WO2025159119A1 - 接合材及びその製造方法、並びに、はんだ継手及びその製造方法 - Google Patents

接合材及びその製造方法、並びに、はんだ継手及びその製造方法

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Publication number
WO2025159119A1
WO2025159119A1 PCT/JP2025/001885 JP2025001885W WO2025159119A1 WO 2025159119 A1 WO2025159119 A1 WO 2025159119A1 JP 2025001885 W JP2025001885 W JP 2025001885W WO 2025159119 A1 WO2025159119 A1 WO 2025159119A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
layer
mass
thickness
coating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/001885
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
智揮 佐々木
真司 菊池
芳恵 立花
歩 美尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP2025572079A priority Critical patent/JPWO2025159119A1/ja
Publication of WO2025159119A1 publication Critical patent/WO2025159119A1/ja
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/18—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by using pressure rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0205—Non-consumable electrodes; C-electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C38/00—Ferrous alloys, e.g. steel alloys

Definitions

  • the present invention relates to a joining material and a manufacturing method thereof, as well as a soldered joint and a manufacturing method thereof.
  • solder joints can reach temperatures of around 250-280°C. For this reason, there is a demand for high-temperature solder that will not melt when operating under such high-temperature conditions.
  • preformed solder is used as the soldering material.
  • Preformed solder is a product made by processing solder into various shapes such as square, ribbon, and disk.
  • a preformed solder for example, a preformed solder obtained by compressing and molding a mixed powder of a metal powder of Sn and a metal powder made of an alloy of Ni and Fe has been proposed (see Patent Document 1).
  • preformed solder can suppress voids compared to TLP paste.
  • metal powder made from an alloy of Ni and Fe is exposed on the joint surface of the preformed solder that comes into contact with the object to be joined. Because the alloy of Ni and Fe has a high melting point and almost no wetting action, a new issue has been discovered: voids are likely to occur in the solder joint.
  • the present invention was made in consideration of the above circumstances, and aims to provide a bonding material and a manufacturing method thereof, as well as a solder joint and a manufacturing method thereof, that can suppress the occurrence of voids in solder joints.
  • a bonding material having a base metal layer and a coating layer covering at least one surface of the base metal layer wherein the base metal layer contains a first metal containing Sn and a second metal consisting of an alloy containing Ni and Fe, the coating layer contains a metal having a lower melting point than the second metal, and the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as base metal layer/coating layer, is 2 or more.
  • a bonding material having a base metal layer and a coating layer covering at least one surface of the base metal layer wherein the base metal layer has a metal structure including a first phase that is a continuous phase and a second phase that is dispersed in the first phase, the first phase being composed of a metal containing Sn, and the second phase being composed of an alloy containing Ni and Fe, the coating layer having a metal structure with a metal phase that is composed of a metal having a lower melting point than the alloy containing Ni and Fe, and the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as base metal layer/coating layer, is 2 or more.
  • a method for manufacturing a bonding material having a base metal layer and a coating layer covering at least one surface of the base metal layer comprising a step of pressing the coating sheet onto at least one surface of a base metal sheet to coat the surface with the coating layer, wherein the base metal sheet contains a first metal containing Sn and a second metal consisting of an alloy containing Ni and Fe, the coating sheet contains a metal having a lower melting point than the second metal, and the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as base metal layer/coating layer, is 2 or more.
  • the method for manufacturing a bonding material according to [11] wherein the base metal layer further contains a third metal whose entire surface is formed of a metal containing Ni.
  • a method for manufacturing a solder joint which forms a joint between objects using a bonding material manufactured by the method for manufacturing a bonding material according to [11] or [12].
  • the present invention provides a bonding material and manufacturing method thereof, as well as a solder joint and manufacturing method thereof, that can suppress the occurrence of voids in solder joints.
  • FIG. 1 is a perspective view of a bonding material 1A according to a first embodiment.
  • FIG. 1 is a schematic diagram showing a cross section in the thickness direction of a bonding material 1A according to a first embodiment.
  • FIG. 10 is an SEM image showing a cross section in the thickness direction of a bonding material 1B according to a second embodiment.
  • 1 is a schematic diagram showing a cross section in the thickness direction of a bonding material 1D obtained by a pressure bonding process A in one embodiment of a method for manufacturing a bonding material.
  • FIG. FIG. 2 is a schematic diagram showing a pressure bonding step B1 in one embodiment of a method for manufacturing a bonding material.
  • FIG. 10 is a schematic diagram showing a pressure bonding step B2 in one embodiment of the method for manufacturing a bonding material.
  • FIG. 10 is a schematic diagram showing a pressure bonding step B3 in one embodiment of the method for manufacturing a bonding material.
  • 10 is a schematic diagram showing a cross section of a third metal 30A in a bonding material according to a third embodiment.
  • FIG. 10 is an SEM image showing a cross section in the thickness direction of a bonding material 1C according to a fourth embodiment.
  • 13 is a schematic diagram showing a cross section of a third metal 30B in the bonding material according to the fifth embodiment.
  • first metal may mean “particles formed of the first metal,””particles formed of the second metal,””particles formed of the third metal,” and “particles formed of the fourth metal,” respectively.
  • first metal powder may mean "a group of particles formed of the first metal,””a group of particles formed of the second metal,””a group of particles formed of the third metal,” and “a group of particles formed of the fourth metal,” respectively.
  • a bonding material 1A according to the first embodiment has a square shape.
  • 1B is a schematic diagram showing a cross section of a bonding material 1A according to the first embodiment.
  • the bonding material 1A has a base metal layer 2A and coating layers 3A that respectively cover both surfaces (i.e., Sa1 and Sa2) of the base metal layer 2A.
  • Ta2 indicates the thickness of the base metal layer 2A
  • Ta3 indicates the thickness of the coating layer 3A.
  • the base metal layer contains a first metal containing Sn and a second metal made of an alloy containing Ni and Fe.
  • the coating layer contains a metal having a melting point lower than that of the second metal.
  • the composition of the base metal layer is different from the composition of the coating layer.
  • the base metal layer contains a first metal containing Sn and a second metal made of an alloy containing Ni and Fe.
  • the first metal includes Sn. Since Sn has excellent ductility, the first metal containing Sn can eliminate voids between the first metals by plastic deformation, and the first metal containing Sn can ensure general performance such as wettability as a soldering material.
  • the first metal may include a metal other than Sn.
  • metals other than Sn that may be contained in the first metal include Ag, Cu, In, Bi, Ni, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt, Pd, Fe, Mn, Zr, and As.
  • These metals other than Sn may include one type or two or more types.
  • the group of metals other than Sn can be arbitrarily selected from these metals.
  • the metals that may be contained in the first metal may be either Sn or a metal other than Sn, or an alloy of Sn and a metal other than Sn.
  • the first metal may be, for example, simple Sn, a mixture of Sn and a metal other than Sn, an alloy of Sn and a metal other than Sn, or a mixture of an alloy containing Sn and a metal other than Sn.
  • the first metal may contain unavoidable impurities in addition to the above-mentioned metals. Even if the first metal contains unavoidable impurities, the effects of the present invention are not affected.
  • the first metal may be one type or two or more types.
  • the melting point of the first metal is preferably 300°C or lower, and may be 250°C or lower, or may be 116 to 200°C.
  • the melting point of the first metal is equal to or lower than the upper limit of the above-mentioned preferred range, the wettability of the solder can be easily ensured.
  • melting point of the metal to be measured refers to the melting point measured by differential scanning calorimetry (DSC).
  • DSC differential scanning calorimetry
  • the melting point of the metal to be measured means the temperature at which the amount of heat absorbed per unit time is the highest, based on the results of DSC measurement of the metal to be measured.
  • the melting point of the metal to be measured means the temperature at the top of that peak.
  • the melting point of the metal to be measured means the temperature at the top of the peak with the highest amount of heat absorbed per unit time, among the multiple peak tops. The same applies to the melting point of the metal powder to be measured.
  • the melting points of the first metal and the fourth metal can be measured using, for example, a DSC7020 manufactured by Hitachi High-Tech Science Corp.
  • the melting points of the second metal and the third metal which will be described later, can be measured using, for example, a DSC404-F3 Pegasus manufactured by NETZSCH.
  • the Sn content in the first metal is preferably 20% by mass or more and 100% by mass or less, relative to the total mass of the first metal.
  • the Sn content in the first metal is preferably 90% by mass or more, more preferably 95% by mass or more, and even more preferably 100% by mass, relative to the total mass of the first metal.
  • the second metal is made of an alloy containing Ni and Fe.
  • the alloy in the second metal preferably contains Ni and Fe, has a higher melting point than the first metal, and is dispersed within the base metal layer.
  • the melting point of the alloy in the second metal is preferably above 300°C, more preferably 500°C or higher, and even more preferably 600 to 1600°C.
  • the alloy of the second metal may contain a metal other than Ni and Fe. That is, the second metal may be an alloy of Ni and Fe, or an alloy of Ni, Fe, and a metal other than these, and among these, an alloy of Ni and Fe is preferable.
  • metals other than Ni and Fe that the second metal may contain include Sn, Ag, Cu, In, Bi, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt, Pd, Mn, Zr, and As. These metals other than Ni and Fe may contain one type, or two or more types. The group of metals other than Ni and Fe can be selected from these metals.
  • the second metal may contain unavoidable impurities in addition to the above-mentioned metals. Even if the second metal contains unavoidable impurities, the effects of the present invention are not affected.
  • the second metal may be one type or two or more types.
  • the Ni content in the second metal is preferably 80 mass % or more and 99 mass % or less, and more preferably 85 mass % or more and 95 mass % or less, based on the total mass of the second metal.
  • the content of Fe in the second metal is preferably 1 mass % or more and 20 mass % or less, and more preferably 5 mass % or more and 15 mass % or less, relative to the total mass of the second metal.
  • particle size of a metal or particle size of a metal powder refers to the average particle size measured on a volume basis using a laser diffraction/scattering particle size distribution analyzer.
  • the average particle size can be measured using, for example, a laser diffraction/scattering particle size distribution analyzer (MT3300EXII) manufactured by Microtrac Bell.
  • the particle size of the second metal is preferably 0.1 to 1000 ⁇ m, more preferably 1 to 100 ⁇ m, and even more preferably 5 to 50 ⁇ m.
  • the particle size of the second metal is at least the lower limit of the above-mentioned preferred range, wettability is easily ensured, and when it is at most the upper limit of the above-mentioned preferred range, an intermetallic compound is more easily formed.
  • the content of the first metal is preferably 30 mass%, 60 mass%, 80 mass%, 90 mass%, or 97 mass% relative to the total mass (100 mass%) of the first metal and the second metal, and the upper and lower limits can be appropriately selected from these values.
  • the content of the first metal may be 30 to 99 mass %, or 30 to 97 mass %, relative to the total mass (100 mass %) of the first metal and the second metal.
  • the content of the second metal is preferably 3 mass%, 10 mass%, 20 mass%, 40 mass%, or 70 mass% relative to the total mass (100 mass%) of the first metal and the second metal, and the upper and lower limits can be appropriately selected from these values.
  • the content of the second metal may be 1 to 70 mass %, or may be 3 to 70 mass %, relative to the total mass (100 mass %) of the first metal and the second metal.
  • the total content of the first metal and the second metal does not exceed 100% by mass.
  • the ratio of the content of the first metal to the content of the second metal is preferably 0.43 or 32 as a mass ratio expressed as the content of the first metal/the content of the second metal, and the upper and lower limits can be appropriately selected from these values.
  • the mass ratio expressed as the content of the first metal/the content of the second metal may be 0.1 or more and 100 or less, or 0.4 or more and 35 or less.
  • the total content of the first metal and the second metal is preferably 60% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, and even more preferably 90% by mass or more and 100% by mass or less, and may even be 100% by mass, relative to the total mass of the base metal layer.
  • the thickness of the base metal layer is preferably 150 ⁇ m, 250 ⁇ m, 290 ⁇ m, 298 ⁇ m, 299 ⁇ m, or 1500 ⁇ m, and the upper and lower limits can be appropriately selected from these values.
  • the thickness of the base metal layer may be, for example, 5 to 5000 ⁇ m, 150 to 1500 ⁇ m, or 150 to 290 ⁇ m.
  • the thickness of the base metal layer is equal to or greater than the above lower limit, the heat resistance of the soldered joint can be more easily improved.
  • the thickness is equal to or less than the above upper limit, the generation of voids in the soldered joint that comes into contact with the object to be joined can be more easily suppressed.
  • the thickness of the base metal layer is, for example, 1 to 5000 ⁇ m, 3 to 5000 ⁇ m, 5 to 5000 ⁇ m, 10 to 5000 ⁇ m, 15 to 5000 ⁇ m, 20 to 5000 ⁇ m, 25 to 5000 ⁇ m, 30 to 5000 ⁇ m, 40 to 5000 ⁇ m, 50 to 5000 ⁇ m, 75 to 5000 ⁇ m, 100 to 500 0 ⁇ m, 125-5000 ⁇ m, 150-5000 ⁇ m, 175-5000 ⁇ m, 200-5000 ⁇ m, 250-5000 ⁇ m, 290-5 000 ⁇ m, 300-5000 ⁇ m, 350-5000 ⁇ m, 400-5000 ⁇ m, 500-5000 ⁇ m, 750-5000 ⁇ m, 100 0-5000 ⁇ m, 1200-5000 ⁇ m, 1500-5000 ⁇ m, 1-4000 ⁇ m, 1-3500 ⁇ m, 1-3000 ⁇ m, 1-25 00 ⁇ m, 1-2000 ⁇ m, 1-1500 ⁇ m, 1-1200 ⁇ m, 1-1000 ⁇ m, 1-750 ⁇ m, 1-500 ⁇ m,
  • the thickness of the base metal layer is equal to or greater than the above lower limit, the heat resistance of the soldered joint can be more easily improved.
  • the thickness is equal to or less than the above upper limit, the generation of voids in the soldered joint that comes into contact with the object to be joined can be more easily suppressed.
  • the coating layer contains a metal having a lower melting point than the alloy containing Ni and Fe that forms the second metal.
  • the metal that forms the coating layer forms a compound with the metal that forms the objects to be joined.
  • the melting point of the metal having a lower melting point than the second metal is preferably 300°C or lower, and may be 250°C or lower, or may be 78 to 200°C.
  • metals with a lower melting point than the second metal include metals containing Sn and metals containing In.
  • the coating layer may contain metals other than Sn and In.
  • the metal that the coating layer may contain may be a simple metal other than Sn or In, or an alloy of Sn or In with a simple metal other than Sn or In.
  • the coating layer may be Sn alone, a mixture of Sn and a metal other than Sn, an alloy of Sn and a metal other than Sn, or a mixture of an alloy containing Sn and a metal other than Sn. Furthermore, the coating layer may be made of In alone, a mixture of In and a metal other than In, an alloy of In and a metal other than In, or a mixture of an alloy containing In and a metal other than In.
  • examples of metals other than Sn that may be contained include Ag, Cu, In, Bi, Ni, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt, Pd, Fe, Mn, Zr, and As.
  • the metal other than Sn may contain one type or two or more types.
  • the group of metals other than Sn can be arbitrarily selected from these metals.
  • examples of metals other than In that may be contained include Sn, Ag, Cu, Bi, Ni, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt, Pd, Fe, Mn, Zr, and As.
  • the metals other than In may include one type or two or more types.
  • the group of metals other than In can be arbitrarily selected from these metals.
  • the coating layer may contain unavoidable impurities in addition to the metals mentioned above. Even if unavoidable impurities are contained, this does not affect the effects of the present invention.
  • the content of Sn in the coating layer is preferably 10% by mass or more and 100% by mass or less relative to the total mass of the coating layer.
  • the content of Sn in the solder is preferably 40% by mass or more, more preferably 60% by mass or more, particularly preferably 80% by mass or more, and most preferably 90% by mass or more, and may be 95% by mass or more or 100% by mass.
  • the In content in the coating layer is preferably 10% by mass or more and 100% by mass or less relative to the total mass of the coating layer.
  • the In content in the solder is preferably 20% by mass or more, more preferably 40% by mass or more, particularly preferably 60% by mass or more, and most preferably 80% by mass or more, and may even be 100% by mass.
  • the coating layer may or may not contain the second metal described above in the [base metal layer], and it is preferable that it does not contain any.
  • the content of the second metal in the coating layer is preferably less than 15 mass%, more preferably 10 mass% or less, even more preferably 1 mass% or less, and particularly preferably 0.1 mass% or less, relative to the total mass of the coating layer.
  • the thickness of the coating layer is preferably 1 ⁇ m, 3 ⁇ m, 5 ⁇ m, 10 ⁇ m, 25 ⁇ m, 30 ⁇ m, 50 ⁇ m, 75 ⁇ m, 100 ⁇ m, or 150 ⁇ m, and the upper and lower limits can be appropriately selected from these values.
  • the thickness of the coating layer may be, for example, 1 to 150 ⁇ m, 3 to 100 ⁇ m, 1 to 75 ⁇ m, or 5 to 75 ⁇ m.
  • the thickness of the coating layer is equal to or greater than the lower limit, it is easier to suppress the generation of voids in the solder joint that contacts the object to be joined.
  • the thickness is equal to or less than the upper limit, it is easier to improve the heat resistance of the solder joint.
  • the thickness of the coating layer may be, for example, 1 to 150 ⁇ m, 3 to 150 ⁇ m, 5 to 150 ⁇ m, 7.5 to 150 ⁇ m, 10 to 150 ⁇ m, 12.5 to 150 ⁇ m, 15 to 150 ⁇ m, 20 to 150 ⁇ m, 25 to 150 ⁇ m, 30 to 150 ⁇ m, 40 to 150 ⁇ m, 50 to 150 ⁇ m, 75 to 150 ⁇ m, 1 to 125 ⁇ m, 1 to 100 ⁇ m, 1 to 75 ⁇ m, 1 to 50 ⁇ m, 1 to 40 ⁇ m, 1 to 30 ⁇ m, 1 to 25 ⁇ m, 1 to 20 ⁇ m, 1 to 15 ⁇ m, 1 to 12.5 ⁇ m, 1 to 10 ⁇ m, 1 to 7.5 ⁇ m, 1 to 5 ⁇ m, or 1 to 3 ⁇ m.
  • the thickness of the coating layer is equal to or greater than the lower limit, it is easier to suppress the generation of voids in the solder joint that contacts the object to be joined.
  • the thickness is equal to or less than the upper limit, it is easier to improve the heat resistance of the solder joint.
  • thickness of coating layer refers to the thickness of the coating layer that coats one side of the base metal layer. In other words, even if both sides of the base metal layer are coated with coating layers, “thickness of coating layer” refers to the thickness of the coating layer that coats one side of the base metal layer, out of the two coating layers.
  • the number of coating layers that coat one surface of the base metal layer may be one or two.
  • the thickness of the coating layer covering one side means the total thickness of all the coating layers covering one side.
  • the number of layers and composition of the coating layers on one side may be different from the number of layers and composition of the coating layers on the other side.
  • the thickness of the bonding material is preferably 300 ⁇ m or 1510 ⁇ m, and the upper and lower limits can be selected appropriately from these values.
  • the thickness of the bonding material may be, for example, 10 to 5300 ⁇ m, or 20 to 1510 ⁇ m.
  • the thickness of the bonding material is, for example, 2 to 5300 ⁇ m, 2 to 4000 ⁇ m, 2 to 3000 ⁇ m, 2 to 2000 ⁇ m, 2 to 1750 ⁇ m, 2 to 1510 ⁇ m, 2 to 1200 ⁇ m, 2 to 1000 ⁇ m, 2 to 750 ⁇ m, 2 to 500 ⁇ m, 2 to 400 ⁇ m, 2 to 300 ⁇ m, 2 to 250 ⁇ m, 2 to 200 ⁇ m, 2 to 150 ⁇ m, 2 to 100 ⁇ m, 2 to 75 ⁇ m, 2 to 50 ⁇ m, 2 to 40 ⁇ m, 2 to 30 ⁇ m, 5 to 5300 ⁇ m, 1 It may be 0 to 5300 ⁇ m, 15 to 5300 ⁇ m, 20 to 5300 ⁇ m, 30 to 5300 ⁇ m, 40 to 5300 ⁇ m, 50 to 5300 ⁇ m, 75 to 5300 ⁇ m, 100 to 5300 ⁇ m, 150 to 5300 ⁇ m, 200 to 5300 ⁇ m, 250 to
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer refers to the ratio expressed as base metal layer ( ⁇ m) / coating layer ( ⁇ m).
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer is preferably 2, 10, 58, 298, 299, or 300, and the upper and lower limits can be appropriately selected from these values.
  • the ratio expressed as base metal layer/coating layer may be, for example, 1 to 500, 2 to 300, 2 to 100, or 2 to 58.
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as base metal layer/coating layer, may be, for example, 2 to 500, 3 to 500, 5 to 500, 7.5 to 500, 10 to 500, 15 to 500, 20 to 500, 30 to 500, 50 to 500, 100 to 500, 200 to 500, 2 to 400, 2 to 350, 2 to 300, 2 to 250, 2 to 200, 2 to 150, 2 to 100, 2 to 75, 2 to 60, 2 to 58, 2 to 50, 2 to 30, 2 to 20, 2 to 15, 2 to 10, 2 to 7.5, 2 to 5, or 2 to 3.
  • the ratio of base metal layer/coating layer When the ratio of base metal layer/coating layer is within the above range, it becomes easier to improve the heat resistance of the soldered joint and to further suppress the generation of voids in the soldered joint that comes into contact with the object to be joined.
  • the ratio When the ratio is equal to or greater than the lower limit of the above range, it becomes easier to improve the heat resistance of the soldered joint.
  • the ratio When the ratio is equal to or less than the upper limit of the above range, it becomes easier to suppress the generation of voids in the soldered joint.
  • the above-mentioned specifications regarding the thickness of the base metal layer and the coating layer, the ratio between the thickness of the base metal layer and the thickness of the coating layer, the contents of the first metal and the second metal, etc. may be combined in any manner.
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer means a ratio expressed as base metal layer ( ⁇ m)/coating layer ( ⁇ m).
  • the thickness of the coating layer is 1 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 300; more preferably, the thickness of the coating layer is 5 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 200; even more preferably, the thickness of the coating layer is 5 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 100; and particularly preferably, the thickness of the coating layer is 5 to 75 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 60.
  • the thickness of the coating layer is within the above range and the ratio of the thickness of the base metal layer to the thickness of the coating layer is within the above range, it becomes easier to improve the heat resistance of the solder joint and to more easily suppress the occurrence of voids in the solder joint.
  • the bonding material according to the first embodiment preferably has a base metal layer thickness of 150 to 1500 ⁇ m, a coating layer thickness of 1 to 150 ⁇ m, a ratio of the thickness of the base metal layer to the thickness of the coating layer expressed as base metal layer/coating layer of 2 to 500, a content of the first metal of 30 to 97 mass% with respect to the total mass (100 mass%) of the first metal and the second metal, a content of the second metal of 3 to 70 mass% with respect to the total mass (100 mass%) of the first metal and the second metal, and a mass ratio of the content of the first metal to the content of the second metal of 0.4 or more and 35 or less, expressed as the content of the first metal/the content of the second metal.
  • the bonding material according to the first embodiment preferably has a base metal layer thickness of 150 to 290 ⁇ m, a coating layer thickness of 5 to 100 ⁇ m, a ratio of the thickness of the base metal layer to the thickness of the coating layer expressed as base metal layer/coating layer of 2 to 58, a content of the first metal of 30 to 97 mass% with respect to the total mass (100 mass%) of the first metal and the second metal, a content of the second metal of 3 to 70 mass% with respect to the total mass (100 mass%) of the first metal and the second metal, and a mass ratio of the content of the first metal to the content of the second metal of 0.4 or more and 35 or less, expressed as the content of the first metal/the content of the second metal.
  • the thickness of the base metal layer is 1 to 5000 ⁇ m
  • the thickness of the coating layer is 1 to 150 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as base metal layer/coating layer, is 2 to 500
  • the content of the first metal is 30 to 97 mass% relative to the total mass (100 mass%) of the first metal and the second metal
  • the content of the second metal is 3 to 70 mass% relative to the total mass (100 mass%) of the first metal and the second metal
  • the ratio of the content of the first metal to the content of the second metal expressed as a mass ratio of the content of the first metal/the content of the second metal, is 0.4 or more and 35 or less.
  • the thickness of the base metal layer is 1 to 2000 ⁇ m
  • the thickness of the coating layer is 1 to 100 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as base metal layer/coating layer, is 2 to 500
  • the content of the first metal is 30 to 97 mass% relative to the total mass (100 mass%) of the first metal and the second metal
  • the content of the second metal is 3 to 70 mass% relative to the total mass (100 mass%) of the first metal and the second metal
  • the ratio of the content of the first metal to the content of the second metal expressed as a mass ratio of the content of the first metal/the content of the second metal, is 0.4 or more and 35 or less.
  • the bonding material according to the first embodiment can be manufactured using known manufacturing methods, such as hot-dip galvanizing and rolling.
  • the bonding material according to the first embodiment described above includes a base metal layer and a coating layer that covers at least one surface of the base metal layer.
  • the bonding material can suppress the occurrence of voids in the solder joint.
  • the reason for this effect is as follows.
  • the surface of the base metal layer containing the metal powder made of Ni-Fe alloy has portions where the metal powder made of Ni-Fe alloy is exposed.
  • the Ni-Fe alloy has a high melting point and extremely low wetting action, so voids are likely to occur in the solder joint.
  • the coating layer covers the base metal layer so that the Ni-Fe alloy is not exposed on the surface of the base metal layer, and therefore, when the objects to be joined are joined using the joining material of the first embodiment, the occurrence of voids in the joint can be suppressed.
  • (Bonding material: second embodiment) 2A is an SEM image showing a cross section in the thickness direction of an example of a bonding material according to Embodiment 2.
  • a bonding material 1B has a base metal layer 2B and coating layers 3B that coat both surfaces of the base metal layer 2B.
  • the base metal layer 2B shown in FIG. 2A has a metal structure including a first phase 10 that is a continuous phase and a second phase 20 that is dispersed in the first phase.
  • the coating layer 3B shown in FIG. 2A has a metal structure with a metal phase made of a metal containing Ni and Fe and having a lower melting point than the alloy.
  • the composition of the base metal layer 2B is different from the composition of the coating layer 3B.
  • the bonding material 1B illustrated in Figure 2A is the bonding material of Example C1, which will be described later in the Examples section.
  • the thickness of the base metal layer is 150 ⁇ m
  • the thickness of the coating layer is 75 ⁇ m.
  • the content of the first phase is 80 mass% relative to the total mass of the base metal layer
  • the content of the second phase is 20 mass% relative to the total mass of the base metal layer.
  • the content of Ni in the second phase is 90 mass% relative to the total mass of the second phase
  • the content of Fe in the second phase is 10 mass% relative to the total mass of the second phase.
  • the bonding material 1B illustrated in FIG. 2A is a clad material in which coating layers are bonded to both surfaces of a base metal layer.
  • an intermetallic compound may be formed at a portion where the base metal layer and the coating layer are in contact.
  • the bonding material according to the second embodiment can be produced, for example, by pressure-bonding a base metal sheet, which is the material of the base metal layer, and a coating sheet, which is the material of the coating layer.
  • the base metal sheet can be manufactured by a method such as rolling molding using a metal powder containing, for example, a first metal including Sn and a second metal consisting of an alloy including Ni and Fe.
  • the base metal sheet can also be referred to as a solder preform.
  • the first phase 10 is a continuous phase and is composed of a metal containing Sn.
  • the description of the metal containing Sn and its content is the same as that of the ⁇ First metal> in the above embodiment.
  • crystal grain boundaries may exist between metal crystals containing Sn.
  • the melting point of the metals constituting the first phase as a whole can be measured in the same manner as the melting point of the first metal.
  • the melting point of the metals constituting the first phase as a whole is determined by the temperature of the peak top with the highest endothermic amount per unit time among multiple peak tops that the multiple types of metals constituting the first phase may have.
  • the overall melting point of the metals that make up the second phase is similarly defined.
  • the overall melting point of the metal forming the entire surface of the third phase is similarly defined.
  • the melting point of the metals constituting the third phase as a whole is defined in the same way.
  • the melting point of the metal forming the surface layer of the third phase as a whole is similarly defined, and the melting point of the metal forming the core portion of the third phase as a whole is similarly defined.
  • the explanation for the melting point of the metals that make up the first phase as a whole is the same as the explanation for the melting point of the first metal.
  • the second phase 20 is dispersed in the first phase 10.
  • the second phase 20 is made of an alloy containing Ni and Fe.
  • the description of the alloy containing Ni and Fe, its particle size, its content, etc. is the same as that of the ⁇ Second metal> in the first embodiment.
  • the explanation for the melting point of the alloy as a whole that constitutes the second phase is the same as the explanation for the melting point of the second metal.
  • the grain size of a phase can be measured and calculated from a cross-sectional structure containing that phase using an optical microscope, SEM, transmission electron microscope (TEM), etc.
  • the grain size of a phase can be calculated by measuring the diameters of three or more phases and averaging these values.
  • the particle size of the second phase can be the particle size of the second metal powder prepared to form the second phase.
  • content of metals constituting a phase means “total content of metals constituting a phase.”
  • the mixing ratio of the metal containing Sn that constitutes the first phase to the alloy containing Ni and Fe that constitutes the second phase is preferably 30 mass%, 60 mass%, 80 mass%, 90 mass%, or 97 mass% relative to the total mass (100 mass%) of the metal containing Sn that constitutes the first phase and the alloy containing Ni and Fe that constitutes the second phase, and the upper and lower limits can be appropriately selected from these values.
  • the content of the second metal may be 30 to 99 mass %, or may be 30 to 97 mass %.
  • the content of the alloy constituting the second phase is preferably 3 mass%, 10 mass%, 20 mass%, 40 mass%, or 70 mass% relative to the total mass (100 mass%) of the metal containing Sn constituting the first phase and the alloy containing Ni and Fe constituting the second phase, and the upper and lower limits can be appropriately selected from these values.
  • the content of the alloy constituting the second phase may be 1 to 70 mass % or 3 to 70 mass % relative to the total mass (100 mass %) of the metal containing Sn constituting the first phase and the alloy containing Ni and Fe constituting the second phase.
  • the total content of the Sn-containing metal that constitutes the first phase and the content of the alloy that constitutes the second phase does not exceed 100% by mass.
  • the ratio of the content of the metal containing Sn constituting the first phase to the content of the alloy containing Ni and Fe constituting the second phase, expressed as a mass ratio of the first phase/the second phase, is preferably 0.43 and 32, and the upper and lower limits can be appropriately selected from these values.
  • the mass ratio expressed as the first phase/the second phase is preferably 0.1 or more and 100 or less, and more preferably 0.4 or more and 35 or less.
  • the total content of the Sn-containing metal constituting the first phase and the Ni- and Fe-containing alloy constituting the second phase is preferably 60% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, and even more preferably 90% by mass or more and 100% by mass or less, and may be 100% by mass, relative to the total mass of the base metal layer.
  • the explanation of the thickness of the base metal layer and coating layer is the same as in the first embodiment.
  • the thickness of the base metal layer of the bonding material according to the second embodiment is preferably 150 ⁇ m, 250 ⁇ m, 290 ⁇ m, 298 ⁇ m, 299 ⁇ m, or 1500 ⁇ m, and the upper and lower limits can be appropriately selected from these values.
  • the thickness of the base metal layer may be, for example, 5 to 5000 ⁇ m, 150 to 1500 ⁇ m, or 150 to 290 ⁇ m.
  • the thickness of the base metal layer is equal to or greater than the above lower limit, the heat resistance of the soldered joint can be more easily improved.
  • the thickness is equal to or less than the above upper limit, the generation of voids in the soldered joint that comes into contact with the object to be joined can be more easily suppressed.
  • the thickness of the base metal layer of the bonding material according to the second embodiment is, for example, 1 to 5000 ⁇ m, 3 to 5000 ⁇ m, 5 to 5000 ⁇ m, 10 to 5000 ⁇ m, 15 to 5000 ⁇ m, 20 to 5000 ⁇ m, 25 to 5000 ⁇ m, 30 to 5000 ⁇ m, 40 to 5000 ⁇ m, 50 to 5000 ⁇ m, 75 to 5000 ⁇ m, ⁇ m, 100-5000 ⁇ m, 125-5000 ⁇ m, 150-5000 ⁇ m, 175-5000 ⁇ m, 200-5000 ⁇ m, 250-5000 ⁇ m, 290-5000 ⁇ m, 300-5000 ⁇ m, 350-5000 ⁇ m, 400-5000 ⁇ m, 500-5000 ⁇ m, 750-5000 ⁇ m, 1000-5000 ⁇ m, 1200-5000 ⁇ m, 1500-5000 ⁇ m, 1-4000 ⁇ m, 1-3500 ⁇ m, 1-3000 ⁇ m , 1-2500 ⁇ m, 1-2000 ⁇ m, 1-1500 ⁇ m, 1-1200 ⁇ m, 1-1000
  • the thickness of the base metal layer is equal to or greater than the above lower limit, the heat resistance of the soldered joint can be more easily improved.
  • the thickness is equal to or less than the above upper limit, the generation of voids in the soldered joint that comes into contact with the object to be joined can be more easily suppressed.
  • the coating layer 3B has a metal structure with a metal phase composed of a metal having a melting point lower than that of the alloy containing Ni and Fe.
  • the metal having a melting point lower than that of the alloy containing Ni and Fe, its content, etc. are the same as those described for the metal having a melting point lower than that of the alloy containing Ni and Fe in the first embodiment.
  • the metals and their contents forming the coating layer in the bonding material according to the second embodiment are the same as the metals and their contents forming the coating layer in the bonding material according to the first embodiment.
  • the number of coating layers and the thickness of the coating layers are the same as those in the first embodiment.
  • the coating layer may or may not have the second phase described above in the [base metal layer], and it is preferable that it does not have one.
  • the content of the alloy containing Ni and Fe constituting the second phase in the coating layer is preferably less than 15 mass %, more preferably 10 mass % or less, even more preferably 1 mass % or less, and particularly preferably 0.1 mass % or less, relative to the total mass of the coating layer.
  • the thickness of the coating layer is preferably 1 ⁇ m, 3 ⁇ m, 5 ⁇ m, 10 ⁇ m, 25 ⁇ m, 30 ⁇ m, 50 ⁇ m, 75 ⁇ m, 100 ⁇ m, or 150 ⁇ m, and the upper and lower limits can be selected appropriately from these values. For example, it may be 1 to 150 ⁇ m, 3 to 100 ⁇ m, 1 to 75 ⁇ m, or 5 to 75 ⁇ m.
  • the thickness of the coating layer is equal to or greater than the above lower limit, it becomes easier to suppress the occurrence of voids in the solder joint that comes into contact with the object to be joined.
  • the thickness is equal to or less than the above upper limit, it becomes easier to improve the heat resistance of the solder joint.
  • the thickness of the coating layer of the bonding material according to the second embodiment may be, for example, 1 to 150 ⁇ m, 3 to 150 ⁇ m, 5 to 150 ⁇ m, 7.5 to 150 ⁇ m, 10 to 150 ⁇ m, 12.5 to 150 ⁇ m, 15 to 150 ⁇ m, 20 to 150 ⁇ m, 25 to 150 ⁇ m, 30 to 150 ⁇ m, 40 to 150 ⁇ m, 50 to 150 ⁇ m, 75 to 150 ⁇ m, 1 to 125 ⁇ m, 1 to 100 ⁇ m, 1 to 75 ⁇ m, 1 to 50 ⁇ m, 1 to 40 ⁇ m, 1 to 30 ⁇ m, 1 to 25 ⁇ m, 1 to 20 ⁇ m, 1 to 15 ⁇ m, 1 to 12.5 ⁇ m, 1 to 10 ⁇ m, 1 to 7.5 ⁇ m, 1 to 5 ⁇ m, or 1 to 3 ⁇ m.
  • the thickness of the coating layer is equal to or greater than the lower limit, it is easier to suppress the generation of voids in the solder joint that contacts the object to be joined.
  • the thickness is equal to or less than the upper limit, it is easier to improve the heat resistance of the solder joint.
  • the thickness of the bonding material is preferably 300 ⁇ m or 1510 ⁇ m, and the upper and lower limits can be selected appropriately from these values.
  • the thickness of the bonding material may be, for example, 10 to 5300 ⁇ m, or 20 to 1510 ⁇ m.
  • the thickness of the bonding material according to the second embodiment is, for example, 2 to 5300 ⁇ m, 2 to 4000 ⁇ m, 2 to 3000 ⁇ m, 2 to 2000 ⁇ m, 2 to 1750 ⁇ m, 2 to 1510 ⁇ m, 2 to 1200 ⁇ m, 2 to 1000 ⁇ m, 2 to 750 ⁇ m, 2 to 500 ⁇ m, 2 to 400 ⁇ m, 2 to 300 ⁇ m, 2 to 250 ⁇ m, 2 to 200 ⁇ m, 2 to 150 ⁇ m, 2 to 100 ⁇ m, 2 to 75 ⁇ m, 2 to 50 ⁇ m, 2 to 40 ⁇ m, 2 to 30 ⁇ m, 5 to 5300 ⁇ m ⁇ m, 10 to 5300 ⁇ m, 15 to 5300 ⁇ m, 20 to 5300 ⁇ m, 30 to 5300 ⁇ m, 40 to 5300 ⁇ m, 50 to 5300 ⁇ m, 75 to 5300 ⁇ m, 100 to 5300 ⁇ m, 150 to 5300 ⁇ m, 200 to 5300 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer is preferably 2, 10, 58, 298, 299, or 300, and the upper and lower limits can be appropriately selected from these values.
  • the ratio expressed as base metal layer/coating layer may be, for example, 1 to 500, 2 to 300, 2 to 100, or 2 to 58.
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer may be, for example, 2 to 500, 3 to 500, 5 to 500, 7.5 to 500, 10 to 500, 15 to 500, 20 to 500, 30 to 500, 50 to 500, 100 to 500, 200 to 500, 300 to 500, 2 to 400, 2 to 350, 2 to 300, 2 to 250, 2 to 200, 2 to 150, 2 to 100, 2 to 75, 2 to 60, 2 to 58, 2 to 50, 2 to 30, 2 to 20, 2 to 15, 2 to 10, 2 to 7.5, 2 to 5, or 2 to 3.
  • the ratio of base metal layer/coating layer When the ratio of base metal layer/coating layer is within the above range, it becomes easier to improve the heat resistance of the soldered joint and to further suppress the generation of voids in the soldered joint that comes into contact with the object to be joined.
  • the ratio When the ratio is equal to or greater than the lower limit of the above range, it becomes easier to improve the heat resistance of the soldered joint.
  • the ratio When the ratio is equal to or less than the upper limit of the above range, it becomes easier to suppress the generation of voids in the soldered joint.
  • the above-mentioned specifications regarding the thickness of the base metal layer and the coating layer, the ratio between the thickness of the base metal layer and the thickness of the coating layer, the content of the Sn-containing metal constituting the first phase and the Ni- and Fe-containing alloy constituting the second phase, etc. may be combined in any manner.
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer means a ratio expressed as base metal layer ( ⁇ m)/coating layer ( ⁇ m).
  • the thickness of the coating layer is 1 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 300; more preferably, the thickness of the coating layer is 5 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 200; even more preferably, the thickness of the coating layer is 5 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 100; and particularly preferably, the thickness of the coating layer is 5 to 75 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 60.
  • the thickness of the coating layer is within the above range and the ratio of the thickness of the base metal layer to the thickness of the coating layer is within the above range, it becomes easier to improve the heat resistance of the solder joint and to more easily suppress the occurrence of voids in the solder joint.
  • the thickness of the base metal layer is 150 to 1500 ⁇ m
  • the thickness of the coating layer is 1 to 150 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 500 as a ratio expressed as base metal layer/coating layer
  • the content of the metal containing Sn constituting the first phase is 30 to 97 mass% with respect to the total mass (100 mass%) of the metal containing Sn constituting the first phase and the alloy containing Ni and Fe constituting the second phase
  • the content of the alloy containing Ni and Fe constituting the second phase is 3 to 70 mass% with respect to the total mass (100 mass%) of the metal containing Sn constituting the first phase and the alloy containing Ni and Fe constituting the second phase
  • the ratio of the content of the metal containing Sn constituting the first phase to the content of the alloy containing Ni and Fe constituting the second phase is 0.4 to 35 as a mass ratio expressed as the content of the first metal/the content of the second metal.
  • the thickness of the base metal layer is 150 to 290 ⁇ m
  • the thickness of the coating layer is 5 to 100 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 58, expressed as the ratio of base metal layer/coating layer
  • the content of the Sn-containing metal constituting the first phase is 30 to 97 mass% with respect to the total mass (100 mass%) of the Sn-containing metal constituting the first phase and the Ni- and Fe-containing alloy constituting the second phase
  • the content of the Ni- and Fe-containing alloy constituting the second phase is 3 to 70 mass% with respect to the total mass (100 mass%) of the Sn-containing metal constituting the first phase and the Ni- and Fe-containing alloy constituting the second phase
  • the ratio of the content of the first metal to the content of the second metal is 0.4 or more and 35 or less, expressed as the mass ratio of the content of the first metal/the content of the second metal.
  • the thickness of the base metal layer is 1 to 5000 ⁇ m
  • the thickness of the coating layer is 1 to 150 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as base metal layer/coating layer, is 2 to 500
  • the content of the Sn-containing metal constituting the first phase is 30 to 97 mass% relative to the total mass (100 mass%) of the Sn-containing metal constituting the first phase and the Ni- and Fe-containing alloy constituting the second phase
  • the content of the Ni- and Fe-containing alloy constituting the second phase is 3 to 70 mass% relative to the total mass (100 mass%) of the Sn-containing metal constituting the first phase and the Ni- and Fe-containing alloy constituting the second phase
  • the ratio of the content of the Sn-containing metal constituting the first phase to the content of the Ni- and Fe-containing alloy constituting the second phase expressed as a mass ratio of the content of the first metal/the content of the second metal
  • the thickness of the base metal layer is 1 to 2000 ⁇ m
  • the thickness of the coating layer is 1 to 100 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as a ratio of base metal layer/coating layer, is 2 to 500
  • the content of the Sn-containing metal constituting the first phase is 30 to 97 mass% relative to the total mass (100 mass%) of the Sn-containing metal constituting the first phase and the Ni- and Fe-containing alloy constituting the second phase
  • the content of the Ni- and Fe-containing alloy constituting the second phase is 3 to 70 mass% relative to the total mass (100 mass%) of the Sn-containing metal constituting the first phase and the Ni- and Fe-containing alloy constituting the second phase
  • the ratio of the content of the Sn-containing metal constituting the first phase to the Ni- and Fe-containing alloy constituting the second phase expressed as a mass ratio of the content of the first metal/the content of the second metal
  • the bonding material according to the second embodiment can be manufactured by, for example, the following manufacturing method.
  • the method for manufacturing a bonding material according to this embodiment is a method for manufacturing a bonding material having a base metal layer and a coating layer that coats at least both surfaces of the base metal layer.
  • the method for manufacturing a bonding material according to this embodiment includes a pressure-bonding step A and any one of pressure-bonding steps B1 to B3.
  • ⁇ Compression bonding process A> a coating sheet is pressure-bonded to one surface of a base metal sheet to coat the surface with the coating layer.
  • the pressure bonding step A provides a bonding material 1D having a base metal layer 2D and a coating layer 3D that coats one surface Sd1 of the base metal layer 2D.
  • the base metal sheet contains a first metal containing Sn and a second metal made of an alloy containing Ni and Fe.
  • the covering sheet contains a metal having a melting point lower than that of the second metal.
  • the covering sheet may be manufactured by a known method, for example, by preparing a metal having a predetermined composition to form the covering sheet, processing the metal into a plate, rolling it to a predetermined thickness, and cutting it to a predetermined size.
  • the metals contained in the base metal sheet, their particle diameters, their contents, etc. are the same as those in the base metal layer of the bonding material.
  • the metals contained in the covering sheet and the amounts thereof are the same as those in the covering layer of the bonding material.
  • a known rolling method can be used, for example, processing can be performed using a twin-roll rolling mill, etc.
  • the number of times of rolling and the rolling load applied to the base metal sheet and the covering sheet can be appropriately set depending on the desired shape and thickness of the target bonding material.
  • the rolling load is not particularly limited, but may be, for example, 0.1 to 20 kN.
  • the number of times of rolling is not particularly limited, but may be 1 to 10 times.
  • the surface temperature of the rolling roll is not particularly limited, but may be, for example, 50 to 150°C.
  • an intermetallic compound may be formed at the interface between the base metal layer and the coating layer.
  • the method for manufacturing a bonding material according to this embodiment may include any one of the crimping processes B1 to B3 after the crimping process A.
  • ⁇ Press-bonding step B1> two bonding materials are prepared, each having a base metal layer and a coating layer that coats one surface of the base metal layer obtained in the pressure bonding step A.
  • the two bonding materials are referred to as a first bonding material and a second bonding material, respectively.
  • a first bonding material and a second bonding material respectively.
  • one surface Sd2 of the base metal layer 2D of the first bonding material 1D and one surface Sd2 of the base metal layer 2D of the second bonding material 1D are pressure-bonded together.
  • the pressure bonding step B1 provides a bonding material 1E having a base metal layer 2E and a coating layer 3E that coats both surfaces (i.e., Se1 and Se2) of the base metal layer 2E.
  • the method of crimping in the crimping step B1 may be the same as the method of crimping in the crimping step A.
  • ⁇ Press-bonding step B2> In the pressure-bonding step B2, one bonding material is prepared, which includes the base metal layer obtained in the pressure-bonding step A and a coating layer that coats one surface of the base metal layer. As illustrated in FIG. 2D, in the pressure-bonding step B2, the bonding material 1D is bent to pressure-bond the surfaces Sd2 of the base metal layers 2D of the bonding material 1D together. By the pressure bonding step B2, a bonding material 1E is obtained which has a base metal layer 2E and a coating layer 3E which coats both surfaces (i.e., Se1 and Se2) of the base metal layer 2E.
  • the method of crimping in the crimping step B2 may be the same as the method of crimping in the crimping step A.
  • one bonding material is prepared, which includes the base metal layer obtained in the pressure-bonding step A and a coating layer that coats one surface of the base metal layer.
  • a cover sheet 3D' is pressure-bonded to one surface Sd2 of the base metal layer 2D of the bonding material 1D.
  • a bonding material 1E is obtained that has a base metal layer 2E and a coating layer 3E that coats both surfaces (i.e., Se1 and Se2) of the base metal layer 2E.
  • the method of crimping in the crimping step B3 may be the same as the method of crimping in the crimping step A.
  • the manufacturing method of the base metal sheet is not particularly limited, but the base metal sheet may be manufactured, for example, by a powder compaction process.
  • ⁇ Powder compaction process In the powder compaction process, a metal powder mixture containing a first metal powder containing Sn and a second metal powder consisting of an alloy containing Ni and Fe is compacted to produce a base metal sheet which is a preform solder.
  • the first metal powder and the second metal powder are the same as the ⁇ first metal> and ⁇ second metal> described above, respectively.
  • the metal powder mixture can be compacted using a known rolling method, such as a twin-roll rolling mill, etc.
  • the number of rolling passes and the rolling load applied to the metal powder mixture can be appropriately set depending on the desired shape and thickness of the target base metal sheet.
  • the rolling load is not particularly limited, but may be, for example, 15 to 40 kN.
  • the surface temperature of the rolling rolls is not particularly limited, but may be, for example, 50 to 150°C.
  • the bonding material according to the second embodiment described above can suppress the occurrence of voids in solder joints, just like the bonding material according to the first embodiment.
  • the base metal layer further contains a third metal whose entire surface is formed of a metal containing Ni.
  • the bonding material according to the third embodiment is similar to the bonding material according to the first embodiment, except that the base metal layer contains a third metal.
  • the entire surface of the third metal is made of a metal containing Ni, that is, Ni is exposed on the surface of the third metal.
  • the Ni content in the metal forming the entire surface of the third metal is 50 mass % or more and 100 mass % or less with respect to the total mass of the metal forming the entire surface of the third metal.
  • the melting point of the metal that forms the entire surface of the third metal is greater than 300°C, preferably 500°C or higher, and more preferably 600 to 1600°C.
  • the third metal is preferably dispersed within the base metal layer.
  • the metal that forms the entire surface of the third metal may consist of only Ni, or may contain metals other than Ni.
  • Examples of the metal that forms the entire surface of the third metal include Ni alone, an alloy of Ni with a metal other than Ni, and a mixture of an alloy containing Ni with another metal, with Ni alone being preferred.
  • examples of the metals other than Ni include Ag, Cu, In, Bi, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt, Pd, Fe, Mn, Zr, Sn, and As. These metals other than Ni may contain one type or two or more types. The group of metals other than Ni can be selected arbitrarily from these metals.
  • the metal forming the entire surface of the third metal may contain unavoidable impurities in addition to the metals described above. Even if unavoidable impurities are contained, the effects of the present invention are not affected.
  • the metal that forms the entire surface of the third metal may be one type, or two or more types may be laminated.
  • the metal forming the entire surface of the third metal is a metal containing Ni and a metal other than Ni
  • the content of Ni in the metal forming the entire surface is 50 mass% or more, preferably 70 mass% or more, more preferably 90 mass% or more, even more preferably 95 mass% or more, and particularly preferably 98 mass% or more, relative to the total mass of the metal forming the entire surface.
  • the metal forming the entire surface of the third metal contains Fe, it is preferable that the Fe content in the metal forming the entire surface of the third metal is greater than or equal to 0 mass% and less than 5 mass% relative to the total mass of the metal forming the entire surface of the third metal.
  • the third metal preferably has a particle size of 0.1 to 1000 ⁇ m, more preferably 1 to 300 ⁇ m, and even more preferably 10 to 100 ⁇ m.
  • the particle size of the third metal is equal to or greater than the lower limit of the above-mentioned preferred range, the thermal conductivity of the solder joint is likely to be increased.
  • the third metal may have a uniform composition throughout.
  • the third metal may have a structure with a plurality of different compositions.
  • the third metal When the third metal has a uniform composition throughout, the third metal may be a metal consisting only of Ni, as described in (1-1) below, or may be a metal containing Ni and a metal other than Ni, as described in (1-2) below. Alternatively, as will be described in (2) below, when the third metal has a structure with a plurality of different compositions, the third metal may have a core portion and a surface layer. These cases will be explained below.
  • the third metal has a uniform composition throughout (1-1)
  • the third metal consists only of Ni
  • the composition of the third metal is different from the compositions of the first metal and the second metal.
  • the content of Ni in the metal forming the entire surface of the third metal is 100 mass% relative to the total mass of the metal forming the entire surface of the third metal
  • the proportion of Ni on the surface of the third metal is 100% relative to the entire surface area (100%) of the third metal.
  • the third metal may contain inevitable impurities in addition to Ni. Even if the third metal contains inevitable impurities, the effects of the present invention are not affected.
  • the composition of the third metal is different from the compositions of the first metal and the second metal.
  • the third metal may be a mixture of Ni and a metal other than Ni, an alloy of Ni and a metal other than Ni, or a mixture of an alloy containing Ni and a metal other than Ni.
  • the third metal may contain unavoidable impurities in addition to the above-mentioned metals. Even if the third metal contains unavoidable impurities, the effects of the present invention are not affected.
  • the third metal (1-2) may be one type or two or more types.
  • the content of Ni in the third metal is 50 mass% or more and 100 mass% or less, preferably 70 mass% or more, more preferably 90 mass% or more, even more preferably 95 mass% or more, and particularly preferably 98 mass% or more, relative to the total mass of the third metal.
  • the content of Fe in the third metal is preferably 0 mass % or more and less than 5 mass % with respect to the total mass of the third metal.
  • the third metal 30A has a structure consisting of a core portion and a surface layer covering the core portion As illustrated in Fig. 3, the third metal 30A has a core portion 301 and a surface layer 302 covering the core portion 301.
  • Rc means the particle diameter of the core portion 301 (hereinafter, Rc may be referred to as the core diameter).
  • Rs means the thickness of the surface layer 302.
  • composition of the metal forming the surface layer is different from the composition of the metal forming the core portion, and the composition of the third metal is different from the compositions of the first metal and the second metal.
  • composition of the metal forming the surface layer of the third metal is different from the compositions of the first metal and the second metal.
  • the metal forming the surface layer of the third metal may be made of only Ni, or may be a metal containing Ni and a metal other than Ni. That is, the metal forming the surface layer of the third metal may be Ni alone, or may be an alloy of Ni and a metal other than Ni.
  • the metal forming the surface layer of the third metal is preferably Ni alone.
  • Metals other than Ni that may be included in the metal forming the surface layer of the third metal include, for example, Ag, Cu, In, Bi, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt, Pd, Fe, Mn, Zr, Sn, and As. These metals other than Ni may include one type or two or more types. The group of metals other than Ni can be selected arbitrarily from these metals.
  • the metal forming the surface layer of the third metal may contain unavoidable impurities in addition to the above-mentioned metals. Even if unavoidable impurities are contained, the effects of the present invention are not affected.
  • the surface layer of the third metal may be made of one type of metal, or two or more types of metal may be laminated.
  • the metal forming the surface layer of the third metal is a metal containing Ni and a metal other than Ni
  • the content of Ni in the metal forming the surface layer of the third metal is 50 mass% or more and less than 100 mass% relative to the total mass of the metal forming the surface layer of the third metal, preferably 70 mass% or more, more preferably 80 mass% or more, even more preferably 90 mass% or more, particularly preferably 95 mass% or more, and most preferably 98 mass% or more.
  • the metal forming the surface layer of the third metal contains Fe, it is preferable that the content of Fe in the metal forming the surface layer of the third metal is equal to or greater than 0 mass% and less than 5 mass% relative to the total mass of the metal forming the surface layer of the third metal.
  • At least a portion of the surface of the core portion is covered with a surface layer.
  • the surface layer may cover a portion of the core portion or the entire core portion, and preferably covers the entire core portion.
  • the entire surface of core portion 301 is covered with surface layer 302.
  • the proportion of the surface area of the core portion that is covered by the surface layer relative to the total surface area (100%) of the core portion is preferably 50% or more and 100% or less, more preferably 70% or more and 100% or less, even more preferably 90% or more and 100% or less, particularly preferably 95% or more and 100% or less, and most preferably 100%.
  • the thickness Rs of the surface layer of the third metal may be, for example, 0.01 ⁇ m or more and 100 ⁇ m or less.
  • the thickness of the surface layer of the third metal may be 0.1 ⁇ m or more, 0.3 ⁇ m or more, 0.5 ⁇ m or more, 0.75 ⁇ m or more, 1 ⁇ m or more, or 2 ⁇ m or more.
  • the thickness of the surface layer of the third metal may be 50 ⁇ m or less, 30 ⁇ m or less, 10 ⁇ m or less, 5 ⁇ m or less, or 3 ⁇ m or less.
  • the thickness Rs of the surface layer of the third metal, the core diameter Rc of the core portion of the third metal, and the thickness Ri of the intermediate layer described later can be measured from the cross-sectional structure of the third metal using an optical microscope, SEM, transmission electron microscope (TEM), etc.
  • the thickness Rs of the surface layer of the third metal can be measured using an Auger electron spectrometer.
  • the core diameter Rc of the core portion of the third metal can be measured as follows.
  • the particle size of the metal powder prepared for use as the core portion can be taken as the core diameter Rc.
  • the surface layer of the third metal may be a plated layer formed by plating.
  • plating methods include known electroplating and electroless plating.
  • the melting point of the metal forming the surface layer of the third metal is above 300°C, preferably above 500°C, and more preferably between 600 and 1600°C.
  • the metal forming the core portion of the third metal may be one type of elemental metal, a mixture of two or more types of elemental metals, an alloy formed from two or more types of metal elements, a mixture of alloys formed from two or more types of metal elements, or a mixture of an alloy formed from two or more types of metal elements and an elemental metal.
  • Examples of metals that may be contained in the core portion of the third metal include Ag, Cu, In, Bi, Ni, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt, Pd, Fe, Mn, Zr, Sn, and As. These metals may be contained alone or in combination of two or more. The group of metals that may be contained in the core portion can be selected from these metals.
  • the core portion of the third metal may contain inevitable impurities in addition to the above-mentioned metals. Even if inevitable impurities are contained, the effects of the present invention are not affected.
  • the metal forming the core portion of the third metal may be one type or two or more types.
  • the core diameter Rc of the core portion of the third metal is preferably 0.1 to 1000 ⁇ m, more preferably 3 to 800 ⁇ m, even more preferably 5 to 500 ⁇ m, particularly preferably 8 to 300 ⁇ m, and most preferably 25 to 150 ⁇ m.
  • the third metal 30A may be one type or two or more types.
  • the content of the first metal is preferably 10 to 98 mass %, more preferably 30 to 90 mass %, and even more preferably 40 to 80 mass %, relative to the total mass of the first metal, the second metal, and the third metal.
  • the content of the second metal is preferably 1 to 70 mass %, more preferably 3 to 30 mass %, relative to the total mass of the first metal, the second metal, and the third metal.
  • the content of the third metal is preferably 1 to 70 mass %, more preferably 5 to 50 mass %, relative to the total mass of the first metal, the second metal, and the third metal.
  • the content of the third metal is within the above-mentioned preferable range, the thermal conductivity of the solder joint can be more easily increased.
  • the total content of the second metal and the third metal is preferably 1 to 90 mass %, more preferably 3 to 70 mass %, and even more preferably 20 to 60 mass %, relative to the total mass of the first metal, the second metal, and the third metal.
  • the total content of the first metal, the second metal, and the third metal does not exceed 100% by mass.
  • the total content of the first metal, second metal, and third metal is preferably 60 to 100 mass%, more preferably 80 to 100 mass%, even more preferably 90 to 100 mass%, and may even be 100 mass%, relative to the total mass of the base metal layer.
  • the ratio of the content of the first metal to the content of the second metal is preferably 0.1 or more and 100 or less, more preferably 1 or more and 50 or less, and even more preferably 4 or more and 30 or less.
  • mass ratio is within the above-mentioned preferred range, voids in the soldered joints can be more easily suppressed, and the heat resistance of the soldered joints can be further improved.
  • the ratio of the content of the first metal to the content of the third metal is preferably 0.1 or more and 100 or less, more preferably 0.3 or more and 20 or less, and even more preferably 1 or more and 5 or less.
  • mass ratio is within the above-mentioned preferred range, it becomes easier to suppress voids in the soldered joints and to increase the thermal conductivity of the soldered joints.
  • the ratio of the content of the second metal to the content of the third metal is preferably 0.01 or more and 100 or less, more preferably 0.1 or more and 50 or less, and even more preferably 1 or more and 30 or less.
  • mass ratio is within the above-mentioned preferred range, the heat resistance of the soldered joints is more likely to be improved, and the thermal conductivity of the soldered joints is more likely to be increased.
  • the description of the composition of the coating layer is the same as that in the first embodiment.
  • the explanation of the thickness of the base metal layer and coating layer is the same as in the first embodiment.
  • the thickness of the base metal layer is preferably 5 to 5000 ⁇ m, more preferably 150 to 1500 ⁇ m, and even more preferably 150 to 290 ⁇ m.
  • the thickness of the coating layer is preferably 1 to 150 ⁇ m, more preferably 3 to 100 ⁇ m, and even more preferably 5 to 75 ⁇ m.
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer is expressed as the ratio of base metal layer/coating layer, and the ratio expressed as base metal layer/coating layer is, for example, preferably 1 to 500, more preferably 2 to 100, and even more preferably 2 to 58.
  • the thickness of the base metal layer of the bonding material according to the third embodiment is, for example, 1 to 5000 ⁇ m, 3 to 5000 ⁇ m, 5 to 5000 ⁇ m, 10 to 5000 ⁇ m, 15 to 5000 ⁇ m, 20 to 5000 ⁇ m, 25 to 5000 ⁇ m, 30 to 5000 ⁇ m, 40 to 5000 ⁇ m, 50 to 5000 ⁇ m, 75 to 5000 ⁇ m, ⁇ m, 100-5000 ⁇ m, 125-5000 ⁇ m, 150-5000 ⁇ m, 175-5000 ⁇ m, 200-5000 ⁇ m, 250-5000 ⁇ m, 290-5000 ⁇ m, 300-5000 ⁇ m, 350-5000 ⁇ m, 400-5000 ⁇ m, 500-5000 ⁇ m, 750-5000 ⁇ m, 1000-5000 ⁇ m, 1200-5000 ⁇ m, 1500-5000 ⁇ m, 1-4000 ⁇ m, 1-3500 ⁇ m, 1-3000 ⁇ m , 1-2500 ⁇ m, 1-2000 ⁇ m, 1-1500 ⁇ m, 1-1200 ⁇ m, 1-1000
  • the thickness of the base metal layer is equal to or greater than the above lower limit, the heat resistance of the soldered joint can be more easily improved.
  • the thickness is equal to or less than the above upper limit, the generation of voids in the soldered joint that comes into contact with the object to be joined can be more easily suppressed.
  • the thickness of the coating layer of the bonding material according to the third embodiment may be, for example, 1 to 150 ⁇ m, 3 to 150 ⁇ m, 5 to 150 ⁇ m, 7.5 to 150 ⁇ m, 10 to 150 ⁇ m, 12.5 to 150 ⁇ m, 15 to 150 ⁇ m, 20 to 150 ⁇ m, 25 to 150 ⁇ m, 30 to 150 ⁇ m, 40 to 150 ⁇ m, 50 to 150 ⁇ m, 75 to 150 ⁇ m, 1 to 125 ⁇ m, 1 to 100 ⁇ m, 1 to 75 ⁇ m, 1 to 50 ⁇ m, 1 to 40 ⁇ m, 1 to 30 ⁇ m, 1 to 25 ⁇ m, 1 to 20 ⁇ m, 1 to 15 ⁇ m, 1 to 12.5 ⁇ m, 1 to 10 ⁇ m, 1 to 7.5 ⁇ m, 1 to 5 ⁇ m, or 1 to 3 ⁇ m.
  • the thickness of the coating layer is equal to or greater than the lower limit, it is easier to suppress the generation of voids in the solder joint that contacts the object to be joined.
  • the thickness is equal to or less than the upper limit, it is easier to improve the heat resistance of the solder joint.
  • the thickness of the bonding material according to the third embodiment is, for example, 2 to 5300 ⁇ m, 2 to 4000 ⁇ m, 2 to 3000 ⁇ m, 2 to 2000 ⁇ m, 2 to 1750 ⁇ m, 2 to 1510 ⁇ m, 2 to 1200 ⁇ m, 2 to 1000 ⁇ m, 2 to 750 ⁇ m, 2 to 500 ⁇ m, 2 to 400 ⁇ m, 2 to 300 ⁇ m, 2 to 250 ⁇ m, 2 to 200 ⁇ m, 2 to 150 ⁇ m, 2 to 100 ⁇ m, 2 to 75 ⁇ m, 2 to 50 ⁇ m, 2 to 40 ⁇ m, 2 to 30 ⁇ m, 5 to 5300 ⁇ m ⁇ m, 10 to 5300 ⁇ m, 15 to 5300 ⁇ m, 20 to 5300 ⁇ m, 30 to 5300 ⁇ m, 40 to 5300 ⁇ m, 50 to 5300 ⁇ m, 75 to 5300 ⁇ m, 100 to 5300 ⁇ m, 150 to 5300 ⁇ m, 200 to 5300 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as base metal layer/coating layer, may be, for example, 2 to 500, 3 to 500, 5 to 500, 7.5 to 500, 10 to 500, 15 to 500, 20 to 500, 30 to 500, 50 to 500, 100 to 500, 200 to 500, 2 to 400, 2 to 350, 2 to 300, 2 to 250, 2 to 200, 2 to 150, 2 to 100, 2 to 75, 2 to 60, 2 to 58, 2 to 50, 2 to 30, 2 to 20, 2 to 15, 2 to 10, 2 to 7.5, 2 to 5, or 2 to 3.
  • the ratio of base metal layer/coating layer When the ratio of base metal layer/coating layer is within the above range, it becomes easier to improve the heat resistance of the soldered joint and to further suppress the generation of voids in the soldered joint that comes into contact with the object to be joined.
  • the ratio When the ratio is equal to or greater than the lower limit of the above range, it becomes easier to improve the heat resistance of the soldered joint.
  • the ratio When the ratio is equal to or less than the upper limit of the above range, it becomes easier to suppress the generation of voids in the soldered joint.
  • the above-mentioned provisions regarding the thickness of the base metal layer and the coating layer, the ratio between the thickness of the base metal layer and the thickness of the coating layer, the structure of the third metal, and the contents of the first metal, second metal, and third metal may be combined in any manner.
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer means a ratio expressed as base metal layer ( ⁇ m)/coating layer ( ⁇ m).
  • the thickness of the coating layer is 1 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 300; more preferably, the thickness of the coating layer is 5 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 200; even more preferably, the thickness of the coating layer is 5 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 100; and particularly preferably, the thickness of the coating layer is 5 to 75 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 60.
  • the thickness of the coating layer is within the above range and the ratio of the thickness of the base metal layer to the thickness of the coating layer is within the above range, it becomes easier to improve the heat resistance of the solder joint and to more easily suppress the occurrence of voids in the solder joint.
  • the bonding material according to the third embodiment preferably has a base metal layer thickness of 150 to 290 ⁇ m, a coating layer thickness of 5 to 100 ⁇ m, a ratio of the thickness of the base metal layer to the thickness of the coating layer expressed as a ratio of base metal layer/coating layer of 2 to 58, the third metal consisting solely of Ni, the content of the first metal being 30 to 90 mass% of the total mass of the first metal, the second metal, and the third metal, the content of the second metal being 3 to 30 mass% of the total mass of the first metal, the second metal, and the third metal, and the content of the third metal being is 5 to 50 mass% of the total mass of the first metal, second metal, and third metal, the ratio of the content of the first metal to the content of the second metal, expressed as a mass ratio of first metal content/second metal content, is 4 or more and 30 or less, the ratio of the content of the first metal to the content of the third metal, expressed as a mass ratio of first metal content/third metal content, is 1 or more
  • the bonding material according to the third embodiment preferably has a base metal layer thickness of 150 to 290 ⁇ m, a coating layer thickness of 5 to 100 ⁇ m, a ratio of the thickness of the base metal layer to the thickness of the coating layer expressed as base metal layer/coating layer of 2 to 58, the third metal has a structure consisting of a core portion and a surface layer coating the core portion, the third metal has a structure consisting of a core portion and a surface layer coating the core portion, the metal forming the surface layer of the third metal consists only of Ni, the content of the first metal is 30 to 90 mass% relative to the total mass of the first metal, the second metal, and the third metal, and the content of the second metal is 30 to 90 mass% relative to the total mass of the first metal, the second metal, and the third metal.
  • the content of the third metal is 5 to 50 mass% of the total mass of the first metal, second metal and third metal
  • the ratio of the content of the first metal to the content of the second metal expressed as a mass ratio of first metal content/second metal content
  • the ratio of the content of the first metal to the content of the third metal expressed as a mass ratio of first metal content/third metal content
  • the ratio of the content of the second metal to the content of the third metal expressed as a mass ratio of third metal content/second metal content, is 1 or more and 30 or less.
  • the bonding material according to the third embodiment preferably has a base metal layer thickness of 1 to 5000 ⁇ m, a coating layer thickness of 1 to 150 ⁇ m, a ratio of the thickness of the base metal layer to the thickness of the coating layer expressed as base metal layer/coating layer of 2 to 500, the third metal consisting solely of Ni, the content of the first metal being 30 to 90 mass% relative to the total mass of the first metal, the second metal, and the third metal, the content of the second metal being 3 to 30 mass% relative to the total mass of the first metal, the second metal, and the third metal, and the content of the third metal being is 5 to 50 mass% of the total mass of the first metal, second metal, and third metal, the ratio of the content of the first metal to the content of the second metal, expressed as a mass ratio of first metal content/second metal content, is 4 or more and 30 or less, the ratio of the content of the first metal to the content of the third metal, expressed as a mass ratio of first metal content/third metal content, is 1 or more and 5 or
  • the bonding material according to the third embodiment preferably has a base metal layer thickness of 1 to 500 ⁇ m, a coating layer thickness of 1 to 100 ⁇ m, a ratio of the thickness of the base metal layer to the thickness of the coating layer expressed as base metal layer/coating layer of 2 to 500, the third metal consisting solely of Ni, the content of the first metal being 30 to 90 mass% relative to the total mass of the first metal, the second metal, and the third metal, the content of the second metal being 3 to 30 mass% relative to the total mass of the first metal, the second metal, and the third metal, and the content of the third metal being is 5 to 50 mass% relative to the total mass of the first metal, second metal, and third metal, the ratio of the content of the first metal to the content of the second metal, expressed as a mass ratio of first metal content/second metal content, is 4 to 30, the ratio of the content of the first metal to the content of the third metal, expressed as a mass ratio of first metal content/third metal content, is 1 to 5, and the ratio of the content of the
  • the bonding material according to the third embodiment can be manufactured using the same method as the bonding material according to the first embodiment.
  • the bonding material according to the third embodiment can suppress the occurrence of voids in the solder joint, similar to the bonding material according to the first embodiment.
  • the base metal layer contains a third metal, which can further increase the thermal conductivity of the solder joint. The reason why such an effect is obtained is not clear, but is presumed to be as follows.
  • Intermetallic compounds have lower thermal conductivity than Cu, Ni, etc.
  • the thermal conductivities of Cu and Ni are 401 W/m ⁇ K and 88.5 W/m ⁇ K, respectively, while the thermal conductivities of the intermetallic compounds Cu 6 Sn 5 (Cu 3 Sn) and Ni 3 Sn 4 are 34 W/m ⁇ K and 20 W/m ⁇ K, respectively.
  • the entire surface of the third metal is made of a metal containing Ni, and because Ni has low reactivity with Sn, Ni3Sn4 is unlikely to be produced. In other words, the surface of the third metal is unlikely to react with Sn in the base metal layer to form an intermetallic compound, making it possible to increase the thermal conductivity of the solder joint.
  • the bonding material according to the fourth embodiment has a base metal layer and a coating layer that coats at least one surface of the base metal layer.
  • Fig. 4 is an example of an SEM image showing a cross section in the thickness direction of the bonding material according to the fourth embodiment.
  • the bonding material 1C has a base metal layer 2C and a coating layer 3C that coats both surfaces of the base metal layer 2C.
  • the base metal layer 2C shown in Figure 4 has a metal structure including a first phase 10 which is a continuous phase, a second phase 20 dispersed in the first phase, and a third phase 30 dispersed in the first phase.
  • the bonding material 1C shown in Figure 4 has a base metal layer thickness of 285 ⁇ m and a coating layer thickness of 7.5 ⁇ m.
  • the content of the metal forming the first phase is 65 mass% relative to the total mass of the base metal layer
  • the content of the metal forming the second phase is 10 mass% relative to the total mass of the base metal layer
  • the content of the metal forming the third phase is 35 mass% relative to the total mass of the base metal layer.
  • the content of Ni in the second phase is 90 mass% relative to the total mass of the second phase
  • the content of Fe in the second phase is 10 mass% relative to the total mass of the second phase.
  • the bonding material according to the fourth embodiment is a clad material in which a coating layer is bonded to at least one surface of a base metal layer.
  • the bonding material according to the fourth embodiment is similar to the bonding material according to the second embodiment, except that the base metal layer has a third phase.
  • the third phase 30 is dispersed in the first phase 10 .
  • the entire surface of the third phase 30 is made of a metal containing Ni.
  • the bonding material according to the fourth embodiment is similar to the bonding material according to the second embodiment, except that the base metal layer has a third phase.
  • the description of the metal whose entire surface contains Ni, its particle size, its content, etc. is the same as that of the ⁇ third metal> in the third embodiment.
  • the description of the overall melting point of the metal that forms the entire surface of the third phase is the same as the description of the melting point of the metal that forms the entire surface of the third metal.
  • the metal constituting the first phase and its content are the same as those described for the ⁇ First metal> in the third embodiment.
  • the metal constituting the second phase and its content are the same as those described for the second metal in the third embodiment.
  • the overall composition of the metal that constitutes the third phase is different from the overall composition of the metal that constitutes the first phase and the overall composition of the alloy that constitutes the second phase.
  • the explanation for the melting point of the metals constituting the third phase as a whole is the same as the explanation for the melting point of the third metal.
  • the particle size of the third phase may be the particle size of the third metal powder prepared to form the third phase.
  • the overall composition of the metal forming the surface layer of the third phase is different from the overall composition of the metal forming the first phase and the overall composition of the alloy forming the second phase.
  • the overall melting point of the metal forming the surface layer of the third phase is similar to the melting point of the metal forming the surface layer of the third metal.
  • the diameter of the core portion and the thickness of the surface layer of the third phase are explained in the same manner as the diameter Rc of the core portion and the thickness Rs of the surface layer of the third metal, respectively.
  • the composition of the coating layer is the same as that of the second embodiment.
  • the explanation of the thickness of the base metal layer and coating layer is the same as in the third embodiment.
  • the thickness of the base metal layer is, for example, 1 to 5000 ⁇ m, 3 to 5000 ⁇ m, 5 to 5000 ⁇ m, 10 to 5000 ⁇ m, 15 to 5000 ⁇ m, 20 to 5000 ⁇ m, 25 to 5000 ⁇ m, 30 to 5000 ⁇ m, 40 to 5000 ⁇ m, 50 to 5000 ⁇ m, 75 to 5000 ⁇ m, 100 to 500 0 ⁇ m, 125-5000 ⁇ m, 150-5000 ⁇ m, 175-5000 ⁇ m, 200-5000 ⁇ m, 250-5000 ⁇ m, 290-5 000 ⁇ m, 300-5000 ⁇ m, 350-5000 ⁇ m, 400-5000 ⁇ m, 500-5000 ⁇ m, 750-5000 ⁇ m, 100 0-5000 ⁇ m, 1200-5000 ⁇ m, 1500-5000 ⁇ m, 1-4000 ⁇ m, 1-3500 ⁇ m, 1-3000 ⁇ m, 1-25 00 ⁇ m, 1-2000 ⁇ m, 1-1500 ⁇ m, 1-1200 ⁇ m, 1-1000 ⁇ m, 1-750 ⁇ m, 1-500 ⁇ m,
  • the thickness of the base metal layer is equal to or greater than the above lower limit, the heat resistance of the soldered joint can be more easily improved.
  • the thickness is equal to or less than the above upper limit, the generation of voids in the soldered joint that comes into contact with the object to be joined can be more easily suppressed.
  • the thickness of the coating layer may be, for example, 1 to 150 ⁇ m, 3 to 150 ⁇ m, 5 to 150 ⁇ m, 7.5 to 150 ⁇ m, 10 to 150 ⁇ m, 12.5 to 150 ⁇ m, 15 to 150 ⁇ m, 20 to 150 ⁇ m, 25 to 150 ⁇ m, 30 to 150 ⁇ m, 40 to 150 ⁇ m, 50 to 150 ⁇ m, 75 to 150 ⁇ m, 1 to 125 ⁇ m, 1 to 100 ⁇ m, 1 to 75 ⁇ m, 1 to 50 ⁇ m, 1 to 40 ⁇ m, 1 to 30 ⁇ m, 1 to 25 ⁇ m, 1 to 20 ⁇ m, 1 to 15 ⁇ m, 1 to 12.5 ⁇ m, 1 to 10 ⁇ m, 1 to 7.5 ⁇ m, 1 to 5 ⁇ m, or 1 to 3 ⁇ m.
  • the thickness of the coating layer is equal to or greater than the lower limit, it is easier to suppress the generation of voids in the solder joint that contacts the object to be joined.
  • the thickness is equal to or less than the upper limit, it is easier to improve the heat resistance of the solder joint.
  • the thickness of the bonding material is, for example, 2 to 5300 ⁇ m, 2 to 4000 ⁇ m, 2 to 3000 ⁇ m, 2 to 2000 ⁇ m, 2 to 1750 ⁇ m, 2 to 1510 ⁇ m, 2 to 1200 ⁇ m, 2 to 1000 ⁇ m, 2 to 750 ⁇ m, 2 to 500 ⁇ m, 2 to 400 ⁇ m, 2 to 300 ⁇ m, 2 to 250 ⁇ m, 2 to 200 ⁇ m, 2 to 150 ⁇ m, 2 to 100 ⁇ m, 2 to 75 ⁇ m, 2 to 50 ⁇ m, 2 to 40 ⁇ m, 2 to 30 ⁇ m, 5 to 5300 ⁇ m, 1 It may be 0 to 5300 ⁇ m, 15 to 5300 ⁇ m, 20 to 5300 ⁇ m, 30 to 5300 ⁇ m, 40 to 5300 ⁇ m, 50 to 5300 ⁇ m, 75 to 5300 ⁇ m, 100 to 5300 ⁇ m, 150 to 5300 ⁇ m, 200 to 5300 ⁇ m, 250 to
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer, expressed as base metal layer/coating layer, may be, for example, 2 to 500, 3 to 500, 5 to 500, 7.5 to 500, 10 to 500, 15 to 500, 20 to 500, 30 to 500, 50 to 500, 100 to 500, 200 to 500, 2 to 400, 2 to 350, 2 to 300, 2 to 250, 2 to 200, 2 to 150, 2 to 100, 2 to 75, 2 to 60, 2 to 58, 2 to 50, 2 to 30, 2 to 20, 2 to 15, 2 to 10, 2 to 7.5, 2 to 5, or 2 to 3.
  • the ratio of base metal layer/coating layer When the ratio of base metal layer/coating layer is within the above range, it becomes easier to improve the heat resistance of the soldered joint and to further suppress the generation of voids in the soldered joint that comes into contact with the object to be joined.
  • the ratio When the ratio is equal to or greater than the lower limit of the above range, it becomes easier to improve the heat resistance of the soldered joint.
  • the ratio When the ratio is equal to or less than the upper limit of the above range, it becomes easier to suppress the generation of voids in the soldered joint.
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer means a ratio expressed as base metal layer ( ⁇ m)/coating layer ( ⁇ m).
  • the thickness of the coating layer is 1 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 300; more preferably, the thickness of the coating layer is 5 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 200; even more preferably, the thickness of the coating layer is 5 to 150 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 100; and particularly preferably, the thickness of the coating layer is 5 to 75 ⁇ m, and the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 60.
  • the thickness of the coating layer is within the above range and the ratio of the thickness of the base metal layer to the thickness of the coating layer is within the above range, it becomes easier to improve the heat resistance of the solder joint and to more easily suppress the occurrence of voids in the solder joint.
  • the thickness of the base metal layer is 1 to 5000 ⁇ m
  • the thickness of the coating layer is 1 to 150 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 500, expressed as the ratio of base metal layer/coating layer
  • the metal constituting the third phase is composed only of Ni
  • the content of the metal constituting the first phase is 30 to 90 mass% relative to the total mass of the metal constituting the first phase, the alloy constituting the second phase, and the metal constituting the third phase
  • the content of the alloy constituting the second phase is 3 to 30 mass% relative to the total mass of the metal constituting the first phase, the alloy constituting the second phase, and the metal constituting the third phase
  • the content of the metal constituting the third phase is 3 to 30 mass% relative to the total mass of the metal constituting the first phase, the alloy constituting the second phase, and the metal constituting the third phase.
  • the content of the alloy constituting the first phase is 5 to 50 mass% of the total mass of the alloy constituting the third phase and the metal constituting the third phase; the ratio of the content of the metal constituting the first phase to the content of the alloy constituting the second phase, expressed as a mass ratio of the content of the metal constituting the first phase/the content of the alloy constituting the second phase, is 4 to 30; the ratio of the content of the metal constituting the first phase to the content of the metal constituting the third phase, expressed as a mass ratio of the content of the metal constituting the first phase/the content of the metal constituting the third phase, is 1 to 5; and the ratio of the content of the alloy constituting the second phase to the content of the metal constituting the third phase, expressed as a mass ratio of the content of the metal constituting the third phase/the content of the alloy constituting the second phase, is 1 to 30.
  • the thickness of the base metal layer is 1 to 500 ⁇ m
  • the thickness of the coating layer is 1 to 100 ⁇ m
  • the ratio of the thickness of the base metal layer to the thickness of the coating layer is 2 to 500, expressed as the ratio of base metal layer/coating layer
  • the metal constituting the third phase is composed only of Ni
  • the content of the metal constituting the first phase is 30 to 90 mass% relative to the total mass of the metal constituting the first phase, the alloy constituting the second phase, and the metal constituting the third phase
  • the content of the alloy constituting the second phase is 3 to 30 mass% relative to the total mass of the metal constituting the first phase, the alloy constituting the second phase, and the metal constituting the third phase
  • the content of the metal constituting the third phase is 10 to 120 mass% relative to the total mass of the metal constituting the first phase, the alloy constituting the second phase, and the metal constituting the third phase.
  • the content of the alloy constituting the first phase is 5 to 50 mass % of the total mass of the alloy constituting the first phase and the metal constituting the third phase
  • the ratio of the content of the metal constituting the second phase to the content of the alloy constituting the second phase expressed as a mass ratio of the content of the metal constituting the first phase/the content of the alloy constituting the second phase, is 4 to 30, and the ratio of the content of the metal constituting the first phase to the content of the metal constituting the third phase, expressed as a mass ratio of the content of the metal constituting the first phase/the content of the metal constituting the third phase, is 1 to 5, and the ratio of the content of the alloy constituting the second phase to the content of the metal constituting the third phase, expressed as a mass ratio of the content of the metal constituting the third phase/the content of the alloy constituting the second phase, is 1 to 30.
  • the bonding material according to the fourth embodiment can suppress the occurrence of voids in the solder joint and can further increase the thermal conductivity of the solder joint.
  • the bonding material according to the fourth embodiment can be manufactured using the same manufacturing method as the bonding material according to the second embodiment, except that a third metal powder is used in addition to the first and second metal powders.
  • the first metal powder, second metal powder, and third metal powder are the same as the ⁇ first metal>, ⁇ second metal>, and ⁇ third metal> described above, respectively.
  • the bonding material according to the fourth embodiment can be manufactured using the same method as the bonding material according to the second embodiment.
  • the base metal layer further contains a third metal 30B whose entire surface is formed of a metal containing Ni.
  • the third metal 30B has an intermediate layer 303 between a core portion 301 and a surface layer 302 that covers the core portion 301.
  • the intermediate layer 303 is adjacent to the core portion 301 and also adjacent to the surface layer 302.
  • Ri denotes the thickness of the intermediate layer 303.
  • the bonding material according to the fifth embodiment is similar to the bonding material according to the first embodiment, except that the base metal layer contains a third metal 30B.
  • the intermediate layer may cover a part of the surface of the core portion, or may cover the entire surface of the core portion, and preferably covers the entire surface of the core portion.
  • the intermediate layer 303 covers the entire surface of the core portion 301.
  • the proportion of the surface area of the core portion that is covered by the intermediate layer relative to the total surface area (100%) of the core portion is preferably 50% or more and 100% or less, more preferably 70% or more and 100% or less, even more preferably 90% or more and 100% or less, particularly preferably 95% or more and 100% or less, and most preferably 100%.
  • the composition of the metal forming the intermediate layer is different from the metal forming the core portion and the metal forming the surface layer.
  • the intermediate layer may be one layer or two or more layers.
  • the metal forming the intermediate layer may be a single elemental metal, or an alloy formed from two or more metal elements.
  • Metals that the intermediate layer may contain include, for example, Ag, Cu, In, Bi, Ni, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt, Pd, Fe, Mn, Zr, Sn, and As. These metals may be contained alone or in combination of two or more. The group of metals that the intermediate layer may contain can be arbitrarily selected from these metals.
  • the intermediate layer may contain unavoidable impurities in addition to the above-mentioned metals. Even if the intermediate layer contains unavoidable impurities, the effects of the present invention are not affected.
  • the intermediate layer may be of one type or of two or more types.
  • the thickness Ri of the intermediate layer may be, for example, 0.01 ⁇ m or more and 100 ⁇ m or less, 0.05 ⁇ m or more and 50 ⁇ m or less, or 0.1 ⁇ m or more and 10 ⁇ m or less.
  • the intermediate layer may be a plating formed by a plating process.
  • plating methods include known electroplating and electroless plating.
  • the core portion 301 and the surface layer 302 of the third metal 30B may be the same as those described above for the third metal 30A.
  • the third metal 30B may be one type or two or more types.
  • the bonding material of the fifth embodiment can suppress the occurrence of voids in the solder joint and can further increase the thermal conductivity of the solder joint.
  • the third metal 30B having the intermediate layer 303 makes it easier to provide the surface layer 302 of the third metal 30B.
  • the bonding material according to other embodiments only one surface of the base metal layer may be coated with the coating layer.
  • the bonding material according to other embodiments may be a clad material in which one surface of the base metal layer and the coating layer are pressure-bonded to each other.
  • a bonding material in which only one surface of the base metal layer is covered with a coating layer can be produced by the ⁇ Compression bonding step A> described above in the method for producing a bonding material of the second embodiment.
  • the base metal layer may contain a fourth metal in addition to the first metal, second metal, and third metal described in the third embodiment.
  • the fourth metal is a metal different from the first metal, second metal, and third metal.
  • the metal forming the fourth metal may be one type of elemental metal, a mixture of two or more types of elemental metals, an alloy formed from two or more types of metal elements, a mixture of alloys formed from two or more types of metal elements, or a mixture of an alloy formed from two or more types of metal elements and an elemental metal.
  • metals that may be included in the fourth metal include Ag, Cu, In, Bi, Ni, Ge, P, Co, Ga, Zn, Sb, Pb, Au, Al, Pt, Pd, Fe, Mn, Zr, Sn, and As. These metals may be included in one type or in combination of two or more types. The group of metals that may be included in the fourth metal can be selected from these metals.
  • the fourth metal powder preferably has a particle size of 0.1 to 1000 ⁇ m, more preferably 1 to 100 ⁇ m, and even more preferably 5 to 50 ⁇ m.
  • the fourth metal powder may contain one type of metal or two or more types of metals.
  • the fourth metal powder is not limited to one type, and metal powders of two or more different compositions may be used.
  • the bonding material according to another embodiment is a bonding material having a base metal layer as described in the above embodiment and a coating layer that covers at least one surface of the base metal layer, and is manufactured, for example, by a hot-dip plating method, a sputtering method, or the like.
  • the hot-dip plating method for example, the base metal layer is immersed in a molten metal that forms the coating layer and then cooled, thereby coating at least one surface of the base metal layer with the metal that forms the coating layer, thereby obtaining the bonding material according to this embodiment.
  • the metal that forms the coating layer is sputtered onto the base metal layer, thereby coating at least one surface of the base metal layer with the metal that forms the coating layer, thereby obtaining the bonding material of this embodiment.
  • the bonding material according to other embodiments may be the base metal layer of the second embodiment coated with a coating layer using, for example, hot-dip plating or sputtering.
  • solder joint In one embodiment, the present invention provides a solder joint formed using the bonding material according to the embodiment.
  • the solder joint of this embodiment does not melt even when a power semiconductor operates at high temperatures, and can suppress the generation of voids in the solder joint.
  • the present invention is a method for manufacturing a solder joint, in which a joint is formed between objects using a bonding material manufactured by the above-described (method for manufacturing a bonding material).
  • a bonding material manufactured by the above-described (method for manufacturing a bonding material).
  • semiconductor elements include silicon carbide (SiC) chips and Si chips.
  • the substrate include a circuit board, a ceramic substrate, a metal substrate, a DCB (Direct Copper Bonding) substrate, etc.
  • the electrode on the substrate may be, for example, a Cu electrode, or a Cu electrode plated with Sn, Ni, Ni—Au, Ni—Pd, or Ni—Pd—Au.
  • flux may be applied in advance to one or both surfaces of the bonding material that will become the bonding surfaces, the bonding surface of the semiconductor element, or the bonding surface of the substrate.
  • the temperature at which the semiconductor element and substrate are joined is preferably 120°C or higher and 400°C or lower, but may also be 200°C or higher and 400°C or lower, or 250°C or higher and 400°C or lower.
  • the method for manufacturing a solder joint of this embodiment is useful for joining under high-temperature conditions (250°C or higher).
  • the atmosphere in which the objects are joined may be air, an inert atmosphere such as a nitrogen atmosphere, or a reducing atmosphere.
  • a nitrogen atmosphere the pressure applied during bonding is preferably adjusted to 0.1 MPa or more and 10 MPa or less.
  • the joining material of the above embodiment can be used to form a joint between objects.
  • the shear strength of this joint can be 12 to 100 N, 16 to 50 N, or 20 to 35 N under conditions of 6.0 mm/min and 250°C.
  • the shear strength of the bonded portion can be measured, for example, as follows.
  • the target bonding material is cut into a size of 5 mm x 5 mm to obtain a test piece.
  • the test piece is mounted on an electroless Ni-plated Cu substrate having a thickness of 0.5 mm and dimensions of 50 mm x 50 mm.
  • a laser microscope for example, can be used to measure the surface roughness of the substrate.
  • a VK-X1000 manufactured by Keyence Corporation
  • a Cu plate having a thickness of 0.5 mm and a size of 5 mm x 5 mm is mounted on the bonding material.
  • soldering is performed in a reflow furnace under pressure in a formic acid atmosphere, with a profile in which the peak temperature is set to 250° C. and the cooling rate is set to 2° C./sec, to produce a soldered joint.
  • the shear strength (N) of the solder joint at the joint is measured using a shear strength measuring device under conditions of 6.0 mm/min and 250° C.
  • the shear strength measuring device for example, STR-1000 manufactured by Rhesca Co., Ltd. can be used.
  • Base metal sheets (A) to (G) were produced by the following procedure.
  • the base metal sheets (A) to (G) are preformed solders obtained by rolling and molding the following raw materials: first metal powder, second metal powder, third metal powder (1), and third metal powder (2).
  • the particle size of the metal powder was measured by measuring the average particle size on a volume basis using a laser diffraction/scattering particle size distribution analyzer (MT3300EXII) manufactured by Microtrac Bell.
  • the melting points of the metal powders were determined by differential scanning calorimetry (DSC).
  • the melting points of the first metal powder were measured using a DSC7020 manufactured by Hitachi High-Tech Science Corporation, and the melting points of the second and third metal powders were measured using a DSC404-F3 Pegasus manufactured by NETZSCH.
  • the thickness Rs of the surface layer of the third metal powder was measured using an Auger electron spectrometer.
  • Ni10Fe Metal powder consisting of an alloy of 90% Ni by mass and 10% Fe by mass (Ni-10% Fe powder), particle size 12.8 ⁇ m, melting point 1444°C
  • the core portion of the third metal powder (1) was a 100 mass % Cu core ball.
  • the particle diameter of the core portion i.e., the core diameter Rc of the core portion
  • the surface layer of the third metal powder (1) was plated with 100 mass % Ni.
  • the plating thickness i.e., the thickness Rs of the surface layer
  • the plated core balls of the third metal powder (1) were obtained by coating the entire surface of a 100% by mass Cu core ball with a 100% by mass Ni plating.
  • the 100% by mass Ni plating was formed by electroplating.
  • Base metal sheet (E) Sn-3 (Ni10Fe) A strip-shaped base metal sheet (E) of a predetermined thickness was obtained in the same manner as the manufacturing method of the base metal sheet (A), except that 97 parts by mass of the first metal powder and 3 parts by mass of the second metal powder were stirred to prepare a metal powder mixture.
  • a strip-shaped base metal sheet (F) of a predetermined thickness was obtained in the same manner as the manufacturing method of the base metal sheet (A), except that 60 parts by mass of the first metal powder, 5 parts by mass of the second metal powder, and 35 parts by mass of the third metal powder (1) were stirred to prepare a metal powder mixture.
  • Base metal sheet (G) Sn-5(Ni10Fe)-35Ni A strip-shaped base metal sheet (G) of a predetermined thickness was obtained in the same manner as the manufacturing method of the base metal sheet (A), except that 60 parts by mass of the first metal powder, 5 parts by mass of the second metal powder, and 35 parts by mass of the third metal powder (2) were stirred to prepare a metal powder mixture.
  • the coating sheets (X) to (Z) were produced according to the following procedure.
  • the following raw materials were used: Sn, Sn-3Ag-0.5Cu alloy, and Sn-5Sb alloy.
  • Covering sheet (X) Sn After processing Sn into a plate shape, it was rolled to a predetermined thickness and cut into a predetermined size to obtain a strip-shaped coated sheet (X) of a predetermined thickness.
  • Covering sheet (Y) Sn-3Ag-0.5Cu A coating sheet (Y) having a predetermined thickness was obtained in the same manner as in the production method of the coating sheet (X), except that a Sn-3Ag-0.5Cu alloy was used instead of Sn.
  • Covering sheet (Z) Sn-5Sb A coating sheet (Z) having a predetermined thickness was obtained in the same manner as in the production method of the coating sheet (X), except that a Sn-5Sb alloy was used instead of Sn.
  • the bonding materials of each example were prepared using the base metal sheets (A) to (G) and the coating sheets (X) to (Z).
  • the thicknesses of the base metal layer and the coating layer were as shown in Tables 1 to 8, respectively.
  • Example A1 The coating sheet (X) was rolled onto one side of the base metal sheet (A) to obtain a metal sheet. Next, the obtained one metal sheet was folded and rolled while the surfaces of the base metal layers were in contact with each other, to obtain a bonding material of Example A1 in which both sides of the base metal layer (A) were coated with the coating layer (X). In this bonding material, the thickness of the base metal layer (A) was 150 ⁇ m, and the thickness of the coating layer (X) was 75 ⁇ m.
  • Examples A2 to A11 As shown in Table 1, the bonding materials of Examples A2 to A6 and A8 to A11 were produced in the same manner as in Example A1, except that the bonding materials were produced using the base metal sheet (A) and the coating sheets (X) to (Z) so that the base metal layer and the coating layer had predetermined thicknesses.
  • Example A7 a bonding material was produced in the same manner as in Example A1, except that only one surface of the base metal sheet (A) was covered with the covering sheet (X).
  • Comparative Examples A1 to A7 As shown in Table 2, Comparative Examples A1 to A7 were produced in the same manner as Example A1, except that the base metal sheet (A) was used, no covering sheet was used, and the base metal layer was formed to a predetermined thickness.
  • Examples B1 to B3, C1 to C4, D1 to D4, E1 to E4, F1 to F4, G1 to G4 As shown in Tables 3 to 8, the bonding materials of each example were manufactured in the same manner as in Example A1, except that the bonding materials were manufactured using the base metal sheets (B) to (G) and the coating sheet (X) so that the base metal layer and the coating layer had a predetermined thickness.
  • FIG. 2 shows an SEM image showing a cross section in the thickness direction of the bonding material of Example C1.
  • each comparative example was produced in the same manner as in Example A1, except that the base metal sheets (B) to (G) were used and the base metal layer was formed to a predetermined thickness without using a covering sheet.
  • Solder joints were produced using the prepared bonding materials as follows, and the void ratios at the bonded portions were measured.
  • Criteria for void rate suppression ability A: The void rate was less than 20%. B: The void ratio was 20% or more and less than 25%. C: The void rate was 25% or more.
  • Shear strength measurement The shear strength (N) of the soldered joints was measured at 6.0 mm/min and 250° C. using a shear strength measuring device (STR-1000, manufactured by Rhesca Co., Ltd.). The higher the shear strength, the better the heat resistance of the soldered joint.

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PCT/JP2025/001885 2024-01-23 2025-01-22 接合材及びその製造方法、並びに、はんだ継手及びその製造方法 Pending WO2025159119A1 (ja)

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Publication number Priority date Publication date Assignee Title
WO2003021664A1 (en) * 2001-08-31 2003-03-13 Hitachi, Ltd. Semiconductor device, structural body and electronic device
JP2014180690A (ja) * 2013-03-19 2014-09-29 Nippon Steel Sumikin Materials Co Ltd シート状高温はんだ接合材およびこれを用いたダイボンディング方法
JP2022155884A (ja) * 2021-03-31 2022-10-14 千住金属工業株式会社 プリフォームはんだ及びその製造方法、並びにはんだ継手の製造方法

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JP6239173B1 (ja) * 2017-04-13 2017-11-29 ニホンハンダ株式会社 金属製部材接合用シート、金属製部材の接合方法および金属製部材接合体
TWI896565B (zh) * 2019-10-23 2025-09-11 美商阿爾發金屬化工公司 用於電子總成之工程材料

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Publication number Priority date Publication date Assignee Title
WO2003021664A1 (en) * 2001-08-31 2003-03-13 Hitachi, Ltd. Semiconductor device, structural body and electronic device
JP2014180690A (ja) * 2013-03-19 2014-09-29 Nippon Steel Sumikin Materials Co Ltd シート状高温はんだ接合材およびこれを用いたダイボンディング方法
JP2022155884A (ja) * 2021-03-31 2022-10-14 千住金属工業株式会社 プリフォームはんだ及びその製造方法、並びにはんだ継手の製造方法

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