WO2024098631A1 - 一种电感组件及其制备方法和应用 - Google Patents

一种电感组件及其制备方法和应用 Download PDF

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Publication number
WO2024098631A1
WO2024098631A1 PCT/CN2023/085018 CN2023085018W WO2024098631A1 WO 2024098631 A1 WO2024098631 A1 WO 2024098631A1 CN 2023085018 W CN2023085018 W CN 2023085018W WO 2024098631 A1 WO2024098631 A1 WO 2024098631A1
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Prior art keywords
alloy powder
powder
magnetic alloy
heating
step heating
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PCT/CN2023/085018
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English (en)
French (fr)
Inventor
陈胜齐
娄海飞
金崭凡
胡江豪
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横店集团东磁股份有限公司
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Publication of WO2024098631A1 publication Critical patent/WO2024098631A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils

Definitions

  • Embodiments of the present application relate to the field of inductor technology, for example, an inductor component and a preparation method and application thereof.
  • inductors are also constantly innovating, and are rapidly upgrading in terms of application, product performance and quality.
  • one-piece molded inductors play an important role.
  • one-piece molded inductors are upgraded products of winding inductors. They are mainly used for power conversion. They have the advantages of high current resistance, stable electromagnetic characteristics, stable temperature rise, low audible noise, low radiated noise, and impact resistance. They are suitable for mobile phones, automobiles, aviation, communications and other fields. They are also widely recognized in the DC-DC (direct current to direct current) power management modules (PMU) of thin and light smart mobile terminal products and have been widely used.
  • DC-DC direct current to direct current
  • CN202183292U discloses an improved one-piece molded inductor, in which the coil needs to be spot welded with the terminal lead frame, and spot welding will cause the DC impedance of the product to increase.
  • the size of the coil and the terminal is very small, it becomes more difficult to position and spot weld the coil and the terminal, and the process difficulty and cost will increase exponentially, making it difficult to implement.
  • this process can achieve mass production of 2012 models and the spot welding yield rate is less than 70%.
  • the coil and the powder material are formed by molding, and the coil will be deformed during the molding process, and the DC impedance of the coil will also increase significantly.
  • the insulation layer of the coil is squeezed by the powder during the molding process, resulting in insulation damage.
  • the powders are squeezed and deformed against each other, and the insulating coating covering the surface of the powder will also be damaged to varying degrees, resulting in poor insulation between the coil and the powder.
  • soft magnetic powders Due to differences in manufacturing processes, soft magnetic powders have very different properties such as morphology, hardness, and particle size. When different powders are graded, they have poor formability and large internal stress. The pressed density of the powders, the internal structure, and the product will all show defects such as cracking to varying degrees, and the product reliability is not high.
  • CN10864890A discloses an electronic component and a method for manufacturing an inductor, which adopts a T-core process.
  • the T-core is first pressed, and then the wire is wound on the T-core. It is processed by hot pressing, roller spraying, electrode laser stripping and other processes. This process focuses on the three processes of cold pressing the T-core, winding and hot pressing. Since the winding needs to be wound on the T-core column, the winding requires a certain amount of hot air (to ensure that the coil can be bonded and not loose when winding) and winding tension, so the cold pressed T-core is required to have a certain strength.
  • Hot pressing is similar to that described in CN202183292U
  • the one-piece molded inductor is very similar to the one-piece molded inductor of CN202183292U.
  • the wound T-core and coil assembly are placed in the mold cavity, then placed on a heating platform for a certain period of time to heat, and then placed in the mold cavity for molding. At this time, the T-core needs to have a certain amount of deformation, that is, to achieve the effect of secondary curing.
  • the hot pressing cannot achieve the secondary pressing effect, and the T-core powder and the hot-pressed powder cannot be well combined, which is prone to interface cracks or internal bonding cracks. It can be seen that the winding process and the hot pressing process have opposite requirements for cold pressing, and only a balance can be achieved in the process. Because it is a molding process, the effects of increased coil deformation impedance and poor insulation of powder extrusion mentioned in CN202183292U still exist, and the product quality is insufficient. In addition, when the product size becomes smaller, such as ⁇ 1.0mm2 , the process technology is difficult, and the requirements for materials and equipment are very high. The investment is large and the yield rate is not high. At present, this process is difficult to form mass production.
  • the embodiment of the present application provides an inductor component and a preparation method and application thereof.
  • the inductor component described in the present application adopts a low-pressure molding process, the basic pressure between the coil and the powder is very low ( ⁇ 0.5T/ cm2 ), the DC impedance of the coil changes little, and the internal stress of the powder is small, which solves the problems of high inter-layer defect rate and inter-layer short circuit of the product caused by serious insulation damage of the powder under high pressure in the existing process.
  • an embodiment of the present application provides a method for preparing an inductor component, the method comprising the following steps:
  • step (2) The magnetic center column obtained in step (1) is combined with the coil and placed in a mold cavity, and the coating powder slurry is injected and then baked to obtain a semi-finished component;
  • step (3) coating an insulating layer on the surface of the semi-finished component obtained in step (2), and electroplating to form an electrode layer after paint stripping to obtain the inductor component.
  • the magnetic center column is formed by cold pressing and then low-temperature sintering.
  • the sintered magnetic center column has excellent magnetic properties and strength, especially the internal stress of the magnetic material is small (low-temperature sintering has the effect of relieving stress), which reduces the DC impedance of the product and improves the working current of the product.
  • the coil, magnetic center column and magnetic material covering the outer layer of the coil in the inductor assembly described in the present application are all processed by independent processes, which solves the problem of large deformation of the existing one-piece molded inductor coil and reduces the DC impedance of the product. It not only improves the working current, but also solves the problem of difficulty in producing small products.
  • the first magnetic alloy powder comprises amorphous alloy powder and/or nanocrystalline powder.
  • the median particle size D50 of the first magnetic alloy powder is 20-40 ⁇ m, for example, 20 ⁇ m, 25 ⁇ m, 30 ⁇ m, 35 ⁇ m or 40 ⁇ m.
  • the second magnetic alloy powder comprises any one of iron-nickel powder, iron-silicon-aluminum powder or iron-silicon-chromium powder, or a combination of at least two of them.
  • the median particle size D50 of the second magnetic alloy powder is 1-5 ⁇ m, for example, 1 ⁇ m, 2 ⁇ m, 3 ⁇ m, 4 ⁇ m or 5 ⁇ m.
  • the gradation ratio of the first magnetic alloy powder and the second magnetic alloy powder is 2:8-8:2, for example, 2:8, 3:7, 4:6, 5:5, 6:4, 7:3 or 8:2.
  • the adhesive comprises epoxy glue.
  • the mass ratio of the total mass of the first magnetic alloy powder and the second magnetic alloy powder to the binder is 100:1-3.5, for example, 100:1, 100:2, 100:3 or 100:3.5.
  • the mesh size of the mixed granulation treatment in step (1) is 60 to 250 meshes, for example: 60 mesh, 80 mesh, 100 mesh, 150 mesh or 250 mesh, etc.
  • the pressure of the pressing treatment is 3-10 T/cm 2 , for example, 3 T/cm 2 , 5 T/cm 2 , 7 T/cm 2 , 8 T/cm 2 or 10 T/cm 2 .
  • the temperature of the pressing treatment is 20-200°C, for example, 20°C, 50°C, 80°C, 100°C or 200°C.
  • the pressing treatment time is 1 to 180 s, for example, 1 s, 5 s, 10 s, 50 s, 100 s or 180 s.
  • the atmosphere of the drying and curing treatment in step (1) includes an inert atmosphere.
  • the temperature rise method of the baking and curing treatment is step-by-step temperature rise.
  • the step-by-step heating includes one-step heating, two-step heating, three-step heating and four-step heating.
  • the temperature after the one-step heating is 90-110°C, for example, 90°C, 95°C, 100°C, 105°C or 110°C.
  • the insulation time after the one-step heating is 20 to 40 minutes, for example, 20 minutes, 25 minutes, 30 minutes, 35 minutes or 40 minutes.
  • the temperature after the two-step heating is 120-150°C, for example, 120°C, 125°C, 130°C, 140°C or 150°C.
  • the insulation time after the two-step heating is 20 to 40 minutes, for example, 20 minutes, 25 minutes, 30 minutes, 35 minutes or 40 minutes.
  • the temperature after the three-step heating is 180-200°C, for example, 180°C, 185°C, 190°C, 195°C or 200°C.
  • the insulation time after the three-step heating is 50 to 70 minutes, for example, 50 minutes, 55 minutes, 60 minutes, 65 minutes or 70 minutes.
  • the temperature after the four-step heating is 350-380°C, for example, 350°C, 355°C, 360°C, 370°C or 380°C.
  • the insulation time after the four-step heating is 100 to 140 minutes, for example: 100 minutes, 110 minutes, 120 minutes, 130 minutes or 140 minutes.
  • the shape of the magnetic center column includes circular, elliptical, square, conical, I-shaped or T-shaped.
  • the magnetic center column reserves a matching clearance of 0.02-0.06 mm (for example, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm or 0.06 mm, etc.).
  • the material of the coil in step (2) includes a conductive material and an insulating layer and a self-adhesive layer arranged on the surface of the conductive material.
  • the conductive material comprises copper.
  • the coil comprises any one of round wire, flat wire or square wire, or a combination of at least two of them.
  • the coating powder slurry in step (2) comprises a third magnetic alloy powder, a fourth magnetic alloy powder, a dispersant, a consumable, an accelerator and an organic solvent.
  • the third magnetic alloy powder includes amorphous alloy powder and/or nanocrystalline powder.
  • the median particle size D50 of the third magnetic alloy powder is 20-55 ⁇ m, for example, 20 ⁇ m, 25 ⁇ m, 30 ⁇ m, 40 ⁇ m or 55 ⁇ m.
  • the fourth magnetic alloy powder includes any one of iron-nickel powder, iron-silicon-aluminum powder or iron-silicon-chromium powder, or a combination of at least two of them.
  • the median particle size D50 of the fourth magnetic alloy powder is 0.3-0.8 ⁇ m, for example, 0.3 ⁇ m, 0.4 ⁇ m, 0.5 ⁇ m, 0.6 ⁇ m or 0.8 ⁇ m.
  • the gradation ratio of the third magnetic alloy powder and the fourth magnetic alloy powder is 2:8-8:2, for example, 2:8, 3:7, 4:6, 5:5, 6:4, 7:3 or 8:2.
  • the organic solvent comprises alcohol and/or toluene.
  • the viscosity of the coating powder slurry is 500-2000 Mpa.s, for example, 500 Mpa.s, 800 Mpa.s, 1000 Mpa.s, 1200 Mpa.s, 1500 Mpa.s or 2000 Mpa.s, etc.
  • the outer layer of the coil coated with magnetic material described in the present application is processed by powder grading, and is composed of two or more soft magnetic alloy powder gradations. Because there is basically no pressure, the insulation of the powder is far better than that of the one-piece molding process.
  • the injection pressure per unit area of the coating powder slurry is ⁇ 0.5 T/cm 2 .
  • the present application adopts a low-pressure molding process, the basic pressure between the coil and the powder is very low ( ⁇ 0.5T/ cm2 ), the DC impedance of the coil changes little, the internal stress of the powder is small, and the high defective rate between product layers caused by serious insulation damage of the powder is avoided, and the problem of short circuit between product layers is solved.
  • the heating method of the baking treatment in step (2) is step-by-step heating.
  • the step-by-step heating includes one-step heating, two-step heating and three-step heating.
  • the temperature after the one-step heating is 90-110°C, for example, 90°C, 95°C, 100°C, 105°C or 110°C.
  • the insulation time after the one-step heating is 20 to 40 minutes, for example, 20 minutes, 25 minutes, 30 minutes, 35 minutes or 40 minutes.
  • the temperature after the two-step heating is 120-150°C, for example, 120°C, 125°C, 130°C, 140°C or 150°C.
  • the insulation time after the two-step heating is 20 to 40 minutes, for example, 20 minutes, 25 minutes, 30 minutes, 35 minutes or 40 minutes.
  • the temperature after the three-step heating is 180-200°C, for example, 180°C, 185°C, 190°C, 195°C or 200°C.
  • the insulation time after the three-step heating is 150 to 200 minutes, for example, 50 minutes, 55 minutes, 60 minutes, 65 minutes or 70 minutes.
  • the present application bakes and cures the magnetic center column by a step-by-step temperature increase method.
  • the step-by-step temperature curing can ensure that the solvent in the magnetic center column evaporates slowly, and the glue cures slowly, and the product itself will not produce excessive stress and strain to cause cracking, pores and other defects.
  • the material of the insulating layer in step (3) includes any one of epoxy resin, polyurethane, silicone resin, organosilicon resin, amino resin, polyimide resin, phenolic resin, cyanate or acrylic resin, or a combination of at least two thereof.
  • the electroplated material includes any one of copper, nickel or tin, or a combination of at least two of them.
  • an embodiment of the present application provides an inductor component, wherein the inductor component is manufactured by the method described in the first aspect.
  • an embodiment of the present application provides an application of the inductor component as described in the second aspect, wherein the inductor component is used for a lightweight and thin smart mobile terminal.
  • the inductor assembly described in the embodiment of the present application is formed by a low-pressure molding process, the basic pressure between the coil and the powder is very low ( ⁇ 0.5T/ cm2 ), the DC impedance of the coil changes little, and the internal stress of the powder is small, which solves the problems of high inter-layer defect rate and inter-layer short circuit of the product caused by serious insulation damage of the powder under high pressure in the existing process.
  • the impedance value of the inductor component obtained by the method described in the embodiment of the present application can reach below 32.18 m ⁇ , and the interlayer defect rate is below 50 ppm.
  • FIG. 1 is a temperature rise curve diagram of the baking and curing described in step (1) of Example 1-3.
  • FIG. 2 is a temperature rise curve diagram of the drying process in step (2) of Example 1-3.
  • This embodiment provides an inductor component, the raw material composition and preparation method of the inductor component are as follows:
  • the pressing conditions of the magnetic center column are: pressing temperature 25°C, time 5s, pressure 5.0T/ cm2 ;
  • Preparation method (1) weighing amorphous alloy powder and iron-nickel powder in proportion, adding solvent and epoxy resin glue to mix and granulate to form granules of a certain shape, then sieving through 100 mesh, taking out the lower layer of powder to press the magnetic center column, and baking and curing the pressed magnetic center column at 360° C. for 120 minutes to form a round magnetic center column.
  • the temperature rise curve of baking and curing is shown in FIG1 ;
  • step (3) Spraying an epoxy resin insulation layer onto the surface of the semi-finished component obtained in step (2), stripping the paint of the sprayed inductor product under a laser paint stripping machine to form an electrode area of a certain size and paint stripping depth, and then electroplating a Cu layer, a Ni layer, and a Sn layer to form an electrode layer to obtain the inductor component.
  • This embodiment provides an inductor component, the raw material composition and preparation method of the inductor component are as follows:
  • Pressing conditions of magnetic center column pressing temperature 25°C, time 5s, pressure 5.0T/ cm2
  • Preparation method (1) weighing amorphous alloy powder and iron-nickel powder in proportion, adding solvent and epoxy resin glue to mix and granulate to form granules of a certain shape, then sieving through 100 mesh, taking out the lower layer of powder to press the magnetic center column, and baking and curing the pressed magnetic center column at 360° C. for 120 minutes to form a round magnetic center column.
  • the temperature rise curve of baking and curing is shown in FIG1 ;
  • step (3) Spraying an epoxy resin insulation layer onto the surface of the semi-finished component obtained in step (2), stripping the paint of the sprayed inductor product under a laser paint stripping machine to form an electrode area of a certain size and paint stripping depth, and then electroplating a Cu layer, a Ni layer, and a Sn layer to form an electrode layer to obtain the inductor component.
  • This embodiment provides an inductor component, the raw material composition and preparation method of the inductor component are as follows:
  • Pressing conditions of magnetic center column pressing temperature 25°C, time 5s, pressure 5.0T/ cm2
  • Preparation method (1) weighing amorphous alloy powder and iron-nickel powder in proportion, adding solvent and epoxy resin glue to mix and granulate to form granules of a certain shape, then sieving through 100 mesh, taking out the lower layer of powder to press the magnetic center column, and baking and curing the pressed magnetic center column at 360° C. for 120 minutes to form a round magnetic center column.
  • the temperature rise curve of baking and curing is shown in FIG1 ;
  • step (3) Spraying an epoxy resin insulation layer onto the surface of the semi-finished component obtained in step (2), stripping the paint of the sprayed inductor product under a laser paint stripping machine to form an electrode area of a certain size and paint stripping depth, and then electroplating a Cu layer, a Ni layer, and a Sn layer to form an electrode layer to obtain the inductor component.
  • the difference between this embodiment and the first embodiment is that the magnetic center column is directly baked and cured at 360° C., and the other conditions and parameters are exactly the same as those in the first embodiment.
  • Example 1 The only difference between this comparative example and Example 1 is that the baking and curing temperature is 330° C., and the other conditions and parameters are exactly the same as those in Example 1.
  • Example 1 The only difference between this comparative example and Example 1 is that the baking and curing temperature is 400° C., and the other conditions and parameters are exactly the same as those in Example 1.
  • the inductor described in CN202183292U was used as a comparative example.
  • the inductor described in CN108648901A was used as a comparative example.
  • the impedance value of the inductor component prepared by the method described in the present application can reach below 32.18 m ⁇ , and the interlayer defect rate is below 50 ppm.
  • Example 1 By comparing Example 1 and Example 4, it can be seen that the present application bakes and cures the magnetic center column by a step-by-step temperature increase method.
  • the step-by-step temperature curing can ensure that the solvent in the magnetic center column evaporates slowly, and the glue cures slowly, and the product itself will not produce excessive stress and strain to cause cracking, pores and other defects.
  • Example 1 By comparing Example 1 with Example 5, it can be seen that the present application considers the composition of the material system and adopts a step-by-step method.
  • the semi-finished components are baked by increasing the temperature.
  • the low-temperature and slow baking allows the residual solvent in the material to be fully volatilized. No cracks, pores, and other defects will occur during high-temperature baking and curing.
  • Example 1 By comparing Example 1 with Examples 6-7, it can be seen that the drying and curing temperature described in the present application will affect the performance of the obtained inductor component.
  • the drying and curing temperature is controlled at 350-380°C, the performance of the obtained inductor component is better. If the drying and curing temperature is too low, the stress relief annealing temperature of the material cannot be reached and the magnetic properties of the material cannot be exerted. If the drying and curing temperature is too high, the glue in the powder glue will be carbonized, the insulation of the material will be reduced, and the product characteristics will be affected.
  • Example 1 By comparing Example 1 with Comparative Examples 1-2, it can be seen that the main advantages of the inductor assembly described in the present application are: 1. Reducing the DC impedance value of the product and improving the working current of the product; 2. Significantly reducing the problem of short circuit between layers of the integrated pressed inductor product; 3. This process has a significant improvement in the difficulty of producing small-sized inductors.

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Abstract

本文公布一种电感组件及其制备方法和应用，所述制备方法包括以下步骤：(1)将第一磁性合金粉料、第二磁性合金粉料和粘结剂混合造粒后进行压制处理，将压制处理后的胚料经烘烤固化处理后得到磁性中柱；(2)将步骤(1)得到的磁性中柱与线圈组合后置于模穴，注入包覆粉浆料后进行烘烤处理得到半成品组件；(3)将绝缘层涂覆在步骤(2)得到的半成品组件表面，经剥漆处理后电镀形成电极层，得到所述电感组件，本申请所述电感组件通过低压成型工艺，线圈与粉料基本压力低，线圈直流阻抗变化小，粉料内应力小，解决了现有制程大压力下，粉料绝缘破坏严重导致产品层间不良率高、产品层间短路等问题。

Description

一种电感组件及其制备方法和应用 技术领域
本申请实施例涉及电感技术领域，例如一种电感组件及其制备方法和应用。
背景技术
全球电子信息产业迅速发展，作为产业发展必不可少的基础电子元件之一的电感器也在不断推陈出新，无论是在应用还是产品性能与品质方面都在快速地进行升级换代，其中一体成型电感在其中起到重要作用。相对于传统的磁封胶电感，一体式模压电感属于绕线电感的升级产品，主要用于电源转换，具有耐大电流、电磁特性平稳、温升稳定，低可听噪声、低放射噪声，耐冲击等优势，适用于手机、汽车、航空、通信等多领域，在轻薄化智能移动终端产品的DC-DC(直流到直流)电源管理模块(PMU)也获得广泛认可，已经得到广泛应用。
CN202183292U公开了一种改进型一体成型电感器，其所述线圈需要与端子导线架点焊，点焊会导致产品直流阻抗增加。当线圈与端子尺寸很小时，线圈与端子定位、点焊就变得比较困难，制程难度及成本会倍数增加实现难度大。目前了解此制程工艺能实现量产机种为2012机种且点焊良品率不足70％。另外，线圈与粉材通过模压方式成型，线圈在模压过程中会产生形变，线圈直流阻抗也会明显增大，且在模压过程中线圈绝缘层受粉料挤压而发生绝缘破损。同时粉料在模压成型时，粉料间相互挤压形变，粉料表层包覆的绝缘涂层也会不同程度损坏，导致线圈与粉料绝缘变差。软磁粉料因其制程工艺差异，粉料特性如形貌、硬度、颗粒大小等差异非常大，不同粉料发生级配时成型性差、内应力大，粉材压制密度、内部及产品都会呈现不同程度开裂等不良，产品可靠性不高。
CN10864890A公开了一种电子元件以及一种电感的制造方法，其采用T-core工艺制程，先压制T-core，然后在T-core上绕线，通过热压、滚喷、电极镭射剥漆等工艺加工而成。此工艺制程重点是冷压T-core、绕线和热压三制程，因绕线需要在T-core柱子上绕线，绕线需要一定的热风(保证线圈绕制时线圈能够黏合不会松散)及绕线张力，所以要求冷压T-core有一定强度，强度越高越容易绕制，所以绕线需求冷压T-core强度越高越好。热压跟CN202183292U所述 的一体模压电感很接近，是将绕制好的T-core与线圈组合体放置到模穴中，然后放在一个加热平台上一定时间加热，然后放置在模腔中模压而成。而此时需要T-core有一定变形量，即达到二次固化的效果。如果冷压T-core强度太高或密度太大，热压就无法达到二次压制效果，T-core粉料与热压粉料就无法很好结合，容易出现界面裂或内部结合裂。可见绕线制程和热压制程对冷压就是一个相反的要求，制程中只能取平衡。因为是模压制程，CN202183292U提到的线圈形变阻抗增大、粉料挤压绝缘变差等影响依然存在，产品品质不足。另外当产品尺寸变小后，如＜1.0mm2时，制程工艺难度大，对材料、设备等要求很高，投资大，成品率不高，目前此工艺制程较难形成批量化。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供一种电感组件及其制备方法和应用，本申请所述电感组件通过低压成型工艺，线圈与粉料基本压力很低(≤0.5T/cm2)，线圈直流阻抗变化小，粉料内应力小，解决了现有制程大压力下，粉料绝缘破坏严重导致产品层间不良率高、产品层间短路等问题。
第一方面，本申请实施例提供了一种电感组件的制备方法，所述制备方法包括以下步骤：
(1)将第一磁性合金粉料、第二磁性合金粉料和粘结剂混合造粒后进行压制处理，将压制处理后的胚料经烘烤固化处理后得到磁性中柱；
(2)将步骤(1)得到的磁性中柱与线圈组合后置于模穴，注入包覆粉浆料后进行烘烤处理得到半成品组件；
(3)将绝缘层涂覆在步骤(2)得到的半成品组件表面，经剥漆处理后电镀形成电极层，得到所述电感组件。
本申请所述电感组件的制备过程中，所述磁性中柱采用冷压成型后低温烧结方式成型，烧结后的磁性中柱有优越的磁性能及强度，尤其是磁性材料内应力小(低温烧结起到去应力功效)，降低了产品直流阻抗，提升产品工作电流。
本申请所述电感组件中的线圈、磁性中柱以及线圈外层包覆磁材均采用独立工艺加工，解决了现有一体成型电感线圈变形量大，降低产品直流阻抗大， 提升工作电流问题，同时解决了小产品生产难度大的问题。
优选地，步骤(1)所述第一磁性合金粉料包括非晶合金粉和/或纳米晶粉。
优选地，所述第一磁性合金粉料的中值粒径D50为20～40μm，例如：20μm、25μm、30μm、35μm或40μm等。
优选地，所述第二磁性合金粉料包括铁镍粉、铁硅铝粉或铁硅铬粉中的任意一种或至少两种的组合。
优选地，所述第二磁性合金粉料的中值粒径D50为1～5μm，例如：1μm、2μm、3μm、4μm或5μm等。
优选地，所述第一磁性合金粉料和第二磁性合金粉料的级配比例为2:8～8:2，例如：2:8、3:7、4:6、5:5、6:4、7:3或8:2等。
优选地，所述粘结剂包括环氧型胶水。
优选地，所述第一磁性合金粉料和第二磁性合金粉料的总质量与所述粘结剂的质量比为100:1～3.5，例如：100:1、100:2、100:3或100:3.5等。
优选地，步骤(1)所述混合造粒处理的目数为60～250目，例如：60目、80目、100目、150目或250目等。
优选地，所述压制处理的压力为3～10T/cm2，例如：3T/cm2、5T/cm2、7T/cm2、8T/cm2或10T/cm2等。
优选地，所述压制处理的温度为20～200℃，例如：20℃、50℃、80℃、100℃或200℃等。
优选地，所述压制处理的时间为1～180s，例如：1s、5s、10s、50s、100s或180s等。
优选地，步骤(1)所述烘干固化处理的气氛包括惰性气氛。
优选地，所述烘烤固化处理的升温方式为阶梯式升温。
所述阶梯式升温包括一步升温、二步升温、三步升温和四步升温。
优选地，所述一步升温后的温度为90～110℃，例如：90℃、95℃、100℃、105℃或110℃等。
优选地，所述一步升温后的保温时间为20～40min，例如：20min、25min、30min、35min或40min等。
优选地，所述二步升温后的温度为120～150℃，例如：120℃、125℃、130℃、140℃或150℃等。
优选地，所述二步升温后的保温时间为20～40min，例如：20min、25min、30min、35min或40min等。
优选地，所述三步升温后的温度为180～200℃，例如：180℃、185℃、190℃、195℃或200℃等。
优选地，所述三步升温后的保温时间为50～70min，例如：50min、55min、60min、65min或70min等。
优选地，所述四步升温后的温度为350～380℃，例如：350℃、355℃、360℃、370℃或380℃等。
优选地，所述四步升温后的保温时间为100～140min，例如：100min、110min、120min、130min或140min等。
优选地，所述磁性中柱的形状包括圆形、椭圆形、方形、锥形、工字型或T形。
优选地，所述磁性中柱预留0.02～0.06mm(例如：0.02mm、0.03mm、0.04mm、0.05mm或0.06mm等)配合间隙。
优选地，步骤(2)所述线圈的材料包括导电材料和设置于所述导电材料表面的绝缘层和自粘层。
优选地，所述导电材料包括铜。
优选地，所述线圈包括圆线、扁线或方角线中的任意一种或至少两种的组合。
优选地，步骤(2)所述包覆粉浆料包括第三磁性合金粉料、第四磁性合金粉料、分散剂、消耗剂、加速剂和有机溶剂。
优选地，所述第三磁性合金粉料包括非晶合金粉和/或纳米晶粉。
优选地，所述第三磁性合金粉料的中值粒径D50为20～55μm，例如：20μm、25μm、30μm、40μm或55μm等。
优选地，所述第四磁性合金粉料包括铁镍粉、铁硅铝粉或铁硅铬粉中的任意一种或至少两种的组合。
优选地，所述第四磁性合金粉料的中值粒径D50为0.3～0.8μm，例如：0.3μm、0.4μm、0.5μm、0.6μm或0.8μm等。
优选地，所述第三磁性合金粉料和第四磁性合金粉料的级配比例为2:8～8:2，例如：2:8、3:7、4:6、5:5、6:4、7:3或8:2等。
优选地，所述有机溶剂包括酒精和/或甲苯。
优选地，所述包覆粉浆料的粘度为500～2000Mpa.s，例如：500Mpa.s、800Mpa.s、1000Mpa.s、1200Mpa.s、1500Mpa.s或2000Mpa.s等。
本申请所述线圈外层包覆磁性材料通过粉料级配方式加工而成，采用两种及以上软磁合金粉料级配组成，因为基本无压力，粉料绝缘性要远优于一体模压工艺。
优选地，所述注入包覆粉浆料的注射单位面积压力≤0.5T/cm2。
本申请采用低压成型工艺，线圈与粉料基本压力很低(≤0.5T/cm2)，线圈直流阻抗变化小，粉料内应力小，避免了粉料绝缘破坏严重导致产品层间不良率高，解决了产品层间短路等问题。
优选地，步骤(2)所述烘烤处理的升温方式为阶梯式升温。
所述阶梯式升温包括一步升温、二步升温和三步升温
优选地，所述一步升温后的温度为90～110℃，例如：90℃、95℃、100℃、105℃或110℃等。
优选地，所述一步升温后的保温时间为20～40min，例如：20min、25min、30min、35min或40min等。
优选地，所述二步升温后的温度为120～150℃，例如：120℃、125℃、130℃、140℃或150℃等。
优选地，所述二步升温后的保温时间为20～40min，例如：20min、25min、30min、35min或40min等。
优选地，所述三步升温后的温度为180～200℃，例如：180℃、185℃、190℃、195℃或200℃等。
优选地，所述三步升温后的保温时间为150～200min，例如：50min、55min、60min、65min或70min等。
本申请通过阶梯式升温的方式对磁性中柱进行烘烤固化，阶梯式温度固化，能保证磁性中柱中溶剂得以缓慢方式挥发，胶水以缓慢方式固化，而产品本身不会产生过多的应力、应变导致开裂、气孔等不良。
优选地，步骤(3)所述绝缘层的材料包括环氧树脂、聚氨酯、硅酮树脂、有机硅树脂、氨基树脂、聚酰亚胺树脂、酚醛树脂、氰酸脂或丙烯酸树脂中的任意一种或至少两种的组合。
优选地，所述电镀的材料包括铜、镍或锡中的任意一种或至少两种的组合。
第二方面，本申请实施例提供了一种电感组件，所述电感组件通过如第一方面所述方法制得。
第三方面，本申请实施例提供了一种如第二方面所述电感组件的应用，所述电感组件用于轻薄化智能移动终端。
相对于相关技术，本申请实施例具有以下有益效果：
(1)本申请实施例所述电感组件通过低压成型工艺，线圈与粉料基本压力很低(≤0.5T/cm2)，线圈直流阻抗变化小，粉料内应力小，解决了现有制程大压力下，粉料绝缘破坏严重导致产品层间不良率高、产品层间短路等问题。
(2)本申请实施例所述方法制得电感组件的阻抗值可达32.18mΩ以下，层间不良率在50ppm以下。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图说明
附图用来提供对本文技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本文的技术方案，并不构成对本文技术方案的限制。
图1是实施例1-3步骤(1)所述烘烤固化的升温曲线图。
图2是实施例1-3步骤(2)所述烘干的升温曲线图。
具体实施方式
下面通过具体实施方式来进一步说明本申请的技术方案。本领域技术人员应该明了，所述实施例仅仅是帮助理解本申请，不应视为对本申请的具体限制。
实施例1
本实施例提供了一种电感组件，所述电感组件的原料组成及制备方法如下：
原料组成：磁性中柱粉料：非晶合金粉D50＝25μm、铁镍粉D50＝2.5μm；级配比例＝4:6，环氧树脂胶水含量2.0％；
磁性中柱压制条件：压制温度25℃、时间5s、压力5.0T/cm2；
线圈外层包覆材料：非晶合金粉D50＝30μm、铁基钴合金粉D50＝0.5μm；级配比例＝6:4，粉材浆料粘度为1000MPa.s、注射单位面积压力：0.1T/cm2；
制备方法：(1)按比例称取非晶合金粉、铁镍粉、并加入溶剂和环氧树脂胶水进行混合、造粒，形成一定形状颗粒料，然后经100目过筛，取下层粉料进行磁性中柱压制，压制后的磁性中柱在360℃下烘烤固化120min而成圆形磁性中柱，所述烘烤固化的升温曲线图如图1所示；
(2)将磁性中柱与线圈组合好一起植入模穴中，然后通过注射填入线圈外层包覆粉浆料，注射单位面积压力0.1T/cm2，再将成型好的胚料与模具一起移转到炉内在180℃下烘烤180min得到半成品组件，所述烘烤的升温曲线图如图2所示；
(3)将环氧树脂绝缘层喷涂在步骤(2)得到的半成品组件表面，喷涂后的电感产品在激光剥漆机下进行剥漆，形成一定尺寸及剥漆深度的电极区域，再经过电镀Cu层、Ni层、Sn层而形成电极层，得到所述电感组件。
实施例2
本实施例提供了一种电感组件，所述电感组件的原料组成及制备方法如下：
原料组成：磁性中柱粉料：非晶合金粉D50＝25μm、铁镍粉D50＝2.5μm；级配比例＝4:6，环氧树脂胶水含量2.0％
磁性中柱压制条件：压制温度25℃、时间5s、压力5.0T/cm2
线圈外层包覆材料：非晶合金粉D50＝30μm、铁基钴合金粉D50＝0.5μm；级配比例＝6:4，粉材浆料粘度为1000MPa.s、注射单位面积压力：0.3T/cm2
制备方法：(1)按比例称取非晶合金粉、铁镍粉、并加入溶剂和环氧树脂胶水进行混合、造粒，形成一定形状颗粒料，然后经100目过筛，取下层粉料进行磁性中柱压制，压制后的磁性中柱在360℃下烘烤固化120min而成圆形磁性中柱，所述烘烤固化的升温曲线图如图1所示；
(2)将磁性中柱与线圈组合好一起植入模穴中，然后通过注射填入线圈外层包覆粉浆料，注射单位面积压力0.3T/cm2，再将成型好的胚料与模具一起移转到炉内在180℃下烘烤180min得到半成品组件，所述烘烤的升温曲线图如图2所示；
(3)将环氧树脂绝缘层喷涂在步骤(2)得到的半成品组件表面，喷涂后的电感产品在激光剥漆机下进行剥漆，形成一定尺寸及剥漆深度的电极区域，再经过电镀Cu层、Ni层、Sn层而形成电极层，得到所述电感组件。
实施例3
本实施例提供了一种电感组件，所述电感组件的原料组成及制备方法如下：
原料组成：磁性中柱粉料：非晶合金粉D50＝25μm、铁镍粉D50＝2.5μm；级配比例＝4:6，环氧树脂胶水含量2.0％
磁性中柱压制条件：压制温度25℃、时间5s、压力5.0T/cm2
线圈外层包覆材料：非晶合金粉D50＝30μm、铁基钴合金粉D50＝0.5μm；级配比例＝6:4，粉材浆料粘度为1000MPa.s、注射单位面积压力：0.5T/cm2
制备方法：(1)按比例称取非晶合金粉、铁镍粉、并加入溶剂和环氧树脂胶水进行混合、造粒，形成一定形状颗粒料，然后经100目过筛，取下层粉料进行磁性中柱压制，压制后的磁性中柱在360℃下烘烤固化120min而成圆形磁性中柱，所述烘烤固化的升温曲线图如图1所示；
(2)将磁性中柱与线圈组合好一起植入模穴中，然后通过注射填入线圈外层包覆粉浆料，注射单位面积压力0.5T/cm2，再将成型好的胚料与模具一起移转到炉内在180℃下烘烤180min得到半成品组件，所述烘烤的升温曲线图如图2所示；
(3)将环氧树脂绝缘层喷涂在步骤(2)得到的半成品组件表面，喷涂后的电感产品在激光剥漆机下进行剥漆，形成一定尺寸及剥漆深度的电极区域，再经过电镀Cu层、Ni层、Sn层而形成电极层，得到所述电感组件。
实施例4
本实施例与实施例1区别仅在于，直接将磁性中柱在360℃下进行烘烤固化，其他条件与参数与实施例1完全相同。
实施例5
本实施例与实施例1区别仅在于，直接将成型好的胚料与模具在180℃下烘烤，其他条件与参数与实施例1完全相同。
实施例6
本对比例与实施例1区别仅在于，烘烤固化的温度为330℃，其他条件与参数与实施例1完全相同。
实施例7
本对比例与实施例1区别仅在于，烘烤固化的温度为400℃，其他条件与参数与实施例1完全相同。
对比例1
采用CN202183292U所述电感器作为对比例。
对比例2
采用CN108648901A所述电感器作为对比例。
性能测试：
采用采用ADEX AX-1152D直流阻抗仪测量产品阻抗值和Chroma 19301A测量产品层间不良，测试结果如表1所示：
表1
由表1可以看出，由实施例1-3可得，本申请所述方法制得电感组件的阻抗值可达32.18mΩ以下，层间不良率在50ppm以下。
由实施例1和实施例4对比可得，本申请通过阶梯式升温的方式对磁性中柱进行烘烤固化，阶梯式温度固化，能保证磁性中柱中溶剂得以缓慢方式挥发，胶水以缓慢方式固化，而产品本身不会产生过多的应力、应变导致开裂、气孔等不良。
由实施例1和实施例5对比可得，本申请考虑材料系统组成，通过阶梯式 升温的方式对半成品组件进行烘烤，低温慢速烘烤使材料中残留的溶剂能得到充分挥发，高温烘烤固化时不会出现开裂、气孔等不良。
由实施例1和实施例6-7对比可得，本申请所述烘干固化的温度会影响制得电感组件的性能，将烘干固化的温度控制在350～380℃，制得电感组件的性能较好，若烘干固化的温度过低，达不到材料去应力退火温度，材料磁性能得不到发挥，若烘干固化的温度过高，粉料胶水中的胶水会碳化，材料绝缘会降低，影响产品特性。
由实施例1和对比例1-2对比可得，本申请所述电感组件的主要优势在于：1、降低产品直流阻抗值，提升产品工作电流；2、明显降低一体式压制电感产品层间短路不良问题；3、此工艺尤其对小尺寸电感生产难度大有明显改善。
申请人声明，以上所述仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，所属技术领域的技术人员应该明了，任何属于本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到的变化或替换，均落在本申请的保护范围和公开范围之内。

Claims (13)

  1. 一种电感组件的制备方法，其包括以下步骤：
    (1)将第一磁性合金粉料、第二磁性合金粉料和粘结剂混合造粒后进行压制处理，将压制处理后的胚料经烘烤固化处理后得到磁性中柱；
    (2)将步骤(1)得到的磁性中柱与线圈组合后置于模穴，注入包覆粉浆料后进行烘烤处理得到半成品组件；
    (3)将绝缘层涂覆在步骤(2)得到的半成品组件表面，经剥漆处理后电镀形成电极层，得到所述电感组件。
  2. 如权利要求1所述的制备方法，其中，步骤(1)所述第一磁性合金粉料包括非晶合金粉和/或纳米晶粉。
  3. 如权利要求1或2所述的制备方法，其中，所述第一磁性合金粉料的中值粒径D50为20～40μm。
  4. 如权利要求1-3任一项所述的制备方法，其中，所述第二磁性合金粉料包括铁镍粉、铁硅铝粉或铁硅铬粉中的任意一种或至少两种的组合。
  5. 如权利要求1-4任一项所述的制备方法，其中，所述第二磁性合金粉料的中值粒径D50为1～5μm；
    优选地，所述第一磁性合金粉料和第二磁性合金粉料的级配比例为2:8～8:2；
    优选地，所述粘结剂包括环氧型胶水；
    优选地，所述第一磁性合金粉料和第二磁性合金粉料的总质量与所述粘结剂的质量比为100:1～3.5。
  6. 如权利要求1-5任一项所述的制备方法，其中，步骤(1)所述混合造粒处理的目数为60～250目；
    优选地，所述压制处理的压力为3～10T/cm2；
    优选地，所述压制处理的温度为20～200℃；
    优选地，所述压制处理的时间为1～180s。
  7. 如权利要求1-6任一项所述的制备方法，其中，步骤(1)所述烘干固化处理的气氛包括惰性气氛；
    优选地，所述烘烤固化处理的升温方式为阶梯式升温；
    所述阶梯式升温包括一步升温、二步升温、三步升温和四步升温；
    优选地，所述一步升温后的温度为90～110℃；
    优选地，所述一步升温后的保温时间为20～40min；
    优选地，所述二步升温后的温度为120～150℃；
    优选地，所述二步升温后的保温时间为20～40min；
    优选地，所述三步升温后的温度为180～200℃；
    优选地，所述三步升温后的保温时间为50～70min；
    优选地，所述四步升温后的温度为350～380℃；
    优选地，所述四步升温后的保温时间为100～140min；
    优选地，所述磁性中柱的形状包括圆形、椭圆形、方形、锥形、工字型或T形；
    优选地，所述磁性中柱预留0.02～0.06mm配合间隙。
  8. 如权利要求1-7任一项所述的制备方法，其中，步骤(2)所述线圈的材料包括导电材料和设置于所述导电材料表面的绝缘层和自粘层；
    优选地，所述导电材料包括铜；
    优选地，所述线圈包括圆线、扁线或方角线中的任意一种或至少两种的组合。
  9. 如权利要求1-8任一项所述的制备方法，其中，步骤(2)所述包覆粉浆料包括第三磁性合金粉料、第四磁性合金粉料、分散剂、消耗剂、加速剂和有机溶剂；
    优选地，所述第三磁性合金粉料包括非晶合金粉和/或纳米晶粉；
    优选地，所述第三磁性合金粉料的中值粒径D50为20～55μm；
    优选地，所述第四磁性合金粉料包括铁镍粉、铁硅铝粉或铁硅铬粉中的任意一种或至少两种的组合；
    优选地，所述第四磁性合金粉料的中值粒径D50为0.3～0.8μm；
    优选地，所述第三磁性合金粉料和第四磁性合金粉料的级配比例为2:8～8:2；
    优选地，所述有机溶剂包括酒精和/或甲苯；
    优选地，所述包覆粉浆料的粘度为500～2000Mpa.s；
    优选地，所述注入包覆粉浆料的注射单位面积压力≤0.5T/cm2。
  10. 如权利要求1-9任一项所述的制备方法，其中，步骤(2)所述烘烤处理的升温方式为阶梯式升温；
    所述阶梯式升温包括一步升温、二步升温和三步升温
    优选地，所述一步升温后的温度为90～110℃；
    优选地，所述一步升温后的保温时间为20～40min；
    优选地，所述二步升温后的温度为120～150℃；
    优选地，所述二步升温后的保温时间为20～40min；
    优选地，所述三步升温后的温度为180～200℃；
    优选地，所述三步升温后的保温时间为150～200min。
  11. 如权利要求1-10任一项所述的制备方法，其中，步骤(3)所述绝缘层的材料包括环氧树脂、聚氨酯、硅酮树脂、有机硅树脂、氨基树脂、聚酰亚胺树脂、酚醛树脂、氰酸脂或丙烯酸树脂中的任意一种或至少两种的组合；
    优选地，所述电镀的材料包括铜、镍或锡中的任意一种或至少两种的组合。
  12. 一种电感组件，其中，所述电感组件通过如权利要求1-11任一项所述方法制得。
  13. 一种如权利要求12所述电感组件的应用，其中，所述电感组件用于轻薄化智能移动终端。
PCT/CN2023/085018 2022-11-10 2023-03-30 一种电感组件及其制备方法和应用 WO2024098631A1 (zh)

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