WO2024106200A1 - Conveyance container delivering/receiving device - Google Patents

Conveyance container delivering/receiving device Download PDF

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Publication number
WO2024106200A1
WO2024106200A1 PCT/JP2023/039230 JP2023039230W WO2024106200A1 WO 2024106200 A1 WO2024106200 A1 WO 2024106200A1 JP 2023039230 W JP2023039230 W JP 2023039230W WO 2024106200 A1 WO2024106200 A1 WO 2024106200A1
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WIPO (PCT)
Prior art keywords
container
transport
transport container
transfer
mounting table
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PCT/JP2023/039230
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French (fr)
Japanese (ja)
Inventor
史郎 原
博幸 西原
直義 阿川
Original Assignee
株式会社デザインネットワーク
国立研究開発法人産業技術総合研究所
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Publication of WO2024106200A1 publication Critical patent/WO2024106200A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a transfer container delivery and receiving device for delivering and receiving a transfer container containing a processing substrate to, for example, a small semiconductor manufacturing device.
  • a production line is made up of an array of minimal equipment, which are small semiconductor manufacturing devices that handle each step of device manufacturing.
  • Each minimal equipment has the same dimensions and shape, and each has a recess formed on its front.
  • Inter-equipment transport units common to each minimal equipment are mounted in these recesses, and an inter-equipment transport system that automatically transports transport containers is configured as an integral part of the production line (see, for example, Patent Documents 1 and 2).
  • Patent No. 6373405 Japanese Patent No. 6422317
  • the operation of supplying a transport container containing small-diameter wafers as processing substrates before processing to the start point of the above-mentioned transfer line, and the operation of recovering the transport container containing small-diameter wafers after processing from the end point of the above-mentioned transfer line are not automated, and operators manually recover the transport containers.
  • labor saving in the minimal fab is insufficient and unmanned operation cannot be performed at night, etc.
  • the objective of the present invention is to provide a transport container handover and receiving device that automates the supply and collection of transport containers to the inter-equipment transport unit, reduces the workload and operators required to operate the device, and enables unmanned automatic operation.
  • the invention of claim 1 is a transport container delivery and reception device that is installed on the side of at least one semiconductor manufacturing device and delivers and receives a transport container containing a substrate therein, the device comprising: a storage section that stacks the transport containers vertically; a take-out/take-in means that can take out the transport container located at the lowest position below the storage section and take in a transport container containing a processed substrate from below the storage section; and a moving means that moves the transport container between a delivery and reception position by the transport means of the semiconductor manufacturing device and a predetermined position below the storage section.
  • the take-out/take-in means takes out the transport container located at the lowest position and moves it by the moving means to a position where it is delivered by the transport means of the semiconductor manufacturing device, while when receiving from the semiconductor manufacturing device, the transport container containing the processed substrate is received from the transport means and moved by the moving means to a predetermined position below the storage section, and the transport container containing the processed substrate is stored below the storage section by the take-out/take-in means.
  • the invention of claim 2 is characterized in that, in addition to the configuration of claim 1, the moving means includes a horizontal drive unit that moves the moving means back and forth horizontally between a position where the moving means delivers and receives the product and a position below the storage unit.
  • the invention of claim 3 in addition to the configuration of claim 1, has an openable and closable clamp mechanism capable of holding the transport container accommodated in the storage section, a container mounting table for mounting the transport container to be handed over to the storage section and the transport container to be received, and a vertical drive unit for vertically reciprocating the container mounting table between an elevated position for supporting the transport container located at the lowest position in the storage section and a lowered position for receiving and being handed over by the transport means of the manufacturing equipment, and when transferring the transport container to the semiconductor manufacturing equipment, the container mounting table supports the transport container located at the lowest position in the storage section, opens the clamp mechanism, lowers the container mounting table by the amount of the transport container located at the lowest position in the storage section, and moves the transport container to the storage section.
  • the clamp mechanism is closed to hold the transport container located directly above the transport container located at the lowest position in the storage unit, and the transport container located at the lowest position in the storage unit is moved to a position where it is transferred by the transport means.
  • the container mounting table supports the transport container containing the processed substrate so that it is stacked below the transport container located at the lowest position in the storage unit
  • the clamp mechanism is opened to raise the container mounting table by the length of one of the transport containers in the storage unit, the transport container containing the processed substrate that is now located at the lowest position in the storage unit is held by closing the clamp mechanism, and the container mounting table is moved to a position where it is transferred by the transport means.
  • the invention of claim 4 is characterized in that, in addition to the configuration described in any one of claims 1 to 3, it is configured to be installable on the left and right side portions of the semiconductor manufacturing device.
  • the supply and recovery of the transport container containing the substrates to the transport means can be automated, reducing the workload and operators required to operate the device and enabling unmanned automatic operation.
  • the structure is simplified by horizontally reciprocating between the position where the transport container is handed over and received by the transport means and the position below the storage section, and it is possible to easily share the operations of handing over and receiving the transport container to the storage section with a single unit.
  • the container mounting table supports the transport container located at the lowest position in the storage section
  • the clamping mechanism is opened to lower the container mounting table by the length of the transport container located at the lowest position in the storage section
  • the transport container located directly above the transport container located at the lowest position in the storage section is held by closing the clamping mechanism
  • the transport container located at the lowest position in the storage section is moved to a position where it is delivered by the transport means.
  • the container mounting table supports the transport container containing the processed substrate so that it is stacked below the transport container located at the lowest position in the storage section
  • the clamping mechanism is opened to raise the container mounting table by the length of the transport container located at the lowest position in the storage section
  • the transport container containing the processed substrate that is now located at the lowest position in the storage section is held by closing the clamping mechanism
  • the container mounting table is moved to a position where it is delivered by the transport means.
  • the device can be installed on the left and right side of the semiconductor manufacturing device, significantly increasing the versatility of the device.
  • FIG. 1A and 1B are diagrams showing a production line for small-sized semiconductor manufacturing equipment to which a transfer container delivery and receiving device according to a first embodiment of the present invention is applied, in which FIG. 1 is a perspective view showing an internal structure of a transfer container delivery and receiving device according to a first embodiment of the present invention, when the transfer container delivery and receiving device is installed on the right side of a small-sized semiconductor manufacturing device; 3 is a perspective view showing a state in which a plurality of wafer transport containers are stacked in a container receiving section in the transport container delivery and receiving device of FIG. 2.
  • FIG. 1 is a perspective view showing an internal structure of a transfer container delivery and receiving device according to a first embodiment of the present invention, when the transfer container delivery and receiving device is installed on the right side of a small-sized semiconductor manufacturing device
  • 3 is a perspective view showing a state in which a plurality of wafer transport containers are stacked in a container receiving section in the transport container delivery and receiving device of FIG. 2.
  • FIG. 1 is a
  • FIG. 1 is a perspective view showing a state in which a horizontal drive unit is driven when a wafer transport container is transferred in the transport container transfer and receiving apparatus according to the first embodiment of the present invention
  • FIG. 5 is a perspective view showing a state in which driving of the vertical driving unit is started from the state shown in FIG. 4, as seen from the rear side.
  • 6 is a perspective view of the state in which the vertical drive unit is further driven from the state of FIG. 5, as viewed from the rear side.
  • FIG. 7 is a perspective view showing a state in which the clamp mechanism is opened from the state shown in FIG. 6 .
  • FIG. 8 is a perspective view showing a state in which a wafer transport pod located immediately above a wafer transport pod located at the lowest position in the accommodation section is held by a clamp mechanism, following the state shown in FIG. 7 .
  • 9 is a perspective view showing a state in which the vertical drive unit is driven to lower the container mounting table from the state shown in FIG. 8 .
  • 10 is a perspective view showing a state in which the horizontal drive unit is driven from the state shown in FIG. 9 to move the wafer transport container to a position where it is handed over by the transport means.
  • FIG. 11 is a front view showing a production line of a minimalist device to which a transfer container delivery and receiving device according to a second embodiment of the present invention is applied.
  • FIG. 1 shows a production line for small-sized semiconductor manufacturing equipment that uses a transfer container delivery and receiving device according to the first embodiment of the present invention, where (a) is a front view and (b) is a left side view.
  • a semiconductor production line 1 to which this embodiment is applied is configured with three small semiconductor manufacturing devices (hereinafter referred to as minimal devices) 2 arranged side by side in a straight line on a floor surface 3.
  • minimal devices 2 small semiconductor manufacturing devices
  • These three minimal devices 2 face each other horizontally with a predetermined gap (for example, 6 mm) between them.
  • Each of the minimal devices 2A, 2B, and 2C has a roughly rectangular parallelepiped housing 4 of a given size (e.g., width 30 cm, depth 45 cm, height 144 cm), and inside the housing 4, a processing chamber 5 and an antechamber 6 are arranged.
  • a processing chamber 5 and an antechamber 6 are arranged inside the housing 4, and inside the processing chamber 5 and an antechamber 6 are arranged.
  • a recess 7 is formed above the apparatus front chamber 6 at the front of the housing 4.
  • the front and side sides of this recess 7 are open, and it is recessed from the front toward the depth.
  • a container mounting table 9 is installed in this recess 7 for mounting a wafer transport container (transport container) 10 that contains small-diameter (e.g., 12.5 mm diameter) semiconductor wafers (substrates) in a sealed state, and a temporary tray 8 for temporarily holding this wafer transport container 10 is also installed.
  • the temporary placement tray 8 is arranged so as to be positioned between the container placement stand 9 of any minimal device 2 and the container placement stand 9 of the adjacent minimal device 2 when multiple minimal devices 2 are arranged side by side.
  • the positional relationship between the container placement stand 9 and the temporary placement tray 8 (in the width direction, depth direction, and height direction of the housing 4) is determined with high precision.
  • a container transport path 11 extending in the direction in which the multiple minimal devices 2 are arranged side by side (the left-right direction (X direction) in FIG. 1(a)) is formed so as to pass through the recesses 7 of the multiple minimal devices 2.
  • the housing 4 is provided with an inter-apparatus transfer unit 12 as a transfer means for transferring the wafer transport container 10 between the three minimal apparatuses 2, which can be raised and lowered by a Z-axis motor (not shown).
  • This inter-apparatus transfer unit 12 is configured to transfer the wafer transport container 10 back and forth between the temporary placement tray 8 and container placement stand 9 of the minimal apparatus 2, and to transfer the wafer transport container 10 back and forth between the container placement stand 9 of the minimal apparatus 2 and the temporary placement tray 8 of the adjacent minimal apparatus 2.
  • the three minimal devices 2 are each equipped with an inter-apparatus transport unit 12, forming a container transport path 11, and this inter-apparatus transport unit 12 is configured to be able to transfer and receive wafer transport containers 10 between the transport container transfer and receiving devices 20A and 20B described below.
  • FIG. 1(a) shows an example in which a production line 1 configured with an array of minimal devices 2 is combined with a transport container transfer and receiving device (loader) 20A and a transport container transfer and receiving device (unloader) 20B.
  • the transport container transfer and receiving device 20A is installed on the right side of the right minimal device 2A, which is the start point of the container transport path 11, while the transport container transfer and receiving device 20B is installed on the left side of the left minimal device 2C, which is the end point of the container transport path 11.
  • the transport container transfer device 20A is installed on the right side of the minimal device 2A and is configured to transfer the wafer transport container 10 to the minimal device 2A, while the transport container transfer device 20B is installed on the left side of the minimal device 2C and is configured to receive the wafer transport container 10 from the minimal device 2C.
  • the transport container transfer device 20A and the transport container transfer device 20B are the same for each minimal device 2A, 2B, 2C, they can be installed in all minimal devices 2 regardless of the processing content of each minimal device 2A, 2B, 2C.
  • transport container transfer/receiving device 20A and the transport container transfer/receiving device 20B have the same internal structure, they can be used to transfer and receive the wafer transport container 10 in the reverse order.
  • FIG. 2 is a perspective view showing the internal structure of a transport container transfer/receiving device 20A according to the first embodiment of the present invention installed on the right side of a minimal device 2A.
  • FIG. 3 is a perspective view showing a state in which multiple wafer transport containers 10 are stacked in the storage section 23 of the transport container transfer/receiving device 20A of FIG. 2.
  • an existing cover (not shown) that is attached in advance to the right side of the minimal device 2A is removed, and then an attachment cover 21 for attaching the transport container transfer device 20A is provided.
  • the transport container delivery and receiving device 20A has a mounting frame 22 fixed to a mounting cover 21 using fastening means such as bolts.
  • a storage section 23 is installed on the recess 7 side of the mounting frame 22. As shown in FIG. 3, this storage section 23 stores multiple wafer transport containers 10, each of which contains unprocessed semiconductor wafers stored in a sealed state, stacked vertically.
  • the wafer transport containers 10 stacked in these storage sections 23 are configured so that the lowest wafer transport container 10 can be removed from below the storage section 23 by an removal/intake device 15 serving as a removal/intake means.
  • the removal/intake device 15 is also configured so that it can take in a wafer transport container 10 containing processed semiconductor wafers (substrates) from below the storage section 23.
  • the horizontal drive unit 30 as a moving means is configured to horizontally reciprocate the wafer transport container 10 between a position where the wafer is handed over and received by the inter-apparatus transport unit 12 and a predetermined position below the storage unit 23.
  • the take-out/take-in device 15 has a clamp mechanism 24, which is configured to be openable and closable so as to hold the wafer transport container 10 housed in the storage section 23.
  • the take-out/take-in device 15 also has a container mounting table 40, which mounts the wafer transport container 10 to be delivered to the storage section 23 and the wafer transport container 10 to be received.
  • the take-out/take-in device 15 also has a vertical drive unit 50, which is configured to move the container mounting table 40 up and down between an elevated position where the wafer transport container 10 located at the lowest position in the storage section 23 can be supported, and a lowered position where the wafer transport container 10 can be delivered and received by the inter-device transport unit 12 of the minimal device 2.
  • the vertical drive unit 50 is described as being moved up and down by an air cylinder, but it can also be moved up and down electrically.
  • the clamp mechanism 24 is installed on the mounting cover 21 at a position corresponding to the lower end of the storage section 23. As shown in Figures 2 and 3, this clamp mechanism 24 has a clamp section 25 that grips and holds the wafer transport container 10 contained in the storage section 23, and a clamp drive section 26 that drives the clamp section 25 to open and close.
  • the horizontal drive unit 30 is installed on the rear side of the mounting cover 21 and mounting frame 22.
  • the container mounting table 40 and the vertical drive unit 50 are supported on the horizontal drive unit 30 via a connecting mechanism 33.
  • the horizontal drive unit 30 has a front-rear drive air cylinder 31, and the above-mentioned connecting mechanism 33 is fixed to the tip of the three cylinder rods 32 of this front-rear drive air cylinder 31.
  • the vertical drive unit 50 is attached to this connecting mechanism 33.
  • This vertical drive unit 50 is attached along the longitudinal direction of the vertical connecting plate 34 of the connecting mechanism 33.
  • the connecting mechanism 33 has a vertical connecting plate 34 to which the tips of the three cylinder rods 32 are fixed, as shown in Figures 4 to 6, and a horizontal connecting plate 35 that is connected to the upper end of the vertical connecting plate 34 so as to extend horizontally on the front side of the minimal device 2A.
  • the vertical drive unit 50 has a vertical drive air cylinder 51.
  • This vertical drive air cylinder 51 is coaxially connected to a long air cylinder 52 that moves the container mounting table 40 up and down with a long stroke, and a short air cylinder 53 that moves the container mounting table 40 up and down with a shorter stroke than the long air cylinder 52, and is equipped with a cylinder rod 54 that is moved up and down by the long air cylinder 52 and the short air cylinder 53.
  • the stroke of the long air cylinder 52 plus the stroke of the short air cylinder 53 is set to a stroke that moves the container mounting table 40 up and down between an elevated position where it can support the wafer transport container 10 located at the lowest position in the accommodation section 23, and a lowered position where it is handed over by the inter-apparatus transport unit 12 of the minimal apparatus 2A.
  • the stroke of the short air cylinder 53 is set to a stroke that moves it up and down the thickness of one wafer transport container 10 located in the accommodation section 23.
  • the vertical drive unit 50 has an upper horizontal section 37, to which the upper end of a cylinder rod 54 is fixed by inserting it through an insertion hole 39 formed in the horizontal connecting plate 35.
  • Two vertical movement rods 36 are connected to both ends of the upper horizontal section 37 so as to pass through the horizontal connecting plate 35.
  • One of the two vertical movement rods 36 is connected to one end of a lower horizontal section 38, and the lower end of a vertical movement rod 41 is connected to the other end of the lower horizontal section 38, and the container mounting table 40 is connected to the upper end of the vertical movement rod 41.
  • the vertical movement rod 41 is inserted through the insertion hole of the horizontal connecting plate 35 so as to be able to move back and forth up and down.
  • the container mounting table 40 and the vertical drive unit 50 can move horizontally back and forth as one unit. Therefore, the container mounting table 40 moves horizontally back and forth between the position where the wafer transport container 10 is transferred and the position directly below the storage unit 23.
  • the container mounting table 40 is used to place the wafer transport container 10 so that the wafer transport container 10 can be removed from the storage unit 23 and transferred to the minimal device 2A.
  • the vertical driving air cylinder 51 when the vertical driving air cylinder 51 is driven to lower the cylinder rod 54, its upper end lowers the upper horizontal section 37, causing the vertical movement rod 36 to lower and the lower horizontal section 38 to lower. This causes the container mounting table 40, the lower end of which is fixed to the lower horizontal section 38, to lower. In this way, the vertical driving air cylinder 51 is configured to be able to move the container mounting table 40 back and forth up and down.
  • a container detection sensor 60 is installed near the container mounting table 40 to detect the wafer transport containers 10 placed on the container mounting table 40.
  • a container number sufficiency sensor 61 is installed near the top end of the storage section 23 in the vertical direction to detect when the wafer transport containers 10 loaded in the storage section 23 reach a specified number, for example 20.
  • a container detection sensor 62 is installed near the take-out/take-out device 15 to detect the wafer transport containers 10 stored in the storage section 23.
  • the transport container transfer/receiving devices 20A, 20B of this embodiment 1 are configured so that the transfer operation and the receiving operation of the wafer transport container 10 can be switched by, for example, a switch not shown.
  • the up-down driving air cylinder 51 of the vertical driving unit 50 is driven to raise the container mounting table 40 by the stroke of the long air cylinder 52 plus the stroke of the short air cylinder 53, and the container mounting table 40 supports the wafer transport container 10 located at the lowest position within the storage unit 23.
  • the clamp mechanism 24 is operated to open the clamp section 25, and the short air cylinder 53 of the up-down driving air cylinder 51 of the vertical driving section 50 is driven to lower the container mounting table 40 by the thickness of one wafer transport container 10 located at the lowest position in the accommodation section 23, i.e., by the stroke of the short air cylinder 53.
  • the clamp mechanism 24 is operated to close the clamp section 25, and the wafer transport container 10 located directly above the wafer transport container 10 located at the lowest position in the accommodation section 23 is held by the clamp section 25.
  • the up-down driving air cylinder 51 of the vertical driving section 50 is driven to lower the container placement table 40 by the stroke of the long air cylinder 52.
  • the front-rear drive air cylinder 31 of the horizontal drive unit 30 is driven to move the container placement table 40 horizontally to a position where it can be handed over by the inter-apparatus transfer unit 12 of the minimal apparatus 2A.
  • the wafer transport containers 10 stacked in the storage unit 23 are sequentially handed over to the inter-apparatus transfer unit 12 of the minimal apparatus 2A.
  • the operation sequence is reversed from that for transferring the wafer transport container 10 to the minimal device 2 described above.
  • the transfer container transfer device 20B receives the wafer transfer container 10 from the minimal device 2C.
  • the transfer container transfer device 20B has the same internal structure as the transfer container transfer device 20A, the same reference numerals will be used in the description.
  • the wafer transport container 10 containing processed semiconductor wafers is received and placed on the container mounting table 40 by the inter-apparatus transport unit 12 of the minimal apparatus 2C. Then, as shown in Figures 3 and 4, the front-rear drive air cylinder 31 of the horizontal drive unit 30 is driven to move the cylinder rod 32 backward, thereby moving the container mounting table 40 horizontally to a position directly below the storage unit 23.
  • the up-down driving air cylinder 51 of the vertical driving unit 50 is driven to raise the container mounting table 40 by the stroke of the long air cylinder 52, and the wafer transport container 10 containing the processed semiconductor wafers is supported so as to be stacked below the wafer transport container 10 located at the lowest position in the storage unit 23.
  • the clamp mechanism 24 is operated to open the clamp section 25, and the short air cylinder 53 of the up-down driving air cylinder 51 of the vertical driving section 50 is driven to raise the container mounting table 40 by the thickness of one wafer transport container 10 in the storage section 23, i.e., by the stroke of the short air cylinder 53.
  • the clamp mechanism 24 is operated to close the clamp section 25 and hold the wafer transport container 10 containing the processed semiconductor wafers, which is now positioned at the lowest position in the storage section 23.
  • the container mounting table 40 is empty after the wafer transport container 10 containing processed semiconductor wafers is supplied to the container section 23.
  • the vertical drive air cylinder 51 of the vertical drive section 50 is driven to lower the container mounting table 40 by the stroke of the long air cylinder 52, as shown in FIG. 9.
  • the front-rear drive air cylinder 31 of the horizontal drive unit 30 is driven to move the container placement table 40 horizontally to a position where it can be received by the inter-apparatus transfer unit 12 of the minimal apparatus 2C.
  • This series of operations is repeated to receive the wafer transfer containers 10 containing the processed semiconductor wafers in the storage unit 23 so that they are stacked one after the other from below.
  • the take-out/take-in device 15 which is composed of the clamp mechanism 24, the container placement table 40, and the vertical drive unit 50, takes out the wafer transport container 10 located at the lowest position from below the storage section 23, and moves it to a position where it is transferred by the inter-apparatus transport unit 12 of the minimal device 2A using the horizontal drive unit 30 as a moving means.
  • the wafer transport container 10 containing the processed semiconductor wafers is received from the inter-apparatus transport unit 12, moved to a predetermined position below the storage section 23 by the horizontal drive unit 30, and the wafer transport container 10 containing the processed semiconductor wafers is stored below the storage section 23 using the take-out/take-in device 15.
  • the horizontal drive unit 30 moves back and forth horizontally between the position where the wafer is handed over and received by the inter-apparatus transport unit 12 and a position below the storage unit 23, thereby simplifying the structure and making it possible to easily share the operations of handing over and receiving the wafer transport container 10 to and from the storage unit 23 with a single unit.
  • the container mounting table 40 supports the wafer transport container 10 located at the lowest position in the storage section 23, the clamp portion 25 of the clamp mechanism 24 is opened to lower the container mounting table 40 by the length of one wafer transport container 10 located at the lowest position in the storage section 23, the clamp mechanism 24 is closed to hold the wafer transport container 10 located directly above the wafer transport container 10 located at the lowest position in the storage section 23, and the wafer transport container 10 located at the lowest position in the storage section 23 is moved to a position where it will be transferred by the inter-apparatus transport unit 12, while when receiving a wafer transport container 10 from the minimal device 2C, the container mounting table 40 supports the wafer transport container 10 located at the lowest position in the storage section 23 by the clamp portion 25 of the clamp mechanism 24, and the wafer transport container 10 located at the lowest position in the storage section 23 is moved to a position where it will be transferred by the inter-apparatus transport unit 12.
  • the wafer transport container 10 containing the processed semiconductor wafers is supported so that it is stacked below the wafer transport container 10 located at the lowest position, the clamp mechanism 24 is opened to raise the container mounting table 40 by the height of one wafer transport container 10 in the storage section 23, the wafer transport container 10 containing the processed semiconductor wafers that is now located at the lowest position in the storage section 23 is held by closing the clamp mechanism 24, and the container mounting table 40 is moved to a position where it can be handed over by the inter-apparatus transport unit 12.
  • the transport container handover and receiving devices 20A, 20B store semiconductor wafers in wafer transport containers 10, and multiple wafer transport containers 10 can be directly stacked, making it possible to remove and load the lowest wafer transport container 10.
  • transport container delivery and reception devices 20A and 20B of this embodiment can be used for both delivery and reception of the wafer transport container 10.
  • transport container delivery and receiving devices 20A and 20B of this embodiment can be installed on both the left and right sides of the minimal device 2, significantly increasing the versatility of the device.
  • the container transfer device 20A and the container transfer device 20B have the storage section 23 installed asymmetrically when viewed from the front, so it is necessary to prepare two models: a container transfer device 20A for the right side and a container transfer device 20B for the left side.
  • the transfer container transfer/receiving device 20A and the transfer container transfer/receiving device 20B are all configured to have the same structure, the transfer container transfer/receiving device 20A and the transfer container transfer/receiving device 20B can be integrated into one common device. In this case, it is possible to reverse the transfer direction by switching between the transfer function and the receiving function of the transfer container transfer/receiving device 20A and the transfer container transfer/receiving device 20B by simple setting operations or remote control.
  • [Embodiment 2] 11 is a front view showing a production line of a minimalist device to which a transfer container delivery and receiving device according to the second embodiment of the present invention is applied. In this embodiment, the same parts as those in the first embodiment are described using the same reference numerals, and descriptions of the same configurations and functions are omitted.
  • a transport container handover/receiving device 20A is installed on the right side of one minimal device 2, which is the starting point of the container transport path 11, while a transport container handover/receiving device 20B is installed on the left side of the minimal device 2, which is the end point of the container transport path 11.
  • the transport container transfer and receiving device 20A and the transport container transfer and receiving device 20B are installed on both sides of multiple minimal devices 2.
  • the transport container transfer and receiving device 20A can be installed on the right side of one minimal device 2, while the transport container transfer and receiving device 20B can be installed on the left side of the minimal device 2, which significantly increases the versatility of the device.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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Abstract

[Problem] To automate supply/recovery of a conveyance container to/from a conveyance means, to thereby reduce the number of manipulators and the work amount required for device management, while enabling unmanned automatic operation. [Solution] When delivering a wafer conveyance container 10 to a minimal device 2, the lowermost wafer conveyance container 10 is taken out from the lower side of a storage part 23 by a loading/unloading device 15, and is moved by a movement device 17 to a position where the container is to be delivered by an inter-device conveyance unit 12 of the minimal device 2. On the other hand, when receiving a wafer conveyance container 10 from the minimal device 2, a wafer conveyance container 10 that has stored therein a machined substrate is received from the inter-device conveyance unit 12, and is moved by the movement device 17 to a prescribed position on the lower side of the storage part 23, thereby storing the wafer conveyance container 10 that has stored therein the machined substrate, on the lower side of the storage part 23 by the loading/unloading device 15.

Description

搬送容器受渡し受取り装置Transport container delivery and receiving device
　本発明は、例えば小型の半導体製造装置に対して、内部に処理基板が収納された搬送容器を受け渡し及び受け取るための搬送容器受渡し受取り装置に関する。 The present invention relates to a transfer container delivery and receiving device for delivering and receiving a transfer container containing a processing substrate to, for example, a small semiconductor manufacturing device.
　従来、半導体製造技術では、ウェハの大口径化によって、チップ製造単価の低減が図られてきた。このため、一連の製造プロセスで使用される装置は巨大化、高価格化の一途をたどり、製造工場の規模や建設・運営コストを肥大化させることとなった。このような大規模半導体製造システムは、少品種大量生産ではチップの製造単価を低減するものの、多品種少量生産の要請に対応しにくく、市場状況に応じた生産量の調整が困難であるとともに、中小企業の参入を困難にする。 Traditionally, semiconductor manufacturing technology has attempted to reduce the unit cost of chip manufacturing by increasing the diameter of wafers. As a result, the equipment used in the manufacturing process has become increasingly larger and more expensive, causing the size of manufacturing factories and the construction and operating costs to balloon. Although such large-scale semiconductor manufacturing systems reduce the unit cost of chip manufacturing in the mass production of a small number of products, they are difficult to meet the demand for small-lot production of a wide variety of products, making it difficult to adjust production volume in response to market conditions and making it difficult for small and medium-sized enterprises to enter the market.
　これらの問題を解決するため、ミニマルファブ、例えば直径１２．５ｍｍ以下のウェハを製造単位として多品種少量生産の半導体、ＭＥＭＳ（Micro Electro Mechanical Systems）デバイスを低コストで製造可能なシステムの産業化を推進している。 To solve these problems, we are promoting the industrialization of minimal fabs, systems that can manufacture a wide variety of semiconductors and MEMS (Micro Electro Mechanical Systems) devices at low cost, using wafers with a diameter of 12.5 mm or less as manufacturing units.
　上記ミニマルファブでは、デバイス製造の各工程を処理する複数の小型の半導体製造装置であるミニマル装置を並べるように配列して製造ラインを構成している。各ミニマル装置は、寸法及び形状が統一され、それぞれ前面に凹部が形成されている。これらの凹部に各ミニマル装置に共通の装置間搬送ユニットを搭載して、搬送容器を自動的に搬送する装置間搬送システムを製造ラインと一体に構成するようにしている（例えば、特許文献１、２参照）。 In the above-mentioned minimal fab, a production line is made up of an array of minimal equipment, which are small semiconductor manufacturing devices that handle each step of device manufacturing. Each minimal equipment has the same dimensions and shape, and each has a recess formed on its front. Inter-equipment transport units common to each minimal equipment are mounted in these recesses, and an inter-equipment transport system that automatically transports transport containers is configured as an integral part of the production line (see, for example, Patent Documents 1 and 2).
特許第６３７３４０５号公報Patent No. 6373405 特許第６４２２３１７号公報Japanese Patent No. 6422317
　したがって、特許文献１、２に記載された装置間搬送ユニットを用いれば、複数のミニマル装置を配列して製造ラインと搬送ラインを同時に一体構成し、ミニマル装置間の搬送容器を自動搬送することができる。 Therefore, by using the inter-apparatus transport unit described in Patent Documents 1 and 2, multiple minimal devices can be arranged to simultaneously form an integrated manufacturing line and transport line, and transport containers can be automatically transported between the minimal devices.
　ところで、上記ミニマルファブでは、上記搬送ラインの始点に処理前の処理基板としての小口径ウェハを収納した搬送容器を供給する動作、及び上記搬送ラインの終点から処理後の小口径ウェハを収納した搬送容器を回収する動作は自動化されておらず、操作者が手作業で搬送容器を回収している。そのため、ミニマルファブにおける省力化が不十分であって、夜間等に無人運転ができないという問題があった。 In the above-mentioned minimal fab, the operation of supplying a transport container containing small-diameter wafers as processing substrates before processing to the start point of the above-mentioned transfer line, and the operation of recovering the transport container containing small-diameter wafers after processing from the end point of the above-mentioned transfer line are not automated, and operators manually recover the transport containers. As a result, there is a problem that labor saving in the minimal fab is insufficient and unmanned operation cannot be performed at night, etc.
　本発明の課題は、装置間搬送ユニットへの搬送容器の供給及び回収を自動化し、装置の運用に要する作業量及び操作者を削減するとともに、無人自動運転を可能とした搬送容器受渡し受取り装置を提供することにある。 The objective of the present invention is to provide a transport container handover and receiving device that automates the supply and collection of transport containers to the inter-equipment transport unit, reduces the workload and operators required to operate the device, and enables unmanned automatic operation.
　請求項１の発明は、少なくとも１台の半導体製造装置の側部に設置され、内部に基板が収納された搬送容器を受け渡し及び受け取る搬送容器受渡し受取り装置であって、前記搬送容器を上下方向に複数積重ねる収容部と、前記収容部の下方に最も下方に位置する前記搬送容器を取り出し可能で、かつ前記収容部の下方から加工済の基板が収納された搬送容器を取り入れ可能な取出し取入れ手段と、前記半導体製造装置の搬送手段による前記搬送容器を受け渡し及び受け取り位置と、前記収容部の下方の所定の位置との間で前記搬送容器を移動させる移動手段と、を備え、前記半導体製造装置に受け渡す場合、前記取出し取入れ手段によって前記最も下方に位置する搬送容器を取出し、前記半導体製造装置の搬送手段によって受け渡される位置まで前記移動手段で移動させる一方、前記半導体製造装置から受け取る場合、前記搬送手段から前記加工済の基板が収納された搬送容器を受け取り、前記収容部の下方の所定の位置まで前記移動手段で移動させて前記加工済の基板が収納された搬送容器を前記取出し取入れ手段によって前記収容部の下方に収容するように構成されていることを特徴とする。 The invention of claim 1 is a transport container delivery and reception device that is installed on the side of at least one semiconductor manufacturing device and delivers and receives a transport container containing a substrate therein, the device comprising: a storage section that stacks the transport containers vertically; a take-out/take-in means that can take out the transport container located at the lowest position below the storage section and take in a transport container containing a processed substrate from below the storage section; and a moving means that moves the transport container between a delivery and reception position by the transport means of the semiconductor manufacturing device and a predetermined position below the storage section. When delivering to the semiconductor manufacturing device, the take-out/take-in means takes out the transport container located at the lowest position and moves it by the moving means to a position where it is delivered by the transport means of the semiconductor manufacturing device, while when receiving from the semiconductor manufacturing device, the transport container containing the processed substrate is received from the transport means and moved by the moving means to a predetermined position below the storage section, and the transport container containing the processed substrate is stored below the storage section by the take-out/take-in means.
　請求項２の発明は、請求項１に記載の構成に加え、前記移動手段は、前記搬送手段によって受け渡され及び受け取られる位置と、前記収容部の下方位置との間で水平往復移動させる水平駆動部を備えていることを特徴とする。 The invention of claim 2 is characterized in that, in addition to the configuration of claim 1, the moving means includes a horizontal drive unit that moves the moving means back and forth horizontally between a position where the moving means delivers and receives the product and a position below the storage unit.
　請求項３の発明は、請求項１に記載の構成に加え、前記取出し取入れ手段は、前記収容部内に収容された前記搬送容器を保持することが可能な開閉可能なクランプ機構と、前記収容部に対して受け渡す前記搬送容器及び受け取る前記搬送容器を載置する容器載置台と、前記容器載置台を前記収容部内の最も下方に位置する前記搬送容器を支持可能な上昇位置と、製造装置の搬送手段によって受け渡され及び受け取り可能な下降位置との間で上下往復移動させる垂直駆動部と、を有し、前記半導体製造装置に受け渡す場合、前記容器載置台で前記収容部内の最も下方に位置する前記搬送容器を支持し、前記クランプ機構を開いて前記収容部内の最も下方に位置する前記搬送容器の一つ分だけ前記容器載置台を下降させ、前記収容部内の最も下方に位置する前記搬送容器の直上に位置する搬送容器を、前記クランプ機構を閉じて保持し、前記収容部内の最も下方に位置する前記搬送容器を前記搬送手段によって受け渡される位置まで移動させる一方、前記半導体製造装置から受け取る場合、前記容器載置台で前記収容部内の最も下方に位置する前記搬送容器の下方に加工済の基板が収納された搬送容器を重ねるように支持し、前記クランプ機構を開いて前記収容部内の前記搬送容器の一つ分だけ前記容器載置台を上昇させ、前記収容部内の最も下方に位置するようになった前記加工済の基板が収納された搬送容器を、前記クランプ機構を閉じて保持し、前記容器載置台を前記搬送手段によって受け渡される位置まで移動させるように構成されていることを特徴とする。 The invention of claim 3, in addition to the configuration of claim 1, has an openable and closable clamp mechanism capable of holding the transport container accommodated in the storage section, a container mounting table for mounting the transport container to be handed over to the storage section and the transport container to be received, and a vertical drive unit for vertically reciprocating the container mounting table between an elevated position for supporting the transport container located at the lowest position in the storage section and a lowered position for receiving and being handed over by the transport means of the manufacturing equipment, and when transferring the transport container to the semiconductor manufacturing equipment, the container mounting table supports the transport container located at the lowest position in the storage section, opens the clamp mechanism, lowers the container mounting table by the amount of the transport container located at the lowest position in the storage section, and moves the transport container to the storage section. The clamp mechanism is closed to hold the transport container located directly above the transport container located at the lowest position in the storage unit, and the transport container located at the lowest position in the storage unit is moved to a position where it is transferred by the transport means. On the other hand, when receiving from the semiconductor manufacturing device, the container mounting table supports the transport container containing the processed substrate so that it is stacked below the transport container located at the lowest position in the storage unit, the clamp mechanism is opened to raise the container mounting table by the length of one of the transport containers in the storage unit, the transport container containing the processed substrate that is now located at the lowest position in the storage unit is held by closing the clamp mechanism, and the container mounting table is moved to a position where it is transferred by the transport means.
　請求項４の発明は、請求項１乃至３の何れか一項に記載の構成に加え、前記半導体製造装置の左右の側面部に設置可能に構成したことを特徴とする。 The invention of claim 4 is characterized in that, in addition to the configuration described in any one of claims 1 to 3, it is configured to be installable on the left and right side portions of the semiconductor manufacturing device.
　請求項１の発明によれば、内部に基板を収納した搬送容器の搬送手段への供給及び回収を自動化し、装置の運用に要する作業量及び操作者を削減するとともに、無人自動運転を可能にすることができる。 According to the invention of claim 1, the supply and recovery of the transport container containing the substrates to the transport means can be automated, reducing the workload and operators required to operate the device and enabling unmanned automatic operation.
　請求項２の発明によれば、搬送手段によって受け渡され及び受け取られる位置と、収容部の下方位置との間で水平往復移動させることにより、構造を簡素化し、収容部に対して搬送容器の受け渡し及び受け取り操作が一台で容易に共有化することが可能となる。 According to the invention of claim 2, the structure is simplified by horizontally reciprocating between the position where the transport container is handed over and received by the transport means and the position below the storage section, and it is possible to easily share the operations of handing over and receiving the transport container to the storage section with a single unit.
　請求項３の発明によれば、半導体製造装置に搬送容器を受け渡す場合、容器載置台で収容部内の最も下方に位置する搬送容器を支持し、クランプ機構を開いて収容部内の最も下方に位置する搬送容器の一つ分だけ容器載置台を下降させ、収容部内の最も下方に位置する搬送容器の直上に位置する搬送容器を、クランプ機構を閉じて保持し、収容部内の最も下方に位置する搬送容器を搬送手段によって受け渡される位置まで移動させる一方、半導体製造装置から搬送容器を受け取る場合、容器載置台で収容部内の最も下方に位置する搬送容器の下方に加工済の基板が収納された搬送容器を重ねるように支持し、クランプ機構を開いて収容部内の搬送容器の一つ分だけ容器載置台を上昇させ、収容部内の最も下方に位置するようになった加工済の基板が収納された搬送容器を、クランプ機構を閉じて保持し、容器載置台を搬送手段によって受け渡される位置まで移動させることにより、内部に基板を収納した搬送容器の搬送手段への供給及び回収を自動化し、装置の運用に要する作業量及び操作者を削減するとともに、無人自動運転を可能にすることができる。 　According to the invention of claim 3, when a transport container is delivered to the semiconductor manufacturing equipment, the container mounting table supports the transport container located at the lowest position in the storage section, the clamping mechanism is opened to lower the container mounting table by the length of the transport container located at the lowest position in the storage section, the transport container located directly above the transport container located at the lowest position in the storage section is held by closing the clamping mechanism, and the transport container located at the lowest position in the storage section is moved to a position where it is delivered by the transport means. On the other hand, when a transport container is received from the semiconductor manufacturing equipment, the container mounting table supports the transport container containing the processed substrate so that it is stacked below the transport container located at the lowest position in the storage section, the clamping mechanism is opened to raise the container mounting table by the length of the transport container located at the lowest position in the storage section, the transport container containing the processed substrate that is now located at the lowest position in the storage section is held by closing the clamping mechanism, and the container mounting table is moved to a position where it is delivered by the transport means. This automates the supply and recovery of the transport container containing the substrate to and from the transport means, reduces the amount of work and operators required for operating the equipment, and enables unmanned automatic operation.
　請求項４の発明によれば、半導体製造装置の左右の側面部に設置可能に構成したことにより、装置の汎用性を著しく高めることができる。 According to the invention of claim 4, the device can be installed on the left and right side of the semiconductor manufacturing device, significantly increasing the versatility of the device.
本発明の実施の形態１に係る搬送容器受渡し受取り装置を適用した小型の半導体製造装置の生産ラインを示す図であって、（ａ）はその正面図、（ｂ）はその左側面図である。1A and 1B are diagrams showing a production line for small-sized semiconductor manufacturing equipment to which a transfer container delivery and receiving device according to a first embodiment of the present invention is applied, in which FIG. 本発明の実施の形態１に係る搬送容器受渡し受取り装置を小型の半導体製造装置の右側面に設置した状態の内部構造を示す斜視図である。1 is a perspective view showing an internal structure of a transfer container delivery and receiving device according to a first embodiment of the present invention, when the transfer container delivery and receiving device is installed on the right side of a small-sized semiconductor manufacturing device; 図２の搬送容器受渡し受取り装置において収容部にウェハ搬送容器を複数積重ねた状態を示す斜視図である。3 is a perspective view showing a state in which a plurality of wafer transport containers are stacked in a container receiving section in the transport container delivery and receiving device of FIG. 2. FIG. 本発明の実施の形態１に係る搬送容器受渡し受取り装置においてウェハ搬送容器を受け渡す場合に水平駆動部を駆動させた状態を示す斜視図である。1 is a perspective view showing a state in which a horizontal drive unit is driven when a wafer transport container is transferred in the transport container transfer and receiving apparatus according to the first embodiment of the present invention; FIG. 図４の状態から垂直駆動部の駆動を開始した状態を後方側から見た斜視図である。5 is a perspective view showing a state in which driving of the vertical driving unit is started from the state shown in FIG. 4, as seen from the rear side. 図５の状態から垂直駆動部をさらに駆動させた状態を後方側から見た斜視図である。6 is a perspective view of the state in which the vertical drive unit is further driven from the state of FIG. 5, as viewed from the rear side. 図６の状態からクランプ機構を開いた状態を示す斜視図である。FIG. 7 is a perspective view showing a state in which the clamp mechanism is opened from the state shown in FIG. 6 . 図７の状態から収容部内の最も下方に位置するウェハ搬送容器の直上に位置するウェハ搬送容器をクランプ機構により保持する状態を示す斜視図である。8 is a perspective view showing a state in which a wafer transport pod located immediately above a wafer transport pod located at the lowest position in the accommodation section is held by a clamp mechanism, following the state shown in FIG. 7 . 図８の状態から垂直駆動部を駆動させて容器載置台を下降させた状態を示す斜視図である。9 is a perspective view showing a state in which the vertical drive unit is driven to lower the container mounting table from the state shown in FIG. 8 . 図９の状態から水平駆動部を駆動させてウェハ搬送容器を搬送手段によって受け渡される位置まで移動させた状態を示す斜視図である。10 is a perspective view showing a state in which the horizontal drive unit is driven from the state shown in FIG. 9 to move the wafer transport container to a position where it is handed over by the transport means. FIG. 本発明の実施の形態２に係る搬送容器受渡し受取り装置を適用したミニマル装置の生産ラインを示す正面図である。11 is a front view showing a production line of a minimalist device to which a transfer container delivery and receiving device according to a second embodiment of the present invention is applied. FIG.
［発明の実施の形態１］
　以下、本発明の各実施の形態では、搬送容器受渡し受取り装置を小型の半導体製造装置に適用した例について説明する。 [First embodiment of the invention]
In the following, in each embodiment of the present invention, an example in which a transfer container delivery and receiving device is applied to a small-sized semiconductor manufacturing device will be described.
　図１は、本発明の実施の形態１に係る搬送容器受渡し受取り装置を適用した小型の半導体製造装置の生産ラインを示す図であって、（ａ）はその正面図、（ｂ）はその左側面図である。 FIG. 1 shows a production line for small-sized semiconductor manufacturing equipment that uses a transfer container delivery and receiving device according to the first embodiment of the present invention, where (a) is a front view and (b) is a left side view.
　図１（ａ）に示すように、本実施の形態を適用した半導体の生産ライン１は、３台の小型の半導体製造装置（以下、ミニマル装置という。）２が床面３上に一直線上に並設して構成されている。これら３台のミニマル装置２（右側のミニマル装置２Ａ、中央のミニマル装置２Ｂ、左側のミニマル装置２Ｃ）は、互いに所定間隔（例えば、６ｍｍ）の隙間を挟んで横向きに対向している。 As shown in FIG. 1(a), a semiconductor production line 1 to which this embodiment is applied is configured with three small semiconductor manufacturing devices (hereinafter referred to as minimal devices) 2 arranged side by side in a straight line on a floor surface 3. These three minimal devices 2 (minimal device 2A on the right, minimal device 2B in the center, and minimal device 2C on the left) face each other horizontally with a predetermined gap (for example, 6 mm) between them.
　各ミニマル装置２Ａ，２Ｂ，２Ｃは、それぞれ所定の大きさ（例えば、幅３０ｃｍ、奥行き４５ｃｍ、高さ１４４ｃｍ）の略直方体状の筐体４を有しており、その筐体４の内部には、処理室５及び装置前室６が配設されている。 Each of the minimal devices 2A, 2B, and 2C has a roughly rectangular parallelepiped housing 4 of a given size (e.g., width 30 cm, depth 45 cm, height 144 cm), and inside the housing 4, a processing chamber 5 and an antechamber 6 are arranged.
　また、筐体４の前部には、図１（ａ），（ｂ）に示すように、凹部７が装置前室６の上方に形成されている。この凹部７は、前面側及び側面側が開放され、前面から奥行きに向けて凹んで形成されている。この凹部７には、小口径（例えば、直径１２．５ｍｍ）の半導体ウェハ（基板）が密閉状態で収納されたウェハ搬送容器（搬送容器）１０を載置するための容器載置台９が設置されているとともに、このウェハ搬送容器１０を一時的に保持する仮置きトレイ８が設置されている。 Also, as shown in Figures 1(a) and (b), a recess 7 is formed above the apparatus front chamber 6 at the front of the housing 4. The front and side sides of this recess 7 are open, and it is recessed from the front toward the depth. A container mounting table 9 is installed in this recess 7 for mounting a wafer transport container (transport container) 10 that contains small-diameter (e.g., 12.5 mm diameter) semiconductor wafers (substrates) in a sealed state, and a temporary tray 8 for temporarily holding this wafer transport container 10 is also installed.
　ここで、仮置きトレイ８は、図１（ａ）に示すように、ミニマル装置２が複数並設されたときに、任意のミニマル装置２の容器載置台９と、その隣のミニマル装置２の容器載置台９との間に位置するように設けられている。各ミニマル装置２において、容器載置台９と仮置きトレイ８との位置関係（筐体４の幅方向、奥行き方向、及び高さ方向）は、高精度に定められている。また、ミニマル装置２が複数並設されたときには、これら複数のミニマル装置２の並設方向（図１（ａ）左右方向（Ｘ方向））に延伸する容器搬送経路１１が複数のミニマル装置２の凹部７を貫くように形成される。 Here, as shown in FIG. 1(a), the temporary placement tray 8 is arranged so as to be positioned between the container placement stand 9 of any minimal device 2 and the container placement stand 9 of the adjacent minimal device 2 when multiple minimal devices 2 are arranged side by side. In each minimal device 2, the positional relationship between the container placement stand 9 and the temporary placement tray 8 (in the width direction, depth direction, and height direction of the housing 4) is determined with high precision. In addition, when multiple minimal devices 2 are arranged side by side, a container transport path 11 extending in the direction in which the multiple minimal devices 2 are arranged side by side (the left-right direction (X direction) in FIG. 1(a)) is formed so as to pass through the recesses 7 of the multiple minimal devices 2.
　さらに、筐体４には、図１（ａ），（ｂ）に示すように、３台のミニマル装置２間でウェハ搬送容器１０を搬送するための搬送手段としての装置間搬送ユニット１２が図示しないＺ軸モータによって昇降自在に設けられている。この装置間搬送ユニット１２は、そのミニマル装置２の仮置きトレイ８と容器載置台９との間でウェハ搬送容器１０を往復搬送することができるとともに、そのミニマル装置２の容器載置台９と、その隣のミニマル装置２の仮置きトレイ８との間でウェハ搬送容器１０を往復搬送することができるように構成されている。 Furthermore, as shown in Figs. 1(a) and (b), the housing 4 is provided with an inter-apparatus transfer unit 12 as a transfer means for transferring the wafer transport container 10 between the three minimal apparatuses 2, which can be raised and lowered by a Z-axis motor (not shown). This inter-apparatus transfer unit 12 is configured to transfer the wafer transport container 10 back and forth between the temporary placement tray 8 and container placement stand 9 of the minimal apparatus 2, and to transfer the wafer transport container 10 back and forth between the container placement stand 9 of the minimal apparatus 2 and the temporary placement tray 8 of the adjacent minimal apparatus 2.
　したがって、３台のミニマル装置２が装置間搬送ユニット１２をそれぞれ搭載することにより、容器搬送経路１１が構成されるとともに、この装置間搬送ユニット１２は、後述する搬送容器受渡し受取り装置２０Ａ，２０Ｂとの間でウェハ搬送容器１０を受け渡したり、あるいは受け取ったりすることができるように構成されている。 Therefore, the three minimal devices 2 are each equipped with an inter-apparatus transport unit 12, forming a container transport path 11, and this inter-apparatus transport unit 12 is configured to be able to transfer and receive wafer transport containers 10 between the transport container transfer and receiving devices 20A and 20B described below.
　そして、図１（ａ）では、ミニマル装置２を配列して構成した生産ライン１に搬送容器受渡し受取り装置(ローダー)２０Ａと、搬送容器受渡し受取り装置(アンローダー)２０Ｂを組み合わせた例を示している。図１（ａ）に示すように、容器搬送経路１１の始点となる右側のミニマル装置２Ａの右側面に搬送容器受渡し受取り装置２０Ａが設置される一方、容器搬送経路１１の終点となる左側のミニマル装置２Ｃの左側面に搬送容器受渡し受取り装置２０Ｂが設置されている。 FIG. 1(a) shows an example in which a production line 1 configured with an array of minimal devices 2 is combined with a transport container transfer and receiving device (loader) 20A and a transport container transfer and receiving device (unloader) 20B. As shown in FIG. 1(a), the transport container transfer and receiving device 20A is installed on the right side of the right minimal device 2A, which is the start point of the container transport path 11, while the transport container transfer and receiving device 20B is installed on the left side of the left minimal device 2C, which is the end point of the container transport path 11.
　ここで、本実施の形態では、搬送容器受渡し受取り装置２０Ａがミニマル装置２Ａの右側面に設置され、ミニマル装置２Ａにウェハ搬送容器１０を受け渡すように構成される一方、搬送容器受渡し受取り装置２０Ｂがミニマル装置２Ｃの左側面に設置され、ミニマル装置２Ｃからウェハ搬送容器１０を受け取るように構成されている。 In this embodiment, the transport container transfer device 20A is installed on the right side of the minimal device 2A and is configured to transfer the wafer transport container 10 to the minimal device 2A, while the transport container transfer device 20B is installed on the left side of the minimal device 2C and is configured to receive the wafer transport container 10 from the minimal device 2C.
　また、搬送容器受渡し受取り装置２０Ａ及び搬送容器受渡し受取り装置２０Ｂは、各ミニマル装置２Ａ，２Ｂ，２Ｃの形状寸法が同一であるため、各ミニマル装置２Ａ，２Ｂ，２Ｃの処理内容に拘らず、全てのミニマル装置２に設置することができる。 In addition, since the shape and dimensions of the transport container transfer device 20A and the transport container transfer device 20B are the same for each minimal device 2A, 2B, 2C, they can be installed in all minimal devices 2 regardless of the processing content of each minimal device 2A, 2B, 2C.
　さらに、搬送容器受渡し受取り装置２０Ａ及び搬送容器受渡し受取り装置２０Ｂは、それぞれ内部構造が同一であるため、ウェハ搬送容器１０の受け渡しと受け取りが逆の動作になるように使用することができる。 Furthermore, since the transport container transfer/receiving device 20A and the transport container transfer/receiving device 20B have the same internal structure, they can be used to transfer and receive the wafer transport container 10 in the reverse order.
　次に、本実施の形態の搬送容器受渡し受取り装置２０Ａ，２０Ｂの構成について説明する。 Next, we will explain the configuration of the transport container delivery and receiving devices 20A and 20B in this embodiment.
　図２は、本発明の実施の形態１に係る搬送容器受渡し受取り装置２０Ａをミニマル装置２Ａの右側面に設置した状態の内部構造を示す斜視図である。図３は、図２の搬送容器受渡し受取り装置２０Ａにおいて収容部２３にウェハ搬送容器１０を複数積重ねた状態を示す斜視図である。 FIG. 2 is a perspective view showing the internal structure of a transport container transfer/receiving device 20A according to the first embodiment of the present invention installed on the right side of a minimal device 2A. FIG. 3 is a perspective view showing a state in which multiple wafer transport containers 10 are stacked in the storage section 23 of the transport container transfer/receiving device 20A of FIG. 2.
　図２に示すように、ミニマル装置２Ａの右側面に搬送容器受渡し受取り装置２０Ａを設置する場合には、ミニマル装置２Ａの右側面にあらかじめ取り付けられている図示しない既存のカバーを取り外した後に、搬送容器受渡し受取り装置２０Ａを取り付けるための取付カバー２１が設けられる。 As shown in FIG. 2, when installing the transport container transfer device 20A on the right side of the minimal device 2A, an existing cover (not shown) that is attached in advance to the right side of the minimal device 2A is removed, and then an attachment cover 21 for attaching the transport container transfer device 20A is provided.
　搬送容器受渡し受取り装置２０Ａは、図２に示すように取付カバー２１にボルト等の締結手段を用いて取付フレーム２２が固定されている。この取付フレーム２２の凹部７側には、収容部２３が設置されている。この収容部２３は、図３に示すように内部に加工前の半導体ウェハを密閉状態で収納したウェハ搬送容器１０が上下方向に複数積重ねられるように収容される。 As shown in FIG. 2, the transport container delivery and receiving device 20A has a mounting frame 22 fixed to a mounting cover 21 using fastening means such as bolts. A storage section 23 is installed on the recess 7 side of the mounting frame 22. As shown in FIG. 3, this storage section 23 stores multiple wafer transport containers 10, each of which contains unprocessed semiconductor wafers stored in a sealed state, stacked vertically.
　これら収容部２３に複数積重ねられたウェハ搬送容器１０は、取出し取入れ手段としての取出し取入れ装置１５よって収容部２３の下方から最も下方に位置するウェハ搬送容器１０を取り出し可能に構成されている。また、取出し取入れ装置１５は、収容部２３の下方から加工済の半導体ウェハ（基板）が収納されたウェハ搬送容器１０を取り入れ可能に構成されている。 The wafer transport containers 10 stacked in these storage sections 23 are configured so that the lowest wafer transport container 10 can be removed from below the storage section 23 by an removal/intake device 15 serving as a removal/intake means. The removal/intake device 15 is also configured so that it can take in a wafer transport container 10 containing processed semiconductor wafers (substrates) from below the storage section 23.
　図２に示すように、移動手段としての水平駆動部３０は、装置間搬送ユニット１２によって受け渡され及び受け取られる位置と、収容部２３の下方の所定位置との間でウェハ搬送容器１０を水平往復移動させるように構成されている。 As shown in FIG. 2, the horizontal drive unit 30 as a moving means is configured to horizontally reciprocate the wafer transport container 10 between a position where the wafer is handed over and received by the inter-apparatus transport unit 12 and a predetermined position below the storage unit 23.
　取出し取入れ装置１５は、クランプ機構２４を有し、このクランプ機構２４は、収容部２３内に収容されたウェハ搬送容器１０を保持することができるように開閉可能に構成されている。また、取出し取入れ装置１５は、容器載置台４０を有し、この容器載置台４０は、収容部２３に対して受け渡すウェハ搬送容器１０及び受け取るウェハ搬送容器１０を載置するものである。さらに、取出し取入れ装置１５は、垂直駆動部５０を有し、この垂直駆動部５０は、容器載置台４０を収容部２３内の最も下方に位置するウェハ搬送容器１０を支持可能な上昇位置と、ミニマル装置２の装置間搬送ユニット１２によって受け渡され及び受け取り可能な下降位置との間で上下往復移動可能に構成されている。なお、本実施の形態において垂直駆動部５０は、エアシリンダによって上下往復移動させる例について説明するが、電動でも上下往復移動可能である。 The take-out/take-in device 15 has a clamp mechanism 24, which is configured to be openable and closable so as to hold the wafer transport container 10 housed in the storage section 23. The take-out/take-in device 15 also has a container mounting table 40, which mounts the wafer transport container 10 to be delivered to the storage section 23 and the wafer transport container 10 to be received. The take-out/take-in device 15 also has a vertical drive unit 50, which is configured to move the container mounting table 40 up and down between an elevated position where the wafer transport container 10 located at the lowest position in the storage section 23 can be supported, and a lowered position where the wafer transport container 10 can be delivered and received by the inter-device transport unit 12 of the minimal device 2. In this embodiment, the vertical drive unit 50 is described as being moved up and down by an air cylinder, but it can also be moved up and down electrically.
　クランプ機構２４は、収容部２３の下端部に対応した位置において取付カバー２１に設置されている。このクランプ機構２４は、図２及び図３に示すように収容部２３内に収容されたウェハ搬送容器１０を掴んで保持するクランプ部２５と、このクランプ部２５を開閉駆動するクランプ駆動部２６とを備えている。 The clamp mechanism 24 is installed on the mounting cover 21 at a position corresponding to the lower end of the storage section 23. As shown in Figures 2 and 3, this clamp mechanism 24 has a clamp section 25 that grips and holds the wafer transport container 10 contained in the storage section 23, and a clamp drive section 26 that drives the clamp section 25 to open and close.
　取付カバー２１及び取付フレーム２２内の背面側には、水平駆動部３０が設置されている。この水平駆動部３０には、連結機構３３を介して容器載置台４０及び垂直駆動部５０が支持されている。 The horizontal drive unit 30 is installed on the rear side of the mounting cover 21 and mounting frame 22. The container mounting table 40 and the vertical drive unit 50 are supported on the horizontal drive unit 30 via a connecting mechanism 33.
　水平駆動部３０は、前後駆動エアシリンダ３１を有し、この前後駆動エアシリンダ３１の３本のシリンダロッド３２の先端部には、上記連結機構３３が固定されている。この連結機構３３には、上記のように垂直駆動部５０が取り付けられている。この垂直駆動部５０は、連結機構３３の垂直連結板３４の長手方向に沿って取り付けられている。 The horizontal drive unit 30 has a front-rear drive air cylinder 31, and the above-mentioned connecting mechanism 33 is fixed to the tip of the three cylinder rods 32 of this front-rear drive air cylinder 31. As described above, the vertical drive unit 50 is attached to this connecting mechanism 33. This vertical drive unit 50 is attached along the longitudinal direction of the vertical connecting plate 34 of the connecting mechanism 33.
　連結機構３３は、図４～図６に示すように３本のシリンダロッド３２のそれぞれの先端部が固定される垂直連結板３４と、この垂直連結板３４の上端部にミニマル装置２Ａの前面側に水平方向に延びるように連結された水平連結板３５とを有している。 The connecting mechanism 33 has a vertical connecting plate 34 to which the tips of the three cylinder rods 32 are fixed, as shown in Figures 4 to 6, and a horizontal connecting plate 35 that is connected to the upper end of the vertical connecting plate 34 so as to extend horizontally on the front side of the minimal device 2A.
　垂直駆動部５０は、上下駆動エアシリンダ５１を有する。この上下駆動エアシリンダ５１は、容器載置台４０を長いストロークで上下往復移動させるロングエアシリンダ５２と、このロングエアシリンダ５２よりも容器載置台４０を短いストロークで上下往復移動させるショートエアシリンダ５３とが同軸状に連結され、これらロングエアシリンダ５２及びショートエアシリンダ５３によって上下往復移動されるシリンダロッド５４を備えている。 The vertical drive unit 50 has a vertical drive air cylinder 51. This vertical drive air cylinder 51 is coaxially connected to a long air cylinder 52 that moves the container mounting table 40 up and down with a long stroke, and a short air cylinder 53 that moves the container mounting table 40 up and down with a shorter stroke than the long air cylinder 52, and is equipped with a cylinder rod 54 that is moved up and down by the long air cylinder 52 and the short air cylinder 53.
　ロングエアシリンダ５２のストロークにショートエアシリンダ５３のストロークを加えたストロークは、容器載置台４０を収容部２３内の最も下方に位置するウェハ搬送容器１０を支持可能な上昇位置と、ミニマル装置２Ａの装置間搬送ユニット１２によって受け渡される下降位置との間を上下往復移動させるストロークに設定されている。ここで、ショートエアシリンダ５３のストロークは、収容部２３内に位置するウェハ搬送容器１０の１個の厚さ分を上下往復移動させるストロークに設定されている。 The stroke of the long air cylinder 52 plus the stroke of the short air cylinder 53 is set to a stroke that moves the container mounting table 40 up and down between an elevated position where it can support the wafer transport container 10 located at the lowest position in the accommodation section 23, and a lowered position where it is handed over by the inter-apparatus transport unit 12 of the minimal apparatus 2A. Here, the stroke of the short air cylinder 53 is set to a stroke that moves it up and down the thickness of one wafer transport container 10 located in the accommodation section 23.
　垂直駆動部５０は、上部水平部３７を有し、この上部水平部３７には、シリンダロッド５４の上端部が水平連結板３５に形成された挿通孔３９を挿通して固定されている。この上部水平部３７の両端には、２本の上下動ロッド３６が水平連結板３５を貫通するように連結されている。２本の上下動ロッド３６の一方は、下部水平部３８の一端に連結され、この下部水平部３８の他端に上下動ロッド４１の下端部が連結され、この上下動ロッド４１の上端部に容器載置台４０が連結されている。上下動ロッド４１は、水平連結板３５の挿通孔を上下往復移動可能に挿通している。 The vertical drive unit 50 has an upper horizontal section 37, to which the upper end of a cylinder rod 54 is fixed by inserting it through an insertion hole 39 formed in the horizontal connecting plate 35. Two vertical movement rods 36 are connected to both ends of the upper horizontal section 37 so as to pass through the horizontal connecting plate 35. One of the two vertical movement rods 36 is connected to one end of a lower horizontal section 38, and the lower end of a vertical movement rod 41 is connected to the other end of the lower horizontal section 38, and the container mounting table 40 is connected to the upper end of the vertical movement rod 41. The vertical movement rod 41 is inserted through the insertion hole of the horizontal connecting plate 35 so as to be able to move back and forth up and down.
　これにより、前後駆動エアシリンダ３１を駆動することにより、容器載置台４０及び垂直駆動部５０が一体で水平往復移動可能となる。したがって、容器載置台４０は、ウェハ搬送容器１０を受け渡す位置と収容部２３の直下位置との間で水平往復移動する。ここで、容器載置台４０は、収容部２３からウェハ搬送容器１０を取り出してミニマル装置２Ａに受け渡すためにウェハ搬送容器１０を載置するものである。 As a result, by driving the front-rear drive air cylinder 31, the container mounting table 40 and the vertical drive unit 50 can move horizontally back and forth as one unit. Therefore, the container mounting table 40 moves horizontally back and forth between the position where the wafer transport container 10 is transferred and the position directly below the storage unit 23. Here, the container mounting table 40 is used to place the wafer transport container 10 so that the wafer transport container 10 can be removed from the storage unit 23 and transferred to the minimal device 2A.
　また、上下駆動エアシリンダ５１を駆動させると、シリンダロッド５４が上昇してその上端部が上部水平部３７を上昇させることで、２本の上下動ロッド３６が上昇して下部水平部３８が上昇する。これにより、下部水平部３８に上下動ロッド４１の下端部が固定された容器載置台４０が上昇することとなる。 In addition, when the vertical drive air cylinder 51 is driven, the cylinder rod 54 rises and its upper end raises the upper horizontal section 37, which in turn raises the two vertical movement rods 36 and raises the lower horizontal section 38. As a result, the container mounting table 40, whose lower end portions of the vertical movement rods 41 are fixed to the lower horizontal section 38, rises.
　さらに、上下駆動エアシリンダ５１を駆動させてシリンダロッド５４を下降させると、その上端部が上部水平部３７を下降させるので、上下動ロッド３６が下降して下部水平部３８が下降する。これにより、下部水平部３８に上下動ロッド４１の下端が固定された容器載置台４０が下降する。このようにして上下駆動エアシリンダ５１は、容器載置台４０を上下往復移動可能に構成している。 Furthermore, when the vertical driving air cylinder 51 is driven to lower the cylinder rod 54, its upper end lowers the upper horizontal section 37, causing the vertical movement rod 36 to lower and the lower horizontal section 38 to lower. This causes the container mounting table 40, the lower end of which is fixed to the lower horizontal section 38, to lower. In this way, the vertical driving air cylinder 51 is configured to be able to move the container mounting table 40 back and forth up and down.
　さらに、容器載置台４０の近傍には、容器載置台４０に載置されたウェハ搬送容器１０を検出するための容器検出センサ６０が設置されている。収容部２３の上下方向の上端部近傍には、収容部２３に積載されたウェハ搬送容器１０が規定数の例えば２０個を充足したとき、その旨を検出するための容器数充足センサ６１が設置されている。また、取出し取入れ装置１５の近傍には、収容部２３内に収容されたウェハ搬送容器１０を検出するための容器検出センサ６２が設置されている。 Furthermore, a container detection sensor 60 is installed near the container mounting table 40 to detect the wafer transport containers 10 placed on the container mounting table 40. A container number sufficiency sensor 61 is installed near the top end of the storage section 23 in the vertical direction to detect when the wafer transport containers 10 loaded in the storage section 23 reach a specified number, for example 20. Furthermore, a container detection sensor 62 is installed near the take-out/take-out device 15 to detect the wafer transport containers 10 stored in the storage section 23.
　そして、本実施の形態１の搬送容器受渡し受取り装置２０Ａ，２０Ｂは、ウェハ搬送容器１０の受け渡し動作と受け取り動作が例えば図示しないスイッチによって切替可能に構成されている。 The transport container transfer/ receiving devices 20A, 20B of this embodiment 1 are configured so that the transfer operation and the receiving operation of the wafer transport container 10 can be switched by, for example, a switch not shown.
　次に、本実施の形態１の搬送容器受渡し受取り装置２０Ａを用いて内部に加工前の半導体ウェハが収納されたウェハ搬送容器１０をミニマル装置２Ａに受け渡す場合の動作について説明する。 Next, we will explain the operation when a wafer transport container 10 containing unprocessed semiconductor wafers is transferred to a minimal device 2A using the transport container transfer device 20A of this embodiment 1.
　まず、収容部２３におけるクランプ機構２４上にウェハ搬送容器１０を多数積載した後、図３及び図４に示すように水平駆動部３０の前後駆動エアシリンダ３１を駆動させ、そのシリンダロッド３２を後退させることで、容器載置台４０を収容部２３に収容されているウェハ搬送容器１０の直下になる位置まで水平移動させる。 First, a number of wafer transport containers 10 are loaded onto the clamp mechanism 24 in the storage section 23, and then, as shown in Figures 3 and 4, the front-rear drive air cylinder 31 of the horizontal drive section 30 is driven to retract the cylinder rod 32, thereby horizontally moving the container mounting table 40 to a position directly below the wafer transport containers 10 stored in the storage section 23.
　そして、図５及び図６に示すように、垂直駆動部５０の上下駆動エアシリンダ５１を駆動してロングエアシリンダ５２のストロークにショートエアシリンダ５３のストロークを加えた両ストローク分、容器載置台４０を上昇させて容器載置台４０で収容部２３内の最も下方に位置するウェハ搬送容器１０を支持する。 Then, as shown in Figures 5 and 6, the up-down driving air cylinder 51 of the vertical driving unit 50 is driven to raise the container mounting table 40 by the stroke of the long air cylinder 52 plus the stroke of the short air cylinder 53, and the container mounting table 40 supports the wafer transport container 10 located at the lowest position within the storage unit 23.
　次いで、図７に示すように、クランプ機構２４を作動させてクランプ部２５を開き、垂直駆動部５０の上下駆動エアシリンダ５１のショートエアシリンダ５３を駆動させて収容部２３内の最も下方に位置するウェハ搬送容器１０の１個の厚さ分だけ、すなわちショートエアシリンダ５３のストローク分だけ容器載置台４０を下降させる。その後、図８に示すようにクランプ機構２４を作動させてクランプ部２５を閉じて、収容部２３内の最も下方に位置するウェハ搬送容器１０の直上に位置するウェハ搬送容器１０をクランプ部２５で保持する。 Next, as shown in FIG. 7, the clamp mechanism 24 is operated to open the clamp section 25, and the short air cylinder 53 of the up-down driving air cylinder 51 of the vertical driving section 50 is driven to lower the container mounting table 40 by the thickness of one wafer transport container 10 located at the lowest position in the accommodation section 23, i.e., by the stroke of the short air cylinder 53. Thereafter, as shown in FIG. 8, the clamp mechanism 24 is operated to close the clamp section 25, and the wafer transport container 10 located directly above the wafer transport container 10 located at the lowest position in the accommodation section 23 is held by the clamp section 25.
　さらに、図９に示すように、容器載置台４０に上記の収容部２３内の最も下方に位置するウェハ搬送容器１０を載置した状態で垂直駆動部５０の上下駆動エアシリンダ５１を駆動してロングエアシリンダ５２のストローク分だけ容器載置台４０を下降させる。 Furthermore, as shown in FIG. 9, with the wafer transport container 10 located at the lowest position within the above-mentioned storage section 23 placed on the container placement table 40, the up-down driving air cylinder 51 of the vertical driving section 50 is driven to lower the container placement table 40 by the stroke of the long air cylinder 52.
　その後、図１０に示すように、水平駆動部３０の前後駆動エアシリンダ３１を駆動させて容器載置台４０をミニマル装置２Ａの装置間搬送ユニット１２によって受け渡される位置まで水平移動させる。これら一連の動作を繰り返して収容部２３に積重ねられたウェハ搬送容器１０をミニマル装置２Ａの装置間搬送ユニット１２に順次受け渡すようにする。 Then, as shown in FIG. 10, the front-rear drive air cylinder 31 of the horizontal drive unit 30 is driven to move the container placement table 40 horizontally to a position where it can be handed over by the inter-apparatus transfer unit 12 of the minimal apparatus 2A. By repeating this series of operations, the wafer transport containers 10 stacked in the storage unit 23 are sequentially handed over to the inter-apparatus transfer unit 12 of the minimal apparatus 2A.
　次に、本実施の形態１の搬送容器受渡し受取り装置２０Ｂを用いて内部に加工済の半導体ウェハが収納されたウェハ搬送容器１０をミニマル装置２Ｃから受け取る場合の各部の動作について説明する。 Next, we will explain the operation of each part when the wafer transport container 10 containing processed semiconductor wafers is received from the minimal device 2C using the transport container delivery and receiving device 20B of this embodiment 1.
　なお、本実施の形態１の搬送容器受渡し受取り装置２０Ｂを用いて内部に加工済の半導体ウェハが収納されたウェハ搬送容器１０をミニマル装置２Ｃから受け取る場合については、上述したウェハ搬送容器１０をミニマル装置２に受け渡す場合と逆の動作順序を経て行われる。 When the wafer transport container 10 containing processed semiconductor wafers is received from the minimal device 2C using the transport container delivery and receiving device 20B of this embodiment 1, the operation sequence is reversed from that for transferring the wafer transport container 10 to the minimal device 2 described above.
　また、搬送容器受渡し受取り装置２０Ｂがウェハ搬送容器１０をミニマル装置２Ｃから受け取る場合について説明する。但し、搬送容器受渡し受取り装置２０Ｂは、搬送容器受渡し受取り装置２０Ａと同じ内部構造であるので、同一の符号を用いて説明する。 Furthermore, a case where the transfer container transfer device 20B receives the wafer transfer container 10 from the minimal device 2C will be described. However, since the transfer container transfer device 20B has the same internal structure as the transfer container transfer device 20A, the same reference numerals will be used in the description.
　まず、加工済の半導体ウェハが収納されたウェハ搬送容器１０がミニマル装置２Ｃの装置間搬送ユニット１２によって容器載置台４０に受け取られて載置される。そして、図３及び図４に示すように水平駆動部３０の前後駆動エアシリンダ３１を駆動させ、そのシリンダロッド３２を後退させることで、容器載置台４０を収容部２３の直下になる位置まで水平移動させる。 First, the wafer transport container 10 containing processed semiconductor wafers is received and placed on the container mounting table 40 by the inter-apparatus transport unit 12 of the minimal apparatus 2C. Then, as shown in Figures 3 and 4, the front-rear drive air cylinder 31 of the horizontal drive unit 30 is driven to move the cylinder rod 32 backward, thereby moving the container mounting table 40 horizontally to a position directly below the storage unit 23.
　そして、図５及び図６に示すように、垂直駆動部５０の上下駆動エアシリンダ５１を駆動してロングエアシリンダ５２のストローク分、容器載置台４０を上昇させて収容部２３内の最も下方に位置するウェハ搬送容器１０の下方に、さらに加工済の半導体ウェハが収納されたウェハ搬送容器１０を重ねるように支持する。 Then, as shown in Figures 5 and 6, the up-down driving air cylinder 51 of the vertical driving unit 50 is driven to raise the container mounting table 40 by the stroke of the long air cylinder 52, and the wafer transport container 10 containing the processed semiconductor wafers is supported so as to be stacked below the wafer transport container 10 located at the lowest position in the storage unit 23.
　次いで、図７に示すように、クランプ機構２４を作動させてクランプ部２５を開き、垂直駆動部５０の上下駆動エアシリンダ５１のショートエアシリンダ５３を駆動させて収容部２３内のウェハ搬送容器１０の１個の厚さ分だけ、すなわちショートエアシリンダ５３のストローク分だけ容器載置台４０を上昇させた後に、収容部２３内の最も下方に位置するようになった加工済の半導体ウェハが収納されたウェハ搬送容器１０を、クランプ機構２４を作動させてクランプ部２５を閉じて保持する。 Next, as shown in FIG. 7, the clamp mechanism 24 is operated to open the clamp section 25, and the short air cylinder 53 of the up-down driving air cylinder 51 of the vertical driving section 50 is driven to raise the container mounting table 40 by the thickness of one wafer transport container 10 in the storage section 23, i.e., by the stroke of the short air cylinder 53. After that, the clamp mechanism 24 is operated to close the clamp section 25 and hold the wafer transport container 10 containing the processed semiconductor wafers, which is now positioned at the lowest position in the storage section 23.
　なお、容器載置台４０上は、収容部２３内に加工済の半導体ウェハが収納されたウェハ搬送容器１０を供給して空になった状態である。この状態で図９に示すように垂直駆動部５０の上下駆動エアシリンダ５１を駆動してロングエアシリンダ５２のストローク分だけ容器載置台４０を下降させる。 The container mounting table 40 is empty after the wafer transport container 10 containing processed semiconductor wafers is supplied to the container section 23. In this state, the vertical drive air cylinder 51 of the vertical drive section 50 is driven to lower the container mounting table 40 by the stroke of the long air cylinder 52, as shown in FIG. 9.
　その後、図１０に示すように、水平駆動部３０の前後駆動エアシリンダ３１を駆動させて容器載置台４０をミニマル装置２Ｃの装置間搬送ユニット１２によって受け取られる位置まで水平移動させる。これら一連の動作を繰り返して加工済の半導体ウェハが収納されたウェハ搬送容器１０を収容部２３に順次下方から積重ねられるように受け取るようにする。 Then, as shown in FIG. 10, the front-rear drive air cylinder 31 of the horizontal drive unit 30 is driven to move the container placement table 40 horizontally to a position where it can be received by the inter-apparatus transfer unit 12 of the minimal apparatus 2C. This series of operations is repeated to receive the wafer transfer containers 10 containing the processed semiconductor wafers in the storage unit 23 so that they are stacked one after the other from below.
　以上説明したように、本実施の形態１によれば、ミニマル装置２にウェハ搬送容器１０を受け渡す場合、クランプ機構２４、容器載置台４０、及び垂直駆動部５０で構成された取出し取入れ装置１５によって収容部２３の下方から最も下方に位置するウェハ搬送容器１０を取り出し、ミニマル装置２Ａの装置間搬送ユニット１２によって受け渡される位置まで移動手段としての水平駆動部３０で移動させる一方、ミニマル装置２Ｃからウェハ搬送容器１０を受け取る場合、装置間搬送ユニット１２から加工済の半導体ウェハが収納されたウェハ搬送容器１０を受け取り、収容部２３の下方の所定の位置まで水平駆動部３０で移動させて加工済の半導体ウェハが収納されたウェハ搬送容器１０を取出し取入れ装置１５によって収容部２３の下方に収容することにより、内部に半導体ウェハを収納したウェハ搬送容器１０の装置間搬送ユニット１２への供給及び回収を自動化し、装置の運用に要する作業量及び操作者を削減するとともに、無人自動運転を可能にすることができる。 As described above, according to the first embodiment, when transferring the wafer transport container 10 to the minimal device 2, the take-out/take-in device 15, which is composed of the clamp mechanism 24, the container placement table 40, and the vertical drive unit 50, takes out the wafer transport container 10 located at the lowest position from below the storage section 23, and moves it to a position where it is transferred by the inter-apparatus transport unit 12 of the minimal device 2A using the horizontal drive unit 30 as a moving means. On the other hand, when receiving the wafer transport container 10 from the minimal device 2C, the wafer transport container 10 containing the processed semiconductor wafers is received from the inter-apparatus transport unit 12, moved to a predetermined position below the storage section 23 by the horizontal drive unit 30, and the wafer transport container 10 containing the processed semiconductor wafers is stored below the storage section 23 using the take-out/take-in device 15. This automates the supply and recovery of the wafer transport container 10 containing the semiconductor wafers to and from the inter-apparatus transport unit 12, reduces the amount of work and operators required for the operation of the device, and enables unmanned automatic operation.
　また、本実施の形態１によれば、水平駆動部３０は、装置間搬送ユニット１２によって受け渡され及び受け取られる位置と、収容部２３の下方位置との間で水平往復移動させることにより、構造を簡素化し、収容部２３に対してウェハ搬送容器１０の受け渡し及び受け取り操作が一台で容易に共有化することが可能となる。 Furthermore, according to the first embodiment, the horizontal drive unit 30 moves back and forth horizontally between the position where the wafer is handed over and received by the inter-apparatus transport unit 12 and a position below the storage unit 23, thereby simplifying the structure and making it possible to easily share the operations of handing over and receiving the wafer transport container 10 to and from the storage unit 23 with a single unit.
　さらに、本実施の形態１によれば、ミニマル装置２Ａにウェハ搬送容器１０を受け渡す場合、容器載置台４０で収容部２３内の最も下方に位置するウェハ搬送容器１０を支持し、クランプ機構２４のクランプ部２５を開いて収容部２３内の最も下方に位置するウェハ搬送容器１０の一つ分だけ容器載置台４０を下降させ、収容部２３内の最も下方に位置するウェハ搬送容器１０の直上に位置するウェハ搬送容器１０を、クランプ機構２４を閉じて保持し、収容部２３内の最も下方に位置するウェハ搬送容器１０を装置間搬送ユニット１２によって受け渡される位置まで移動させる一方、ミニマル装置２Ｃからウェハ搬送容器１０を受け取る場合、容器載置台４０で収容部２３内の最も下方に位置するウェハ搬送容器１０の下方に加工済の半導体ウェハが収納されたウェハ搬送容器１０を重ねるように支持し、クランプ機構２４を開いて収容部２３内のウェハ搬送容器１０の一つ分だけ容器載置台４０を上昇させ、収容部２３内の最も下方に位置するようになった加工済の半導体ウェハが収納されたウェハ搬送容器１０を、クランプ機構２４を閉じて保持し、容器載置台４０を装置間搬送ユニット１２によって受け渡される位置まで移動させることにより、内部に半導体ウェハを収納したウェハ搬送容器１０の装置間搬送ユニット１２への供給及び回収を自動化し、装置の運用に要する作業量及び操作者を削減するとともに、無人自動運転を可能にすることができる。 Furthermore, according to this embodiment 1, when transferring a wafer transport container 10 to the minimal device 2A, the container mounting table 40 supports the wafer transport container 10 located at the lowest position in the storage section 23, the clamp portion 25 of the clamp mechanism 24 is opened to lower the container mounting table 40 by the length of one wafer transport container 10 located at the lowest position in the storage section 23, the clamp mechanism 24 is closed to hold the wafer transport container 10 located directly above the wafer transport container 10 located at the lowest position in the storage section 23, and the wafer transport container 10 located at the lowest position in the storage section 23 is moved to a position where it will be transferred by the inter-apparatus transport unit 12, while when receiving a wafer transport container 10 from the minimal device 2C, the container mounting table 40 supports the wafer transport container 10 located at the lowest position in the storage section 23 by the clamp portion 25 of the clamp mechanism 24, and the wafer transport container 10 located at the lowest position in the storage section 23 is moved to a position where it will be transferred by the inter-apparatus transport unit 12. The wafer transport container 10 containing the processed semiconductor wafers is supported so that it is stacked below the wafer transport container 10 located at the lowest position, the clamp mechanism 24 is opened to raise the container mounting table 40 by the height of one wafer transport container 10 in the storage section 23, the wafer transport container 10 containing the processed semiconductor wafers that is now located at the lowest position in the storage section 23 is held by closing the clamp mechanism 24, and the container mounting table 40 is moved to a position where it can be handed over by the inter-apparatus transport unit 12. This automates the supply and recovery of the wafer transport container 10 containing the semiconductor wafers to and from the inter-apparatus transport unit 12, reducing the amount of work and operators required to operate the device and enabling unmanned automatic operation.
　したがって、本実施の形態によれば、搬送容器受渡し受取り装置２０Ａ，２０Ｂは、ウェハ搬送容器１０内に半導体ウェハが収納されており、ウェハ搬送容器１０を直接複数積重ねることができることから、最も下方に位置するウェハ搬送容器１０を取り出し、取り入れ可能となり、半導体ウェハが露出して処理室に搬送される従来の大規模な半導体製造装置と比較し、装置としての構造を簡素化し、少量多品種生産のコスト減に、非常に有益である。 Therefore, according to this embodiment, the transport container handover and receiving devices 20A, 20B store semiconductor wafers in wafer transport containers 10, and multiple wafer transport containers 10 can be directly stacked, making it possible to remove and load the lowest wafer transport container 10. Compared to conventional large-scale semiconductor manufacturing equipment in which semiconductor wafers are exposed and transported to a processing chamber, this simplifies the structure of the equipment and is extremely beneficial in reducing costs for small-lot, high-mix production.
　また、本実施の形態の搬送容器受渡し受取り装置２０Ａ，２０Ｂは、ウェハ搬送容器１０の受け渡しと受け取りを共用化することができる。 In addition, the transport container delivery and reception devices 20A and 20B of this embodiment can be used for both delivery and reception of the wafer transport container 10.
　さらに、本実施の形態の搬送容器受渡し受取り装置２０Ａ，２０Ｂは、ミニマル装置２の左右の両側面に設置することができるので、装置の汎用性を著しく高めることができる。 Furthermore, the transport container delivery and receiving devices 20A and 20B of this embodiment can be installed on both the left and right sides of the minimal device 2, significantly increasing the versatility of the device.
　なお、本実施の形態１では、搬送容器受渡し受取り装置２０Ａ及び搬送容器受渡し受取り装置２０Ｂは、正面視で収容部２３が左右非対称に設置されているため、右側面用の搬送容器受渡し受取り装置２０Ａ、左側面用の搬送容器受渡し受取り装置２０Ｂの２機種を用意する必要がある。 In this embodiment 1, the container transfer device 20A and the container transfer device 20B have the storage section 23 installed asymmetrically when viewed from the front, so it is necessary to prepare two models: a container transfer device 20A for the right side and a container transfer device 20B for the left side.
　また、本実施の形態１では、搬送容器受渡し受取り装置２０Ａ及び搬送容器受渡し受取り装置２０Ｂを全て同一構造に構成すれば、搬送容器受渡し受取り装置２０Ａ及び搬送容器受渡し受取り装置２０Ｂを１機種の共通装置に統合することができる。この場合、簡単な設定操作や遠隔制御により搬送容器受取り受渡し装置２０Ａと搬送容器受渡し受取り装置２０Ｂの受け渡し機能と受け取り機能とを入れ換えて、搬送方向を反転させることも可能となる。
［発明の実施の形態２］
　図１１は、本発明の実施の形態２に係る搬送容器受渡し受取り装置を適用したミニマル装置の生産ラインを示す正面図である。なお、本実施の形態において、前記実施の形態１と同一の部分には同一の符号を用いて説明し、重複する構成及び作用の説明は省略する。 In addition, in the first embodiment, if the transfer container transfer/receiving device 20A and the transfer container transfer/receiving device 20B are all configured to have the same structure, the transfer container transfer/receiving device 20A and the transfer container transfer/receiving device 20B can be integrated into one common device. In this case, it is possible to reverse the transfer direction by switching between the transfer function and the receiving function of the transfer container transfer/receiving device 20A and the transfer container transfer/receiving device 20B by simple setting operations or remote control.
[Embodiment 2]
11 is a front view showing a production line of a minimalist device to which a transfer container delivery and receiving device according to the second embodiment of the present invention is applied. In this embodiment, the same parts as those in the first embodiment are described using the same reference numerals, and descriptions of the same configurations and functions are omitted.
　図１１に示すように、本実施の形態２は、１台のミニマル装置２の容器搬送経路１１の始点となる右側面に搬送容器受渡し受取り装置２０Ａが設置される一方、容器搬送経路１１の終点となるミニマル装置２の左側面に搬送容器受渡し受取り装置２０Ｂが設置されている。 As shown in FIG. 11, in this embodiment 2, a transport container handover/receiving device 20A is installed on the right side of one minimal device 2, which is the starting point of the container transport path 11, while a transport container handover/receiving device 20B is installed on the left side of the minimal device 2, which is the end point of the container transport path 11.
　前記実施の形態１では、複数のミニマル装置２の両側面に搬送容器受渡し受取り装置２０Ａ及び搬送容器受渡し受取り装置２０Ｂを設置したが、本実施の形態２によれば、１台のミニマル装置２の右側面部に搬送容器受渡し受取り装置２０Ａを設置する一方、ミニマル装置２の左側面部に搬送容器受渡し受取り装置２０Ｂを設置して使用することができるので、装置の汎用性を著しく高めることができる。 In the first embodiment, the transport container transfer and receiving device 20A and the transport container transfer and receiving device 20B are installed on both sides of multiple minimal devices 2. However, according to the second embodiment, the transport container transfer and receiving device 20A can be installed on the right side of one minimal device 2, while the transport container transfer and receiving device 20B can be installed on the left side of the minimal device 2, which significantly increases the versatility of the device.
　１　生産ライン
　２，２Ａ，２Ｂ，２Ｃ　小型の半導体製造装置（ミニマル装置）
　３　床面
　４　筐体
　５　処理室
　６　装置前室
　７　凹部
　８　仮置きトレイ
　９　容器載置台
　１０　ウェハ搬送容器（搬送容器）
　１１　容器搬送経路
　１２　装置間搬送ユニット（搬送手段）
　１５　取出し取入れ装置（取出し取入れ手段）
　２０　搬送容器受渡し受取り装置
　２０Ａ　搬送容器受渡し受取り装置
　２０Ｂ　搬送容器受渡し受取り装置
　２１　取付カバー
　２２　取付フレーム
　２３　収容部
　２４　クランプ機構
　２５　クランプ部
　２６　駆動機構
　３０　水平駆動部（移動手段）
　３１　前後駆動エアシリンダ
　３２　シリンダロッド
　３３　連結部材
　３４　垂直連結板
　３５　水平連結板
　３６　上下動ロッド
　３７　上部水平部
　３８　下部水平部
　４０　容器載置台
　４１　上下動ロッド
　５０　垂直駆動部
　５１　上下駆動エアシリンダ
　５２　ロングエアシリンダ
　５３　ショートエアシリンダ
　５４　シリンダロッド
　６０　容器検出センサ
　６１　容器数充足センサ
　６２　容器検出センサ 1 Production line 2, 2A, 2B, 2C Small semiconductor manufacturing equipment (minimal equipment)
3 Floor surface 4 Housing 5 Processing chamber 6 Equipment front chamber 7 Recess 8 Temporary placement tray 9 Container placement stand 10 Wafer transport container (transport container)
11 Container transport path 12 Inter-apparatus transport unit (transport means)
15 Take-out/take-out device (take-out/take-out means)
20 Transfer container delivery/reception device 20A Transfer container delivery/reception device 20B Transfer container delivery/reception device 21 Mounting cover 22 Mounting frame 23 Storage section 24 Clamping mechanism 25 Clamping section 26 Driving mechanism 30 Horizontal driving section (moving means)
31 Front-rear drive air cylinder 32 Cylinder rod 33 Connecting member 34 Vertical connection plate 35 Horizontal connection plate 36 Up-down movement rod 37 Upper horizontal section 38 Lower horizontal section 40 Container placement platform 41 Up-down movement rod 50 Vertical drive section 51 Up-down drive air cylinder 52 Long air cylinder 53 Short air cylinder 54 Cylinder rod 60 Container detection sensor 61 Container number sufficiency sensor 62 Container detection sensor

Claims (4)

  1. 　少なくとも１台の半導体製造装置の側部に設置され、内部に基板が収納された搬送容器を受け渡し及び受け取る搬送容器受渡し受取り装置であって、
    　前記搬送容器を上下方向に複数積重ねる収容部と、
    　前記収容部の下方から最も下方に位置する前記搬送容器を取り出し可能で、かつ前記収容部の下方に加工済の基板が収納された搬送容器を取り入れ可能な取出し取入れ手段と、
    　前記半導体製造装置の搬送手段による前記搬送容器を受け渡し及び受け取り位置と、前記収容部の下方の所定の位置との間で前記搬送容器を移動させる移動手段と、を備え、
    　前記半導体製造装置に受け渡す場合、前記取出し取入れ手段によって前記最も下方に位置する搬送容器を取出し、前記半導体製造装置の搬送手段によって受け渡される位置まで前記移動手段で移動させる一方、
    　前記半導体製造装置から受け取る場合、前記搬送手段から前記加工済の基板が収納された搬送容器を受け取り、前記収容部の下方の所定の位置まで前記移動手段で移動させて前記加工済の基板が収納された搬送容器を前記取出し取入れ手段によって前記収容部の下方に収容するように構成されていることを特徴とする搬送容器受渡し受取り装置。     A transfer container delivery and reception device is installed at a side of at least one semiconductor manufacturing device, and delivers and receives a transfer container containing substrates therein,
    a storage section for stacking a plurality of the transport containers in a vertical direction;
    a take-out/take-in means for taking out the transport container located at the lowest position from below the accommodation section and taking in a transport container storing processed substrates below the accommodation section;
    a moving means for moving the transport container between a position for transferring and receiving the transport container by the transport means of the semiconductor manufacturing apparatus and a predetermined position below the accommodation unit,
    When transferring the container to the semiconductor manufacturing equipment, the lowermost transfer container is removed by the removal/intake means and moved by the moving means to a position where the container is transferred by the transfer means of the semiconductor manufacturing equipment.
    The transport container handover and receiving device is configured such that, when receiving from the semiconductor manufacturing equipment, the transport container containing the processed substrate is received from the transport means, moved to a predetermined position below the storage section by the moving means, and the transport container containing the processed substrate is stored below the storage section by the removal and insertion means.
  2. 　前記移動手段は、前記搬送手段によって受け渡され及び受け取られる位置と、前記収容部の下方位置との間で水平往復移動させる水平駆動部を備えていることを特徴とする請求項１に記載の搬送容器受渡し受取り装置。 The transport container delivery and receiving device according to claim 1, characterized in that the moving means is provided with a horizontal drive unit that moves the container back and forth horizontally between a position where the container is delivered and received by the transport means and a position below the storage unit.
  3. 　前記取出し取入れ手段は、
    　前記収容部内に収容された前記搬送容器を保持することが可能な開閉可能なクランプ機構と、
    　前記収容部に対して受け渡す前記搬送容器及び受け取る前記搬送容器を載置する容器載置台と、
    　前記容器載置台を前記収容部内の最も下方に位置する前記搬送容器を支持可能な上昇位置と、製造装置の搬送手段によって受け渡され及び受け取り可能な下降位置との間で上下往復移動させる垂直駆動部と、を有し、
    　前記半導体製造装置に受け渡す場合、前記容器載置台で前記収容部内の最も下方に位置する前記搬送容器を支持し、前記クランプ機構を開いて前記収容部内の最も下方に位置する前記搬送容器の一つ分だけ前記容器載置台を下降させ、前記収容部内の最も下方に位置する前記搬送容器の直上に位置する搬送容器を、前記クランプ機構を閉じて保持し、前記収容部内の最も下方に位置する前記搬送容器を前記搬送手段によって受け渡される位置まで移動させる一方、
    　前記半導体製造装置から受け取る場合、前記容器載置台で前記収容部内の最も下方に位置する前記搬送容器の下方に加工済の基板が収納された搬送容器を重ねるように支持し、前記クランプ機構を開いて前記収容部内の前記搬送容器の一つ分だけ前記容器載置台を上昇させ、前記収容部内の最も下方に位置するようになった前記加工済の基板が収納された搬送容器を、前記クランプ機構を閉じて保持し、前記容器載置台を前記搬送手段によって受け渡される位置まで移動させるように構成されていることを特徴とする請求項１に記載の搬送容器受渡し受取り装置。     The take-out/take-in means is
    an openable and closable clamp mechanism capable of holding the transport container accommodated in the accommodation section;
    a container placement table for placing the transport container to be delivered to the storage unit and the transport container to be received by the storage unit;
    a vertical drive unit that vertically reciprocates the container placement platform between an elevated position at the lowest position in the storage unit where the container can be supported and a lowered position where the container can be delivered and received by a transport means of a manufacturing apparatus;
    When transferring the container to the semiconductor manufacturing equipment, the container mounting table supports the transport container located at the lowest position in the storage unit, the clamping mechanism is opened to lower the container mounting table by the distance of one of the transport containers located at the lowest position in the storage unit, the clamping mechanism is closed to hold the transport container located directly above the transport container located at the lowest position in the storage unit, and the transport container located at the lowest position in the storage unit is moved to a position where it will be transferred by the transport means,
    The transport container handover and receiving device of claim 1 is configured to support a transport container containing a processed substrate in a stacked manner below the transport container located at the lowest position in the accommodation section on the container mounting table, open the clamping mechanism to raise the container mounting table by the height of one of the transport containers in the accommodation section, close the clamping mechanism to hold the transport container containing the processed substrate that is now located at the lowest position in the accommodation section, and move the container mounting table to a position where it can be handed over by the transport means, when receiving the transport container from the semiconductor manufacturing equipment.
  4. 　前記半導体製造装置の左右の側面部に設置可能に構成したことを特徴とする請求項１乃至３の何れかに記載の搬送容器受渡し受取り装置。 The transport container delivery and receiving device according to any one of claims 1 to 3, characterized in that it is configured to be able to be installed on the left and right side portions of the semiconductor manufacturing device.
PCT/JP2023/039230 2022-11-16 2023-10-31 Conveyance container delivering/receiving device WO2024106200A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-183487 2022-11-16
JP2022183487A JP2024072578A (en) 2022-11-16 2022-11-16 Transport container delivery and receiving device

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WO2024106200A1 true WO2024106200A1 (en) 2024-05-23

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142360A (en) * 2001-11-02 2003-05-16 Daikin Ind Ltd Apparatus for manufacturing semiconductor device
JP2008511178A (en) * 2004-08-23 2008-04-10 ブルックス オートメーション インコーポレイテッド Elevator-based tool loading and buffering system
JP2011258722A (en) * 2010-06-08 2011-12-22 National Institute Of Advanced Industrial & Technology Connection conveyance system
JP2016111032A (en) * 2014-12-02 2016-06-20 国立研究開発法人産業技術総合研究所 Inter-device transfer unit and inter-device transfer system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003142360A (en) * 2001-11-02 2003-05-16 Daikin Ind Ltd Apparatus for manufacturing semiconductor device
JP2008511178A (en) * 2004-08-23 2008-04-10 ブルックス オートメーション インコーポレイテッド Elevator-based tool loading and buffering system
JP2011258722A (en) * 2010-06-08 2011-12-22 National Institute Of Advanced Industrial & Technology Connection conveyance system
JP2016111032A (en) * 2014-12-02 2016-06-20 国立研究開発法人産業技術総合研究所 Inter-device transfer unit and inter-device transfer system

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