WO2024147351A1 - Procédé de liaison, système de liaison, dispositif d'éclairage et dispositif de traitement d'activation - Google Patents
Procédé de liaison, système de liaison, dispositif d'éclairage et dispositif de traitement d'activation Download PDFInfo
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- WO2024147351A1 WO2024147351A1 PCT/JP2024/000043 JP2024000043W WO2024147351A1 WO 2024147351 A1 WO2024147351 A1 WO 2024147351A1 JP 2024000043 W JP2024000043 W JP 2024000043W WO 2024147351 A1 WO2024147351 A1 WO 2024147351A1
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- bonding
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- chip
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- gas
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Abstract
Selon la présente invention, un procédé de liaison permettant de lier deux substrats (W1, W2) comprend une étape d'exposition à des gaz consistant à exposer des surfaces de liaison des deux substrats (W1, W2) à une atmosphère dans laquelle un gaz d'hydrocarbure insaturé et un gaz d'ozone sont présents, une étape d'élimination d'eau consistant à éliminer l'eau qui a adhéré aux surfaces de liaison des substrats (W1, W2), et une étape de liaison temporaire consistant à lier temporairement les deux substrats (W1, W2) l'un à l'autre. Avant l'étape d'exposition aux gaz, une étape de traitement d'activation est effectuée, lors de laquelle les surfaces de liaison des deux substrats (W1, W2) sont activées.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-001038 | 2023-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2024147351A1 true WO2024147351A1 (fr) | 2024-07-11 |
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