WO2024161935A1 - 発光装置および表示装置 - Google Patents

発光装置および表示装置 Download PDF

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Publication number
WO2024161935A1
WO2024161935A1 PCT/JP2024/000459 JP2024000459W WO2024161935A1 WO 2024161935 A1 WO2024161935 A1 WO 2024161935A1 JP 2024000459 W JP2024000459 W JP 2024000459W WO 2024161935 A1 WO2024161935 A1 WO 2024161935A1
Authority
WO
WIPO (PCT)
Prior art keywords
light source
light
emitting device
light emitting
sheet member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2024/000459
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
慎 赤阪
宗也 荒木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Group Corp
Original Assignee
Sony Group Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Group Corp filed Critical Sony Group Corp
Priority to EP24749891.8A priority Critical patent/EP4661085A1/en
Priority to CN202480006976.1A priority patent/CN120883761A/zh
Priority to JP2024574367A priority patent/JPWO2024161935A1/ja
Publication of WO2024161935A1 publication Critical patent/WO2024161935A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/857—Interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133601—Illuminating devices for spatial active dimming
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/851—Wavelength conversion means
    • H10H29/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/855—Optical field-shaping means, e.g. lenses
    • H10H29/856—Reflecting means

Definitions

  • This disclosure relates to a light-emitting device suitable for use as a surface light source, and a display device that displays images using illumination light from the light-emitting device.
  • a light emitting device has a plurality of light source units and one relay film member.
  • Each of the plurality of light source units has one light source board and one or more light sources provided on the one light source board.
  • the one relay sheet member supports each of the plurality of light source units and is electrically connected to each of the plurality of light source units.
  • each of the multiple light source units is supported by a single relay sheet member, and each of the multiple light source units is electrically connected to the single relay sheet member. This is advantageous in making the overall configuration thinner and lighter. In addition, since the position of each of the multiple light source units can be finely adjusted, the position of each light source can be easily optimized.
  • FIG. 1A is a first perspective view illustrating a light emitting device according to a first embodiment of the present disclosure, viewed from a first direction.
  • FIG. 1B is a second perspective view showing the light emitting device shown in FIG. 1A viewed from a second direction.
  • FIG. 2A is a plan view showing a planar configuration of a relay film member of the light emitting device shown in FIG. 1A.
  • FIG. 2B is a plan view showing a planar layout of a plurality of light source units of the light emitting device shown in FIG. 1A.
  • FIG. 3 is a cross-sectional view showing a cross-sectional configuration of a portion of the light-emitting device shown in FIG. 1A.
  • FIG. 1A is a first perspective view illustrating a light emitting device according to a first embodiment of the present disclosure, viewed from a first direction.
  • FIG. 1B is a second perspective view showing the light emitting device shown in FIG. 1A viewed from a second direction
  • FIG. 4 is an enlarged cross-sectional view showing an example of the configuration of the light source shown in FIG.
  • FIG. 5 is an enlarged cross-sectional view showing an example of the detailed configuration of the connection member shown in FIG.
  • FIG. 6A is a first cross-sectional view illustrating a process for forming the connection member shown in FIG.
  • FIG. 6B is a second cross-sectional view illustrating the process of forming the connection member shown in FIG.
  • FIG. 6C is a second cross-sectional view illustrating the process of forming the connection member shown in FIG.
  • FIG. 7 is a plan view showing a configuration example of a light emitting device according to a first modified example of the first embodiment.
  • FIG. 8 is a plan view showing a configuration example of a light emitting device according to a second modification of the first embodiment.
  • FIG. 9 is a plan view showing a configuration example of a light emitting device according to a third modified example of the first embodiment.
  • FIG. 10 is a plan view showing an example of a configuration of a light emitting device according to a fourth modified example of the first embodiment.
  • FIG. 11A is a plan view showing a configuration example of a light source unit according to a fifth modified example of the first embodiment.
  • FIG. FIG. 11B is a cross-sectional view showing an example of a configuration of a light source unit according to a sixth modified example of the first embodiment.
  • FIG. 11C is a plan view showing an example of a configuration of a light emitting device according to a seventh modification of the first embodiment.
  • FIG. 11D is a plan view showing an example of a configuration of a light emitting device according to an eighth modification of the first embodiment.
  • FIG. 11E is a plan view illustrating a configuration example of a light source unit according to a ninth modification of the first embodiment.
  • FIG. 12 is a cross-sectional view showing a configuration example of a light emitting device according to a tenth modification of the first embodiment.
  • FIG. 13 is a perspective view illustrating an external appearance of a display device according to a second embodiment of the present disclosure.
  • FIG. 14 is an exploded perspective view of the main body shown in FIG. FIG.
  • FIG. 15 is an exploded perspective view of the panel module shown in FIG.
  • FIG. 16 is a schematic plan view illustrating an example of the planar configuration of the panel module shown in FIG.
  • FIG. 17 is a schematic plan view illustrating an example of a planar configuration of a panel module according to a first modified example of the second embodiment.
  • FIG. 18 is a schematic plan view illustrating an example of a planar configuration of a panel module according to a second modified example of the second embodiment.
  • FIG. 19 is a schematic plan view illustrating an example of a planar configuration of a panel module according to a third modified example of the second embodiment.
  • FIG. 20 is a cross-sectional view illustrating a configuration example of a light emitting device according to a first modification of the present disclosure.
  • FIG. 20 is a cross-sectional view illustrating a configuration example of a light emitting device according to a first modification of the present disclosure.
  • FIG. 21 is a cross-sectional view illustrating a configuration example of a light emitting device according to a second modified example of the present disclosure.
  • FIG. 22 is a cross-sectional view illustrating a configuration example of a light emitting device according to a third modified example of the present disclosure.
  • FIG. 23 is a cross-sectional view illustrating a configuration example of a light emitting device according to a fourth modified example of the present disclosure.
  • FIG. 24 is a cross-sectional view illustrating a configuration example of a light emitting device according to a fifth modified example of the present disclosure.
  • FIG. 25 is a cross-sectional view illustrating a configuration example of a light emitting device according to a sixth modified example of the present disclosure.
  • FIG. 26 is a perspective view illustrating a configuration example of a display device according to a seventh modified example of the present disclosure.
  • First embodiment 1.1 Configuration 1A and 1B are perspective views showing a configuration example of a light-emitting device 100 according to a first embodiment of the present disclosure.
  • the light-emitting device 100 is suitable as a surface light source, and is used, for example, as a direct-down type backlight mounted on a liquid crystal display device.
  • 1A and 1B show the light-emitting device 100 viewed from opposite directions. Specifically, 1A shows the light-emitting device 100 viewed from the light-emitting surface side, and 1B shows the light-emitting device 100 viewed from the back side opposite to the light-emitting surface.
  • FIGS. 1A and 1B are plan views showing an example of the planar configuration of the light-emitting device 100 shown in FIGS. 1A and 1B, respectively.
  • FIG. 2A shows a schematic planar configuration of a relay sheet member 20 described below
  • FIG. 2B shows a schematic planar layout of a plurality of light source units 10 described below.
  • FIG. 3 is an enlarged cross-sectional view showing an example of the cross-sectional configuration of a portion of the light-emitting device 100 shown in FIGS. 1A and 1B. Note that FIG. 3 shows a cross section taken along the III-III cutting line shown in FIG. 2A.
  • the light emitting device 100 has, for example, a plurality of light source units 10, one relay sheet member 20, and one protective sheet member 30.
  • the plurality of light source units 10 are arranged in a discrete manner so as to be aligned along both the X-axis direction and the Y-axis direction and to be spaced apart from each other.
  • the mutual intervals between the plurality of light source units 10 are not limited to being constant, and can be set arbitrarily according to the desire.
  • the one relay sheet member 20 and the one protective sheet member 30 extend in both the X-axis direction and the Y-axis direction so as to include portions that are joined to each of the plurality of light source units 10.
  • the relay sheet member 20 is mechanically joined to each of the plurality of light source units 10. In other words, the relay sheet member 20 supports each of the plurality of light source units.
  • the relay sheet member 20 is also electrically connected to each of the plurality of light source units 10.
  • the relay sheet member 20 is shown with a dashed line to ensure visibility of the multiple light source units 10.
  • the protective sheet member 30 is shown with a dashed line to ensure visibility of the multiple light source units 10.
  • the protective sheet member 30 is omitted.
  • each light source unit 10 has one light source substrate 1 and one light source 2.
  • the light source substrate 1 has a surface 1FS and a back surface 1BS on the opposite side of the thickness direction (Z-axis direction) to the surface 1FS.
  • the light sources 2 are provided on the surface 1FS (FIG. 3) of the light source substrate 1.
  • the light sources 2 are arranged, for example, in a row at a predetermined interval along the X-axis direction, which is the longitudinal direction of the light source substrate 1.
  • the relay sheet member 20 is provided on the surface 1FS side of each of the multiple light source substrates 1.
  • the relay sheet member 20 is joined to the surface 1FS of each of the multiple light source substrates 1 by, for example, a conductive connection member 6.
  • the protective sheet member 30 extends along the XY plane and is provided on the back surface 1BS side of each of the multiple light source substrates 1 so as to cover the entirety of the multiple light source units 10.
  • the protective sheet member 30 may be joined to the back surface 1BS of each of the multiple light source substrates 1 by, for example, adhesion.
  • the light emitting device 100 further includes driving elements 40C, 40L, and 40R, as shown in FIG. 2A.
  • the driving elements 40C, 40L, and 40R are substantially the same components, except for their different positions. Therefore, in the following description, the driving elements 40C, 40L, and 40R may be collectively referred to as driving element 40.
  • the driving element 40 may be provided, for example, on the relay sheet member 20, as shown in FIG. 2A. Alternatively, the driving element 40 may be provided on the light source substrate 1 of each light source unit 10. The driving element 40 may also be provided on both the relay sheet member 20 and the light source substrate 1 of the light source unit 10.
  • each of the light source units 10 has a light source substrate 1, a plurality of light sources 2, wiring 4, and a resin layer 5.
  • the light source substrate 1 is, for example, a resin-made film-like member having electrical insulation, and may be flexible.
  • the light source substrate 1 may be, for example, a resin film made of PI (polyimide), PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), PEI (polyetherimide), LCP (liquid crystal polymer), or fluororesin.
  • the light source substrate 1 may be a metal-based substrate such as aluminum (Al) on whose surface an insulating resin layer such as polyimide or epoxy-based resin is formed.
  • the light source substrate 1 may be a film substrate made of a glass-containing resin such as a glass epoxy resin represented by FR4 or a glass composite resin represented by CEM3.
  • a plurality of wirings 4 and a plurality of light sources 2 are mounted on the surface 1FS of the light source substrate 1.
  • the wirings 4 are covered with a resin layer 5 except for a portion thereof.
  • a connection member 6 is provided in a standing manner in a partial region of each of the plurality of wirings 4.
  • Each of the plurality of wirings 4 is electrically connected to the relay sheet member 20 via the connection member 6.
  • the light sources 2 are provided on the surface 1FS of the light source substrate 1.
  • a plurality of wirings 4 having a predetermined pattern shape are formed so that each of one or more light sources 2 can be independently controlled for light emission.
  • the plurality of wirings 4 enables local light emission control (local dimming) of the plurality of light sources 2.
  • the light emission intensity and the timing of lighting are controlled for each unit area A (described as AL, AC, AR in FIG. 2B) shown by the dashed line in FIG. 2 by the driving element 40 (described as 40L, 40C, 40R in FIG. 2A).
  • the driving element 40 is a driving IC that drives each light source 2, that is, turns on and off the light.
  • the plurality of light sources 2 provided in the unit area AL are connected to the driving element 40L by the wiring 4 (FIG. 3) and the wiring 22 (described later).
  • the light sources 2 provided in the unit area AC are connected to the driving element 40C by the wiring 4 (FIG. 3) and the wiring 22 (described later).
  • the light sources 2 provided in the unit area AR are connected to the driving element 40R by the wiring 4 (FIG. 3) and the wiring 22 (described later).
  • the driving element 40L drives, for example, four light sources 2 provided in the unit area AL among the multiple light sources 2.
  • the driving element 40C drives, for example, four light sources 2 provided in the unit area AC among the multiple light sources 2.
  • the driving element 40R drives, for example, four light sources 2 provided in the unit area AR among the multiple light sources 2.
  • four light sources 2 are arranged in one unit area A (AL, AC, AR), but the present disclosure is not limited thereto.
  • the number of light sources 2 included in one unit area A (AL, AC, AR) may be 1 to 3, or may be 5 or more.
  • the layout of the multiple unit areas AR is not limited to that shown in FIG. 2B.
  • the wiring 4 is formed by, for example, laminating copper foil to the light source substrate 1 and then patterning it using photolithography.
  • the wiring 4 may be formed by forming a metal film on the light source substrate 1 using plating or vacuum deposition technology and then patterning it using photolithography.
  • the wiring 4 may be formed by a printing method such as screen printing or inkjet printing. Examples of materials that can be used to form the wiring 4 include copper (Cu), aluminum (Al), silver (Ag), or alloys of these.
  • the resin layer 5 is, for example, a white resist layer.
  • the resin layer 5 has a relatively high reflectance with respect to the light emitted from the light source 2.
  • the white resist include inorganic materials such as titanium oxide (TiO 2 ) fine particles and barium sulfate (BaSO 4 ) fine particles, and organic materials such as porous acrylic resin fine particles and polycarbonate resin fine particles having countless holes for light scattering. Epoxy-based resins can also be used as the constituent material of the resin layer 5.
  • the resin layer 5 may be made of a resin containing fine particles of an inorganic material such as titanium oxide (TiO 2 ) fine particles and barium sulfate (BaSO 4 ) fine particles.
  • a relay sheet member 20 is bonded by adhesion or the like to the surface of the resin layer 5 in an area other than the area where the light source 2 is provided.
  • Fig. 4 is an enlarged cross-sectional view showing one configuration example of the light source 2 shown in Fig. 1.
  • the light source 2 is a so-called direct potting type light source, and has a light emitting element 71 and a sealing lens 72.
  • the light emitting element 71 has, for example, a semiconductor layer 73 including a light emitting body, and a reflective layer 75 arranged to face the semiconductor layer 73 in the Z-axis direction with a transparent layer 74 interposed therebetween.
  • the transparent layer 74 is made of, for example, sapphire or silicon carbide (SiC).
  • the semiconductor layer 73 is, for example, an n-type semiconductor layer, an active layer, and a p-type semiconductor layer stacked in this order from the transparent layer 74 side.
  • the n-type semiconductor layer is made of, for example, an n-type nitride semiconductor (for example, n-type GaN).
  • the active layer is made of, for example, a nitride semiconductor (for example, n-type GaN) having a quantum well structure.
  • the p-type semiconductor layer is made of, for example, a p-type nitride semiconductor (for example, p-type GaN).
  • the semiconductor layer 73 is made of, for example, a blue LED (Light Emitting Diode) that emits blue light (for example, wavelength 440 nm to 460 nm).
  • the reflective layer 75 is provided on the surface of the transparent layer 74 opposite to the semiconductor layer 73.
  • the reflective layer 75 is made of a material having a high reflectance.
  • the reflective layer 75 is made of a silver vapor deposition film, an aluminum vapor deposition film, a multilayer reflective film, or the like.
  • the multilayer reflective film may be, for example, a Distributed Bragg Reflector (DBR).
  • DBR Distributed Bragg Reflector
  • the light LB emitted from the active layer of the semiconductor layer 73 is reflected by the reflective layer 75 and then enters the sealing lens 72 from the end face 74T of the transparent layer 74.
  • the light LB that enters the sealing lens 72 passes through the sealing lens 72 and is emitted to the surroundings. Note that the light LB is subjected to an optical effect when passing through the sealing lens 72.
  • the sealing lens 72 is an optical member made of a transparent resin such as silicone or acrylic.
  • the sealing lens 72 is configured to cover the entire light-emitting element 71 and seal the light-emitting element 71.
  • the sealing lens 72 has a refractive index between the refractive index of the semiconductor layer 73 of the light-emitting element 71 and the refractive index of air.
  • the sealing lens 72 is intended to protect the light-emitting element 71 and to improve the extraction efficiency of the light emitted from the light-emitting element 71.
  • the outer shape of the sealing lens 72 is not particularly limited as long as it has an optical effect as a lens for extracting the light LB emitted from the light-emitting element 71.
  • the outer shape of the sealing lens 72 is not limited to a shape including a spherical surface, and may be a shape including an aspherical surface.
  • the sealing lens 72 may be configured to control the light distribution direction of the light LB emitted from the light-emitting element 71.
  • the light source 2 is configured as a direct potting type, it is easy to make the shape of the sealing lens 72 into a dome shape with an aspect ratio of 0.2 or more and 1 or less.
  • the shape of the sealing lens 72 is made into a dome shape, particularly within the range of 0.4 to 0.6, the brightness uniformity characteristics such as brightness unevenness are improved.
  • the aspect ratio is the ratio of the height h to the radius r of the dome-shaped lens shape, or h/r. When the aspect ratio is 1, the shape is a hemisphere.
  • the sealing lens 72 may include, for example, a particulate wavelength conversion member 81.
  • the wavelength conversion member 81 includes, for example, a phosphor (fluorescent substance) such as a fluorescent pigment or fluorescent dye, or quantum dots, and is excited by light from the light source 2, and converts the light from the light source 2 into light of a different wavelength different from the original wavelength through the principle of fluorescence emission, etc., and emits this light. Note that, for simplicity, in FIG. 4, the wavelength conversion member 81 is depicted as particulate, but the present disclosure is not limited to the wavelength conversion member 81 being particulate.
  • the wavelength conversion member 81 absorbs the blue light LB emitted from the semiconductor layer 73 of the light source 2 and converts a portion of it to red light (e.g., wavelength 620 nm to 750 nm) or green light (e.g., wavelength 495 nm to 570 nm).
  • red light e.g., wavelength 620 nm to 750 nm
  • green light e.g., wavelength 495 nm to 570 nm.
  • the blue light LB from the semiconductor layer 73 passes through the sealing lens 72 including the wavelength conversion member 81, and the red, green, and blue lights are combined to generate white light.
  • the wavelength conversion member 81 included in the sealing lens 72 may absorb blue light and convert a portion of it to yellow light. In this case, the light from the light source 2 passes through the sealing lens 72, and the yellow and blue lights are combined to generate white light. Therefore, the light source 2 can be said to be a white light source.
  • the wavelength conversion member 81 preferably includes quantum dots.
  • Quantum dots are particles with a major axis of about 1 nm to 100 nm, and have discrete energy levels. Since the energy state of quantum dots depends on their size, it is possible to freely select the emission wavelength by changing the size. In addition, the emission light of quantum dots has a narrow spectral width. The color gamut is expanded by combining light with such steep peaks. Therefore, by using quantum dots as the wavelength conversion member, it is possible to easily expand the color gamut. Furthermore, quantum dots have high responsiveness, and it is possible to efficiently use the light of the light source 2. In addition, quantum dots are also highly stable.
  • Quantum dots are, for example, compounds of group 12 elements and group 16 elements, compounds of group 13 elements and group 16 elements, or compounds of group 14 elements and group 16 elements, such as CdSe, CdTe, ZnS, CdS, PbS, PbSe, or CdHgTe. Additionally, there is a demand for Cd-free quantum dots due to environmental regulations such as the RoHS regulation, and core materials include InP, perovskite CsPbBr3, Zn(Te,Se), and silver indium sulfide, which is a ternary system of the I-III-VI group.
  • the relay sheet member 20 is a member that electrically and mechanically connects the plurality of light source units 10 and relays the plurality of light source units 10 with a power supply circuit, a driving circuit, and the like.
  • the relay sheet member 20 may be, for example, made of a flexible film member.
  • the relay sheet member 20 is provided in common with the plurality of light source units 10. As described above, the relay sheet member 20 is joined to the surface 1FS of the light source substrate 1 in each of the plurality of light source units 10. More specifically, the relay sheet member 20 is provided in an area of the surface 1FS of the light source substrate 1 other than the area in which the light source 2 is provided.
  • the relay sheet member 20 has a plurality of openings 21K. As shown in FIGS.
  • each of the plurality of openings 21K is provided at a position where it overlaps with the light source 2 in each of the plurality of light source units 10 in the thickness direction (Z-axis direction) perpendicular to the surface 1FS.
  • the opening 21K is a hole for disposing the light source 2, and the resin layer 5 is exposed in the region where the opening 21K is formed, and the exposed resin layer 5 is covered by the sealing lens 72 of the light source 2.
  • the relay sheet member 20 is bonded to the surface of the resin layer 5 extending in the XY plane.
  • the relay sheet member 20 has a base material 21, wiring 22, a connection portion 23, and an insulating film 24.
  • the substrate 21 is, for example, a reflective sheet serving as a reflective layer that reflects light from one or more light sources 2 in each of the multiple light source units 10.
  • the substrate 21 has a high reflectance, for example, to the light LB from the light source 2 and the light LY wavelength-converted by the wavelength conversion member 81.
  • the substrate 21 may contain titanium oxide or Ag (silver) as a material having a high reflectance.
  • the substrate 21 is, for example, a white resist layer.
  • the white resist include inorganic materials such as titanium oxide (TiO 2 ) fine particles and barium sulfate (BaSO 4 ) fine particles, and organic materials such as porous acrylic resin fine particles and polycarbonate resin fine particles having countless holes for light scattering.
  • an epoxy-based resin may also be used as a constituent material of the substrate 21.
  • the substrate 21 may be constituted by a resin containing fine particles of an inorganic material such as titanium oxide (TiO 2 ) fine particles and barium sulfate (BaSO 4 ) fine particles.
  • the base material 21 is a reflective sheet, among the lights LB and LY, the return light reflected by other members, such as a light diffusion sheet provided in front of the relay sheet member 20, i.e., on the opposite side of the light source board 1 as seen from the relay sheet member 20, is reflected by the base material 21 and used as recycled light for generating white light. This makes it possible to improve the brightness of the light emitting device 100 as a whole.
  • the wiring 22 is selectively provided on a part of the back surface 21BS of the substrate 21 that faces the front surface 1FS of the light source substrate.
  • the wiring 22 is formed by, for example, laminating copper foil on the back surface 21BS of the substrate 21 and then patterning the wiring 22 using a photolithography method.
  • the wiring 22 may be formed by forming a metal film on the back surface 21BS of the substrate 21 using plating or vacuum film formation technology and then patterning the wiring 22 using a photolithography method.
  • the wiring 22 may be formed by a printing method such as screen printing or inkjet printing. Examples of the material of the wiring 22 include copper (Cu), aluminum (Al), silver (Ag), or an alloy thereof.
  • the connection portion 23 is a conductive pad provided on the opposite side of the substrate 21 from the wiring 22 so as to cover a part of the wiring 22.
  • the insulating film 24 is preferably provided so as to cover the parts of the wiring 22 other than the parts covered by the connection parts 23. This is because it acts as a protective film that reduces the opportunities for the wiring 22 to come into contact with the outside air and moisture, and can prevent deterioration of the wiring 22, such as oxidation and alteration.
  • the relay sheet member 20 is joined to each of the light source units 10 via the conductive connection members 6. Specifically, as shown in FIG. 3, the connection parts 23 facing each other in the Z-axis direction and the wiring 4 of the light source unit 10 are joined so as to sandwich the connection members 6.
  • the relay sheet member 20 is joined to a part of the peripheral area surrounding the light source 2 of the light source board 1 in the XY plane, for example.
  • Each light source unit 10 and the relay sheet member 20 may be joined at multiple locations via the connection members 6. In that case, each light source unit 10 is more stably held by the relay sheet member 20.
  • multiple channels such as signal transmission paths and power supply paths between each light source unit 10 and the relay sheet member 20 can be secured, more functions can be provided.
  • connection member 6 has a bump 61, a conductive material layer 63, and an adhesive layer AD.
  • the bump 61 is provided on the exposed surface of the wiring 4 without being covered by the resin layer 5.
  • the conductive material layer 63 is sandwiched between the bump 61 and the connection portion 23.
  • a conductive paste containing at least one of Ag, Cu, Ni, and Sn, solder, and an anisotropic conductive adhesive are preferably used.
  • the adhesive layer AD can also be made of an anisotropic conductive adhesive like the conductive material layer 63.
  • the adhesive layer AD and the conductive material layer 63 can be formed at the same time using the same anisotropic conductive adhesive.
  • the anisotropic conductive adhesive is an insulating adhesive in which multiple conductive particles are dispersed. Therefore, for example, the anisotropic conductive adhesive sandwiched and pressed between the bump 61 and the connection portion 23 will have multiple conductive particles conducting with each other, forming the conductive material layer 63.
  • the anisotropic conductive adhesive in areas other than the area sandwiched between the bump 61 and the connection portion 23 constitutes an adhesive layer AD that exhibits insulating properties.
  • FIG. 6A to 6C are cross-sectional views showing the process of forming the connection member 6 of the light-emitting device 100.
  • the wiring 4 of the light source unit 10 and the wiring 22 of the relay sheet member 20 are opposed to each other.
  • a bump 61 is formed so as to cover the wiring 4.
  • an anisotropic conductive adhesive 63Z is formed so as to cover the bump 61.
  • the anisotropic conductive adhesive 63Z is pressed so as to be sandwiched between the bump 61 and the connection portion 23, so that the anisotropic conductive adhesive 63Z sandwiched between the bump 61 and the connection portion 23 becomes a conductive material layer 63 having conductivity.
  • the connection member 6 is formed, and the light source unit 10 and the relay sheet member 20 are joined.
  • the bump 61 is formed only on the wiring 4 is illustrated in FIGS. 5 to 6C, the present disclosure is not limited thereto.
  • bumps may be provided on both the wiring 4 and the connection portion 23, and an anisotropic conductive adhesive may be sandwiched between them and pressed to form the connection member 6.
  • the protective sheet member 30 is provided in common to the plurality of light source units 10. As described above, the protective sheet member 30 is bonded to the rear surface 1BS of one light source substrate 1 in each of the plurality of light source units 10. As shown in FIG. 3, the protective sheet member 30 has, for example, a base material 31 and an adhesive layer 32. The base material 31 is bonded to the rear surface 1BS of the light source substrate 1 by the adhesive layer 32. The base material 31 may be made of, for example, the same material as the base material 21 of the relay sheet member 20. That is, the base material 31 may be, for example, a reflective sheet as a reflective layer that reflects light from one or more light sources 2 in each of the plurality of light source units 10.
  • the base material 31 may also be a film member having flexibility. Note that all of the light source substrate 1, the relay sheet member 20, and the protective sheet member 30 may be flexible. In that case, the handleability is improved. In addition, by providing the protective sheet member 30, oxidation of the wiring 22 of the relay sheet member 20 and oxidation of the wiring 4 of each light source unit 10 can be prevented. Furthermore, by providing the protective sheet member 30, the mechanical strength of the light emitting device 100 can be increased.
  • a part of the blue light LB emitted from the semiconductor layer 73 of the light source 2 becomes light LY that has been wavelength converted (emitted) by the wavelength conversion member.
  • the wavelength converted light LY is, for example, red light and green light, or yellow light.
  • the blue light LB that has not been absorbed by the wavelength conversion member 81 is also emitted from the light source 2.
  • the forward-facing light of the unwavelength converted blue light LB and the forward-facing light of the wavelength converted light LY are combined to generate white light, which is emitted forward (outside the light source device).
  • the light emitting device 100 of this embodiment has one relay sheet member 20 that supports each of the multiple light source units 10 and is electrically connected to each of the multiple light source units 10. That is, according to the light emitting device 100, both the electrical connection and the mechanical connection between the multiple light source units 10 are made through one relay sheet member 20 including the wiring 22, so that the overall configuration of the light emitting device 100 can be made lighter and thinner. Also, according to the light emitting device 100, both the electrical connection and the mechanical connection between the multiple light source units 10 are made through one relay sheet member 20 including the wiring 22, so that the position of each of the multiple light source units 10 can be easily fine-tuned, and the position of each light source 2 can be easily optimized.
  • the multiple light source units 10 by connecting the multiple light source units 10 with one relay sheet member 20, it is possible to reduce the amount of material used for the light source board 1 while having multiple light sources 2, compared to a configuration in which multiple light sources are arranged on a single board-like substrate, for example.
  • the total area of the light source substrates 1, each of which is provided with one or more light sources 2 can be approximately 0.25 or less relative to the area of the light-emitting surface of the light-emitting device 100.
  • the relay sheet member 20 is used as a reflective sheet. Therefore, the total area of the light source substrates 1, each of which is provided with one or more light sources 2, can be approximately half or less relative to the area of the reflective sheet.
  • the light source substrate 1 on which the light source 2 is mounted is required to have high quality in order to enable the formation of a high-definition thin film pattern, for example. Therefore, it is generally often expensive. Therefore, according to the light-emitting device 100, the total area of the light source substrates 1 can be kept small, so that a high-definition emission luminance distribution can be realized while achieving weight reduction, thinning, and cost reduction.
  • the dimensions of the wiring 22 connecting the light source substrates 1 of the plurality of light source units 10 can be made relatively large and the placement precision of the wiring 22 can be kept low, compared to the dimensions of the plurality of wirings 4 formed on each light source substrate 1 and the placement precision of the plurality of wirings 4.
  • the light emitting device 100 has a structure that can be fabricated by individually manufacturing the plurality of light source units 10, each of which has a light source 2 and wiring 4 provided on the light source substrate 1, and one relay sheet member 20 on which the wiring 22 is provided, and then connecting the plurality of light source units 10 with one relay sheet member 20. Therefore, the ease of manufacturing the light emitting device 100 as a whole can be improved, and an improvement in the yield during the manufacturing process can be expected.
  • the relay sheet member 20 is bonded to the surface 1FS, which is the light emitting surface side, of each of the light source boards 1 of the multiple light source units 10, and the relay sheet member 20 includes a base material 21 as a reflective layer that reflects light from each light source 2. This makes it possible to improve the light emitting efficiency of the light emitting device 100.
  • the protective sheet member 30 is bonded to the back surface 1BS of each of the light source substrates 1 of the multiple light source units 10.
  • the protective sheet member 30 it is possible to prevent oxidation and corrosion of the wiring 22 of the relay sheet member 20 and oxidation and corrosion of the wiring 4 of each of the multiple light source units 10.
  • the protective sheet member 30 it is possible to increase the mechanical strength of the light emitting device 100.
  • the light source units 10 and the relay sheet member 20 are joined via a conductive connection member 6. Therefore, compared to the case where the light source units 10 are joined via a connector, the connection parts between the light source units 10 and the relay sheet member 20 can be simplified, made smaller, thinner, and lighter. Therefore, compared to the case where a connector is used, each light source unit 10 can be made smaller, and the number of light sources 2 per unit area can be increased. That is, the multiple light sources 2 can be highly integrated. Also, compared to the case where a connector is used, the ease of manufacture is improved. In the light emitting device 100, the multiple light source units 10 and the relay sheet member 20 can also be joined at multiple points by the connection member 6.
  • the multiple light source units 10 are more stably held by the relay sheet member 20. Also, since multiple channels such as signal transmission paths and power supply paths between each light source unit 10 and the relay sheet member 20 can be secured, the light emitting device 100 can have more functions.
  • the light emitting device 100 can be suitably used in display devices having curved screens, for example.
  • multiple light source units 10 are fixed and integrated by a single relay sheet member 20. This makes it easier to handle semi-finished products during the manufacturing process, and the work of joining multiple light source units 10 to the relay sheet member 20 can be performed all at once, improving ease of manufacturing.
  • the relay sheet member 20 has an opening 21K in the area where it overlaps with the light source 2 in the Z-axis direction. Therefore, even if the relay sheet member 20 is placed on the light emitting side of the light source 2, it is possible to join the multiple light source units 10 while avoiding the area where the light source 2 is present. This makes it possible to avoid the relay sheet member 20 impeding the progress of the emitted light.
  • a driving element that drives the multiple light sources 2 is provided on at least one of the relay sheet member 20 and the light source board 1. Therefore, the multiple light sources 2 can be driven at a faster speed compared to when the driving element 40 is provided outside the light emitting device 100.
  • the light emitting device 100 of the present embodiment can achieve high integration by arranging a plurality of light sources at a higher density, while exhibiting excellent light emitting performance.
  • the light emitting device 100 is easy to manufacture, and the overall structure can be made thinner and lighter.
  • FIG. 7 is a cross-sectional view showing a configuration example of a light emitting device 100A according to a first modified example (modified example 1-1) of the first embodiment.
  • the relay sheet member 20 is disposed so that the surface 21FS faces the back surface 1BS of one of the light source substrates 1 in each of the plurality of light source units 10.
  • the wiring 22 is selectively provided on a part of the surface 21FS of the base material 21 facing the back surface 1BS of each of the light source substrates 1.
  • the insulating film 24 is provided so as to cover the wiring 22.
  • the insulating film 24 may be made of a material having a high reflectance with respect to the light LB from the light source 2 and the light LY whose wavelength has been converted by the wavelength conversion member 81, for example.
  • the insulating film 24 may contain titanium oxide or Ag (silver) as a material having a high reflectance.
  • the insulating film 24 is, for example, a white resist layer.
  • white resist include inorganic materials such as titanium oxide ( TiO2 ) particles and barium sulfate ( BaSO4 ) particles, and organic materials such as porous acrylic resin particles and polycarbonate resin particles having countless pores for light scattering. Epoxy resins can also be used as the material for the insulating film 24.
  • the insulating film 24 may be made of a resin containing inorganic material particles such as titanium oxide ( TiO2 ) particles and barium sulfate ( BaSO4 ) particles.
  • the relay sheet member 20 is provided so as to face the rear surface 1BS of the light source substrate 1 of each of the multiple light source units 10. Therefore, in the light emitting device 100A, it is not necessary to provide an opening 21K in the base material 21, and mechanical strength can be ensured without providing a protective sheet member 30.
  • (Variation 1-2) 8 is a cross-sectional view showing an example of the configuration of a light emitting device 100B according to a second modified example (modified example 1-2) of the first embodiment.
  • a relay sheet member 20-2 is used instead of the relay sheet member 20.
  • the relay sheet member 20-2 does not have an insulating film 24 that covers the wiring 22. Except for this point, the configuration of the light emitting device 100B is the same as that of the light emitting device 100 of the above embodiment.
  • (Modification 1-3) 9 is a cross-sectional view showing an example of the configuration of a light emitting device 100C according to a third modified example (modified example 1-3) of the first embodiment.
  • a relay sheet member 20-3 is used instead of the relay sheet member 20.
  • the relay sheet member 20-3 has, between the base material 21 and the wiring 22, an insulating film 25 and an adhesive layer 26, in this order from the wiring 22 side. Except for this point, the configuration of the light emitting device 100C is the same as that of the light emitting device 100 of the above embodiment.
  • the relay sheet member 20-3 can be obtained by the following method. Specifically, a flexible printed circuit board in which the wiring 22 is patterned on the insulating film 25 is prepared in advance, and the flexible printed circuit board is attached to the back surface 21BS of the base material 21 with the adhesive layer 26, thereby obtaining the relay sheet member 20-3.
  • the relay sheet member 20-3 By producing the relay sheet member 20-3 by such a method, it is possible to avoid the application of heat to the base material 21 when patterning the wiring 22.
  • the relay sheet member 20-3 can be used as the constituent material of the base material 21 even if the material is easily altered by heat.
  • FIG. 10 is a cross-sectional view showing a configuration example of a light emitting device 100D according to a fourth modification (modification 1-4) of the first embodiment.
  • a sealing resin 82 is provided instead of the sealing lens 72.
  • the sealing resin 82 is filled in, for example, the opening 21K. Except for this point, the configuration of the light emitting device 100D is substantially the same as the configuration of the light emitting device 100 of the above embodiment.
  • the sealing resin 82 can have a lens function by having a curved surface 82FS.
  • the sealing resin 82 can be embedded with a wavelength conversion member 81.
  • light diffusing particles may be embedded in the sealing resin 82.
  • the end surface 21KS of the opening 21K is preferably inclined so that the inner diameter of the opening 21K increases as it moves away from the semiconductor layer 73 in the Z-axis direction.
  • the light emitting device 100D has a larger volume than the sealing lens 72, so optical effects such as wavelength conversion and light scattering can be sufficiently obtained without the need to provide a wavelength conversion sheet or diffusion sheet in front of the multiple light source units 10.
  • FIG. 1A is a schematic plan view illustrating a configuration example of a light source unit 10A according to a fifth modified example (modified example 1-5) of the first embodiment.
  • a driving element 40 is provided on a surface 1FS of a light source substrate 1 on which a light source 2 is provided.
  • the light source 2 is driven by the driving element 40.
  • Modification 1-6 11B is a schematic cross-sectional view showing a configuration example of a light source unit 10B according to a sixth modified example (modified example 1-6) of the first embodiment.
  • a driving element 40 is provided on a back surface 1BS opposite to a front surface 1FS of a light source substrate 1 on which a light source 2 is provided.
  • the light source 2 is driven by the driving element 40.
  • Modification 1-7) 11C is a schematic plan view showing a configuration example of a light emitting device 100E according to a seventh modification (modification 1-7) of the first embodiment.
  • the light emitting device 100E some of the light source units 10 among the plurality of light source units 10 arranged discretely in both the X-axis direction and the Y-axis direction are replaced with driving elements 40.
  • the driving elements 40 are mounted on a substrate 41 formed of the same material as the light source substrate 1, for example.
  • the substrate 41 is joined to the relay sheet member 20 in the same manner as the light source substrate 1.
  • the driving elements 40 are adapted to drive the light sources of some of the light source units 10 arranged around them.
  • Modification 1-8) 11D is a schematic plan view showing a configuration example of a light emitting device 100F according to an eighth modification (modification 1-8) of the first embodiment.
  • the light emitting device 100F several driving elements 40 are arranged in the gaps between a plurality of light source units 10 that are discretely arranged in both the X-axis direction and the Y-axis direction.
  • the driving elements 40 are mounted on a substrate 41 that is made of the same material as the light source substrate 1, for example.
  • the substrate 41 is joined to the relay sheet member 20, similar to the light source substrate 1.
  • the driving elements 40 are adapted to drive the light sources of several light source units 10 arranged around them.
  • FIG. 11E is a schematic plan view showing a configuration example of a light source unit 10C according to a ninth modification (modification 1-9) of the first embodiment.
  • the light source unit 10C has a plurality of light sources 2 (2A to 2D) provided on a surface 1FS of one light source substrate 1, and a driving element 40 provided in the gaps between the plurality of light sources 2 on the surface 1FS.
  • the plurality of light sources 2 (2A to 2D) are all driven by the driving element 40.
  • the light sources 2A to 2D may each include a light-emitting element (for example, all blue LEDs) that emit light of the same color.
  • the light sources 2A to 2D may include a light-emitting element, at least some of which emit light of a different color from the others. More specifically, for example, the light source 2A may include a blue LED that emits blue light, the light source 2B and the light source 2D may include a green LED that emits green light, and the light source 2C may include a red LED that emits red light. Alternatively, for example, light source 2A may emit blue light, light source 2B may emit green light, light source 2C may emit red light, and light source 2D may emit yellow light or white light.
  • (Variation 1-10) 12 is a schematic cross-sectional view showing a configuration example of a light emitting device 100G according to a tenth modification (modification 1-10) of the first embodiment.
  • the light emitting device 100G includes a reflective sheet member 50 instead of the relay sheet member 20, and a protective sheet member 30A instead of the protective sheet member 30.
  • wiring 33 and a connection portion 34 are provided on the protective sheet member 30A, so that the protective sheet member 30A is also used as a relay sheet member.
  • the protective sheet member 30A has a substrate 31, wiring 33, a connection portion 34, and an insulating film 35.
  • the wiring 33 is selectively provided on the upper surface of the substrate 31 facing the light source substrate 1.
  • the connection portion 34 is a conductive pad, and is provided on the opposite side of the substrate 31 from the wiring 33 so as to cover a portion of the wiring 33.
  • the insulating film 35 is preferably provided so as to cover the parts of the wiring 33 other than the parts covered by the connection portion 34. This is because it acts as a protective film that reduces the opportunities for the wiring 33 to come into contact with the outside air and moisture, and can prevent deterioration of the wiring 33 such as oxidation and alteration.
  • the wiring 4 provided on the light source substrate 1 is electrically connected to the connection portion 34 via the connection member 6.
  • the reflective sheet member 50 has a base material 51 and an adhesive layer 52.
  • the base material 51 is adhered to the light source substrate 1 and the protective sheet member 30A by the adhesive layer 52.
  • the base material 51 may be made of, for example, the same material as the base material 21 of the relay sheet member 20. That is, the base material 51 is, for example, a white resist layer.
  • the base material 51 has high reflectivity, for example, for the light LB from the light source 2 and the light LY whose wavelength has been converted by the wavelength conversion member 81.
  • the base material 51 has an opening 51K at a position overlapping with the light source 2 in the Z-axis direction.
  • Second embodiment [2.1 Configuration] 13 shows an external view of a display device 101 according to a second embodiment of the present technology.
  • the display device 101 includes a light-emitting device 100 and is used, for example, as a thin television device, and has a configuration in which a flat body 102 for displaying images is supported by a stand 103.
  • the display device 101 is used as a free-standing type by placing the stand 103 attached to the body 102 on a horizontal surface such as a floor, a shelf, or a stand, but it can also be used as a wall-mounted type by removing the stand 103 from the body 102.
  • FIG. 14 shows an exploded view of the main body 102 shown in FIG. 13.
  • the main body 102 has, for example, a front exterior member (bezel) 111, a panel module 112, and a rear exterior member (rear cover) 113, in this order from the front side (viewer side).
  • the front exterior member 111 is a frame-shaped member that covers the front periphery of the panel module 112, and a pair of speakers 114 are arranged below it.
  • the panel module 112 is fixed to the front exterior member 111, and a power supply board 115 and a signal board 116 are mounted on its rear surface, and a mounting bracket 117 is fixed to it.
  • the mounting bracket 117 is for mounting a wall-mount bracket, mounting boards, etc., and mounting the stand 103.
  • the rear exterior member 113 covers the rear and side surfaces of the panel module 112.
  • FIG. 15 shows an exploded view of the panel module 112 shown in FIG. 14.
  • the panel module 112 has, for example, from the front side (viewer side), a front housing (top chassis) 121, a liquid crystal panel 122, a frame-shaped member (middle chassis) 123, a light-emitting device 100, a rear housing (back chassis) 124, and a timing controller board 127, in this order.
  • the front housing 121 is a frame-shaped metal part that covers the front peripheral edge of the liquid crystal panel 122.
  • the liquid crystal panel 122 has, for example, a liquid crystal cell 122A, a source substrate 122B, and a flexible substrate 122C such as a COF (Chip On Film) that connects these.
  • the frame member 123 is a frame-shaped resin part that holds the liquid crystal panel 122.
  • the rear housing 124 is a metal part made of iron (Fe) or the like that houses the liquid crystal panel 122, the frame member 123, and the light emitting device 100.
  • a timing controller board 127 is also mounted on the rear surface of the rear housing 124.
  • FIG. 16 is a schematic plan view showing a more specific example of the configuration of the panel module 112.
  • a total of 12 light emitting devices 100 (100-1 to 100-12) are arranged in an area corresponding to the display area of the liquid crystal panel 122 extending in the H direction (horizontal direction) and V direction (vertical direction).
  • six rows of light emitting devices 100 are arranged in the H direction, and two rows of light emitting devices 100 are arranged in the V direction.
  • the timing controller board 127 is provided, for example, in the central area of the panel module 112.
  • the timing controller board 127 and the multiple light emitting devices 100 are connected, for example, by cables CB (CB1 to CB12) and connectors CN (CN1 to CN12), respectively.
  • cables CB CB1 to CB12
  • connectors CN CN1 to CN12
  • ACP anisotropic conductive adhesive
  • ACF anisotropic conductive adhesive
  • the display device 101 an image is displayed by selectively transmitting light from the light emitting device 100 through the liquid crystal panel 122.
  • the display device 101 is provided with the light emitting device 100 having excellent light emission controllability and improved light emission efficiency, and therefore, improvement in the display quality of the display device 101 can be expected.
  • FIG. 17 is a schematic plan view showing a panel module 112A as a first modified example (modified example 2-1) of the second embodiment.
  • the timing controller board 127 and all the light emitting devices 100 are individually and directly connected by the cable CB and the connector CN.
  • the relay sheet members 20 of two adjacent light emitting devices 100 in the V direction are electrically connected to each other to form six light emitting device pairs 100P (100P1 to 100P6).
  • each of the light emitting devices 100-1 to 100-6 is connected to each of the light emitting devices 100-7 to 100-12 to form each of the light emitting device pairs 100P1 to 100P6.
  • the connection between the relay sheet members 20 can be performed, for example, by a board-to-board connector, or a flexible printed circuit board (FPC) and an anisotropic conductive adhesive (ACA).
  • the timing controller board 127 and the six light emitting device pairs 100P1 to 100P6 are connected by cables CB1 to CB6 and connectors CN1 to CN6, respectively.
  • the timing controller board 127 and the six light emitting device pairs 100P1 to 100P6 may be connected using an anisotropic conductive adhesive (ACP, ACF).
  • the panel module 112A of FIG. 17 makes it possible to reduce the number of cables CB and connectors CN, or the number of joints using anisotropic conductive adhesive, when the same number of light-emitting devices 100 are used.
  • (Variation 2-2) 18 is a schematic plan view showing a panel module 112B as a second modified example (modified example 2-2) of the second embodiment.
  • the panel module 112B of this modified example has a total of eight light emitting devices 100 (100-1 to 100-8) arranged in four rows in the H direction and two rows in the V direction.
  • the relay sheet members 20 of two light emitting devices 100 adjacent to each other in the H direction may be electrically connected to each other to form a total of four light emitting device pairs 100P1 to 100P4.
  • a light emitting device pair 100P1 formed by connecting the relay sheet members 20 of the light emitting devices 100-1 to 100-2, a light emitting device pair 100P2 formed by connecting the relay sheet members 20 of the light emitting devices 100-3 to 100-4, a light emitting device pair 100P3 formed by connecting the relay sheet members 20 of the light emitting devices 100-5 to 100-6, and a light emitting device pair 100P4 formed by connecting the relay sheet members 20 of the light emitting devices 100-7 to 100-8 may be formed.
  • the connection between the relay sheet members 20 is as described above.
  • the timing controller board 127 and the light emitting device pairs 100P1 to 100P4 are connected by the connectors CN1 to CN4.
  • the timing controller board 127 and the light emitting device pairs 100P1 to 100P4 may be connected using an anisotropic conductive adhesive (ACP, ACF).
  • ACP anisotropic conductive adhesive
  • the relay sheet members 20 of the four light emitting devices 100-1 to 100-4 arranged in the H direction may be electrically connected to each other, and the relay sheet members 20 of the four light emitting devices 100-5 to 100-8 may be electrically connected to each other.
  • the timing controller board 127 and all the light emitting devices 100-1 to 100-8 may be individually and directly connected to each other using at least one of a cable CB, a connector CN, and an anisotropic conductive adhesive (ACP, ACF).
  • FIG. 19 is a schematic plan view showing a panel module 112C as a third modified example (modified example 2-3) of the second embodiment.
  • the panel module 112B (FIG. 17) of modified example 2-2 is composed of a plurality of light emitting devices 100 connected to each other.
  • the panel module 112C of this modified example is composed of a single light emitting device 100.
  • the timing controller board 127 provided on the back surface of the light emitting device 100 and the wiring 22 can be connected using at least one of a cable, a connector, and an anisotropic conductive adhesive (ACP, ACF).
  • ACP anisotropic conductive adhesive
  • [3.1 Modification 3-1] 20 is an enlarged cross-sectional view of a portion of a light emitting device 100G serving as modified example 3-1 of the present disclosure.
  • the light emitting element 71 is sealed by the sealing lens 72, but the present disclosure is not limited to this.
  • the light emitting device 100G includes a light source 2A instead of the light source 2.
  • the light source 2A includes a light emitting element 71A instead of the light emitting element 71, and a cap lens 72A instead of the sealing lens 72.
  • the light-emitting element 71A is, for example, a packaged blue LED.
  • the light-emitting element 71A specifically has a light-emitting layer 76, a base 77, and a sealing material 78.
  • the base 77 has a concave housing portion.
  • the light-emitting layer 76 is disposed on the bottom surface of the housing portion of the base 77.
  • the housing portion of the base 77 is filled with a sealing material 78.
  • the light-emitting layer 76 is, for example, a point light source, and specifically, is composed of a blue LED.
  • the base 77 is mounted on the light source substrate 1 by soldering or the like via an external electrode made of, for example, a lead frame.
  • the surface of the housing portion of the base 77 has a high reflectance with respect to the light from the light-emitting layer 76.
  • the surface of the housing portion of the base 77 may contain, for example, silver (Ag) as a material having a high reflectance.
  • the sealing material 78 is composed of a transparent resin such as silicone or acrylic.
  • the cap lens 72A is disposed directly above the light-emitting element 71A, spaced apart from the light-emitting element 71A. At the center of the cap lens 72A, an incident surface 72A1 that is concave toward the light-emitting element 71A is provided so as to face the light-emitting element 71A in the Z-axis direction.
  • the cap lens 72A also has an exit surface 72A2 that is, for example, convex toward the diffusion sheet 7 provided on the opposite side of the light-emitting element 71A.
  • the incident surface 72A1 and the exit surface 72A2 each have a diffusing effect on the blue light LB from the light-emitting element 71A.
  • the light emitting device 100G may further include a diffusion sheet 7, a wavelength conversion sheet 8, and a group of optical sheets 9.
  • the diffusion sheet 7 is an optical member disposed between the wavelength conversion sheet 8 and the multiple light sources 2A.
  • the diffusion sheet 7 is intended to uniformize the angular distribution of the incident light.
  • the diffusion sheet 7 may be one diffusion plate or one diffusion sheet, or two or more diffusion plates or two or more diffusion sheets.
  • the diffusion sheet 7 may also be a plate-shaped optical member having a certain thickness and hardness.
  • the wavelength conversion sheet 8 is arranged to face the multiple light sources 2A.
  • the wavelength conversion sheet 8 includes, for example, particulate wavelength conversion material 81.
  • the optical sheet group 9 is an optical member arranged on the light exit surface side of the wavelength conversion sheet 8, i.e., on the opposite side of the diffusion sheet 7 as viewed from the wavelength conversion sheet 8.
  • the optical sheet group 9 includes, for example, a sheet or film for improving brightness.
  • the optical sheet group 9 includes an optical sheet 91 and an optical sheet 92 stacked in order on the wavelength conversion sheet 8.
  • the optical sheet 91 and the optical sheet 92 may be joined together and integrated.
  • the optical sheet 91 is, for example, a prism sheet.
  • the optical sheet 92 is, for example, a reflective polarizing film such as DBEF (Dual Brightness Enhancement Film).
  • the number of optical sheets constituting the optical sheet group 9, as well as the type and stacking order of the multiple optical sheets constituting the optical sheet group 9, can be selected arbitrarily.
  • the blue light emitted from the light-emitting element 71A is diffused by the cap lens 72A and the diffusion sheet 7, and then converted from blue light to white light as it passes through the wavelength conversion sheet 8.
  • the white light converted from the blue light is further luminance-improved and uniformized by the optical sheet group 9, and is then irradiated onto a liquid crystal display panel or the like.
  • a packaged blue LED is used as the light emitting element 71A, but the present disclosure is not limited to this.
  • a packaged white LED may be adopted instead of the packaged blue LED.
  • the light emitting element 1B has, for example, a light emitting layer 76 made of a blue LED, a base 77, and a sealing material 79 made of a transparent resin containing a wavelength conversion material. Note that the light emitting device 100H does not require the wavelength conversion sheet 8. Therefore, compared with the light emitting device 100G of FIG. 18, it is advantageous in terms of making the overall configuration thinner.
  • the light emitting device of the present disclosure is not limited to one that arranges a lens on the emission side of the light emitting element.
  • a plurality of light emitting elements 71C which are packaged blue LEDs, may be arranged without providing various lenses.
  • the light emitting element 71C has substantially the same configuration as the light emitting element 71A shown in FIG. 18, and has a light emitting layer 76, which is, for example, made of a blue LED, a base 77, and a sealing material 78.
  • the blue light emitted from the light emitting element 71C is diffused by the diffusion sheet 7, and then converted from blue light to white light when passing through the wavelength conversion sheet 8.
  • the white light converted from the blue light is further luminance-improved and uniformed by the optical sheet group 9, and is irradiated to a liquid crystal display panel or the like.
  • a packaged blue LED is used as the light emitting element 71C, but the present disclosure is not limited thereto.
  • a packaged white LED may be adopted instead of the packaged blue LED.
  • the light emitting element 71D has substantially the same configuration as the light emitting element 71B shown in FIG. 17, and has, for example, a light emitting layer 76 made of a blue LED, a base 77, and a sealant 79 made of a transparent resin containing a wavelength conversion material.
  • the light emitting device 100J does not require a wavelength conversion sheet 8. Therefore, compared with the light emitting device 100I of FIG. 20, it is advantageous in terms of making the overall configuration thinner.
  • a light emitting device 100K as modified example 3-5 of the present disclosure shown in Fig. 24 includes a light emitting element 71E having a dome-shaped sealing material 78.
  • the configuration of the light emitting element 71E is substantially the same as the configuration of the light emitting element 71C, except for the shape of the sealing material 78.
  • the sealing material 78 has a dome shape, so that the sealing material 78 can have a lens effect. Therefore, the desired alignment performance can be easily obtained.
  • the light emitting device 100L as modified example 3-6 of the present disclosure shown in FIG. 25 includes a light emitting element 71F having a dome-shaped sealing material 99.
  • the configuration of the light emitting element 71F is substantially the same as that of the light emitting element 71D, except that the shape of the sealing material 78 is different.
  • the light emitting element 71F has a light emitting layer 76 made of, for example, a blue LED, a base 77, and a sealing material 79 made of a transparent resin containing a wavelength conversion material.
  • the sealing material 79 since the sealing material 79 has a dome shape, the sealing material 79 can have a lens effect. Therefore, the desired alignment performance can be easily obtained.
  • the display device 101 including the liquid crystal panel 122 has been described as an example, but the present disclosure is not limited thereto. That is, in the display device 101, the light emitting device 100 is used as a backlight for the liquid crystal panel 122, but the light emitting device 100 may be used as a display panel.
  • Figure 26 shows a schematic diagram of a display device 201 including a display panel 200.
  • the display device 201 includes a display panel 210 and a control circuit 220 that drives and controls the display panel 210.
  • the display device 201 is a so-called LED display, in which LEDs are used as display pixels. That is, the light source 2 of the light-emitting device 100 is used as a display pixel.
  • the display panel 210 is a combination of a mounting substrate 210A including the light-emitting device 100 and a counter substrate 210B.
  • the surface of the counter substrate 210B (the surface opposite to the mounting substrate 210A) is an image display surface, and has a display area in the center and a frame area, which is a non-display area, around the display substrate 210B.
  • the counter substrate 210B is disposed in a position opposite the mounting substrate 210A, for example, with a predetermined gap therebetween.
  • the counter substrate 210B may be in contact with the upper surface of the mounting substrate 210A.
  • the opposing substrate 210B has, for example, a light-transmitting substrate that transmits visible light, such as a glass substrate, a transparent resin substrate, or a transparent resin film.
  • the light source is not limited to either a white light source or a blue light source, and may be a light source that emits other colors, such as a red light source or a green light source.
  • the present disclosure may have the following configurations. ⁇ 1> A plurality of light source units each including a light source substrate and one or more light sources provided on the light source substrate; a relay sheet member supporting each of the plurality of light source units and electrically connected to each of the plurality of light source units. ⁇ 2> The light emitting device according to ⁇ 1> above, wherein one or more wirings are formed on the one relay sheet member.
  • ⁇ 3> The light emitting device according to ⁇ 2> above, further comprising a conductive material that electrically connects the plurality of light source units and the wiring of the one relay sheet member.
  • ⁇ 4> The light emitting device according to any one of ⁇ 1> to ⁇ 3> above, wherein the plurality of light source units are spaced apart from each other.
  • ⁇ 5> The light emitting device according to any one of ⁇ 1> to ⁇ 4> above, wherein at least one of the light source board and the one relay sheet member has flexibility.
  • the light source substrate in each of the plurality of light source units includes a first surface on a side from which light from the one or more light sources is emitted and a second surface opposite to the first surface,
  • the one relay sheet member has a plurality of openings, The light emitting device according to ⁇ 6> above, wherein the plurality of openings are provided at positions overlapping with the one or more light sources in each of the plurality of light source units in a thickness direction perpendicular to the first surface.
  • ⁇ 8> The light emitting device according to ⁇ 7> above, wherein the one relay sheet member includes a reflective layer that reflects light from the one or more light sources in each of the plurality of light source units.
  • ⁇ 9> Further comprising one protective sheet member, The light emitting device according to any one of ⁇ 6> to ⁇ 8> above, wherein the one protective sheet member is bonded to the second surface of the one light source substrate in each of the plurality of light source units.
  • ⁇ 10> The light emitting device according to ⁇ 9> above, wherein the light source board, the one relay sheet member, and the one protective sheet member are all flexible.
  • the light emitting device according to item ⁇ 9> or ⁇ 10> above, wherein the one protective sheet member includes a reflective layer that reflects light from the one or more light sources in each of the plurality of light source units.
  • the light source substrate in each of the plurality of light source units includes a first surface on a side from which light from the one or more light sources is emitted and a second surface opposite to the first surface,
  • the light emitting device according to any one of ⁇ 1> to ⁇ 5> above, wherein the one relay sheet member is joined to the second surface of the one light source substrate in each of the plurality of light source units.
  • ⁇ 13> The light emitting device according to any one of ⁇ 1> to ⁇ 12> above, further comprising a driving element for driving the one or more light sources in each of the plurality of light source units.
  • a driving element for driving the one or more light sources in each of the plurality of light source units.
  • the driving element is mounted on at least one of the one relay sheet member and the one light source board.
  • the driving element is The light emitting device described in ⁇ 13> or ⁇ 14> above, which is mounted on the one light source substrate in at least one of the plurality of light source units and drives the one or more light sources provided on the one light source substrate on which the driving element is mounted.
  • the plurality of light source units include a first light source unit and a second light source unit, The light-emitting device described in any one of ⁇ 13> to ⁇ 15> above, wherein the driving element is mounted on the relay sheet member and is configured to drive both one or more light sources provided in the first light source unit and one or more light sources provided in the second light source unit.
  • the plurality of light sources are all white light sources or include a red light source, a green light source and a blue light source.
  • the light source includes a light emitting element that emits blue light;
  • the light emitting device according to any one of ⁇ 1> to ⁇ 17> above, wherein the wavelength conversion member converts blue light from the light emitting element into white light.
  • the wavelength conversion member includes quantum dots.
  • the light emitting device comprises: A plurality of light source units each including a light source substrate and one or more light sources provided on the light source substrate; a relay sheet member supporting each of the plurality of light source units and electrically connected to each of the plurality of light source units.
  • the relay sheet member may further include a plurality of connection portions that electrically connect the plurality of light source units to the relay sheet member, the plurality of light source units and the relay sheet member overlap each other at the plurality of connection portions in a thickness direction of the light source substrate,

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)
PCT/JP2024/000459 2023-01-31 2024-01-11 発光装置および表示装置 Ceased WO2024161935A1 (ja)

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CN202480006976.1A CN120883761A (zh) 2023-01-31 2024-01-11 发光装置及显示装置
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CN120883761A (zh) 2025-10-31
EP4661085A1 (en) 2025-12-10

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