WO2024103718A1 - Liquid-cooling heat dissipation device, heat dissipation system, and electronic device - Google Patents

Abstract

A liquid-cooling heat dissipation device, a heat dissipation system, and an electronic device, relating to the technical field of heat dissipation. The liquid-cooling heat dissipation device comprises a cold plate; the cold plate comprises side walls, a top plate and a bottom plate; the side walls, the top plate and the bottom plate form a first containing cavity; a flow channel is formed in the first containing cavity; a liquid inlet and a liquid outlet communicated with the flow channel are formed on the side walls respectively; the bottom plate is made of a flexible material; when the bottom plate is in contact with an element to be heat-dissipated, the bottom plate can deform according to the shape of the element to be heat-dissipated, so that the bottom plate fits the element to be heat-dissipated, and conducts heat from the element to be heat-dissipated to a cooling liquid flowing in the flow channel. The flexible bottom plate is provided and can deform according to heat dissipation surfaces of elements to be heat-dissipated having different shapes and heights, thereby ensuring a close fit between the bottom plate and the heat dissipation surfaces of the elements to be heat-dissipated; there is no need to provide additional flexible materials such as TIM materials between the bottom plate and elements to be heat-dissipated, thereby reducing material loss, saving cost, and effectively improving the heat dissipation efficiency.

Description

Liquid cooling device, cooling system and electronic equipment

This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on November 15, 2022, with application number 202211431039.X and application name “Liquid Cooling Device, Cooling System and Electronic Equipment”, the entire contents of which are incorporated by reference in this application.

Technical Field

The present application relates to the field of heat dissipation technology, and in particular to a liquid cooling device, a heat dissipation system and an electronic device.

Background technique

At present, the heat dissipation of components is mainly liquid cooling and air cooling. Among them, for liquid cooling, a metal cold plate is usually used in combination with a thermal interface material (TIM) to dissipate heat from the heating device. The TIM material can ensure the fit with the heating device through its own flexibility and reduce thermal resistance. However, the use of TIM will increase product costs and make assembly complicated. In addition, when the heating device is a plug-in device, each plug-in and pull-out means wasting a TIM material, which is extremely costly and wastes costs.

Summary of the invention

The present application provides a liquid cooling device, a cooling system and an electronic device to solve the problem in the above-mentioned prior art that the use of TIM materials will lead to complicated product assembly, increase material loss during the plugging and unplugging of heating devices, and cause cost increase.

The first aspect of the present application provides a liquid-cooled heat dissipation device, which includes: a cold plate, the cold plate includes a side wall, a top plate and a bottom plate, the side wall, the top plate and the bottom plate constitute a first accommodating cavity, a flow channel is arranged in the first accommodating cavity, and a liquid inlet and a liquid outlet connected to the flow channel are respectively arranged on the side wall; the bottom plate is made of a flexible material, and when the bottom plate contacts with a heat sink, the bottom plate can be deformed according to the shape of the heat sink so that the bottom plate fits with the heat sink and conducts the heat of the heat sink to the cooling liquid flowing in the flow channel.

The liquid-cooled heat dissipation device provided in the present application can reliably fit with heat sinks with different heat dissipation surfaces by providing a flexible base plate, without adding additional flexible materials such as TIM materials between the base plate and the heat sink, thereby reducing material loss and saving costs, while effectively improving heat dissipation efficiency.

In a possible implementation, the top plate and/or the side wall are made of flexible material. The flexible material can make the bottom plate, top plate or side wall deform according to the shape of the heat sink when in contact with the heat sink, so that the bottom plate, top plate or side wall can fit the heat sink reliably and effectively transfer heat to the coolant in the cold plate, so that one cold plate can be used to dissipate heat for multiple heat sinks, thereby improving heat dissipation efficiency, reducing space occupation, and facilitating product miniaturization.

In a possible implementation, the bottom plate is a single-layer structure or a multi-layer structure. The bottom plate can be a single-layer structure, so that the bottom plate and the cold plate can be easily processed and manufactured. The bottom plate can also be a multi-layer structure, and the softness of each layer can be different, so as to improve the strength of the bottom plate and avoid tearing.

In a possible implementation, when the bottom plate is a single-layer structure, the flexible material is one or more of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone. The bottom plate made of such materials can have good flexibility and lower thermal resistance than air, and can be elastically expanded and deformed by the pressure of the coolant, so that the bottom plate can fit with the heat sink, and there will be no gap between the bottom plate and the heat sink, avoiding the gap between the bottom plate and the heat sink, thereby reducing the thermal resistance, and at the same time maximizing the contact area between the bottom plate and the heat sink, so that the heat of the heat sink can be transferred to the coolant through the bottom plate, thereby improving the heat dissipation effect.

In a possible implementation, when the base plate is a multi-layer structure, the base plate includes a first layer and a second layer, the hardness of the first layer is greater than the hardness of the second layer, the first layer is used to enhance the structural strength of the base plate, and the second layer is used to ensure the flexibility of the base plate.

In a possible implementation, the first layer and the second layer are made of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone. The first layer and the second layer made of these materials have good flexibility, and the hardness of the first layer and the second layer can be adjusted through corresponding processes to improve the structural strength of the bottom plate. In an implementation mode of the invention, the material of the bottom plate is a single-layer structure or a multi-layer structure, which is a composite material composed of carbon fiber or glass fiber and one or more of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone. The carbon fiber or glass fiber can improve the overall strength of the bottom plate, prevent the bottom plate from being damaged during use, and extend the service life of the bottom plate.

In a possible implementation, the top plate and the bottom plate form the main body of the cold plate, at least part of the side wall forms the inlet and outlet of the cold plate, the flow channel is arranged in the main body, the inlet and the outflow are respectively connected to the two ends of the main body, the liquid inlet is arranged in the inlet, and the liquid outlet is arranged in the outflow; the inner side wall of the inlet and/or the outflow is provided with a guide structure, and the guide structure is used to make the cooling liquid evenly distributed in the flow channel.

The coolant entering from the liquid inlet can be dispersed to various positions of the main body through the guidance and diversion of the guide structure, so that the coolant can flow at various positions of the main body, and the heat at various positions can be taken away by the coolant, thereby improving the heat dissipation effect of the cold plate. The outflow part can also be provided with a guide structure, through which the coolant in the main body can be gathered to the liquid outlet to speed up the output of the coolant, reduce the impact of the coolant on the inner wall of the cold plate, and reduce noise.

In a possible implementation, the guide structure includes a plurality of guide plates arranged in parallel and at intervals.

Among them, each guide plate can realize the diversion of the coolant, so that the coolant entering from the liquid inlet can be distributed between any two adjacent guide plates, so that the coolant entering from the liquid inlet can be quickly distributed to various areas of the main body, so that each part of the main body can play an effective heat dissipation function.

In one possible implementation, the guide structure includes a plurality of guide plates, and the plurality of guide plates in the inlet portion converge from a side close to the main body portion toward a side of the liquid inlet, and/or the plurality of guide plates in the outflow portion converge from a side close to the main body portion toward a side of the liquid outlet.

Among them, each guide plate is distributed in a radial shape, so that the ends of each guide plate close to the liquid inlet are relatively gathered, so that the coolant entering from the liquid inlet can quickly enter between two adjacent guide plates, and be guided to different areas of the main body through the guide plates, so that all parts of the main body can play an effective heat dissipation function. In addition, the coolant that has undergone heat exchange in the main body can also be quickly gathered to the position of the liquid outlet through the guide plate of the outflow part, so that it can quickly flow out from the liquid outlet, thereby improving the heat exchange efficiency.

In a possible implementation, there are multiple flow channels, and the multiple flow channels are arranged in an array, and the cross-sectional shape of the flow channels is circular, elliptical, rectangular, square or trapezoidal along a direction perpendicular to the flow of the coolant in the flow channels.

Among them, the multiple flow channels distributed in an array can be evenly distributed in various positions and regions in the cold plate for heat dissipation, thereby improving the heat dissipation efficiency of the cold plate and achieving uniform heat dissipation at various positions of the heat sink.

In a possible implementation, the flow channel has one, thereby simplifying the structure, facilitating processing and manufacturing, and saving costs.

In a possible implementation, the wall thickness of the base plate is determined by the thermal conductivity of the cold plate material, the surface temperature of the heat sink, the temperature of the coolant, and the heat flux density of the heat sink. The wall thickness of the base plate can be designed according to the above parameters of the base plate, the heat sink, and the coolant, so that the base plate has a more appropriate wall thickness in the corresponding heat dissipation scenario, ensuring that the base plate has a reliable structural strength in the corresponding scenario and can obtain a longer service life.

In a possible implementation, the wall thickness of the bottom plate is 0.1 to 5 mm. Due to the variety of sizes, heat generation, and heat dissipation environments of the heat sink, the bottom plate may have different thicknesses corresponding to different heat sinks to ensure that the bottom plate has better structural strength and service life when dissipating heat from different heat sinks, thereby achieving the versatility of the liquid cooling device.

In a possible implementation, the deformation amount of the bottom plate caused by the pressure of the coolant is determined by the thickness of the cold plate, the equivalent elastic modulus of the bottom plate material, the wall thickness of the bottom plate and the cooling liquid pressure. Thus, the cold plate and the heat sink can be matched with a better bottom plate deformation amount in the corresponding heat dissipation scenario, which can avoid the bottom plate from contacting the heat sink before the bottom plate expands and deforms, and can reliably fit the bottom plate with the heat sink after the bottom plate expands.

In one possible implementation, when there are multiple heat sinks, there are gaps between the multiple heat sinks. The base plate can cover the surfaces of the multiple heat sinks and fill the gaps, so that the heat sink and the base plate have a larger contact area and the heat dissipation efficiency is improved.

In a possible implementation, the cold plate is integrally formed by injection molding, blow molding, extrusion or ultrasonic welding. The above-mentioned integral molding process can form the bottom plate, top plate, side wall and internal flow channel of the cold plate at one time. This facilitates the manufacture of the cold plate and can ensure the overall structural stability of the cold plate.

In a possible implementation, the liquid-cooled heat dissipation device also includes a regulating mechanism, a first valve, a second valve and a third valve, the regulating mechanism is provided with a second accommodating chamber, and the second accommodating chamber is communicated with the flow channel; the first valve is provided at the liquid inlet, the second valve is provided at the liquid outlet, and the third valve is provided between the cold plate and the regulating mechanism; when the first valve and the second valve are closed and the third valve is opened, the coolant in the cold plate flows into the second accommodating chamber, causing the cold plate to shrink.

Among them, when it is necessary to plug or unplug the heat sink or disassemble the cold plate, the first valve and the second valve can be closed and the third valve can be opened, so that the coolant in the cold plate can flow into the cavity of the adjustment mechanism. After the coolant in the cold plate is reduced, it shrinks and deforms, so that a gap is generated between the cold plate and the heat sink, thereby avoiding contact between the heat sink and the cold plate and causing wear when plugging and unplugging the heat sink.

When the cold plate needs to expand to contact the heat sink for heat dissipation, the first valve and the second valve are opened, and the third valve is closed, so that the coolant can flow into the cold plate from the liquid inlet and flow out from the liquid outlet to achieve normal coolant circulation. By closing the third valve, the coolant in the cold plate can be prevented from flowing into the adjustment mechanism, ensuring that the cold plate can maintain an expanded state.

In one possible implementation, the surface shape of the base plate matches the surface shape of the heat sink. The surface shape of the base plate is the shape before expansion, which can better adapt to the heat sink with a flat or irregular surface, and can ensure that the base plate can fit more reliably when it contacts the heat sink after expansion and deformation.

In a second aspect, a heat dissipation system is further provided, comprising at least one liquid cooling device provided in the first aspect of the present application, and the heat dissipation system further comprises:

a heat exchanger, wherein the inlet of the heat exchanger is connected to the liquid outlet of the cold plate, and the outlet of the heat exchanger is connected to the liquid inlet of the cold plate;

A first power mechanism, wherein one end of the first power mechanism is communicated with the heat exchanger, and the other end of the first power mechanism is communicated with the liquid inlet of the cold plate.

The heat exchanger can realize heat exchange of the coolant, so that the temperature of the coolant input into the liquid cooling device is lower, the first power mechanism can provide power for the circulation of the coolant in the entire cooling system, and the controller can control the operation of the first power mechanism. Therefore, the cooling system can realize continuous and efficient heat dissipation of the heat sink, can be applied to the inside or outside of the electronic equipment, and has the versatility of heat dissipation in different scenarios.

In one possible implementation, the heat dissipation system also includes a liquid replenishment container for holding coolant and a second power mechanism, the liquid replenishment port of the liquid replenishment container is connected to the heat exchanger and the liquid-cooled heat dissipation device through the second power mechanism, and the liquid return port of the liquid replenishment container is connected to the adjustment mechanism of the liquid-cooled heat dissipation device.

When the cold plate needs to be switched from an expanded state to a contracted state, the coolant in the cold plate needs to flow into the volume of the regulating mechanism, and the coolant in the regulating mechanism can be further converged into the refill container through the pipeline. When the amount of coolant in the circulation loop of the heat dissipation system is insufficient, the coolant recovered in the refill container can be added to the circulation loop of the heat dissipation system through the second power mechanism, so that the heat dissipation system can continue to operate normally. The second power mechanism can be a pump, which can pump the coolant in the refill container into the flow path of the heat dissipation system, and the second power mechanism can be started and stopped by controlling the pump.

In a third aspect, an electronic device is also provided, which includes the liquid-cooled heat sink and the heat sink provided in the first aspect of the present application or any possible implementation of the first aspect, wherein the cold plate in the liquid-cooled heat sink is used to contact the heat sink.

Among them, the electronic device including the liquid cooling heat dissipation device has the same technical effects as the liquid cooling heat dissipation device described above, which will not be repeated here.

In one possible implementation, there are multiple heat sinks, a first gap is set between the multiple heat sinks, and the cold plate is set in the first gap. When coolant is passed through the cold plate, the flexible bottom plate and top plate can be deformed by the pressure of the coolant and can fit with the heat sinks on both sides, so that heat can be dissipated by multiple heat sinks through one cold plate, thereby improving the heat dissipation efficiency.

In a possible implementation, the electronic device further includes a stopper, a second gap is provided between the stopper and the heat sink, and the cold plate is provided in the second gap. When the cold plate is used to dissipate heat from the heat sink on one side, the stopper may be located on the side of the cold plate away from the heat sink to limit the position of the cold plate, thereby ensuring that the cold plate can reliably fit with the heat sink after expansion, and avoiding separation of the cold plate from the heat sink.

In a possible implementation, the electronic device has a plurality of electronic devices, and the cold plate is disposed between two adjacent electronic devices. Thus, heat dissipation of the electronic device can be achieved outside the electronic device.

It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a top view of a heat dissipation system provided by the present application;

FIG2 is a top view of a liquid cooling device provided by the present application;

FIG3 is a top view of a cold plate provided by the present application;

FIG4 is a cross-sectional view at A-A in FIG3 provided by the present application;

FIG5 is a cross-sectional view of a bottom plate with a single-layer structure provided by the present application;

FIG6 is a schematic diagram of a multi-layer structure bottom plate provided by the present application, in which the first layer is located outside the second layer;

FIG7 is a schematic diagram of a multi-layer structure bottom plate provided by the present application, in which the first layer is located inside the second layer;

FIG8 is a schematic diagram of a base plate provided in the present application in which a reinforcing material is provided;

FIG9 is a cross-sectional view of the inflow portion provided by the present application at B-B in FIG3 ;

FIG10 is another cross-sectional view of the inflow portion provided by the present application at the B-B position in FIG3 ;

FIG11 is another cross-sectional view of the cold plate at position A-A in FIG3 provided by the present application;

FIG12 is a cross-sectional view of another cold plate at A-A in FIG3 provided by the present application;

FIG13 is a cross-sectional view of another cold plate at A-A in FIG3 provided by the present application;

FIG14 is a top view of a heat dissipation system provided by the present application when a cold plate is placed above a heat dissipation body;

FIG15 is a cross-sectional view of a cold plate placed above a heat sink at position C-C in FIG14 provided by the present application;

FIG16 is a top view of a heat dissipation system provided by the present application when a heat sink is placed above a cold plate;

FIG17 is a top view of a heat dissipation system provided by the present application when being applied to heat dissipation of memory;

FIG18 is a cross-sectional view at D-D in FIG17 provided by the present application;

FIG19 is a schematic diagram of a heat dissipation system provided in the present application when used to dissipate heat from electronic equipment.

Reference numerals:
10-liquid cooling device; 1-cold plate; 11-bottom plate; 111-first layer;
112- second layer; 113- reinforcing material; 12- top plate; 13- side wall;
14-main body; 15-inflow part; 151-liquid inlet; 16-outflow part;
161-liquid outlet; 17a-guide plate; 17b-guide plate; 18-flow channel;
2-regulating mechanism; 3-first valve; 4-second valve; 5-third valve;
20-heat exchanger; 30-first power mechanism; 40-controller; 50-liquid replenishing container;
60-second power mechanism; 100-electronic device; 110-electronic device; 111-memory;
112-PCB; 113-capacitor; 114-inductor.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

Detailed ways

In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

At present, the heat dissipation of components is mainly liquid cooling and air cooling. Among them, the liquid cooling can use a metal cold plate with a thermal interface material (TIM) to dissipate heat from the heating device. The coolant can flow through the metal cold plate, and the coolant and the metal surface can achieve a good heat dissipation effect. However, the existing metal cold plate is usually a regular rectangular plate. The surface of the metal cold plate is a plane, and the metal cold plate can contact the plane on the heating device to dissipate heat. However, the hardness of the metal cold plate and the heating device is relatively large, and the plane of the metal cold plate and the plane of the heating device cannot be guaranteed to be completely fitted. There will still be many tiny gaps between the planes, and these gaps will be filled with air. The thermal resistance of air is much greater than the thermal resistance of the metal cold plate material and the surface material of the heating device, which is not conducive to heat dissipation. For this reason, the traditional method is generally to add TIM material between the metal cold plate and the heating device to reduce the thermal resistance. The TIM material itself is relatively soft and can fill the gap between the metal cold plate and the heating device through its own deformation. The thermal resistance of the TIM material is lower than that of the air, thereby achieving the purpose of reducing the thermal resistance.

However, the extensive use of TIM materials will increase the cost of heat dissipation products, and the thickness of TIM materials is relatively small. When the heat-generating device is a pluggable device, since the TIM material fits tightly against the heat-generating device, each plugging and unplugging will cause great wear and even damage to the TIM material, rendering the TIM material unusable, thereby increasing the waste of materials and costs.

The present application provides a liquid cooling heat dissipation device 10 that can be applied to a heat dissipation system. The liquid cooling heat dissipation device can be arranged inside or outside the electronic device 100. The electronic device 100 can be a mobile phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) device, a virtual reality (VR) device, an artificial intelligence (AI) device, a wearable device, a vehicle-mounted device, a smart home device and/or a smart city device, a personal computer (PC) server, an edge device, a supercomputer, and other electronic devices that can use liquid cooling to dissipate heat. The embodiments of the present application do not impose any special restrictions on the specific types of the electronic devices.

In one embodiment, a heat sink is provided in the electronic device. For example, when the electronic device is a computer, the computer may be provided with heat sinks such as memory, hard disk, inductor, capacitor, motherboard, etc. The liquid cooling heat sink provided in this embodiment may contact these heat sinks to achieve heat dissipation. For example, when the heat sink is only a capacitor, the liquid cooling heat sink may be used to dissipate heat from the capacitor. When the heat sink is a capacitor and an inductor, the liquid cooling heat sink may contact the capacitor and the inductor at the same time to dissipate heat.

In another embodiment, the liquid cooling heat dissipation device can be used to dissipate heat for the entire electronic device in addition to dissipating heat for a specified electronic device in the same electronic device. That is, the heat sink can be the electronic device itself in addition to the electronic components in the electronic device. In this case, the heat sink is used to dissipate heat for the entire electronic device. For example, when the heat sink is a blade server, the heat sink is used to dissipate heat for the blade server. When the heat sink is a plurality of blade servers, the liquid cooling heat sink can be used to dissipate heat for the plurality of blade servers.

In another embodiment, the heat sink may also be a new energy vehicle battery, etc.

For example, FIG1 is a top view of a heat dissipation system provided by the present application. Referring to FIG1 , the heat dissipation system includes a heat exchanger 20, a first power mechanism 30, a controller 40, and the liquid-cooled heat dissipation device 10, wherein the heat of the heat dissipation body can be transferred to the coolant in the liquid-cooled heat dissipation device 10, so that the temperature of the heat dissipation body decreases, and the temperature of the coolant in the liquid-cooled heat dissipation device 10 increases. The coolant with increased temperature can enter the heat exchanger 20, and the heat exchanger 20 can reduce the temperature of the coolant again, so that the coolant with a lower temperature enters the next heat dissipation cycle. The first power mechanism 30 can provide power for the flow of the coolant in the liquid-cooled heat dissipation device 10.

Specifically, Figure 2 is a top view of a liquid-cooled heat dissipation device provided by the present application, Figure 3 is a top view of a cold plate provided by the present application, and Figure 4 is a cross-sectional view at A-A in Figure 3 provided by the present application. Referring to Figures 2 to 4, the liquid-cooled heat dissipation device 10 includes a cold plate 1, and the cold plate 1 includes a side wall 13, a top plate 12 and a bottom plate 11. The side wall 13, the top plate 12 and the bottom plate 11 constitute a first accommodating cavity, and a flow channel 18 is arranged in the first accommodating cavity. The side wall 13 is respectively provided with a liquid inlet 151 and a liquid outlet 161 connected to the flow channel 18, and the liquid inlet 151 can be used to input cooling liquid into the flow channel 18 in the cold plate 1, and the liquid outlet 161 can be used to output the cooling liquid in the flow channel 18 that has undergone heat exchange with the heat sink.

The bottom plate 11 is made of a flexible material. When the bottom plate 11 contacts the heat sink, the bottom plate 11 can be deformed according to the shape of the heat sink so that the bottom plate 11 fits the heat sink and conducts the heat of the heat sink to the coolant flowing in the flow channel 18 .

The heat sink may have a flat surface or a non-flat surface. When the cold plate 1 is attached to the heat sink through the bottom plate 11 made of a flexible material, the flexible bottom plate 11 can match the surfaces of various shapes on the heat sink through its own deformation, so that the flexible bottom plate 11 is closely attached to the surface of the heat sink, and there is no gap between the flexible bottom plate 11 and the heat sink, so that the heat of the heat sink can be directly transferred to the coolant in the flow channel 18 through the bottom plate 11 to achieve heat dissipation. There is no need to add additional flexible materials such as TIM materials between the flexible bottom plate 11 and the heat sink, so that material loss can be reduced and cost can be saved.

Specifically, since the cold plate 1 is provided with a flexible bottom plate 11, when the cold plate 1 is placed above the heat sink, the bottom plate 11 The flexibility of the body can be deformed when supported by the heat sink, so as to achieve reliable fit with the heat sink. When the coolant is passed into the flow channel 18, the gravity of the coolant can act on the bottom plate 11, so that the deformation of the bottom plate 11 can be increased, further ensuring that the bottom plate 11 is reliably in contact with the heat sink, so that the bottom plate 11 can adapt to the shape of different heat sink surfaces through its own deformation, so that the bottom plate 11 can fit closely with the plane or special-shaped surface of the heat sink, conduct the heat of the heat sink to the coolant flowing in the flow channel, and then achieve the heat dissipation of the heat sink by the heat dissipation device.

In addition, when there are multiple heat sinks, and there is a gap between two adjacent heat sinks, the cold plate 1 can be placed in the gap between the two adjacent heat sinks. When coolant flows into the flow channel 18 of the cold plate 1, the bottom plate 11 can be deformed by the pressure of the coolant, so that the bottom plate 11 can be reliably fitted with the adjacent heat sink to achieve effective heat dissipation.

In this embodiment, the cold plate 1 can be an integrally formed structure, for example, the cold plate 1 can be integrally formed by an injection molding process, a blow molding process, an extrusion process or an ultrasonic welding process. That is, the bottom plate 11, the top plate 12, the side wall 13 and the internal flow channel 18 of the cold plate 1 can be formed at one time by the above-mentioned integrally formed process, thereby facilitating the manufacture of the cold plate 1 and ensuring the overall structural stability of the cold plate 1.

In one embodiment, the bottom plate 11, the top plate 12, the side wall 13 and the side wall of the flow channel 18 can all be made of flexible materials. Therefore, when the coolant is passed into the flow channel 18, all parts of the cold plate 1 as a whole can be expanded and deformed by the pressure of the coolant, and all parts of the cold plate 1 can be used to contact the heat sink for heat dissipation. It is possible to use one cold plate 1 to dissipate heat for multiple heat sinks, thereby improving the heat dissipation efficiency, reducing space occupancy, and facilitating product miniaturization.

In another embodiment, both the bottom plate 11 and the top plate 12 can be made of flexible materials. When the cold plate 1 is placed between two adjacent heat sinks, the bottom plate 11 of the cold plate 1 can contact one heat sink, and the top plate 12 of the cold plate 1 can contact another heat sink, so that the two heat sinks can be cooled by one cold plate 1 at the same time, which simplifies the structure and improves the heat dissipation efficiency. Among them, the side wall 13 can be made of metal material, and the bottom plate 11 and the top plate 12 can be fixed on both sides of the side wall 13 respectively. The side wall 13 made of metal material can ensure the stability of the overall structural shape of the cold plate 1.

In another embodiment, both the bottom plate 11 and the side wall 13 may be made of flexible materials, so that the bottom plate 11 may be more easily elastically deformed, thereby reducing the restriction of the side wall 13 on the deformation of the bottom plate 11 .

Optionally, the cross-sectional shape of the cold plate 1 can be circular, oval, square, rectangular, trapezoidal, etc. In this embodiment, for the sake of convenience, the cross-sectional shape of the cold plate 1 is circular as an example for explanation. FIG5 is a cross-sectional view of a bottom plate provided by the present application as a single-layer structure. The cross section shown in FIG5 is a cross section formed after cutting at A-A in FIG3. Referring to FIG5, the bottom plate 11 can be a single-layer structure, that is, the bottom plate 11 can be directly formed of a single material or composite material to form a flexible layer with a certain wall thickness. The flexible layer can be applied to the cold plate 1 to form the bottom plate 11, thereby facilitating the processing and manufacturing of the bottom plate 11 and the cold plate 1.

Optionally, when the bottom plate 11 is a single-layer structure, the flexible material is one or more of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone. The bottom plate 11 made of such materials can have good flexibility and lower thermal resistance than air, and can be elastically expanded and deformed by the pressure of the coolant, so that the bottom plate 11 can fit with the heat sink, and there will be no gap between the bottom plate 11 and the heat sink, avoiding empty filling between the bottom plate 11 and the heat sink, thereby reducing thermal resistance, and at the same time maximizing the contact area between the bottom plate 11 and the heat sink, so that the heat of the heat sink can be transferred to the coolant through the bottom plate 11, thereby improving the heat dissipation effect.

In another embodiment, the bottom plate 11 may be a multi-layer structure, for example, the bottom plate 11 may include two layers, three layers, four layers or more layers, and the materials of each layer may be the same or different, but the properties of the materials of each layer may be different. For example, the bottom plate 11 may include two layers, both of which are flexible, but the hardness of one layer may be slightly greater than the hardness of the other side, so that the overall strength of the bottom plate 11 can be improved by the layer with greater hardness while ensuring the overall flexibility of the bottom plate 11, thereby avoiding tearing.

Optionally, Figure 6 is a schematic diagram of a first layer of a multi-layer structure base provided by the present application, in which the first layer is located on the outside of the second layer, and Figure 7 is a schematic diagram of a first layer of a multi-layer structure base provided by the present application, in which the first layer is located on the inside of the second layer. Referring to Figures 6 and 7, when the base plate 11 is a multi-layer structure, the base plate 11 includes a first layer 111 and a second layer 112, and the hardness of the first layer 111 and the second layer 112 are different. The hardness of the first layer 111 may be greater than the hardness of the second layer 112. The first layer 111 is used to enhance the structural strength of the base plate 11, and the second layer 112 is used to ensure the flexibility of the base plate 11.

In the process of preparing the cold plate, the first layer 111 and the second layer 112 may be prepared separately, and then the first layer 111 and the second layer 112 may be laminated and combined into a composite layer of an integral structure. The composite layer is made into a preform, which can be placed in a mold, and compressed air is introduced into the preform to inflate the preform to form a cold plate. The bottom plate 11 as a part of the cold plate can also be directly formed.

Wherein, the first layer 111 and the second layer 112 are both flexible layers, on this basis, the hardness of the first layer 111 can be greater than the hardness of the second layer 112, or less than the hardness of the second layer 112, so that the strength of the bottom plate 11 can be improved by a layer with a larger hardness, and the flexibility of the bottom plate 11 can be ensured by a layer with a smaller hardness. Wherein, referring to FIG6, the first layer 111 can be arranged on the outside of the second layer 112, referring to FIG7, or it can be arranged on the inside of the second layer 112, and the "outside" is the outside of the cold plate 1, and the "inside" is the inside of the cold plate 1. In a preferred embodiment, referring to FIG6, the hardness of the outer layer is less than the hardness of the inner layer, so that the structure can be strengthened from the inside of the bottom plate 11, and the bottom plate 11 can maintain a certain shape, and the outer layer of the bottom plate 11 can have better flexibility and can adapt to the surface of the heat sink. In this embodiment, the outer layer can directly contact the heat sink.

Specifically, the materials of the first layer 111 and the second layer 112 are respectively one of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone. For example, the material of the first layer 111 can be polyethylene, and the material of the second layer 112 can be polypropylene; or the material of the first layer 111 can be polytetrafluoroethylene, and the material of the second layer 112 can be silicone; or the first layer 111 and the second layer 112 can be made of the same material, and in the process of making the first layer 111 and the second layer 112, the hardness of the first layer 111 or the second layer 112 can be different by controlling the process parameters.

Optionally, the material of the single-layer structure and multi-layer structure of the bottom plate 11 is a composite material composed of carbon fiber or glass fiber and one or more of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone. For example, FIG8 is a schematic diagram of a bottom plate provided by the present application with a reinforcing material. Referring to FIG8, when the bottom plate 11 has only one layer, the layer can be composited with one or more of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone, and reinforcing materials 113 such as carbon fiber or glass fiber can be added to the material of the bottom plate 11 at the same time. The reinforcing materials 113 such as carbon fiber or glass fiber can improve the overall strength of the bottom plate 11, prevent the bottom plate 11 from being damaged during use, and extend the service life of the bottom plate 11.

The structural scheme of the liquid inlet 151 and the liquid outlet 161 is further described below in conjunction with FIG. 3 . FIG. 3 is a top view of a cold plate provided by the present application.

For ease of description, the area formed by the top plate 12 and the bottom plate 11 may be referred to as the main body 14 of the cold plate 1, the area in the side wall 13 where the liquid inlet is provided may be referred to as the inflow portion 15, and the area where the liquid outlet is provided may be referred to as the outflow portion 16. It is understood that the flow channel 18 is provided in the main body 14, the inflow portion 15 and the outflow portion 16 are respectively connected to the two ends of the main body 14, the liquid inlet 151 is provided in the inflow portion 15, and the liquid outlet 161 is provided in the outflow portion 16.

Among them, referring to FIG3 , the main body 14 can have a large area. In order to enable each part of the main body 14 that contacts the heat sink to have a good heat dissipation effect, the coolant needs to flow in each area of the main body 14 corresponding to the heat sink to take away the heat from each part. However, the liquid inlet 151 and the liquid outlet 161 need to be connected to a pipeline with a small diameter. When the coolant enters the main body 14 from the liquid inlet 151 with a small diameter, the coolant is approximately columnar and is not easy to diffuse to the surroundings, which will result in less or even no coolant at a position far from the liquid inlet 151 in the main body 14, which will result in the failure of some positions on the main body 14 far from the liquid inlet 151 to achieve a heat dissipation effect.

To this end, the guide plate provided by the present application is further described in conjunction with Figures 9 and 10. Figure 9 is a cross-sectional view of the inflow portion provided by the present application at B-B in Figure 3, and Figure 10 is another cross-sectional view of the inflow portion provided by the present application at B-B in Figure 3.

Referring to FIG. 9 and FIG. 10 , the inner wall 13 of the inflow portion 15 and/or the outflow portion 16 may be provided with a guide structure, and the guide structure is used to evenly distribute the coolant in the flow channel 18. The coolant entering from the liquid inlet 151 can be dispersed to various positions of the main body 14 through the guidance and diversion of the guide structure, so that the coolant can flow at various positions of the main body 14, so that the heat at various positions can be taken away by the coolant, thereby improving the heat dissipation effect of the cold plate 1. The outflow portion 16 may also be provided with a guide structure, through which the coolant in the main body 14 can be gathered to the liquid outlet 161, so as to speed up the output of the coolant, reduce the impact of the coolant on the inner wall of the cold plate 1, and reduce noise.

In a specific embodiment, referring to Fig. 9, the guide structure may include a plurality of guide plates 17a arranged in parallel and spaced apart. Each guide plate 17a can realize the diversion of the coolant, so that the coolant entering from the liquid inlet 151 can be distributed between any two adjacent guide plates 17a, so that the coolant entering from the liquid inlet 151 can be quickly distributed to various areas of the main body 14, so that each part of the main body 14 can play an effective heat dissipation function.

In another specific embodiment, referring to FIG. 10 , the flow guide structure may include a plurality of flow guide plates 17 b, and a plurality of flow guide plates 17 b in the inflow portion 15 may be provided. The guide plates 17b are gathered from the side close to the main body 14 to the side of the liquid inlet 151, and/or the multiple guide plates 17b of the outflow part 16 are gathered from the side close to the main body 14 to the side of the liquid outlet 161. In this embodiment, the guide plates 17b are radially distributed, so that the ends of the guide plates 17b close to the liquid inlet 151 are relatively gathered, so that the coolant entering from the liquid inlet 151 can quickly enter between two adjacent guide plates 17b, and be guided to different areas of the main body 14 through the guide plates 17b, so that all parts of the main body 14 can play an effective heat dissipation function. In addition, the coolant that has undergone heat exchange in the main body 14 can also be quickly gathered to the position of the liquid outlet 161 through the guide plates 17b of the outflow part 16, so that it can quickly flow out from the liquid outlet 161, thereby improving the heat exchange efficiency.

The guide plate can be integrally formed during the molding process of the side wall 13 . For example, the guide plate can be integrally formed with the side wall 13 through an injection molding process, a blow molding process, an extrusion process, or an ultrasonic welding process.

Next, the structure of the flow channel 18 provided in the present application is introduced in conjunction with FIG. 11 .

There may be one or more flow channels 18 in the cold plate 1. FIG. 11 is another cross-sectional view of the cold plate at A-A in FIG. 3 provided by the present application, FIG. 12 is another cross-sectional view of the cold plate at A-A in FIG. 3 provided by the present application, and FIG. 13 is another cross-sectional view of the cold plate at A-A in FIG. 3 provided by the present application. Referring to FIG. 11 to FIG. 13, when a plurality of flow channels 18 are provided in the cold plate 1, the plurality of flow channels 18 are arranged in an array. Among them, the plurality of flow channels 18 may have one row and multiple columns, or may have multiple rows and multiple columns, and the plurality of flow channels 18 distributed in an array may be evenly distributed in various position areas in the cold plate 1 for heat dissipation, thereby improving the heat dissipation efficiency of the cold plate 1 and achieving uniform heat dissipation at various positions of the heat sink.

Of course, in some other embodiments, referring to FIG. 4 , there may be only one flow channel 18 , that is, the accommodating cavity in the cold plate 1 serves as the flow channel 18 .

The cross-sectional shape of the flow channel 18 may be, but is not limited to, circular, elliptical, rectangular, square or trapezoidal. Referring to FIG. 11 , the cross-sectional shape of the flow channel 18 is rectangular; referring to FIG. 12 , the cross-sectional shape of the flow channel 18 is runway-shaped; referring to FIG. 13 , the cross-sectional shape of the flow channel 18 is circular. The specific shape may be designed according to the surface condition of the heat sink so that the cold plate 1 can achieve a better heat dissipation effect.

The structure of the bottom plate 11 will be further described below with reference to the accompanying drawings.

The wall thickness of the bottom plate 11 can be determined by the thermal conductivity of the cold plate 1 material, the surface temperature of the heat sink, the temperature of the coolant, and the heat flux density of the heat sink. The bottom plate 11 is made of a flexible material. After frequent expansion or contraction, the strength of the bottom plate 11 will be weakened. If the thickness of the bottom plate 11 is too small, the bottom plate 11 will be broken when the bottom plate 11 expands and deforms; and if the thickness of the bottom plate 11 is too large, it will be unfavorable for the expansion and deformation of the bottom plate 11, and it is difficult to ensure that the bottom plate 11 and the heat sink are reliably fitted. Therefore, in this embodiment, by comprehensively considering the thermal conductivity of the cold plate 1 material, the surface temperature of the heat sink, the temperature of the coolant, and the heat flux density of the heat sink, the wall thickness of the bottom plate 11 can be reasonably designed to ensure the normal use of the cold plate 1 and extend its service life.

In a specific embodiment, the wall thickness of the bottom plate 11 can be calculated by the following formula:

Wherein, h is the wall thickness of the bottom plate 11; k is the thermal conductivity of the material of the bottom plate 11; Tc is the surface temperature of the heat sink; T is the temperature of the coolant; and q is the heat flux density of the heat sink.

In this embodiment, the wall thickness of the base plate 11 can be designed according to the above parameters of the base plate 11, the heat sink and the coolant, so that the base plate 11 can have a more suitable wall thickness in the corresponding heat dissipation scenario, ensuring that the base plate 11 has reliable structural strength in the corresponding scenario and can obtain a longer service life.

Optionally, the wall thickness of the bottom plate 11 can be 0.1 to 5 mm. Due to the variety of sizes, heat generation, heat dissipation environments, etc. of the heat sink, the bottom plate 11 can have different thicknesses corresponding to different heat sinks to ensure that the bottom plate 11 has better structural strength and service life when dissipating heat for different heat sinks. In this embodiment, the wall thickness of the bottom plate 11 is 0.1 to 5 mm, so that the bottom plate 11 can be applicable to various heat sinks, thereby realizing the versatility of the liquid cooling heat dissipation device.

If the thickness of the bottom plate 11 is too small, for example, less than 0.1 mm, the bottom plate 11 will be cracked when it is expanded by the coolant pressure; if the thickness of the bottom plate 11 is too large, for example, greater than 5 mm, it is not conducive to the expansion and deformation of the bottom plate 11, resulting in the bottom plate 11 not being able to fit the surface of the heat sink, especially for a heat sink with an uneven surface, which is easy to cause a gap between the bottom plate 11 and the heat sink. gap, reducing the heat dissipation effect.

Of course, when the cold plate 1 is integrally formed by an injection molding process, a blow molding process, an extrusion process or an ultrasonic welding process, the bottom plate 11 , the top plate 12 and the side wall 13 may all have the same wall thickness.

Optionally, along the thickness direction of the cold plate 1, the deformation amount of the bottom plate 11 caused by the pressure of the coolant is determined by the thickness of the cold plate 1, the equivalent elastic modulus of the bottom plate 11 material, the wall thickness of the bottom plate 11 and the cooling liquid pressure. The above-mentioned "thickness of the cold plate 1" is the thickness when the cold plate 1 is not filled with coolant. When the cold plate 1 is placed between two adjacent heat sinks, the cold plate 1 is in a deflated state without being filled with coolant, and the thickness of the cold plate 1 is less than the distance between the two adjacent heat sinks, thereby avoiding the wear between the cold plate 1 and the heat sink when it is installed. In other words, in order to avoid the heat sink from being worn due to the contact between the cold plate 1 and the heat sink during the plug-in process or during the disassembly process of the cold plate 1, it is necessary to maintain a suitable gap between the cold plate 1 and the heat sink when the coolant is not filled in the cold plate 1, and the gap needs to enable the cold plate 1 to fit with the heat sink when it expands. Therefore, it is necessary to reasonably design the gap between the cold plate 1 and the heat sink, and the gap can be reflected by the deformation amount of the bottom plate 1 when it is subjected to the pressure of the coolant. In this embodiment, by comprehensively considering the thickness of the cold plate 1, the equivalent elastic modulus of the base plate 11 material, the wall thickness of the base plate 11 and the cooling hydraulic pressure, the cold plate 1 and the heat sink can be matched with an optimal deformation amount of the base plate 11 in a corresponding heat dissipation scenario, which can avoid contact between the base plate 11 and the heat sink before the base plate 11 expands and deforms, and can reliably fit the base plate 11 with the heat sink after expansion.

In one embodiment, the cold plate 1 is placed at the center between two adjacent heat sinks. The cold plate 1 has equal gaps with the corresponding heat sinks on both sides along the thickness direction, that is, the gap between the bottom plate 11 and the corresponding heat sink is equal to the gap between the top plate 12 and the corresponding heat sink.

Along the thickness direction of the cold plate 1, the deformation of the bottom plate 11 caused by the pressure of the coolant is calculated by the following formula:

Wherein, Δr is the deformation of the bottom plate 11 caused by the pressure of the coolant; D is the thickness of the cold plate 1 before the coolant is filled; E is the equivalent elastic modulus of the bottom plate 11 material; and h is the wall thickness of the bottom plate 11.

In this embodiment, the deformation amount of the bottom plate 11 caused by the pressure of the coolant can be designed according to the thickness of the cold plate 1 before the coolant is filled, the equivalent elastic modulus of the bottom plate 11 material and the wall thickness of the bottom plate 11, so that the bottom plate 11 can have a more appropriate deformation amount in the corresponding heat dissipation scenario, so that the bottom plate 11 does not contact the heat sink before deformation to avoid wear, and can be reliably fitted with the heat sink after deformation to achieve a better heat dissipation effect.

The above formula can reflect the deformation of the bottom plate 11, and of course can also be used for the deformation of the top plate 12. According to the deformation of the bottom plate 11 and the top plate 12, the gap between the cold plate 1 and the heat sink can be determined, which is convenient for the layout of the cold plate 1 and the heat sink to achieve a better heat dissipation effect.

Next, the working mode of the cold plate 1 is further described with reference to the accompanying drawings.

Referring to Figures 1 and 2, the liquid-cooled heat dissipation device also includes a regulating mechanism 2, a first valve 3, a second valve 4 and a third valve 5. A second accommodating chamber is provided in the regulating mechanism 2, and the second accommodating chamber is connected to the flow channel 18. The first valve 3 is provided at the liquid inlet 151, the second valve 4 is provided at the liquid outlet 161, and the third valve 5 is provided between the cold plate 1 and the regulating mechanism 2.

When the cold plate 1 needs to expand to contact with the heat sink for heat dissipation, the first valve 3 and the second valve 4 are opened, and the third valve 5 is closed, so that the coolant can flow into the cold plate 1 from the liquid inlet 151 and flow out from the liquid outlet 161, thereby realizing normal coolant circulation. By closing the third valve 5, the coolant in the cold plate 1 can be prevented from flowing into the adjustment mechanism 2, ensuring that the cold plate 1 can maintain an expanded state.

When it is necessary to plug or unplug the heat sink, or disassemble the cold plate 1, the first valve 3 and the second valve 4 can be closed, and the third valve 5 can be opened, so as to prevent the coolant in the heat dissipation system from being input into the cold plate 1. At the same time, the coolant in the cold plate 1 can flow into the second accommodating chamber of the adjustment mechanism 2, causing the cold plate 1 to shrink and deform, thereby creating a gap between the cold plate 1 and the heat sink, avoiding wear caused by contact between the cold plate 1 and the heat sink during the process of plugging or unplugging the heat sink or disassembling the cold plate 1.

Among them, the first valve 3, the second valve 4 and the third valve 5 can all be electrically connected to the controller 40 in the heat dissipation system, so that automatic control of each valve can be achieved, which is easy to operate.

Optionally, the surface shape of the bottom plate 11 matches the surface shape of the heat sink. Before, the surface of the base plate 11 has a certain shape, for example, the surface of the base plate 11 can be flat or uneven, and correspondingly, the surface of the heat sink can also have a shape corresponding to the surface of the base plate 11, so that when the base plate 11 expands and deforms and contacts with the heat sink, it can fit more reliably.

In one embodiment, when there are multiple heat sinks, there are gaps between the multiple heat sinks, and the bottom plate 11 can cover the surfaces of the multiple heat sinks. The bottom plate 11 can deform along with the shapes of the heat sink surfaces and fill the gaps. For example, FIG14 is a top view of a cooling system provided by the present application when a cold plate is placed above a heat sink, and FIG15 is a cross-sectional view of a cold plate placed above a heat sink at position C-C in FIG14 provided by the present application. Referring to FIG14 and FIG15 , a printed circuit board (PCB) may have various electronic devices 110 as heat sinks, such as an inductor 114, a capacitor 113, a resistor, etc. These electronic devices 110 protrude from the surface of the PCB 112. When it is necessary to dissipate heat from these electronic devices 110 on the PCB 112, the side of the cold plate 1 having the bottom plate 11 may be placed on the PCB 112. After being supported by the electronic devices 110, the bottom plate 11 may be deformed and wrapped around the outer surface of each electronic device 110, so that the bottom plate 11 and the electronic device 110 have a larger contact area, thereby having a better heat dissipation effect. The portion of the bottom plate 11 that is not in contact with the electronic device 110 may be supported on the PCB 112 between the electronic devices 110, thereby also dissipating heat from the PCB 112. The portion of the bottom plate 11 that is not in contact with the electronic device 110 is a portion of the bottom plate 11 located between the electronic devices 110 , or is another portion that is not in contact with the electronic device 110 during operation.

Among them, the surface shape of the bottom plate 11 before deformation can be a plane, and the flexibility of the bottom plate 11 can be used to cover the surface of the electronic device 110; the surface of the bottom plate 11 can also have a shape corresponding to the shape of the electronic device 110, for example, the bottom plate 11 has a first recessed structure and a second recessed structure matching the inductor 114 and the capacitor 113. When the bottom plate 11 expands, the first recessed structure on the bottom plate 11 can fit with the corresponding inductor 114, and the second recessed structure on the bottom plate 11 can fit with the corresponding capacitor 113. By making the bottom plate 11 have a shape corresponding to the electronic device 110, it can be ensured that the bottom plate 11 and each electronic device 110 are reliably fitted, thereby improving the heat dissipation effect.

FIG16 is a top view of a heat dissipation system provided by the present application when a heat sink is placed above a cold plate. In some other embodiments, referring to FIG16 , a PCB 112 mounted with components such as capacitors and inductors may be placed above the cold plate 1. The gravity of the PCB and the electronic device 110 presses on the cold plate 1, so that a reliable fit between the cold plate 1 and the electronic device 110 can be achieved.

The present application also provides a heat dissipation system, see FIG1 , the heat dissipation system includes the liquid cooling heat dissipation device provided in any embodiment of the present application, the heat dissipation system also includes a heat exchanger 20 and a first power mechanism 30, the inlet of the heat exchanger 20 is connected to the liquid outlet 161 of the cold plate 1, and the outlet of the heat exchanger 20 is connected to the liquid inlet 151 of the cold plate 1. One end of the first power mechanism 30 is connected to the heat exchanger 20, and the other end of the first power mechanism 30 is connected to the liquid inlet 151 of the cold plate 1, and the first power mechanism 30 can be a pump. Among them, the heat exchanger 20, the first power mechanism 30, and the liquid cooling heat dissipation device 10 can all be connected by pipelines.

The heat dissipation system can be arranged outside the electronic device, and only the liquid cooling device can be arranged inside the electronic device, so that the heat dissipation body inside the electronic device is cooled by the liquid cooling device, thereby avoiding the problem of occupying the internal space of the device and affecting the heat dissipation effect caused by arranging the heat dissipation system as a whole inside the electronic device. Of course, the liquid cooling device can also be arranged outside the electronic device to dissipate heat for the entire electronic device.

Optionally, the heat dissipation system may further include a controller 40, which may be electrically connected to the first power mechanism 30 to control the start and stop of the first power mechanism 30. The controller 40 may also control the flow rate of the coolant according to the temperature of the heat dissipation body.

As a possible implementation method, the cooling effect may deteriorate due to evaporation of the coolant as the coolant is used for a certain period of time, temperature, and environment. The present application also provides a refilling solution that can replenish the coolant in the flow channel in a timely manner.

Referring to Figure 1, the heat dissipation system also includes a liquid replenishing container 50 for containing coolant and a second power mechanism 60. The second power mechanism 60 is used to replenish the coolant in the liquid replenishing container 50 to the heat exchanger 20 and the liquid-cooled heat dissipation device. The liquid return port of the liquid replenishing container 50 is connected to the adjustment mechanism 2 of the liquid-cooled heat dissipation device.

When the cold plate 1 needs to be switched from an expanded state to a contracted state, the coolant in the cold plate 1 needs to flow into the cavity of the regulating mechanism 2, and the coolant in the regulating mechanism 2 can further flow back to the refill container 50 through the pipeline, wherein the controller 40 can control the regulating mechanism 2 to make the coolant therein flow back to the refill container 50. When the amount of coolant in the circulation loop of the heat dissipation system is insufficient, the coolant recovered in the refill container 50 can be supplemented to the circulation loop of the heat dissipation system through the second power mechanism 60, so that the heat dissipation system can continue to operate normally. The second power mechanism 60 can be a pump, which can pump the coolant in the refill container 50 into the flow path of the heat dissipation system, and the second power mechanism 60 can be started and stopped by the control of the pump.

The embodiment of the present application also provides an electronic device 100, which includes a liquid cooling device 10 and a heat sink provided in the embodiment of the present application. The cold plate 1 in the liquid cooling device 10 is used to contact the heat sink to achieve heat dissipation of the heat sink.

In one embodiment, referring to FIG. 14 and FIG. 15 , as described above, there may be multiple heat sinks, and there are gaps between the multiple heat sinks. The bottom plate 11 may cover the surfaces of the multiple heat sinks and fill the gaps.

In another embodiment, FIG17 is a top view of a heat dissipation system provided by the present application when used to dissipate heat for memory, and FIG18 is a cross-sectional view at D-D in FIG17 provided by the present application. Referring to FIG17 and FIG18 , there may be multiple heat sinks, a first gap is provided between the multiple heat sinks, and the cold plate 1 is provided in the first gap. In other words, the cold plate 1 can be provided between adjacent heat sinks to dissipate heat for multiple heat sinks at the same time, thereby improving the heat dissipation efficiency.

17 and 18, the heat sink may be a memory 111, and a plurality of memories 111 may be arranged. The cold plate 1 may be disposed between two adjacent memories 111 to dissipate heat for the memories 111. Of course, in some other embodiments, the heat sink may also be an inductor, a capacitor, and the like.

In another embodiment, the electronic device 100 further includes a stopper, a second gap is provided between the stopper and the heat sink, and the cold plate 1 is provided in the second gap. In this embodiment, the heat sink may have one, one side of the cold plate 1 may abut against the heat sink, and the other side may be limited by the stopper to ensure that the cold plate 1 can reliably fit with the heat sink after expansion, and to avoid separation of the cold plate 1 from the heat sink.

In one possible implementation, FIG19 is a schematic diagram of a heat dissipation system provided by the present application when applied to dissipate heat for an electronic device. Referring to FIG19 , the heat sink is an electronic device 100. At this time, the liquid-cooled heat dissipation device can dissipate heat for the electronic device, that is, the heat on the surface of the electronic device can be heat-exchanged with the heat of the coolant in the liquid-cooled heat dissipation device to achieve heat dissipation and cooling of the electronic device.

In another possible implementation, when the heat sink is a plurality of electronic devices 100, the cold plate 1 is disposed between two adjacent electronic devices 100. As described above, when the electronic device 100 is a blade server, the plurality of blade servers can be arranged in an array, and a liquid cooling device can be disposed between two adjacent blade servers to achieve heat dissipation for each blade server. Of course, in some other embodiments, the electronic device 100 can also be a new energy vehicle battery, etc.

As a possible implementation, when it is necessary to plug or unplug the heat sink, or disassemble the cold plate 1, the first valve 3 and the second valve 4 can be closed first, and the third valve 5 can be opened, so that all or part of the coolant in the cold plate 1 can flow into the accommodating chamber in the regulating mechanism 2 (for the convenience of description, it can be called the second accommodating chamber), so that the cold plate 1 can shrink and deform, so that a gap can be generated between the cold plate 1 and the heat sink, and wear caused by the contact between the cold plate 1 and the heat sink can be avoided during the process of plugging or unplugging the heat sink or disassembling the cold plate 1; then the coolant in the regulating mechanism 2 is controlled to flow back to the liquid replenishing container 50 for recycling. Among them, the regulating mechanism 2 can be connected to a pump, and the coolant in the regulating mechanism 2 can be extracted by controlling the start and stop of the pump.

When the heat sink is plugged in and out, and the cold plate 1 needs to be used for heat dissipation, the first valve and the second valve can be controlled to be opened, and the third valve can be closed, and the first power mechanism 30 can be started to promote the coolant to pass into the cold plate 1 through the liquid inlet. The high-temperature coolant in the cold plate 1 that has undergone heat exchange flows out from the liquid outlet and does not enter the regulating mechanism 2. The high-temperature coolant flowing out of the liquid outlet enters the heat exchanger 20 for cooling. The cooled coolant can enter the cold plate 1 from the liquid inlet again to achieve circulating heat dissipation.

As another possible implementation, when it is detected that the amount of coolant in the circuit formed by the liquid cooling device 10, the heat exchanger 20, and the first power system 30 is less than a set value, the second power mechanism 60 can be turned on. The second power mechanism 60 can replenish the coolant in the liquid replenishing container 50 into the circuit to ensure normal heat dissipation through the circulation of the coolant.

The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (18)

1. A liquid cooling device, comprising:

   A cold plate, the cold plate comprising a side wall, a top plate and a bottom plate, the side wall, the top plate and the bottom plate forming a first accommodating cavity, a flow channel being arranged in the first accommodating cavity, and a liquid inlet and a liquid outlet communicating with the flow channel being arranged on the side wall respectively;

   The bottom plate is made of a flexible material. When the bottom plate contacts the heat sink, the bottom plate can be deformed according to the shape of the heat sink so that the bottom plate fits the heat sink and conducts the heat of the heat sink to the coolant flowing in the flow channel.
2. The liquid cooling heat dissipation device according to claim 1 is characterized in that the base plate is a single-layer structure or a multi-layer structure.
3. The liquid cooling device according to claim 2 is characterized in that when the base plate is a single-layer structure, the flexible material is one or more of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone.
4. The liquid cooling device according to claim 2 is characterized in that when the base plate is a multi-layer structure, the base plate includes a first layer and a second layer, the hardness of the first layer is greater than the hardness of the second layer, the first layer is used to enhance the structural strength of the base plate, and the second layer is used to ensure the flexibility of the base plate.
5. The liquid cooling device according to claim 4 is characterized in that the materials of the first layer and the second layer are respectively one of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone.
6. The liquid cooling device according to any one of claims 1-5 is characterized in that the material of the base plate is a single-layer structure or a multi-layer structure, which is a composite material composed of carbon fiber or glass fiber and one or more of polyethylene, polypropylene, polytetrafluoroethylene, polyfluorinated ethylene propylene copolymer or silicone.
7. The liquid cooling device according to any one of claims 1 to 6, characterized in that:

   The inner wall of the liquid inlet is provided with a flow guiding structure, and the flow guiding structure is used to make the coolant evenly distributed in the flow channel.
8. The liquid cooling device according to claim 7 is characterized in that the guide structure includes a plurality of guide plates arranged in parallel and at intervals.
9. The liquid cooling device according to claim 7 is characterized in that the guide structure includes a plurality of guide plates, and the plurality of guide plates in the inlet portion converge from a side close to the main body portion to a side of the liquid inlet, and/or the plurality of guide plates in the outflow portion converge from a side close to the main body portion to a side of the liquid outlet.
10. The liquid-cooled heat sink according to any one of claims 1 to 9 is characterized in that the wall thickness of the base plate is determined by the thermal conductivity of the cold plate material, the surface temperature of the heat sink, the temperature of the coolant and the heat flux density of the heat sink.
11. The liquid cooling device according to claim 10 is characterized in that the wall thickness of the bottom plate is 0.1 to 5 mm.
12. The liquid-cooled heat dissipation device according to any one of claims 1-11 is characterized in that the deformation of the base plate caused by the pressure of the coolant is determined by the thickness of the cold plate, the equivalent elastic modulus of the base plate material, the wall thickness of the base plate and the pressure strength of the cooling liquid.
13. The liquid cooling device according to any one of claims 1 to 12 is characterized in that when there are multiple heat sinks, there are gaps between the multiple heat sinks, and the base plate can cover the surfaces of the multiple heat sinks and fill the gaps.
14. The liquid cooling heat dissipation device according to any one of claims 1-13 is characterized in that the cold plate is integrally formed by an injection molding process, a blow molding process, an extrusion process or an ultrasonic welding process.
15. The liquid cooling heat dissipation device according to any one of claims 1 to 14 is characterized in that the liquid cooling heat dissipation device further comprises a regulating mechanism, a first valve, a second valve and a third valve, the regulating mechanism is provided with a second accommodating chamber, and the second accommodating chamber is communicated with the flow channel; the first valve is provided at the liquid inlet, the second valve is provided at the liquid outlet, and the third valve is provided between the cold plate and the regulating mechanism;

    When the first valve and the second valve are closed and the third valve is opened, the cooling liquid in the cold plate flows into the second accommodating cavity, causing the cold plate to shrink.
16. A heat dissipation system, characterized in that it comprises at least one liquid cooling heat dissipation device according to any one of claims 1 to 15, and the heat dissipation system further comprises:

    a heat exchanger, wherein the inlet of the heat exchanger is connected to the liquid outlet of the cold plate, and the outlet of the heat exchanger is connected to the liquid inlet of the cold plate;

    A first power mechanism, wherein one end of the first power mechanism is communicated with the heat exchanger, and the other end of the first power mechanism is communicated with the liquid inlet of the cold plate.
17. The heat dissipation system according to claim 16, characterized in that the heat dissipation system further comprises a A liquid replenishment container and a second power mechanism, wherein the second power mechanism is used to replenish the coolant in the liquid replenishment container to the heat exchanger and the liquid cooling device, and the liquid return port of the liquid replenishment container is connected to the regulating mechanism of the liquid cooling device.
18. An electronic device, characterized in that it comprises the liquid-cooling heat dissipation device and the heat dissipation body according to any one of claims 1 to 15, wherein the cold plate in the liquid-cooling heat dissipation device is used to contact the heat dissipation body.