WO2025256473A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置

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Publication number
WO2025256473A1
WO2025256473A1 PCT/CN2025/099530 CN2025099530W WO2025256473A1 WO 2025256473 A1 WO2025256473 A1 WO 2025256473A1 CN 2025099530 W CN2025099530 W CN 2025099530W WO 2025256473 A1 WO2025256473 A1 WO 2025256473A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
conductive
partition structure
area
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/099530
Other languages
English (en)
French (fr)
Inventor
金玉
王欢
徐磊
张丽
徐文杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
Original Assignee
Kunshan Govisionox Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Publication of WO2025256473A1 publication Critical patent/WO2025256473A1/zh
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Definitions

  • This disclosure relates to the field of display technology, specifically to a display panel and its manufacturing method, and a display device.
  • OLED Organic light-emitting diode
  • the present disclosure provides a display panel and a method for manufacturing the same, as well as a display device, which solves the problem of low reliability of display panels in the prior art.
  • a second aspect of this disclosure provides another display panel, including a display area, an aperture area, and a transition area located between the display area and the aperture area;
  • the display panel includes: a substrate; a plurality of light-emitting functional layers, sequentially stacked on one side of the substrate and located in the display area, at least one light-emitting functional layer extending from the display area to the transition area, the plurality of light-emitting functional layers including a stacked first electrode layer and a second electrode layer, the second electrode layer being located on the side of the first electrode layer near the substrate and located in the display area; at least one partition structure located in the transition area and between the light-emitting functional layers and the substrate, the light-emitting functional layers in the transition area being disconnected at the partition structure; and a retention electrode located in the transition area, the retention electrode and the second electrode layer being disposed in the same layer and made of the same material.
  • This disclosure provides a fourth aspect of a method for fabricating a display panel, the display panel including a display area, a hole area, and a transition area located between the display area and the hole area; the fabrication method includes: fabricating an electrically connected charge dispersion structure and at least one intermediate partition structure on a substrate, both the charge dispersion structure and the intermediate partition structure being located in the transition area; fabricating a second electrode material layer on the substrate, the second electrode material layer being located in the display area and the transition area; wet etching the sidewalls of the second electrode material layer and the intermediate partition structure to obtain the second electrode layer, and forming a groove on the sidewall of the intermediate partition structure to obtain the partition structure; fabricating a light-emitting layer and a first electrode layer on the side of the second electrode layer and the partition structure facing away from the substrate, the first electrode layer extending from the display area to the transition area and breaking at the partition structure.
  • the fifth aspect of this disclosure provides a display device, including the display panel provided in any of the above embodiments.
  • the display panel and its preparation method and display device provided in the embodiments of this disclosure, by setting a charge dispersion structure electrically connected to the isolation structure in the display panel, the electrons lost during the side etching process of the isolation structure can be dispersed by the charge dispersion structure during the preparation process of the display panel.
  • the second electrode layer e.g., anode
  • Figure 1 is a schematic diagram of the cross-sectional structure of a display panel in the related technology.
  • Figure 2a is a top view of a display panel provided in an embodiment of this disclosure.
  • Figure 2b is a schematic diagram of the cross-sectional structure of the display panel shown in Figure 2a along line A1A2.
  • Figure 3 is a schematic cross-sectional view of a display panel provided in another embodiment of this disclosure.
  • Figure 4 is a partial top view of the display panel shown in Figure 3.
  • Figure 5a is a top view of the first conductive layer in the display panel shown in Figure 3.
  • Figure 5c is a top view of the partition structure in the display panel shown in Figure 3.
  • Figure 6a is a top view of the first conductive layer provided in another embodiment of the present disclosure.
  • Figure 6b is a top view of a partition structure provided in another embodiment of this disclosure.
  • Figure 7a is a top view of the second conductive layer provided in another embodiment of this disclosure.
  • Figure 7b is a top view of a partition structure provided in another embodiment of this disclosure.
  • Figure 8 is a cross-sectional structural diagram of a display panel provided in another embodiment of this disclosure.
  • Figure 9 is a partial top view of the display panel provided in another embodiment of this disclosure.
  • Figure 10 is a partial top view of the display panel provided in another embodiment of this disclosure.
  • Figure 11 is a schematic cross-sectional view of a display panel provided in another embodiment of this disclosure.
  • Figure 12 is a schematic cross-sectional view of a display panel provided in another embodiment of this disclosure.
  • Figure 13 is a schematic flowchart of a method for preparing a display panel according to an embodiment of the present disclosure.
  • Figure 14 is a schematic diagram of the structure of a display device provided in an embodiment of this disclosure.
  • the reliability of display panels is a crucial criterion for product market entry.
  • Environmental testing is one aspect of reliability measurement.
  • Environmental testing primarily includes temperature cycling tests, damp heat tests, and low-temperature tests.
  • display panels must withstand various harsh environmental conditions to ensure long-term stability and durability under diverse climatic conditions.
  • the display panel has a packaging structure designed to protect it from moisture and oxygen in the environment. Environmental testing places severe challenges on the reliability of the display panel's packaging.
  • a structure When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.
  • FIG 1 is a schematic cross-sectional view of a display panel in the related technology.
  • the display panel includes a display area AA, an aperture area H, and a transition area T located between the display area AA and the aperture area H.
  • the transition area T contains an encapsulation crack L.
  • one of the causes of encapsulation cracks is the presence of a foreign object Q beneath the encapsulation structure.
  • the presence of foreign object Q causes stress concentration in the encapsulation structure at that location, thus causing cracks.
  • This foreign object Q is mainly a silver complex.
  • the silver complex forms during the wet etching process of the anode 10.
  • the etching solution can further etch the aluminum layer in the partition structure 13, thereby forming an undercut structure.
  • the electrons lost by the aluminum accumulate on the titanium surface.
  • Silver ions in the etching solution gain electrons and combine with byproducts from other etching reactions to form a silver complex.
  • this disclosure provides a display panel that improves packaging reliability by blocking the formation of silver complexes.
  • Figure 2a is a top view of a display panel according to an embodiment of this disclosure.
  • Figure 2b is a cross-sectional view of the display panel shown in Figure 2a along line A1A2.
  • the display panel includes a display area AA, a hole area H, and a transition area T located between the display area AA and the hole area H.
  • the display panel includes a substrate 11, multiple light-emitting functional layers 120, at least one partition structure 13, and a charge-dispersing structure 14.
  • the multiple light-emitting functional layers 120 are sequentially stacked on one side of the substrate 11. At least one light-emitting functional layer 120 extends from the display area AA to the transition area T.
  • the partition structure 13 is located between the light-emitting functional layers 120 and the substrate 11, and is situated in the transition area T.
  • the light-emitting functional layers 120 in the transition area T are interrupted at the partition structure 13.
  • the charge-dispersing structure 14 is located in the transition area T, specifically between the substrate 11 and the partition structure 13, or on the side of the partition structure 13 facing away from the substrate 11, or on the same layer as the partition structure 13, etc.
  • the charge-dispersing structure 14 is electrically connected to the partition structure 13.
  • the substrate 11 can be a substrate substrate.
  • the substrate may be a glass substrate.
  • the substrate may comprise an organic resin material such as epoxy resin, triazine, silicone resin, or polyimide.
  • the substrate may be an FR4 type printed circuit board (PCB) or a flexible PCB that is easily deformable.
  • the substrate may include a ceramic material such as silicon nitride, aluminum nitride, or aluminum oxide, or may include a metal or metal compound.
  • the substrate may be a metal core printed circuit board (MCPCB) or a metal copper clad laminate (MCCL).
  • the plurality of light-emitting functional layers 120 include a first electrode layer 121 and a second electrode layer 123 stacked together.
  • the first electrode layer 121 is located on the side of the second electrode layer 123 facing away from the substrate 11, and extends from the display area AA to the transition area T.
  • the second electrode layer 123 is located in the display area.
  • the first electrode layer 121 is a cathode layer
  • the second electrode layer 123 is an anode layer.
  • the plurality of light-emitting functional layers 120 may further include a common layer 122 located between the first electrode layer 121 and the second electrode layer 123, extending from the display area AA to the transition area T.
  • the common layer 122 includes at least one of an electron transport layer, an electron blocking layer, an electron injection layer, a hole transport layer, a hole blocking layer, and a hole injection layer.
  • the plurality of light-emitting functional layers 120 may further include a light-emitting layer 124 located between the first electrode layer 121 and the second electrode layer 123.
  • the light-emitting layer 124 may extend from the display area AA to the transition area T, or it may be located only in the display area AA.
  • the first electrode layer 121 includes a connected electrode portion and an electrode extension portion, with the electrode portion located in the display area AA and the electrode extension portion located in the transition area T.
  • the common layer 122 includes a connected functional portion and a functional extension portion, with the functional portion located in the display area AA and the functional extension portion located in the transition area T.
  • the stacked electrode portion, the second electrode layer 123, and the functional portion and light-emitting layer 124 located between the electrode portion and the second electrode layer 123 constitute a light-emitting device 12.
  • the light-emitting device 12 is, for example, a light-emitting diode (Mini LED) or an organic light-emitting diode (OLED).
  • the partition structure 13 has a partitioning function, and the film layer deposited on the partition structure 13 can be broken at the partition structure 13.
  • the partition structure 13 includes a first portion 131 and a second portion 132 stacked together, with the first portion 131 located on the side of the second portion 132 closer to the substrate 11, and the orthographic projection of the first portion 131 onto the substrate 11 falling within the orthographic projection range of the second portion 132 onto the substrate 11.
  • the cross-section of the partition structure 13 can be T-shaped.
  • the first portion 131 is made of aluminum
  • the second portion 132 is made of titanium.
  • the partition structure 13 may further include a third portion 133 located on the side of the first portion 131 closer to the substrate 11.
  • the orthographic projection of the first portion 131 onto the substrate 11 lies within the orthographic projection range of the third portion 133 onto the substrate 11.
  • the cross-section of the partition structure 13 may be I-shaped.
  • the second portion 132 and the third portion 133 are made of the same material.
  • both the second portion 132 and the third portion 133 are made of titanium.
  • the charge dispersion structure 14 has a charge dispersion function.
  • the charge dispersion structure 14 is a conductive structure.
  • the electrons lost by the first part 131 (e.g., the aluminum layer) in the barrier structure 13 can be dispersed by the charge dispersion structure 14, thus preventing accumulation around the second part 132 and the third part 133. This prevents silver ions generated during the wet etching process from gaining electrons, thereby preventing the formation of silver complexes and improving packaging reliability.
  • the charge dispersion structure 14 includes at least one stacked conductive layer 140, and the at least one conductive layer 140 and at least one isolation structure 13 are electrically connected, that is, the at least one conductive layer 140 and the at least one isolation structure 13 are at the same potential.
  • the conductive layer 140 and any of the isolation structures 13 can be connected via conductive vias, or via other conductive layers 140 or other isolation structures. This embodiment does not limit this connection.
  • the orthographic projection of the partition structure 13 on the substrate 11 is within the orthographic projection range of the conductive layer 140 on the substrate 11. This facilitates the provision of conductive vias between the conductive layer 140 and the partition structure 13 to connect the conductive layer 140 and the partition structure 13.
  • the charge dispersion structure 14 includes multiple conductive layers 140, with a portion of the conductive layers 140 located between the partition structure 13 and the substrate 11.
  • the remaining conductive layers 140 may be located on the side of the partition structure 13 facing away from the substrate 11, or may be disposed in the same layer as the partition structure 13.
  • a portion of the remaining conductive layers 140 may be located on the side of the partition structure 13 facing away from the substrate 11, while another portion of the conductive layers 140 may be disposed in the same layer as the partition structure 13.
  • the display panel also includes a pixel definition layer 15, which encloses a pixel opening.
  • the pixel definition layer 15 covers the edge of the second electrode layer 123.
  • the light-emitting layer 124 is located within the pixel opening.
  • the display panel also includes a pixel circuit 16 located between the light-emitting device 12 and the substrate 11.
  • the pixel circuit 16 is connected to the light-emitting device 12 to drive the light-emitting device 12 to emit light at a predetermined brightness.
  • the display panel also includes a packaging structure 40 located on the side of the light-emitting device 12 and the partition structure 13 away from the substrate 11.
  • Figure 3 is a schematic cross-sectional view of a display panel provided in another embodiment of this disclosure.
  • the difference between the display panel shown in Figure 3 and the display panel shown in Figure 2b is that, in this embodiment, the display panel further includes multiple metal layers located between the substrate 11 and the light-emitting device 12.
  • Each conductive layer 140 between the partition structure 13 and the substrate 11 is disposed on the same layer as a metal layer.
  • the plurality of conductive layers 140 include a first conductive layer 141 and a second conductive layer 142, with the first conductive layer 141 located on the side of the second conductive layer 142 closer to the substrate 11.
  • the plurality of metal layers include a first metal layer M1 and a second metal layer M2, with the first metal layer M1 located on the side of the second metal layer M2 closer to the substrate 11.
  • the first conductive layer 141 and the first metal layer M1 are disposed in the same layer, and the second conductive layer 142 and the second metal layer M2 are disposed in the same layer.
  • the first metal layer M1 and the second metal layer M2 are both made of molybdenum, and correspondingly, the first conductive layer 141 and the second conductive layer 142 are both made of molybdenum.
  • the advantage of this is that the conductive layers 140 and the metal layers disposed in the same layer can be fabricated simultaneously, thereby simplifying the fabrication process.
  • the plurality of metal layers further includes a third metal layer M3 located on the side of the second metal layer M2 facing away from the substrate 11.
  • the third metal layer M3 and the partition structure 13 are disposed in the same layer and are made of the same material.
  • the display panel further includes a semiconductor layer, such as a P-Si layer.
  • the semiconductor layer is located between the first metal layer M1 and the substrate 11.
  • the semiconductor layer and a portion of the metal layer constitute a pixel circuit 16, which is connected to the light-emitting device 12.
  • the remaining portion of the metal layer forms various signal lines, such as drive power signal lines, data signal lines, scan signal lines, etc.
  • the display panel also includes multiple insulating layers, which are located between adjacent metal layers, or between a metal layer and a semiconductor layer, or between a metal layer and a light-emitting device 12.
  • the display panel further includes a dam 17 located in the transition zone T.
  • the dam 17 may be located between adjacent partition structures 13.
  • Figure 4 is a partial top view of the display panel shown in Figure 3.
  • the display panel also includes a cutting area C located between the transition area T and the hole area H.
  • This cutting area C is the area remaining after cutting along the cutting path during the manufacturing process of the display panel. In other words, after cutting along the cutting path, a portion of the cutting path will remain in the final product, forming the cutting area C.
  • the outer edge of the conductive layer 140 is recessed within the transition region T and spaced apart from the cutting region C.
  • the conductive layer 140 includes a first conductive layer 141 and a second conductive layer 142, with the first conductive layer 141 located on the side of the second conductive layer 142 closer to the substrate 11.
  • a first gap exists between the first conductive layer 141 and the cutting region C, and a second gap exists between the second conductive layer 141 and the cutting region C. Both the first and second gaps are greater than zero, with the first gap being greater than the second gap.
  • the edge of the conductive layer 140 can be avoided from being exposed and corroded when the cutting area C is cut, thereby improving the reliability of the display panel.
  • Figure 5a is a top view of the first conductive layer in the display panel shown in Figure 3.
  • Figure 5b is a top view of the second conductive layer in the display panel shown in Figure 3.
  • Figure 5c is a top view of the partition structure in the display panel shown in Figure 3. The connection relationship between the conductive layer 140 and the partition structure 13 in this embodiment will be described in detail below with reference to Figures 3 and 5a-5c.
  • the top view of the first conductive layer 141 is annular.
  • the top view of the second conductive layer 142 is also annular, and conductive vias are formed on the second conductive layer 142.
  • the first conductive layer 141 is electrically connected to the partition structure 13 through multiple first conductive vias H1 (e.g., white hollow dots), and the second conductive layer 142 is connected to the partition structure 13 through multiple second conductive vias H2 (e.g., black solid dots).
  • the first conductive vias H1 e.g., white hollow dots
  • At least one partition structure 13 includes a near-display area partition structure 1301, which refers to the partition structure 13 closest to the display area AA among all partition structures 13.
  • the near-display area partition structure 1301 is connected to the first conductive layer 141 through multiple first conductive vias H1, and to the second conductive layer 142 through multiple second conductive vias H2.
  • the first conductive layer 141 and the second conductive layer 142 are short-circuited through the near-display area partition structure 1301.
  • the first conductive via H1 penetrates the second conductive layer 142.
  • the first conductive via H1 can be electrically connected to the second conductive layer 142, or it can be insulated from it.
  • the first conductive via H1 and the second conductive layer 142 are insulated from each other.
  • the second conductive layer 142 is provided with a large hole with a diameter larger than that of the first conductive via H1.
  • the first conductive via H1 is located inside the large hole, and the large hole and the first conductive via H1 are electrically isolated by an insulating layer.
  • the first conductive via H1 and the second conductive via H2 are arranged alternately.
  • At least one partition structure 13 also includes multiple non-near-display-area partition structures in addition to the near-display-area partition structure 1301.
  • the non-near-display-area partition structures include a near-hole partition structure 1302 and a central partition structure 1303.
  • the central partition structure 1303 is located between the near-hole partition structure 1302 and the near-display-area partition structure 1301.
  • the multiple non-near-display-area partition structures are alternately electrically connected to the first conductive layer 141 and the second conductive layer 142; that is, each non-near-display-area partition structure is electrically connected to only one conductive layer 140, and adjacent non-near-display-area partition structures are connected to different conductive layers 140.
  • the near-hole partition structure 1302, the central partition structure 1303, the near-display-area partition structure 1301, and the conductive layer 140 are electrically connected, achieving equipotentiality.
  • the number of conductive vias on the plurality of non-proximity display area partition structures is equal.
  • conductive vias on the non-near-display area partition structure are arranged at equal intervals.
  • the number of conductive vias on the non-near-display area partition structure is greater than or equal to 2 and less than or equal to 10.
  • Figures 6a and 6b are top views of different structures in a display panel according to another embodiment of the present disclosure.
  • the display panels shown in Figures 6a and 6b are two different implementations of the display panels shown in Figures 5a-5c.
  • Figure 6a is a top view of the first conductive layer according to another embodiment of the present disclosure.
  • Figure 6b is a top view of the partition structure according to another embodiment of the present disclosure.
  • the first conductive layer 141 includes a plurality of first conductive rings 1410 spaced apart.
  • Each first conductive ring 1410 corresponds to a partition structure 13, and the plurality of first conductive rings 1410 are electrically connected.
  • Different first conductive rings 1410 can be directly connected or indirectly connected through the partition structure 13.
  • the plurality of first conductive rings 1410 include a near-hole conductive ring 1411 and a non-near-hole conductive ring 1412 other than the near-hole conductive ring 1411.
  • the first conductive layer 141 also includes a plurality of first connecting portions 1413, and adjacent non-near-hole conductive rings 1412 are connected through the first connecting portions 1413, that is, adjacent non-near-hole conductive rings 1412 are directly connected.
  • At least one partition structure 13 includes a near-display area partition structure 1301, a near-hole area partition structure 1302, and a central partition structure 1303 located between the near-display area partition structure 1301 and the near-hole area partition structure 1302.
  • the display panel also includes a plurality of second connecting portions 143, which connect the near-hole area partition structure 1302 and a central partition structure 1303 adjacent to the near-hole area partition structure 1302.
  • first conductive rings 1410 and partition structures 13 are connected by multiple third conductive vias H3.
  • the number of third conductive vias H3 corresponding to different first conductive rings 1410 may be equal or unequal.
  • the third conductive vias H3 corresponding to the first conductive rings 1410 are arranged at equal intervals.
  • adjacent partition structures 13 are electrically connected near the hole area H, rather than adjacent first conductive rings 1410.
  • This has the advantage that the partition structures 13 are relatively stable and will not corrode even when exposed to the cutting line.
  • the first conductive rings 1410 are susceptible to corrosion, since the near-hole conductive ring 1411 near the hole area H and the central conductive ring 1412 adjacent to it are not directly connected, corrosion of the near-hole conductive ring 1411 will not lead to corrosion of other first conductive rings 1411, thereby improving the reliability of the display panel.
  • the display panels shown in Figures 6a and 6b only illustrate a charge dispersion structure comprising a single conductive layer 140, i.e., a first conductive layer 141.
  • the charge dispersion structure may also include a second conductive layer 142.
  • the structure of the second conductive layer 142 is, for example, shown in Figures 7a and 7b.
  • Figure 7a is a top view of the second conductive layer provided in another embodiment of this disclosure.
  • Figure 7b is a top view of the partition structure provided in another embodiment of this disclosure.
  • the structure of the first conductive layer 141 in the display panel provided in this embodiment is still shown in Figure 6a.
  • the display panel further includes a second conductive layer 142, which is located between the first conductive layer 141 and the partition structure 13.
  • the second conductive layer 142 includes a plurality of second conductive rings 1420 spaced apart.
  • the second conductive rings 1420 and the partition structure 13 correspond one-to-one, and the corresponding second conductive rings 1420 and the partition structure 13 are connected by a plurality of fourth conductive vias H4.
  • the third conductive vias H3 penetrate the second conductive rings 1420. In this way, the second conductive rings 1420, the first conductive rings 1410 and the partition structure 13 are at the same potential.
  • the orthographic projections of the third conductive via H3 and the fourth conductive via H4 on the substrate 11 are alternately arranged.
  • the number of third conductive vias H3 corresponding to different first conductive rings 1410 is equal.
  • the number of third conductive vias H3 corresponding to the first conductive ring 1410 is greater than or equal to 1 and less than or equal to 5.
  • the number of fourth conductive vias H4 corresponding to different second conductive rings 1420 is equal.
  • the number of fourth conductive vias H4 corresponding to the second conductive ring 1420 is greater than or equal to 1 and less than or equal to 5.
  • the charge dispersion structure 14 disperses the electrons that accumulate on the surface of the isolation structure 13 during the wet etching process of the second electrode 123, thereby hindering the formation of silver complex and improving the packaging reliability.
  • This disclosure also provides another display panel that, by reducing the concentration of silver ions generated during the wet etching process of the second electrode layer 123, achieves the technical effect of hindering the formation of silver complexes, thereby improving packaging reliability.
  • the embodiments based on this core inventive concept are described in detail below with reference to the accompanying drawings.
  • Figure 8 is a schematic cross-sectional view of a display panel provided in another embodiment of the present disclosure.
  • the display panel includes a display area AA, a hole area H, and a transition area T located between the display area AA and the hole area H.
  • the display panel also includes a cutting area C located between the hole area H and the transition area T.
  • the display panel includes a substrate 11, multiple light-emitting functional layers 120, at least one partition structure 13, and a retaining electrode 21.
  • the multiple light-emitting functional layers 120 are sequentially stacked on one side of the substrate 11 and located in the display area AA. At least one light-emitting functional layer 120 extends from the display area AA to a transition area T.
  • the multiple light-emitting functional layers 120 include a stacked first electrode layer 121 and a second electrode layer 123, with the second electrode layer 123 located on the side of the first electrode layer 121 closer to the substrate 11 and in the display area AA.
  • At least one partition structure 13 is located between the light-emitting functional layers 120 and the substrate 11 and in the transition area T.
  • the light-emitting functional layers 120 in the transition area T are interrupted at the partition structure 13.
  • the retaining electrode 21 may be located in the transition area T and/or the cutting area C.
  • the retaining electrode 21 and the second electrode layer 123 are disposed in the same layer and are made of the same material, meaning that the retaining electrode 21 and the second electrode layer 123 can be fabricated simultaneously.
  • the silver complex is formed during the wet etching process of the second electrode layer 123 by combining silver ions in the second electrode layer 123, electrons lost from the aluminum layer in the barrier structure 13, and some other products in the etching solution.
  • a retained electrode 21 is formed, thereby reducing the local silver ion concentration in the transition region T, thus hindering the formation of the silver complex and improving the reliability of the display panel.
  • the display panel further includes a protective layer 22 covering the edge region of the retention electrode 21.
  • the display panel also includes a pixel definition layer 15 located in the display area AA.
  • the pixel definition layer 15 is disposed in the same layer as the protective layer 22 and is made of the same material.
  • Figure 9 is a partial top view of a display panel provided in another embodiment of this disclosure. As shown in Figure 9, in this embodiment, at least one partition structure 13 includes multiple partition structures 13.
  • the retaining electrode 21 includes a first retaining electrode ring 210, which is located between adjacent partition structures 13.
  • the display panel also includes a dam 17 located in the transition area T.
  • the dam 17 surrounds the aperture area H.
  • a plurality of partition structures 13 include a near-dam partition structure 1304.
  • the near-dam partition structure 1304 is the partition structure 13 closest to the dam 17.
  • the plurality of partition structures 13 may include one or two near-dam partition structures 1304.
  • a first retaining electrode ring 210 is located between the near-dam partition structure 1304 and the dam 17. Exemplarily, as shown in FIG9, the first retaining electrode ring 210 is located on the side of the dam 17 closer to the aperture area H.
  • the first retaining electrode ring 210 may also be located on the side of the dam 17 closer to the display area AA.
  • the first retaining electrode ring 210 is electrically connected to the near-dam partition structure 1304.
  • the first retaining electrode ring 210 can also serve as a conductive layer 140 in the charge dispersion structure mentioned in the above embodiment, used to disperse the charge on the partition structure 13, thereby further hindering the formation of silver complex and improving the reliability of the display panel.
  • Figure 10 is a partial top view of a display panel according to another embodiment of this disclosure.
  • the display panel further includes a cutting area C, located between the hole area H and the transition area T.
  • the retaining electrode 21 includes a second retaining electrode ring 211, located in the cutting area C.
  • the display panel provided in any embodiment of this disclosure is a display panel after the hole area H has been cut.
  • the retaining electrode 21 may further include a third retaining electrode, which covers the hole area H and forms a full-surface structure with the second retaining electrode ring 211.
  • This disclosure also provides another type of display panel, which isolates the electrical signal in the first electrode layer 131 by providing a potential isolation structure on the side wall of the partial isolation structure 12, thereby preventing the electrical signal from interacting with the polarizer in the aperture region H and causing reliability failure.
  • the potential isolation structure will be described in detail below with reference to the accompanying drawings.
  • FIG 11 is a schematic cross-sectional view of a display panel according to another embodiment of the present disclosure.
  • the display panel includes a display area AA, a hole area H, and a transition area T located between the display area AA and the hole area H.
  • the display panel includes a substrate 11, a plurality of light-emitting functional layers 120, at least one partition structure 13, and a potential isolation structure 31.
  • the plurality of light-emitting functional layers 120 are sequentially stacked on one side of the substrate 11, with at least one light-emitting functional layer 120 extending from the display area AA to the transition area T.
  • At least one partition structure 13 is located between the substrate 11 and the light-emitting functional layers 120, and is situated in the transition area T.
  • the potential isolation structure 31 covers one sidewall of the partition structure 13.
  • the light-emitting functional layers 120 in the transition area T are continuous on the surface of the potential isolation structure 31 facing away from the partition structure 13, and are interrupted at the partition structure 13 where the potential isolation structure 31 is not covered.
  • the potential isolation structure 31 is an insulating structure and also serves to smooth the sidewall of the isolation structure 13, filling in the grooves on one sidewall of the isolation structure to flatten it. This ensures that the common layer 120 is continuous on the surface of the potential isolation structure 31 away from the isolation structure 13, and is discontinuous on the sidewall of the same isolation structure 13 that is not covered by the potential isolation structure 31.
  • the electrical signal in the first electrode layer 121 of the common layer 120 is transmitted from the display area AA to the transition area T and terminates at the potential isolation structure 31, preventing the signal from further transmitting to the aperture area H and interfering with structures such as the polarizer in the aperture area H, thereby further improving the reliability of the display panel.
  • the plurality of partition structures include a near-display area partition structure 1301, a near-hole area partition structure 1302, and at least one central partition structure 1303 located between the near-display area partition structure 1301 and the near-hole area partition structure 1302.
  • a potential isolation structure 31 covers one sidewall of a central partition structure 1303.
  • the potential isolation structure 31 covers the sidewall of the central partition structure 1303 closest to the display area AA.
  • the display panel further includes a planarization layer 32 located between the light-emitting device 12 and the substrate 11.
  • the planarization layer 32 is disposed in the same layer as the potential blocking structure 31 and is made of the same material. This simplifies the fabrication process.
  • FIG 11 uses only one potential isolation structure 31 as an example. In actual products, those skilled in the art can reasonably set the number of potential isolation structures 31 according to actual needs. It should be noted that some of the isolation structures 13 and potential isolation structures 31 in the entire isolation structure 13 correspond one-to-one, and the remaining isolation structures 13 cannot be provided with potential isolation structures 31. Furthermore, potential isolation structures 31 can be provided on only one side of the same isolation structure 13, and cannot be provided on both sides.
  • the display panel provided in any of the above embodiments may further include an encapsulation structure.
  • Figure 12 is a schematic cross-sectional view of a display panel provided in another embodiment of this disclosure. Based on the display panel provided in any of the above embodiments, taking the display panel shown in Figure 11 as an example, the display panel shown in Figure 12 further includes: a first encapsulation layer 41, covering the surface of the light-emitting functional layer 120 facing away from the substrate 11.
  • the first encapsulation layer 41 is a first inorganic encapsulation layer.
  • the display panel may further include a second encapsulation layer 42, which is stacked on the side of the first encapsulation layer 41 away from the substrate 11, and terminates at the side of the dam 17 near the display area AA.
  • the second encapsulation layer 42 is an organic encapsulation layer.
  • the display panel may further include a third encapsulation layer 43, stacked on the side of the second encapsulation layer 42 facing away from the substrate 11, wherein the orthographic projection of the third encapsulation layer 43 on the substrate 11 covers the orthographic projection of the first encapsulation layer 41 on the substrate 11.
  • the third encapsulation layer 43 is a second inorganic encapsulation layer.
  • the display panel may include multiple of the following: the charge dispersion structure 14 provided in any of the embodiments of FIG2b-7b, the retention electrode 21 provided in any of the embodiments of FIG8-10, and the charge blocking structure 31 provided in the embodiment shown in FIG11. These will not be described in detail in this disclosure.
  • FIG. 13 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of this disclosure. As shown in Figure 13, the manufacturing method 1300 includes:
  • Step S1310 refers to the display panel shown in FIG11, where an electrically connected charge dispersion structure 14 and at least one intermediate partition structure are fabricated on the substrate 11.
  • the intermediate partition structure refers to the intermediate structure obtained during the fabrication of the partition structure 13. Both the charge dispersion structure 14 and the partition structure 13 are located in the transition region T.
  • Step S1320 A second electrode material layer is prepared on the substrate 11. The second electrode material layer is located in the display area and the transition area.
  • a second electrode material layer can be prepared using a film-forming process.
  • step S1330 the second electrode material layer and the sidewall of the intermediate partition structure are wet-etched to obtain the second electrode layer 133, and a groove is formed on the sidewall of the intermediate partition structure to obtain the partition structure 13.
  • the silver in the second electrode material layer is etched by the etching solution, gaining electrons and generating silver ions.
  • the aluminum in the partition structure 13 is etched by the etching solution, losing electrons.
  • the electrons accumulate around the intermediate partition structure and move towards the charge-dispersing structure to disperse. As a result, the concentration of free electrons in the etching solution decreases, preventing silver ions from combining with electrons to form silver complexes.
  • step S1340 a light-emitting layer and a first electrode layer 131 are prepared on the side of the second electrode layer 133 and the partition structure 13 away from the substrate 11.
  • the first electrode layer 131 extends from the display area AA to the transition area T and is broken at the partition structure 13.
  • the charge dispersion structure 14 includes a plurality of stacked conductive layers 140.
  • the fabrication method 1300 further includes: simultaneously fabricating at least one metal layer with at least one conductive layer 140, wherein the metal layer and the conductive layer 140 correspond one-to-one, and the metal layer is located in the display area AA.
  • the fabrication method 1300 before fabricating the light-emitting device 12 on the substrate 11, the fabrication method 1300 further includes: fabricating a pixel circuit 16 on the substrate 11, wherein the pixel circuit 16 is electrically connected to the second electrode layer 123, and the pixel circuit 16 includes at least one metal layer, that is, at least a portion of the metal layer and the conductive layer 140 in the pixel circuit correspond one-to-one and are disposed in the same layer.
  • the process of performing step S1330 can further obtain a retention electrode 21, which is located in the transition region T.
  • the preparation method 1300 may further include: preparing a protective layer 22 around the retaining electrode 21.
  • the preparation method 1300 further includes: preparing a potential blocking structure 31 on one side wall of the partial blocking structure 13, wherein a first electrode layer 131 extending to the transition region T and at least one light-emitting functional layer are continuous on the surface of the potential blocking structure 31 opposite to the blocking structure 13.
  • the preparation method 1300 may further include: preparing a planarization layer simultaneously with the potential blocking structure 31, the planarization layer being located between the light-emitting functional layer and the substrate 11.
  • the fabrication method 1300 further includes the step of fabricating a packaging structure.
  • the packaging structure includes, for example, a first packaging layer 41, a second packaging layer 42, and a third packaging layer 43 stacked sequentially.
  • FIG14 is a schematic diagram of the structure of a display device provided in an embodiment of this disclosure. As shown in FIG14, the display device includes the display panel 10 provided in any of the above embodiments.
  • a display device is a product with image display capabilities.
  • a display device can be used to display static images, such as pictures or photographs.
  • a display device can also be used to display dynamic images, such as videos.
  • Display devices can be laptops, mobile phones, handheld or portable computers, cameras, camcorders, in-vehicle smart central control screens, calculators, smartwatches, GPS navigators, electronic photographs, electronic billboards or signs, projectors, etc.
  • the display device can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

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Abstract

本公开提供了一种显示面板及其制备方法、显示装置，解决了现有技术中显示面板可靠性较低的问题。其中，显示面板包括显示区、孔区，以及位于显示区和孔区之间的过渡区；显示面板包括：基板；多个发光功能层，顺序叠置于基板一侧，至少一层发光功能层从显示区延伸至过渡区；至少一个隔断结构，位于过渡区，并位于基板和发光功能层之间，过渡区的发光功能层在隔断结构处断开；以及电荷分散结构，位于过渡区，隔断结构与电荷分散结构电连接。

Description

显示面板及其制备方法、显示装置
相关申请的交叉引用
本申请要求享有于2024年6月11日提交的名称为“显示面板及其制备方法、显示装置”的中国专利申请第2024107487642号的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本公开涉及显示技术领域，具体涉及一种显示面板及其制备方法、显示装置。
背景技术
有机发光二极管显示具有视角宽、驱动电压低、发光色彩丰富、可实现大面积柔性显示等优点，是目前被广泛关注的显示技术之一。
随着显示技术的发展，为了满足高屏占比要求，通常在显示面板的显示区设置开孔，以集成诸如摄像头、听筒及红外感应元件等。然而，开孔的设置会使显示面板的封装效果变差，影响显示效果。
发明内容
有鉴于此，本公开实施例提供了一种显示面板及其制备方法、显示装置，解决了现有技术中显示面板可靠性较低的问题。
本公开第一方面提供了一种显示面板，包括显示区、孔区，以及位于显示区和孔区之间的过渡区；显示面板包括：基板；多个发光功能层，顺序叠置于基板一侧，至少一层发光功能层从显示区延伸至过渡区；至少一个隔断结构，位于过渡区，并位于基板和发光功能层之间，过渡区的发光功能层在隔断结构处断开；以及电荷分散结构，位于过渡区，隔断结构与电荷分散结构电连接。
本公开第二方面提供了另一种显示面板，包括显示区、孔区，以及位于显示区和孔区之间的过渡区；显示面板包括：基板；多个发光功能层，顺序叠置于基板一侧，并位于显示区，至少一层发光功能层从显示区延伸至过渡区，多个发光功能层包括叠置的第一电极层和第二电极层，第二电极层位于第一电极层靠近基板一侧，第二电极层位于显示区；至少一个隔断结构，位于过渡区，并位于发光功能层和基板之间，过渡区的发光功能层在隔断结构处断开；以及保留电极，位于过渡区，保留电极和第二电极层同层设置，并且材料相同。
本公开第三方面提供了又一种显示面板，包括显示区、孔区，以及位于显示区和孔区之间的过渡区；显示面板包括：基板；多个发光功能层，顺序叠置于基板一侧，至少一层发光功能层从显示区延伸至过渡区；至少一个隔断结构，位于过渡区，并位于基板和发光功能层之间；以及电位隔断结构，覆盖一隔断结构的单侧侧壁；其中，过渡区的发光功能层在电位隔断结构背离隔断结构的表面上连续，并在未覆盖电位隔断结构的隔断结构处断开。
本公开第四方面提供了一种显示面板的制备方法，显示面板包括显示区、孔区，以及位于显示区和孔区之间的过渡区；制备方法包括：在基板上制备电连接的电荷分散结构和至少一个中间隔断结构，电荷分散结构和中间隔断结构均位于过渡区；在基板上制备第二电极材料层，第二电极材料层位于显示区和过渡区；对第二电极材料层和中间隔断结构的侧壁进行湿刻，得到第二电极层，并在中间隔断结构的侧壁上形成凹槽，以得到隔断结构；在第二电极层和隔断结构背离基板一侧制备发光层和第一电极层，第一电极层从显示区延伸至过渡区，并在隔断结构处断开。
本公开第五方面提供了一种显示装置，包括上述任一实施例提供的显示面板。
根据本公开实施例提供的显示面板及其制备方法、显示装置，通过在显示面板中设置与隔断结构电连接的电荷分散结构，可以在显示面板的制备过程中，利用电荷分散结构分散隔断结构侧刻过程中失去的电子，从而避免与隔断结构侧刻过程同步图形化的第二电极层(例如阳极)释放的银离子结合该电子生成银络合物，进而避免银络合物对封装可靠性造成不良影响，以此提升封装可靠性。
附图说明
图1为相关技术中的显示面板的截面结构示意图。
图2a为本公开一实施例提供的显示面板的俯视结构示意图。
图2b为图2a所示显示面板沿A1A2线的截面结构示意图。
图3为本公开另一实施例提供的显示面板的截面结构示意图。
图4为图3所示显示面板的局部俯视图。
图5a为图3所示显示面板中第一导电层的俯视图。
图5b为图3所示显示面板中第二导电层的俯视图。
图5c为图3所示显示面板中隔断结构的俯视图。
图6a为本公开再一实施例提供的第一导电层的俯视图。
图6b为本公开又一实施例提供的隔断结构的俯视图。
图7a为本公开又一实施例提供的第二导电层的俯视示意图。
图7b为本公开又一实施例提供的隔断结构的俯视示意图。
图8为本公开又一实施例提供的显示面板的截面结构示意图。
图9为本公开又一实施例提供的显示面板的局部俯视结构示意图。
图10为本公开又一实施例提供的显示面板的局部俯视结构示意图。
图11为本公开又一实施例提供的显示面板的截面结构示意图。
图12为本公开又一实施例提供的显示面板的截面结构示意图。
图13为本公开一实施例提供的显示面板的制备方法的流程示意图。
图14为本公开一实施例提供的显示装置的结构示意图。
具体实施方式
显示面板的可靠性能够满足要求是产品投入市场的一个重要衡量标准。其中，环境试验是衡量可靠性的一个测试方向。环境试验主要包括温度循环试验、湿热试验、低温试验等。在环境试验中，显示面板需要承受多种恶劣环境条件，确保产品在各种气候条件下都具有长期稳定性和耐用性。
显示面板具有封装结构，封装结构用于阻隔环境中的水汽和氧气。环境试验对显示面板的封装可靠性提出了严峻考验。
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
在附图中，为了图示的清楚，可夸大层和区域的尺寸。可以理解的是，当结构被称为“在”另一结构“上或下”时，该结构可直接在另一结构上或下，或者还可存在中间结构。同样的附图标记始终指示同样的结构。这里提到的结构包括膜层、元件、器件、构件、组件中的一项。
当结构被称为“连接”到另一结构时，该结构可直接连接到另一结构，或者以一个或更多个中间结构置于它们之间的方式间接连接到另一结构。
环境试验中的不合格显示面板较大概率上是由于存在封装裂纹。图1为相关技术中的显示面板的截面结构示意图。如图1所示，显示面板包括显示区AA、孔区H，以及位于显示区AA和孔区H之间的过渡区T。其中，过渡区T存在封装裂纹L。
发明人经过不断探索和深入研究发现，封装裂纹的成因之一是由于封装结构下方存在异物Q。异物Q的存在导致封装结构在该位置集中应力，从而造成裂纹。该异物Q主要是银络合物。银络合物形成于阳极10的湿刻过程。湿刻过程中，刻蚀药液可以进一步刻蚀隔断结构13中的铝层，从而形成底切结构。这种情况下，铝失去的电子在钛表面聚集。刻蚀药液中的银离子得到电子，并与其它刻蚀反应中的副产物结合生成银络合物。
基于上述发现，本公开提供了一种显示面板，通过阻断银络合物的生成达到了提升封装可靠性的目的。
图2a为本公开一实施例提供的显示面板的俯视结构示意图。图2b为图2a所示显示面板沿A1A2线的截面结构示意图。结合图2a和图2b可以看出，显示面板包括显示区AA、孔区H，以及位于显示区AA和孔区H之间的过渡区T。
显示面板包括基板11、多个发光功能层120、至少一个隔断结构13和电荷分散结构14。多个发光功能层120顺序叠置于基板11一侧。至少一层发光功能层120从显示区AA延伸至过渡区T。隔断结构13位于发光功能层120和基板11之间，并位于过渡区T。过渡区T的发光功能层120在隔断结构13处断开。电荷分散结构14位于过渡区T，具体可以位于基板11和隔断结构13之间，或者位于隔断结构13背离基板11一侧，或者与隔断结构13同层设置等。电荷分散结构14与隔断结构13电连接。
其中，基板11可以是衬底基板。
在一些实施例中，衬底基板可以为玻璃基衬底。
在一些实施例中，衬底基板可以包括诸如环氧树脂、三嗪、硅树脂或聚酰亚胺的有机树脂材料。例如，衬底基板可以是FR4类型印刷电路板PCB，或者可以是易于变形的柔性PCB。
在一些实施例中，衬底基板可以包括诸如氮化硅、氮化铝或三氧化二铝的陶瓷材料，或者包括金属或金属化合物。例如，衬底基板可以是金属芯印刷电路板(MCPCB)或金属覆铜层压板(MCCL)。
多个发光功能层120包括叠置的第一电极层121和第二电极层123，第一电极层121位于第二电极层123背离基板11一侧，第一电极层121由显示区AA延伸至过渡区T。第二电极层123位于显示区。示例性的，第一电极层121为阴极层，第二电极层123为阳极层。多个发光功能层120还可以包括位于第一电极层121和第二电极层123之间的共通层122，共通层122从显示区AA延伸至过渡区T。共通层122包括电子传输层、电子阻挡层、电子注入层、空穴传输层、空穴阻挡层、空穴注入层等中的至少一者。
多个发光功能层120还可以包括位于第一电极层121和第二电极层123之间的发光层124。发光层124可以由显示区AA延伸至过渡区T，也可以仅位于显示区AA。
第一电极层121包括连接的电极部和电极延伸部，电极部位于显示区AA，电极延伸部位于过渡区T。共通层122包括连接的功能部和功能延伸部，功能部位于显示区AA，功能延伸部位于过渡区T。叠置的电极部、第二电极层123，以及位于电极部和第二电极层123之间的功能部、发光层124构成发光器件12。发光器件12例如为发光二极管(Light Emitting Diode，Mini LED)或有机电致发光二极管(Organic Light-Emitting Diode，OLED)等。
隔断结构13具有隔断作用，蒸镀于隔断结构13上方的膜层可以在隔断结构13处断开。
例如，隔断结构13包括叠置的第一部131和第二部132，第一部131位于第二部132靠近基板11一侧，第一部131在基板11上的正投影位于第二部132在基板11上的正投影范围内。这种情况下，隔断结构13的截面可以是“T”字型。示例性的，第一部131的材料为铝。第二部132的材料为钛。
隔断结构13还可以包括第三部133，位于第一部131靠近基板11一侧。第一部131在基板11上的正投影位于第三部133在基板11上的正投影范围内。这种情况下，隔断结构13的截面可以是“工”字型。示例性的，第二部132和第三部133的材料相同。例如，第二部132和第三部133的材料均为钛。
电荷分散结构14具有电荷分散作用。例如，电荷分散结构14为导电结构。在湿刻制备第二电极层123(例如阳极)的过程中，隔断结构13中的第一部131(例如铝层)失去的电子可以通过电荷分散结构14分散掉，而避免在第二部132和第三部133周边聚集，使得湿刻过程产生的银离子无法得到电子，从而无法形成银络合物，进而提升封装可靠性。
在一个实施例中，如图2b所示，电荷分散结构14包括叠置的至少一个导电层140，至少一个导电层140和至少一个隔断结构13电连接，即至少一个导电层140和至少一个隔断结构13整体等电位。
导电层140和任一隔断结构13可以通过导电过孔连接，也可以通过其它导电层140或其它隔断结构连接。隔断结构13和任一导电层140可以通过导电过孔连接，也可以通过其它隔断结构或其它导电层140连接。本实施例对此不作限定。
在一个实施例中，隔断结构13在基板11上的正投影位于导电层140在基板11上的正投影范围内。如此，便于在导电层140和隔断结构13之间设置导电过孔，以连接导电层140和隔断结构13。
如图2b所示，至少部分导电层140位于隔断结构13和基板11之间。例如，电荷分散结构14包括多个导电层140，部分导电层140位于隔断结构13和基板11之间。其余导电层140可以位于隔断结构13背离基板11一侧，或者与隔断结构13同层设置。或者，其余导电层140中的一部分导电层140位于隔断结构13背离基板11一侧，另一部分导电层140与隔断结构13同层设置。
如图2b所示，显示面板还包括像素定义层15，像素定义层15围合出像素开口。像素定义层15覆盖第二电极层123的边缘。发光层124位于像素开口内。
显示面板还包括像素电路16，位于发光器件12和基板11之间。像素电路16和发光器件12连接，以驱动发光器件12按照预定亮度发光。
显示面板还包括封装结构40，位于发光器件12和隔断结构13背离基板11一侧。
图3为本公开另一施例提供的显示面板的截面结构示意图。如图3所示显示面板和图2b所示显示面板的区别在于，在本实施例中，显示面板还包括多个金属层，位于基板11和发光器件12之间。隔断结构13和基板11之间的每个导电层140与一金属层同层设置。
例如，多个导电层140包括第一导电层141和第二导电层142，第一导电层141位于第二导电层142靠近基板11一侧。多个金属层包括第一金属层M1和第二金属层M2，第一金属层M1位于第二金属层M2靠近基板11一侧。第一导电层141和第一金属层M1同层设置，第二导电层142和第二金属层M2同层设置。示例性的，第一金属层M1和第二金属层M2的材料均为钼，相应地，第一导电层141和第二导电层142的材料均为钼。这样的好处在于，同层设置的导电层140和金属层可以同步制备，从而简化制备工艺。
在一个实施例中，如图3所示，多个金属层还包括第三金属层M3，位于第二金属层M2背离基板11一侧。第三金属层M3和隔断结构13同层设置，并且材料相同。
在一个实施例中，如图3所示，显示面板还包括半导体层，半导体层例如为P-si层。半导体层位于第一金属层M1和基板11之间。半导体层和部分金属层构成像素电路16，像素电路16与发光器件12连接。其余部分金属层形成各种信号线，例如驱动电源信号线、数据信号线、扫描信号线等。
应当理解，显示面板还包括多个绝缘层，绝缘层位于相邻金属层之间，或者位于金属层和半导体层之间，或者位于金属层和发光器件12之间。
在一个实施例中，如图3所示，显示面板还包括堤坝17，位于过渡区T。堤坝17具体可以位于相邻隔断结构13之间。
图4为图3所示显示面板的局部俯视图。如图4所示，显示面板还包括位于过渡区T和孔区H之间的切割区C。该切割区C是在显示面板的制备过程中，沿切割道进行切割后残留的区域，也就是说，沿切割道切割后，会在最终产品中残留部分切割道，形成切割区C。
结合图3和图4所示，导电层140的外边缘内缩于过渡区T以内，并与切割区C间隔设置。例如，导电层140包括第一导电层141和第二导电层142，第一导电层141位于第二导电层142靠近基板11一侧。第一导电层141和切割区C之间具有第一间隔，第二导电层141和切割区C之间具有第二间隔，第一间隔和第二间隔均大于零，并且第一间隔大于第二间隔。
根据本实施例提供的显示面板，通过设置导电层140的外边缘内缩于过渡区T以内，并与切割区C间隔设置，可以避免对切割区C进行切割时，暴露导电层140边缘，进而被腐蚀，从而提升显示面板的可靠性。
图5a为图3所示显示面板中第一导电层的俯视图。图5b为图3所示显示面板中第二导电层的俯视图。图5c为图3所示显示面板中隔断结构的俯视图。下面结合图3和图5a-图5c具体说明本实施例中导电层140和隔断结构13的连接关系。
如图5a所示，第一导电层141的俯视结构为圆环状。如图5b所示，第二导电层142的俯视结构也为圆环状，并且，第二导电层142上开设有导电过孔。第一导电层141通过多个第一导电过孔H1(例如白色空心点)与隔断结构13电连接，第二导电层142通过多个第二导电过孔H2(例如黑色实心点)与隔断结构13连接。其中，第一导电过孔H1(例如白色空心点)贯穿第二导电层142。
具体而言，结合图3、图5b和图5c所示，至少一个隔断结构13包括近显示区隔断结构1301，近显示区隔断结构1301是指所有隔断结构13中距离显示区AA最近的隔断结构13。近显示区隔断结构1301通过多个第一导电过孔H1与第一导电层141连接，近显示区隔断结构1301通过多个第二导电过孔H2与第二导电层142连接。如此，第一导电层141和第二导电层142通过近显示区隔断结构1301实现了短接。示例性的，第一导电过孔H1贯穿第二导电层142。第一导电过孔H1可以和第二导电层142电连接，也可以绝缘设置。示例性的，第一导电过孔H1和第二导电层142绝缘设置。这种情况下，在第一导电过孔H1所在位置，第二导电层142设置有孔径大于第一导电过孔H1的大孔，第一导电过孔H1位于大孔内，大孔和第一导电过孔H1之间通过绝缘层电隔绝。示例性的，在近显示区隔断结构1301的周向上，第一导电过孔H1和第二导电过孔H2交替排布。
至少一个隔断结构13还包括除了近显示区隔断结构1301之外的多个非近显示区隔断结构。非近显示区隔断结构包括近孔区隔断结构1302和中央隔断结构1303。中央隔断结构1303位于近孔区隔断结构1302和近显示区隔断结构1301之间。多个非近显示区隔断结构交替与第一导电层141和第二导电层142电连接，即每个非近显示区隔断结构仅与一个导电层140电连接，并且相邻非近显示区隔断结构连接不同导电层140。如此，近孔区隔断结构1302、中央隔断结构1303、近显示区隔断结构1301、导电层140电连接，实现了等电位。
在一个实施例中，多个非近显示区隔断结构上的导电过孔的数量相等。
在一个实施例中，如图5c所示，非近显示区隔断结构上的导电过孔等间隔排布。
在一个实施例中，如图5c所示，非近显示区隔断结构上的导电过孔的数量大于或等于2并且小于或等于10。
图6a和图6b为本公开再一实施例提供的显示面板中不同结构的俯视图。图6a和图6b所示显示面板与图5a-图5c所示显示面板为并列的两种不同实现方式。图6a为本公开再一实施例提供的第一导电层的俯视图。图6b为本公开再一实施例提供的隔断结构的俯视图。
在本实施例中，如图6a所示，第一导电层141包括间隔设置的多个第一导电环1410，第一导电环1410和隔断结构13一一对应，多个第一导电环1410电连接。不同第一导电环1410可以直接连接，也可以通过隔断结构13间接连接。
例如，多个第一导电环1410包括近孔区导电环1411和除了近孔区导电环1411之外的非近孔区导电环1412。第一导电层141还包括多个第一连接部1413，相邻非近孔区导电环1412通过第一连接部1413连接，即相邻非近孔区导电环1412直接连接。
如图6b所示，至少一个隔断结构13包括近显示区隔断结构1301、近孔区隔断结构1302，以及位于近显示区隔断结构1301和近孔区隔断结构1302之间的中央隔断结构1303。显示面板还包括多个第二连接部143，第二连接部143连接近孔区隔断结构1302和与近孔区隔断结构1302相邻的一个中央隔断结构1303。
结合图6a和图6b所示，相互对应的第一导电环1410和隔断结构13通过多个第三导电过孔H3连接。不同第一导电环1410对应的第三导电过孔H3的数量相等或不等。第一导电环1410对应的第三导电过孔H3等间隔排布。
根据本实施例提供的显示面板，在靠近孔区H的位置，相邻隔断结构13电连接，而非相邻第一导电环1410电连接。这样的好处在于，隔断结构13性质相对稳定，即使暴露于切割线，也不会被腐蚀。与此同时，即便第一导电环1410易于被腐蚀，但由于靠近孔区H的近孔区导电环1411和与近孔区导电环1411相邻的中央导电环1412没有直接连接，因此即便近孔区导电环1411被腐蚀，也不会导致其它第一导电环1411被腐蚀，从而提升了显示面板的可靠性。
图6a和图6b所示显示面板仅以电荷分散结构包括一个导电层140，即第一导电层141为例。在其它实施例中，电荷分散结构还可以包括第二导电层142。这种情况下，第二导电层142的结构例如为图7a和图7b所示。
图7a为本公开又一实施例提供的第二导电层的俯视示意图。图7b为本公开又一实施例提供的隔断结构的俯视示意图。本实施例提供的显示面板中第一导电层141的结构仍以图6a所示。参阅图6a、图7a和图7b所示，在本实施例中，显示面板还包括第二导电层142，第二导电层142位于第一导电层141和隔断结构13之间。第二导电层142包括间隔设置的多个第二导电环1420。第二导电环1420和隔断结构13一一对应，相互对应的第二导电环1420和隔断结构13通过多个第四导电过孔H4连接。第三导电过孔H3贯穿第二导电环1420。如此，实现了第二导电环1420、第一导电环1410和隔断结构13等电位。
在一个实施例中，对于相互对应的第一导电环1410和第二导电环1420，第三导电过孔H3在基板11上的正投影和第四导电过孔H4在基板11上的正投影交替设置。
在一个实施例中，不同第一导电环1410对应的第三导电过孔H3的数量相等。例如，第一导电环1410对应的第三导电过孔H3的数量大于或等于1并且小于或等于5。
在一个实施例中，不同第二导电环1420对应的第四导电过孔H4的数量相等。例如，第二导电环1420对应的第四导电过孔H4的数量大于或等于1并且小于或等于5。
根据上述任一实施例提供的显示面板，通过设置与隔断结构13连接的电荷分散结构14，利用电荷分散结构14分散掉第二电极123湿刻过程中聚集在隔断结构13表面的电子，阻碍了银络合物的形成，从而提升了封装可靠性。
本公开实施例还提供了另一种显示面板，通过削减湿刻制备第二电极层123的过程中产生的银离子浓度，达到了阻碍银络合物的形成，从而提升了封装可靠性的技术效果。下面结合附图对基于该核心发明构思的实施例进行具体说明。
图8为本公开再一实施例提供的显示面板的截面结构示意图。如图8所示，显示面板包括显示区AA、孔区H，以及位于显示区AA和孔区H之间的过渡区T。显示面板还包括位于孔区H和过渡区T之间的切割区C。
显示面板包括基板11、多个发光功能层120、至少一个隔断结构13和保留电极21。其中，多个发光功能层120顺序叠置于基板11一侧，并位于显示区AA。至少一层发光功能层120从显示区AA延伸至过渡区T。多个发光功能层120包括叠置的第一电极层121和第二电极层123，第二电极层123位于第一电极层121靠近基板11一侧，第二电极层123位于显示区AA。至少一个隔断结构13位于发光功能层120和基板11之间，并位于过渡区T。过渡区T的发光功能层120在隔断结构13处断开。保留电极21可以位于过渡区T，和/或切割区C。保留电极21和第二电极层123同层设置，并且材料相同，即保留电极21和第二电极层123可以同步制备得到。
如前文所述，银络合物是在湿刻制备第二电极层123的过程中，由第二电极层123中的银离子、隔断结构13中铝层失去的电子，以及刻蚀液中的一些其它产物结合而成的。根据本实施例提供的显示面板，通过在湿刻制备第二电极层123的过程中，保留过渡区T的部分第二电极材料层，形成保留电极21，从而减小了过渡区T局部银离子浓度，进而阻碍了银络合物的形成，提升了显示面板的可靠性。
在一个实施例中，如图8所示，显示面板还包括保护层22，保护层22覆盖保留电极21的边缘区域。示例性的，显示面板还包括像素定义层15，位于显示区AA。像素定义层15与保护层22同层设置，并且材料相同。通过设置保护层21包覆保留电极21的周边，可以避免保留电极21中的银离子迁移。
图9为本公开又一实施例提供的显示面板的局部俯视结构示意图。如图9所示，在本实施例中，至少一个隔断结构13包括多个隔断结构13。保留电极21包括第一保留电极环210，第一保留电极环210位于相邻隔断结构13之间。
例如，显示面板还包括堤坝17，位于过渡区T。堤坝17环绕孔区H。多个隔断结构13包括近堤坝隔断结构1304。近堤坝隔断结构1304即距离堤坝17最近的隔断结构13。多个隔断结构13可以包括1个近堤坝隔断结构1304或2个近堤坝隔断结构1304。第一保留电极环210位于近堤坝隔断结构1304和堤坝17之间。示例性的，如图9所示，第一保留电极环210位于堤坝17靠近孔区H一侧。第一保留电极环210也可以位于堤坝17靠近显示区AA一侧。
在一个实施例中，如图9所示，第一保留电极环210和近堤坝隔断结构1304电连接。这种情况下，第一保留电极环210还可以作为上文实施例中提到的电荷分散结构中的一个导电层140，用于分散隔断结构13上的电荷，从而进一步阻碍银络合物的形成，提升显示面板的可靠性。
图10为本公开又一实施例提供的显示面板的局部俯视结构示意图。如图10所示，在本实施例中，显示面板还包括切割区C，位于孔区H和过渡区T之间。保留电极21包括第二保留电极环211，位于切割区C。
本公开任一实施例提供的显示面板(除非有特别声明)均为对孔区H进行切割之后的显示面板。对于切割之前的显示面板而言，保留电极21还可以包括第三保留电极，第三保留电极覆盖孔区H，并且和第二保留电极环211形成整面结构。
本公开还提供了又一种显示面板，通过在部分隔断结构12的侧壁上设置电位隔断结构，以隔断第一电极层131中的电信号，避免该电信号在孔区H与偏光片发生作用，引起可靠性失效。下面结合附图对电位隔断结构进行具体说明。
图11为本公开又一实施例提供的显示面板的截面结构示意图。如图11所示，显示面板包括显示区AA、孔区H，以及位于显示区AA和孔区H之间的过渡区T。
显示面板包括：基板11、多个发光功能层120、至少一个隔断结构13和电位隔断结构31。其中，多个发光功能层120顺序叠置于基板11一侧，至少一层发光功能层120从显示区AA延伸至过渡区T。至少一个隔断结构13位于基板11和发光功能层120之间，并位于过渡区T。电位隔断结构31覆盖一隔断结构13的单侧侧壁。过渡区T的发光功能层120在电位隔断结构31背离隔断结构13的表面上连续，并在未覆盖电位隔断结构31的隔断结构13处断开。
电位隔断结构31为绝缘结构，并起到平滑隔断结构13侧壁的作用，即将隔断结构单侧侧壁上的凹槽填充掉，使得该单侧侧壁平坦化。如此，可以确保共通层120在电位隔断结构31背离隔断结构13的表面上连续而不断开，并且在同一隔断结构13未覆盖电位隔断结构31的侧壁上断开而不连续。如此，共通层120中第一电极层121中的电信号由显示区AA向过渡区T传输，并在电位隔断结构31处终止，从而避免该电信号进一步传输至孔区H，与孔区H的偏光片等结构产生影响，进而进一步提升了显示面板的可靠性。
在一个实施例中，如图11所示，多个隔断结构包括近显示区隔断结构1301、近孔区隔断结构1302，以及位于近显示区隔断结构1301和近孔区隔断结构1302之间的至少一个中央隔断结构1303。电位隔断结构31覆盖一中央隔断结构1303的单侧侧壁。例如，电位隔断结构31覆盖中央隔断结构1303靠近显示区AA一侧的侧壁。
在一个实施例中，显示面板还包括平坦化层32，位于发光器件12和基板11之间。平坦化层32与电位隔断结构31同层设置，并且材料相同。如此，可以简化制备过程。
图11所示实施例仅以一个电位隔断结构31为例进行了说明。实际产品中，本领域技术人员可以根据实际需要合理设置电位隔断结构31的数量。需要注意的是，全部隔断结构13中的部分隔断结构13和电位隔断结构31一一对应，其余部分隔断结构13不能设置电位隔断结构31。并且，同一隔断结构13的单侧设置电位隔断结构31，而不能两侧均设置电位隔断结构31。
上述任一实施例提供的显示面板还可以包括封装结构。图12为本公开又一实施例提供的显示面板的截面结构示意图。如图12所示的显示面板在上述任一实施例提供的显示面板的基础上，以图11所示显示面板为例，还包括：第一封装层41，覆盖在发光功能层120背离基板11的表面。示例性的，第一封装层41为第一无机封装层。
显示面板还可以包括第二封装层42，第二封装层42叠置在第一封装层41背离基板11一侧，第二封装层42截止于堤坝17靠近显示区AA一侧。示例性的，第二封装层42为有机封装层。
显示面板还可以包括第三封装层43，叠置在第二封装层42背离基板11一侧，第三封装层43在基板11上的正投影覆盖第一封装层41在基板11上的正投影。示例性的，第三封装层43为第二无机封装层。
上述各实施例之间可以相互组合。例如，显示面板同时包括图2b-图7b中任一实施例提供的电荷分散结构14、图8-图10中任一实施例提供的保留电极21、图11所示实施例提供的电荷隔断结构31中的多项，本公开实施例对此不再赘述。
本公开还提供了一种显示面板的制备方法，用于制备上述任一实施例提供的显示面板。图13为本公开一实施例提供的显示面板的制备方法的流程示意图。如图13所示，制备方法1300包括：
步骤S1310，作为示例，可参阅图11所示显示面板，在基板11上制备电连接的电荷分散结构14和至少一个中间隔断结构。中间隔断结构是指制备隔断结构13的过程中得到的中间结构。电荷分散结构14和隔断结构13均位于过渡区T。
步骤S1320，在基板11上制备第二电极材料层，第二电极材料层位于显示区和过渡区。
例如，采用成膜工艺制备第二电极材料层。
步骤S1330，对第二电极材料层和中间隔断结构的侧壁进行湿刻，得到第二电极层133，并在中间隔断结构的侧壁上形成凹槽，以得到隔断结构13。
该过程中，第二电极材料层中的银被刻蚀液腐蚀得到电子，生成银离子。隔断结构13中的铝被刻蚀液腐蚀失去电子，电子聚集在中间隔断结构周边，并向电荷分散结构移动，以散开。如此，刻蚀液中的自由电子浓度减少，使得银离子无法和电子结合来得到银络合物。
步骤S1340，在第二电极层133和隔断结构13背离基板11一侧制备发光层和第一电极层131，第一电极层131从显示区AA延伸至过渡区T，并在隔断结构13处断开。
在一个实施例中，电荷分散结构14包括叠置的多个导电层140。这种情况下，制备方法1300还包括：与至少一个导电层140同步制备至少一个金属层，金属层和导电层140一一对应，金属层位于显示区AA。通过将显示区AA的金属层和过渡区T的导电层140同步制备，可以简化制备过程。
在一个实施例中，在基板11上制备发光器件12之前，制备方法1300还包括：在基板11上制备像素电路16，像素电路16和第二电极层123电连接，像素电路16包括至少一个金属层，即像素电路中的至少部分金属层和导电层140一一对应，同层设置。
在一个实施例中，执行步骤S1330的过程可以进一步得到保留电极21，保留电极21位于过渡区T。
这种情况下，在步骤S1330之后，制备方法1300还可以包括：在保留电极21的周边制备保护层22。
在一个实施例中，在步骤S1320之前，制备方法1300还包括：在部分隔断结构13的单侧侧壁上制备电位隔断结构31，延伸至过渡区T的第一电极层131和至少一个发光功能层在电位隔断结构31背离隔断结构13的表面上连续。
这种情况下，制备方法1300还可以包括：与电位隔断结构31同步制备平坦化层，平坦化层位于发光功能层和基板11之间。
在一个实施例中，可参阅图12所示显示面板，制备方法1300还包括制备封装结构的步骤。封装结构例如包括依次叠置的第一封装层41、第二封装层42和第三封装层43。
本公开还提供了一种显示装置。图14为本公开一实施例提供的显示装置的结构示意图。如图14所示，显示装置包括上述任一实施例提供的显示面板10。
显示装置为具有图像显示功能的产品。例如，显示装置可以用于显示静态图像，例如图片或照片。显示装置也可以用于显示动态图像，例如视频。
显示装置可以是笔记本电脑、移动电话、手持式或便携式计算机、相机、摄像机、车载智能中控屏、计算器、智能手表、GPS导航器、电子相片、电子广告牌或指示牌、投影仪等。
此外，显示装置还可以兼具拍照、录像、指纹识别、人脸识别等功能。相应地，显示装置还包括用于实现上述功能的至少一个功能模块，例如屏下摄像头、屏下指纹识别传感器等。
以上结合具体实施例描述了本公开的基本原理，但是，需要指出的是，在本公开中提及的优点、优势、效果等仅是示例而非限制，不能认为这些优点、优势、效果等是本公开的各个实施例必须具备的。另外，上述公开的具体细节仅是为了示例的作用和便于理解的作用，而非限制，上述细节并不限制本公开为必须采用上述具体的细节来实现。
为了例示和描述的目的已经给出了以上描述。此外，此描述不意图将本公开的实施例限制到在此公开的形式。尽管以上已经讨论了多个示例方面和实施例，但是本领域技术人员将认识到其某些变型、修改、改变、添加和子组合。

Claims (20)

  1. 一种显示面板，包括显示区、孔区，以及位于所述显示区和所述孔区之间的过渡区；所述显示面板包括：
    基板；
    多个发光功能层，顺序叠置于所述基板一侧，至少一层所述发光功能层从所述显示区延伸至所述过渡区；
    至少一个隔断结构，位于所述过渡区，并位于所述基板和所述发光功能层之间，所述过渡区的所述发光功能层在所述隔断结构处断开；以及
    电荷分散结构，位于所述过渡区，所述隔断结构与所述电荷分散结构电连接。
  2. 根据权利要求1所述的显示面板，其中，所述电荷分散结构包括至少一个导电层，至少一个所述导电层和至少一个所述隔断结构电连接；
    所述隔断结构在所述基板上的正投影位于所述导电层在所述基板上的正投影范围内；
    所述多个发光功能层包括叠置的第一电极层和第二电极层，所述第一电极层位于所述第二电极层背离所述基板一侧，所述第一电极层由所述显示区延伸至所述过渡区；
    所述多个发光功能层还包括位于所述第一电极层和所述第二电极层之间的共通层，所述共通层由所述显示区延伸至所述过渡区，所述共通层包括空穴传输层、空穴注入层、电子传输层和电子注入层中的至少一项。
  3. 根据权利要求2所述的显示面板，其中，至少部分所述导电层位于所述隔断结构和所述基板之间；
    所述显示面板还包括多个金属层，位于所述基板和所述发光功能层之间，所述隔断结构和所述基板之间的每个所述导电层与一所述金属层同层设置；
    所述显示面板还包括位于所述过渡区和所述孔区之间的切割区，所述导电层的外边缘内缩于所述过渡区以内，并与所述切割区间隔设置；
    所述导电层的材料为钼。
  4. 根据权利要求2或3所述的显示面板，其中，至少一个所述导电层包括第一导电层和第二导电层，所述第一导电层位于所述第二导电层靠近所述基板一侧；至少一个所述隔断结构包括近显示区隔断结构，所述近显示区隔断结构通过多个第一导电过孔与所述第一导电层连接，所述近显示区隔断结构通过多个第二导电过孔与所述第二导电层连接；
    所述第一导电过孔贯穿所述第二导电层；
    在所述近显示区隔断结构的周向上，所述第一导电过孔和所述第二导电过孔交替排布。
  5. 根据权利要求4所述的显示面板，其中，至少一个所述隔断结构还包括除了所述近显示区隔断结构之外的非近显示区隔断结构，多个所述非近显示区隔断结构交替与所述第一导电层和所述第二导电层电连接；
    不同所述非近显示区隔断结构上的导电过孔的数量相等；
    所述非近显示区隔断结构上的导电过孔等间隔排布；
    所述非近显示区隔断结构上的所述导电过孔的数量大于或等于2并且小于或等于10。
  6. 根据权利要求2或3所述的显示面板，其中，至少一个所述导电层包括第一导电层，所述第一导电层包括间隔设置的多个第一导电环，所述第一导电环和所述隔断结构一一对应，多个所述第一导电环电连接；
    多个所述第一导电环包括近孔区导电环和除了所述近孔区导电环之外的非近孔区导电环；所述第一导电层还包括多个第一连接部，相邻所述非近孔区导电环通过所述第一连接部连接；
    至少一个所述隔断结构包括近孔区隔断结构、近显示区隔断结构，以及位于所述近孔区隔断结构和所述近显示区隔断结构之间的至少一个中央隔断结构；所述显示面板还包括多个第二连接部，所述第二连接部连接所述近孔区隔断结构和与所述近孔区隔断结构相邻的一个所述中央隔断结构；
    相互对应的所述第一导电环和所述隔断结构通过多个第三导电过孔连接。
  7. 根据权利要求6所述的显示面板，其中，至少一个所述导电层还包括第二导电层，位于所述第一导电层和所述隔断结构之间；所述第二导电层包括间隔设置的多个第二导电环，所述第二导电环和所述隔断结构一一对应，相互对应的所述第二导电环和所述隔断结构通过多个第四导电过孔连接；
    所述第四导电过孔贯穿所述第一导电环；
    对于相互对应的所述第一导电环和所述第二导电环，所述第三导电过孔在所述基板上的正投影和所述第四导电过孔在所述基板上的正投影交替设置；
    不同所述第一导电环对应的所述第三导电过孔的数量相等；
    不同所述第二导电环对应的所述第四导电过孔的数量相等；
    所述第一导电环上所述第三导电过孔的数量大于或等于1并且小于或等于5；
    所述第二导电环上所述第四导电过孔的数量大于或等于1并且小于或等于5。
  8. 根据权利要求1所述的显示面板，其中，所述多个发光功能层包括叠置的第一电极层和第二电极层，所述第二电极层位于所述第一电极层靠近所述基板一侧，所述第二电极层位于所述显示区；所述显示面板还包括保留电极，所述保留电极位于所述过渡区，所述保留电极和所述第二电极层同层设置，并且材料相同；
    所述显示面板还包括保护层，所述保护层覆盖所述保留电极的边缘区域；
    所述显示面板还包括像素定义层，位于所述显示区；所述像素定义层与所述保护层同层设置，并且材料相同。
  9. 根据权利要求8所述的显示面板，其中，至少一个所述隔断结构包括多个隔断结构；所述保留电极包括第一保留电极环，所述第一保留电极环位于相邻所述隔断结构之间；
    所述显示面板还包括堤坝，位于所述过渡区，所述堤坝环绕所述孔区；多个所述隔断结构包括近堤坝隔断结构，所述第一保留电极环位于所述近堤坝隔断结构和所述堤坝之间；
    所述第一保留电极环位于所述堤坝靠近所述孔区一侧；
    所述第一保留电极环和所述近堤坝隔断结构电连接。
  10. 根据权利要求8或9所述的显示面板，其中，还包括切割区，位于所述孔区和所述过渡区之间；所述保留电极包括第二保留电极环，位于所述切割区。
  11. 根据权利要求1所述的显示面板，其中，至少一个所述隔断结构包括多个隔断结构；所述显示面板还包括电位隔断结构，覆盖一所述隔断结构的单侧侧壁；所述过渡区的所述发光功能层在所述电位隔断结构背离所述隔断结构的表面上连续。
  12. 根据权利要求11所述的显示面板，其中，所述过渡区的所述发光功能层在未覆盖所述电位隔断结构的所述隔断结构处断开。
  13. 根据权利要求11所述的显示面板，其中，多个所述隔断结构包括近显示区隔断结构、近孔区隔断结构，以及位于所述近显示区隔断结构和所述近孔区隔断结构之间的至少一个中央隔断结构，所述电位隔断结构覆盖一所述中央隔断结构的单侧侧壁；
    所述电位隔断结构覆盖所述中央隔断结构靠近所述显示区一侧的侧壁；
    所述显示面板还包括平坦化层，位于所述发光功能层和所述基板之间；所述平坦化层与所述电位隔断结构同层设置，并且材料相同。
  14. 根据权利要求1所述的显示面板，其中，所述隔断结构包括叠置的第一部和第二部，所述第一部位于所述第二部靠近所述基板一侧，所述第一部在所述基板上的正投影位于所述第二部在所述基板上的正投影范围内；
    所述隔断结构还包括第三部，位于所述第一部靠近所述基板一侧，所述第一部在所述基板上的正投影位于所述第三部在所述基板上的正投影范围内；
    所述第二部和所述第三部的材料相同；
    所述第二部和所述第三部的材料为钛；
    所述第一部的材料为铝。
  15. 根据权利要求1所述的显示面板，其中，还包括第一封装层，覆盖在所述发光功能层背离所述基板的表面；
    所述显示面板还包括堤坝和第二封装层；所述堤坝位于所述过渡区，所述第二封装层叠置在所述第一封装层背离所述基板一侧，所述第二封装层截止于所述堤坝靠近所述显示区一侧；
    所述显示面板还包括第三封装层，叠置在所述第二封装层背离所述基板一侧，所述第三封装层在所述基板上的正投影覆盖所述第一封装层在所述基板上的正投影。
  16. 一种显示面板，包括显示区、孔区，以及位于所述显示区和所述孔区之间的过渡区；所述显示面板包括：
    基板；
    多个发光功能层，顺序叠置于所述基板一侧，并位于所述显示区，至少一层所述发光功能层从所述显示区延伸至所述过渡区，所述多个发光功能层包括叠置的第一电极层和第二电极层，所述第二电极层位于所述第一电极层靠近所述基板一侧，所述第二电极层位于所述显示区；
    至少一个隔断结构，位于所述过渡区，并位于所述发光功能层和所述基板之间，所述过渡区的所述发光功能层在所述隔断结构处断开；以及
    保留电极，位于所述过渡区，所述保留电极和所述第二电极层同层设置，并且材料相同。
  17. 一种显示面板的制备方法，所述显示面板包括显示区、孔区，以及位于所述显示区和所述孔区之间的过渡区；所述制备方法包括：
    在基板上制备电连接的电荷分散结构和至少一个中间隔断结构，所述电荷分散结构和所述中间隔断结构均位于所述过渡区；
    在所述基板上制备第二电极材料层，所述第二电极材料层位于所述显示区和所述过渡区；
    对所述第二电极材料层和所述中间隔断结构的侧壁进行湿刻，得到第二电极层，并在所述中间隔断结构的侧壁上形成凹槽，以得到隔断结构；
    在所述第二电极层和所述隔断结构背离所述基板一侧制备发光层和第一电极层，所述第一电极层从所述显示区延伸至所述过渡区，并在所述隔断结构处断开。
  18. 根据权利要求17所述的制备方法，其中，所述电荷分散结构包括叠置的至少一个导电层；所述制备方法还包括：
    与至少一个所述导电层同步制备至少一个金属层，所述金属层和所述导电层一一对应，所述所述金属层位于所述显示区；
    在所述基板上制备电连接的电荷分散结构和至少一个中间隔断结构之前，所述制备方法还包括：
    在所述基板上制备像素电路，所述像素电路和所述第二电极层电连接，所述像素电路包括至少一个所述金属层。
  19. 根据权利要求17所述的制备方法，其中，所述对所述第二电极材料层和所述中间隔断结构的侧壁进行湿刻，得到第二电极层和隔断结构的同时，进一步得到保留电极，所述保留电极位于所述过渡区；
    所述制备方法还包括：
    在所述保留电极的周边制备保护层。
  20. 根据权利要求17所述的制备方法，其中，在所述在所述基板上制备第二电极材料层之前，还包括：
    在部分所述隔断结构的单侧侧壁上制备电位隔断结构，延伸至所述过渡区的所述第一电极层和至少一个发光功能层在所述电位隔断结构背离所述隔断结构的表面上连续；
    所述制备方法还包括：
    与所述电位隔断结构同步制备平坦化层，所述平坦化层位于所述发光功能层和所述基板之间。
PCT/CN2025/099530 2024-06-11 2025-06-06 显示面板及其制备方法、显示装置 Pending WO2025256473A1 (zh)

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CN118019397A (zh) * 2024-02-02 2024-05-10 京东方科技集团股份有限公司 显示面板、显示设备及显示面板的检测方法
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