WO2024185135A1 - 電気回路形成方法、および電気回路形成装置 - Google Patents

電気回路形成方法、および電気回路形成装置 Download PDF

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Publication number
WO2024185135A1
WO2024185135A1 PCT/JP2023/009100 JP2023009100W WO2024185135A1 WO 2024185135 A1 WO2024185135 A1 WO 2024185135A1 JP 2023009100 W JP2023009100 W JP 2023009100W WO 2024185135 A1 WO2024185135 A1 WO 2024185135A1
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WO
WIPO (PCT)
Prior art keywords
conductive fluid
conductive paste
electronic component
curing
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/009100
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English (en)
French (fr)
Japanese (ja)
Inventor
亮 榊原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to PCT/JP2023/009100 priority Critical patent/WO2024185135A1/ja
Priority to IL322346A priority patent/IL322346A/en
Priority to CN202380095310.3A priority patent/CN120731664A/zh
Priority to EP23926345.2A priority patent/EP4679948A4/en
Priority to JP2025505038A priority patent/JPWO2024185135A1/ja
Publication of WO2024185135A1 publication Critical patent/WO2024185135A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0182—Using a temporary spacer element or stand-off during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the present invention relates to a method for forming an electrical circuit that connects metal wiring formed on a resin layer to electrodes of an electronic component using a conductive fluid.
  • Patent Document 1 describes a technology for connecting metal wiring formed on a resin layer to electrodes of electronic components using a conductive fluid.
  • the objective of the present invention is to ensure proper electrical continuity between metal wiring formed on a resin layer and electrodes of electronic components when the metal wiring is connected to the electrodes of electronic components using a conductive fluid.
  • this specification discloses a method for forming an electric circuit, including a wiring forming step of forming metal wiring on a resin layer, a first application step of applying a conductive fluid to a position on the metal wiring where an electrode of an electronic component is to be mounted, a first curing step of curing the conductive fluid applied in the first application step, a second application step of applying a conductive fluid on the conductive fluid cured in the first curing step, a mounting step of mounting the electronic component so that the electrode comes into contact with the conductive fluid applied in the second application step, and a second curing step of curing the conductive fluid applied in the second application step after the electronic component is mounted in the mounting step.
  • the present specification also discloses an electric circuit forming apparatus that includes a wiring forming apparatus that forms metal wiring, an application apparatus that applies a conductive fluid, a curing apparatus that hardens the conductive fluid, a mounting apparatus that mounts electronic components, and a control device, and the control device executes the following steps: a wiring forming process in which the wiring forming apparatus forms metal wiring on a resin layer; a first application process in which the application apparatus applies a conductive fluid to a position on the metal wiring where an electrode of an electronic component is to be mounted; a first curing process in which the curing apparatus hardens the conductive fluid applied in the first application process; a second application process in which the application apparatus applies a conductive fluid on the conductive fluid hardened in the first curing process; an installation process in which the installation apparatus installs the electronic component so that the electrode comes into contact with the conductive fluid applied in the second application process; and a second curing process in which the curing apparatus hardens the conductive fluid applied in the second application process after the electronic component is mounted
  • a conductive fluid is applied to the intended mounting position of the electrode of the electronic component on the metal wiring, and the conductive fluid is hardened. Then, a conductive fluid is applied on top of the hardened conductive fluid, the electronic component is mounted so that the electrode is in contact with the conductive fluid, and the conductive fluid in contact with the electrode is hardened. This makes it possible to properly ensure conductivity between the metal wiring and the electrode of the electronic component.
  • FIG. 1 is a diagram illustrating an example of a circuit forming device.
  • FIG. 2 is a block diagram showing an example of a control device.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board on which a resin laminate has been formed.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in which wiring is formed on a resin laminate.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in which a resin laminate is further formed on the resin laminate.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in which a conductive paste is applied onto wiring.
  • FIG. 1 is a cross-sectional view showing an example of a circuit board in a state in which a thermosetting resin is applied onto a resin layer.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board on which electronic components are mounted.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in a state in which an electronic component is pressed against a resin laminate.
  • 1 is a cross-sectional view showing an example of a circuit board in which a thermosetting resin is applied around an electronic component.
  • 1 is a cross-sectional view showing an example of a circuit board in which wiring and electrodes of an electronic component are connected by thin bumps.
  • FIG. 1 is a cross-sectional view showing an example of a circuit board in a state in which a thermosetting resin is applied onto a resin layer.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board on which electronic components are mounted.
  • FIG. 2 is a cross-sectional
  • FIG. 2 is a cross-sectional view showing an example of a circuit board on which a conductive fluid has been dispensed onto a hardened conductive fluid.
  • FIG. 13 is a diagram showing an example of a circuit board when a first stage of conductive fluid is discharged. 13 is a diagram showing an example of a circuit board when a second stage of conductive fluid is discharged.
  • FIG. 1 is a cross-sectional view showing an example of a circuit board in a state in which a thermosetting resin is applied onto a resin layer.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board on which electronic components are mounted.
  • FIG. 2 is a cross-sectional view showing an example of a circuit board in a state in which an electronic component is pressed against a resin laminate.
  • 1 is a cross-sectional view showing an example of a circuit board in which a thermosetting resin is applied around an electronic component.
  • FIG. 1 shows an example of a circuit forming device 10.
  • the circuit forming device 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 23, a third modeling unit 24, a fourth modeling unit 25, a pressing unit 26, a mounting unit 27, and a control device (see FIG. 2) 28.
  • the conveying device 20, the first modeling unit 22, the second modeling unit 23, the third modeling unit 24, the fourth modeling unit 25, the pressing unit 26, and the mounting unit 27 are arranged on a base 29 of the circuit forming device 10.
  • the base 29 is generally rectangular in shape, and in the following description, the longitudinal direction of the base 29 is referred to as the X-axis direction, the lateral direction of the base 29 as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 29 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 also includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by the drive of the electromagnetic motor 38.
  • the Y-axis slide mechanism 32 also includes a Y-axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • the stage 52 is held by the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to any position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to any position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, a lifting device (see FIG. 2) 64, and a heater (see FIG. 2) 66.
  • the base 60 is formed in a flat plate shape, and a substrate is placed on the upper surface.
  • the holding devices 62 are provided on both sides of the base 60 in the X-axis direction.
  • the substrate is fixedly held by clamping both edges in the X-axis direction of the substrate placed on the base 60 between the holding devices 62.
  • the lifting device 64 is disposed below the base 60, and raises and lowers the base 60.
  • the heater 66 is built into the base 60, and heats the substrate placed on the base 60 to a desired temperature.
  • the first modeling unit 22 is a unit that models the wiring of the circuit board, and has a first printing section 72 and a baking section 74.
  • the first printing section 72 has an inkjet head (see FIG. 2) 76 that ejects metal ink in lines.
  • the metal ink is a dispersion of nanometer-sized metal particles, such as silver particles, in a solvent. The surfaces of the metal particles are coated with a dispersant to prevent agglomeration in the solvent.
  • the inkjet head 76 ejects the metal ink from multiple nozzles, for example, by a piezo method using piezoelectric elements.
  • the baking section 74 has an infrared irradiation device 78 (see Figure 2).
  • the infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays.
  • the metal ink irradiated with infrared rays is baked, and wiring is formed.
  • baking of metal ink is a phenomenon in which, by applying energy, the solvent is evaporated and the protective film for the metal particles, i.e., the dispersant is decomposed, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, by baking the metal ink, metal wiring is formed.
  • the second modeling unit 23 is a unit that models the resin layer of the circuit board, and has a second printing unit 84 and a curing unit 86.
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88 that ejects ultraviolet curable resin.
  • the ultraviolet curable resin is a resin that hardens when exposed to ultraviolet light.
  • the inkjet head 88 may be, for example, a piezo type that uses a piezoelectric element, or a thermal type that heats the resin to generate bubbles and ejects the resin from multiple nozzles.
  • the curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the top surface of the UV-curable resin discharged by the inkjet head 88, for example by leveling the surface of the UV-curable resin while scraping off excess resin with a roller or blade, thereby making the thickness of the UV-curable resin uniform.
  • the irradiation device 92 has a mercury lamp or LED as a light source, and irradiates the discharged UV-curable resin with ultraviolet light. This hardens the discharged UV-curable resin, forming a resin layer.
  • the third modeling unit 24 is a unit that models the connection parts between the electrodes of electronic components and the wiring on the circuit board, and has a third printing unit 100.
  • the third printing unit 100 has a dispenser (see FIG. 2) 106 that dispenses conductive paste.
  • the conductive paste is a resin that hardens when heated at a relatively low temperature, with micrometer-sized metal particles dispersed in it. The metal particles are in the form of flakes, and the viscosity of the conductive paste is relatively high compared to metal ink.
  • the dispenser 106 can change the amount of ink dispensed per unit time by adjusting the pressure during dispensing. On the other hand, the dispenser 106 can also change the amount of ink dispensed by changing the dispensing time while keeping the amount of ink dispensed per unit time constant.
  • the conductive paste dispensed by the dispenser 106 is then heated by the heater 66 built into the base 60.
  • the resin in the heated conductive paste hardens.
  • the resin in the conductive paste hardens and shrinks, and the flake-shaped metal particles dispersed in the resin come into contact with each other. This allows the conductive paste to exhibit conductivity.
  • the resin in the conductive paste is an organic adhesive, and exerts adhesive power by hardening when heated.
  • the conductive paste hardens at, for example, approximately 80°C.
  • the fourth modeling unit 25 is a unit that models resin for fixing electronic components to a circuit board, and has a fourth printing unit 110.
  • the fourth printing unit 110 has a dispenser 116 (see FIG. 2) that dispenses thermosetting resin.
  • Thermosetting resin is resin that hardens when heated.
  • the dispenser 116 is, for example, an air pulse type that uses compressed air.
  • the thermosetting resin dispensed by the dispenser 116 is heated by a heater 66 built into the base 60 and hardens.
  • the thermosetting resin hardens at, for example, about 80°C.
  • the pressing unit 26 is a unit for pressing the circuit board, and has a pressing section 120.
  • the pressing section 120 has a pressing plate (see FIG. 9) 122, a rubber plate (see FIG. 9) 124, and a cylinder (see FIG. 2).
  • the rubber plate 124 is molded, for example, from silicon rubber and has a plate shape.
  • the pressing plate 122 is molded, for example, from steel and has a plate shape.
  • the rubber plate 124 is attached to the underside of the pressing plate 122, and the pressing plate 122 is pressed against the circuit board by the operation of the cylinder 126. As a result, the circuit board is pressed by the pressing plate 122 via the rubber plate 124.
  • the force pressing the board can be controllably changed by controlling the operation of the cylinder 126.
  • the mounting unit 27 is a unit that mounts electronic components on a circuit board, and has a supply section 130 and a mounting section 132.
  • the supply section 130 has multiple tape feeders (see FIG. 2) 134 that feed taped electronic components one by one, and supplies the electronic components at a supply position.
  • the supply section 130 is not limited to tape feeders 134, and may be a tray-type supply device that picks up and supplies electronic components from a tray.
  • the supply section 130 may also be configured to include both tape-type and tray-type supply devices, or other types of supply devices.
  • the mounting section 132 has a mounting head (see FIG. 2) 136 and a moving device (see FIG. 2) 138.
  • the mounting head 136 has a suction nozzle (not shown) for suctioning and holding electronic components.
  • the suction nozzle sucks and holds the electronic component by sucking air when negative pressure is supplied from a positive and negative pressure supply device (not shown).
  • the positive and negative pressure supply device then supplies a slight positive pressure to release the electronic component.
  • the moving device 138 also moves the mounting head 136 between the supply position of electronic components by the tape feeder 134 and the board placed on the base 60. As a result, in the mounting section 132, the electronic component supplied from the tape feeder 134 is held by the suction nozzle, and the electronic component held by the suction nozzle is mounted on the board.
  • the control device 28 includes a controller 140 and a plurality of drive circuits 142.
  • the plurality of drive circuits 142 are connected to the electromagnetic motors 38, 56, the holding device 62, the lifting device 64, the heater 66, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the dispenser 106, the dispenser 116, the cylinder 126, the tape feeder 134, the mounting head 136, and the moving device 138.
  • the controller 140 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to the plurality of drive circuits 142.
  • a resin laminate is formed on the base 60 with the above-mentioned configuration, and wiring is formed on the upper surface of the resin laminate. Then, the electrodes of the electronic components are electrically connected to the wiring via the conductive paste, and the electronic components are fixed with resin to form a circuit board.
  • a process for forming a circuit board will now be described. Specifically, first, the stage 52 is moved below the second modeling unit 23. Then, in the second modeling unit 23, as shown in FIG. 3, a resin laminate 152 is formed on the base 60 of the stage 52.
  • the resin laminate 152 is formed by repeatedly ejecting ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet light by the irradiation device 92.
  • the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the upper surface of the base 60.
  • the ultraviolet curing resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curing resin is uniform.
  • the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet light. This forms a thin film resin layer 153 on the base 60.
  • the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin film resin layer 153.
  • the thin film of ultraviolet curable resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ejected thin film of ultraviolet curable resin with ultraviolet light, thereby laminating a thin film of resin layer 153 on top of the thin film of resin layer 153.
  • the ejection of ultraviolet curable resin onto the thin film of resin layer 153 and the irradiation of ultraviolet light are repeated, and multiple resin layers 153 are laminated to form a resin laminate 152.
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 ejects the metal ink 160 in a line shape according to the circuit pattern onto the upper surface of the resin laminate 152, as shown in FIG. 4.
  • the infrared irradiation device 78 irradiates the metal ink 160 ejected according to the circuit pattern with infrared rays. As a result, the metal ink 160 is baked, and wiring 162 is formed on the upper surface of the resin laminate 152. Note that in FIG.
  • wiring 162a the wiring on the left side in FIG. 4 is described as wiring 162a
  • the wiring in the center is described as wiring 162b
  • the wiring on the right side is described as wiring 162c.
  • the inkjet head 88 ejects the ultraviolet curing resin in a thin film so that the ends of the three wirings 162 are exposed.
  • the ultraviolet curing resin is flattened in the curing section 86 so that the film thickness of the ultraviolet curing resin is uniform.
  • the irradiation device 92 irradiates the thin film of ultraviolet curing resin with ultraviolet light. As a result, a resin layer 156 is formed on the resin laminate 152, as shown in FIG. 5.
  • the inkjet head 88 ejects the ultraviolet curing resin in a thin film only on the resin layer 156. That is, the inkjet head 88 ejects the ultraviolet curing resin in a thin film on the resin layer 156 so that the ends of the three wirings 162 are exposed.
  • the thin film of ultraviolet curing resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curing resin ejected in a thin film with ultraviolet light, thereby laminating the resin layer 156 on the resin layer 156.
  • the ejection of the ultraviolet curing resin on the resin layer 156 and the irradiation of ultraviolet light are repeated, and a plurality of resin layers 156 are laminated to form the resin laminate 157.
  • the resin laminate 157 is formed on the resin laminate 152, and the step between the resin laminate 152 and the resin laminate 157 functions as the cavity 154.
  • the stage 52 is moved below the third modeling unit 24. Then, in the third printing section 100 of the third modeling unit 24, the dispenser 106 dispenses conductive paste 166 onto both ends of the wiring 162b and onto the ends of the wiring 162a and wiring 162c that face both ends of the wiring 162b, as shown in FIG. 6.
  • the stage 52 is moved below the fourth modeling unit 25.
  • the dispenser 116 dispenses thermosetting resin 170 onto the upper surface of the resin laminate 152 between the ends of the two opposing wirings 162a, b, as shown in FIG. 7, and dispenses thermosetting resin 170 onto the upper surface of the resin laminate 152 between the ends of the two opposing wirings 162b, c.
  • thermosetting resin 170 When the thermosetting resin 170 is discharged onto the upper surface of the resin laminate 152 between the ends of the two opposing wirings 162, the stage 52 is moved below the mounting unit 27.
  • an electronic component (see FIG. 8) 172 is supplied by the tape feeder 134, and the electronic component 172 is held by the suction nozzle of the mounting head 136.
  • the electronic component 172 is composed of a component body 176 and two electrodes 178 arranged on the lower surface of the component body 176.
  • the mounting head 136 is then moved by the moving device 138, and the electronic component 172 held by the suction nozzle is mounted so as to be electrically connected to the wiring 162, as shown in FIG. 8.
  • FIG. 8 In FIG.
  • electronic component 172a is mounted so that electrode 178 contacts uncured conductive paste 166 dispensed onto wiring 162a, b.
  • component body 176 of electronic component 172a contacts uncured thermosetting resin 170 dispensed between wiring 162a, b.
  • Electronic component 172b is mounted so that electrode 178 contacts uncured conductive paste 166 dispensed onto wiring 162b, c.
  • component body 176 of electronic component 172b contacts uncured thermosetting resin 170 dispensed between wiring 162b, c.
  • conductive paste 166 is dispensed at the intended attachment position of electrode 178 to wiring 162
  • thermosetting resin 170 is dispensed at the intended attachment position of component body 176.
  • thermosetting resin 170 that comes into contact with the component body 176 is sealed between the component body 176 and the resin laminate 152. In other words, the thermosetting resin 170 is sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176.
  • the amount of thermosetting resin 170 dispensed by the dispenser 116 is controlled so that the thermosetting resin 170 does not spill out from between the upper surface of the resin laminate 152 and the lower surface of the component body 176.
  • the stage 52 is moved below the pressing unit 26. Then, in the pressing section 120 of the pressing unit 26, as shown in FIG. 9, the electronic component 172 mounted on the resin laminate 152 is pressed from above downward by the pressing plate 122 via the rubber plate 124.
  • the rubber plate 124 is attached to the underside of the pressing plate 122, the rubber plate 124 elastically deforms when the two electronic components 172 are pressed, and the two electronic components 172 with different height dimensions can be pressed appropriately.
  • the resin laminate 152 is heated by the heater 66 built into the base 60.
  • the conductive paste 166 and the thermosetting resin 170 are heated and hardened through the resin laminate 152. That is, the conductive paste 166 is heated while being compressed between the wiring 162 and the electrode 178, and the thermosetting resin 170 is heated while being compressed between the resin laminate 152 and the component body 176, so that the conductive paste 166 and the thermosetting resin 170 are hardened.
  • the heating temperature is the temperature at which the conductive paste 166 and the thermosetting resin 170 are hardened (e.g., 80°C).
  • the heating temperature is a heating temperature for completely hardening the conductive paste and the thermosetting resin, and is set by the respective manufacturers of the conductive paste and the thermosetting resin.
  • the heating temperature may also be set according to the respective heating results of the conductive paste and the thermosetting resin experimentally performed by the user.
  • the conductive paste 166 hardens to exhibit conductivity.
  • the conductive paste 166 is heated in a compressed state, the metal particles contained in the conductive paste 166 adhere to each other, increasing the conductivity.
  • the electronic component 172 is electrically connected to the wiring 162 via the hardened conductive paste 166. Since the hardened conductive paste 166 functions as a bump, the hardened conductive paste 166 is described as a bump 168.
  • the component body 176 and the thermosetting resin 170 adhere to each other, and the electrode 178 and the conductive paste 166 adhere to each other.
  • the electronic component 172 is fixed to the upper surface of the resin laminate 152 at the component body 176 by the adhesion force of the thermosetting resin 170, and the electrical connection between the electronic component 172 and the wiring 162 is ensured by the adhesion force of the conductive paste 166.
  • the stage 52 is moved below the fourth modeling unit 25.
  • the dispenser 116 ejects the thermosetting resin 180 around the electronic component 172 so as to cover the side of the component body 176 of the electronic component 172, as shown in FIG. 10.
  • the heater 66 built into the base 60 heats the resin laminate 152.
  • the thermosetting resin 180 is heated through the resin laminate 152 and hardens.
  • the heating temperature is, for example, a temperature at which the thermosetting resin 180 hardens (for example, 80°C).
  • the thermosetting resin 180 hardens while covering the side of the component body 176.
  • thermosetting resins 170, 180 are sealed between the upper surface of the resin laminate 152 and the lower surface of the component body 176, and harden while covering the side surface of the component body 176.
  • the electronic component 172 mounted on the upper surface of the resin laminate 152 is fixed by the hardened resin.
  • the electronic component 172 is mounted so that the electrode 178 contacts the uncured conductive paste 166, and the electronic component 172 is heated while being pressed by the pressing plate 122, so that the electronic component 172 and the wiring 162 are electrically connected by the bump 168.
  • the bump 168 that electrically connects the electronic component 172 and the wiring 162 is made of a material having a low elastic modulus, so that the electrical connection between the electronic component 172 and the wiring 162 is ensured.
  • the elastic modulus of the bump 168 that is, the elastic modulus of the conductive paste 166 when cured, is 0.2 GPa or less.
  • the elastic modulus E is a physical property value that indicates the resistance to deformation, and is a general term for the proportional constant between the stress ⁇ and the strain ⁇ in elastic deformation.
  • the elastic modulus of the bump 168 is 0.2 GPa or less. In this case, the bump 168 is about 7.5 times more likely to deform than a bump having a general elastic modulus (e.g., about 1.5 GPa) using a general conductive paste.
  • the bump 168 which is relatively easy to deform, connects the wiring 162 and the electrode 178 of the electronic component 172, so that the stress generated when the circuit board is deformed is alleviated by the bump 168, and the conduction between the wiring 162 and the electronic component 172 is ensured.
  • the circuit board when the circuit board is formed, heating and cooling are repeated, and the expansion and contraction of the electronic components may be repeated.
  • the heating and cooling during the formation of the circuit board may cause warping of the resin laminate 152, etc.
  • the bumps 168 are deformed in response to the stress generated when the resin laminate 152, etc. is warped, thereby ensuring electrical continuity between the wiring 162 and the electronic components 172.
  • the stress generated between the wiring 162 and the electrode 178 was measured when the wiring 162 and the electrode 178 were connected using a general conductive paste instead of the conductive paste 166.
  • the stress generated between the wiring 162 and the electrode 178 was measured when the wiring 162 and the electrode 178 were connected using the conductive paste 166.
  • the stress generated when the conductive paste 166 was used was about 1/4 of the stress generated when the general conductive paste was used. For this reason, by using a conductive paste 166 with a low elastic modulus, i.e., a bump 168, to connect the wiring 162 and the electrode 178, it is possible to ensure electrical continuity between the wiring 162 and the electrode 178.
  • the electronic component 172 is mounted so that the electrode 178 contacts the uncured conductive paste 166, and the electronic component 172 is heated while being pressed by the pressure plate 122, so that the electronic component 172 and the wiring 162 are electrically connected by the bump 168. Therefore, there is a risk that the uncured conductive paste 166 is crushed when pressed, the thickness of the bump 168 becomes thin, and the conduction between the wiring 162 and the electrode 178 cannot be properly ensured.
  • the uncured conductive paste 166 is soft, when the electronic component 172 is heated while being pressed by the pressure plate 122, the thickness of the bump 168 becomes thin as shown in FIG. 11. In this way, when the thickness of the bump 168 becomes thin, the ability of the bump 168 to follow the stress generated between the wiring 162 and the electrode 178 decreases, and it may not be possible to properly ensure the conduction between the wiring 162 and the electrode 178.
  • bumps 168 by hardening conductive paste 166 before mounting electronic component 172. That is, as shown in FIG. 6, after conductive paste 166 is discharged onto wiring 162, resin laminate 152 is heated by heater 66 built into base 60. Here, the heating temperature is a temperature at which conductive paste 166 hardens (e.g., 80°C). As a result, conductive paste 166 is heated through resin laminate 152 and hardened to form bump 168. Then, as shown in FIG. 7, thermosetting resin 170 is discharged between two wirings 162, and electronic component 172 is mounted so that electrode 178 contacts bump 168 and component body 176 contacts thermosetting resin 170 as shown in FIG. 8.
  • thermosetting resin 170 is hardened by heating, but the conductive paste 166 is hardened and becomes the bump 168 before the electronic component 172 is mounted. Therefore, even if the electronic component 172 is pressed, the bump 168 is not crushed too much, and the thickness of the bump 168 is not made too thin, and a predetermined thickness is ensured. In this way, by hardening the conductive paste 166 before the electronic component 172 is mounted, the thickness of the bump 168 is ensured and the followability of the bump 168 can be ensured.
  • the conductive paste 166 is heated to form the bump 168, and the electronic component 172 is mounted after the conductive paste is discharged onto the bump 168.
  • the resin laminate 152 is heated by the heater 66 built into the base 60.
  • the heating temperature is a temperature at which the conductive paste 166 hardens (e.g., 80° C.). As a result, the conductive paste 166 is heated through the resin laminate 152 and hardened to form the bump 168.
  • conductive paste 200 is dispensed by dispenser 106 onto bump 168.
  • dispenser 106 dispenses conductive paste 200 so that the amount of conductive paste 200 dispensed is less than the amount of conductive paste 166 dispensed.
  • dispenser 106 dispenses conductive paste 200 at the same amount of conductive paste per unit time as the amount of conductive paste 166 dispensed.
  • the movement speed of stage 52 i.e., the relative speed between stage 52 and dispenser 106
  • the movement speed of stage 52 when dispenser 106 dispenses conductive paste 200 is set faster than the movement speed of stage 52 when dispenser 106 dispenses conductive paste 166.
  • the discharge time when the dispenser 106 discharges the conductive paste 200 becomes shorter than the discharge time when the dispenser 106 discharges the conductive paste 166, and the discharge amount of the conductive paste 200 becomes smaller than the discharge amount of the conductive paste 166.
  • the discharge amount of the conductive paste 200 is made smaller than the discharge amount of the conductive paste 166 by changing the moving speed of the stage 52 without changing the discharge amount per unit time.
  • the discharge amount of the conductive paste 200 can be made smaller than the discharge amount of the conductive paste 166 without changing the discharge amount per unit time.
  • the conductive paste 200 can be discharged onto the bump 168 without overflowing from above the bump 168.
  • the discharge height of the conductive paste 200 when it is discharged is set higher than the discharge height of the conductive paste 166 when it is discharged.
  • the discharge height of the dispenser 106 when the conductive paste 166 is discharged that is, the distance between the lower end of the discharge nozzle 206 of the dispenser 106 and the upper surface of the wiring 162 is set to L1.
  • the discharge height of the dispenser 106 when the conductive paste 166 is discharged is set to L2.
  • the discharge height L2 of the conductive paste 200 is set higher than the discharge height L1 of the conductive paste 166.
  • thermosetting resin 170 is discharged between the two wirings 162.
  • the electronic component 172 is mounted so that the electrode 178 contacts the conductive paste 200 and the component body 176 contacts the thermosetting resin 170.
  • the electronic component 172 is pressed by the pressing plate 122 via the rubber plate 124.
  • the resin laminate 152 is heated by the heater 66 built into the base 60.
  • the conductive paste 200 and the thermosetting resin 170 are heated and hardened via the resin laminate 152.
  • the heating temperature is a temperature (e.g., 80° C.) at which the conductive paste 200 and the thermosetting resin 170 harden.
  • the conductive paste 200 discharged onto the bump 168 is uncured, the conductive paste 200 and the electrode 178 of the electronic component 172 are pressed against each other, and thus the conductive paste 200 and the electrode 178 of the electronic component 172 are brought into close contact with each other.
  • the conductive paste 200 is then cured by heating the heater 66, forming a bump 210 in close contact with the electrode 178.
  • the bump 210 is formed when the uncured conductive paste 200 is pressed against the bump 210, and therefore the thickness of the bump 210 is thin, but the bump 168 located below the bump 210 is not easily crushed even when the electronic component 172 is pressed against the bump 210. For this reason, a predetermined thickness is ensured in the bump 168 located below the bump 210. In other words, a predetermined thickness is ensured in the first-stage bump 168 located below the bump 210, and the adhesion force between the bump 210 and the electrode 178 is ensured in the second-stage bump 210 located above the bump 168.
  • the first stage bump 168 deforms in response to the stress generated between the wiring 162 and the electrode 178, and the second stage bump 210 adheres closely to the electrode 178. This makes it possible to properly ensure electrical continuity between the electrode 178 and the two-stage bumps 168 and 210.
  • thermosetting resin 180 is discharged to cover the side surface of the component body 176 of the electronic component 172, and the heater 66 heats the resin laminate 152. As a result, the thermosetting resin 180 hardens, and the electronic component 172 is fixed by the thermosetting resins 170, 180, thereby forming the circuit board 220.
  • the controller 140 of the control device 28 has a wiring forming section 230, a first applying section 232, a first curing section 234, a second applying section 236, a mounting section 238, and a second curing section 240, as shown in FIG. 2.
  • the wiring forming section 230 is a functional section for forming the wiring 162 on the resin laminate 152.
  • the first applying section 232 is a functional section for applying the conductive paste 166 on the wiring 162.
  • the first curing section 234 is a functional section for curing the conductive paste 166.
  • the second applying section 236 is a functional section for applying the conductive paste 200 on the bump 168.
  • the mounting section 238 is a functional section for mounting the electronic component 172 so that the electrode 178 contacts the conductive paste 200.
  • the second curing section 240 is a functional section for curing the conductive paste 200.
  • the circuit forming device 10 is an example of an electric circuit forming device.
  • the first modeling unit 22 is an example of a wiring forming device.
  • the mounting unit 27 is an example of a mounting device.
  • the heater 66 is an example of a curing device.
  • the dispenser 106 is an example of an application device.
  • the resin laminate 152 is an example of a resin layer.
  • the wiring 162 is an example of a metal wiring.
  • the conductive paste 166 is an example of a conductive fluid.
  • the electronic component 172 is an example of an electronic component.
  • the electrode 178 is an example of an electrode.
  • the conductive paste 200 is an example of a conductive fluid.
  • the process performed by the wiring forming unit 230 is an example of a wiring forming process.
  • the process performed by the first application unit 232 is an example of a first application process.
  • the process performed by the first curing unit 234 is an example of a first curing process.
  • the process performed by the second application unit 236 is an example of a second application process.
  • the process performed by the application unit 238 is an example of a mounting process.
  • the process performed by the second curing unit 240 is an example of a second curing process.
  • thermosetting resin 170 is dispensed onto the resin laminate 152 before the electronic component 172 is mounted
  • thermosetting resin 180 is dispensed onto the resin laminate 152 after the electronic component 172 is mounted
  • thermosetting resin 170 and the thermosetting resin 180 may be dispensed onto the resin laminate 152 after the electronic component 172 is mounted.
  • thermosetting resin 170 may be dispensed between the electronic component 172 and the resin laminate 152, and the thermosetting resin 180 may be dispensed to surround the periphery of the electronic component 172.
  • the electronic component 172 is compressed and heated by the pressure plate 122, causing the thermosetting resin 170 and the thermosetting resin 180 to harden.
  • thermosetting resin 170 after the thermosetting resin 170 is discharged, the electronic component 172 is attached so that the component body 176 comes into contact with the uncured thermosetting resin 170.
  • the thermosetting resin 170 may be semi-cured by the heater 66, and the electronic component 172 may be attached so that the component body 176 comes into contact with the semi-cured thermosetting resin 170.
  • the electronic component 172 is heated while being compressed by the pressure plate 122, so that the thermosetting resin 170 is completely cured.
  • the heating conditions for semi-curing the thermosetting resin are conditions that do not satisfy the heating conditions for completely curing the thermosetting resin. For example, if the thermosetting resin is completely cured by heating at 80°C for 1 hour, the thermosetting resin may be semi-cured by heating at 60°C for 30 minutes.
  • the amount of conductive paste 200 discharged is made less than the amount of conductive paste 166 by changing the movement speed of the stage 52 without changing the amount of dispensed by the dispenser 106 per unit time.
  • the amount of conductive paste 200 discharged may be made less than the amount of conductive paste 166 by changing the amount of dispensed by the dispenser 106 per unit time without changing the movement speed of the stage 52.
  • the amount of conductive paste 200 discharged may be made less than the amount of conductive paste 166 by changing at least one of the movement speed of the stage 52 and the amount of dispensed by the dispenser 106 per unit time.
  • the conductive paste 166 is completely cured to form the bump 168, and then the conductive paste 200 is discharged onto the bump 168.
  • the conductive paste 166 may be semi-cured, and then the conductive paste 200 may be discharged onto the semi-cured conductive paste 166.
  • the electronic component 172 may be mounted so that the electrode 178 contacts the conductive paste 200, and then the electronic component 172 may be compressed by the pressing plate 122 while being heated, thereby completely curing the conductive paste 166 and the conductive paste 200.
  • the heating conditions for semi-curing the conductive paste are conditions that do not satisfy the heating conditions for completely curing the conductive paste. For example, if the conductive paste is completely cured by heating at 80°C for 1 hour, the conductive paste may be semi-cured by heating at 60°C for 30 minutes.
  • the conductive paste or thermosetting resin is heated to 80°C when curing, but the conductive paste or thermosetting resin may be heated to a temperature of 80°C or higher to cure the conductive paste or thermosetting resin. However, taking into account thermal expansion, etc., it is preferable to heat the conductive paste or thermosetting resin at the lowest temperature at which it cures.
  • the conductive paste 166 is used as the conductive fluid that electrically connects the wiring 162 and the electrode 178 of the electronic component 172, but various fluids can be used as long as they are conductive.
  • thermosetting resin is used as the curable resin for fixing the electronic components 172, but it is possible to form an ultraviolet curable resin, a two-liquid mixed curable resin, a thermoplastic resin, or the like.
  • an ultraviolet curable resin is used as the resin for forming the resin laminate 152
  • a thermosetting resin is used as the resin for fixing the electronic components 172.
  • the resin for forming the resin laminate 152 and the resin for fixing the electronic components 172 are different curable resins, but the resin for forming the resin laminate 152 and the resin for fixing the electronic components 172 may be the same curable resin.
  • the conductive paste is dispensed by the dispenser 106, but it may be transferred by a transfer device or the like.
  • the conductive paste may also be printed by screen printing.
  • Circuit forming device (electrical circuit forming device) 22: First modeling unit (wiring forming device) 27: Mounting unit (mounting device) 66: Heater (curing device) 106: Dispenser (applicator) 152: Resin laminate (resin layer) 162: Wiring (metal wiring) 166: Conductive paste (conductive fluid) 172: Electronic component 178: Electrode 200: Conductive paste (conductive fluid) 230: Wiring forming section (wiring forming process) 232: First application section (first application process) 234: First curing section (first curing process) 236: Second application section (second application process) 238: Mounting section (mounting process) 240: Second curing section (second curing process)

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PCT/JP2023/009100 2023-03-09 2023-03-09 電気回路形成方法、および電気回路形成装置 Ceased WO2024185135A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2023/009100 WO2024185135A1 (ja) 2023-03-09 2023-03-09 電気回路形成方法、および電気回路形成装置
IL322346A IL322346A (en) 2023-03-09 2023-03-09 Method for creating electrical circuits and device for creating electrical circuits
CN202380095310.3A CN120731664A (zh) 2023-03-09 2023-03-09 电气回路形成方法和电气回路形成装置
EP23926345.2A EP4679948A4 (en) 2023-03-09 2023-03-09 METHOD FOR FORMING AN ELECTRICAL CIRCUIT AND DEVICE FOR FORMING AN ELECTRICAL CIRCUIT
JP2025505038A JPWO2024185135A1 (https=) 2023-03-09 2023-03-09

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020079744A1 (ja) * 2018-10-16 2020-04-23 株式会社Ｆｕｊｉ 回路形成方法
WO2022113186A1 (ja) 2020-11-25 2022-06-02 株式会社Fuji 電気回路形成方法
WO2022195800A1 (ja) * 2021-03-18 2022-09-22 株式会社Fuji 電子部品装着方法、および電子部品装着装置

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Publication number Priority date Publication date Assignee Title
JP4191567B2 (ja) * 2003-09-18 2008-12-03 株式会社リコー 導電性接着剤による接続構造体及びその製造方法
US7422973B2 (en) * 2006-01-27 2008-09-09 Freescale Semiconductor, Inc. Method for forming multi-layer bumps on a substrate

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Publication number Priority date Publication date Assignee Title
WO2020079744A1 (ja) * 2018-10-16 2020-04-23 株式会社Ｆｕｊｉ 回路形成方法
WO2022113186A1 (ja) 2020-11-25 2022-06-02 株式会社Fuji 電気回路形成方法
WO2022195800A1 (ja) * 2021-03-18 2022-09-22 株式会社Fuji 電子部品装着方法、および電子部品装着装置

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Title
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