WO2025007306A1 - Mems麦克风 - Google Patents

Mems麦克风 Download PDF

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Publication number
WO2025007306A1
WO2025007306A1 PCT/CN2023/105942 CN2023105942W WO2025007306A1 WO 2025007306 A1 WO2025007306 A1 WO 2025007306A1 CN 2023105942 W CN2023105942 W CN 2023105942W WO 2025007306 A1 WO2025007306 A1 WO 2025007306A1
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WO
WIPO (PCT)
Prior art keywords
sound hole
substrate
circuit board
mems
hole
Prior art date
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Ceased
Application number
PCT/CN2023/105942
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English (en)
French (fr)
Inventor
陈兴福
陈志远
张堂玉
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AAC Technologies Holdings Shenzhen Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
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Publication date
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Priority to PCT/CN2023/105942 priority Critical patent/WO2025007306A1/zh
Priority to US18/399,742 priority patent/US20250011158A1/en
Publication of WO2025007306A1 publication Critical patent/WO2025007306A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0075—For improving wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0323—Grooves
    • B81B2203/0338—Channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0353—Holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H04R1/083—Special constructions of mouthpieces
    • H04R1/086—Protective screens, e.g. all weather or wind screens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the invention relates to the field of electroacoustic conversion, and in particular to a MEMS microphone.
  • MEMS microphones are MEMS microphones manufactured based on MEMS sensor technology. They have improved noise cancellation performance, good RF performance and electromagnetic interference suppression capabilities, and are widely used in various electronic products such as smart phones, wired headphones, tablets and notebooks.
  • the MEMS microphone of the related technology includes a shell, a substrate connected with the shell cover to form a receiving space, and an ASIC chip and a MEMS chip placed in the receiving space.
  • the MEMS chip is placed on the substrate, and the diaphragm of the MEMS chip divides the receiving space into a front cavity and a rear cavity.
  • a through hole connected to the front cavity is provided on the substrate. After the atmospheric pressure enters from the through hole, it takes a while for the air pressure in the front cavity and the rear cavity to be balanced, so the diaphragm of the MEMS chip is easily damaged.
  • the MEMS microphone has weak anti-blowing ability.
  • the object of the present invention is to provide a MEMS microphone with strong anti-blowing capability.
  • the present invention provides a MEMS microphone, comprising a shell, a substrate connected to the shell to form a receiving space, and an ASIC chip and a MEMS chip placed in the receiving space, the MEMS chip is provided with a diaphragm and a back plate spaced from the diaphragm, the MEMS chip is placed on the substrate, the diaphragm divides the receiving space into a front cavity and a rear cavity, the substrate comprises an upper surface connected to the MEMS chip and a lower surface opposite to the upper surface, the substrate is also provided with a first sound hole extending from the upper surface to the lower surface and not passing through the lower surface, a second sound hole extending from the lower surface to the upper surface and not passing through the upper surface, a connecting channel provided between the upper surface and the lower surface of the substrate and connecting the first sound hole and the second sound hole, and an air hole extending from the upper surface to the lower surface and not passing through the lower surface, the MEMS chip covers the first sound hole
  • the elastic member is connected to the upper surface of the substrate.
  • the elastic member includes a fixing portion connected to the upper surface of the substrate and an elastic portion covering the air hole.
  • the first sound hole and the second sound hole are arranged laterally spaced apart.
  • the projection of the second acoustic hole on the upper surface and the air hole are respectively located on two sides of the MEMS chip.
  • the substrate is a stacked circuit board, which includes a first circuit board connected to the MEMS chip, a second circuit board spaced apart from the first circuit board, and a third circuit board located between the first circuit board and the second circuit board, the third circuit board is a hollow ring structure, the first sound hole and the air hole pass through the first circuit board, and the second sound hole passes through the second circuit board.
  • the diaphragm is closer to the substrate than the back plate.
  • the MEMS microphone of the present invention by providing air holes and elastic members on the substrate, can open the air holes when needed to balance the air pressure in the front and rear cavities in time, thereby buffering the impact of the air pressure on the diaphragm of the MEMS chip.
  • FIG. 1 is a cross-sectional view of a MEMS microphone provided by an embodiment of the present invention.
  • a MEMS microphone 100 includes a housing 10, a substrate 20 that is connected to the housing 10 to form a receiving space 101, and an ASIC chip 40 and a MEMS chip 30 placed in the receiving space 101, wherein the MEMS chip 30 is connected to the substrate 20.
  • the MEMS chip 30 is provided with a diaphragm 31 and a back plate 32 spaced from the diaphragm 31, the diaphragm 31 and the back plate 32 form a capacitor structure, and the diaphragm 31 divides the receiving space 101 into a front cavity 11 and a rear cavity 12.
  • the diaphragm 31 is arranged closer to the substrate than the back plate 32, and in other embodiments, the back plate may be arranged closer to the substrate than the diaphragm.
  • the substrate 20 includes an upper surface 201 connected to the MEMS chip 30 and a lower surface 202 opposite to the upper surface 201.
  • the substrate 30 is also provided with a first sound hole 21 extending from the upper surface 201 to the lower surface 202 and not passing through the lower surface 202, a second sound hole 22 extending from the lower surface 202 to the upper surface 201 and not passing through the upper surface 201, and a connecting channel 23 provided between the upper surface 201 and the lower surface 202 of the substrate 20 and connecting the first sound hole 21 and the second sound hole 22.
  • the MEMS chip 30 covers the first sound hole 21 and the first sound hole 21 is connected to the front cavity 11.
  • the first sound hole 21 and the second sound hole 22 are arranged at intervals laterally, that is, the first sound hole 21 and the second sound hole 22 are staggered, which can prevent external dust from falling on the MEMS chip 30, and can also play a buffering role against the impact of external airflow, thereby improving the reliability of the product.
  • the substrate 20 is further provided with an air hole 24 extending from the upper surface 201 to the lower surface 202 and not passing through the lower surface 202, the air hole 24 is connected to the connecting channel 23 and the rear cavity 12, and the MEMS microphone 100 is further provided with an elastic member 50 covering the air hole 24, and the elastic member 50 can open or close the air hole 24.
  • the elastic member 50 can be opened so that the connecting channel 23 is connected to the rear cavity 12 through the air hole 24 to balance the air pressure of the front and rear cavities in time, so as to reduce the impact of the external airflow on the MEMS chip 30.
  • the air hole 24 and the second sound hole 22 are arranged at intervals in the horizontal direction, that is, the second sound hole 22 and the air hole 24 are arranged staggered, which can reduce the direct impact of the external airflow on the elastic member 50 and increase the life of the elastic member 50.
  • the elastic member 50 is connected to the upper surface 201 of the substrate 20, and includes a fixing portion 51 connected to the upper surface 201 and an elastic portion 52 covering the air vent 24, that is, the fixing portion 51 is a fixed end, and the elastic portion 52 is a free end.
  • the elastic portion 51 is not fixed to the substrate 20, and the fixing portion 51 and the elastic portion 50 are integrally arranged.
  • the elastic member 50 can be elastic silicone or metal foil.
  • the MEMS chip 30 converts the sound signal into an electrical signal
  • the ASIC chip 40 receives the electrical signal from the MEMS chip 30, processes the electrical signal, and outputs it to the outside.
  • the projection of the second sound hole 22 on the upper surface 201 and the air hole 24 are respectively located on both sides of the MEMS chip 30, that is, the first sound hole 21 is closer to the second sound hole 22 than the air hole 24, so that the sound signal can be first picked up by the MEMS chip 30 through the first sound hole 21, preventing the sound signal from directly entering the back cavity 12 from the air hole 24, thereby affecting the reliability of the product.
  • the substrate 20 is a stacked circuit board, which includes a first circuit board 211 connected to the MEMS chip 30, a second circuit board 212 spaced apart from the first circuit board 211, and a third circuit board 213 located between the first circuit board 211 and the second circuit board 212, wherein the third circuit board 213 is a hollow ring structure, the first sound hole 22 and the air hole 24 penetrate the first circuit board 211, and the second sound hole 22 penetrates the second circuit board 212.
  • a cavity may also be directly dug inside the substrate.
  • the MEMS microphone 100 of the present invention by providing the air holes 24 and the elastic member 50 on the substrate 20, can open the air holes 24 when needed to balance the air pressure in the front and rear cavities in time, thereby buffering the impact force of the air pressure on the diaphragm 31 of the MEMS chip 30.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

一种MEMS麦克风（100），包括壳体（10）、与壳体（10）盖接形成收容空间（101）的基板（20）以及置于收容空间（101）中的ASIC芯片（40）和MEMS芯片（30），基板（20）还设有自上表面（201）向下表面（202）延伸且未穿过下表面的第一声孔（21）、自下表面（202）向上表面（201）延伸且未穿过上表面（201）的第二声孔（22）、设于基板（20）的上表面（201）和下表面（202）之间且连通第一声孔（21）和第二声孔（22）的连接通道（23）以及自上表面（201）向下表面（202）延伸且未穿过下表面（202）的透气孔（24），透气孔（24）与第二声孔（22）横向间隔设置，MEMS麦克风（100）还设有覆盖透气孔（24）的弹性件（50），弹性件（50）可打开或关闭透气孔（24）。MEMS麦克风（100）具有较强的抗吹气能力。

Description

MEMS麦克风
【 技术领域】
本发明涉及电声转换领域，尤其涉及一种MEMS麦克风。
【 背景技术】
MEMS（微型机电系统，Microelectro Mechanical Systems） MEMS麦克风是基于MEMS传感器技术制造的MEMS麦克风，具有改进的噪声消除性能、良好的射频性能及电磁干扰抑制能力，被广泛应用于智能手机、线控耳机、平板以及笔记本等各类电子产品中。
相关技术的MEMS麦克风包括壳体、与所述壳体盖接形成收容空间的基板以及置于所述收容空间中的ASIC芯片和MEMS芯片，MEMS芯片置于所述基板，MEMS芯片的振膜将收容空间分为前腔和后腔，基板上设有与前腔连通的通孔，大气压从所述通孔进入后，前腔和后腔的气压需要一段时间才能平衡，因此容易损坏MEMS芯片的振膜，MEMS麦克风的抗吹气能力较弱。
因此，实有必要提供一种新的MEMS麦克风解决上述技术问题。
【 发明内容】
本发明的目的在于提供一种抗吹气能力强的MEMS麦克风。
为了达到上述目的，本发明提供了一种MEMS麦克风，包括壳体、与所述壳体盖接形成收容空间的基板以及置于所述收容空间中的ASIC芯片和MEMS芯片，所述MEMS芯片设有振膜和与所述振膜间隔的背板，所述MEMS芯片置于所述基板，所述振膜将所述收容空间分为前腔和后腔，所述基板包括与所述MEMS芯片连接的上表面和与所述上表面相对的下表面，所述基板还设有自所述上表面向下表面延伸且未穿过下表面的第一声孔、自所述下表面向上表面延伸且未穿过上表面的第二声孔、设于所述基板的上表面和下表面之间且连通所述第一声孔和第二声孔的连接通道以及自所述上表面向下表面延伸且未穿过下表面的透气孔，所述MEMS芯片覆盖所述第一声孔并且所述第一声孔与所述前腔连通，所述透气孔连通所述连接通道和后腔，所述透气孔与所述第二声孔横向间隔设置，所述MEMS麦克风还设有覆盖所述透气孔的弹性件，所述弹性件可打开或关闭所述透气孔。
优选的，所述弹性件与所述基板的上表面连接。
优选的，所述弹性件包括与所述基板的上表面连接的固定部和覆盖所述透气孔的弹性部。
优选的，所述第一声孔和所述第二声孔横向间隔设置。
优选的，所述第二声孔在所述上表面的投影与所述透气孔分别位于所述MEMS芯片的两侧。
优选的，所述基板为层叠的线路板，其包括与所述MEMS芯片连接的第一线路板、与所述第一线路板间隔设置的第二线路板以及位于第一线路板和第二线路板之间的第三线路板，所述第三线路板为中空环状结构，第一声孔和透气孔贯穿所述第一线路板，所述第二声孔贯穿所述第二线路板。
优选的，所述振膜比所述背板更靠近所述基板。
与相关技术相比，本发明的MEMS麦克风，通过在基板上设置透气孔和弹性件，能够在需要时打开透气孔以及时平衡前后腔的气压，从而缓冲气压对MEMS芯片振膜的冲击力。
【 附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本发明实施例提供的MEMS麦克风的剖视图。
【 具体实施方式】   
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参阅图1，一种MEMS麦克风100，包括壳体10、与所述壳体10盖接形成收容空间101的基板20以及置于所述收容空间101中的ASIC芯片40和MEMS芯片30，MEMS芯片30与基板20连接。所述MEMS芯片30设有振膜31和与所述振膜31间隔的背板32，所述振膜31和背板32形成电容结构，并且振膜31将收容空间101分为前腔11和后腔12。在本实施方式中，振膜31设置得比背板32更靠近基板，在其它实施方式中，背板可设置得比振膜更靠近基板。
所述基板20包括与所述MEMS芯片30连接的上表面201和与所述上表面201相对的下表面202，所述基板30还设有自所述上表面201向下表面202延伸且未穿过下表面202的第一声孔21、自所述下表面202向上表面201延伸且未穿过上表面201的第二声孔22以及设于所述基板20的上表面201和下表面202之间且连通所述第一声孔21和第二声孔22的连接通道23，所述MEMS芯片30覆盖所述第一声孔21并且所述第一声孔21与所述前腔11连通，第一声孔21和第二声孔22横向间隔设置，即第一声孔21和第二声孔22错开设置，能够防止外界的粉尘落到MEMS芯片30上，还能对外界的气流冲击起到缓冲作用，提高了产品的可靠性。
在本实施方式中，所述基板20还设有自所述上表面201向下表面202延伸且未穿过下表面202的透气孔24，透气孔24连通所述连接通道23和后腔12，所述MEMS麦克风100还设有覆盖所述透气孔24的弹性件50，所述弹性件50可打开或关闭所述透气孔24。当外界的气流通过第二声孔22和连接通道23时，弹性件50可打开使得连接通道23通过透气孔24与后腔12连通以及时平衡前后腔的气压，以减少外界气流对MEMS芯片30的冲击。另外，所述透气孔24与所述第二声孔22横向间隔设置，即第二声孔22与透气孔24错开设置，可减少外界气流对弹性件50的直接冲击，增加弹性件50的寿命。
另外，弹性件50与基板20的上表面201连接，其包括与上表面201连接的固定部51和覆盖透气孔24的弹性部52，即，固定部51为固定端，弹性部52为自由端，弹性部51未与基板20固定，固定部51和弹性部50为一体设置，弹性件50可为具有弹性的硅胶或金属薄片。
当外界的声音通过第二声孔22进入连接通道23，随后进入第一声孔21到达MEMS芯片30，MEMS芯片30将声音信号转换成电信号，ASIC芯片40接收来自MEMS芯片30发出的电信号，并对该电信号进行处理并对外输出。在本实施方式中，第二声孔22在上表面201的投影与透气孔24分别位于MEMS芯片30的两侧，即第一声孔21较透气孔24更靠近所述第二声孔22，可使得声音信号先通过第一声孔21被MEMS芯片30拾取，防止声音信号直接从透气孔24进入后腔12，从而影响产品的可靠性。
另外，所述基板20为层叠的线路板，其包括与所述MEMS芯片30连接的第一线路板211、与所述第一线路板211间隔设置的第二线路板212以及位于第一线路板211和第二线路板212之间的第三线路板213，所述第三线路板213为中空环状结构，第一声孔22和透气孔24贯穿所述第一线路板211，所述第二声孔22贯穿所述第二线路板212。在其它实施方式中，也可直接在基板的内部挖腔。
本发明的MEMS麦克风100，通过在基板20上设置透气孔24和弹性件50，能够在需要时打开透气孔24以及时平衡前后腔的气压，从而缓冲气压对MEMS芯片30振膜31的冲击力
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (7)

  1. 一种MEMS麦克风，包括壳体、与所述壳体盖接形成收容空间的基板以及置于所述收容空间中的ASIC芯片和MEMS芯片，所述MEMS芯片设有振膜和与所述振膜间隔的背板，所述MEMS芯片置于所述基板，所述振膜将所述收容空间分为前腔和后腔，所述基板包括与所述MEMS芯片连接的上表面和与所述上表面相对的下表面，其特征在于：所述基板还设有自所述上表面向下表面延伸且未穿过下表面的第一声孔、自所述下表面向上表面延伸且未穿过上表面的第二声孔、设于所述基板的上表面和下表面之间且连通所述第一声孔和第二声孔的连接通道以及自所述上表面向下表面延伸且未穿过下表面的透气孔，所述MEMS芯片覆盖所述第一声孔并且所述第一声孔与所述前腔连通，所述透气孔连通所述连接通道和后腔，所述透气孔与所述第二声孔横向间隔设置，所述MEMS麦克风还设有覆盖所述透气孔的弹性件，所述弹性件可打开或关闭所述透气孔。
  2. 根据权利要求1所述的MEMS麦克风，其特征在于，所述弹性件与所述基板的上表面连接。
  3. 根据权利要求1所述的MEMS麦克风，其特征在于，所述弹性件包括与所述基板的上表面连接的固定部和覆盖所述透气孔的弹性部。
  4. 根据权利要求1所述的MEMS麦克风，其特征在于，所述第一声孔和所述第二声孔横向间隔设置。
  5. 根据权利要求1所述的MEMS麦克风，其特征在于，所述第二声孔在所述上表面的投影与所述透气孔分别位于所述MEMS芯片的两侧。
  6. 根据权利要求1所述的MEMS麦克风，其特征在于，所述基板为层叠的线路板，其包括与所述MEMS芯片连接的第一线路板、与所述第一线路板间隔设置的第二线路板以及位于第一线路板和第二线路板之间的第三线路板，所述第三线路板为中空环状结构，第一声孔和透气孔贯穿所述第一线路板，所述第二声孔贯穿所述第二线路板。
  7. 根据权利要求1所述的MEMS麦克风，其特征在于，所述振膜比所述背板更靠近所述基板。
PCT/CN2023/105942 2023-07-05 2023-07-05 Mems麦克风 Ceased WO2025007306A1 (zh)

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