WO2024098596A1 - 一种微型电感线圈及其制备方法 - Google Patents

一种微型电感线圈及其制备方法 Download PDF

Info

Publication number
WO2024098596A1
WO2024098596A1 PCT/CN2023/079910 CN2023079910W WO2024098596A1 WO 2024098596 A1 WO2024098596 A1 WO 2024098596A1 CN 2023079910 W CN2023079910 W CN 2023079910W WO 2024098596 A1 WO2024098596 A1 WO 2024098596A1
Authority
WO
WIPO (PCT)
Prior art keywords
annular planar
coil
conductor
planar conductor
layer
Prior art date
Application number
PCT/CN2023/079910
Other languages
English (en)
French (fr)
Inventor
李金兵
赵宜泰
赵家彦
李永权
Original Assignee
昆山玛冀电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昆山玛冀电子有限公司 filed Critical 昆山玛冀电子有限公司
Publication of WO2024098596A1 publication Critical patent/WO2024098596A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings

Definitions

  • the present invention relates to the technical field of inductor coils, and in particular to H01F27/30. More particularly, the present invention relates to a miniature inductor coil and a preparation method thereof.
  • power module solutions are favored by more and more equipment manufacturers.
  • the power module solution is based on discrete switching power supply technology, which converts the device power bus to each load point (POL) in the infrastructure system through DC/DC, which greatly reduces the power loss of the line.
  • POL load point
  • DC/DC load point
  • the current inductor coil production mainly uses traction to pull the conductor to cooperate with the main shaft trajectory movement, and the conductor is wound on the skeleton or magnetic core to form a multi-turn winding.
  • this winding method will largely cause the conductor to be damaged due to excessive tension during winding, resulting in undesirable phenomena such as the enamel layer being damaged and the conductor being broken.
  • the conductor will inevitably have winding defects due to the winding gap caused by the crossing between turns.
  • Chinese patent CN202122097482 provides an inductor coil mechanism, which assembles multiple coils by utilizing the setting of a ring. This method will cause a single coil conductor to be damaged due to excessive tension during winding, resulting in undesirable phenomena such as the enamel layer being damaged and the conductor being broken.
  • the first aspect of the present invention provides a miniature inductor coil, comprising:
  • N layers of unclosed annular planar conductors are vertically distributed and connected through guide holes, and a physical isolation layer is formed between adjacent unclosed annular planar conductors outside the guide holes; N ⁇ 2;
  • the coil pins including the first coil pin and the second coil pin, are respectively arranged on the bottom layer unclosed annular planar conductor and the top layer unclosed annular planar conductor.
  • the micro inductor coil of the present application is composed of N layers of unclosed annular planar conductors, and the N layers of unclosed annular planar conductors are connected through guide holes.
  • the invention avoids the problem in the prior art that, for conductors with very small wire diameters or cross-sectional areas, the winding method causes the conductor to be damaged due to excessive tension during winding, resulting in the occurrence of undesirable phenomena such as enamel layer damage and conductor breakage, while also avoiding winding defects.
  • the material of the physical isolation layer is an insulating material.
  • the thickness of the annular planar conductor does not exceed 6 times the skin depth, preferably, does not exceed 4 times the skin depth; more preferably, does not exceed 2 times the skin depth.
  • f is the frequency, unit is Hz;
  • ⁇ is the skin depth, unit is mm.
  • the thickness of the annular planar conductor does not exceed 0.56 mm; preferably, the thickness of the annular conductor does not exceed 0.28 mm.
  • the thickness of the annular planar conductor does not exceed 0.1 mm; preferably, the thickness of the annular conductor does not exceed 0.053 mm.
  • the micro-inductor coil of the present invention is less affected by the skin effect, and the losses of resistance and inductance are reduced.
  • the width of the annular planar conductor is not particularly limited, and those skilled in the art may make a conventional selection according to needs, and examples thereof include 250 ⁇ m, 300 ⁇ m, etc.
  • the inner cross-sectional area A1 of the N-layer annular planar conductor does not exceed the outer cross-sectional area A2 of the annular planar conductor.
  • A1 is the middle gray area
  • A2 is the outer gray area.
  • the guide holes are arranged on the physical isolation layer, and the number of guide holes on each physical isolation layer is greater than or equal to 1, preferably greater than or equal to 2.
  • the specific number can be conventionally selected by those skilled in the art.
  • the aperture size of the guide holes is not particularly limited, and those skilled in the art can make conventional selections.
  • the guide hole in the present invention is a through hole with conductive properties.
  • the second aspect of the present invention provides a method for preparing the micro-inductor coil, comprising the following steps:
  • the method for preparing the micro inductor coil comprises the following steps:
  • step (2) covering the surface of the insulating material covering the guide hole with a layer of conductive material, etching the conductive material to form an unclosed annular planar conductor, and filling the etched conductive part with insulating material; covering the upper surface of the etched and filled conductor with insulating material, and forming a guide hole penetrating the insulating layer with the insulating material by drilling and electroplating; repeating step (2) to obtain an unclosed annular planar conductor covered with N layers of insulating material;
  • step (3) A layer of conductive material is covered on the surface of the uppermost insulating material in step (2), and the conductive material is etched to form an unclosed annular planar conductor and a second lead pin of the coil, and the etched conductive portion is filled with conductive material; and the upper surface of the etched and filled conductive portion is covered with conductive material.
  • the insulating material is selected from any one or more of polyimide, polyamide, and epoxy resin.
  • the conductor material is a metal material, preferably copper.
  • the thickness of the insulating film is not particularly limited, and examples thereof include 20 ⁇ m, 25 ⁇ m, 30 ⁇ m, etc.
  • the present invention has the following beneficial effects:
  • the preparation method of the micro-inductor coil of the present invention forms a ring-shaped conductor by etching, and each layer of the conductor is connected by a plated through-hole buried in the insulating layer, thereby avoiding the layer-by-layer crossing problem that occurs in the traditional coil winding process, and at the same time avoiding the problem that the winding method in the existing process for conductors with very small wire diameters or cross-sectional areas will largely cause the conductor to have undesirable phenomena such as the enamel layer being damaged and the conductor being broken due to excessive tension during winding.
  • FIG1 is a flow chart of the preparation of a micro inductor coil
  • FIG2 is a schematic diagram of the structure of a miniature inductor coil; wherein 1 is the first pin of the coil; 2 is the second pin of the coil; 3 is a ring-shaped plane conductor;
  • FIG3 is a graph showing AC resistance testing of Example 1 and Comparative Example 1;
  • FIG4 is a top perspective view of the miniature inductor coil of Example 1;
  • FIG. 5 is a schematic diagram of the inner loop area of a micro-inductor coil.
  • a miniature inductor coil as shown in FIG2 , comprises: 6 layers of unclosed annular planar conductors 3, the 6 layers of unclosed annular planar conductors 3 are vertically distributed and connected through guide holes, and a physical isolation layer is formed between adjacent unclosed annular planar conductors outside the guide holes through a layer of epoxy resin; wherein the thickness of the annular planar conductor is 48.5 ⁇ m and the width is 250 ⁇ m.
  • the coil pins including the coil first pin 1 and the coil second pin 2, are respectively arranged on the bottom layer unclosed annular planar conductor and the top layer unclosed annular planar conductor.
  • the top perspective view of the obtained micro inductor coil is shown in FIG4 .
  • the preparation method of the micro inductor coil is as follows:
  • the coil is packaged in a magnetic material with a size of 1400*1200*1000, the relative magnetic permeability of the magnetic material is 30, and the cross-sectional area Ae of the magnetic core of the inductor is 0.2925 mm 2 .
  • a miniature inductor coil is the same as the embodiment 1, except that the thickness of the annular planar conductor is 60 ⁇ m.
  • the preparation method of the micro inductor coil is the same as that of Example 1.
  • the coil is packaged in a magnetic material with a size of 1400*1200*1000, the relative magnetic permeability of the magnetic material is 30, and the cross-sectional area Ae of the magnetic core of the inductor is 0.2925 mm 2 .
  • a miniature inductor coil is the same as the embodiment 1, except that the thickness of the annular planar conductor is 25 ⁇ m.
  • the preparation method of the micro inductor coil is the same as that of Example 1.
  • the coil is packaged in a magnetic material with a size of 1400*1200*1000, the relative magnetic permeability of the magnetic material is 30, and the cross-sectional area Ae of the magnetic core of the inductor is 0.2925 mm 2 .
  • a miniature inductor coil, the preparation method is the same as that of Example 1.
  • the coil is packaged in a magnetic material with a size of 1400*1200*1000, the relative magnetic permeability of the magnetic material is 30, and the cross-sectional area Ae of the inductor core is 0.5525 mm 2 .
  • a miniature inductor coil, the preparation method is the same as that of Example 1.
  • the coil is packaged in a magnetic material with a size of 1400*1200*1000, the relative magnetic permeability of the magnetic material is 30, and the cross-sectional area Ae of the inductor core is 0.6825 mm 2 .
  • the copper wire is wound on a rectangular frame with a size of 450 ⁇ m*650 ⁇ m, with 6 turns, 3 turns in the inner layer and 3 turns in the outer layer.
  • the diameter of the copper wire is 120 ⁇ m
  • the thickness of the paint film is 25 ⁇ m
  • the first pin of the coil is formed by the inner coil winding in the opposite direction
  • the second pin of the coil is formed by the outer coil winding out.
  • Example 1 AC resistance test was conducted on Example 1 and Comparative Example 1, and the test results are shown in FIG3 .
  • the resistance of the conductor of Example 1 of the present invention changes less with the current, because the conductor prepared according to the present invention is smaller in size, and therefore less affected by the skin depth than the coil prepared by traditional winding. This is beneficial for the inductor to ensure lower AC loss at high frequencies.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

一种微型电感线圈及其制备方法。微型电感线圈，包括：N层未闭合环形平面导体（3）和线圈引脚（1、2）。微型电感线圈的制备方法，通过蚀刻手段形成的环形导体（3），各层导体（3）之间通过埋于绝缘层电镀导通孔相连，这样避免了传统线圈绕制工艺所出现的层层跨越问题，同时避免了现有工艺中对于线径或截面积很小的导体而言，绕线方式很大程度上会使导体在绕制的时候因为张力过大而出现漆包层被破坏、导体断裂等不良现象。

Description

一种微型电感线圈及其制备方法 技术领域
本发明涉及电感线圈技术领域，具体涉及H01F27/30，更具体地，本发明涉及一种微型电感线圈及其制备方法。
背景技术
在通信和计算基础架构的电源管理系统中，电源模块方案被越来越多的设备制造商所青睐。电源模块方案是基于分立式开关电源的技术，它将设备电源总线通过DC/DC的方式转换为基础架构系统中的各个负载点(POL)，这极大程度降低了线路的电力损耗。然而这项技术对于电源模块的高密度、高集成度提出了很严苛的要求，设计者在选择器件时必须兼顾高性能和小尺寸。
电感作为电源模块重要的元器件之一，其结构尺寸微型化受制于线圈的设计以及制造工艺。目前的电感线圈制作主要通过牵引力拉住导体配合主轴轨迹运动，将导体绕制在骨架或者磁芯上形成多匝绕组。对于线径或截面积很小的导体而言，这种绕线方式很大程度上会使导体在绕制的时候因为张力过大而出现漆包层被破坏、导体断裂等不良现象。此外，导体在上述的线圈绕制过程中，不可避免的出现由于匝与匝之间跨越造成的绕线间隙而造成绕层缺陷，同时匝与匝之间的跨越也是线圈设计无法达到理想单匝线圈的主要原因。例如中国专利CN202122097482提供了一种电感线圈机构，通过利用套环的设置，将多个线圈进行组装，该种方法会存在单个线圈导体在绕制的时候因为张力过大而出现漆包层被破坏、导体断裂等不良现象。
发明内容
针对现有技术中存在的一些问题，本发明第一个方面提供了一种微型电感线圈，包括：
N层未闭合环形平面导体，N层未闭合环形平面导体垂直分布，且通过导孔连接，导孔之外相邻未闭合环形平面导体之间形成物理隔离层；N≥2；
线圈引脚，包括线圈第一引脚和线圈第二引脚，分别设置于底层未闭合环形平面导体和顶层未闭合环形平面导体上。
相比于现有技术中使用导体线圈缠绕的方式，本申请微型电感线圈由N层未闭合环形平面导体构成，并通过导孔将N层未闭合环形平面导体进行连接， 避免了现有技术中对于线径或截面积很小的导体而言，绕线方式使导体在绕制的时候因为张力过大而出现漆包层被破坏、导体断裂等不良现象，同时避免了绕层缺陷。
在一种实施方式中，所述物理隔离层的材料为绝缘材料。
在一种实施方式中，所述环形平面导体的厚度不超过集肤深度的6倍，优选的，不超过集肤深度的4倍；更优选不超过集肤深度的2倍。
其中，集肤深度计算公式如下：
其中，f为频率，单位Hz；
Δ为集肤深度，单位mm。
更具体地，当本发明的线圈应用于300000Hz以上频率，环形平面导体的厚度不超过0.56mm；优选的，环形导体厚度不超过0.28mm。当本发明的线圈应用于2000000Hz以上频率，环形平面导体的厚度不超过0.1mm；优选的，环形导体厚度不超过0.053mm。
申请人意外的发现，当环形平面导体的厚度不超过集肤深度的4倍，尤其是不超过集肤深度的2倍时，此时本发明微型电感线圈受集肤效应影响较小，电阻和电感的损耗降低。
本申请中环形平面导体的宽度不作特别限定，本领域技术人员可根据需要进行常规选择，可以列举的有250μm，300μm等。
在一种实施方式中，在N层环形平面导体内环截面积A1不超过环形平面导体外围截面积A2。具体见图5，A1为中间灰色区域，A2为外围灰色区域。
申请人意外的发现，环形平面导体内环尺寸控制在本申请中范围内，电感感值优。
在一种实施方式中，导孔设置在物理隔离层上，每层物理隔离层上的导孔个数大于等于1，优选大于等于2，具体个数本领域技术人员可作常规选择，此外，导孔孔径大小不作特别限定，本领域技术人员可作常规选择。
本发明中导孔为具有导电性能的通孔。
本发明第二个方面提供了一种所述微型电感线圈的制备方法，包括如下步骤：
(1)在绝缘材料表面覆盖一层导体材料，蚀刻得到未闭合的环形平面导体和线圈第一引脚，然后于蚀刻部分填充并在环形平面导体上部覆盖一层绝缘材料，并钻孔、电镀得到含有导孔的物理隔离层，重复以上操作，得到N层未闭合环形平面导体，并在最后一层环形平面导体蚀刻得到线圈第二引脚，并在蚀刻、填充好的导体的上表面覆盖绝缘材料；
(2)保留一定绝缘膜厚，通过激光切割退去环形平面导体内侧和外侧的多余的绝缘材料。
在一种实施方式中，所述微型电感线圈的制备方法包括下面步骤：
(1)在绝缘材料表面覆盖一层导体材料，将导体材料蚀刻形成未闭合的环形平面导体，并蚀刻得到线圈第一引脚，将蚀刻掉的导体部分进行绝缘材料填充，并在该导体表面覆盖一层绝缘材料，然后在该绝缘材料上钻孔、电镀形成贯穿绝缘层的导孔；
(2)在上述包埋导孔的绝缘材料表面覆盖一层导体材料，将导体材料蚀刻形成未闭合的环形平面导体，被蚀刻掉的导体部分通过绝缘材料进行填充；在蚀刻、填充好的导体的上表面覆盖绝缘材料，该绝缘材料通过钻孔、电镀形成贯穿绝缘层的导孔；重复步骤(2)，可得到N层覆盖绝缘材料的未闭合环形平面导体；
(3)在步骤(2)最上层的绝缘材料表面表面覆盖一层导体材料，将导体材料蚀刻形成未闭合的环形平面导体以及线圈第二引出脚，被蚀刻掉的导体部分通过绝缘材料进行填充；在蚀刻、填充好的导体的上表面覆盖绝缘材料。
(4)保留一定绝缘膜厚，通过激光切割退去环形平面导体内侧和外侧的多余的绝缘材料。
在一种实施方式中，绝缘材料选自聚酰亚胺、聚酰胺、环氧树脂的任意一种或多种。
本申请中导体材料为金属材料，优选为铜。
本申请中绝缘膜的厚度不作特别限定，可以列举的有20μm，25μm，30μm等。
本发明与现有技术相比具有以下有益效果：
本发明微型电感线圈的制备方法，通过蚀刻手段形成的环形导体，各层导体之间通过埋于绝缘层电镀导通孔相连，这样避免了传统线圈绕制工艺所出现的层层跨越问题，同时避免了现有工艺中对于线径或截面积很小的导体而言，绕线方式很大程度上会使导体在绕制的时候因为张力过大而出现漆包层被破坏、导体断裂等不良现象。
附图说明
图1为微型电感线圈的制备流程图；
图2为微型电感线圈的结构示意图；其中1-线圈第一引脚；2-线圈第二引脚；3-环形平面导体；
图3为实施例1和对比实施例1交流电阻测试图；
图4为实施例1微型电感线圈的俯视透视图；
图5为微型电感线圈的内环面积示意图。
具体实施方式
以下通过具体实施方式说明本发明，但不局限于以下给出的具体实施例。
实施例1
一种微型电感线圈，如图2，包括：6层未闭合环形平面导体3，6层未闭合环形平面导体3垂直分布，且通过导孔连接，导孔之外相邻未闭合环形平面导体之间通过一层环氧树脂层形成物理隔离层；其中，环形平面导体的厚度为48.5μm，宽度为250μm。
线圈引脚，包括线圈第一引脚1和线圈第二引脚2，分别设置于底层未闭合环形平面导体和顶层未闭合环形平面导体上。得到的微型电感线圈的俯视透视图见图4。
该微型电感线圈的制备方法如下：
通过蚀刻在尺寸为1400μm*1200μm*25μm的聚酰亚胺材料表面覆盖的铜片得到6层被环氧树脂包覆的未闭合的环形平面导体。相邻导体通过两个孔径为100μm的电镀导通孔连接；其中，环形导体的厚度为48.5μm，宽度为250μm；环形导体内环尺寸为450μm*650μm。线圈第一引脚与底层环形平面导体未闭合一端相连，线圈第二引脚与顶层底层环形平面导体未闭合一端相连。通过激光切合褪去导体表面多余的聚酰亚胺材料，保留25μm的绝缘厚度。具体流程图见图1。
上述线圈封装于1400*1200*1000尺寸的磁性材料中，磁性材料的相对导磁率为30，电感的磁芯截面积Ae为0.2925mm2。
实施例2
一种微型电感线圈同实施例1，不同之处在于，环形平面导体的厚度为60μm。
该微型电感线圈的制备方法同实施例1。
上述线圈封装于1400*1200*1000尺寸的磁性材料中，磁性材料的相对导磁率为30，电感的磁芯截面积Ae为0.2925mm2。
实施例3
一种微型电感线圈同实施例1，不同之处在于，环形平面导体的厚度为25μm。
该微型电感线圈的制备方法同实施例1。
上述线圈封装于1400*1200*1000尺寸的磁性材料中，磁性材料的相对导磁率为30,电感的磁芯截面积Ae为0.2925mm2。
实施例4
一种微型电感线圈、制备方法同实施例1。
上述线圈封装于1400*1200*1000尺寸的磁性材料中，磁性材料的相对导磁率为30,,电感的磁芯截面积Ae为0.5525mm2。
实施例5
一种微型电感线圈、制备方法同实施例1。
上述线圈封装于1400*1200*1000尺寸的磁性材料中，磁性材料的相对导磁率为30,,电感的磁芯截面积Ae为0.6825mm2。
对实施例1-5进行电感特性测试，结果见表1。
表1
由实施例1-实施例3的结果可知，环形导体的厚度越高，电感的感值和电阻值越低。同时由实施例1-实施例5的测试结果可知，一定范围内，增加环形导体内环尺寸，即磁芯截面积Ae，电感感值增加。当形导体内环尺寸增加到一定数值后，电感感值会有所下降。
对比实施例1
将铜线绕制在尺寸为450μm*650μm的矩形骨架上，绕线匝数为6，分为内层3匝和外层3匝。铜线的直径为120μm，漆膜厚度为25μm，线圈第一引脚由内层线圈绕进反方向形成，线圈第二引脚由外层线圈绕出方向形成。
对实施例1和对比实施例1进行交流电阻测试，测试结果见图3，从图3可知，本发明的实施例1导体的电阻随电流的变化幅度较小，这是由于根据本发明制备的导体尺寸较小，因此受肌肤深度的影响要低于通过传统绕线制备的线圈。这有利于电感在高频时能保证有较低的交流损耗。

Claims (9)

  1. 一种微型电感线圈，其特征在于，包括：
    N层未闭合环形平面导体，N层未闭合环形平面导体垂直分布，且通过导孔连接，导孔之外相邻未闭合环形平面导体之间形成物理隔离层；N≥2；
    线圈引脚，包括线圈第一引脚和线圈第二引脚，分别设置于底层未闭合环形平面导体和顶层未闭合环形平面导体上。
  2. 根据权利要求1所述微型电感线圈，其特征在于，所述物理隔离层的材料为绝缘材料。
  3. 根据权利要求2所述微型电感线圈，其特征在于，所述绝缘材料选自聚酰亚胺、聚酰胺、环氧树脂中一种或多种。
  4. 根据权利要求1-3任一项所述微型电感线圈，其特征在于，所述环形平面导体的厚度不超过集肤深度的6倍。
  5. 根据权利要求4所述微型电感线圈，其特征在于，所述环形平面导体的厚度不超过集肤深度的4倍，优选不超过集肤深度的2倍。
  6. 根据权利要求4所述微型电感线圈，其特征在于，集肤深度的计算需要满足下式：其中，f为频率，单位Hz；Δ为集肤深度，单位mm。
  7. 根据权利要求6所述微型电感线圈，其特征在于，在N层环形平面导体内环截面积A1不超过环形平面导体外围截面积A2。
  8. 根据权利要求7所述微型电感线圈，其特征在于，导孔设置在物理隔离层上，每层物理隔离层上的导孔个数大于等于1，优选大于等于2。
  9. 一种根据权利要求1-8任一项所述微型电感线圈的制备方法，其特征在于，包括下面步骤：
    (1)在绝缘材料表面覆盖一层导体材料，蚀刻得到未闭合的环形平面导体和线圈第一引脚，然后于蚀刻部分填充并在环形平面导体上部覆盖一层绝缘材料，并钻孔、电镀得到含有导孔的物理隔离层，重复以上操作，得到N层未闭合环形平面导体，并在最后一层环形平面导体蚀刻得到线圈第二引脚，并在蚀刻、填充好的导体的上表面覆盖绝缘材料；
    (2)保留一定绝缘膜厚，通过激光切割退去环形平面导体内侧和外侧的多余的绝缘材料。
PCT/CN2023/079910 2022-11-10 2023-03-06 一种微型电感线圈及其制备方法 WO2024098596A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202211406882.2A CN115775672A (zh) 2022-11-10 2022-11-10 一种微型电感线圈及其制备方法
CN202211406882.2 2022-11-10

Publications (1)

Publication Number Publication Date
WO2024098596A1 true WO2024098596A1 (zh) 2024-05-16

Family

ID=85388909

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/079910 WO2024098596A1 (zh) 2022-11-10 2023-03-06 一种微型电感线圈及其制备方法

Country Status (2)

Country Link
CN (1) CN115775672A (zh)
WO (1) WO2024098596A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001250723A (ja) * 2000-03-07 2001-09-14 Tdk Corp 高ｑ高周波コイル及びその製造方法
JP2002110425A (ja) * 2000-09-27 2002-04-12 Tdk Corp 高周波コイル
JP2002324962A (ja) * 2001-02-21 2002-11-08 Toppan Printing Co Ltd インダクタ内蔵のプリント配線板及びその製造方法
JP2004221331A (ja) * 2003-01-15 2004-08-05 Sony Corp コイルとその製造方法
US20060145805A1 (en) * 2004-12-30 2006-07-06 Samsung Electro-Mechanics Co., Ltd. Printed circuit board having three-dimensional spiral inductor and method of fabricating same
CN113192721A (zh) * 2021-01-21 2021-07-30 龙腾 基于印制电路板的电感结构、包含该结构的柔性多层印制电路板及包含该结构的变压器结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001250723A (ja) * 2000-03-07 2001-09-14 Tdk Corp 高ｑ高周波コイル及びその製造方法
JP2002110425A (ja) * 2000-09-27 2002-04-12 Tdk Corp 高周波コイル
JP2002324962A (ja) * 2001-02-21 2002-11-08 Toppan Printing Co Ltd インダクタ内蔵のプリント配線板及びその製造方法
JP2004221331A (ja) * 2003-01-15 2004-08-05 Sony Corp コイルとその製造方法
US20060145805A1 (en) * 2004-12-30 2006-07-06 Samsung Electro-Mechanics Co., Ltd. Printed circuit board having three-dimensional spiral inductor and method of fabricating same
CN113192721A (zh) * 2021-01-21 2021-07-30 龙腾 基于印制电路板的电感结构、包含该结构的柔性多层印制电路板及包含该结构的变压器结构

Also Published As

Publication number Publication date
CN115775672A (zh) 2023-03-10

Similar Documents

Publication Publication Date Title
JP6071945B2 (ja) インダクタ及びその製造方法
US7107666B2 (en) Method of manufacturing an ultra-miniature magnetic device
US20030070282A1 (en) Ultra-miniature magnetic device
US11139108B2 (en) Coil electronic component
KR19990006843A (ko) 파워 마이크로마그네틱 집적 회로 및 그 제조 방법
CN108615598B (zh) 电感器
JP7267641B2 (ja) Ｍｅｍｓソレノイドインダクタ及びその製造方法
US20240186052A1 (en) Nanomagnetic inductor cores, inductors and devices incorporating such cores, and associated manufacturing methods
US7423509B2 (en) Coil comprising several coil branches and micro-inductor comprising one of the coils
CN109741903A (zh) 一种mems直线形螺线管电感器及其制造方法
US10998125B2 (en) Coil component
WO2024098596A1 (zh) 一种微型电感线圈及其制备方法
KR101187489B1 (ko) 멀티 트랜스포머 및 이를 제조하는 방법
JP7378166B2 (ja) Ｍｅｍｓソレノイドトランス及びその製造方法
TW202420344A (zh) 微型電感線圈及其製備方法
CN109961920B (zh) 绕线电感器及其制造方法
JPH11176639A (ja) 平面型インダクタおよび平面型トランス
JP6485984B1 (ja) コイル部品
US20230071379A1 (en) Coil component and manufacturing method therefor
WO2000005734A1 (en) Ultra-miniature magnetic device
AU2020101712A4 (en) A MEMS miniaturized solenoid transformer and its manufacturing method
US20220005640A1 (en) A vertical magnetic structure for integrated power conversion
JPH09148140A (ja) 表面実装型トランス
CN109390144A (zh) 一种mems环形螺线管变压器及其制造方法
CN109599249A (zh) 一种mems回形螺线管变压器及其制造方法