WO2025002008A1 - 光模块 - Google Patents

光模块 Download PDF

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Publication number
WO2025002008A1
WO2025002008A1 PCT/CN2024/100714 CN2024100714W WO2025002008A1 WO 2025002008 A1 WO2025002008 A1 WO 2025002008A1 CN 2024100714 W CN2024100714 W CN 2024100714W WO 2025002008 A1 WO2025002008 A1 WO 2025002008A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
optical surface
chip
fiber adapter
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/100714
Other languages
English (en)
French (fr)
Inventor
杨思更
刘旭霞
王凤来
何鹏
马晓磊
赵贺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Shandong University
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Shandong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202310790220.8A external-priority patent/CN117111227A/zh
Priority claimed from CN202310791657.3A external-priority patent/CN117170041A/zh
Priority claimed from CN202321691824.9U external-priority patent/CN219997357U/zh
Application filed by Hisense Broadband Multimedia Technology Co Ltd, Shandong University filed Critical Hisense Broadband Multimedia Technology Co Ltd
Publication of WO2025002008A1 publication Critical patent/WO2025002008A1/zh
Priority to US19/344,025 priority Critical patent/US20260029592A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures

Definitions

  • the present disclosure relates to the technical field of optical fiber communication, and in particular to an optical module.
  • optical modules are tools for realizing the mutual conversion of optical and electrical signals. They are one of the key components in optical communication equipment and are at the core of optical communication.
  • packaging forms of optical modules include coaxial (Transistor-Outline, TO) packaging and chip on board (Chip on Board, COB) packaging.
  • the optical transmitting chip and the optical receiving chip are directly mounted on the circuit board, and a lens assembly is arranged above the optical transmitting chip and the optical receiving chip to change the transmission direction of the optical signal transmitted by the optical transmitting chip and the transmission direction of the optical signal to be received by the optical receiving chip through the lens assembly, so as to realize the optical module to transmit and receive optical signals.
  • the optical module provided by the present disclosure includes:
  • a circuit board with a light emitting chip and a light receiving chip arranged on the surface;
  • a lens assembly the bottom of which is connected to the circuit board and covers the light emitting chip and the light receiving chip;
  • the lens assembly comprises a lens assembly body, a first optical fiber adapter and a second optical fiber adapter; the first optical fiber adapter and the second optical fiber adapter are arranged at a first end of the lens assembly body, the first optical fiber adapter is configured to transmit a transmitting optical signal, and the second optical fiber adapter is configured to transmit a receiving optical signal;
  • the distance between the center of the optical transmitting chip and the center of the optical receiving chip in the direction perpendicular to the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter is smaller than the distance between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter;
  • a first optical surface, a second optical surface, a third optical surface and a fourth optical surface are formed on the lens assembly body; the first optical surface faces the first optical fiber adapter, the second optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located above the light emitting chip and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter; the third optical surface faces the second optical fiber adapter, the fourth optical surface faces the third optical surface and the light receiving chip, and the light receiving chip is located below the fourth optical surface and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter.
  • FIG1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure.
  • FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure.
  • FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • FIG4 is an exploded view of an optical module provided according to some embodiments of the present disclosure.
  • FIG5 is a schematic diagram of assembling a lens assembly and a circuit board according to some embodiments of the present disclosure
  • FIG6 is a schematic diagram of a partial structure of a circuit board provided according to some embodiments of the present disclosure.
  • FIG7 is an exploded schematic diagram of a lens assembly and a circuit board according to some embodiments of the present disclosure.
  • FIG8 is a structural schematic diagram 1 of a lens assembly provided according to some embodiments of the present disclosure.
  • FIG9 is a second structural schematic diagram of a lens assembly provided according to some embodiments of the present disclosure.
  • FIG10 is a third structural schematic diagram of a lens assembly provided according to some embodiments of the present disclosure.
  • FIG11 is a fourth structural schematic diagram of a lens assembly provided according to some embodiments of the present disclosure.
  • FIG12 is a cross-sectional view 1 of a lens assembly provided according to some embodiments of the present disclosure.
  • FIG13 is a second cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure.
  • FIG14 is a schematic diagram of a partial structure of a lens assembly body provided according to some embodiments of the present disclosure.
  • FIG15 is a cross-sectional view 1 of a lens assembly in use according to some embodiments of the present disclosure.
  • FIG16 is a second cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure.
  • FIG17 is a first cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure.
  • FIG18 is a second cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure.
  • FIG19 is a cross-sectional view of a lens assembly according to some embodiments of the present disclosure.
  • FIG20 is a cross-sectional view 1 of another lens assembly provided according to some embodiments of the present disclosure.
  • FIG21 is a second cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure.
  • FIG22 is a perspective view of yet another lens assembly provided according to some embodiments of the present disclosure.
  • FIG23 is a second perspective view of yet another lens assembly provided according to some embodiments of the present disclosure.
  • FIG24 is a cross-sectional view 1 of yet another lens assembly provided according to some examples of the present disclosure.
  • FIG25 is a third perspective view of yet another lens assembly provided according to some embodiments of the present disclosure.
  • FIG26 is a partial enlarged view of point O in FIG25;
  • FIG27 is a second cross-sectional view of yet another lens assembly provided according to some embodiments of the present disclosure.
  • FIG28 is a partial enlarged view of point P in FIG27;
  • FIG29 is a third cross-sectional view of yet another lens assembly provided according to some embodiments of the present disclosure.
  • FIG30 is a fourth cross-sectional view of yet another lens assembly provided according to some embodiments of the present disclosure.
  • FIG31 is a fifth cross-sectional view of yet another lens assembly provided according to some embodiments of the present disclosure.
  • FIG32 is a bottom view 1 of yet another lens assembly in use according to some embodiments of the present disclosure.
  • FIG. 33 is a second bottom view of yet another lens assembly in use according to some embodiments of the present disclosure.
  • first and second are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.
  • a feature defined as “first” or “second” may explicitly or implicitly include one or more of the features.
  • plural means two or more.
  • the expressions “coupled” and “connected” and their derivatives may be used.
  • the term “connected” may be used to indicate that two or more components are in direct physical or electrical contact with each other.
  • the term “coupled” may be used to indicate that two or more components are in direct physical or electrical contact.
  • the term “coupled” or “communicatively coupled” may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.
  • At least one of A, B, and C has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • optical communication technology in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission.
  • the light loaded with information is an optical signal.
  • the signals that information processing equipment can recognize and process are electrical signals.
  • Information processing equipment usually includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc.
  • information transmission equipment usually includes optical fibers and optical waveguides.
  • the optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment.
  • at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal;
  • the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal;
  • the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.
  • the information processing device directly connected to the optical module is called the upper computer of the optical module.
  • the optical signal input end or the optical signal output end of the optical module can be called an optical port
  • the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.
  • FIG1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure.
  • the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .
  • One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200.
  • the optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power.
  • the signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby achieving long-distance, low-power loss information transmission.
  • the optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200.
  • the host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.
  • the host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing.
  • the optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.
  • the host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network.
  • the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, which is configured to be connected to a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103.
  • USB Universal Serial Bus
  • One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103.
  • the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal.
  • the second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.
  • the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000.
  • the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.
  • the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.
  • OLT optical line terminal
  • ONT optical network device
  • data center server a data center server
  • FIG2 is a partial structural diagram of a host computer according to some embodiments.
  • the host computer 100 also includes a PCB circuit board 105 arranged in the housing, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector arranged inside the cage 106.
  • the electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200.
  • the heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107.
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100.
  • the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.
  • Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure
  • Figure 4 is an exploded diagram of an optical module provided according to some embodiments of the present disclosure.
  • the optical module 200 includes a shell, a circuit board 300 and a lens assembly 400 disposed in the shell.
  • the housing comprises an upper housing 201 and a lower housing 202 .
  • the upper housing 201 covers the lower housing 202 to form the housing having two openings 203 and 204 .
  • the outer contour of the housing is generally a square body.
  • the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.
  • the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021;
  • the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.
  • the direction of the connection line of the two openings 203 and 204 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200.
  • the opening 203 is located at the end of the optical module 200 (the left end of FIG. 3 ), and the opening 204 is also located at the end of the optical module 200 (the right end of FIG. 3 ).
  • the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200.
  • the opening 203 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port and is inserted into the upper computer (for example, the optical network terminal 100); the opening 204 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical module 200.
  • the upper housing 201 and the lower housing 202 are combined to facilitate the installation of components such as the circuit board 300 and the lens assembly 400 into the housing, and these components are packaged and protected by the upper housing 201 and the lower housing 202.
  • components such as the circuit board 300 and the lens assembly 400
  • it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these components, which is conducive to automated production.
  • the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking component 600 located outside its housing, and the unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.
  • the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit component that matches the cage 106 of the host computer 100.
  • the snap-fit component of the unlocking component 600 fixes the optical module 200 in the cage 106;
  • the snap-fit component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.
  • the circuit board 300 includes circuit traces, electronic components and chips.
  • the electronic components and chips are connected together according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission and grounding.
  • Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET).
  • Chips include, for example, lasers, photodetectors, microcontroller units (MCU), laser driver chips, limiting amplifiers (LA), clock and data recovery (CDR) chips, power management chips, digital signal processing (DSP) chips, etc. Processing, DSP) chip.
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.
  • the circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins.
  • the circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106.
  • the gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in FIG. 4), or can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions where a large number of pins are required.
  • the gold finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc.
  • I2C Inter-Integrated Circuit
  • flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • the lens assembly 400 is connected to the circuit board 300 and covers the light emitting chip and/or the light receiving chip; the lens assembly 400 has a transmission surface and a reflection surface, so as to adjust the transmission direction of the transmitted light signal and/or the received light signal through the combination of the transmission surface and the reflection surface, so that the transmitted light signal generated by the light emitting chip can be output from the optical module, and the light signal input to the optical module can be transmitted to the light receiving chip.
  • the light emitting chip is such as a laser
  • the light receiving chip is such as a photodetector.
  • the lens assembly 400 is not limited to being provided with a light emitting chip and/or a light receiving chip, and a photoelectric monitoring component, a driver chip, etc. can also be provided.
  • the optical module 200 includes a lens assembly 400, and the lens assembly 400 is projected on the optical emitting chip and the optical receiving chip to adjust the transmission direction of the emitted optical signal and the received optical signal.
  • the number of lens assemblies 400 in the optical module 200 is not limited to one, and two lens assemblies 400 may be included, and a light emitting chip and/or a light receiving chip are arranged below each lens assembly 400.
  • the lens assembly 400 is disposed at the end of the circuit board 300, such as near the light port; however, some embodiments of the present disclosure are not limited to disposing the lens assembly 400 at the end of the circuit board 300, and the lens assembly 400 can also be disposed in the middle of the circuit board 300.
  • FIG5 is a schematic diagram of an assembly of a lens assembly and a circuit board according to some embodiments of the present disclosure.
  • the lens assembly 400 includes a first fiber adapter 410, a second fiber adapter 420, and a lens assembly body 430.
  • the first fiber adapter 410 is connected to one side of the first end of the lens assembly body 430
  • the second fiber adapter 420 is connected to the other side of the first end of the lens assembly body 430, that is, the first fiber adapter 410 and the second fiber adapter 420 are arranged side by side at the first end of the lens assembly body 430.
  • the first fiber adapter 410 and the second fiber adapter 420 are respectively configured to connect to the optical fiber 101 to transmit the emission optical signal to the optical fiber 101 or to transmit the reception optical signal to the lens assembly body 430.
  • the first fiber adapter 410 is configured to transmit the emission optical signal to the optical fiber 101
  • the second fiber adapter 420 is configured to transmit the reception optical signal to the optical fiber 101.
  • one fiber adapter is arranged on the lens assembly 400, and two lens assemblies 400 are arranged in the optical module 200.
  • the distance between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420 is a preset value, such as the distance L between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420 is 6.25 mm. Even if two lens assemblies 400 are provided in the optical module 200, the distance between the optical axes of the optical fiber adapters on the two lens assemblies 400 should also be a fixed value.
  • FIG6 is a schematic diagram of a partial structure of a circuit board provided according to some embodiments of the present disclosure.
  • a light emitting chip 310 and a light receiving chip 320 are disposed on the top surface of the circuit board 300, the center of the light emitting chip 310 is located on the projection line of the optical axis of the first optical fiber adapter 410 on the top surface of the circuit board 300, and the center of the light receiving chip 320 is located on the projection line of the optical axis of the second optical fiber adapter 420 on the top surface of the circuit board 300, so that the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is a preset value.
  • the center of the light emitting chip 310 mainly refers to the center of the effective light emitting surface
  • the center of the light receiving chip 320 mainly refers to the center of the effective detection surface.
  • the optical transmitter chip 310 and the optical receiver chip 320 need to share a driver chip, and the length of the driver chip is less than the spacing L.
  • the wiring between the optical transmitter chip 310 and the driver chip and the wiring between the optical receiver chip 320 and the driver chip cannot be too long, such as being controlled within 0.1 mm, etc. Therefore, the distance between the center of the optical transmitter chip 310 and the center of the optical receiver chip 320 needs to be less than the spacing L.
  • the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is less than the spacing L.
  • a lens assembly is provided in an embodiment of the present application.
  • FIG7 is a schematic diagram of an exploded view of a lens assembly and a circuit board provided according to some embodiments of the present disclosure.
  • a light emitting chip 310 and a light receiving chip 320 are arranged on the circuit board 300, and the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is less than the spacing L, and the lens assembly 400 is arranged above the light emitting chip 310 and the light receiving chip 320.
  • the bottom of the lens assembly 400 is connected to the circuit board 300, and the bottom of the lens assembly 400 and the surface of the circuit board 300 form a receiving cavity, and the light emitting chip 310 and the light receiving chip 320 are located in the receiving cavity.
  • the lens assembly 400 can not only adjust the transmission direction of the light emitting chip 310 emitting the light signal and the light receiving chip 320 receiving the light signal, but also protect the light emitting chip 310 and the light receiving chip 320.
  • the optical axis of the first optical fiber adapter 410 is projected on the circuit board 300 as a straight line M
  • the optical axis of the second optical fiber adapter 420 is projected on the circuit board 300 as a straight line N
  • the distance between the straight line M and the straight line N is L
  • the optical emitting chip 310 and the optical receiving chip 320 are located between the straight line M and the straight line N.
  • the center of the optical emitting chip 310 is located on the straight line M or the center of the optical receiving chip 320 is located on the straight line N.
  • a driver chip 330 is further disposed on the circuit board 300.
  • the driver chip 330 is disposed in a receiving cavity formed by the bottom of the lens assembly 400 and the circuit board 300, and the driver chip 330 is located on a side of the light emitting chip 310 and the light receiving chip 320 away from the optical port of the optical module 200.
  • the driver chip 330 is disposed on a side of the light emitting chip 310 and the light receiving chip 320 away from the optical port; the driver chip 330 is electrically connected to the light emitting chip 310 and the light receiving chip 320, respectively, that is, the light emitting chip 310 and the light receiving chip 320 share the driver chip 330.
  • two driver chips are disposed on the circuit board, one driver chip is wired to the light emitting chip 310, and the other driver chip is wired to the light receiving chip 320.
  • FIG. 8 is a structural schematic diagram of a lens assembly according to some embodiments of the present disclosure
  • FIG. 9 is a structural schematic diagram of a lens assembly according to some embodiments of the present disclosure
  • the lens assembly 400 includes a first optical fiber adapter 410, a second optical fiber adapter 420, and a lens assembly body 430.
  • the lens assembly body 430 is formed with a plurality of optical surfaces, and the optical surfaces are used to transmit optical signals or reflect optical signals, etc.
  • the first end of the lens assembly body 430 is close to the optical port of the optical module 200, and the second end of the lens assembly body 430 is close to the electrical port of the optical module 200.
  • the lens assembly 400 is a transparent plastic part that is integrally injection molded.
  • the first optical fiber adapter 410 is connected to one side of the first end of the lens assembly body 430, and the second optical fiber adapter 420 is connected to the other side of the first end of the lens assembly body 430, that is, the first optical fiber adapter 410 and the second optical fiber adapter 420 are arranged side by side at the first end of the lens assembly body 430.
  • the first optical fiber adapter 410 and the second optical fiber adapter 420 are hollow structures, and the first optical fiber adapter 410 and the second optical fiber adapter 420 are configured to connect the optical fiber 101 to transmit optical signals.
  • the first optical fiber adapter 410 and the second optical fiber adapter 420 are respectively provided with optical fiber ferrules inside, and the optical fiber ferrules are used to improve the coupling efficiency of the optical signal between the optical fiber 101 and the lens assembly body 430 .
  • a first recess 440 is formed on the top of the lens assembly body 430, and a plurality of optical surfaces are formed at the bottom of the first recess 440.
  • the first recess 440 is formed by the top surface of the lens assembly body 430 being recessed toward the bottom of the lens assembly body 430.
  • the first recess 440 is formed on the lens assembly body 430, and the optical surface is formed at the bottom of the first recess 440, so that the thickness of the position where the optical surface is set on the lens assembly body 430 can be adjusted through the first recess 440, so that the optical surface can be easily processed.
  • a second recess 450 is formed at the bottom of the lens assembly body 430, and the second recess 450 and the surface of the circuit board 300 form a receiving cavity, so that the light emitting chip 310 and the light receiving chip 320 can be conveniently arranged below the lens assembly 400.
  • the second recess 450 is formed by the bottom surface of the lens assembly body 430 being recessed toward the top of the lens assembly body 430.
  • an optical surface is also formed on the top surface of the second recess 450, and the optical surface is mainly used to transmit optical signals, such as focusing optical signals.
  • FIG10 is a third schematic diagram of the structure of a lens assembly according to some embodiments of the present disclosure
  • FIG11 is a fourth schematic diagram of the structure of a lens assembly according to some embodiments of the present disclosure.
  • a first groove 431 is formed on the top of the lens assembly body 430
  • a first optical surface 4311 is formed on the side wall of the first groove 431.
  • the first optical surface 4311 is located in the extension direction of the first optical fiber adapter 410.
  • the first optical surface 4311 is used to reflect the transmitted light signal and change the transmission direction of the transmitted light signal.
  • the projection of the first optical surface 4311 in the extension direction of the first optical fiber adapter 410 covers the end face of the optical fiber ferrule in the first optical fiber adapter 410.
  • the first optical surface 4311 changes the transmission direction of the transmitted optical signal from the A-B direction to the C-D direction.
  • a reflective film is provided on the first optical surface 4311 to improve the reflection efficiency of the first optical surface 4311 for the transmitted optical signal.
  • the A-B direction of the lens assembly 400 is the width direction of the lens assembly 400
  • the C-D direction of the lens assembly 400 is the length direction of the lens assembly 400
  • the E-F direction of the lens assembly 400 is the height direction of the lens assembly 400.
  • the width direction of the lens assembly 400 is parallel to the width direction of the circuit board 300
  • the length direction of the lens assembly 400 is parallel to the length direction of the circuit board 300
  • the height direction of the lens assembly 400 is perpendicular to the top surface of the circuit board 300, so that the first optical surface 4311 changes the transmission direction of the emitted light signal in the width and length directions of the circuit board 300.
  • a second groove 432 is formed at the top of the lens assembly body 430, and the second groove 432 is located between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420; a second optical surface 4321 is formed at the bottom of the second groove 432, and the second optical surface 4321 is used to reflect the transmitted light signal to change the transmission direction of the transmitted light signal.
  • the second optical surface 4321 is located above the light emitting chip 310, and the second optical surface 4321 changes the direction in which the light emitting chip 310 generates the light signal.
  • the projection of the second optical surface 4321 in the direction of the circuit board 300 covers the light emitting chip 310.
  • a reflective film is provided on the second optical surface 4321 to improve the reflection efficiency of the second optical surface 4321.
  • the first optical surface 4311 and the second optical surface 4321 are combined so that the light emitting chip 310 is arranged between the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300. Therefore, even if the center of the light emitting chip 310 is not on the straight line M, the emission light signal generated by the light emitting chip 310 can be transmitted through the first optical fiber adapter 410.
  • a third groove 433 is formed on the top of the lens assembly body 430, and a third optical surface 4331 is formed on the side wall of the third groove 433.
  • the third optical surface 4331 is located in the extension direction of the second optical fiber adapter 420.
  • the third optical surface 4331 is used to reflect the received optical signal and change the transmission direction of the received optical signal.
  • the projection of the third optical surface 4331 in the extension direction of the second optical fiber adapter 420 covers the end face of the optical fiber ferrule in the second optical fiber adapter 420.
  • the third optical surface 4331 changes the transmission direction of the received optical signal from the C-D direction to the A-B direction, that is, the third optical surface 4331 changes the transmission direction of the transmitted optical signal in the length and width directions of the circuit board 300.
  • a reflective film is provided on the third optical surface 4331 to improve the reflection efficiency of the third optical surface 4331 for the received optical signal.
  • a fourth groove 434 is formed on the top of the lens assembly body 430, and the fourth groove 434 is located between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420; a fourth optical surface 4341 is formed on the side wall of the fourth groove 434, and the fourth optical surface 4341 is used to reflect the received optical signal to change the transmission direction of the received optical signal.
  • the fourth optical surface 4341 is located above the optical receiving chip 320, and the fourth optical surface 4341 reflects and transmits the received optical signal to the optical receiving chip 320.
  • the projection of the fourth optical surface 4341 in the direction of the circuit board 300 covers the optical receiving chip 320.
  • a reflective film is provided on the fourth optical surface 4341 to improve the reflection efficiency of the fourth optical surface 4341 to the received optical signal.
  • the third optical surface 4331 and the fourth optical surface 4341 are combined so that the optical receiving chip 320 is disposed between the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300, so that even if the center of the optical receiving chip 320 is not on the straight line N, the received light signal input through the second optical fiber adapter 420 can be transmitted to the optical receiving chip 320.
  • a fifth optical surface 4322 is further formed at the bottom of the second groove 432.
  • the fifth optical surface 4322 can transmit the emitted light signal. It can also reflect the emitted light signal.
  • the emitted light signal transmitted through the fifth optical surface 4322 is transmitted in the direction of the first optical surface 4311, and the light signal reflected through the fifth optical surface 4322 is used for monitoring the emitted light power of the optical module.
  • the second optical surface 4321 and the fifth optical surface 4322 intersect in the second groove 432.
  • a backlight detection chip is provided on the circuit board 300, and the lens assembly 400 is located above the backlight detection chip. The backlight detection chip receives the light signal reflected through the fifth optical surface 4322 to monitor the emitted light power of the optical module.
  • a sixth optical surface 4323 is further formed on the sidewall of the second groove 432 , and the sixth optical surface 4323 is used to transmit the emission light signal transmitted through the fifth optical surface 4322 to transmit it in the direction of the first optical surface 4311 .
  • a first groove 431, a second groove 432, a third groove 433 and a fourth groove 434 on the lens assembly body 430 it is convenient to control the thickness of each position of the lens assembly body 430, so as to facilitate the molding of the corresponding optical surface and make the optical surface easy to process.
  • FIG12 is a cross-sectional view of a lens assembly according to some embodiments of the present disclosure.
  • the first optical fiber adapter 410 is provided with a first through hole 411, and a first optical fiber ferrule 460 is provided in the first through hole 411.
  • the first optical fiber ferrule 460 is used to couple the optical signal from the lens assembly body 430 into the optical fiber 101, thereby improving the coupling efficiency of the transmitted optical signal to the optical fiber 101.
  • a first blind hole 435 is further provided on the lens assembly body 430 , one end of the first blind hole 435 is connected to the first through hole 411 , and a first lens 4351 is provided at the other end of the first blind hole 435 , and the first lens 4351 is used to converge the emission light signal reflected by the first optical surface 4311 to the end face of the first optical fiber ferrule 460 .
  • the end face of the first optical fiber ferrule 460 is an inclined face, and the inclination angle of the end face of the first optical fiber ferrule 460 is 4-7°, which reduces the optical signal reflected by the end face of the first optical fiber ferrule 460 from returning along the transmission optical path of the transmitted optical signal.
  • FIG13 is a second cross-sectional view of a lens assembly according to some embodiments of the present disclosure.
  • the second optical fiber adapter 420 is provided with a second through hole 421, and a second optical fiber ferrule 470 is provided in the second through hole 421.
  • the second optical fiber ferrule 470 is used to couple the optical signal from the optical fiber 101 into the lens assembly body 430, thereby improving the coupling efficiency of the received optical signal to the lens assembly body 430.
  • a second blind hole 436 is further provided on the lens assembly body 430, one end of the second blind hole 436 is connected to the second through hole 421, and a second lens 4361 is provided at the other end of the second blind hole 436, and the second lens 4361 is used to collimate the received light signal output through the end face of the second optical fiber ferrule 470 to the third optical surface 4331.
  • the end face of the second optical fiber ferrule 470 is an inclined surface, and the inclination angle of the end face of the second optical fiber ferrule 470 is 4-7°, which reduces the reception light signal reflected by the third optical surface 4331 and is reflected again by the end face of the second optical fiber ferrule 470 back to the transmission light path of the reception light signal.
  • Fig. 14 is a partial structural diagram of a lens assembly body provided according to some embodiments of the present disclosure
  • Fig. 15 is a cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure.
  • the optical emitting chip 310 and the optical receiving chip 320 are arranged between the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300.
  • a seventh optical surface 451 and an eighth optical surface 452 are provided on the top surface of the second recess 450.
  • the seventh optical surface 451 is located above the light emitting chip 310 and is used to transmit the emission light signal generated by the light emitting chip 310;
  • the eighth optical surface 452 is located above the light receiving chip 320 and is used to transmit the received light signal so that the received light signal is transmitted to the light receiving chip 320.
  • a third lens 4511 is disposed on the seventh optical surface 451 , and the third lens 4511 is used to collimate the emission light signal generated by the light emitting chip 310 .
  • a fourth lens 4521 is disposed on the eighth optical surface 452 , and the fourth lens 4521 is used to converge the received optical signal toward the optical receiving chip 320 .
  • a fifth groove 453 is disposed on the top surface of the second recess 450, and a seventh optical surface 451 and an eighth optical surface 452 are formed on the bottom surface of the fifth groove 453.
  • the fifth groove 453 is used to adjust the relative heights of the seventh optical surface 451 and the eighth optical surface 452, that is, the distance between the seventh optical surface 451 and the light emitting surface of the light emitting chip 310, and the distance between the eighth optical surface 452 and the light receiving surface of the light receiving chip 320.
  • the relative positions of the backlight detection chip, the light emitting chip 310 and the light receiving chip 320 are adjusted by adjusting the positions of the first optical surface 4311, the second optical surface 4321, the fifth optical surface 4322, etc., such as locating the backlight detection chip on the connecting line between the light emitting chip 310 and the light receiving chip 320, locating the backlight detection chip between the light emitting chip 310 and the light receiving chip 320, or locating the backlight detection chip on the side of the light emitting chip 310 away from the light receiving chip 320.
  • a first backlight detection chip 340 is also disposed below the lens assembly body 430, and a ninth optical surface 454 is also formed in the fifth groove 453.
  • the ninth optical surface 454 transmits the light signal and transmits the light signal to the first backlight detection chip 340.
  • the first backlight detection chip 340 receives the light signal for detecting the emission light power of the light emitting chip 310.
  • the first backlight detection chip 340 is located between the light emitting chip 310 and the light receiving chip 320
  • the ninth optical surface 454 is located between the seventh optical surface 451 and the eighth optical surface 452 .
  • a fifth lens 4541 is disposed on the ninth optical surface 454 , and the fifth lens 4541 is used to converge the optical signal.
  • the ninth optical surface 454 is an inclined surface, and a step surface 4324 is formed on the side wall of the second groove 432, and the step surface 4324 is located above the ninth optical surface 454, so that the thickness of the lens assembly body 430 above the ninth optical surface 454 can be adjusted through the step surface 4324 to ensure the formability of the ninth optical surface 454, thereby facilitating the processing of the ninth optical surface 454.
  • FIG16 is a second cross-sectional view of a lens assembly in use according to some embodiments of the present disclosure, and FIG16 shows a transmission optical path of a lens assembly 400.
  • the emission light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511 and transmitted to the second optical surface 4321, and reflected by the second optical surface 4321 and transmitted to the fifth optical surface 4322; the emission light signal transmitted to the fifth optical surface 4322 partially passes through the fifth optical surface 4322 and partially is reflected by the fifth optical surface 4322; the emission light signal transmitted through the fifth optical surface 4322 is transmitted to the sixth optical surface 4323, passes through the sixth optical surface 4323 and passes through the sixth optical surface 4323, and the emission light signal transmitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311, and finally reflected by the first optical surface 4311.
  • the emission light signal reflected by the fifth optical surface 4322 is transmitted to the ninth optical surface 454, and converged by the fifth lens 4541 and transmitted to the first
  • the received optical signal is transmitted to the third optical surface 4331 , reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341 , reflected by the fourth optical surface 4341 and transmitted to the eighth optical surface 452 , and converged by the fourth lens 4521 and transmitted to the optical receiving chip 320 .
  • the inclination angle of the second optical surface 4321 is ⁇ 1
  • the inclination angle of the fifth optical surface 4322 is ⁇ 2
  • the inclination angle of the sixth optical surface 4323 is ⁇ 3
  • the inclination angle of the ninth optical surface 454 is ⁇ 4.
  • the inclination angle ⁇ 1 of the second optical surface 4321, the inclination angle ⁇ 2 of the fifth optical surface 4322, the inclination angle ⁇ 3 of the sixth optical surface 4323, and the inclination angle ⁇ 4 of the ninth optical surface 454 cooperate with each other, and need to refer to the spacing L1 and L2 of the optical surfaces, and the specific values are selected by mutual coordination.
  • the spacing between the first backlight detection chip 340 and the light emitting chip 310 is combined with the inclination angle ⁇ 1 of the second optical surface 4321, the inclination angle ⁇ 2 of the fifth optical surface 4322, and the inclination angle ⁇ 4 of the ninth optical surface 454.
  • the selection of the inclination angle ⁇ 1 of the second optical surface 4321 , the inclination angle ⁇ 2 of the fifth optical surface 4322 , and the inclination angle ⁇ 4 of the ninth optical surface 454 needs to consider the distance between the first backlight detection chip 340 and the light emitting chip 310 .
  • FIG17 is a cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure.
  • a second backlight detection chip 350 is disposed on a side of the light emitting chip 310 away from the light receiving chip 320; a tenth optical surface is formed on the top surface of the second recess 450, and the tenth optical surface is located above the second backlight detection chip 350.
  • the tenth optical surface is used to transmit the light signal and transmit the light signal to the second backlight detection chip 350; the second backlight detection chip 350 receives the light signal to detect the light emission power of the light emitting chip 310.
  • the light signal transmitted to the tenth optical surface is refracted at the tenth optical surface, and the light signal refracted by the tenth optical surface is transmitted to the second backlight detection chip 350.
  • FIG18 is a second cross-sectional view of another lens assembly in use according to some embodiments of the present disclosure.
  • FIG18 shows a transmission light path of another lens assembly 400 .
  • the emission light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511 and transmitted to the second optical surface 4321, reflected by the second optical surface 4321 and transmitted to the fifth optical surface 4322, and transmitted to the sixth optical surface 4323 through the fifth optical surface 4322;
  • the emission light signal transmitted to the sixth optical surface 4323 is partially transmitted through the sixth optical surface 4323 and partially reflected by the sixth optical surface 4323;
  • the emission light signal transmitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311, and finally reflected by the first optical surface 4311;
  • the light signal reflected by the sixth optical surface 4323 is transmitted to the fifth optical surface 4322 and transmitted to the second optical surface 4321 through the fifth optical surface 4322, reflected by the second optical surface 4321 and transmitted to the tenth optical surface,
  • the inclination angle of the tenth optical surface is ⁇ 5.
  • the inclination angle ⁇ 5 of the tenth optical surface needs to be selected in combination with the inclination angle ⁇ 1 of the second optical surface 4321, the inclination angle ⁇ 2 of the fifth optical surface 4322, and the inclination angle ⁇ 3 of the sixth optical surface 4323.
  • the spacing between the second backlight detection chip 350 and the light emitting chip 310 is combined with the inclination angle ⁇ 1 of the second optical surface 4321, the inclination angle ⁇ 2 of the fifth optical surface 4322, and the inclination angle ⁇ 5 of the tenth optical surface.
  • the selection of the inclination angle ⁇ 1 of the second optical surface 4321, the inclination angle ⁇ 2 of the fifth optical surface 4322, and the inclination angle ⁇ 5 of the tenth optical surface needs to consider the spacing between the second backlight detection chip 350 and the light emitting chip 310.
  • FIG19 is a cross-sectional view of a lens assembly provided according to some embodiments of the present disclosure, and FIG19 shows a transmission optical path of a lens assembly 400.
  • the emission light signal passes through the fifth optical surface 4322, is transmitted to the first optical surface 4311, is reflected by the first optical surface 4311 and is transmitted to the first lens 4351, is converged by the first lens 4351 and is transmitted to the first optical fiber ferrule 460 and is transmitted along the extension direction of the first optical fiber ferrule 460.
  • the received optical signal is transmitted to the second lens 4361 through the second optical fiber ferrule 470 , collimated by the second lens 4361 and transmitted to the third optical surface 4331 , and reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341 .
  • FIG. 20 is a cross-sectional view 1 of another lens assembly provided according to some embodiments of the present disclosure
  • FIG. 21 is a cross-sectional view 2 of another lens assembly provided according to some embodiments of the present disclosure.
  • the center of the optical receiving chip 320 is located on the projection of the optical axis of the second optical fiber adapter 420 in the direction of the circuit board 300, and a sixth groove 437 is provided above the optical receiving chip 320, and an eleventh optical surface 4371 is formed in the sixth groove 437, and the eleventh optical surface 4371 is inclined in the direction of the second optical fiber adapter 420.
  • the received optical signal is transmitted to the eleventh optical surface 4371 through the second optical fiber adapter 420; the eleventh optical surface 4371 reflects the received optical signal, and changes the transmission direction of the received optical signal from parallel to the circuit board 300 to perpendicular to the circuit board 300.
  • the eleventh optical surface 4371 is located above the eighth optical surface 452 , and the light receiving chip 320 is located below the fourth lens 4521 .
  • the received light signal reflected by the eleventh optical surface 4371 is transmitted to the fourth lens 4521 , and then converged by the fourth lens 4521 and transmitted to the light receiving chip 320 .
  • the optical emitting chip 310 is moved closer to the position where the optical axis of the second optical fiber adapter 420 is projected on the circuit board 300. That is, compared with the optical emitting chip 310 and the optical receiving chip 320 being located between the projection of the optical axis of the first optical fiber adapter 410 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300, the optical emitting chip 310 moves in the direction of the second optical fiber adapter 420, and then the second optical surface 4321 and the like all move in the same direction.
  • the center of the light emitting chip 310 can also be close to or located at the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 to adaptively adjust the position and combination of the optical surfaces on the lens assembly 400.
  • the distance between the center of the optical transmitting chip 310 and the optical axis of the first optical fiber adapter 410 projected on the circuit board 300 is equal to the distance between the center of the optical receiving chip 320 and the optical axis of the second optical fiber adapter 420 projected on the circuit board 300, so that the optical path length of the optical signal transmitted inside the optical module 200 is similar to the process length of the optical signal received, so as to balance the optical path length of the optical signal transmitted inside the optical module 200 and the optical path length of the optical signal received, and then coordinate the tolerance of the optical path of the transmitted optical signal and the optical path of the received optical signal.
  • the backlight detection chip is not located on the connection line between the light emitting chip 310 and the light receiving chip 320, so as to facilitate the setting of the backlight detection chip, such as reducing the restrictions of the assembly space on the selection of the backlight detection chip.
  • FIG22 is a perspective view of another lens assembly provided according to some embodiments of the present disclosure
  • FIG23 is a perspective view of another lens assembly provided according to some embodiments of the present disclosure
  • FIG24 is a cross-sectional view of another lens assembly provided according to some examples of the present disclosure.
  • the bottom of the second groove 432 forms a second optical surface 4321, a fifth optical surface 4322, and a sixth optical surface 4323, and the second optical surface 4321 and the fifth optical surface 4322 do not intersect in the second groove 432, that is, the intersection of the second optical surface 4321 and the fifth optical surface 4322 is not in the second groove 432.
  • a first plane 4325 is formed in the second groove 432, and the first plane 4325 is perpendicular to the optical axis of the light emitting chip 310.
  • Optical surface 4321 is located on one side of first plane 4325
  • fifth optical surface 4322 is located on the other side of first plane 4325
  • second optical surface 4321 and fifth optical surface 4322 are not symmetrical about the central axis of first plane 4325 .
  • FIG. 25 is a third perspective view of another lens assembly provided according to some embodiments of the present disclosure
  • FIG. 26 is a partial enlarged view of position O in FIG. 25
  • FIG. 27 is a second cross-sectional view of another lens assembly provided according to some embodiments of the present disclosure
  • FIG. 28 is a partial enlarged view of position P in FIG. 27 .
  • a twelfth optical surface 456 is formed on one side of the seventh optical surface 451 close to the front end of the lens assembly 400, and the twelfth optical surface 456 is located below the second optical surface 4321, and the twelfth optical surface 456 is used to refract the transmitted light signal.
  • the twelfth optical surface 456 refracts the light signal used to monitor the light power emitted by the light emitting chip, so that the optical axis of the light signal used to monitor the light power emitted by the light emitting chip deviates from the optical axis of the light emitting chip 310.
  • the twelfth optical surface 456 is formed on the bottom surface of the twelfth optical surface 456.
  • Figure 29 is a third cross-sectional view of yet another lens assembly provided according to some embodiments of the present disclosure
  • Figure 30 is a fourth cross-sectional view of yet another lens assembly provided according to some embodiments of the present disclosure
  • Figure 31 is a fifth cross-sectional view of yet another lens assembly provided according to some embodiments of the present disclosure.
  • Figures 29-31 show the transmission light path of yet another lens assembly 400. As shown in Fig. 29 and Fig.
  • the emission light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511 and transmitted to the second optical surface 4321, and reflected by the second optical surface 4321 and transmitted to the fifth optical surface 4322; the emission light signal transmitted to the fifth optical surface 4322 partially passes through the fifth optical surface 4322 and partially is reflected by the fifth optical surface 4322; the emission light signal transmitted through the fifth optical surface 4322 is transmitted to the sixth optical surface 4323, passes through the sixth optical surface 4323 and passes through the sixth optical surface 4323, and the emission light signal transmitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311, and finally reflected by the first optical surface 4311.
  • the light signal reflected by the fifth optical surface 4322 is transmitted to the second optical surface 4321, reflected by the second optical surface 4321 and transmitted to the twelfth optical surface 456, and transmitted through the twelfth optical surface 456 to the backlight detection chip.
  • the received optical signal is transmitted to the third optical surface 4331 , reflected by the third optical surface 4331 and transmitted to the fourth optical surface 4341 , reflected by the fourth optical surface 4341 and transmitted to the eighth optical surface 452 , and converged by the fourth lens 4521 and transmitted to the optical receiving chip 320 .
  • FIG32 is a bottom view of another lens assembly in use according to some embodiments of the present disclosure.
  • a third backlight detection chip 360 is further provided below the lens assembly 400.
  • the third backlight detection chip 360 is provided on the right side of the light emitting chip 310 and the third backlight detection chip 360 is located below the twelfth optical surface 456.
  • the third backlight detection chip 360 is closer to the optical port of the optical module 200 than the light emitting chip 310.
  • the third backlight detection chip 360 is not located on the line connecting the light emitting chip 310 and the light receiving chip 320, so that the third backlight detection chip 360 is far away from the driver chip 330, effectively avoiding the third backlight detection chip 360 interfering with the layout of the driver chip 330, or effectively avoiding the driver chip 330 interfering with the layout of the third backlight detection chip 360. If the size of the third backlight detection chip 360 is relatively large, the third backlight detection chip 360 is provided on the light emitting chip 310, so as to avoid the assembly interference between the third backlight detection chip 360 and the driver chip 330.
  • FIG33 is a bottom view 2 of another lens assembly in use according to some embodiments of the present disclosure.
  • a fourth backlight detection chip 370 is further provided below the lens assembly 400.
  • the fourth backlight detection chip 370 is provided at the diagonally opposite side of the light emitting chip 310, away from the light receiving chip 320, and the fourth backlight detection chip 370 is located below the twelfth optical surface 456.
  • the fourth backlight detection chip 370 is closer to the optical port of the optical module 200 than the light emitting chip 310.
  • the fourth backlight detection chip 370 is not located on the line connecting the light emitting chip 310 and the light receiving chip 320, so that the fourth backlight detection chip 370 is away from the driving chip 330, effectively avoiding the fourth backlight detection chip 370 interfering with the layout of the driving chip 330, or effectively avoiding the driving chip 330 interfering with the layout of the fourth backlight detection chip 370.
  • the optical emitting chip 310 and the optical receiving chip 320 are arranged between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420 through the lens assembly 400, so that the optical emitting chip 310 and the optical receiving chip 320 can be close to each other, and the optical emitting chip 310 and the optical receiving chip 320 can share the driving chip 330.

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Abstract

一种光模块（200），光模块（200）包括：电路板（300），表面设置有光发射芯片（310）和光接收芯片（320）；透镜组件（400），底部连接电路板（300）并罩射在光发射芯片（310）和光接收芯片（320）上；透镜组件（400）包括透镜组件本体（430）、第一光纤适配器（410）和第二光纤适配器（420）；第一光纤适配器（410）和第二光纤适配器（420）设置在透镜组件本体（430）的第一端，第一光纤适配器（410）被配置为，传输发射光信号，第二光纤适配器（420）被配置为，传输接收光信号；光发射芯片（310）的中心和光接收芯片（320）的中心在第一光纤适配器（410）的光轴线和第二光纤适配器（420）的光轴线垂直方向上的距离，小于第一光纤适配器（410）的光轴线和第二光纤适配器（420）的光轴线的距离；透镜组件本体（430）上形成有第一光学面（4311）、第二光学面（4321）、第三光学面（4331）和第四光学面（4341）。

Description

光模块
本申请要求在2023年6月30日提交中国专利局、申请号为202310790220.8的优先权；在2023年6月30日提交中国专利局、申请号为202310791657.3的优先权；在2023年6月30日提交中国专利局、申请号为202321691824.9的优先权；其全部内容通过引用结合在本申请中。
技术领域
本公开涉及光纤通信技术领域，尤其涉及一种光模块。
背景技术
随着云计算、移动互联网、视频等新型业务和应用模式发展，光通信技术的发展进步变的愈加重要。而在光通信技术中，光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一，处于光通信核心位置。目前光模块的封装形式包括同轴(Transistor-Outline，TO)封装和板上芯片(Chip on Board,COB)封装等。
在COB封装结构的光模块中，光发射芯片和光接收芯片直接贴装设置在电路板上，光发射芯片和光接收芯片的上方设置透镜组件，以通过透镜组件改变光发射芯片发射光信号的传输方向以及光接收芯片待接收光信号的传输方向，实现光模块发射光信号和接收光信号。
发明内容
本公开提供的光模块，包括：
电路板，表面设置有光发射芯片和光接收芯片；
透镜组件，底部连接所述电路板并罩射在所述光发射芯片和所述光接收芯片上；其中：
所述透镜组件包括透镜组件本体、第一光纤适配器和第二光纤适配器；所述第一光纤适配器和所述第二光纤适配器设置在所述透镜组件本体的第一端，所述第一光纤适配器被配置为，传输发射光信号，所述第二光纤适配器被配置为，传输接收光信号；
所述光发射芯片的中心和所述光接收芯片的中心在所述第一光纤适配器的光轴线和所述第二光纤适配器的光轴线垂直方向上的距离，小于所述第一光纤适配器的光轴线和所述第二光纤适配器的光轴线的距离；
所述透镜组件本体上形成有第一光学面、第二光学面、第三光学面和第四光学面；所述第一光学面朝向所述第一光纤适配器，所述第二光学面朝向所述第一光学面和所述光发射芯片，且所述第二光学面位于所述光发射芯片的上方以及位于所述第一光纤适配器的光轴线和所述第二光纤适配器的光轴线之间；所述第三光学面朝向所述第二光纤适配器，所述第四光学面朝向所述第三光学面和所述光接收芯片，且所述光接收芯片位于所述第四光学面的下方以及位于所述第一光纤适配器的光轴线和所述第二光纤适配器的光轴线之间。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为根据本公开一些实施例提供的一种光通信系统的部分结构图；
图2为根据本公开一些实施例提供的一种上位机的局部结构图；
图3为根据本公开一些实施例提供的一种光模块的结构图；
图4为根据本公开一些实施例提供的一种光模块的分解图；
图5为根据本公开一些实施例提供的一种透镜组件与电路板的装配示意图；
图6为根据本公开一些实施例提供的一种电路板的局部结构示意图；
图7为根据本公开一些实施例提供的一种透镜组件与电路板的分解示意图；
图8为根据本公开一些实施例提供的一种透镜组件的结构示意图一；
图9为根据本公开一些实施例提供的一种透镜组件的结构示意图二；
图10为根据本公开一些实施例提供的一种透镜组件的结构示意图三；
图11为根据本公开一些实施例提供的一种透镜组件的结构示意图四；
图12为根据本公开一些实施例提供的一种透镜组件的剖视图一；
图13为根据本公开一些实施例提供的一种透镜组件的剖视图二；
图14为根据本公开一些实施例提供的一种透镜组件本体的局部结构示意图；
图15为根据本公开一些实施例提供的一种透镜组件的使用状态剖视图一；
图16为根据本公开一些实施例提供的一种透镜组件的使用状态剖视图二；
图17为根据本公开一些实施例提供的另一种透镜组件的使用状态剖视图一；
图18为根据本公开一些实施例提供的另一种透镜组件的使用状态剖视图二；
图19为根据本公开一些实施例提供的一种透镜组件的剖视图；
图20为根据本公开一些实施例提供的另一种透镜组件的剖视图一；
图21为根据本公开一些实施例提供的另一种透镜组件的剖视图二；
图22为根据本公开一些实施例提供的再一种透镜组件的立体图一；
图23为根据本公开一些实施例提供的再一种透镜组件的立体图二；
图24为根据本公开一些实例提供的再一种透镜组件的剖视图一；
图25为根据本公开一些实施例提供的再一种透镜组件的立体图三；
图26为图25中O处的局部放大图；
图27为根据本公开一些实施例提供的再一种透镜组件的剖视图二；
图28为图27中P处的局部放大图；
图29为根据本公开一些实施例提供的再一种透镜组件的剖视图三；
图30为根据本公开一些实施例提供的再一种透镜组件的剖视图四；
图31为根据本公开一些实施例提供的再一种透镜组件的剖视图五；
图32为根据本公开一些实施例提供的再一种透镜组件使用状态的仰视图一；
图33为根据本公开一些实施例提供的再一种透镜组件使用状态的仰视图二。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“耦接”和“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。又如，描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接物理接触或电接触。然而，术语“耦接”或“通信耦合(communicatively coupled)”也可能指两个或两个以上部件彼此间并无直接接触，但仍彼此协作或相互作用。这里所公开的实施例并不必然限制于本文内容。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“适用于”或“被配置为”的使用意味着开放和包容性的语言，其不排除适用于或被配置为执行额外任务或步骤的设备。
如本文所使用的那样，“约”、“大致”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
在光通信技术中，为了在信息处理设备之间建立信息传递，需要将信息加载到光上，利用光的传播实现信息的传递。这里，加载有信息的光就是光信号。光信号在信息传输设备中传输时可以减少光功率的损耗，因此可以实现高速度、远距离、低成本的信息传递。信息处理设备能够识别和处理的信号是电信号。信息处理设备通常包括光网络终端(Optical Network Unit，ONU)、网关、路由器、交换机、手机、计算机、服务器、平板电脑、电视机等，信息传输设备通常包括光纤及光波导等。
光模块可以实现信息处理设备与信息传输设备之间的光信号与电信号的相互转换。例如，光模块的光信号输入端或光信号输出端中的至少一个连接有光纤，光模块的电信号输入端或电信号输出端中的至少一个连接有光网络终端；来自光纤的第一光信号传输至光模块，光模块将该第一光信号转换为第一电信号，并将该第一电信号传输至光网络终端；来自光网络终端的第二电信号传输至光模块，光模块将该第二电信号转换为第二光信号，并将该第二光信号传输至光纤。由于多个信息处理设备之间可以通过电信号进行信息传输，因此，需要多个信息处理设备中的至少一个信息处理设备直接与光模块连接，而无需所有的信息处理设备直接与光模块连接。这里，直接连接光模块的信息处理设备被称为光模块的上位机。另外，光模块的光信号输入端或光信号输出端可被称为光口，光模块的电信号输入端或电信号输出端可被称为电口。
图1为根据本公开一些实施例提供的一种光通信系统的部分结构图。如图1所示，光通信系统主要包括远端信息处理设备1000、本地信息处理设备2000、上位机100、光模块200、光纤101以及网线103。
光纤101的一端向远端信息处理设备1000的方向延伸，且光纤101的另一端通过光模块200的光口与光模块200连接。光信号可以在光纤101中全反射，且光信号在全反射方向上的传播几乎可以维持原有光功率，光 信号在光纤101中发生多次的全反射，以将来自远端信息处理设备1000的光信号传输至光模块200中，或将来自光模块200的光信号传输至远端信息处理设备1000，从而实现远距离、低功率损耗的信息传递。
光通信系统可以包括一根或多根光纤101，且光纤101与光模块200可拆卸连接，或固定连接。上位机100被配置为向光模块200提供数据信号，或从光模块200接收数据信号，或对光模块200的工作状态进行监测或控制。
上位机100包括大致呈长方体的壳体(housing)，以及设置在该壳体上的光模块接口102。光模块接口102被配置为接入光模块200，以使上位机100与光模块200建立单向或双向的电信号连接。
上位机100还包括对外电接口，该对外电接口可以接入电信号网络。例如，该对外电接口包括通用串行总线接口(Universal Serial Bus，USB)或网线接口104，网线接口104被配置为接入网线103，以使上位机100与网线103建立单向或双向的电信号连接。网线103的一端连接本地信息处理设备2000，且网线103的另一端连接上位机100，以通过网线103在本地信息处理设备2000与上位机100之间建立电信号连接。例如，本地信息处理设备2000发出的第三电信号通过网线103传入上位机100，上位机100根据该第三电信号生成第二电信号，来自上位机100的该第二电信号传输至光模块200，光模块200将该第二电信号转换为第二光信号，并将该第二光信号传输至光纤101，该第二光信号在光纤101中传输至远端信息处理设备1000。例如，来自远端信息处理设备1000的第一光信号通过光纤101传播，来自光纤101的第一光信号传输至光模块200，光模块200将该第一光信号转换为第一电信号，光模块200将该第一电信号传输至上位机100，上位机100根据该第一电信号生成第四电信号，并将该第四电信号传入本地信息处理设备2000。需要说明的是，光模块是实现光信号与电信号相互转换的工具，在上述光信号与电信号的转换过程中，信息并未发生变化，信息的编码和解码方式可以发生变化。
上位机100除了包括光网络终端之外，还包括光线路终端(Optical Line Terminal，OLT)、光网络设备(Optical Network Terminal，ONT)、或数据中心服务器等。
图2为根据一些实施例的一种上位机的局部结构图。为了清楚地显示光模块200与上位机100的连接关系，图2仅示出了上位机100的与光模块200相关的结构。如图2所示，上位机100还包括设置于壳体内的PCB电路板105、设置在PCB电路板105的表面的笼子106、设置于笼子106上的散热器107、以及设置于笼子106内部的电连接器。该电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起结构。
光模块200插入上位机100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200插入笼子106中后，光模块200的电口与笼子106内部的电连接器连接，从而使光模块200与上位机100建立双向的电信号连接。此外，光模块200的光口与光纤101连接，从而使得光模块200与光纤101建立双向的光信号连接。
图3为根据本公开一些实施例提供的一种光模块的结构图,图4为根据本公开一些实施例提供的一种光模块的分解图。如图3和4所示，光模块200包括壳体(shell)，设置于壳体内的电路板300和透镜组件400。
壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口203和204的上述壳体；壳体的外轮廓一般呈现方形体。
在一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011，盖板2011盖合在下壳体202的两个下侧板2022上，以形成上述壳体。
在一些实施例中，下壳体202包括底板2021以及位于底板2021两侧、与底板2021垂直设置的两个下侧板2022；上壳体201包括盖板2011，以及位于盖板2011两侧、与盖板2011垂直设置的两个上侧板，由两个上侧板与两个下侧板2022结合，以实现上壳体201盖合在下壳体202上。
两个开口203和204的连线所在的方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。例如，开口203位于光模块200的端部(图3的左端)，开口204也位于光模块200的端部(图3的右端)。或者，开口203位于光模块200的端部，而开口204则位于光模块200的侧部。开口203为电口，电路板300的金手指从电口伸出，插入上位机(例如，光网络终端100)中；开口204为光口，被配置为接入光纤101，以使光纤101连接光模块200中。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、透镜组件400等组件安装到壳体中，由上壳体201、下壳体202对这些器件形成封装保护。此外，在装配电路板300、透镜组件400等组件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化地实施生产。
在一些实施例中，上壳体201及下壳体202采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外部的解锁部件600，解锁部件600被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
例如，解锁部件600位于下壳体202的两个下侧板2022的外侧，包括与上位机100的笼子106匹配的卡合部件。当光模块200插入笼子106中时，由解锁部件600的卡合部件将光模块200固定在笼子106中；拉动解锁部件600时，解锁部件600的卡合部件随之移动，从而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的固定，从而可以将光模块200从笼子106中抽出。
电路板300包括电路走线、电子元件及芯片，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如包括激光器、光电探测器、微控制单元(Microcontroller Unit，MCU)、激光驱动芯片、限幅放大器(Limiting Ampl ifier，LA)、时钟数据恢复(Clock and Data Recovery，CDR)芯片、电源管理芯片、数字信号处理(Digital Signal  Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳地承载上述电子元件和芯片；硬性电路板还可以插入上位机100的笼子106中的电连接器中。
电路板300还包括形成在其端部表面的金手指，金手指由相互独立的多个引脚组成。电路板300插入笼子106中，由金手指与笼子106内的电连接器导通。金手指可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以提供更多数量的引脚，从而适应引脚数量需求大的场合。金手指被配置为与上位机建立电连接，以实现供电、接地、二线制同步串行(Inter-Integrated Circuit，I2C)信号传递、数据信号传递等。当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。
在一些实施例中，透镜组件400连接电路板300并罩射在光发射芯片和/或光接收芯片上方；透镜组件400上具有透射面、反射面，以通过透射面和反射面组合调整发射光信号和/或接收光信号的传输方向，使光发射芯片产生的发射光信号能够从光模块输出、以及输入光模块的光信号能够传输至光接收芯片。光发射芯片如激光器，光接收芯片如光电探测器。透镜组件400下方不局限于设置光发射芯片和/或光接收芯片，还可以设置光电监测部件、驱动芯片等。
在一些实施例中，光模块200中包括一个透镜组件400，透镜组件400罩射在光发射芯片和光接收芯片上，用于调整发射光信号和接收光信号的传输方向。当然在一些实施例中，光模块200中透镜组件400的个数不局限于一个，还可以包括两个透镜组件400，每个透镜组件400的下方设置光发射芯片和/或光接收芯片。
在一些实施例中，透镜组件400设置在电路板300的端部，如靠近光口的位置；但本公开一些实施例不局限于将透镜组件400设置在电路板300的端部，还可以将透镜组件400设置在电路板300的中部。
图5为根据本公开一些实施例提供的一种透镜组件与电路板的装配示意图。在一些实施例中，如图5所示，透镜组件400包括第一光纤适配器410、第二光纤适配器420和透镜组件本体430。第一光纤适配器410连接透镜组件本体430的第一端的一侧，第二光纤适配器420连接透镜组件本体430的第一端的另一侧，即第一光纤适配器410和第二光纤适配器420并排设置在透镜组件本体430的第一端。第一光纤适配器410和第二光纤适配器420分别被配置为连接光纤101，以向光纤101传输发射光信号或向透镜组件本体430传输接收光信号。示例性的，第一光纤适配器410被配置为向光纤101传输发射光信号，第二光纤适配器420被配置为向光纤101传输接收光信号。当然在一些实施例中，透镜组件400上设置一个光纤适配器，光模块200内设置两个透镜组件400。
在一些实施例中，第一光纤适配器410的光轴线和第二光纤适配器420的光轴线之间的间距为预设值，如第一光纤适配器410的光轴线和第二光纤适配器420的光轴线之间的间距L为6.25mm。即使光模块200内设置两个透镜组件400，两个透镜组件400上光纤适配器的光轴线之间的距离也应为固定值。
图6为根据本公开一些实施例提供的一种电路板的局部结构示意图。在一些实施例中，如图6所示，电路板300的顶面设置有光发射芯片310和光接收芯片320，光发射芯片310的中心位于第一光纤适配器410的光轴线在电路板300的顶面的投影直线上，光接收芯片320的中心位于第二光纤适配器420的光轴线在电路板300的顶面的投影直线上，使光发射芯片310的中心和光接收芯片320的中心之间的距离为预设值。需要说明的，光发射芯片310的中心主要指有效发光面的中心，光接收芯片320的中心主要指有效探测面的中心。
在一些实施例中，光发射芯片310和光接收芯片320需要共用驱动芯片，且驱动芯片的长度小于间距L，而为了保证信号传输的性能，光发射芯片310与驱动芯片之间打线以及光接收芯片320驱动芯片之间的打线不可过长，如需控制在0.1mm以内等，因此导致光发射芯片310的中心和光接收芯片320的中心之间的距离需要小于间距L。
在一些实施例中，即使光发射芯片310和光接收芯片320不共用驱动芯片，为了方便其他器件的布局设置，也需要缩小光发射芯片310的中心和光接收芯片320的中心之间距离至小于间距L。为了满足光发射芯片310的中心和光接收芯片320的中心之间的距离小于间距L，本申请实施例中提供了一种透镜组件。
图7为根据本公开一些实施例提供的一种透镜组件与电路板的分解示意图。如图7所示，电路板300上设置光发射芯片310和光接收芯片320，光发射芯片310的中心和光接收芯片320中心的距离小于间距L，透镜组件400设置在光发射芯片310和光接收芯片320上方。示例性的，透镜组件400的底部连接电路板300，透镜组件400的底部与电路板300的表面形成容纳腔，光发射芯片310和光接收芯片320位于容纳腔中。透镜组件400不仅能够调整光发射芯片310发射光信号和光接收芯片320接收光信号的传输方向，还能保护光发射芯片310和光接收芯片320。
在一些实施例中，第一光纤适配器410的光轴线在电路板300上投影为直线M，第二光纤适配器420的光轴线在电路板300上的投影为直线N，直线M和直线N的距离为L，光发射芯片310和光接收芯片320位于直线M和直线N之间。当然，在一些实施例中，光发射芯片310的中心位于直线M上或光接收芯片320的中心位于直线N上。
在一些实施例中，电路板300上还设置驱动芯片330，驱动芯片330设置在透镜组件400的底部与电路板300形成的容纳腔中，且驱动芯片330位于光发射芯片310和光接收芯片320远离光模块200的光口的一侧。示例性的，驱动芯片330设置在光发射芯片310和光接收芯片320远离光口的一侧；驱动芯片330分别电连接光发射芯片310和光接收芯片320，即光发射芯片310和光接收芯片320共用驱动芯片330。当然，在一些实施例中，电路板上设置两个驱动芯片，一个驱动芯片打线连接光发射芯片310，另一个驱动芯片打线连接光接收芯片320。
图8为根据本公开一些实施例提供的一种透镜组件的结构示意图一，图9为根据本公开一些实施例提供的 一种透镜组件的结构示意图二。如图8和图9所示，在一些实施例中，透镜组件400包括第一光纤适配器410、第二光纤适配器420和透镜组件本体430。透镜组件本体430上形成有多个光学面，光学面用于透射光信号或反射光信号等。透镜组件本体430的第一端靠近光模块200的光口，透镜组件本体430的第二端靠近光模块200的电口。
在一些实施例中，透镜组件400为透明塑料件，采用一体注塑成型。
第一光纤适配器410连接透镜组件本体430的第一端的一侧，第二光纤适配器420连接透镜组件本体430的第一端的另一侧，即第一光纤适配器410和第二光纤适配器420并排设置在透镜组件本体430的第一端。第一光纤适配器410和第二光纤适配器420为中空结构，第一光纤适配器410和第二光纤适配器420被配置为连接光纤101，以传输光信号。
在一些实施例中，第一光纤适配器410和第二光纤适配器420的内部设置分别设置光纤插芯，光纤插芯用于提高光纤101与透镜组件本体430之间光信号的耦合效率。
如图8所示，在一些实施例中，透镜组件本体430的顶部形成有第一凹陷440，第一凹陷440的底部形成有多个光学面。示例性的，第一凹陷440由透镜组件本体430的顶面向透镜组件本体430的底部方向凹陷形成。透镜组件本体430上形成第一凹陷440，第一凹陷440的底部形成光学面，以便于通过第一凹陷440调整透镜组件本体430上设置光学面的位置处的厚度，使光学面方便加工。
如图9所示，在一些实施例中，透镜组件本体430的底部形成有第二凹陷450，第二凹陷450与电路板300的表面形成容纳腔，使透镜组件400的下方方便设置光发射芯片310和光接收芯片320等。示例性的，第二凹陷450由透镜组件本体430的底面向透镜组件本体430的顶部方向凹陷形成。在一些实施例中，第二凹陷450的顶面上也形成有光学面，该光学面主要用于透过光信号，如汇聚光信号等。
图10为根据本公开一些实施例提供的一种透镜组件的结构示意图三，图11为根据本公开一些实施例提供的一种透镜组件的结构示意图四。如图10和图11所示，透镜组件本体430的顶部形成有第一凹槽431，第一凹槽431的侧壁上形成有第一光学面4311。第一光学面4311位于第一光纤适配器410的延伸方向上。第一光学面4311用于反射发射光信号，改变发射光信号的传输方向。
在一些实施例中，第一光学面4311在第一光纤适配器410的延伸方向的投影覆盖第一光纤适配器410中光纤插芯的端面。示例性的，第一光学面4311将发射光信号的传输方向从A-B方向改变为C-D方向。在一些实施例中，第一光学面4311上设置反射膜，以便提高第一光学面4311对发射光信号的反射效率。
在一些实施例中，透镜组件400的A-B方向为透镜组件400的宽度方向，透镜组件400的C-D方向为透镜组件400的长度方向,透镜组件400的E-F方向为透镜组件400的高度方向。示例性的，透镜组件400的宽度方向与电路板300的宽度方向平行，透镜组件400的长度方向与电路板300的长度方向平行，透镜组件400的高度方向垂直于电路板300的顶面，进而第一光学面4311在电路板300的宽度和长度方向上改变发射光信号的传输方向。
如图10和图11所示，透镜组件本体430的顶部形成有第二凹槽432，第二凹槽432位于第一光纤适配器410的光轴线和第二光纤适配器420的光轴线之间；第二凹槽432的底部形成有第二光学面4321，第二光学面4321用于反射发射光信号，以改变发射光信号的传输方向。第二光学面4321位于光发射芯片310的上方，第二光学面4321改变光发射芯片310产生光信号的方向。在一些实施例中，第二光学面4321在电路板300方向的投影覆盖光发射芯片310。在一些实施例中，第二光学面4321上设置反射膜，以便提高第二光学面4321的反射效率。
在本公开一些实施例中，第一光学面4311和第二光学面4321结合，使光发射芯片310设置在第一光纤适配器410的光轴线在电路板300的投影与第二光纤适配器420的光轴线在电路板300的投影之间，进而即使光发射芯片310的中心不在直线M上，光发射芯片310产生的发射光信号也能够通过第一光纤适配器410传输出去。
如图10和图11所示，透镜组件本体430的顶部形成有第三凹槽433，第三凹槽433的侧壁上形成有第三光学面4331。第三光学面4331位于第二光纤适配器420的延伸方向上。第三光学面4331用于反射接收光信号，改变接收光信号的传输方向。
在一些实施例中，第三光学面4331在第二光纤适配器420的延伸方向的投影覆盖第二光纤适配器420中光纤插芯的端面。示例性的，第三光学面4331将接收光信号的传输方向从C-D方向改变为A-B方向，即第三光学面4331在电路板300的长度和宽度方向上改变发射光信号的传输方向。在一些实施例中，第三光学面4331上设置反射膜，以便提高第三光学面4331对接收光信号的反射效率。
如图10和图11所示，透镜组件本体430的顶部形成有第四凹槽434，第四凹槽434位于第一光纤适配器410的光轴线和第二光纤适配器420的光轴线之间；第四凹槽434的侧壁上形成有第四光学面4341，第四光学面4341用于反射接收光信号，以改变接收光信号的传输方向。第四光学面4341位于光接收芯片320的上方，第四光学面4341将接收光信号反射传输至光接收芯片320。在一些实施例中，第四光学面4341在电路板300方向的投影覆盖光接收芯片320。在一些实施例中，第四光学面4341上设置反射膜，以便提高第四光学面4341对接收光信号的反射效率。
在本公开一些实施例中，第三光学面4331和第四光学面4341结合，使光接收芯片320设置在第一光纤适配器410的光轴线在电路板300的投影与第二光纤适配器420的光轴线在电路板300的投影之间，进而即使光接收芯片320的中心不在直线N上，通过第二光纤适配器420输入的接收光信号也能够传输至光接收芯片320。
在一些实施例中，第二凹槽432的底部还形成有第五光学面4322，第五光学面4322既能透射发射光信号 又能反射发射光信号。经第五光学面4322透射的发射光信号向第一光学面4311所在方向传输，经第五光学面4322反射的光信号用于光模块发射光功率监测。在一些实施例中，第二光学面4321与第五光学面4322在第二凹槽432内相交。示例性的，电路板300上设置背光检测芯片，透镜组件400位于背光检测芯片上方，背光检测芯片接收经第五光学面4322反射的光信号进行光模块发射光功率监测。
在一些实施例中，第二凹槽432的侧壁上还形成有第六光学面4323，第六光学面4323用于透射经第五光学面4322透射的发射光信号，以向第一光学面4311所在方向传输。
在本公开一些实施例中，通过在透镜组件本体430上开设第一凹槽431、第二凹槽432、第三凹槽433和第四凹槽434，便于控制透镜组件本体430各位置的厚度，以便于相应光学面的成型，使光学面便于加工。
图12为根据本公开一些实施例提供的一种透镜组件的剖视图一。如图12所示，第一光纤适配器410设置第一通孔411，第一通孔411内设置第一光纤插芯460。第一光纤插芯460用于光信号从透镜组件本体430耦合进入光纤101，提高发射光信号到光纤101的耦合效率。
在一些实施例中，透镜组件本体430上还设置第一盲孔435，第一盲孔435的一端连通第一通孔411，第一盲孔435的另一端设置第一透镜4351，第一透镜4351用于汇聚经过第一光学面4311反射的发射光信号到第一光纤插芯460的端面。
在一些实施例中，第一光纤插芯460的端面为倾斜面，第一光纤插芯460的端面的倾斜角度为4-7°，减少被第一光纤插芯460的端面反射的光信号沿发射光信号的传输光路返回。
图13为根据本公开一些实施例提供的一种透镜组件的剖视图二。如图13所示，第二光纤适配器420设置第二通孔421，第二通孔421内设置第二光纤插芯470。第二光纤插芯470用于光信号从光纤101耦合进入透镜组件本体430，提高接收光信号到透镜组件本体430的耦合效率。
在一些实施例中，透镜组件本体430上还设置第二盲孔436，第二盲孔436的一端连通第二通孔421，第二盲孔436的另一端设置第二透镜4361，第二透镜4361用于准直经过第二光纤插芯470的端面输出的接收光信号到第三光学面4331。
在一些实施例中，第二光纤插芯470的端面为倾斜面，第二光纤插芯470的端面的倾斜角度为4-7°，减少被第三光学面4331反射的接收光信号再次被第二光纤插芯470的端面反射回接收光信号的传输光路中。
图14为根据本公开一些实施例提供的一种透镜组件本体的局部结构示意图，图15为根据本公开一些实施例提供的一种透镜组件的使用状态剖视图一。光发射芯片310和光接收芯片320设置第一光纤适配器410的光轴线在电路板300上投影和第二光纤适配器420的光轴线在电路板300上的投影之间。
如图14和图15所示，第二凹陷450的顶面上设置第七光学面451和第八光学面452。第七光学面451位于光发射芯片310的上方，第七光学面451用于透射光发射芯片310产生的发射光信号；第八光学面452位于光接收芯片320的上方，第八光学面452用于透射接收光信号，使接收光信号传输至光接收芯片320。
在一些实施例中，第七光学面451上设置第三透镜4511，第三透镜4511用于准直光发射芯片310产生的发射光信号。
在一些实施例中，第八光学面452上设置第四透镜4521，第四透镜4521用于向光接收芯片320汇聚接收光信号。
在一些实施例中，第二凹陷450的顶面上设置第五凹槽453，第五凹槽453的底面上形成第七光学面451和第八光学面452。通过第五凹槽453调整第七光学面451和第八光学面452的相对高度，即第七光学面451与光发射芯片310的光发射面之间的距离、以及第八光学面452与光接收芯片320的光接收面之间的距离。
在一些实施例中，通过调整第一光学面4311、第二光学面4321、第五光学面4322等的位置，以调整背光检测芯片与光发射芯片310、光接收芯片320的相对的位置，如使背光检测芯片位于光发射芯片310和光接收芯片320的连线上，使背光检测芯片位于光发射芯片310和光接收芯片320之间，或使背光检测芯片位于光发射芯片310远离光接收芯片320的一侧。
在一些实施例中，透镜组件本体430的下方还设置有第一背光检测芯片340，第五凹槽453内还形成有第九光学面454，第九光学面454透过光信号并将光信号传输至第一背光检测芯片340，第一背光检测芯片340接收该光信号，以用于检测光发射芯片310的发射光功率。
在一些实例中，第一背光检测芯片340位于光发射芯片310和光接收芯片320之间，第九光学面454位于第七光学面451和第八光学面452之间。
在一些实施例中，第九光学面454上设置第五透镜4541，第五透镜4541用于汇聚光信号。
在一些实施例中，第九光学面454为倾斜面，第二凹槽432的侧壁上形成有台阶面4324，台阶面4324位于第九光学面454的上方，以通过台阶面4324调整第九光学面454上方透镜组件本体430的厚度，保证第九光学面454的成型性，进而便于第九光学面454加工。
图16为根据本公开一些实施例提供的一种透镜组件的使用状态剖视图二，图16示出了一种透镜组件400的传输光路。如图16所示，光发射芯片310产生的发射光信号传输至第三透镜4511，经第三透镜4511准直传输至第二光学面4321，经第二光学面4321反射传输至第五光学面4322；传输至第五光学面4322的发射光信号部分透过第五光学面4322、部分被第五光学面4322反射；透过第五光学面4322的发射光信号传输至第六光学面4323，经过第六光学面4323并透过第六光学面4323，透过第六光学面4323的发射光信号传输至第一光学面4311，最后经第一光学面4311反射。被第五光学面4322反射的发射光信号传输至第九光学面454，经第五透镜4541汇聚传输至第一背光检测芯片340。
如图16所示，接收光信号传输至第三光学面4331，被第三光学面4331反射传输至第四光学面4341，经过第四光学面4341反射传输至第八光学面452，经第四透镜4521汇聚传输至光接收芯片320。
在本公开一些实施例中，以垂直于光发射芯片310的出光面为参考，第二光学面4321的倾斜角度为α1，第五光学面4322的倾斜角度为α2，第六光学面4323的倾斜角度为α3，第九光学面454的倾斜角度为α4。第二光学面4321的倾斜角度α1、第五光学面4322的倾斜角度α2、第六光学面4323的倾斜角度α3和第九光学面454的倾斜角度α4相互配合，且需要参考光学面的间距L1和L2，具体值通过相互协调选择。第一背光检测芯片340与光发射芯片310的间距结合第二光学面4321的倾斜角度α1、第五光学面4322的倾斜角度α2和第九光学面454的倾斜角度α4。相应的，第二光学面4321的倾斜角度α1、第五光学面4322的倾斜角度α2和第九光学面454的倾斜角度α4的选择，需要考虑第一背光检测芯片340与光发射芯片310的间距。
图17为根据本公开一些实施例提供的另一种透镜组件的使用状态剖视图一。如图17所示，在一些实例中，光发射芯片310远离光接收芯片320的一侧设置第二背光检测芯片350；第二凹陷450的顶面上形成有第十光学面，第十光学面位于第二背光检测芯片350的上方。第十光学面用于透射光信号并将光信号传输至第二背光检测芯片350；第二背光检测芯片350接收该光信号，以用于检测光发射芯片310的发射光功率。示例性的，传输至第十光学面的光信号，在第十光学面发生折射，被第十光学面折射的光信号传输至第二背光检测芯片350。
图18为根据本公开一些实施例提供的另一种透镜组件的使用状态剖视图二，图18示出了另一种透镜组件400的传输光路。如图18所示，光发射芯片310产生的发射光信号传输至第三透镜4511，经第三透镜4511准直传输至第二光学面4321，经第二光学面4321反射传输至第五光学面4322、并透过第五光学面4322传输至第六光学面4323；传输至第六光学面4323部分透过第六光学面4323、部分被第六光学面4323反射；透过第六光学面4323的发射光信号传输至第一光学面4311，最后经第一光学面4311反射；被第六光学面4323反射的光信号传输至第五光学面4322并透射第五光学面4322传输至第二光学面4321，经第二光学面4321反射传输至第十光学面，透过第十光学面传输至第二背光检测芯片350。
在本公开一些实施例中，以垂直于光发射芯片310的出光面为参考，第十光学面的倾斜角度为α5。第十光学面的倾斜角度α5需要结合第二光学面4321的倾斜角度α1、第五光学面4322的倾斜角度α2和第六光学面4323的倾斜角度α3选择。第二背光检测芯片350与光发射芯片310的间距结合第二光学面4321的倾斜角度α1、第五光学面4322的倾斜角度α2和第十光学面的倾斜角度α5。相应的，第二光学面4321的倾斜角度α1、第五光学面4322的倾斜角度α2和第十光学面的倾斜角度α5的选择，需要考虑第二背光检测芯片350与光发射芯片310的间距。
图19为根据本公开一些实施例提供的一种透镜组件的剖视图，图19中示出了一种透镜组件400的传输光路。如图19所示，发射光信号透过第五光学面4322、传输至第一光学面4311，经过第一光学面4311反射传输至第一透镜4351，经第一透镜4351汇聚传输至第一光纤插芯460并沿第一光纤插芯460延长方向传输。
如图19所示，接收光信号通过第二光纤插芯470传输至第二透镜4361，经过第二透镜4361准直传输至第三光学面4331，经第三光学面4331反射传输至第四光学面4341。
图20为根据本公开一些实施例提供的另一种透镜组件的剖视图一，图21为根据本公开一些实施例提供的另一种透镜组件的剖视图二。在一些实施例中，如图20和图21所示，光接收芯片320的中心位于第二光纤适配器420的光轴线在电路板300方向的投影上，光接收芯片320的上方设置第六凹槽437，第六凹槽437内形成第十一光学面4371，第十一光学面4371向第二光纤适配器420所在方向倾斜。接收光信号通过第二光纤适配器420传输至第十一光学面4371；第十一光学面4371反射接收光信号，将接收光信号的传输方向从平行与电路板300改变为垂直于电路板300。
在一些实施例中，第十一光学面4371位于第八光学面452上方，光接收芯片320位于第四透镜4521下方，经第十一光学面4371反射的接收光信号传输至第四透镜4521，再经第四透镜4521汇聚传输至光接收芯片320。
为了适应光发射芯片310与光接收芯片320之间距离的要求，光发射芯片310向第二光纤适配器420的光轴线在电路板300上投影所在位置靠近，即相较于光发射芯片310和光接收芯片320位于电路板300上第一光纤适配器410的光轴线的投影和第二光纤适配器420的光轴线的投影之间，光发射芯片310向第二光纤适配器420所在方向移动，进而第二光学面4321等均同向移动。
当然，在本公开实施例中，还可以使光发射芯片310的中心靠近或位于第一光纤适配器410的光轴线在电路板300上投影，适应性调整透镜组件400上光学面的位置以及光学面的组合。
在一些实施例中，光发射芯片310的中心和第一光纤适配器410的光轴线在电路板300上投影的距离与光接收芯片320的中心和第二光纤适配器420的光轴线在电路板300上投影的距离相等，使光模块200内部发射光信号的光程长度与接收光信号的过程长度近似，以便于均衡光模块200内部发射光信号的光程长度与接收光信号的光程长度，进而能够协调发射光信号传输光路和接收光信号传输光路的容差。
在一些实施例中，通过调整第一光学面4311、第二光学面4321、第五光学面4322等的位置，使背光检测芯片不位于光发射芯片310和光接收芯片320的连线上，以有助于背光检测芯片的设置，如减少装配空间对背光检测芯片选择的限制。
图22为根据本公开一些实施例提供的再一种透镜组件的立体图一，图23为根据本公开一些实施例提供的再一种透镜组件的立体图二，图24为根据本公开一些实例提供的再一种透镜组件的剖视图一。在一些实施例中，如图22和图23所示，第二凹槽432的底部形成第二光学面4321、第五光学面4322和第六光学面4323，第二光学面4321与第五光学面4322在第二凹槽432内不相交，即第二光学面4321与第五光学面4322的相交处不在第二凹槽432内。
示例性的，第二凹槽432内形成有第一平面4325，第一平面4325与光发射芯片310的光轴线垂直，第二 光学面4321位于第一平面4325的一侧，第五光学面4322位于第一平面4325的另一侧，且第二光学面4321和第五光学面4322不关于第一平面4325的中轴线对称。
图25为根据本公开一些实施例提供的再一种透镜组件的立体图三，图26为图25中O处的局部放大图，图27为根据本公开一些实施例提供的再一种透镜组件的剖视图二，图28为图27中P处的局部放大图。如图25-图28所示，第七光学面451靠近透镜组件400前端的一侧形成有第十二光学面456，第十二光学面456位于第二光学面4321的下方，第十二光学面456用于折射透过光信号。示例性的，第十二光学面456折射用于监测光发射芯片发射光功率的光信号，使用于监测光发射芯片发射光功率的光信号的光轴偏离光发射芯片310的光轴。在一些实施例中，第十二光学面456的底面上形成第十二光学面456。
图29为根据本公开一些实施例提供的再一种透镜组件的剖视图三，图30为根据本公开一些实施例提供的再一种透镜组件的剖视图四，图31为根据本公开一些实施例提供的再一种透镜组件的剖视图五，图29-图31示出了再一种透镜组件400的传输光路。如图29和图30所示，光发射芯片310产生的发射光信号传输至第三透镜4511，经第三透镜4511准直传输至第二光学面4321，经第二光学面4321反射传输至第五光学面4322；传输至第五光学面4322的发射光信号部分透过第五光学面4322、部分被第五光学面4322反射；透过第五光学面4322的发射光信号传输至第六光学面4323，经过第六光学面4323并透过第六光学面4323，透过第六光学面4323的发射光信号传输至第一光学面4311，最后经第一光学面4311反射。被第五光学面4322反射的光信号传输至第二光学面4321，经第二光学面4321反射传输至第十二光学面456，透过第十二光学面456传输至背光检测芯片。
如图29和图31所示，接收光信号传输至第三光学面4331，被第三光学面4331反射传输至第四光学面4341，经过第四光学面4341反射传输至第八光学面452，经第四透镜4521汇聚传输至光接收芯片320。
图32为根据本公开一些实施例提供的再一种透镜组件使用状态的仰视图一。如图32所示，透镜组件400下方还设置第三背光检测芯片360，第三背光检测芯片360设置在光发射芯片310的右侧且第三背光检测芯片360位于第十二光学面456的下方，第三背光检测芯片360较光发射芯片310更靠近光模块200的光口。第三背光检测芯片360不位于光发射芯片310和光接收芯片320的连线上，使第三背光检测芯片360远离驱动芯片330，有效避免设置第三背光检测芯片360干涉驱动芯片330的布局，或有效避免驱动芯片330干涉第三背光检测芯片360的布局。如当选用第三背光检测芯片360尺寸相对较大些时，将第三背光检测芯片360设置在光发射芯片310，能够避免第三背光检测芯片360和驱动芯片330的装配干涉。
图33为根据本公开一些实施例提供的再一种透镜组件使用状态的仰视图二。如图33所示，在一些实施例中，透镜组件400下方还设置第四背光检测芯片370，第四背光检测芯片370设置在光发射芯片310的斜对角侧、远离光接收芯片320且第四背光检测芯片370位于第十二光学面456的下方，第四背光检测芯片370较光发射芯片310更靠近光模块200的光口。第四背光检测芯片370不位于光发射芯片310和光接收芯片320的连线上，使第四背光检测芯片370远离驱动芯片330，有效避免设置第四背光检测芯片370干涉驱动芯片330的布局，或有效避免驱动芯片330干涉第四背光检测芯片370的布局。
本公开一些实施例提供的光模块中，通过透镜组件400实现将光发射芯片310和光接收芯片320设置在第一光纤适配器410的光轴线和第二光纤适配器420的光轴线之间，使光发射芯片310和光接收芯片320可相互靠近，以及使光发射芯片310和光接收芯片320共用驱动芯片330能够实现。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (15)

  1. 一种光模块，包括：
    电路板，表面设置有光发射芯片和光接收芯片；
    透镜组件，底部连接所述电路板并罩射在所述光发射芯片和所述光接收芯片上；其中：
    所述透镜组件包括透镜组件本体、第一光纤适配器和第二光纤适配器；所述第一光纤适配器和所述第二光纤适配器设置在所述透镜组件本体的第一端，所述第一光纤适配器被配置为，传输发射光信号，所述第二光纤适配器被配置为，传输接收光信号；
    所述光发射芯片的中心和所述光接收芯片的中心在所述第一光纤适配器的光轴线和所述第二光纤适配器的光轴线垂直方向上的距离，小于所述第一光纤适配器的光轴线和所述第二光纤适配器的光轴线的距离；
    所述透镜组件本体上形成有第一光学面、第二光学面、第三光学面和第四光学面；所述第一光学面朝向所述第一光纤适配器，所述第二光学面朝向所述第一光学面和所述光发射芯片，且所述第二光学面位于所述光发射芯片的上方以及位于所述第一光纤适配器的光轴线和所述第二光纤适配器的光轴线之间；所述第三光学面朝向所述第二光纤适配器，所述第四光学面朝向所述第三光学面和所述光接收芯片，且所述光接收芯片位于所述第四光学面的下方以及位于所述第一光纤适配器的光轴线和所述第二光纤适配器的光轴线之间。
  2. 根据权利要求1所述的光模块，其中，所述第一光学面被配置为，改变所述发射光信号在所述电路板宽度和长度方向上的方向，所述第三光学面被配置为，改变所述接收光信号在所述电路板长度和宽度方向上的方向，以将所述光发射芯片产生的发射光信号传输至所述第一光纤适配器、以及将通过所述第二光纤适配器输入的接收光信号传输至所述光接收芯片。
  3. 根据权利要求2所述的光模块，其中，所述透镜组件本体的顶部形成有第一凹陷，所述第一凹陷的底部形成有第一凹槽、第二凹槽、第三凹槽和第四凹槽；
    所述第一凹槽的侧壁上形成所述第一光学面，所述第一光学面被配置为，向所述第一光纤适配器反射发射光信号；所述第二凹槽的底部形成有第二光学面，所述第二光学面向所述第一光学面反射发射光信号；
    所述第三凹槽的侧壁上形成所述第三光学面，所述第三光学面被配置为，反射所述第二光纤适配器输入的光接收信号；所述第四凹槽的侧壁上形成第四光学面，所述第四光学面位于所述第三光学面的反射光路上，并将被所述第三光学面反射的光信号向所述光接收芯片所在方向反射。
  4. 根据权利要求3所述的光模块，其中，所述第二凹槽的底部还形成有第五光学面，所述第二凹槽的侧壁上形成第六光学面，所述第五光学面和所述第六光学面位于所述第二光学面到所述第一光学面的光路上，且透过所述第五光学面的发射光信号传输至所述第六光学面、透射所述第六光学面的光信号传输至所述第一光学面。
  5. 根据权利要求4所述的光模块，其中，所述透镜组件本体的底部形成有第二凹陷，所述第二凹陷的顶面上设置第五凹槽，所述第五凹槽的底部形成有第七光学面和第八光学面，所述第七光学面位于所述光发射芯片的上方且位于所述第二光学面的下方，所述第八光学面位于所述光接收芯片的上方且位于所述第四光学面的下方；
    所述第七光学面上设置第三透镜，所述第三透镜准直所述光发射芯片产生的发射光信号；所述第八光学面上设置第四透镜，所述第四透镜向所述光接收芯片汇聚接收光信号。
  6. 根据权利要求4所述的光模块，其中，所述电路板的表面还设置第一背光检测芯片，所述第一背光检测芯片位于所述光发射芯片和所述光接收芯片之间；
    所述透镜组件本体的底部形成有第九光学面，所述第九光学面位于所述第一背光检测芯片的上方，所述第五光学面被配置为，反射部分发射光信号，被所述第五光学面反射的发射光信号传输至所述第九光学面；
    所述第九光学面上设置第五透镜，所述第五透镜被配置为，向所述第一背光检测芯片汇聚发射光信号。
  7. 根据权利要求4所述的光模块，其中，所述电路板的表面还设置第二背光检测芯片，所述第二背光检测芯片位于所述光发射芯片远离所述光接收芯片的一侧；
    所述透镜组件本体的底部形成有第十光学面，所述第十光学面位于所述第二背光检测芯片的上方；
    所述第六光学面被配置为，反射部分发射光信号，被所述第六光学面反射的发射光信号传输至所述第五光学面并透过所述第五光学面，透过所述第五光学面的光信号传输至所述第二光学面并经所述第二光学面反射传输至所述第十光学面、透过所述第十光学面传输至所述第二背光检测芯片。
  8. 根据权利要求3所述的光模块，其中，所述第一光纤适配器上形成有第一通孔，所述第一通孔内设置第一光纤插芯；所述透镜组件本体上设置有第一盲孔，所述第一盲孔位于所述第一光纤适配器到所述第一光学面的光路上；
    所述第一盲孔的一端连通所述第一通孔，所述第一盲孔的另一端设置第一透镜，所述第一透镜将所述第一光学面发射的光信号汇聚传输至所述第一光纤插芯。
  9. 根据权利要求3所述的光模块，其中，所述第二光纤适配器上形成有第二通孔，所述第二通孔内设置第二光纤插芯；所述透镜组件本体上设置有第二盲孔，所述第二盲孔位于所述第二光纤适配器到所述第三光学面的光路上；
    所述第二盲孔的一端连通所述第二通孔，所述第二盲孔的一端设置第二透镜，所述第二透镜将通过所述第二光纤插芯传输的接收光信号准直传输至所述第三光学面。
  10. 根据权利要求1所述的光模块，其中，所述光发射芯片的中心位于所述第一光纤适配器的光轴线在所述电路板的投影和所述第二光纤适配器的光轴线在所述电路板上的投影之间；所述光接收芯片的中心位于所述 第一光纤适配器的光轴线在所述电路板的投影和所述第二光纤适配器的光轴线在所述电路板上的投影之间。
  11. 根据权利要求5所述的光模块，其中，所述电路板表面设置有背光检测芯片；
    所述透镜组件本体上还形成有第十二光学面；所述第二光学面位于所述第十二光学面的上方，所述第十二光学面位于所述光发射芯片的上方；所述第十二光学面位于所述第七光学面的一侧，且所述第十二光学面位于所述第七光学面靠近所述透镜组件本体连接所述第一光纤适配的一侧；被所述第五光学面反射的发射光信号传输至所述第二光学面、经所述第二光学面反射传输至所述第十二光学面；所述第十二光学面折射光信号至所述背光检测芯片。
  12. 根据权利要求11所述的光模块，其中，所述第二凹槽内还形成有第一平面，所述第二光学面位于所述第一平面的一侧，所述第五光学面位于所述第一平面的另一侧，所述第二光学面和所述第五光学面不关于所述第一平面的中轴线对称。
  13. 根据权利要求11所述的光模块，其中所述第十二光学面形成于所述第二凹陷的顶部。
  14. 根据权利要求11所述的光模块，其中，所述第一凹陷的底部形成第六凹槽，所述第六凹槽内形成第十一光学面；
    所述光接收芯片的中心位于所述第二光纤适配器的光轴线在电路板上的投影上，所述第十一光学面朝向所述第二光纤适配器和所述光接收芯片，且所述第十一光学面位于所述光接收芯片的上方。
  15. 根据权利要求11所述的光模块，其中，所述电路板的表面还设置驱动芯片，所述光发射芯片和所述光接收芯片分别电连接所述驱动芯片，且所述驱动芯片设置在所述光发射芯片和所述光接收芯片远离所述光模块的光口的一侧；所述背光检测芯片包括第三背光检测芯片或第四背光检测芯片；
    所述第三背光检测芯片位于所述光发射芯片靠近所述光口的一侧，所述第三背光检测芯片位于所述第十二光学面的下方；
    所述第四背光检测芯片位于所述光发射芯片靠近所述光口的斜对角侧，且远离所述光接收芯片，所述第四背光检测芯片位于所述第十二光学面的下方。
PCT/CN2024/100714 2023-06-30 2024-06-21 光模块 Ceased WO2025002008A1 (zh)

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