WO2024150410A1

WO2024150410A1 - Substrate work machine

Info

Publication number: WO2024150410A1
Application number: PCT/JP2023/000798
Authority: WO
Inventors: 有城神谷; 幹雄中島; 明宏野田; 晴哉坂口; 陽一村野
Original assignee: 株式会社Fuji
Priority date: 2023-01-13
Filing date: 2023-01-13
Publication date: 2024-07-18

Abstract

This substrate work machine comprises: a transport device that transports a substrate; a work device that performs work on the substrate that has been transported to a predetermined position by the transport device; an imaging device that images an arbitrary position over the transport device; and a recognition device that recognizes a part of the substrate transported by the transport device on the basis of imaging data obtained by the imaging device. If the imaging data obtained by the imaging device at a first imaging position is not appropriate for recognizing the part of the substrate, the imaging device performs imaging at a second imaging position different from the first imaging position, and the recognition device recognizes the part of the substrate on the basis of the imaging data obtained at the second imaging position.

Description

Substrate-related work machine

The present invention relates to a substrate-related processing machine that performs processing on circuit boards.

The following patent document describes an example of a substrate-related processing machine that performs processing on circuit boards:

International Publication No. 2018/142492 JP 2014-222713 A

The objective of the present invention is to perform proper work on circuit boards.

In order to solve the above problems, this specification discloses a substrate-related operating machine that includes a transport device that transports a substrate, a working device that performs work on the substrate transported to a predetermined position by the transport device, an imaging device that captures an image of an arbitrary position on the transport device, and a recognition device that recognizes a portion of the substrate transported by the transport device based on image data captured by the imaging device, and when image data captured by the imaging device at a first imaging position is not appropriate for recognizing the portion of the substrate, the imaging device captures an image at a second imaging position different from the first imaging position, and the recognition device recognizes the portion of the substrate based on the image data captured at the second imaging position.

The substrate-related work machine disclosed herein makes it possible to perform work appropriately on circuit boards.

FIG. 2 is a perspective view showing an electronic component mounting device. FIG. 2 is a perspective view showing a substrate transport and holding device. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2 . FIG. 2 is a block diagram showing a control device. 1 is a top view of a substrate transport and holding device showing a working position and a first imaging position; FIG. 4 is a top view of the board transport and holding device showing the working position and the position of the circuit board. FIG. 13 is a diagram showing an image of pre-transport imaging data. FIG. 13 is a diagram showing an image of post-transport imaging data. FIG. 13 is a diagram showing an image of pre-transport imaging data. 1 is a top view of a substrate transport and holding device showing a working position, a first imaging position, and a second imaging position; FIG. FIG. 2 is a top view of the substrate transport and holding device showing the working position and the imaging candidate range. 1 is a top view of a substrate transport and holding device showing a working position, a first imaging position, and a second imaging position; FIG. 1 is a top view of a substrate transport and holding device showing a working position, a first imaging position, and an imaging candidate range. FIG.

Below, an embodiment of the present invention will be described in detail with reference to the drawings as a form for implementing the present invention.

FIG. 1 shows an electronic component mounting device 10. The electronic component mounting device 10 has one system base 12 and two mounting machines 16 arranged side by side on the system base 12. In the following explanation, the direction in which the mounting machines 16 are lined up is referred to as the X direction, the horizontal direction perpendicular to that direction is referred to as the Y direction, and the vertical direction perpendicular to that direction is referred to as the Z direction.

Each placement machine 16 mainly comprises a placement machine main body 20, a pair of substrate transport and holding devices 22, a placement head moving device (hereinafter sometimes abbreviated as "moving device") 24, a placement head 25, a mark camera 27, a supply device 29, and a control device (see Figure 4) 30. The placement machine main body 20 is composed of a frame 31 and a beam 32 suspended on the frame 31.

As shown in Figures 2 and 3, each of the pair of substrate transport and holding devices 22 has a conveyor device 50 and a substrate holding device 52. Figure 2 is a view showing the substrate transport and holding device 22 from an obliquely upward perspective, and Figure 3 is a view showing the substrate transport and holding device 22 from the perspective of line AA in Figure 2.

The conveyor device 50 has a pair of

guide rails

60, 62 and a conveyor belt 66 provided on each

guide rail

60, 62. The pair of

guide rails

60, 62 are arranged parallel to each other, and each

guide rail

60, 62 is supported on the upper surface of a support base 72 via a pair of support legs 70. The

guide rails

60, 62 are arranged to extend in the X direction.

In addition, two

pulleys

74, 76 are arranged on the side of each

guide rail

60, 62 with the axis in the Y direction. These two

pulleys

74, 76 are arranged at both ends of each

guide rail

60, 62. The guide rail 60 and the guide rail 62 are arranged with the surfaces on which the

pulleys

74, 76 are arranged facing each other. A conveyor belt 66 is wound around the

pulleys

74, 76 of each

guide rail

60, 62, and the conveyor belt 66 is rotated by the drive of an electromagnetic motor (see Figure 4) 78.

The conveyor belt 66 can rotate in either the clockwise direction or the counterclockwise direction in FIG. 3. This makes it possible for a circuit board (see FIG. 6) 80 to be placed on the conveyor belt 66, and for the circuit board to be transported in either the direction from the side where pulley 74 is located to the side where pulley 76 is located, or from the side where pulley 76 is located to the side where pulley 74 is located.

The substrate holding device 52 also has a backup plate 90, multiple backup pins 91, a plate lifting mechanism 92, and a pair of clamp bars 93. The backup plate 90 is generally rectangular and is disposed below the

guide rails

60, 62 so as to extend between the pair of support legs 70 of each

guide rail

60, 62. For example, multiple backup pins 91 are arranged in a 3×3 array on the upper surface of the backup plate 90, that is, three arrays in the X direction and three arrays in the Y direction. The backup plate 90 is disposed on the upper surface of the support base 72 via a plate lifting mechanism 92, and the plate lifting mechanism 92 raises and lowers the backup plate 90 by driving an electromagnetic motor (see FIG. 4) 96.

Furthermore, each of the pair of clamp bars 93 is fixed to the upper surface of the

guide rails

60, 62 so that the backup plate 90 is located between both ends of each clamp bar 93. In other words, the clamp bar 93 is fixed to the upper surface of the

guide rails

60, 62 so that it extends toward the space between the pair of

guide rails

60, 62, and extends above the conveyor belt 66 disposed on the

guide rails

60, 62.

With this structure, in the board transport and holding device 22, the circuit board 80 transported by the conveyor device 50 is clamped by the board holding device 52. In more detail, the circuit board 80 is carried into the mounting machine 16 and transported by the conveyor device 50 to a predetermined work position (the position shown by the dashed line in FIG. 5). When the circuit board 80 is transported to the work position, both edges of the circuit board 80 placed on the conveyor belt 66 of the conveyor device 50 are positioned below a pair of clamp bars 93.

Next, when the circuit board 80 is transported to the working position, the plate lifting mechanism 92 is operated to raise the backup plate 90. At this time, the upper ends of the backup pins 91 come into contact with the underside of the circuit board 80, and as the backup plate 90 rises, the circuit board 80 also rises. At this time, the circuit board 80 is lifted from the conveyor belt 66. As the backup plate 90 rises, the circuit board 80 also rises, and both ends of the upper surface of the circuit board 80 come into contact with the undersides of the pair of clamp bars 93. As a result, while supported from below by the backup pins 91, the circuit board 80 comes into contact with the clamp bars 93 at both edges and is held by the board holding device 52.

As shown in FIG. 1, the moving device 24 is an XY robot type moving device. The moving device 24 is equipped with an electromagnetic motor (see FIG. 4) 112 that slides the slider 110 in the X direction, and an electromagnetic motor (see FIG. 4) 114 that slides the slider 110 in the Y direction. A mounting head 25 is attached to the slider 110, and the mounting head 25 moves to any position on the frame 31 by the operation of the two

electromagnetic motors

112, 114.

The mounting head 25 mounts electronic components on the circuit board 80. The mounting head 25 has a suction nozzle 120 provided on its bottom end surface. The suction nozzle 120 is connected to a positive/negative pressure supply device (see FIG. 4) 122 via negative pressure air and positive pressure air passages. The suction nozzle 120 suctions and holds the electronic component by negative pressure, and releases the held electronic component by positive pressure. The mounting head 25 also has a nozzle lifting device (see FIG. 4) 124 that raises and lowers the suction nozzle 120. The nozzle lifting device 124 allows the mounting head 25 to change the vertical position of the electronic component it holds.

The mark camera 27 is fixed to the slider 110 of the moving device 24 in a downward facing position, and moves to any position together with the mounting head 25 by operating the moving device 24. This allows the mark camera 27 to capture an image of any position on the frame 31.

The supply device 29 is a feeder type supply device and is disposed at the front end of the frame 31. The supply device 29 has a tape feeder 130. The tape feeder 130 houses taped components in a wound state. The taped components are electronic components that have been taped. The tape feeder 130 then feeds out the taped components using a feed device (see FIG. 4) 132. In this way, the feeder type supply device 29 feeds out the taped components to supply electronic components to the mounting head 25 at the supply position.

As shown in FIG. 4, the control device 30 has a controller 140, a plurality of drive circuits 142, and a control circuit 144. The plurality of drive circuits 142 are connected to the

electromagnetic motors

78, 96, 112, 114, the positive and negative pressure supply device 122, the nozzle lifting device 124, and the sending device 132. The controller 140 is mainly a computer, including a CPU, ROM, RAM, etc., and is connected to the plurality of drive circuits 142. As a result, the operation of the substrate transport and holding device 22, the moving device 24, etc. is controlled by the controller 140. The controller 140 is also connected to a display panel (see FIG. 1) 145 via the control circuit 144. As a result, the controller 140 displays an arbitrary image on the display panel 145. Furthermore, the controller 140 is also connected to an image processing device 146. The image processing device 146 is a device for processing the image data captured by the mark camera 27. As a result, the controller 140 acquires various information from the image data.

In the mounting machine 16, the above-mentioned configuration allows the mounting head 25 to perform mounting work on the circuit board 80 held by the board transport and holding device 22. Specifically, when the circuit board 80 is carried into the mounting machine 16, the conveyor device 50 transports the circuit board 80 to a working position in response to a command from the controller 140. Then, at the working position, the board holding device 52 holds the circuit board 80 in a fixed position. Also, the tape feeder 130 sends out taped components in response to a command from the controller 140, and supplies electronic components at a supply position. Then, the mounting head 25 moves above the supply position of the electronic components in response to a command from the controller 140, and sucks and holds the electronic components with the suction nozzle 120. Next, the mounting head 25 moves above the circuit board and mounts the electronic components on the circuit board 80. Then, when the mounting of the electronic components onto the circuit board 80 is completed, the board holding device 52 releases the circuit board 80, and the circuit board 80 is transported by the conveyor device 50 and removed from the mounting machine 16.

In this way, in the placement machine 16, the circuit board 80 is transported to the work position by the conveyor device 50 and held at the work position by the board holding device 52, thereby performing the work of mounting electronic components on the circuit board 80. In order for the conveyor device 50 to properly transport the circuit board 80 to the work position, the mark camera 27 captures an image of the circuit board 80, and the transport position of the circuit board 80 is corrected based on the image data.

Specifically, as shown in FIG. 5, a work position (position indicated by a dashed line in the figure) 150 is set as the intended position for transporting the circuit board 80 by the conveyor device 50, and the circuit board is transported to the work position 150. However, as shown in FIG. 6, due to a slight operational error of the conveyor device 50 or slippage of the circuit board on the conveyor belt, the circuit board 80 may not be transported to the work position 150. For this reason, as shown in FIG. 5, an imaging position (position indicated by a dotted line in the figure) 160 is set in a range including the end of the work position 150, that is, the intended position for transporting the circuit board 80 by the conveyor device 50. Note that the imaging position 160 is set to include a predetermined range in the X direction (e.g., several centimeters) so that the end of the circuit board 80 in the X direction is included in the imaging position 160 even if the circuit board 80 is transported to a position shifted from the work position 150. The imaging position 160 is also set in advance by the operator.

Before the circuit board 80 is transported to the work position 150, for example, before it is carried into the mounting machine 16, the mark camera 27 moves above the imaging position 160 and captures an image of the imaging position 160 before the circuit board 80 is transported to the work position 150. At this time, since the circuit board 80 has not been transported to the work position 150, the mark camera 27 captures an image of the upper surface of the backup plate 90 of the board holding device 52 at the imaging position 160. Then, when the image capture is completed, the imaging data of the circuit board 80 before it is transported (hereinafter, referred to as "pre-transport imaging data") is transmitted to the control device 30. Note that since the upper surface of the backup plate 90 is black, the image captured by the mark camera 27 is an overall black image, as shown in FIG. 7, and is an image of the upper surface of the backup plate 90.

When the image capturing at the image capturing position 160 before the circuit board 80 is transported is completed in this manner, the circuit board 80 is transported toward the work position 150 by the conveyor device 50. Then, when the transport of the circuit board 80 to the work position 150 is completed, the mark camera 27 moves above the image capturing position 160 and captures the image of the image capturing position 160 after the circuit board 80 is transported to the work position 150. Then, when the image capturing is completed, the image capturing data after the transport of the circuit board 80 (hereinafter, described as "imaging data after transport") is transmitted to the control device 30. Note that, since the end of the circuit board 80 in the X direction is located at the image capturing position 160 after the transport of the circuit board 80, the image captured by the mark camera 27 is an image including the end 180 of the circuit board 80, as shown in FIG. 8. Incidentally, the black image in the image is an image of the top surface of the backup plate 90, and the dark gray image is an image of the top surface of the circuit board 80.

When the pre-transport imaging data and post-transport imaging data are transmitted to the control device 30, the recognition operation execution unit (see FIG. 4) 170 of the control device 30 executes the recognition operation of the edge of the circuit board 80. In the recognition operation, the pre-transport imaging data and the post-transport imaging data are compared, and the common parts of the pre-transport imaging data and the post-transport imaging data are estimated to be the imaging data of the image of the backup plate 90, and the different parts of the pre-transport imaging data and the post-transport imaging data are estimated to be the imaging data of the image of the circuit board 80. Then, the boundary between the part estimated to be the backup plate 90 and the part estimated to be the circuit board 80 is recognized as the edge 180 of the circuit board 80. At this time, the coordinate position of the edge 180 of the circuit board 80 is calculated. In addition, the work position 150 is set in advance, and the coordinate position of the work position 150 is also set as a matter of course. Therefore, in the recognition operation execution unit 170, as shown in FIG. 6, the difference ΔX in the X direction between the coordinate position of the edge 180 of the circuit board 80 and the coordinate position of the work position 150 is calculated. Then, the conveyor device 50 transports the circuit board 80 so that the difference ΔX becomes 0. That is, as shown in FIG. 6, when the circuit board 80 is shifted by the difference ΔX from the working position 150 toward the pulley 74, the conveyor device 50 transports the circuit board 80 in the direction of the pulley 76 a distance equivalent to the difference ΔX. This allows the circuit board 80 to be transported appropriately to the working position 150. Then, when the circuit board 80 is transported to the working position 150, the circuit board is clamped by the board holding device 52. This allows the mounting operation to be performed on the circuit board 80 that has been transported appropriately to the working position 150.

However, if the top surface of the backup plate 90 is dirty or scratched, halation or the like may occur in the image of the backup plate 90 in the pre-transport imaging data, and the edge 180 of the circuit board 80 may not be properly recognized. In more detail, if the top surface of the backup plate 90 is dirty or scratched, the image in the pre-transport imaging data includes a blurred white image where halation occurs, as shown in FIG. 9. In this way, an image including halation is not an image of uniform brightness, and it is difficult to recognize the position of the backup plate 90, so it is not suitable for performing a recognition operation. For this reason, when the pre-transport imaging data is not suitable for a recognition operation, an image is captured by the mark camera 27 at the imaging position of the pre-transport imaging data, that is, at a second imaging position different from the imaging position 160. Note that the imaging position 160 is described as the first imaging position 160 to distinguish it from the second imaging position.

Specifically, when the pre-transport imaging data at the first imaging position 160 is transmitted to the control device 30, the recognition work execution unit 170 judges whether the imaging data is appropriate for the recognition work. At this time, for example, the recognition work execution unit 170 calculates the brightness for each coordinate of the image to judge whether the brightness of the image based on the pre-transport imaging data is uniform, and judges whether the difference between the highest brightness and the lowest brightness exceeds a threshold value. Then, if the difference between the highest brightness and the lowest brightness does not exceed the threshold value, the recognition work execution unit 170 judges that the brightness of the image based on the pre-transport imaging data is uniform and that the imaging data is appropriate for the recognition work. In this way, when it is judged that the pre-transport imaging data at the first imaging position 160 is appropriate for the recognition work, the recognition work is executed at the first imaging position 160. That is, the mark camera 27 captures an image of the circuit board 80 after the board has been transported at the first imaging position 160, and the edge 180 of the circuit board 80 is recognized by comparing the pre-transport imaging data at the first imaging position 160 with the post-transport imaging data at the first imaging position 160.

On the other hand, if the difference between the highest brightness and the lowest brightness in the pre-transport imaging data at the first imaging position 160 exceeds the threshold value, the recognition operation execution unit 170 determines that the brightness of the image based on the pre-transport imaging data is not uniform and that the imaging data is not suitable for the recognition operation. In this way, when it is determined that the pre-transport imaging data at the first imaging position 160 is not suitable for the recognition operation, the second imaging position is automatically set by the setting unit (see FIG. 4) 172 of the control device 30. A first program (see FIG. 4) 176 and a second program (see FIG. 4) 178 are stored in the setting unit 172, and the setting unit 172 sets the second imaging position according to one of the first program 176 and the second program 178.

First, a case where the second imaging position is set according to the first program 176 will be described. The first program 176 is programmed to set the second imaging position to a position shifted in the width direction of the circuit board 80 from the first imaging position 160. Therefore, the second imaging position is set to a position shifted in the width direction of the circuit board 80 from the first imaging position 160 according to the first program 176. The width direction of the circuit board 80 is the direction intersecting the conveying direction of the circuit board 80 conveyed by the conveyor device 50, that is, the Y direction, and the length direction of the circuit board 80 is the conveying direction of the circuit board 80 conveyed by the conveyor device 50, that is, the X direction. Therefore, according to the first program 176, as shown in FIG. 10, the second imaging position 188 is set to a position shifted in the Y direction from the first imaging position 160. The amount of shift Y1 of the second imaging position 188 in the Y direction from the first imaging position 160 is programmed in the first program 176. That is, the X coordinate of the second imaging position 188 is set to the same position as the X coordinate of the first imaging position 160, and the Y coordinate of the second imaging position 188 is set to a position shifted by Y1 from the Y coordinate of the first imaging position 160. In this way, by setting the second imaging position 188 to a position shifted in the Y direction from the first imaging position 160, it is possible to image an area including the edge 180 of the circuit board 80 at the second imaging position 188.

When the second imaging position 188 is set according to the first program 176, the mark camera 27 moves above the second imaging position 188 before the board is transported to capture an image of the second imaging position 188. Next, the imaging data at the second imaging position 188, i.e., the pre-transport imaging data, is transmitted to the control device 30, and the recognition operation execution unit 170 determines whether the pre-transport imaging data at the second imaging position 188 is appropriate for the recognition operation. At this time, if it is determined that the pre-transport imaging data at the second imaging position 188 is appropriate for the recognition operation, the recognition operation is executed at the second imaging position 188. In other words, the mark camera 27 captures an image of the circuit board 80 after the board is transported at the second imaging position 188, and the edge 180 of the circuit board 80 is recognized by comparing the pre-transport imaging data at the second imaging position 188 with the post-transport imaging data at the second imaging position 188. This makes it possible to properly recognize the end 180 of the circuit board 80 based on the imaging data at the automatically set second imaging position 188, even if the end 180 of the circuit board 80 cannot be recognized based on the imaging data at the first imaging position 160.

If it is determined that the pre-transport imaging data at the second imaging position 188 is not appropriate for the recognition work, the setting unit 172 sets a third imaging position according to the first program 176. The third imaging position is set to a position further shifted by Y1 in the Y direction from the second imaging position 188. In other words, the third imaging position is set to a position shifted twice Y1 in the Y direction from the first imaging position 160. Then, when the third imaging position is set, the third imaging position is imaged by the mark camera 27 before the substrate is transported, and the suitability of the pre-transport imaging data at the third imaging position for the recognition work is determined. At this time, if it is determined that the pre-transport imaging data at the third imaging position is appropriate for the recognition work, the recognition work is performed at the third imaging position. On the other hand, if it is determined that the pre-transport imaging data at the third imaging position is not appropriate for the recognition work, the fourth imaging position is set to a position shifted three times Y1 in the Y direction from the first imaging position 160, and is processed in the same manner as the imaging data at the third imaging position. Then, new imaging positions are set in sequence until the pre-transport imaging data is determined to be appropriate for the recognition task, and the recognition task is performed at the imaging position determined to be appropriate for the recognition task.

The second program 178 is programmed to set the second imaging position from within the imaging candidate range. As shown in FIG. 11, the imaging candidate range 190 includes a first imaging candidate range 190a obtained by shifting the first imaging position 160 in the Y direction, and the Y-direction range of the first imaging candidate range 190a is set to overlap with the Y-direction range of the work position 150. The imaging candidate range 190 also includes a second imaging candidate range 190b on the opposite side of the first imaging position 160 and the work position 150, and the Y-direction range of the second imaging candidate range 190b is also set to overlap with the Y-direction range of the work position 150. The imaging candidate range 190 is set by the second program 178 based on the size of the work position 150, that is, the size of the circuit board 80 to be transported. The second imaging position is then set from within the imaging candidate range 190 in accordance with the second program 178. For example, when the second imaging position is set from within the first imaging candidate range 190a, the second imaging position is set at a position shifted in the Y direction from the first imaging position 160. Note that the method of setting the second imaging position from within the first imaging candidate range 190a is very similar to the method of setting the second imaging position according to the first program 176, and therefore a description thereof will be omitted. In this way, by setting the second imaging position from within the first imaging candidate range 190a, it is possible to image the range including the edge 180 of the circuit board 80 at the second imaging position.

When the second imaging position is set from within the second imaging candidate range 190b, for example, as shown in FIG. 12, the second imaging position 200 is set at a position directly opposite the first imaging position 160 and the work position 150. That is, the Y coordinate of the second imaging position 200 is set to the same position as the Y coordinate of the first imaging position 160, and the X coordinate of the second imaging position 200 is set to a position shifted from the X coordinate of the first imaging position 160 by a length equivalent to the length dimension of the work position 150 in the X direction. In this way, by setting the second imaging position 200 from within the second imaging candidate range 190b, it is possible to image a range including the edge 180 of the circuit board 80 at the second imaging position 200.

Then, when the second imaging position is set according to the second program 178, the recognition work is performed at the second imaging position. Note that the recognition work at the second imaging position according to the second program 178 is the same as the recognition work at the second imaging position according to the first program 176, and therefore a description thereof is omitted. Also, if the pre-transport imaging data at the second imaging position according to the second program 178 is not suitable for the recognition work, similarly to the first program 176, new imaging positions are set in sequence until the pre-transport imaging data is determined to be suitable for the recognition work, and the recognition work is performed at the imaging position determined to be suitable for the recognition work.

In addition, in the second program 178, the imaging candidate range is set according to the shape of the circuit board. In detail, a work position 210 having the shape shown in FIG. 13 may be set. In such a shape of the work position 210, a circuit board having recesses formed at both ends in the X direction is held by the board holding device 52, and the electronic component mounting work is performed. The work position 210 includes a first end 210a located at both ends in the X direction and a second end 210b located at a location recessed by X1 in the X direction from the first end 210a. In the work position 210, a first imaging position 212 is set in advance in a range including the second end 210b. Then, the imaging candidate range 220 is set by the second program 178 so as to include a first imaging candidate range 220a obtained by shifting the first imaging position 212 in the Y direction, and the Y-direction range of the first imaging candidate range 220a is set so as to overlap the range of the second end 210b of the work position 210. The second program 178 also sets the imaging candidate range 220 to include the first imaging position 212 and the second imaging candidate range 220b at the opposite position across the work position 210, and the Y-direction range of the second imaging candidate range 220b is also set to overlap with the range of the second end 210b of the work position 210. The second program 178 then sets the second imaging position from within the imaging candidate range 220. The method of setting the second imaging position from within the imaging candidate range 220 is the same as the method of setting the second imaging position from within the imaging candidate range 190. Once the second imaging position is set, the recognition task is performed in the same manner as the procedure described above.

By using the above-mentioned method, when the second imaging position and the third and subsequent imaging positions in the case where the pre-transport imaging data at the second imaging position is not suitable for the recognition work are set in the setting unit 172 according to the first program 176 or the second program 178, the set imaging position is displayed on the display panel 145. This allows the worker to check whether the automatically set work position includes the edge of the circuit board.

In the above description, the second and subsequent imaging positions are automatically set by the setting unit 172, but the worker can also set the second and subsequent imaging positions in advance. That is, for example, the worker sets the second to fifth imaging positions in advance in the control device 30 so as to include the edge of the circuit board. Then, when the pre-transport imaging data at the first imaging position is not appropriate for the recognition work, the mark camera 27 captures the image before the board is transported at the second imaging position that is set in advance. At this time, when the pre-transport imaging data at the second imaging position is appropriate for the recognition work, the recognition work is executed at the second imaging position. This makes it possible to perform the recognition work at the second imaging position that the worker desires. On the other hand, when the pre-transport imaging data at the second imaging position is not appropriate for the recognition work, imaging is performed at the third and subsequent imaging positions that are set in advance, and it is determined whether the pre-transport imaging data is appropriate for the recognition work. This makes it possible to perform the recognition work at the third and subsequent imaging positions that the worker desires when the recognition work cannot be performed based on the imaging data at the second imaging position. Note that if the second to fifth imaging positions have been set in advance by the worker, the second to fifth imaging positions are not displayed on the display panel 145. This is because the worker has set the second to fifth imaging positions, and therefore there is no need to notify the worker of the second to fifth imaging positions.

In the above embodiment, the mounting machine 16 is an example of a substrate-related work machine. The substrate transport and holding device 22 is an example of a transport device. The mounting head 25 is an example of a work device. The mark camera 27 is an example of an imaging device. The circuit board 80 is an example of a substrate. The display panel 145 is an example of an alarm device. The work position 150 is an example of a predetermined position. The recognition work execution unit 170 is an example of a recognition device. The setting unit 172 is an example of a setting device. The work position 210 is an example of a predetermined position.

As described above, this embodiment provides the following advantages:

In the mounting machine 16, when the image data captured by the mark camera 27 at the first imaging position is not suitable for recognizing a part of the circuit board, specifically, the edge, the mark camera 27 captures an image at the second imaging position. Then, the recognition operation execution unit 170 of the control device 30 recognizes the edge of the circuit board based on the image data captured at the second imaging position. In other words, when the edge of the circuit board cannot be recognized based on the image data captured at the first imaging position, the mark camera 27 automatically captures an image at the second imaging position, and the edge of the circuit board is recognized based on the image data. This makes it possible to reduce the worker's efforts during the recognition operation and shorten the recognition operation time. In other words, in the past, when the image data at the first imaging position was not suitable for the recognition operation, the worker searched for the second imaging position, input the searched second imaging position, and then performed the recognition operation again. For this reason, in the past, the worker repeatedly searched for and input the second imaging position, and performed the recognition operation. On the other hand, with the placement machine 16, the worker does not need to search for and input the second imaging position, and the imaging and recognition work is performed automatically at the second imaging position. This saves the worker time during the recognition work and shortens the recognition work time.

Furthermore, the first imaging position 160 is set in advance, and the second imaging position 188 is set in the setting unit 172 in accordance with the first program 176 to a position shifted from the first imaging position 160 in the width direction of the circuit board. This makes it possible to automatically set the second imaging position 188, which includes the edge of the circuit board.

Furthermore, the first imaging position 160 is set in advance, and the second imaging position 200 is set in the setting unit 172 in accordance with the second program 178 to a position opposite the first imaging position 160 and the working position 150. This makes it possible to automatically set the second imaging position 200, which includes the edge of the circuit board.

In addition, when the second imaging position is set according to the first program 176 or the second program 178, the second imaging position is displayed on the display panel 145. This allows the worker to check whether the second imaging position includes the edge of the circuit board.

In addition, the worker can set not only the first imaging position but also the second imaging position in advance. This makes it possible for the worker to perform recognition work at the second imaging position of his/her choice.

Furthermore, if the pre-transport imaging data at the first imaging position is not appropriate for the recognition operation, the mark camera 27 captures an image at the second imaging position before the board is transported. At this time, if the pre-transport imaging data at the second imaging position is appropriate for the recognition operation, the mark camera 27 captures an image again at the second imaging position after the board is transported. Then, the edge of the circuit board is recognized based on the pre-transport imaging data at the second imaging position and the post-transport imaging data at the second imaging position. This makes it possible to properly recognize the edge of the circuit board in the recognition operation at the second imaging position.

The present invention is not limited to the above embodiment, and can be embodied in various forms with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the edge of the circuit board is recognized in the recognition process, but various parts of the circuit board, such as corners of the circuit board, characteristic parts formed on the circuit board, and symbols marked on the circuit board, can be recognized in the recognition process. Examples of characteristic parts formed on the circuit board include convex parts, concave parts, protrusions, and notches. Examples of symbols marked on the circuit board include fiducial marks.

In addition, in the above embodiment, the edge of the circuit board is recognized based on the pre-transport imaging data and the post-transport imaging data, but the edge of the circuit board may be recognized based on the post-transport imaging data. In such a case, for example, if the post-transport imaging data at the first imaging position is not appropriate for the recognition operation, an image is taken after the board is transported at the second imaging position, and the recognition operation is performed based on the second post-transport imaging data.

In the above embodiment, when the edge of the circuit board is recognized, the transport position of the circuit board is corrected based on the amount of misalignment in the X direction between the recognized edge of the circuit board and the work position 150, and the circuit board is transported to the work position 150. The circuit board transported to the work position 150 is then held by the board holding device 52, and the mounting work is performed. On the other hand, when the edge of the circuit board is recognized, the position at which the circuit board is stopped may be calculated based on the recognized edge of the circuit board. The circuit board may then be held by the board transport and holding device 52 at the position at which the circuit board is stopped, and the mounting work may be performed.

In addition, in the above embodiment, the setting of the imaging position and the recognition work are performed in the control device 30, but the setting of the imaging position and the recognition work may be performed in another information processing device, the cloud, etc.

In the above embodiment, the second and subsequent imaging positions that are automatically set by the setting unit 172 are displayed on the display panel 145 to notify the operator, but the operator may be notified by sound, light, etc.

In addition, in the above embodiment, the present invention is applied to a mounting machine 16 that mounts electronic components on a circuit board, but the present invention can also be applied to a substrate-related work machine that performs soldering work on a circuit board, a substrate-related work machine that performs inspection work on a circuit board, etc.

The contents of this disclosure are not limited to the dependent relationships described in the claims. For example, this specification also discloses the technical idea of changing "the substrate-related operation machine described in claim 1" in claim 6 to "the substrate-related operation machine described in claims 1 to 5." In addition, this specification also discloses the technical idea of changing "the substrate-related operation machine described in claim 1" in claim 7 to "the substrate-related operation machine described in claims 1 to 6."

16: Placement machine (machine for substrate work) 22: Substrate transport and holding device (transport device) 25: Placement head (working head) 27: Mark camera (imaging device) 80: Circuit board (substrate) 145: Display panel (alarm device) 150: Work position (predetermined position) 170: Recognition work execution unit (recognition device) 172: Setting unit (setting device) 210: Work position (predetermined position)

Claims

A transport device that transports the substrate;
a working device that performs a work on the substrate transported to a predetermined position by the transport device;
an imaging device that images an arbitrary position on the conveying device;
a recognition device that recognizes a portion of the substrate transported by the transport device based on image data captured by the imaging device;
Equipped with
When imaging data captured by the imaging device at a first imaging position is not suitable for recognizing a portion of the board, the imaging device captures an image at a second imaging position different from the first imaging position, and the recognition device recognizes the portion of the board based on the imaging data captured at the second imaging position.
The first imaging position is set in advance,
2 . The substrate-related operating machine according to claim 1 , further comprising a setting device that sets the second image capturing position to a position shifted from the first image capturing position in a width direction of the substrate transported by the transport device.
The first imaging position is set in advance,
2. The substrate-related operating apparatus according to claim 1, further comprising a setting device for setting the second image capturing position to a position opposite the first image capturing position with respect to the predetermined position.
The substrate-related operation machine according to claim 2 or 3, further comprising a notification device that notifies the second imaging position set by the setting device.
The substrate-related operation machine according to claim 1, wherein the first imaging position and the second imaging position are preset.
The substrate-related work machine according to claim 1, wherein if the imaging data captured by the imaging device at the first imaging position before the substrate is transported is not suitable for recognizing a portion of the substrate, the imaging device captures an image at the second imaging position before the substrate is transported, and if the imaging data captured at the second imaging position is suitable for recognizing a portion of the substrate, the imaging device captures an image again at the second imaging position after the substrate is transported, thereby recognizing a portion of the substrate based on the imaging data captured at the second imaging position before the substrate is transported and the imaging data captured at the second imaging position after the substrate is transported.
The substrate-related processing machine according to claim 1, wherein the portion of the substrate is an edge of the substrate.