(Meth) acrylic acid ester copolymer C: butyl acrylate 98% by mass, methyl methacrylate 1% by mass, 2-hydroxyethyl acrylate 1% by mass (meth) acrylic acid ester copolymer (glass transition temperature Tg = −53. 7 ° C), synthetic product.

(Meth) acrylic ester copolymer D: 83% by mass of butyl acrylate, 15% by mass of methyl methacrylate, 2% by mass of 2-hydroxyethyl acrylate (glass transition temperature Tg = −39. 5 ° C), synthetic product.

(Meth) acrylic ester copolymer E: 55% by mass of butyl acrylate, 35% by mass of methyl methacrylate, and 10% by mass of 2-hydroxyethyl acrylate (glass transition temperature Tg = -12. 3 ° C), synthetic product.

(Meth) acrylic acid ester copolymer F: 50% by mass of butyl acrylate, 40% by mass of methyl methacrylate and 10% by mass of 2-hydroxyethyl acrylate (glass transition temperature Tg = −5. 6 ° C), synthetic product.

Radiation polymerizable (meth) acrylate monomer B having 3 vinyl groups: Trimethylolpropane triacrylate (3 acrylate functional groups, molecular weight 296), commercially available product.
Radiation polymerizable (meth) acrylate monomer C having two vinyl groups: Polyethylene glycol dimethacrylate (two acrylate functional groups, number average molecular weight about 1,100), synthetic product.

Tackifying resin B: Coumarone resin type, softening point 80 ° C., hydroxyl value 100 KOH mg / g, commercially available product.
Tackifying resin C: rosin ester type, softening point 30 ° C., hydroxyl value 20 KOH mg / g, commercially available product.
Tackifying resin D: hydrogenated petroleum resin, softening point 30 ° C., hydroxyl value 50 KOH mg / g, commercially available product.
Tackifying resin E: xylene resin system, softening point 30 ° C., hydroxyl value 150 KOH mg / g, commercially available product.
Tackifying resin F: alkylphenol resin system, softening point 30 ° C., hydroxyl value 180 KOH mg / g, commercially available product.
Tackifying resin G: alkylphenol resin system, softening point 30 ° C., hydroxyl number 200 KOH mg / g, commercially available product.

The pressure-sensitive adhesive and pressure-sensitive adhesive sheet according to the present invention, when dicing the electronic component assembly attached to the pressure-sensitive adhesive or pressure-sensitive adhesive sheet to form a chip-shaped electronic component, suppresses scattering of the electronic component, It is suitable for manufacturing electronic parts such as a dicing process because it has an effect of suppressing the scraping of glue and suppressing the peeling and dropping of the electronic parts during expansion.

Claims (12)

A pressure-sensitive adhesive containing a (meth) acrylic acid ester copolymer, a urethane (meth) acrylate oligomer having 4 or more vinyl groups, and a radiation polymerizable (meth) acrylate monomer having 4 or more vinyl groups. The pressure-sensitive adhesive according to claim 1, comprising 1 to 50 parts by mass of a tackifying resin having a softening point of 50 ° C or lower. The pressure-sensitive adhesive according to claim 1 or 2, wherein the number average molecular weight of the urethane (meth) acrylate oligomer having 4 or more vinyl groups is 3,000 or less. 100 parts by mass of (meth) acrylic acid ester copolymer, 20 to 200 parts by mass of urethane (meth) acrylate oligomer having 4 or more vinyl groups, and radiation-polymerizable (meth) acrylate monomer having 4 or more vinyl groups The pressure-sensitive adhesive according to any one of claims 1 to 3, comprising 5 to 50 parts by mass. The pressure-sensitive adhesive according to any one of claims 1 to 4, wherein the tackifier resin has a hydroxyl value of 50 to 150 KOHmg / g. The pressure-sensitive adhesive according to any one of claims 1 to 5, wherein the tackifying resin is a terpene phenol-based resin. The pressure-sensitive adhesive according to any one of claims 1 to 6, wherein the (meth) acrylic acid ester copolymer has a glass transition temperature (Tg) of -40 to -10 ° C. The pressure-sensitive adhesive according to any one of claims 1 to 7, wherein the isocyanate component of the urethane (meth) acrylate oligomer having 4 or more vinyl groups has a plurality of isocyanate groups, and the isocyanate component is an aromatic diisocyanate or an alicyclic diisocyanate. Agent. 9. An isocyanate trimer having a plurality of isocyanate groups, which is either aromatic, alicyclic or aliphatic, and a urethane (meth) acrylate oligomer having 4 or more vinyl groups. The adhesive in any one. The adhesive sheet using the adhesive as described in any one of Claims 1 thru | or 9. The pressure-sensitive adhesive sheet according to claim 10, which is used for fixing an electronic component. The electronic component manufacturing method using the adhesive sheet of Claim 10 or Claim 11.