CN103171286B - Gas confinement system - Google Patents

Gas confinement system Download PDF

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Publication number
CN103171286B
CN103171286B CN201210596572.1A CN201210596572A CN103171286B CN 103171286 B CN103171286 B CN 103171286B CN 201210596572 A CN201210596572 A CN 201210596572A CN 103171286 B CN103171286 B CN 103171286B
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CN
China
Prior art keywords
gas
gas confinement
panel
assembly
confinement assembly
Prior art date
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CN201210596572.1A
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Chinese (zh)
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CN103171286A (en
Inventor
J·莫克
A·S-K·柯
E·弗伦斯基
S·奥尔德森
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Kedihua display technology (Shaoxing) Co., Ltd
Original Assignee
Kateeva Inc
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Priority claimed from US13/720,830 external-priority patent/US8899171B2/en
Application filed by Kateeva Inc filed Critical Kateeva Inc
Priority to CN201610692510.9A priority Critical patent/CN106274054B/en
Priority to CN201610837821.XA priority patent/CN107029931B/en
Publication of CN103171286A publication Critical patent/CN103171286A/en
Application granted granted Critical
Publication of CN103171286B publication Critical patent/CN103171286B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • B41J29/393—Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/811—Controlling the atmosphere during processing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

This teaching relates to each embodiment of gas-tight seal gas confinement assembly and system, described gas confinement assembly and system can easily carry and assemble, and are arranged to keep minimum inert gas volume and farthest close to each device wherein encapsulated and equipment.The gas-tight seal gas confinement assembly of this teaching and each embodiment of system can make gas confinement assembly by minimize gas confinement assembly internal capacity and simultaneously Optimization Work space to build in the way of accommodating the various floor spaces of various OLED print systems.Each embodiment of the gas confinement assembly so built also is prone to the inside of gas confinement assembly accessible from the outside and easily accessible inside to safeguard during process, minimizes downtime simultaneously.

Description

Gas confinement system
Cross-Reference to Related Applications
This application claims in the priority of U. S. application No. 61/579,233 that on December 22nd, 2011 submits to.This application requires in the U. S. application No. 12/652 that January 5 submitted to and announced as US 2010/0201749 on August 12nd, 2010, the priority of 040, it requires again in the U. S. application No. 12/139 that on June 13rd, 2008 submits to and announces as US 2008/0311307 on December 18th, 2008, the priority of 391, and also require in the priority of U. S. application No. 61/142,575 that on January 5th, 2009 submits to.Applying for reference to introducing in full of all cross references enumerated herein.
Technical field
This teaching relates to each embodiment of gas-tight seal gas confinement assembly and system, described gas confinement assembly and system can easily carry and assemble, and are arranged to keep minimum inert gas volume and farthest close to each device wherein encapsulated and equipment.
Background technology
To the interest of the potential of OLED Display Technique by OLED Display Technique attribute drive, including the display floater represented, there is highly saturated color, be high-contrast, ultra-thin, quickly response and energy efficient.Additionally, various base materials, including flexible polymeric material, may be used for the manufacture of OLED Display Technique.Although being used for representing for emphasizing the potential of this technology of the display of the small screen application (mainly cell phone), but remain challenge when this manufacture is zoomed to larger amplitude face.Such as, than Gen 5.5 substrates (have about 130 cm × 150 The size of cm) manufacture OLED display in bigger substrate and still need demonstration.
Organic Light Emitting Diode (OLED) device can print various organic film in substrate by using OLED print system and other material manufactures.This organic material is susceptible to the infringement of oxidation and other chemical process.By can scale for various size of foundation base and can inertia, there is no particle printing environment in carry out in the way of accommodate OLED print system and be likely to be of multiple challenge.Because the facility printed for printing large format panel substrate needs substantial amounts of space, thus big facility is maintained at and needs gas purification to have significant engineering challenge to remove under reactive environments material (such as, water vapour and oxygen) and the inert environments of organic vapor continuously.Such as, it is provided that the big facility being hermetically sealed is likely to be of engineering challenge.In addition, feeding turnover OLED print system is so that various cables, line and the pipeline of operation print system are likely to be of challenge, so that gas lock effectively achieves about environment composition (such as, oxygen and water vapour) the specification of level because they may produce the notable dead volume that can retain this reactive materials.Additionally, it is desirable to this facility being maintained in the inert environments of process is easily accessible, in order to safeguard with minimum downtime.In addition to there is no reactive materials, the printing environment of OLED device needs the lowest particle environments.In this respect, provide in completely enclosed system and keep the environment that there is no particle to have the particle minimizing unexistent additional challenges of process that can carry out (such as under open air, high flow capacity laminar flow filter mantle) in atmospheric conditions.
Therefore; need multiple embodiments of gas lock; described gas lock can inertia, there is no particle environment in accommodate OLED print system; and can be readily scalable to manufacture oled panel on various size of foundation base and base material; during process, it is also easy to OLED print system accessible from the outside and easily accessible inside, in order to safeguard with minimum downtime simultaneously.
Accompanying drawing explanation
By with reference to accompanying drawing, obtaining being best understood from of the feature and advantage of the disclosure, accompanying drawing is intended to illustrate and not limit this teaching.
Fig. 1 is the gas confinement assembly according to this each embodiment instructed and the schematic diagram of system.
Fig. 2 is the left front stereogram of the gas confinement assembly according to this each embodiment instructed and system.
Fig. 3 is the front right perspective view of the gas confinement assembly according to this each embodiment instructed.
Fig. 4 is the exploded view of the gas confinement assembly according to this each embodiment instructed.
Fig. 5 is the exploded front stereogram of the framing component assembly according to this each embodiment instructed, it is illustrated that each panel frame section and section panel.
Fig. 6 A is the perspective rear view of gloves ported shroud (gloveport cap), and Fig. 6 B is the enlarged drawing of shoulder screw of gloves ported shroud of each embodiment according to this gas confinement assembly instructed.
Fig. 7 A is the amplification stereogram of the snap lock latch (bayonet latch) of gloves ported shroud assembly, and Fig. 7 B is the sectional view of gloves ported shroud assembly, it is shown that the head of shoulder screw engages with the recess in snap lock latch.
Fig. 8 A-8C is the schematic plan of each embodiment of the gasket seal for forming joint.
Fig. 9 A and Fig. 9 B is each stereogram of the sealing of the framing component illustrating each embodiment according to this gas confinement assembly instructed.
Figure 10 A-10B be with each embodiment of the gas confinement assembly instructed according to this for receive can relevant each figure of the sealing of section panel of easily disassembled maintenance window.
Figure 11 A-11B be with each embodiment instructed according to this for receiving the amplification perspective, cut-away view that the sealing of the section panel inserting panel or window panel is relevant.
Figure 12 A is the base portion according to this each embodiment instructed, and described base portion includes dish and rests upon multiple cushion blocks thereon.Figure 12 B is the amplification stereogram of the cushion block shown in Figure 12 A.
Figure 13 is the wall framing component relevant with dish according to this each embodiment instructed and the exploded view of top plate member.
Figure 14 A is the stereogram building the stage of the gas confinement assembly according to this each embodiment instructed, and wherein, lifter assembly is in raised position.Figure 14 B is the exploded view of the lifter assembly shown in Figure 14 A.
Figure 15 is the imaginary front perspective view of the gas confinement assembly according to this each embodiment instructed, it is shown that be arranged on the pipe-line system in gas confinement component internal.
Figure 16 is the imaginary top perspective view of the gas confinement assembly according to this each embodiment instructed, it is shown that be arranged on the pipe-line system in gas confinement component internal.
Figure 17 is the imaginary face upwarding stereogram of the gas confinement assembly according to this each embodiment instructed, it is shown that be arranged on the pipe-line system in gas confinement component internal.
Figure 18 A shows the schematic diagram of multi beam cable, line and pipeline etc..Figure 18 B shows this bundle of inswept each embodiment being fed past according to this pipe-line system instructed of gas.
Figure 19 is schematic diagram, it is shown that be trapped in how the reactive materials (A) in the dead band of multi beam cable, circuit and pipeline etc. actively purges from the inert gas (B) of inswept pipeline, and described wiring in bundles passes through described pipeline.
Figure 20 A is the cable being routed through pipeline and the imaginary stereogram of pipeline of each embodiment of gas confinement assembly and the system instructed according to this.Figure 20 B is the enlarged drawing of the opening shown in Figure 20 A of each embodiment according to this gas confinement assembly instructed, it is shown that the details of the lid for being enclosed on opening.
Figure 21 is the view of the top board of the illuminator including gas confinement assembly and system according to this each embodiment instructed.
Figure 22 is curve map, it is illustrated that according to the LED light spectrum of the gas confinement assembly of this each embodiment instructed and the illuminator of system unit.
Figure 23 is the front perspective view of the view of the gas confinement assembly according to this each embodiment instructed.
Figure 24 illustrates the exploded view of each embodiment of the gas confinement assembly shown in the Figure 23 according to this each embodiment instructed and relevant system unit.
Figure 25 is the schematic diagram of each embodiment of the gas confinement assembly of this teaching and relevant system unit.
Figure 26 is the gas confinement assembly according to this each embodiment instructed and the schematic diagram of system, it is illustrated that the embodiment circulated by the gas of gas confinement assembly.
Figure 27 is the gas confinement assembly according to this each embodiment instructed and the schematic diagram of system, it is illustrated that the embodiment circulated by the gas of gas confinement assembly.
Figure 28 is the schematic cross-section of the gas confinement assembly according to this each embodiment instructed.
Figure 29 is the gas confinement assembly according to this each embodiment instructed and the schematic diagram of system.
Figure 30 is the gas confinement assembly according to this each embodiment instructed and the schematic diagram of system.
Detailed description of the invention
This teaching discloses each embodiment of gas confinement assembly; described gas confinement assembly can sealably build and be formed integrally with gas circulation, filtration and purifying part can keep inertia, the gas confinement assembly that there is no particle environments and system to be formed, for needing the process of this environment.The level of every kind of material of various reactive materials (including various reactive ambient gas, such as water vapour and oxygen, and organic vapor) can be maintained at such as 100 by this embodiment of gas confinement assembly and system Ppm or lower, 10 ppm or lower, 1.0 Ppm or lower or 0.1 ppm or lower.Additionally, each embodiment of gas confinement assembly can provide and meet ISO The low particle environments of 3 grades of 14644 and 4 grades clean room standards.
The those of ordinary skill of every field is it is contemplated that the embodiment of gas confinement assembly is in the practicality of each technical field.Although this teaching can be benefited from the most different fields (such as, chemistry, biotechnology, new and high technology and pharmaceutical field), but OLED is printed for illustrating the practicality of each embodiment of gas confinement assembly and the system instructed according to this.Each embodiment of the gas confinement component system that can accommodate OLED print system can provide such as but not limited to following feature: seals and circulates, through multiple structures and destructing, the locking device providing gas-tight seal, minimize enclosed volume, and during process and during safeguarding, be prone to inside accessible from the outside.As discussed subsequently; this feature of each embodiment of gas confinement assembly can have the impact on function; such as but not limited to, structural integrity makes the low-level being prone to keep reactive materials during process, and the turnover of fast packing volume minimizes the downtime during maintenance cycle.Thus, it is provided that each feature of the practicality that oled panel prints and explanation provide benefit can also to various technical fields.
As it was noted above, such as, (have about 130 than Gen 5.5 substrate The size of cm × 150 cm) manufacture OLED display in bigger substrate and still need demonstration.For by the flat-panel monitor printing manufacture outside OLED, in the generation of mother glass size of foundation base, has stood to develop since about 20 nineties in century are in early days.The first generation (being expressed as Gen 1) of mother glass substrate is about 30 cm × 40 cm, thus can produce 15 ' ' panel.About 20 the mid-90s in century, the prior art producing flat-panel monitor has developed into Gen The mother glass size of foundation base of 3.5, has the size of about 60 cm × 72 cm.
Along with the propelling in each generation, for Gen 7.5 and Gen The mother glass size of 8.5 produces the printing manufacture process outside OLED.Gen 7.5 mother glasses have about 195 cm × 225 The size of cm, and each substrate can cut into eight 42 ' ' or six 47 ' ' flat board.The mother glass used in Gen 8.5 is about 220 × 250 cm, and each substrate can cut into six 55 ' ' or eight 46 ' ' flat board.The promise of quality (such as, purer color, higher contrast, thin, flexible, transparency and energy efficiency) is had been carried out by OLED flat-panel monitor, and meanwhile, OLED manufactures and is limited to Gen 3.5 and less in practice.Currently, OLED prints the optimal manufacturing technology being considered as to break through this restriction, and allows oled panel manufacture to be applied not only to Gen 3.5 and less mother glass size, and for maximum sample glass size, such as, Gen 5.5, Gen 7.5 and Gen 8.5.It will be appreciated by the skilled addressee that the feature that oled panel prints includes using various base material, such as but not limited to, various glass substrate material and various polymeric base material.In this respect, come from the size using the term of substrate based on glass to record and can apply to be applicable to the substrate of any material that OLED prints.
Print about OLED, according to this teaching, it has been found that keep notable low-level reactive materials (such as but not limited to, environment composition, the various organic vapors such as used in oxygen and water vapour, and OLED ink) relevant with providing the OLED flat-panel monitor meeting necessary lifetime specification.Lifetime specification is for oled panel technology particular importance, because this is directly related with the display product time limit；The product specification of all panel technology is difficult to meet currently for oled panel technology.By means of each embodiment of this gas confinement component system instructed, in order to provide the panel meeting necessary lifetime specification, the level of every kind of reactive materials (such as, water vapour, oxygen and organic vapor) may remain in such as 100 Ppm or lower, 10 ppm or lower, 1.0 Ppm or lower or 0.1 ppm or lower.Additionally, OLED prints needs there is no the environment of particle.For OLED prints, keep the environment particular importance that there is no particle, even if because the least particle is likely to the visible defects caused on oled panel.Currently, needed for OLED display meets commercialization, low defect level has challenge.Completely enclosed system keeps there is no that particle environments has the particle that can carry out (such as under open air, high flow capacity laminar flow filter mantle) in atmospheric conditions and reduces the unexistent additional challenges of process.Thus, keep inertia, necessary specification without particle environments to be likely to be of various challenge in big facility.
Explanation when printing the information that the needs of oled panel can summarize in checking table 1 in the level of every kind of reactive materials (such as, water vapour, oxygen and organic vapor) may remain in the facility of such as 100 ppm or lower, 10 ppm or lower, 1.0 ppm or lower or 0.1 ppm or lower.On table 1, the data of general introduction come from and test with each test sample of big pixel, the organic film composition of spin coating device breadth manufacture including for every kind in red, green and blueness.This test sample is significantly more susceptible to manufacture and test, for the rapid evaluation purpose of various preparations and process.Although test sample test should not obscured with the life test printing panel, but it can represent the impact on the life-span of various preparation and process.Result shown in following table represents the change of the process steps that test sample manufactures, wherein, compared with the test sample that (but in atmosphere rather than in nitrogen environment) similarly manufactures, only spin coating environment is for the test sample change manufactured in nitrogen environment (wherein, reactive materials is less than 1 ppm).
Can be clear by the data checking the test sample for manufacturing under various process environment in table 1, especially in the case of red and blueness, efficiently reduce organic film composition be exposed in the environment of reactive materials printing can be on the stability of various EL with thus the life-span is had and significantly affects.
Table 1: the inert gas process impact on the oled panel life-span.
Thus, there is challenge in terms of the firm closed system that can accommodate OLED print system inertia there is no the gas confinement environment of particle is provided when being printed and zoom to Gen 8.5 and more Datong District from Gen 3.5 by OLED.It is envisaged that; according to this teaching; this gas lock includes, but not limited to, e.g. following attribute by having: gas lock may be easy to scale to provide for the Optimization Work space of OLED print system; minimum inert gas volume is provided simultaneously; and during process, it being also easy to OLED print system accessible from the outside, the most easily accessible inside is to safeguard with minimum downtime.
Each embodiment instructed according to this, it is provided that a kind of for needing the gas confinement assembly of the various air-sensitive processes of inert environments, may be configured to multiple wall frameworks and the top board framing component being sealed.In certain embodiments, multiple wall frameworks and top board framing component can use reusable securing member to tighten together, such as bolt and screwed hole.Each embodiment of gas confinement assembly for instructing according to this, multiple framing components can be built into restriction gas confinement frame assembly, and each framing component includes multiple panel frame section.
The gas confinement assembly of this teaching can be to be designed to accommodate system in the way of can minimizing the enclosed volume around system, such as OLED print system.Each embodiment of gas confinement assembly can with minimize gas confinement assembly internal capacity and simultaneously Optimization Work space build in the mode accommodating the various floor spaces (footprint, or footprint) of various OLED print systems.Each embodiment of the gas confinement assembly so built also is prone to the inside of gas confinement assembly accessible from the outside and easily accessible inside to safeguard during process, minimizes downtime simultaneously.In this respect, each embodiment according to this gas confinement assembly instructed can be wide about the various floor space fixed wheels of various OLED print systems.According to each embodiment, once fixed wheel exterior feature framing component is constructed to form gas confinement frame assembly, and various types of panels just can be sealably mounted in the multiple panel sections including framing component, to complete the installation of gas confinement assembly.In each embodiment of gas confinement assembly, multiple framing components can be manufactured in a position or multiple position (to include, but not limited to, e.g., multiple wall framing components and at least one top board framing component) and for the multiple panels being arranged in panel frame section, and then build in another position.Additionally, give the parts of the gas confinement assembly for building this teaching can transport properties, each embodiment of gas confinement assembly can through multiple structures and destructing circulation repeatedly mount and dismount.
Being hermetically sealed in order to ensure gas lock, each embodiment of the gas confinement assembly of this teaching provides and is used for combining each framing component to provide frame seal.By the close fit cross part (including pad or other seal) between each framing component, inside can be adequately sealed, the most gas-tight seal.Building the most completely, the gas confinement assembly of sealing can include internal and multiple inner corners edge, and at least one inner corners edge is arranged at the cross part of each framing component and adjoining frame members.One or more in framing component, such as at least half in framing component, can include along one or more sealant compressible shims that one or more respective edges is fixing.The one or more sealant compressible shim can be configured to combine once multiple framing components and install the panel of airtight body and just produces gas-tight seal gas confinement assembly.The gas confinement assembly sealed can be formed such that the corner edge of framing component is sealed by multiple sealant compressible shims.For each framing component, such as but not limited to interior wall framework surface, roof framework surface, upright side walls framework surface, diapire framework surface and combinations thereof, one or more sealant compressible shim can be provided with.
Each embodiment for gas confinement assembly, each framing component can include multiple section, the plurality of section is designed and manufactured to receive any one in the various panel type can being sealably mounted in each section, to provide the panel sealing of the airtight body for each panel.In each embodiment of this gas confinement assembly instructed, each section framework can have section framework pad, by means of selected securing member, described section framework pad guarantees that each panel being arranged in each section framework can provide for each panel with thus for building the sealing of the airtight body of gas lock completely.In various embodiments, gas confinement assembly can have one or more in window panel or maintenance control panel in each Wall board；Wherein, each window panel or maintenance control panel can have at least one gloves port.During gas confinement assembling components, each gloves port can have attached gloves, thus gloves extend in inside.According to each embodiment, each gloves port can have the hardware for installing gloves, and wherein, this hardware uses gasket seal around each gloves port, and it provides the sealing of airtight body to minimize the leakage by gloves port or molecule diffusion.For each embodiment of this gas confinement assembly instructed, described hardware is also designed to be prone to cover cap and open the gloves port of terminal use.
The gas confinement assembly instructed according to this and each embodiment of system can include the gas confinement assembly formed from multiple framing components and panel section and gas circulation, filter and purifying part.For each embodiment of gas confinement assembly and system, pipe-line system can be installed during assembling process.Each embodiment instructed according to this, pipe-line system may be mounted in the gas confinement frame assembly that multiple framing components build.In various embodiments, pipe-line system can combine at multiple framing components and be arranged on multiple framing component before forming gas confinement frame assembly.The pipe-line system of each embodiment of gas confinement assembly and system can be configured so that the essentially all gas being drawn into pipe-line system from one or more pipe-line system entrances is moved through each embodiment in gas filtration loop, for removing the particulate matter of gas confinement assembly and internal system.Additionally, the entrance and exit that the pipe-line system of each embodiment of gas confinement assembly and system can be configured to the gas purification loop by gas confinement component external separates from the gas filtration loop of gas confinement component internal.
Such as, the gas that gas confinement assembly and system can have in gas confinement component internal circulates and filtration system.This self-filtering system can have the multiple fan filter units in inside, and can be configured to provide gas laminar flow in inside.Laminar flow can be to the direction of internal bottom or other direction any from internal top.Although the gas stream produced by the circulatory system needs not be laminar flow, but gas laminar flow can be used to ensure that thoroughly and completely having enough to meet the need of gas in inside.Gas laminar flow can be also used for minimizing turbulent flow, and this turbulent flow is undesirable, because it is so that the powder collection in environment is in this regions of turbulent flow, thus prevents filtration system from removing those particles from environment.In addition, in order to keep preferred temperature in inside, it is provided that use the heat regulating system of multiple heat exchanger, such as operate by means of fan or another gas-recycling plant, near fan or another gas-recycling plant, or it is used in combination with fan or another gas-recycling plant.Gas purification loop can be configured to by least one gas cleaning components outside locking device from gas confinement component internal recyclegas.In this respect, the filtration of gas confinement component internal and the circulatory system are combined the continuous circulation that can provide the notable low particulate inert gas run through in gas confinement assembly with the gas purification loop of gas confinement component external, and it has notable low-level reactive materials.Gas purge system can be configured to keep the most low-level and is not intended to composition, such as organic solvent and steam thereof and water, water vapour, oxygen etc..
Except being provided for gas circulation, filtering and in addition to purifying part, pipe-line system can be sized and be shaped to accommodate at least one in electric wire, wire harness and various fluid containment pipe wherein, it is likely to be of a large amount of dead volume when tying in, wherein, environment composition (such as, water, water vapour, oxygen etc.) may be trapped and be difficult to be removed by cleaning system.In certain embodiments, the combination of any one and fluid containment pipe in cable, electric wire and wire harness can be substantially provided in pipe-line system, and can be operatively connected to at least one in the electrical system being arranged in inside, mechanical system and cooling system respectively.Owing to gas circulation, filtration and purifying part can be configured so that essentially all circulated inert gas is all aspirated through pipe-line system, therefore it is trapped in and effectively purges from a large amount of dead volumes of this material that ties in the environment composition in the dead volume of the various material that ties in can be contained in pipe-line system by making this material that ties in.
The gas confinement assembly instructed according to this and each embodiment of system can include the gas confinement assembly formed from multiple framing components and panel section and gas circulation, filter and purifying part, and additionally includes each embodiment of pressurized inert gas recirculating system.This pressurized inert gas recirculating system can use in the operation of OLED print system, for various pneumatic actuating devices and equipment, as the most described in more detail.
According to this teaching, solve multiple engineering challenge, in order in gas confinement assembly and system, provide each embodiment of pressurized inert gas recirculating system.First, under the typical operation of the gas confinement assembly and system that do not have pressurized inert gas recirculating system, gas confinement assembly can be maintained at slight positive internal pressure relative to external pressure, in order to prevents outer side gas or air from entering when producing any leakage in gas confinement assembly and system internal.Such as, the gas confinement assembly instructed for this and each embodiment of system, under typical operation, the inside of gas confinement assembly can be maintained at for example, at least 2 relative to the surrounding environment outside closed system The pressure of mbarg, the pressure of for example, at least 4 mbarg, at least 6 The pressure of mbarg, the pressure of at least 8 mbarg, or higher pressure.Pressurized inert gas recirculating system is kept to be probably challenge in gas confinement component system, because it has and keep a relevant balance play dynamically and persistently carried out of the slight positive internal pressure of gas confinement assembly and system, and simultaneously continuously introduce gas-pressurized in gas confinement assembly and system.Additionally, the variable demand of each device and equipment is likely to be formed various gas confinement assemblies and the irregular pressure curve of system of this teaching.Keep dynamic pressure balance can provide the globality of OLED print procedure being used for persistently carrying out the gas confinement assembly being maintained at slight positive pressure relative to external environment condition under these conditions.
For each embodiment of gas confinement assembly and system, each embodiment in pressurized inert gas loop can be included according to this pressurized inert gas recirculating system instructed, it is possible to use at least one in compressor, reservoir and air blast and combinations thereof.Each embodiment including the pressurized inert gas recirculating system of each embodiment in pressurized inert gas loop can have custom-designed Stress control bypass circulation, and it can provide the inert gas internal pressure being in stability line definite value in the gas confinement assembly that this is instructed and system.In each embodiment of gas confinement assembly and system, pressurized inert gas recirculating system can be configured to recycle pressurized inert gas via Stress control bypass circulation when the inert gas pressure in the reservoir in pressurized inert gas loop exceedes predetermined threshold value pressure.Threshold pressure can be such as about 25 In the range of between psig to about 200 psig, or specifically in about 75 In the range of between psig to about 125 psig, or specifically in about 90 In the range of between psig to about 95 psig.In this respect, this teaching gas confinement assembly and the system with the pressurized inert gas recirculating system of each embodiment with custom-designed Stress control bypass circulation may remain in the balance in gas-tight seal gas lock with pressurized inert gas recirculating system.
According to this teaching, various devices and equipment can be arranged in inside, and with have various pressurized inert gas loop pressurized inert gas recirculating system each embodiment fluid communication, described pressurized inert gas loop can use at least one in various pressurized-gas source, such as compressor, air blast and combinations thereof.The gas lock instructed for this and each embodiment of system, use various pneumatically-operated device and equipment can provide low particles generation performance and low-maintenance cost.Exemplary means and equipment that gas confinement assembly connects can be arranged on in internal system and with various pressurized inert gas loop fluid can include, such as but not limited to, in pneumatic robot, substrate suspending bench, air bearing, air lining, compressed gas instrument, pneumatic actuator one or more, and combinations thereof.Substrate suspending bench and air bearing may be used for operating the various aspects of the OLED print system of each embodiment according to this gas confinement assembly instructed.Such as, the substrate suspending bench of air bearing technology is used to may be used for the correct position in substrate feed to printhead chamber and support substrate during OLED print procedure.
As it was noted above, the operation of each embodiment that each embodiment of substrate suspending bench and air bearing is to being contained according to the OLED print system in this gas confinement assembly instructed is probably useful.As Fig. 1 for gas confinement assembly and system 2000 schematically shown in, use the substrate suspending bench of air bearing technology may be used for the correct position in substrate feed to printhead chamber and support substrate during OLED print procedure.In FIG, gas confinement assembly 1500 can be load lock system, it can have the inlet chamber 1510 for being received substrate by the first access hatch 1512 and 1514, for substrate is moved to gas confinement assembly 1500 from inlet chamber 1510, in order to print.May be used for being isolated from each other by chamber and isolating from external environment condition according to this each gate instructed.According to this teaching, each gate can select from physics gate and gas curtain.
During substrate reception process, gate 1512 can be opened, and gate 1514 may be at closed position, in order to prevents environmental gas from entering gas confinement assembly 1500.Once substrate receives in inlet chamber 1510, gate 1512 and 1514 both can be closed and inlet chamber 1510 can use inert gas purge, such as nitrogen, any rare gas and any combination thereof, until the level of reactive ambient gas is in such as 100 Ppm or lower, 10 ppm or lower, 1.0 Ppm or lower or 0.1 ppm or lower.After environmental gas reaches of a sufficiently low level, gate 1514 can be opened, and 1512 still close, to allow substrate 1550 to be transported to gas confinement component chambers 1500 from inlet chamber 1510, as shown in Figure 1.Substrate is transported to gas confinement component chambers 1500 from inlet chamber 1510 can be via such as but not limited to the suspending bench being arranged on chamber 1500 and 1510.Substrate is transported to gas confinement component chambers 1500 from inlet chamber 1510 can also be via such as but not limited to substrate feed robot, and substrate 1550 can be placed in the suspending bench in chamber 1500 by it.Substrate 1550 can keep being supported in substrate suspending bench during print procedure.
Each embodiment of gas confinement assembly and system 2000 can have by gate 1524 and gas confinement assembly and the outlet chamber 1520 of system 1500 fluid communication.According to each embodiment of gas confinement assembly and system 2000, after print procedure completes, substrate 1550 can be transported to outlet chamber 1520 from gas confinement assembly 1500 by gate 1524.Substrate is transported to outlet chamber 1520 from gas confinement component chambers 1500 can be via such as but not limited to the suspending bench being arranged on chamber 1500 and 1520.Substrate is transported to outlet chamber 1520 from gas confinement component chambers 1500 can also be via such as but not limited to substrate feed robot, and substrate 1550 can be picked up in the suspending bench being arranged at chamber 1500 and be transported to chamber 1520 by it.For each embodiment of gas confinement assembly and system 2000, when gate 1524 in the closed position to prevent reactive ambient gas from entering gas confinement assembly 1500 time, substrate 1550 can be fetched via gate 1522 from outlet chamber 1520.
In addition to the load lock system including the inlet chamber 1510 and outlet chamber 1520 being in fluid communication with gas confinement assembly 1500 respectively via gate 1514 and 1524, gas confinement assembly and system 2000 can include system controller 1600.System controller 1600 can include the one or more processor circuit (not shown) connected with one or more memory circuitry (not shown).System controller 1600 can also with include the load lock system connectivity of inlet chamber 1510 and outlet chamber 1520, and finally connect with the printing nozzle of OLED print system.Thus, system controller 1600 can coordinate the opening and closing of gate 1512,1514,1522 and 1524.System controller 1600 can also control the ink distribution of the printing nozzle to OLED print system.Substrate 1550 can be carried by each embodiment of the load lock system of this teaching, via such as but not limited to using the substrate suspending bench of air bearing technology or the substrate suspending bench of air bearing technology and the combination of substrate feed robot, load lock system includes inlet chamber 1510 and outlet chamber 1520 via gate 1514 and 1524 and gas confinement assembly 1500 fluid communication respectively.
Each embodiment of the load lock system of Fig. 1 can also include atmospheric control 1700, and it can include vacuum source and inert gas source, can include nitrogen, any rare gas and any combination thereof.The substrate suspension system being contained in gas confinement assembly and system 2000 can include multiple vacuum ports and the gas bearing ports being generally arranged on flat surfaces.Substrate 1550 can be passed through the boost in pressure of inert gas (such as, nitrogen, any rare gas and any combination thereof) and be held away from crust.The flowing flowing out bearing volume completes by means of multiple vacuum ports.The substrate 1550 hoverheight in substrate suspending bench becomes generally according to gas pressure and gas flow.The vacuum of atmospheric control 1700 and pressure may be used for supporting during manipulation in gas confinement assembly 1500 substrate 1550 in the load lock system of Fig. 1, such as during printing.Control system 1700 can be also used for supporting substrate 1550 by the load lock system of Fig. 1 during being carried, and load lock system includes inlet chamber 1510 and the outlet chamber 1520 being in fluid communication with gas confinement assembly 1500 respectively via gate 1514 and 1524.Carrying by gas confinement assembly and system 2000 to control substrate 1550, system controller 1600 is connected with inert gas source 1710 and vacuum 1720 with 1722 by valve 1712 respectively.Unshowned addition of vacuum and inert gas supply connection and valve can be supplied to gas confinement assembly and system 2000, by the load lock system diagram of Fig. 1, to further provide for controlling the various gases needed for enclosed environment and vacuum facility.
In order to provide the stereogram of more multidimensional to each embodiment of gas confinement assembly and the system instructed according to this, Fig. 2 is the left front stereogram of each embodiment of gas confinement assembly and system 2000.Fig. 2 shows and includes gas confinement assembly 1500, inlet chamber 1510 and the load lock system of the first gate 1512.Gas confinement assembly and the system 2000 of Fig. 2 can include gas purge system 2130, for providing the constant supply of inert gas of organic vapor having notable low-level reactive environments material (such as water vapour and oxygen) and obtaining from OLED print procedure to gas confinement system 1500.Gas confinement assembly and the system 2000 of Fig. 2 also have controller system 1600, for system control function, as mentioned before.
Fig. 3 is the front right perspective view building gas confinement assembly 100 completely according to this each embodiment instructed.Gas confinement assembly 100 can accommodate one or more gases, for keeping the inert environments in gas confinement component internal.The gas confinement assembly of this teaching and system can be useful in terms of the inert gas environment in keeping inside.Inert gas can be any gas under one group of qualifications without undergoing chemical reaction.Some of inert gas generally use example can include nitrogen, any rare gas and any combination thereof.Gas confinement assembly 100 is configured to surround and protection air-sensitive process, such as, use Industrial printing systems to print Organic Light Emitting Diode (OLED) ink.It is that the example of reactive environmental gas includes water vapour and oxygen to OLED ink.As it was noted above, gas confinement assembly 100 can be configured to keep sealed environment and allow parts or print system effectively to operate, avoid polluting, aoxidizing and damage otherwise reactive material and substrate simultaneously.
As shown in Figure 3, each embodiment of gas confinement assembly can include following element portion, including front portion or the first Wall board 210 ', left side or the second Wall board (not shown), right side or the 3rd Wall board 230 ', rear portion or the 4th Wall board (not shown) and ceiling panel 250 ', this gas confinement assembly can be attached to dish 204, and dish 204 rests upon on base portion (not shown).As the most described in more detail, each embodiment of the gas confinement assembly 100 of Fig. 1 can build from anterior or the first wall framework 210, left side or the second wall framework (not shown), right side or the 3rd wall framework 230, rear portion or the 4th Wall board (not shown) and top board framework 250.Each embodiment of top board framework 250 can include fan filter unit lid 103 and the first top board framework pipeline 105 and the first top board framework pipeline 107.The embodiment instructed according to this, various types of section panels may be mounted at any one in the multiple panel sections including framing component in.In each embodiment of the gas confinement assembly 100 of Fig. 1, metal panels section 109 can be welded in framing component during framework establishment.For each embodiment of gas confinement assembly 100, the insertion panel 110 illustrated for Wall board 210 ' and the window panel 120 illustrated for Wall board 230 ' and can easily disassembled maintenance window 130 can be included through the section panel type that several structures of gas confinement assembly and destructing circulation repeatedly mount and dismount.
Although the inside close to locking device 100 can may be easy to easily disassembled maintenance window 130, but can use dismountable any panel with the inside close to gas confinement assembly and system, for repairing and routine maintenance purpose.Maintenance or repair this close to due to by such as window panel 120 and can the panel of easily disassembled maintenance window 130 provide close and different, itself so that terminal use's gloves during use from gas confinement component external close to gas confinement component internal.Such as, be attached to any gloves of gloves port 140, such as gloves 142, as in Fig. 3 for shown in panel 230, terminal use can be made between gas confinement component system validity period close to internal.
Fig. 4 illustrates the exploded view of each embodiment of the gas confinement assembly shown in Fig. 3.Each embodiment of gas confinement assembly can have multiple Wall board, perspective outboard view including front walls panel 210 ', the perspective outboard view of left side wall panel 220 ', the perspective interior view of right side wall panel 230 ', the perspective interior view of rear wall panel 240 ', and the top perspective view of ceiling panel 250 ', as shown in Figure 3, gas confinement assembly can be attached to dish 204, and dish 204 rests upon on base portion 202.OLED print system may be mounted on dish 204 top, and print procedure is known is sensitive to environmental condition.According to this teaching, gas confinement assembly can build from framing component, the wall framework 210 of such as Wall board 210 ', the wall framework 220 of Wall board 220 ', the wall framework 230 of Wall board 230 ', the wall framework 240 of Wall board 240 ' and the top board framework 250 of ceiling panel 250 ', the most then can install multiple section panel.In this respect, it may be desirable to the design of the section panel that streaming repeatedly can mount and dismount through several structures of each embodiment of the gas confinement assembly of this teaching and destructing circulation.In addition, the floor space of wide each embodiment to accommodate OLED print system of fixed wheel of gas confinement assembly 100 can be carried out, so that inert gas volume required in minimizing gas confinement assembly, and make terminal use's easily accessible (the most such during gas confinement assembly uses and during safeguarding).
Using front walls panel 210 ' and left side wall panel 220 ' as example, each embodiment of framing component can have the metal panels section 109 being welded in framing component during framing component builds.Insert panel 110, window panel 120 and can may be mounted in each wall framing component by easily disassembled maintenance window 130, and repeatedly can mount and dismount through several structures of the gas confinement assembly 100 of Fig. 4 and destructing circulation.It can be seen that in the example of Wall board 210 ' and Wall board 220 ', Wall board can have near can the window panel 120 of easily disassembled maintenance window 130.Similarly, as shown in exemplary rear Wall board 240 ', Wall board can have window panel, such as window panel 125, and it has two adjacent gloves ports 140.Each embodiment of wall framing component for instructing according to this, and for the gas confinement assembly 100 of Fig. 3 it can be seen that this set of gloves may be easy to from the outside of gas lock close to the element portion in closed system.Therefore, each embodiment of gas lock can provide two or more gloves ports, thus left hand set and right hand set can be stretched in inside and manipulate the one or more items in inside by terminal use, and does not disturb the composition of the gaseous environment in inside.Such as, any one in window panel 120 and maintenance window 130 may be positioned such that beneficially from the outside of gas confinement assembly close to the adjusting part gas confinement component internal.According to each embodiment of window panel (such as, window panel 120 and maintenance window 130), when need not terminal use by the gloves of gloves port close to time, this window may not include gloves port and gloves port assembly.
As shown in Figure 4, each embodiment of wall and ceiling panel can have multiple insertion panel 110.In figure 4, it can be seen that insert panel can have variously-shaped and aspect ratio.Except inserting in addition to panel, ceiling panel 250 ' can have installations, bolt connection, threaded, fixing or be otherwise fastened to fan filter unit lid 103 and first top board framework pipeline 105 and the second top board framework pipeline 107 of top board framework 250.As the most described in more detail, the pipe-line system being in fluid communication with the pipeline 107 of ceiling panel 250 ' may be mounted in the inside of gas confinement assembly.According to this teaching, this pipe-line system can be a part for the gas-circulating system of gas confinement component internal, and provides the flowing stream for separately leaving gas confinement assembly, for cycling through at least one gas cleaning components of gas confinement component external.
Fig. 5 is the exploded front stereogram of framing component assembly 200, and wherein, wall framework 220 can be built into and include the most supplementary of panel.Although being not limited to shown design, but the framing component assembly 200 of wall framework 220 is used to may be used for illustrating each embodiment according to this framing component assembly instructed.According to this teaching, each embodiment of framing component assembly can be made up of each framing component and the section panel being arranged in each frame panel section of each framing component.
According to each embodiment of this each framing component assembly instructed, framing component assembly 200 can include framing component, such as wall framework 220.Each embodiment for gas confinement assembly, the gas confinement assembly 100 of such as Fig. 3, the process that can use the facility being contained in this gas confinement assembly may not need only provide for the gas-tight seal locking device of inert environments, and needs there is no the environment of particulate matter.In this respect, the various sizes metal tube material of each embodiment for building framework can be used according to this framing component instructed.This metal tube material solves expectation material properties, include but not limited to, will not demote to produce the high globality material of particulate matter, and produce and there is high intensity and there is the framing component of optimum weight, it is simple to carry out carrying, build and deconstruct the gas confinement assembly including each framing component and panel section from the three unities to another place.Those of ordinary skill in the art are it is readily understood that any material meeting these requirements may be used for forming each framing component instructed according to this.
Such as, according to each embodiment of this framing component instructed, such as framing component assembly 200, can build from extruding metal tube.Each embodiment according to framing component, it is possible to use aluminium, steel and various metallic composite build framing component.In various embodiments, it is possible to use have such as but not limited to following size and have 1/8 " to 1/4 " metal tube of wall thickness: 2 " wX2 " h, 4 " wX2 " h and 4 " wX4 " h, to build each embodiment according to this framing component instructed.In addition, the various fiber reinforced polymer composites with various pipe or other form are available, it has and includes but not limited to following material properties: will not demote to produce the high globality material of particulate matter, and generation has high intensity and has the framing component of optimum weight, it is simple to carry out carrying, build and deconstructing from the three unities to another place.
About from various sizes each framing component of metal tube material construction, it is contemplated that, can weld to be formed each embodiment in frame welding portion.Suitable industry adhesive can be used to carry out additionally, build each framing component of material construction from various sizes.Should be will not carry out in the way of inherently creating by the leakage paths of framing component it is contemplated that build each framing component.In this respect, for each embodiment of gas confinement assembly, build each framing component and any method of the leakage paths that will not inherently create by framing component can be used to carry out.Additionally, according to each embodiment of this framing component instructed, such as the wall framework 220 of Fig. 4, can be painted or coating.For from being such as prone to oxidation (wherein, the material formed in surface can form particulate matter) each embodiment of framing component of making of metal tube material, can carry out brushing or coating or other surface process, such as anodization, to prevent from forming particulate matter.
The framing component assembly 200 of framing component assembly, such as Fig. 5, can have framing component, such as wall framework 220.Wall framework 220 can have top 226(top wall framework backing plate 227 and can be fastened thereon) and bottom 228(base wall framework backing plate 229 can be fastened thereon).As the most described in more detail, the backing plate being arranged on framing component surface is a part for gasket seal system, it is combined with the gasket seal of the panel being arranged in framing component section, it is provided that be used for the gas-tight seal of each embodiment according to this gas confinement assembly instructed.Framing component, the wall framework 220 of the framing component assembly 200 of such as Fig. 5, can have multiple panel frame section, wherein, each section can be made into the various types of panels of reception, such as but not limited to inserting panel 110, window panel 120 and can easily disassembled maintenance window 130.When building framing component, various types of panel section can be formed.The type of panel section can include, but not limited to, e.g. for receive insert panel 110 insert panel section 10, for receive window panel 120 window panel section 20 and can the maintenance window panel section 30 of easily disassembled maintenance window 130 for receiving.
Each type of panel section can have a panel part segment frames of receiving panel, and can be arranged to each panel and can sealably be fastened to, according in this each panel section instructed, be used for building gas-tight seal gas confinement assembly.Such as, in the Fig. 5 showing the frame assembly instructed according to this, inserting panel section 10 and be shown as having framework 12, window panel section 20 is shown as having framework 22, and maintenance window panel section 30 is shown as having framework 32.For each embodiment of this wall frame assembly instructed, each panel part segment frames can be to receive the sheet material in panel section with sequential welding bead weld, to provide gas-tight seal.For each embodiment of wall frame assembly, each panel part segment frames can be made up of various sheet material, and including the structure material selected from fiber reinforced polymer composites, it can use suitable industry adhesive to be arranged in panel section.Teaching as related to subsequently sealing is described in more detail, and each panel part segment frames can have the sealant compressible shim being disposed thereon, to guarantee can be formed the sealing of airtight body for each panel installed and be fastened in each panel section.In addition to panel part segment frames, each framing component section can have and positioning panel and be firmly fastened to the hardware that panel is relevant in panel section.
Each embodiment of the panel frame 122 inserting panel 110 and window panel 120 can build from sheet material, such as but not limited to aluminium, various aluminium and stainless alloy.The attribute of panel material can be identical with the structural material of each embodiment for constituting framing component.In this respect, there is the material for the attribute of various panel members include but not limited to: will not demote to produce the high globality material of particulate matter, and generation has high intensity and has the panel of optimum weight, in order to carry out carrying, build and deconstructing from the three unities to another place.Such as, each embodiment of cellular chip material can have the required attribute being used as to build the panel material of the panel frame 122 inserting panel 110 and window panel 120.Cellular chip material can be made up of various materials；Metal and metal composite and polymer, and polymer composite honeycomb chip material.When making from metal material, each embodiment of detachable panel can have the grounding connection included in the panel, to guarantee the total ground connection when gas confinement component construction.
Give gas confinement assembly for building this teaching gas confinement component parts can transport properties, any one in each embodiment of the section panel of this teaching can repeat installation and removal, with the inside close to gas confinement assembly during gas confinement assembly and system use.
Such as, the panel section 30 of easily disassembled maintenance window panel 130 can have one group four pads for receiving, one of them is shown as window guiding pad 34.In addition, building for receiving and the panel section 30 of easily disassembled maintenance window panel 130 can have one group of four clamping plate 36, it is used for being arranged on and each can be clamped in maintenance window panel section 30 by maintenance window 130 by one group of four acting in opposition toggle clamp 136 on the maintenance window framework 132 of easily disassembled maintenance window 130.Additionally, each in two window handles 138 may be mounted at can be on easily disassembled maintenance window framework 132, so that terminal use's maintenance window easy to removal and installation 130.The detachable quantity of maintenance window handle, type and arrange and can change.Additionally, for receive can the maintenance window panel section 30 of easily disassembled maintenance window panel 130 so that at least two in window clip 35 is selectively installed in each maintenance window panel section 30.Although display is in the top of each maintenance window panel section 30 and bottom, but at least two window clip can be to install in order to any mode of fastening maintenance window 130 in panel part segment frames 32.Instrument may be used for dismounting and installs window clip 35, in order to allows maintenance window 130 dismounting and again installs.
The acting in opposition toggle clamp 136 of maintenance window 130 and the hardware (including that clamping plate 36, window guide pad 34 and window clip 35) being arranged in panel section 30 can be built by any suitable material and combination of materials.Such as, one or more this elements can include at least one metal, at least one pottery, at least one plastics and combinations thereof.Detachable maintenance window handle 138 can be built by any suitable material and combination of materials.Such as, one or more this elements can include at least one metal, at least one pottery, at least one plastics, at least one rubber and combinations thereof.The window 124 of closed window, such as window panel 120 or the window 134 of maintenance window 130, can include any suitable material and combination of materials.According to each embodiment of this gas confinement assembly instructed, closed window can include transparent and trnaslucent materials.In each embodiment of gas confinement assembly, closed window can include material based on silica (such as but not limited to glass and quartz) and various types of material based on polymer (such as but not limited to Merlon, acrylic acid and the vinyl material of various ranks).Various compositions that it will appreciated by the skilled person that example window gate material and combinations thereof are also used as the transparent and trnaslucent materials instructed according to this.
In Figure 5 for framing component assembly 200 it can be seen that the gloves port of band cover cap 150 can be had easily disassembled maintenance window panel 130.Although Fig. 3 showing, all gloves ports have outward extending gloves, but as it is shown in figure 5, depend on terminal use the need of remotely close to the inside of gas confinement assembly, gloves port can also be by cover cap.Cover cap is latched on gloves securely by each embodiment of the cover assembly as shown in Fig. 6 A-7B when terminal use does not uses gloves, and is conveniently accessible to when terminal use is desirable for gloves simultaneously.
In fig. 6, it is shown that cover cap 150, it can have inner surface 151, outer surface 153 and can be with the wide side 152 for grasping of fixed wheel.Three shoulder screw 156 extend from the edge 154 of cover cap 150.As shown in Figure 6B, during each shoulder screw is fixed on edge 154 so that shank 155 extends setpoint distance from edge 154, thus head 157 not joining edge 154.In Fig. 7 A-7B, gloves port hardware assembly 160 can be modified to provide cover assembly, and it includes for being pressurized to relative to the locking mechanism of cover cap gloves port when having normal pressure outside locking device at locking device.
For each embodiment of the gloves port hardware assembly 160 of Fig. 6 A, snap clamp so that cover cap 150 is enclosed on gloves port hardware assembly 160, and simultaneously provide the easily accessible gloves of terminal use quickly couple design.In the top perspective view of the gloves port hardware assembly 160 shown in Fig. 7 A, gloves port assembly 160 can include back plate 161 and header board 163, and header board 163 has the threaded screws head 162 for installing gloves and flange 164.Flange 164 shows snap lock latch 166, there is groove 165, be used for receiving shoulder screw 156(Fig. 6 B) shoulder screw head 157.Each shoulder screw 156 can align with each in the snap lock latch 166 of gloves port hardware assembly 160 and engage.The groove 168 of snap lock latch 166 has the opening 165 being positioned at end and is positioned at the locking recess 167 at the other end of groove 168.The most each shoulder screw head 157 inserts in each opening 165, and cover cap 150 just can rotate, until the end near locking recess 167 of shoulder screw head adjacent groove 168.Sectional view shown in Fig. 7 B shows for the lock-in feature of cover cap gloves when gas confinement component system uses.During use, the internal gas pressure of the inert gas in locking device is more than set amount than the pressure of gas confinement component external.Normal pressure can fill gloves (Fig. 3), thus when gloves compress for 150 times at cover cap during the use of the gas confinement assembly that this is instructed, shoulder screw head 157 moves to lock in recess 167, so that it is guaranteed that gloves port window is by reliably cover cap.But, terminal use can grasp cover cap 150 by fixed wheel exterior feature for the side 152 grasped, and is easily disengaged from the cover cap being fastened in snap lock latch when not in use.Fig. 7 B also show the back plate 161 on the inner surface 131 of window 134 and the header board on the outer surface of window 134 163, and two plates all have O-ring packing 169.
Such as discuss in the following teaching of Fig. 8 A-9B, the section panel frame seal of wall and top board framing component seal and airtight body combines provides each embodiment of the gas-tight seal gas confinement assembly for the air-sensitive process needing inert environments.Contributing to providing the parts of the reactive materials of notable low concentration and the gas confinement assembly of the lowest particle environments and system to include but not limited to, gas-tight seal gas confinement assembly and efficient gas circulation and particle filter system, including pipe-line system.There is provided and be probably challenge for gas confinement assembly the most gas-tight seal；Especially when three framing components form three plane ties together.Thus, three plane ties are sealed in be provided for having especially difficult challenge through the gas-tight seal aspect of easily installing of several structures and the gas confinement assembly of destructing circulation assembly and disassembly.
In this respect, the gas-tight seal of the gas confinement assembly providing effective gasket seal and providing to build completely around parts and system is built according to each embodiment of this gas confinement assembly instructed by effective gasket seal of joint and at load bearing.Different from conventional joint sealing, the joint sealing instructed according to this: 1) it is included in top and bottom terminal frame joint joint portion (wherein, three framing components are combined) place adjoins the consistent parallel alignment of shim section and vertical orientated pad length, thus avoid angularly stitching alignment and sealing, 2) provide for the whole width formation length of adjacency along joint, thus increase and be in sealing contact area at three plane tie joint portions, 3) be designed with backing plate, described backing plate along all vertically and horizontally and top and bottom three plane tie gasket seal provide consistent compression stress.Additionally, the selection of gasket material can affect the validity providing gas-tight seal, this will be discussed later.
Fig. 8 A-8C is the schematic top plan view that conventional three plane ties of diagram seal the contrast sealed with three plane ties instructed according to this.Each embodiment according to this gas confinement assembly instructed, can have such as but not limited at least four wall framing component, top board framing component and dish, it can be bonded to form gas confinement assembly, thus produce and need gas-tight seal multiple vertical, level and three plane ties.In fig. 8 a, the schematic top plan view of conventional three gasket seals is formed by the first pad I, and the first pad I is vertical orientated with pad II in X-Y plane.As shown in Figure 8 A, in X-Y plane by vertical orientated formed be sewn between two sections and have by the contact length W of gasket width dimension limitation1.Additionally, pad III(is at the vertical orientated pad of vertical direction and pad I and pad II) terminal part can adjoin pad I and pad II, by shadow representation.In the fig. 8b, the schematic top plan view of conventional three plane tie gasket seals is formed by the first pad length I, and the first pad length I is vertical with the second pad length II, and has 45 ° of seam faying faces of two length, wherein, it is sewn between two sections and there is the contact length W more than gasket material width2.The configuration of similar map 8A, pad III(is vertical with pad I and pad II at vertical direction) end portion can adjoin pad I and pad II, by shadow representation.Assuming that gasket width is identical in Fig. 8 A and Fig. 8 B, the contact length W of Fig. 8 B2Contact length W more than Fig. 8 A1。
Fig. 8 C is the schematic top plan view according to these three plane tie gasket seals instructed.First pad length I can have the shim section I ' of the direction formation being perpendicular to pad length I, wherein, the length that shim section I ' has can be about the size of the width of combined structure member, such as forming the 4 of each wall framing component of the gas confinement assembly of this teaching " w X 2 " h or 4 " w X 4 " h metal tube.Pad II is vertical with pad I in X-Y plane, and has shim section II ', and the stacked length of shim section II ' and shim section I ' is about the width of combined structure member.The width of shim section I ' and II ' is the width of selected compressible pad sheet material.Pad III is vertical orientated with pad I and pad II at vertical direction.Shim section III ' is the end portion of pad III.Shim section III ' is formed by the vertical length of shim section III ' Yu pad III is vertical orientated.Shim section III ' can be formed such that it has the length about the same with shim section I ' and II ', and width is the thickness of selected compressible pad sheet material.In this respect, the contact length W of three shown in Fig. 8 C alignment section3More than being respectively provided with contact length W1And W2Fig. 8 A or Fig. 8 B shown in conventional delta connection seal.
In this respect, at terminal fitting joint portion, the consistent parallel alignment (will be otherwise the pad of vertical alignment, as shown in the situation of Fig. 8 A and Fig. 8 B) of shim section is formed according to these three plane tie gasket seals instructed.This consistent parallel alignment of three plane tie gasket seal sections strides across described section and applies consistent transverse sealing power, and airtight three plane ties at top and bottom corners to promote the joint formed by wall framing component seal.Additionally, the consistent each section aliging shim section that each three plane ties seal is chosen the width of the most combined structure member, thus provide the Maximum Contact length of consistent section of aliging.Additionally, be designed with backing plate according to this joint sealing instructed, described backing plate is along building all vertical, the level of joint and the compression stress that three gasket seal offers are consistent.Evincible, select the width of the gasket material that the routine three provided for the example of Fig. 8 A and Fig. 8 B seals can be at least the width of combined structure member.
The exploded perspective of Fig. 9 A illustrates the black box 300 instructed before all framing components are combined according to this, thus pad shows and is in uncompressed state.In figure 9 a, in the first step building gas lock from all parts of gas confinement assembly, multiple wall framing components, such as wall framework 310, wall framework 350 and top board framework 370, can sealably be combined.Seal according to this framing component instructed and be to provide gas confinement assembly once build the pith being just hermetically sealed and providing the sealing can implemented through several structures of gas confinement assembly and destructing circulation completely.Although the example be given in the following teaching of Fig. 9 A-9B is the part for sealing gas closed component, but it will be appreciated by the skilled addressee that this teaching be applicable to the gas confinement assembly of this teaching whole any one.
The first wall framework 310 shown in Fig. 9 A can have to be installed the medial surface 311 of backing plate 312, vertical side 314 and installs the top surface 315 of backing plate 316.First wall framework 310 can have the first pad 320, and the first pad 320 is arranged in the space formed by backing plate 312 and adheres to the space formed by backing plate 312.The gap 302 stayed after the first pad 320 is arranged in the space formed by backing plate 312 and adheres to the space formed by backing plate 312 can extend the vertical length of the first pad 320, as shown in Figure 9 A.As shown in Figure 9 A, submissive pad 320 can be arranged in the space formed by backing plate 312 and adhere to the space formed by backing plate 312, and can have vertical pad length 321, curve pad length 323 and in 90 ° with vertical pad length 321 planar shape and terminate at the pad length 325 of vertical side 314 of wall framework 310 on internal frame member 311.In figure 9 a, the first wall framework 310 can have the top surface 315 installing backing plate 316, thus forms space on surface 315, and the second pad 340 vertically adheres to described space in described space and near the inward flange 317 of wall framework 310.The gap 304 stayed after the second pad 340 is arranged in the space formed by backing plate 316 and adheres to the space formed by backing plate 316 can extend the horizontal length of the second pad 340, as shown in Figure 9 A.Additionally, as shown in phantom lines, the length 345 of pad 340 is the most parallel with the length 325 of pad 320 and aligns adjacently.
The second wall framework 350 shown in Fig. 9 A can have external frame side 353, vertical side 354 and install the top surface 355 of backing plate 356.Second wall framework 350 can have the first pad 360, and the first pad 360 is arranged in the space formed by backing plate 356 and adheres to the space formed by backing plate 356.The gap 306 stayed after the first pad 360 is arranged in the space formed by backing plate 356 and adheres to the space formed by backing plate 356 can extend the horizontal length of the first pad 360, as shown in Figure 9 A.As shown in Figure 9 A, submissive pad 360 can have vertical length 361, length of curve 363 and in 90 ° with top surface 355 planar shape and terminate at the length 365 of outer frame members 353.
As shown in the exploded perspective view of Fig. 9 A, the internal frame member 311 of wall framework 310 can be incorporated into the vertical side 354 of wall framework 350 to form a structure joint of gas confinement frame assembly.About the sealing building joint so formed, in each embodiment of gasket seal at the terminal fitting joint portion of the wall framing component instructed according to this, as shown in Figure 9 A, the length 345 of the length 325 of pad 320, the length 365 of pad 360 and pad 340 is alignd the most adjacently and as one man.Additionally, as the most described in more detail, each embodiment of the backing plate of this teaching can provide the consistent compression between about 20% to about 40% deflection of the compressible pad sheet material of each embodiment of the gas confinement assembly for gas-tight seal teaching.
Fig. 9 B illustrates the black box 300 instructed after all framing components combine according to this, thus pad is shown as compressive state.Fig. 9 B shows and illustrates with imaginary drawing at first wall framework the 310, second wall framework 350 and top board framework 370() between top terminals joint joint portion at the stereogram of details of the corner sealing of three plane ties that formed.As shown in Figure 9 B, backing plate the pad space limited may determine that one fixed width, thus after combining wall framework 310, wall framework 350 and top board framework 370；As shown in imaginary drawing, the consistent compression between about 20% to about 40% deflection forming the compressible pad sheet material of vertical, level and three gasket seals guarantees that the gasket seal at all surface sealed in the joint of wall framing component can provide gas-tight seal.In addition, pad gap 302,304 and 306(is not shown) be dimensioned so that compressible pad sheet material about 20% to about 40% deflection between optimal compression after, each pad can with joint sheet gap, as in Fig. 9 B for shown in pad 340 and pad 360.Thus, in addition to being arranged by each pad of restriction and providing consistent compression with the space adhered to, it is designed to provide each embodiment of backing plate in gap to also assure that each compression gasket can be complied with in the space limited by backing plate, without wrinkling in compressive state in the way of by is formationed leakage paths or swell or be molded the most brokenly.
According to each embodiment of this gas confinement assembly instructed, various types of section panels can use the sealant compressible shim material seal being arranged on each panel part segment frames.Integration Framework component gasket seal, the position and material for forming the sealant compressible shim of sealing between each section panel and panel part segment frames can provide the gas-tight seal gas confinement assembly with the leakage of little or no gas.In addition, for all types of panels (such as, the insertion panel 110 of Fig. 5, window panel 120 and can easily disassembled maintenance window 130) Seal Design durable panel can be provided to seal in this panel repeated removal with after installing (in order to need, such as in order to safeguard) close to gas confinement component internal.
Such as, Figure 10 A shows maintenance window panel section 30 and can the exploded view of easily disassembled maintenance window 130.As it was noted above, maintenance window panel section 30 can manufacture can easily disassembled maintenance window 130 for reception.For each embodiment of gas confinement assembly, panel section, such as detachable maintenance control panel section 30, can have panel part segment frames 32 and the sealant compressible shim 38 being arranged on panel part segment frames 32.In various embodiments, with fastening in detachable maintenance window panel section 30 can the relevant hardware of easily disassembled maintenance window 130 so that terminal use is easily installed and again installs, and guarantee simultaneously can easily disassembled maintenance window 130 install as desired by the terminal use needing to be immediately adjacent to gas confinement component internal and be again arranged in panel section 30 time holding airtight body sealing.Can include rigidity window frame 132 by easily disassembled maintenance window 130, it can be by such as but not limited to the metal tube material construction described in any framing component for this teaching of structure.Maintenance window 130 can use snap action securing hardware, such as but not limited to acting in opposition toggle clamp 136, in order to makes terminal use readily accessible and installation and maintenance window 130 again.Figure 10 A shows the gloves port hardware assembly 160 of earlier figures 7A-7B, it is shown that one group of 3 snap lock latch 166.
As shown in the front view of the detachable maintenance window panel section 30 of Figure 10 A, can have one group of four toggle clamp 136 being fastened on window frame 132 by easily disassembled maintenance window 130.Maintenance window 130 can be positioned at restriction distance in panel part segment frames 30, for guaranteeing the Suitable compression power against pad 38.Using one group of four window to guide pad 34, as shown in Figure 10 B, it may be mounted in each corner of panel section 30, for positioning maintenance window 130 in panel section 30.Each in one group of clamping plate 36 can be configured to receive can the acting in opposition toggle clamp 136 of easily disassembled maintenance window 136.According to each embodiment for circulating gas-tight seal maintenance window 130 in several installation and removal, the mechanical strength of maintenance window framework 132 and maintenance window 130 combine relative to the defined position (guiding pad 34 offer by a group window) of sealant compressible shim 38 and may insure that once maintenance window 130 fastening puts in place, being fastened on the acting in opposition toggle clamp 136 in corresponding clamping plate 36 such as but not limited to using, maintenance window framework 132 just can provide uniform power with restriction compression (being guided pad 34 setting by a group window) on panel part segment frames 32.This group window guides pad 34 to be located so that the window 130 compression stress on pad 38 deflects sealant compressible shim 38 between about 20% to about 40%.In this respect, structure and the manufacturing of panel section 30 of maintenance window 130 provides the sealing for the maintenance window 130 airtight body in panel section 30.As it was noted above, window clip 35 can be arranged in panel section 30 after maintenance window 130 is fastened in panel section 30, and the dismounting when maintenance window 130 needs dismounting.
Acting in opposition toggle clamp 136 can use any appropriate means and means combination to be fastened to can easily disassembled maintenance window framework 132.The example of the suitable fastener means that can use include at least one adhesive (such as but not limited to, epoxy resin or cement bonding agent), at least one bolt, at least one screw, at least one other securing member, at least one groove, at least one track, at least one weld part and combinations thereof.Acting in opposition toggle clamp 136 be can be directly connected to detachable maintenance window framework 132 or indirectly connected by adaptor plate.Acting in opposition toggle clamp 136, clamping plate 36, window guide pad 34 and window clip 35 can be built by any suitable material and combination of materials.Such as, one or more this elements can include at least one metal, at least one pottery, at least one plastics and combinations thereof.
Can be in addition to easily disassembled maintenance window except sealing, the sealing of airtight body can be provided for inserting panel and window panel.The other type of section panel that repeatedly can mount and dismount in panel section includes, but not limited to, e.g. the insertion panel 110 shown in Fig. 5 and window panel 120.In fig. 5 it can be seen that the panel frame 122 of window panel 120 is similarly constructed with inserting panel 110.Thus, according to each embodiment of gas confinement assembly, can be identical for receiving the manufacture inserting panel and the panel section of window panel.In this respect, the sealing inserting panel and window panel can use same principle to implement.
With reference to Figure 11 A and 11B, and each embodiment instructed according to this, any panel of gas lock (such as, the gas confinement assembly 100 of Fig. 1) can include one or more insertion panel section 10, and it can have the framework 12 being configured to receive corresponding insertion panel 110.Figure 11 A refers to publish picture the stereogram of the amplifier section shown in 11B.In Figure 11 A, insertion panel 110 is shown relative to insert framework 12 and positions.At Figure 11 B it can be seen that insert panel 110 to be attached to framework 12, wherein, framework 12 can be such as to be built by metal.In certain embodiments, metal can include aluminium, steel, copper, stainless steel, chromium, alloy and combinations thereof etc..Multiple blind cutting thread holes 14 can be formed in inserting panel section framework 12.Panel part segment frames 12 is built into and is included in the pad 16 inserted between panel 110 and framework 12, and sealant compressible shim 18 can be arranged on here.Blind cutting thread hole 14 can be M5 type.Screw 15 can be received by blind cutting thread hole 14, thus is inserting compression gasket 16 between panel 110 and framework 12.Once put in place against pad 16 fastening, insert panel 110 in inserting panel section 10, just form the sealing of airtight body.As it was noted above, various section panels can be implemented by this panel sealing, include but not limited to, the insertion panel 110 shown in Fig. 5 and window panel 120.
Each embodiment according to the sealant compressible shim instructed according to this, seal for framing component and the compressible pad sheet material of panel sealing can be selected from various compressible polymeric materials, such as but not limited to any closed air chamber polymeric material classification, this area is also referred to as expanded rubber material or expansile polymeric material.In brief, closed air chamber polymer is prepared in the way of gas confinement is in discrete chamber；The most each discrete chamber is closed by polymeric material.The attribute of the compressible closed air chamber polymeric pad sheet material being expected to be useful in the airtight body sealing of framework and panel component includes but not limited to, they are firm to the chemical attack of the chemical substance of wide scope, there is extraordinary moisture barrier attribute, it is resilient in wide temperature range, and resists permanent compressive deformation.Generally speaking, compared with open plenum topology convergence material, closed air chamber polymeric material has high dimension stability, relatively low moisture absorption coefficient and higher-strength.The all kinds polymeric material that can make closed air chamber polymeric material includes, but not limited to, e.g.: silicones, neoprene, ethylene-propylene-diene terpolymer (EPT) (using ethylene propylene diene monomer (EPDM, or the ethylene propylene diene rubber) polymer made and compound), ethene nitrile, butadiene-styrene rubber (SBR) and various copolymer thereof and blend.
The expectation material properties of closed air chamber polymer only keeps when the air chamber constituting block materials remains intact during use.In this respect, can exceed that closed air chamber polymer sets the mode of specified material specification (such as, exceed in assigned temperature or compression zone use specification) and uses this material can cause the degradation of gasket seal.In each embodiment of the closed air chamber polymer pad of the section panel in seal frame component and frame panel section, between the compression of this material should be less than about 50% to about 70% deflection, between can deflecting about 20% to about 40% for optimum performance.
In addition to closed air chamber compressible pad sheet material, another example of the compressible pad sheet material classification with the expectation attribute for building the embodiment according to this gas confinement assembly instructed includes hollow extrusion die mould compressible pad sheet material classification.Hollow extrusion die mould gasket material has expectation attribute as material classification, including but not limited to, they are firm to the chemical attack of the chemical substance of wide scope, have extraordinary moisture barrier attribute, it is resilient in wide temperature range, and resists permanent compressive deformation.This hollow extrusion die mould compressible pad sheet material can occur with the variously-shaped factor of wide scope, such as but not limited to, any one in U-shaped air chamber, D-shaped air chamber, square air chamber, rectangle air chamber and various conventional shape factor hollow extrusion die mould gasket material.Various hollow extrusion die mould gasket materials can be made up of the polymeric material being used for manufacturing closed air chamber compressible pad sheet material.Can be made up of silicones, neoprene, ethylene-propylene-diene terpolymer (EPT) (using polymer and compound that ethylene propylene diene monomer (EPDM) makes), ethene nitrile, butadiene-styrene rubber (SBR) and various copolymer thereof and blend such as but not limited to, each embodiment of hollow extrusion die mould pad.The compression of this hollow gas chamber gasket material should be less than about 50% deflection, in order to keeps expectation attribute.
Those of ordinary skill in the art can easily understand that, although closed air chamber compressible pad sheet material classification and hollow extrusion die mould compressible pad sheet material classification are given as examples, but any compressible pad sheet material with expectation attribute may be used to seal each panel in the structure member (the most various walls and top board framing component) of this teaching offer and sealing panel section framework.
Gas confinement assembly can be built from multiple framing components, the gas confinement assembly 100 of such as Fig. 3 and Fig. 4 or the gas confinement assembly 1000 of Figure 23 and Figure 24 as discussed subsequently, so that minimize damage system unit (such as but not limited to, gasket seal, framing component, pipeline and section panel) risk.Such as, gasket seal is the parts that may be susceptible to damage during building gas lock from multiple framing components.Each embodiment instructed according to this, material and method are arranged to minimize or eliminate the risk of all parts damaging gas confinement assembly during building the gas lock instructed according to this.
Figure 12 A is the stereogram building the starting stage of gas confinement assembly (the gas confinement assembly 100 of such as Fig. 3).Although gas confinement assembly (such as gas confinement assembly 100) is for illustrating the structure of the gas confinement assembly of this teaching, but those of ordinary skill will be consequently realised that, this teaching is applicable to each embodiment of gas confinement assembly.As illustrated in fig. 12, during the structure starting stage of gas confinement assembly, multiple cushion blocks are first placed on the dish 204 that supported by base portion 202.Cushion block can be thicker than the compressible pad sheet material being arranged on each wall framing component being installed on dish 204.A series of cushion blocks can be placed on multiple positions on the periphery edge of dish 204, and in described position, during assembling, each wall framing component of gas confinement assembly can be placed on a series of cushion block and near the position of dish 204, and does not contacts with dish 204.Expect to protect so as not to be arranged on each wall framing component compressible pad sheet material (in order to dish 204 sealing purpose) by any infringement in the way of assemble each wall framing component at dish 204.Thus, use cushion block (each Wall board parts can be placed on the initial position on dish 204 on cushion block) to prevent the compressible pad sheet material (in order to form gas-tight seal purpose with dish 204) being arranged on each wall framing component by any infringement.Such as but not limited to, as illustrated in fig. 12, front circumference edge 201 can have pad 93,95 and 97, and front walls framing component can rest upon on pad 93,95 and 97；Right periphery edge 205 can have pad 89 and 91, and right side wall framing component can rest upon on pad 89 and 91；Rear perimeter edge 207 can have two pads, and rear wall framework pad can rest upon thereon, illustrated therein is pad 87.Any quantity, type and the combination of cushion block can be used.It will be appreciated by the skilled addressee that, according to this teaching, cushion block can be positioned on dish 204, although the most not shown different cushion block in Figure 12 A-Figure 14 B.
For from component framework component assemble gas lock instruct the exemplary cushion block of each embodiment shown in Figure 12 B according to this, it is the stereogram irising out the 3rd cushion block 91 shown in part of Fig. 9 A.Exemplary cushion block 91 can include the cushion block bar (strap) 90 being attached to cushion block transverse side 92.Cushion block can be made up of any suitable material and combination of materials.Such as, each cushion block can include the polyethylene of supra polymer weight.Cushion block bar 90 can be made up of any suitable material and combination of materials.In certain embodiments, cushion block bar 90 includes nylon material, poly-alkylene material etc..Cushion block 91 has top surface 94 and basal surface 96.Cushion block 87,89,93,95,97 and other cushion block any used can construct with same or like physical attribute, and can include same or like material.Cushion block can be to allow stably to be placed into the periphery top edge of dish 204 and easy-to-dismount mode rests upon, clamps or its other modes are conveniently provided.
In the exploded perspective view that Figure 13 provides, front walls framework 210, left side wall framework 220, right side wall framework 230, rear wall framework 240 and top board on dish 204 that framing component can include being attached to rest upon on base portion 202 or top frame 250.OLED print system 50 may be mounted on dish 204 top.
The gas confinement assembly instructed according to this and the OLED print system 50 of each embodiment of system can include such as: granite base portion；The movable bridge of OLED printing equipment can be supported；The one or more devices extended from each embodiment of pressurized inert gas recirculating system and equipment, such as, substrate suspending bench, air bearing, track, guide rail；For OLED film formation material is deposited on suprabasil inkjet printer system, including OLED ink supply subsystem and ink jet-print head；One or more robots etc..Providing all parts that can include OLED print system 50, each embodiment of OLED print system 50 can have various floor space and form factor.
OLED ink-jet print system can include allowing multiple devices of ink droplet reliable arrangement ad-hoc location in substrate and equipment.These devices and equipment may include but be not limited to, print head assembly, ink induction system, kinematic system, substrate loading and uninstalling system and head maintenance system.Print head assembly includes at least one ink gun, with at least one aperture that can be sprayed with controllable rate, speed and size by ink droplet.Ink gun is supplied by ink supply system, and ink is supplied to ink gun by ink supply system.Print the relative motion needed between print head assembly and substrate.This completes by means of kinematic system, it is common that portal frame or separation axle XYZ system.Print head assembly can move (portal frame type) in anchoring base, or in the case of point off-axis configuration, printhead and substrate both can be moved.In another embodiment, printing station can be fixed, and substrate can be moved relative to printhead at X and Y-axis, and Z axis motion provides at substrate or printhead.When printhead moves relative to substrate, ink droplet sprays in orthochronous to be deposited on desired locations in substrate.Substrate uses substrate loading and uninstalling system insert printer and remove from printer.Depending on that printer configures, this can be by machinery conveyer, substrate suspending bench or have the robot of end effector and complete.Head maintenance system can include multiple subsystem, and it allows such as drop volume demarcation, the scraping on inkjet nozzle surface, starts the maintenance task that ink is ejected into useless pond.
Each embodiment according to this teaching assembling gas lock, front portion or the first wall framework 210, left side or the second wall framework 220, right side or the 3rd wall framework 230, rear portion or the 4th wall framework 250 and top board framework 250 can be built together in systematic order as shown in fig. 13 that, are then attached to the dish 204 being arranged on base portion 202.Each embodiment of framing component can use gantry to be positioned on cushion block to prevent from damaging compressible pad sheet material, as mentioned before.Such as, using gantry, front walls framework 210 can rest upon at least three cushion block, such as the pad 93,95 and 97 on the periphery top edge 201 of the dish 204 shown in Figure 12 A.After front walls framework 210 is placed on cushion block, wall framework 220 and wall framework 230 can be placed sequentially on the cushion block being arranged on the periphery edge 203 of dish 204 and periphery edge 205 in succession or in any order.Each embodiment according to this teaching assembling gas lock from component framework component, front walls framework 210 can be placed on cushion block, subsequently left side wall framework 220 and right side wall framework 230 are placed on cushion block so that they put in place be bolted connection or be otherwise fastened to front walls framework 210.In various embodiments, rear wall framework 240 can be placed on cushion block so that they put in place be bolted connection or be otherwise fastened to left side wall framework 220 and right side wall framework 230.For each embodiment, once wall framing component tightens together to form adjacent wall framework closed component, and top top board framework 250 is secured to this wall framework closed component to form whole gas closed frame assembly.In each embodiment for this teaching building gas confinement assembly, in this assembling stage, whole gas closed frame assembly rests upon on the plurality of cushion block to protect the globality of each framing component pad.
As shown in Figure 14 A, for each embodiment of this teaching for building gas confinement assembly, then gas confinement frame assembly 400 can be positioned so that pad can be removed to prepare gas confinement frame assembly 400 is attached to dish 204.Figure 14 A shows that gas confinement frame assembly 400 uses lifter assembly 402, lifter assembly 404 and lifter assembly 406 to be increased to from cushion block and promotes and leave the position of cushion block.In this each embodiment instructed, lifter assembly 402,404 and 406 can attach around the periphery of gas confinement frame assembly 400.After lifter assembly is attached, the gas confinement frame assembly built completely with rising or can stretch out each lifter assembly and lift-off cushion block by activating each lifter assembly, thus raises gas confinement frame assembly 400.As shown in Figure 14 A, gas confinement frame assembly 400 is shown as being thus lifted to previously rest upon above multiple cushion blocks thereon.Then the plurality of cushion block can be removed the position that rests upon from dish 204, thus then framework can be reduced on dish 204 and be then attached to dish 204.
Figure 14 B is the exploded view of the identical lifter assembly 402 of each embodiment according to this lifter assembly instructed, as shown in Figure 11 A.As it can be seen, lifter assembly 402 includes wear prevention pad 408, installing plate 410, first clamp bearing 412 and second clamp bearing 413.First clamp 414 and second clamp 415 are shown as being in line with corresponding clip bearing 412 and 413.Jack bent axle 416 is attached to the top of very heavy apical axis 418.Trailer jack 520(trailer jack) it is shown as perpendicular to very heavy apical axis 418 and is attached to very heavy apical axis 418.Jack base portion 422 is shown as a part for the bottom of very heavy apical axis 418.Being foot abutment 424 below jack base portion 422, it is configured to receive the bottom of very heavy apical axis 418 and may be connected on it.Smoothing foot (leveling Foot) 426 it is also shown as and is configured to be received by foot abutment 424.Those of ordinary skill in the art can will readily recognize that, any means being suitable for lifting operation may be used to raise gas confinement frame assembly from cushion block, thus cushion block can be removed and intact gas confinement assembly can be reduced on dish.Such as, said one or multiple lifter assembly, such as 402,404 and 406 are replaced, it is possible to use hydraulic pressure, pneumatically or electrically lifter.
According to each embodiment of this teaching for building gas confinement assembly, multiple securing members can provide and be configured to be tightened together by the plurality of framing component, and then gas confinement frame assembly are fastened to dish.The plurality of securing member can include that being arranged on corresponding frame component along each edge of each framing component is configured to one or more fastener portion of the position intersected with the adjoining frame members in multiple framing components.The plurality of securing member and sealant compressible shim can be configured so that when framing component combines sealant compressible shim is arranged close to inside and hardware near outside, thus hardware will not provide multiple leakage paths of airtight body closed component of this teaching.
The plurality of securing member can include multiple screwed holes at the edge of multiple bolts at the edge along one or more framing components and the one or more different frames components along multiple framing components.The plurality of securing member can include that multiple nut fixes bolt (captured Bolt).Described bolt can include the bolt head being extended the outer surface of the corresponding panel.Bolt can sink in the recess in framing component.Clip, screw, rivet, adhesive and other securing member may be used for tightening together framing component.Bolt or other securing member may extend through the outer wall of one or more framing component and enter in the screwed hole in the sidewall of one or more adjoining frame members or roof or other complementary fasteners feature.
As seen in figs. 15-17, for building each embodiment of the method for gas lock, pipe-line system may be mounted at and combined in the interior section formed by wall framework and top board framing component.For each embodiment of gas confinement assembly, pipe-line system can be installed during building process.Each embodiment instructed according to this, pipe-line system may be mounted in the gas confinement frame assembly built by multiple framing components.In various embodiments, pipe-line system can combine at multiple framing components and be arranged on multiple framing component before forming gas confinement frame assembly.The pipe-line system of each embodiment of gas confinement assembly and system can be configured so that the essentially all gas being drawn into pipe-line system from one or more pipe-line system entrances is all moved through each embodiment in gas filtration loop, for removing the particulate matter in gas confinement assembly.In addition, the pipe-line system of each embodiment of gas confinement assembly and system can be configured to the entrance and exit of the gas purification loop by gas confinement component external from gas filtration loop separately, and gas filtration loop is for removing the particulate matter in gas confinement assembly.Each embodiment according to this pipe-line system instructed can be made up of sheet metal, such as but not limited to having about 80 The aluminium flake of mil thickness.
Figure 15 shows the right front imagination stereogram of the piping components 500 of gas confinement assembly 100.Closed pipe system assembly 500 can have front walls panel piping components 510.As it can be seen, front walls panel piping components 510 can have front walls panel entry pipeline the 512, first front walls panel standpipe 514 and the second front walls panel standpipe 516, both it is in fluid communication with front walls panel entry pipeline 512.First front walls panel standpipe 514 is shown as having outlet 515, and outlet 515 sealably engages with the top board pipeline 505 of fan filter unit lid 103.In a similar manner, the second front walls panel standpipe 516 is shown as having outlet 517, and outlet 517 sealably engages with the top board pipeline 507 of fan filter unit lid 103.In this respect, front walls panel piping components 510 provides and is used for the inert gas in gas confinement assembly from bottom cycle, use front walls panel entry pipeline 512, by each front walls panel standpipe 514 and 516, and carry air by outlet 505 and 507 respectively, thus air can be filtered by such as fan filter unit 752.As the most described in more detail, the quantity of fan filter unit, size and dimension can select according to the physical location of the substrate in print system during process.Heat exchanger 742 is near fan filter unit 752, and as a part for heat regulating system, the inert gas that can would circulate through gas confinement assembly 100 is maintained at preferred temperature.
Right side wall panel piping components 530 can have right side wall panel inlet duct 532, and it is in fluid communication with right side wall panel upper pipe 538 by right side wall panel the first standpipe 534 and right side wall panel the second standpipe 536.Right side wall panel upper pipe 538 can have the first entrance end 535 and second pipe outlet end 537, and second pipe outlet end 537 is in fluid communication with the rear wall upper panel pipeline 536 of rear wall piping components 540.Left side wall panel piping components 520 can have and for parts identical described in right side wall panel assembly 530, wherein, at Figure 15 it can be seen that pass through left side wall panel entry pipeline 522 and the first left side wall panel standpipe 524 that the first left side wall panel standpipe 524 is in fluid communication with left side wall upper panel pipeline (not shown).Rear wall panel piping components 540 can have rear wall panel entry pipeline 542, and rear wall panel entry pipeline 542 is in fluid communication with left side wall panel assembly 520 and right side wall panel assembly 530.Additionally, rear wall panel piping components 540 can have rear wall panel bottom pipe 544, rear wall panel bottom pipe 544 can have rear wall panel the first entrance 541 and rear wall panel the second entrance 543.Rear wall panel bottom pipe 544 can be in fluid communication with rear wall upper panel pipeline 536 via the first bulkhead 547 and the second bulkhead 549, and described bulkhead structure may be used for be fed to inside such as but not limited to the various bundles of cable, line and pipeline etc. from the outside of gas confinement assembly 100.Pipeline tapping 533 is provided for the bundle of cable, line and pipeline etc. is removed rear wall upper panel pipeline 536, and it can be via bulkhead 549 through upper pipe 536.Bulkhead 547 and bulkhead 549 can use removably insertable panel gas-tight seal, as mentioned before on outside.Rear wall upper panel pipeline shows one corner by ventilating opening 545(Figure 15) it is in fluid communication with such as but not limited to fan filter unit 754.In this respect, left side wall panel piping components 520, right side wall panel piping components 530 and rear wall panel piping components 540 provide and are used for the inert gas in gas confinement assembly from bottom cycle, use Wall board inlet duct 522,532 and 542 and front panel lower pipeline 544 respectively, it is in fluid communication with ventilating opening 545 by each standpipe aforesaid, pipeline, bulkhead passage etc., thus air can be filtered by such as fan filter unit 755.Heat exchanger 745 is near fan filter unit 755, and as a part for heat regulating system, the inert gas that can would circulate through gas confinement assembly 100 is maintained at preferred temperature.
In fig. 15 it is shown that fed by the cable of opening 533.As the most described in more detail, each embodiment of the gas confinement assembly of this teaching provides for making the bundle of cable, line and pipeline etc. pass through pipe-line system.In order to eliminate the leakage paths formed around this bundle, it is possible to use for using each method of different size cable, line and pipeline in compliant materials sealed beam.Also show pipe I and pipe II for closed pipe system assembly 500 in Figure 15, it is shown as a part for fan filter unit lid 103.Pipe I provides the inert gas outlet to extraneous gas cleaning system, and the purification inert gas that pipe II provides to the filtration within gas confinement assembly 100 and closed circuit returns.
Figure 16 shows the imaginary top perspective view of closed pipe system assembly 500.Can be seen that left side wall panel piping components 520 and the symmetric property of right side wall panel piping components 530.For right side wall panel piping components 530, right side wall panel inlet duct 532 is in fluid communication with right side wall panel upper pipe 538 by right side wall panel the first standpipe 534 and right side wall panel the second standpipe 536.Right side wall panel upper pipe 538 can have the first entrance end 535 and second pipe outlet end 537, and second pipe outlet end 537 is in fluid communication with the rear wall upper panel pipeline 536 of rear wall piping components 540.Similarly, left side wall panel piping components 520 can have left side wall panel entry pipeline 522, and left side wall panel entry pipeline 522 is in fluid communication with left side wall upper panel pipeline 528 by left side wall panel the first standpipe 524 and left side wall panel the second standpipe 526.Left side wall upper panel pipeline 528 can have the first entrance end 525 and second pipe outlet end 527, and second pipe outlet end 527 is in fluid communication with the rear wall upper panel pipeline 536 of rear wall piping components 540.Additionally, rear wall panel piping components can have rear wall panel entry pipeline 542, rear wall panel entry pipeline 542 is in fluid communication with left side wall panel assembly 520 and right side wall panel assembly 530.Additionally, rear wall panel piping components 540 can have rear wall panel bottom pipe 544, rear wall panel bottom pipe 544 can have rear wall panel the first entrance 541 and rear wall panel the second entrance 543.Rear wall panel bottom pipe 544 can be in fluid communication with rear wall upper panel pipeline 536 via the first bulkhead 547 and the second bulkhead 549.Piping components 500 shown in Figure 15 and Figure 16 can provide the inert gas Efficient Cycle (inert gas is recycled to ceiling panel pipeline 505 and 507 via front walls Face plate outlet 515 and 517 from anterior Wall board inlet duct 512 by respectively) from anterior Wall board piping components 510 and from left side wall panel assembly 520, the Efficient Cycle of right side wall panel assembly 530 and rear wall panel piping components 540 is (by air respectively from inlet duct 522, 532 and 542 are recycled to ventilating opening 545).Once inert gas via ceiling panel pipeline 505 and 507 and ventilating opening 545 be discharged to the closed area under the fan filter unit lid 103 of locking device 100, the inert gas so discharged can be filtered by fan filter unit 752 and 754.Additionally, the inert gas of circulation can be a part for heat regulating system by heat exchanger 742 and 744() it is maintained at preferred temperature.
Figure 17 is the imaginary upward view of closed pipe system assembly 500.Inlet ductwork assembly 502 includes the front walls panel entry pipeline 512 of fluid communication with each other, left side wall panel entry pipeline 522, right side wall panel inlet duct 532 and rear wall panel entry pipeline 542.Each inlet duct that Inlet ductwork assembly 502 is included, exist and understand opening along each duct bottom is equally distributed, many group openings are emphasized especially, the purpose instructed for this, such as opening 511, the opening 521 of left side wall panel entry pipeline 522, the opening 531 of right side wall panel inlet duct 532 and the opening 541 of right side wall panel inlet duct 542 of front walls panel entry pipeline 512.In the bottom of each inlet duct it will be seen that the offer of this opening is effectively absorbed in locking device 100 for inert gas, for circulation continuously and filtration.The circulation continuously of the inert gas of each embodiment of gas confinement assembly and filtration provide the environment that there is no particle in each embodiment for keeping gas confinement component system.Each embodiment of gas confinement component system may remain in 4 grades of ISO 14644 for particulate matter.Each embodiment of gas confinement component system may remain in ISO for the process that particle contamination is especially sensitive 3 grades of specifications of 14644.As it was noted above, pipe I provides the inert gas outlet to extraneous gas cleaning system, and the purification inert gas that pipe II provides to the filtration within gas confinement assembly 100 and closed circuit returns.
In each embodiment of the gas confinement component system instructed according to this, the bundle of cable, line and pipeline etc. can be fed through pipeline, in order to the reactive ambient gas in the dead band of the bundle that purging is trapped in cable, line and pipeline etc., such as water vapour and oxygen.According to this teaching, it has been found that the dead band formed in the bundle of cable, line and pipeline forms the reservoir of retained reactive materials, it can extend significantly so that gas confinement assembly meets the time needed for performing the specification of air-sensitive process.Gas confinement assembly and each embodiment of system for this teaching for printing OLED device, various reactive materials (include various reactive ambient gas, such as water vapour and oxygen, and organic vapor) in every kind of material can be maintained at such as 100 Ppm or lower, 10 ppm or lower, 1.0 Ppm or lower or 0.1 ppm or lower.
In order to be understood by how the cable feeding of pipeline can cause minimizing to purge, from the dead volume of the cable that ties in, line and pipeline etc., the time needed for reactive ambient gas that retains, with reference to Figure 18 A-19.Figure 18 A shows that the enlarged drawing of bundle I, bundle I can be the bundles that can include pipeline (such as, for various ink, solvent etc. flow to the pipeline A of print system (such as the print system 50 of Figure 13)).The bundle I of Figure 18 A can also include electric wire (such as electric wire B) and cable (such as coaxial cable C).Route to internal to be connected to various device and equipment (including OLED print system) together with this pipeline, line can tie in cable and from outside.In the shadow region of Figure 18 A it can be seen that this bundle can form substantial amounts of dead band D.In the schematic perspective view of Figure 18 B, when cable, line and bale of pipeline I are fed through pipeline II, inert gas III can continuously sweep described bundle.The amplification sectional view of Figure 19 shows that continuously sweeping the inert gas of the pipeline that ties in, line and cable can the most effectively increase the dead volume formed from this bundle and remove the speed of retained reactive materials.The reactive species concentrations of diffusion rate and dead volume outer (overall area by being occupied by inert gas species B represents in Figure 19) that reactive materials A leaves dead volume (overall area by being occupied represents in Figure 19) by substance A is inversely proportional to.That is, if in the just volume outside dead volume, the concentration of reactive materials is high, then diffusion rate reduces.If the reactive species concentrations in this region reduces (by the flowing stream of inert gas, then pass through mass action) continuously from the just volume dead volume space, then the speed that reactive materials spreads from dead volume increases.Additionally, by same principle, inert gas can be spread in dead volume, because retained reactive materials is removed from these spaces effectively.
Figure 20 A is the stereogram of the back angle of each embodiment of gas confinement assembly 600, and imaginary drawing enters the inside of gas confinement assembly 600 through return duct 605.For each embodiment of gas confinement assembly 600, rear wall panel 640 can have insertion panel 610, inserts panel 610 and is configured to provide at the path of such as electrically bulkhead.The bundle of cable, line and pipeline etc. can be fed through bulkhead and enter cable wiring conduit, the such as pipeline 632 shown in right side wall panel 630, to this end, the bundle routing in the first cable, line and bale of pipeline conduit entrance 636 with exposure dismantled by removably insertable panel.From here, described bundle can be fed to the inside of gas confinement assembly 600, and is illustrated by the return duct 605 in the inside of gas confinement assembly 600 in imaginary drawing.Each embodiment for the gas confinement assembly of cable, line and bale of pipeline wiring can have more than one cable, line and bale of pipeline import, as shown in FIG. 20 A, it illustrates the first bundle conduit entrance 634 and the second bundle conduit entrance 636 restrainted for another.Figure 20 B shows the enlarged drawing of the bundle conduit entrance 634 for cable, line and bale of pipeline.Bundle conduit entrance 634 can have features designed to form, with slide lid 633, the opening 631 sealed.In various embodiments, opening 631 can accommodate flexible sealing module, such as, provided by the Roxtec Company sealed for cable entries, and it can accommodate the cable of various diameters, line and pipeline etc. in bundle.Alternatively, the top 635 of slide lid 633 and the upper part 637 of opening 631 can have the compliant materials arranged on each surface, thus compliant materials the cable of various sizes diameter, line and pipeline etc. in the bundle being fed through import (e.g., bundle conduit entrance 634) can around form sealing.
Figure 21 is gas confinement assembly and the ceiling panel 250 ' of system 100 of the upward view of each embodiment of the ceiling panel of this teaching, such as Fig. 3.According to each embodiment of this teaching assembling gas lock, lighting device may be mounted in the inside top surface of ceiling panel (the gas confinement assembly of such as Fig. 3 and the ceiling panel 250 ' of system 100).As shown in figure 21, lighting device can be arranged on the interior section of each framing component by the top board framework 250 with interior section 251.Such as, top board framework 250 can have two top board framework sections 40, and top board framework section 40 is generally of two top board Vierendeel girders 42 and 44.Each top board framework section 40 can have the first side 41 towards top board framework 250 positioned internal and the second side 43 towards the outside location of top board framework 250.For providing each embodiment instructed according to this of illumination for gas lock, illumination component 46 can be installed right.Every pair of illumination component 46 can include the second illumination component 47 of the first illumination component 45 near the first side 41 and the second side 43 near top board framework section 40.The quantity of the illumination component shown in Figure 21, to position and be grouped be exemplary.The quantity of illumination component and packet can be with any desired or suitable method changes.In various embodiments, illumination component can be installed straightly, and in other embodiments, may be mounted so that they can move to each position and angle.The setting of illumination component is not limited to top panel top board 433, but in addition to that or replace may be located at other inner surface any of the gas confinement assembly shown in Fig. 3 and system 100, outer surface and surface combination on.
Various illumination components can include any quantity, the lamp of type or combination, such as halogen light modulation, white lamp, incandescence, arc lamp or light emitting diode or device (LED).Such as, each illumination component can include 1 LED to about 100 LED, about 10 LED to about 50 LED, or more than 100 LED.LED or other lighting device can send in chromatogram, chromatogram is outer or any color of a combination thereof or color combination.Each embodiment according to the gas confinement assembly for inkjet printing OLED material, because the photaesthesia that some materials are to some wavelength, thus the optical wavelength being arranged on the lighting device in gas confinement assembly can be specifically chosen, during avoiding process, material is demoted.It is, for example possible to use 4X cool white LED, it is possible to use 4X yellow led or its any combination.The example of 4X cool white LED is can be from IDEC Corporation The LF1B-D4S-2THWW4 that of Sunnyvale, California obtain.The example of the 4X yellow led that can use is the LF1B-D4S-2SHY6 that can also obtain from IDEC Corporation.LED or other illumination component can position or suspension any position from the interior section 251 of top board framework 250 or on another surface of gas confinement assembly.Illumination component is not limited to LED.Any suitable illumination component or the combination of illumination component can be used.Figure 22 is IDEC The curve map of LED light spectrum, and show the x-axis corresponding with intensity when peak strength is 100% and the y-axis corresponding with wavelength (unit: nanometer).Show LF1B yellow type, yellow fluorescence lamp, LF1B white type LED, LF1B cool white type LED and the frequency spectrum of LF1B redness type LED.Each embodiment instructed according to this, it is possible to use other spectrum and spectral combination.
Recall, each embodiment of gas confinement assembly can by minimize gas confinement assembly internal capacity and simultaneously Optimization Work space to build in the way of accommodating the various floor spaces of various OLED print systems.Each embodiment of the gas confinement assembly so built also is prone to the inside of gas confinement assembly accessible from the outside and easily accessible inside to safeguard during process, minimizes downtime simultaneously.In this respect, each embodiment according to this gas confinement assembly instructed can be wide about the various floor space fixed wheels of various OLED print systems.
Those of ordinary skill is appreciated that, this teaching for the structure of framing component structure, panel structure, framework and panel sealing and gas confinement assembly (such as, the gas confinement assembly 100 of Fig. 3) can apply to the gas confinement assembly with various sizes and design.Such as but not limited to, contain size of foundation base Gen Each embodiment of the fixed wheel exterior feature gas confinement assembly of this teaching of 3.5 to Gen 10 can have at about 6 m3To about 95 m3Between internal capacity, and can for uncertain profile and have suitable nominal dimension locking device save volume between about 30% to about 70%.Each embodiment of gas confinement assembly provides the profile for gas confinement assembly so that each framing component is built into, so that accommodate OLED print system for its function and simultaneously Optimization Work space to minimize inert gas volume, and also allow for during process, be easy to OLED print system accessible from the outside.In this respect, each gas confinement assembly of this teaching can change in terms of profile layout and volume.
Figure 23 provides the example according to this gas confinement assembly instructed.Gas confinement assembly 1000 can include forward frame assembly 1100, central frame assembly 1200 and rear frame assembly 1300.Forward frame assembly 1100 can include forward frame base portion 1120, front walls framework 1140 and anterior top board framework 1160, and front walls framework 1140 has the opening 1142 for receiving substrate.Central frame assembly 1200 can include central frame base portion 1220, right-hand member wall framework 1240, midfeather framework 1260 and left end wall framework 1280.Rear frame assembly 1300 can include rear frame base portion 1320, rear wall framework 1340 and rear portion top board framework 1360.Region shown in shade shows the available work volume of gas confinement assembly 1000, and it is the volume that can be used for accommodating OLED print system.Each embodiment fixed wheel exterior feature of gas confinement assembly 1000 is for minimizing operation air-sensitive process (such as, OLED print procedure) needed for the volume recycling inert gas, and allow to be conveniently accessible to OLED print system (the most remotely or directly by can easily disassembled panel have easy access to) simultaneously.For containing size of foundation base Gen Each embodiment of the gas confinement assembly of this teaching of 3.5 to Gen 10, can have at about 6 m according to each embodiment of this fixed wheel exterior feature gas confinement assembly instructed3To about 95 m3Between gas confinement volume, such as but not limited at about 15 m3To about 30 m3Between, for such as Gen For the OLED printing of 5.5 to Gen 8.5 size of foundation base, this is probably useful.
Gas confinement assembly 1000 can have in this teaching for all features described in example gases closed component 100.Such as but not limited to, gas confinement assembly 1000 can use the sealing instructed according to this, to provide through several structures and the gas-tight seal locking device of destructing circulation.Each embodiment of gas confinement system based on gas confinement assembly 1000 can have gas purge system, various reactive materials (can be included various reactive ambient gas by it, such as water vapour and oxygen, and organic vapor) the level of every kind of material be maintained at such as 100 Ppm or lower, 10 ppm or lower, 1.0 Ppm or lower or 0.1 ppm or lower.
Additionally, each embodiment of gas confinement component system based on gas confinement assembly 1000 can have circulation and filtration system, it can provide and meet ISO 3 grades of 14644 and 4 grades clean room standards without particle environments.In addition, as subsequently in more detail shown in, based on this gas confinement assembly instructed (such as, gas confinement assembly 100 and gas closed component 1000) gas confinement component system can have each embodiment of pressurized inert gas recirculating system, it may be used for operating such as but not limited to one or more in following: pneumatic robot, substrate suspending bench, air bearing, air lining, compressed gas instrument, pneumatic actuator, and combinations thereof.The gas lock instructed for this and each embodiment of system, use various pneumatically-operated device and equipment can provide low particles generation performance and low-maintenance cost.
Figure 24 is the exploded view according to this gas confinement assembly 1000 instructed, it is illustrated that can be constructed to provide each framing component of gas-tight seal gas lock.As described previously for described in each embodiment of the gas lock 100 of Fig. 3 and Figure 13, OLED ink-jet print system 50 can include multiple devices and the equipment allowing that ink droplet reliable arrangement goes up ad-hoc location in substrate (such as substrate 60), illustrates near substrate suspending bench 54.Providing all parts that can include OLED print system 50, each embodiment of OLED print system 50 can have various floor space and form factor.According to each embodiment of OLED ink-jet print system, various base materials may be used for substrate 60, such as but not limited to various glass substrate material and various polymeric base material.
According to each embodiment of this gas confinement assembly instructed, as described previously for described in gas lock 100, the structure of gas confinement assembly can be carried out around whole OLED print system, to minimize the volume of gas confinement assembly and to be conveniently accessible to inside.In fig. 24, the example that fixed wheel is wide can consider that OLED print system 50 provides.
As shown in figure 24, can there are six isolators in OLED print system 50, it can be seen that two of which: the first isolator 51 and the second isolator 53, it supports the substrate suspending bench 54 of OLED print system 50.In addition to two all relative with visible first isolator 51 and the second isolator 53 additional isolator, there are two isolators supporting OLED print system base portion 52.Closed front base portion 1120 can have the first closed front isolator bearing 1121 supporting the first closed front isolator wall framework 1123.Second closed front isolator wall framework 1127 is supported by the second closed front isolator bearing (not shown).Similarly, centre sealed end region 1220 can have the first middle closing isolator bearing 1221 supporting the first middle closing isolator wall framework 1223.Close isolator wall framework 1227 in the middle of second and close the support of isolator bearing (not shown) in the middle of second.Finally, rear closure base portion 1320 can have the first rear closure isolator bearing 1321 supporting the middle closing in rear portion isolator wall framework 1323.Second rear closure isolator wall framework 1327 is supported by the second rear closure isolator bearing (not shown).Each embodiment of isolator wall framing component can around each isolator fixed wheel wide, thus minimize the volume around each isolator supporting member.Additionally, be demountable detachable panel for the shade panel section shown in each isolator wall framework of base portion 1120,1220 and 1320, such as to keep in repair isolator.Closed front assembly base portion 1120 can have dish 1122, and middle closed component base portion 1220 can have dish 1222, and rear closure assembly base portion 1320 can have dish 1322.When base portion builds completely to form adjacent base portion, OLED print system may be mounted on the adjacent dish being consequently formed, in the way of being similar to be arranged on the dish 204 of Figure 13 OLED print system 50.As it was noted above, the wall framework 1140 of wall and top board framing component, such as forward frame assembly 1100, top board framework 1160；The wall framework 1240,1260 and 1280 of central frame assembly 1200；And the wall framework 1340 of rear frame assembly 1300, top board framework 1360, then can combine around OLED print system 50.Thus, gas-tight seal each embodiment determining contoured wall framing component of this teaching efficiently reduces the inert gas volume in gas confinement assembly 100, and simultaneously facilitates each device close to OLED print system and equipment.
The gas that the gas confinement assembly instructed according to this and system can have in gas confinement component internal circulates and filtration system.This self-filtering system can have the multiple fan filter units in inside, and can be configured to provide gas laminar flow in inside.Laminar flow can be to the direction of internal bottom or other direction any from internal top.Although the gas stream produced by the circulatory system needs not be laminar flow, but gas laminar flow can be used to ensure that thoroughly and completely having enough to meet the need of gas in inside.Gas laminar flow can be also used for minimizing turbulent flow, and this turbulent flow is undesirable, because it is so that the powder collection in environment is in this regions of turbulent flow, thus prevents filtration system from removing those particles from environment.In addition, in order to keep preferred temperature in inside, it is provided that use the heat regulating system of multiple heat exchanger, such as operate by means of fan or another gas-recycling plant, near fan or another gas-recycling plant, or it is used in combination with fan or another gas-recycling plant.Gas purification loop can be configured to by least one gas cleaning components outside locking device from gas confinement component internal recyclegas.In this respect, the filtration of gas confinement component internal and the circulatory system are combined the continuous circulation that can provide the notable low particulate inert gas run through in gas confinement assembly with the gas purification loop of gas confinement component external, and it has notable low-level reactive materials.Gas purge system can be configured to keep the most low-level and is not intended to composition, such as organic solvent and steam thereof and water, water vapour, oxygen etc..
Figure 25 shows gas confinement assembly and the schematic diagram of system 2100.Each embodiment of gas confinement assembly and system 2100 can include the gas confinement assembly 1500 instructed according to this and the gas purification loop 2130 of gas confinement assembly 1500 fluid communication and at least one heat regulating system 2140.Additionally, each embodiment of gas confinement assembly and system can have pressurized inert gas recirculating system 2169, it can be with supplying inert gas to operate each device, the substrate suspending bench of such as OLED print system.Each embodiment of pressurized inert gas recirculating system 2169 can use compressor, air blast and both combinations, as the source of each embodiment of inert gas recirculating system 2169, as the most described in more detail.Additionally, gas confinement assembly and system 2100 can have at the filtration within gas confinement assembly and system 2100 and circulatory system (not shown).
As shown in figure 25, each embodiment of gas confinement assembly for instructing according to this, the design of pipeline can would circulate through the inert gas of gas purification loop 2130 from the internal inert gas filtering continuously and circulating of each embodiment at gas confinement assembly separately.Gas purification loop 2130 includes egress line 2131, and it is from gas confinement assembly 1500 to solvent removing component 2132 and then to gas purge system 2134.The inert gas being cleaned solvent and other reactant gas material (such as oxygen and water vapour) then returns gas confinement assembly 1500 by inlet line 2133.Gas purification loop 2130 can also include properly managing and connecting, and sensor, such as oxygen, water vapour and solvent vapo(u)r sensor.Gas circulation unit, such as fan, air blast or motor etc., can be independently arranged or be integrally formed in such as gas purge system 2134, so that gas to cycle through gas purification loop 2130.Each embodiment according to gas confinement assembly, although solvent is removed system 2132 and gas purge system 2134 and is shown as separate unit in the schematic diagram shown in Figure 25, but solvent is removed together with system 2132 and gas purge system 2134 can be contained in as single clean unit.Heat regulating system 2140 can include at least one cooler 2141, and it can have the fluid issuing circuit 2143 for being recycled to by cooling agent in gas confinement assembly and be used for the fluid intake circuit 2145 making cooling agent return cooler.
The gas purification loop 2130 of Figure 25 can have the solvent removal system 2132 being arranged on gas purge system 2134 upstream, thus removes system 2132 via egress line 2131 by solvent from the inert gas of gas confinement assembly 1500 circulation.According to each embodiment, system 2132 removed by solvent can be based on the solvent capture systems from the inert gas lyosoption steam being removed system 2132 by the solvent of Figure 25.Sorbent bed or multiple beds, such as but not limited to activated carbon, molecular sieve etc., can remove the various organic vapors of wide scope effectively.For each embodiment of gas confinement assembly, cold capture technique can be used, to remove the solvent vapo(u)r in solvent removal system 2132.As mentioned before, each embodiment of gas confinement assembly for instructing according to this, sensor can be used, such as oxygen, water vapour and solvent vapo(u)r sensor, to monitor the effective removal from the inert gas being continuously circulated through gas confinement component system (such as, the gas confinement component system 2100 of Figure 25) of this material.Solvent is removed each embodiment of system and be may indicate that when absorbent (such as activated carbon, molecular sieve etc.) arrives capacity, thus sorbent bed or multiple bed can regenerate or change.The regeneration of molecular sieve can include heating molecular sieve so that molecular sieve contacts with forming gas, and combinations thereof etc..The molecular sieve being configured to capture each material (including oxygen, water vapour and solvent) can include the forming gas of hydrogen (such as by heating and being exposed to, nitrogen including about 96% and the forming gas of the hydrogen of 4%) and regenerate, described percentage is volume ratio or weight ratio.The physics regeneration of activated carbon can use the similar procedure heated in an inert atmosphere to complete.
Any suitable gas cleaning system may be used to the gas purge system 2134 of the gas purification loop 2130 of Figure 25.Such as, can be from MBRAUN Inc., of Statham, New Hampshire or Innovative The gas purge system that Technology of Amesbury, Massachusetts obtain can be used for being integrally formed in each embodiment according to this gas confinement assembly instructed.Gas purge system 2134 may be used for purifying one or more inert gases in gas confinement assembly and system 2100, such as, to purify all gas environment in gas confinement assembly.As it was noted above, so that gas cycles through gas purification loop 2130, gas purge system 2134 can have gas circulation unit, such as fan, air blast or motor etc..In this respect, gas purge system can select according to the volume of locking device, and it can limit for making inert gas be moved through the volume flow rate of gas purge system.For including having up to about 4 m3The gas confinement assembly of gas confinement assembly of volume and each embodiment of system；Can use and can move about 84 m3The gas purge system of/h.For including having up to about 10 m3The gas confinement assembly of gas confinement assembly of volume and each embodiment of system；Can use and can move about 155 m3The gas purge system of/h.For having about 52-114 m3Between each embodiment of gas confinement assembly of volume；More than one gas purge system can be used.
Any suitable gas filter or purifier can be included in the gas purge system 2134 of this teaching.In certain embodiments, gas purge system can include two purifiers in parallel, thus a device can be taken away for maintenance with off-line, and another device may be used for the operation of continuation system, and does not interrupt.In certain embodiments, such as, gas purge system can include one or more molecular sieve.In certain embodiments, gas purge system can at least include the first molecular sieve and the second molecular sieve, thus it is saturated at molecular sieve impurity or otherwise think that when can not sufficiently effective operate, system can be switched to another molecular sieve, regenerates the saturated or molecular sieve of poor efficiency simultaneously.Control unit can provide the operating efficiency for determining each molecular sieve, switches between the operation at different molecular sieve, is used for regenerating one or more molecular sieve, or for a combination thereof.As it was noted above, molecular sieve can be reproduced and reuse.
About the heat regulating system 2140 of Figure 25, at least one fluid cooler 2141 can be set, for cooling down the gaseous environment in gas confinement assembly and system 2100.For each embodiment of this gas confinement assembly instructed, cooling fluid is flowed to the heat exchanger in locking device by fluid cooler 2141, and wherein, inert gas is through the filtration system within locking device.At least one fluid cooler can also be arranged in gas confinement assembly and system 2100, the heat of the equipment encapsulated in coming from gas lock 2100 with cooling.Such as but not limited to, at least one fluid cooler may be provided for gas confinement assembly and system 2100, comes from the heat of OLED print system with cooling.Heat regulating system 2140 can include heat exchange or Peltier device, and can have various cooling capacity.Such as, for each embodiment of gas confinement assembly and system, cooler can be provided in the cooling capacity between about 2 kW to about 20 kW.Fluid cooler 1136 and 1138 can cool down one or more fluids.In certain embodiments, fluid cooler can use multiple fluid as cooling agent, such as but not limited to, water, antifreezing agent, cold-producing medium and combinations thereof, as heat-exchange fluid.Suitably No leakage locking connection may be used for connecting about pipe and system unit.
As shown in Figure 26 and Figure 27, one or more fan filter units can be configured to provide the substantially laminar flow by internal gas.According to each embodiment of the gas confinement assembly instructed according to this, one or more fan units are arranged close to the first inner surface of gaseous environment locking device, and one or more pipe-line system entrances are arranged close to relative second inner surface of gaseous environment locking device.Such as, gaseous environment locking device can include inner top and bottom inner rim, the one or more fan unit can be arranged close to inner top, the one or more pipe-line system entrance can include the multiple entrance openings being arranged close to bottom inner rim, it is a part for pipe-line system, as seen in figs. 15-17.
Figure 26 is the sectional view of the length intercepting along the gas confinement assembly according to this each embodiment instructed and system 2000.The gas confinement assembly of Figure 26 and system 2000 can include that the gas lock 1500 that can accommodate OLED print system 50 and gas purge system 2130(are referring also to Figure 25), heat regulating system 2140, filter and the circulatory system 2150 and pipe-line system 2170.Heat regulating system 2140 can include the fluid cooler 2141 being in fluid communication with cooler outlet circuit 2143 and cooler inlet line 2145.Cooling fluid may exit off fluid cooler 2141, flowing is by cooler outlet circuit 2143, and flow to heat exchanger, for the gas confinement assembly shown in Figure 26 and each embodiment of system, its may be located in multiple fan filter unit each near.Fluid can return cooler 2141, to be maintained at constant preferred temperature by cooler inlet line 2145 by the heat exchanger near fan filter unit.As it was noted above, cooler outlet circuit 2141 connects with multiple heat exchanger fluid with cooler inlet line 2143, including the first heat exchanger the 2142, second heat exchanger 2144 and the 3rd heat exchanger 2146.According to the gas confinement assembly shown in Figure 26 and each embodiment of system, first heat exchanger the 2142, second heat exchanger 2144 and the 3rd heat exchanger 2146 respectively with the first fan filter unit the 2152, second fan filter unit 2154 and three fan filter unit 2156 thermal communication of filtration system 2150.
In fig. 26, many arrows show the flowing of each fan filter unit round, and also show the flowing within including the pipe-line system 2170 of the first pipe-line system pipe 2173 and second pipe system pipes 2174, as shown in the rough schematic view of Figure 26.First pipe-line system pipe 2173 can be received gas by the first entrance 2171 and can be discharged by the first pipe outlet 2175.Similarly, second pipe system pipes 2174 can receive gas and by second pipe outlet 2176 discharge by second pipe entrance 2172.Additionally, as shown in figure 26, pipe-line system 2170 will be again circulated through the inert gas of filtration system 2150 separately by effectively limiting space 2180 in inside, and space 2180 is in fluid communication with gas purge system 2130 via gas purification egress line 2131.The circulatory system of this each embodiment included for the pipe-line system described in Figure 15-17 provides substantially laminar flow, minimize turbulent flow, promote the circulation of the particulate matter of the gaseous environment in locking device inside, have enough to meet the need and filter, and offer is by the circulation of the gas purge system of gas confinement component external.
Figure 27 is the sectional view intercepted along the gas confinement assembly of each embodiment according to this gas confinement assembly instructed and the length of system 23000.Similar with the gas confinement assembly 2200 of Figure 26, the gas confinement component system 2300 of Figure 27 can include gas lock 1500, and it can accommodate OLED print system 50 and gas purge system 2130(referring also to Figure 25), heat regulating system 2140, filter and the circulatory system 2150 and pipe-line system 2170.Each embodiment for gas confinement assembly 2300, heat regulating system 2140 can include the fluid cooler 2141 being in fluid communication with cooler outlet circuit 2143 and cooler inlet line 2145, can connect with multiple heat exchanger fluid, such as first heat exchanger 2142 and the second heat exchanger 2144, as shown in figure 27.According to the gas confinement assembly shown in Figure 27 and each embodiment of system, each heat exchanger, such as first heat exchanger 2142 and the second heat exchanger 2144, can be with the inert gas thermal communication of circulation, by being located close to pipe outlet, the first pipe outlet 2175 of such as pipe-line system 2170 and second pipe outlet 2176.In this respect, return from entrance (the first entrance 2171 of such as pipe-line system 2170 and second pipe entrance 2172) so that the inert gas filtered can be thermally regulated before cycling through first fan filter unit 2152, second fan filter unit 2154 of filtration system 2150 of such as Figure 27 and three fan filter unit 2156 respectively.
Arrow from the direction of the inert gas showing the locking device cycling through Figure 26 and 27 is it can be seen that fan filter unit is configured to provide from locking device top down towards the substantially laminar flow of bottom.Such as, can be from Flanders Corporation, of Washington, North Carolina or Envirco The fan filter unit that Corporation of Sanford, North Carolina obtain can be used for being formed integral in each embodiment according to this gas confinement assembly instructed.Each embodiment of fan filter unit can exchange between about 350 cubic feet/minute (CFM) to about 700 CFM of the inert gas by each unit.As shown in figures 26 and 27, owing to fan filter unit is in parallel connection rather than is arranged in series, thus the amount of the inert gas that can exchange in the system including multiple fan filter unit is proportional to the element number of use.At the near-bottom of locking device, gas stream guides towards multiple pipe-line system entrances, is schematically illustrated as the first entrance 2171 and second pipe entrance 2172 in Figure 26 and 27.As described previously for described in Figure 15-17, entrance it is positioned at the approximate bottom of locking device and makes the good turnover of gas gaseous environment in upper fan filter unit flows downward beneficially locking device, and promoting the thoroughly turnover of all gas environment by the gas purge system being used in combination with locking device and mobile.By using the laminar flow of gaseous environment and thoroughly turnover filtered in making gaseous environment cycle through pipe-line system and promote locking device with the circulatory system 2150, pipe-line system would circulate through the inert gas flow of gas purification loop 2130 separately, the level of every kind of reactive materials (such as water and oxygen, and every kind of solvent) may remain in such as 100 in each embodiment of gas confinement assembly Ppm or lower, such as 1.0 ppm or lower, 0.1 Ppm or lower.
According to each embodiment of the gas confinement component system for OLED print system, the quantity of fan filter unit can select according to the physical location of the substrate in print system during process.Therefore, although in Figure 26 and 27, show 3 fan filter units, but the quantity of fan filter unit can change.Such as, Figure 28 is the sectional view of the length intercepting along gas confinement assembly and system 2400, and it is similar with the gas confinement assembly shown in Figure 23 and Figure 24 and system.Gas confinement assembly and system 2400 can include gas confinement assembly 1500, and it accommodates the OLED print system 50 being supported on base portion 52.The substrate suspending bench 54 of OLED print system is limited to substrate during the OLED of substrate prints and may move through the stroke of system 2400.Thus, the filtration system 2150 of gas confinement assembly and system 2400 has appropriate number of fan filter unit；Shown in 2151-2155, corresponding by the physics stroke of OLED print system 50 with substrate during process.In addition, the schematic cross sectional representation of Figure 28 has gone out the fixed wheel exterior feature of each embodiment of gas lock can efficiently reduce inert gas volume required during OLED print procedure, and it is (the most close during process to simultaneously facilitate the inside close to gas lock 1500, such as use and be arranged on the gloves in each gloves port, or be immediately adjacent to by various detachable panels in the case of attended operation).
Each embodiment of gas lock and system can use pressurized inert gas recirculating system, is used for operating various pneumatic operation device and equipment.Additionally, as it was noted above, the embodiment of the gas confinement assembly of this teaching can be maintained at slight positive pressure relative to external environment condition, such as but not limited to about 2 Between mbarg to about 8 mbarg.Pressurized inert gas recirculating system is kept to be probably challenge in gas confinement component system, because it has and keep a relevant balance play dynamically and persistently carried out of the slight positive internal pressure of gas confinement assembly and system, and simultaneously continuously introduce gas-pressurized in gas confinement assembly and system.Additionally, the variable demand of each device and equipment is likely to be formed various gas confinement assemblies and the irregular pressure curve of system of this teaching.Keep dynamic pressure balance can provide the globality of OLED print procedure being used for persistently carrying out the gas confinement assembly being maintained at slight positive pressure relative to external environment condition under these conditions.
As shown in figure 29, each embodiment of gas confinement assembly and system 3000 can have extraneous gas loop 2500, for integrating and control to be used for inert gas source 2509 and clean dry air (CDA) source 2512 of the various aspects of the operation of gas confinement assembly and system 3000.It will be appreciated by the skilled addressee that gas confinement system 3000 can also include that internal particle filters each embodiment with gas-circulating system and each embodiment of extraneous gas cleaning system, as mentioned before.Except in addition to integrating and controlling the external circuit 2500 in inert gas source 2509 and CDA source 2512, gas confinement assembly and system 3000 can have compressor loop 2160, it can may be arranged on each device in gas confinement assembly and system 3000 inside and equipment with supplying inert gas for operation.
The compressor loop 2160 of Figure 29 can include compressor the 2162, first reservoir 2164 and the second reservoir 2168 being configured to fluid communication.Compressor 2162 can be configured to the inert gas aspirated from gas confinement assembly 1500 is compressed to desired pressure.The entrance side of compressor loop 2160 can be in fluid communication with gas confinement assembly 1500 by having the circuit 2503 of valve 2505 and check-valves 2507 via gas confinement module outlet 2501.Compressor loop 2160 can be in fluid communication with gas confinement assembly 1500 via extraneous gas loop 2500 on the outlet side of compressor loop 2160.Reservoir 2164 can be arranged between the joint portion in compressor 2162 and compressor loop 2160 and extraneous gas loop 2500, and can be configured to produce 5 psig or higher pressure.Second reservoir 2168 may be in compressor loop 2160, circulates, due to compressor piston, the fluctuation caused for damping with about 60 Hz.For each embodiment of compressor loop 2160, the first reservoir 2164 can have the capacity between about 80 gallons to about 160 gallons, and the second reservoir can have the capacity between about 30 gallons to about 60 gallons.According to each embodiment of gas confinement assembly and system 3000, compressor 2162 can be zero entrance compressor (zero ingress Compressor).Various types of zero enter compressors can in each embodiment of the gas confinement assembly not having environmental gas to leak into this teaching and system in the case of operation.Zero each embodiment entering compressor can be run continuously, such as during utilizing the OLED print procedure of purposes of each device and the equipment needing compressed inert.
Reservoir 2164 can be configured to receive from compressor 2162 and gather compressed inert.Compressed inert can be supplied to gas confinement assembly 1500 by reservoir 2164 when needed.Such as, reservoir 2164 can provide gas to keep the pressure of all parts of gas confinement assembly 1500, such as but not limited to one or more in following: pneumatic robot, substrate suspending bench, air bearing, air lining, compressed gas instrument, pneumatic actuator, and combinations thereof.If Figure 29 is for shown in gas confinement assembly and system 3000, gas confinement assembly 1500 can have and is encapsulated in OLED print system 50 therein.As shown in figure 24, OLED print system 50 can be supported by granite level 52, and can include substrate suspending bench 54, for by correct position in substrate feed to printhead chamber and support substrate during OLED print procedure.Use additionally, the air bearing 58 being supported on bridge 56 can replace such as linear mechanical bearing.The gas lock instructed for this and each embodiment of system, use various pneumatic operation device and equipment can provide low particles generation performance and low-maintenance cost.Compressor loop 2160 can be configured to be continuously fed to pressurized inert gas each device and the equipment of gas confinement equipment 3000.In addition to supply pressurized inert gas, its use air bearing technology of substrate suspending bench 54(of OLED print system 50) also use vacuum system 2550, vacuum system 2550 is connected with gas confinement assembly 1500 by circuit 2552 when valve 2554 is in an open position.
Can have as shown in figure 29 for the Stress control bypass circulation 2165 of compressor loop 2160 according to this pressurized inert gas recirculating system instructed, it is in order to compensate the variable demand of gas-pressurized during use, thus provides the gas confinement assembly of this teaching and the dynamic equilibrium of each embodiment of system.For the gas confinement assembly instructed according to this and each embodiment of system, bypass circulation can keep the constant pressure in reservoir 2164, and do not disturb or change the pressure in locking device 1500.Bypass circulation 2165 can have the first bypass inlet valve 2162 on the entrance side being positioned at bypass circulation 2165, and it is closed, unless used bypass circulation 2165.Bypass circulation 2165 can also have back pressure regulator, and it can use when the second valve 2163 cuts out.Bypass circulation 2165 can have the second reservoir 2168 at the outlet side being arranged on bypass circulation 2165.For using the embodiment of the compressor loop 2160 of zero entrance compressor, bypass circulation 2165 can compensate during gas confinement assembly and system use over time through the little skew of contingent pressure.When bypass inlet valve 2161 is in an open position, bypass circulation 2165 can be in fluid communication with compressor loop 2160 on the entrance side of bypass circulation 2165.When bypass inlet valve 2161 is opened, the inert gas if from compressor loop 2160 can not meet the needs in gas confinement assembly 1500 inside, then the inert gas shunted by bypass circulation 2165 can be recycled to compressor.When the inert gas pressure in reservoir 2164 exceedes predetermined threshold value pressure, compressor loop 2160 is configured to be diverted through inert gas bypass circulation 2165.The predetermined threshold value pressure of reservoir 2164 can be at about 25 psig to about 200 when the flow rate of at least about 1 cubic feet/minute (cfm) Between psig, or can be between about 50 psig to about 150 psig when the flow rate of at least about 1 cubic feet/minute (cfm), or can be at about 75 psig to about 125 when the flow rate of at least about 1 cubic feet/minute (cfm) Between psig, or can be between about 90 psig to about 95 psig when the flow rate of at least about 1 cubic feet/minute (cfm).
Each embodiment of compressor loop 2160 can use the various compressors in addition to zero enters compressor, and such as variable speed compressor maybe can be controlled in the compressor of the state of opening or closing.As it was noted above, zero entrance compressor guarantees do not have environment reaction material can introduce gas confinement assembly and system.Thus, any compressor configuration preventing environment reaction material from introducing gas confinement assembly and system may be used to compressor loop 2160.According to each embodiment, the compressor 2162 of gas confinement assembly and system 3000 can be contained in such as but not limited in gas-tight seal housing.Enclosure interior can be configured to and inert gas fluid communication, such as, form the identical inert gas of the inert gas environment of gas confinement assembly 1500.For each embodiment of compressor loop 2160, compressor 2162 can control in constant speed to keep constant pressure.In not using the other embodiments of compressor loop 2160 of zero entrance compressor, compressor 2162 can cut out when reaching max-thresholds pressure and open when minimizing threshold pressure.
In the Figure 30 for gas confinement assembly and system 3100, air blast loop 2170 and blower vacuum loop 2550 display are for operating the substrate suspending bench 54 of OLED print system 50, and it is contained in gas confinement assembly 1500.As described previously for described in compressor loop 2160, air blast loop 2170 can be configured to be continuously fed to pressurized inert gas substrate suspending bench 54.
The gas confinement assembly of pressurized inert gas recirculating system and each embodiment of system can be used can to have the various loops using various pressurized-gas sources, such as at least one in compressor, air blast and combinations thereof.In the Figure 30 for gas confinement assembly and system 3100, compressor loop 2160 can be in fluid communication with extraneous gas loop 2500, and it can be for being applied to high consumption manifold 2525 and the inert gas of low consumption manifold 2513.For the gas confinement assembly instructed according to this and each embodiment of system, as shown in the Figure 29 for gas confinement assembly and system 3000, the high manifold 2525 that consumes may be used for being supplied to inert gas various device and equipment, such as but not limited to one or more in following: substrate suspending bench, pneumatic robot, air bearing, air lining and compressed gas instrument, and combinations thereof.For the gas confinement assembly instructed according to this and each embodiment of system, low consumption manifold 2513 may be used for being supplied to inert gas various device and equipment, such as but not limited to one or more in following: isolator and pneumatic actuator and combinations thereof.
Each embodiment for gas confinement assembly and system 3100, air blast loop 2170 may be used for being supplied to pressurized inert gas each embodiment of substrate suspending bench 54, and may be used for being supplied to pressurized inert gas such as but not limited to one or more in following with the compressor loop 2160 of extraneous gas loop 2500 fluid communication: pneumatic robot, air bearing, air lining and compressed gas instrument, and combinations thereof.In addition to supply pressurized inert gas, the substrate suspending bench 54 using the OLED print system 50 of air bearing technology also uses blower vacuum system 2550, and blower vacuum system 2550 is connected with gas confinement assembly 1500 by circuit 2552 when valve 2554 is in an open position.Inert gas pressurized source can be supplied to the first air blast 2174 of substrate suspending bench 54 and the second air blast 2550 as the vacuum source of substrate suspending bench 54 to be maintained in inert gas environment by the housing 2172 in air blast loop 2170.The attribute that can manufacture the pressurized inert gas of each embodiment being suitable as substrate suspending bench or the air blast of vacuum source includes, but not limited to, e.g.: they have high reliability so that they have low-maintenance cost；There is variable speed control；And the volume flow with wide scope (can provide at about 100 m3/ h to about 2500 m3Each embodiment of volume flow between/h).Each embodiment in air blast loop 2170 can also have the first isolating valve 2173 at the arrival end of compressor loop 2170 and the check-valves at the port of export of compressor loop 2,170 2175 and the second isolating valve 2177.Each embodiment in air blast loop 2170 can have adjustable valve 2176(and can be such as but not limited to, sluice valve, butterfly valve, needle valve or globe valve) and for will be maintained at the heat exchanger 2178 of limiting temperature to the inert gas of substrate suspension system 54 from blower assembly 2170.
Figure 30 shows the extraneous gas loop 2500 that also figure 29 illustrates, and is used for inert gas source 2509 and clean dry air (CDA) source 2512 of the various aspects of the gas confinement assembly of Figure 29 and the operation of the gas confinement assembly of system 3000 and Figure 30 and system 3100 for integration and control.The extraneous gas loop 2500 of Figure 29 and Figure 30 can include at least four mechanical valve.These valves include the first mechanical valve the 2502, second mechanical valve the 2504, the 3rd mechanical valve 2506 and the 4th mechanical valve 2508.These each valves are positioned at the position in each flow circuits, it is allowed to control both inert gas (such as, nitrogen, any rare gas and any combination thereof) and air-source (such as, clean dry air (CDA)).Inert shell gas circuit 2510 extends from inert shell gas source 2509.Inert shell gas circuit 2510 continues to extend linearly as low consumption manifold line 2152, and low consumption manifold line 2152 is in fluid communication with low consumption manifold 2513.Cross link the first section 2514 extends from the first flowing joint portion 2516, and the first flowing joint portion 2516 is positioned at the cross part of inert shell gas circuit 2510, low consumption manifold line 2152 and cross link the first section 2514.Cross link the first section 2514 extends to the second flowing joint portion 2518.Compressor inert gas circuit 2520 extends from the reservoir 2164 of compressor loop 2160 and terminates at the second flowing joint portion 2518.CDA circuit 2522 extends from CDA source 2512 and consumes manifold line 2524 as height and continues, and the high manifold line 2524 that consumes is in fluid communication with the high manifold 2525 that consumes.3rd flow combinations portion 2526 is positioned at cross link the second section 2528, clean dry air circuit 2522 and the high cross part consuming manifold line 2524.Cross link the second section 2528 extends to the 3rd flow combinations portion 2526 from the second flowing joint portion 2518.
About description and the reference table 2 in extraneous gas loop 2500, the following is the general introduction of some each operator schemes, table 2 is the form of the valve position of each operator scheme of gas confinement assembly and system.
Table 2
Table 2 shows procedure schema, and wherein, valve state produces only inert gas compressor operator scheme.In procedure schema, as shown in figure 30 and as shown in the valve state of table 2, the first mechanical valve 2502 and the 3rd mechanical valve 2506 are in closedown configuration.Second mechanical valve 2504 and the 4th mechanical valve 2508 are in and open configuration.Owing to these concrete valves configure, compressed inert is allowed to flow to low consumption manifold 2513 and high consumption both manifolds 2525.Under normal operation, the inert gas coming from inert shell gas source and the clean dry air coming from CDA source are prevented from flowing to low consumption manifold 2513 and any one consumed in manifold 2525 high.
As shown in table 2 and with reference to Figure 30, there is the series of valves state for safeguarding and recover.The gas confinement assembly of this teaching can need to safeguard every now and then, needs from system failure recovery in addition.In this concrete pattern, the second mechanical valve 2504 and the 4th mechanical valve 2508 are in closedown configuration.First mechanical valve 2502 and the 3rd mechanical valve 2506 are in and open configuration.Inert shell gas source and CDA source provide inert gas, to be supplied to those parts being in the dead volume that low consumption and also having during restoration is difficult to effectively purge by low consumption manifold 2513.The example of this parts includes pneumatic actuator.Comparatively speaking, those parts of consumption can consume manifold 2525 by means of height during safeguarding and supply CDA.Valve 2504,2508,2530 isolation compressor is used to prevent reactive materials (such as, oxygen and water vapour) from polluting the inert gas in compressor and reservoir.
Safeguarding or after having recovered, gas confinement assembly by multiple cycle purge, must reach the of a sufficiently low level of every kind of material until reactive environments material (such as, oxygen and water), and such as 100 Ppm or lower, such as 10 ppm or lower, 1.0 Ppm or lower or 0.1 ppm or lower.As shown in table 2 and with reference to Figure 30, during purge mode, the 3rd mechanical valve 2506 is closed and the 5th mechanical valve 2530 is also at closing configuration.First mechanical valve the 2502, second mechanical valve 2504 and the 4th mechanical valve 2508 are in and open configuration.Owing to this concrete valve configures, only inert shell gas is allowed to flowing and is allowed to flow to low consumption manifold 2513 and high consumption both manifolds 2525.
As shown in table 2 and with reference to Figure 30, " without flowing " pattern and leak-testing pattern are the patterns used as required." without flowing " pattern is the pattern with the configuration of following valve state: first mechanical valve the 2502, second mechanical valve the 2504, the 3rd mechanical valve 2506 and the 4th mechanical valve 2508 are in closing configuration.This closedown configuration causes " without flowing " pattern of system, wherein, comes from any gas in inert gas, CDA or compressor source and all can not arrive low consumption manifold 2513 or high consumption manifold 2525.This " without flow pattern " is probably useful when system does not uses, and can keep the free time in extending the period.Leak-testing pattern may be used for the leakage in detecting system.Leak-testing pattern is used exclusively compressed inert, and system is isolated so that the low consumption parts (such as, isolator and pneumatic actuator) of low consumption manifold 2513 are carried out leak test by it from the high manifold 2525 that consumes of Figure 30.In this leak-testing pattern, the first mechanical valve the 2502, the 3rd mechanical valve 2506 and the 4th mechanical valve 2508 are in closing configuration.Only the second mechanical valve 2504 is in and opens configuration.Therefore, compressed nitrogen can flow to low consumption manifold 2513 from compressor inert gas source 2519, and does not has the gas stream of paramount consumption manifold 2525.
All publications, the patents and patent applications mentioned in this specification are all incorporated by reference into herein in degree identical being incorporated by reference into instruction independently specially as each individually disclosed thing, patents and patent applications.
Although embodiment of the disclosure being shown and described herein, but it will be apparent to one skilled in the art that this embodiment provides only by the mode of example.In the case of without departing from the disclosure, those skilled in the art are now it is appreciated that many modification, change and substitute.It should be appreciated that the various replacement schemes of disclosure embodiment as herein described can be used when putting into practice the disclosure.Claims are intended to limit the scope of the present disclosure, and thus contain the method and structure in the range of these appended claims and their equivalents.

Claims (28)

1. a gas confinement system, including:
Including the gas confinement assembly of multiple framing component assemblies, wherein, described framing component assembly is sealably combined to limit internal；
Inert gas environment, described inert gas environment is contained in described inside and includes being in water and the oxygen of 100 ppm or less level；And
Pressurized inert gas recirculating system, described pressurized inert gas recirculating system operatively couples pressurized inert gas is supplied to the one or more pneumatic means being arranged in described inside, and described pressurized inert gas recirculating system includes:
Compressor loop, described compressor loop includes and the entrance of described internal fluid communication and the outlet of described internal fluid communication, includes the compressor loop path of described entrance and exit, arranges compressor between the inlet along described compressor loop path and be arranged on the reservoir between compressor and outlet along described compressor loop path, wherein, described reservoir arrangements becomes supply pressurized inert gas, with operation setting the one or more pneumatic means in described inside.
Gas confinement system the most according to claim 1, also includes:
Stress control bypass circulation, wherein, bypass circulation entrance is in fluid communication with compressor loop via bypass inlet valve, and wherein, Bypass outlet position between bypass inlet valve and compressor is in fluid communication with compressor loop.
Gas confinement system the most according to claim 2, also includes:
Air blast loop, described air blast loop includes and the entrance of described internal fluid communication and the outlet of described internal fluid communication, the air blast loop path including described entrance and exit, the adjustable valve that is arranged on along described air blast loop path between air blast and outlet.
Gas confinement system the most according to claim 2, wherein, via Stress control bypass circulation to recycle pressurized inert gas when the pressure of the inert gas environment that described compressor loop is configured in reservoir exceedes predetermined threshold value pressure.
Gas confinement system the most according to claim 4, wherein, described predetermined threshold value pressure is from 25 psig to 200 psig.
Gas confinement system the most according to claim 1, wherein, the one or more pneumatic means selected from pneumatic robot, substrate suspending bench, air bearing, air lining, compressed gas instrument, pneumatic actuator, and combinations thereof.
Gas confinement system the most according to claim 1, wherein, the seal formed for each framing component assembly sealably combined is gasket seal.
Gas confinement system the most according to claim 7, wherein, gasket seal is made up of closed air chamber polymeric material.
Gas confinement system the most according to claim 1, wherein, each framing component assembly includes the framing component with multiple panel section, and wherein, each panel section has the panel being sealably mounted in each panel section.
Gas confinement system the most according to claim 9, wherein, each panel is sealably mounted in each panel section via gasket seal.
11. gas confinement systems according to claim 10, wherein, gasket seal is made up of closed air chamber polymeric material.
12. gas confinement systems according to claim 1, wherein, gas confinement assembly is hermetically sealed.
13. gas confinement systems according to claim 1, wherein, the inert gas environment in described inside is maintained above the internal pressure of environmental pressure.
14. gas confinement systems according to claim 13, wherein, described internal pressure is in the scope from 2 mbarg to 8 mbarg.
15. gas confinement systems according to claim 13, wherein, described internal pressure is less than the pressure of the pressurized inert gas supply of the one or more pneumatic means.
16. gas confinement systems according to claim 1, wherein, described inert gas environment is inert for the flat-panel monitor print procedure performed in gas confinement system.
17. gas confinement systems according to claim 16, wherein, described inert gas environment is nitrogen environment.
18. gas confinement systems according to claim 1, also include the ink jet printing device being arranged in described inside.
19. gas confinement systems according to claim 1, also include gas circulation and filtration system.
20. gas confinement systems according to claim 1, also include the printing device being arranged in the inside of described gas confinement system.
21. gas confinement systems according to claim 20, wherein, printing device includes:
At least one printhead；
Substrate support equipment；With
Kinematic system, described kinematic system is configured to apply described relative movement between at least one printhead and substrate.
22. gas confinement systems according to claim 21, wherein, substrate support equipment includes suspending bench.
23. gas confinement systems according to claim 22, wherein, the export operation ground of pressurized inert gas recirculating system couples, so that pressurized inert gas flow to suspending bench.
24. gas confinement systems according to claim 20, wherein, described inert gas environment is nitrogen environment.
25. gas confinement systems according to claim 20, wherein, described inside is maintained above the pressure of environmental pressure.
26. gas confinement systems according to claim 20, wherein, printing device is configured to ink is distributed to substrate, for flat-panel monitor manufacture.
27. gas confinement systems according to claim 20, wherein, described inert gas environment is inert to the print procedure performed via printing device.
28. gas confinement systems according to claim 20, wherein, the described inert gas environment flat-panel monitor manufacture process to performing via described printing device is inert.
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CN106274054B (en) 2018-04-17
CN203666124U (en) 2014-06-25

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