WO2024109547A1

WO2024109547A1 - Portable air conditioner

Info

Publication number: WO2024109547A1
Application number: PCT/CN2023/130587
Authority: WO
Inventors: 甄锦雅; 刘凯; 李伟平; 宋国伟; 杨广; 杨勇升
Original assignee: 深圳市蓝禾技术有限公司
Priority date: 2022-11-21
Filing date: 2023-11-09
Publication date: 2024-05-30

Abstract

Disclosed in the embodiments of the present application is a portable air conditioner, comprising, for example: a housing; a temperature adjusting device, which is arranged in the housing and comprises multistage semiconductor chilling plates, which are stacked upon each other; and a conduction member, which is arranged on the housing and is connected to one end of the multistage semiconductor chilling plates. In the embodiments of the present application, a temperature adjusting device, which has multistage semiconductor chilling plates stacked upon each other, is provided in the housing, and one end of the multistage semiconductor chilling plates is attached to the conduction member; thus, energy is transferred and diffused stage by stage by means of sequentially stacking the multistage semiconductor chilling plates, thereby improving energy diffusion and conduction effects and temperature adjusting efficiency.

Description

Portable Air Conditioner

Technical Field

The present application relates to the technical field of air conditioning, and in particular to a portable air conditioner.

Background technique

In recent years, people are increasingly pursuing a more convenient life. In order to meet the demand for air conditioning in outdoor activities or other life scenarios, various portable air conditioners have appeared on the market, such as neck-hanging air conditioners.

The current portable air conditioner generally includes a housing, an energy dissipation module and a temperature control device. The energy dissipation module and the temperature control device are arranged inside the housing, and the energy dissipation module is against one end of the temperature control device. The temperature control device is typically a single-stage semiconductor refrigeration plate. However, the heat dissipation effect of the single-stage semiconductor refrigeration plate itself is not good, so that even if the combination of the single-stage semiconductor refrigeration plate and the energy dissipation module is adopted, the heat dissipation effect cannot be effectively improved, resulting in poor cooling effect of the single-stage semiconductor refrigeration plate, and then poor cooling effect of the temperature control device.

Contents of this application

Therefore, in order to overcome at least some of the defects and shortcomings in the prior art, a portable air conditioner provided in an embodiment of the present application improves the energy dissipation effect and temperature regulation efficiency.

Specifically, an embodiment of the present application provides a portable air conditioner, comprising: a shell; a temperature control device, disposed in the shell, the temperature control device comprising a multi-stage semiconductor refrigeration plate stacked on each other; and a conductive member, disposed on the shell, the conductive member connected to one end of the multi-stage semiconductor refrigeration plate.

In one embodiment of the present application, the multi-stage semiconductor refrigeration plate includes a substrate, a first semiconductor couple string and a second semiconductor couple string, and the substrate is arranged between the first semiconductor couple string and the second semiconductor couple string and respectively connects the first semiconductor couple string and the second semiconductor couple string.

In one embodiment of the present application, the multi-stage semiconductor refrigeration plate includes a first substrate, a second substrate, a first semiconductor couple string and a second semiconductor couple string, the opposite sides of the first substrate are respectively connected to the first semiconductor couple string and the second substrate, and the opposite sides of the second substrate are respectively connected to the first substrate and the second semiconductor couple string.

In one embodiment of the present application, the multi-stage semiconductor refrigeration plate includes adjacent front-stage semiconductor refrigeration plates and rear-stage semiconductor refrigeration plates, and the contour size of the end face of the front-stage semiconductor refrigeration plate adjacent to the conductive member is equal to or smaller than the contour size of the end face of the rear-stage semiconductor refrigeration plate away from the conductive member.

In one embodiment of the present application, the multi-stage semiconductor refrigeration plate includes at least three stages of semiconductor refrigeration plates, and in the direction away from the conductive element, the contour dimensions of the end faces of the semiconductor refrigeration plates of each stage in the multi-stage semiconductor refrigeration plate adjacent to the conductive element increase successively.

In one embodiment of the present application, a temperature sensing unit is disposed inside the multi-stage semiconductor refrigeration plate.

In one embodiment of the present application, the semiconductor refrigeration plates at each stage of the multi-stage semiconductor refrigeration plate are connected in series with each other, and the multi-stage semiconductor refrigeration plate includes a first power supply end and a second power supply end, and the first power supply end and the second power supply end are connected to semiconductor refrigeration plates at different stages of the multi-stage semiconductor refrigeration plate.

In one embodiment of the present application, the semiconductor refrigeration plates at each stage of the multi-stage semiconductor refrigeration plate are connected in parallel with each other, and the semiconductor refrigeration plates at each stage of the multi-stage semiconductor refrigeration plate include a first power supply terminal and a second power supply terminal.

In one embodiment of the present application, the semiconductor refrigeration plates of each stage in the multi-stage semiconductor refrigeration plate are connected in parallel with each other, and the multi-stage semiconductor refrigeration plate includes a first power supply end and a second power supply end, and the first power supply end and the second power supply end are connected to the semiconductor refrigeration plates of the same stage in the multi-stage semiconductor refrigeration plate.

In one embodiment of the present application, the portable air conditioner further comprises an energy dissipation module, wherein the energy dissipation module is disposed in the shell, and the energy dissipation module is connected to an end of the multi-stage semiconductor refrigeration plate away from the conductive element.

In one embodiment of the present application, the shell is bent to form a wearing space, and the conductive member is arranged on a side of the shell close to the wearing space.

It can be seen from the above that the above technical solution has at least one or more of the following beneficial effects:

The embodiment of the present application solves the problem of poor energy dissipation effect caused by the method of using a single-stage semiconductor refrigeration plate plus an energy dissipation device in the prior art, improves the energy dissipation effect and temperature control efficiency, and also improves the user experience.

BRIEF DESCRIPTION OF THE DRAWINGS

The specific implementation methods of the present application will be described in detail below with reference to the accompanying drawings.

FIG1 is a schematic diagram of the three-dimensional structure of a portable air conditioner provided in one embodiment of the present application.

FIG. 2 is a schematic structural diagram of the portable air conditioner shown in FIG. 1 from another viewing angle.

FIG. 3 is a schematic cross-sectional structural diagram of the portable air conditioner shown in FIG. 2 .

FIG. 4 is a schematic diagram of the three-dimensional structure of the temperature control device in FIG. 3 .

FIG. 5 is a schematic cross-sectional view of the temperature control device shown in FIG. 4 .

FIG. 6 is a schematic diagram of the three-dimensional structure of the temperature control device in FIG. 3 .

FIG. 7 is a schematic cross-sectional view of the temperature control device shown in FIG. 6 .

FIG. 8 is a schematic diagram of the three-dimensional structure of the temperature control device in FIG. 3 .

FIG. 9 is a schematic cross-sectional view of the temperature control device shown in FIG. 8 .

FIG. 10 is a schematic diagram of the three-dimensional structure of the temperature control device in FIG. 3 .

FIG. 11 is a schematic cross-sectional structural diagram of the temperature control device shown in FIG. 10 .

FIG. 12 is a schematic diagram of the three-dimensional structure of another temperature control device provided in an embodiment of the present application.

FIG. 13 is a schematic diagram of the three-dimensional structure of another temperature control device provided in an embodiment of the present application.

FIG. 14 is a schematic diagram of the three-dimensional structure of another temperature control device provided in an embodiment of the present application.

FIG. 15 is a schematic diagram of the three-dimensional structure of another temperature control device provided in an embodiment of the present application.

FIG. 16 is a schematic diagram of the three-dimensional structure of another temperature control device provided in an embodiment of the present application.

FIG. 17 is a schematic diagram of the exploded structure of a semiconductor refrigeration plate provided in the present application.

FIG. 18 is a schematic diagram of the structure of the semiconductor cooling plate shown in FIG. 17 after the first substrate, the second substrate and the sealant are removed.

FIG. 19 is a schematic diagram of a cross-sectional structure of the semiconductor cooling plate shown in FIG. 17 .

FIG20 is a schematic diagram of the structure of a portable air conditioner provided in the present application.

FIG. 21 is a schematic diagram of a cross-sectional structure of the portable air conditioner shown in FIG. 20 .

FIG. 22 is a schematic diagram of the exploded structure of the portable air conditioner shown in FIG. 20 .

FIG. 23 is a schematic diagram showing the dimensional relationship between the conductive member and the semiconductor cooling plate shown in FIG. 22 .

Detailed ways

In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below with reference to the accompanying drawings.

In order to enable those skilled in the art to better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of the present application.

It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

It should also be noted that the division of multiple embodiments in the present application is only for the convenience of description and should not constitute a special limitation. The features in various embodiments can be combined and referenced to each other without contradiction.

As shown in FIG. 1 , FIG. 2 and FIG. 3 , an embodiment of the present application provides a portable air conditioner 10. Specifically, the portable air conditioner here may be, for example, a neck-hanging air conditioner, a handheld air conditioner, a waist-hanging air conditioner, etc. The present application takes a neck-hanging air conditioner as an example for explanation. The portable air conditioner 10, for example, includes: a housing 100, a conductive member 200 and a temperature control device 400.

Specifically, as shown in Figures 1, 2 and 3, the shell 100 is bent to form a wearing space 101. The wearing space 101 is used to be put on the user's wearing part, such as the neck. The shell 100 is provided with a accommodating chamber 102 inside, which is used to accommodate other parts, such as a fan assembly, a temperature regulating assembly 400, a conductive member 200, etc. The shell 100 is also provided with an air duct inside, and an air outlet and an air inlet are also provided on the shell 100, and the air outlet and the air inlet are connected to the air duct. The fan assembly is arranged in the air duct, and is used to fan out the airflow introduced from the air inlet from the air outlet. The shell 100 is provided with a first opening (not shown in the figure), and the first opening is connected to the accommodating chamber 102.

The conducting member 200 is disposed on a side of the housing 100 close to the wearing space 101, and the temperature regulating device 400 is disposed in the housing 100 for cooling or heating, and is transmitted to the wearing part of the user such as the neck or waist through the conducting member 200, so as to achieve temperature regulation. Specifically, the temperature regulating device 400 includes, for example, multi-stage semiconductor cooling sheets stacked on each other. As shown in FIG. 4 , the temperature regulating device 400 includes a first end 4001 and a second end 4003 that are arranged opposite to each other along the stacking direction in which the multi-stage semiconductor cooling sheets are stacked in sequence.

The conductive member 200 is a heat conductive member made of a material with good heat conduction, such as an aluminum alloy. The conductive member 200 is arranged on the shell 100, for example, the conductive member 200 is located at the first opening, and the conductive member 200 also contacts the one end of the thermostat 400 through the first opening of the shell 100. For example, when the conductive member 200 contacts the first end 4001 of the thermostat 400, the conductive member 200 is used to conduct heat to the part worn by the human body to achieve the heating function of the portable air conditioner 10. For another example, when the conductive member 200 contacts the first end 4001 of the thermostat 400, the conductive member 200 is used to dissipate the heat of the part worn by the human body to achieve the cooling function of the portable air conditioner 10.

The embodiment of the present application solves the problem of poor energy dissipation effect caused by the prior art using a single-stage semiconductor refrigeration plate plus an energy dissipation device, thereby improving the energy dissipation effect and temperature control efficiency, and also improving the user experience.

In addition, as shown in FIG3 , the portable air conditioner 10 may further include an energy dissipation module 300. The energy dissipation module 300 is disposed in the housing 100. The energy dissipation module 300 is connected to an end of the multi-stage semiconductor refrigeration plate of the temperature control device 400 that is away from the conductive member 200. For example, when the energy dissipation module 300 is attached to the second end 4003 of the temperature control device 400 and the second end 4003 is a hot end, the energy dissipation module 300 is, for example, a heat dissipation module, which is used to dissipate heat from the second end 4003 of the temperature control device 400. The energy dissipation module 300, for example, includes a heat dissipation member and a heat dissipation fan, etc. The heat dissipation member may be an aluminum alloy member, for example, used to dissipate heat from the temperature control device 400 by air cooling, and of course, heat dissipation may also be performed by relying solely on the heat dissipation member without providing a heat dissipation fan. For another example, when the energy dissipation module 300 is attached to the second end 4003 of the temperature control device 400 and the second end 4003 is a cold end, the energy dissipation module 300 includes a cooling member, which can also be an aluminum alloy member for cooling the second end 4003 of the temperature control device 400.

In addition, the contour dimensions of the end faces of the multi-stage semiconductor refrigeration sheet are equal. Specifically, as shown in FIG. 4 and FIG. 8 , the multi-stage semiconductor refrigeration sheet includes adjacent front-stage semiconductor refrigeration sheet 410 and rear-stage semiconductor refrigeration sheet 420, and the contour dimension of the end face of the front-stage semiconductor refrigeration sheet 410 adjacent to the conductive member 200 is equal to the contour dimension of the end face of the rear-stage semiconductor refrigeration sheet 420 away from the conductive member 200. For example, as shown in FIG. 4 , the first end 4101 of the front-stage semiconductor refrigeration sheet 410 is disposed adjacent to the conductive member 200. The second end 4202 of the rear-stage semiconductor refrigeration sheet 420 is disposed away from the conductive member 200. The contour dimensions of the end face of the first end 4101 of the front-stage semiconductor refrigeration plate 410 are equal to the contour dimensions of the end face of the second end 4202 of the rear-stage semiconductor refrigeration plate 420. For example, the length dimension of the end face of the first end 4101 of the front-stage semiconductor refrigeration plate 410 is equal to the length dimension of the end face of the second end 4202 of the rear-stage semiconductor refrigeration plate 420, and the width dimension of the end face of the first end 4101 of the front-stage semiconductor refrigeration plate 410 is equal to the width dimension of the end face of the second end 4202 of the rear-stage semiconductor refrigeration plate 420.

Furthermore, the multi-stage semiconductor refrigeration plate includes adjacent front-stage semiconductor refrigeration plates 410 and rear-stage semiconductor refrigeration plates 420, and the contour size of the end face of the front-stage semiconductor refrigeration plate 410 adjacent to the conductive member is smaller than the contour size of the end face of the rear-stage semiconductor refrigeration plate 420 adjacent to the conductive member. As shown in Figures 6 and 10, the contour size of the end face of the first end 4101 of the front-stage semiconductor refrigeration plate 410 adjacent to the conductive member 200 is smaller than the contour size of the end face of the second end 4202 of the rear-stage semiconductor refrigeration plate 420 away from the conductive member 200. If the internal space of the housing 100 allows, the number of stages of the multi-stage semiconductor refrigeration plate can be three or more, so as to further enhance the energy dissipation effect of the multi-stage semiconductor refrigeration plate. Furthermore, in the direction away from the conductive member 200, the contour size of the end face of the semiconductor refrigeration plate of each stage in the multi-stage semiconductor refrigeration plate adjacent to the conductive member 200 increases in sequence. In this way, the energy dissipation effect of the front semiconductor cooling plate 410 can be further improved by the rear semiconductor cooling plate 420 with a larger end surface profile. In addition, for the stacking of multiple semiconductor cooling plates of the temperature control device 400, the connection mode of the multiple semiconductor cooling plates can be series connection or parallel connection.

In some embodiments of the present application, the semiconductor refrigeration plates of each stage in the multi-stage semiconductor refrigeration plate are sequentially connected in series.

As shown in FIG8 and FIG10, each level of semiconductor refrigeration plate includes, for example, a first substrate 440a, a plurality of flow guides 450, a plurality of semiconductor couple pairs 460, and a second substrate 440b. The first substrate 440a and the second substrate 440b are, for example, ceramic substrates. The semiconductor couple pairs 460 are, for example, a plurality of NP-type semiconductor couple pairs. The plurality of flow guides 450 are arranged at intervals on two opposite sides of the first substrate 440a and the second substrate 440b, and the plurality of semiconductor couple pairs 470 are connected between the plurality of flow guides 450 on the opposite sides between the first substrate 440a and the second substrate 440b, that is, the plurality of flow guides 450 and the plurality of semiconductor couple pairs 470 are alternately spaced, so that the plurality of semiconductor couple pairs 470 are connected in series to form a semiconductor couple pair string 460.

In addition, the multi-stage semiconductor refrigeration plate includes, for example, a first power supply terminal 4011 and a second power supply terminal 4012, wherein the first power supply terminal 4011 and the second power supply terminal 4012 are connected to semiconductor refrigeration plates of different stages in the multi-stage semiconductor refrigeration plate. Specifically, the first power supply terminal 4011 is electrically connected to one end of the semiconductor couple string 460 of one of the semiconductor refrigeration plates, and the second power supply terminal 4012 is electrically connected to one end of the semiconductor couple string 460 of another semiconductor refrigeration plate. Specifically, as shown in FIG16 , the multi-stage semiconductor refrigeration plate includes adjacent front-stage semiconductor refrigeration plates 410 and rear-stage semiconductor refrigeration plates 420, the first power supply terminal 4011 is connected to one end of the semiconductor couple string 460 on the front-stage semiconductor refrigeration plate 410, and the second power supply terminal 4012 is connected to one end of the semiconductor couple string 460 on the rear-stage semiconductor refrigeration plate 420. In this way, the number of connections between the multi-stage semiconductor refrigeration plate and the external circuit is reduced, and the design of the control circuit of the multi-stage semiconductor refrigeration plate is simplified.

In some embodiments of the present application, the semiconductor refrigeration plates of each stage in the multi-stage semiconductor refrigeration plate are connected in parallel. Specifically, as shown in Figures 4 to 7, the multi-stage semiconductor refrigeration plate includes adjacent front-stage semiconductor refrigeration plates 410 and rear-stage semiconductor refrigeration plates 420. The multiple semiconductor couple pairs 470 of the front-stage semiconductor refrigeration plate 410 are arranged at intervals and sequentially connected in series to form a first semiconductor couple pair string 460a, and the multiple semiconductor couple pairs 470 of the rear-stage semiconductor refrigeration plate 420 are arranged at intervals and sequentially connected in series to form a second semiconductor couple pair string 460b. The first semiconductor couple pair string 460a of the front-stage semiconductor refrigeration plate 410 is connected in parallel with the second semiconductor couple pair string 460b of the rear-stage semiconductor refrigeration plate 420. In addition, the semiconductor refrigeration plates of each stage in the multi-stage semiconductor refrigeration plate include a first power supply terminal 4011 and a second power supply terminal 4012. The first power supply end 4011 and the second power supply end 4012 are connected to the semiconductor refrigeration plate of the same stage in the multi-stage semiconductor refrigeration plate, for example, the first power supply end 4011 and the second power supply end 4012 are both connected to the front-stage semiconductor refrigeration plate 410. Of course, the first power supply end 4011 and the second power supply end 4012 can also be connected to the rear-stage semiconductor refrigeration plate 420.

In other embodiments of the present application, as shown in FIG. 4 and FIG. 6 , the multi-stage semiconductor refrigeration sheet includes a substrate 440, a first semiconductor couple pair string 460a, and a second semiconductor couple pair string 460b. The substrate 440 here is, for example, a ceramic substrate forming the second end 4102 of the front-stage semiconductor refrigeration sheet 410. The first semiconductor couple pair string 460a is, for example, a semiconductor couple pair string obtained by sequentially connecting a plurality of semiconductor couple pairs 470 of the front-stage semiconductor refrigeration sheet 410 in series. The second semiconductor couple pair string 460b is, for example, a semiconductor couple pair string obtained by sequentially connecting a plurality of semiconductor couple pairs 470 of the rear-stage semiconductor refrigeration sheet 420 in series. The substrate 440 is disposed between the first semiconductor couple pair string 460a and the second semiconductor couple pair string 460b and respectively connects the first semiconductor couple pair string 460a and the second semiconductor couple pair string 460b. Such an arrangement enables the front-stage semiconductor refrigeration chip 410 and the rear-stage semiconductor refrigeration chip 420 to share a substrate 440 , thereby improving the energy dissipation effect of the rear-stage semiconductor refrigeration chip 420 on the front-stage semiconductor refrigeration chip 410 .

In other embodiments of the present application, as shown in FIG9 and FIG11, the multi-stage semiconductor refrigeration sheet includes a first substrate 440a, a second substrate 440b, a first semiconductor couple pair string 460a, and a second semiconductor couple pair string 460b. The first substrate 440a herein is, for example, a ceramic substrate forming the second end 4102 of the front-stage semiconductor refrigeration sheet 410. The second substrate 440b is, for example, a ceramic substrate forming the first end 4201 of the rear-stage semiconductor refrigeration sheet 420. The first semiconductor couple pair string 460a is, for example, a first semiconductor couple pair string 460a obtained by sequentially connecting in series a plurality of semiconductor couple pairs 470 of the front-stage semiconductor refrigeration sheet 410. The second semiconductor couple pair string 460b is, for example, a second semiconductor couple pair string 460b obtained by sequentially connecting in series a plurality of semiconductor couple pairs 470 of the rear-stage semiconductor refrigeration sheet 420. The first semiconductor couple string 460a and the second substrate 440b are connected to the opposite sides of the first substrate 440a, respectively, and the first substrate 440a and the second semiconductor couple string 460b are connected to the opposite sides of the second substrate 440b. Furthermore, a thermal interface management material may be filled between the first substrate 440a and the second substrate 440b. The thermal interface management material may be, for example, thermally conductive silica gel or thermally conductive silicone grease, to fill the gap between the first substrate 440a and the second substrate 440b, thereby improving the energy conduction efficiency between the first substrate 440a and the second substrate 440b.

In accordance with the above, in other embodiments of the present application, the semiconductor refrigeration sheets of each stage in the multi-stage semiconductor refrigeration sheet can also be connected in parallel in another manner. As shown in Figures 8 to 11, the multi-stage semiconductor refrigeration sheet includes adjacent front-stage semiconductor refrigeration sheets 410 and rear-stage semiconductor refrigeration sheets 420, and the first substrate 440a of the front-stage semiconductor refrigeration sheet 410 is attached to the second substrate 440b of the rear-stage semiconductor refrigeration sheet 420, for example, by thermally conductive silicone or thermally conductive silicone grease; the plurality of semiconductor couple pairs 460 of the front-stage semiconductor refrigeration sheet 410 are arranged at intervals and sequentially connected in series to form a first semiconductor couple pair string 460a, and the plurality of semiconductor couple pairs 460 of the rear-stage semiconductor refrigeration sheet 420 are arranged at intervals and sequentially connected in series to form a second semiconductor couple pair string 460b, and the first semiconductor couple pair string 460a of the front-stage semiconductor refrigeration sheet 410 is connected in parallel with the second semiconductor couple pair string 460b of the rear-stage semiconductor refrigeration sheet 420. The semiconductor refrigeration plates at each level in the multi-stage semiconductor refrigeration plate include a first power supply terminal 4011 and a second power supply terminal 4012. Further, as shown in FIG14 and FIG15, any two levels of semiconductor refrigeration plates in the multi-stage semiconductor refrigeration plate are connected in parallel, and the power of each level of semiconductor refrigeration plate can be individually controlled by its own first power supply terminal 4011 and second power supply terminal 4012. In this way, the desired semiconductor refrigeration plate can be controlled according to the actual needs of the user.

In other embodiments of the present application, as shown in Figures 12 to 15, the periphery of the plurality of semiconductor couple pairs 470 of each stage of the semiconductor cooling sheet is filled with sealant 430. Such a configuration isolates the semiconductor couple pair string 460 from the outside air, which not only plays a role in moisture and humidity prevention, but also can extend the service life of the semiconductor cooling sheet and improve product quality.

17 , the present application provides a semiconductor refrigeration plate, for example, the front-stage semiconductor refrigeration plate 410 in the aforementioned embodiment, and the semiconductor refrigeration plate includes: a first substrate 440a, a second substrate 440b, a sealant 430, a plurality of semiconductor couple pairs 470 and a temperature sensing unit 480.

The sealant 430 is disposed between the first substrate 440a and the second substrate 440b, and the sealant 430, the first substrate 440a, and the second substrate 440b enclose a receiving space 490. The plurality of semiconductor couples 470 and the temperature sensing unit 480 are, for example, both disposed between the first substrate 440a and the second substrate 440b and located inside the receiving space 490.

Further, the semiconductor refrigeration plate, for example, further includes a first terminal 401 and a second terminal 402, the first terminal 401 is electrically connected to the plurality of semiconductor couples 470 and extends to the outside of the accommodation space 490, and the second terminal 402 is electrically connected to the temperature sensing unit 480 and extends to the outside of the accommodation space 490. Specifically, the first terminal 401, for example, includes a first power supply terminal 4011 and a second power supply terminal 4012, and the second terminal 402, for example, includes a third power supply terminal 4021 and a fourth power supply terminal 4022. For example, the first power supply terminal 4011 and the second power supply terminal 4012 are power lines, and the third power supply terminal 4021 and the fourth power supply terminal 4022 are signal lines. Among them, the first power supply terminal 4011 and the second power supply terminal 4012 are electrically connected to the multiple semiconductor couple pairs 470, and extend to the outside of the accommodating space 490 so as to be electrically connected to an external circuit; the third power supply terminal 4021 and the fourth power supply terminal 4022 are electrically connected to the temperature sensing unit 480 and extend to the outside of the accommodating space 490 so as to be electrically connected to an external circuit, and in order to conveniently distinguish the first wiring terminal 401 and the second wiring terminal 402, the first wiring terminal 401 and the second wiring terminal 402, for example, use wires of different thicknesses or wires of different colors, for example, the first power supply terminal 4011 and the second power supply terminal 4012 use thin wires, and the third power supply terminal 4021 and the fourth power supply terminal 4022 use thick wires; or, the first power supply terminal 4011 and the second power supply terminal 4012 use white wires and blue wires respectively, and the third power supply terminal 4021 and the fourth power supply terminal 4022 use black wires and red wires respectively. In other embodiments, the first terminal 401 and the second terminal 402 may also adopt other wiring methods, as long as the plurality of semiconductor couple pairs 470 and the temperature sensing unit 480 can be connected to the external circuit respectively.

Based on the above, as shown in FIG. 19 , a plurality of semiconductor thermocouple pairs 470 are arranged at intervals from each other and are sequentially connected in series to form a semiconductor thermocouple pair string 460, and each of the semiconductor thermocouple pairs 470 includes, for example, a first type semiconductor thermocouple 4701 and a second type semiconductor thermocouple 4702 connected in series. Among them, the first type semiconductor thermocouple 4701 is, for example, an N-type semiconductor thermocouple, and the second type semiconductor thermocouple 4702 is, for example, a P-type semiconductor thermocouple, and vice versa. Because the carriers of the N-type semiconductor thermocouple are electrons and the carriers of the P-type semiconductor thermocouple are holes, the current directions of semiconductor thermocouples of different types will be opposite, so the electrons of the N-type semiconductor thermocouple and the holes of the P-type semiconductor thermocouple flow in the same direction, wherein the carriers of the semiconductor thermocouple will become the medium for heat transfer, and the external DC power supply provides the energy required for the flow of electrons. After the power is turned on, the electrons start from the negative pole (-), first pass through the P-type semiconductor thermocouple, absorb heat, and then release heat at the N-type semiconductor thermocouple. Every time they pass through a pair of N- and P-type semiconductor thermocouples, heat is sent from one end to the other end. Because of this active heat pumping, a temperature difference is caused, forming a hot and cold end. When the current direction is opposite, the direction of heat transfer is also opposite. This principle can be used for temperature control. The temperature sensing unit 480 is used to sense the operating temperature of the semiconductor refrigeration plate to obtain a sensing result, and output the sensing result to an external circuit.

For example, the external circuit mentioned above is, for example, an external control circuit, and a plurality of semiconductor thermocouple pairs 470 are electrically connected to the external control circuit through the first power supply terminal 4011 and the second power supply terminal 4012 to realize cold end cooling and hot end heating; the temperature sensing unit 480 is electrically connected to the external control circuit through the third power supply terminal 4021 and the fourth power supply terminal 4022, so as to sense the working temperature of the semiconductor refrigeration plate and send the sensing result to the external control circuit. When the working temperature exceeds the set value, the controller on the external control circuit can timely adjust the heat dissipation efficiency of the semiconductor refrigeration plate 10 or directly shut down the semiconductor refrigeration plate to protect the semiconductor refrigeration plate from damage.

In the embodiment of the present application, a first substrate 440a, a second substrate 440b and a sealant 430 are provided to enclose a housing space 490, so that the housing space 490 is isolated from the external environment, wherein the sealant 430 plays a role of moisture-proof and heat-insulating, and a temperature sensing unit 480 is integrated in the housing space 490, that is, the semiconductor refrigeration chip has a temperature sensing unit 480 inside, and there is no need to install a temperature sensing unit separately. This can not only avoid the situation in the prior art where the temperature sensing unit 480 falls off relative to the semiconductor refrigeration chip due to external forces and other factors, but also avoid the influence of the ambient temperature on the temperature detection process, thereby more accurately detecting the temperature. In addition, a temperature sensing unit 480 is integrated inside the semiconductor refrigeration chip. The temperature detected by the temperature sensing unit 480 is the working temperature inside the semiconductor refrigeration chip, rather than the working temperature at the place where the semiconductor refrigeration chip is attached to the outer surface. This can more accurately reflect the temperature change of the semiconductor refrigeration chip when it is working, thereby further improving the accuracy of the working temperature detection of the semiconductor refrigeration chip.

The structure of the semiconductor cooling plate is further described below in conjunction with Figures 17 to 19.

Referring to FIG. 17 again, the first substrate 440a and the second substrate 440b are, for example, arranged opposite to each other. For example, the first substrate 440a and the second substrate 440b are, for example, arranged parallel to each other. The first substrate 440a is, for example, a cold end substrate, and the second substrate 440b is, for example, a hot end substrate, and vice versa. The first substrate 440a and the second substrate 440b can be fixedly connected by a sealant 430, for example, and the sealant 430 is filled in the peripheral edge between the first substrate 440a and the second substrate 440b to maintain the stability of the connection between the two. For example, the sealant 430 can be made of rubber, which is a milky white elastic solid after curing. The purpose of curing is to isolate the multiple semiconductor couples 470 and the temperature sensing unit 480 from the external environment, so as to play a role of moisture-proof and heat-insulating. Furthermore, the first substrate 440a and the second substrate 440b are, for example, ceramic substrates, such as Al2O3 (aluminum oxide), BeO (bismuth oxide), AIN (aluminum nitride) and other material substrates, which not only have good thermal conductivity, but also have good electrical insulation properties, so that the semiconductor refrigeration plate can simplify the structure while ensuring the working performance. In a specific embodiment, one or both of the first substrate 440a and the second substrate 440b can be, for example, a metal substrate, and the inner surface of the metal substrate is provided with an insulating layer. For example, the metal substrate can be an aluminum substrate, a copper substrate or other metal conductors. The inner surfaces of the first substrate 440a and the second substrate 440b are isolated from the multiple semiconductor couple pairs 470 by the insulating layer. On the one hand, it ensures that the current flowing into the multiple semiconductor couple pairs 470 is electrically isolated from the first substrate 440a and the second substrate 440b. On the other hand, the better thermal conductivity of the first substrate 440a and the second substrate 440b made of metal can be fully utilized to conduct the cold energy and heat energy generated by the multiple semiconductor couple pairs 470.

According to the above, the plurality of semiconductor thermocouple pairs 470 are, for example, fixedly clamped between the first substrate 440a and the second substrate 440b, and are sequentially connected in series between the first power supply end 4011 and the second power supply end 4012, as shown in FIG18. The number of the plurality of semiconductor thermocouple pairs 470 is preferably 100 to 120, preferably 103 or 105, so that when the semiconductor refrigeration sheet is applied to a wearable product, sufficient cold energy or heat energy can be provided to enhance the user experience. Referring to FIG19, each of the semiconductor thermocouple pairs 470, for example, includes a first type semiconductor thermocouple 4701 and a second type semiconductor thermocouple 4702 connected in series, and the height H1 of each of the first type semiconductor thermocouple and the second type semiconductor thermocouple in the distance direction between the first substrate and the second substrate is 1.0 mm to 2.0 mm, and the height H1 is preferably 1.7 mm, which is conducive to the thinning of the semiconductor refrigeration sheet, so that it is more suitable for wearable products.

In addition, the length and width of the first type semiconductor thermocouple 4701 and the second type semiconductor thermocouple 4702 of each semiconductor couple pair 470 are preferably 1.0 mm. The distance between the first type semiconductor thermocouple 4701 and the second type semiconductor thermocouple 4702 of each semiconductor couple pair 470 is 0.5 mm to 1.2 mm. Referring to FIG. 19 , there is a first distance D1 between the first type semiconductor thermocouple 4701 and the second type semiconductor thermocouple 4702 of the first thermocouple pair of two adjacent semiconductor couple pairs 470, and there is a second distance D2 between the first type semiconductor thermocouple 4701 and the second type semiconductor thermocouple 4702 of the second thermocouple pair of two adjacent semiconductor couple pairs 470, and the second distance D2 is different from the first distance D1. For example, the first distance D1 is, for example, 0.5 mm to 0.7 mm, preferably 0.6 mm, and the second distance D2 is, for example, 0.8 mm to 1.2 mm, preferably 1.0 mm. Here, by setting the first distance D1 and the second distance D2 to be different and further designing the numerical range of the first distance D1 and the second distance D2, the semiconductor refrigeration sheet can have a better cooling or heating effect.

In addition, referring to FIG. 17 and FIG. 18, the temperature sensing unit 480 is arranged in the edge area between the first substrate 440a and the second substrate 440b, and the edge area is located outside the setting area of the multiple semiconductor couple pairs 470. The setting area of the multiple semiconductor couple pairs 470 may refer to an area diffused outward from the center between the first substrate 440a and the second substrate 440b. In this way, on the one hand, adding the temperature sensing unit 480 inside the semiconductor refrigeration plate will not affect the setting of the multiple semiconductor couple pairs 470, and on the other hand, it is also convenient to lead out the third power supply terminal 4021 and the fourth power supply terminal 4022 of the temperature sensing unit 480, thereby simplifying the manufacturing process of the semiconductor refrigeration plate.

Furthermore, the temperature sensing unit 480 is, for example, attached to the inner surface of the first substrate 440a, thereby simplifying the assembly operation of assembling the temperature sensing unit 480 inside the semiconductor refrigeration chip. For example, the temperature sensing unit 480 includes, for example, a thermistor. The temperature sensing unit 480 detects the temperature inside the semiconductor refrigeration chip as the working temperature of the semiconductor refrigeration chip. The external circuit can optimize the control curve of the semiconductor refrigeration chip according to the detection result of the temperature sensing unit 480, improve the accuracy of the temperature regulation of the semiconductor refrigeration chip, and can timely start the protection control of the semiconductor refrigeration chip when the working temperature inside the semiconductor refrigeration chip is too high, thereby extending the service life of the semiconductor refrigeration chip, which can also avoid the safety risks that may be caused by overheating of the semiconductor refrigeration chip.

In summary, the semiconductor refrigeration plate provided by the present application forms a housing space by setting a first substrate, a second substrate and an enclosure, so that the housing space is isolated from the external environment, wherein the sealant plays a role of moisture-proof and heat-insulating, and by integrating a temperature sensing unit inside the housing space, that is, the semiconductor refrigeration plate has a temperature sensing unit inside, and there is no need to install a temperature sensing unit separately, which can not only avoid the situation in the prior art that the temperature sensing unit is relatively detached from the semiconductor refrigeration plate due to external forces and other factors, but also avoid the influence of the ambient temperature on the temperature detection process, and more accurately detect the working temperature of the semiconductor refrigeration plate. In addition, the temperature sensing unit is set inside the semiconductor refrigeration plate, and the temperature detected by the temperature sensing unit is set as the working temperature inside the semiconductor refrigeration plate, rather than the working temperature at the attachment point of the outer surface of the semiconductor refrigeration plate, so that the temperature change of the semiconductor refrigeration plate when working can be more accurately reflected, thereby further improving the working temperature detection accuracy of the semiconductor refrigeration plate. Furthermore, the first distance and the second distance of the first type semiconductor thermocouple and the second type semiconductor thermocouple are set to be different, so that the semiconductor refrigeration plate can have a better cooling or heating effect. In addition, by designing the number of thermocouple pairs, when applied to wearable products, sufficient cooling energy or heating energy can be provided to enhance the user experience. In addition, by designing the height of the first type semiconductor thermocouple and the second type semiconductor thermocouple, it is conducive to the thinning of the semiconductor cooling sheet, so that it is more suitable for wearable products.

Referring to FIG. 20 and FIG. 21 , the present application provides a portable air conditioner, comprising a housing 100, a semiconductor cooling sheet as described in the above-mentioned embodiment disposed in the housing 100, and a conductive member 200 disposed inside the housing 100, wherein the conductive member 200 is thermally connected to the first substrate 440a of the semiconductor cooling sheet. The portable air conditioner may be a temperature-regulating product that can be worn on different parts of the user's body, and the housing 100 corresponds to a structure that stably wears the portable air conditioner on the corresponding part of the user's body, such as: the portable air conditioner may be a temperature-regulating device worn on the user's wrist, wherein the housing 100 may be The portable air conditioner may be a temperature control device worn on the user's waist, wherein the housing 100 may be a fixed belt wrapped around the user's waist, or the portable air conditioner may be a temperature control device worn on the user's neck, wherein the housing 100 may be a neck-mounted frame wrapped around the user's neck. In this embodiment, for ease of understanding, the portable air conditioner is described as a neck-hanging temperature control device as an example.

In some embodiments, the housing 100 includes a first arm 110, a second arm 120, and a connecting structure 130 that bendably connects the first arm 110 and the second arm 120. The semiconductor cooling sheet is disposed in the first arm 110 and the second arm 120, respectively, and the conductive member 200 is disposed on the inner side of the first arm 110 and the second arm 120, respectively.

In some embodiments, referring to Fig. 22, a positioning structure 140 for mounting and fixing the semiconductor cooling sheet may be provided in the first arm 110 and the second arm 120. The inner side refers to the side that is relatively close to the user's skin surface when the portable air conditioner is worn on the user's body.

In some embodiments, referring to FIG. 21 again, the connection structure 130 includes an elastic member 132 and two connecting members 134, and the two connecting members 134 are rotatably connected to each other, and the connecting members 134 are respectively connected to the first arm 110 and the second arm 120, and the two ends of the elastic member 132 can respectively abut against the two connecting members 134, and an elastic force rotating inward is applied to the first arm 110 and the second arm 120 through the connecting members 134, so as to ensure that when the neck-hanging temperature control device is worn on the user's neck, the conductive member 200 located on the inner side of the first arm 110 and the second arm 120 can maintain contact with the skin at the neck.

In some embodiments, referring to FIG. 20 and FIG. 21 again, the first arm 110 and the second arm 120 are respectively provided with an air inlet 150 and an air outlet 160, and the first arm 110 and the second arm 120 are respectively formed with a receiving chamber 102 communicating with the air inlet 150 and an air duct 104 communicating the receiving chamber 102 and the air outlet 160, and the first arm 110 and the second arm 120 are respectively provided with a fan assembly 500 accommodated in the receiving chamber 102. The air duct 104 can be divided into a plurality of sub-air ducts 1040 by a partition 106, and the air outlets 160 on the first arm 110 and the second arm 120 can be formed into a plurality of sub-air outlets corresponding to different sub-air ducts 1040. In some embodiments, the internal space of the first arm 110 and the second arm 120 may also include a receiving cavity 108 separated from the air duct 104 by a partition 106, and the external control circuit of the semiconductor refrigeration plate may be arranged in the receiving cavity 108. The airflow generated during the operation of the fan assembly 500 mainly flows into each sub-air duct 1040, and flows out from the corresponding sub-air outlet 160 through the diversion and guidance of the sub-air duct 1040 to blow air and dissipate heat to different parts of the human body respectively. A small part of the airflow can flow into the receiving cavity 108 to dissipate heat for the circuit, thereby ensuring the stability of the circuit during operation.

In addition, in a specific embodiment, referring to FIG. 23 , the length L1 of the semiconductor refrigeration sheet is 30 mm to 45 mm, the width W1 of the semiconductor refrigeration sheet is 15 mm to 25 mm, and the size of the semiconductor refrigeration sheet is preferably 40 mm in length L1 and 20 mm in width W1. In this way, the volume of the semiconductor refrigeration sheet can be reduced as much as possible while ensuring the cooling/heating effect of the semiconductor refrigeration sheet, and the cooling/heating efficiency of the semiconductor refrigeration sheet under the same volume can be improved, so that it can be applied to wearable products with smaller volume.

In some embodiments, referring to FIG. 23 again, the ratio of the length L1 of the semiconductor refrigeration sheet to the length L2 of the conductive member 200 is 0.25 to 0.5, and the ratio is preferably 0.3. The ratio of the width W1 of the semiconductor refrigeration sheet to the width W2 of the conductive member 200 is 0.5 to 0.75, and the ratio is preferably 0.6. Furthermore, the conductive member 200 has two opposite edges 210 in its length direction, and the distance D3 from the semiconductor refrigeration sheet to any of the edges 331 along the length direction of the conductive member 200 is 15 mm to 30 mm. Here, by reasonably designing the size relationship between the semiconductor refrigeration sheet and the conductive member 200, the conduction efficiency and conduction uniformity of the conductive member 200 can be guaranteed.

In summary, the portable air conditioner provided in the present application has more accurate temperature monitoring of the semiconductor refrigeration chip, which makes the temperature control performance of the product better; and through the reasonable design of the size relationship between the semiconductor refrigeration chip and the conductive part, it can ensure the conduction efficiency and conduction uniformity of the conductive part.

The above is only a preferred embodiment of the present application and does not constitute any form of limitation to the present application. Although the present application has been disclosed as a preferred embodiment as above, it is not intended to limit the present application. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of the technical contents disclosed above without departing from the scope of the technical solution of the present application. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.

Claims

A portable air conditioner, comprising:

case;

A temperature regulating device is arranged in the housing, and the temperature regulating device includes a multi-stage semiconductor refrigeration sheet stacked on each other; and

A conductive member is arranged on the shell, and the conductive member is connected to one end of the multi-stage semiconductor refrigeration plate.
The portable air conditioner as described in claim 1 is characterized in that the multi-stage semiconductor refrigeration plate includes a substrate, a first semiconductor couple string and a second semiconductor couple string, and the substrate is arranged between the first semiconductor couple string and the second semiconductor couple string and respectively connects the first semiconductor couple string and the second semiconductor couple string.
The portable air conditioner as described in claim 1 is characterized in that the multi-stage semiconductor refrigeration plate includes a first substrate, a second substrate, a first semiconductor couple string and a second semiconductor couple string, the opposite sides of the first substrate are respectively connected to the first semiconductor couple string and the second substrate, and the opposite sides of the second substrate are respectively connected to the first substrate and the second semiconductor couple string.
The portable air conditioner as described in claim 1 is characterized in that the multi-stage semiconductor refrigeration plate includes adjacent front-stage semiconductor refrigeration plates and rear-stage semiconductor refrigeration plates, and the contour size of the end face of the front-stage semiconductor refrigeration plate adjacent to the conductive member is equal to or smaller than the contour size of the end face of the rear-stage semiconductor refrigeration plate away from the conductive member.
The portable air conditioner as described in claim 1 is characterized in that the multi-stage semiconductor refrigeration plate includes at least three stages of semiconductor refrigeration plates, and in the direction away from the conductive member, the contour dimensions of the end faces of the semiconductor refrigeration plates of each stage in the multi-stage semiconductor refrigeration plate adjacent to the conductive member increase successively.
The portable air conditioner according to claim 1 is characterized in that a temperature sensing unit is provided inside the multi-stage semiconductor refrigeration plate.
The portable air conditioner as described in any one of claims 1 to 6 is characterized in that the semiconductor refrigeration plates at each stage in the multi-stage semiconductor refrigeration plate are connected in series with each other, and the multi-stage semiconductor refrigeration plate includes a first power supply end and a second power supply end, and the first power supply end and the second power supply end are connected to semiconductor refrigeration plates at different stages in the multi-stage semiconductor refrigeration plate.
The portable air conditioner according to any one of claims 1 to 6, characterized in that the semiconductor refrigeration plates at each stage of the multi-stage semiconductor refrigeration plate are connected in parallel with each other, and the semiconductor refrigeration plates at each stage of the multi-stage semiconductor refrigeration plate include a first power supply terminal and a second power supply terminal; or

The semiconductor refrigeration plates at each stage of the multi-stage semiconductor refrigeration plate are connected in parallel with each other. The multi-stage semiconductor refrigeration plate includes a first power supply end and a second power supply end. The first power supply end and the second power supply end are connected to the semiconductor refrigeration plates at the same stage of the multi-stage semiconductor refrigeration plate.
The portable air conditioner according to any one of claims 1 to 6 is characterized in that the portable air conditioner also includes an energy dissipation module, the energy dissipation module is arranged in the shell, and the energy dissipation module is connected to an end of the multi-stage semiconductor refrigeration plate away from the conductive element.
The portable air conditioner according to any one of claims 1 to 6 is characterized in that the shell is bent to form a wearing space, and the conductive member is arranged on a side of the shell close to the wearing space.