ZA954134B - Wave soldering apparatus and process - Google Patents

Wave soldering apparatus and process

Info

Publication number
ZA954134B
ZA954134B ZA954134A ZA954134A ZA954134B ZA 954134 B ZA954134 B ZA 954134B ZA 954134 A ZA954134 A ZA 954134A ZA 954134 A ZA954134 A ZA 954134A ZA 954134 B ZA954134 B ZA 954134B
Authority
ZA
South Africa
Prior art keywords
soldering apparatus
wave soldering
wave
soldering
Prior art date
Application number
ZA954134A
Other languages
English (en)
Inventor
Harbhajan S Nayar
Sean M Adams
Neeraj Saxena
Bohdan A Wasiczko
Original Assignee
Boc Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boc Group Inc filed Critical Boc Group Inc
Publication of ZA954134B publication Critical patent/ZA954134B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
ZA954134A 1994-05-31 1995-05-19 Wave soldering apparatus and process ZA954134B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/251,055 US5509598A (en) 1994-05-31 1994-05-31 Wave soldering apparatus and process

Publications (1)

Publication Number Publication Date
ZA954134B true ZA954134B (en) 1996-04-02

Family

ID=22950291

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA954134A ZA954134B (en) 1994-05-31 1995-05-19 Wave soldering apparatus and process

Country Status (9)

Country Link
US (1) US5509598A (de)
EP (1) EP0685287B1 (de)
KR (1) KR950035550A (de)
CN (1) CN1115560A (de)
AU (1) AU1798195A (de)
CA (1) CA2148210A1 (de)
DE (1) DE69500904D1 (de)
PH (1) PH30880A (de)
ZA (1) ZA954134B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3306468B2 (ja) * 1997-10-30 2002-07-24 セレスティカ・ジャパン・イーエムエス株式会社 自動ハンダ付け機構及びその機構を用いる装置並びにそのハンダ付け方法
DE19749185A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Mit einer Gasversorgung verbindbare Gasverteilung
US6326797B2 (en) * 1998-03-04 2001-12-04 International Business Machines Corporation Apparatus and method for evaluating printed circuit board assembly manufacturing processes
DE19955659A1 (de) * 1999-11-19 2001-05-31 Messer Griesheim Gmbh Verfahren und Vorrichtung zum flussmittelfreien Löten mit reaktivgasangereicherten Metallschmelzen
NL1017843C2 (nl) * 2001-04-12 2002-10-22 Vitronics Soltec B V Inrichting voor selectief solderen.
TW200610122A (en) * 2004-09-14 2006-03-16 P Kay Metal Inc Soldering process
DE502007006711D1 (de) * 2006-05-23 2011-04-28 Linde Ag Vorrichtung und Verfahren zum Wellenlöten
US20090261147A1 (en) * 2008-04-22 2009-10-22 Lambertus Petrus Christinus Willemen Dross Removal
FR2946271B1 (fr) * 2009-06-04 2011-08-05 Air Liquide Procede et installation de traitement de l'alliage de tout ou partie de la zone "morte" du bain de soudure d'une machine de brasage ou etamage a la vague, visant a eliminer tout ou partie des scories d'oxyde formees dans le bain de
US8220699B2 (en) * 2010-03-12 2012-07-17 Air Products And Chemicals, Inc. Apparatus and method for providing an inerting gas during soldering
SG174695A1 (en) * 2010-03-12 2011-10-28 Air Prod & Chem Apparatus and method for providing an inerting gas during soldering
US8146792B2 (en) * 2010-03-16 2012-04-03 Flextronics Ap, Llc Solder return for wave solder nozzle
US20130045131A1 (en) * 2011-08-17 2013-02-21 Honeywell International Inc. Lead-Free Solder Compositions
CN114226907B (zh) * 2022-02-23 2022-04-26 飞荣达科技(江苏)有限公司 一种助焊剂流体压力控制装置
CN115476015A (zh) * 2022-11-01 2022-12-16 成都科力深传感技术有限公司 一种钎焊钎料敷设方法
CN117798451B (zh) * 2024-03-01 2024-04-30 深圳市志胜威电子设备有限公司 一种选择性波峰焊喷锡装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5731195A (en) * 1980-08-01 1982-02-19 Aiwa Co Method of soldering leadless electric part
GB2083773B (en) * 1980-08-01 1984-10-24 Aiwa Co A soldering method for electric and/or electronic components
JPS57169295A (en) * 1981-04-10 1982-10-18 Aiwa Co Method of soldering electric part or like
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
US5203489A (en) * 1991-12-06 1993-04-20 Electrovert Ltd. Gas shrouded wave soldering
US5297724A (en) * 1993-05-26 1994-03-29 The Boc Group, Inc. Wave soldering method and apparatus
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations

Also Published As

Publication number Publication date
EP0685287B1 (de) 1997-10-22
PH30880A (en) 1997-12-23
DE69500904D1 (de) 1997-11-27
CA2148210A1 (en) 1995-12-01
AU1798195A (en) 1995-12-07
EP0685287A1 (de) 1995-12-06
US5509598A (en) 1996-04-23
CN1115560A (zh) 1996-01-24
KR950035550A (ko) 1995-12-30

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