WO2025102406A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2025102406A1
WO2025102406A1 PCT/CN2023/132795 CN2023132795W WO2025102406A1 WO 2025102406 A1 WO2025102406 A1 WO 2025102406A1 CN 2023132795 W CN2023132795 W CN 2023132795W WO 2025102406 A1 WO2025102406 A1 WO 2025102406A1
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WO
WIPO (PCT)
Prior art keywords
layer
metal partition
partition structure
close
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2023/132795
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English (en)
French (fr)
Inventor
彭斯敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US18/291,568 priority Critical patent/US20250228105A1/en
Publication of WO2025102406A1 publication Critical patent/WO2025102406A1/zh
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present invention relates to the field of display technology, and in particular to a display panel and a display device.
  • OLED organic light-emitting diode
  • flexible organic light-emitting diode (OLED) display panels have the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption and extremely high response speed.
  • OLED luminescent materials are organic materials that are extremely sensitive to water and oxygen.
  • flexible OLEDs use thin film encapsulation (TFE) technology, which is generally an inorganic/organic/inorganic multilayer film stacking structure.
  • TFE thin film encapsulation
  • WVTR water vapor transmission rate
  • the OLED display panel with under-screen camera needs to dig a hole on the panel to place the camera.
  • the area is encapsulated by thin film encapsulation to ensure the packaging performance of the opening area and extend the service life of the product.
  • the common layer is separated at this position by engraving the metal partition structure to form a step difference, forming a discontinuous common layer, and external water vapor cannot invade the display area through the common layer.
  • the cathode above the common layer will also be separated at the metal partition structure.
  • the cathode is a mixed metal layer of Mg/Ag. After being separated at the metal partition structure, it overlaps with the intermediate metal Al of the metal partition structure to form a circuit conduction. During the reliability test, water vapor and K + in the polarizer enter the interface of the common layer. At the same time, the disconnected cathode overlaps with the intermediate metal Al of the metal partition structure, and is connected to the entire cathode of the display area, transmitting a negative voltage to form an electrochemically corroded cathode. Water vapor generates OH ⁇ ions under the action of electrons, reacts with TFE inorganic film to generate K 2 SiO 3 , and dissolves in aqueous solution, destroying the TFE packaging layer, causing packaging failure. After water vapor enters the display area, it reacts with the luminescent material to form hole black spots/rings, which seriously affects the service life of the product.
  • the embodiments of the present application provide a display panel and a display device, which can suppress electrochemical corrosion of the conductive circuit between the cathode and the metal partition structure, improve the packaging performance of the display panel, extend the reliability test time, and increase the product service life.
  • An embodiment of the present application provides a display panel, comprising an opening area, a transition area disposed at the periphery of the opening area, and a display area disposed at the periphery of the transition area, the display panel further comprising:
  • a dam disposed on the substrate and located in the transition zone;
  • a first metal partition structure is disposed on the substrate, the first metal partition structure is located in the transition area, the first metal partition structure is disposed on a side of the dam away from the opening area, and a first undercut structure is concavely provided on a side of the first metal partition structure close to the dam;
  • a common layer comprising a first common portion and a second common portion, wherein the first common portion continuously extends from the display area to an upper surface of the first metal partition structure away from the substrate, the second common portion extends in a direction away from the opening area, and an end of the second common portion away from the opening area is located in the first undercut structure, and the first common portion is disconnected from the second common portion;
  • the cathode includes a first cathode portion and a second cathode portion, wherein the first cathode portion is arranged on the surface of the first common portion, one end of the second cathode portion is arranged in the first undercut structure and on the surface of the second common portion, and the first cathode portion is disconnected from the second cathode portion.
  • An embodiment of the present application further provides a display device, comprising a display panel, wherein the display panel comprises an opening area, a transition area disposed at the periphery of the opening area, and a display area disposed at the periphery of the transition area, and the display panel further comprises:
  • a dam disposed on the substrate and located in the transition zone;
  • a first metal partition structure is disposed on the substrate, the first metal partition structure is located in the transition area, the first metal partition structure is disposed on a side of the dam away from the opening area, and a first undercut structure is concavely provided on a side of the first metal partition structure close to the dam;
  • a common layer comprising a first common portion and a second common portion, wherein the first common portion continuously extends from the display area to an upper surface of the first metal partition structure away from the substrate, the second common portion extends in a direction away from the opening area, and an end of the second common portion away from the opening area is located in the first undercut structure, and the first common portion is disconnected from the second common portion;
  • the cathode includes a first cathode portion and a second cathode portion, wherein the first cathode portion is arranged on the surface of the first common portion, one end of the second cathode portion is arranged in the first undercut structure and on the surface of the second common portion, and the first cathode portion is disconnected from the second cathode portion.
  • FIG1 is a partial schematic plan view of a display panel provided in an embodiment of the present application.
  • FIG2 is a cross-sectional view of a first display panel provided by an embodiment of the present application along the A-A' direction shown in FIG1 ;
  • FIG3 is an enlarged schematic diagram of the first metal partition structure in FIG2 ;
  • FIG4 is an enlarged schematic diagram of the second metal partition structure in FIG2 ;
  • FIG5 is a cross-sectional view of a second display panel provided by an embodiment of the present application along the A-A’ direction shown in FIG1 ;
  • FIG6 is a cross-sectional view of a third display panel provided by an embodiment of the present application along the A-A′ direction shown in FIG1 ;
  • FIG. 7a to 7d are schematic flow charts of a method for manufacturing a display panel provided in an embodiment of the present application.
  • the embodiments of the present application provide a display panel that can suppress electrochemical corrosion of the conductive circuit between the cathode and the metal partition structure, improve the packaging performance of the display panel, extend the reliability test time, and increase the product service life.
  • a display panel comprising an opening area, a transition area arranged at the periphery of the opening area, and a display area arranged at the periphery of the transition area, the display panel further comprising:
  • a dam disposed on the substrate and located in the transition zone;
  • a first metal partition structure is disposed on the substrate, the first metal partition structure is located in the transition area, the first metal partition structure is disposed on a side of the dam away from the opening area, and a first undercut structure is concavely provided on a side of the first metal partition structure close to the dam;
  • a common layer comprising a first common portion and a second common portion, wherein the first common portion continuously extends from the display area to the upper surface of the first metal partition structure away from the substrate, the second common portion extends in a direction away from the opening area, and an end of the second common portion away from the opening area is located in the first undercut structure, and the first common portion is disconnected from the second common portion;
  • the cathode includes a first cathode portion and a second cathode portion, wherein the first cathode portion is arranged on the surface of the first common portion, one end of the second cathode portion is arranged in the first undercut structure and on the surface of the second common portion, and the first cathode portion is disconnected from the second cathode portion.
  • the display panel also includes a high-voltage DC power signal line and a low-voltage DC power signal line, the first metal partition structure is electrically connected to the high-voltage DC power signal line, and the cathode is electrically connected to the low-voltage DC power signal line.
  • the high-voltage DC power signal routing is arranged around the first metal partition structure, and the high-voltage DC power signal routing is overlapped with the first metal partition structure at multiple locations around the periphery.
  • the high-voltage DC power signal wiring is in a grid shape.
  • the high-voltage DC power signal wiring is arranged on the same layer as the first metal partition structure.
  • the display panel includes an organic insulating layer, the organic insulating layer at least covers a side surface of the first metal partition structure close to the display area, and the first common portion is partially disposed on a surface of the organic insulating layer.
  • the organic insulating layer covers at least a portion of a surface of the first metal partition structure that is away from the substrate.
  • the organic insulating layer includes at least one planar layer and a pixel definition layer disposed on the planar layer, and at least one of the planar layer and the pixel definition layer at least covers a side surface of the first metal partition structure close to the display area.
  • the display panel includes a first source-drain electrode layer, the organic insulating layer includes a first planar layer, and the first source-drain electrode layer is disposed between the first planar layer and the substrate;
  • the first metal partition structure is arranged in the same layer as the first source-drain electrode layer.
  • the display panel includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer, and a second planar layer stacked on the substrate;
  • the first metal partition structure is arranged on the same layer as the second source-drain electrode layer, the edge of the first flat layer close to the opening area is located on the side of the first metal partition structure close to the display area, and at least one of the second flat layer and the pixel definition layer at least covers the side of the first metal partition structure close to the display area.
  • the display panel includes a first source-drain electrode layer, a first planar layer, a second source-drain electrode layer, a second planar layer, a third source-drain electrode layer and a third planar layer stacked on the substrate;
  • the first metal partition structure is arranged on the same layer as the third source-drain electrode layer, the edges of the first flat layer and the second flat layer close to the opening area are both located on the side of the first metal partition structure close to the display area, and at least one of the third flat layer and the pixel definition layer at least covers the side of the first metal partition structure close to the display area.
  • an edge of the first common portion close to the first undercut structure is farther away from the substrate than an edge of the second common portion close to the first undercut structure, and an edge of the first cathode portion close to the first undercut structure is farther away from the substrate than an edge of the second cathode portion close to the first undercut structure.
  • the first metal partition structure includes a first conductive layer, a second conductive layer and a third conductive layer stacked on the substrate, an end of the second conductive layer close to the opening area is retracted into an end of the first conductive layer and the third conductive layer close to the opening area, and an end of the second conductive layer close to the opening area is enclosed with an end of the first conductive layer and the third conductive layer close to the opening area to form the first undercut structure.
  • the second common portion is in contact with the first conductive layer, and one end of the second common portion located in the first undercut structure is disconnected from the second conductive layer, and the second cathode portion is in contact with the first conductive layer, and one end of the second cathode portion located in the first undercut structure is disconnected from the second conductive layer.
  • the display panel further includes:
  • At least one second metal partition structure is disposed on the substrate, at least one second metal partition structure is located on a side of the dam close to the opening area, and the second metal partition structure is disposed around the opening area;
  • the second common portion includes a first common sub-portion and a second common sub-portion, the first common sub-portion is disconnected from the second common sub-portion, the first common sub-portion is arranged on the surface of the second metal partition structure away from the substrate, the second common sub-portion is arranged on opposite sides of the second metal partition structure and is placed in the first undercut structure and the second undercut structure, and the first common sub-portion is disconnected from the second common sub-portion;
  • the second cathode portion includes a first cathode sub-portion and a second cathode sub-portion, the first cathode sub-portion is disconnected from the second cathode sub-portion, the first cathode sub-portion is arranged on the surface of the first common sub-portion, the second cathode sub-portion is arranged on the surface of the second common sub-portion, the end of the second cathode sub-portion is arranged in the first undercut structure and the second undercut structure, and the first cathode sub-portion is disconnected from the second cathode sub-portion.
  • the second metal partition structure includes a fourth conductive layer, a fifth conductive layer and a sixth conductive layer stacked on the substrate, an end of the fifth conductive layer close to the opening area is retracted inwardly of the fourth conductive layer and the sixth conductive layer close to the opening area, and an end of the fifth conductive layer close to the opening area is enclosed with the fourth conductive layer and the sixth conductive layer close to the opening area to form the second undercut structure;
  • one end of the fifth conductive layer close to the dam is retracted into one end of the fourth conductive layer and the sixth conductive layer close to the dam, and one end of the fifth conductive layer close to the dam is enclosed with one end of the fourth conductive layer and the sixth conductive layer close to the dam to form the second undercut structure.
  • the display panel further includes a plurality of bosses, some of the bosses are disposed between the first metal partition structure and the substrate, and other parts of the bosses are disposed between the second metal partition structure and the substrate.
  • the embodiments of the present application provide a display panel and a display device, wherein the display panel includes a substrate, a dam, a first metal partition structure, a common layer and a cathode, wherein the first metal partition structure is recessed with a first bottom cut structure on the side surface close to the dam, the common layer includes a first common portion and a second common portion, and the cathode layer includes a first cathode portion and a second cathode portion.
  • the transition area A2 is used as a transition area between the opening area A1 and the display area A3 to prevent water vapor from the external environment from invading the display area A3 through the opening area A1.
  • the display area A3 is mainly used to realize the function of displaying images on the screen.
  • the opening area A1 and the transition area A2 do not have the function of displaying images.
  • the opening area A 1 is provided with a light-transmitting hole 11, which may penetrate the display panel in the thickness direction of the display panel, or may only penetrate part of the film layer of the display panel, but does not penetrate the display panel.
  • the camera component is correspondingly arranged in the light-transmitting hole 11 or below the light-transmitting hole, and the camera component obtains external light through the light-transmitting hole 11.
  • the size and shape of the light-transmitting hole are the same as the size and shape of the opening area A1.
  • the opening area A1 is circular in shape.
  • the transition area A2 is arranged around the opening area A1.
  • the shape of the transition area A2 can be regarded as a closed ring.
  • the display area A3 is arranged around the transition area A2.
  • the number of opening areas A1 and light-transmitting holes is not limited to one in the above embodiments, but may also be two or more.
  • the shape of the opening area A1 is not limited to the circle in the above embodiments, but may also be an ellipse, a strip, a teardrop shape or other unconventional shapes.
  • the shapes of the transition area A2 and the display area A3 may be adapted to the shape of the opening area A1.
  • the display panel includes a substrate 1, a dam 7 and a first metal partition structure 2, the dam 7 is arranged on the substrate 1, the dam 7 is located in the transition area A2 and is arranged around the opening area A1, the first metal partition structure 2 is arranged on the substrate 1, the first metal partition structure 2 is located in the transition area A2 and is arranged on the side of the dam 7 away from the opening area A1, the first metal partition structure 2 is arranged around the opening area A1, and the shape of the orthographic projection of the first metal partition structure 2 on the substrate 1 is a closed ring.
  • Figure 3 is an enlarged schematic diagram of the first metal partition structure in Figure 2, a first undercut structure 20 is recessed on the side of the first metal partition structure 2 close to the opening area A1, and the first undercut structure 20 is formed by the middle area of the side of the first metal partition structure 2 close to the opening area A1 being recessed into the interior of the first metal partition structure 2, and no groove is set on the side of the first metal partition structure 2 close to the display area A3.
  • the step difference cannot be filled, thereby forming a first common portion 31 and a second common portion 32, and the first common portion 31 and the second common portion 32 are disconnected at the side of the first metal partition structure 2 close to the opening area A1.
  • the first common portion 31 is disconnected from the second common portion 32, and the water vapor cannot continue to penetrate into the first common portion 31, and therefore cannot further penetrate into the display area A3 through the second common portion 32, thereby preventing the water vapor from penetrating into the display area A3 and causing damage to the luminescent material.
  • the edge of the first common portion 31 close to the first undercut structure 20 is farther away from the substrate 1 than the edge of the second common portion 32 close to the first undercut structure 20, that is, the edge of the first common portion 31 close to the first undercut structure 20 and the edge of the second common portion 32 close to the first undercut structure 20 are located on horizontal planes at different heights, and the distance between the plane where the edge of the first common portion 31 close to the first undercut structure 20 is located and the substrate 1 is greater than the distance between the plane where the edge of the second common portion 32 close to the first undercut structure 20 is located and the substrate 1.
  • the first cathode portion 41 and the second cathode portion 42 are separated by the first metal partition structure 2, and the first cathode portion 41 is continuously distributed only from the display area A3 to the upper surface of the first metal partition structure 2 away from the substrate 1, which can avoid the charged first cathode portion 41 and the first metal partition structure 2 from overlapping to form a conductive path to cause electrochemical corrosion, thereby improving the packaging performance and increasing the service life of the product.
  • the cathode 4 is also prepared by a full-surface evaporation process.
  • the principle of the disconnection of the first cathode portion 41 and the second cathode portion 42 at the side of the first metal partition structure 2 close to the opening area A1 is the same as the principle of the disconnection of the first common portion 31 and the second common portion 32 of the above-mentioned common layer 3 at this location, which will not be repeated here.
  • the edge of the first cathode portion 41 close to the first undercut structure 20 is farther away from the substrate 1 than the edge of the second cathode portion 42 close to the first undercut structure 20, that is, the edge of the first cathode portion 41 close to the first undercut structure 20 and the edge of the second cathode portion 42 close to the first undercut structure 20 are located on horizontal planes at different heights, and the distance between the plane where the edge of the first cathode portion 41 close to the first undercut structure 20 is located and the substrate 1 is greater than the distance between the plane where the edge of the second cathode portion 42 close to the first undercut structure 20 is located and the substrate 1.
  • the voltage of the first cathode portion 41 When powered on, the voltage of the first cathode portion 41 is a negative voltage, and the voltage of the first metal partition structure 2 is a positive voltage.
  • the voltage of the second cathode portion 42 When the second cathode portion 42 is deposited in the first undercut structure 20 and overlaps with the first metal partition structure 2 to form a conductive path, since the voltage of the first metal partition structure 2 is a positive voltage, the voltage of the second cathode portion 42 overlapped with the first metal partition structure 2 is also a positive voltage. Since the voltage of the electrolyte environment formed after the water vapor and K + in the polarizer enter the interior of the panel is a positive voltage, the voltage of the first metal partition structure 2 is also a positive voltage, and there is no electrode for electrochemical corrosion. Therefore, the embodiments of the present application can destroy the conditions for electrochemical corrosion, inhibit the electrochemical corrosion of the conductive path between the cathode 4 and the first metal partition structure 2, thereby improving the packaging performance and increasing the
  • the display panel further includes a high-voltage DC power signal line VDD and a low-voltage DC power signal line (not shown in the figure), the first metal partition structure 2 is electrically connected to the high-voltage DC power signal line VDD, and the cathode 4 is electrically connected to the low-voltage DC power signal line.
  • the high-voltage DC power signal line VDD transmits a high-voltage DC power signal, which is a constant positive voltage DC signal
  • the low-voltage DC power signal line transmits a low-voltage DC power signal, which is a constant negative voltage DC signal.
  • the first metal partition structure 2 is a closed ring line in a top view
  • the high-voltage DC power signal line VDD is arranged at the periphery of the first metal partition structure 2, and is arranged around the first metal partition structure 2
  • the high-voltage DC power signal line VDD is overlapped at multiple locations around the first metal partition structure 2.
  • the high-voltage DC power signal wiring VDD is in a grid shape.
  • the display panel includes an organic insulating layer 5 , the organic insulating layer 5 at least covers the side surface of the first metal partition structure 2 close to the display area A3 , and the first common portion 31 is partially disposed on the surface of the organic insulating layer 5 .
  • the organic insulating layer 5 covers the side of the first metal partition structure 2 close to the display area A3, the first common portion 31 and the first cathode portion 41 are continuously laid from the surface of the first metal partition structure 2 away from the substrate 1 to the surface of the organic insulating layer 5, the organic insulating layer 5 insulates and separates the first cathode portion 41 from the first metal partition structure 2, and the side of the first metal partition structure 2 close to the opening area A1 is not covered by an organic insulating layer.
  • the organic insulating layer 5 can be used to protect the side of the first metal partition structure 2 close to the display area A3, so as to avoid etching the side of the first metal partition structure 2 close to the display area A3 when etching to form the first undercut structure 20, so that the first common portion 31 and the first cathode portion 41 can be continuously distributed from the surface of the first metal partition structure 2 away from the substrate 1 to the display area A3, and avoid the first common portion 31 and the first cathode portion 41 being disconnected at the side of the first metal partition structure 2 close to the display area A3 and overlapping with the first metal partition structure 2.
  • the organic insulating layer 5 not only covers the side surface of the first metal partition structure 2 close to the display area A3 , but also covers at least a portion of the surface of the first metal partition structure 2 facing away from the substrate 1 .
  • the organic insulating layer 5 covers the portion of the surface of the first metal partition structure 2 facing away from the substrate 1 close to the display area A3 and the side of the first metal partition structure 2 close to the display area A3.
  • the organic insulating layer 5 covers the side of the first metal partition structure 2 close to the display area A3, thereby preventing the side of the first metal partition structure 2 close to the display area A3 from being etched to form a step difference, resulting in the first common portion 31 and the first cathode portion 41 being disconnected at the side of the first metal partition structure 2 close to the display area A3 and overlapping with the first metal partition structure 2.
  • the organic insulating layer 5 not only covers the side surface of the first metal partition structure 2 close to the display area A3 , but also completely covers the surface of the first metal partition structure 2 facing away from the substrate 1 .
  • the organic insulating layer 5 includes at least one planar layer and a pixel definition layer 50 disposed on the planar layer, and at least one of the planar layer and the pixel definition layer 50 at least covers a side surface of the first metal partition structure 2 close to the display area A3.
  • the organic insulating layer 5 includes a first flat layer 51 and a pixel definition layer 50, wherein the first flat layer 51 is disposed on the substrate 1, and the pixel definition layer 50 is disposed on the surface of the first flat layer 51 facing away from the substrate 1.
  • the first flat layer 51 and the pixel definition layer 50 are both made of organic insulating materials.
  • the pixel definition layer 50 has a plurality of pixel openings, and the light-emitting layer 6 is disposed in the pixel openings.
  • the first flat layer 51 covers a portion of the side surface of the first metal partition structure 2 close to the display area A3, and the pixel definition layer 50 covers a portion of the surface of the first metal partition structure 2 facing away from the substrate 1, and also covers the side surface of the first metal partition structure 2 close to the display area A3 that is not covered by the first flat layer 51.
  • the edge of the first flat layer 51 close to the opening area A1 is located on the side of the first metal partition structure 2 close to the display area A3, that is, the first flat layer 51 does not cover the side of the first metal partition structure 2 close to the display area A3, and the pixel definition layer 50 covers the side of the first metal partition structure 2 close to the display area A3.
  • the pixel definition layer 50 can further cover at least a portion of the surface of the first metal partition structure 2 away from the substrate 1.
  • the first flat layer 51 covers the side of the first metal partition structure 2 close to the display area A3, and the edge of the pixel definition layer 50 close to the opening area A1 is located on the side of the first metal partition structure 2 close to the display area A3, that is, the pixel definition layer 50 does not cover the side of the first metal partition structure 2 close to the display area A3. Based on this structure, the first flat layer 51 can further cover at least a portion of the surface of the first metal partition structure 2 away from the substrate 1.
  • the display panel further includes a first source-drain electrode layer SD1, the first source-drain electrode layer SD1 is disposed between the first planar layer 51 and the substrate 1, the first metal partition structure 2 is disposed on the same layer as the first source-drain electrode layer SD1, and the film layer structure and material of the first metal partition structure 2 are the same as the film layer structure and material of the first source-drain electrode layer SD1, that is, the first metal partition structure 2 can be prepared synchronously with the process of the first source-drain electrode layer SD1.
  • the high-voltage DC power signal line VDD is arranged on the same layer as the first metal partition structure 2, and the film layer structure and material of the high-voltage DC power signal line VDD are the same as the film layer structure and material of the first metal partition structure 2, that is, the first metal partition structure 2 and the high-voltage DC power signal line VDD can be simultaneously prepared using the process of the first source-drain electrode layer SD1.
  • the high-voltage DC power signal line VDD is arranged in a different layer from the first metal partition structure 2.
  • the high-voltage DC power signal line VDD can be arranged in a gate metal layer, or when the display panel has multiple source-drain electrode metal layers, the high-voltage DC power signal line VDD and the first metal partition structure 2 are arranged in the same layer as different source-drain electrode metal layers, and the high-voltage DC power signal line VDD and the first metal partition structure 2 can be electrically connected through a via on the insulating layer.
  • the display panel includes a first source-drain electrode layer SD1, a first planar layer 51, a second source-drain electrode layer SD2, and a second planar layer 52 stacked on a substrate 1.
  • the first metal partition structure 2 is arranged on the same layer as the second source-drain electrode layer SD2.
  • the edge of the first planar layer 51 close to the opening area A1 is located on the side of the first metal partition structure 2 close to the display area A3.
  • At least one of the second planar layer 52 and the pixel definition layer 50 at least covers the side of the first metal partition structure 2 close to the display area A3.
  • FIG5 is a cross-sectional view of the second display panel provided by the embodiment of the present application along the A-A’ direction shown in FIG1 , and its structure is substantially the same as that of the display panel shown in FIG2 , except that: the organic insulating layer 5 has a first flat layer 51 and a second flat layer 52, the display panel has a first source-drain electrode layer SD1 and a second source-drain electrode layer SD2, the first flat layer 51 covers the first source-drain electrode layer SD1, the second source-drain electrode layer SD2 is arranged on the first flat layer 51, the first metal partition structure 2 is arranged on the same layer as the second source-drain electrode layer SD2, and the first metal partition structure 2 is arranged on the substrate 1.
  • the organic insulating layer 5 has a first flat layer 51 and a second flat layer 52
  • the display panel has a first source-drain electrode layer SD1 and a second source-drain electrode layer SD2
  • the first flat layer 51 covers the first source-drain electrode layer SD1
  • the edge of the first flat layer 51 close to the opening area A1 is located on the side of the first metal partition structure 2 close to the display area A3, and the second flat layer 52 and the pixel definition layer 50 both cover the side of the first metal partition structure 2 close to the display area A3 and the partial surface of the first metal partition structure 2 facing away from the substrate 1.
  • the edges of the first flat layer 51 and the second flat layer 52 close to the opening area A1 are both located on the side of the first metal partition structure 2 close to the display area A3, and the pixel definition layer 50 covers the side of the first metal partition structure 2 close to the display area A3 and the portion of the surface of the first metal partition structure 2 facing away from the substrate 1.
  • the edges of the first flat layer 51 and the pixel definition layer 50 near the opening area A1 are both located on the side of the first metal partition structure 2 near the display area A3, and the second flat layer 52 covers the side of the first metal partition structure 2 near the display area A3 and a portion of the surface of the first metal partition structure 2 facing away from the substrate 1.
  • the first metal partition structure 2 may also be disposed in the same layer as the first source-drain electrode layer SD1 .
  • the display panel includes a first source-drain electrode layer SD1, a first planar layer 51, a second source-drain electrode layer SD2, a second planar layer 52, a third source-drain electrode layer SD3 and a third planar layer 53 stacked on a substrate 1, the first metal partition structure 2 and the third source-drain electrode layer SD3 are arranged on the same layer, the edges of the first planar layer 51 and the second planar layer 52 close to the opening area A1 are both located on the side of the first metal partition structure 2 close to the display area A3, and at least one of the third planar layer 53 and the pixel definition layer 50 at least covers the side of the first metal partition structure 2 close to the display area A3.
  • Figure 6 is a cross-sectional view of the third display panel provided by the embodiment of the present application along the A-A’ direction shown in Figure 1, and its structure is substantially the same as the structure of the display panel shown in Figure 2, except that: the organic insulating layer 5 has a first flat layer 51, a second flat layer 52 and a third flat layer 53, the display panel has a first source-drain electrode layer SD1, a second source-drain electrode layer SD2 and a third source-drain electrode layer SD3, the first metal partition structure 2 is arranged on the same layer as the third source-drain electrode layer SD3, the edges of the first flat layer 51 and the second flat layer 52 close to the opening area A1 are both located on the side of the first metal partition structure 2 close to the display area A3, and the third flat layer 53 and the pixel definition layer 50 both cover the side of the first metal partition structure 2 close to the display area A3 and the partial surface of the first metal partition structure 2 facing away from the substrate 1.
  • the organic insulating layer 5 has a first flat layer 51, a
  • the edges of the first flat layer 51, the second flat layer 52 and the third flat layer 53 near the opening area A1 are all located on the side of the first metal partition structure 2 near the display area A3, and the pixel definition layer 50 covers the side of the first metal partition structure 2 near the display area A3 and the portion of the surface of the first metal partition structure 2 facing away from the substrate 1.
  • the first metal partition structure 2 may also be provided in the same layer as the second source-drain electrode layer SD2 or the first source-drain electrode layer SD1.
  • the first metal partition structure 2 includes a first conductive layer 21, a second conductive layer 22 and a third conductive layer 23 stacked on the substrate 1, the second conductive layer 22 is arranged between the first conductive layer 21 and the third conductive layer 23, and the end of the second conductive layer 22 close to the opening area A1 is retracted into the first conductive layer 21 and the end of the third conductive layer 23 close to the opening area A1.
  • the first undercut structure 20 can be regarded as a groove formed on the side of the first metal partition structure near the opening area A1, wherein the side of the second conductive layer 22 near the opening area A1 serves as the bottom of the groove of the first undercut structure 20, and the surface of the first conductive layer 21 near the third conductive layer 23 and the surface of the third conductive layer 23 near the first conductive layer 21 can serve as the groove wall of the first undercut structure 20.
  • the second common portion 32 is in contact with the first conductive layer 21, and one end of the second common portion 32 located in the first undercut structure 20 is disconnected from the second conductive layer 22.
  • the second cathode portion 42 is in contact with the first conductive layer 21, and one end of the second cathode portion 42 located in the first undercut structure 20 is disconnected from the second conductive layer 22.
  • the voltage of the first metal partition structure 2 can be transmitted to the second cathode portion 42, so that the voltage of the second cathode portion 42 is positive, thereby destroying the conditions for electrochemical corrosion and inhibiting electrochemical corrosion from occurring in the conductive path between the cathode 4 and the first metal partition structure 2.
  • the second conductive layer 22 is made of different materials from the first conductive layer 21, the first conductive layer 21 is made of the same material as the third conductive layer 23, and the etching rate of the second conductive layer 22 is greater than that of the first conductive layer 21 and the third conductive layer 23. This ensures that when the first metal partition structure 2 is etched, the etching degree of the second conductive layer 22 is greater than that of the first conductive layer 21 and the third conductive layer 23, so as to form a first undercut structure 20.
  • the materials of the first conductive layer 21 and the third conductive layer 23 are both titanium, and the material of the second conductive layer 22 is aluminum.
  • FIG. 4 is an enlarged schematic diagram of the second metal partition structure in FIG. 2
  • the display panel further includes a dam 7 and at least one second metal partition structure 8, the dam 7 is disposed on the substrate 1, the dam 7 is located on the side of the first metal partition structure 2 close to the opening area A1, the dam 7 is disposed around the opening area A1, the dam 7 can be made of the same material as at least one layer of the organic insulating layer 5, for example, the dam 7 is the same material as the pixel definition layer 50, and the dam 7 can be prepared synchronously with the pixel definition layer 50 using the same process.
  • the material of the dam 7 can also be the same as the material of the planar layer; or, the dam 7 includes at least two upper and lower parts, one of which is the same material as the planar layer, and the other is the same material as the pixel definition layer.
  • the second metal partition structure 8 is disposed on the substrate 1 . At least one second metal partition structure 8 is located on a side of the dam 7 close to the opening area A1 . The second metal partition structure 8 is disposed around the opening area A1 .
  • At least one of the side surfaces of the second metal partition structure 8 close to the opening area A1 and the side surfaces close to the dam 7 is recessed with a second undercut structure 80, and the second common portion 32 includes a first common sub-portion 321 and a second common sub-portion 322.
  • the first common sub-portion 321 is arranged on the surface of the second metal partition structure 8 facing away from the substrate 1, and the second common sub-portion 322 is arranged on the opposite sides of the second metal partition structure 8 and is placed in the first undercut structure 20 and the second undercut structure 80, and the first common sub-portion 321 is disconnected from the second common sub-portion 322.
  • the edge of the first common sub-portion 321 close to the second undercut structure 80 is farther away from the substrate 1 than the edge of the second common sub-portion 322 close to the second undercut structure 80, that is, the edge of the first common sub-portion 321 close to the second undercut structure 80 and the edge of the second common sub-portion 322 close to the second undercut structure 80 are located on horizontal planes at different heights, and the distance between the plane where the edge of the first common sub-portion 321 close to the second undercut structure 80 is located and the substrate 1 is greater than the distance between the plane where the edge of the second common sub-portion 322 close to the second undercut structure 80 is located and the substrate 1.
  • the second cathode portion 42 includes a first cathode sub-portion 421 and a second cathode sub-portion 422.
  • the first cathode sub-portion 421 is disconnected from the second cathode sub-portion 422.
  • the first cathode sub-portion 421 is arranged on the surface of the first common sub-portion 321, and the second cathode sub-portion 422 is arranged on the surface of the second common sub-portion 322 and in the first undercut structure 20 and/or the second undercut structure 80.
  • the edge of the first cathode sub-portion 421 close to the second undercut structure 80 is farther away from the substrate 1 than the edge of the second cathode sub-portion 422 close to the second undercut structure 80, that is, the edge of the first cathode sub-portion 421 close to the second undercut structure 80 and the edge of the second cathode sub-portion 422 close to the second undercut structure 80 are located on horizontal planes at different heights, and the distance between the plane where the edge of the first cathode sub-portion 421 close to the second undercut structure 80 is located and the substrate 1 is greater than the distance between the plane where the edge of the second cathode sub-portion 422 close to the second undercut structure 80 is located and the substrate 1.
  • the shapes of the positive projections of the dam 7 and the second metal partition structure 8 on the substrate 1 are both closed rings, so that the second metal partition structure 8 can be used to isolate the common layer 3 and cathode 4 of the display area A3 from the common layer 3 and cathode 4 of the transition area A2.
  • the display panel has a plurality of second metal partition structures 8, the number of which may be 2, 3, 4 or more, and the plurality of second metal partition structures 8 are arranged at intervals on one side of the dam 7 close to the opening area A1.
  • the common layer 3 and the cathode 4 can be separated into a plurality of mutually disconnected parts, further reducing the risk of water vapor invading the display area A3 through the common layer 3.
  • second metal partition structures 8 shown in FIG. 2 does not represent the number of second metal partition structures 8 in actual applications.
  • the number of second metal partition structures 8 can be set according to demand and is not limited here.
  • the display panel has multiple second metal partition structures 8, at least one second metal partition structure 8 is arranged on a side of the dam 7 close to the opening area A1, and at least one second metal partition structure 8 is arranged between the dam 7 and the first metal partition structure 2.
  • a second metal partition structure 8 is disposed on one side of the dam 7 close to the opening area A1 and between the dam 7 and the first metal partition structure 2 .
  • six second metal partition structures 8 are provided on the side of the dam 7 close to the opening area A1, and two second metal partition structures 8 are provided between the dam 7 and the first metal partition structure 2.
  • the number of second metal partition structures 8 on the side of the dam 7 close to the opening area A1 and between the dam 7 and the first metal partition structure 2 can be set according to demand, and is not limited here.
  • the second metal partition structure 8 includes a fourth conductive layer 81, a fifth conductive layer 82 and a sixth conductive layer 83 stacked on the substrate 1, and one end of the fifth conductive layer 82 close to the opening area A1 is retracted into one end of the fourth conductive layer 81 and the sixth conductive layer 83 close to the opening area A1, and one end of the fifth conductive layer 82 close to the opening area A1 is combined with one end of the fourth conductive layer 81 and the sixth conductive layer 83 close to the opening area A1 to form a second undercut structure 80, and one end of the fifth conductive layer 82 close to the dam 7 is retracted into one end of the fourth conductive layer 81 and the sixth conductive layer 83 close to the dam 7, and one end of the fifth conductive layer 82 close to the dam 7 is combined with one end of the fourth conductive layer 81 and the sixth conductive layer 83 close to the dam 7 to form a second undercut structure 80.
  • the fourth conductive layer 81 and the sixth conductive layer 83 are both made of titanium, and the fifth conductive layer 82 is made of aluminum.
  • first metal partition structure 2 and the second metal partition structure 8 are arranged in the same layer, and the film layer structure and material of the first metal partition structure 2 are the same as the film layer structure and material of the second metal partition structure 8, that is, the first metal partition structure 2 and the second metal partition structure 8 can be simultaneously prepared using the same process.
  • the display panel further includes a plurality of bosses 9, some of which are disposed between the first metal partition structure 2 and the substrate 1, and other parts of which are disposed between the second metal partition structure 8 and the substrate 1.
  • the bosses 9 may be etched from inorganic insulating layers such as a buffer layer, a gate insulating layer, and an interlayer dielectric layer.
  • the display panel also includes an encapsulation layer 10, which is continuously arranged in the transition area A2 and the display area A3, and the encapsulation layer covers the common layer 3, the cathode 4, the first metal partition structure 2, the first undercut structure 20, the second metal partition structure 8 and the second undercut structure 80.
  • the encapsulation layer 10 is a thin film encapsulation structure, and the encapsulation layer 10 includes a first inorganic encapsulation layer 101, an organic encapsulation layer 103 and a second inorganic encapsulation layer 102.
  • the organic encapsulation layer 103 is sandwiched between the first inorganic encapsulation layer 101 and the second inorganic encapsulation layer 102.
  • the organic encapsulation layer 102 is blocked by the dam 7 on the side of the dam 7 close to the display area A3.
  • the first inorganic encapsulation layer 101 and the second inorganic encapsulation layer 102 are continuously distributed from the display area A3 to the junction of the transition area A2 and the opening area A1.
  • the embodiment of the present application further provides a method for manufacturing a display panel, and in combination with FIG. 7a to FIG. 7d, FIG. 7a to FIG. 7d are schematic flow charts of the method for manufacturing a display panel provided in the embodiment of the present application.
  • the present application only takes the first display panel shown in FIG. 2 as an example, and the method for manufacturing a display panel includes:
  • Step S1 forming a first metal partition structure 2 on a substrate 1 .
  • step S1 specifically includes: forming a metal layer on a substrate 1; etching the metal layer by a dry etching process to form a first metal partition structure 2 and a plurality of second metal partition structures 8, wherein the second metal partition structure 8 is located on a side of the first metal partition structure 2 close to the opening area A1.
  • the metal layer may be a source-drain electrode metal layer.
  • the metal layer may be any one of the source-drain electrode metal layers.
  • Step S2 forming an organic insulating layer 5 on the first metal partition structure 2 .
  • step S1 specifically includes: depositing an organic insulating material on the substrate 1; etching the organic insulating material by an etching process to form an organic insulating layer 5 and a dam 7, wherein the dam 7 is located between the first metal partition structure 2 and the second metal partition structure 8.
  • the organic insulating layer 5 covers the side of the first metal partition structure 2 close to the display area A3 and the surface of the first metal partition structure 2 facing away from the substrate 1.
  • Step S3 performing side engraving processing on the first metal partition structure 2 and the second metal partition structure 8 to form a first undercut structure and a second undercut structure.
  • step S3 the first metal partition structure 2 and the second metal partition structure 8 can be side-etched by a wet etching process.
  • the side of the first metal partition structure 2 close to the opening area A1 is not covered by the organic insulating layer 5. Therefore, a first undercut structure is formed on the side of the first metal partition structure 2 close to the opening area A1, and a second undercut structure is formed on the side of the second metal partition structure close to the opening area A1 and the side close to the dam 7.
  • Step S4 forming a common layer 3 and a cathode 4 on the substrate 1 .
  • Step S5 forming a packaging layer 10 on the substrate 1 .
  • the encapsulation layer 10 is continuously disposed in the transition area A2 and the display area A3 , and covers the common layer 3 , the cathode 4 , the first metal partition structure 2 , the first undercut structure, the second metal partition structure 8 and the second undercut structure.
  • the encapsulation layer 10 is a thin film encapsulation structure, and the encapsulation layer 10 includes a first inorganic encapsulation layer 101, an organic encapsulation layer 103, and a second inorganic encapsulation layer 102.
  • the organic encapsulation layer 103 is sandwiched between the first inorganic encapsulation layer 101 and the second inorganic encapsulation layer 102.
  • the organic encapsulation layer 102 is blocked by the dam 7 on the side of the dam 7 close to the display area A3.
  • the first inorganic encapsulation layer 101 and the second inorganic encapsulation layer 102 are continuously distributed from the display area A3 to the junction of the transition area A2 and the opening area A1.
  • the first inorganic encapsulation layer 101 and the second inorganic encapsulation layer 102 can be prepared by plasma enhanced chemical vapor deposition, and the organic encapsulation layer can be prepared by inkjet printing.
  • this embodiment only takes the first type of display panel shown in FIG. 2 as an example, and the manufacturing methods of the display panels described in other embodiments are substantially the same as the above method, which will not be described in detail here.
  • the embodiments of the present application further provide a display device, the display device includes a camera component and a display panel provided in any of the above embodiments, the camera component is correspondingly arranged in the opening area of the display panel.
  • the display device is but not limited to display devices such as smart phones, smart watches, desktop computers, laptop computers, and televisions.
  • the embodiments of the present application provide a display panel and a display device, wherein the display panel includes a substrate, a first metal partition structure, a common layer and a cathode, wherein a first bottom cut structure is recessed on the side of the first metal partition structure near the opening area, the common layer includes a first common portion and a second common portion, and the cathode layer includes a first cathode portion and a second cathode portion.
  • the step difference formed by the first bottom cut structure can not only separate the first common portion and the second common portion, and cut off the path for water vapor to invade the display area through the common layer, thereby preventing water vapor from invading the display area laterally through the common layer, but also separate the charged first cathode portion from the uncharged second cathode portion near the opening area, thereby avoiding electrochemical corrosion caused by the overlap of the charged first cathode portion and the first metal partition structure to form a conductive path, thereby improving the packaging performance and increasing the service life of the product.

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Abstract

本申请提供了一种显示面板及显示装置，该显示面板包括基板、堤坝、第一金属隔断结构、共通层和阴极，第一金属隔断结构靠近开孔区的侧面凹设有第一底切结构，不仅可以防止水汽通过共通层侧向入侵显示区，还可以避免带电的阴极与第一金属隔断结构搭接形成导电通路发生电化学腐蚀。

Description

显示面板及显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板及显示装置。
 背景技术
柔性有机发光二极管(organic light-emitting diode，OLED)显示面板与传统的刚性显示面板相比，具有自发光、广视角、高对比、低耗电以及极高反应速度等优点。OLED发光材料是一种对水氧极其敏感的有机材料，通常柔性OLED采用薄膜封装（thin film encapsulation，TFE）技术，一般为无机/有机/无机的多层膜叠加结构，水蒸气透过率（water vapor transmission rate，WVTR）可降到约10-6g/m2·day级别，保证了OLED发光材料正常工作。
目前，屏下摄像OLED显示面板需要在面板上挖孔来放置摄像头，为了保证开孔区的封装性能，需要将该区域的共通层与显示区的共通层隔断，避免水汽通过共通层侧向入侵，再通过薄膜封装对该区域进行封装，保证开孔区的封装性能，延长产品使用寿命。在过渡区通过对金属隔断结构侧刻形成段差，将共通层在此位置进行隔断，形成不连续的共通层，外界水汽无法通过共通层入侵显示区。然而，共通层上方的阴极在金属隔断结构处也会被隔断，阴极为Mg/Ag混合的金属层，在金属隔断结构处隔断后，与金属隔断结构的中间金属Al搭接，形成电路导通。在可靠性测试过程中，水汽与偏光片中的K +进入共通层界面，同时断开的阴极与金属隔断结构的中间金属Al搭接，与显示区的整面阴极导通，输送负电压，形成电化学腐蚀的阴极。水汽在电子作用下生成OH⁻离子，与TFE无机膜发生生成K 2SiO 3，并且溶于水溶液中，破坏TFE封装层，导致封装失效，水汽进入显示区后与发光材料发生反应，出现孔黑斑/环，严重影响产品使用寿命。
故，有必要提供一种显示面板及显示装置来改善这一缺陷。
 发明概述
本申请的实施例提供了一种显示面板及显示装置，可以抑制阴极与金属隔断结构的导通电路发生电化学腐蚀，提升显示面板的封装性能，延长可靠性测试时间，提升产品使用寿命。
本申请的实施例提供了一种显示面板，包括开孔区、设置于所述开孔区外围的过渡区以及设置于所述过渡区外围的显示区，所述显示面板还包括：
基板；
堤坝，设置在所述基板上，并位于所述过渡区；
第一金属隔断结构，设置于所述基板上，所述第一金属隔断结构位于所述过渡区，所述第一金属隔断结构设置在所述堤坝远离所述开孔区的一侧，所述第一金属隔断结构靠近所述堤坝的侧面凹设有第一底切结构；
共通层，包括第一共通部和第二共通部，所述第一共通部从所述显示区连续延伸至所述第一金属隔断结构背离所述基板的上表面，所述第二共通部沿远离所述开孔区的方向延伸，且所述第二共通部的远离所述开孔区的一端位于所述第一底切结构内，所述第一共通部与所述第二共通部断开设置；
阴极，包括第一阴极部和第二阴极部，所述第一阴极部设置于所述第一共通部的表面上，所述第二阴极部的一端设置在所述第一底切结构内并设置于所述第二共通部的表面上，所述第一阴极部与所述第二阴极部断开设置。
本申请的实施例还提供了一种显示装置，包括显示面板，所述显示面板包括开孔区、设置于所述开孔区外围的过渡区以及设置于所述过渡区外围的显示区，所述显示面板还包括：
基板；
堤坝，设置在所述基板上，并位于所述过渡区；
第一金属隔断结构，设置于所述基板上，所述第一金属隔断结构位于所述过渡区，所述第一金属隔断结构设置在所述堤坝远离所述开孔区的一侧，所述第一金属隔断结构靠近所述堤坝的侧面凹设有第一底切结构；
共通层，包括第一共通部和第二共通部，所述第一共通部从所述显示区连续延伸至所述第一金属隔断结构背离所述基板的上表面，所述第二共通部沿远离所述开孔区的方向延伸，且所述第二共通部的远离所述开孔区的一端位于所述第一底切结构内，所述第一共通部与所述第二共通部断开设置；
阴极，包括第一阴极部和第二阴极部，所述第一阴极部设置于所述第一共通部的表面上，所述第二阴极部的一端设置在所述第一底切结构内并设置于所述第二共通部的表面上，所述第一阴极部与所述第二阴极部断开设置。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是揭示的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请的实施例提供的显示面板的局部平面示意图；
图2为本申请的实施例提供的第一种显示面板沿图1所示的沿A-A’方向的剖面图；
图3为图2中第一金属隔断结构处的放大示意图；
图4为图2中第二金属隔断结构处的放大示意图；
图5为本申请的实施例提供的第二种显示面板沿图1所示的沿A-A’方向的剖面图；
图6为本申请的实施例提供的第三种显示面板沿图1所示的沿A-A’方向的剖面图；
图7a至图7d为本申请的实施例提供的显示面板的制作方法的流程示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本揭示可用以实施的特定实施例。本揭示所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本揭示，而非用以限制本揭示。在图中，结构相似的单元是用以相同标号表示。
下面结合附图和具体实施例对本揭示做进一步的说明：
本申请的实施例提供了一种显示面板，可以抑制阴极与金属隔断结构的导通电路发生电化学腐蚀，提升显示面板的封装性能，延长可靠性测试时间，提升产品使用寿命。
显示面板，包括开孔区、设置于所述开孔区外围的过渡区以及设置于所述过渡区外围的显示区，所述显示面板还包括：
基板；
堤坝，设置在所述基板上，并位于所述过渡区；
第一金属隔断结构，设置于所述基板上，所述第一金属隔断结构位于所述过渡区，所述第一金属隔断结构设置在所述堤坝远离所述开孔区的一侧，所述第一金属隔断结构靠近所述堤坝的侧面凹设有第一底切结构；
共通层，包括第一共通部和第二共通部，所述第一共通部从所述显示区连续延伸至所述第一金属隔断结构背离所述基板的上表面，所述第二共通部沿远离所述开孔区的方向延伸，且所述第二共通部的远离所述开孔区的一端位于所述第一底切结构内，所述第一共通部与所述第二共通部断开设置；
阴极，包括第一阴极部和第二阴极部，所述第一阴极部设置于所述第一共通部的表面上，所述第二阴极部的一端设置在所述第一底切结构内并设置于所述第二共通部的表面上，所述第一阴极部与所述第二阴极部断开设置。
根据本申请一实施例，所述显示面板还包括高压直流电源信号走线和低压直流电源信号走线，所述第一金属隔断结构与所述高压直流电源信号走线电连接，所述阴极与所述低压直流电源信号走线电连接。
根据本申请一实施例，所述高压直流电源信号走线围绕所述第一金属隔断结构设置，所述高压直流电源信号走线与所述第一金属隔断结构的四周多处搭接。
根据本申请一实施例，所述高压直流电源信号走线为网格状。
根据本申请一实施例，所述高压直流电源信号走线与所述第一金属隔断结构同层设置。
根据本申请一实施例，所述显示面板包括有机绝缘层，所述有机绝缘层至少覆盖所述第一金属隔断结构靠近所述显示区的侧面，所述第一共通部部分设置于所述有机绝缘层的表面上。
根据本申请一实施例，所述有机绝缘层覆盖所述第一金属隔断结构背离所述基板的至少部分表面。
根据本申请一实施例，所述有机绝缘层包括至少一层平坦层和设置于所述平坦层上的像素定义层，所述平坦层和所述像素定义层中的至少一个至少覆盖所述第一金属隔断结构靠近所述显示区的侧面。
根据本申请一实施例，所述显示面板包括第一源漏电极层，有机绝缘层包括第一平坦层，所述第一源漏电极层设置于所述第一平坦层与所述基板之间；
其中，所述第一金属隔断结构与所述第一源漏电极层同层设置。
根据本申请一实施例，所述显示面板包括叠设于所述基板上的第一源漏电极层、第一平坦层、第二源漏电极层和第二平坦层；
其中，所述第一金属隔断结构与所述第二源漏电极层同层设置，所述第一平坦层靠近所述开孔区的边缘位于所述第一金属隔断结构靠近所述显示区的一侧，所述第二平坦层和所述像素定义层中的至少一个至少覆盖所述第一金属隔断结构靠近所述显示区的侧面。
根据本申请一实施例，所述显示面板包括叠设于所述基板上的第一源漏电极层、第一平坦层、第二源漏电极层、第二平坦层、第三源漏电极层和第三平坦层；
其中，所述第一金属隔断结构与所述第三源漏电极层同层设置，所述第一平坦层和所述第二平坦层的靠近所述开孔区的边缘均位于所述第一金属隔断结构靠近所述显示区的一侧，所述第三平坦层和所述像素定义层中的至少一个至少覆盖所述第一金属隔断结构靠近所述显示区的侧面。
根据本申请一实施例，在垂直于所述基板的方向上，所述第一共通部靠近所述第一底切结构的边缘相较于所述第二共通部靠近所述第一底切结构的边缘更远离所述基板，所述第一阴极部靠近所述第一底切结构的边缘相较于所述第二阴极部靠近所述第一底切结构的边缘更远离所述基板。
根据本申请一实施例，所述第一金属隔断结构包括叠设于所述基板上的第一导电层、第二导电层和第三导电层，所述第二导电层靠近所述开孔区的一端内缩于所述第一导电层和所述第三导电层靠近所述开孔区的一端，所述第二导电层靠近所述开孔区的一端与所述第一导电层和所述第三导电层靠近所述开孔区的一端围合形成所述第一底切结构。
根据本申请一实施例，所述第二共通部与所述第一导电层接触，所述第二共通部位于所述第一底切结构内的一端与所述第二导电层断开设置，所述第二阴极部与所述第一导电层接触，所述第二阴极部位于所述第一底切结构内的一端与所述第二导电层断开设置。
根据本申请一实施例，所述显示面板还包括：
至少一个第二金属隔断结构，设置于所述基板上，至少一个所述第二金属隔断结构位于所述堤坝靠近所述开孔区的一侧，所述第二金属隔断结构围绕所述开孔区设置；
其中，所述第二金属隔断结构靠近所述开孔区的侧面和靠近所述堤坝的侧面中的至少一个凹设有第二底切结构，所述第二共通部包括第一共通子部和第二共通子部，所述第一共通子部与所述第二共通子部断开设置，所述第一共通子部设置于所述第二金属隔断结构背离所述基板的表面上，所述第二共通子部设置于所述第二金属隔断结构的相对两侧并置于所述第一底切结构内和所述第二底切结构内，所述第一共通子部与所述第二共通子部断开设置；
所述第二阴极部包括第一阴极子部和第二阴极子部，所述第一阴极子部与所述第二阴极子部断开设置，所述第一阴极子部设置于所述第一共通子部的表面上，所述第二阴极子部设置于所述第二共通子部的表面上，所述第二阴极子部的端部设置于所述第一底切结构内和所述第二底切结构内，所述第一阴极子部与所述第二阴极子部断开设置。
根据本申请一实施例，所述第二金属隔断结构包括叠设于所述基板上的第四导电层、第五导电层和第六导电层，所述第五导电层靠近所述开孔区的一端内缩于所述第四导电层和所述第六导电层靠近所述开孔区的一端，所述第五导电层靠近所述开孔区的一端与所述第四导电层和所述第六导电层靠近所述开孔区的一端围合形成所述第二底切结构；
和/或，所述第五导电层靠近所述堤坝的一端内缩于所述第四导电层和所述第六导电层靠近所述堤坝的一端，所述第五导电层靠近所述堤坝的一端与所述第四导电层和所述第六导电层靠近所述堤坝的一端围合形成所述第二底切结构。
根据本申请一实施例，所述显示面板还包括多个凸台，部分所述凸台设置于所述第一金属隔断结构与所述基板之间，另外部分所述凸台设置于所述第二金属隔断结构与所述基板之间。
根据本申请一实施例，所述显示面板还包括封装层，所述封装层连续设置于所述过渡区和所述显示区，所述封装层覆盖所述共通层、所述阴极、所述第一金属隔断结构、所述第一底切结构、所述第二金属隔断结构以及所述第二底切结构。
根据本申请一实施例，所述共通层包括层叠设置的空穴注入层、空穴传输层、电子传输层以及电子注入层。
本申请实施例的有益效果：本申请的实施例提供了一种显示面板及显示装置，该显示面板包括基板、堤坝、第一金属隔断结构、共通层和阴极，第一金属隔断结构靠近堤坝的侧面凹设有第一底切结构，共通层包括第一共通部和第二共通部，阴极层包括第一阴极部和第二阴极部，利用第一底切结构形成的段差不仅可以将第一共通部和第二共通部隔断开，切断水汽通过共通层侵入至显示区的路径，防止水汽通过共通层侧向入侵显示区，还可以将带电的第一阴极部与第二阴极部隔断开，避免第一阴极部与第一金属隔断结构搭接形成导电通路发生电化学腐蚀，从而可以提升封装性能，增加产品的使用寿命。
结合图1和图2所示，图1为本申请的实施例提供的显示面板的局部平面示意图，图2为本申请的实施例提供的第一种显示面板沿图1所示的沿A-A’方向的剖面图，显示面板包括开孔区A1、设置于开孔区A1外围的过渡区A2以及设置于过渡区A2外围的显示区A3。开孔区A1用于放置摄像组件并为摄像组件提供获取外界光线的路径，过渡区A2作为开孔区A1和显示区A3之间过渡的区域，用于防止外界环境的水汽通过开孔区A1侵入显示区A3，显示区A3主要用于实现画面图像显示的功能，开孔区A1和过渡区A2均不具备图像显示的功能。
开孔区A     1设置有1个透光孔11，透光孔11在显示面板的厚度方向上可以贯穿显示面板，也可以仅穿透显示面板的部分膜层，但并未贯穿显示面板，摄像组件对应设置于透光孔11内或者透光孔下方，摄像组件通过透光孔11获取外界光线。
在其中一个实施例中，透光孔的尺寸和形状与开孔区A1的尺寸和形状相同，开孔区A1的形状为圆形，过渡区A2围绕开孔区A1设置，过渡区A2的形状可以视为封闭的环形，显示区A3围绕过渡区A2设置。
在其他一些实施例中，开孔区A1和透光孔的数量不仅限于上述实施例中的1个，也可以为2个及以上，开孔区A1的形状不仅限于上述实施例中的圆形，也可以为椭圆形、长条形、水滴形或者其他非常规形状，过渡区A2和显示区A3的形状与开孔区A1的形状相适配即可。
结合图1和图2所示，显示面板包括基板1、堤坝7和第一金属隔断结构2，堤坝7设置于基板1上，堤坝7位于过渡区A2且围绕开孔区A1设置，第一金属隔断结构2设置于基板1上，第一金属隔断结构2位于过渡区A2且设置于堤坝7远离开孔区A1的一侧，第一金属隔断结构2围绕开孔区A1设置，第一金属隔断结构2在基板1上的正投影的形状为封闭的环形。
需要说明的是，基板1为阵列基板，基板1包括基底和设置于基底上的无机绝缘层、栅极金属层、有源层和源漏电极金属层等，基底为柔性基底，基底的材料可以是但不限于聚酰亚胺。第一金属隔断结构2设置于基板1上可以指的是第一金属隔断结构2设置于基底的表面上，并且与基底的表面直接接触，也可以指的是第一金属隔断结构2设置于基底的表面上，第一金属隔断结构2与基底的表面之间被无机绝缘层或者其他膜层间隔开。
结合图2和图3所示，图3为图2中第一金属隔断结构处的放大示意图，第一金属隔断结构2靠近开孔区A1的侧面凹设有第一底切结构20，第一底切结构20由第一金属隔断结构2靠近开孔区A1的侧面的中间区域向第一金属隔断结构2内部凹陷形成，第一金属隔断结构2靠近显示区A3的侧面未设置凹槽。
显示面板还包括共通层3，共通层3包括第一共通部31和第二共通部32，第一共通部31从显示区A3连续延伸至第一金属隔断结构2背离基板1的上表面，第二共通部32沿远离开孔区A1的方向延伸，且第二共通部32的远离所述开孔区的一端位于第一底切结构20内，第一共通部31与第二共通部32断开设置，第一共通部31和第二共通部32的膜层结构和材料相同置。
共通层3包括但不限于叠设的空穴注入层、空穴传输层、电子传输层和电子注入层，显示面板还包括多个图案化的发光层6，发光层6设置于空穴传输层与电子传输层之间。空穴注入层、空穴传输层、电子注入层和电子传输层均由整面蒸镀工艺制备而成。由于第一金属隔断结构2靠近开孔区A1的侧面上形成有第一底切结构20，使得第一金属隔断结构2背离基板1的表面与第一金属隔断结构2的底部之间形成段差，在蒸镀形成上述各膜层时，由于共通层3的厚度较薄，无法该段差填平，从而形成第一共通部31和第二共通部32，并使得第一共通部31与第二共通部32在第一金属隔断结构2靠近开孔区A1的侧面处断开连接。在此结构下，外界的水汽通过开孔区A1的透光孔侵入至第二共通部32后，由于第一共通部31与第二共通部32断开连接，水汽无法继续侵入第一共通部31，因此也无法通过第二共通部32进一步侵入至显示区A3，从而可以防止水汽侵入至显示区A3对发光材料造成损坏。
结合图3所示，在垂直于基板1的方向上，第一共通部31靠近第一底切结构20的边缘相较于第二共通部32靠近第一底切结构20的边缘更远离基板1，即第一共通部31靠近第一底切结构20的边缘与第二共通部32靠近第一底切结构20的边缘位于不同高度的水平面上，第一共通部31靠近第一底切结构20的边缘所在的平面与基板1之间的距离大于于第二共通部32靠近第一底切结构20的边缘所在的平面与基板1之间的距离。
结合图2和图3所示，显示面板还包括阴极4，阴极4包括第一阴极部41和第二阴极部42，第一阴极部41设置于第一共通部31的表面上，第一阴极部41与第一共通部31都是从显示区A3连续延伸至第一金属隔断结构2背离基板1的表面，第二阴极部42的一端设置在第一底切结构20内并设置于第二共通部32的表面上，第一阴极部41与第二阴极部42断开设置。在此结构下，利用第一金属隔断结构2将第一阴极部41和第二阴极部42隔断开，并使第一阴极部41仅连续分布于显示区A3至第一金属隔断结构2背离基板1的上表面，可以避免带电的第一阴极部41与第一金属隔断结构2搭接形成导电通路发生电化学腐蚀，从而可以提升封装性能，增加产品的使用寿命。
需要说明的是，阴极4也是采用整面蒸镀工艺制备而成，第一阴极部41与第二阴极部42在第一金属隔断结构2靠近开孔区A1的侧面处断开的原理与上述共通层3的第一共通部31和第二共通部32在该处断开的原理相同，此处不做赘述。
结合图3所示，在垂直于基板1的方向上，第一阴极部41靠近第一底切结构20的边缘相较于第二阴极部42靠近第一底切结构20的边缘更远离基板1，即第一阴极部41靠近第一底切结构20的边缘与第二阴极部42靠近第一底切结构20的边缘位于不同高度的水平面上，第一阴极部41靠近第一底切结构20的边缘所在的平面与基板1之间的距离大于于第二阴极部42靠近第一底切结构20的边缘所在的平面与基板1之间的距离。
在通电的状态下，第一阴极部41的电压为负电压，第一金属隔断结构2的电压为正电压。当第二阴极部42沉积在第一底切结构20内并与第一金属隔断结构2搭接形成导电通路后，由于第一金属隔断结构2的电压为正电压，使得与第一金属隔断结构2搭接的第二阴极部42的电压也为正电压，由于水汽和偏光片中的K +进入面板内部后形成的电解液环境的电压为正电压，第一金属隔断结构2的电压也为正电压，不具备发生电化学腐蚀的电极，因此本申请的实施例可以破坏发生电化学腐蚀的条件，抑制阴极4与第一金属隔断结构2的导电通路发生电化学腐蚀，从而可以提升封装性能，增加产品的使用寿命。
在一些实施例中，如图1所示，显示面板还包括高压直流电源信号走线VDD和低压直流电源信号走线（图中未示出），第一金属隔断结构2与高压直流电源信号走线VDD电连接，阴极4与低压直流电源信号走线电连接。高压直流电源信号走线VDD传输高压直流电源信号，高压直流电源信号为恒定的正电压直流信号，低压直流电源信号走线传输低压直流电源信号，低压直流电源信号为恒定的负电压直流信号。在此结构下，通过将第一金属隔断结构2与高压直流电源信号走线VDD电连接，可以利用高压直流电源信号走线VDD向第一金属隔断结构2输出正电压，以破坏发生电化学腐蚀的条件，抑制阴极4与第一金属隔断结构2的导电通路发生电化学腐蚀。
在其中一个实施例中，如图1所示，第一金属隔断结构2在俯视视角下为封闭的环形走线，高压直流电源信号走线VDD设置于第一金属隔断结构2的外围，并且围绕第一金属隔断结构2设置，高压直流电源信号走线VDD与第一金属隔断结构2的四周多处搭接。通过在第一金属隔断结构2的四周设置多处搭接点将高压直流电源信号走线VDD与第一金属隔断结构2搭接，可以增大直流电源信号走线VDD与第一金属隔断结构2的接触面积，降低高压直流电源信号走线VDD与第一金属隔断结构2的阻抗。
在其中一个实施例中，如图1所示，高压直流电源信号走线VDD为网格状。
在一些实施例中，显示面板包括有机绝缘层5，有机绝缘层5至少覆盖第一金属隔断结构2靠近显示区A3的侧面，第一共通部31部分设置于有机绝缘层5的表面上。
在其中一个实施例中，如图1所示，有机绝缘层5覆盖第一金属隔断结构2靠近显示区A3的侧面，第一共通部31和第一阴极部41均由第一金属隔断结构2背离基板1的表面连续铺设至有机绝缘层5的表面上，有机绝缘层5将第一阴极部41与第一金属隔断结构2绝缘隔开，第一金属隔断结构2靠近开孔区A1的侧面没有设置有机绝缘层进行覆盖。如此可以利用有机绝缘层5对第一金属隔断结构2靠近显示区A3的侧面进行保护，避免在蚀刻形成第一底切结构20时对第一金属隔断结构2靠近显示区A3的侧面同样造成蚀刻，从而可以使第一共通部31和第一阴极部41能够在第一金属隔断结构2背离基板1的表面至显示区A3连续分布，避免第一共通部31和第一阴极部41在第一金属隔断结构2靠近显示区A3的侧面处断开并与第一金属隔断结构2搭接。
在一些实施例中，有机绝缘层5不仅覆盖第一金属隔断结构2靠近显示区A3的侧面，有机绝缘层5还覆盖第一金属隔断结构2背离基板1的至少部分表面。
在其中一个实施例中，如图1所示，有机绝缘层5覆盖第一金属隔断结构2背离基板1的表面靠近显示区A3的部分以及第一金属隔断结构2靠近显示区A3的侧面，通过延长有机绝缘层5的覆盖范围至第一金属隔断结构2背离基板1的表面上，可以确保有机绝缘层5对第一金属隔断结构2靠近显示区A3的侧面进行覆盖，避免第一金属隔断结构2靠近显示区A3的侧面被蚀刻形成段差导致第一共通部31和第一阴极部41在第一金属隔断结构2靠近显示区A3的侧面处断开并与第一金属隔断结构2搭接的情况发生。
在其中一个实施例中，有机绝缘层5不仅覆盖第一金属隔断结构2靠近显示区A3的侧面，有机绝缘层5还完全覆盖第一金属隔断结构2背离基板1的表面。
在一些实施例中，有机绝缘层5包括至少一层平坦层和设置于平坦层上的像素定义层50，平坦层和像素定义层50中的至少一个至少覆盖第一金属隔断结构2靠近显示区A3的侧面。
在其中一个实施例中，如图3所示，有机绝缘层5包括第一平坦层51、像素定义层50，第一平坦层51设置于基板1上，像素定义层50设置于第一平坦层51背离基板1的表面上。第一平坦层51和像素定义层50均由有机绝缘材料制备而成。像素定义层50具有多个像素开口，发光层6设置于像素开口内。第一平坦层51覆盖第一金属隔断结构2靠近显示区A3的部分侧面，像素定义层50覆盖第一金属隔断结构2背离基板1的部分表面，并且还覆盖第一金属隔断结构2靠近显示区A3的未被第一平坦层51覆盖的侧面。
在其中一个实施例中，第一平坦层51靠近开孔区A1的边缘位于第一金属隔断结构2靠近显示区A3的一侧，即第一平坦层51未覆盖第一金属隔断结构2靠近显示区A3的侧面，像素定义层50覆盖第一金属隔断结构2靠近显示区A3的侧面。在此结构的基础上，像素定义层50还可以进一步覆盖第一金属隔断结构2背离基板1的至少部分表面。
在其中一个实施例中，第一平坦层51覆盖第一金属隔断结构2靠近显示区A3的侧面，像素定义层50靠近开孔区A1的边缘位于第一金属隔断结构2靠近显示区A3的一侧，即像素定义层50未覆盖第一金属隔断结构2靠近显示区A3的侧面。在此结构的基础上，第一平坦层51还可以进一步覆盖第一金属隔断结构2背离基板1的至少部分表面。
在其中一个实施例中，如图3所示，显示面板还包括第一源漏电极层SD1，第一源漏电极层SD1设置于第一平坦层51与基板1之间，第一金属隔断结构2与第一源漏电极层SD1同层设置，第一金属隔断结构2的膜层结构以及材料与第一源漏电极层SD1的膜层结构以及材料均相同，即可以利用第一源漏电极层SD1的制程同步制备第一金属隔断结构2。
在其中一个实施例中，高压直流电源信号走线VDD与第一金属隔断结构2同层设置，高压直流电源信号走线VDD的膜层结构以及材料与第一金属隔断结构2的膜层结构以及材料均相同，即可以利用第一源漏电极层SD1的制程同步制备第一金属隔断结构2和高压直流电源信号走线VDD。
在其他一些实施例中，高压直流电源信号走线VDD与第一金属隔断结构2异层设置。例如，高压直流电源信号走线VDD可以设置于栅极金属层，或者当显示面板具有多层源漏电极金属层时，高压直流电源信号走线VDD与第一金属隔断结构2分别与不同的源漏电极金属层同层设置，高压直流电源信号走线VDD与第一金属隔断结构2可以通过绝缘层上的过孔进行电连接。
在一些实施例中，显示面板包括叠设于基板1上的第一源漏电极层SD1、第一平坦层51、第二源漏电极层SD2和第二平坦层52，第一金属隔断结构2与第二源漏电极层SD2同层设置，第一平坦层51靠近开孔区A1的边缘位于第一金属隔断结构2靠近显示区A3的一侧，第二平坦层52和像素定义层50中的至少一个至少覆盖第一金属隔断结构2靠近显示区A3的侧面。
在其中一个实施例中，如图5所示，图5为本申请的实施例提供的第二种显示面板沿图1所示的沿A-A’方向的剖面图，其结构与图2所示的显示面板的结构大致相同，区别在于：有机绝缘层5具有第一平坦层51和第二平坦层52，显示面板具有第一源漏电极层SD1和第二源漏电极层SD2，第一平坦层51覆盖第一源漏电极层SD1，第二源漏电极层SD2设置于第一平坦层51上，第一金属隔断结构2与第二源漏电极层SD2同层设置，第一金属隔断结构2设置于基板1上。第一平坦层51靠近开孔区A1的边缘位于第一金属隔断结构2靠近显示区A3的一侧，第二平坦层52和像素定义层50均覆盖第一金属隔断结构2靠近显示区A3的侧面以及第一金属隔断结构2背离基板1的部分表面。
在其中一个实施例中，第一平坦层51和第二平坦层52靠近开孔区A1的边缘均位于第一金属隔断结构2靠近显示区A3的一侧，像素定义层50覆盖第一金属隔断结构2靠近显示区A3的侧面以及第一金属隔断结构2背离基板1的部分表面。
在其中一个实施例中，第一平坦层51和像素定义层50靠近开孔区A1的边缘均位于第一金属隔断结构2靠近显示区A3的一侧，第二平坦层52覆盖第一金属隔断结构2靠近显示区A3的侧面以及第一金属隔断结构2背离基板1的部分表面。
在其中一个实施例中，当显示面板具有第一源漏电极层SD1和第二源漏电极层SD2时，第一金属隔断结构2也可以与第一源漏电极层SD1同层设置。
在一些实施例中，显示面板包括叠设于基板1上的第一源漏电极层SD1、第一平坦层51、第二源漏电极层SD2、第二平坦层52、第三源漏电极层SD3和第三平坦层53，第一金属隔断结构2与第三源漏电极层SD3同层设置，第一平坦层51和第二平坦层52的靠近开孔区A1的边缘均位于第一金属隔断结构2靠近显示区A3的一侧，第三平坦层53和像素定义层50中的至少一个至少覆盖第一金属隔断结构2靠近显示区A3的侧面。
在其中一个实施例中，如图6所示，图6为本申请的实施例提供的第三种显示面板沿图1所示的沿A-A’方向的剖面图，其结构与图2所示的显示面板的结构大致相同，区别在于：有机绝缘层5具有第一平坦层51、第二平坦层52和第三平坦层53，显示面板具有第一源漏电极层SD1、第二源漏电极层SD2和第三源漏电极层SD3，第一金属隔断结构2与第三源漏电极层SD3同层设置，第一平坦层51和第二平坦层52靠近开孔区A1的边缘均位于第一金属隔断结构2靠近显示区A3的一侧，第三平坦层53和像素定义层50均覆盖第一金属隔断结构2靠近显示区A3的侧面以及第一金属隔断结构2背离基板1的部分表面。
在其中一个实施例中，第一平坦层51、第二平坦层52和第三平坦层53靠近开孔区A1的边缘均位于第一金属隔断结构2靠近显示区A3的一侧，像素定义层50覆盖第一金属隔断结构2靠近显示区A3的侧面以及第一金属隔断结构2背离基板1的部分表面。
在其他一些实施例中，当显示面板具有第一源漏电极层SD1、第二源漏电极层SD2和第三源漏电极层SD3时，第一金属隔断结构2也可以与第二源漏电极层SD2或第一源漏电极层SD1同层设置。
在一些实施例中，如图3所示，第一金属隔断结构2包括叠设于基板1上的第一导电层21、第二导电层22和第三导电层23，第二导电层22设置于第一导电层21与第三导电层23之间，第二导电层22靠近开孔区A1的一端内缩于第一导电层21和第三导电层23靠近开孔区A1的一端。
第二导电层22靠近开孔区A1的一端与第一导电层21和第三导电层23靠近开孔区A1的一端围合形成第一底切结构20，第一底切结构20可以视为形成于第一金属隔断结构靠近开孔区A1的侧面上的凹槽，其中，第二导电层22靠近开孔区A1的侧面作为第一底切结构20的槽底，第一导电层21靠近第三导电层23的表面和第三导电层23靠近第一导电层21的表面可以作为第一底切结构20的槽壁。
第二共通部32与第一导电层21接触，第二共通部32位于第一底切结构20内的一端与第二导电层22断开设置，第二阴极部42与第一导电层21接触，第二阴极部42位于第一底切结构20内的一端与第二导电层22断开设置，如此可以将第一金属隔断结构2的电压传递给第二阴极部42，使第二阴极部42的电压为正，从而可以破坏发生电化学腐蚀的条件，抑制阴极4与第一金属隔断结构2的导电通路发生电化学腐蚀。
在其中一个实施例中，第二导电层22与第一导电层21的材料不同，第一导电层21与第三导电层23的材料相同，第二导电层22的蚀刻速率大于第一导电层21和第三导电层23，如此可以确保在对第一金属隔断结构2进行蚀刻时，第二导电层22的蚀刻程度大于第一导电层21和第三导电层23，以便于形成第一底切结构20。
在其中一个实施例中，第一导电层21和第三导电层23的材料均为钛，第二导电层22的材料为铝。
在一些实施例中，结合图1、图2和图4所示，图4为图2中第二金属隔断结构处的放大示意图，显示面板还包括堤坝7和至少一个第二金属隔断结构8，堤坝7设置于基板1上，堤坝7位于第一金属隔断结构2靠近开孔区A1的一侧，堤坝7围绕开孔区A1设置，堤坝7可以由有机绝缘层5中的至少一层的材料相同，例如堤坝7与像素定义层50的材料的相同，堤坝7可以与像素定义层50采用同一工艺同步制备而成。堤坝7的材料也可以与平坦层的材料相同；或者，堤坝7包括上下至少两个部分，其中一部分平坦层的材料相同，另一部分与像素定义层的材料相同。
第二金属隔断结构8设置于基板1上，至少一个第二金属隔断结构8位于堤坝7靠近开孔区A1的一侧，第二金属隔断结构8围绕开孔区A1设置。
第二金属隔断结构8靠近开孔区A1的侧面和靠近堤坝7的侧面中的至少一个凹设有第二底切结构80，第二共通部32包括第一共通子部321和第二共通子部322，第一共通子部321设置于第二金属隔断结构8的背离基板1的表面上，第二共通子部322设置于第二金属隔断结构8的相对两侧并置于第一底切结构20内和第二底切结构80内，第一共通子部321与第二共通子部322断开连接。
结合图4所示，在垂直于基板1的方向上，第一共通子部321靠近第二底切结构80的边缘相较于第二共通子部322靠近第二底切结构80的边缘更远离基板1，即第一共通子部321靠近第二底切结构80的边缘与第二共通子部322靠近第二底切结构80的边缘位于不同高度的水平面上，第一共通子部321靠近第二底切结构80的边缘所在的平面与基板1之间的距离大于于第二共通子部322靠近第二底切结构80的边缘所在的平面与基板1之间的距离。
第二阴极部42包括第一阴极子部421和第二阴极子部422，第一阴极子部421与第二阴极子部422断开设置，第一阴极子部421设置于第一共通子部321的表面上，第二阴极子部422设置于第二共通子部322的表面上以及第一底切结构20和/或第二底切结构80内。
结合图4所示，在垂直于基板1的方向上，第一阴极子部421靠近第二底切结构80的边缘相较于第二阴极子部422靠近第二底切结构80的边缘更远离基板1，即第一阴极子部421靠近第二底切结构80的边缘与第二阴极子部422靠近第二底切结构80的边缘位于不同高度的水平面上，第一阴极子部421靠近第二底切结构80的边缘所在的平面与基板1之间的距离大于于第二阴极子部422靠近第二底切结构80的边缘所在的平面与基板1之间的距离。
需要说明的是，第一共通子部321和第二共通子部322在第二底切结构80处断开的原理以及第一阴极子部421和第二阴极子部422在第二底切结构80处断开的原理均与前文所述的共通层3的第一共通部31和第二共通部32在该处断开的原理相同，此处不做赘述。
结合图1和图2所示，堤坝7和第二金属隔断结构8在基板1上的正投影的形状均为封闭的环形，如此可以利用第二金属隔断结构8将显示区A3的共通层3和阴极4与过渡区A2的共通层3和阴极4隔断。
在一些实施例中，如图2所示，显示面板具有多个第二金属隔断结构8，第二金属隔断结构8的数量可以为2个、3个或者4个及以上等，多个第二金属隔断结构8间隔设置于堤坝7靠近开孔区A1的一侧。在此结构下，通过在过渡区A2增设多个第二金属隔断结构8，可以将共通层3和阴极4隔断成多个相互断开的部分，进一步降低水汽通过共通层3侵入显示区A3的风险。
需要说明的是，图2示意的第二金属隔断结构8的数量不代表实际应用中第二金属隔断结构8的数量，第二金属隔断结构8的数量可以根据需求进行设置，此处不做限制。
在一些实施例中，显示面板具有多个第二金属隔断结构8，至少一个第二金属隔断结构8设置于堤坝7靠近开孔区A1的一侧，至少一个第二金属隔断结构8设置于堤坝7与第一金属隔断结构2之间。
在其中一个实施例中，堤坝7靠近开孔区A1的一侧以及堤坝7与第一金属隔断结构2之间各设置有一个第二金属隔断结构8。
在其中一个实施例中，堤坝7靠近开孔区A1的一侧设置有6个第二金属隔断结构8，堤坝7与第一金属隔断结构2之间设置有2个第二金属隔断结构8。在实际应用中，堤坝7靠近开孔区A1的一侧以及堤坝7与第一金属隔断结构2之间的第二金属隔断结构8的数量可以根据需求进行设置，此处不做限制。
在一些实施例中，如图4所示，第二金属隔断结构8包括叠设于基板1上的第四导电层81、第五导电层82和第六导电层83，第五导电层82靠近开孔区A1的一端内缩于第四导电层81和第六导电层83靠近开孔区A1的一端，第五导电层82靠近开孔区A1的一端与第四导电层81和第六导电层83靠近开孔区A1的一端围合形成第二底切结构80，第五导电层82靠近堤坝7的一端内缩于第四导电层81和第六导电层83靠近堤坝7的一端，第五导电层82靠近堤坝7的一端与第四导电层81和第六导电层83靠近堤坝7的一端围合形成第二底切结构80。
在其中一个实施例中，第四导电层81和第六导电层83的材料均为钛，第五导电层82的材料为铝。
在其中一个实施例中，第一金属隔断结构2和第二金属隔断结构8同层设置，且第一金属隔断结构2的膜层结构以及材料与第二金属隔断结构8膜层结构以及材料均相同，即可以利用同一制程同步制备第一金属隔断结构2和第二金属隔断结构8。
在其中一个实施例中，显示面板还包括多个凸台9，部分凸台9设置于第一金属隔断结构2与基板1之间，另外部分凸台9设置于第二金属隔断结构8与基板1之间，凸台9可以由缓冲层、栅极绝缘层、层间介质层等无机绝缘层蚀刻而成。通过在第一金属隔断结构2和第二金属隔断结构8的底部增设凸台9，可以增加第一金属隔断结构2以及第二金属隔断结构8的段差，有利于共通层3和阴极4在第一金属隔断结构2和第二金属隔断结构8处断开。
在一些实施例中，显示面板还包括封装层10，封装层10连续设置于过渡区A2和显示区A3，封装层覆盖共通层3、阴极4、第一金属隔断结构2、第一底切结构20、第二金属隔断结构8以及第二底切结构80。
在其中一个实施例中，封装层10为薄膜封装结构，封装层10包括第一无机封装层101、有机封装层103和第二无机封装层102，有机封装层103夹设于第一无机封装层101与第二无机封装层102之间，有机封装层102被堤坝7阻挡于堤坝7靠近显示区A3的一侧，第一无机封装层101和第二无机封装层102均由显示区A3连续分布至过渡区A2与开孔区A1交界处。
依据本申请上述实施例提供的显示面板，本申请的实施例还提供一种显示面板的制作方法，结合图7a至图7d所示，图7a至图7d为本申请的实施例提供的显示面板的制作方法的流程示意图，本申请仅以图2所示的第一种显示面板为例，显示面板的制作方法包括：
步骤S1：在基板1上形成第一金属隔断结构2。
如图7a所示，步骤S1具体包括：在基板1上形成金属层；通过干刻工艺对金属层进行蚀刻，形成第一金属隔断结构2和多个第二金属隔断结构8，第二金属隔断结构8位于第一金属隔断结构2靠近开孔区A1的一侧。金属层可以为源漏电极金属层。当显示面板具有多层源漏电极金属层时，金属层可以为其中任意一层源漏电极金属层。
步骤S2：在第一金属隔断结构2上形成有机绝缘层5。
如图7b所示，步骤S1具体包括：在基板1上沉积有机绝缘材料；通过蚀刻工艺对有机绝缘材料进行蚀刻，形成有机绝缘层5和堤坝7，堤坝7位于第一金属隔断结构2与第二金属隔断结构8之间。有机绝缘层5覆盖第一金属隔断结构2靠近显示区A3的侧面以及第一金属隔断结构2背离基板1的部分表面。
步骤S3：对第一金属隔断结构2和第二金属隔断结构8进行侧刻处理，形成第一底切结构和第二底切结构。
结合图3、图4以及图7b所示，步骤S3中可以通过湿刻工艺对第一金属隔断结构2和第二金属隔断结构8进行侧刻处理，第一金属隔断结构2靠近开孔区A1的侧面未被有机绝缘层5覆盖，因此会在第一金属隔断结构2靠近开孔区A1的侧面形成第一底切结构，第二金属隔断结构靠近开孔区A1的侧面和靠近堤坝7的侧面均形成有第二底切结构。
步骤S4：在基板1上形成共通层3和阴极4。
如图7c所示，由于第一金属隔断结构2和第二金属隔断结构8的侧面均存在段差，共通层3和阴极4在第一金属隔断结构2靠近开孔区A1的侧面以及第二金属隔断结构8靠近开孔区A1的侧面和靠近堤坝7的侧面均会断开，形成不连续的膜层。
步骤S5：在基板1上形成封装层10。
如图7d所示，封装层10连续设置于过渡区A2和显示区A3，封装层覆盖共通层3、阴极4、第一金属隔断结构2、第一底切结构、第二金属隔断结构8以及第二底切结构。
封装层10为薄膜封装结构，封装层10包括第一无机封装层101、有机封装层103和第二无机封装层102，有机封装层103夹设于第一无机封装层101与第二无机封装层102之间，有机封装层102被堤坝7阻挡于堤坝7靠近显示区A3的一侧，第一无机封装层101和第二无机封装层102均由显示区A3连续分布至过渡区A2与开孔区A1交界处。第一无机封装层101和第二无机封装层102可以通过等离子体增强化学气相沉积的方式制备而成，有机封装层可以通过喷墨打印的方式制备而成。
需要说明的是，本实施例仅以图2所示的第一种显示面板为例，其他实施例所述的显示面板的制作方法与上述方法大致相同，此处不做赘述。
依据本申请上述实施例提供的显示面板，本申请的实施例还提供一种显示装置，显示装置包括摄像组件和如上述任意一种实施例提供的显示面板，摄像组件对应设置于显示面板的开孔区。显示装置但不仅限于如智能手机、智能手表、台式电脑、笔记本电脑以及电视等显示设备。
本申请实施例的有益效果：本申请的实施例提供了一种显示面板及显示装置，该显示面板包括基板、第一金属隔断结构、共通层和阴极，第一金属隔断结构靠近开孔区的侧面凹设有第一底切结构，共通层包括第一共通部和第二共通部，阴极层包括第一阴极部和第二阴极部，利用第一底切结构形成的段差不仅可以将第一共通部和第二共通部隔断开，切断水汽通过共通层侵入至显示区的路径，防止水汽通过共通层侧向入侵显示区，还可以将带电的第一阴极部与靠近开孔区且不带电的第二阴极部隔断开，避免带电的第一阴极部与第一金属隔断结构搭接形成导电通路发生电化学腐蚀，从而可以提升封装性能，增加产品的使用寿命。
综上所述，虽然本申请以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为基准。

Claims (20)

  1. 一种显示面板，包括开孔区、设置于所述开孔区外围的过渡区以及设置于所述过渡区外围的显示区，所述显示面板还包括：
    基板；
    堤坝，设置在所述基板上，并位于所述过渡区；
    第一金属隔断结构，设置于所述基板上，所述第一金属隔断结构位于所述过渡区，所述第一金属隔断结构设置在所述堤坝远离所述开孔区的一侧，所述第一金属隔断结构靠近所述堤坝的侧面凹设有第一底切结构；
    共通层，包括第一共通部和第二共通部，所述第一共通部从所述显示区连续延伸至所述第一金属隔断结构背离所述基板的上表面，所述第二共通部沿远离所述开孔区的方向延伸，且所述第二共通部的远离所述开孔区的一端位于所述第一底切结构内，所述第一共通部与所述第二共通部断开设置；
    阴极，包括第一阴极部和第二阴极部，所述第一阴极部设置于所述第一共通部的表面上，所述第二阴极部的一端设置在所述第一底切结构内并设置于所述第二共通部的表面上，所述第一阴极部与所述第二阴极部断开设置。
  2. 如权利要求1所述的显示面板，其中，所述显示面板还包括高压直流电源信号走线和低压直流电源信号走线，所述第一金属隔断结构与所述高压直流电源信号走线电连接，所述阴极与所述低压直流电源信号走线电连接。
  3. 如权利要求2所述的显示面板，其中，所述高压直流电源信号走线围绕所述第一金属隔断结构设置，所述高压直流电源信号走线与所述第一金属隔断结构的四周多处搭接。
  4. 如权利要求3所述的显示面板，其中，所述高压直流电源信号走线为网格状。
  5. 如权利要求2所述的显示面板，其中，所述高压直流电源信号走线与所述第一金属隔断结构同层设置。
  6. 如权利要求1所述的显示面板，其中，所述显示面板包括有机绝缘层5，所述有机绝缘层至少覆盖所述第一金属隔断结构靠近所述显示区的侧面，所述第一共通部部分设置于所述有机绝缘层的表面上。
  7. 如权利要求6所述的显示面板，其中，所述有机绝缘层覆盖所述第一金属隔断结构背离所述基板的至少部分表面。
  8. 如权利要求6所述的显示面板，其中，所述有机绝缘层包括至少一层平坦层和设置于所述平坦层上的像素定义层，所述平坦层和所述像素定义层中的至少一个至少覆盖所述第一金属隔断结构靠近所述显示区的侧面。
  9. 如权利要求8所述的显示面板，其中，所述显示面板包括第一源漏电极层，有机绝缘层包括第一平坦层，所述第一源漏电极层设置于所述第一平坦层与所述基板之间；
    其中，所述第一金属隔断结构与所述第一源漏电极层同层设置。
  10. 如权利要求8所述的显示面板，其中，所述显示面板包括叠设于所述基板上的第一源漏电极层、第一平坦层、第二源漏电极层和第二平坦层；
    其中，所述第一金属隔断结构与所述第二源漏电极层同层设置，所述第一平坦层靠近所述开孔区的边缘位于所述第一金属隔断结构靠近所述显示区的一侧，所述第二平坦层和所述像素定义层中的至少一个至少覆盖所述第一金属隔断结构靠近所述显示区的侧面。
  11. 如权利要求8所述的显示面板，其中，所述显示面板包括叠设于所述基板上的第一源漏电极层、第一平坦层、第二源漏电极层、第二平坦层、第三源漏电极层和第三平坦层；
    其中，所述第一金属隔断结构与所述第三源漏电极层同层设置，所述第一平坦层和所述第二平坦层的靠近所述开孔区的边缘均位于所述第一金属隔断结构靠近所述显示区的一侧，所述第三平坦层和所述像素定义层中的至少一个至少覆盖所述第一金属隔断结构靠近所述显示区的侧面。
  12. 如权利要求1所述的显示面板，其中，在垂直于所述基板的方向上，所述第一共通部靠近所述第一底切结构的边缘相较于所述第二共通部靠近所述第一底切结构的边缘更远离所述基板，所述第一阴极部靠近所述第一底切结构的边缘相较于所述第二阴极部靠近所述第一底切结构的边缘更远离所述基板。
  13. 如权利要求1所述的显示面板，其中，所述第一金属隔断结构包括叠设于所述基板上的第一导电层、第二导电层和第三导电层，所述第二导电层靠近所述开孔区的一端内缩于所述第一导电层和所述第三导电层靠近所述开孔区的一端，所述第二导电层靠近所述开孔区的一端与所述第一导电层和所述第三导电层靠近所述开孔区的一端围合形成所述第一底切结构。
  14. 如权利要求13所述的显示面板，其中，所述第二共通部与所述第一导电层接触，所述第二共通部位于所述第一底切结构内的一端与所述第二导电层断开设置，所述第二阴极部与所述第一导电层接触，所述第二阴极部位于所述第一底切结构内的一端与所述第二导电层断开设置。
  15. 如权利要求1所述的显示面板，其中，所述显示面板还包括：
    至少一个第二金属隔断结构，设置于所述基板上，至少一个所述第二金属隔断结构位于所述堤坝靠近所述开孔区的一侧，所述第二金属隔断结构围绕所述开孔区设置；
    其中，所述第二金属隔断结构靠近所述开孔区的侧面和靠近所述堤坝的侧面中的至少一个凹设有第二底切结构，所述第二共通部包括第一共通子部和第二共通子部，所述第一共通子部设置于所述第二金属隔断结构背离所述基板的表面上，所述第二共通子部设置于所述第二金属隔断结构的相对两侧并置于所述第一底切结构内和所述第二底切结构内，所述第一共通子部与所述第二共通子部断开设置；
    所述第二阴极部包括第一阴极子部和第二阴极子部，所述第一阴极子部设置于所述第一共通子部的表面上，所述第二阴极子部设置于所述第二共通子部的表面上，所述第二阴极子部的端部设置于所述第一底切结构内和所述第二底切结构内，所述第一阴极子部与所述第二阴极子部断开设置。
  16. 如权利要求15所述的显示面板，其中，所述第二金属隔断结构包括叠设于所述基板上的第四导电层、第五导电层和第六导电层，所述第五导电层靠近所述开孔区的一端内缩于所述第四导电层和所述第六导电层靠近所述开孔区的一端，所述第五导电层靠近所述开孔区的一端与所述第四导电层和所述第六导电层靠近所述开孔区的一端围合形成所述第二底切结构；
    和/或，所述第五导电层靠近所述堤坝的一端内缩于所述第四导电层和所述第六导电层靠近所述堤坝的一端，所述第五导电层靠近所述堤坝的一端与所述第四导电层和所述第六导电层靠近所述堤坝的一端围合形成所述第二底切结构。
  17. 如权利要求15所述的显示面板，其中，所述显示面板还包括多个凸台，部分所述凸台设置于所述第一金属隔断结构与所述基板之间，另外部分所述凸台设置于所述第二金属隔断结构与所述基板之间。
  18. 如权利要求15所述的显示面板，其中，所述显示面板还包括封装层，所述封装层连续设置于所述过渡区和所述显示区，所述封装层覆盖所述共通层、所述阴极、所述第一金属隔断结构、所述第一底切结构、所述第二金属隔断结构以及所述第二底切结构。
  19. 如权利要求1所述的显示面板，其中，所述共通层包括层叠设置的空穴注入层、空穴传输层、电子传输层以及电子注入层。
  20. 一种显示装置，包括显示面板，所述显示面板包括开孔区、设置于所述开孔区外围的过渡区以及设置于所述过渡区外围的显示区，所述显示面板还包括：
    基板；
    堤坝，设置在所述基板上，并位于所述过渡区；
    第一金属隔断结构，设置于所述基板上，所述第一金属隔断结构位于所述过渡区，所述第一金属隔断结构设置在所述堤坝远离所述开孔区的一侧，所述第一金属隔断结构靠近所述堤坝的侧面凹设有第一底切结构；
    共通层，包括第一共通部和第二共通部，所述第一共通部从所述显示区连续延伸至所述第一金属隔断结构背离所述基板的上表面，所述第二共通部沿远离所述开孔区的方向延伸，且所述第二共通部的远离所述开孔区的一端位于所述第一底切结构内，所述第一共通部与所述第二共通部断开设置；
    阴极，包括第一阴极部和第二阴极部，所述第一阴极部设置于所述第一共通部的表面上，所述第二阴极部的一端设置在所述第一底切结构内并设置于所述第二共通部的表面上，所述第一阴极部与所述第二阴极部断开设置。
PCT/CN2023/132795 2023-11-16 2023-11-21 显示面板及显示装置 Pending WO2025102406A1 (zh)

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CN119630206B (zh) * 2025-01-08 2026-03-10 武汉华星光电半导体显示技术有限公司 显示面板及显示装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN218160441U (zh) * 2022-06-15 2022-12-27 华为技术有限公司 显示面板、显示屏以及电子设备
CN116156934A (zh) * 2021-11-17 2023-05-23 华为终端有限公司 显示面板及其制作方法、电子设备
CN116916690A (zh) * 2023-07-21 2023-10-20 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN117642025A (zh) * 2023-11-16 2024-03-01 武汉华星光电半导体显示技术有限公司 显示面板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116156934A (zh) * 2021-11-17 2023-05-23 华为终端有限公司 显示面板及其制作方法、电子设备
CN218160441U (zh) * 2022-06-15 2022-12-27 华为技术有限公司 显示面板、显示屏以及电子设备
CN116916690A (zh) * 2023-07-21 2023-10-20 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN117642025A (zh) * 2023-11-16 2024-03-01 武汉华星光电半导体显示技术有限公司 显示面板

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