ZA706968B - Electroless copper plating solution and process - Google Patents

Electroless copper plating solution and process

Info

Publication number
ZA706968B
ZA706968B ZA706968A ZA706968A ZA706968B ZA 706968 B ZA706968 B ZA 706968B ZA 706968 A ZA706968 A ZA 706968A ZA 706968 A ZA706968 A ZA 706968A ZA 706968 B ZA706968 B ZA 706968B
Authority
ZA
South Africa
Prior art keywords
plating solution
copper plating
electroless copper
electroless
solution
Prior art date
Application number
ZA706968A
Other languages
English (en)
Inventor
K Hacias
Original Assignee
Hooker Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemical Corp filed Critical Hooker Chemical Corp
Publication of ZA706968B publication Critical patent/ZA706968B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Lubricants (AREA)
  • Chemical Treatment Of Metals (AREA)
ZA706968A 1969-12-30 1970-10-13 Electroless copper plating solution and process ZA706968B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88930969A 1969-12-30 1969-12-30

Publications (1)

Publication Number Publication Date
ZA706968B true ZA706968B (en) 1971-07-28

Family

ID=25394885

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA706968A ZA706968B (en) 1969-12-30 1970-10-13 Electroless copper plating solution and process

Country Status (13)

Country Link
US (1) US3664852A (ja)
JP (1) JPS491130B1 (ja)
AT (1) AT298928B (ja)
BE (1) BE759316A (ja)
CA (1) CA922056A (ja)
CH (1) CH536881A (ja)
DE (1) DE2055085A1 (ja)
ES (1) ES386925A1 (ja)
FR (1) FR2071915A5 (ja)
GB (1) GB1280260A (ja)
NL (1) NL7018320A (ja)
SE (1) SE363853B (ja)
ZA (1) ZA706968B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2053860C3 (de) * 1970-10-29 1980-11-06 Schering Ag Saures wäßriges Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
ES529705A0 (es) * 1983-02-21 1984-11-01 Rca Corp Perfeccionamientos introducidos en un circuito de control del tamano de la imagen para un dispositivo de presentacion visual
US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
JP2009001872A (ja) * 2007-06-22 2009-01-08 Kobe Steel Ltd 線状材の銅めっき方法および銅めっきワイヤ
JP6270681B2 (ja) * 2014-09-29 2018-01-31 学校法人 関西大学 配線構造体の製造方法、銅置換めっき液および配線構造体
US20230063860A1 (en) * 2021-08-24 2023-03-02 ACS ENTERPRISES, LLC d/b/a AMERICAN CHEMICAL Copper treatment additive
CN114106595B (zh) * 2021-11-08 2023-05-12 凯明(常州)新材料科技有限公司 一种滚针轴承用钢丝的表面处理方法

Also Published As

Publication number Publication date
AT298928B (de) 1972-05-25
SE363853B (ja) 1974-02-04
JPS491130B1 (ja) 1974-01-11
DE2055085A1 (de) 1971-07-01
ES386925A1 (es) 1973-04-16
CH536881A (fr) 1973-05-15
US3664852A (en) 1972-05-23
BE759316A (fr) 1971-04-30
CA922056A (en) 1973-03-06
GB1280260A (en) 1972-07-05
NL7018320A (ja) 1971-07-02
FR2071915A5 (ja) 1971-09-17

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