WO2024124715A1 - Optical module, and method for monitoring transmitted optical power of optical module - Google Patents

Abstract

Disclosed are an optical module, and a method for monitoring the transmitted optical power of an optical module. The optical module comprises: a circuit board, which is provided with a laser driving chip and an MCU; and a light transmitting component, which comprises a semiconductor laser, a backlight detector and a temperature sensor, wherein the backlight detector is used for receiving backlight of the semiconductor laser, and the temperature sensor is used for measuring the operating temperature of the semiconductor laser; the backlight detector is connected to the laser driving chip, the laser driving chip is connected to the MCU, and the laser driving chip obtains an ADC value and transmits same to the MCU; and the MCU acquires the ADC value and the current operating temperature of the semiconductor laser, determines a corresponding dark current compensation value and a corresponding optical power compensation value according to the current operating temperature, and uses the dark current compensation value and the optical power compensation value to compensate for the ADC value, which is measured by using the backlight detector, of the transmitted optical power of the optical module.

Description

Optical module and optical module transmission light power monitoring method

This application claims the priority of application number 202211598347.1 filed with the China Patent Office on December 12, 2022, and all the contents of which are incorporated by reference into this application.

Technical Field

The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module and a method for monitoring the optical power transmitted by the optical module.

Background technique

With the development of new services and application modes such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment. And with the rapid development of 5G networks, optical modules have made great progress. In order to ensure the transmission quality of signals in optical communication technology, the host computer needs to better monitor the optical module, such as monitoring the transmit optical power of the optical module.

Summary of the invention

In the first aspect, an optical module is provided according to some embodiments of the present disclosure, and the optical module includes: a circuit board, provided with a laser driver chip and an MCU; a light emitting component, electrically connected to the circuit board. Wherein: the light emitting component includes a semiconductor laser, a backlight detector and a temperature sensor, the semiconductor laser is configured to emit a light signal, the backlight detector is configured to receive the backlight of the semiconductor laser, and the temperature sensor is configured to detect the operating temperature of the semiconductor laser. The backlight detector is connected to the monitoring function input end of the laser driver chip, the monitoring function output end of the laser driver chip is connected to the MCU, and the laser driver chip obtains the ADC value and transmits it to the MCU. The MCU is configured to: receive the ADC value sent by the laser driver chip; obtain the current operating temperature of the semiconductor laser in response to the received ADC value; determine the dark current compensation value and the optical power compensation value according to the obtained current operating temperature of the semiconductor laser; compensate the ADC value according to the dark current compensation value and the optical power compensation value to obtain the ADC compensation value; perform dimension conversion of the ADC compensation value according to the conversion slope and the conversion bias to obtain the reported value of the optical module transmitted optical power; compare the reported value of the optical module transmitted optical power with the preset reported value; if the reported value of the optical module transmitted optical power is less than the preset reported value, save the minimum reported value of the optical transmitted optical power to the preset storage area for reading by the host computer where the optical module is located; if the reported value of the optical module transmitted optical power is greater than or equal to the preset reported value, save the reported value of the optical module transmitted optical power to the preset storage area for reading by the host computer where the optical module is located. Among them, the dark current compensation value is configured to compensate for the influence of the dark current of the backlight detector on the light power emitted by the optical module, the optical power compensation value is configured to compensate for the influence of temperature on the light power emitted by the optical module, the minimum value reported for the light emission power is set in the optical module, and the preset storage area is located in the optical module.

In a second aspect, according to some embodiments of the present disclosure, a method for monitoring the optical power transmitted by an optical module is provided, the method comprising: receiving an ADC value sent by a laser driver chip; obtaining the current operating temperature of a semiconductor laser in response to the received ADC value; determining a dark current compensation value and an optical power compensation value based on the obtained current operating temperature; compensating the ADC value based on the dark current compensation value and the optical power compensation value to obtain an ADC compensation value; performing dimension conversion of the ADC compensation value based on a conversion slope and a conversion bias to obtain a reported value of the optical power transmitted by the optical module; and comparing the optical power transmitted by the optical module. The size of the reported value and the preset reported value; if the reported value of the optical power emitted by the optical module is less than the preset reported value, the minimum reported value of the optical power emitted is saved to the preset storage area for reading by the host computer where the optical module is located; if the reported value of the optical power emitted by the optical module is greater than or equal to the preset reported value, the reported value of the optical power emitted by the optical module is saved to the preset storage area for reading by the system where the optical module is located. Among them, the dark current compensation value is used to compensate for the influence of the dark current of the backlight detector on the optical power emitted by the optical module, the optical power compensation value is used to compensate for the influence of temperature on the optical power emitted by the optical module, the minimum reported value of the optical power emitted is set in the optical module, and the preset storage area is located in the optical module.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the present disclosure, the following is a brief introduction to the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and for those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

FIG3 is a schematic diagram of the structure of an optical module provided according to some embodiments of the present disclosure;

FIG4 is an exploded view of an optical module provided according to some embodiments of the present disclosure;

FIG5 is a structural diagram of an optical emission component according to some embodiments of the present disclosure;

FIG6 is a schematic diagram of the internal structure of a light emitting component provided according to some embodiments of the present disclosure;

FIG7 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure;

FIG8 is a schematic diagram of the connection relationship between a device in a light emitting component and a device on a circuit board according to some embodiments of the present disclosure;

FIG. 9 is a flow chart of a method for monitoring the transmitted optical power of an optical module according to some embodiments of the present disclosure.

Detailed ways

The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms such as the third person singular form "comprises" and the present participle form "comprising" are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the embodiments or The specific features, structures, materials or characteristics related to the examples are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner.

In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct or indirect physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct or indirect physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

“At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

“A and/or B” includes the following three combinations: A only, B only, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

As used herein, "about," "substantially," or "approximately" includes the stated value and an average that is within an acceptable range of variation from that value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals/gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and/or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and/or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in FIG1 , the optical communication system partially presents a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. Exemplarily, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional or bidirectional electrical signal connection.

Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and data center servers are common host computers.

One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

Exemplarily, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

Exemplarily, a first optical signal from the direction of a remote information processing device 1000 propagates through an optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

FIG. 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG. 2, the host computer 100 also includes a PCB circuit board 105 arranged in the housing, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106, and the heat sink 107 has a protruding structure that increases the heat dissipation area. The fin-like structure is a common protruding structure.

The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

FIG. 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure; Some embodiments provide an exploded view of an optical module, FIG. 3 and FIG. 4 show an optical module of a coaxial package (TO-CAN, TO), and the embodiments of the present disclosure are not limited to TO package, and can also be a chip on board (Chip On Board, COB) package, micro-optical package, etc. As shown in FIG. 3 and FIG. 4, the optical module 200 includes a shell, a circuit board 206, a light receiving component 207 and a light emitting component 300 arranged in the shell.

The shell comprises an upper shell 201 and a lower shell 202 . The upper shell 201 covers the lower shell 202 to form the above shell with two openings. The outer contour of the shell is generally a square body.

In some embodiments of the present disclosure, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

The direction of the connection line of the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger of the circuit board 206 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the external optical fiber 101 so that the external optical fiber 101 is connected to the light receiving component 207 and/or the light emitting component 300 in the optical module 200.

The upper housing 201 and the lower housing 202 are combined to facilitate the installation of components such as the circuit board 206, the light receiving component 207, and the light emitting component 300 into the above-mentioned housing, and these components are packaged and protected by the upper housing 201 and the lower housing 202. In addition, when assembling components such as the circuit board 206, the light receiving component 207, and the light emitting component 300, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are conveniently arranged, which is conducive to the automated production.

In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located outside its housing, and the unlocking component 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

For example, the unlocking component 203 is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and has a snap-fit component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106 of the host computer, the snap-fit component of the unlocking component 203 fixes the optical module 200 in the cage 106 of the host computer. When the unlocking component 203 is pulled, the snap-fit component of the unlocking component 203 moves accordingly, thereby changing the connection relationship between the snap-fit component and the host computer, so as to release the snap-fit relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

The circuit board 206 includes circuit traces, electronic components, and chips. The electronic components and chips are connected together according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET). The chips may include, for example, microcontroller units (MCUs). MCU), laser driver chip, limiting amplifier (LA), clock and data recovery (CDR) chip, power management chip, digital signal processing (DSP) chip, etc.

The circuit board 206 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can stably bear the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

The circuit board 206 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 206 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 206 (such as the upper surface shown in FIG. 4), or can be set on the upper and lower surfaces of the circuit board 206 to provide more pins. The gold finger is configured to establish an electrical connection with the host computer to realize power supply, grounding, I2C signal transmission, data signal transmission, etc.

Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards. For example, a flexible circuit board can be used to connect a rigid circuit board to an optical transceiver component.

The optical emitting component 300 is configured to transmit an optical signal, and the optical receiving component 207 is configured to receive an optical signal. In some embodiments, the optical emitting component 300 and the optical receiving component 207 are combined together to form an integrated optical transceiver component. Of course, in the embodiment of the present disclosure, the optical emitting component 300 and the optical receiving component 207 can also be separated, that is, the optical emitting component 300 and the optical receiving component 207 do not share a housing.

FIG5 is a structural diagram of an optical emission component provided according to some embodiments of the present disclosure. As shown in FIG5 , the optical emission component 300 provided in this embodiment includes a tube seat 310 and a tube cap 320, the tube cap 320 is connected to the tube seat 310 and forms a relatively sealed space with the tube seat 310, and the components for generating and transmitting optical signals, such as laser components, lenses, semiconductor coolers (TEC), etc., are arranged in the space.

A plurality of pins are arranged on the tube base 310, and one end of some of the pins extends into the space formed by the tube base 310 and the tube cap 320. The plurality of pins include but are not limited to a high-frequency pin for transmitting a high-frequency signal, a grounding pin for grounding, and a first pin and a second pin for supplying power to the TEC. The pins arranged on the tube base 310 facilitate the electrical connection between the electrical components in the light emitting component 300 and the circuit board 206. Exemplarily, one end of the pin is connected to one end of the flexible circuit board, and the other end of the flexible circuit board is connected to the circuit board 206, so that the electrical components in the light emitting component 300 are electrically connected to the circuit board 206 through the flexible circuit board. Of course, in the embodiment of the present disclosure, the light emitting component 300 is not limited to being electrically connected to the circuit board 206 through the flexible circuit board.

FIG6 is a schematic diagram of the internal structure of a light emitting component provided according to some embodiments of the present disclosure. As shown in FIG6, in some embodiments, the light emitting component 300 further includes a semiconductor laser 330, a temperature sensor 340 and a backlight detector 350; the semiconductor laser 330 is used to emit an optical signal; the temperature sensor 340 is used to detect the temperature inside the light emitting component 300, so as to control the temperature inside the light emitting component 300; the backlight detector 350 is used to receive the backlight of the semiconductor laser 330 to monitor the light power emitted by the light emitting component 300. Exemplarily, the semiconductor laser may be an electro-absorption modulated laser (EML), and the temperature sensor 340 may be a thermistor. In some embodiments of the present disclosure, the backlight detector 350 is arranged on the backlight side of the semiconductor laser 330 to directly receive the backlight of the semiconductor laser 330. Of course, in some embodiments, the optical signal emitted by the semiconductor laser 330 is split and transmitted to the backlight detector 350; for example, when the optical module is a COB package, part of the optical signal emitted by the semiconductor laser is reflected by the lens assembly and transmitted to the backlight detector. device.

In some embodiments of the present disclosure, the temperature sensor 340 is connected to the MCU2062, and the MCU2062 obtains the real-time operating temperature of the semiconductor laser 330 through the temperature sensor 340 to adjust and control the operating temperature of the semiconductor laser 330, thereby ensuring that the semiconductor laser 330 can operate within the operating temperature range, that is, ensuring that the optical module operates within the operating temperature range. In some embodiments, the operating range of the semiconductor laser 330 is -40°C to 120°C, or -40°C to 140°C, etc. Exemplarily, the light emitting component 300 includes a TEC, which is disposed below the semiconductor laser 330 and is in contact with the semiconductor laser 330, and the MCU2062 controls the adjustment of the operating temperature of the semiconductor laser 330 through the TEC.

FIG7 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure, FIG8 is a schematic diagram of the connection relationship between a device in a light emitting component and a device on a circuit board provided according to some embodiments of the present disclosure, and FIG7 and FIG8 show the connection relationship between the light emitting component 300 and its internal devices and the devices on the circuit board in some embodiments of the present disclosure. As shown in FIG7 and FIG8, in some embodiments, a laser driver chip 2061 and an MCU 2062 are provided on the circuit board 206, the monitoring function input end of the laser driver chip 2061 is electrically connected to the backlight detector 350, and the monitoring function output end of the laser driver chip 2061 is connected to the MCU 2062; the laser driver chip 2061 transmits the ADC value detected by the backlight detector 350 to the MCU 2062.

Exemplarily, when the backlight detector 350 is used to detect the emitted light power, the backlight detector 350 receives the light signal and converts it into an electrical signal, which is transmitted to the monitoring function input terminal of the laser driver chip 2061 in the form of current. The laser driver chip 2061 collects the electrical signal to obtain a voltage-type ADC value; the monitoring function output terminal I2C of the laser driver chip 2061 is connected to MCU2062, and then the laser driver chip 2061 transmits the obtained ADC value to MCU2062 via I2C. MCU2062 saves the received ADC value to a preset storage area for reading by the host computer where the optical module is located. The preset storage area is located in the optical module, such as the preset storage area is located in MCU2062.

In the process of monitoring the optical power emitted by the optical module through the backlight detector 350, since the ADC value obtained by the laser driving chip 2061 in combination with the backlight detector 350 is affected by the dark current of the backlight detector 350 and the influence of temperature on the semiconductor laser 330, there is an error between the ADC value obtained and the actual optical power emitted by the semiconductor laser 330, which leads to low accuracy in monitoring the optical power emitted by the optical module.

In order to improve the accuracy of the optical module emission light power monitoring, in the embodiment of the present disclosure, after the MCU2062 receives the ADC value sent by the laser driver chip 2061, the dark current compensation value and the optical power compensation value are used to compensate the ADC value to obtain the ADC compensation value, and finally the ADC compensation value is converted to obtain the optical module emission light power reporting value, and the converted optical module emission light power reporting value is saved to a preset storage area for the upper computer where the optical module is located to read, that is, the converted optical module emission light power reporting value is used as the optical module emission light power reporting value. Among them, the dark current compensation value is configured to compensate for the influence of the dark current of the backlight detector on the optical module emission light power, and the optical power compensation value is configured to compensate for the influence of temperature on the optical module emission light power. Therefore, in the embodiment of the present disclosure, the dark current compensation value and the optical power compensation value are used to compensate for the detected value, reduce the influence of the dark current and temperature of the backlight detector 350 on the detection of the optical power emitted by the semiconductor laser 330, so as to improve the accuracy of the optical module emission light power monitoring. In some embodiments, the dark current compensation value and the optical power compensation value may be determined based on experience, but are certainly not limited thereto; the preset storage area may be located in a register in the MCU2062 , and may also be located outside the MCU2062 .

In some embodiments of the present disclosure, when MCU2062 receives the ADC value sent by the laser driver chip 2061, in response to the received ADC value, MCU2062 obtains the current operating temperature of the semiconductor laser 330, and MCU2062 determines the corresponding dark current compensation value and the corresponding dark current compensation value for compensating the ADC value according to the current operating temperature of the semiconductor laser 330. Optical power compensation value. In the disclosed embodiment, the dark current compensation value and the optical power compensation value are respectively related to the temperature of the semiconductor laser 330 , which can further reduce the influence of the temperature of the semiconductor laser 330 on the detection of the optical power emitted by the semiconductor laser 330 .

In some embodiments of the present disclosure, a dark current compensation lookup table is pre-stored in MCU2062; wherein the dark current compensation lookup table includes at least one target temperature and a target dark current compensation value corresponding to the target temperature, and the dark current compensation lookup table includes multiple target temperatures and target dark current compensation values corresponding to the target temperatures one by one. According to the current operating temperature of the semiconductor laser 330, the dark current compensation lookup table is searched to obtain the corresponding dark current compensation value.

In some embodiments of the present disclosure, the multiple target temperatures are certain different temperatures within the operating range of the semiconductor laser 330, that is, the multiple target temperatures are certain different temperatures within the operating range of the optical module; for example, the multiple target temperatures include a first target temperature, a second target temperature, a third target temperature, etc., and the first target temperature, the second target temperature and the third target temperature, etc. are all different.

In some embodiments, the first target temperature is less than the second target temperature and less than the third target temperature. Exemplarily, the first target temperature is within a relatively low temperature range, the second target temperature is within a relatively medium temperature range, and the third target temperature is within a relatively high temperature range. For example, if the operating range of the semiconductor laser 330 is -40°C to 120°C, the first target temperature may be -20°C, the second target temperature may be 20°C, and the third target temperature may be 80°C. Of course, the specific temperatures of the first target temperature, the second target temperature, and the third target temperature are not limited thereto. In some embodiments, multiple target temperatures should be distributed as evenly as possible within the operating range of the semiconductor laser 330.

In some embodiments of the present disclosure, the target dark current compensation value corresponding to each target temperature is obtained through experimental statistics. Exemplarily, a large number of optical modules are selected, and a large number of optical modules are tested corresponding to each target temperature to obtain a large number of corresponding dark current values, and the target dark current compensation value corresponding to the target temperature is obtained by averaging or performing certain weight calculations. For example, the optical module is controlled so that the current operating temperature of the semiconductor laser 330 is the target temperature, and the semiconductor laser 330 is turned off to transmit the light signal to obtain the current ADC value. For multiple target temperatures, each optical module can be tested for multiple target temperatures in turn; or, a batch of optical modules are first tested at a certain target temperature, and then another test at the same temperature is performed, and the optical power compensation values corresponding to all target temperatures of a batch of optical modules are obtained by testing in turn.

In some embodiments of the present disclosure, in order to facilitate the determination of the dark current compensation value through the dark current compensation lookup table, multiple target temperatures divide the operating temperature range of the optical module into multiple temperature intervals; one or more sub-target temperatures are set in each temperature interval, and the sub-target dark current compensation value corresponding to the sub-target temperature is determined by the linear relationship between the adjacent target temperature and the target dark current compensation value; or, the sub-target dark current compensation value corresponding to the sub-target temperature is determined according to the target temperature corresponding to the end point of the temperature interval and the target dark current compensation value corresponding to the target temperature. Exemplarily, the first target temperature, the second target temperature and the third target temperature divide the operating temperature range of the optical module into 4 temperature intervals. The temperature intervals between adjacent sub-target temperatures may be equal, but of course they are not limited to being equal in the embodiments of the present disclosure. In some embodiments, the temperature intervals between adjacent sub-target temperatures in each temperature interval are equal, and the temperature intervals between adjacent sub-target temperatures in different temperature intervals are equal. The temperature interval may be 0.1°C, 0.5°C, 1°C or 2°C, etc.

For example, assuming that the operating temperature range of the optical module is -40°C to 120°C, the multiple target temperatures include a first target temperature T1, a second target temperature T2, and a third target temperature T3. The first target temperature T1, the second target temperature T2, and the third target temperature T3 divide the operating temperature range of the optical module into four temperature intervals, and define the operating temperature range less than the second target temperature T2 as the low temperature zone, and the operating temperature range greater than the second target temperature T2 as the low temperature zone. In the high temperature zone, each temperature interval has several sub-target temperatures with a temperature interval of T, and the corresponding test statistics include a first target dark current compensation value of DarkADC1, a second target dark current compensation value of DarkADC2, and a third target dark current compensation value of DarkADC3.

Calculate the first high temperature area slope SlopeHigh1 and the first low temperature area slope SlopeLow1:

SlopeHigh1 = (DarkADC3 – DarkADCT2) / (T3 – T2);

SlopeLow1 = (DarkADC2 – DarkADCT2)/(T2 – T1).

Thus, a dark current compensation lookup table is obtained. Table 1 provides a dark current compensation lookup table according to some embodiments.

Table I:

When MCU2062 receives the ADC value sent by the laser driver chip 2061, and MCU2062 obtains that the current operating temperature of the semiconductor laser 330 is (-40+T*X), MCU2062 searches for (-40+T*X) in the dark current compensation lookup table. If there is a temperature (-40+T*X) in the dark current compensation lookup table, MCU2062 directly obtains the dark current compensation value corresponding to (-40+T*X). If there is no temperature (-40+T*X) in the dark current compensation lookup table, MCU2062 determines the dark current compensation value corresponding to (-40+T*X) based on the linear relationship between the two adjacent temperatures of (-40+T*X).

In some embodiments of the present disclosure, an optical power compensation lookup table is pre-stored in MCU2062; wherein the optical power compensation lookup table includes at least one target temperature and an optical power compensation value corresponding to the target temperature, and generally the optical power compensation lookup table includes multiple target temperatures and optical power compensation values corresponding to the target temperatures one by one. According to the current operating temperature of the semiconductor laser 330, the optical power compensation lookup table is searched to obtain the corresponding optical power compensation value.

In some embodiments of the present disclosure, the multiple target temperatures are certain different temperatures within the working range of the optical module; for example, the multiple target temperatures include a first target temperature, a second target temperature, a third target temperature, etc., and the first target temperature, the second target temperature and the third target temperature, etc. are all different.

In some embodiments, the first target temperature is less than the second target temperature and less than the third target temperature. Exemplarily, the first target temperature is within a relatively low temperature range, the second target temperature is within a relatively medium temperature range, and the third target temperature is within a relatively high temperature range. For example, if the operating range of the optical module is -40°C to 120°C, the first target temperature may be -20°C, the second target temperature may be 20°C, and the third target temperature may be 80°C. Of course, the specific temperatures of the first target temperature, the second target temperature, and the third target temperature are not limited thereto. In some embodiments, multiple target temperatures should be distributed as evenly as possible within the operating range of the optical module.

In some embodiments of the present disclosure, the optical power compensation value corresponding to each target temperature is obtained through experimental statistics. Exemplarily, a large number of optical modules are selected, and the ADC values of a large number of optical modules are tested for each target temperature at the same emission optical power of the semiconductor laser 330, so as to ensure that the optical modules transmit optical signals at the same emission optical power, and obtain the ADC values detected at different temperatures by statistics, and determine the compensation value so that the ADC values at different temperatures reach the preset ADC value, which is the target optical power compensation value corresponding to the target temperature. The preset ADC value can usually adopt the ADC value of a certain temperature, such as the ADC value detected at room temperature. For example, for each optical module, the ADC values detected at different temperatures are tested under multiple different emission optical powers, and the target optical power compensation value corresponding to each target temperature is statistically determined.

In some embodiments of the present disclosure, in order to facilitate the determination of the optical power compensation value through the optical power compensation lookup table, multiple target temperatures divide the operating temperature range of the optical module into multiple temperature intervals, and one or more sub-target temperatures are set in each temperature interval. The sub-target optical power compensation value corresponding to the sub-target temperature is determined by the linear relationship between the adjacent target temperature and the target optical power compensation value; or, the sub-target optical power compensation value corresponding to the sub-target temperature is determined according to the target temperature corresponding to the end point of the temperature interval and the target optical power compensation value corresponding to the target temperature. Exemplarily, the first target temperature, the second target temperature, and the third target temperature divide the operating temperature range of the optical module into 4 temperature intervals. The temperature intervals between adjacent sub-target temperatures may be equal, but of course they are not limited to being equal in the embodiments of the present disclosure. In some embodiments, the temperature intervals between adjacent sub-target temperatures in each temperature interval are equal, and the temperature intervals between adjacent sub-target temperatures in different temperature intervals are equal. The temperature interval may be 0.1°C, 0.5°C, 1°C, or 2°C, etc.

Exemplarily, assuming that the operating temperature range of the optical module is -40°C to 120°C, the multiple target temperatures include a first target temperature T1, a second target temperature T2 and a third target temperature T3, the first target temperature T1, the second target temperature T2 and the third target temperature T3 divide the operating temperature range of the optical module into four temperature intervals, and define the operating temperature range less than the second target temperature T2 as a low temperature zone, and the operating temperature range greater than the second target temperature T2 as a high temperature zone, each temperature interval has multiple sub-target temperatures with a temperature interval of T, and the corresponding test statistics are the first target optical power compensation value TxPADC1, the second target optical power compensation value TxPADC2 and the third target optical power compensation value TxPADC3.

Calculate the slope of the second high temperature area SlopeHigh2 and the slope of the second low temperature area SlopeLow2:

SlopeHigh = (TxPADC3 – TxPADCT2) / (T3 – T2);

SlopeLow＝(TxPADC2–TxPADC2)/(T2–T1).

Thus, an optical power compensation lookup table is obtained. Table 2 provides an optical power compensation lookup table according to some embodiments.

Table II:

When MCU2062 receives the ADC value sent by the laser driver chip 2061, and MCU2062 obtains the current operating temperature of the semiconductor laser 330 as (-40+T*X), MCU2062 searches for (-40+T*X) in the optical power compensation lookup table. If there is a temperature (-40+T*X) in the optical power compensation lookup table, MCU2062 directly obtains the optical power compensation value corresponding to (-40+T*X). If there is no temperature (-40+T*X) in the optical power compensation lookup table, MCU2062 determines the optical power compensation value corresponding to (-40+T*X) based on the linear relationship between two adjacent temperatures of (-40+T*X).

Assuming that when MCU2062 receives the ADC value sent by the laser driver chip 2061, and MCU2062 obtains the current operating temperature of the semiconductor laser 330 as (-40+T*X), the corresponding dark current compensation value A and the optical power compensation value B are obtained, then according to ADC compensation value = ADC value + dark current compensation value + optical power compensation value, the ADC compensation value C = ADC value + A + B is obtained.

In some embodiments of the present disclosure, the optical module transmitted optical power reported value is obtained by dimensional conversion of the ADC compensation value, so that the dimension of the optical module transmitted optical power reported value obtained by the MCU is the same as the dimension of the system where the optical module is located, so as to ensure that the system where the optical module is located can obtain accurate optical module transmitted optical power.

In some embodiments of the present disclosure, the optical module transmitted optical power reported value is converted according to the optical module transmitted optical power reported value = ADC compensation value * Slope + Offset to complete the ADC compensation value dimension conversion, where Slope is the conversion slope and Offset is the conversion offset.

In some embodiments of the present disclosure, Slope and Offset are calculated as follows:

Take two optical power points and obtain the corresponding ADC values and optical power values, such as (ADC1, Txp1) and (ADC2, Txp2).

Slope = (Txp1-Txp2)/(ADC1–ADC2);

Offset = (Txp2*ADC1-Txp1*ADC2)/(ADC1-ADC2).

In some embodiments of the present disclosure, the optical module is provided with a minimum value for reporting the optical power of optical emission, which is used to indicate the optical power of the optical module when the optical power of optical emission is reported. When the reported value of the optical power of optical emission of the optical module is obtained, the difference between the reported value of the optical power of optical emission obtained and the preset reported value is determined; if the reported value of the optical power of optical emission of the optical module is less than the preset reported value, The minimum reported value of the optical transmit optical power is used as the optical module transmit optical power; if the reported value of the optical module transmit optical power is greater than or equal to the preset reported value, the reported value of the optical module transmit optical power is used as the optical module transmit optical power.

In some embodiments of the present disclosure, when MCU2062 receives the ADC value sent by the laser driver chip 2061, it determines whether the ADC value is less than the preset ADC value; if the ADC value is less than the preset ADC value, the minimum reported value of the optical emission power is saved to the preset storage area for reading by the host computer where the optical module is located.

In some embodiments of the present disclosure, the light emitting component 300 in the optical module is not limited to emitting one optical signal or one wavelength of optical signal. When the light emitting component 300 emits two optical signals, a backlight detector is set on the backlight side of each optical signal and the ADC value of each optical signal is obtained through the laser driving chip 2061, and the ADC value of each optical signal is transmitted to the MCU2062. The MCU2062 obtains the dark current compensation value and the optical power compensation value corresponding to each optical signal to compensate the corresponding ADC value to obtain the corresponding ADC compensation value. Finally, the ADC compensation value of each optical signal is dimensionally converted to obtain the optical module emission optical power reporting value of each optical signal, and the value is saved in the preset storage area for reading by the host computer where the optical module is located.

Based on the optical module provided by the embodiment of the present disclosure, the embodiment of the present disclosure also provides a method for monitoring the optical power transmitted by the optical module. FIG9 is a flow chart of a method for monitoring the optical power transmitted by an optical module provided by some embodiments of the present disclosure. As shown in FIG9, the method for monitoring the optical power transmitted by the optical module provided by the embodiment of the present disclosure includes:

Receive the ADC value sent by the laser driver chip;

In response to the received ADC value, obtaining a current operating temperature of the semiconductor laser;

Determine the dark current compensation value and the optical power compensation value according to the current operating temperature obtained; wherein the dark current compensation value is used to compensate for the influence of the dark current of the backlight detector on the optical power emitted by the optical module, and the optical power compensation value is used to compensate for the influence of temperature on the optical power emitted by the optical module;

Compensate the ADC value according to the dark current compensation value and the optical power compensation value to obtain an ADC compensation value;

The ADC compensation value dimension conversion is performed according to the conversion slope and conversion offset to obtain the reported value of the optical power transmitted by the optical module;

Compare the reported value of the optical module's transmitted optical power with the preset reported value;

If the reported value of the optical power transmitted by the optical module is less than the preset reported value, the minimum reported value of the optical power transmitted is saved in the preset storage area for reading by the host computer where the optical module is located; the minimum reported value of the optical power transmitted is set in the optical module, and the preset storage area is located in the optical module;

If the reported value of the optical power transmitted by the optical module is greater than or equal to the preset reported value, the reported value of the optical power transmitted by the optical module is saved in a preset storage area for reading by the host computer where the optical module is located.

For a detailed description of the method for monitoring the optical power transmitted by an optical module, please refer to the description of the optical module in the above embodiment. Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present disclosure, rather than to limit it; although the present disclosure is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims (10)

1. An optical module, comprising:

   A circuit board is provided with a laser driving chip and an MCU;

   a light emitting component, electrically connected to the circuit board,

   Wherein: the light emitting component includes a semiconductor laser, a backlight detector and a temperature sensor, the semiconductor laser is configured to emit a light signal, the backlight detector is configured to receive the backlight of the semiconductor laser, and the temperature sensor is configured to detect the operating temperature of the semiconductor laser; the backlight detector is connected to the monitoring function input end of the laser driver chip, the monitoring function output end of the laser driver chip is connected to the MCU, the laser driver chip obtains the ADC value and transmits it to the MCU,

   Wherein, the MCU is configured as:

   Receiving the ADC value sent by the laser driver chip;

   In response to the received ADC value, obtaining a current operating temperature of the semiconductor laser;

   Determine a dark current compensation value and an optical power compensation value according to the acquired current operating temperature of the semiconductor laser, wherein the dark current compensation value is configured to compensate for the influence of the dark current of the backlight detector on the optical power emitted by the optical module, and the optical power compensation value is configured to compensate for the influence of temperature on the optical power emitted by the optical module;

   Compensate the ADC value according to the dark current compensation value and the optical power compensation value to obtain an ADC compensation value;

   The ADC compensation value is converted according to the conversion slope and the conversion bias to obtain a reported value of the optical power transmitted by the optical module;

   Compare the reported value of the optical power transmitted by the optical module with the preset reported value;

   If the reported value of the optical power transmitted by the optical module is less than the preset reported value, the minimum reported value of the optical power transmitted is saved in a preset storage area for reading by the host computer where the optical module is located, wherein the minimum reported value of the optical power transmitted is set in the optical module, and the preset storage area is located in the optical module, and

   If the reported value of the optical power transmitted by the optical module is greater than or equal to the preset reported value, the reported value of the optical power transmitted by the optical module is saved in the preset storage area for reading by the host computer where the optical module is located.
2. The optical module according to claim 1, wherein determining the dark current compensation value and the optical power compensation value comprises:

   According to the current operating temperature, a dark current compensation lookup table is searched to obtain a dark current compensation value, wherein the dark current compensation lookup table stores multiple target temperatures and target dark current compensation values corresponding to the target temperatures, so as to be used to determine the corresponding dark current compensation value according to the current temperature.
3. The optical module according to claim 1, wherein determining the dark current compensation value and the optical power compensation value comprises:

   According to the current operating temperature, an optical power compensation lookup table is searched to obtain an optical power compensation value, wherein the optical power compensation lookup table stores multiple target temperatures and target optical power compensation values corresponding to the target temperatures, so as to determine the corresponding optical power compensation value according to the current temperature.
4. The optical module according to any one of claims 1 to 3, wherein the MCU is further configured to:

   After receiving the ADC value sent by the laser driving chip, it is determined whether the ADC value is less than a preset ADC value.

   When the ADC value is less than the preset ADC value, the minimum reported value of the optical emission optical power is saved in the preset storage area for reading by the host computer where the optical module is located.
5. The optical module according to claim 2, wherein the plurality of target temperatures include a first target temperature, a second target temperature, and a third target temperature that increase in sequence, and the corresponding target dark current compensation values include a first target dark current compensation value, a second target dark current compensation value, and the third target dark current compensation value; and

   Among them, the first target temperature, the second target temperature and the third target temperature divide the operating temperature range of the optical module into four temperature intervals, at least one sub-target temperature is set in each temperature interval, and the sub-target dark current compensation value corresponding to the sub-target temperature is determined according to the target temperature corresponding to the temperature interval endpoint and the target dark current compensation value corresponding to the target temperature.
6. The optical module according to claim 3, wherein the plurality of target temperatures include a first target temperature, a second target temperature, and a third target temperature that increase in sequence, and the corresponding target optical power compensation values include a first target optical power compensation value, a second target optical power compensation value, and a third target optical power compensation value; and

   Among them, the first target temperature, the second target temperature and the third target temperature divide the operating temperature range of the optical module into four temperature intervals, at least one sub-target temperature is set in each temperature interval, and the sub-target optical power compensation value corresponding to the sub-target temperature is determined according to the target temperature corresponding to the temperature interval endpoint and the target optical power compensation value corresponding to the target temperature.
7. The optical module according to any one of claims 1 to 6, wherein the ADC compensation value dimension conversion is performed according to the conversion slope and the conversion offset to obtain the optical module transmit optical power reporting value, comprising:

   The optical module transmitted optical power reported value is obtained according to the optical module transmitted optical power reported value=ADC compensation value*Slope+Offset conversion, wherein the Slope is the conversion slope, and the Offset is the conversion offset.
8. The optical module according to claim 5, wherein determining the sub-target dark current compensation value corresponding to the sub-target temperature according to the target temperature corresponding to the temperature interval endpoint and the target dark current compensation value corresponding to the target temperature comprises:

   The sub-target dark current compensation value corresponding to the sub-target temperature in the corresponding interval is calculated according to the first dark current slope = (second target dark current compensation value - first target dark current compensation value) / (second target temperature - first target temperature) or the second dark current slope = (third target dark current compensation value - second target dark current compensation value) / (third target temperature - second target temperature).
9. The optical module according to claim 6, wherein determining the sub-target optical power compensation value corresponding to the sub-target temperature according to the target temperature corresponding to the temperature interval endpoint and the target optical power compensation value corresponding to the target temperature comprises:

   The sub-target optical power compensation value corresponding to the sub-target temperature in the corresponding interval is calculated according to the first dark current slope = (second target optical power compensation value - first target optical power compensation value) / (second target temperature - first target temperature) or the second dark current slope = (third target optical power compensation value - second target optical power compensation value) / (third target temperature - second target temperature).
10. A method for monitoring the transmitted optical power of an optical module, the method comprising:

    Receive the ADC value sent by the laser driver chip;

    In response to the received ADC value, obtaining a current operating temperature of the semiconductor laser;

    Determine a dark current compensation value and an optical power compensation value according to the current operating temperature obtained, wherein the dark current compensation value is configured to compensate for the influence of the dark current of the backlight detector on the optical power emitted by the optical module, and the optical power compensation value is configured to compensate for the influence of temperature on the optical power emitted by the optical module;

    Compensate the ADC value according to the dark current compensation value and the optical power compensation value to obtain an ADC compensation value;

    The ADC compensation value is converted according to the conversion slope and the conversion bias to obtain a reported value of the optical power transmitted by the optical module;

    Compare the reported value of the optical power transmitted by the optical module with the preset reported value;

    If the reported value of the optical power transmitted by the optical module is less than the preset reported value, the minimum reported value of the optical power transmitted is saved in a preset storage area for reading by the host computer where the optical module is located, wherein the minimum reported value of the optical power transmitted is set in the optical module, and the preset storage area is located in the optical module, and

    If the reported value of the optical power transmitted by the optical module is greater than or equal to the preset reported value, the reported value of the optical power transmitted by the optical module is saved in a preset storage area for reading by the host computer where the optical module is located.