JP2003142360A - Apparatus for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing semiconductor devices, which can flexibly deal with the manufacturing of various type semiconductor devices and which has high productivity. SOLUTION: A conveying line 1 is coupled separably to a plurality of conveying modules 10. A plurality of processing chambers, in which works are arrayed according to the processing order of the works so as to process the works in a flow-shop method, are separably coupled via intermediate conveying chambers 70 to the line 1. The module 10 and the chamber are added or reduced to deal with the manufacture of the various types of semiconductor devices. Since the works are conveyed in one direction by the flow-shop method and processed at the line 1, it is not necessary to reciprocate the works, and the works can be processed sequentially one by one, and not wasted over a long time. Accordingly, high throughput is incorporated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device manufacturing apparatus processes a work by a job shop method to manufacture a semiconductor device. This job shop type semiconductor device manufacturing apparatus includes an etching area, a lithography area, a CV
A plurality of areas such as a D (vapor phase growth) area, a PVD (physical vapor deposition) area, a cleaning area, and an inspection area are connected by a transfer line having a conveyor, such as a vacuum transfer line or a magnetic levitation vacuum transfer line, to work. Was repeatedly moved back and forth to a lithography area, an etching area, a CVD area, and the like in the order of steps to complete the semiconductor device.

More specifically, as shown in FIG. 5, a vacuum transfer line 300 connects a CVD area 100, an etching area 200, a lithography area (not shown), a cleaning area, and the like. CVD area 1
00 is a CVD processing chamber 101, 1 having a CVD apparatus.
01, 101 (only three are shown for convenience of description, but actually, there are much more CVD processing chambers) and transfer chambers 102, 102, 102 having transfer devices such as a transfer robot.
Have. In addition, the etching area 200 includes etching processing chambers 201, 201, 201 (for convenience of explanation,
Only three are shown, but in reality there are far more etching chambers. ) And a transfer chamber 202, 202, 202 having a transfer device such as a transfer robot.

To manufacture a semiconductor device, for example, a film is chemically vapor-deposited on a wafer (not shown) in the CVD processing chamber 101 in the CVD area 100, and the wafer obtained by vapor-depositing the film is transferred into the transfer chamber 102. The transfer robot of (1) transfers the wafer to a vacuum transfer line 300 having a conveyor, transfers it to a lithography area (not shown), forms a resist mask on the film, and transfers the wafer on which the mask is formed to the etching area 200. In the etching area 200, the film of the wafer is partially etched in the etching processing chamber 201 using the mask.
The wafer having the etched film is sent to the vacuum transfer line 300 by the transfer robot in the transfer chamber 202, transferred to a cleaning area (not shown), and cleaned. Then, the cleaned wafer is sent again to the CVD area 100 to chemically vapor-deposit another film.

[0005]

As described above, the conventional job shop type semiconductor device manufacturing apparatus described above includes the etching area, the lithography area, the CVD area, and the P area.
Since a plurality of processing chambers are collectively arranged in each area such as a VD area, a cleaning area, and an inspection area, and a work is moved back and forth between the areas through a transfer line according to processing, various semiconductors can be used. Although it has the advantage of being able to flexibly respond to the manufacturing of equipment, it has low productivity because the work has to be reciprocated between the areas many times through the transfer robot in the transfer chamber and the vacuum transfer line, that is, throughput. There is a drawback that the (processing amount) is small.

Therefore, an object of the present invention is to provide a semiconductor device manufacturing apparatus which can flexibly deal with the manufacture of various semiconductor devices and has high productivity.

[0007]

In order to solve the above problems, a semiconductor device manufacturing apparatus according to a first aspect of the present invention includes a transfer module including a transfer chamber having a transfer device and a mounting chamber on which a work is placed. It is characterized in that a plurality of transfer lines that are separably connected to each other and a plurality of processing chambers that are separably connected to the transfer line are provided to process a work by a flow shop method.

In the semiconductor device manufacturing apparatus having the above-described structure, the transfer line is configured by connecting a plurality of transfer modules in a separable manner, and the plurality of processing chambers are connected in a separable manner to the transfer line. Therefore, in the above-described semiconductor device manufacturing apparatus, a transfer module and a processing chamber are added or deleted according to the type of the semiconductor device to configure a transfer line according to a request, and the processing chambers are transferred in an order according to the request. Can be connected to a line. Therefore, this semiconductor device manufacturing apparatus can be used for manufacturing various semiconductor devices, and has extremely high flexibility.

Further, according to the above semiconductor device manufacturing apparatus, in the transfer line including the plurality of transfer modules,
Since a plurality of processing chambers are connected so as to process the work by the flow shop method, that is, the processing chambers are connected according to the processing order of the work, it is not necessary to reciprocate the work in the transfer line, and Can be sequentially processed one after another, and there is no need to wait for a long time, and the throughput is increased.

A semiconductor device manufacturing apparatus according to a second aspect of the present invention is the semiconductor device manufacturing apparatus according to the first aspect, wherein the intermediate transfer chamber has a transfer device between the transfer line and the processing chamber. It is characterized by connecting.

According to the above structure, since the intermediate transfer chamber having the transfer device exists between the transfer line and the processing chamber, the work is directly processed by the transfer device of the transfer chamber of the transfer module of the transfer line. It is possible to carry the work to and from the processing chamber by the transfer device of the intermediate transfer chamber without carrying it to the processing chamber. Therefore, even if the transfer device in the transfer chamber of the transfer module has a single standard size, the transfer device in the intermediate transfer chamber can be used without causing a problem such as insufficient arm length of the transfer device. By doing so, the work can be taken in and out of the processing chamber. Further, even if there is a constraint that the material of the transfer device that can be put in the processing chamber must be a special material, the transfer module of the intermediate transfer chamber can be made by using the special material. The transfer device in the transfer chamber can be made of a standard material. Therefore, the flexibility of the semiconductor device manufacturing apparatus can be further increased, and the transfer module, and thus the transfer line, can be manufactured at low cost.

A semiconductor device manufacturing apparatus according to a third aspect of the present invention is the semiconductor device manufacturing apparatus according to the first or second aspect, in which a plurality of the transport modules are connected and at least the transport line is provided. It is characterized in that a backup line connected to the transfer line is provided so as to be in parallel with a part thereof, and the processing chamber is connected to the backup line.

According to the above construction, even if a failure occurs in the transfer line or the processing chamber, the semiconductor device manufacturing apparatus can be operated by passing through the backup line and the processing chamber connected to the backup line. You can keep it going. Therefore, the operating rate of this semiconductor device manufacturing apparatus is high. Further, by connecting a processing chamber different from the processing chamber of the transfer line to the backup line, it is possible to manufacture different types of semiconductor devices in parallel, that is, a semiconductor device passing only the transfer line and a semiconductor device passing the backup line. it can.

A semiconductor device manufacturing apparatus according to a fourth aspect of the present invention is the semiconductor device manufacturing apparatus according to any one of the first to third aspects, wherein the backup line and the processing chamber are provided between the backup line and the processing chamber. It is characterized in that an intermediate transfer chamber having a transfer device is connected.

Since the semiconductor device manufacturing apparatus having the above structure has the intermediate transfer chamber having the transfer device, it has high flexibility and a transfer module, as in the semiconductor device manufacturing apparatus according to the present invention. As a result, the transfer line can be manufactured at low cost.

A semiconductor device manufacturing apparatus according to a fifth aspect of the present invention is the semiconductor device manufacturing apparatus according to any one of the first to fourth aspects, wherein the plurality of transfer modules have a substantially rectangular horizontal cross section. It is characterized by being.

According to the above construction, since the horizontal cross section of the transfer module is substantially rectangular, it is possible to extend the transfer line from the transfer module in any of the four directions.

A semiconductor device manufacturing apparatus according to a sixth aspect of the present invention is the semiconductor device manufacturing apparatus according to the fifth aspect, wherein at least three side surfaces of the transfer module are provided with mechanical connecting means and at least two side surfaces are electrically connected. And a plurality of transfer modules are mechanically and electrically connected to each other.

According to the above construction, since at least three side surfaces of the transfer module are provided with mechanical connection means and at least two side surfaces are provided with electrical connection means, other transfer modules, processing chambers, intermediate transfer chambers and the like are provided. It can be easily mechanically and electrically connected.

A semiconductor device manufacturing apparatus according to a seventh aspect of the present invention is the semiconductor device manufacturing apparatus according to any one of the first to sixth aspects, wherein the transfer module mounting chamber has a plurality of workpieces. And a cooling unit for cooling the work, a heater unit for heating the work, or an aligning unit for detecting and correcting the posture of the work.

According to the above construction, in the mounting chamber of the transfer module, a plurality of works are stored in the buffer unit, or the works are cooled by the cooler unit.
Alternatively, the work is heated by the heater unit, or the posture of the work is detected and corrected by the aligning unit.

According to an eighth aspect of the present invention, there is provided a semiconductor device manufacturing apparatus according to any one of the first to seventh aspects of the semiconductor device manufacturing apparatus, wherein the carrier module of the carrier chamber or the intermediate carrier is used. At least one of the chamber transfer devices is a double-arm transfer robot having two arms.

According to the above construction, since the transfer device is a double-arm type transfer robot having two arms, the two arms receive the work from the front stage and the work to the rear stage, or process the work. It can be inserted into and taken out of a chamber or the like at the same time, so that many works can be transported quickly.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the embodiments shown in the drawings.

(First Embodiment) FIG. 1 is a schematic view of a semiconductor device manufacturing apparatus according to the first embodiment. In the transfer line 1 for transferring the work W such as a wafer in the direction of the arrow X, C
Each of the VD processing chamber 20, the lithography processing chamber 30, the etching processing chamber 40, the cleaning processing chamber 50, and the PVD processing chamber 60 is connected via an intermediate transfer chamber 70. The transfer line 1 is formed by connecting a plurality of transfer modules 10, 10, .... The CVD processing chamber 20, the lithography processing chamber 30, the etching processing chamber 40, the cleaning processing chamber 50, and the PVD processing chamber 60 are flow-shop type workpieces W.
Are arranged in the order of processing so that can be processed.

As shown in FIG. 2, the transfer module 1 is provided.
0 has a substantially rectangular horizontal cross section, and has a transfer chamber 2 and a loading chamber 3
Consists of. The transfer chamber 2 is provided with a SCARA type 3 link double arm type transfer robot 5 as an example of a transfer device. This transfer robot 5 has two arms 11 composed of articulated links 6, 7, and 8 arranged vertically, and each arm 11, 11 can transfer wafers W, W separately. As the transfer device, a SCARA type 2-link double arm type transfer robot (each arm is composed of two links), a SCARA type instead of the SCARA type 3-link double arm type transfer robot 5 are shown. A 3-link single-arm transfer robot (only one arm is provided), a scalar 2-link single-arm transfer robot, or the like may be used. On the other hand, the mounting table 1 on which the wafer W is mounted is placed in the mounting chamber 3 described above.
2 is provided.

Flange 15, 15, 15 as an example of mechanical connecting means is provided on three side surfaces of the transfer module 10 other than the mounting chamber 3 of the transfer chamber 2. By this flange 15, the adjacent transfer modules 10,
The ten members are mechanically tightly and separably connected to each other.
Of course, a sealing material (not shown) is provided on the contact surface of the flange 15. An intermediate transfer chamber 70 is densely and separably connected to the other side surface of the transfer chamber 2 of the transfer module 10 by the flange 15. Further, in another lower flange 15 in FIG. 2,
Although not shown, it has a blind lid. Above flange 1
Since 5, 15, 15 are fastened to the other side with fasteners such as bolts, by loosening the fasteners, the transport modules 10, 10 are separated from each other, or the intermediate transport chamber 7
0 can be separated from the transport module 10.

The intermediate transfer chamber 70 is provided with a scalar type 3 link double arm type transfer robot 5 which is exactly the same as the scalar type 3 link double arm type transfer robot 5 in the transfer chamber 2. The flanges 16, 16 as an example of mechanical connecting means provided in the intermediate transfer chambers 70, 70 are provided with CVD.
The processing chamber 20 and the lithography processing chamber 30 are separably connected to each other by fasteners such as bolts. The etching processing chamber 40, the cleaning processing chamber 50, and the PVD processing chamber 60 are
Although not shown in FIG. 1, similarly, it is tightly and separably connected to the intermediate transfer chamber 70 by a flange.

The flange 15 of the transfer module 10,
Although not shown, the flange 16 of the intermediate transfer chamber 70 is provided with a connector as an example of electrical connection means,
The transfer modules 10, 10 themselves, or the transfer module 10 and the intermediate transfer chamber 70, or the intermediate transfer chamber 70.
The CVD processing chamber 20 and the like can be electrically separated from each other.

According to the semiconductor device manufacturing apparatus having the above-described structure, as shown in FIG. 1, a work W such as a film-formed wafer is processed by a flow shop method in a CVD processing chamber 20, a lithography processing chamber 30, and an etching process. While being successively processed in the chamber 40, the cleaning treatment chamber 50, the PVD treatment chamber 60, etc., the conveyance line 1 is conveyed in the direction indicated by the arrow X. That is, the work W is conveyed only in the X direction without being reciprocated in the conveyance line 1 while being sequentially processed one after another without waiting for a long time, so that the productivity is high and the throughput is high.

More specifically, as shown in FIGS. 1 and 2, one arm 11 of the transfer robot 5 in the transfer chamber 2 of the leftmost transfer module 10 transfers the work W to one of the transfer robots 5 in the intermediate transfer chamber 70. Hand it over to arm 11
Then, the work W is carried into the CVD processing chamber 20. At the same time, another one of the transfer robots 5 in the intermediate transfer chamber 70
The work W, which is a wafer formed by chemical vapor deposition, is taken out from the CVD processing chamber 20 by one arm 11. The vacant arm 11 of the transfer robot 5 of the transfer chamber 2 of the transfer module 10 receives the taken-out work W from the arm 11 of the transfer robot 5 of the intermediate transfer chamber 70, and the mounting table 12 of the mounting chamber 3 is received. Place on. At this time, the other arm 11 of the transfer robot 5 in the transfer chamber 2 of the transfer module 10 stands by with the work W which is the next wafer to be vapor-phase grown in the CVD processing apparatus 20.

The workpiece W on the mounting table 12 of the mounting chamber 3 of the transfer module 10 is moved by one arm 11 of the transfer robot 5 of the transfer chamber 2 of the adjacent transfer module 10.
It is carried onto one arm 11 of the transfer robot 5 in the intermediate transfer chamber 70. The arm 11 of the intermediate transfer chamber 70 carries the work W into the lithography processing chamber 30. At the same time, another arm 11 of the transfer robot 5 in the intermediate transfer chamber 70 takes out the work W, which is a resist-formed wafer, from the lithography processing chamber 30.
The vacant arm 11 of the transfer robot 5 of the transfer chamber 2 of the transfer module 10 receives the taken-out work W from the arm 11 of the transfer robot 5 of the intermediate transfer chamber 70, and the workpiece W of the loading chamber 3 on the right side is received. It is mounted on the mounting table 12.

As described above, the transfer robots 5, 5, ... Send the work W in one direction one after another by pseudo handing, and the CVD processing chamber 20 and the lithography processing chamber are arranged in the processing order. The work W is sequentially processed by the flow shop method in the 30, the etching processing chamber 40, the cleaning processing chamber 50, the PVD processing chamber 60, and the like, and is transported only in the direction indicated by the arrow X without reciprocating the transport line 1. in this way,
Work W is processed one after another by the flow shop method,
Since the waiting period does not become long and the carrier line 1 does not reciprocate, the semiconductor device manufacturing apparatus has high productivity and high throughput.

Further, the transfer robot 2 in the transfer chamber 2 and the intermediate transfer chamber 70 of the transfer module 10 is a SCARA type 3 link double arm type transfer robot 5.
Since it has two arms 11, 11, it accepts the work W from the front stage and delivers it to the rear stage, or the work W.
Can be inserted into and removed from the CVD processing chamber 20 and the like at the same time, and therefore, many works W can be transported quickly.

The transfer line 1 is constructed by connecting a plurality of transfer modules 10, 10, ... In a mechanically and electrically separable manner with a flange 15 and a connector (not shown). In addition, the CVD processing chamber 20, the lithography processing chamber 30, the etching processing chamber 40, the cleaning processing chamber 50, and the PVD processing chamber 6 via the intermediate transfer chamber 70.
0 and the like are mechanically and electrically separably connected by a flange 16 and a connector (not shown). Therefore, according to the type of semiconductor device to be manufactured, the transfer module 10 and the processing chamber such as the CVD processing chamber 20 can be added or deleted to easily configure the transfer line 1 according to the request, and the order according to the request can be obtained. The processing chamber can be connected to the transfer line 1. Therefore, this semiconductor device manufacturing apparatus has an advantage that it can be used for manufacturing various semiconductor devices and has extremely high flexibility.

In the first embodiment, since the intermediate transfer chamber 70 having the transfer robot 5 is provided between the transfer line 1 and the processing chamber such as the CVD processing chamber 20, the transfer module is, for example, a transfer module. The length of the arm 11 of the transfer robot 5 of 10 is insufficient, and the work W
Even if the wafer cannot be directly transferred to the CVD processing chamber 20, the intermediate transfer chamber 7
The work W is transported to the CVD processing chamber 20 by the arm 11 of the transfer robot 5 of 0, and the work W is also transported from the CVD processing chamber 20.
Can be carried out. Further, in the above description, the transfer robot 5 in the intermediate transfer chamber 70 is the same as the transfer robot 5 in the transfer module 10, but the transfer robot in the intermediate transfer chamber is changed to the transfer module 10 according to the situation of the processing chamber. It may be different from the transport robot 5.
For example, the arm of the transfer robot in the intermediate transfer chamber 70 may be longer than the arm 11 of the transfer robot 5 in the transfer module 10. By doing so, even if the transfer robot 5 in the transfer chamber 2 of the transfer module 10 has a single standard size, problems such as insufficient length of the arm 11 do not occur. In addition, the CVD processing chamber 2
Even if there is a constraint that the material of the arm 11 of the transfer robot 5 that can be placed in the processing chamber such as 0 is made of a special material such as ceramics, the material of the arm of the transfer robot in the intermediate transfer chamber 70 is made special. With such a material, the arm 11 of the transfer robot 5 in the transfer chamber 2 of the transfer module 10 can be made of a standard material. Therefore, the flexibility of the semiconductor device manufacturing apparatus can be further increased, and the transport module 10,
As a result, the transport line 1 can be manufactured at low cost.

(Second Embodiment) FIG. 3 is a schematic diagram of a semiconductor device manufacturing apparatus according to a second embodiment. In FIG. 3, the same components as those of the semiconductor device manufacturing apparatus of the first embodiment shown in FIGS. 1 and 2 are designated by the same reference numerals as those of the first embodiment, and detailed description thereof will be omitted. .

The semiconductor device manufacturing apparatus according to the second embodiment is different from the constituent elements of the semiconductor device manufacturing apparatus according to the first embodiment in that an inspection chamber 8 as an example of a processing chamber.
0, Equipment (Equipment Front End Module) 90, 9
1, a cassette 95, a transfer module 110, and intermediate transfer chambers 170 and 171.

The transfer module 110 comprises a transfer chamber 2 having the same transfer robot 5 as in the first embodiment, and a mounting chamber 113 having a buffer unit (not shown) for accommodating a plurality of works (wafers). The transport module 110 differs from the transport module 10 only in that it has a buffer unit instead of the mounting table 12. The transport module 110 and the transport module 10 are connected by a flange 15 with their longitudinal directions orthogonal to each other.

The intermediate transfer chamber 170 is not shown,
The transfer robot has the same transfer robot as the transfer robot 5 in the intermediate transfer chamber 70, and has four connection side flanges, and has two CVD processing chambers 20 and 20 and two intermediate transfer chambers 17.
The work W can be taken in and out of the 1,171. The intermediate transfer chamber 171 has a plan view.
It has the shape of a scalene pentagon and does not have a transfer robot inside, and acts as a passage.

In the inspection room 80, it is inspected whether or not the desired processing has been performed on the work W. The front device 90,
A plurality of works W are placed in front of 91 in order to adjust the conveyance of the works W. The cassette 95 accommodates, for example, 25 works (wafers) W.

The transfer module 10, 10, 110
Are, in sequence, the flange 15 and the connector (not shown 7).
Are mechanically and electrically separably connected to each other to form a hook-shaped first transfer line 51. The transfer modules 10 and 110 are sequentially and mechanically and electrically separably connected to each other by a flange 15 and a connector (not shown) 7 to form a hook-shaped second transfer line 52.
Are configured. The intermediate transfer chambers 171, 170, 17
1 also serves to connect the first transfer line 51 and the second transfer line 52 so as to be separable mechanically and electrically.

In the above structure, the work W from the cassette 95 is transferred from the front device 90 to the first transfer line 5.
1, while being transferred in one direction through the intermediate transfer chambers 171, 170, 171 and the second transfer line 52, processing and inspection via the etching processing chambers 40, 40, the CVD processing chambers 20, 20 and the inspection chamber 80. The front device 9
Carried to 1.

In the semiconductor device manufacturing apparatus according to the second embodiment, the work W is transferred to the first transfer line 51 and the intermediate transfer chamber 17.
1, 170, 171 and the second transport line 52 are transported in only one direction, and the workpieces W are sequentially processed by the flow shop method, so that the period for waiting the workpiece W does not become long, and Since the first and second transfer lines 51 and 52 are not reciprocated, the productivity is high and the throughput is high.

In the semiconductor device manufacturing apparatus according to the second embodiment, the first transfer line 51 is connected to the transfer module 1
0, 10, 110 are mechanically and electrically separably connected by a flange 15 and a connector, and the etching processing chambers 40, 4 are connected to the first transfer line 51.
0 is mechanically and electrically separably connected with a flange and a connector (not shown) via the intermediate transfer chamber 70,
In addition, the second transfer line 52 is connected to the transfer module 10,
110 is configured to be mechanically and electrically separably connected by the flange 15 and the connector, and the inspection chamber 80 is mechanically and electrically connected to the second transfer line 52 via the intermediate transfer chamber 70 by the flange and the connector (not shown). Electrically separable connection. Further, the first transfer line 51 and the second transfer line 52 are connected to the intermediate transfer chamber 1
71, 170, 171 and flanges and connectors (not shown) are mechanically and electrically separably connected. Therefore, the semiconductor device manufacturing apparatus according to the second embodiment includes the transfer modules 10 and 110 and the intermediate transfer chamber 1.
By adding and removing 70, 171 and the CVD processing chamber 20 and the like, there is an advantage that various semiconductor devices can be manufactured and flexibility is high.

Further, in the semiconductor device manufacturing apparatus according to the second embodiment, the mounting chamber 113 of the transfer module 110 is used.
Has a buffer unit for accommodating a plurality of works W, it is possible to store the works W in the middle of the first and second transfer lines 51, 52 and adjust the transfer speed of the works W as required. is there.

Although not shown in the figure, a cooler unit for cooling the work, a heater unit for preheating the work, or a posture of the work is detected in the placing chamber 113 instead of the buffer unit. An aligning unit for correction may be provided.

(Third Embodiment) FIG. 4 is a schematic view of a semiconductor device manufacturing apparatus according to a third embodiment. 4, the same components as those of the semiconductor device manufacturing apparatus of the second embodiment shown in FIG. 3 are designated by the same reference numerals as those of the second embodiment, and detailed description thereof will be omitted.

In the semiconductor device manufacturing apparatus according to the third embodiment, the first transport line 61 is mechanically configured so that the transport modules 10, 110 and 110 arranged in a substantially T shape can be separated by a flange and a connector (not shown). In addition, the second transfer line 62 is configured by mechanically and electrically connecting the second transfer line 62 so that the transfer modules 10 and 110 arranged in a hook shape can be separated by a flange and a connector (not shown). is doing.

A first backup line 261 is connected in parallel with the first transfer line 61. The first backup line 261 is configured by mechanically and electrically connecting the transfer modules 110, 110 arranged in a hook shape so as to be separable by a flange and a connector (not shown). The transfer module 1 of the first transfer line 61
10, 110 and the transfer modules 110, 110 of the first backup line 261 form a “b” -shaped passage. A second backup line 262 is connected in parallel with the second transfer line 62. The second backup line 262 is configured by mechanically and electrically connecting the transfer modules 110, 110 arranged in a hook shape so as to be separable by a flange and a connector (not shown). The transfer modules 10 and 110 of the second transfer line 62 and the transfer modules 110 and 110 of the second backup line 262 form a "square" -shaped passage.

The transfer module 110 of the first backup line 261 and the second backup line 262.
An intermediate transfer chamber 170 having a transfer robot (not shown) is mechanically and electrically connected to the transfer module 110 of FIG. 1 through a flange and a connector (not shown) via intermediate transfer chambers 171 and 171 having an isosceles pentagonal shape. There is.

In the semiconductor device manufacturing apparatus according to the third embodiment, the work W is transferred to the first transfer line 61, the intermediate transfer chamber 17 and the intermediate transfer chamber 17.
1, 170, 171 and the second transfer line 62, the transfer robot 5 does not transfer by a pseudo handing method in only one direction and reciprocally moves, and sequentially processes the flow shop method one by one. Like a semiconductor device manufacturing apparatus, it has high productivity and high throughput.

The semiconductor device manufacturing apparatus according to the third embodiment is similar to the semiconductor device manufacturing apparatus according to the second embodiment in that the transfer modules 10, 110, the intermediate transfer chamber 170,
171, an etching processing chamber, a CVD processing chamber, etc. (see FIG.
By adding and deleting the above), it is possible to manufacture various semiconductor devices, and there is an advantage that flexibility is high.

Furthermore, in the semiconductor device manufacturing apparatus according to the third embodiment, for example, the first transfer line 6 is used.
1, the last transfer module 110, the upper intermediate transfer chambers 171, 170, 171 in FIG. 4, the first transfer module 110 of the second transfer line 62, the intermediate transfer chamber 1
When the CVD processing chamber (referred to in FIG. 3) connected to 70 fails, the first bypass line 261, the lower intermediate transfer chamber 171, 170, 171 in FIG. A connected CVD processing chamber (not shown),
Further, the work W can be processed while being transported via the second bypass line 262. Therefore, in the semiconductor device manufacturing apparatus according to the third embodiment, the first transfer line 6 is used.
1, the second transfer line 62, the upper intermediate transfer chamber 171,
170, 171, CVD processing room, inspection room (refer to FIG. 3)
Even if the above troubles occur, the work W has the first and second backup lines 261, 262, and the first and second backup lines thereof.
The intermediate transfer chambers 171, 170, 171, 70 connected to the backup lines 261 and 262, the CVD processing chamber (not shown), and the inspection chamber (not shown) are used to manufacture the semiconductor device. Can be kept running. Therefore, the operation rate of this semiconductor device manufacturing apparatus is high. Furthermore, in the semiconductor device manufacturing apparatus according to the third embodiment, a part of the first transfer line 61 and the first backup line 261 form a “b” -shaped passage, and the second transfer line Since the line 62 and the second backup line 262 form a "square" -shaped passage, for example, in FIG.
1, 170, 171, 70, when the CVD processing chamber or the like fails, the work W is erected with all of the first transfer line 61, the second transfer line 62, and the first and second backup lines 261 and 262. Transport module 110,1
10 and lower intermediate transfer chambers 171, 170, 171,
It is possible to continue operating the semiconductor device manufacturing apparatus via the CVD processing chamber 70 and the like. Therefore,
The operation rate of this semiconductor device manufacturing apparatus is high. Further, although not shown, a processing chamber different from the processing chamber of the transfer line is connected to the backup line so that different types of semiconductor devices, that is, a semiconductor device passing only through the transfer line and a semiconductor device passing through the backup line are connected in parallel. It can be manufactured.

In the above-mentioned first, second and third embodiments, as the transfer device, the articulated transfer robot in which the links are connected by the joints is used, but an orthogonal axis transfer robot may be used, or the transfer robot may be used. Instead of this, for example, a transfer device including a conveyor, a lifting device, a swing arm, and the like may be used.

In the first, second and third embodiments, the processing chambers are connected to the transfer lines 1, 51, 52, 61 and 62 via the intermediate transfer chambers 70, 170 and 171. The processing chambers may be separably connected.

Further, in the above-described third embodiment, a part of the first transfer line 61 and the first backup line 261 form a “square” -shaped passage, and the second transfer line 62 is connected to the second transfer line 62. Although the first and second backup lines 261 and 262 are provided so as to form a “b” -shaped passage with the second backup line 262, the backup lines are not limited to this and may be provided in various ways. You can The backup line can function if provided in parallel with a part of the transfer line.

[0058]

As is apparent from the above, in the semiconductor device manufacturing apparatus of the first aspect of the present invention, the transfer line is configured by connecting a plurality of transfer modules so that the transfer module can be separated, and a plurality of processings are performed on the transfer line. Since the chambers are separably connected, a transfer module and a processing chamber can be added or deleted according to the type of semiconductor device to configure a transfer line according to the request, and the processing chambers can be arranged in an order according to the request. It can be connected to a transfer line, and therefore can be used for manufacturing various semiconductor devices, and has extremely high flexibility.

Further, in the semiconductor device manufacturing apparatus according to the first aspect of the present invention, a plurality of processing chambers are connected to the transfer line composed of the plurality of transfer modules in accordance with the processing order of the works so as to process the works by the flow shop method. Therefore, it is not necessary to reciprocate the workpieces in the transfer line, and the workpieces can be sequentially machined one after another without waiting for a long time, thus having a high throughput.

Further, according to the semiconductor device manufacturing apparatus of the invention of claim 2, between the transfer line and the processing chamber,
Since the intermediate transfer chamber having the transfer device is provided, even if the transfer device of the transfer chamber of the transfer module has a single standard size, the work is transferred to the processing chamber by the transfer device of the intermediate transfer chamber. Can be taken in and out, and also
Even if there is a constraint that the material of the transfer device that can be placed in the processing chamber must be a special material, the transfer module of the transfer module can be transferred by using the special material of the transfer device of the intermediate transfer chamber. The chamber carrier can be made of standard materials. Therefore, in the semiconductor device manufacturing apparatus according to the second aspect of the present invention, the flexibility can be further increased, and the transfer module, and thus the transfer line, can be manufactured at low cost.

According to the semiconductor device manufacturing apparatus of the third aspect of the present invention, a plurality of transfer modules are connected and connected to the transfer line in parallel with at least a part of the transfer line. Since the backup line and the processing chamber connected to the backup line are provided, even if a failure occurs in the transfer line or the processing chamber connected to the transfer line, the backup line and the processing connected to the backup line By passing through the chamber, the semiconductor device manufacturing apparatus can be continuously operated. Therefore, the semiconductor device manufacturing apparatus according to the third aspect has an advantage that the operating rate is high.
Further, by connecting a processing chamber different from the processing chamber of the transfer line to the backup line, it is possible to manufacture different types of semiconductor devices in parallel, that is, a semiconductor device passing only the transfer line and a semiconductor device passing the backup line. it can.

Further, the semiconductor device manufacturing apparatus according to the fourth aspect of the present invention has the intermediate transfer chamber having the transfer apparatus, and therefore has a high flexibility like the semiconductor device manufacturing apparatus according to the second aspect of the present invention. And the transport module, and by extension,
The transfer line can be manufactured at low cost.

Further, according to the semiconductor device manufacturing apparatus of the present invention, since the horizontal cross section of the transfer module is substantially rectangular, the transfer line can be extended from the transfer module in any of the four directions. Is possible.

According to the semiconductor device manufacturing apparatus of the sixth aspect of the present invention, since at least three side surfaces of the transfer module are provided with mechanical connecting means and at least two side surfaces thereof are provided with electrical connecting means, another transfer apparatus is provided. Modules, processing chambers, intermediate transfer chambers, etc. can be mechanically and electrically connected easily.

According to a seventh aspect of the present invention, there is provided a semiconductor device manufacturing apparatus in which a buffer unit for accommodating a plurality of works, a cooler unit for cooling the works, or a heater unit for heating the works is installed in a mounting chamber of the transfer module. ,
Or, since it includes one of the aligning units for correcting the posture of the work, the buffer unit stores a plurality of works, or the cooler unit cools the works, or the heater unit heats the works.
Work can be corrected with the aligning unit.

According to the semiconductor device manufacturing apparatus of the eighth aspect of the invention, since the transfer device is a double-arm transfer robot having two arms, the two arms can receive the work from the preceding stage. And handing over to the latter stage,
Alternatively, it is possible to insert and take out workpieces at the same time to the processing chamber and the like, and therefore, many workpieces can be transported quickly.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a semiconductor device manufacturing apparatus according to a first embodiment of the present invention.

FIG. 2 is an enlarged view of part of the semiconductor device manufacturing apparatus of FIG.

FIG. 3 is a schematic diagram of a semiconductor device manufacturing apparatus according to a second embodiment of the present invention.

FIG. 4 is a schematic diagram of a semiconductor device manufacturing apparatus according to a third embodiment of the present invention.

FIG. 5 is a schematic view of a conventional semiconductor device manufacturing apparatus.

[Explanation of symbols]

1, 51, 52, 61, 62 Transport line 2 transfer room 3,113 Placement room 5 Transport robot 10,110 transfer module 11 arms 12 mounting table 15, 16 flange 20 CVD processing chamber 30 Lithography processing room 40 Etching chamber 50 Cleaning process room 60 PVD processing room 70,170,171 Intermediate transfer chamber 80 inspection room 261,262 backup line W work

Claims (8)

[Claims] 1. A plurality of transfer modules (10, 110) each comprising a transfer chamber (2) having a transfer device (5) and a mounting chamber (3, 113) for mounting a work (W) are separable. Conveying line (1, 51, 52, 61, 6)
2) and a plurality of processing chambers (20, 30, 40, 5) that are separably connected to the transfer line (1, 51, 52, 61, 62).
0, 60, 80) and processing a work (W) by a flow shop method. 2. The semiconductor device manufacturing apparatus according to claim 1, wherein the transfer line (1, 51, 52, 61, 62) and the processing chamber (20, 30, 40, 50, 60, 80) Between the intermediate transfer chambers (70, 17) having the transfer device (5).
0) is connected to the semiconductor device manufacturing apparatus. 3. The semiconductor device manufacturing apparatus according to claim 1, wherein a plurality of the transfer modules (10, 110) are connected to each other, and at least a part of the transfer lines (61, 62). The transfer lines (61, 6) are arranged in parallel.
Backup line (261, 26) connected to 2)
2), and a processing chamber (20, 80) is connected to the backup line (261, 262). 4. The semiconductor device manufacturing apparatus according to claim 1, further comprising a transfer device between the backup line (261, 262) and the processing chamber (20, 80). 5) An apparatus for manufacturing a semiconductor device, characterized in that an intermediate transfer chamber (70, 170) having the above 5) is connected. 5. The semiconductor device manufacturing apparatus according to claim 1, wherein the plurality of transfer modules (10, 110) have a substantially rectangular horizontal cross section. Equipment manufacturing equipment. 6. The apparatus for manufacturing a semiconductor device according to claim 5, wherein at least three side surfaces of the transfer module (10, 110) are provided with mechanical connection means (15) and at least two side surfaces thereof are provided with electrical connection means. The plurality of transfer modules (10, 110) are mechanically and electrically connected to each other, and the semiconductor device manufacturing apparatus is characterized. 7. The semiconductor device manufacturing apparatus according to claim 1, wherein the mounting chamber (3, 1) of the transfer module (10, 110).
13) is a buffer unit that stores a plurality of works (W), a cooler unit that cools the works (W), a heater unit that heats the works (W), or a posture of the works (W) is detected and corrected. Which includes any of the aligning units described above. 8. The semiconductor device manufacturing apparatus according to claim 1, wherein the transfer device (5) or the intermediate transfer chamber (5) of the transfer chamber (2) of the transfer module (10, 110). 70, 170), at least one of the transfer devices (5) is a double-arm transfer robot (5) having two arms.