WO2024236768A1 - 切削工具 - Google Patents

切削工具 Download PDF

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Publication number
WO2024236768A1
WO2024236768A1 PCT/JP2023/018429 JP2023018429W WO2024236768A1 WO 2024236768 A1 WO2024236768 A1 WO 2024236768A1 JP 2023018429 W JP2023018429 W JP 2023018429W WO 2024236768 A1 WO2024236768 A1 WO 2024236768A1
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WO
WIPO (PCT)
Prior art keywords
layer
group
substrate
cutting tool
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/018429
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English (en)
French (fr)
Japanese (ja)
Inventor
望 月原
治世 福井
敏広 田畑
幸治 倉持
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to PCT/JP2023/018429 priority Critical patent/WO2024236768A1/ja
Priority to EP23937510.8A priority patent/EP4644021A4/en
Priority to CN202380093878.1A priority patent/CN120603665A/zh
Priority to JP2023565262A priority patent/JP7544294B1/ja
Priority to US18/577,284 priority patent/US12350743B2/en
Publication of WO2024236768A1 publication Critical patent/WO2024236768A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B27/00Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14Cutting tools of which the bits or tips or cutting inserts are of special material
    • B23B27/148Composition of the cutting inserts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B27/00Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14Cutting tools of which the bits or tips or cutting inserts are of special material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23CMILLING
    • B23C5/00Milling-cutters
    • B23C5/16Milling-cutters characterised by physical features other than shape
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641Nitrides
    • C23C14/0647Boron nitride
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0664Carbonitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325Electric arc evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34Nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/044Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B2228/00Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
    • B23B2228/10Coatings
    • B23B2228/105Coatings with specified thickness

Definitions

  • This disclosure relates to cutting tools.
  • JP 2022-095116 A discloses a cutting tool that includes a substrate and a coating disposed on the substrate, the coating including a first layer made of metallic tungsten and hexagonal ditungsten carbide.
  • the cutting tool of the present disclosure comprises: 1.
  • a cutting tool comprising a substrate and a coating disposed on the substrate, the coating comprises a first layer of hexagonal W(C 1-a N a ) x ;
  • the a is 0.3 or more and 0.8 or less, The cutting tool, wherein x is equal to or greater than 0.8 and equal to or less than 1.2.
  • FIG. 1 is a perspective view illustrating one embodiment of a cutting tool.
  • FIG. 2 is a schematic enlarged cross-sectional view of an example of the cutting tool according to the first embodiment.
  • FIG. 3 is a schematic enlarged cross-sectional view of another example of the cutting tool according to the first embodiment.
  • FIG. 4 is a schematic enlarged cross-sectional view of another example of the cutting tool according to the first embodiment.
  • the present disclosure therefore aims to provide a cutting tool that has a long tool life, especially in environments with high thermal loads such as when turning titanium alloys.
  • the cutting tool of the present disclosure can have a long tool life, especially in an environment of high thermal load such as during turning of titanium alloys.
  • the cutting tool of the present disclosure comprises: 1. A cutting tool comprising a substrate and a coating disposed on the substrate, the coating comprises a first layer of hexagonal W(C 1-a N a ) x ; The a is 0.3 or more and 0.8 or less, The cutting tool, wherein x is equal to or greater than 0.8 and equal to or less than 1.2.
  • the cutting tool disclosed herein has a long tool life, especially in environments with high thermal loads such as when turning titanium alloys.
  • a peak may exist in the range of diffraction angle 2 ⁇ of 46.0° or more and 47.0° or less.
  • the peak with a diffraction angle 2 ⁇ in the range of 46.0° to 47.0° (hereinafter also referred to as the "first peak") is a peak caused by the (105) plane of hexagonal tungsten nitride.
  • the presence of the first peak in the X-ray diffraction spectrum of the first layer further improves the heat resistance of the coating.
  • the thickness of the first layer may be 0.3 ⁇ m or more and 4.0 ⁇ m or less. This further improves the tool life.
  • the coating further includes a second layer disposed on an opposite side of the first layer from the substrate,
  • the second layer may be composed of at least one element selected from a first group consisting of Group 4 elements, Group 5 elements, Group 6 elements, aluminum, and silicon of the periodic table, or a compound composed of at least one element selected from the first group and at least one element selected from a second group consisting of carbon, nitrogen, oxygen, and boron.
  • the coating further includes a third layer disposed between the substrate and the first layer;
  • the third layer may be composed of at least one element selected from a first group consisting of Group 4 elements, Group 5 elements, Group 6 elements, aluminum, and silicon of the periodic table, or a compound composed of at least one element selected from the first group and at least one element selected from a second group consisting of carbon, nitrogen, oxygen, and boron.
  • the substrate may include at least one material selected from the group consisting of cemented carbide, cermet, high speed steel, ceramics, cubic boron nitride sintered body, and diamond sintered body, thereby providing a tool with excellent hardness and strength at high temperatures.
  • a ⁇ B means the upper and lower limits of a range (i.e., greater than or equal to A and less than or equal to B). If no unit is stated for A and only a unit is stated for B, the units of A and B are the same.
  • a cutting tool 10 according to one embodiment of the present disclosure (hereinafter also referred to as “embodiment 1”) includes: A cutting tool comprising a substrate 11 and a coating 14 disposed on the substrate 11, The coating includes a first layer 12 made of hexagonal W(C 1-a N a ) x ; The a is 0.3 or more and 0.8 or less, The cutting tool, wherein x is equal to or greater than 0.8 and equal to or less than 1.2.
  • the cutting tool of this embodiment has a long tool life, even in environments with high thermal loads, such as when turning titanium alloys.
  • the reason for this is believed to be as follows.
  • the first layer is made of hexagonal W(C 1-a N a ) x . Since the first layer contains C (carbon), the friction coefficient at the contact interface with the workpiece is reduced, and cutting resistance can be reduced. As a result, a cutting tool including the first layer has improved wear resistance and tool life.
  • the first layer contains N (nitrogen), which improves heat resistance compared to WC.
  • N nitrogen
  • cutting tools that contain the first layer have improved oxidation resistance and longer tool life in processes where the cutting edge becomes hot, such as dry cutting processes.
  • the cutting tool of this embodiment may be, for example, a drill, an end mill, an indexable cutting tip for a drill, an indexable cutting tip for an end mill, an indexable cutting tip for milling, an indexable cutting tip for turning, a metal saw, a gear cutting tool, a reamer, a tap, etc.
  • FIG. 1 is a perspective view illustrating one embodiment of a cutting tool.
  • a cutting tool having such a shape is used, for example, as an indexable cutting tip.
  • the cutting tool 10 has a rake face 1, a flank face 2, and a cutting edge ridge 3 where the rake face 1 and the flank face 2 intersect. That is, the rake face 1 and the flank face 2 are connected via the cutting edge ridge 3.
  • the cutting edge ridge 3 constitutes the tip of the cutting edge of the cutting tool 10.
  • the shape of such a cutting tool 10 can also be understood as the shape of the base material of the cutting tool. That is, the base material has a rake face, a flank face, and a cutting edge ridge that connects the rake face and the flank face.
  • the substrate of the present embodiment can be any substrate known in the art.
  • the substrate is preferably selected from the group consisting of cemented carbide (for example, tungsten carbide (WC)-based cemented carbide, cemented carbide containing Co in addition to WC, cemented carbide containing Cr, Ti, Ta, Nb, etc.
  • cemented carbide for example, tungsten carbide (WC)-based cemented carbide, cemented carbide containing Co in addition to WC, cemented carbide containing Cr, Ti, Ta, Nb, etc.
  • cermet mainly composed of TiC, TiN, TiCN, etc.
  • high-speed steel ceramics (titanium carbide, silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, etc.), cubic boron nitride sintered body (cBN sintered body) and diamond sintered body, and more preferably selected from the group consisting of cemented carbide, cermet and cBN sintered body.
  • the effect of this embodiment is exhibited even if such a cemented carbide contains free carbon or an abnormal phase called the ⁇ phase in the structure.
  • the substrate used in this embodiment may have a modified surface.
  • a de- ⁇ layer may be formed on the surface, and in the case of a cermet, a surface hardened layer may be formed. The effect of this embodiment is exhibited even if the surface is modified in this way.
  • the base material may or may not have a chip breaker.
  • the shape of the ridge portion of the cutting edge may be any of the following: sharp edge (the ridge where the rake face and flank intersect), honing (a shape in which a radius is added to a sharp edge), negative land (a chamfered shape), or a combination of honing and negative land.
  • the "coating" according to this embodiment has the effect of improving various properties such as chipping resistance and wear resistance of the cutting tool by covering at least a part of the substrate (for example, a part involved in cutting that comes into contact with the workpiece during cutting).
  • the coating can cover at least the part involved in cutting.
  • the coating may cover the entire surface of the substrate. Even if the configuration of the coating is partially different, it does not deviate from the scope of this embodiment.
  • the part involved in cutting of the substrate means, for example, an area on the surface of the substrate that is within 50 ⁇ m from the cutting edge line.
  • the coating may cover the entire surface of the part involved in cutting of the substrate.
  • the coating includes a first layer made of hexagonal W(C 1-a N a ) x .
  • Figure 2 is a schematic cross-sectional view of a cutting tool according to one aspect of the present embodiment. As shown in Figure 2, the first layer 12 may be provided directly on the substrate 11.
  • the coating may include other layers in addition to the first layer 12.
  • the other layers include a third layer 15 disposed between the substrate 11 and the first layer 12 as shown in FIG. 4, and a second layer 13 disposed on the side of the first layer 12 opposite the substrate 11 as shown in FIGS. 3 and 4.
  • the thickness of the coating may be 0.3 ⁇ m or more and 10 ⁇ m or less, 0.5 ⁇ m or more and 10 ⁇ m or less, 1 ⁇ m or more and 6 ⁇ m or less, or 1.5 ⁇ m or more and 4 ⁇ m or less. If the thickness of the coating is less than 0.1 ⁇ m, the abrasion resistance tends to decrease. If the thickness of the coating exceeds 10 ⁇ m, for example, peeling or destruction of the coating tends to occur frequently when a large stress is applied between the coating and the substrate during intermittent processing.
  • the thickness of the coating refers to the sum of the thicknesses of the layers that make up the coating, such as the first layer, second layer, and third layer, which will be described later.
  • the thickness of the coating is measured using a transmission electron microscope (TEM) to measure any three points on a cross-sectional sample parallel to the normal direction of the substrate surface, and then averaging the thicknesses measured at the three points.
  • TEM transmission electron microscope
  • An example of a transmission electron microscope is the spherical aberration corrector "JEM-2100F (trademark)" manufactured by JEOL Ltd.
  • JEM-2100F spherical aberration corrector
  • the coating includes a first layer made of hexagonal W(C 1-a N a ) x (wherein a is 0.3 to 0.8, and x is 0.8 to 1.2).
  • Hexagonal W(C 1-a N a ) x means W(C 1-a N a ) x having a hexagonal crystal structure.
  • the hexagonal crystal structure of the first layer suppresses the diffusion reaction between the coating and the workpiece, reduces adhesion of the workpiece, and improves tool life.
  • the first layer can improve the heat resistance, oxidation resistance, and wear resistance of the coating.
  • the first layer may contain inevitable impurities in addition to hexagonal W(C 1-a N a ) x , as long as the effects of the cutting tool according to this embodiment are not impaired.
  • the inevitable impurities include iron (Fe), calcium (Ca), zinc (Zn), sodium (Na), fluorine (F), nickel (Ni), molybdenum (Mo), and chromium (Cr).
  • the content ratio of the inevitable impurities is preferably 0 mass% or more and 0.2 mass% or less with respect to the total mass of the first layer. The content ratio of the inevitable impurities is measured by glow discharge mass spectrometry.
  • the "second layer” and the "third layer” described later may contain inevitable impurities as long as the effects of the cutting tool according to this disclosure are not impaired.
  • the first layer is made of W(C 1-a N a ) x , which is a hexagonal crystal structure.
  • peaks originating from layers other than the first layer or from the substrate may be detected in the XRD spectrum.
  • the peaks originating from the first layer are identified by the following method.
  • XRD measurement is performed on the coating by irradiating the surface of the measurement sample opposite the substrate with X-rays, and diffraction pattern A is obtained.
  • the layer on the surface side (X-ray irradiated side) of the measurement sample that is closer to the surface than the first layer is mechanically removed to expose the first layer.
  • XRD measurement is performed on the exposed surface of the first layer by irradiating X-rays, and diffraction pattern B is obtained.
  • the first layer of the measurement sample is mechanically removed to expose the layer closer to the substrate than the first layer.
  • XRD measurement is performed on the exposed surface of the layer by irradiating X-rays, and diffraction pattern C is obtained.
  • Peaks derived from the first layer are identified by comparing diffraction patterns A, B, and C.
  • the X-ray diffraction spectrum in which peaks derived from the first layer are identified by the above-mentioned procedure is referred to as the "X-ray diffraction spectrum of the first layer.”
  • Apparatuses used for the above X-ray diffraction measurements include "SmartLab” (product name) manufactured by Rigaku Corporation and "X'pert” (product name) manufactured by PANalytical.
  • XRD measurement conditions Scanning axis: 2 ⁇ - ⁇ X-ray source: Cu-K ⁇ ray (1.541862 ⁇ ) Detector: 0-dimensional detector (scintillation counter) Tube voltage: 45 kV Tube current: 40mA Incident optical system: Use of mirrors Receiving optical system: Use of analyzer crystal (PW3098/27) Step: 0.03° Accumulation time: 2 seconds Scan range (2 ⁇ ): 10° to 120°
  • a peak may be present in the range of diffraction angle 2 ⁇ of 46.0° or more and 47.0° or less.
  • the peak in the range of diffraction angle 2 ⁇ of 46.0° or more and 47.0° or less (hereinafter also referred to as the "first peak") is a peak due to hexagonal tungsten nitride.
  • the first layer is made of hexagonal W(C 1-a N a ) x , where a is 0.3 or more and 0.8 or less, and x is 0.8 or more and 1.2 or less.
  • the lower limit of a is 0.3 or more, may be 0.4 or more, or may be 0.5 or more.
  • the upper limit of a is 0.8 or less, may be 0.7 or less, or may be 0.6 or less.
  • a may be 0.4 or more and 0.7 or less, or may be 0.5 or more and 0.6 or less.
  • the lower limit of x is 0.8 or more, and may be 0.9 or more.
  • the upper limit of x is 1.2 or less, and may be 1.1 or less.
  • x may be 0.9 or more and 1.1 or less, or may be 1.0.
  • the first layer is made of hexagonal W(C 1-a N a ) x
  • the first layer may contain inevitable impurities in addition to W(C 1-a N a ) x , as long as the effect of the present disclosure is not impaired.
  • inevitable impurities include oxygen and carbon.
  • the total content of inevitable impurities in the first unit layer 12 may be greater than 0 atomic % and less than 1 atomic %.
  • atomic % means the ratio (%) of the number of atoms to the total number of atoms constituting the layer.
  • the above a is measured using electron energy loss spectroscopy (TEM-EELS).
  • TEM-EELS electron energy loss spectroscopy
  • the cutting tool is cut in a direction normal to the surface of the coating using an argon ion slicer to prepare a slice of 3 to 100 nm thickness that includes the cross section of the coating.
  • the slice is observed at 100,000 to 1,000,000 times magnification using a transmission electron microscope (TEM, product name: "JEM-2100F/Cs", manufactured by JEOL Ltd.) to obtain a cross-sectional transmission image of the coating.
  • the cross-sectional transmission image is scanned using electron energy loss spectroscopy (EELS) with a 10 nm square observation spot to observe the energy loss curve associated with the excitation of carbon and nitrogen electrons.
  • EELS electron energy loss spectroscopy
  • the parallel intensity of 270 to 280 eV for carbon and 385 to 395 eV for nitrogen are defined as background intensity, and the ratio of the carbon energy to the nitrogen energy is calculated. This allows the above a to be obtained.
  • the ratio A N1 /A M1 of the total number of C and N atoms A N1 to the number of W atoms A M1 is 0.8 or more and 1.2 or less.
  • the ratio A N1 /A M1 can be measured by a Rutherford backscattering (RBS) method. It has been confirmed that the effect of the present disclosure is not impaired as long as the ratio A N1 /A M1 is within the above range.
  • the lower limit of the thickness of the first layer may be 0.2 ⁇ m or more. This suppresses the diffusion reaction between the first layer and the workpiece.
  • the lower limit of the thickness of the first layer may be 0.3 ⁇ m or more, 0.5 ⁇ m or more, 0.7 ⁇ m or more, or 0.9 ⁇ m or more.
  • the upper limit of the thickness of the first layer may be 5.0 ⁇ m or less. This provides a coating with high hardness and good wear resistance.
  • the upper limit of the thickness of the first layer may be 4.0 ⁇ m or less, 2.0 ⁇ m or less, or 1.5 ⁇ m or less.
  • the coating 14 may further include a second layer 13 provided on the side of the first layer 12 opposite the substrate 11.
  • “provided on the side of the first layer opposite the substrate” means that the second layer 13 is provided on the upper side (the side away from the substrate) of the first layer 12, and the first layer 12 and the second layer 13 do not need to be in contact with each other.
  • another layer may be provided between the first layer 12 and the second layer 13.
  • the second layer 13 may be provided directly on the first layer 12.
  • the second layer 13 may be the outermost layer.
  • the second layer may be made of at least one element selected from the first group consisting of Group 4 elements, Group 5 elements, Group 6 elements, aluminum (Al) and silicon (Si), or a compound consisting of at least one element selected from the first group and at least one element selected from the second group consisting of carbon (C), nitrogen (N), oxygen (O) and boron (B).
  • Group 4 elements include titanium (Ti), zirconium (Zr), hafnium (Hf), etc.
  • Group 5 elements include vanadium (V), niobium (Nb), tantalum (Ta), etc.
  • Group 6 elements include chromium (Cr), molybdenum (Mo), tungsten (W), etc.
  • the second layer may contain impurities in addition to at least one element selected from Group 1 or the above compound.
  • the second layer can be made of at least one element selected from Group 1A consisting of Cr, Al, Ti and Si, or a compound consisting of at least one element selected from Group 1A and at least one element selected from Group 2 consisting of carbon, nitrogen, oxygen and boron.
  • Examples of compounds constituting the second layer include AlTiBN, TiAlN, TiAlON, Al2O3 , TiAlSiN, TiCrSiN, TiAlCrSiN, AlCrN, AlCrO, AlCrON, AlCrSiN, AlCrBN, TiZrN, TiAlMoN, TiAlNbN, TiSiN, AlCrTaN, AlVN, AlTiVN, TiB2 , TiCrHfN, CrSiWN, TiAlCN, TiSiCN, AlZrON, AlCrCN, AlHfN, CrSiBON, TiAlWN, AlCrMoCN, TiCN, TiCON, ZrN, and ZrCN. These compounds can reduce the friction coefficient of the coating and extend the life of the cutting tool.
  • the thickness of the second layer may be 0.1 ⁇ m or more.
  • the thickness of the second layer is 0.1 ⁇ m or more, the lubricity imparting effect of the second layer is easily obtained.
  • the thickness of the second layer may be 2 ⁇ m or less.
  • the coating 14 may further include a third layer 15 disposed between the substrate 11 and the first layer 12. This can increase the adhesion between the substrate 11 and the coating 14.
  • the third layer may be made of at least one element selected from the first group consisting of Group 4, Group 5, and Group 6 elements, aluminum (Al), and silicon (Si), or a compound consisting of at least one element selected from the first group and at least one element selected from the second group consisting of carbon (C), nitrogen (N), oxygen (O), and boron (B).
  • Group 4 elements include titanium (Ti), zirconium (Zr), and hafnium (Hf).
  • Group 5 elements include vanadium (V), niobium (Nb), and tantalum (Ta).
  • Group 6 elements include chromium (Cr), molybdenum (Mo), and tungsten (W).
  • the third layer may contain impurities in addition to at least one element selected from Group 1 or the above compound.
  • Examples of compounds constituting the third layer include TiWCN, TiN, TiAlN, TiAlON, Al2O3 , TiAlSiN, TiCrSiN, TiAlCrSiN, AlCrN, AlCrO, AlCrON, AlCrSiN, AlCrBN, TiZrN, TiAlMoN, TiAlNbN, TiSiN, AlCrTaN, AlVN, AlTiVN, TiB2 , TiCrHfN, CrSiWN, TiAlCN, TiSiCN, AlZrON, AlCrCN, AlHfN, CrSiBON, TiAlWN, AlCrMoCN, TiCN, TiCON, ZrN and ZrCN.
  • the coating may include an intermediate layer disposed between the second layer and the first layer, or between the first layer and the third layer.
  • the intermediate layer include TiAlCeN, AlTiN, AlTiBN, AlTiSiN, AlTiYN, AlTiLaN, etc.
  • the thickness of the intermediate layer may be 0.1 ⁇ m to 2 ⁇ m, 0.3 ⁇ m to 1.5 ⁇ m, or 0.4 ⁇ m to 1.0 ⁇ m.
  • the method for manufacturing the cutting tool according to this embodiment includes a first step of preparing a substrate and a second step of forming a coating on the substrate.
  • the second step includes a step of forming a first layer. Each step will be described below.
  • a substrate is prepared.
  • the substrate may be the substrate described in the first embodiment.
  • a coating is formed on the substrate.
  • the second step includes a step of forming a first layer. Examples of a method for forming the first layer include a physical vapor deposition method (PVD method).
  • Physical vapor deposition methods include, for example, sputtering, ion plating, arc ion plating, and electron ion beam deposition.
  • the use of cathodic arc ion plating or sputtering, which have a high ionization rate of the raw material elements, is preferable because it allows metal or gas ion bombardment treatment of the substrate surface before forming the coating, thereby significantly improving the adhesion between the coating and the substrate.
  • WC targets for example, binderless WC with a composition of 93% or more by mass of WC and a sintered target with a C content of 3 to 6.1% by mass
  • the substrate temperature is set to 400 to 550°C
  • the gas pressure in the device is set to 1.5 to 5.5 Pa.
  • nitrogen (N 2 ) gas or a mixture of nitrogen gas and argon gas is introduced.
  • an arc current of 80-150A is supplied to the cathode electrode, and metal ions and the like are generated from the arc evaporation source to form a first layer on the substrate.
  • the tungsten filament also discharges during film formation (emission current 30-45A). This allows the number of ions in the plasma to be increased.
  • An example of a device used for the arc ion plating method is the AIP (product name) manufactured by Kobe Steel, Ltd.
  • the substrate temperature, gas pressure, bias voltage, frequency, arc current, and emission current during film formation are kept constant within the above ranges.
  • the second step can include a surface treatment step of the coating, such as grinding or shot blasting, in addition to the step of forming the first layer.
  • the second step can also include a step of forming other layers, such as the second layer, the third layer, and an intermediate layer.
  • the other layers can be formed by a conventionally known chemical vapor deposition method or a physical vapor deposition method. From the viewpoint that the other layers can be formed continuously with the first layer in one physical vapor deposition apparatus, it is preferable to form the other layers by a physical vapor deposition method.
  • ⁇ Cutting tool manufacturing> [Samples 1 to 22, Samples 101 to 105] ⁇ First step> In the first step, a JIS K10 cemented carbide (shape: JIS CNMG120408) was prepared as a substrate. Next, the substrate was set at a predetermined position in an arc ion plating device (manufactured by Kobe Steel, Ltd., product name: AIP).
  • ⁇ Second step> a coating including a first layer was formed on the substrate by arc ion plating to obtain each cutting tool sample.
  • the first layer was formed by the following method. First, WC targets (sintered targets with a composition of 93% or more by weight of WC and a C content of 3 to 6.1% by weight) were set in two opposing arc-type evaporation sources in the apparatus. The substrate temperature was set to 400 to 550°C, and the gas pressure in the apparatus was set to 1.5 to 5.5 Pa.
  • nitrogen (N 2 ) gas or a mixed gas of nitrogen gas and argon gas was introduced.
  • the substrate (negative) bias voltage was maintained at 10 to 150 V and DC or pulse DC (frequency 20 to 50 kHz), and an arc current of 80 to 150 A was supplied to the cathode electrode to generate metal ions and the like from the arc evaporation source, forming a first layer on the substrate.
  • a tungsten filament was also discharged during film formation (emission current 30 to 45 A).
  • the substrate temperature, gas pressure, bias voltage, frequency, and emission current during film formation were kept constant within the above ranges.
  • the gas composition, gas pressure, arc current, and bias voltage were adjusted within the above ranges to adjust the composition of the first layer and the presence or absence of a first peak in the XRD spectrum of the first layer (a peak in the range where the diffraction angle 2 ⁇ is 46.0° to 47.0°).
  • a third layer was provided between the substrate and the first layer.
  • the third layer was formed directly on the substrate using the following procedure before the formation of the first layer.
  • a target (sintered target) containing the metal composition in the column for the composition of the third layer in Table 1 was set in the arc evaporation source of the arc ion plating device.
  • the substrate temperature was set to 600°C and the gas pressure in the device was set to 3.5 Pa.
  • a mixed gas of nitrogen gas, methane gas, and argon gas was introduced as the reactive gas.
  • an arc current of 130 A was supplied to the cathode electrode. The supply of the arc current generated metal ions and the like from the arc evaporation source, forming the third layer to the thickness listed in Table 1.
  • a second layer was provided on top of the first layer.
  • the second layer was formed directly on top of the first layer after the formation of the first layer, using the following procedure.
  • a target (sintered target) containing the metal composition in the column for the composition of the second layer listed in Table 1 was set in the arc evaporation source of the arc ion plating device.
  • the substrate temperature was set to 550°C and the gas pressure inside the device was set to 4.0 Pa. Nitrogen was introduced as the reactive gas.
  • an arc current of 150 A was supplied to the cathode electrode. The supply of the arc current generated metal ions and the like from the arc evaporation source, forming a second layer to the thickness listed in Table 1.
  • the gas pressure was set to 1.0 Pa, a mixture of nitrogen gas and argon gas was introduced, the bias voltage was set to 100 V, and the other conditions were the same as for samples 1 to 22.
  • the gas pressure was set to 4.0 Pa, a mixture of nitrogen gas and argon gas was introduced, the bias voltage was set to 200 V, the arc current was set to 150 A, and the other conditions were the same as for samples 1 to 22.
  • the gas pressure was set to 5.0 Pa, a mixture of nitrogen gas and argon gas was introduced, the bias voltage was set to 500 V, the arc current was set to 190 A, and the other conditions were the same as for samples 1 to 22.
  • Sample 106 A substrate identical to that of Sample 1 was prepared, and a coating was formed on the substrate in the same manner as that of Sample 15 of Patent Document 1 to obtain a cutting tool of Sample 106.
  • hexagonal in the "crystal structure” column indicates that the first layer does not contain tungsten carbide or tungsten nitride, which have a cubic crystal structure, and indicates that the first layer is made of hexagonal W(C1 -aNa ) x , which has a hexagonal crystal structure.
  • the notation "Hexagonal + Cubic" in the "Crystal Structure” column indicates that the first layer contained a mixture of hexagonal tungsten nitride (hexagonal WN), hexagonal tungsten carbide (hexagonal WC), and at least one of cubic WN and W 3 C. If at least one of the peaks shown in JCPDS (ICDD) Card 01-075-1012 (WN) and 00-042-0853 (W 3 C) is observed in the XRD spectrum of the first layer, the first layer contains a cubic crystal structure.
  • the "W+hW 2 C" in the "Crystal Structure” column for Sample 106 indicates that the first layer is composed of metallic tungsten and hexagonal ditungsten carbide.
  • composition of the first layer of each sample was measured using electron energy loss spectroscopy (TEM-EELS) and Rutherford backscattering (RBS). When the second and third layers were formed, their compositions were also measured. The specific measurement method is described in the first embodiment, and therefore the description will not be repeated. The results are shown in the “a” and “x” columns of "First layer (W(C 1-a N a ) x )", the “Composition” column of "Second layer”, and the “Composition” column of "Third layer” in Table 1.
  • ⁇ Thickness of each layer> The thicknesses of the first layer, the second layer, the third layer, and the coating were measured using a transmission electron microscope (TEM) (manufactured by JEOL Ltd., product name: JEM-2100F). The specific measurement method is described in embodiment 1, and therefore the description will not be repeated. The results are shown in the "Thickness" column of each layer in Table 1.
  • TEM transmission electron microscope
  • Cutting tools Samples 1 to 22 correspond to examples, and cutting tools Samples 101 to 106 correspond to comparative examples. The results of the cutting tests confirmed that cutting tools Samples 1 to 22 have a longer tool life, even in environments with high thermal loads, than cutting tools Samples 101 to 106.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
PCT/JP2023/018429 2023-05-17 2023-05-17 切削工具 Ceased WO2024236768A1 (ja)

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PCT/JP2023/018429 WO2024236768A1 (ja) 2023-05-17 2023-05-17 切削工具
EP23937510.8A EP4644021A4 (en) 2023-05-17 2023-05-17 CUTTING TOOL
CN202380093878.1A CN120603665A (zh) 2023-05-17 2023-05-17 切削工具
JP2023565262A JP7544294B1 (ja) 2023-05-17 2023-05-17 切削工具
US18/577,284 US12350743B2 (en) 2023-05-17 2023-05-17 Cutting tool

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JP2024519615A (ja) * 2021-05-07 2024-05-20 エービー サンドビック コロマント 切削工具

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CN120099455B (zh) * 2025-05-08 2025-07-18 赣州澳克泰工具技术有限公司 一种复合涂层刀具及其制备方法和应用

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JP2024519615A (ja) * 2021-05-07 2024-05-20 エービー サンドビック コロマント 切削工具

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EP4644021A1 (en) 2025-11-05
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