WO2024178762A1 - 背光模组与显示装置 - Google Patents

背光模组与显示装置 Download PDF

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Publication number
WO2024178762A1
WO2024178762A1 PCT/CN2023/083896 CN2023083896W WO2024178762A1 WO 2024178762 A1 WO2024178762 A1 WO 2024178762A1 CN 2023083896 W CN2023083896 W CN 2023083896W WO 2024178762 A1 WO2024178762 A1 WO 2024178762A1
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WO
WIPO (PCT)
Prior art keywords
light
substrate
backlight module
recessed
guide plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/083896
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English (en)
French (fr)
Inventor
李副
程艳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US18/247,635 priority Critical patent/US12487488B2/en
Publication of WO2024178762A1 publication Critical patent/WO2024178762A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/855—Optical field-shaping means, e.g. lenses
    • H10H29/856—Reflecting means

Definitions

  • the present application relates to the field of display, and in particular to a backlight module and a display device.
  • Mini-LED Small-pitch light-emitting diode
  • the low-temperature polycrystalline silicon-liquid crystal display panel equipped with a Mini-LED backlight module has a significantly improved dark state display effect compared to the organic light-emitting display panel.
  • the thickness and response time still need to be improved, it has obvious advantages in power consumption, HDR standards, contrast, brightness and product reliability.
  • the embodiments of the present application provide a backlight module and a display device, wherein the backlight module can solve the problems of too low brightness and too high cost.
  • the embodiment of the present application provides a backlight module, and the backlight module includes:
  • a light source assembly disposed on the substrate, comprising a plurality of light-emitting chips disposed at intervals;
  • a light guide plate disposed on the light source assembly
  • a plurality of grooves are arranged on the surface of the light guide plate facing the substrate, at least a part of the light-emitting chip is arranged in one of the grooves, and a plurality of first recessed parts distributed at intervals are arranged on the bottom of the groove, and the first recessed parts have an arc surface recessed in the direction away from the substrate.
  • a plurality of second recessed portions distributed at intervals are provided on the side wall of the groove, and the second recessed portions have an arc surface recessed in a direction away from the corresponding light-emitting chip.
  • the distribution density of the first recessed portions is greater than the distribution density of the second recessed portions.
  • the curvature of the arc surface of the first recessed portion is greater than the curvature of the arc surface of the second recessed portion.
  • the length of the orthographic projection of each first recessed portion on the substrate is 5 micrometers to 50 micrometers, and the distance between two adjacent first recessed portions is 5 micrometers to 500 micrometers.
  • a reflective layer is disposed between the substrate and the light guide plate in the spacing region between adjacent light-emitting chips.
  • a plurality of spaced-apart protrusions are provided on a surface of the light guide plate opposite to the reflective layer, and the protrusions have arc surfaces protruding toward the substrate.
  • the backlight module includes a first light-emitting area and a second light-emitting area located between the first light-emitting area and the edge of the substrate, and the distribution density of the protrusions in the first light-emitting area is less than the distribution density of the protrusions in the second light-emitting area.
  • a surface of the light guide plate away from the substrate has a micro-prism structure.
  • a plurality of spaced-apart light-scattering films are disposed on a side of the light guide plate away from the substrate, and one of the light-scattering films is disposed corresponding to one of the light-emitting chips.
  • a surface of the light-scattering film away from the substrate is provided with a plurality of third recessed portions distributed at intervals, and the third recessed portions have an arc surface recessed toward the substrate.
  • the orthographic projection of a diffuser film on the substrate covers the orthographic projection of a corresponding light-emitting chip on the substrate, and the orthographic projection area of a diffuser film on the substrate is 1-2 times the orthographic projection area of the corresponding light-emitting chip on the substrate.
  • the backlight module further includes a beam splitter film disposed on a side of the light-scattering film away from the substrate and a brightness enhancement film disposed on the beam splitter film.
  • An embodiment of the present application further provides a display device, which includes a display panel and the above-mentioned backlight module, and the display panel is arranged on the light emitting surface of the backlight module.
  • a plurality of second recessed portions distributed at intervals are provided on the side wall of the groove, and the second recessed portions have an arc surface recessed in a direction away from the corresponding light-emitting chip.
  • the distribution density of the first recessed portions is greater than the distribution density of the second recessed portions.
  • the curvature of the arc surface of the first recessed portion is greater than the curvature of the arc surface of the second recessed portion.
  • the length of the orthographic projection of each first recessed portion on the substrate is 5 micrometers to 50 micrometers, and the distance between two adjacent first recessed portions is 5 micrometers to 500 micrometers.
  • a reflective layer is disposed between the substrate and the light guide plate in the spacing region between adjacent light-emitting chips.
  • a plurality of spaced-apart protrusions are provided on a surface of the light guide plate opposite to the reflective layer, and the protrusions have arc surfaces protruding toward the substrate.
  • the embodiment of the present application provides a backlight module and a display panel, wherein the backlight module includes a substrate; a light source assembly, which is arranged on the substrate and includes a plurality of light-emitting chips arranged at intervals; and a light guide plate, which is arranged on the light source assembly; wherein a plurality of grooves are arranged on the surface of the light guide plate facing the substrate, at least a portion of the light-emitting chip is correspondingly arranged in one of the grooves, and a plurality of first recessed portions distributed at intervals are arranged on the bottom of the groove, wherein the first recessed portion has an arc surface that is recessed in a direction away from the substrate, and by arranging a plurality of first recessed portions distributed at intervals on the bottom of the groove, the When the light emitted from the top surface of the light-emitting chip reaches the arc surface of the first recessed portion, that is, the interface from the light-sparse medium air to the light-dense
  • FIG1 is a schematic diagram of a cross-sectional structure of a backlight module provided in an embodiment of the present application
  • FIG2 is an enlarged schematic diagram of the structure of the A1 region in FIG1 ;
  • FIG3 is an enlarged schematic diagram of the structure of the A2 area in FIG1 ;
  • FIG4 is a schematic diagram of a planar structure of a backlight module provided in an embodiment of the present application.
  • FIG5 is a schematic diagram of a cross-sectional structure of a light-scattering film in a backlight module provided in an embodiment of the present application;
  • FIG. 6 is a schematic diagram of a planar structure of a light source assembly in a backlight module provided in an embodiment of the present application.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the said features. In the description of the present application, the meaning of “multiple” is two or more, unless otherwise clearly and specifically defined.
  • the embodiment of the present application provides a backlight module.
  • the backlight module includes a substrate 100 and a light source assembly 200 and a light guide plate 300 sequentially disposed on the substrate 100 .
  • the substrate 100 is a flexible circuit board or a printed circuit board, etc.; the light source assembly 200 includes a plurality of light-emitting chips 210 arranged at intervals, and the light-emitting chip 210 is electrically connected to the substrate 100.
  • the light-emitting chip 210 is a five-sided light-emitting chip, specifically a five-sided light-emitting diode;
  • the light guide plate 300 is arranged on the light source assembly 200, and is used to receive the light emitted by the light-emitting chip 210 and transmit the light.
  • the material of the light guide plate 300 is polycarbonate, acrylic or other conventional materials in the field.
  • a plurality of grooves G are arranged on the surface of the light guide plate 300 facing the substrate 100, at least a part of the light-emitting chip 210 is arranged in one of the grooves G, and a plurality of first recessed portions 310 distributed at intervals are arranged on the bottom of the groove G, and the first recessed portions 310 have an arc surface recessed in a direction away from the substrate 100.
  • each of the light-emitting chips 210 is arranged in the groove G opened in the light guide plate 300, that is, the side wall and the groove bottom of the groove G serve as the corresponding light incident surface of the light-emitting chip 210, and the light emitted from the light-emitting chip 210 in various directions enters the light guide plate 300 through the side wall and the groove bottom of the groove G and is transmitted in the light guide plate 300, and finally emits from the light exit surface of the light guide plate 300, that is, the surface away from the substrate 100;
  • the light emitted from the top surface of the light-emitting chip 210 reaches the arc surface of the first recessed portion 310, that is, the interface from the light-sparse medium air to the light-dense medium light guide plate, the light is refracted and diverged when passing through the arc surface of the recess, so that the light emitted from the top surface of the light-emitting chip 210 can be more emitted between two adjacent light-emitting chips 210, so as to improve the brightness uniformity of the backlight module, that is, by providing the first recessed portion 310 on the light guide plate 300, the desired splitting effect can be achieved without adding an additional splitting film, thereby reducing the manufacturing cost of the backlight module, and at the same time greatly reducing the light loss, thereby improving the brightness of the backlight module.
  • a plurality of second recessed portions 320 are provided on the side wall of the groove G at intervals, and the second recessed portions 320 have an arc surface that is recessed in a direction away from the corresponding light-emitting chip 210. Furthermore, by providing a plurality of second recessed portions 320 at intervals on the side wall of the groove G, when the light emitted from the side of the light-emitting chip 210 reaches the recessed arc surface of the second recessed portion 320, it is the interface from the light-sparse medium air to the light-dense medium light guide plate.
  • the light When passing through the recessed arc surface, the light is refracted and diverged, so that the light emitted from the side of the light-emitting chip 210 can be more evenly projected to the interval area of the adjacent light-emitting chip 210, thereby realizing light effect atomization to further improve the brightness uniformity of the backlight module.
  • the distribution density of the first recessed portion 310 is set to be greater than the distribution density of the second recessed portion 320. In this way, the light emitted from the top surface of the light emitting chip 210 can be more projected into the first recessed portion 310 and refracted and diverged and then projected into the light guide plate 300.
  • the specific sizes of the distribution densities of the first recessed portion 310 and the second recessed portion 320 are set according to the actual light emission angle of the light emitting chip 210.
  • the curvature of the concave arc surface of the first recessed portion 310 is set to be greater than the curvature of the concave arc surface of the second recessed portion 320, so that the light emitted from the top surface of the light-emitting chip 210 can be refracted and diverged at a larger angle when passing through the first recessed portion 310 and then emitted into the light guide plate 300.
  • the curvature of the concave arc surface of the first recessed portion 310 and the curvature of the concave arc surface of the second recessed portion 320 are set according to the actual light emission angle of the light-emitting chip 210.
  • the size of the first recessed portion 310 is 5 microns to 50 microns, and the spacing between two adjacent first recessed portions 310 is 5 microns to 500 microns, wherein the size of the first recessed portion 310 is defined as: the length of the positive projection of the first recessed portion 310 on the substrate 100 in the arrangement direction of the plurality of first recessed portions 310.
  • the spacing between two adjacent first recessed portions 310 is usually greater than the size of the first recessed portion 310.
  • the size of the first recessed portion 310 and the spacing between two adjacent first recessed portions 310 are set according to the actual light emission angle of the light-emitting chip 210.
  • the size of the second recessed portion 320 is 5 microns to 50 microns, wherein the size of the second recessed portion 320 is defined as: the length of the orthographic projection of the second recessed portion 320 on the substrate 100 in the arrangement direction of the plurality of second recessed portions 320.
  • the spacing between two adjacent second recessed portions 320 is 5 microns to 500 microns, and the spacing between two adjacent second recessed portions 320 is generally greater than the size of the second recessed portion 320.
  • the size of the second recessed portion 320 and the spacing between two adjacent second recessed portions 320 are set according to the actual light output angle of the light emitting chip 210.
  • the best light atomization effect can be obtained, so that the backlight module has the best brightness uniformity.
  • a reflective layer 400 is provided between the substrate 100 and the light guide plate 300, for reflecting the light emitted from the lower side of the light emitting chip 210 toward the upper side so as to be emitted from the light emitting surface of the light guide plate 300, thereby avoiding the loss of the light emitted from the lower side of the light emitting chip 210, improving the utilization rate of the light emitted from the light emitting chip 210, and further improving the brightness of the backlight module.
  • a plurality of spaced-apart protrusions 330 are disposed on a surface of the light guide plate 300 opposite to the reflective layer 400 , and the protrusions 330 have arc surfaces that are concave toward the substrate 100 .
  • the protrusions 330 have arc surfaces that are concave toward the substrate 100 .
  • Figures 1 and 3 at the same time.
  • Another part of the light is refracted at the interface and reaches the reflective layer 400 downward, and is reflected back to the raised portion 330 by the reflective layer 400. Since the raised portion 330 has an arc surface recessed toward the substrate 100, the light reflected by the reflective layer 400 to the raised portion 330 is refracted and converged at the arc surface interface. The refracted light will be closer to the direction perpendicular to the substrate 100, that is, the raised portion 330 plays a role of forward light guidance, thereby optimizing the light output angle of the backlight module.
  • the backlight module includes a first light-emitting area L1 and a second light-emitting area L2 located between the first light-emitting area L1 and the edge of the substrate 100.
  • the distribution density of the protrusions 330 in the first light-emitting area L1 is less than the distribution density of the protrusions 330 in the second light-emitting area L2, that is, the protrusions 330 in the peripheral area are arranged more densely to guide more light in the forward direction, thereby reducing the large-angle light emitted from the peripheral area to the non-effective backlight area, that is, improving the utilization rate of the light emitted by the light-emitting chip 210, thereby improving the brightness of the backlight module.
  • the size of the raised portion 330 is 5 microns to 50 microns, and the spacing between two adjacent raised portions 330 is 5 microns to 500 microns, wherein the size of the raised portion 330 is defined as the longest dimension of the positive projection of the raised portion 330 on the substrate 100.
  • the spacing between two adjacent raised portions 330 is usually larger than the size of the raised portion 330.
  • the size of the raised portion 330 and the spacing between two adjacent raised portions 330 are set according to the actual light emission angle of the light-emitting chip 210.
  • the distribution of the first light emitting area L1 and the second light emitting area L2, as well as the distribution of the protrusions 330 in the first light emitting area L1 and the second light emitting area L2 are adjusted so that the brightness and light emission angle of the backlight module reach the optimal state.
  • the surface of the light guide plate 300 away from the substrate 100 has a micro-prism structure 340 , that is, the micro-prism structure 340 is arranged on the light emitting surface of the light guide plate 300 to further guide the emitted light in a positive direction, optimize the light emitting angle of the backlight module, and enhance the brightness of the backlight module.
  • the cross-sectional shape of the micro-prismatic structure 340 is a triangle (as shown in FIG. 1 ), a trapezoid, or a semicircle.
  • a side of the light guide plate 300 away from the substrate 100 is also provided with a plurality of spaced-apart diffuser films 600, one of the diffuser films 600 is arranged corresponding to one of the light emitting chips 210, and the diffuser film 600 is an optical film with divergent light, so that the light emitted from the top surface of the light emitting chip 210 passes through the diffuser film 600 and is more emitted to between the two adjacent light emitting chips 210, so as to improve the brightness uniformity of the backlight module; that is, the diffuser film 600 cooperates with the first recessed portion 310 provided on the groove G to disperse the light emitted from the top surface of the light emitting chip 210 to between the two adjacent light emitting chips 210, so as to achieve the best brightness uniformity of the backlight module.
  • a plurality of third recessed portions 610 are arranged at intervals on the surface of the diffuser film 600 away from the substrate 100.
  • the third recessed portion 610 has an arc surface that is recessed toward the substrate 100.
  • the size of the third recessed portion 610, the curvature of the arc surface recessed in the third recessed portion 610, and the distribution density of the third recessed portion 610 are comprehensively adjusted to obtain the best light atomization effect, thereby making the backlight module have the best brightness uniformity.
  • the material of the light-scattering film 600 may be white ink, and the third recessed portion 610 on the light-scattering film 600 is formed by a nano-imprinting process.
  • the orthographic projection of the diffuser film 600 on the substrate 100 covers the orthographic projection of a corresponding light-emitting chip 210 on the substrate 100, and the orthographic projection area of the diffuser film 600 on the substrate 100 is 1-2 times the orthographic projection area of the corresponding light-emitting chip 210 on the substrate 100.
  • the orthographic projection center of one of the light-scattering films 600 on the substrate 100 coincides with the orthographic projection center of a corresponding one of the light-emitting chips 210 on the substrate 100 .
  • the backlight module also includes a splitter film 700 arranged on the side of the diffuser film 600 away from the substrate 100 and a brightness enhancing film 800 arranged on the splitter film 700.
  • the splitter film 700 and the brightness enhancing film 800 are both arranged on the entire surface.
  • the splitter film 700 further performs full-surface light effect atomization on the basis of local light effect atomization of the diffuser film 600, the first recessed portion 310 and the second recessed portion 320 to improve the brightness uniformity of the backlight module.
  • the light diverged by the splitter film 700 passes through the brightness enhancing film 800 and then is emitted forwardly, thereby optimizing the light emission direction of the backlight module to improve the brightness of the backlight module.
  • a transparent encapsulation layer 500 is further disposed between the light guide plate 300 and the light-scattering film 600 .
  • the light emitting chips 210 are distributed in a honeycomb matrix, or in other distribution modes according to actual needs, which is not particularly limited in the embodiments of the present application.
  • the backlight module provided in the above-mentioned embodiment of the present application, by providing the light guide plate 300 with a special structure, the light paths of the light emitted from each of the light-emitting chips 210 are adjusted by using the first recessed portion 310, the second recessed portion 320, the raised portion 330 and the micro-prism structure 340 provided on the light guide plate 300, so that the light emitted from the light guide plate 300 is evenly distributed and has a better exit angle, that is, the backlight module has better brightness uniformity and higher brightness;
  • the brightness uniformity of the backlight module is further optimized and the brightness is improved.
  • the backlight module does not need to be provided with a multi-layer stacked light splitting structure, thereby reducing the production cost of the backlight module, and is particularly suitable for large-scale industrial production.
  • the above backlight module embodiment only describes the above structure. It can be understood that, in addition to the above structure, the backlight module provided in the embodiment of the present application may also include any other necessary structure as needed, which is not specifically limited here.
  • a display device in another embodiment of the present application, includes a display panel and the backlight module provided in the above embodiment.
  • the display panel is arranged on one side of the light emitting surface of the backlight module.

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Abstract

本申请公开了一种背光模组与显示装置，背光模组包括：基板；光源组件，设置于基板上，包括多个间隔设置的发光芯片；导光板，设置于光源组件上；其中，导光板朝向基板的表面上设置有多个凹槽，一发光芯片的至少局部对应设置于一所述凹槽内，凹槽的槽底上设置有多个第一凹陷部，第一凹陷部具有向远离基板的方向凹陷的弧面。

Description

背光模组与显示装置 技术领域
本申请涉及显示领域，尤其涉及一种背光模组与显示装置。
 背景技术
小间距发光二极管（Mini-LED）技术具有极大潜力成为下一代显示技术发展方向之一，搭载了Mini-LED背光模组的低温多晶硅-液晶显示面板，其暗态显示效果相较于有机发光显示面板有显著的提升，尽管在厚度和响应时间上还有待提高，但在功耗、HDR标准、对比度、亮度以及产品信赖性上，都具有明显优势。
但是，目前的Mini-LED通常需设置多层依次堆叠的分光结构才能实现较好的亮度均匀性，如此，一方面造成制造成本过高的问题，另一方面会导致较多的光线损失进而导致亮度过低的问题。
 技术问题
本申请实施例提供一种背光模组与显示装置，所述背光模组可解决亮度过低以及成本过高的问题。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供了一种背光模组，所述背光模组包括：
基板；
光源组件，设置于所述基板上，包括多个间隔设置的发光芯片；以及
导光板，设置于所述光源组件上；
其中，所述导光板朝向所述基板的表面上设置有多个凹槽，一所述发光芯片的至少局部对应设置于一所述凹槽内，所述凹槽的槽底上设置有多个间隔分布的第一凹陷部，所述第一凹陷部具有向远离所述基板的方向凹陷的弧面。
在本申请的一些实施例中，所述凹槽的侧壁上设置有多个间隔分布的第二凹陷部，所述第二凹陷部具有向远离对应的所述发光芯片的方向凹陷的弧面。
在本申请的一些实施例中，所述第一凹陷部的分布密度大于所述第二凹陷部的分布密度。
在本申请的一些实施例中，所述第一凹陷部具有的所述弧面的曲率大于所述第二凹陷部具有的所述弧面的曲率。
在本申请的一些实施例中，在多个所述第一凹陷部的排列方向上，每一所述第一凹陷部在所述基板上的正投影的长度为5微米-50微米，相邻两所述第一凹陷部的间距为5微米-500微米。
在本申请的一些实施例中，在相邻的所述发光芯片之间的间隔区域，所述基板与所述导光板之间设置有反射层。
在本申请的一些实施例中，所述导光板与所述反射层相对的表面上设置有多个间隔分布的凸起部，所述凸起部具有朝向所述基板的方向凸出的弧面。
在本申请的一些实施例中，所述背光模组包括第一发光区以及位于所述第一发光区与所述基板的边缘之间的第二发光区，所述第一发光区内的所述凸起部的分布密度小于所述第二发光区内的所述凸起部的分布密度。
在本申请的一些实施例中，所述导光板远离所述基板的表面具有微棱镜结构。
在本申请的一些实施例中，所述导光板远离所述基板的一侧设置有多个间隔设置的散光膜片，一所述散光膜片与一所述发光芯片对应设置。
在本申请的一些实施例中，所述散光膜片远离所述基板的表面设置有多个间隔分布的第三凹陷部，所述第三凹陷部具有朝向所述基板的方向凹陷的弧面。
在本申请的一些实施例中，一所述散光膜片在所述基板上的正投影覆盖对应的一所述发光芯片在所述基板上的正投影，一所述散光膜片在所述基板上的正投影面积为对应的所述发光芯片在所述基板上的正投影面积的1-2倍。
在本申请的一些实施例中，所述背光模组还包括设置于所述散光膜片远离所述基板的一侧的分光膜与设置于所述分光膜上的增亮膜。
本申请实施例还提供了一种显示装置，所述显示装置包括显示面板和上述的背光模组，所述显示面板设置于所述背光模组的出光面。
在本申请的一些实施例中，所述凹槽的侧壁上设置有多个间隔分布的第二凹陷部，所述第二凹陷部具有向远离对应的所述发光芯片的方向凹陷的弧面。
在本申请的一些实施例中，所述第一凹陷部的分布密度大于所述第二凹陷部的分布密度。
在本申请的一些实施例中，所述第一凹陷部具有的所述弧面的曲率大于所述第二凹陷部具有的所述弧面的曲率。
在本申请的一些实施例中，在多个所述第一凹陷部的排列方向上，每一所述第一凹陷部在所述基板上的正投影的长度为5微米-50微米，相邻两所述第一凹陷部的间距为5微米-500微米。
在本申请的一些实施例中，在相邻的所述发光芯片之间的间隔区域，所述基板与所述导光板之间设置有反射层。
在本申请的一些实施例中，所述导光板与所述反射层相对的表面上设置有多个间隔分布的凸起部，所述凸起部具有朝向所述基板的方向凸出的弧面。
 有益效果
本申请实施例提供一种背光模组与显示面板，所述背光模组包括基板；光源组件，设置于所述基板上，包括多个间隔设置的发光芯片；导光板，设置于所述光源组件上；其中，所述导光板朝向所述基板的表面上设置有多个凹槽，一所述发光芯片的至少局部对应设置于一所述凹槽内，所述凹槽的槽底上设置有多个间隔分布的第一凹陷部，所述第一凹陷部具有向远离所述基板的方向凹陷的弧面，通过在所述凹槽的槽底上设置有多个间隔分布的第一凹陷部，所述发光芯片顶面的所出射的光线到达所述第一凹陷部凹陷的弧面时，即为由光疏介质空气射至光密介质导光板的界面，在穿过该凹陷的弧面时光线发生折射并发散，进而使得由所述发光芯片顶面的所出射的光线能更多地射至相邻两所述发光芯片之间，以提升该背光模组的亮度均匀性，即通过在所述导光板上设置所述第一凹陷部，无需新增额外的分光膜即可实现所需的分光效果，从而降低了该背光模组的制造成本，同时大大减少光线损失而提升背光模组的亮度。
 附图说明
图1是本申请实施例提供的一种背光模组的截面结构示意图；
图2是图1中A1区域的放大结构示意图；
图3是图1中A2区域的放大结构示意图；
图4是本申请实施例提供的一种背光模组的平面结构示意图；
图5是本申请实施例提供的一种背光模组中的散光膜片的截面结构示意图；
图6是本申请实施例提供的一种背光模组中的光源组件的平面结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请中，“示例性”一词用来表示“用作例子、例证或说明”。本申请中被描述为“示例性”的任何实施例不一定被解释为比其它实施例更优选或更具优势。为了使本领域任何技术人员能够实现和使用本申请，给出了以下描述。在以下描述中，为了解释的目的而列出了细节。应当明白的是，本领域普通技术人员可以认识到，在不使用这些特定细节的情况下也可以实现本申请。在其它实例中，不会对公知的结构和过程进行详细阐述，以避免不必要的细节使本申请的描述变得晦涩。因此，本申请并非旨在限于所示的实施例，而是与符合本申请所公开的原理和特征的最广范围相一致。
本申请实施例提供了一种背光模组，参阅图1，所述背光模组包括基板100与依次设置于所述基板100上的光源组件200以及导光板300；
所述基板100为柔性电路板或印制电路板等；所述光源组件200包括多个间隔设置的发光芯片210，所述发光芯片210与所述基板100电性连接，所述发光芯片210为五面发光的发光芯片，具体可为五面发光的发光二极管；所述导光板300设置于所述光源组件200上，用于接收所述发光芯片210所发射的光线并传导出光，所述导光板300的材料为聚碳酸酯、亚克力或其他本领域常规材料。
其中，所述导光板300朝向所述基板100的表面上设置有多个凹槽G，一所述发光芯片210的至少局部对应设置于一所述凹槽G内，所述凹槽G的槽底上设置有多个间隔分布的第一凹陷部310，所述第一凹陷部310具有向远离所述基板100的方向凹陷的弧面。
在本申请实施例所提供的背光模组中，将各所述发光芯片210设置于所述导光板300所开设的所述凹槽G内，即所述凹槽G的侧壁与槽底作为对应的所述发光芯片210的入光面，所述发光芯片210各个方向所出射的光线通过所述凹槽G的侧壁与槽底进入所述导光板300内并在所述导光板300内传导，最终从所述导光板300的出光面即远离所述基板100的表面出射；
进一步地，通过在所述凹槽G的槽底上设置有多个间隔分布的第一凹陷部310，同时参阅图1和图2，所述发光芯片210顶面的所出射的光线到达所述第一凹陷部310凹陷的弧面时，即为由光疏介质空气射至光密介质导光板的界面，在穿过该凹陷的弧面时光线发生折射并发散，进而使得由所述发光芯片210顶面的所出射的光线能更多地射至相邻两所述发光芯片210之间，以提升该背光模组的亮度均匀性，即通过在所述导光板300上设置所述第一凹陷部310，无需新增额外的分光膜即可实现所需的分光效果，从而降低了该背光模组的制造成本，同时大大减少光线损失进而提升了背光模组的亮度。
在一些实施例中，所述凹槽G的侧壁上设置有多个间隔分布的第二凹陷部320，所述第二凹陷部320具有向远离对应的所述发光芯片210方向凹陷的弧面，进一步地，通过在所述凹槽G的侧壁上设置有多个间隔分布的第二凹陷部320，所述发光芯片210侧面的所出射的光线到达所述第二凹陷部320凹陷的弧面时，即为由光疏介质空气射至光密介质导光板的界面，在穿过该凹陷的弧面时光线发生折射并发散，进而使得由所述发光芯片210侧面的所出射的光线能更均匀地射至相邻的所述发光芯片210的间隔区域，实现光效雾化以进一步提升该背光模组的亮度均匀性。
在一些实施例中，基于实际光效雾化需求，所述发光芯片210顶面所出射的光线相较于侧面所出射的光线需要进行更高程度的光效雾化，因此，将所述第一凹陷部310的分布密度设置为大于所述第二凹陷部320的分布密度，如此使得所述发光芯片210顶面所出射的光线能更多地射至所述第一凹陷部310并折射发散再射至所述导光板300中，所述第一凹陷部310以及所述第二凹陷部320的分布密度的具体大小根据所述发光芯片210的实际出光角度进行设定。
在一些实施例中，基于实际光效雾化需求，所述发光芯片210顶面所出射的光线相较于侧面所出射的光线需要进行更高程度的光效雾化，因此，将所述第一凹陷部310具有的凹陷的弧面的曲率设置为大于所述第二凹陷部320具有的凹陷的弧面的曲率，如此使得所述发光芯片210顶面所出射的光线穿过所述第一凹陷部310时能以更大的角度折射发散再射至所述导光板300中，所述第一凹陷部310具有的凹陷的弧面的曲率大小以及所述第二凹陷部320具有的凹陷的弧面的曲率大小根据所述发光芯片210的实际出光角度进行设定。
在一些实施例中，所述第一凹陷部310的尺寸为5微米-50微米，相邻两所述第一凹陷部310的间距为5微米-500微米，其中，所述第一凹陷部310的尺寸定义为：在多个所述第一凹陷部310的排列方向上，所述第一凹陷部310在所述基板100上的正投影的长度，实际设定时，相邻两所述第一凹陷部310的间距通常大于所述第一凹陷部310的尺寸，进一步地，所述第一凹陷部310的尺寸以及相邻两所述第一凹陷部310的间距根据所述发光芯片210的实际出光角度进行设定。
在一些实施例中，所述第二凹陷部320的尺寸为5微米-50微米，其中，所述第二凹陷部320的尺寸定义为：在多个所述第二凹陷部320的排列方向上，所述第二凹陷部320在所述基板100上的正投影的长度。相邻两所述第二凹陷部320的间距为5微米-500微米，相邻两所述第二凹陷部320的间距通常大于所述第二凹陷部320的尺寸，进一步地，所述第二凹陷部320的尺寸以及相邻两所述第二凹陷部320的间距根据所述发光芯片210的实际出光角度进行设定。
综上，依据所述发光芯片210的实际出光角度，通过综合调控所述第一凹陷部310以及所述第二凹陷部320的尺寸、所述第一凹陷部310以及所述第二凹陷部320所凹陷的弧面的曲率、所述第一凹陷部310以及所述第二凹陷部320的分布密度，以获得最佳的光效雾化效果，进而使得所述背光模组具有最佳的亮度均匀性。
在一些实施例中，参阅图1，在相邻的所述发光芯片210之间的间隔区域，所述基板100与所述导光板300之间设置有反射层400，用于将所述发光芯片210向下侧出射的光线向上侧反射从而由所述导光板300的出光面出射，避免所述发光芯片210向下侧出射的光线损失掉，提升所述发光芯片210出射光线的利用率，进而提升所述背光模组的亮度。
在一些实施例中，参阅图1，所述导光板300与所述反射层400相对的表面上设置有多个间隔分布的凸起部330，所述凸起部330具有朝向所述基板100方向凹陷的弧面。请同时参阅图1和图3，所述发光芯片210的侧面出射的部分光线射至所述凸起部330所凹陷的弧面时，即为由光密介质导光板射至光疏介质空气的界面，从而使得部分光线在该界面发生全反射而向上侧传输进而由所述导光板300的出光面出射，另一部分光线在该界面发生折射向下到达所述反射层400，并经反射层400重新反射回所述凸起部330，又由于所述凸起部330具有朝向所述基板100方向凹陷的弧面，所述反射层400反射至所述凸起部330的光线在该弧面界面发生折射汇聚，经折射后的光线会更接近垂直于所述基板100的方向，即所述凸起部330起到了正向导光的作用，优化了所述背光模组的出光角度。
在一些实施例中，请同时参阅图1和图4，所述背光模组包括第一发光区L1以及位于所述第一发光区L1与所述基板100边缘之间的第二发光区L2，所述第一发光区L1内的所述凸起部330的分布密度小于所述第二发光区L2内的所述凸起部330的分布密度，即将外围区域的所述凸起部330设置的更密集，用以对更多的光线进行正向导光，从而减少外围区域的出射至非有效背光区域的大角度光线，即提升所述发光芯片210所出射光线的利用率，进而提升背光模组的亮度。
在一些实施例中，所述凸起部330的尺寸为5微米-50微米，相邻两所述凸起部330的间距为5微米-500微米，其中，所述凸起部330的尺寸定义为所述凸起部330在所述基板100上的正投影的最长尺寸，实际设定时，相邻两所述凸起部330的间距通常大于所凸起部330的尺寸，进一步地，所述凸起部330的尺寸以及相邻两所述凸起部330的间距根据所述发光芯片210的实际出光角度进行设定。
根据所述发光芯片210的实际出光角度，调整所述第一发光区L1与所述第二发光区L2的分布，以及所述第一发光区L1与所述第二发光区L2中的所述凸起部330的分布，使得所述背光模组的亮度与出光角度达到最佳状态。
在一些实施例中，请参阅图1，所述导光板300远离所述基板100的表面具有微棱镜结构340，即在所述导光板300的出光面设置微棱镜结构340，进一步对所出射光线进行正向导光，优化所述背光模组的出光角度，提升所述背光模组的亮度。
在一些实施例中，所述微棱镜结构340的截面形状为三角形（如图1所示）、梯形或半圆形等。
在一些实施例中，请参阅图1，所述导光板300远离所述基板100的一侧还设置有多个间隔设置的散光膜片600，一所述散光膜片600与一所述发光芯片210对应设置，所述散光膜片600即为具有发散光线的光学膜片，使得由所述发光芯片210顶面的所出射的光线穿过所述散光膜片600后更多地射至相邻两所述发光芯片210之间，以提升该背光模组的亮度均匀性；即该散光膜片600与所述凹槽G上设置的所述第一凹陷部310协同作用，用于将所述发光芯片210顶面的所出射的光线分散至相邻两所述发光芯片210之间，以使得该背光模组的亮度均匀性达到最佳状态。
在一些实施例中，请同时参阅图1和图5，所述散光膜片600远离所述基板100的表面设置有多个间隔分布的第三凹陷部610，所述第三凹陷部610具有朝向所述基板100方向凹陷的弧面，经由所述导光板300出射的光线到达所述散光膜片600的所述第三凹陷部610凹陷的弧面时，即为由光密介质散光膜片射至光疏介质空气的界面，在穿过该凹陷的弧面时光线发生折射并发散。
可以理解的是，依据所述导光板300出射光线的实际角度，通过综合调控所述第三凹陷部610的尺寸、所述第三凹陷部610中所凹陷的弧面的曲率、所述第三凹陷部610的分布密度，以获得最佳的光效雾化效果，进而使得所述背光模组具有最佳的亮度均匀性。
在一些实施例中，所述散光膜片600的材料可以为白色油墨，所述散光膜片600上的所述第三凹陷部610通过纳米压印工艺形成。
在一些实施例中，一所述散光膜片600在所述基板100上的正投影覆盖对应的一所述发光芯片210在所述基板100上的正投影，且一所述散光膜片600在所述基板100上的正投影面积为对应的所述发光芯片210在所述基板100上的正投影面积的1-2倍。
在一些实施例中，一所述散光膜片600在所述基板100上的正投影中心与对应的一所述发光芯片210在所述基板100上的正投影中心重合。
在一些实施例中，所述背光模组还包括设置于所述散光膜片600远离所述基板100的一侧的分光膜700与设置于所述分光膜700上的增亮膜800，所述分光膜700与所述增亮膜800均为整面设置，所述分光膜700在所述散光膜片600、所述第一凹陷部310以及所述第二凹陷部320的局部光效雾化基础上，进一步进行整面的光效雾化以提升该背光模组的亮度均一性，经由所述分光膜700发散的光线通过所述增亮膜800后正向出射，优化所述背光模组的出光方向以提升所述背光模组的亮度。
在一些实施例中，所述导光板300与所述散光膜片600之间还设置有透明封装层500。
在一些实施例中，参阅图6，所述发光芯片210呈蜂窝点阵分布，或根据实际需求为其他分布方式，本申请实施例对此不作特殊限定。
综上，在本申请上述实施例所提供的背光模组中，通过设置具有特殊结构的所述导光板300，利用所述导光板300上所设置的第一凹陷部310、第二凹陷部320、凸起部330以及微棱镜结构340对各所述发光芯片210所出射的光线进行光路调节，使得从所述导光板300出射的光线均匀的分布且具有较佳的出射角度，即使得该背光模组具有较佳的亮度均匀性与较高的亮度；
进一步地，结合设置于所述导光板300出光面的散光膜片600、分光膜700以及增亮膜800，进一步优化该背光模组的亮度均匀性且提升亮度。
通过上述结构设计，使得该背光模组无需再设置多层堆叠的分光结构，降低了背光模组的生产成本，特别适合大规模产业化生产。
需要说明的是，上述背光模组实施例中仅描述了上述结构，可以理解的是，除了上述结构之外，在本申请实施例所提供的背光模组中，还可以根据需要包括任何其他的必要结构，具体此处不作限定。
本申请另一实施例中，还提供了一种显示装置，所述显示装置包括显示面板和上述实施例所提供的背光模组，所述显示面板设置于所述背光模组出光面的一侧。
以上对本申请实施例所提供的一种背光模组与显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种背光模组，其中，所述背光模组包括：
    基板；
    光源组件，设置于所述基板上，包括多个间隔设置的发光芯片；以及
    导光板，设置于所述光源组件上；
    其中，所述导光板朝向所述基板的表面上设置有多个凹槽，一所述发光芯片的至少局部对应设置于一所述凹槽内，所述凹槽的槽底上设置有多个间隔分布的第一凹陷部，所述第一凹陷部具有向远离所述基板的方向凹陷的弧面。
  2. 根据权利要求1所述的背光模组，其中，所述凹槽的侧壁上设置有多个间隔分布的第二凹陷部，所述第二凹陷部具有向远离对应的所述发光芯片的方向凹陷的弧面。
  3. 根据权利要求2所述的背光模组，其中，所述第一凹陷部的分布密度大于所述第二凹陷部的分布密度。
  4. 根据权利要求2所述的背光模组，其中，所述第一凹陷部具有的所述弧面的曲率大于所述第二凹陷部具有的所述弧面的曲率。
  5. 根据权利要求1所述的背光模组，其中，在多个所述第一凹陷部的排列方向上，每一所述第一凹陷部在所述基板上的正投影的长度为5微米-50微米，相邻两所述第一凹陷部的间距为5微米-500微米。
  6. 根据权利要求1所述的背光模组，其中，在相邻的所述发光芯片之间的间隔区域，所述基板与所述导光板之间设置有反射层。
  7. 根据权利要求6所述的背光模组，其中，所述导光板与所述反射层相对的表面上设置有多个间隔分布的凸起部，所述凸起部具有朝向所述基板的方向凸出的弧面。
  8. 根据权利要求7所述的背光模组，其中，所述背光模组包括第一发光区以及位于所述第一发光区与所述基板的边缘之间的第二发光区，所述第一发光区内的所述凸起部的分布密度小于所述第二发光区内的所述凸起部的分布密度。
  9. 根据权利要求1所述的背光模组，其中，所述导光板远离所述基板的表面具有微棱镜结构。
  10. 根据权利要求1所述的背光模组，其中，所述导光板远离所述基板的一侧设置有多个间隔设置的散光膜片，一所述散光膜片与一所述发光芯片对应设置。
  11. 根据权利要求10所述的背光模组，其中，所述散光膜片远离所述基板的表面设置有多个间隔分布的第三凹陷部，所述第三凹陷部具有朝向所述基板的方向凹陷的弧面。
  12. 根据权利要求10所述的背光模组，其中，一所述散光膜片在所述基板上的正投影覆盖对应的一所述发光芯片在所述基板上的正投影，一所述散光膜片在所述基板上的正投影面积为对应的所述发光芯片在所述基板上的正投影面积的1-2倍。
  13. 根据权利要求10所述的背光模组，其中，所述背光模组还包括设置于所述散光膜片远离所述基板的一侧的分光膜与设置于所述分光膜上的增亮膜。
  14. 一种显示装置，其中，所述显示装置包括显示面板和背光模组，所述显示面板设置于所述背光模组的出光面，其中，所述背光模组包括：
    基板；
    光源组件，设置于所述基板上，包括多个间隔设置的发光芯片；以及
    导光板，设置于所述光源组件上；
    其中，所述导光板朝向所述基板的表面上设置有多个凹槽，一所述发光芯片的至少局部对应设置于一所述凹槽内，所述凹槽的槽底上设置有多个间隔分布的第一凹陷部，所述第一凹陷部具有向远离所述基板的方向凹陷的弧面。
  15. 根据权利要求14所述的显示装置，其中，所述凹槽的侧壁上设置有多个间隔分布的第二凹陷部，所述第二凹陷部具有向远离对应的所述发光芯片的方向凹陷的弧面。
  16. 根据权利要求15所述的显示装置，其中，所述第一凹陷部的分布密度大于所述第二凹陷部的分布密度。
  17. 根据权利要求15所述的显示装置，其中，所述第一凹陷部具有的所述弧面的曲率大于所述第二凹陷部具有的所述弧面的曲率。
  18. 根据权利要求14所述的显示装置，其中，在多个所述第一凹陷部的排列方向上，每一所述第一凹陷部在所述基板上的正投影的长度为5微米-50微米，相邻两所述第一凹陷部的间距为5微米-500微米。
  19. 根据权利要求14所述的显示装置，其中，在相邻的所述发光芯片之间的间隔区域，所述基板与所述导光板之间设置有反射层。
  20. 根据权利要求19所述的显示装置，其中，所述导光板与所述反射层相对的表面上设置有多个间隔分布的凸起部，所述凸起部具有朝向所述基板的方向凸出的弧面。
PCT/CN2023/083896 2023-02-28 2023-03-24 背光模组与显示装置 Ceased WO2024178762A1 (zh)

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