YU39570B - Arrangement for establishing memory subsystems having different operational characteristics - Google Patents

Arrangement for establishing memory subsystems having different operational characteristics

Info

Publication number
YU39570B
YU39570B YU2718/78A YU271878A YU39570B YU 39570 B YU39570 B YU 39570B YU 2718/78 A YU2718/78 A YU 2718/78A YU 271878 A YU271878 A YU 271878A YU 39570 B YU39570 B YU 39570B
Authority
YU
Yugoslavia
Prior art keywords
arrangement
operational characteristics
different operational
memory subsystems
establishing memory
Prior art date
Application number
YU2718/78A
Other languages
English (en)
Other versions
YU271878A (en
Inventor
R B Johnson
C M Nibby
Original Assignee
Honeywell Inf Systems Italia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inf Systems Italia filed Critical Honeywell Inf Systems Italia
Publication of YU271878A publication Critical patent/YU271878A/xx
Publication of YU39570B publication Critical patent/YU39570B/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/029Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0295Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Numerical Control (AREA)
  • Structure Of Printed Boards (AREA)
  • Dram (AREA)
YU2718/78A 1977-12-01 1978-11-21 Arrangement for establishing memory subsystems having different operational characteristics YU39570B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/856,433 US4190901A (en) 1977-12-01 1977-12-01 Printed circuit board apparatus which facilitates fabrication of units comprising a data processing system

Publications (2)

Publication Number Publication Date
YU271878A YU271878A (en) 1982-10-31
YU39570B true YU39570B (en) 1984-12-31

Family

ID=25323618

Family Applications (1)

Application Number Title Priority Date Filing Date
YU2718/78A YU39570B (en) 1977-12-01 1978-11-21 Arrangement for establishing memory subsystems having different operational characteristics

Country Status (8)

Country Link
US (1) US4190901A (fr)
JP (1) JPS54151329A (fr)
AU (1) AU517165B2 (fr)
CA (1) CA1119314A (fr)
DE (1) DE2851608A1 (fr)
FR (1) FR2410937B1 (fr)
GB (1) GB2009517B (fr)
YU (1) YU39570B (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266285A (en) * 1979-06-28 1981-05-05 Honeywell Information Systems, Inc. Row selection circuits for memory circuits
EP0063119A1 (fr) * 1980-07-10 1982-10-27 Omicron Electronics Ltd Procede de fabrication de representations de plaques de circuits imprimes, et procede et moyen de fabrication de plaques de circuits imprimes
US4339784A (en) * 1980-08-11 1982-07-13 Rca Corporation Solder draw pad
US4507127A (en) * 1981-12-21 1985-03-26 Nippon Furnace Kogyo Co., Ltd. System for recovering resources from sludge
US4613940A (en) * 1982-11-09 1986-09-23 International Microelectronic Products Method and structure for use in designing and building electronic systems in integrated circuits
JPS63211692A (ja) * 1987-02-27 1988-09-02 株式会社日立製作所 両面配線基板
US5066831A (en) * 1987-10-23 1991-11-19 Honeywell Inc. Universal semiconductor chip package
US4891789A (en) * 1988-03-03 1990-01-02 Bull Hn Information Systems, Inc. Surface mounted multilayer memory printed circuit board
US5036163A (en) * 1989-10-13 1991-07-30 Honeywell Inc. Universal semiconductor chip package
US5276832A (en) * 1990-06-19 1994-01-04 Dell U.S.A., L.P. Computer system having a selectable cache subsystem
US5130894A (en) * 1990-11-26 1992-07-14 At&T Bell Laboratories Three-dimensional circuit modules

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1590612B2 (de) * 1966-05-27 1971-01-28 Standard Elektrik Lorenz Ag, 7000 Stuttgart Verdrahtungsmatrix
DE1902494B2 (de) * 1969-01-18 1971-11-18 System elektronischer funktions baueinheiten
NL7013032A (fr) * 1970-09-03 1972-03-07
US3917984A (en) * 1974-10-01 1975-11-04 Microsystems Int Ltd Printed circuit board for mounting and connecting a plurality of semiconductor devices
JPS5239440Y2 (fr) * 1974-10-17 1977-09-06

Also Published As

Publication number Publication date
JPS54151329A (en) 1979-11-28
AU4203678A (en) 1979-06-07
GB2009517B (en) 1982-02-10
FR2410937A1 (fr) 1979-06-29
FR2410937B1 (fr) 1988-03-25
DE2851608A1 (de) 1979-06-07
YU271878A (en) 1982-10-31
AU517165B2 (en) 1981-07-09
GB2009517A (en) 1979-06-13
CA1119314A (fr) 1982-03-02
DE2851608C2 (fr) 1987-09-03
US4190901A (en) 1980-02-26

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