WO2024251029A1 - 扬声器及电子设备 - Google Patents

扬声器及电子设备 Download PDF

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Publication number
WO2024251029A1
WO2024251029A1 PCT/CN2024/096547 CN2024096547W WO2024251029A1 WO 2024251029 A1 WO2024251029 A1 WO 2024251029A1 CN 2024096547 W CN2024096547 W CN 2024096547W WO 2024251029 A1 WO2024251029 A1 WO 2024251029A1
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WO
WIPO (PCT)
Prior art keywords
speaker
loudspeaker
cavity
sound
guide channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/096547
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English (en)
French (fr)
Inventor
蒋国珠
龙立锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2024251029A1 publication Critical patent/WO2024251029A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present application belongs to the technical field of sound-generating devices, and specifically relates to a loudspeaker and an electronic device.
  • the purpose of the embodiments of the present application is to provide a speaker and an electronic device that can achieve high and low frequency sound efficiency and high and low frequency sound intensity using limited space.
  • an embodiment of the present application provides a speaker, comprising a speaker shell and a speaker main body, the speaker main body being arranged in the speaker shell, a speaker front cavity and a speaker rear cavity being formed between the speaker main body and the speaker shell, the speaker shell also having a sound guide channel, a first end of the sound guide channel being connected to the speaker rear cavity, and a second end of the sound guide channel being connected to the speaker front cavity, the sound guide channel being used to change the phase of sound waves in the speaker rear cavity so that the sound waves in the speaker front cavity are superimposed on the sound waves in the speaker rear cavity.
  • an embodiment of the present application further provides an electronic device, including the above-mentioned speaker,
  • the electronic device also includes a mainboard cover, the speaker housing has a mating surface arranged toward the mainboard cover, the sound guide channel is arranged on the mating surface, the sound guide channel is located on a side of the mating surface away from the mainboard cover and toward the mainboard cover.
  • a speaker front cavity and a speaker rear cavity are formed between the speaker body and the speaker housing, and a sound outlet channel on the speaker housing is connected to the speaker front cavity.
  • a sound guide channel is also provided on the speaker, and the two ends of the sound guide channel are respectively connected to the speaker rear cavity and the speaker front cavity.
  • the diaphragm of the speaker body can vibrate, so that sound waves can be formed in the speaker front cavity and the speaker rear cavity respectively.
  • the sound waves in the speaker front cavity can be propagated outside the speaker, and the sound waves in the speaker rear cavity can enter the speaker front cavity through the sound guide channel and superimpose with the sound waves in the speaker front cavity.
  • the sound guide channel can change the phase of the sound wave in the speaker rear cavity, so that the sound wave in the speaker rear cavity produces an anti-phase, and the phase tends to be consistent with the sound wave in the speaker front cavity, thereby enhancing the low-frequency sound efficiency and the low-frequency sound intensity. It can be seen that the present application can enhance the low-frequency sound efficiency and the low-frequency sound intensity by setting a sound guide channel on the speaker housing, without increasing the volume of the speaker and using an intelligent power amplifier, thereby using limited space to achieve the purpose of high and low frequency sound efficiency and high and low frequency sound intensity.
  • the heated gas in the rear cavity of the speaker can be discharged outside the speaker through the sound guide channel, thereby dissipating the heat inside the speaker to solve the problem that the heat emitted by the speaker is difficult to dissipate.
  • FIG1 is a cross-sectional schematic diagram of an electronic device disclosed in an embodiment of the present application.
  • FIG2 is a schematic diagram of a partial structure of an electronic device disclosed in an embodiment of the present application.
  • FIG3 is a second schematic diagram of a partial structure of an electronic device disclosed in an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of an electronic device disclosed in another embodiment of the present application.
  • first, second, etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first”, “second”, etc. are generally of one type, and the number of objects is not limited.
  • the first object can be one or more.
  • “and/or” in the specification and claims represents at least one of the connected objects, and the character “/" generally indicates that the objects associated with each other are in an "or” relationship.
  • the embodiment of the present application discloses a speaker, including a speaker housing 100 and a speaker body 200, wherein the speaker body 200 is disposed in the speaker housing 100, and a speaker front cavity 310 and a speaker rear cavity 320 are formed between the speaker body 200 and the speaker housing 100.
  • the speaker housing 100 may also have a sound outlet channel 101, which is connected to the speaker front cavity 310, and sound waves in the speaker front cavity 310 may be transmitted from the speaker to the outside of the speaker through the sound outlet channel 101.
  • the speaker housing 100 further has a sound guide channel 102, a first end of the sound guide channel 102 is connected to the speaker rear cavity 320, and a second end of the sound guide channel 102 is connected to the speaker front cavity 310.
  • the second end of the sound guide channel 102 can be directly connected to the speaker front cavity 310, or indirectly connected to the speaker front cavity 310 through the sound outlet channel 101.
  • the sound guide channel 102 is used to change the phase of the sound waves in the speaker rear cavity 320 so that the sound waves in the speaker front cavity 310 are superimposed with the sound waves in the speaker rear cavity 320 .
  • a speaker front cavity 310 and a speaker rear cavity 320 are formed between the speaker body 200 and the speaker housing 100, and a sound outlet channel 101 on the speaker housing 100 is connected to the speaker front cavity 310.
  • the speaker is also provided with a sound guide channel 102, and the two ends of the sound guide channel 102 are respectively connected to the speaker rear cavity 320 and the speaker front cavity 310.
  • the diaphragm of the speaker body 200 can vibrate, so that sound waves can be formed in the speaker front cavity 310 and the speaker rear cavity 320 respectively.
  • the sound waves in the speaker front cavity 310 can be propagated outside the speaker, and the sound waves in the speaker rear cavity 320 can pass through the sound guide channel 102.
  • the sound guide channel 102 can change the phase of the sound waves in the rear cavity 320 of the speaker, so that the sound waves in the rear cavity 320 of the speaker produce anti-phase and tend to be consistent with the phase of the sound waves in the front cavity 310 of the speaker, thereby enhancing the low-frequency sound efficiency and low-frequency sound intensity; It can be seen that the present application can enhance the low-frequency sound efficiency and low-frequency sound intensity by setting the sound guide channel 102 on the speaker housing 100, without increasing the volume of the speaker and using an intelligent power amplifier, thereby utilizing limited space to achieve the purpose of high and low frequency sound efficiency and high and low frequency sound intensity.
  • the heated gas in the rear cavity 320 of the speaker can be discharged from the speaker through the sound guide channel 102, thereby discharging the heat in the speaker, so as to solve the problem that the heat emitted by the speaker is difficult to dissipate.
  • the sound guide channel 102 is used to change the phase of the sound waves in the speaker rear cavity 320 so that the sound waves in the speaker front cavity 310 are positively superimposed with the sound waves in the speaker rear cavity 320. This can further enhance the low-frequency sound generation efficiency and low-frequency sound generation intensity.
  • the sound waves in the speaker rear cavity 320 can be reversed by adjusting the structural parameters of the sound guide channel 102; wherein the structural parameters include at least one of the length and cross-sectional area of the sound guide channel 102.
  • the ability of the sound guide channel 102 to change the phase of the sound waves in the speaker rear cavity 320 is adjusted by adjusting the length and cross-sectional area of the sound guide channel 102, such as: the length and cross-sectional area of the sound guide channel 102 can be adjusted so that the phase difference between the sound waves in the speaker front cavity 310 and the sound waves in the speaker rear cavity 320 is less than half of the phase of the sound waves in the speaker front cavity 310, so as to facilitate the positive superposition of the two.
  • the cross-sectional area of the sound guide channel 102 is the area of the cross section of the sound guide channel 102 perpendicular to its axis.
  • the speaker rear cavity 320 includes a filling cavity 321, and the filling cavity 321 is filled with particles 322.
  • the filling cavity 321 in the speaker rear cavity 320 is filled with particles 322, and the particles 322 are porous structures, which can adsorb air molecules, so that the equivalent volume of the speaker rear cavity 320 can be increased, which is equivalent to increasing the volume of the speaker rear cavity 320, thereby increasing the low-frequency sound efficiency and low-frequency sound intensity.
  • the particles 322 are filled in the filling cavity 321, which can increase the low-frequency sound efficiency and low-frequency sound intensity without increasing the volume of the speaker.
  • the speaker rear cavity 320 is connected to the sound guide channel 102, the air in the speaker rear cavity 320 has good circulation, and the particles 322 in the filling cavity 321 can more fully adsorb air molecules, thereby further increasing the equivalent volume of the speaker rear cavity 320.
  • the filling cavity 321 is located on one side of the speaker body 200 along a first direction, wherein the first direction is perpendicular to the height direction of the speaker. Taking the shown orientation as an example, the filling cavity 321 is located on one side of the speaker body 200 along the first direction. At this time, the filling cavity 321 is not stacked above or below the speaker body 200. That is to say, the filling cavity 321 is arranged side by side with the speaker body 200, which can compress the height of the speaker housing 100, thereby reducing the space occupied by the speaker in the height direction within the electronic device.
  • the first end of the sound guide channel 102 is disposed adjacent to the filling cavity 321, so that all the particles 322 in the filling cavity 321 are disposed adjacent to the first end of the sound guide channel 102, and the first end of the sound guide channel 102 is connected to the speaker front cavity 310, so that the air flow of the first end of the sound guide channel 102 is good, so that the particles 322 in the filling cavity 321 can more fully absorb air molecules, thereby further increasing the equivalent volume of the speaker rear cavity 320.
  • the speaker rear cavity 320 can have a larger equivalent volume when the height of the speaker housing 100 is compressed, so that the speaker has better low-frequency sounding efficiency and low-frequency sounding intensity.
  • At least a portion of the filling cavity 321 is located on the side of the speaker body 200 away from the speaker front cavity 310, which allows at least a portion of the particulate matter 322 to be located on the side of the speaker body 200 away from the speaker front cavity 310.
  • the space on the side of the speaker body 200 away from the speaker front cavity 310 can be fully utilized to fill the particulate matter 322, which can increase the volume of the filling cavity 321, thereby increasing the volume of the particulate matter 322 filled therein, and further increasing the equivalent volume of the speaker rear cavity 320.
  • the first end of the sound guide channel 102 is arranged away from the filling cavity 321, so that the particles 322 in the filling cavity 321 are far away from the first end of the sound guide channel 102, and therefore the particles 322 in the filling cavity 321 will not block the heated gas in the rear cavity 320 of the speaker from entering the sound guide channel 102, thereby making the speaker have a good heat dissipation effect.
  • the filling cavity 321 can be made to not block the heated gas in the rear cavity 320 of the speaker from entering the sound guide channel 102 even if its volume is large.
  • a first dustproof net 400 is provided in the speaker rear cavity 320, and the first dustproof net 400 and the inner wall of the speaker rear cavity 320 together form a filling cavity 321.
  • the filling cavity 321 is formed by the first dustproof net 400 and the inner wall of the speaker rear cavity 320, and the first dustproof net 400 and the inner wall of the speaker rear cavity 320 can hinder the movement of the particles 322 in the filling cavity 321, thereby reducing the wear of the particles 322 during the movement, and further preventing the problem of limited increase in the equivalent volume of the speaker rear cavity 320 due to the wear of the particles 322.
  • the filling cavity 321 can also be formed by a breathable isolation member such as a perforated plate, or the particles 322 can be directly filled into the filling cavity 321.
  • a breathable isolation member such as a perforated plate
  • the present application does not limit the method of forming the filling cavity 321 .
  • the first dustproof net 400 is located between the particles 322 and the first end of the sound guide channel 102. In this embodiment, the first dustproof net 400 is located between the particles 322 and the first end of the sound guide channel 102, so that the first dustproof net 400 can prevent the particles 322 in the filling cavity 321 from entering the sound guide channel 102, thereby preventing the particles 322 from blocking the sound guide channel 102 and hindering the sound waves and heat of the speaker rear cavity 320 from being transmitted to the speaker front cavity 310. It can be seen that the present embodiment can achieve the two purposes of reducing the wear of the particles 322 during the movement and preventing the particles 322 from entering the sound guide channel 102 by setting the first dustproof net 400, thereby achieving the effect of one object with multiple uses.
  • the speaker housing 100 includes a housing 110, a receiving space is provided in the housing 110, and the speaker body 200 is provided in the receiving space.
  • a sound guide channel 102 may be provided inside the housing 110, but this requires the housing 110 to have a relatively large wall thickness, which not only increases the volume of the speaker in the electronic device, but also increases the weight of the speaker, thereby reducing the user experience.
  • the speaker further includes a sealing sheet 500, a partial area of the housing 110 is recessed in a direction toward the accommodation space, and a sound guide groove is formed with an opening facing away from the accommodation space, and the sealing sheet 500 covers the opening of the sound guide groove to form the sound guide channel 102.
  • a partial area of the housing 110 is recessed into the accommodation space to form the sound guide groove, and the sound guide groove cooperates with the sealing sheet 500 to form the sound guide channel 102, so there is no need to open the sound guide channel 102 in the housing 110, so this embodiment can reduce the wall thickness of the housing 110, thereby reducing the volume and weight of the speaker.
  • the sealing sheet 500 can be a flat structure or an arched structure, etc.
  • sound guide channels 102 with different cross-sectional shapes and cross-sectional areas can be obtained, which can adjust the ability of the sound guide channel 102 to change the sound waves in the speaker rear cavity 320, thereby facilitating the positive superposition of the sound waves in the speaker front cavity 310 and the sound waves in the speaker rear cavity 320.
  • the first end of the sound guide channel 102 and the second end of the sound guide channel 102 are respectively located on opposite sides of the speaker front cavity 310. Specifically, the first end of the sound guide channel 102 and the second end of the sound guide channel 102 are respectively located on opposite sides of the speaker front cavity 310 along its own length direction. At this time, the sound guide channel 102 extends roughly along the plane where the display screen of the electronic device is located. In this embodiment, the two ends of the sound guide channel 102 are respectively located on opposite sides of the speaker front cavity 310, which can increase the length of the sound guide channel 102, thereby improving the sound guide channel 102's contact with the sound waves of the speaker rear cavity 320.
  • the phase of the sound waves in the speaker rear cavity 320 can be made closer to the phase of the sound waves in the speaker front cavity 310, thereby enhancing the positive superposition effect of the two.
  • the first end of the sound guide channel 102 and the second end of the sound guide channel 102 can also be located on two adjacent sides of the speaker front cavity 310, or on the same side of the speaker front cavity 310.
  • the speaker housing 100 includes an outer shell 110, and the outer shell 110 includes a shell body 111 and a top cover 112.
  • the top cover 112 covers the shell body 111 and is detachably connected to the shell body 111.
  • the sound guide channel 102 is provided on the top cover 112.
  • the outer shell 110 includes the shell body 111 and the top cover 112.
  • the speaker body 200 can be provided in the shell body 111.
  • the top cover 112 is detachably connected to the shell body 111.
  • the top cover 112 can be removed from the shell body 111 and then the sound guide channel 102 can be processed on the top cover 112. It is more convenient to process the sound guide channel 102 in this way.
  • the speaker housing 100 also includes a support member 120, which is disposed in the shell body 111.
  • the support member 120 is disposed around the outer circumference of the speaker body 200 and is connected to the top cover 112.
  • the speaker body 200, the support member 120, the shell body 111 and the top cover 112 surround and form a speaker front cavity 310, so that the speaker rear cavity 320 can be disposed around the speaker front cavity 310, thereby achieving the purpose of increasing the volume of the speaker rear cavity 320.
  • the top cover 112 includes a front cavity cover 113 and a rear cavity cover 114
  • the support member 120 is connected to the front cavity cover 113
  • the speaker body 200, the support member 120, the shell body 111 and the front cavity cover 113 surround to form a speaker front cavity 310
  • the rear cavity cover 114 is arranged around the outer circumferential surface of the front cavity cover 113, and the edge of the rear cavity cover 114 close to the front cavity cover 113 is detachably connected to the support member 120
  • the rear cavity cover 114 is detachably connected to the shell body 111
  • the sound guide channel 102 is arranged on the rear cavity cover 114, so that the rear cavity cover 114 can be removed from the shell body 111 and the support member 120 and then the sound guide channel 102 can be processed on the rear cavity cover 114, so that it is more convenient to process the sound guide channel 102.
  • the embodiment of the present application also discloses an electronic device, including a speaker as described in any of the above embodiments, the electronic device also includes a mainboard cover 800, the speaker housing 100 has a mating surface arranged toward the mainboard cover 800, the sound guide channel 102 is arranged on the mating surface, and the sound guide channel 102 is located on the side of the mating surface away from the mainboard cover 800 and faces the mainboard cover 800.
  • the sound guide channel 102 is located on the side of the mating surface away from the mainboard cover 800, so that the mating surface of the speaker housing 100 can be fitted with the mainboard cover 800, and then the mainboard cover 800 and the speaker housing 100 are used to form the sound guide channel 800, without the need to use additional sealing members such as the sealing sheet 500 to form the sound guide channel 800, so that the volume of the electronic device can be compressed.
  • this embodiment can also be combined with the technical solution of the speaker including the sealing sheet 500.
  • the mainboard cover 800 fits with the sealing sheet 500, and the two work together to form the sound guide channel 800, and the mainboard cover 800 can press the sealing sheet 500, so that the sealing effect of the sealing sheet 500 is improved. better.
  • the electronic device includes a middle frame 700, which is provided with a sound hole 710, which can be connected to the sound outlet channel 101, and the sound waves emitted by the speaker can be transmitted to the external environment through the sound hole 710; when there are other structural parts between the middle frame 700 and the speaker, sound transmission holes can be set on the other structural parts, and the sound outlet channel 101 and the sound outlet hole 710 can be connected through the sound transmission holes; further, a second dustproof net 600 is provided at least one of the outlet of the sound outlet channel 101 and the outlet of the sound transmission hole.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本申请属于发声装置技术领域，具体涉及一种扬声器及电子设备。该扬声器包括扬声器壳体和扬声器主体，扬声器主体设于扬声器壳体内，扬声器主体与扬声器壳体之间形成扬声器前腔和扬声器后腔，扬声器壳体还具有导音通道，导音通道的第一端与扬声器后腔相连通，导音通道的第二端与扬声器前腔相连通，导音通道用于改变扬声器后腔内的声波的相位，以使扬声器前腔内的声波与扬声器后腔内的声波叠加。

Description

扬声器及电子设备
交叉引用
本申请要求在2023年06月06日提交中国专利局、申请号为202310668328.X、名称为“扬声器及电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请属于发声装置技术领域，具体涉及一种扬声器及电子设备。
背景技术
随着手机等终端设备的发展，用户对音质的要求越来越高，需要较好的低频发声效率和低频发声强度，为满足上述要求，目前行业内通常会增大扬声器后腔的体积，以及使用智能功放使扬声器获得较大的激励信号，从而提高扬声器的低频发声效率和低频发声强度。但增大扬声器后腔的体积将会增大扬声器的体积，进而增大终端设备的体积。
发明内容
本申请实施例的目的是提供一种扬声器及电子设备，能够利用有限的空间实现高低频发声效率和高低频发声强度。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种扬声器，包括扬声器壳体和扬声器主体，扬声器主体设于扬声器壳体内，扬声器主体与扬声器壳体之间形成扬声器前腔和扬声器后腔，扬声器壳体还具有导音通道，导音通道的第一端与扬声器后腔相连通，导音通道的第二端与扬声器前腔相连通，导音通道用于改变扬声器后腔内的声波的相位，以使扬声器前腔内的声波与扬声器后腔内的声波叠加。
第二方面，本申请实施例还提供了一种电子设备，包括如上述的扬声器， 电子设备还包括主板上盖，扬声器壳体具有朝向主板上盖设置的配合面，导音通道设于配合面，导音通道位于配合面的远离主板上盖的一侧，且朝向主板上盖。
本申请实施例中，扬声器主体与扬声器壳体之间形成扬声器前腔和扬声器后腔，扬声器壳体上的出音通道与扬声器前腔相连通，扬声器上还设有导音通道，导音通道的两端分别与扬声器后腔和扬声器前腔相连通，扬声器主体的振膜可进行振动，如此可分别在扬声器前腔和扬声器后腔内形成声波，扬声器前腔内的声波可传播至扬声器外，而扬声器后腔内的声波可经过导音通道进入扬声器前腔，并与扬声器前腔内的声波进行叠加，而导音通道可改变扬声器后腔内的声波的相位，从而使扬声器后腔内的声波产生反相，并与扬声器前腔内的声波的相位趋于一致，进而增强低频发声效率和低频发声强度。可见，本申请可通过在扬声器壳体上设置导音通道便可增强低频发声效率和低频发声强度，而无需增大扬声器的体积和使用智能功放，进而利用有限的空间实现高低频发声效率和高低频发声强度的目的。此外，在扬声器工作的过程中，扬声器后腔内被加热的气体可通过导音通道排出扬声器外，从而排出扬声器内的热量，以解决扬声器散发出的热量难以散发出去的问题。
附图说明
图1为本申请实施例公开的电子设备的剖视示意图；
图2为本申请实施例公开的电子设备的部分结构示意图一；
图3为本申请实施例公开的电子设备的部分结构示意图二；
图4为本申请另一实施例公开的电子设备的剖视示意图。
附图标记说明：
100-扬声器壳体、101-出音通道、102-导音通道、110-外壳、111-壳本体、
112-顶盖、113-前腔盖、114-后腔盖、120-支撑件、200-扬声器主体、310-扬声器前腔、320-扬声器后腔、321-填充腔、322-颗粒物、400-第一防尘网、500-密封片、600-第二防尘网、700-中框、710-出音孔、800-主板上盖。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的扬声器及电子设备进行详细地说明。
如图1至图4所示，本申请实施例公开了一种扬声器，包括扬声器壳体100和扬声器主体200，扬声器主体200设于扬声器壳体100内，扬声器主体200与扬声器壳体100之间形成扬声器前腔310和扬声器后腔320。具体地，扬声器壳体100还可具有出音通道101，出音通道101与扬声器前腔310相连通，扬声器前腔310内的声波可通过出音通道101从扬声器内传播至扬声器外。
扬声器壳体100还具有导音通道102，导音通道102的第一端与扬声器后腔320相连通，导音通道102的第二端与扬声器前腔310相连通。具体地，导音通道102的第二端可直接与扬声器前腔310相连通，也可通过出音通道101与扬声器前腔310间接连通。
导音通道102用于改变扬声器后腔320内的声波的相位，以使扬声器前腔310内的声波与扬声器后腔320内的声波叠加。
本申请实施例中，扬声器主体200与扬声器壳体100之间形成扬声器前腔310和扬声器后腔320，扬声器壳体100上的出音通道101与扬声器前腔310相连通，扬声器上还设有导音通道102，导音通道102的两端分别与扬声器后腔320和扬声器前腔310相连通，扬声器主体200的振膜可进行振动，如此可分别在扬声器前腔310和扬声器后腔320内形成声波，扬声器前腔310内的声波可传播至扬声器外，而扬声器后腔320内的声波可经过导音通道102 进入扬声器前腔310，并与扬声器前腔310内的声波进行叠加，而导音通道102可改变扬声器后腔320内的声波的相位，从而使扬声器后腔320内的声波产生反相，并与扬声器前腔310内的声波的相位趋于一致，进而增强低频发声效率和低频发声强度；可见，本申请可通过在扬声器壳体100上设置导音通道102便可增强低频发声效率和低频发声强度，而无需增大扬声器的体积和使用智能功放，进而利用有限的空间实现高低频发声效率和高低频发声强度的目的。此外，在扬声器工作的过程中，扬声器后腔320内被加热的气体可通过导音通道102排出扬声器外，从而排出扬声器内的热量，以解决扬声器散发出的热量难以散发出去的问题。
在一种可选的实施例中，导音通道102用于改变扬声器后腔320内的声波的相位，以使扬声器前腔310内的声波与扬声器后腔320内的声波正向叠加。如此可进一步地增强低频发声效率和低频发声强度。
在一种可选的实施例中，通过调节导音通道102的结构参数可使扬声器后腔320内的声波反相；其中，结构参数包括导音通道102的长度和横截面积中的至少一者。本实施例中，通过调整导音通道102的长度、横截面积来调节导音通道102对扬声器后腔320的声波的相位的改变能力，如：可调整导音通道102的长度、横截面积以使扬声器前腔310内的声波与扬声器后腔320内的声波之间的相位差小于扬声器前腔310内的声波的相位的一半，以利于两者正向叠加。需要说明的是，导音通道102的横截面积是导音通道102的垂直于其轴线的截面的面积。
在一种可选的实施例中，扬声器后腔320包括填充腔321，填充腔321内填充有颗粒物322。本实施例中，扬声器后腔320中的填充腔321内填充有颗粒物322，颗粒物322为多孔结构，其可吸附空气分子，如此可增大扬声器后腔320的等效体积，这相当于增加了扬声器后腔320的体积，进而增大低频发声效率和低频发声强度。可见，本实施例在填充腔321内填充颗粒物322，可实现在不增大扬声器的体积的情况下，增大低频发声效率和低频发声强度。此外，由于扬声器后腔320与导音通道102相连通，因此扬声器后腔320中的空气的流通性较好，填充腔321内的颗粒物322能更加充分地吸附空气分子，进而可进一步地增大扬声器后腔320的等效体积。
在一种可选的实施例中，填充腔321位于扬声器主体200的沿第一方向上的一侧，其中，第一方向与扬声器的高度方向垂直。本实施例中，以图1 所示方位为例，填充腔321位于扬声器主体200的沿第一方向的一侧，此时填充腔321并未叠置于扬声器主体200的上方或者下方，也就是说，填充腔321与扬声器主体200并排设置，这可压缩扬声器壳体100的高度，从而减小扬声器占用的电子设备内的高度方向上的空间。
在一种可选的实施例中，导音通道102的第一端邻近填充腔321设置，这可使填充腔321内的所有颗粒物322均靠近导音通道102的第一端设置，而导音通道102的第一端与扬声器前腔310相连通，因此导音通道102的第一端的空气流通性较好，从而可使填充腔321内的颗粒物322能更加充分地吸附空气分子，进而进一步地增大扬声器后腔320的等效体积。在本实施与上一实施例组合的情况下，可使得扬声器在扬声器壳体100的高度被压缩的情况下，扬声器后腔320也能拥有较大的等效体积，从而使扬声器拥有较好的低频发声效率和低频发声强度。
在一种可选的实施例中，填充腔321的至少一部分位于扬声器主体200的背离扬声器前腔310的一侧，这可使颗粒物322的至少一部分位于扬声器主体200的背离扬声器前腔310的一侧，如此可充分利用扬声器主体200的背离扬声器前腔310一侧的空间填充颗粒物322，这可增大填充腔321的体积，从而增大其内填充的颗粒物322的体积，进而增大扬声器后腔320的等效体积。
在一种可选的实施例中，导音通道102的第一端远离填充腔321设置，如此填充腔321内的颗粒物322距离导音通道102的第一端较远，因此填充腔321内的颗粒物322不会阻挡扬声器后腔320内被加热的气体进入导音通道102，进而使得扬声器具有良好的散热效果。在本实施与上一实施例组合的情况下，可使得填充腔321在其体积较大的情况下，也不会阻挡扬声器后腔320内被加热的气体进入导音通道102。
在一种可选的实施例中，扬声器后腔320内设有第一防尘网400，第一防尘网400与扬声器后腔320的内壁共同形成填充腔321。本实施例中，通过第一防尘网400和扬声器后腔320的内壁形成填充腔321，第一防尘网400和扬声器后腔320的内壁可阻碍填充腔321内的颗粒物322运动，从而减小颗粒物322在运动过程中的磨损，进而可防止由于颗粒物322磨损而导致的对扬声器后腔320的等效体积增大有限的问题。当然，除第一防尘网400外，还可通过孔板等透气隔离件形成填充腔321，或者可直接将颗粒物322填充 至扬声器后腔320以形成填充腔321，本申请不对形成填充腔321的方式作限定。
在一种可选的实施例中，第一防尘网400位于颗粒物322与导音通道102的第一端之间。本实施例中，第一防尘网400位于颗粒物322与导音通道102的第一端之间，如此第一防尘网400可防止填充腔321内的颗粒物322进入导音通道102内，进而可防止颗粒物322堵塞导音通道102而阻碍扬声器后腔320的声波、热量向扬声器前腔310传递的问题。可见，本实施例通过设置第一防尘网400就可达到减小颗粒物322在运动过程中产生的磨损，以及防止颗粒物322进入导音通道102内的两个目的，从而达到一物多用的效果。
可选地，扬声器壳体100包括外壳110，外壳110内设有容纳空间，扬声器主体200设于容纳空间内。可选地，可在外壳110的内部设置导音通道102，但这需要外壳110具有较大的壁厚，如此不仅会增大扬声器所占用电子设备内的体积，还会增加扬声器的重量，进而降低用户体验。
在一种可选的实施例中，扬声器还包括密封片500，外壳110的部分区域沿朝向容纳空间的方向凹陷，并形成开口背离容纳空间的导音槽，密封片500封盖导音槽的开口以形成导音通道102。本实施例中，外壳110的部分区域凹陷至容纳空间内以形成导音槽，导音槽与密封片500配合以形成导音通道102，如此无需在外壳110内开设导音通道102，因此本实施例可减小外壳110的壁厚，从而减小扬声器的体积、重量。此外，上一实施例的导音通道102一经形成后，其横截面的形状、横截面积无法改变，而本实施例可通过改变密封片500的形状，或者使用不同形状的密封片500封盖导音槽，如密封片500可以为平板结构，也可以为拱形结构等，如此可得到不同的横截面形状、横截面面积的导音通道102，这可调整导音通道102对扬声器后腔320的声波的改变能力，进而利于扬声器前腔310内的声波与扬声器后腔320内的声波正向叠加。
在一种可选的实施例中，导音通道102的第一端和导音通道102的第二端分别位于扬声器前腔310的相对的两侧。具体来讲，导音通道102的第一端和导音通道102的第二端分别位于扬声器前腔310沿自身长度方向的相对两侧，此时，导音通道102大致沿电子设备的显示屏所在平面延伸。本实施例中，导音通道102的两端分别位于扬声器前腔310的相对的两侧可增加导音通道102的长度，从而可提高导音通道102对扬声器后腔320的声波的相 位的改变能力，进而可使得扬声器后腔320内的声波的相位更趋近于扬声器前腔310内的声波的相位，增强两者正向叠加的效果。当然，导音通道102的第一端和导音通道102的第二端也可以分别位于扬声器前腔310的相邻的两侧，或者位于扬声器前腔310的同一侧。
在一种可选的实施例中，扬声器壳体100包括外壳110，外壳110包括壳本体111和顶盖112，顶盖112盖合于壳本体111，并与壳本体111可拆卸连接，导音通道102设于顶盖112。本实施例中，外壳110包括壳本体111和顶盖112，扬声器主体200可设于壳本体111内，顶盖112与壳本体111可拆卸连接，可将顶盖112从壳本体111上拆卸下来后再在顶盖112上加工导音通道102，如此加工导音通道102较为方便。
进一步地，扬声器壳体100还包括支撑件120，支撑件120设于所述壳本体111内，支撑件120围绕扬声器主体200的外周面设置并与顶盖112相连，扬声器主体200、支撑件120、壳本体111和顶盖112围绕形成扬声器前腔310，如此可使扬声器后腔320围绕扬声器前腔310设置，从而达到增大扬声器后腔320的体积的目的。可选地，顶盖112包括前腔盖113和后腔盖114，支撑件120与前腔盖113相连，且扬声器主体200、支撑件120、壳本体111和前腔盖113围绕形成扬声器前腔310，后腔盖114围绕前腔盖113的外周面设置，且后腔盖114的靠近前腔盖113的边缘与支撑件120可拆卸连接，后腔盖114与壳本体111可拆卸连接，导音通道102设于后腔盖114，如此可将后腔盖114从壳本体111和支撑件120上拆卸下来后再在后腔盖114上加工导音通道102，如此加工导音通道102更加方便。
本申请实施例还公开了一种电子设备，包括如上述任一项实施例所述的扬声器，电子设备还包括主板上盖800，扬声器壳体100具有朝向主板上盖800设置的配合面，导音通道102设于配合面，导音通道102位于配合面的远离主板上盖800的一侧，且朝向主板上盖800。具体地，导音通道102位于配合面的远离主板上盖800的一侧，如此可使扬声器壳体100的配合面与主板上盖800相贴合，进而利用主板上盖800和扬声器壳体100形成导音通道800，而无需额外使用密封片500等密封件来形成导音通道800，如此可压缩电子设备的体积。当然，本实施例也可与扬声器包括密封片500的技术方案组合，此时主板上盖800与密封片500相贴合，两者共同作用以形成导音通道800，并且主板上盖800可按压密封片500，使得密封片500的密封效果 更好。
可选地，电子设备包括中框700，中框700上设有出音孔710，出音孔710可与出音通道101相连通，扬声器发出的声波可通过出音孔710传播至外部环境中；在中框700与扬声器之间具有其他结构件的情况下，可在其他结构件上设置传音通孔，出音通道101与出音孔710之间可通过传音通孔相连通；进一步地，出音通道101的出口处以及传音通孔的出口处中的至少一者设有第二防尘网600。
本申请上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (12)

  1. 一种扬声器，包括扬声器壳体(100)和扬声器主体(200)，所述扬声器主体(200)设于所述扬声器壳体(100)内，所述扬声器主体(200)与扬声器壳体(100)之间形成扬声器前腔(310)和扬声器后腔(320)，
    所述扬声器壳体(100)还具有导音通道(102)，所述导音通道(102)的第一端与所述扬声器后腔(320)相连通，所述导音通道(102)的第二端与所述扬声器前腔(310)相连通，所述导音通道(102)用于改变所述扬声器后腔(320)内的声波的相位，以使所述扬声器前腔(310)内的声波与所述扬声器后腔(320)内的声波叠加。
  2. 根据权利要求1所述的扬声器，其中，所述导音通道(102)用于改变所述扬声器后腔(320)内的声波的相位，以使所述扬声器前腔(310)内的声波与所述扬声器后腔(320)内的声波正向叠加。
  3. 根据权利要求1所述的扬声器，其中，通过调节所述导音通道(102)的结构参数可使所述扬声器后腔(320)内的声波反相；
    其中，所述结构参数包括所述导音通道(102)的长度和横截面积中的至少一者。
  4. 根据权利要求1所述的扬声器，其中，所述扬声器后腔(320)包括填充腔(321)，所述填充腔(321)内填充有颗粒物(322)。
  5. 根据权利要求4所述的扬声器，其中，所述填充腔(321)位于所述扬声器主体(200)的沿第一方向上的一侧，
    其中，所述第一方向与所述扬声器的高度方向垂直。
  6. 根据权利要求4所述的扬声器，其中，所述填充腔(321)的至少一部分位于所述扬声器主体(200)的背离所述扬声器前腔(310)的一侧。
  7. 根据权利要求4所述的扬声器，其中，所述扬声器后腔(320)内设有第一防尘网(400)，所述第一防尘网(400)与所述扬声器后腔(320)的内壁共同形成所述填充腔(321)。
  8. 根据权利要求7所述的扬声器，其中，所述第一防尘网(400)位于所述颗粒物(322)与所述导音通道(102)的第一端之间。
  9. 根据权利要求1所述的扬声器，其中，所述扬声器还包括密封片(500)，所述扬声器壳体(100)包括外壳(110)，所述外壳(110)内设有容纳空间， 所述扬声器主体(200)设于所述容纳空间内，所述外壳(110)的部分区域沿朝向所述容纳空间的方向凹陷，并形成开口背离所述容纳空间的导音槽，所述密封片(500)封盖所述导音槽的开口以形成所述导音通道(102)。
  10. 根据权利要求1所述的扬声器，其中，所述导音通道(102)的第一端和所述导音通道(102)的第二端分别位于所述扬声器前腔(310)的相对的两侧。
  11. 根据权利要求1所述的扬声器，其中，所述扬声器壳体(100)包括外壳(110)，所述外壳(110)包括壳本体(111)和顶盖(112)，所述顶盖(112)盖合于所述壳本体(111)，并与所述壳本体(111)可拆卸连接，所述导音通道(102)设于所述顶盖(112)。
  12. 一种电子设备，包括如权利要求1至11中任一项所述的扬声器，所述电子设备还包括主板上盖(800)，所述扬声器壳体(100)具有朝向所述主板上盖(800)设置的配合面，所述导音通道(102)位于所述配合面的远离所述主板上盖(800)的一侧，且朝向所述主板上盖(800)。
PCT/CN2024/096547 2023-06-06 2024-05-31 扬声器及电子设备 Ceased WO2024251029A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103686550A (zh) * 2013-11-18 2014-03-26 歌尔声学股份有限公司 扬声器模组
CN203537552U (zh) * 2013-09-17 2014-04-09 富祐鸿科技股份有限公司 回路开口与振膜同侧的扬声器音箱
US20220078558A1 (en) * 2019-05-15 2022-03-10 Vivo Mobile Communication Co.,Ltd. Speaker and terminal device
CN116647797A (zh) * 2023-06-06 2023-08-25 维沃移动通信有限公司 扬声器及电子设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203537552U (zh) * 2013-09-17 2014-04-09 富祐鸿科技股份有限公司 回路开口与振膜同侧的扬声器音箱
CN103686550A (zh) * 2013-11-18 2014-03-26 歌尔声学股份有限公司 扬声器模组
US20220078558A1 (en) * 2019-05-15 2022-03-10 Vivo Mobile Communication Co.,Ltd. Speaker and terminal device
CN116647797A (zh) * 2023-06-06 2023-08-25 维沃移动通信有限公司 扬声器及电子设备

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