CN103171286A - Gas enclosure assembly and system - Google Patents

Gas enclosure assembly and system Download PDF

Info

Publication number
CN103171286A
CN103171286A CN2012105965721A CN201210596572A CN103171286A CN 103171286 A CN103171286 A CN 103171286A CN 2012105965721 A CN2012105965721 A CN 2012105965721A CN 201210596572 A CN201210596572 A CN 201210596572A CN 103171286 A CN103171286 A CN 103171286A
Authority
CN
China
Prior art keywords
gas
closed component
panel
gas closed
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2012105965721A
Other languages
Chinese (zh)
Other versions
CN103171286B (en
Inventor
J·莫克
A·S-K·柯
E·弗伦斯基
S·奥尔德森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kedihua display technology (Shaoxing) Co., Ltd
Original Assignee
Kateeva Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/720,830 external-priority patent/US8899171B2/en
Application filed by Kateeva Inc filed Critical Kateeva Inc
Priority to CN201610692510.9A priority Critical patent/CN106274054B/en
Priority to CN201610837821.XA priority patent/CN107029931B/en
Publication of CN103171286A publication Critical patent/CN103171286A/en
Application granted granted Critical
Publication of CN103171286B publication Critical patent/CN103171286B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B05B17/0607Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
    • B05B17/0638Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • B41J29/393Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/14Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/811Controlling the atmosphere during processing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

Description

Gas closed component and system
The cross reference of related application
The application requires in the U. S. application No.61/579 of submission on December 22nd, 2011,233 priority.This application requires to submit to and the U. S. application No.12/652 as the US2010/0201749 announcement on August 12nd, 2010 January 5,040 priority, it requires again to submit to and the U. S. application No.12/139 as the US2008/0311307 announcement on December 18th, 2008 on June 13rd, 2008,391 priority, and also require in the U. S. application No.61/142 of submission on January 5th, 2009,575 priority.The reference in its entirety of applying for of all cross references that this paper enumerates is introduced.
Technical field
This instruction relates to each embodiment of gas-tight seal gas closed component and system, described gas closed component and system can easily carry and assemble, and each device and the equipment being arranged to keep minimum inert gas volume and farthest approaching wherein encapsulation.
Background technology
The interest of the potential of OLED Display Technique by OLED Display Technique attribute drive, is comprised that the display floater that represents has HI SA highly saturated color, be high-contrast, ultra-thin, fast response and energy efficient.In addition, various base materials comprise flexible polymeric material, can be used for the manufacturing of OLED Display Technique.Although be used for the small screen use (being mainly cell phone) display represent the potential that is used for emphasizing this technology, remain challenge when zooming to this manufacturing than large format.For example, make the OLED display on than the larger substrate of Gen5.5 substrate (size with about 130cm * 150cm) and still remain demonstration.
Organic Light Emitting Diode (OLED) device can be by printing various organic films with the OLED print system and other material is made in substrate.This organic material may be easy to be subject to the infringement of oxidation and other chemical process.With can convergent-divergent be used for various size of foundation base and can be in inertia, there is no that mode that the printing environment of particle carries out holds the OLED print system and may have a plurality of challenges.Need a large amount of spaces because be used for the facility of printing large format panel substrate printing, thereby large facility is remained on needs gas purification to have significant engineering challenge under the inert environments of removing reactive environments material (for example, water vapour and oxygen) and organic vapor continuously.For example, provide the large facility that is hermetically sealed to have the engineering challenge.In addition, present turnover OLED print system so that various cables, line and the pipeline of operation print system may have challenge, in order to make the gas locking device about environment composition (for example effectively reach, oxygen and water vapour) the specification of level because they may produce the remarkable dead volume that can hold back this reactive materials.In addition, this facility that expectation remains on for the inert environments of process is easy to approach, so that with safeguarding minimum downtime.Except there is no reactive materials, the printing environment of OLED device needs significantly low particle environment.In this respect, provide in complete closed system and the environment that keeps there is no particle have can (for example under open air, high flow capacity laminar flow filter mantle) carries out in atmospheric conditions particle reduce the unexistent additional challenges of process.
Therefore; a plurality of embodiment that need the gas locking device; described gas locking device can be in inertia, hold the OLED print system in there is no the environment of particle; and easily convergent-divergent is to make oled panel on various size of foundation base and base material; also be easy to simultaneously from the outside near the OLED print system during process and be easy to approach inner so that with minimum maintenance downtime.
Description of drawings
By the reference accompanying drawing, will obtain the better understanding of feature and advantage of the present disclosure, accompanying drawing is intended to explanation rather than limits this instruction.
Fig. 1 is according to the gas closed component of each embodiment of this instruction and the schematic diagram of system.
Fig. 2 is according to the gas closed component of each embodiment of this instruction and the left front stereogram of system.
Fig. 3 is the right front stereogram according to the gas closed component of each embodiment of this instruction.
Fig. 4 is the exploded view according to the gas closed component of each embodiment of this instruction.
Fig. 5 is the exploded front stereogram according to the framing component assembly of each embodiment of this instruction, illustrates each panel frame section's section and section's section panel.
Fig. 6 A is the perspective rear view of gloves port cover cap (gloveport cap), and Fig. 6 B is the enlarged drawing according to the shoulder screw of the gloves port cover cap of each embodiment of the gas closed component of this instruction.
Fig. 7 A is the amplification stereogram of the snap lock latch (bayonet latch) of gloves port cover assembly, and Fig. 7 B is the sectional view of gloves port cover assembly, shows the head of shoulder screw and engages with recess in snap lock latch.
Fig. 8 A-8C is the schematic plan of each embodiment that is used to form the gasket seal of joint.
Fig. 9 A and Fig. 9 B are that diagram is according to each stereogram of the sealing of the framing component of each embodiment of the gas closed component of this instruction.
Figure 10 A-10B is and each figure relevant according to the sealing that is used for receiving easy section's section panel of detachable maintaining window of each embodiment of the gas closed component of this instruction.
Figure 11 A-11B is and is used for receiving the relevant amplification perspective, cut-away view of the sealing of the section's section panel that inserts panel or window panel according to each embodiment of this instruction.
Figure 12 A is the base portion according to each embodiment of this instruction, and described base portion comprises dish and sits a plurality of cushion blocks of putting thereon.Figure 12 B is the amplification stereogram of the cushion block shown in Figure 12 A.
Figure 13 is according to the wall framing component relevant with dish of each embodiment of this instruction and the exploded view of top plate member.
Figure 14 A is the stereogram according to the structure stage of the gas closed component of each embodiment of this instruction, and wherein, the lifter assembly is in raised position.Figure 14 B is the exploded view of the lifter assembly shown in Figure 14 A.
Figure 15 is the imaginary front perspective view according to the gas closed component of each embodiment of this instruction, shows the pipe-line system that is arranged in gas closed component inside.
Figure 16 is the imaginary top perspective view according to the gas closed component of each embodiment of this instruction, shows the pipe-line system that is arranged in gas closed component inside.
Figure 17 is the imaginary face upwarding stereogram according to the gas closed component of each embodiment of this instruction, shows the pipe-line system that is arranged in gas closed component inside.
Figure 18 A shows the schematic diagram of multi beam cable, line and pipeline etc.Figure 18 B shows that gas is inswept to be fed by this bundle according to each embodiment of the pipe-line system of this instruction.
Figure 19 is schematic diagram, and how the reactive materials (A) that shows in the dead band that is trapped in multi beam cable, circuit and pipeline etc. initiatively purges from the inert gas (B) of inswept pipeline, and described wiring in bundles is by described pipeline.
Figure 20 A passes through the cable of pipeline and the imaginary stereogram of pipeline according to the wiring of each embodiment of the gas closed component of this instruction and system.Figure 20 B is according to the enlarged drawing of the opening shown in Figure 20 A of each embodiment of the gas closed component of this instruction, shows be used to the details that is enclosed in the lid on opening.
Figure 21 is the view that comprises according to the top board of the illuminator of the gas closed component of each embodiment of this instruction and system.
Figure 22 is curve map, illustrates the LED spectrum according to the illuminator of the gas closed component of each embodiment of this instruction and system unit.
Figure 23 is the front perspective view according to the view of the gas closed component of each embodiment of this instruction.
Figure 24 illustrates the exploded view according to each embodiment of the gas closed component shown in Figure 23 of each embodiment of this instruction and relevant system unit.
Figure 25 is the schematic diagram of each embodiment of the gas closed component of this instruction and relevant system unit.
Figure 26 is according to the gas closed component of each embodiment of this instruction and the schematic diagram of system, illustrates the embodiment by the gas circulation of gas closed component.
Figure 27 is according to the gas closed component of each embodiment of this instruction and the schematic diagram of system, illustrates the embodiment by the gas circulation of gas closed component.
Figure 28 is the schematic cross-section according to the gas closed component of each embodiment of this instruction.
Figure 29 is according to the gas closed component of each embodiment of this instruction and the schematic diagram of system.
Figure 30 is according to the gas closed component of each embodiment of this instruction and the schematic diagram of system.
Figure 31 is the form according to each embodiment of this instruction, shows the valve position of each operator scheme of the gas closed component that can use the extraneous gas loop and system.
The specific embodiment
This instruction discloses each embodiment of gas closed component; described gas closed component can sealably build and integral body is formed with gas circulation, filtration and purifying part to form gas closed component and the system that can keep inertia, there is no the particle environment, needing to be used for the process of this environment.This embodiment of gas closed component and system can (comprise various reactive ambient gas may with various reactive materials, for example water vapour and oxygen, and organic vapor) the level of every kind of material for example remain on 100ppm or lower, 10ppm or lower, 1.0ppm or lower or 0.1ppm or lower.In addition, each embodiment of gas closed component can provide the low particle environment of 3 grades and 4 grades toilet's standards that satisfy ISO14644.
The those of ordinary skill of every field can expect that the embodiment of gas closed component is in the practicality of each technical field.Although extremely this instruction can be benefited from different fields (for example, chemistry, biotechnology, new and high technology and pharmaceutical field), OLED prints for the practicality of illustration according to each embodiment of the gas closed component of this instruction and system.Each embodiment that can hold the gas closed component system of OLED print system can provide such as but not limited to following feature: sealing provides the locking device of gas-tight seal through a plurality of structures and destructing circulation, minimize enclosed volume, and be easy to approach inside from the outside during process and during safeguarding.As subsequent discussion; this feature of each embodiment of gas closed component can have the impact on function; such as but not limited to; structural integrity makes and is easy to keep the low-level of reactive materials during process, and the downtime of fast packing volume turnover minimum maintenance cycle period.Thereby, provide each feature and the explanation of the practicality of oled panel printing to provide benefit to various technical fields.
As mentioned before, for example, make the OLED display on than the larger substrate of Gen5.5 substrate (size with about 130cm * 150cm) and still remain demonstration.For the flat-panel monitor of being made by the printing outside OLED, in the generation of mother glass size of foundation base, stood to develop since about nineties in 20th century is early stage.The first generation of mother glass substrate (being expressed as Gen1) is about 30cm * 40cm, thereby can produce 15 " panel.About the mid-90 in 20th century, the prior art of producing flat-panel monitor has developed into the mother glass size of foundation base of Gen3.5, has the size of about 60cm * 72cm.
Along with the propelling in each generation, the mother glass size that is used for Gen7.5 and Gen8.5 is produced the printing manufacture process that is used for outside OLED.The Gen7.5 mother glass has the size of about 195cm * 225cm, and each substrate can cut into eight 42 " or six 47 " flat board.The mother glass that uses in Gen8.5 is about 220 * 250cm, and each substrate can cut into six 55 " or eight 46 " flat board.The OLED flat-panel monitor realizes the promise of quality (for example, purer color, higher contrast, thin, flexible, transparency and energy efficiency), and simultaneously, OLED makes and is limited in practice Gen3.5 and less.Current, OLED prints the best manufacturing technology that is considered to break through this restriction, and allows the oled panel manufacturing not only to be used for Gen3.5 and less mother glass size, and is used for the maximum sample glass size, for example, and Gen5.5, Gen7.5 and Gen8.5.It will be appreciated by the skilled addressee that a feature that oled panel is printed comprises can use various base materials, such as but not limited to, various glass substrate material and various Polymers bottom material.In this respect, come from the substrate that the size of using based on the term record of the substrate of glass can be applied to be applicable to any material that OLED prints.
Print about OLED, according to this instruction, have been found that keep remarkable low-level reactive materials (such as but not limited to, environment composition, for example oxygen and water vapour, and the various organic vapors that use in the OLED China ink) the OLED flat-panel monitor that satisfies necessary life-span specification is relevant with providing.The life-span specification is for oled panel technology particular importance, because this is directly related with the display product time limit; The product specification of all panel technology is current to be difficult to satisfy for the oled panel technology.Each embodiment by means of the gas closed component system of this instruction, for the panel that satisfies necessary life-span specification is provided, the level of every kind of reactive materials (for example, water vapour, oxygen and organic vapor) for example can remain on 100ppm or lower, 10ppm or lower, 1.0ppm or lower or 0.1ppm or lower.In addition, OLED prints the environment that need to there is no particle.Print for OLED, keep there is no the environment particular importance of particle, even because very little particle also may cause the visible defects on oled panel.Current, the OLED display satisfies the required low defect level of commercialization challenge.Keep there is no in complete closed system the particle environment have can (for example under open air, high flow capacity laminar flow filter mantle) carries out in atmospheric conditions particle reduce the unexistent additional challenges of process.Thereby, keep inertia in large facility, may have various challenges without the necessary specification of particle environment.
Illustrate when printing the information that the needs of oled panel can summarize in checking table 1 in the level of every kind of reactive materials (for example, water vapour, oxygen and organic vapor) can remain on 100ppm for example or lower, 10ppm or lower, 1.0ppm or lower or 0.1ppm or lower facility.On table 1, the data of general introduction come from for every kind in red, green and blueness and are comprising that each test sample with the organic film composition of large pixel, the manufacturing of spin coating device breadth tests.This test sample is easier to Computer-Assisted Design, Manufacture And Test significantly, to be used for the rapid evaluation purpose of various preparations and process.Although test sample test should not obscured with the life test of printing panel, it can represent the impact on the life-span of various preparations and process.Result shown in following table represents the variation of the process steps that test sample is made, wherein, compare with the test sample of (but in air rather than in nitrogen environment) manufacturing similarly, only the spin coating environment changes for the test sample of making in nitrogen environment (wherein, reactive materials is less than 1ppm).
Can be clear by the data of checking the test sample that being used in table 1 makes under the various process environment, especially in the situation that red and blue, print in effectively reducing the organic film composition and be exposed to the environment of reactive materials can on the stability of various EL with thereby the life-span is had appreciable impact.
Figure BSA00000839025100071
Table 1: the impact of inert gas process on the oled panel life-span
Thereby, challenge OLED being printed zoom to Gen8.5 from Gen3.5 and more to provide during Datong District to exist aspect the firm closed system that can hold the OLED print system inertia there is no the gas enclosed environment of particle.What can imagine is; according to this instruction; this gas locking device will have the attribute that comprises such as but not limited to following: the gas locking device can be easy to convergent-divergent to be provided for the Optimization Work space of OLED print system; minimum inert gas volume is provided simultaneously; and also be easy to during process from the outside near the OLED print system, be easy to simultaneously approach inner so that with minimum maintenance downtime.
According to each embodiment of this instruction, a kind of gas closed component of the various air-sensitive processes be used to needing inert environments is provided, can comprise a plurality of wall frameworks and the top board framing component that can be sealed.In certain embodiments, a plurality of wall frameworks and top board framing component can use reusable securing member to tighten together, for example bolt and screwed hole.For each embodiment according to the gas closed component of this instruction, a plurality of framing components can be built into and limit gas closed frame assembly, and each framing component comprises a plurality of panel frame section section.
The gas closed component of this instruction can be designed to the mode containment with the enclosed volume around can minimization system, for example OLED print system.Each embodiment of gas closed component can with the internal capacity of minimum gas closed component and simultaneously the Optimization Work space build in the mode of the various floor spaces (footprint, or footprint) of holding various OLED print systems.Each embodiment of the gas closed component that so builds also be easy to during process from the outside near the inside of gas closed component and be easy to approach inner in order to safeguard, simultaneous minimization downtime.In this respect, can be wide about the various floor space fixed wheels of various OLED print systems according to each embodiment of the gas closed component of this instruction.According to each embodiment, in case the wide framing component of fixed wheel is fabricated to form gas closed frame assembly, various types of panels just can sealably be arranged in a plurality of panel part sections that comprise framing component, to complete the installation of gas closed component.In each embodiment of gas closed component, can be a position or a plurality of position make a plurality of framing components (comprise such as but not limited to, a plurality of wall framing components and at least one top board framing component) and a plurality of panels of being used for being arranged on panel frame section section, and then build in another position.In addition, but the transport properties of the parts of given gas closed component for building this instruction, and each embodiment of gas closed component can mount and dismount through a plurality of structures and destructing with being cycled to repeat.
Be hermetically sealed in order to ensure the gas locking device, each embodiment of the gas closed component of this instruction is provided in conjunction with each framing component so that frame seal to be provided.By the close fit cross part between each framing component (comprising pad or other seal), inside can fully be sealed, for example gas-tight seal.In case build fully, the gas closed component of sealing can comprise inner and a plurality of inner corners edges, and at least one inner corners edge is arranged on the cross part place of each framing component and adjacent frame member.One or more in framing component, for example in framing component at least half, can comprise along the fixing one or more sealant compressible shims of its one or more respective edges.Described one or more sealant compressible shim can be configured in case a plurality of framing components combine and panel that airtight body is installed just produces gas-tight seal gas closed component.The gas closed component of sealing can form the corner edge that makes framing component and be sealed by a plurality of sealant compressible shims.For each framing component, such as but not limited to interior wall framework surface, roof framework surface, upright side walls framework surface, diapire framework surface and combination thereof, can be provided with one or more sealant compressible shims.
Each embodiment for the gas closed component, each framing component can comprise a plurality of sections, described a plurality of sections are designed and manufactured as reception can sealably be arranged on any in various panel type in each section, with the panel sealing of the airtight body that is provided for each panel.In each embodiment of the gas closed component of this instruction, each segment frames can have section's segment frames pad, thereby each panel that described segment frames pad guaranteed to be arranged in each segment frames by means of selected securing member can be provided for each panel and be used for building fully the sealing of the airtight body of gas locking device.In each embodiment, the gas closed component can have one or more in window panel or maintenance control panel in each Wall board; Wherein, each window panel or maintenance control panel can have at least one gloves port.At gas closed component assembly process, each gloves port can have attached gloves, thereby gloves can extend in inside.According to each embodiment, each gloves port can have for the hardware that gloves are installed, and wherein, this hardware uses gasket seal around each gloves port, and its sealing that airtight body is provided is to minimize leakage or the molecular diffusion by the gloves port.For each embodiment of the gas closed component of this instruction, the gloves port that described hardware also is designed to be easy to cover cap and opens the terminal use.
Can comprise from gas closed component and gas circulation, filtration and the purifying part of a plurality of framing components and the formation of panel part section according to the gas closed component of this instruction and each embodiment of system.For each embodiment of gas closed component and system, pipe-line system can be installed during assembling process.According to each embodiment of this instruction, pipe-line system can be arranged in the gas closed frame assembly of a plurality of framing components structures.In each embodiment, pipe-line system can be at a plurality of framing components in conjunction with being arranged on a plurality of framing components before forming gas closed frame assembly.The pipe-line system of each embodiment of gas closed component and system can be arranged to be drawn into from one or more pipe-line system entrances each embodiment that all gas basically pipe-line system moves through the gas filtration loop, is used for removing the particulate matter of gas closed component and internal system.In addition, the pipe-line system of each embodiment of gas closed component and system can be configured to the entrance and exit of the gas purification loop of the gas closed component outside gas filtration loop from gas closed component inside is separated.
For example, gas closed component and system can have gas circulation and the filtration system in gas closed component inside.This self-filtering system can have a plurality of fan filter units in inside, and can be configured to provide the gas laminar flow in inside.Laminar flow can be that internally top is to direction or any other direction of inner bottom.Although the gas flow that produces by the circulatory system needs not be laminar flow, the gas laminar flow can be used for guaranteeing thoroughly and fully having enough to meet the need of inside gas.The gas laminar flow can also be used for minimizing turbulent flow, and this turbulent flow is undesirable, because it can be so that the particle in environment be collected in this regions of turbulent flow, thereby prevents that filtration system from removing those particles from environment.In addition, in order to keep preferred temperature in inside, can provide the heat regulating system that uses a plurality of heat exchangers, for example by means of fan or the operation of another gas-recycling plant, near fan or another gas-recycling plant, perhaps be combined with fan or another gas-recycling plant.Gas purification loop can be configured to by at least one gas purification parts of locking device outside from gas closed component inner loop gas.In this respect, the filtration of gas closed component inside and the circulatory system are combined with the gas purification loop of gas closed component outside can provide the continuous circulation that runs through the significantly low particulate inert gas in the gas closed component, and it has remarkable low-level reactive materials.Gas purge system can be configured to keep the very low-level composition of not wishing, such as organic solvent and steam thereof and water, water vapour, oxygen etc.
Except being provided for gas circulation, filtration and purifying part, pipe-line system can sizing and is shaped at least one that hold therein in electric wire, wire harness and various fluid containment pipe, it may have a large amount of dead volumes when tying in, wherein, environment composition (for example, water, water vapour, oxygen etc.) may be trapped and be difficult to be removed by cleaning system.In certain embodiments, the combination of any in cable, electric wire and wire harness and fluid containment pipe can be arranged in pipe-line system basically, and can be respectively be arranged on inside in electrical system, mechanical system and cooling system at least one functionally be connected.Because gas circulation, filtration and purifying part can be arranged so that all circulated inert gas all aspirate by pipe-line system basically, the environment composition that therefore is trapped in the dead volume of the various materials that tie in can purge by a large amount of dead volumes from this material that ties in effectively by making this material that ties in be contained in pipe-line system.
Can comprise from gas closed component and gas circulation, filtration and the purifying part of a plurality of framing components and the formation of panel part section according to the gas closed component of this instruction and each embodiment of system, and additionally comprise each embodiment of pressurized inert gas recirculating system.This pressurized inert gas recirculating system can be used in the operation of OLED print system, is used for various pneumatic actuating devices and equipment, as described in more detail subsequently.
According to this instruction, a plurality of engineering challenges have been solved, in order to each embodiment of pressurized inert gas recirculating system is provided in gas closed component and system.At first, under the typical operation of the gas closed component that there is no the pressurized inert gas recirculating system and system, the gas closed component can remain on slight positive internal pressure with respect to external pressure, in order to prevent that outside gas or air from entering inside when producing any leakage in gas closed component and system.For example, for the gas closed component of this instruction and each embodiment of system, under typical operation, the inside of gas closed component can for example remain on the pressure of 2mbarg at least with respect to the surrounding environment of closed system outside, the pressure of 4mbarg at least for example, at least the pressure of 6mbarg, the pressure of 8mbarg at least, or high pressure more.Keep the pressurized inert gas recirculating system that challenge may be arranged in gas closed component system, because it has the dynamic balance play with continue carry out relevant with the slight positive internal pressure that keeps gas closed component and system, and introduces continuously gas-pressurized in gas closed component and system simultaneously.In addition, the variable demand of each device and equipment may form the various gas closed components of this instruction and the irregular pressure curve of system.To keep with respect to the gas closed component that external environment condition remains on slight positive pressure the dynamic pressure balance can be provided for continuing the globality of the OLED print procedure that carries out under this condition.
For each embodiment of gas closed component and system, can comprise each embodiment in pressurized inert gas loop according to the pressurized inert gas recirculating system of this instruction, can use at least a and combination in compressor, reservoir and air blast.Each embodiment of pressurized inert gas recirculating system that comprises each embodiment in pressurized inert gas loop can have custom-designed pressure and control bypass circulation, and it can provide the inert gas that is in stability line definite value internal pressure in the gas closed component of this instruction and system.In each embodiment of gas closed component and system, the pressurized inert gas recirculating system can be configured to control bypass circulation recirculation pressurized inert gas via pressure when inert gas pressure in the reservoir in pressurized inert gas loop surpasses predetermined threshold value pressure.Threshold pressure can be for example at about 25psig to the about scope between 200psig, perhaps more specifically at about 75psig to the about scope between 125psig, perhaps more specifically at about 90psig to the about scope between 95psig.In this respect, have this instruction gas closed component and the system of pressurized inert gas recirculating system that controls each embodiment of bypass circulation with custom-designed pressure and can remain on the balance that has the pressurized inert gas recirculating system in gas-tight seal gas locking device.
According to this instruction, various devices and equipment can be arranged in inside, and be communicated with each embodiment fluid of the pressurized inert gas recirculating system with various pressurized inert gas loops, various pressurized-gas sources can be used in described pressurized inert gas loop, for example at least a in compressor, air blast and combination thereof.For the gas locking device of this instruction and each embodiment of system, use various pneumatically-operated devices and equipment can provide low particle to generate performance and the low cost of safeguarding.Exemplary means and the equipment that can be arranged in gas closed component and internal system and be communicated with various pressurized inert gas loops fluid can comprise, such as but not limited to, one or more in pneumatic robot, substrate suspending bench, air bearing, air lining, Compressed Gas instrument, pneumatic actuator and combination thereof.Substrate suspending bench and air bearing can be used for operation according to the various aspects of the OLED print system of each embodiment of the gas closed component of this instruction.For example, use the substrate suspending bench of air bearing technology can be used for substrate feed to the correct position of printhead chamber and during the OLED print procedure support base.
As mentioned before, each embodiment of substrate suspending bench and air bearing may be useful to the operation that is contained according to each embodiment of the OLED print system in the gas closed component of this instruction.As Fig. 1 for gas closed component and system 2000 schematically as shown in, use the substrate suspending bench of air bearing technology can be used for substrate feed to the correct position of printhead chamber and during the OLED print procedure support base.In Fig. 1, gas closed component 1500 can be the load locking system, it can have for receive the entrance chamber 1510 of substrate by the first access hatch 1512 and 1514, is used for substrate is moved to gas closed component 1500 from entrance chamber 1510, in order to print.Can be used for chamber being isolated from each other and isolating from external environment condition according to each gate of this instruction.According to this instruction, each gate can be selected from physics gate and gas curtain.
During the substrate receiving course, gate 1512 can be opened, and gate 1514 can be in the closed position, in order to prevent that environmental gas from entering gas closed component 1500.In case substrate is received in entrance chamber 1510, gate 1512 and 1514 both can be closed and entrance chamber 1510 can be used inert gas purge, for example nitrogen, any rare gas and any combination thereof is until the level of reactive ambient gas may for example is in 100ppm or lower, 10ppm or lower, 1.0ppm or lower or 0.1ppm or lower.After environmental gas reached enough low level, gate 1514 can be opened, and 1512 still close, and was transported to gas closed component chamber 1500 to allow substrate 1550 from entrance chamber 1510, as shown in Figure 1.Substrate is transported to gas closed component chamber 1500 from entrance chamber 1510 can be via such as but not limited to the suspending bench that is arranged on chamber 1500 and 1510.Substrate is transported to gas closed component chamber 1500 from entrance chamber 1510 can also be via such as but not limited to the substrate feed robot, and it can be placed on substrate 1550 on the suspending bench that is arranged in chamber 1500.Substrate 1550 is supported on the substrate suspending bench can keep during print procedure.
Each embodiment of gas closed component and system 2000 can have the outlet chamber 1520 that is communicated with gas closed component and system's 1500 fluids by gate 1524.According to each embodiment of gas closed component and system 2000, after print procedure was completed, substrate 1550 can be transported to outlet chamber 1520 by gate 1524 from gas closed component 1500.Substrate is transported to outlet chamber 1520 from gas closed component chamber 1500 can be via such as but not limited to the suspending bench that is arranged on chamber 1500 and 1520.Substrate is transported to outlet chamber 1520 from gas closed component chamber 1500 can also be via such as but not limited to the substrate feed robot, and it can pick up and be transported to chamber 1520 with the suspending bench of substrate 1550 from be arranged at chamber 1500.For each embodiment of gas closed component and system 2000, in the closed position when preventing that reactive ambient gas may from entering gas closed component 1500 when gate 1524, substrate 1550 can be fetched via gate 1522 from outlet chamber 1520.
Except comprising respectively the load locking system via gate 1514 and the 1524 entrance chambers 1510 that are communicated with gas closed component 1500 fluids and outlet chamber 1520, gas closed component and system 2000 can comprise system controller 1600.System controller 1600 can comprise the one or more processor circuit (not shown) that are communicated with one or more memory circuitry (not shown).System controller 1600 can also be communicated with the load locking system that includes oral chamber 1510 and outlet chamber 1520, and finally is communicated with the printing nozzle of OLED print system.Thus, system controller 1600 can be coordinated gate 1512,1514,1522 and 1524 opening and closing.The China ink that system controller 1600 can also be controlled to the printing nozzle of OLED print system distributes.Each embodiment that substrate 1550 can be passed through the load locking system of this instruction carries, via the combination such as but not limited to the substrate suspending bench of the substrate suspending bench of using the air bearing technology or air bearing technology and substrate feed robot, the load locking system comprises respectively via gate 1514 and 1524 entrance chamber 1510 and the outlet chamber 1520 that are communicated with gas closed component 1500 fluids.
Each embodiment of the load locking system of Fig. 1 can also comprise atmospheric control 1700, and it can comprise vacuum source and inert gas source, can comprise nitrogen, any rare gas and any combination thereof.The substrate suspension system that is contained in gas closed component and system 2000 can comprise the gentle axon socket end of a plurality of vacuum ports mouth that usually is arranged on flat surfaces.Substrate 1550 can be passed through boost in pressure and the maintenance of inert gas (for example, nitrogen, any rare gas and any combination thereof) and leave crust.Flowing out flowing of bearing volume completes by means of a plurality of vacuum ports.The hoverheight of substrate 1550 on the substrate suspending bench becomes according to gas pressure and gas flow usually.Support base 1550 during the vacuum of atmospheric control 1700 and pressure can be used for controlling in the load locking system gas closed component 1500 of Fig. 1 is for example during printing.Control system 1700 can also be used for support base 1550 during carrying by the load locking system of Fig. 1, and the load locking system comprises respectively via gate 1514 and 1524 entrance chamber 1510 and the outlet chamber 1520 that are communicated with gas closed component 1500 fluids.Carry by gas closed component and system 2000 in order to control substrate 1550, system controller 1600 is communicated with inert gas source 1710 and vacuum 1720 by valve 1712 and 1722 respectively.Unshowned addition of vacuum and inert gas supply circuit and valve can offer gas closed component and system 2000, by the load locking system diagram of Fig. 1, control required various gases and the vacuum facility of enclosed environment further to provide.
In order to be provided the more stereogram of multidimensional according to the gas closed component of this instruction and each embodiment of system, Fig. 2 is the left front stereogram of each embodiment of gas closed component and system 2000.Fig. 2 shows the load locking system that comprises gas closed component 1500, entrance chamber 1510 and the first gate 1512.Gas closed component and the system 2000 of Fig. 2 can comprise gas purge system 2130, are used for providing the constant supply of inert gas of the organic vapor that has remarkable low-level reactive environments material (for example water vapour and oxygen) and obtain from the OLED print procedure to gas closed system 1500.Gas closed component and the system 2000 of Fig. 2 also have controller system 1600, are used for system control function, as mentioned before.
Fig. 3 is the right front stereogram that builds gas closed component 100 fully according to each embodiment of this instruction.Gas closed component 100 can hold one or more gases, is used for keeping the inert environments of gas closed component inside.The gas closed component of this instruction and system can be useful aspect the inert gas environment in keeping inside.Inert gas can be without undergoing any gas of chemical reaction under one group of qualifications.The common usage example of some of inert gas can comprise nitrogen, any rare gas and any combination thereof.Gas closed component 100 is configured to surround and protection air-sensitive process, for example uses Industrial Printing system print Organic Light Emitting Diode (OLED) China ink.The example that is reactive environmental gas to the OLED China ink comprises water vapour and oxygen.As mentioned before, gas closed component 100 can be configured to keep sealed environment and allow parts or print system effectively to operate, and avoids simultaneously pollution, oxidation and infringement otherwise reactive material and substrate.
As shown in Figure 3, each embodiment of gas closed component can comprise with the lower component part, comprise front portion or the first Wall board 210 ', left side or the second Wall board (not shown), right side or the 3rd Wall board 230 ', rear portion or wall panel (not shown) and top board panel 250 ', this gas closed component can be attached to dish 204, and dish 204 is sat and put on the base portion (not shown).As described in more detail subsequently, each embodiment of the gas closed component 100 of Fig. 1 can be from anterior or the first wall framework 210, left side or the second wall framework (not shown), right side or the 3rd wall framework 230, rear portion or wall panel (not shown) and top board framework 250 structures.Each embodiment of top board framework 250 can comprise fan filter unit lid the 103 and first top board framework pipeline 105 and the first top board framework pipeline 107.According to the embodiment of this instruction, various types of section panels can be arranged in any in a plurality of panel part sections that comprise framing component.In each embodiment of the gas closed component 100 of Fig. 1, sheet metal panel part section 109 can be welded to framing component during framework builds in.For each embodiment of gas closed component 100, can comprise through section's section panel type that several build and destructing mount and dismount with being cycled to repeat of gas closed component the insertion panel 110 that illustrates for Wall board 210 ' and the window panel 120 that illustrates for Wall board 230 ' and easy detachable maintaining window 130.
Although easily detachable maintaining window 130 can be easy to the inside near locking device 100, can use dismountable any panel with the inside near gas closed component and system, to be used for repairing and routine maintenance purpose.Maintenance or this approaching due to by for example window panel 120 and easy approaching of providing of the panel of detachable maintaining window 130 and different of repairing, its can so that terminal use's gloves during use from gas closed component outside near gas closed component inside.For example, be attached to any gloves of gloves port one 40, for example gloves 142, as in Fig. 3 for as shown in panel 230, can make the terminal use approach between the operating period in gas closed component system inner.
Fig. 4 illustrates the exploded view of each embodiment of gas closed component shown in Figure 3.Each embodiment of gas closed component can have a plurality of Wall boards, the outside stereogram that comprises front walls panel 210 ', the outside stereogram of left side wall panel 220 ', the perspective interior view of right side wall panel 230 ', the perspective interior view of rear wall panel 240 ', and the top perspective view of top board panel 250 ', as shown in Figure 3, the gas closed component can be attached to dish 204, and dish 204 is sat and put on base portion 202.The OLED print system can be arranged on coils on 204 tops, and print procedure is known is responsive to environmental condition.According to this instruction, the gas closed component can build from framing component, for example then the top board framework 250 of the wall framework 240 of the wall framework 230 of the wall framework 220 of the wall framework 210 of Wall board 210 ', Wall board 220 ', Wall board 230 ', Wall board 240 ' and top board panel 250 ', wherein can install a plurality of section panels.In this respect, can expect that streaming can build and the design of section's section panel that destructing mounts and dismounts with being cycled to repeat through several of each embodiment of the gas closed component of this instruction.In addition, the fixed wheel exterior feature that can carry out gas closed component 100 is with the floor space of each embodiment of holding the OLED print system, so that required inert gas volume in the minimum gas closed component, and make the terminal use be easy near (between the gas closed component operating period and both like this during safeguarding).
Use front walls panel 210 ' and left side wall panel 220 ' as example, each embodiment of framing component can have the sheet metal panel part section 109 be welded to framing component during framing component builds in.Insert panel 110, window panel 120 and easily detachable maintaining window 130 can be arranged in each wall framing component, and can mount and dismount through several structures and the destructing of the gas closed component 100 of Fig. 4 with being cycled to repeat.Can find out: in the example of Wall board 210 ' and Wall board 220 ', Wall board can have the close easily window panel 120 of detachable maintaining window 130.Similarly, as shown in exemplary rear wall panel 240 ', Wall board can have the window panel, and for example the window panel 125, and it has two adjacent gloves port ones 40.For each embodiment according to the wall framing component of this instruction, and can find out for the gas closed component 100 of Fig. 3, this set of gloves can be easy to outside from the gas locking device near the parts part in closed system.Therefore, each embodiment of gas locking device can provide two or more gloves ports, thereby the terminal use can stretch into left hand cover and right hand cover in inside and control one or more items in inside, and does not disturb the composition of the gaseous environment in inside.For example, any in window panel 120 and maintenance window 130 can be positioned to be beneficial to from the outside of gas closed component near the adjusting part gas closed component inside.According to each embodiment of window panel (for example, window panel 120 and maintenance window 130), when the gloves that do not need the terminal use by the gloves port near the time, this window can not comprise gloves port and gloves port assembly.
As shown in Figure 4, each embodiment of wall and top board panel can have a plurality of insertion panels 110.Can find out in Fig. 4, insert panel and can have various shapes and aspect ratio.Except inserting panel, top board panel 250 ' can have installations, bolt to be connected, be threaded, fix or the fan filter unit that otherwise is fastened to top board framework 250 builds the 103 and first top board framework pipeline 105 and the second top board framework pipeline 107.As described in more detail subsequently, the pipe-line system that is communicated with pipeline 107 fluids of top board panel 250 ' can be arranged in the inside of gas closed component.According to this instruction, this pipe-line system can be the part of the gas-circulating system of gas closed component inside, and the mobile stream that is provided for separately leaving the gas closed component, at least one the gas purification parts that cycles through gas closed component outside.
Fig. 5 is the exploded front stereogram of framing component assembly 200, and wherein, wall framework 220 can be built into and comprise the fully additional of panel.Although design shown in being not limited to uses the framing component assembly 200 of wall framework 220 can be used for illustration according to each embodiment of the framing component assembly of this instruction.According to this instruction, each embodiment of framing component assembly can be made of each framing component and the section's section panel that is arranged in each framework panel part section of each framing component.
According to each embodiment of each framing component assembly of this instruction, framing component assembly 200 can comprise framing component, and for example the wall framework 220.Each embodiment for the gas closed component, the gas closed component 100 of Fig. 3 for example, can use the process that is contained in the facility in this gas closed component may not only need to provide the gas-tight seal locking device of inert environments, and need to there is no the environment of particulate matter.In this respect, can use various sizes metal tube material for each embodiment of construction framework according to the framing component of this instruction.This metal tube material has solved the expectation material properties, include but not limited to, the high globality material of particulate matter will can not be demoted to produce, and produce the framing component have high strength and to have optimum weight, be convenient to from the gas closed component that the three unities is carried to another place, structure and destructing comprise each framing component and panel part section.Those of ordinary skills can easily understand, and any material that satisfies these requirements can be used to form each framing component according to this instruction.
For example, according to each embodiment of the framing component of this instruction, for example the framing component assembly 200, can build from the extrusion metal pipe.According to each embodiment of framing component, can come the construction framework member with aluminium, steel and various metallic composite.In each embodiment, can use have such as but not limited to following size and have 1/8 " to 1/4 " metal tube of wall thickness: 2 " w * 2 " h, 4 " w * 2 " h and 4 " w * 4 " h, to build each embodiment according to the framing component of this instruction.In addition, various fiber reinforced polymer composites with various pipes or other form are available, it has and includes but not limited to following material properties: the high globality material that will can not demote to produce particulate matter, and produce the framing component have high strength and to have optimum weight, be convenient to from the three unities carry to another place, structure and destructing.
About building each framing component from various sizes metal tube material, what can imagine is to weld to form each embodiment of frame welding section.In addition, building each framing component of material construction from various sizes can use suitable industry adhesive to carry out.What can imagine is, building each framing component should carry out in the mode that will can not form inherently the leakage paths by framing component.In this respect, for each embodiment of gas closed component, build each framing component and can use any method that will can not form inherently the leakage paths by framing component to carry out.In addition, according to each embodiment of the framing component of this instruction, for example the wall framework 220 of Fig. 4, can be brushed or coating.For from for example being easy to oxidation (wherein, the material that forms in the surface can form particulate matter) each embodiment of the framing component made of metal tube material, can brush or coating or other surface treatment, for example anodization is to prevent from forming particulate matter.
The framing component assembly, for example the framing component assembly 200 of Fig. 5, can have framing component, and for example the wall framework 220.Wall framework 220 can have top 226 (top wall framework backing plate 227 can be fastened thereon) and bottom 228 (base wall framework backing plate 229 can be fastened thereon).As described in more detail subsequently, being arranged on the lip-deep backing plate of framing component is the part of gasket seal system, the gasket seal of its panel in being arranged on framing component section section is combined, and is provided for the gas-tight seal according to each embodiment of the gas closed component of this instruction.Framing component, the wall framework 220 of the framing component assembly 200 of Fig. 5 for example can have a plurality of panel frame section section, wherein, each section can manufacture and receive various types of panels, such as but not limited to inserting panel 110, window panel 120 and easy detachable maintaining window 130.When the construction framework member, can form various types of panel part sections.The type of panel part section can comprise such as but not limited to being used for receiving inserting surface board section 10, the window side board section 20 that is used for receive window panel 120 of inserting panel 110 and being used for receiving the easily maintenance window panel part section 30 of detachable maintaining window 130.
The panel part section of every type can have the panel part segment frames that receives panel, and can be arranged to each panel and can sealably be fastened in each panel part section according to this instruction, is used for building gas-tight seal gas closed component.For example, in the Fig. 5 that shows according to the frame assembly of this instruction, inserting surface board section 10 is shown as has framework 12, and window side board section 20 is shown as has framework 22, and maintenance window panel part section 30 is shown as has framework 32.For each embodiment of the wall frame assembly of this instruction, each panel part segment frames can be to receive sheet material in the panel part section with the sequential welding bead weld, so that gas-tight seal to be provided.For each embodiment of wall frame assembly, each panel part segment frames can be made by various sheet material, comprises the structure material that is selected from fiber reinforced polymer composites, and it can use suitable industry adhesive to be arranged in the panel part section.As described in more detail in the instruction that relates to subsequently sealing, each panel part segment frames can have sealant compressible shim disposed thereon, to guarantee for the sealing of installing and be fastened on each panel in each panel part section and can form airtight body.Except the panel part segment frames, each framing component section section can have and is firmly fastened to the relevant hardware of panel with positioning panel and in the panel part section.
Each embodiment that inserts the panel frame 122 of panel 110 and window panel 120 can build from sheet material, such as but not limited to aluminium, various aluminium and stainless alloy.The attribute of panel material can be identical with the structural material of each embodiment that is used for the formation framing component.In this respect, the material that has for the attribute of various panel members includes but not limited to: the high globality material that will can not demote to produce particulate matter, and produce the panel have high strength and to have optimum weight so that from the three unities carry to another place, structure and destructing.For example, each embodiment of cellular chip material can have the required attribute as the panel material that builds the panel frame 122 that inserts panel 110 and window panel 120.The cellular chip material can be made by various materials; Metal and metal composite and polymer, and polymer composite honeycomb chip material.Can have grounding connection being included in panel at each embodiment of detachable panel when metal material is made, to guarantee total ground connection when the gas closed component builds.
But the transport properties of the gas closed component parts of given gas closed component for building this instruction, any in each embodiment of section's section panel of this instruction can repeat installation and removal at gas closed component and system between the operating period, with the inside near the gas closed component.
For example, the panel part section 30 of detachable maintaining window panel 130 can have one group of four pad for receiving easily, and one of them is shown as window guiding pad 34.In addition, build to be used for receive easily that the panel part section 30 of detachable maintaining window panel 130 can have one group of four clamping plate 36, its can be used for use be arranged on each easily one group of four acting in opposition toggle clamp 136 on the maintenance window framework 132 of detachable maintaining window 130 maintenance window 130 is clamped in maintenance window panel part section 30.In addition, each in two window handles 138 can be arranged on easily on detachable maintaining window frame 132, so that terminal use's maintenance window 130 easy to removal and installation.Quantity, the type of detachable maintenance window handle and arrange and to change.In addition, easily the maintenance window panel part section 30 of detachable maintaining window panel 130 can be so that at least two of window clip 35 optionally be arranged in each maintenance window panel part section 30 to be used for reception.Although be presented at top and the bottom of each maintenance window panel part section 30, at least two window clips can be to install in order to any mode of fastening maintenance window 130 in panel part segment frames 32.Instrument can be used for dismounting and window clip 35 is installed, in order to allow maintenance window 130 dismountings and again install.
The acting in opposition toggle clamp 136 of maintenance window 130 and the hardware (comprising clamping plate 36, window guiding pad 34 and window clip 35) that is arranged on panel part section 30 can be built by any suitable material and combination of materials.For example, one or more this elements can comprise at least a metal, at least a pottery, at least a plastics and combination thereof.Detachable maintenance window handle 138 can be built by any suitable material and combination of materials.For example, one or more this elements can comprise at least a metal, at least a pottery, at least a plastics, at least a rubber and combination thereof.Closed window, for example the window 134 of the window 124 of window panel 120 or maintenance window 130, can comprise any suitable material and combination of materials.According to each embodiment of the gas closed component of this instruction, closed window can comprise transparent and trnaslucent materials.In each embodiment of gas closed component, closed window can comprise material (such as but not limited to glass and quartz) and the various types of material based on polymer (such as but not limited to various other Merlon of level, acrylic acid and vinyl material) based on silica.One of ordinary skill in the art will appreciate that, the various compositions of example window material and combination thereof can also be as the transparent and trnaslucent materials according to this instruction.
Can find out for framing component assembly 200 in Fig. 5, easily detachable maintaining window panel 130 can have the gloves port with cover cap 150.Although show in Fig. 3 that all gloves ports have outward extending gloves, as shown in Figure 5, depend on whether the terminal use needs long-range inside near the gas closed component, and the gloves port can also be by cover cap.Each embodiment of cover assembly as shown in Fig. 6 A-7B is latched in cover cap on gloves when the terminal use does not use gloves securely, and is convenient to approach when the terminal use wishes to use gloves simultaneously.
In Fig. 6 A, show cover cap 150, it can have inner surface 151, outer surface 153 and can the fixed wheel wide side 152 that grasps of being used for.Three shoulder screws 156 extend from the edge 154 of cover cap 150.As shown in Fig. 6 B, each shoulder screw is fixed in edge 154, makes shank 155 154 extend setpoint distances from the edge, thus head 157 joining edge 154 not.In Fig. 7 A-7B, gloves port hardware assembly 160 can be modified to provide cover assembly, it comprise for locking device pressurized when having normal pressure with respect to the locking device outside locking mechanism of cover cap gloves port.
For each embodiment of the gloves port hardware assembly 160 of Fig. 6 A, the buckle clamping can be so that cover cap 150 be enclosed on gloves port hardware assembly 160, and provides simultaneously the terminal use to be easy to quick connection design near gloves.Gloves port hardware assembly 160 shown in Fig. 7 A overlook enlarged drawing, gloves port assembly 160 can comprise rear plate 161 and header board 163, header board 163 has for threaded screws head 162 and flange 164 that gloves are installed.Show snap lock latch 166 on flange 164, have groove 165, be used for receiving shoulder screw 156 (Fig. 6 B) shoulder screw head 157.Each shoulder screw 156 can with the snap lock latch 166 of gloves port hardware assembly 160 in each align and engage.The locking recess 167 at the groove 168 of snap lock latch 166 has the opening 165 that is positioned at an end place and is positioned at groove 168 other end place.In case each shoulder screw head 157 inserts in each opening 165, cover cap 150 just can rotate, until the end near locking recess 167 of shoulder screw head adjacent channels 168.Sectional view shown in Fig. 7 B shows the lock-in feature of cover cap gloves when using in gas closed component system.During use, the internal gas pressure of the inert gas in locking device than the pressure of gas closed component outside greater than set amount.Normal pressure can be filled gloves (Fig. 3), thus at gloves between the operating period of the gas closed component of this instruction during in cover cap 150 lower compression, shoulder screw head 157 moves in locking recess 167, thereby guarantees that the gloves port window is by cover cap reliably.Yet the terminal use can grasp cover cap 150 by the wide side 152 that is used for grasping of fixed wheel, and easily breaks away from the cover cap in being fastened on snap lock latch when not using.Rear plate 161 and 163, two plates of the header board on the outer surface of window 134 that Fig. 7 B also shows on the inner surface 131 of window 134 all have O-ring packing 169.
As what discuss in the following instruction of Fig. 8 A-9B, combine each embodiment of gas-tight seal gas closed component of the air-sensitive process that needing to be provided for inert environments of section's section panel frame seal of wall and top board framing component seal and airtight body.Help to provide the reactive materials of remarkable low concentration and the gas closed component of significantly low particle environment and the parts of system to include but not limited to; gas-tight seal gas closed component and efficient gas circulation and particle filter system comprise pipe-line system.The effective gas-tight seal that is provided for the gas closed component may have challenge; Especially when three framing components form three plane ties together.Thereby three plane ties are sealed in and are provided for and can build and the easy installation gas-tight seal aspect of the gas closed component of destructing circulation assembly and disassembly has difficult especially challenge through several.
In this respect, according to each embodiment of the gas closed component of this instruction by effective gasket seal of joint and the gas closed component that provides effective gasket seal to provide around load bearing builds parts to build fully and the gas-tight seal of system.different from conventional joint sealing, joint sealing according to this instruction: 1) be included in top and bottom terminal frame joint joint portion (wherein, three framing components are combined) locate in abutting connection with the consistent parallel aligned of pad section section with vertical orientated pad length, thereby avoid the alignment of angle seam and sealing, 2) be provided for forming length of adjacency along the whole width of joint, thereby the sealing contact surface that increases by three places, plane tie joint portion is long-pending, 3) be designed with backing plate, described backing plate vertically provides consistent compression stress with level and top with bottom three plane tie gasket seals along all.In addition, the selection of gasket material can affect the validity that gas-tight seal is provided, and this will be in subsequent discussion.
Fig. 8 A-8C is the conventional three plane ties sealings of diagram and schematic top plan view according to the contrast of the three plane ties sealings of this instruction.Each embodiment according to the gas closed component of this instruction, can have such as but not limited at least four wall framing components, top board framing component and dish, its can be combined forming the gas closed component, thereby produce need gas-tight seal a plurality of vertically, level and three plane ties.In Fig. 8 A, the schematic top plan view of conventional three gasket seals is formed by the first pad I, and the first pad I is vertical orientated with pad II in X-Y plane.As shown in Fig. 8 A, have by vertical orientated being sewn on of forming the contact length W that is limited by the gasket width size between two section's sections in X-Y plane 1In addition, the terminal part of pad III (at vertical direction and pad I and the vertical orientated pad of pad II) can be in abutting connection with pad I and pad II, by shadow representation.In Fig. 8 B, the schematic top plan view of conventional three plane tie gasket seals is formed by the first pad length I, and the first pad length I is vertical with the second pad length II, and has 45 ° of seam faying faces of two length, wherein, be sewn on the contact length W that has between two section's sections greater than the gasket material width 2The configuration of similar map 8A, the end of pad III (vertical with pad II with pad I at vertical direction) is divided can be in abutting connection with pad I and pad II, by shadow representation.Suppose that gasket width is identical in Fig. 8 A and Fig. 8 B, the contact length W of Fig. 8 B 2Contact length W greater than Fig. 8 A 1
Fig. 8 C is the schematic top plan view according to the three plane tie gasket seals of this instruction.The first pad length I can have the pad section I ' of section perpendicular to the direction formation of pad length I, wherein, the length that the section I ' of pad section has can be approximately the size of the width of combined structure member, for example be used to form this instruction the gas closed component each wall framing component 4 " w * 2 " h or 4 " w * 4 " the h metal tube.Pad II is vertical with pad I in X-Y plane, and has the pad section II ' of section, and the stacked length of the pad section II ' of section and the pad section I ' of section is approximately the width of combined structure member.The width of the section I ' of pad section and II ' is the width of selected compressible pad sheet material.Pad III is vertical orientated at vertical direction and pad I and pad II.The section III ' of pad section is that the end of pad III is divided.The section III ' of pad section is by vertical length vertical orientated form of the pad section III ' of section with pad III.The section III ' of pad section can form and make it have the length approximately identical with II ' with the pad section I ' of section, and width is the thickness of selected compressible pad sheet material.In this respect, the contact length W of three alignment part sections shown in Fig. 8 C 3Greater than having respectively contact length W 1And W 2Fig. 8 A or Fig. 8 B shown in the sealing of conventional delta connection.
In this respect, form the consistent parallel aligned (otherwise will be the pad of vertical alignment, as shown in the situation of Fig. 8 A and Fig. 8 B) of pad section section at place, terminal fitting joint portion according to the three plane tie gasket seals of this instruction.This consistent parallel aligned of three plane tie gasket seal section sections strides across described section and applies consistent transverse sealing power, seals with the top of the joint that promotes to be formed by the wall framing component and airtight three plane ties of bottom corners.In addition, the selected width that is approximately combined structure member of each section of the consistent alignment pad section section of each three plane ties sealing, thus the Maximum Contact length of consistent alignment part section is provided.In addition, be designed with backing plate according to the joint sealing of this instruction, described backing plate along build joint all vertically, level and three gasket seals provide consistent compression stress.Evinciblely be that the width of selecting to be used for the gasket material of three sealings of routine that the example of Fig. 8 A and Fig. 8 B provides can be at least the width of combined structure member.
The exploded perspective of Fig. 9 A illustrated before all framing components are combined black box 300 according to this instruction, thereby pad shows and is in uncompressed state.In Fig. 9 A, building the first step of gas locking device from all parts of gas closed component, a plurality of wall framing components, for example wall framework 310, wall framework 350 and top board framework 370 can be by sealably combinations.Sealing is to provide the gas closed component in case build fully and just be hermetically sealed and provide and can build and the pith of the sealing of destructing circulation enforcement through several of gas closed component according to the framing component of this instruction.Although the example that provides in the following instruction of Fig. 9 A-9B is the part for the sealing gas closed component, it will be appreciated by the skilled addressee that this instruction be applicable in the gas closed component of this instruction whole any.
The first wall framework 310 shown in Fig. 9 A can have medial surface 311, the vertical side 314 that backing plate 312 is installed and the top surface 315 that backing plate 316 is installed.The first wall framework 310 can have the first pad 320, the first pads 320 and is arranged in the space that is formed by backing plate 312 and adheres to the space that is formed by backing plate 312.In the first pad 320 is arranged on the space that is formed by backing plate 312 and adhere to the vertical length that the first pad 320 can be extended in the gap 302 that stays after the space that formed by backing plate 312, as shown in Fig. 9 A.As shown in Fig. 9 A, submissive pad 320 can be arranged in the space that is formed by backing plate 312 and adhere to the space that is formed by backing plate 312, and can have vertical pad length 321, curve pad length 323 and planar form 90 ° and end at the pad length 325 of the vertical side 314 of wall framework 310 with vertical pad length 321 on inner frame member 311.In Fig. 9 A, the first wall framework 310 can have the top surface 315 that backing plate 316 is installed, thereby forms the space on surface 315, and the second pad 340 vertically adheres to described space in described space and near the inward flange 317 of wall framework 310.In the second pad 340 is arranged on the space that is formed by backing plate 316 and adhere to the horizontal length that the second pad 340 can be extended in the gap 304 that stays after the space that formed by backing plate 316, as shown in Fig. 9 A.In addition, as shown in hacures, the length 345 of pad 340 and the length 325 of pad 320 are as one man parallel and align adjacently.
The second wall framework 350 shown in Fig. 9 A can have external frame side 353, vertical the side 354 and top surface 355 of backing plate 356 is installed.The second wall framework 350 can have the first pad 360, the first pads 360 and is arranged in the space that is formed by backing plate 356 and adheres to the space that is formed by backing plate 356.In the first pad 360 is arranged on the space that is formed by backing plate 356 and adhere to the horizontal length that the first pad 360 can be extended in the gap 306 that stays after the space that formed by backing plate 356, as shown in Fig. 9 A.As shown in Fig. 9 A, submissive pad 360 can have vertical length 361, length of curve 363 and planar form 90 ° and end at the length 365 of outer frame members 353 with top surface 355.
As shown in the exploded perspective view of Fig. 9 A, the inner frame member 311 of wall framework 310 can be incorporated into the vertical side 354 of wall framework 350 to form a structure joint of gas closed frame assembly.Sealing about the structure joint of such formation, in each embodiment according to the gasket seal at the place, terminal fitting joint portion of the wall framing component of this instruction, as shown in Fig. 9 A, the length 345 of the length 325 of pad 320, the length 365 of pad 360 and pad 340 is all alignd adjacently and as one man.In addition, as described in more detail subsequently, each embodiment of the backing plate of this instruction can be provided for this instruction of gas-tight seal the gas closed component each embodiment the compressible pad sheet material about 20% to the consistent compression between about 40% deflection.
Fig. 9 B illustrate all framing components in conjunction with after according to the black box 300 of this instruction, thereby pad is shown as compressive state.Fig. 9 B shows the stereogram of details of the corner sealing of three plane ties that the place, top terminals joint joint portion between the first wall framework 310, the second wall framework 350 and top board framework 370 (illustrating with imaginary drawing) forms.As shown in Fig. 9 B, certain width can be determined in the pad space that is limited by backing plate, thereby after in conjunction with wall framework 310, wall framework 350 and top board framework 370; As shown in imaginary drawing, be used to form vertically, the compressible pad sheet material of level and three gasket seals about 20% guarantee can provide gas-tight seal at the gasket seal at all surface place of the joint of wall framing component sealing to the consistent compression between about 40% deflection.In addition, pad gap 302,304 and 306 (not shown) be sized to make the compressible pad sheet material about 20% to the optimal compression between about 40% deflection, each pad can joint sheet the gap, as in Fig. 9 B for as shown in pad 340 and pad 360.Thereby, except providing consistent compression by the space that limits each pad setting and adhesion, be designed to provide each embodiment of the backing plate in gap to guarantee that also each compression gasket can comply with in the space that is limited by backing plate, and can be with mode wrinkling or protuberance or otherwise moulding brokenly in compressive state that will form leakage paths.
According to each embodiment of the gas closed component of this instruction, various types of section panels can use the sealant compressible shim material seal that is arranged on each panel part segment frames.Integration Framework member gasket seal, the position and the material that are used for the sealant compressible shim of formation sealing between each section panel and panel part segment frames can provide the gas-tight seal gas that has seldom or do not have Leakage Gas closed component.In addition, (for example be used for all types of panels, the insertion panel 110 of Fig. 5, window panel 120 and easy detachable maintaining window 130) Seal Design can provide afterwards durable panel sealing in this panel repeated removal and installation (in order to need near gas closed component inside, for example in order to safeguard).
For example, Figure 10 A shows maintenance window panel part section 30 and the easy exploded view of detachable maintaining window 130.As mentioned before, maintenance window panel part section 30 can be made for receiving easily detachable maintaining window 130.For each embodiment of gas closed component, the panel part section, detachable maintenance surface board section 30 for example can have panel part segment frames 32 and be arranged on sealant compressible shim 38 on panel part segment frames 32.In each embodiment, the hardware relevant with fastening easily detachable maintaining window 130 in detachable maintenance window panel part section 30 can so that the terminal use be convenient to install and again install, and guarantee simultaneously easy detachable maintaining window 130 directly install near the terminal use of gas closed component inside by needs as required with again be arranged on panel part section 30 in the time maintenance airtight body sealing.Easily detachable maintaining window 130 can comprise rigidity window frame 132, and it can be by building such as but not limited to the described metal tube material of any framing component for this instruction of structure.Maintenance window 130 can use the snap action securing hardware, such as but not limited to acting in opposition toggle clamp 136, in order to make the terminal use be convenient to dismounting and installation and maintenance window 130 again.The gloves port hardware assembly 160 of earlier figures 7A-7B has been shown in Figure 10 A, has shown one group of 3 snap lock latch 166.
As shown in the front view of the detachable maintenance window panel part section 30 of Figure 10 A, easily detachable maintaining window 130 can have one group of four toggle clamp 136 that is fastened on window frame 132.Maintenance window 130 can be positioned in panel part segment frames 30 and limit distance, for the suitable compression stress of guaranteeing against pad 38.Use one group of four windows guiding pad 34, as shown in Figure 10 B, it can be arranged in each bight of panel part section 30, is used at panel part section 30 location maintenance windows 130.Each in one group of clamping plate 36 can be configured to receive the easily acting in opposition toggle clamp 136 of detachable maintaining window 136.According to each embodiment that is used at several installation and removal circulation gas-tight seal maintenance windows 130, the mechanical strength of maintenance window framework 132 and maintenance window 130 with respect to the restriction position of sealant compressible shim 38 (providing by a group window guiding pad 34) in case put in place in conjunction with guaranteeing that maintenance window 130 is fastening, be fastened on acting in opposition toggle clamp 136 in corresponding clamping plate 36 such as but not limited to use, maintenance window framework 132 just can provide uniform power with limiting compression (being set by a group window guiding pad 34) on panel part segment frames 32.This group window guiding pad 34 is located so that window 130 is at the deflection sealant compressible shim 38 between about 20% to about 40% of the compression stress on pad 38.In this respect, the manufacturing of the structure of maintenance window 130 and panel part section 30 is provided for the sealing of the airtight body of maintenance window 130 in panel part section 30.As mentioned before, window clip 35 can be arranged on panel part section 30 after maintenance window 130 is fastened in panel part section 30 in, and dismounting when maintenance window 130 needs dismounting.
Acting in opposition toggle clamp 136 can use any appropriate means and means combination to be fastened to easily detachable maintaining window frame 132.The example of operable suitable fastener means comprise at least a adhesive (such as but not limited to, epoxy resin or cement bonding agent), at least one bolt, at least one screw, at least one other securing member, at least one groove, at least one track, at least one weld part and combination thereof.Acting in opposition toggle clamp 136 can be directly connected to detachable maintenance window framework 132 or indirectly connect by adaptor plate.Acting in opposition toggle clamp 136, clamping plate 36, window guiding pad 34 and window clip 35 can be built by any suitable material and combination of materials.For example, one or more this elements can comprise at least a metal, at least a pottery, at least a plastics and combination thereof.
Easily the detachable maintaining window, the sealing of airtight body can also be provided for inserting panel and window panel except sealing.Section's section panel of other type that can repeatedly mount and dismount in the panel part section comprises such as but not limited to insertion panel 110 shown in Figure 5 and window panel 120.Can find out in Fig. 5, the panel frame 122 of window panel 120 builds similarly with insertion panel 110.Thereby according to each embodiment of gas closed component, the manufacturing that is used for the panel part section of reception insertion panel and window panel can be identical.The sealing of in this respect, inserting panel and window panel can use same principle to implement.
With reference to figure 11A and 11B, and each embodiment according to this instruction, any panel of gas locking device (for example, the gas closed component 100 of Fig. 1) can comprise one or more inserting surface board sections 10, and it can have the framework 12 that is configured to receive corresponding insertion panel 110.Figure 11 A refer to publish picture stereogram of the amplifier section shown in 11B.In Figure 11 A, insert panel 110 and be shown as with respect to insertion framework 12 location.Can find out at Figure 11 B, insert panel 110 and be attached to framework 12, wherein, framework 12 can be for example to be built by metal.In certain embodiments, metal can comprise aluminium, steel, copper, stainless steel, chromium, alloy and combination thereof etc.A plurality of blind cutting threads hole 14 can form in inserting surface board segment frames 12.Panel part segment frames 12 is built into and is included in the pad 16 that inserts between panel 110 and framework 12, and sealant compressible shim 18 can be arranged on here.Blind cutting thread hole 14 can be the M5 type.Screw 15 can be received by blind cutting thread hole 14, thereby is inserting compression gasket 16 between panel 110 and framework 12.In case put in place against pad 16 is fastening, insert panel 110 just in the sealing of inserting surface board section 10 interior formation airtight bodies.As mentioned before, this panel sealing can be implemented various section panels, includes but not limited to insertion panel 110 shown in Figure 5 and window panel 120.
According to each embodiment according to the sealant compressible shim of this instruction, the compressible pad sheet material that is used for framing component sealing and panel sealing can be selected from various compressible polymeric materials, such as but not limited to any closed air chamber polymeric material classification, this area is also referred to as expanded rubber material or expanded polymer material.In brief, the closed air chamber polymer prepares in the mode that gas is enclosed in discrete chamber; Wherein each discrete chamber is sealed by polymeric material.The attribute of compressible closed air chamber polymeric pad sheet material that is expected to be useful in the airtight body sealing of framework and panel component includes but not limited to, they are firm to the chemical attack of the chemical substance of wide region, has extraordinary moisture barrier attribute, be resilient in wide temperature range, and resist permanent compressive deformation.Generally speaking, compare with opening air chamber structure polymeric material, the closed air chamber polymeric material has high dimension stability, than low moisture absorption coefficient and higher-strength.The all kinds polymeric material that can make the closed air chamber polymeric material comprises such as but not limited to silicones, neoprene, ethylene-propylene-diene terpolymer (EPT) (polymer and the compound that use EPDM diene monomers (EPDM, or ethylene propylene diene rubber) to make), ethene nitrile, butadiene-styrene rubber (SBR) and various copolymer and blend.
The expectation material properties of closed air chamber polymer only remains intact during use when can't harm at the air chamber that consists of block materials and keeps.In this respect, use this material can cause the degradation of gasket seal in the mode that may surpass the material specification (for example, surpassing the specification of using in assigned temperature or compression zone) that the closed air chamber polymer sets.In each embodiment of the closed air chamber polymer pad of the section's section panel that is used for seal frame member and framework panel part section, the compression of this material should be no more than about 50% between about 70% deflection, for optimum performance can be about 20% between about 40% deflection.
Except closed air chamber compressible pad sheet material, have for other another example of sealant compressible shim material type that builds according to the expectation attribute of the embodiment of the gas closed component of this instruction and comprise hollow extrusion die mould sealant compressible shim material classification.Hollow extrusion die mould gasket material has the expectation attribute as the material classification, include but not limited to, they are firm to the chemical attack of the chemical substance of wide region, have extraordinary moisture barrier attribute, be resilient in wide temperature range, and resist permanent compressive deformation.This hollow extrusion die mould compressible pad sheet material can occur with the various form factors of wide region, such as but not limited to, any in U-shaped air chamber, D shape air chamber, square air chamber, rectangle air chamber and various conventional shape factor hollow extrusion die mould gasket material.Various hollow extrusion die mould gasket materials can be by making for the manufacture of the polymeric material of closed air chamber compressible pad sheet material.Such as but not limited to, each embodiment of hollow extrusion die mould pad can be made by silicones, neoprene, ethylene-propylene-diene terpolymer (EPT) (polymer and the compound that use EPDM diene monomers (EPDM) to make), ethene nitrile, butadiene-styrene rubber (SBR) and various copolymer thereof and blend.The compression of this hollow gas chamber gasket material should be no more than about 50% deflection, in order to keep the expectation attribute.
Those of ordinary skills can easily understand, although closed air chamber sealant compressible shim material classification and hollow extrusion die mould sealant compressible shim material classification provide as example, any compressible pad sheet material with expectation attribute may be used to seal structure member (for example various walls and top board framing component) that this instruction provides and each panel in sealing surface board segment frames.
Can build the gas closed component from a plurality of framing components, the gas closed component 100 of Fig. 3 and Fig. 4 or as Figure 23 of subsequent discussion and the gas closed component 1000 of Figure 24 for example, so that minimize damage system unit (such as but not limited to, gasket seal, framing component, pipeline and section's section panel) risk.For example, gasket seal is to build the parts that may be easy to damage during the gas locking device from a plurality of framing components.According to each embodiment of this instruction, materials and methods is arranged to minimize or eliminate the risk of damaging all parts of gas closed component during building according to the gas locking device of this instruction.
Figure 12 A is the stereogram of the structure starting stage of gas closed component (for example gas closed component 100 of Fig. 3).Although gas closed component (for example the gas closed component 100) is used for the structure of the gas closed component of this instruction of illustration, those of ordinary skill can recognize, this instruction is applicable to each embodiment of gas closed component.As shown in Figure 12 A, during the structure starting stage of gas closed component, at first a plurality of cushion blocks are placed on the dish 204 that is supported by base portion 202.Cushion block can be thicker than the compressible pad sheet material that is arranged on each wall framing component that is installed on dish 204.A series of cushion blocks can be placed on a plurality of positions on dish 204 periphery edge, and in described position, each wall framing component of assembly process gas closed component can be placed on a series of cushion blocks and near the position of dish 204, and does not contact with dish 204.Expectation protecting in case be arranged on compressible pad sheet material on each wall framing component (for dish 204 sealing purposes) be subject to the mode of any infringement at dish 204 each wall framing components of assembling.Thereby the compressible pad sheet material (in order to form the gas-tight seal purposes with dish 204) of using cushion block (each Wall board parts can be placed on the initial position that coils on 204 on cushion block) to prevent from being arranged on each wall framing component is subject to any infringement.Such as but not limited to, as shown in Figure 12 A, anterior periphery edge 201 can have pad 93,95 and 97, and the front walls framing component can be sat and put on pad 93,95 and 97; Right periphery edge 205 can have pad 89 and 91, and the right side wall framing component can be sat and put on pad 89 and 91; Rear portion periphery edge 207 can have two pads, and rear wall framework pad can be sat and put thereon, wherein shows pad 87.Can use any quantity, type and the combination of cushion block.It will be appreciated by the skilled addressee that according to this instruction, cushion block can be positioned on dish 204, although each the not shown different cushion block in Figure 12 A-Figure 14 B.
Be used for from component framework Components Composition gas locking device according to this exemplary cushion block of instructing each embodiment shown in Figure 12 B, it is the stereogram of irising out the 3rd cushion block 91 shown in part of Fig. 9 A.Exemplary cushion block 91 can comprise the cushion block bar (strap) 90 that is attached to cushion block transverse side 92.Cushion block can be made by any suitable material and combination of materials.For example, each cushion block can comprise the polyethylene of supra polymer weight.Cushion block bar 90 can be made by any suitable material and combination of materials.In certain embodiments, cushion block bar 90 comprises nylon material, poly-alkylene material etc.Cushion block 91 has top surface 94 and basal surface 96.Cushion block 87,89,93,95,97 and any other cushion block of using can be with identical or similar physical attribute construction, and can comprise identical or similar material.Cushion block can be to allow the stable peripheral top edge that is placed into dish 204 easy-to-dismount mode sit put, clamping or its other modes arrange expediently.
In the exploded perspective view that Figure 13 provides, framing component can comprise being attached to sits front walls framework 210, left side wall framework 220, right side wall framework 230, rear wall framework 240 and top board or the top frame 250 of putting on the dish 204 on base portion 202.OLED print system 50 can be arranged on coils on 204 tops.
For example can comprise according to the OLED print system 50 of each embodiment of the gas closed component of this instruction and system: the granite base portion; Can support the movable bridge of OLED printing equipment; The one or more devices and the equipment that extend from each embodiment of pressurized inert gas recirculating system, for example, substrate suspending bench, air bearing, track, guide rail; Be used for the OLED film formation material is deposited on suprabasil inkjet printer system, comprise OLED China ink supply subsystem and ink jet-print head; One or more robots etc.Provide all parts that can comprise OLED print system 50, each embodiment of OLED print system 50 can have various floor spaces and form factor.
The OLED ink-jet print system can comprise a plurality of devices and the equipment that allows ink droplet reliably is arranged on ad-hoc location in substrate.These devices and equipment can include but not limited to, print head assembly, black induction system, kinematic system, substrate loading and unloading system and head maintenance system.Print head assembly comprises at least one ink gun, with at least one aperture that ink droplet can be sprayed with controllable rate, speed and size.Ink gun is supplied with by ink supply system, and ink supply system offers ink gun with China ink.Printing needs the relative motion between print head assembly and substrate.This completes by means of kinematic system, normally portal frame or declutch shaft XYZ system.Print head assembly can move (portal frame type) on anchoring base, perhaps in the situation that declutch shaft configures, printhead and substrate both can be moved.In another embodiment, printing station can be fixed, and substrate can move with respect to printhead at X and Y-axis, and the Z axis motion provides in substrate or printhead place.When printhead moved with respect to substrate, ink droplet sprayed to be deposited on desired locations in substrate in orthochronous.Substrate is used substrate loading and unloading system's insertion printer and is removed from printer.Depend on printer configuration, this can complete with mechanical conveyer, substrate suspending bench or the robot with end effector.The head maintenance system can comprise a plurality of subsystems, and it allows to demarcate, the scraping on inkjet nozzle surface, to start the maintenance task that China ink is ejected into useless pond such as drop volume.
Each embodiment according to this instruction of assembling the gas locking device, as shown in figure 13 anterior or the first wall framework 210, left side or the second wall framework 220, right side or the 3rd wall framework 230, rear portion or wall framework 250 and top board framework 250 can be built together in systematic order, then are attached to the dish 204 that is arranged on base portion 202.Each embodiment of framing component can use gantry to be positioned on cushion block in order to prevent from damaging the compressible pad sheet material, as mentioned before.For example, use gantry, front walls framework 210 can be sat and put at least three cushion blocks, for example the pad 93,95 and 97 on the peripheral top edge 201 of the dish shown in Figure 12 A 204.After forwardly wall framework 210 was placed on cushion block, wall framework 220 and wall framework 230 can be placed on the periphery edge 203 and the cushion block on periphery edge 205 that has been arranged on respectively dish 204 in succession or with any order successively.According to each embodiment from this instruction of component framework Components Composition gas locking device, front walls framework 210 can be placed on cushion block, subsequently left side wall framework 220 and right side wall framework 230 are placed on cushion block, make them put to be connected by bolt in place or otherwise be fastened to front walls framework 210.In each embodiment, rear wall framework 240 can be placed on cushion block, makes them put to be connected by bolt in place or otherwise is fastened to left side wall framework 220 and right side wall framework 230.For each embodiment, in case the wall framing component tightens together to form abuts with wall framework closed component, top top board framework 250 just can be fixed to this wall framework closed component to form complete gas closed frame assembly.At each embodiment of this instruction that is used for structure gas closed component, in this assembling stage, complete gas closed frame assembly is sat and is put on described a plurality of cushion blocks in order to protect the globality of each framing component pad.
As shown in Figure 14 A, for each embodiment of this instruction that is used for structure gas closed component, then gas closed frame assembly 400 can be located to pad can remove to prepare gas closed frame assembly 400 is attached to dish 204.Figure 14 A shows gas closed frame assembly 400 and uses lifter assembly 402, lifter assembly 404 and lifter assembly 406 to be increased to the position that promotes and leave cushion block from cushion block.In each embodiment of this instruction, lifter assembly 402,404 and 406 can be attached around the periphery of gas closed frame assembly 400.After the lifter assembly was attached, the gas closed frame assembly that builds fully can be by activating each lifter assembly raising or to stretch out each lifter assembly and lift from cushion block, thus rising gas closed frame assembly 400.As shown in Figure 14 A, gas closed frame assembly 400 is shown as and is thus lifted to previous seat and puts thereon a plurality of cushion blocks top.Then described a plurality of cushion block can be removed from the seat seated position of coiling on 204, thereby then framework can be reduced on dish 204 and then be attached to dish 204.
Figure 14 B is the exploded view according to the identical lifter assembly 402 of each embodiment of the lifter assembly of this instruction, as shown in Figure 11 A.As shown in the figure, lifter assembly 402 comprises wear prevention pad 408, installing plate 410, first clamp bearing 412 and second clamp bearing 413.First clamp 414 and second clamp 415 are shown as with corresponding clip bearing 412 and 413 and are in line.Jack bent axle 416 is attached to the top of very heavy apical axis 418.Trailer jack 520 (trailerjack) is shown as perpendicular to very heavy apical axis 418 and is attached to very heavy apical axis 418.Jack base portion 422 is shown as the part of the bottom of very heavy apical axis 418.Be foot abutment 424 below jack base portion 422, it is configured to receive the bottom of very heavy apical axis 418 and can be connected thereto.Smoothing foot (leveling foot) 426 also is illustrated and is configured to be received by foot abutment 424.Those of ordinary skills can easily recognize, any means that are suitable for lifting operation may be used to from cushion block rising gas closed frame assembly, thereby cushion block can be removed and intact gas closed component can be reduced on dish.For example, replace above-mentioned one or more lifter assembly, for example 402,404 and 406, can use hydraulic pressure, pneumatic or electric hoist device.
According to each embodiment of this instruction that is used for structure gas closed component, a plurality of securing members can provide and be configured to described a plurality of framing components are tightened together, and then gas closed frame assembly are fastened to dish.Described a plurality of securing member can comprise along each edge of each framing component be arranged on the respective frame member be configured to a plurality of framing components in one or more securing member parts of position of adjacent frame bar-crossing.Described a plurality of securing member and sealant compressible shim can be arranged so that when framing component combines sealant compressible shim arranges near inside and hardware near outside, thereby hardware can not provide a plurality of leakage paths of the airtight body closed component of this instruction.
Described a plurality of securing member can comprise along a plurality of bolts at the edge of one or more framing components and along a plurality of screwed holes at the edge of the one or more different frames members in a plurality of framing components.Described a plurality of securing member can comprise a plurality of nut set bolts (capturedbolt).Described bolt can comprise the bolt head that extends the outer surface that leaves the corresponding panel.Bolt can sink in recess in framing component.Clip, screw, rivet, adhesive and other securing member can be used for framing component is tightened together.Bolt or other securing member can extend through the outer wall of one or more framing components and enter in the sidewall or the screwed hole in roof or other complementary fasteners feature of one or more adjacent frame members.
As shown in Figure 15-17, for each embodiment of the method that builds the gas locking device, pipe-line system can be arranged on by wall framework and top board framing component in conjunction with in the interior section that forms.For each embodiment of gas closed component, pipe-line system can be installed during building process.According to each embodiment of this instruction, pipe-line system can be arranged in the gas closed frame assembly that is built by a plurality of framing components.In each embodiment, pipe-line system can be at a plurality of framing components in conjunction with being arranged on a plurality of framing components before forming gas closed frame assembly.The pipe-line system of each embodiment of gas closed component and system can be arranged to be drawn into from one or more pipe-line system entrances each embodiment that all gas basically pipe-line system all moves through the gas filtration loop, is used for removing the particulate matter in the gas closed component.In addition, the pipe-line system of each embodiment of gas closed component and system can be configured to the entrance and exit of the gas purification loop of gas closed component outside from the gas filtration loop separately, and the gas filtration loop is used for removing the particulate matter in the gas closed component.Can be made by sheet metal according to each embodiment of the pipe-line system of this instruction, such as but not limited to the aluminium flake with about 80mil thickness.
Figure 15 shows the right front imaginary stereogram of the pipe-line system assembly 500 of gas closed component 100.Closed pipe system assembly 500 can have front walls panel pipe-line system assembly 510.As shown in the figure, front walls panel pipe-line system assembly 510 can have front walls panel inlet duct 512, the first front walls panel standpipe 514 and the second front walls panel standpipe 516, and it both is communicated with front walls panel inlet duct 512 fluids.The first front walls panel standpipe 514 is shown as has outlet 515, and outlet 515 sealably engages with the top board pipeline 505 of fan filter unit lid 103.In a similar manner, the second front walls panel standpipe 516 is shown as has outlet 517, and outlet 517 sealably engages with the top board pipeline 507 of fan filter unit lid 103.In this respect, front walls panel pipe-line system assembly 510 is provided for the inert gas in the gas closed component from bottom cycle, use front walls panel inlet duct 512, by each front walls panel standpipe 514 and 516, and respectively air is carried by outlet 505 and 507, thereby air can filter by for example fan filter unit 752.As described in more detail subsequently, the quantity of fan filter unit, size and dimension can be selected according to the physical location of the substrate in print system during process.Heat exchanger 742 as the part of heat regulating system, can remain on preferred temperature near fan filter unit 752 with the inert gas that cycles through gas closed component 100.
Right side wall panel pipe-line system assembly 530 can have right side wall panel inlet duct 532, and it is communicated with right side wall panel upper pipe 538 fluids by right side wall panel the first standpipe 534 and right side wall panel the second standpipe 536.Right side wall panel upper pipe 538 can have the first entrance end 535 and second pipe outlet end 537, and second pipe outlet end 537 is communicated with rear wall panel upper pipe 536 fluids of rear wall pipe-line system assembly 540.Left side wall panel pipe-line system assembly 520 can have with for the described identical parts of right side wall panel assembly 530, wherein, can see at Figure 15 left side wall panel inlet duct 522 and the first left side wall panel standpipe 524 that is communicated with left side wall panel upper pipe (not shown) fluid by the first left side wall panel standpipe 524.Rear wall panel pipe-line system assembly 540 can have rear wall panel inlet duct 542, and rear wall panel inlet duct 542 is communicated with left side wall panel assembly 520 and right side wall panel assembly 530 fluids.In addition, rear wall panel pipe-line system assembly 540 can have rear wall panel bottom pipe 544, and rear wall panel bottom pipe 544 can have rear wall panel the first entrance 541 and rear wall panel the second entrance 543.Rear wall panel bottom pipe 544 can be communicated with rear wall panel upper pipe 536 fluids via the first bulkhead 547 and the second bulkhead 549, and described bulkhead structure can be used for and will present to inside from the outside of gas closed component 100 such as but not limited to the various bundles of cable, line and pipeline etc.Pipeline tapping 533 is provided for the bundle of cable, line and pipeline etc. is shifted out rear wall panel upper pipe 536, and it can pass upper pipe 536 via bulkhead 549.Bulkhead 547 and bulkhead 549 externally upper the use detachably insert the panel gas-tight seal, as mentioned before.Rear wall panel upper pipe by ventilating opening 545 (illustrated in Figure 15 one a bight) be communicated with such as but not limited to fan filter unit 754 fluids.In this respect, left side wall panel pipe-line system assembly 520, right side wall panel pipe-line system assembly 530 and rear wall panel pipe-line system assembly 540 are provided for the inert gas in the gas closed component from bottom cycle, use respectively Wall board inlet duct 522,532 and 542 and front panel lower pipeline 544, it is communicated with ventilating opening 545 fluids by aforesaid each standpipe, pipeline, bulkhead passage etc., thereby air can filter by for example fan filter unit 755.Heat exchanger 745 as the part of heat regulating system, can remain on preferred temperature near fan filter unit 755 with the inert gas that cycles through gas closed component 100.
In Figure 15, show by the cable of opening 533 and present.As described in more detail subsequently, each embodiment of the gas closed component of this instruction is provided for making the bundle of cable, line and pipeline etc. to pass through pipe-line system.In order to eliminate the leakage paths that forms around this bundle, can use each method for the different size cable, line and the pipeline that use the compliant materials sealed beam.Also show pipe I and pipe II for closed pipe system assembly 500 in Figure 15, it is shown as the part of fan filter unit lid 103.Pipe I provides to the outlet of the inert gas of extraneous gas cleaning system, and pipe II provides to the filtration of gas closed component 100 inside and the purification inert gas of closed circuit and returns.
The imaginary top perspective view of closed pipe system assembly 500 has been shown in Figure 16.Can find out the symmetric property of left side wall panel pipe-line system assembly 520 and right side wall panel pipe-line system assembly 530.For right side wall panel pipe-line system assembly 530, right side wall panel inlet duct 532 is communicated with right side wall panel upper pipe 538 fluids by right side wall panel the first standpipe 534 and right side wall panel the second standpipe 536.Right side wall panel upper pipe 538 can have the first entrance end 535 and second pipe outlet end 537, and second pipe outlet end 537 is communicated with rear wall panel upper pipe 536 fluids of rear wall pipe-line system assembly 540.Similarly, left side wall panel pipe-line system assembly 520 can have left side wall panel inlet duct 522, and left side wall panel inlet duct 522 is communicated with left side wall panel upper pipe 528 fluids by left side wall panel the first standpipe 524 and left side wall panel the second standpipe 526.Left side wall panel upper pipe 528 can have the first entrance end 525 and second pipe outlet end 527, and second pipe outlet end 527 is communicated with rear wall panel upper pipe 536 fluids of rear wall pipe-line system assembly 540.In addition, rear wall panel pipe-line system assembly can have rear wall panel inlet duct 542, and rear wall panel inlet duct 542 is communicated with left side wall panel assembly 520 and right side wall panel assembly 530 fluids.In addition, rear wall panel pipe-line system assembly 540 can have rear wall panel bottom pipe 544, and rear wall panel bottom pipe 544 can have rear wall panel the first entrance 541 and rear wall panel the second entrance 543.Rear wall panel bottom pipe 544 can be communicated with rear wall panel upper pipe 536 fluids via the first bulkhead 547 and the second bulkhead 549.Figure 15 and pipe-line system assembly 500 shown in Figure 16 can provide the Efficient Cycle of inert gas from anterior Wall board pipe-line system assembly 510 (it is recycled to top board panel pipeline 505 and 507 via front walls panel outlet 515 and 517 with inert gas respectively from anterior Wall board inlet duct 512) and from left side wall panel assembly 520, the Efficient Cycle of right side wall panel assembly 530 and rear wall panel pipe-line system assembly 540 is (with air respectively from inlet duct 522, 532 and 542 are recycled to ventilating opening 545).In case inert gas via top board panel pipeline 505 and 507 and ventilating opening 545 be discharged to closed area under the fan filter unit lid 103 of locking device 100, the inert gas of discharging like this can be by fan filter unit 752 and 754 filtrations.In addition, the inert gas of circulation can remain on preferred temperature by heat exchanger 742 and 744 (being the part of heat regulating system).
Figure 17 is the imaginary upward view of closed pipe system assembly 500.Inlet duct system component 502 comprises front walls panel inlet duct 512, left side wall panel inlet duct 522, right side wall panel inlet duct 532 and the rear wall panel inlet duct 542 of fluid communication with each other.Each inlet duct that comprises for inlet duct system component 502, existence is known opening along each duct bottom is equally distributed, many group openings are by lay special stress on, to be used for the purpose of this instruction, as the opening 511 of front walls panel inlet duct 512, the opening 521 of left side wall panel inlet duct 522, the opening 531 of right side wall panel inlet duct 532 and the opening 541 of right side wall panel inlet duct 542.Bottom at each inlet duct can see, this opening is provided for inert gas in the interior effective picked-up of locking device 100, to be used for continuous circulation and filtration.The continuous circulation of the inert gas of each embodiment of gas closed component and filtration are provided for keeping the interior environment that there is no particle of each embodiment of gas closed component system.Each embodiment of gas closed component system can remain on 4 grades of ISO14644 for particulate matter.Each embodiment of gas closed component system can remain on 3 grades of specifications of ISO14644 for the responsive especially process of particle contamination.As mentioned before, pipe I provides to the outlet of the inert gas of extraneous gas cleaning system, and pipe II provides to the filtration of gas closed component 100 inside and the purification inert gas of closed circuit and returns.
In each embodiment according to the gas closed component system of this instruction, the bundle of cable, line and pipeline etc. can be presented by pipeline, in order to purge the reactive ambient gas may in the dead band of the bundle that is trapped in cable, line and pipeline etc., for example water vapour and oxygen.According to this instruction, have been found that the dead band that forms forms the reservoir of the reactive materials of holding back in the bundle of cable, line and pipeline, it can extend significantly and makes the gas closed component meet the required time of specification of execution air-sensitive process.For the gas closed component of this instruction that is used for printing OLED device and each embodiment of system, various reactive materials (comprise various reactive ambient gas may, for example water vapour and oxygen, and organic vapor) in every kind of material for example can remain on 100ppm or lower, 10ppm or lower, 1.0ppm or lower or 0.1ppm or lower.
Hold back the required time of reactive ambient gas may in order to understand to present how to cause reducing purging from the dead volume of the cable that ties in, line and pipeline etc. by the cable of pipeline, with reference to figure 18A-19.Figure 18 A shows the enlarged drawing of bundle I, and bundle I can comprise the pipeline bundle of (for example, being used for various China inks, solvent etc. are flowed to the pipeline A of print system (as the print system 50 of Figure 13)).The bundle I of Figure 18 A can also comprise electric wire (for example electric wire B) and cable (for example coaxial cable C).This pipeline, line and cable can tie in together and route to inner to be connected to various devices and equipment (comprising the OLED print system) from the outside.Shadow region at Figure 18 A can find out, this bundle can form a large amount of dead band D.In the schematic perspective view of Figure 18 B, when cable, line and bale of pipeline I presented by pipeline II, inert gas III is inswept described bundle continuously.The amplification sectional view of Figure 19 shows continuously, and how the inert gas of the inswept pipeline that ties in, line and cable can increase the speed of removing the reactive materials of holding back from the dead volume of this intrafascicular formation effectively.Reactive materials A leaves (representing by the overall area that is occupied by the inert gas substance B) outside the diffusion rate and dead volume of dead volume (representing by the overall area that is occupied by substance A) in Figure 19 in Figure 19 reactive species concentrations is inversely proportional to.That is, if the concentration of reactive materials is high in the volume outside dead volume just, diffusion rate reduces so.If the reactive species concentrations in this zone reduces (by the mobile stream of inert gas, so pass through mass action) continuously from the volume outside the dead volume space just, reactive materials increases from the speed of dead volume diffusion so.In addition, by same principle, inert gas can be spread in dead volume, because institute's reactive materials of holding back is removed from these spaces effectively.
Figure 20 A is the stereogram in rear bight of each embodiment of gas closed component 600, and imaginary drawing passes the inside that Returning pipe 605 enters gas closed component 600.For each embodiment of gas closed component 600, rear wall panel 640 can have the panel 610 of insertion, and insertion panel 610 is configured to provide the path to for example electric bulkhead.The bundle of cable, line and pipeline etc. can be presented and enter the cable wiring conduit by bulkhead, for example at the pipeline 632 shown in right side wall panel 630, for this reason, detachably insert panel and dismantled to expose the bundle that routes in the first cable, line and bale of pipeline conduit entrance 636.From here, described bundle can be fed to the inside of gas closed component 600, and illustrates by the Returning pipe 605 in the inside of gas closed component 600 in imaginary drawing.Each embodiment that is used for the gas closed component of cable, line and bale of pipeline wiring can have more than a cable, line and bale of pipeline import, as shown in Figure 20 A, and the second beam tube road import 636 that it shows the first beam tube road import 634 and is used for another bundle.Figure 20 B shows the enlarged drawing for the beam tube road import 634 of cable, line and bale of pipeline.Beam tube road import 634 can have the opening 631 that is designed to form with slide lid 633 sealing.In each embodiment, opening 631 can hold the flexible sealing module, is for example provided by the Roxtec Company that is used for the cable entries sealing, and it can hold cable, line and the pipeline etc. of intrafascicular various diameters.Alternatively, the top 635 of slide lid 633 and the top part 637 of opening 631 can have and be arranged on each lip-deep compliant materials, thereby compliant materials can form sealing around cable, line and the pipeline etc. of presenting the intrafascicular various sizes diameter by import (as, beam tube road import 634).
Figure 21 is the upward view of each embodiment of the top board panel of this instruction, for example the top board panel 250 ' of the gas closed component of Fig. 3 and system 100.According to each embodiment of this instruction of assembling the gas locking device, lighting device can be arranged on the inside top surface of top board panel (for example top board panel 250 ' of the gas closed component of Fig. 3 and system 100).As shown in figure 21, the top board framework 250 that has an interior section 251 can be arranged on lighting device on the interior section of each framing component.For example, top board framework 250 can have two top board frame section sections 40, and top board frame section section 40 has two top board Vierendeel girders 42 and 44 usually.Each top board frame section section 40 can have towards the first side 41 of top board framework 250 positioned internal with towards outside the second side 43 of locating of top board framework 250.Each embodiment according to this instruction for illumination is provided for the gas locking device can install 46 pairs of illumination components.The every pair of illumination component 46 can comprise near the first illumination component 45 of the first side 41 with near the second illumination component 47 of the second side 43 of top board frame section section 40.The quantity of illumination component shown in Figure 21, location and grouping are exemplary.The quantity of illumination component and grouping can change with any expectation or suitable method.In each embodiment, illumination component can be installed straightly, and in other embodiments, can be mounted to make them can move to each position and angle.The setting of illumination component is not limited to top panel top board 433, but in addition or in any other inner surface that can be positioned at gas closed component shown in Figure 3 and system 100 of replacing, outer surface and surface combination.
Various illumination components can comprise lamp or the combination of any quantity, type, for example halogen light modulation, white lamp, incandescence, arc lamp or light emitting diode or device (LED).For example, each illumination component can comprise 1 LED to about 100 LED, and about 10 LED are to about 50 LED, perhaps greater than 100 LED.LED or other lighting device can send in chromatogram, chromatogram outer or any color or the color combination of its combination.Each embodiment according to the gas closed component that is used for inkjet printing OLED material, because the photaesthesia of some materials to some wavelength, thereby the optical wavelength that is arranged on the lighting device in the gas closed component can specifically be selected, to avoid material degradation during process.For example, the cold White LED of 4X be can use, 4X yellow led or its any combination also can be used.The example of the cold White LED of 4X is can be from IDEC Corporation of Sunnyvale, the LF1B-D4S-2THWW4 that California obtains.The example of operable 4X yellow led is also can be from the LF1B-D4S-2SHY6 of IDECCorporation acquisition.LED or other illumination component can be from the interior sections 251 of top board framework 250 or another lip-deep location, any position of gas closed component or suspend.Illumination component is not limited to LED.Can use the combination of any suitable illumination component or illumination component.Figure 22 is the curve map of IDEC LED spectrum, and show x axle corresponding with intensity when peak strength is 100% and with wavelength (unit: nanometer) corresponding y axle.Show the frequency spectrum of the yellow type of LF1B, yellow fluorescence lamp, LF1B white type LED, the cold white type LED of LF1B and the red type LED of LF1B.Each embodiment according to this instruction can use other spectrum and spectral combination.
Recall, each embodiment of gas closed component can with the internal capacity of minimum gas closed component and simultaneously the Optimization Work space build in the mode of the various floor spaces of holding various OLED print systems.Each embodiment of the gas closed component that so builds also be easy to during process from the outside near the inside of gas closed component and be easy to approach inner in order to safeguard, simultaneous minimization downtime.In this respect, can be wide about the various floor space fixed wheels of various OLED print systems according to each embodiment of the gas closed component of this instruction.
Those of ordinary skill is appreciated that, this instruction that is used for the structure of framing component structure, panel structure, framework and panel sealing and gas closed component (for example, the gas closed component 100 of Fig. 3) can be applied to have the gas closed component of various sizes and design.Such as but not limited to, each embodiment of the wide gas closed component of fixed wheel of containing this instruction of size of foundation base Gen3.5 to Gen10 can have at about 6m 3To about 95m 3Between internal capacity, and can save volume between about 30% to about 70% for uncertain profile and the locking device with suitable nominal dimension.Each embodiment of gas closed component can be so that each framing component be built into the profile that is provided for the gas closed component, so that hold the OLED print system be used for its function and simultaneously the Optimization Work space minimizing the inert gas volume, and also allow to be convenient to during process from the outside near the OLED print system.In this respect, each gas closed component of this instruction can change aspect profile layout and volume.
Figure 23 provides the example according to the gas closed component of this instruction.Gas closed component 1000 can comprise forward frame assembly 1100, central frame assembly 1200 and rear frame assembly 1300.Forward frame assembly 1100 can comprise forward frame base portion 1120, front walls framework 1140 and anterior top board framework 1160, and front walls framework 1140 has for the opening 1142 that receives substrate.Central frame assembly 1200 can comprise central frame base portion 1220, right-hand member wall framework 1240, midfeather framework 1260 and left end wall framework 1280.Rear frame assembly 1300 can comprise rear frame base portion 1320, rear wall framework 1340 and rear portion top board framework 1360.Zone shown in shade shows the available work volume of gas closed component 1000, and it is the volume that can be used for holding the OLED print system.Each embodiment fixed wheel of gas closed component 1000 is wide for (for example minimizing operation air-sensitive process, the OLED print procedure) volume of required recirculation inert gas, and allow simultaneously to be convenient near OLED print system (remotely or directly easily approaching by can easily dismantling panel during operation).For each embodiment of the gas closed component of this instruction of containing size of foundation base Gen3.5 to Gen10, can have at about 6m according to each embodiment of the wide gas closed component of fixed wheel of this instruction 3To about 95m 3Between the gas enclosed volume, such as but not limited at about 15m 3To about 30m 3Between, this may be useful for the OLED printing of for example Gen5.5 to Gen8.5 size of foundation base.
Gas closed component 1000 can have all features of putting down in writing for example gases closed component 100 in this instruction.Such as but not limited to, gas closed component 1000 can use the sealing according to this instruction, so that the gas-tight seal locking device through several build and destructing circulates to be provided.Each embodiment based on the gas closed system of gas closed component 1000 can have gas purge system, it can (comprise various reactive ambient gas may with various reactive materials, for example water vapour and oxygen, and organic vapor) the level of every kind of material for example remain on 100ppm or lower, 10ppm or lower, 1.0ppm or lower or 0.1ppm or lower.
In addition, can have circulation and filtration system based on each embodiment of the gas closed component system of gas closed component 1000, its can provide 3 grades and 4 grades toilet's standards satisfying ISO14644 without the particle environment.In addition, as shown in more detailed subsequently, based on the gas closed component of this instruction (for example, gas closed component 100 and gas closed component 1000) each embodiment that can have the pressurized inert gas recirculating system of gas closed component system, it can be used for operation such as but not limited to lower one or more: pneumatic robot, substrate suspending bench, air bearing, air lining, Compressed Gas instrument, pneumatic actuator and combination thereof.For the gas locking device of this instruction and each embodiment of system, use various pneumatically-operated devices and equipment can provide low particle to generate performance and the low cost of safeguarding.
Figure 24 is the exploded view according to the gas closed component 1000 of this instruction, illustrates each framing component that can be fabricated to provide gas-tight seal gas locking device.As preamble for as described in each embodiment of the gas locking device 100 of Fig. 3 and Figure 13, OLED ink-jet print system 50 can comprise a plurality of devices and the equipment that allows ink droplet reliably is arranged on the upper ad-hoc location of substrate (for example substrate 60), illustrates near substrate suspending bench 54.Provide all parts that can comprise OLED print system 50, each embodiment of OLED print system 50 can have various floor spaces and form factor.According to each embodiment of OLED ink-jet print system, various base materials can be used for substrate 60, such as but not limited to various glass substrate material and various Polymers bottom material.
Each embodiment according to the gas closed component of this instruction, as preamble for as described in gas locking device 100, the structure of gas closed component can carry out around the whole OLED print system, with the volume of minimum gas closed component and be convenient to approach inner.In Figure 24, the example of fixed wheel exterior feature can consider that OLED print system 50 provides.
As shown in figure 24, can have six isolators on OLED print system 50, can see wherein two: the first isolator 51 and the second isolator 53, it supports the substrate suspending bench 54 of OLED print system 50.Except two all relative with the second isolator 53 with visible the first isolator 51 additional isolator, there are two isolators that support OLED print system base portion 52.Closed front base portion 1120 can have the first closed front isolator bearing 1121 that supports the first closed front isolator wall framework 1123.The second closed front isolator wall framework 1127 is supported by the second closed front isolator bearing (not shown).Similarly, sealing base portion 1220 in centre can have the first middle sealing isolator bearing 1221 that supports sealing isolator wall framework 1223 in the middle of first.In the middle of second, sealing isolator wall framework 1227 seals the support of isolator bearing (not shown) in the middle of second.At last, rear closure base portion 1320 can have the first rear closure isolator bearing 1321 that supports the middle sealing in rear portion isolator wall framework 1323.The second rear closure isolator wall framework 1327 is supported by the second rear closure isolator bearing (not shown).Each embodiment of isolator wall framing component can be wide at fixed wheel around each isolator, thereby minimize the volume around each isolator supporting member.In addition, be demountable detachable panel for the shadow surface board section shown in base portion 1120, each isolator wall framework of 1220 and 1320, for example so that the maintenance isolator.Closed front assembly base portion 1120 can have dish 1122, and simultaneously middle closed component base portion 1220 can have dish 1222, and rear closure assembly base portion 1320 can have dish 1322.When base portion built to form in abutting connection with base portion fully, the OLED print system can be arranged on thus on the abuts tray that forms, and to be similar to, OLED print system 50 was arranged on mode on the dish 204 of Figure 13.As mentioned before, wall and top board framing component, for example the wall framework 1140 of forward frame assembly 1100, top board framework 1160; The wall framework 1240 of central frame assembly 1200,1260 and 1280; And the wall framework 1340 of rear frame assembly 1300, top board framework 1360, then can combine around OLED print system 50.Thereby each embodiment that the contoured wall framing component is decided in the gas-tight seal of this instruction reduces the inert gas volume in gas closed component 100 effectively, and is convenient to simultaneously each device and equipment near the OLED print system.
Can have gas circulation and filtration system in gas closed component inside according to the gas closed component of this instruction and system.This self-filtering system can have a plurality of fan filter units in inside, and can be configured to provide the gas laminar flow in inside.Laminar flow can be that internally top is to direction or any other direction of inner bottom.Although the gas flow that produces by the circulatory system needs not be laminar flow, the gas laminar flow can thoroughly and fully having enough to meet the need for the gas of guaranteeing inside.The gas laminar flow can also be used for minimizing turbulent flow, and this turbulent flow is undesirable, because it can be so that the particle in environment be collected in this regions of turbulent flow, thereby prevents that filtration system from removing those particles from environment.In addition, in order to keep preferred temperature in inside, can provide the heat regulating system that uses a plurality of heat exchangers, for example by means of fan or the operation of another gas-recycling plant, near fan or another gas-recycling plant, perhaps be combined with fan or another gas-recycling plant.Gas purification loop can be configured to by at least one gas purification parts of locking device outside from gas closed component inner loop gas.In this respect, the filtration of gas closed component inside and the circulatory system are combined with the gas purification loop of gas closed component outside can provide the continuous circulation that runs through the significantly low particulate inert gas in the gas closed component, and it has remarkable low-level reactive materials.Gas purge system can be configured to keep the very low-level composition of not wishing, such as organic solvent and steam thereof and water, water vapour, oxygen etc.
Figure 25 shows the schematic diagram of gas closed component and system 2100.Each embodiment of gas closed component and system 2100 can comprise the gas closed component 1500 according to this instruction, gas purification loop 2130 and at least one heat regulating system 2140 that is communicated with gas closed component 1500 fluids.In addition, each embodiment of gas closed component and system can have pressurized inert gas recirculating system 2169, and it can install to operate each by supplying inert gas, for example the substrate suspending bench of OLED print system.Each embodiment of pressurized inert gas recirculating system 2169 can use compressor, air blast and both combinations, as the source of each embodiment of inert gas recirculating system 2169, as described in more detail subsequently.In addition, gas closed component and system 2100 can have filtration and the circulatory system (not shown) in gas closed component and system 2100 inside.
As shown in figure 25, for each embodiment according to the gas closed component of this instruction, the inert gas that the design of pipeline can cycle through gas purification loop 2130 is from the inert gas of the inner continuous filtration of each embodiment of gas closed component and circulation separately.Gas purification loop 2130 comprises egress line 2131, and it is from gas closed component 1500 to removal of solvents parts 2132 and then to gas purge system 2134.The inert gas that is cleaned solvent and other reactant gas material (for example oxygen and water vapour) then returns to gas closed component 1500 by entrance circuit 2133.Gas purification loop 2130 can also comprise that suitable pipe is connected and sensor with connection, for example oxygen, water vapour and solvent vapo(u)r sensor.The gas circulation unit, such as fan, air blast or motor etc. for example can independently arrange or be integrally formed in gas purge system 2134, with gas circulation by gas purification loop 2130.Each embodiment according to the gas closed component, although removal of solvents system 2132 and gas purge system 2134 are shown as separate unit in schematic diagram shown in Figure 25, removal of solvents system 2132 and gas purge system 2134 can be used as single clean unit and are contained in together.Heat regulating system 2140 can comprise at least one cooler 2141, its can have for circulate coolant to the fluid issuing circuit 2143 of gas closed component be used for making cooling agent return to the fluid intake circuit 2145 of cooler.
The gas purification loop 2130 of Figure 25 can have the removal of solvents system 2132 of the gas purge system of being arranged on 2134 upstreams, thus from the inert gas of gas closed component 1500 circulations via egress line 2131 by removal of solvents system 2132.According to each embodiment, removal of solvents system 2132 can be based on from the solvent capture systems of the inert gas lyosoption steam of the removal of solvents system 2132 by Figure 25.Sorbent bed or a plurality of beds such as but not limited to active carbon, molecular sieve etc., can be removed the various organic vapors of wide region effectively.Each embodiment for the gas closed component can adopt cold capture technique, to remove the solvent vapo(u)r in removal of solvents system 2132.As mentioned before, for each embodiment according to the gas closed component of this instruction, can use sensor, for example oxygen, water vapour and solvent vapo(u)r sensor, to monitor this material from effective removal of the inert gas that cycles through continuously gas closed component system (for example, the gas closed component system 2100 of Figure 25).Each embodiment of removal of solvents system can indicate absorbent (such as active carbon, molecular sieve etc.) when to arrive capacity, thereby sorbent bed or a plurality of bed can regenerate or change.The regeneration of molecular sieve can comprise the heating molecular sieve, makes molecular sieve contact with forming gas, and combination etc.Be configured to catch the molecular sieve of each material (comprising oxygen, water vapour and solvent) can be by heating and be exposed to comprise hydrogen forming gas (for example, the forming gas that comprises the hydrogen of about 96% nitrogen and 4%) and regenerate, described percentage is volume ratio or weight ratio.The physics regeneration of active carbon can use the similar procedure that heats under inert environments to complete.
Any suitable gas cleaning system may be used to the gas purge system 2134 of the gas purification loop 2130 of Figure 25.For example, can be from MBRAUN Inc., of Statham, the gas purge system that NewHampshire or Innovative Technology of Amesbury, Massachusetts obtain can be used for being integrally formed in each embodiment according to the gas closed component of this instruction.Gas purge system 2134 can be used for one or more inert gases in Purge gas closed component and system 2100, for example, and with all gas environment in the Purge gas closed component.As mentioned before, pass through gas purification loop 2130 in order to make gas circulation, gas purge system 2134 can have gas circulation unit, such as fan, air blast or motor etc.In this respect, gas purge system can be selected according to the volume of locking device, and it can be defined for the volume flow rate that makes inert gas move through gas purge system.Have until about 4m for comprising 3The gas closed component of gas closed component of volume and each embodiment of system; Can use and to move about 84m 3The gas purge system of/h.Have until about 10m for comprising 3The gas closed component of gas closed component of volume and each embodiment of system; Can use and to move about 155m 3The gas purge system of/h.For having about 52-114m 3Between each embodiment of gas closed component of volume; Can use more than a gas purge system.
Any suitable gas filter or purifier can be included in the gas purge system 2134 of this instruction.In certain embodiments, gas purge system can comprise two purifiers in parallel, thus device can off-line take away and safeguard being used for, and another device can be used for the operation of continuation system, and does not interrupt.In certain embodiments, for example, gas purge system can comprise one or more molecular sieves.In certain embodiments, gas purge system can comprise the first molecular sieve and the second molecular sieve at least, thereby saturated or think that otherwise in the time of can not enough effectively operating, system can switch to another molecular sieve, the molecular sieve of regenerate simultaneously saturated or poor efficiency at molecular sieve impurity.Control module can be provided for determining the operating efficiency of each molecular sieve, is used for switching between the operation of different molecular sieve, is used for regenerating one or more molecular sieves, or is used for its combination.As mentioned before, molecular sieve can be reproduced and reuse.
About the heat regulating system 2140 of Figure 25, at least one fluid cooler 2141 can be set, be used for the gaseous environment in refrigerating gas closed component and system 2100.For each embodiment of the gas closed component of this instruction, fluid cooler 2141 flows to heat exchanger in locking device with cooling fluid, and wherein, inert gas is through the filtration system of locking device inside.At least one fluid cooler can also be arranged in gas closed component and system 2100, with the cooling heat that comes from the equipment of gas locking device 2100 interior encapsulation.Such as but not limited to, at least one fluid cooler can also be provided for gas closed component and system 2100, with the cooling heat that comes from the OLED print system.Heat regulating system 2140 can comprise heat exchange or Peltier device, and can have various cooling capacities.For example, for each embodiment of gas closed component and system, cooler can be provided in about 2kW to the cooling capacity between about 20kW.Fluid cooler 1136 and 1138 can cooling one or more fluids.In certain embodiments, fluid cooler can use multiple fluid as cooling agent, such as but not limited to, water, antifreezing agent, cold-producing medium and combination thereof are as heat-exchange fluid.Suitable can be used for connecting about pipe and system unit without leaking the locking connection.
As Figure 26 and shown in Figure 27, one or more fan filter units can be configured to provide the roughly laminar flow by the gas of inside.According to each embodiment according to the gas closed component of this instruction, one or more fan units arrange the first inner surface near the gaseous environment locking device, and one or more pipe-line system entrances arrange relative the second inner surface near the gaseous environment locking device.For example, the gaseous environment locking device can comprise inner top and bottom inner rim, described one or more fan unit can arrange near inner top, described one or more pipe-line system entrance can comprise a plurality of entrance openings that arrange near the bottom inner rim, it is the part of pipe-line system, as shown in Figure 15-17.
Figure 26 is along the sectional view according to the length intercepting of the gas closed component of each embodiment of this instruction and system 2000.The gas closed component of Figure 26 and system 2000 can comprise gas locking device 1500 and gas purge system 2130 (also referring to Figure 25), heat regulating system 2140, filtration and the circulatory system 2150 and the pipe-line system 2170 that can hold OLED print system 50.Heat regulating system 2140 can comprise the fluid cooler 2141 that is communicated with cooler outlet circuit 2143 and cooler entrance circuit 2145 fluids.Cooling fluid can leave fluid cooler 2141, flow through cooler outlet circuit 2143, and flow to heat exchanger, for gas closed component shown in Figure 26 and each embodiment of system, it can be arranged near each of a plurality of fan filter units.Fluid can return to cooler 2141 by cooler entrance circuit 2145 near the heat exchanger fan filter unit, to remain on constant preferred temperature.As mentioned before, cooler outlet circuit 2141 and cooler entrance circuit 2143 are communicated with a plurality of heat exchanger fluid, comprise the first heat exchanger 2142, the second heat exchanger 2144 and the 3rd heat exchanger 2146.According to gas closed component shown in Figure 26 and each embodiment of system, the first heat exchanger 2142, the second heat exchanger 2144 and the 3rd heat exchanger 2146 respectively with the first fan filter unit 2152, the second fan filter unit 2154 and three fan filter unit 2156 thermal communications of filtration system 2150.
In Figure 26, many arrows show and come and go flowing of each fan filter unit, and also show flowing in the pipe-line system 2170 that comprises the first pipe-line system pipe 2173 and second pipe system pipes 2174, as shown in the rough schematic view of Figure 26.The first pipe-line system pipe 2173 can and can be discharged by the first pipe outlet 2175 by the first entrance 2171 receiver gases.Similarly, second pipe system pipes 2174 can export 2176 discharges by second pipe entrance 2172 receiver gases and by second pipe.In addition, as shown in figure 26, pipe-line system 2170 will cycle through in inside filtration system 2150 again by restriceted envelope 2180 effectively inert gas separately, space 2180 is communicated with gas purge system 2130 fluids via gas purification egress line 2131.Thisly comprise that the circulatory system for each embodiment of the described pipe-line system of Figure 15-17 provides roughly laminar flow, minimize turbulent flow, circulation, turnover and the filtration of the particulate matter of the gaseous environment of promotion in locking device inside, and circulation by the gas purge system of gas closed component outside is provided.
Figure 27 is along the sectional view according to the length intercepting of the gas closed component of each embodiment of the gas closed component of this instruction and system 23000.Similar with the gas closed component 2200 of Figure 26, the gas closed component system 2300 of Figure 27 can comprise gas locking device 1500, and it can hold OLED print system 50 and gas purge system 2130 (also referring to Figure 25), heat regulating system 2140, filtration and the circulatory system 2150 and pipe-line system 2170.Each embodiment for gas closed component 2300, heat regulating system 2140 can comprise the fluid cooler 2141 that is communicated with cooler outlet circuit 2143 and cooler entrance circuit 2145 fluids, can be communicated with a plurality of heat exchanger fluid, for example the first heat exchanger 2142 and the second heat exchanger 2144, as shown in figure 27.According to gas closed component shown in Figure 27 and each embodiment of system, each heat exchanger, for example the first heat exchanger 2142 and the second heat exchanger 2144, can with the circulation the inert gas thermal communication, by locating near pipe outlet, for example the outlet of the first pipe outlet 2175 of pipe-line system 2170 and second pipe 2176.In this respect, return so that the inert gas that filters can be by thermal conditioning before cycling through respectively the first fan filter unit 2152, the second fan filter unit 2154 and the three fan filter unit 2156 of the filtration system 2150 of Figure 27 for example from entrance (for example the first entrance 2171 and the second pipe entrance 2172 of pipe-line system 2170).
Can find out from the arrow of the direction of the inert gas that shows the locking device that cycles through Figure 26 and 27, the roughly laminar flow towards the bottom is provided to provide from the locking device top downwards fan filter unit.For example, can be from Flanders Corporation, of Washington, the fan filter unit that NorthCarolina or Envirco Corporation of Sanford, North Carolina obtain can be used for being formed integral in each embodiment according to the gas closed component of this instruction.Each embodiment of fan filter unit can exchange by between about 350 cubic feet/minutes (CFM) of the inert gas of each unit extremely about 700CFM.As shown in Figure 26 and 27, because fan filter unit is in parallel connection rather than series connection setting, thereby the element number of the amount of the inert gas that can exchange in comprising the system of a plurality of fan filter units and use is proportional.Near the bottom of locking device, gas flow guides towards a plurality of pipe-line system entrances, is schematically illustrated as the first entrance 2171 and second pipe entrance 2172 in Figure 26 and 27.As preamble for as described in Figure 15-17, entrance is positioned at the roughly bottom of locking device and makes gas flow downward from the top fan filter unit to be beneficial to the good turnover of the gaseous environment in locking device, and promote thorough turnover and movement by all gas environment of the gas purge system that is combined with locking device.Have enough to meet the need with thorough by the laminar flow that use is filtered and the circulatory system 2150 makes gaseous environment cycle through the gaseous environment in pipe-line system and promotion locking device, the inert gas flow that pipe-line system will cycle through gas purification loop 2130 separates, the level of every kind of reactive materials (for example water and oxygen, and every kind of solvent) for example can remain on 100ppm or lower, for example 1.0ppm or lower, 0.1ppm or lower in each embodiment of gas closed component.
According to each embodiment of the gas closed component system that is used for the OLED print system, the quantity of fan filter unit can be selected according to the physical location of the substrate in print system during process.Therefore, although 3 fan filter units have been shown in Figure 26 and 27, the quantity of fan filter unit can change.For example, Figure 28 is the sectional view along the intercepting of the length of gas closed component and system 2400, and itself and Figure 23 and gas closed component shown in Figure 24 and system class are seemingly.Gas closed component and system 2400 can comprise gas closed component 1500, and it holds the OLED print system 50 that is supported on base portion 52.During the OLED that the substrate suspending bench 54 of OLED print system is limited to substrate prints, substrate can move through the stroke of system 2400.Thereby the filtration system 2150 of gas closed component and system 2400 has the fan filter unit of suitable quantity; Shown in 2151-2155, corresponding by the physics stroke of OLED print system 50 with substrate during process.In addition, the fixed wheel exterior feature that the schematic cross sectional representation of Figure 28 has gone out each embodiment of gas locking device can reduce inert gas volume required during the OLED print procedure effectively, and the inside of being convenient to simultaneously near gas locking device 1500 (remotely approaches during process, for example use the gloves that are arranged in each gloves port, perhaps in the situation that attended operation is directly approaching by various detachable panels).
Each embodiment of gas locking device and system can use the pressurized inert gas recirculating system, is used for operating various pneumatic operation devices and equipment.In addition, as mentioned before, the embodiment of the gas closed component of this instruction can remain on slight positive pressure with respect to external environment condition, such as but not limited between the extremely about 8mbarg of about 2mbarg.Keep the pressurized inert gas recirculating system that challenge may be arranged in gas closed component system, because it has the dynamic balance play with continue carry out relevant with the slight positive internal pressure that keeps gas closed component and system, and introduces continuously gas-pressurized in gas closed component and system simultaneously.In addition, the variable demand of each device and equipment may form the various gas closed components of this instruction and the irregular pressure curve of system.To keep with respect to the gas closed component that external environment condition remains on slight positive pressure the dynamic pressure balance can be provided for continuing the globality of the OLED print procedure that carries out under this condition.
As shown in figure 29, each embodiment of gas closed component and system 3000 can have extraneous gas loop 2500, is used for integrating and control inert gas source 2509 and clean dry air (CDA) source 2512 of the various aspects of the operation that is used for gas closed component and system 3000.It will be appreciated by the skilled addressee that gas closed system 3000 can also comprise that internal particle filters and each embodiment of gas-circulating system and each embodiment of extraneous gas cleaning system, as mentioned before.Except external circuit 2500 that be used for to integrate and control inert gas source 2509 and CDA source 2512, gas closed component and system 3000 can have compressor loop 2160, it can supplying inert gas, is used for each device and equipment that operation may be arranged on gas closed component and system 3000 inside.
The compressor loop 2160 of Figure 29 can comprise compressor 2162, the first reservoir 2164 and the second reservoir 2168 that is configured to the fluid connection.Compressor 2162 can be configured to the inert gas from 1500 suctions of gas closed component is compressed to desired pressure.The entrance side of compressor loop 2160 can be communicated with gas closed component 1500 fluids by the circuit 2503 with valve 2505 and check-valves 2507 via gas closed component outlet 2501.Compressor loop 2160 can be on the outlet side of compressor loop 2160 be communicated with gas closed component 1500 fluids via extraneous gas loop 2500.Reservoir 2164 can be arranged between the joint portion in compressor 2162 and compressor loop 2160 and extraneous gas loop 2500, and can be configured to produce 5psig or higher pressure.The second reservoir 2168 can be in compressor loop 2160, is used for the fluctuation that damping causes with about 60Hz circulation due to compressor piston.For each embodiment of compressor loop 2160, the first reservoir 2164 can have the capacity between about 80 gallons to about 160 gallons, and the second reservoir can have the capacity between about 30 gallons to about 60 gallons.According to each embodiment of gas closed component and system 3000, compressor 2162 can be the zero compressor (zero ingress compressor) that enters.Various types of zero enters compressor can be in the situation that do not have environmental gas to operate in leaking into each embodiment of the gas closed component of this instruction and system.Zero each embodiment that enters compressor can move continuously, for example during utilization needs the OLED print procedure of purposes of each device of compressed inert and equipment.
Reservoir 2164 can be configured to receive and gather compressed inert from compressor 2162.Reservoir 2164 can be supplied to compressed inert gas closed component 1500 when needed.For example, reservoir 2164 can provide the pressure of all parts of gas to keep gas closed component 1500, such as but not limited to as lower one or more: pneumatic robot, substrate suspending bench, air bearing, air lining, Compressed Gas instrument, pneumatic actuator and combination thereof.For as shown in gas closed component and system 3000, gas closed component 1500 can have the OLED print system 50 that is encapsulated in wherein as Figure 29.As shown in figure 24, OLED print system 50 can be supported by granite level 52, and can comprise substrate suspending bench 54, be used for substrate feed to printhead chamber correct position and during the OLED print procedure support base.In addition, the air bearing 58 that is supported on bridge 56 can replace for example linear mechanical bearing use.For the gas locking device of this instruction and each embodiment of system, use various pneumatic operation devices and equipment can provide low particle to generate performance and the low cost of safeguarding.Compressor loop 2160 can be configured to pressurized inert gas is supplied to continuously each device and the equipment of gas provision for sealing 3000.Except the supplied with pressurized inert gas, the substrate suspending bench 54 of OLED print system 50 (it uses the air bearing technology) is also used vacuum system 2550, and vacuum system 2550 is communicated with gas closed component 1500 by circuit 2552 when valve 2554 is shown in an open position.
Can have according to the pressurized inert gas recirculating system of this instruction the pressure control bypass circulation 2165 that is used for as shown in figure 29 compressor loop 2160, it is in order to compensating during use the variable demand of gas-pressurized, thereby the dynamic equilibrium of each embodiment of the gas closed component of this instruction and system is provided.For according to the gas closed component of this instruction and each embodiment of system, bypass circulation can keep the constant pressure in reservoir 2164, and does not disturb or change pressure in locking device 1500.Bypass circulation 2165 can have the first bypass inlet valve 2162 on the entrance side that is positioned at bypass circulation 2165, and it is closed, unless use bypass circulation 2165.Bypass circulation 2165 can also have back pressure regulator, and it can use when second valve 2163 is closed.Bypass circulation 2165 can have second reservoir 2168 at the outlet side place that is arranged on bypass circulation 2165.For using zero embodiment that enters the compressor loop 2160 of compressor, bypass circulation 2165 can compensate gas closed component and system between the operating period along with the time through the little skew of contingent pressure.When bypass inlet valve 2161 was shown in an open position, bypass circulation 2165 can be communicated with compressor loop 2160 fluids on the entrance side of bypass circulation 2165.When bypass inlet valve 2161 is opened, can not satisfy needs in gas closed component 1500 inside if come from the inert gas of compressor loop 2160, the inert gas by bypass circulation 2165 shuntings can be recycled to compressor so.When the inert gas pressure in reservoir 2164 surpassed predetermined threshold value pressure, compressor loop 2160 was configured to the inert gas shunting by bypass circulation 2165.The predetermined threshold value pressure of reservoir 2164 can be approximately between the extremely about 200psig of 25psig when the flow rate of about at least 1 cubic feet/minute (cfm), perhaps can be approximately between the extremely about 150psig of 50psig when the flow rate of about at least 1 cubic feet/minute (cfm), perhaps can be at about 75psig to approximately between 125psig when the about at least 1 cubic feet/flow rate of minute (cfm), perhaps can be at about 90psig to approximately between 95psig when the flow rate of about at least 1 cubic feet/minute (cfm).
Each embodiment of compressor loop 2160 can use the various compressors that enter compressor except zero, and for example variable speed compressor maybe can be controlled in the compressor of the state of opening or closing.As mentioned before, zero enter compressor and guarantee not have the environment reaction material can introduce gas closed component and system.Thereby, prevent that any compressor configuration of environment reaction material introducing gas closed component and system may be used to compressor loop 2160.According to each embodiment, the compressor 2162 of gas closed component and system 3000 can be contained in such as but not limited in the gas-tight seal housing.Enclosure interior can be configured to be communicated with the inert gas source fluid, for example forms the identical inert gas of the inert gas environment of gas closed component 1500.For each embodiment of compressor loop 2160, compressor 2162 can be controlled at constant speed to keep constant pressure.Do not using zero to enter other embodiment of compressor loop 2160 of compressor, compressor 2162 can cut out when reaching max-thresholds pressure and open when reaching minimum threshold pressure.
At the Figure 30 that is used for gas closed component and system 3100, air blast loop 2170 and blower vacuum loop 2550 demonstrations are used for the substrate suspending bench 54 of operation OLED print system 50, and it is contained in gas closed component 1500.For as described in compressor loop 2160, air blast loop 2170 can be configured to pressurized inert gas is supplied to substrate suspending bench 54 continuously as preamble.
Can use each embodiment of the gas closed component of pressurized inert gas recirculating system and system can have the various loops of using various pressurized-gas sources, for example at least a in compressor, air blast and combination thereof.At the Figure 30 that is used for gas closed component and system 3100, compressor loop 2160 can be communicated with extraneous gas loop 2500 fluids, and it can supply to be applied to the inert gas of high flow rate manifold 2525 and low consumption manifold 2513.For according to the gas closed component of this instruction and each embodiment of system, as being used for the shown in Figure 29 of gas closed component and system 3000, high flow rate manifold 2525 can be used for inert gas is supplied to various devices and equipment, such as but not limited to as lower one or more: substrate suspending bench, pneumatic robot, air bearing, air lining and Compressed Gas instrument and combination thereof.For according to the gas closed component of this instruction and each embodiment of system, low consumption manifold 2513 can be used for inert gas is supplied to various devices and equipment, such as but not limited to as lower one or more: isolator and pneumatic actuator and combination thereof.
Each embodiment for gas closed component and system 3100, air blast loop 2170 can be used for pressurized inert gas is supplied to each embodiment of substrate suspending bench 54, and the compressor loop 2160 that is communicated with extraneous gas loop 2500 fluids can be used for pressurized inert gas be supplied to such as but not limited to as lower one or more: pneumatic robot, air bearing, air lining and Compressed Gas instrument and make up.Except the supplied with pressurized inert gas, use the substrate suspending bench 54 of the OLED print system 50 of air bearing technology also to use blower vacuum system 2550, blower vacuum system 2550 is communicated with gas closed component 1500 by circuit 2552 when valve 2554 is shown in an open position.The housing 2172 in air blast loop 2170 can be supplied to the inert gas pressurized source the first air blast 2174 of substrate suspending bench 54 and remain in inert gas environment as the second air blast 2550 of the vacuum source of substrate suspending bench 54.The attribute that can make the air blast of the pressurized inert gas of each embodiment that is suitable as the substrate suspending bench or vacuum source comprise such as but not limited to: they have high reliability, make them have the low cost of safeguarding; Has variable speed control; And the volume flow with wide region (can be provided at about 100m 3/ h is to about 2500m 3Each embodiment of volume flow between/h).Each embodiment in air blast loop 2170 can also have at first isolating valve 2173 at the arrival end place of compressor loop 2170 and at check-valves 2175 and second isolating valve 2177 at the port of export place of compressor loop 2170.The heat exchanger 2178 that each embodiment in air blast loop 2170 can have adjustable valve 2176 (can be such as but not limited to sluice valve, butterfly valve, needle valve or globe valve) and be used for the inert gas from blower assembly 2170 to substrate suspension system 54 is remained on limiting temperature.
Figure 30 shows also extraneous gas shown in Figure 29 loop 2500, is used for integrating and control inert gas source 2509 and clean dry air (CDA) source 2512 of various aspects of the operation of the gas closed component of the gas closed component that is used for Figure 29 and system 3000 and Figure 30 and system 3100.The extraneous gas loop 2500 of Figure 29 and Figure 30 can comprise at least four mechanical valve.These valves comprise the first mechanical valve 2502, the second mechanical valve 2504, the 3rd mechanical valve 2506 and the 4th mechanical valve 2508.These each valves are arranged in the position of each flow circuits, allow to control inert gas (for example, nitrogen, any rare gas and any combination thereof) and air-source (for example, clean dry air (CDA)) both.Housing inert gas circuit 2510 extends from housing inert gas source 2509.Housing inert gas circuit 2510 continues to extend linearly as low consumption manifold line 2152, and low consumption manifold line 2152 is communicated with low consumption manifold 2513 fluids.Cross link First section 2514 is extended from the first mobile joint portion 2516, and the first mobile joint portion 2516 is positioned at the cross part place of housing inert gas circuit 2510, low consumption manifold line 2152 and cross link First section 2514.Cross link First section 2514 extends to the second mobile joint portion 2518.Compressor inert gas circuit 2520 extends and ends at second joint portion 2518 of flowing from the reservoir 2164 of compressor loop 2160.CDA circuit 2522 is from CDA source 2512 extensions and as 2524 continuation of high flow rate manifold line, high flow rate manifold line 2524 is communicated with high flow rate manifold 2525 fluids.The 3rd flow combinations section 2526 is positioned at the cross part place of second section 2528 of cross link, clean dry air circuit 2522 and high flow rate manifold line 2524.Second section 2528 of cross link extends to the 3rd flow combinations section 2526 from second joint portion 2518 of flowing.
About the description in extraneous gas loop 2500 and with reference to Figure 31, be below the general introduction of some each operator schemes, Figure 31 is the form of valve position of each operator scheme of gas closed component and system.
The form of Figure 31 shows procedure schema, and wherein, the valve state produces only inert gas compressor operator scheme.In procedure schema, as shown in figure 30 and as shown in the valve state of Figure 31, the first mechanical valve 2502 and the 3rd mechanical valve 2506 are in closes configuration.The second mechanical valve 2504 and the 4th mechanical valve 2508 are in opens configuration.Due to these concrete valves configurations, compressed inert be allowed to flow to low consumption manifold 2513 and high flow rate manifold 2525 both.Under normal operation, the clean dry air that comes from the inert gas of housing inert gas source and come from the CDA source is prevented from flowing to any in low consumption manifold 2513 and high flow rate manifold 2525.
As shown in figure 31 and with reference to Figure 30, exist to be used for the series of valves state safeguarding and recover.The gas closed component of this instruction can need to safeguard every now and then, need from system failure recovery in addition.In this concrete pattern, the second mechanical valve 2504 and the 4th mechanical valve 2508 are in closes configuration.The first mechanical valve 2502 and the 3rd mechanical valve 2506 are in opens configuration.Housing inert gas source and CDA source provide inert gas, are in low consumption and also have those parts that during restoration are difficult to the dead volume that effectively purges to be supplied to by low consumption manifold 2513.The example of this parts comprises pneumatic actuator.Comparatively speaking, those parts of consumption can be by means of high flow rate manifold 2525 supply CDA during safeguarding.Use valve 2504,2508,2530 isolation compressors to prevent that reactive materials (for example, oxygen and water vapour) from polluting the inert gas in compressor and reservoir.
After safeguarding or recovering to complete, the gas closed component must be by a plurality of cycle purge, until the reactive environments material (for example, the oxygen G﹠W) reach the enough low-level of every kind of material, for example 100ppm or lower, for example 10ppm or lower, 1.0ppm or lower or 0.1ppm or lower.As shown in figure 31 and with reference to Figure 30, during purge mode, the 3rd mechanical valve 2506 is closed and the 5th mechanical valve 2530 also is in and closes configuration.The first mechanical valve 2502, the second mechanical valve 2504 and the 4th mechanical valve 2508 are in opens configuration.Due to this concrete valve configuration, only the housing inert gas be allowed to flow and be allowed to flow to low consumption manifold 2513 and high flow rate manifold 2525 both.
As shown in figure 31 and with reference to Figure 30, " without flowing " pattern and leak-testing pattern are the patterns of using as required." without flowing " pattern is the pattern with following valve state configuration: the first mechanical valve 2502, the second mechanical valve 2504, the 3rd mechanical valve 2506 and the 4th mechanical valve 2508 all are in closes configuration.This closes " without flowing " pattern that configuration causes system, and wherein, any gas that comes from inert gas, CDA or compressor source all can not arrive low consumption manifold 2513 or high flow rate manifold 2525.This " without flow pattern " may be useful when not using in system, and can extend the maintenance free time in the period.The leak-testing pattern can be for detection of the leakage in system.The leak-testing pattern is used compressed inert exclusively, its with system from high flow rate manifold 2525 isolation of Figure 30 in order to the low consumption parts (for example, isolator and pneumatic actuator) of low consumption manifold 2513 are carried out leak test.In this leak-testing pattern, the first mechanical valve 2502, the 3rd mechanical valve 2506 and the 4th mechanical valve 2508 all are in closes configuration.Only the second mechanical valve 2504 is in and opens configuration.Therefore, compressed nitrogen can flow to low consumption manifold 2513 from compressor inert gas source 2519, and there is no the gas flow to high flow rate manifold 2525.
All publications, patent and the patent application of mentioning in this specification all as each independent publication, patent and patent application indicate specially and independently on degree identical introducing by reference and be incorporated herein by reference.
Although show and described embodiment of the present disclosure at this paper, those skilled in the art are with clear, this embodiment only provides by way of example.Do not departing from situation of the present disclosure, those skilled in the art will expect now many modification, variation and substitute.Should be understood that, can adopt the various replacement schemes of disclosure embodiment as herein described when putting into practice the disclosure.Claims are intended to limit the scope of the present disclosure, and are encompassed in thus the method and structure in these claims and equivalent scope thereof.

Claims (15)

1. a gas closed component and system comprise:
The gas closed component that comprises a plurality of framing component assemblies, wherein, described framing component assembly is by sealably in conjunction with to limit inside;
Inert gas environment, described inert gas environment are contained in described inside and comprise and all be in 100ppm or still less water and the oxygen of level; And
The pressurized inert gas recirculating system, described pressurized inert gas recirculating system comprises:
Compressor loop, described compressor loop comprises and the entrance of described internal fluid communication, and the outlet of described internal fluid communication, comprise described entrance and exit loop path, be arranged on the compressor between entrance and exit and be arranged on reservoir between compressor and outlet along described loop path along described loop path, wherein, described reservoir arrangements becomes to receive and gather the compressed inert that comes from compressor.
2. gas closed component according to claim 1 and system also comprise:
Pressure is controlled bypass circulation, and wherein, the bypass circulation entrance is communicated with compressor loop path fluid via the bypass inlet valve, and the position that bypass exports between bypass inlet valve and compressor is communicated with compressor loop path fluid.
3. also comprise according to claim 1 or gas closed component claimed in claim 2 and system:
Air blast loop, described air blast loop comprise and the entrance of described internal fluid communication, and the outlet of described internal fluid communication, comprise described entrance and exit loop path, be arranged on adjustable valve between air blast and outlet along described loop path.
4. gas closed component according to claim 3 and system wherein, control bypass via pressure when the pressure that described compressor loop is configured to the inert gas environment in reservoir surpasses predetermined threshold value pressure and recycle pressurized inert gas.
5. gas closed component according to claim 4 and system, wherein, described compressor loop is configured to the pressure of the inert gas environment in reservoir over recycle pressurized inert gas via pressure control bypass when approximately 25psig is to the predetermined threshold value pressure between about 200psig.
6. gas closed component according to claim 3 and system, also comprise the equipment that is arranged in described inside, described equipment is by using the pressurized inert gas that is produced by the pressurized inert gas recirculating system to operate, wherein, described equipment can be with lower one or more: pneumatic robot, substrate suspending bench, air bearing, air lining, Compressed Gas instrument, pneumatic actuator and combination thereof.
7. gas closed component according to claim 3 and system, wherein, the seal that forms for the framing component assembly of each sealably combination is gasket seal.
8. gas closed component according to claim 7 and system, wherein, made by closed air chamber polymer pad sheet material for the pad of the framing component assembly that seals each sealably combination.
9. gas closed component according to claim 3 and system, wherein, each framing component assembly comprises the framing component with a plurality of panel part sections, wherein, each panel part section has the panel that sealably is arranged in each panel part section.
10. gas closed component according to claim 9 and system, wherein, the seal that forms for each panel in each the panel part section that sealably is arranged on framing component comprises gasket seal.
11. gas closed component according to claim 10 and system, wherein, the pad of each panel that is used for each panel part section of seal frame member is made by closed air chamber polymer pad sheet material.
12. gas closed component according to claim 3 and system, wherein, the gas locking device is hermetically sealed.
13. a gas closed component and system comprise:
The gas closed component that comprises a plurality of framing component assemblies, wherein, described framing component assembly is by sealably in conjunction with to limit inside;
Be arranged on gas circulation and filtration system in described inside, for the circulation of the inert gas that described inside is provided and from its removal particulate matter;
Gas purge system, described gas purge system is outside at the gas closed component, and can make the inert gas that is contained in described inside cycle through gas purge system, the water in described inside and each the level in oxygen are remained on 100ppm or still less;
Be arranged on the pipe-line system assembly in described inside, wherein, described pipe-line system assembly is communicated with gas circulation and filtration system fluid in described inside, and with the gas purge system of gas closed component outside independently fluid be communicated with, thereby all inert gases basically that cycle through gas circulation and filtration system and gas purge system all are drawn through pipe-line system; And
Bundle, described bundle comprise at least a in cable, electric wire, fluid containment pipeline and combination thereof, and wherein, described bundle is arranged in described pipe-line system basically.
14. gas closed component according to claim 13 and system, wherein, the multiple environment composition that is trapped in the dead volume of described bundle can be purged from dead volume by the inert gas of suction by pipe-line system.
15. gas closed component according to claim 13 and system, wherein, described gas circulation and filtration system are configured to provide the roughly laminar flow by the gas of inside.
CN201210596572.1A 2011-12-22 2012-12-24 Gas confinement system Active CN103171286B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610692510.9A CN106274054B (en) 2011-12-22 2012-12-24 Gas confinement system
CN201610837821.XA CN107029931B (en) 2011-12-22 2012-12-24 Gas enclosure system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161579233P 2011-12-22 2011-12-22
US61/579233 2011-12-22
US13/720830 2012-12-19
US13/720,830 US8899171B2 (en) 2008-06-13 2012-12-19 Gas enclosure assembly and system

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201610692510.9A Division CN106274054B (en) 2011-12-22 2012-12-24 Gas confinement system
CN201610837821.XA Division CN107029931B (en) 2011-12-22 2012-12-24 Gas enclosure system

Publications (2)

Publication Number Publication Date
CN103171286A true CN103171286A (en) 2013-06-26
CN103171286B CN103171286B (en) 2016-09-07

Family

ID=48631677

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201610837821.XA Active CN107029931B (en) 2011-12-22 2012-12-24 Gas enclosure system
CN201210596572.1A Active CN103171286B (en) 2011-12-22 2012-12-24 Gas confinement system
CN201220754157.XU Expired - Lifetime CN203666124U (en) 2011-12-22 2012-12-24 Gas enclosing system
CN201610692510.9A Active CN106274054B (en) 2011-12-22 2012-12-24 Gas confinement system

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201610837821.XA Active CN107029931B (en) 2011-12-22 2012-12-24 Gas enclosure system

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201220754157.XU Expired - Lifetime CN203666124U (en) 2011-12-22 2012-12-24 Gas enclosing system
CN201610692510.9A Active CN106274054B (en) 2011-12-22 2012-12-24 Gas confinement system

Country Status (1)

Country Link
CN (4) CN107029931B (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106591777A (en) * 2017-01-05 2017-04-26 利亚德光电股份有限公司 Film plating tool and method of LED display screen
CN106795386A (en) * 2014-07-25 2017-05-31 科迪华公司 Organic film ink composite and method
CN107253404A (en) * 2013-10-02 2017-10-17 科迪华公司 Apparatus and method for controlling printing interval
CN107611287A (en) * 2014-01-21 2018-01-19 科迪华公司 Equipment and technology for electronic device package
CN107922766A (en) * 2015-08-31 2018-04-17 科迪华公司 Organic film ink composite based on two and single (methyl) acrylate
CN110281668A (en) * 2014-07-18 2019-09-27 科迪华公司 The gas confinement system and method for being recycled and being filtered using multizone
US10851450B2 (en) 2008-06-13 2020-12-01 Kateeva, Inc. Method and apparatus for load-locked printing
US10900678B2 (en) 2008-06-13 2021-01-26 Kateeva, Inc. Gas enclosure assembly and system
US11034176B2 (en) 2008-06-13 2021-06-15 Kateeva, Inc. Gas enclosure assembly and system
US11107712B2 (en) 2013-12-26 2021-08-31 Kateeva, Inc. Techniques for thermal treatment of electronic devices
CN114273154A (en) * 2014-11-26 2022-04-05 科迪华公司 Environmentally controlled coating system
CN114434972A (en) * 2016-07-18 2022-05-06 科迪华公司 Printing system components and techniques
US11338319B2 (en) 2014-04-30 2022-05-24 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
US11633968B2 (en) 2008-06-13 2023-04-25 Kateeva, Inc. Low-particle gas enclosure systems and methods
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113524917B (en) * 2015-07-31 2023-11-28 科迪华公司 Ink delivery system and method
CN108995379B (en) * 2018-07-27 2020-07-24 深圳市华星光电技术有限公司 Ink-jet printing system and method for panel manufacturing process

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1445089A (en) * 2002-03-15 2003-10-01 精工爱普生株式会社 Through structure of sealed chamber connecting pipeline, device with the structure and its making method
CN1956209A (en) * 2002-01-23 2007-05-02 精工爱普生株式会社 Organic el device, manufacturing device thereof, electronic device and liquid droplet ejection apparatus
CN101357541A (en) * 2007-08-02 2009-02-04 精工爱普生株式会社 Liquid droplet ejection apparatus, method of manufacturing electro-optical apparatus, and electro-optical apparatus
CN101396918A (en) * 2007-08-27 2009-04-01 精工爱普生株式会社 Suction device, suction system, and liquid droplet ejection apparatus having the device or the system, as well as electro-optical apparatus and manufacturing method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375304B1 (en) * 2000-02-17 2002-04-23 Lexmark International, Inc. Maintenance mist control
JP2002069650A (en) * 2000-08-31 2002-03-08 Applied Materials Inc Method and apparatus for vapor phase deposition, and method and device for manufacturing semiconductor device
JP4423082B2 (en) * 2004-03-29 2010-03-03 京セラ株式会社 Gas nozzle, manufacturing method thereof, and thin film forming apparatus using the same
US7354845B2 (en) * 2004-08-24 2008-04-08 Otb Group B.V. In-line process for making thin film electronic devices
KR100659057B1 (en) * 2004-07-15 2006-12-21 삼성에스디아이 주식회사 Mask frame assembly for thin layer vacuum evaporation and organic electro-luminescence display device
KR100668309B1 (en) * 2004-10-29 2007-01-12 삼성전자주식회사 Manufacturing method of nozzle plate
JP4459037B2 (en) * 2004-12-01 2010-04-28 キヤノン株式会社 Liquid discharge head
CN201446232U (en) * 2009-07-10 2010-05-05 西北工业大学 Inert atmosphere control device for enclosed circulating purification

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1956209A (en) * 2002-01-23 2007-05-02 精工爱普生株式会社 Organic el device, manufacturing device thereof, electronic device and liquid droplet ejection apparatus
CN1445089A (en) * 2002-03-15 2003-10-01 精工爱普生株式会社 Through structure of sealed chamber connecting pipeline, device with the structure and its making method
CN101357541A (en) * 2007-08-02 2009-02-04 精工爱普生株式会社 Liquid droplet ejection apparatus, method of manufacturing electro-optical apparatus, and electro-optical apparatus
CN101396918A (en) * 2007-08-27 2009-04-01 精工爱普生株式会社 Suction device, suction system, and liquid droplet ejection apparatus having the device or the system, as well as electro-optical apparatus and manufacturing method thereof

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10851450B2 (en) 2008-06-13 2020-12-01 Kateeva, Inc. Method and apparatus for load-locked printing
US11230757B2 (en) 2008-06-13 2022-01-25 Kateeva, Inc. Method and apparatus for load-locked printing
US11034176B2 (en) 2008-06-13 2021-06-15 Kateeva, Inc. Gas enclosure assembly and system
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US10900678B2 (en) 2008-06-13 2021-01-26 Kateeva, Inc. Gas enclosure assembly and system
US11633968B2 (en) 2008-06-13 2023-04-25 Kateeva, Inc. Low-particle gas enclosure systems and methods
CN107253404A (en) * 2013-10-02 2017-10-17 科迪华公司 Apparatus and method for controlling printing interval
CN107264083A (en) * 2013-10-02 2017-10-20 科迪华公司 Apparatus and method for controlling printing interval
CN107264083B (en) * 2013-10-02 2019-11-19 科迪华公司 For controlling the device and method of printing interval
US11107712B2 (en) 2013-12-26 2021-08-31 Kateeva, Inc. Techniques for thermal treatment of electronic devices
CN107611287A (en) * 2014-01-21 2018-01-19 科迪华公司 Equipment and technology for electronic device package
US11489119B2 (en) 2014-01-21 2022-11-01 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
US11338319B2 (en) 2014-04-30 2022-05-24 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
CN110281668A (en) * 2014-07-18 2019-09-27 科迪华公司 The gas confinement system and method for being recycled and being filtered using multizone
CN106795386A (en) * 2014-07-25 2017-05-31 科迪华公司 Organic film ink composite and method
CN114273154A (en) * 2014-11-26 2022-04-05 科迪华公司 Environmentally controlled coating system
CN107922766A (en) * 2015-08-31 2018-04-17 科迪华公司 Organic film ink composite based on two and single (methyl) acrylate
CN114434972A (en) * 2016-07-18 2022-05-06 科迪华公司 Printing system components and techniques
CN114434972B (en) * 2016-07-18 2023-09-29 科迪华公司 Printing system assembly and techniques
CN106591777B (en) * 2017-01-05 2019-11-08 利亚德光电股份有限公司 The film coating jig and film plating process of LED display
CN106591777A (en) * 2017-01-05 2017-04-26 利亚德光电股份有限公司 Film plating tool and method of LED display screen

Also Published As

Publication number Publication date
CN106274054A (en) 2017-01-04
CN103171286B (en) 2016-09-07
CN107029931A (en) 2017-08-11
CN107029931B (en) 2020-11-03
CN106274054B (en) 2018-04-17
CN203666124U (en) 2014-06-25

Similar Documents

Publication Publication Date Title
CN203666124U (en) Gas enclosing system
US11034176B2 (en) Gas enclosure assembly and system
CN203854316U (en) Combination unit of gas enclosed assembly and systems
US10900678B2 (en) Gas enclosure assembly and system
JP6605089B2 (en) Gas enclosure assembly and system
CN105190860B (en) Gas confinement system and the method for utilizing supplemental closure device
US10442226B2 (en) Gas enclosure assembly and system
JP5902872B2 (en) Gas enclosure assembly and system
TWI542839B (en) Gas enclosure assembly and system
US11975546B2 (en) Gas enclosure assembly and system
US20210108811A1 (en) Gas enclosure assembly and system

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20201105

Address after: 326 Yinqiao Road, Yuecheng District, Shaoxing City, Zhejiang Province

Patentee after: Kedihua display technology (Shaoxing) Co., Ltd

Address before: California, USA

Patentee before: Codiva

TR01 Transfer of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Gas seal system

Effective date of registration: 20210126

Granted publication date: 20160907

Pledgee: Shaoxing Binhai New Area integrated circuit industry equity investment fund partnership (L.P.)

Pledgor: Kedihua display technology (Shaoxing) Co., Ltd

Registration number: Y2021990000110

PE01 Entry into force of the registration of the contract for pledge of patent right