WO2024255488A1 - 溶液供给装置及半导体设备 - Google Patents

溶液供给装置及半导体设备 Download PDF

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Publication number
WO2024255488A1
WO2024255488A1 PCT/CN2024/091726 CN2024091726W WO2024255488A1 WO 2024255488 A1 WO2024255488 A1 WO 2024255488A1 CN 2024091726 W CN2024091726 W CN 2024091726W WO 2024255488 A1 WO2024255488 A1 WO 2024255488A1
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Prior art keywords
solution
delivery pipeline
pipeline
regulating valve
main
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Ceased
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PCT/CN2024/091726
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English (en)
French (fr)
Inventor
王子豪
陈建
王晖
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ACM Research Shanghai Inc
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ACM Research Shanghai Inc
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Priority to KR1020257043829A priority Critical patent/KR20260021658A/ko
Publication of WO2024255488A1 publication Critical patent/WO2024255488A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67D—DISPENSING, DELIVERING OR TRANSFERRING LIQUIDS, NOT OTHERWISE PROVIDED FOR
    • B67D7/00—Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes
    • B67D7/06—Details or accessories
    • B67D7/74—Devices for mixing two or more different liquids to be transferred
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67D—DISPENSING, DELIVERING OR TRANSFERRING LIQUIDS, NOT OTHERWISE PROVIDED FOR
    • B67D7/00—Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes
    • B67D7/02—Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes for transferring liquids other than fuel or lubricants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67D—DISPENSING, DELIVERING OR TRANSFERRING LIQUIDS, NOT OTHERWISE PROVIDED FOR
    • B67D7/00—Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes
    • B67D7/06—Details or accessories
    • B67D7/36—Arrangements of flow- or pressure-control valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B67—OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS; LIQUID HANDLING
    • B67D—DISPENSING, DELIVERING OR TRANSFERRING LIQUIDS, NOT OTHERWISE PROVIDED FOR
    • B67D7/00—Apparatus or devices for transferring liquids from bulk storage containers or reservoirs into vehicles or into portable containers, e.g. for retail sale purposes
    • B67D7/06—Details or accessories
    • B67D7/78—Arrangements of storage tanks, reservoirs or pipe-lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Definitions

  • the present invention relates to the field of semiconductor equipment, and further to a solution supply device and semiconductor equipment.
  • the concentration of the solution fluctuates greatly during the mixing process.
  • the concentration drift will have a cumulative effect, which will cause the solution to etch the product film in an unstable manner and even cause the product to be scrapped.
  • the chemical mixing and supplying device includes: a first chemical source part 112, a second chemical source part 122, a first delivery pipeline 114, a second delivery pipeline 124, a main delivery pipeline 140, a mixer 142 located in the main delivery pipeline 140, first and fourth flow meters 116 and 126, a discharge pipeline 150, and a control component 130 for comparing a chemical mixing ratio calculated based on flow rate data provided by the first and fourth flow meters 116 and 126 with a preset chemical mixing ratio to control the flow rate of the chemical.
  • the discharge pipeline 150 is connected to the first and second delivery pipelines 114 and 124, respectively, and can be connected to the chemical source parts 112 and 122, respectively. Because the flow rate of the initially delivered chemical is very unstable, the initially delivered chemical is discharged from the discharge pipeline 150 for 3-5 seconds, and then a stable flow rate is maintained, that is, the chemical is discharged during the flow rate adjustment process.
  • the discharge line 150 can be used to discharge the unstable-flowing chemicals in the first and second delivery lines 114 and 124, and prevent the unstable-flowing chemicals from flowing to the main delivery line 140 and the mixer 142, when the delivery of the chemicals to the discharge line 150 is stopped and the chemicals are started to be delivered to the main delivery line 140, the chemicals delivered by the first delivery line 114 and the second delivery line 124 will be mixed in the main delivery line 140.
  • the chemical flow rate in the first delivery pipeline 114 and the second delivery pipeline 124 changes dramatically, resulting in unstable chemical flow rate mixed from the first delivery pipeline 114 and the second delivery pipeline 124 and input to the main delivery pipeline 140, which in turn causes deviations in the chemical mixing ratio of the main delivery pipeline 140 input into the mixer 142, and deviations in the concentration of the chemical solution provided by the mixer 142 to the processing device 10.
  • this patent aims to improve the volume ratio accuracy of each chemical component in the mixed liquid.
  • the purpose of the present invention is to improve the volume ratio accuracy of each chemical component in the mixed liquid.
  • the present invention provides a solution supply device and a semiconductor device.
  • the present invention provides a solution supply device for providing a mixed solution to a processing device, comprising:
  • a first solution input end is used to receive an injected first solution; a second solution input end is used to receive an injected second solution; a first delivery pipeline is connected to the first solution input end; a second delivery pipeline is connected to the second solution input end; a mixing tank is connected to an end of the first delivery pipeline away from the first solution input end, and an end of the second delivery pipeline away from the second solution input end, for mixing the first solution and the second solution to form a mixed solution; a main delivery pipeline is connected between the mixing tank and the treatment device, for providing the mixed solution to the treatment device; a main discharge line is connected to the main delivery pipeline; a control component is communicatively connected to the main discharge line and the main delivery pipeline, for discharging the mixed solution with an unstable flow through the main discharge pipeline before the main delivery pipeline provides the mixed solution to the treatment device.
  • the present invention provides a semiconductor device including a semiconductor processing apparatus and the above solution supplying apparatus.
  • the present invention has the following beneficial effects:
  • the present invention adds a main discharge pipeline after the liquid is mixed, discharges the solution with abnormal concentration due to unstable flow rate in the early stage of the mixed solution through the main discharge pipeline, and then delivers it into the processing device after the liquid flow rate is stabilized, thereby improving the volume ratio accuracy of each component in the mixed solution.
  • the present invention also provides a voltage stabilizer in the pipeline to stabilize the hydraulic pressure being delivered, so that the liquid with a stable flow rate is delivered into the processing device, thereby improving the volume ratio accuracy of each component in the mixed solution.
  • FIG1 is a structural diagram of a chemical mixing and supplying device according to the background technology of the present invention.
  • FIG2 is a schematic diagram of an embodiment of a solution supply device of the present invention.
  • FIG3 is a schematic diagram of another embodiment of the solution supply device of the present invention.
  • FIG4 is a schematic diagram of another embodiment of the solution supply device of the present invention.
  • FIG. 5 is a schematic diagram of another embodiment of the solution supply device of the present invention.
  • the terms “installed”, “connected”, and “connected” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components.
  • installed should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components.
  • this embodiment discloses a solution supply device 200, which includes a first solution input end 211, a second solution input end 221, a first delivery pipeline 210, a second delivery pipeline 221, and a second delivery pipeline 222.
  • pipeline 220 main delivery line 230 , main discharge line 240 , mixing tank 250 , and control component 270 .
  • the first solution input end 211 is used to receive the injected first solution
  • the second solution input end 221 is used to receive the injected second solution
  • the first solution is different from the second solution.
  • the first delivery pipeline 210 is connected to the first solution input end 211
  • the second delivery pipeline 220 is connected to the second solution input end 221.
  • the mixing tank 250 is connected to one end of the first delivery pipeline 210 away from the first solution input end 211, and one end of the second delivery pipeline 220 away from the second solution input end 221, that is, the mixing tank 250 is arranged at the confluence of the first delivery pipeline 210 and the second delivery pipeline 220, or the first delivery pipeline 210 and the second delivery pipeline 220 are respectively connected to the mixing tank 250, for mixing the solutions respectively delivered by the first delivery pipeline 210 and the second delivery pipeline 220.
  • the main delivery pipeline 230 is connected between the mixing tank 250 and the treatment device 300, for providing the mixed solution to the treatment device 300.
  • main discharge pipeline 240 is connected to the main delivery pipeline 230, which is equivalent to a branch of the main delivery pipeline 230.
  • the control component 270 maintains communication connection with the main delivery pipeline 230 and the main discharge pipeline 240 respectively, and is used to discharge the solution with unstable flow rate in the DR direction shown in Figure 2 through the main discharge pipeline 240 before the main delivery pipeline 230 provides the mixed solution to the processing device 300.
  • This embodiment can stably transport the mixed solution in the mixing tank 250 to the processing device 300, thereby improving the volume ratio accuracy of each component in the mixed solution, so that the mixed solution supplied to the processing device 300 each time has an accurate concentration.
  • a second regulating valve 241 is provided on the main discharge pipeline 240, and a first regulating valve 231 is provided on the main delivery pipeline 230 between the main discharge pipeline 240 and the treatment device 300.
  • the first regulating valve 231 is located between the main discharge pipeline 240 and the treatment device 300, and the first regulating valve 231 and the second regulating valve 241 are respectively connected to the control component 270 for communication.
  • the control component 270 closes the first regulating valve 231 and opens the second regulating valve 241 to discharge the solution with an unstable flow through the main discharge pipeline 240.
  • the control component 270 first opens the first regulating valve 231. At this time, the solution in the main delivery pipeline 230 is divided into two parts, one part continues to be discharged by the main discharge pipeline 240, and the other part is supplied to the treatment device 300. After the first regulating valve 231 and the second regulating valve 241 are simultaneously in the open state for a preset time, the solution flow in the main delivery pipeline 230 will tend to stabilize. At this time, the second regulating valve 241 is closed. At this time, all the solution in the main delivery pipeline 230 is supplied to the processing device 300.
  • a second flow meter 242 is provided on the main discharge pipeline 240, and the main delivery pipeline 230 is provided on the main discharge pipeline 240.
  • a first flow meter 232 is provided between the discharge pipeline 240 and the treatment device 300, and the first flow meter 232 and the second flow meter 242 are respectively connected to the control component 270 for communication.
  • the flow value of the solution flow in the main discharge pipeline 240 detected by the second flow meter 242 when the flow rate is stable is the first detection value.
  • the flow rate of the solution in the main delivery pipeline 230 will change due to the opening of the first regulating valve 231.
  • the real-time value of the solution flow rate (i.e., the solution flow rate in the branch 233 of the main delivery pipeline 230) delivered from the main delivery pipeline 230 to the treatment device 300 detected by the first flow meter 232 is defined as the second detection value
  • the real-time value of the solution flow rate in the main discharge pipeline 240 detected by the second flow meter 242 is defined as the third detection value.
  • the control component 270 adjusts the opening rate of the first regulating valve 231 and the closing rate of the second regulating valve 241 to keep the sum of the second detection value and the third detection value equal to the first detection value, thereby maintaining the flow stability in the main delivery pipeline 230.
  • the first regulating valve 231 is fully opened and the second regulating valve 241 is fully closed.
  • the second detection value is equal to the first detection value
  • the third detection value is equal to zero.
  • a feed tank 234 (daily tank) may also be provided on the main delivery pipeline 230, and the feed tank 234 is located between the main discharge pipeline 240 and the treatment device 300, and is used to buffer the mixed solution from the mixing tank 250 and supply it to the treatment device 300.
  • the feed tank 234 is provided after the first regulating valve 231 and the second flow meter 242 and before the treatment device 300, so as to improve the volume ratio accuracy of each component in the mixed solution entering the feed tank 234, so that the mixed solution supplied to the treatment device 300 by the feed tank 234 each time has an accurate concentration.
  • a third regulating valve 212 and a third flowmeter 213 are provided on the first delivery pipeline 210, and the third regulating valve 212 is located between the first solution input end 211 and the third flowmeter 213.
  • a fourth regulating valve 222 and a fourth flowmeter 223 are provided on the second delivery pipeline 220, and the fourth regulating valve 222 is located between the second solution input end 221 and the fourth flowmeter 223, that is, along the solution flow direction in the first delivery pipeline 210 or the second delivery pipeline 220, the third flowmeter 213 is downstream of the third regulating valve 212, and the fourth flowmeter 223 is downstream of the fourth regulating valve 222, so as to detect the actual flow in the first delivery pipeline 210 or the second delivery pipeline 220 that may fluctuate due to the action of the third regulating valve 212 or the fourth regulating valve 222.
  • the third regulating valve 212 and the fourth regulating valve 222, the third flow meter 213 and the fourth flow meter 223 are respectively connected to the control component 270 for communication.
  • the control component 270 can receive the flow information signal sent by the third flow meter 213 and the fourth flow meter 223, and control the opening of the third regulating valve 212 and the fourth regulating valve 222 to adjust the flow of each pipeline.
  • the first, second, third and fourth regulating valves are connected to the control component 270 for communication.
  • the valves 231, 241, 212 and 222 are preferably flow control valves (FCV), but may also be ordinary gate valves.
  • the control component 270 can control the concentration ratio by controlling the flow ratio of the solutions in the first delivery pipeline 210 and the second delivery pipeline 220 respectively through the flow control valves, that is, the control component 270 detects the flow data in the first delivery pipeline 210 and the second delivery pipeline 220 respectively through the third flow meter 213 and the fourth flow meter 223, calculates the flow ratio of different chemical solutions injected into the first solution input end 211 and the second solution input end 221, compares the calculated flow ratio with the preset solution volume mixing ratio, and outputs a control signal for controlling the opening rate of the third regulating valve 212 and the fourth regulating valve 222, thereby controlling the concentration of the mixed solution, so that the first solution and the second solution are mixed to form a mixed solution with the above-mentioned preset solution volume mixing ratio, thereby achieving the preset concentration ratio.
  • first solution input end 211 injects HF (hydrogen fluoride) solution and the second solution input end 221 injects DIW (deionized water) as an example:
  • the control component 270 controls the flow ratio of HF or DIW in the first delivery pipeline 210 and the second delivery pipeline 220 through the third regulating valve 212 and the fourth regulating valve 222, respectively, to adjust the concentration of the mixed solution in the mixing tank 250, and the HF/DIW mixed solution with large flow fluctuations caused by changes in pressure or pipe resistance is discharged from the main discharge pipeline 240.
  • the control component 270 opens the first regulating valve 231 to inject the HF/DIW mixed solution with a stable flow into the feed tank 234, and in the above process, the control component 270 adjusts the opening rate of the first regulating valve 231 and the closing rate of the second regulating valve 241 according to the above-mentioned control method to maintain the stability of the flow in the main delivery pipeline 230.
  • this embodiment discloses a solution supply device 200, which is similar to the first embodiment and includes a first solution input end 211, a second solution input end 221, a first delivery pipeline 210, a second delivery pipeline 220, a main delivery pipeline 230, a main discharge pipeline 240, a mixing tank 250, a feed tank 234, and a control component 270.
  • the connection method of the above components and pipelines is the same as that of the first embodiment, and will not be repeated here.
  • the difference between this embodiment and the first embodiment is that a buffer tank 214 and a circulation pipeline 215 are added to the first delivery pipeline 210, and a secondary discharge pipeline 224 is added to the second delivery pipeline 220.
  • the buffer tank 214 is located between the first solution input end 211 and the third regulating valve 212, one end of the circulation pipeline 215 is connected to the first delivery pipeline 210 between the buffer tank 214 and the first solution input end 211, and the other end is connected to the first delivery pipeline 210 between the buffer tank 214 and the third regulating valve 212, and the circulation pipeline 215 is equipped with a fifth regulating valve 216 and a fifth flowmeter 217.
  • One end of the secondary discharge pipeline 224 is connected to the first delivery pipeline 210 between the second solution input end 221 and the fourth regulating valve 222, and the secondary discharge pipeline 224 is equipped with a sixth regulating valve 225 and a sixth flowmeter 226.
  • the fifth regulating valve 216, the sixth regulating valve 225, the fifth flowmeter 217 and the sixth flowmeter 226 are also respectively connected to the control component 270 for communication.
  • first solution input end 211 injects HF (hydrogen fluoride) solution and the second solution input end 221 injects DIW (deionized water) as an example:
  • the fifth regulating valve 216 and the sixth regulating valve 225 are opened, and the first, second, third and fourth regulating valves 231, 241, 212 and 222 are closed.
  • the HF solution will circulate in the buffer tank 214 and the circulation pipeline 215 at the set flow rate, and the DIW will begin to be regulated in a stable flow rate through the secondary discharge pipeline 224.
  • the fifth regulating valve 216 and the sixth regulating valve 225 are closed, and the second, third and fourth regulating valves 241, 212 and 222 are opened synchronously, and the first regulating valve 231 is still in a closed state.
  • the HF solution stops entering the circulation pipeline 215, and the DIW stops being discharged from the secondary discharge pipeline 224.
  • the HF solution and DIW will converge in the mixing tank 250, and the HF/DIW mixed solution after passing through the mixing tank 250 flows to the main discharge pipeline 240, and the HF/DIW mixed solution with a large flow fluctuation caused by the change of pressure or pipe resistance is discharged from the main discharge pipeline 240.
  • the first regulating valve 231 is opened to inject the HF/DIW mixed solution with a stable flow rate into the feed tank 234 .
  • this embodiment discloses a solution supply device 200, which is similar to the first embodiment and includes a first solution input end 211, a second solution input end 221, a first delivery pipeline 210, a second delivery pipeline 220, a main delivery pipeline 230, a mixing tank 250, a feed tank 234 and a control component 270.
  • the connection method of the above components and pipelines is the same as that of the first embodiment, and will not be repeated here.
  • the difference between this embodiment and the first embodiment is that a voltage stabilizer 260 is added to the first delivery pipeline 210 and the second delivery pipeline 220, respectively.
  • the pressure regulator 260 can achieve the same technical effect as the main discharge pipeline 240 in the first embodiment, so the main delivery pipeline 230 in this embodiment may not be connected to the main discharge pipeline 240.
  • the pressure regulator 260 may be a hydraulic balance valve, or may be composed of a controller, a pressure sensor, and a flow control valve.
  • the pressure sensor is connected to the inside of the pipe and transmits the pressure signal to the controller.
  • the controller controls the opening of the flow control valve according to the received pressure signal, so that the pressure in the pipe is maintained at a constant state.
  • the controller may be independent of the control component 270, or may be a part of the control component 270.
  • first solution input end 211 injects HF (hydrogen fluoride) solution and the second solution input end 221 injects DIW (deionized water) as an example:
  • the main delivery pipeline 230 is connected to the main discharge pipeline 240: first open the second, third and fourth regulating valves 241, 212 and 222, close the first regulating valve 231, and the HF solution and DIW are respectively passed through the regulators 260 of their respective pipelines and merged in the mixing tank 250, and the HF/DIW mixed solution is discharged for a specified time through the main discharge pipeline 240.
  • the feed tank 234 needs to be replenished, close the second regulating valve 241, open the first regulating valve 231, and inject the HF/DIW mixed solution with a stable flow into the feed tank 234.
  • the first, third and fourth regulating valves 231, 212 and 222 are directly opened to allow the HF solution and DIW to merge in the mixing tank 250 through the regulators 260 of their respective pipelines, and the HF/DIW mixed solution injected into the feed tank 234 is maintained in a dynamic balance of the hydraulic pressure in the main delivery pipeline 230 by using the regulators 260 on the first and second delivery pipelines 210 and 220, so as to provide a stable flow rate for the feed tank 234, so as to ensure the accuracy of the concentration of the HF/DIW mixed solution.
  • This embodiment discloses a semiconductor device, which includes a processing device 300 and a solution supply device 200 in any of the above embodiments.
  • the above processing device 300 includes but is not limited to a wafer cleaning tank or a wafer etching tank, and the solution supply device 200 can provide a mixed solution to one or more of the above wafer cleaning tanks and wafer etching tanks through a main delivery pipeline 230, thereby performing etching and cleaning processes on the wafer.
  • the stability of the amount of etched film in the etching process can be improved, and the cleanliness of the substrate surface in the cleaning process can be improved.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Accessories For Mixers (AREA)

Abstract

本发明公开了溶液供给装置及半导体设备，该溶液供给装置用于为处理装置提供混合溶液，包括：第一溶液输入端、第二溶液输入端、第一输送管线、第二输送管线、设于第一和第二输送管线汇合处的混合槽、与混合槽连接的主输送管线、连接于混合槽和处理装置之间的主输送管线的主排放管线，以及与主排放管线和主输送管线通信连接的控制部件，该控制部件用于使主输送管线为处理装置提供混合溶液之前，经主排放管线排放具有不稳定流量的溶液。本发明实现了提升混液中各化学组分的体积比例精度的效果。

Description

溶液供给装置及半导体设备 技术领域
本发明涉及半导体设备领域，进一步地涉及一种溶液供给装置及半导体设备。
背景技术
在半导体湿法清洗和刻蚀设备中，需将不同溶液按比例混合使用，为保证产品刻蚀薄膜量稳定在一定范围，对混合溶液浓度稳定性有较高要求，常见混合溶液包括例如：DHF溶液(水和49％氢氟酸的混合液)、SC1溶液(体积比例为1∶2∶50的氨水、双氧水以及水的混合液)、HF/HNO3溶液(氢氟酸和硝酸的混合液)。现有设备端通过调节不同输入管线中化学溶液的注入流量，从而控制各组分化学溶液的配比体积，以达到配置目标浓度溶液的目的。
但是由于管路设计和阀件响应调控需要一定时间等限制，溶液在混合过程中浓度波动较大，而且随着在线实时补液次数的增加，浓度漂移会出现累计效应，进而将造成溶液对于产品薄膜的刻蚀量不稳定，甚至导致产品报废。
例如，在申请号为200510075183.4的发明专利中，公开了一种化学品混合和供给装置及方法，如图1所示，该化学品混合和供给装置包括：第一化学品来源部分112、第二化学品来源部分122、第一输送管线114、第二输送管线124、主输送管线140、位于主输送管线140的混合器142、第一和第四流量计116和126、排出管线150以及用于比较基于由第一和第四流量计116和126提供的流速数据而计算出的化学品混合比与预设的化学品混合比以控制化学品的流速的控制部件130。排出管线150分别连接于第一和第二输送管线114和124上，可分别与化学品来源部分112、122连接，因为最初输送的化学品的流速非常不稳定，最初输送的化学品由排出管线150排放3-5秒钟，此后维持稳定的流速，即在流速调整的过程中排放化学品。
尽管上述排出管线150可用于排放第一和第二输送管线114和124中不稳定流动的化学品，防止具有不稳定流量的化学品流向主输送管线140及混合器142的作用。但当停止输送化学品至排出管线150，并开始将其输送至主输送管线140时，第一输送管线114和第二输送管线124所输送的化学品将在主输送管线140混合， 由于在开关阀前后管路内部的管阻和压力发生变化，导致第一输送管线114和第二输送管线124内的化学品流量急剧变化，从而导致由第一输送管线114和第二输送管线124混合输入到主输送管线140的化学品流量不稳定，进而导致主输送管线140输入混合器142内的化学品混合比出现偏差，以及由混合器142提供至处理装置10的化学品溶液浓度出现偏差。
因此，本专利旨在提升混液中各化学组分的体积比例精度。
发明内容
针对上述技术问题，本发明的目的在于提升混液中各化学组分的体积比例精度，为了实现上述目的，本发明提供了一种溶液供给装置及半导体设备。
在一些实施方式中，本发明提供了一种溶液供给装置用于为处理装置提供混合溶液，包括：
第一溶液输入端，用于接收注入的第一溶液；第二溶液输入端，用于接收注入的第二溶液；第一输送管线，与所述第一溶液输入端连接；第二输送管线，与所述第二溶液输入端连接；混合槽，连接于所述第一输送管线远离所述第一溶液输入端的一端，及所述第二输送管线远离所述第二溶液输入端的一端，用于混合所述第一溶液和所述第二溶液并形成混合溶液；主输送管线，连接于所述混合槽与所述处理装置之间，用于为所述处理装置提供混合溶液；主排放管线，连接于所述主输送管线；控制部件，与所述主排放管线和所述主输送管线通信连接，用于在所述主输送管线为所述处理装置提供混合溶液之前，经所述主排放管线排放具有不稳定流量的混合溶液。
在一些实施方式中，本发明提供了一种半导体设备，包括半导体处理装置和上述溶液供给装置。
与现有技术相比，本发明具有以下有益效果：
本发明通过在药液混合完成后增设主排放管线，将混液初期因为流量不稳定所导致浓度异常的溶液通过主排放管线排放掉，待稳定配液流量后再输送进入处理装置，从而提升混合溶液中各组份体积比例精度。本发明还通过在管线中设置稳压器，稳定所输送的液压，从而将具有稳定流量的液体输送进入处理装置，提升混合溶液中各组份体积比例精度。
附图概述
本发明的特征、性能由以下的实施例及其附图进一步描述。
图1是本发明背景技术的化学品混合和供给装置的构造图；
图2是本发明溶液供给装置的一种实施方式示意图；
图3是本发明溶液供给装置的另一种实施方式示意图；
图4是本发明溶液供给装置的另一种实施方式示意图；
图5是本发明溶液供给装置的另一种实施方式示意图。
本发明的较佳实施方式
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对照附图说明本发明的具体实施方式。显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图，并获得其他的实施方式。
为使图面简洁，各图中只示意性地表示出了与发明相关的部分，它们并不代表其作为产品的实际结构。另外，以使图面简洁便于理解，在有些图中具有相同结构或功能的部件，仅示意性地绘示了其中的一个，或仅标出了其中的一个。在本文中，“一个”不仅表示“仅此一个”，也可以表示“多于一个”的情形。
在本文中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
另外，在本申请的描述中，术语“第一”、“第二”等仅用于区分描述，而不能理解为指示或暗示相对重要性。
【实施例一】
如图2所示，本实施例公开了一种溶液供给装置200，该溶液供给装置200包括第一溶液输入端211、第二溶液输入端221、第一输送管线210、第二输送 管线220、主输送管线230、主排放管线240、混合槽250和控制部件270。
其中，第一溶液输入端211用于接收注入的第一溶液，第二溶液输入端221用于接收注入的第二溶液，上述第一溶液不同于第二溶液。第一输送管线210与第一溶液输入端211连接，第二输送管线220与第二溶液输入端221连接，混合槽250连接于第一输送管线210远离第一溶液输入端211的一端，及第二输送管线220远离第二溶液输入端221的一端，即混合槽250设于第一输送管线210和第二输送管线220的汇合处，或第一输送管线210和第二输送管线220分别与混合槽250连接，用于混合分别由第一输送管线210和第二输送管线220输送的溶液。主输送管线230连接于混合槽250与处理装置300之间，用于为处理装置300提供混合溶液。
此外，主排放管线240连接于主输送管线230，相当于主输送管线230的一个支路。控制部件270与主输送管线230和主排放管线240分别保持通信连接，用于在主输送管线230为处理装置300提供混合溶液之前，经由主排放管线240按图2所示的DR方向排放具有不稳定流量的溶液。该实施方式可使混合槽250内的混合溶液稳定地向处理装置300输送，从而提升混合溶液中各组份体积比例精度，使每次供应给处理装置300的混合溶液都有精确的浓度。
本申请对如何排放溶液不做限制。在一些实施例中，主排放管线240上设有第二调节阀241，主输送管线230上在主排放管线240和处理装置300之间设有第一调节阀231，第一调节阀231位于主排放管线240和处理装置300之间，且上述第一调节阀231和第二调节阀241分别与控制部件270通信连接。主输送管线230为处理装置300提供混合溶液之前，控制部件270关闭第一调节阀231，开启第二调节阀241，以通过主排放管线240排放具有不稳定流量的溶液。而在主输送管线230为处理装置300提供混合溶液时，控制部件270先开启第一调节阀231，此时，主输送管线230中的溶液分为两部分，一部分继续由主排放管线240排放，另一部分供应给处理装置300。第一调节阀231和第二调节阀241同时处于开启状态预设时间后，主输送管线230内的溶液流量将趋于稳定，此时再关闭第二调节阀241，此时，主输送管线230中的溶液全部供应给处理装置300。
优选地，主排放管线240上设有第二流量计242，主输送管线230在主排 放管线240和处理装置300之间设有第一流量计232，且上述第一流量计232和第二流量计242分别与控制部件270通信连接。其中，在主输送管线230为处理装置300提供混合溶液之前，第二流量计242检测得主排放管线240内的溶液流量稳定时的流量值为第一检测值。主输送管线230为处理装置300提供混合溶液时，由于第一调节阀231的开启，主输送管线230内溶液的流量将发生变化，此时将第一流量计232检测得主输送管线230向处理装置300输送的溶液流量(即主输送管线230的分支233内的溶液流量)的实时值定义为第二检测值，第二流量计242检测得主排放管线240内的溶液流量实时值定义为第三检测值。控制部件270通过调节第一调节阀231的开启速率和第二调节阀241的关闭速率，以保持第二检测值和第三检测值之和等于第一检测值，进而维持主输送管线230内的流量稳定。最终，第一调节阀231完全开启，第二调节阀241完全关闭，此时第二检测值等于第一检测值，第三检测值等于零。
优选地，如图3所示，主输送管线上230上还可设置进料槽234(日用槽)，进料槽234位于主排放管线240和处理装置300之间，用于缓存来自混合槽250的混合溶液，并供应至处理装置300。且在该实施例附图中，进料槽234设置于第一调节阀231和第二流量计242之后及处理装置300之前，以提高进入进料槽234内的混合溶液中各组份体积比例精度，进而使进料槽234每次供应给处理装置300的混合溶液都有精确的浓度。
在一些实施例中，第一输送管线210上设有第三调节阀212和第三流量计213，第三调节阀212位于第一溶液输入端211与第三流量计213之间，第二输送管线220上设有第四调节阀222和第四流量计223，第四调节阀222位于第二溶液输入端221与第四流量计223之间，即沿第一输送管线210或第二输送管线220内溶液流动方向，第三流量计213在第三调节阀212的下游，第四流量计223在第四调节阀222的下游，以检测第一输送管线210或第二输送管线220内可能由于第三调节阀212或第四调节阀222的动作发生波动的实际流量。且上述第三调节阀212和第四调节阀222，第三流量计213和第四流量计223分别与控制部件270通信连接，控制部件270可接收第三流量计213和四流量计223发送的流量信息信号，且控制第三调节阀212和第四调节阀222的开度以对各管线的流量进行调节。需要说明的是，上述第一、二、三和四调节 阀231、241、212和222优选为流量控制阀(FCV，Flow Control Valve)，也可以为普通闸阀。
当第三调节阀212和第四调节阀222选用流量控制阀时，控制部件270可通过流量控制阀分别控制第一输送管线210和第二输送管线220内的溶液流量比来控制浓度配比，即控制部件270通过第三流量计213和第四流量计223分别检测第一输送管线210和第二输送管线220内的流量数据，计算注入第一溶液输入端211和第二溶液输入端221不同化学溶液的流量比值，比较计算出的流量比值与预设的溶液体积混合比，以输出用于控制第三调节阀212和第四调节阀222的开启率的控制信号，进而控制混合溶液的浓度，以使第一溶液和第二溶液混合形成具有上述预设的溶液体积混合比的混合溶液，进而达到预设的浓度配比。
在实际应用中，以第一溶液输入端211注入HF(氟化氢)溶液，第二溶液输入端221注入DIW(去离子水)为例：
首先，仅开启第二、三和四调节阀241、212和222，关闭第一调节阀231，控制部件270通过第三调节阀212和第四调节阀222分别控制第一输送管线210和第二输送管线220内HF或DIW的溶液流量比，以调节混合槽250内的混合溶液的浓度，且由主排放管线240排放出由于压力或管阻变化而产生的流量波动较大的HF/DIW混合溶液。其次，待第二流量计242检测到主排放管线240中的溶液流量稳定后，控制部件270开启第一调节阀231向进料槽234内注入流量稳定的HF/DIW混合溶液，且上述过程中由控制部件270按前文中的调控方式调节第一调节阀231的开启速率和第二调节阀241的关闭速率，以维持主输送管线230内的流量稳定。
【实施例二】
如图4所示，本实施例公开了一种溶液供给装置200，与实施例一类似，包括第一溶液输入端211、第二溶液输入端221、第一输送管线210、第二输送管线220、主输送管线230、主排放管线240、混合槽250、进料槽234和控制部件270。上述各部件和管线的连接方式与实施例一相同，在此不再赘述，本实施例与实施例一的区别在于第一输送管线210上增加了缓冲槽214及循环管线215，第二输送管线220上增加了次排放管线224。
其中，缓冲槽214位于第一溶液输入端211和第三调节阀212之间，循环管线215的一端连接在缓冲槽214和第一溶液输入端211之间的第一输送管线210上，另一端连接在缓冲槽214和第三调节阀212之间的第一输送管线210上，且循环管线215装设有第五调节阀216和第五流量计217。次排放管线224的一端接入于第二溶液输入端221和第四调节阀222之间的第一输送管线210，且次排放管线224装设有第六调节阀225和第六流量计226。上述第五调节阀216、第六调节阀225、第五流量计217和第六流量计226也分别与控制部件270通信连接。
在实际应用中，以第一溶液输入端211注入HF(氟化氢)溶液，第二溶液输入端221注入DIW(去离子水)为例：
首先，仅开启第五调节阀216和第六调节阀225，关闭第一、二、三和四调节阀231、241、212和222，HF溶液将按设定流量在缓冲槽214及循环管线215进行内循环，DIW将开始通过次排放管线224进行流量稳定调节。其次，当HF溶液和DIW的流量都达到设定值并稳定一段时间后，关闭第五调节阀216和第六调节阀225，并同步开启第二、三和四调节阀241、212和222，第一调节阀231仍处于关闭状态。HF溶液停止进入循环管线215，DIW停止由次排放管线224排放，HF溶液和DIW将汇聚于混合槽250，且经过混合槽250后的HF/DIW混合溶液流向主排放管线240，并由主排放管线240排放出由于压力或管阻变化而产生的流量波动较大的HF/DIW混合溶液。最后，待第二流量计242检测出流量稳定后，再开启第一调节阀231向进料槽234内注入流量稳定的HF/DIW混合溶液。
【实施例三】
如图5所示，本实施例公开了一种溶液供给装置200，与实施例一类似，包括第一溶液输入端211、第二溶液输入端221、第一输送管线210、第二输送管线220、主输送管线230、混合槽250、进料槽234和控制部件270。且上述各部件和管线的连接方式与实施例一相同，在此不再赘述，本实施例与实施例一的区别在于第一输送管线210和第二输送管线220分别增加了稳压器260。
此外，由于第一输送管线210和第二输送管线220分别通过稳压器260维持管内恒定的压力，溶液进入主输送管线230压力不变，从而保证流量动态稳 定的效果，即稳压器260可起到与实施例一中的主排放管线240相同的技术效果，因此在本实施例中主输送管线230可以不接入主排放管线240。其中，稳压器260可选用液压平衡阀，也可以由控制器、压力传感器和流量调节阀组成，压力传感器与管内接通并将压力信号传输给控制器，控制器根据接收的压力信号控制流量调节阀的开度，使得管内的压力维持在恒定状态，控制器可独立于控制部件270，或属于控制部件270的一部分。
在实际应用中，以第一溶液输入端211注入HF(氟化氢)溶液，第二溶液输入端221注入DIW(去离子水)为例：
若主输送管线230接有主排放管线240：先开启第二、第三和第四调节阀241、212和222，关闭第一调节阀231，HF溶液和DIW分别经过各自管线的稳压器260在混合槽250内汇合，并经由主排放管线240排放指定时间的HF/DIW混合溶液。再在进料槽234需要补液时，关闭第二调节阀241、开启第一调节阀231向进料槽234内注入流量稳定的HF/DIW混合溶液。
若主输送管线230未连接主排放管线240，则直接开启第一、第三和第四调节阀231、212和222，使HF溶液和DIW分别经过各自管线的稳压器260在混合槽250内汇合，并向进料槽234内注入的HF/DIW混合溶液，利用第一和第二输送管线210和220上的稳压器260，维持主输送管线230内液压的动态平衡，为进料槽234提供稳定的流量，以保证HF/DIW混合溶液浓度的准确性。
【实施例四】
本实施例公开了一种半导体设备，该半导体设备包括处理装置300和上述任一实施例中的溶液供给装置200。上述处理装置300包括但不限于晶圆清洗槽或晶圆刻蚀槽，且溶液供给装置200可通过主输送管线230为一个或多个上述晶圆清洗槽和晶圆刻蚀槽提供混合溶液，从而对晶圆实施刻蚀和清洗工艺。本实施例通过在半导体设备中设置上述溶液供给装置200，可以提高刻蚀工艺中刻蚀薄膜量的稳定性，改善清洗工艺中基板表面的洁净度。
应当说明的是，上述实施例均可根据需要自由组合。以上仅是本发明的优选实施方式，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种溶液供给装置，用于为处理装置提供混合溶液，其特征在于，包括：
    第一溶液输入端，用于接收注入的第一溶液；
    第二溶液输入端，用于接收注入的第二溶液；
    第一输送管线，与所述第一溶液输入端连接；
    第二输送管线，与所述第二溶液输入端连接；
    混合槽，连接于所述第一输送管线远离所述第一溶液输入端的一端，及所述第二输送管线远离所述第二溶液输入端的一端，用于混合所述第一溶液和所述第二溶液并形成混合溶液；
    主输送管线，连接于所述混合槽与所述处理装置之间，用于为所述处理装置提供混合溶液；
    主排放管线，连接于所述主输送管线；
    控制部件，与所述主排放管线和所述主输送管线通信连接，用于在所述主输送管线为所述处理装置提供混合溶液之前，经所述主排放管线排放具有不稳定流量的混合溶液。
  2. 根据权利要求1所述的溶液供给装置，其特征在于：
    所述主输送管线上设有第一调节阀，所述第一调节阀位于所述主排放管线和所述处理装置之间；
    所述主排放管线上设有第二调节阀；
    所述控制部件分别与所述第一调节阀和第二调节阀通信连接，并被配置为：在所述主输送管线为所述处理装置提供混合溶液之前，所述控制部件关闭所述第一调节阀，并开启所述第二调节阀，以通过所述主排放管线排放具有不稳定流量的混合溶液；以及
    在所述主输送管线为所述处理装置提供混合溶液时，所述控制部件控制所述第一调节阀开启，并控制所述第一调节阀和所述第二调节阀均处于开启状态预设时间后，再关闭所述第二调节阀。
  3. 根据权利要求1所述的溶液供给装置，其特征在于：
    所述主输送管线上依次设有第一调节阀和第一流量计，所述第一调节阀和第一流量计位于所述主排放管线和所述处理装置之间；
    所述主排放管线上依次设有第二调节阀和第二流量计；
    所述控制部件分别与所述第一调节阀、所述第一流量计、所述第二调节阀和所述第二流量计通信连接，并被配置为：
    在所述主输送管线为所述处理装置提供混合溶液之前，所述控制部件关闭所述第一调节阀，并开启所述第二调节阀，所述第二流量计检测得所述主排放管线内的溶液流量稳定时的流量值为第一检测值；
    在所述主输送管线为所述处理装置提供混合溶液时，所述第一流量计检测得所述主输送管线向所述处理装置输送的溶液流量实时值为第二检测值，所述第二流量计检测得所述主排放管线内的溶液流量实时值为第三检测值，所述控制部件调节所述第一调节阀的开启速率和所述第二调节阀的关闭速率，以使所述第二检测值和所述第三检测值之和等于所述第一检测值。
  4. 根据权利要求1所述的溶液供给装置，其特征在于，
    所述主输送管线上设有进料槽，所述进料槽位于所述主排放管线和所述处理装置之间，用于缓存来自所述混合槽的混合溶液，并供应至所述处理装置。
  5. 根据权利要求1所述的溶液供给装置，其特征在于，
    所述第一输送管线上设有第三调节阀和第三流量计；
    所述第二输送管线上设有第四调节阀和第四流量计；
    所述控制部件还被配置为：接收由所述第三流量计和所述第四流量计检测到的流量数据，计算所述第一溶液和所述第二溶液的流量比值，比较所述流量比值与预设的混合比，以输出用于控制所述第三调节阀和第四调节阀开启率的控制信号，以使所述第一溶液和所述第二溶液混合形成具有所述预设的混合比的混合溶液。
  6. 根据权利要求1所述的溶液供给装置，其特征在于，
    所述第一输送管线和所述第二输送管线上分别设有稳压器，用于稳定所述第一输送管线和所述第二输送管线内的液压。
  7. 根据权利要求1所述的溶液供给装置，其特征在于，包括：
    缓冲槽，设于所述第一输送管线；
    循环管线，连接于所述第一输送管线的所述缓冲槽前后，用于在所述第一输送管线为所述混合槽提供第一溶液之前，经由所述循环管线回收具有不稳定流量的第一溶液。
  8. 根据权利要求1或7所述的溶液供给装置，其特征在于，包括：
    次排放管线，连接于所述第二输送管线，用于在所述第二输送管线为所述混合槽提供第二溶液之前，经所述次排放管线排放具有不稳定流量的第二溶液。
  9. 一种溶液供给装置，用于为处理装置提供混合溶液，其特征在于，包括：
    第一溶液输入端，用于接收注入的第一溶液；
    第二溶液输入端，用于接收注入的第二溶液；
    第一输送管线，与所述第一溶液输入端连接；
    第二输送管线，与所述第二溶液输入端连接；
    混合槽，连接于所述第一输送管线远离所述第一溶液输入端的一端，及所述第二输送管线远离所述第二溶液输入端的一端，用于混合所述第一溶液和所述第二溶液并形成混合溶液；
    主输送管线，连接于所述混合槽与所述处理装置之间，用于为所述处理装置提供混合溶液；其中，
    所述第一输送管线和所述第二输送管线上分别设有稳压器，用于稳定所述第一输送管线和所述第二输送管线内的液压。
  10. 一种半导体设备，其特征在于，包括用于处理半导体的处理装置和如权利要求1-9任一项所述的溶液供给装置。
PCT/CN2024/091726 2023-06-13 2024-05-08 溶液供给装置及半导体设备 Ceased WO2024255488A1 (zh)

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