WO2025113333A1 - 电极引入装置及半导体工艺设备 - Google Patents

电极引入装置及半导体工艺设备 Download PDF

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Publication number
WO2025113333A1
WO2025113333A1 PCT/CN2024/133739 CN2024133739W WO2025113333A1 WO 2025113333 A1 WO2025113333 A1 WO 2025113333A1 CN 2024133739 W CN2024133739 W CN 2024133739W WO 2025113333 A1 WO2025113333 A1 WO 2025113333A1
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WO
WIPO (PCT)
Prior art keywords
boat
electrode
conductive
group
feet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/133739
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English (en)
French (fr)
Other versions
WO2025113333A9 (zh
Inventor
周振溪
闫志顺
刘志伟
赵福平
韩天棋
李补忠
郑建宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
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Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Publication of WO2025113333A1 publication Critical patent/WO2025113333A1/zh
Publication of WO2025113333A9 publication Critical patent/WO2025113333A9/zh
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Definitions

  • the present application relates to the technical field of coating equipment, and in particular to an electrode introduction device and semiconductor process equipment.
  • PECVD Pulsma-Enhanced Chemical Vapor Deposition
  • an RF power source is introduced into the reaction chamber by an electrode introduction device, and the electrode in the reaction chamber is in conductive contact with the carrier boat to complete the coating.
  • an RF power source is introduced into the reaction chamber by an electrode introduction device, and the electrode in the reaction chamber is in conductive contact with the carrier boat to complete the coating.
  • the present application discloses an electrode introduction device and a semiconductor process equipment to solve the problem in the related art that a large gap exists between the electrode and the carrier boat, resulting in poor contact or even short circuit between the electrode and the carrier boat.
  • an embodiment of the present application discloses an electrode introduction device, which is applied to a semiconductor process equipment, wherein the semiconductor process equipment includes a carrier boat, and the disclosed electrode introduction device includes an electrode body and an electrical connection assembly;
  • the electrode body comprises a first conductive portion, a second conductive portion and an elastic electrical connection portion, wherein the first conductive portion and the second conductive portion are respectively used for conductive contact with a group of boat feet of the carrying boat;
  • the first conductive part and the second conductive part are electrically connected via the elastic electrical connection part, and the elastic electrical connection part is used to pull the first conductive part and the second conductive part so that the surfaces of the first conductive part and the second conductive part are in contact with the surfaces of a group of boat feet of the carrying boat;
  • the electrical connection assembly is electrically connected to the first conductive part or the second conductive part, and is used to electrically connect the electrode body to a power source.
  • an embodiment of the present application discloses a semiconductor process equipment, which includes a reaction chamber, a carrier boat, a bracket and the electrode introduction device mentioned above, wherein the bracket is arranged in the reaction chamber, the carrier boat is placed on the bracket when the process is carried out, the electrode body is arranged on the bracket, and a group of boat feet of the carrier boat are in conductive contact with the electrode body.
  • the electrode introduction device disclosed in the embodiment of the present application improves the relevant technology.
  • the electrode body is connected to the power supply through an electrical connection component.
  • the electrode body includes a first conductive part, a second conductive part and an elastic electrical connection part.
  • the first conductive part and the second conductive part are electrically connected through the elastic electrical connection part.
  • the surfaces of the first conductive part and the second conductive part can be fitted with the surfaces of a group of boat feet of the supporting boat.
  • the surfaces of the first conductive part and the second conductive part are not easy to adhere to the film layer, thereby avoiding the problem of poor contact or even short circuit between the electrode body and the group of boat feet of the supporting boat, thereby improving the efficiency and yield of the coating process.
  • FIG1 is a schematic structural diagram of an electrode introduction device disclosed in an embodiment of the present application.
  • FIG2 is a schematic diagram of an assembly structure of a conductive support member and an electrode body disclosed in an embodiment of the present application
  • FIG3 is a second schematic diagram of an assembly structure of a conductive support member and an electrode body disclosed in an embodiment of the present application;
  • FIG4 is a schematic structural diagram of a semiconductor process equipment disclosed in an embodiment of the present application.
  • FIG. 5 is a schematic diagram of an assembly structure of a carrying boat and a bracket disclosed in an embodiment of the present application.
  • first, second, etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first”, “second”, etc. are generally of the same type, and the number of objects is not limited.
  • the first object can be one or more.
  • the embodiment of the present application discloses an electrode introduction device 200, which is applied to semiconductor process equipment.
  • the semiconductor process equipment includes a carrier boat 100.
  • the carrier boat 100 is used as a carrier for chemical vapor deposition and is mainly used to carry parts to be plated.
  • the carrier boat 100 can be made of high-temperature resistant conductive materials such as graphite.
  • the parts to be plated can be chips, solar cells, etc.
  • PECVD Pullasma-enhanced Chemical Vapor Deposition
  • a layer of dark blue silicon nitride film i.e., an anti-reflection film, is deposited on the surface of the solar cell by using the carrier boat 100, a radio frequency power supply and an appropriate amount of reaction gas, which can significantly improve the photoelectric conversion efficiency of the solar cell.
  • the carrying boat 100 is provided with boat feet, and the boat feet are in conductive contact with the electrode introduction device 200 to achieve circuit conduction.
  • the specific number of boat feet can be selected according to the specific structure of the electrode introduction device 200.
  • the number of boat feet is at least two groups, one of which is used to connect the positive electrode of the power supply, and the other is used to connect the negative electrode of the power supply.
  • Each group of boat feet includes at least one boat foot.
  • the number of boat feet included in each group of boat feet can be appropriately increased, such as each group of boat feet includes 2 boat feet.
  • the carrying boat 100 can also be connected to the positive electrode of the power supply only through the electrode introduction device 200, and connected to the negative electrode of the power supply through the plug-in fit of the electrode rod 320 and the electrode hole, or the carrying boat 100 is connected to the negative electrode of the power supply only through the electrode introduction device 200, and connected to the positive electrode of the power supply through the plug-in fit of the electrode rod 320 and the electrode hole.
  • the embodiment of the present application is not limited to this.
  • the electrode introduction device 200 includes an electrode body 220 and an electrical connection assembly 230.
  • the electrode body 220 may specifically include a first conductive portion 221, a second conductive portion 222 and an elastic electrical connection portion 223.
  • the first conductive portion 221 and the second conductive portion 222 are respectively used to make conductive contact with a group of boat feet of the carrying boat 100.
  • the first conductive portion 221 and the second conductive portion 222 form two conductive contact surfaces with two boat feet in a group of boat feet of the carrying boat 100.
  • the conductive contact area between the electrode body 220 and the carrying boat 100 is larger, the contact resistance is smaller, and the problem of heat generation can be reduced.
  • the first conductive portion 221 and the second conductive portion 222 can be made of metal material and have a certain elasticity.
  • the first conductive part 221 and the second conductive part 222 are electrically connected via an elastic electrical connection part 223.
  • the elastic electrical connection part 223 may be a structure with a certain elasticity such as a spring or a spring sheet, and the elastic electrical connection part 223 is made of a conductive material.
  • the first conductive part 221 and the second conductive part 222 are connected to the elastic electrical connection part 223 by welding, bolting, etc.
  • the electrical connection component 230 is used to electrically connect the electrode body 220 to a power source, which may be a radio frequency power source.
  • the electrical connection component 230 may be a conductive cable, a steel rod, etc.
  • the electrical connection component 230 is electrically connected to the first conductive part 221 or the second conductive part 222, and the first conductive part 221 and the second conductive part 222 are electrically connected via an elastic electrical connection part 223.
  • the connection method between the electrical connection component 230 and the first conductive part 221 or the second conductive part 222 may be welding, bolt connection, etc.
  • the electrode body 220 is connected to the power supply through the electrical connection component 230, and can be in conductive contact with a group of boat feet of the carrying boat 100, which is convenient for the disassembly and maintenance of the electrode body 220; the electrode body 220 includes a first conductive part 221, a second conductive part 222 and an elastic electrical connection part 223, and the first conductive part 221 and the second conductive part 222 are electrically connected through the elastic electrical connection part 223.
  • the surfaces of the first conductive part 221 and the second conductive part 222 can be fitted with the surfaces of a group of boat feet of the carrying boat 100, and the surfaces of the first conductive part 221 and the second conductive part 222 are not easy to adhere to the film layer, thereby avoiding the problem of poor contact or even short circuit between the electrode body 220 and a group of boat feet of the carrying boat 100, thereby improving the efficiency and yield of the coating process.
  • the semiconductor process equipment may further include a support 210, the support 210 is used to support the carrier boat 100, the boat foot of the carrier boat 100 is overlapped on the support 210, and the electrode body 220 is also overlapped on the support 210, that is, the first conductive part 221 and the second conductive part 222 are overlapped on the support 210 respectively.
  • the electrode body 220 is located between a group of boat feet of the carrier boat 100 and the support 210, the electrode body 220 and the support 210 are in insulating contact, and the electrode body 220 and a group of boat feet of the carrier boat 100 are in conductive contact.
  • each group of boat feet of the carrier boat 100 includes two boat feet arranged oppositely along the width direction of the carrier boat 100, and each boat foot is supported by one of the two supporting rods 211; the first conductive part 221 and the second conductive part 222 are overlapped on the two supporting rods 211 respectively.
  • the first conductive part 221 and the second conductive part 222 are respectively located between two boat feet in a group of boat feet of the carrying boat 100 and the two support rods 211, and the first conductive part 221 and the second conductive part 222 are respectively insulated from and in contact with the two support rods 211, and the first conductive part 221 and the second conductive part 222 are respectively in conductive contact with two boat feet in a group of boat feet of the carrying boat 100. Moreover, two boat feet in a group of boat feet are electrically connected through the first conductive part 221, the second conductive part 222 and the elastic electrical connection part 223.
  • the bracket 210 By setting up the bracket 210, on the one hand, the electrode body 220 and the supporting boat 100 can be stably supported; on the other hand, since the electrode body 220 is overlapped on the bracket 210, it is convenient to adjust the position of the electrode body 220 to improve flexibility. At the same time, it is also convenient to disassemble and maintain the electrode body 220 and the bracket 210 respectively.
  • the structures of the first conductive portion 221 and the second conductive portion 222 may be the same or different.
  • the structures are described by taking the first conductive portion 221 or the second conductive portion 222 as an example.
  • the first conductive portion 221 or the second conductive portion 222 may include a plurality of bending portions 2211, and the plurality of bending portions 2211 are connected in sequence.
  • the plurality of bending portions 2211 may be formed by pre-bending on the first conductive portion 221 or the second conductive portion 222, or the plurality of bending portions 2211 may be made separately and then connected together by welding.
  • the elastic electrical connection part 223 is connected to the bent part 2211 located at the end position among the multiple bent parts 2211 to pull the multiple bent parts 2211 to bend along the docking position, which is the docking position between each two adjacent bent parts 2211.
  • the elastic electrical connection part 223 and the bent part 2211 located at the end position among the multiple bent parts 2211 can be connected specifically by welding, bolt connection, etc. Since the first conductive part 221 or the second conductive part 222 adopts a multi-stage bending design, it is easier to bend and adjust under the pulling action of the elastic electrical connection part 223, so that it is more suitable for fitting with the surface of the boat foot of the carrying boat 100.
  • the semiconductor process equipment includes two electrode introduction devices 200, and the electrode bodies 220 included in the two electrode introduction devices 200 are arranged at intervals along the length direction of the bracket 210 (for example, the length direction of the support rod 211), and the supporting boat 100 is provided with two groups of boat feet arranged at intervals along its own length direction (parallel to the length direction of the bracket 210).
  • the two groups of boat feet can be respectively arranged at two ends of the supporting boat 100 along its own length direction, and the electrode body 220 included in each electrode introduction device 200 is in conductive contact with a group of boat feet of the supporting boat 100.
  • one of the two groups of boat feet of the same supporting boat 100 is the anode boat foot, and the other group is the cathode boat foot.
  • each group of boat feet (being the anode boat foot or the cathode boat foot) may have two or more electrical contact points with the same electrode body 220.
  • each group of boat feet (being the anode boat foot or the cathode boat foot) has two electrical contact points with the same electrode body 220, and the two electrical contact points are respectively in conductive contact with the first conductive portion 221 and the second conductive portion 222 in the same electrode body 220, that is, the first conductive portion 221 and the second conductive portion 222 of the electrode body 220 included in each electrode introduction device 200 are respectively in conductive contact with two boat feet in the corresponding group of boat feet, and these two boat feet are both anode boat feet or cathode boat feet.
  • the electrode body 220 included in one of the two electrode introduction devices 200 is electrically connected to the positive electrode of the power source through the electrical connection component 230 therein to form an anode loop; the electrode body 220 included in the other of the two electrode introduction devices 200 is electrically connected to the negative electrode of the power source through the electrical connection component 230 therein to form a cathode loop.
  • the carrier boat 100 is connected to the positive and negative electrodes of the power source through the two electrode introduction devices 200 to realize the conduction of the power supply loop.
  • each electrode introduction device 200 includes an electrical connection assembly 230 including a conductive support 231, which is attached to a side support 210 (e.g., one of the two support rods 211).
  • a conductive support 231 electrically connects the electrode body 220 to the positive electrode of the power source, an anode loop is formed between the power source and the carrier boat 100; when the conductive support 231 electrically connects the electrode body 220 to the negative electrode of the power source, a cathode loop is formed between the power source and the carrier boat 100.
  • the electrode bodies 220 included in the two electrode introduction devices 200 correspond to the positions of the two groups of boat feet of the carrier boat 100, and the two groups of boat feet are respectively arranged at the two ends of the carrier boat 100 along its own length direction, in order to achieve connection with the electrode bodies 220 included in the two electrode introduction devices 200, the lengths of the conductive support members 231 included in the two electrode introduction devices 200 are different along the length direction of the support 210, and the difference in the length of the conductive support members 231 included in the two electrode introduction devices 200 is consistent with the spacing distance between the two groups of boat feet of the carrier boat 100 along the length direction of the carrier boat 100.
  • the conductive support member 231 can realize the electrical connection between the electrode body 220 and the power supply on the one hand, and can also play a certain role in fixing the electrode body 220 overlapped on the support 210 to prevent the electrode body 220 from sliding off the support 210.
  • the conductive support 231 may be a telescopic rod or a structure with a certain elastic telescopic function, which may be extended or shortened along the length direction of the support 210, thereby driving the electrode body 220 to move along the length direction of the support 210, so as to achieve a good fit with the position of the boat foot of the carrying boat 100, and improve the accuracy of the conductive contact between the electrode body 220 and the boat foot of the carrying boat 100.
  • the conductive support member 231 may include a connection portion 2311, an adjustment portion 2312, and a main body 2313.
  • the connection portion 2311 is used to connect the positive or negative electrode of the power source.
  • the connection portion 2311 and the positive or negative electrode of the power source may be connected by bolt connection, plug connection, or clamp connection.
  • the main body 2313 is electrically connected to the connection portion 2311 and the electrode body 220, respectively, and is used to introduce current into the electrode body 220.
  • the connection portion 2311 and the main body 2313 are connected by the adjustment portion 2312.
  • the adjustment portion 2312 can be extended or shortened along the length direction of the bracket 210, thereby realizing that the conductive support member 231 is extended or shortened along the length direction of the bracket 210. It should be noted that the connection portion 2311, the adjustment portion 2312, and the main body 2313 all adopt a conductive structure, and the adjustment portion 2312 may include a bolt and a nut.
  • a nut may be provided on one of the connecting portion 2311 and the main body 2313, and a bolt may be provided on the other of the connecting portion 2311 and the main body 2313, and the screwing length of the bolt and the nut may be adjusted, thereby realizing the telescopic function of the adjustment portion 2312;
  • a slide rail may be provided on one of the connecting portion 2311 and the main body 2313, and a slider may be provided on the other of the connecting portion 2311 and the main body 2313, and the telescopic function may be realized by utilizing the sliding cooperation of the slide rail and the slider, etc., and the embodiments of the present application are not limited to this.
  • the main body 2313 includes an elastic main body 2314 and a rigid main body 2315.
  • the elastic main body 2314 can be a structure that can provide a certain amount of elastic deformation, such as a cable or an elastic conductive sheet
  • the rigid main body 2315 can be a structure that is strong and not easily deformed, such as a steel rod.
  • One end of the elastic main body 2314 is connected to the connecting part 2311 through an adjusting part 2312, and the other end of the elastic main body 2314 is connected to the rigid main body 2315 through another adjusting part 2312.
  • the end of the rigid main body 2315 that is away from the elastic main body 2314 is connected to the first conductive part 221 or the second conductive part 222.
  • the rigid main body 2315 is mainly used to ensure the overall strength of the conductive support 231 and provide sufficient support for the electrode body 220.
  • the elastic main body 2314 is mainly used to provide a certain amount of deformation buffer to avoid the problem of local fracture and damage of the conductive support 231 due to thermal expansion, thereby improving durability.
  • insulating layers 232 can be wrapped on the outside of the connecting portion 2311, the adjusting portion 2312 and the main body 2313 respectively.
  • the insulating layer 232 can be made of high-temperature resistant materials such as ceramics and glass.
  • the insulating layer 232 when the length of the insulating layer 232 is relatively large, taking into account the difficulty of production and assembly issues, the insulating layer 232 can be designed in segments, that is, the insulating layer 232 includes multiple sub-insulating layers 2321, and the connection between adjacent sub-insulating layers 2321 is provided with a protective layer 2322, and the protective layer 2322 is wrapped in the exposed area between adjacent sub-insulating layers 2321.
  • the materials of the protective layer 2322 and the sub-insulating layer 2321 can be the same or different.
  • the embodiments of the present application also disclose a semiconductor process equipment.
  • the disclosed semiconductor process equipment may include a reaction chamber 300, a carrier boat 100, a bracket 210, and the electrode introduction device 200 described in the above embodiment.
  • the reaction chamber 300 is used to provide a closed vacuum chamber for the chemical vapor deposition process.
  • the bracket 210 is arranged in the reaction chamber 300, and can be overlapped on the inner wall or other structural parts of the reaction chamber 300.
  • the carrier boat 100 can be placed on the bracket 210 or detached from the bracket 210 through a transfer mechanism.
  • the conductive support member 231 is attached to the bracket 210, and the electrode body 220 is arranged on the bracket 210, and can be overlapped on the bracket 210.
  • the boat foot of the carrier boat 100 is in conductive contact with the electrode body 220.
  • the electrode body 220 in the semiconductor process equipment is overlapped on the bracket 210 and connected to the power supply through the electrical connection component 230, so that it can be in conductive contact with a group of boat feet of the carrier boat 100, which is convenient for the disassembly and maintenance of the electrode body 220;
  • the electrode body 220 includes a first conductive part 221, a second conductive part 222 and an elastic electrical connection part 223, and the first conductive part 221 and the second conductive part 222 are electrically connected through the elastic electrical connection part 223.
  • the reaction chamber 300 has an opening 310, and the carrying boat 100, the electrode body 220 and other devices can enter and exit the reaction chamber 300 through the opening 310.
  • the number of the carrying boat 100 is two, including a first boat 110 and a second boat 120, the first boat 110 and the second boat 120 are respectively placed on the support 210, and a preset distance is spaced between the first boat 110 and the second boat 120.
  • the first boat 110 is close to the opening 310 of the reaction chamber 300
  • the second boat 120 is far away from the opening 310 of the reaction chamber 300.
  • the end of the first boat 110 close to the opening 310 of the reaction chamber 300 is provided with a first group of boat feet 111, the end of the first boat 110 far away from the opening 310 of the reaction chamber 300 is provided with a second group of boat feet 112, the end of the second boat 120 close to the opening 310 of the reaction chamber 300 is provided with a third group of boat feet 121, and the end of the second boat 120 far away from the opening 310 of the reaction chamber 300 is provided with a fourth group of boat feet 122.
  • the semiconductor process equipment includes two groups of electrode introduction devices 200 corresponding to the first boat 110 and the second boat 120 respectively, each group of electrode introduction devices 200 includes two electrode introduction devices 200, and a total of four electrode introduction devices 200.
  • the electrode bodies 220 included in the four electrode introduction devices 200 are arranged at intervals along the length direction of the bracket 210, and the electrode bodies 220 included in the four electrode introduction devices 200 are respectively in conductive contact with the first group of boat feet 111, the second group of boat feet 112, the third group of boat feet 121 and the fourth group of boat feet 122.
  • one of the two electrode introduction devices 200 that are in conductive contact with the first group of boat feet 111 and the second group of boat feet 112 includes an electrode body 220 that is electrically connected to the positive pole of the power supply through the conductive support 231 therein, and the other includes an electrode body 220 that is electrically connected to the negative pole of the power supply through the conductive support 231 therein;
  • one of the two electrode introduction devices 200 that are in conductive contact with the third group of boat feet 121 and the fourth group of boat feet 122 includes an electrode body 220 that is electrically connected to the positive pole of the power supply through the conductive support 231 therein, and the other includes an electrode body 220 that is electrically connected to the negative pole of the power supply through the conductive support 231 therein.
  • the first boat 110 and the second boat 120 can be powered by the same power supply or by two power supplies. It should be noted that the lengths of the conductive support members 231 included in the four electrode introduction devices 200 are all different, and the specific lengths can be selected according to the positions of the first group of boat feet 111, the second group of boat feet 112, the third group of boat feet 121, and the fourth group of boat feet 122.
  • the double-boat solution can carry more parts to be plated, which can improve the efficiency of the coating process.
  • the first boat 110 and the second boat 120 both use the electrode introduction device 200 including the electrode body 220 and the electrical connection component 230 to achieve circuit conduction. Since the electrode body 220 is overlapped on the bracket 210, it is easy to disassemble and maintain, which greatly improves the efficiency.
  • the carrier boat 100 includes a first boat 110 close to the opening 310 of the reaction chamber 300 and a second boat 120 away from the opening 310 of the reaction chamber 300; a first group of boat feet 111 is provided at one end of the first boat 110 close to the opening 310 of the reaction chamber 300, and a second group of boat feet 112 is provided at one end of the first boat 110 away from the opening 310 of the reaction chamber 300.
  • the semiconductor process equipment includes two electrode introduction devices 200, and the two electrode introduction devices 200 include electrode bodies 22 0 are arranged at intervals along the length direction of the bracket 210 itself, and the electrode bodies 220 included in the two electrode introduction devices 200 are respectively in conductive contact with the first group of boat feet 111 and the second group of boat feet 112.
  • the electrode body 220 included in one of the two electrode introduction devices 200 is electrically connected to the positive electrode of the power supply through the electrical connection component 230 therein to form an anode loop
  • the electrode body 220 included in the other of the two electrode introduction devices 200 is electrically connected to the negative electrode of the power supply through the electrical connection component 230 therein to form a cathode loop.
  • the second boat 120 and the first boat 110 are connected to the power supply in a different manner.
  • the second boat 120 is provided with an electrode hole on a side away from the opening 310 of the reaction chamber 300.
  • the electrode hole is used to be plugged and electrically connected with the electrode rod 320 inserted into the reaction chamber 300.
  • there are two electrode holes and two electrode rods 320 which are plugged in one by one.
  • One of the two electrode rods 320 is electrically connected to the positive electrode of the power supply, and the other of the two electrode rods 320 is electrically connected to the negative electrode of the power supply.
  • the positive and negative electrode rods 320 are respectively plugged into the two electrode holes of the second boat 120 to achieve circuit conduction.
  • the first boat 110 and the second boat 120 can be powered by the same power supply, or they can be powered by two power supplies. Compared with the method of introducing current from the opening 310 of the reaction chamber 300 by using the electrode body 220 and the conductive support member 231, the second boat 120 uses the method of plugging the electrode rod 320 and the electrode hole. The generated electric field is more stable, and the problem of uncontrollable displacement caused by the excessive extension span of the conductive support member 231 can be avoided.
  • a third group of boat feet 121 is provided at one end of the second boat 120 close to the opening 310 of the reaction chamber 300, and a fourth group of boat feet 122 is provided at one end of the second boat 120 away from the opening 310 of the reaction chamber 300.
  • the bracket 210 may include two parallel support rods 211, and each support rod 211 is provided with four groups of insulating sleeves 212 at intervals along its own length direction. Two insulating sleeves in each group of insulating sleeves 212 are relatively sleeved on the outer surfaces of the two support rods 211.
  • the four groups of insulating sleeves 212 are respectively used to support one boat foot in the first group of boat feet 111, one boat foot in the second group of boat feet 112, one boat foot in the third group of boat feet 121 and one boat foot in the fourth group of boat feet 122.
  • the insulating sleeves 212 can be made of ceramic or glass. It is easy to understand that the first group of boat feet 111, the second group of boat feet 112, the third group of boat feet 121 and the fourth group of boat feet 122 each include two boat feet arranged oppositely along the width direction of the first boat 110 or the second boat 120, and each boat foot is supported by an insulating sleeve 212 on one of the two support rods 211.
  • the electrode body 220 included in the electrode introduction device 200 is mounted on the insulating sleeve 212.
  • the wall thickness of the insulating sleeve 212 can be designed differently.
  • the wall thickness of the insulating sleeve 212 provided at the first group of boat feet 111 and the second group of boat feet 112 can be made smaller than the wall thickness of the insulating sleeve 212 provided at the third group of boat feet 121 and the fourth group of boat feet 122, and the difference in wall thickness is consistent with the thickness value of the first conductive part 221 or the second conductive part 222 in the electrode body 220.
  • the first boat 110 and the second boat 120 can be at the same height, thereby ensuring the consistency of the first boat 110 and the second boat 120 during a process such as a chemical vapor deposition process.

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Abstract

一种电极引入装置（200）及半导体工艺设备，半导体工艺设备包括承载舟（100），所公开的电极引入装置（200）包括电极本体（220）和电连接组件（230），电极本体（220）包括第一导电部（221）、第二导电部（222）和弹性电连接部（223），电连接组件（230）与第一导电部（221）或第二导电部电（222）连接，用于将电极本体（220）电连接于电源，第一导电部（221）和第二导电部（222）分别用于与承载舟（100）的一组舟脚导电接触，第一导电部（221）和第二导电部（222）通过弹性电连接部（223）电连接，弹性电连接部（223）用于牵拉第一导电部（221）和第二导电部（222），以使第一导电部（221）和第二导电部（222）的表面与承载舟（100）的一组舟脚的表面贴合，第一导电部（221）和第二导电部（222）的表面不易附着膜层，从而避免了电极本体（220）与承载舟（100）的舟脚之间出现接触不良、甚至短路的问题，进而提升了镀膜工艺的效率和良品率。

Description

电极引入装置及半导体工艺设备 技术领域
本申请涉及镀膜设备技术领域，尤其涉及一种电极引入装置及半导体工艺设备。
背景技术
PECVD(Plasma-Enhanced Chemical Vapor Deposition，等离子体增强化学气相沉积)是半导体制造工艺中常用的薄膜材料制备方法，用于沉积二氧化硅、氮化硅等半导体材料。在相关技术中，依靠电极引入装置将射频电源引入反应室内，位于反应室内的电极与承载舟导电接触，以完成镀膜。而电极与承载舟存在接合不佳的问题，造成电极与承载舟之间存在较大的间隙，在经过长时间的高温环境以及镀膜环境后，暴露在间隙处的电极的表面会附着膜层，导致电极与承载舟之间出现接触不良、甚至短路的问题，从而影响了镀膜工艺的效率和良品率。
发明内容
本申请公开一种电极引入装置及半导体工艺设备，以解决相关技术中电极与承载舟之间存在较大的间隙，导致电极与承载舟之间出现接触不良、甚至短路的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例公开了一种电极引入装置，应用于半导体工艺设备，所述半导体工艺设备包括承载舟，所公开的电极引入装置包括电极本体和电连接组件；
所述电极本体包括第一导电部、第二导电部和弹性电连接部，所述第一导电部和所述第二导电部分别用于与所述承载舟的一组舟脚导电接触；
所述第一导电部和所述第二导电部通过所述弹性电连接部电连接，所述弹性电连接部用于牵拉所述第一导电部和所述第二导电部，以使所述第一导电部和所述第二导电部的表面与所述承载舟的一组舟脚的表面贴合；
所述电连接组件与所述第一导电部或所述第二导电部电连接，用于将所述电极本体电连接于电源。
第二方面，本申请实施例公开了一种半导体工艺设备，所公开的半导体工艺设备包括反应室、承载舟、支架和上文所述的电极引入装置，所述支架设于所述反应室内，在进行工艺时所述承载舟放置于所述支架上，所述电极本体设置于所述支架上，且所述承载舟的一组舟脚与所述电极本体导电接触。
本申请采用的技术方案能够达到以下技术效果：
本申请实施例公开的电极引入装置对相关技术进行改进，电极本体通过电连接组件与电源接通，电极本体包括第一导电部、第二导电部和弹性电连接部，第一导电部和第二导电部通过弹性电连接部电连接，在弹性电连接部的牵拉作用下，能够使第一导电部和第二导电部的表面与承载舟的一组舟脚的表面贴合，第一导电部和第二导电部的表面不易附着膜层，从而避免了电极本体与承载舟的一组舟脚之间出现接触不良、甚至短路的问题，进而提升了镀膜工艺的效率和良品率。
附图说明
图1为本申请实施例公开的一种电极引入装置的结构示意图；
图2为本申请实施例公开的一种导电支撑件与电极本体的装配结构示意图之一；
图3为本申请实施例公开的一种导电支撑件与电极本体的装配结构示意图之二；
图4为本申请实施例公开的一种半导体工艺设备的结构示意图；
图5为本申请实施例公开的一种承载舟与支架的装配结构示意图。
附图标记说明：
100-承载舟、110-第一舟、111-第一舟脚、112-第二舟脚、120-第二舟、
121-第三舟脚、122-第四舟脚；
200-电极引入装置，210-支架、211-支撑杆、212-绝缘套筒、220-电极本
体、221-第一导电部、2211-弯折部、222-第二导电部、223-弹性电连接部、230-电连接组件、231-导电支撑件、2311-连接部、2312-调节部、2313-主体部、2314-弹性主体、2315-刚性主体、232-绝缘层、2321-子绝缘层、2322-防护层；
300-反应室、310-开口、320-电极杆。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。
以下结合附图，详细说明本申请各个实施例公开的技术方案。
请参考图1至图5，本申请实施例公开了一种电极引入装置200，应用于半导体工艺设备，半导体工艺设备包括承载舟100，承载舟100作为化学气相沉积的载体，主要用于承载待镀件，承载舟100可以采用石墨等耐高温的导电材质制成，待镀件可以为芯片、太阳能电池片等，示例性的，PECVD(Plasma-enhanced Chemical VaporDeposition，等离子体增强化学气相沉积)技术被用于太阳能电池片的加工工序中，通过承载舟100、射频电源以及适量的反应气体在太阳能电池片表面沉积一层深蓝色氮化硅膜，即减反射膜，能够显著提升太阳能电池片的光电转化效率。
承载舟100设有舟脚，通过舟脚与电极引入装置200导电接触，实现电路导通，舟脚的具体数量可以根据电极引入装置200的具体结构进行选择，一般情况下，舟脚的数量为至少两组，其中一组用于连接电源的正极，另一组用于连接电源的负极。每组舟脚中至少包括1个舟脚，为增大承载舟100与电极引入装置200的导电面积，可适当增加每组舟脚包括的舟脚数量，如每组舟脚中包括2个舟脚。另外，承载舟100也可仅通过电极引入装置200连接于电源的正极，通过电极杆320和电极孔的插接配合连接于电源的负极，或者，承载舟100仅通过电极引入装置200连接于电源的负极，通过电极杆320和电极孔的插接配合连接于电源的正极，只要能够实现电源回路的导通即可，本申请实施例对此不作限定。
如图1至图5所示，电极引入装置200包括电极本体220和电连接组件230，电极本体220具体可以包括第一导电部221、第二导电部222和弹性电连接部223，第一导电部221和第二导电部222分别用于与承载舟100的一组舟脚导电接触。具体地，第一导电部221和第二导电部222与承载舟100的一组舟脚中的两个舟脚共形成两个导电接触面，相较于采用单一导电接触面的方案，在本申请实施例中，电极本体220与承载舟100之间导电接触的面积更大，接触电阻更小，能够减少发热的问题出现。第一导电部221和第二导电部222可以采用金属材质制成，具有一定的弹性。
第一导电部221和第二导电部222通过弹性电连接部223电连接，弹性电连接部223可以为弹簧、弹片等具有一定弹性的结构，且弹性电连接部223采用导电材质制成，第一导电部221和第二导电部222与弹性电连接部223的连接方式可以为焊接、螺栓连接等。
电连接组件230用于将电极本体220电连接于电源，电源可以为射频电源，电连接组件230可以为导电线缆、钢杆等，一种具体的电连接方式中，电连接组件230与第一导电部221或者第二导电部222电连接，第一导电部221和第二导电部222之间再通过弹性电连接部223电连接，电连接组件230与第一导电部221或者第二导电部222的连接方式可以为焊接、螺栓连接等。
通过上文所述可知，本申请实施例公开的电极引入装置200对相关技术进行改进，电极本体220通过电连接组件230与电源接通，即可与承载舟100的一组舟脚导电接触，便于电极本体220的拆装维护；电极本体220包括第一导电部221、第二导电部222和弹性电连接部223，第一导电部221和第二导电部222通过弹性电连接部223电连接，在弹性电连接部223的牵拉作用下，能够使第一导电部221和第二导电部222的表面与承载舟100的一组舟脚的表面贴合，第一导电部221和第二导电部222的表面不易附着膜层，从而避免了电极本体220与承载舟100的一组舟脚之间出现接触不良、甚至短路的问题，进而提升了镀膜工艺的效率和良品率。
进一步地，半导体工艺设备还可以包括支架210，支架210用于支撑承载舟100，承载舟100的舟脚搭接在支架210上，电极本体220也搭接在支架210上，也即，第一导电部221和第二导电部222分别搭接在支架210上。电极本体220位于承载舟100的一组舟脚和支架210之间，电极本体220与支架210之间绝缘接触，电极本体220与承载舟100的一组舟脚之间导电接触。在支架210可以包括两根沿承载舟长度方向延伸且相互平行的支撑杆211的实施例(在后文中详细描述)中，承载舟100的每一组舟脚包括两个沿承载舟100的宽度方向相对布置的舟脚，每一个舟脚由两根支撑杆211中的一根进行支撑；第一导电部221和第二导电部222分别搭接在两根支撑杆211上。第一导电部221和第二导电部222分别位于承载舟100的一组舟脚中的两个舟脚和两根支撑杆211之间，第一导电部221和第二导电部222分别与两根支撑杆211之间绝缘接触，第一导电部221和第二导电部222分别与承载舟100的一组舟脚中的两个舟脚之间导电接触。而且，一组舟脚的两个舟脚通过第一导电部221、第二导电部222和弹性电连接部223电导通。
通过设置支架210，一方面，能够对电极本体220和承载舟100进行稳定支撑；另一方面，由于电极本体220搭接在支架210上，便于对电极本体220的位置进行调整以提升灵活性，同时，也便于对电极本体220和支架210分别进行拆卸维护。
在一些实施例中，如图2至图3所示，第一导电部221和第二导电部222的结构可以相同，也可以不同，在第一导电部221和第二导电部222结构相同的情况下，以第一导电部221或者第二导电部222为例对其结构进行说明。第一导电部221或者第二导电部222可以包括多个弯折部2211，多个弯折部2211依次连接，多个弯折部2211可以是在第一导电部221或者第二导电部222上通过预弯折处理形成的，也可以是多个弯折部2211分别制作，然后通过焊接的方式对接在一起。弹性电连接部223与多个弯折部2211中位于端部位置的弯折部2211连接，以牵拉多个弯折部2211沿对接位置折弯，该对接位置即为各相邻两个弯折部2211之间的对接位置，弹性电连接部223与多个弯折部2211中位于端部位置的弯折部2211具体可以通过焊接、螺栓连接等方式进行连接。由于第一导电部221或者第二导电部222采用多段弯折的设计，在弹性电连接部223的牵拉作用下，更容易进行折弯调整，从而更适于与承载舟100的舟脚的表面贴合。
在进一步的方案中，如图1至图5所示，半导体工艺设备包括两个电极引入装置200，两个电极引入装置200包括的电极本体220沿支架210的长度方向(例如，支撑杆211的长度方向)间隔设置，承载舟100沿自身长度方向(平行于支架210的长度方向)间隔设置有两组舟脚，两组舟脚可分别设置在承载舟100沿自身长度方向的两个端部，每一个电极引入装置200包括的电极本体220与该承载舟100的一组舟脚导电接触。根据功能划分，同一承载舟100的两组舟脚中的其中一组为阳极舟脚，另一组为阴极舟脚，为提升电连接的稳定性，每一组舟脚(为阳极舟脚或阴极舟脚)与同一电极本体220的电接触点可以为两个或两个以上，示例性的，每一组舟脚(为阳极舟脚或阴极舟脚)与同一电极本体220的电接触点分别为两个，两个电接触点分别与同一个电极本体220中的第一导电部221和第二导电部222导电接触，即，每一个电极引入装置200包括的电极本体220的第一导电部221和第二导电部222分别与对应的一组舟脚中的两个舟脚导电接触，这两个舟脚均为阳极舟脚或阴极舟脚。
在一些实施例中，两个电极引入装置200中的一者包括的电极本体220通过其中的电连接组件230电连接于电源的正极，形成阳极回路；两个电极引入装置200中的另一者包括的电极本体220通过其中的电连接组件230电连接于电源的负极，形成阴极回路。承载舟100通过两个电极引入装置200分别连接电源的正负极实现电源回路的导通。
在一些实施例中，如图1至图5所示，每一个电极引入装置200包括的电连接组件230包括导电支撑件231，导电支撑件231附设在一侧支架210(例如，两个支撑杆211中的一个)上。在导电支撑件231将电极本体220电连接于电源的正极时，电源与承载舟100之间形成阳极回路；在导电支撑件231将电极本体220电连接于电源的负极时，电源与承载舟100之间形成阴极回路。在半导体工艺设备中包括两个电极引入装置200的实施例中，由于两个电极引入装置200包括的电极本体220与承载舟100的两组舟脚位置相对应，而两组舟脚又分别设置在承载舟100沿自身长度方向的两个端部，为了与两个电极引入装置200包括的电极本体220实现连接，沿支架210的长度方向，两个电极引入装置200包括的导电支撑件231的长度不同，两个电极引入装置200包括的导电支撑件231长度的差值与承载舟100两组舟脚在沿承载舟100长度方向上的间隔距离保持一致。导电支撑件231一方面能够实现电极本体220和电源之间的电连接，另一方面，也能够对搭接在支架210上的电极本体220起到一定的固定的作用，以避免电极本体220从支架210上滑落。
在进一步的方案中，如图1至图3所示，导电支撑件231可采用伸缩杆或者具有一定弹性伸缩功能的结构，可沿支架210的长度方向伸长或者缩短，从而带动电极本体220沿支架210的长度方向移动，以与承载舟100的舟脚位置实现良好的适配，提升电极本体220与承载舟100的舟脚导电接触的准确性。在更换不同规格的承载舟100时，仅需对应调整导电支撑件231的长度，即可调整电极本体220在沿支架210的长度方向的位置，提升了电极引入装置200的适配范围。
在一些实施例中，如图1至图3所示，导电支撑件231可以包括连接部2311、调节部2312和主体部2313，连接部2311用于连接电源的正极或者负极，连接部2311与电源的正极或者负极的连接方式可以为螺栓连接、插接、卡接等。主体部2313分别与连接部2311和电极本体220电连接，用于将电流引入到电极本体220上，连接部2311和主体部2313之间通过调节部2312连接，调节部2312可沿支架210的长度方向伸长或者缩短，从而实现导电支撑件231在沿支架210的长度方向上伸长或者缩短。需要说明的是，连接部2311、调节部2312和主体部2313均采用导电结构，调节部2312可以包括螺栓和螺母。
示例性的，可以在连接部2311和主体部2313的一者上设置螺母，在连接部2311和主体部2313的另一者上设置螺栓，螺栓和螺母的旋合长度可以进行调节，从而实现调节部2312的伸缩功能；也可以在连接部2311和主体部2313的一者上设置滑轨，在连接部2311和主体部2313的另一者上设置滑块，利用滑轨和滑块的滑动配合实现伸缩功能等，本申请实施例对此不作限定。
在一些实施例中，如图2至图5所示，主体部2313包括弹性主体2314和刚性主体2315，弹性主体2314可以为线缆、弹性导电片之类的能够提供一定弹性形变量的结构，刚性主体2315可以为钢杆等强度较大且不易变形的结构。弹性主体2314的一端通过一调节部2312与连接部2311连接，弹性主体2314的另一端通过另一调节部2312与刚性主体2315连接，刚性主体2315背离弹性主体2314的一端与第一导电部221或第二导电部222连接。刚性主体2315主要用于保证导电支撑件231的整体强度，对电极本体220起到足够的支撑作用，弹性主体2314主要用于提供一定的形变缓冲量，避免导电支撑件231由于热膨胀导致的局部断裂、损坏的问题发生，提升了耐久性。
在进一步的方案中，如图1至图3所示，为避免导电支撑件231与承载舟100之间出现电弧引发安全事故，可以在连接部2311、调节部2312和主体部2313的外侧分别包裹绝缘层232，绝缘层232可以由陶瓷、玻璃等耐高温的材料制成。
在一些实施例中，如图1至图3所示，在绝缘层232的长度较大时，考虑到制作难度和装配的问题，可将绝缘层232采用分段设计，即，绝缘层232包括多个子绝缘层2321，相邻的子绝缘层2321的连接处套设有防护层2322，防护层2322包裹在相邻的子绝缘层2321之间的裸露区域，防护层2322和子绝缘层2321的材质可以相同也可以不同。
请参考图1至图5，本申请实施例还公开一种半导体工艺设备，所公开的半导体工艺设备可以包括反应室300、承载舟100、支架210和上文实施例所述的电极引入装置200，反应室300用于为化学气相沉积工艺提供密闭真空腔室。支架210设置在反应室300内，具体可搭接在反应室300的内壁或其他结构件上，承载舟100可通过转运机构放置在支架210上或者脱离支架210。导电支撑件231附设在支架210上，电极本体220设置在支架210上，具体可搭接在支架210上，承载舟100的舟脚与电极本体220导电接触。
通过上文所述可知，本申请实施例公开的半导体工艺设备对相关技术进行改进，半导体工艺设备中的电极本体220搭接在支架210上，并通过电连接组件230与电源接通，即可与承载舟100的一组舟脚导电接触，便于电极本体220的拆装维护；电极本体220包括第一导电部221、第二导电部222和弹性电连接部223，第一导电部221和第二导电部222通过弹性电连接部223电连接，在弹性电连接部223的牵拉作用下，能够使第一导电部221和第二导电部222的表面与承载舟100的舟脚的表面贴合，第一导电部221和第二导电部222的表面不易附着膜层，从而避免了电极本体220与承载舟100的一组舟脚之间出现接触不良、甚至短路的问题，进而提升了镀膜工艺的效率和良品率。
在一些实施例中，反应室300具有开口310，承载舟100、电极本体220等器件可通过开口310进出反应室300。为提升生产效率，承载舟100的数量为两个，包括第一舟110和第二舟120，第一舟110和第二舟120分别放置在支架210上，第一舟110和第二舟120之间间隔预设距离。其中，第一舟110靠近反应室300的开口310，第二舟120远离反应室300的开口310，第一舟110靠近反应室300的开口310的一端设有第一组舟脚111，第一舟110远离反应室300的开口310的一端设有第二组舟脚112，第二舟120靠近反应室300的开口310的一端设有第三组舟脚121，第二舟120远离反应室300的开口310的一端设有第四组舟脚122。
半导体工艺设备包括分别与第一舟110和第二舟120对应的两组电极引入装置200，每组电极引入装置200包括两个电极引入装置200，一共四个电极引入装置200，四个电极引入装置200包括的电极本体220沿支架210的长度方向间隔设置，四个电极引入装置200包括的电极本体220分别与第一组舟脚111、第二组舟脚112、第三组舟脚121和第四组舟脚122导电接触。对应地，与第一组舟脚111和第二组舟脚112导电接触的两个电极引入装置200中的一者包括的电极本体220通过其中的导电支撑件231电连接于电源的正极，另一者包括的电极本体220通过其中的导电支撑件231电连接于电源的负极；与第三组舟脚121和第四组舟脚122导电接触的两个电极引入装置200中的一者包括的电极本体220通过其中的导电支撑件231电连接于电源的正极，另一者包括的电极本体220通过其中的导电支撑件231电连接于电源的负极。
上述的第一舟110和第二舟120可通过同一电源供电，也可采用两个电源分别供电。需要说明的是，四个电极引入装置200包括的导电支撑件231的长度均不相同，具体长度可以根据第一组舟脚111、第二组舟脚112、第三组舟脚121、第四组舟脚122所在的位置进行选择。
采用双舟的方案，所承载的待镀件数量更多，能够提升镀膜工艺的效率，第一舟110和第二舟120均采用电极引入装置200包括的电极本体220和电连接组件230实现电路导通，由于电极本体220搭接在支架210上，便于拆装维护，极大的提升了效率。
在另一些实施例中，如图1至图5所示，承载舟100包括靠近反应室300的开口310的第一舟110和远离反应室300的开口310的第二舟120；第一舟110靠近反应室300的开口310的一端设有第一组舟脚111，第一舟110远离反应室300的开口310的一端设有第二组舟脚112，半导体工艺设备包括两个电极引入装置200，两个电极引入装置200包括的电极本体220沿支架210自身长度方向间隔设置，两个电极引入装置200包括的电极本体220分别与第一组舟脚111和第二组舟脚112导电接触，对应地，两个电极引入装置200中的一者包括的电极本体220通过其中的电连接组件230电连接于电源的正极，形成阳极回路，两个电极引入装置200中的另一者包括的电极本体220通过其中的电连接组件230电连接于电源的负极，形成阴极回路。
第二舟120与第一舟110采用不同的方式与电源导通，具体的，第二舟120在背离反应室300的开口310的一侧设有电极孔，该电极孔用于与插入反应室300的电极杆320插接电连接，需要说明的是，电极孔和电极杆320的数量均为两个，一一对应插接，两个电极杆320中的其中一个电连接于电源的正极，两个电极杆320中的另一个电连接于电源的负极，正、负电极杆320分别插接在第二舟120的两个电极孔内实现电路导通。第一舟110和第二舟120可通过同一电源供电，也可采用两个电源分别供电。第二舟120采用电极杆320和电极孔插接的方式，相较于采用电极本体220和导电支撑件231从反应室300开口310处将电流引入的方式，所产生的电场更加稳定，也能避免导电支撑件231延伸跨度过大造成的位移不可控的问题。
在进一步的方案中，如图1和图5所示，第二舟120靠近反应室300的开口310的一端设有第三组舟脚121，第二舟120远离反应室300的开口310的一端设有第四组舟脚122，支架210可以包括两根平行设置的支撑杆211，每根支撑杆211沿自身长度方向均间隔设置有四组绝缘套筒212，每一组绝缘套筒212中的两个绝缘套筒相对的套设于两根支撑杆211的外表面，四组绝缘套筒212分别用于支撑第一组舟脚111中的一个舟脚、第二组舟脚112中的一个舟脚、第三组舟脚121中的一个舟脚和第四组舟脚122中的一个舟脚，绝缘套筒212可以采用陶瓷或者玻璃材质制成。容易理解的是，第一组舟脚111、第二组舟脚112、第三组舟脚121和第四组舟脚122均包括两个沿第一舟110或第二舟120的宽度方向相对布置的舟脚，每一个舟脚由两根支撑杆211中的一根上的绝缘套筒212进行支撑。电极引入装置200中包括的电极本体220搭设在绝缘套筒212上。
针对第一舟110与第二舟120采用不同的方式与电源导通的方案，由于第一舟110的第一组舟脚111和第二组舟脚112与绝缘套筒212之间具有电极本体220进行支撑，第二舟120的第三组舟脚121和第四组舟脚122与绝缘套筒212不存在电极本体220的支撑，会导致第一舟110和第二舟120之间存在高度差，为弥补第一舟110和第二舟120之间的高度差，可对绝缘套筒212的壁厚进行差异化设计。
具体地，可以使设于第一组舟脚111和第二组舟脚112处的绝缘套筒212的壁厚小于设于第三组舟脚121和第四组舟脚122处的绝缘套筒212的壁厚，壁厚的差值和电极本体220中第一导电部221或者第二导电部222的厚度值保持一致，利用绝缘套筒212在不同位置的差异化壁厚设计，可使第一舟110和第二舟120处于同一高度，保证了第一舟110和第二舟120在工艺过程中例如化学气相沉积过程中的一致性。
本申请上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的技术特征只要不矛盾，均可以组合形成更具体的实施例，考虑到行文简洁，在此则不再赘述。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (14)

  1. 一种电极引入装置，应用于半导体工艺设备，所述半导体工艺设备包括承载舟，其特征在于，所述电极引入装置包括电极本体和电连接组件；
    所述电极本体包括第一导电部、第二导电部和弹性电连接部，所述第一导电部和所述第二导电部分别用于与所述承载舟的一组舟脚导电接触；
    所述第一导电部和所述第二导电部通过所述弹性电连接部电连接，所述弹性电连接部用于牵拉所述第一导电部和所述第二导电部，以使所述第一导电部和所述第二导电部的表面与所述承载舟的一组舟脚的表面贴合；
    所述电连接组件与所述第一导电部或所述第二导电部电连接，用于将所述电极本体电连接于电源。
  2. 根据权利要求1所述的电极引入装置，其特征在于，所述第一导电部和所述第二导电部中的至少一者包括多个弯折部，多个所述弯折部依次连接，所述弹性电连接部与多个所述弯折部中位于端部位置的所述弯折部连接，以牵拉多个所述弯折部沿对接位置折弯。
  3. 根据权利要求1所述的电极引入装置，其特征在于，所述电连接组件包括导电支撑件，所述导电支撑件用于将所述电极本体电连接于所述电源的正极或负极。
  4. 根据权利要求3所述的电极引入装置，其特征在于，所述导电支撑件可沿所述承载舟的长度方向伸长或者缩短，以带动所述电极本体沿所述承载舟的长度方向移动。
  5. 根据权利要求4所述的电极引入装置，其特征在于，所述导电支撑件包括连接部、调节部和主体部，所述连接部用于连接所述电源的正极或者负极，所述连接部和所述主体部之间通过所述调节部连接，所述调节部可沿所述承载舟的长度方向伸长或者缩短。
  6. 根据权利要求5所述的电极引入装置，其特征在于，所述主体部包括弹性主体和刚性主体，所述弹性主体的一端通过一所述调节部与所述连接部连接，所述弹性主体的另一端通过另一所述调节部与所述刚性主体连接，所述刚性主体背离所述弹性主体的一端与所述第一导电部或所述第二导电部连接。
  7. 根据权利要求5所述的电极引入装置，其特征在于，所述连接部、所述调节部和所述主体部的外侧均包裹有绝缘层。
  8. 根据权利要求7所述的电极引入装置，其特征在于，所述绝缘层包括多个间隔设置的子绝缘层，相邻的所述子绝缘层的连接处套设有防护层。
  9. 一种半导体工艺设备，其特征在于，包括反应室、承载舟、支架和权利要求1-8任一项所述的电极引入装置，所述支架设于所述反应室内，在进行工艺时所述承载舟放置于所述支架上，所述电极本体设置于所述支架上，且所述承载舟的一组舟脚与所述电极本体导电接触。
  10. 根据权利要求9所述的半导体工艺设备，其特征在于，
    所述电极引入装置包括的第一导电部和所述第二导电部分别搭接在所述支架上。
  11. 根据权利要求10所述的半导体工艺设备，其特征在于，所述半导体工艺设备包括两个所述电极引入装置，两个所述电极引入装置包括的所述电极本体沿所述支架的长度方向间隔设置；
    所述承载舟沿自身长度方向间隔设置有两组舟脚，每一个所述电极引入装置包括的所述电极本体与所述承载舟的一组舟脚导电接触；
    两个所述电极引入装置中的一者包括的所述电极本体通过其中的所述电连接组件电连接于所述电源的正极，两个所述电极引入装置中的另一者包括的所述电极本体通过其中的所述电连接组件电连接于所述电源的负极。
  12. 根据权利要求11所述的半导体工艺设备，其特征在于，每一个所述电极引入装置包括的所述电连接组件包括导电支撑件，两个所述电极引入装置包括的所述导电支撑件用于将两个所述电极引入装置包括的所述电极本体分别电连接于所述电源的正极和负极，其中，沿所述支架的长度方向，两个所述电极引入装置包括的所述导电支撑件的长度不同。
  13. 根据权利要求10或12所述的半导体工艺设备，其特征在于，还包括绝缘套筒；
    所述支架包括两根平行设置的支撑杆，一组所述绝缘套筒相对的套设在所述支撑杆的外表面，其中所述一组绝缘套筒包括两个所述绝缘套筒；
    所述第一导电部和所述第二导电部分别搭接在所述一组绝缘套筒上。
  14. 根据权利要求13所述的半导体工艺设备，其特征在于，所述承载舟包括靠近所述反应室的开口的第一舟和远离所述反应室的开口的第二舟；
    所述第一舟靠近所述反应室的开口的一端设有第一组舟脚，所述第一舟远离所述反应室的开口的一端设有第二组舟脚，所述第二舟靠近所述反应室的开口的一端设有第三组舟脚，所述第二舟远离所述反应室的开口的一端设有第四组舟脚；
    每根所述支撑杆沿自身长度方向均间隔设置有四个绝缘套筒，所述绝缘套筒套设于所述支撑杆的外侧面，四个所述绝缘套筒分别用于支撑所述第一组舟脚中的一个舟脚、所述第二组舟脚中的一个舟脚、所述第三组舟脚中的一个舟脚和所述第四组舟脚中的一个舟脚，用于支撑所述第一组舟脚中的一个舟脚和所述第二组舟脚中的一个舟脚的所述绝缘套筒的外侧面搭接有所述电极本体，其中，用于支撑所述第一组舟脚中的一个舟脚和所述第二组舟脚中的一个舟脚的所述绝缘套筒的壁厚小于用于支撑所述第三组舟脚的一个舟脚和所述第四组舟脚的一个舟脚的所述绝缘套筒的壁厚。
PCT/CN2024/133739 2023-11-30 2024-11-22 电极引入装置及半导体工艺设备 Pending WO2025113333A1 (zh)

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