WO2024095569A1 - インダクタ部品 - Google Patents

インダクタ部品 Download PDF

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Publication number
WO2024095569A1
WO2024095569A1 PCT/JP2023/030259 JP2023030259W WO2024095569A1 WO 2024095569 A1 WO2024095569 A1 WO 2024095569A1 JP 2023030259 W JP2023030259 W JP 2023030259W WO 2024095569 A1 WO2024095569 A1 WO 2024095569A1
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WIPO (PCT)
Prior art keywords
wiring
coil
axis
inductor component
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/030259
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English (en)
French (fr)
Japanese (ja)
Inventor
秀基 加茂
由雅 吉岡
剛 高松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2024554272A priority Critical patent/JP7831626B2/ja
Priority to CN202380076181.3A priority patent/CN120153441A/zh
Publication of WO2024095569A1 publication Critical patent/WO2024095569A1/ja
Priority to US19/195,247 priority patent/US20250259777A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H01F27/2828—Construction of conductive connections, of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06—Coil winding
    • H01F41/061—Winding flat conductive wires or sheets
    • H01F41/063—Winding flat conductive wires or sheets with insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers

Definitions

  • This disclosure relates to inductor components.
  • the inductor component has an element body, a coil provided within the element body and wound along the axial direction, and a first external electrode and a second external electrode provided on the element body and electrically connected to the coil.
  • the width of the pad portion is wider than the width of the wiring portion, so part of the pad portion is located radially inside the coil relative to the wiring portion. This makes the inner diameter of the coil smaller, and the efficiency of obtaining inductance is not necessarily high.
  • the present disclosure therefore aims to provide an inductor component that can increase the efficiency of obtaining inductance.
  • an inductor component comprises: an element body including a first main surface and a second main surface opposed to each other; a coil provided on the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil;
  • the axis of the coil is disposed parallel to the first major surface;
  • the coil is a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wires extending from the first coil wiring toward the second coil wiring and arranged along the axis; a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on an opposite side of the axis from the
  • axis refers to the intersection of a first plane passing through the center between the first coil wiring and the second coil wiring and a second plane passing through the center between the first through wiring and the second through wiring.
  • the phrase "the first through wiring and the second through wiring are non-parallel when viewed in the axial direction” means that the center line of the first through wiring and the center line of the second through wiring are not parallel when viewed in the axial direction.
  • the center lines of the first through wiring and the second through wiring refer to lines passing through the centers of the through wiring in a plane perpendicular to the extension direction.
  • the external electrodes are provided on the element body specifically means that the external electrodes are provided on the outer surface side of the element body, including cases where the external electrodes are provided directly on the outer surface of the element body, cases where the external electrodes are provided on the outside of the element body via a separate member on the element body, and cases where the external electrodes are provided on the outer surface of the element body with part of them embedded in the element body.
  • the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring, and the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of a spiral shape, so that the inner diameter of the coil can be increased and the efficiency of obtaining inductance can be increased. Also, by increasing the efficiency of obtaining inductance, the Q value can be increased. Furthermore, since the first through wiring and the second through wiring are non-parallel when viewed in the axial direction, the design freedom of the first through wiring and the second through wiring can be improved, for example, the Q value can be increased or the self-resonant frequency can be increased.
  • the first through-hole wiring and the second through-hole wiring are linearly symmetrical with respect to the axis when viewed in a direction perpendicular to the first main surface.
  • symmetry with respect to the coil axis can be ensured, making it easy to design the coil.
  • the first through-hole wiring and the second through-hole wiring are symmetrical with respect to a line that is perpendicular to the first main surface and includes the axis when viewed from the axial direction.
  • symmetry with respect to the coil axis can be ensured, making it easy to design the coil.
  • the line edge roughness of the first through wiring is greater than the line edge roughness of the first coil wiring.
  • the line edge roughness of the first through wiring refers to the line edge roughness of the side of the first through wiring on the inner diameter side of the coil in a cross section perpendicular to the axis of the coil and including the center line of the first through wiring.
  • the line edge roughness of the first coil wiring refers to the line edge roughness of the side of the first coil wiring in a cross section perpendicular to the first main surface and including the center line of the first coil wiring.
  • the anchor effect improves adhesion between the first through wiring and the element body.
  • the line edge roughness of the first through wiring is equal to or smaller than the line edge roughness of the first coil wiring.
  • the side of the first through wiring is smooth, so that the increase in resistance at high frequencies due to the skin effect can be suppressed, and the Q value can be improved.
  • the width of the first through-hole wiring and the width of the second through-hole wiring are different.
  • the width of the first through-hole wiring is the equivalent circle diameter obtained from the cross-sectional area of the first through-hole wiring in a cross section that includes the center of the extension direction of the first through-hole wiring and is parallel to the first main surface.
  • the width of the second through-hole wiring is the equivalent circle diameter obtained from the cross-sectional area of the second through-hole wiring in a cross section that includes the center of the extension direction of the second through-hole wiring and is parallel to the first main surface.
  • the design freedom of the first through-hole wiring and the second through-hole wiring can be improved.
  • the first through wiring has an outer circumferential portion located radially outward of the coil with respect to the first coil wiring and the second coil wiring when viewed in the axial direction,
  • the outer circumferential portion is disposed between 0.3 and 0.7 inclusive of a height of the element body in a direction perpendicular to the first main surface, with the first main surface as a reference.
  • the second coil wiring means being located radially outward of the tangent line that contacts the end face that is located in a direction parallel to the first main surface of the first coil wiring and the end face that is located in a direction parallel to the first main surface of the second coil wiring, as viewed from the axial direction.
  • the first through wiring has an outer peripheral portion, so the inner diameter of the coil can be increased to improve the Q value.
  • the outer peripheral portion is disposed between 0.3 and 0.7 of the height of the element body, so that the outer peripheral portion can be provided on only a portion of the height of the element body, thereby reducing the possibility that the first through wiring will be exposed from the element body when singulated.
  • a second coil provided on the body and wound in a spiral shape along a second axis parallel to the axis; a third external electrode and a fourth external electrode provided on the element body and electrically connected to the second coil,
  • the second coil is a plurality of third coil wirings provided on the first main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the first main surface; a plurality of fourth coil wirings provided on the second main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the second main surface; a plurality of third through wirings extending from the third coil wiring toward the fourth coil wiring and arranged along the second axis; a plurality of fourth through wirings extending from the third coil wiring toward the fourth coil wiring, provided on an opposite side of the second axis from the third through wiring, and arranged along the second axis; the third coil wiring, the third through wiring, the fourth coil wiring,
  • the efficiency of obtaining inductance can be increased in the second coil as well as in the first coil, and design freedom can be improved.
  • the first through wire and the second through wire and the third through wire and the fourth through wire are line-symmetrical with respect to a center line between the first coil and the second coil.
  • the second through wire and the third through wire are arranged in parallel.
  • the second through-hole wiring and the third through-hole wiring are arranged in parallel, so that the distance between adjacent coils and the second coil can be reduced, and the inductor component can be made smaller.
  • the first through wiring and the second through wiring are asymmetrical with respect to a straight line that is perpendicular to the first main surface and includes the axis, when viewed from the axial direction.
  • the first through-hole wiring and the second through-hole wiring are asymmetrical with respect to a straight line that is perpendicular to the first main surface and includes the axis when viewed from the axial direction, thereby further improving the design freedom of the first through-hole wiring and the second through-hole wiring.
  • the third through wire and the fourth through wire are non-parallel when viewed from the second axial direction.
  • the distance between the third through-hole wiring and the fourth through-hole wiring can be increased, and the inner diameter of the second coil can be increased, thereby improving the Q value.
  • the first through wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring
  • the first external electrode is provided on the first main surface side and overlaps at least a portion of the first connection surface when viewed in a direction perpendicular to the first main surface;
  • the inclination angle on the axial side between a straight line connecting the center of the first connection surface and the center of the second connection surface and the connection surface connected to the first through wiring of the second coil wiring is greater than or equal to 60° and less than 90°.
  • the inclination angle is less than 90°, the area of the first coil wiring that overlaps with the first external electrode when viewed from a direction perpendicular to the first main surface can be reduced. This reduces the parasitic capacitance between the first external electrode and the first coil wiring, and increases the self-resonant frequency.
  • the inclination angle is 60° or more, the inner diameter of the coil can be secured, thereby ensuring the Q value.
  • a portion of the first connection surface and a portion of the second connection surface preferably overlap when viewed in a direction perpendicular to the first main surface.
  • a part of the first connection surface and a part of the second connection surface overlap, so when a through hole is formed in the base body, a seed layer is provided on the inner surface of the through hole, and the first through wiring is formed on the seed layer by electrolytic plating, the formation of the seed layer becomes easy.
  • the center of the first connection surface is preferably closer to the axis than the center of the second connection surface when viewed in a direction perpendicular to the first main surface.
  • the first connection surface is disposed inside the coil relative to the second connection surface when viewed from a direction perpendicular to the first main surface. This makes it possible to reduce the area of the first coil wiring that overlaps with the first external electrode when viewed from a direction perpendicular to the first main surface, thereby reducing the parasitic capacitance between the first external electrode and the first coil wiring and increasing the self-resonant frequency.
  • the first through-hole wiring has a conductive layer located on the outer periphery when viewed from the direction in which the first through-hole wiring extends, and a non-conductive layer located inside the conductive layer.
  • the current when used in the high frequency band, the current mainly flows through the surface of the first through-hole wiring due to the skin effect, so by providing a conductive layer on the outer periphery, the Q value is not lowered.
  • the Q value when provided on the outer periphery, the Q value is not lowered.
  • by providing a non-conductive layer on the inside stress can be alleviated, and manufacturing costs can be reduced by not using a conductor.
  • the cross-sectional area of at least one of the two ends in the extension direction of the first through-hole wiring is larger than the cross-sectional area of the center part in the extension direction of the first through-hole wiring.
  • the cross-sectional area of the end of the first through wiring can be increased, improving the connectivity between the first through wiring and at least one of the first coil wiring and the second coil wiring.
  • the cross-sectional area of the end of the first through wiring is large and the cross-sectional area of the center of the first through wiring is small, it is easy to form the first through wiring.
  • the thickness of the inductor component is 200 ⁇ m or less.
  • the inductor components can be made thinner.
  • the first external electrode and the second external electrode are preferably located inside the outer surface of the body when viewed in a direction perpendicular to the first main surface.
  • the first external electrode and the second external electrode are not in contact with the outer surface of the element body, so that when the inductor components are singulated, the load on the first external electrode and the second external electrode can be reduced, and deformation and peeling of the first external electrode and the second external electrode can be suppressed. Therefore, even if the inductor component is made small, deformation and peeling of the first external electrode and the second external electrode can be prevented.
  • the inductor component further comprises an organic insulator provided on the first main surface, the element body being an inorganic insulator, and the organic insulator being located inside the outer surface of the inorganic insulator when viewed in a direction perpendicular to the first main surface.
  • the organic insulator since the organic insulator is included, the organic insulator is easily given fluidity, and when the first coil wiring is covered with the organic insulator, the organic insulator can be easily filled between adjacent first coil wirings, improving insulation. In addition, since the organic insulator is not in contact with the outer surface of the mechanical insulator, the load on the organic insulator can be reduced when singulating into individual inductor components, and deformation and peeling of the organic insulator can be suppressed.
  • the inductor component according to one aspect of the present disclosure can improve the efficiency of obtaining inductance.
  • FIG. 2 is a schematic bottom view of the inductor component of the first embodiment as viewed from the bottom side.
  • FIG. This is a cross-sectional view of FIG.
  • FIG. 3 is a cross-sectional view taken along line III-III of FIG.
  • FIG. 3 is an enlarged view of a portion of FIG. 2 .
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • FIG. 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • FIG. 11 is a cross-sectional view showing a first modified example of an inductor component.
  • FIG. 11 is a cross-sectional view showing a second modified example of the inductor component.
  • FIG. 11 is a cross-sectional view showing a third modified example of the inductor component.
  • FIG. 11 is a cross-sectional view showing a fourth modified example of the inductor component.
  • FIG. 11 is a cross-sectional view showing a fifth modified example of the inductor component.
  • FIG. 13 is a schematic bottom view of the inductor component of the second embodiment as viewed from the bottom side.
  • FIG. FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7.
  • FIG. 9 is a partially enlarged view of FIG. 8 .
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component.
  • FIG. 11 is a cross-sectional view showing a first modified example of an inductor component.
  • FIG. 11 is a cross-sectional view showing a second modified example of the inductor component.
  • Fig. 1 is a schematic bottom view of the inductor component 1 as viewed from the bottom side.
  • Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1.
  • Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1.
  • external electrodes are depicted by two-dot chain lines in Fig. 1.
  • the element body 10 is depicted as transparent so that the structure can be easily understood, but it may be semi-transparent or opaque.
  • the inductor component 1 is a surface mount type inductor component used, for example, in a high frequency signal transmission circuit. As shown in Figures 1, 2 and 3, the inductor component 1 includes an element body 10, a coil 110 provided on the element body 10 and wound in a spiral shape along an axis AX, and a first external electrode 121 and a second external electrode 122 provided on the element body 10 and electrically connected to the coil 110.
  • the element body 10 has a length, width, and height.
  • the element body 10 has a first end face 100e1 and a second end face 100e2 at both ends in the length direction, a first side face 100s1 and a second side face 100s2 at both ends in the width direction, and a bottom face 100b and a top face 100t at both ends in the height direction.
  • the outer surface 100 of the element body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, the bottom face 100b, and the top face 100t.
  • the bottom face 100b corresponds to an example of a "first main face” as described in the claims
  • the top face 100t corresponds to an example of a "second main face” as described in the claims.
  • the length direction (longitudinal direction) of the element body 10, which is the direction from the first end face 100e1 to the second end face 100e2, is referred to as the X direction.
  • the width direction of the element body 10, which is the direction from the first side face 100s1 to the second side face 100s2, is referred to as the Y direction.
  • the height direction of the element body 10, which is the direction from the bottom face 100b to the top face 100t, is referred to as the Z direction.
  • the X direction, Y direction, and Z direction are mutually perpendicular, and when arranged in the order X, Y, Z, they form a right-handed system.
  • the "outer surface 100 of the element body” including the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, the second side surface 100s2, the bottom surface 100b, and the top surface 100t of the element body 10 does not simply mean a surface facing the outer periphery of the element body 10, but a surface that is the boundary between the outside and the inside of the element body 10. Furthermore, “above the outer surface 100 of the element body 10” does not mean an absolute direction such as vertically upward as defined by the direction of gravity, but refers to a direction toward the outside of the outside and the inside with the outer surface 100 as a boundary, based on the outer surface 100. Therefore, "above the outer surface 100” is a relative direction determined by the orientation of the outer surface 100. Furthermore, "above” with respect to a certain element includes not only an upper side away from the element, that is, an upper position through another object on the element or an upper position with a space therebetween, but also a position directly above the element (on).
  • the axis AX of the coil 110 is arranged parallel to the bottom surface 100b.
  • the coil 110 includes a plurality of bottom surface wirings 11b arranged on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX on a plane parallel to the bottom surface 100b, a plurality of top surface wirings 11t arranged on the top surface 100t side with respect to the axis AX and arranged along the axis AX on a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom surface wirings 11b toward the top surface wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom surface wirings 11b toward the top surface wirings 11t, arranged on the opposite side of the first through wirings 13 with respect to the axis AX and arranged along the axis AX.
  • the bottom wiring 11b corresponds to an example of the "first coil wiring” described in the claims
  • the top wiring 11t corresponds to an example of the "second coil wiring” described in the claims.
  • the axis AX is the intersection of a first plane passing through the center between the bottom wiring 11b and the top wiring 11t, and a second plane passing through the center between the first through wiring 13 and the second through wiring 14.
  • the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110.
  • the axis AX of the coil 110 has no dimension in a direction perpendicular to the axis AX.
  • the coil 110 includes the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14.
  • the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14 are connected in this order to form at least a part of a spiral shape, so that the inner diameter of the coil 110 can be increased and the efficiency of obtaining inductance can be increased. Furthermore, by increasing the efficiency of obtaining inductance, the Q value can be increased.
  • the pad portion of a conventional inductor component and the bottom wiring 11b and top wiring 11t of this embodiment are "receiving portions" for the wiring that penetrates the element body (the conductive vias of a conventional inductor component and the first through wiring 13 and second through wiring 14 of this embodiment), and therefore have a shape that extends perpendicularly in the direction that penetrates the element body.
  • the pad portion extends in a direction perpendicular to the axis of the coil, and is likely to have a structure that blocks magnetic flux generated in the axial direction of the coil.
  • the first through wiring 13 and the second through wiring 14 extend in a direction perpendicular to the axis AX of the coil 110, so the bottom wiring 11b and the top wiring 11t extend in a direction parallel to the axis AX of the coil 110. Therefore, the bottom wiring 11b and the top wiring 11t are unlikely to have a structure that blocks magnetic flux generated in the direction of the axis AX. In other words, with this embodiment, a structure that is unlikely to block magnetic flux can be achieved, improving the inductance acquisition efficiency and Q value.
  • the first through-hole wiring 13 and the second through-hole wiring 14 are non-parallel when viewed along the axis AX.
  • the center line 13a of the first through-hole wiring 13 and the center line 14a of the second through-hole wiring 14 are not parallel when viewed along the axis AX.
  • the first through-wire 13 and the second through-wire 14 are non-parallel when viewed from the axis AX direction, which improves the design freedom of the first through-wire 13 and the second through-wire 14, and for example, the Q value can be increased or the self-resonant frequency can be raised. Specifically, the distance between the first through-wire 13 and the second through-wire 14 can be increased, and the inner diameter of the coil 110 can be increased, improving the Q value.
  • all the first through wirings 13 and all the second through wirings 14 are non-parallel when viewed from the axis AX direction. It is sufficient that at least one first through wiring 13 and at least one second through wiring 14 are non-parallel when viewed from the axis AX direction. It is preferable that the first through wiring 13 and the second through wiring 14 intersecting on the same plane perpendicular to the axis AX are non-parallel when viewed from the axis AX direction. Although all the first through wirings 13 overlap when viewed from the axis AX direction, there may be first through wirings 13 that do not overlap when viewed from the axis AX direction among all the first through wirings 13. The same applies to the second through wirings 14.
  • the volume of the inductor component 1 is 0.08 mm3 or less, and the size of the long side of the inductor component 1 is 0.65 mm or less.
  • the size of the long side of the inductor component 1 refers to the largest value among the length, width, and height of the inductor component 1, and in this embodiment, refers to the length in the X direction. According to the above configuration, the volume of the inductor component 1 is small and the long side of the inductor component 1 is short, so that the weight of the inductor component 1 is light. Therefore, even if the external electrodes 121 and 122 are small, the necessary mounting strength can be obtained.
  • the thickness of the inductor component 1 is preferably 200 ⁇ m or less. This allows the inductor component 1 to be made thin.
  • the size of the inductor component 1 (length (X direction) x width (Y direction) x height (Z direction)) is 0.6 mm x 0.3 mm x 0.3 mm, 0.4 mm x 0.2 mm x 0.2 mm, 0.25 mm x 0.125 mm x 0.120 mm, etc. Furthermore, the width and height do not have to be equal, and may be, for example, 0.4 mm x 0.2 mm x 0.3 mm.
  • the element body 10 contains SiO2 , which can provide insulation and rigidity to the element body 10.
  • the element body 10 is made of, for example, a sintered glass body.
  • the sintered glass body may contain alumina, which can further increase the strength of the element body.
  • the glass sintered body is formed, for example, by stacking multiple insulating layers containing glass.
  • the stacking direction of the multiple insulating layers is the Z direction.
  • the insulating layers are in a layered form having main surfaces extending in the XY plane. Note that, due to firing or the like, the interfaces between the multiple insulating layers of the element body 10 may not be clear.
  • the element body 10 may be made of, for example, a glass substrate.
  • the glass substrate may be a single-layer glass substrate, and since the majority of the element body is made of glass, losses such as eddy current losses at high frequencies can be suppressed.
  • the coil 110 includes a plurality of bottom wirings 11b, a plurality of top wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14.
  • the bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14 are connected in sequence to form at least a portion of the coil 110 wound in the axial direction AX.
  • the coil 110 is a so-called helical-shaped coil 110, so that in a cross section perpendicular to the axis AX, the area in which the bottom wiring 11b, the top wiring 11t, the first through wiring 13, and the second through wiring 14 run parallel to the winding direction of the coil 110 can be reduced, thereby reducing the stray capacitance in the coil 110.
  • a helical shape refers to a shape in which the number of turns in the entire coil is greater than one turn, and the number of turns in the coil in a cross section perpendicular to the axis is less than one turn.
  • One turn or more refers to a state in which, in a cross section perpendicular to the axis, the coil wiring has parts that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction
  • “less than one turn” refers to a state in which, in a cross section perpendicular to the axis, the coil wiring does not have parts that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction.
  • the bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b extends in the Y direction at a slight incline toward the X direction. All the bottom wirings 11b are arranged parallel to the X direction.
  • modified illumination such as annular illumination or dipole illumination
  • the pattern resolution in a specific direction can be improved to form a finer pattern.
  • the bottom wirings 11b extend in only one direction and all the bottom wirings 11b are arranged in parallel, so that fine bottom wirings 11b can be formed by using modified illumination, for example, in the photolithography process, and the inductor component 1 can be made smaller.
  • the top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t extends in the Y direction. All the top surface wiring 11t are arranged in parallel along the X direction. With the above configuration, the top surface wiring 11t extends in only one direction and is arranged in parallel. Therefore, by using, for example, modified illumination in the photolithography process, fine top surface wiring 11t can be formed, and the inductor component 1 can be made smaller.
  • the bottom wiring 11b and the top wiring 11t are made of a good conductor material such as copper, silver, gold, or an alloy of these.
  • the bottom wiring 11b and the top wiring 11t may be a metal film formed by plating, vapor deposition, sputtering, or the like, or may be a metal sintered body formed by applying and sintering a conductive paste.
  • the bottom wiring 11b and the top wiring 11t may also be a multi-layer structure in which multiple metal layers are stacked.
  • the thickness of the bottom wiring 11b and the top wiring 11t is preferably 5 ⁇ m or more and 50 ⁇ m or less.
  • the first through wiring 13 is disposed on the first side surface 100s1 side of the axis AX within the through hole V of the element body 10, and the second through wiring 14 is disposed on the second side surface 100s2 side of the axis AX within the through hole V of the element body 10.
  • the first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. This allows the lengths of the first through wiring 13 and the second through wiring 14 to be shortened, thereby suppressing the DC resistance (Rdc). All of the first through wirings 13 and all of the second through wirings 14 are disposed in parallel along the X direction.
  • the first through wiring 13 and the second through wiring 14 are non-parallel when viewed from the axis AX direction. Specifically, the first through wiring 13 and the second through wiring 14 are bent at the center so that the distance between them becomes wider toward the center in the Z direction. In other words, the first through wiring 13 and the second through wiring 14 each have a shape that spreads outward in the radial direction of the coil 110 toward the center in the Z direction. In addition, the first through wiring 13 and the second through wiring 14 each have a stepped shape along the Z direction.
  • the first through wiring 13 and the second through wiring 14 are each formed by stacking multiple conductor layers, the first through wiring 13 and the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.
  • the first through-wire 13 and the second through-wire 14 are linearly symmetrical with respect to the axis AX when viewed from a direction perpendicular to the bottom surface 100b. This ensures symmetry of the coil 110 with respect to the axis AX, making it easier to design the coil 110. It also reduces the intrusion of some of the through-wires into the inner diameter of the coil 110, improving the Q value.
  • the first through-wire 13 and the second through-wire 14 are symmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed in the direction of the axis AX. This ensures symmetry of the coil 110 with respect to the axis AX, making it easier to design the coil 110. It also reduces the intrusion of some of the through-wires into the inner diameter of the coil 110, improving the Q value.
  • the line edge roughness (hereinafter also referred to as LER (Line Edge Roughness)) of the first through wiring 13 is greater than the line edge roughness of the bottom wiring 11b.
  • the line edge roughness of the first through wiring 13 refers to the line edge roughness of the side of the first through wiring 13 on the inner diameter side of the coil 110 in a cross section perpendicular to the axis AX of the coil 110 and including the center line 13a of the first through wiring 13.
  • the line edge roughness of the bottom wiring 11b refers to the line edge roughness of the side of the bottom wiring 11b in a cross section perpendicular to the bottom surface 100b and including the center line 14a of the bottom wiring 11b. This improves the adhesion between the first through wiring 13 and the element body 10 due to the anchor effect.
  • the LER of the first through wiring 13 refers to the dimensional variation in the width of the first through wiring 13.
  • the width of the first through wiring 13 is the dimension in a direction perpendicular to the center line 13a in a cross section including the center line 13a of the first through wiring 13.
  • the method for measuring the LER complies with the SEMI standard (SEMI Standard P47-0307, Test Method for Evaluation of Line-Edge Roughness and Line width Roughness).
  • SEMI standard SEMI Standard P47-0307, Test Method for Evaluation of Line-Edge Roughness and Line width Roughness.
  • an SEM image (or optical image) of the first through wiring 13 is acquired at a magnification that covers 1/3 or more of the length of the first through wiring 13 in the extension direction, and the LER of the first through wiring 13 is calculated using WinROOF2018, which is image processing software.
  • an SEM image of the bottom wiring 11b is acquired at a magnification that covers 1/3 or more of the length of the bottom wiring 11b in the extension direction, and the LER of the bottom wiring 11b is calculated.
  • the LER refers to the average value of the LER calculated at three or more points in the image acquired as described above, and the three or more points include at least two points where the distance between the two points is half or more of the acquired image.
  • the line edge roughness of the first through wiring 13 may be greater than the line edge roughness of the top surface wiring 11t, and the adhesion between the first through wiring 13 and the element body 10 is improved due to the anchor effect.
  • the line edge roughness of the second through wiring 14 may be greater than the line edge roughness of the bottom wiring 11b, and the anchor effect improves the adhesion between the second through wiring 14 and the element body 10.
  • the line edge roughness of the second through wiring 14 may be greater than the line edge roughness of the top wiring 11t, and the anchor effect improves the adhesion between the second through wiring 14 and the element body 10.
  • the line edge roughness of the first through wiring 13 may be equal to or smaller than the line edge roughness of the bottom wiring 11b. In this way, since the side surface of the first through wiring 13 is smooth, an increase in resistance at high frequencies due to the skin effect can be suppressed, and the Q value can be improved. Similarly, the line edge roughness of the first through wiring 13 may be equal to or smaller than the line edge roughness of the top wiring 11t. Similarly, the line edge roughness of the second through wiring 14 may be equal to or smaller than the line edge roughness of the bottom wiring 11b, and since the side surface of the second through wiring 14 is smooth, it is possible to suppress an increase in resistance at high frequencies due to the skin effect, and the Q value can be improved. Similarly, the line edge roughness of the second through wiring 14 may be equal to or smaller than the line edge roughness of the top wiring 11t.
  • the width of the first through wiring 13 and the width of the second through wiring 14 are different.
  • the width of the first through wiring 13 is a circle equivalent diameter obtained from the cross-sectional area of the first through wiring 13 in a cross section that includes the center of the extension direction of the first through wiring 13 and is parallel to the bottom surface 100b.
  • the width of the second through wiring 14 is a circle equivalent diameter obtained from the cross-sectional area of the second through wiring 14 in a cross section that includes the center of the extension direction of the second through wiring 14 and is parallel to the bottom surface 100b.
  • the first through wiring 13 is divided into three equal parts in the height direction, an upper part, a middle part, and a lower part, and the average value of the circle equivalent diameter of the cross-sectional area of each of the three equal parts is set as the width.
  • the width of the first through wiring 13 and the width of the second through wiring 14 are considered to be different when the width of the first through wiring 13 and the width of the second through wiring 14 are relatively different by 10% or more.
  • the above configuration improves the design freedom of the first through-wire 13 and the second through-wire 14. For example, if the through-wire is inclined or curved, the DC resistance increases, so the width of the through-wire on the side with the longer line length is increased so that the DC resistance of through-wires of different shapes and different line lengths is the same.
  • the first through wiring 13 has an outer peripheral portion 131 located radially outward of the coil 110 from the bottom wiring 11b and the top wiring 11t when viewed from the axis AX direction.
  • the outer peripheral portion 131 is located radially outward of the coil 110 from a tangent L2 that touches an end face 11b1 of the bottom wiring 11b located in a direction parallel to the bottom face 100b and an end face 11t1 of the top wiring 11t located in a direction parallel to the bottom face 100b when viewed from the axis AX direction.
  • the outer peripheral portion 131 is located between 0.3 and 0.7 of the height Z1 of the element body 10 in a direction perpendicular to the bottom face 100b, with the bottom face 100b as a reference.
  • the height Z1 of the element body 10 is the distance from the bottom face 100b to the top face 100t.
  • the position of 1.0 of the height Z1 of the element body 10 corresponds to the top face 100t.
  • the first through wiring 13 has an outer peripheral portion 131, so the inner diameter of the coil 110 can be increased to improve the Q value.
  • the outer peripheral portion 131 is disposed between 0.3 and 0.7 of the height Z1 of the element body, the outer peripheral portion 131 can be provided on only a portion of the height Z1 of the element body 10, thereby reducing the possibility that the first through wiring 13 will be exposed from the element body 10 when singulated.
  • the second through wiring 14 has an outer peripheral portion that is located radially outward of the coil 110 relative to the bottom wiring 11b and the top wiring 11t when viewed from the axis AX direction, and the outer peripheral portion is positioned between 0.3 and 0.7 of the height Z1 of the element body 10. This makes it possible to increase the inner diameter of the coil 110 and improve the Q value, and also reduces the possibility of the second through wiring 14 being exposed from the element body 10 when singulated.
  • the first through wiring 13 contains SiO 2. According to this, when the element body 10 contains SiO 2 , the linear expansion coefficient of the first through wiring 13 can be matched to the linear expansion coefficient of the element body 10, and cracks between the first through wiring 13 and the element body 10 can be suppressed.
  • a conductive paste is used for the first through wiring 13.
  • the conductive material is Ag, Cu, or the like.
  • the second through wiring 14 similarly contains SiO 2 .
  • the first end of the bottom wiring 11b and the first end of the top wiring 11t overlap when viewed from a direction perpendicular to the bottom surface 100b, and the angle ⁇ between the bottom wiring 11b and the top wiring 11t is an acute angle.
  • the angle ⁇ is the angle between the center line of the width of the bottom wiring 11b (the dashed line in FIG. 2) and the center line of the width of the top wiring 11t (the dashed line in FIG. 2) when viewed from a direction perpendicular to the bottom surface 100b.
  • the angle ⁇ between the bottom wiring 11b and the top wiring 11t connected to the same first through wiring 13 is 5° or more and 45° or less when viewed from a direction perpendicular to the bottom surface 100b.
  • the angle ⁇ is the angle between the center line of the width of the bottom wiring 11b (the dashed line in FIG. 2) and the center line of the width of the top wiring 11t (the dashed line in FIG. 2) when viewed from a direction perpendicular to the bottom surface 100b.
  • the coil 110 is wound tightly, so that the inductance can be improved. Since the angle ⁇ is 45° or less, the coil length is shortened, the leakage magnetic flux is reduced, and the Q value is increased.
  • the coil length refers to the distance between the two ends located at the outermost positions in the axis AX direction among the bottom wiring 11b, the top wiring 11t, the first through wiring 13, and the second through wiring 14. Since the angle ⁇ is 5° or more, the possibility of contact between two adjacent first through wirings 13 in the axis AX direction is reduced, and the possibility of contact between two adjacent second through wirings 14 in the axis AX direction is reduced. Note that the angle ⁇ may be 5° or more and 45° or less in at least one pair of bottom wiring 11b and top wiring 11t among all the bottom wirings 11b and top wiring 11t.
  • the angle ⁇ between the bottom surface wiring 11b and the top surface wiring 11t connected to the same second through wiring 14 is 5° or more and 45° or less. This allows the coil 110 to be wound tightly, improving the inductance.
  • At least one of the bottom wiring 11b, top wiring 11t, first through wiring 13, and second through wiring 14 includes a void portion or a resin portion.
  • a void portion or a resin portion This allows the stress caused by the difference in linear expansion coefficient between the wiring and the element body 10 to be absorbed by the void portion or resin portion, and the stress can be alleviated.
  • a method for forming the void portion for example, a material that is burned away by sintering is used as the wiring material, and the void portion can be formed by sintering the wiring.
  • a method for forming the resin portion for example, a conductive paste can be used as the wiring material to form the resin portion.
  • At least one of the bottom surface wiring 11b and the top surface wiring 11t contains SiO 2.
  • the linear expansion coefficient of the wiring can be matched to the linear expansion coefficient of the element body 10, and cracks between the wiring and the element body 10 can be suppressed.
  • the first external electrode 121 is connected to a first end of the coil 110, and the second external electrode 122 is connected to a second end of the coil 110.
  • the first external electrode 121 is provided on the first end face 100e1 side with respect to the center in the X direction of the element body 10 so as to be exposed from the outer surface 100 of the element body 10.
  • the second external electrode 122 is provided on the second end face 100e2 side with respect to the center in the X direction of the element body 10 so as to be exposed from the outer surface 100 of the element body 10.
  • the first external electrode 121 and the second external electrode 122 are located inside the outer surface 100 of the element body 10.
  • the first external electrode 121 and the second external electrode 122 are located inside the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, and the second side surface 100s2 of the element body 10.
  • the first external electrode 121 and the second external electrode 122 are not in contact with the outer surface 100 of the element body 10, so when the inductor components are singulated, the load on the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component is made small, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.
  • the first external electrode 121 may be provided continuously on the bottom surface 100b and the first end surface 100e1. In this way, since the first external electrode 121 is a so-called L-shaped electrode, a solder fillet can be formed on the first external electrode 121 when the inductor component 1 is mounted on a mounting board. Similarly, the second external electrode 122 may be provided continuously on the bottom surface 100b and the second end surface 100e2.
  • the first external electrode 121 has a bottom surface portion 121b provided on the bottom surface 100b and a via portion 121v embedded in the bottom surface 100b.
  • the via portion 121v is connected to the bottom surface portion 121b.
  • the via portion 121v is connected to an end of the bottom surface wiring 11b located on the first end surface 100e1 side in the axis AX direction.
  • the second external electrode 122 has a bottom surface portion 122b provided on the bottom surface 100b and a via portion 122v embedded in the bottom surface 100b.
  • the via portion 122v is connected to the bottom surface portion 122b.
  • the via portion 122v is connected to the end of the bottom surface wiring 11b located on the second end surface 100e2 side in the axis AX direction.
  • the first external electrode 121 has an underlayer 121e1 and a plating layer 121e2 that covers the underlayer 121e1.
  • the underlayer 121e1 includes a conductive material such as Ag or Cu.
  • the plating layer 121e2 includes a conductive material such as Ni or Sn.
  • a part of the bottom portion 121b and the via portion 121v are composed of the underlayer 121e1.
  • Another part of the bottom portion 121b is composed of the plating layer 121e2.
  • the second external electrode 122 has an underlayer and a plating layer that covers the underlayer.
  • the first external electrode 121 and the second external electrode 122 may be composed of a single layer of conductive material.
  • Figures 5A to 5M are views corresponding to the cross section II-II of Figure 1.
  • Figures 5I, 5J, and 5M are views corresponding to the cross section III-III of Figure 1.
  • a first insulating layer 1011 is provided on a base substrate 1000 by printing.
  • the material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, etc.
  • the material of the first insulating layer 1011 is, for example, a resin such as epoxy or polyimide, or an inorganic insulating film such as SiO or SiN.
  • the second insulating layer 1012 is provided on the first insulating layer 1011 by printing.
  • a groove 1012a is provided in the second insulating layer 1012.
  • the groove 1012a is formed, for example, by a photolithography process. Note that the groove may be formed from the beginning as a printing pattern.
  • a top conductor layer 1011t is provided in the groove 1012a by printing.
  • the material of the top conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, etc.
  • the top conductor layer 1011t is formed as a printing pattern so that it remains only in the groove 1012a. Note that after the top conductor layer 1011t is printed on the second insulating layer 1012, a photolithography process may be used to make the top conductor layer 1011t remain only in the groove 1012a.
  • a third insulating layer 1013 is provided on the second insulating layer 1012 by printing.
  • a first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013.
  • the first groove 1013a and the second groove 1013b are formed in the same manner as in FIG. 5B.
  • the first through conductor layer 1131 of the first layer is provided by printing in the first groove 1013a
  • the second through conductor layer 1141 of the first layer is provided by printing in the second groove 1013b.
  • the first through conductor layer 1131 of the first layer and the second through conductor layer 1141 of the first layer are formed in the same manner as in FIG. 5C.
  • a fourth insulating layer 1014 is provided on the third insulating layer 1013, and a second-layer first penetrating conductor layer 1132 and a second-layer second penetrating conductor layer 1142 are provided in each of the two grooves provided in the fourth insulating layer 1014. Furthermore, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a third-layer first penetrating conductor layer 1133 and a third-layer second penetrating conductor layer 1143 are provided in each of the two grooves provided in the fifth insulating layer 1015.
  • a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a fourth-layer first penetrating conductor layer 1134 and a fourth-layer second penetrating conductor layer 1144 are provided in each of the two grooves provided in the sixth insulating layer 1016.
  • a seventh insulating layer 1017 is provided on the sixth insulating layer 1016, and a fifth layer, a first penetrating conductor layer 1135, and a fifth layer, a second penetrating conductor layer 1145 are provided in each of the two grooves provided in the seventh insulating layer 1017.
  • the first through conductor layer 1131 of the first layer, the first through conductor layer 1132 of the second layer, and the first through conductor layer 1133 of the third layer are stacked in order so as to be shifted radially outward of the coil
  • the first through conductor layer 1133 of the third layer, the first through conductor layer 1134 of the fourth layer, and the first through conductor layer 1135 of the fifth layer are stacked in order so as to be shifted radially inward of the coil.
  • the second through conductor layer 1141 of the first layer, the second through conductor layer 1142 of the second layer, and the second through conductor layer 1143 of the third layer are stacked in order so as to be shifted radially outward of the coil
  • the second through conductor layer 1143 of the third layer, the second through conductor layer 1144 of the fourth layer, and the second through conductor layer 1145 of the fifth layer are stacked in order so as to be shifted radially inward of the coil.
  • an eighth insulating layer 1018 is provided on the seventh insulating layer 1017, and a bottom conductor layer 1011b is provided in a groove provided in the eighth insulating layer 1018.
  • the material of the bottom conductor layer 1011b is the same as the material of the top conductor layer 1011t.
  • a ninth insulating layer 1019 is provided on the eighth insulating layer 1018.
  • a groove 1019a is provided in the ninth insulating layer 1019 so that a portion of the bottom conductor layer 1011b is exposed.
  • an underlying conductor layer 1121e1 is provided on the ninth insulating layer 1019 and in the groove 1019a.
  • the material of the underlying conductor layer 1121e1 is, for example, a resin paste such as Ag or Cu.
  • the entire laminate is sintered in a high-temperature (e.g., 500°C or higher) furnace.
  • the first to ninth insulating layers 1011-1019 are sintered to form the base body 10
  • the top conductor layer 1011t is sintered to form the top wiring 11t
  • the bottom conductor layer 1011b is sintered to form the bottom wiring 11b
  • the first through conductor layers 1131-1135 of the first to fifth layers are sintered to form the first through wiring 13
  • the second through conductor layers 1141-1145 of the first to fifth layers are sintered to form the second through wiring 14
  • the base conductor layer 1121e1 is sintered to form the base layer 121e1.
  • the strength can be improved by sintering the insulating layers, and the conductor layers are sintered to volatilize unnecessary resin components contained in the conductor layers and fuse the conductor material contained in the conductor layers to achieve high conductivity.
  • the base substrate 1000 may be peeled off by decomposing the surface during sintering, or may be mechanically removed by grinding or the like before or after sintering, or may be chemically removed by etching or the like before or after sintering.
  • the chip is cut into individual pieces along cut lines C.
  • a plating layer 121e2 is formed by barrel plating so as to cover the base layer 121e1, forming a first external electrode 121. In this way, the inductor component 1 is manufactured as shown in FIG. 2.
  • Fig. 6A is a view showing a first modified example of the inductor component, corresponding to the II-II cross section of Fig. 1.
  • the first through wire 13 and the second through wire 14 are not parallel when viewed from the axis AX direction. This makes it possible to increase the distance between the first through wire 13 and the second through wire 14, thereby making it possible to increase the inner diameter of the coil 110 and improve the Q value.
  • first through-wire 13 and the second through-wire 14 are bent at the center so that the distance between them becomes wider toward the center in the Z direction.
  • first through-wire 13 and the second through-wire 14 each have a shape that spreads outward in the radial direction of the coil 110 toward the center in the Z direction.
  • first through wiring 13 and the second through wiring 14 each have an arc shape along the Z direction. That is, the inner surface of the first through wiring 13 has a concave curved surface, and the outer surface of the first through wiring 13 has a convex curved surface.
  • the inner surface of the second through wiring 14 has a concave curved surface, and the outer surface of the second through wiring 14 has a convex curved surface.
  • the inner surfaces of the first through wiring 13 and the second through wiring 14 are the surfaces on the inner diameter side of the coil 110, and the outer surfaces of the first through wiring 13 and the second through wiring 14 are the surfaces on the outer diameter side of the coil 110.
  • the inner surfaces of the first through wiring 13 and the second through wiring 14 and the outer surfaces of the first through wiring 13 and the second through wiring 14 can be made smooth, thereby reducing DC resistance.
  • the inner surfaces of the first through wiring 13 and the second through wiring 14 are smooth, it is possible to suppress an increase in resistance at high frequencies due to the skin effect, and the Q value can be improved.
  • FIG. 6B is a view showing a second modified example of the inductor component, corresponding to the cross section taken along line II-II in FIG. 1.
  • the first through wire 13 and the second through wire 14 are not parallel when viewed from the axis AX direction. This allows the distance between the first through wire 13 and the second through wire 14 to be increased, the inner diameter of the coil 110 to be increased, and the Q value to be improved.
  • the first through wiring 13 and the second through wiring 14 are inclined so that the distance between them becomes wider toward the top surface wiring 11t in the Z direction.
  • the first through wiring 13 and the second through wiring 14 each have a shape that spreads outward in the radial direction of the coil 110 as far as the top surface wiring 11t in the Z direction. In this way, the coil 110 has a trapezoidal shape when viewed in the axial AX direction.
  • the first through-hole wiring 13 and the second through-hole wiring 14 can be formed in a straight line and shortened, thereby reducing the DC resistance of the first through-hole wiring 13 and the second through-hole wiring 14.
  • FIG. 6C is a view showing a third modified example of an inductor component corresponding to the cross section taken along line II-II in Fig. 1.
  • an inductor component 1C of the third modified example includes a first coil 110A and a second coil 110B, as compared with the inductor component 1 shown in Fig. 2.
  • the first coil 110A corresponds to the coil 110 of the inductor component 1 shown in Fig. 2.
  • the second coil 110B like the first coil 110A, is provided on the element body 10, wound in a spiral shape along the axis AX (an example of the second axis), and connected to a third external electrode and a fourth external electrode (not shown).
  • the third external electrode and the fourth external electrode have the same configuration as the first external electrode 121 and the second external electrode 122 of the inductor component 1 shown in FIG. 1.
  • the second coil 110B like the first coil 110A, includes bottom wiring 11b (an example of the third coil wiring), top wiring 11t (an example of the fourth coil wiring), a first through wiring 13 (an example of the third through wiring), and a second through wiring 14 (an example of the fourth through wiring).
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from the direction of the axis AX. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.
  • the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1 in FIG. 2.
  • the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction.
  • the first through wiring 13 has a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 is formed by stacking multiple conductor layers, the first through wiring 13 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from the axis AX direction. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.
  • the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1 in FIG. 2.
  • the first through wiring 13 has a linear shape parallel to the Z direction.
  • the second through wiring 14 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction.
  • the second through wiring 14 has a stepped shape along the Z direction. According to the above configuration, when the second through wiring 14 is formed by stacking multiple conductor layers, the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.
  • the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other.
  • the first and second through wirings 13 and 14 of the first coil 110A and the first and second through wirings 13 and 14 of the second coil 110B are symmetrical with respect to a center line M between the first coil 110A and the second coil 110B.
  • the center line M is a line that passes through the center between the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B.
  • first through wiring 13 of the first coil 110A and the second through wiring 14 of the second coil 110B are line-symmetrical with respect to the center line M
  • second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are line-symmetrical with respect to the center line M. This makes it easy to obtain the first coil 110A and the second coil 110B with the same characteristics.
  • the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged in parallel.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel.
  • the distance between the adjacent first coil 110A and second coil 110B can be reduced, and the inductor component 1C can be made smaller.
  • the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other.
  • the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed from the direction of the axis AX.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel, so that the distance between the adjacent first coil 110A and second coil 110B can be reduced, and the inductor component 1C can be made compact.
  • the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed from the axis AX direction, so that the design freedom of the first through wiring 13 and the second through wiring 14 can be further improved.
  • the first through wire 13 and the second through wire 14 may be asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed in the axis AX direction.
  • FIG. 6D is a view showing a fourth modified example of an inductor component corresponding to the cross section taken along line II-II in Fig. 1.
  • the coil includes a first coil 110A and a second coil 110B.
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from the direction of the axis AX. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.
  • the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1A in FIG. 6A.
  • the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction.
  • the first through wiring 13 has an arc shape along the Z direction.
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from the axis AX direction. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.
  • the second through wire 14 has the same configuration as the second through wire 14 of the inductor component 1A in FIG. 6A.
  • the first through wire 13 has a straight line shape parallel to the Z direction.
  • the second through wire 14 is bent at the center so that the distance between the first through wire 13 and the second through wire 14 becomes wider toward the center in the Z direction.
  • the second through wire 14 has an arc shape along the Z direction.
  • the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged in parallel.
  • the first through wiring 13 and the second through wiring 14 of the first coil 110A and the first through wiring 13 and the second through wiring 14 of the second coil 110B are line-symmetrical with respect to the center line M between the first coil 110A and the second coil 110B.
  • first through wiring 13 of the first coil 110A and the second through wiring 14 of the second coil 110B are line-symmetrical with respect to the center line M
  • second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are line-symmetrical with respect to the center line M. This makes it possible to easily obtain the first coil 110A and the second coil 110B with the same characteristics.
  • the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged in parallel.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel.
  • the distance between the adjacent first coil 110A and second coil 110B can be reduced, and the inductor component 1D can be made smaller.
  • the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other.
  • the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed from the direction of the axis AX.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel, so that the distance between the adjacent first coil 110A and second coil 110B can be reduced, and the inductor component 1D can be made compact.
  • the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed from the axis AX direction, so that the design freedom of the first through wiring 13 and the second through wiring 14 can be further improved.
  • the first through wire 13 and the second through wire 14 may be asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed in the direction of the axis AX.
  • FIG. 6E is a view showing a fifth modified example of an inductor component corresponding to the cross section taken along line II-II in Fig. 1.
  • inductor component 1E of the fifth modified example includes a first coil 110A and a second coil 110B, as compared with inductor component 1B of the second modified example shown in Fig. 6B.
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from the direction of the axis AX. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.
  • the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1B of the second modified example.
  • the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t side.
  • the first through wiring 13 and the second through wiring 14 can be formed in a linear shape and shortened, thereby reducing the DC resistance of the first through wiring 13 and the second through wiring 14.
  • the first through-wire 13 and the second through-wire 14 are not parallel when viewed from the axis AX direction. This allows the distance between the first through-wire 13 and the second through-wire 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.
  • the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1B of the second modified example.
  • the first through wiring 13 has a linear shape parallel to the Z direction.
  • the second through wiring 14 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t.
  • the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged in parallel.
  • the first through wiring 13 and the second through wiring 14 of the first coil 110A and the first through wiring 13 and the second through wiring 14 of the second coil 110B are line-symmetrical with respect to the center line M between the first coil 110A and the second coil 110B.
  • first through wiring 13 of the first coil 110A and the second through wiring 14 of the second coil 110B are line-symmetrical with respect to the center line M
  • second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are line-symmetrical with respect to the center line M. This makes it possible to easily obtain the first coil 110A and the second coil 110B with the same characteristics.
  • the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged in parallel.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel, the distance between the adjacent first coil 110A and second coil 110B can be reduced, and the inductor component 1E can be made smaller.
  • the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged in parallel.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel.
  • the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed from the direction of the axis AX.
  • the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel, so that the distance between the adjacent first coil 110A and second coil 110B can be reduced, and the inductor component 1E can be made compact.
  • the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed from the axis AX direction, so that the design freedom of the first through wiring 13 and the second through wiring 14 can be further improved.
  • the first through wire 13 and the second through wire 14 may be asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed in the axis AX direction.
  • Fig. 7 is a schematic bottom view showing the second embodiment of the inductor component as viewed from the bottom side.
  • Fig. 8 is a cross-sectional view taken along line VIII-VIII of Fig. 7.
  • the insulating layer is omitted, and the external electrodes are drawn with two-dot chain lines.
  • the element body 10 is drawn transparently so that the structure can be easily understood.
  • the second embodiment differs from the first embodiment mainly in the position of the coil axis, the material of the element body, and the provision of an insulating layer, and these differences in configuration will be mainly described below.
  • the other configurations are the same as those of the first embodiment, and description thereof will be omitted.
  • the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the element body 10 in the X direction. This can reduce the interference with the magnetic flux of the coil 110 by the first external electrode 121 and the second external electrode 122, improving the efficiency of obtaining inductance.
  • the length of coil 110 in the axial AX direction is shorter than the inner diameter of coil 110.
  • the length of coil 110 in the axial AX direction is also called the coil length. This allows the Q value to be improved because the coil length is short and the coil inner diameter is large.
  • the inner diameter of the coil refers to the equivalent diameter of a circle based on the minimum area of the region surrounded by coil 110 when viewed through the axial AX direction.
  • the element body 10 is an inorganic insulator.
  • the material of the element body 10 is preferably glass, which has high insulating properties and can suppress eddy currents and increase the Q value.
  • the element body 10 preferably contains silicon, which provides high thermal stability of the element body 10 and therefore can suppress fluctuations in dimensions of the element body 10 due to heat and reduce variations in electrical characteristics.
  • the element body 10 is preferably a single-layer glass plate. This ensures the strength of the element body 10. Furthermore, in the case of a single-layer glass plate, the dielectric loss is small, so the Q value at high frequencies can be increased. Furthermore, since there is no sintering process as in the case of sintered bodies, deformation of the element body 10 during sintering can be suppressed, which suppresses pattern misalignment, making it possible to provide an inductor component with a small inductance tolerance.
  • the material of the single-layer glass plate is preferably a photosensitive glass plate such as Foturan II (registered trademark of Schott AG).
  • the single-layer glass plate preferably contains cerium oxide (ceria: CeO 2 ), in which case the cerium oxide acts as a sensitizer, making processing by photolithography easier.
  • the single-layer glass plate can be processed by mechanical processing such as drilling and sandblasting, dry/wet etching using a photoresist/metal mask, laser processing, etc., it may be a glass plate that does not have photosensitivity.
  • the single-layer glass plate may be made by sintering a glass paste, or may be formed by a known method such as the float method.
  • the inductor component 1F has an insulator 22.
  • the insulator 22 covers both the bottom surface 100b and the top surface 100t of the element body 10. Note that the insulator 22 may be provided only on the bottom surface 100b out of the bottom surface 100b and the top surface 1100t.
  • the insulator 22 is a member that covers the wiring (bottom wiring 11b, top wiring 11t) to protect the wiring from external forces, prevent damage to the wiring, and improve the insulation of the wiring.
  • the insulator 22 is preferably an organic insulator.
  • the insulator 22 may be a resin film such as epoxy or polyimide, which is easy to form.
  • the insulator 22 is preferably made of a material with a low dielectric constant, which can reduce the stray capacitance formed between the coil 110 and the external electrodes 121 and 122 when the insulator 22 is present between the coil 110 and the external electrodes 121 and 122.
  • the insulator 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.), or by applying a paste-like resin and thermally curing it.
  • the insulator 22 may be an inorganic film such as an oxide, nitride, or oxynitride of silicon or hafnium, which has excellent insulation properties and thin film forming properties.
  • the organic insulator is located inside the outer surface 100 of the inorganic insulator when viewed from a direction perpendicular to the bottom surface 100b.
  • the organic insulator is easily given fluidity, and when the wiring (bottom surface wiring 11b, top surface wiring 11t) is covered with the organic insulator, the organic insulator can be easily filled between adjacent wirings, improving insulation.
  • the organic insulator since the organic insulator is not in contact with the outer surface of the mechanical insulator, the load on the organic insulator can be reduced when singulating into individual inductor components, and deformation and peeling of the organic insulator can be suppressed.
  • the bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b extends in the X direction. All the bottom wirings 11b are arranged in parallel along the Y direction.
  • the top wiring 11t extends in only one direction. Specifically, the top wiring 11t extends in the X direction at a slight incline toward the Y direction. All the top wirings 11t are arranged in parallel along the Y direction.
  • the first through wiring 13 is arranged on the first end face 100e1 side with respect to the axis AX within the through hole V of the element body 10
  • the second through wiring 14 is arranged on the second end face 100e2 side with respect to the axis AX within the through hole V of the element body 10.
  • the first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t.
  • the multiple first through wirings 13 and the multiple second through wirings 14 are each arranged in parallel along the Y direction.
  • the first through wiring 13 and the second through wiring 14 are non-parallel when viewed from the axis AX direction. Specifically, the first through wiring 13 and the second through wiring 14 are inclined so that the distance between them becomes wider toward the top surface wiring 11t in the Z direction.
  • the first through wiring 13 and the second through wiring 14 each have a shape that spreads outward in the radial direction of the coil 110 as far as the top surface wiring 11t in the Z direction.
  • the coil 110 has a trapezoidal shape when viewed from the axis AX direction. According to the above configuration, the first through wiring 13 and the second through wiring 14 can be formed in a straight line and shortened, and the DC resistance of the first through wiring 13 and the second through wiring 14 can be reduced.
  • FIG. 9 is a partially enlarged view of FIG. 8.
  • the first through wiring 13 has a first connection surface 13y1 connected to the bottom wiring 11b and a second connection surface 13y2 connected to the top wiring 11t.
  • the first external electrode 121 is provided on the bottom surface 100b side, and when viewed from a direction perpendicular to the bottom surface 100b, the first external electrode 121 overlaps at least a portion of the first connection surface 13y1.
  • the inclination angle ⁇ on the axis AX side between the straight line L3 connecting the center of the first connection surface 13y1 and the center of the second connection surface 13y2 and the connection surface 11t2 connected to the first through wiring 13 of the top wiring 11t is 60° or more and less than 90°.
  • the inclination angle ⁇ is less than 90°, the area of the bottom wiring 11b that overlaps with the first external electrode 121 when viewed from a direction perpendicular to the bottom surface 100b can be reduced. This reduces the parasitic capacitance between the first external electrode 121 and the bottom wiring 11b, and increases the self-resonant frequency.
  • the inclination angle ⁇ is 60° or more, the inner diameter of the coil 110 can be secured to ensure the Q value.
  • the second through wiring 14 has a first connection surface 14y1 connected to the bottom wiring 11b and a second connection surface 14y2 connected to the top wiring 11t.
  • the second external electrode 122 is provided on the bottom surface 100b side, and when viewed from a direction perpendicular to the bottom surface 100b, the second external electrode 122 may overlap at least a portion of the first connection surface 14y1.
  • the inclination angle ⁇ on the axis AX side between the straight line L4 connecting the center of the first connection surface 14y1 and the center of the second connection surface 14y2 and the connection surface 11t3 connected to the second through wiring 14 of the top wiring 11t may be 60° or more and less than 90°.
  • the inclination angle ⁇ is less than 90°, so the area of the bottom wiring 11b that overlaps with the second external electrode 122 when viewed from a direction perpendicular to the bottom surface 100b can be reduced. This reduces the parasitic capacitance between the second external electrode 122 and the bottom wiring 11b, and increases the self-resonant frequency.
  • the inclination angle ⁇ is 60° or more, so the inner diameter of the coil 110 can be secured to ensure the Q value.
  • the center of the first connection surface 13y1 is closer to the axis AX than the center of the second connection surface 13y2 when viewed from a direction perpendicular to the bottom surface 100b.
  • the first connection surface 13y1 when viewed from a direction perpendicular to the bottom surface 100b, the first connection surface 13y1 is disposed inside the coil 110 more than the second connection surface 13y2.
  • This makes it possible to reduce the area of the bottom wiring 11b that overlaps with the first external electrode 121 when viewed from a direction perpendicular to the bottom surface 100b, thereby reducing the parasitic capacitance between the first external electrode 121 and the bottom wiring 11b and increasing the self-resonant frequency.
  • the center of the first connection surface 14y1 may be closer to the axis AX than the center of the second connection surface 14y2 when viewed from a direction perpendicular to the bottom surface 100b.
  • copper foil 2001 is provided by printing on a base substrate 2000.
  • the material of the base substrate 2000 is the same as that of the base substrate 1000 in the first embodiment.
  • a glass substrate 2010 that will become the element body 10 is provided on a base substrate 2000.
  • the base substrate 2000 and the glass substrate 2010 are attached to each other using a jig such as conductive tape, pins, or a frame.
  • the glass substrate 2010 has a first through hole V1 and a second through hole V2.
  • the first through hole V1 and the second through hole V2 are non-parallel.
  • the glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate.
  • the TGV substrate is a substrate in which through holes are formed in advance by a laser, photolithography, or the like.
  • the glass substrate 2010 may be, for example, a TSV (Through Silicon Via) substrate, or may be something else.
  • Ti/Cu or other necessary conductive materials may be deposited in advance as seeds on the surface of the glass substrate 2010 by sputtering or the like.
  • a first through conductor layer 2013 that will become the first through wiring 13 is formed in the first through hole V1.
  • a second through conductor layer that will become the second through wiring 14 is formed in the second through hole V2.
  • the first through hole V1 is electrolytically plated to form the first through conductor layer 2013, and the second through hole V2 is electrolytically plated to form the second through conductor layer 2014.
  • a seed layer may be formed on the surface of the glass substrate 2010 or the inner surface of the through holes V1 and V2 by sputtering or the like, and a through conductor layer may be formed by known methods such as filled plating, conformal plating, or a printing and filling method of a conductive paste. If there is unnecessary plating growth on the surface of the glass substrate 2010, the unnecessary portions are removed by polishing, CMP, wet etching (etch-back), or dry etching.
  • the base substrate 2000 is peeled off from the glass substrate 2010.
  • the base substrate 2000 may be removed mechanically by grinding or the like, or may be removed chemically by etching or the like.
  • a bottom conductor layer 2011b that will become the bottom wiring 11b and a top conductor layer 2011t that will become the top wiring 11t are formed on a glass substrate 2010.
  • a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer.
  • a copper layer is formed by electrolytic plating on the seed layer in the openings of the photoresist.
  • the photoresist and seed layer are removed by wet etching or dry etching. This forms the bottom conductor layer 2011b and the top conductor layer 2011t that are patterned into an arbitrary shape.
  • the bottom conductor layer 2011b and the top conductor layer 2011t may be formed one at a time, or both may be formed simultaneously.
  • insulating layers 2022 that become insulators 22 are provided on the top and bottom surfaces of glass substrate 2010 so as to cover the conductor layers.
  • bottom-side insulating layer 2022 and top-side insulating layer 2022 may be formed one at a time, or both may be formed simultaneously.
  • holes 2022a are provided on bottom conductor layer 2011b of bottom-side insulating layer 2022 using photolithography or laser processing.
  • a first external electrode conductor layer 2121 that will become the first external electrode 121 is provided on the bottom insulating layer 2022.
  • the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b.
  • a Pd catalyst (not shown) is provided on the bottom insulating layer 2022, and a Ni, Au plating layer is formed by electroless plating.
  • a patterned photoresist is formed on the plating layer. The plating layer in the openings of the photoresist is removed by wet etching or dry etching. This forms the first external electrode conductor layer 2121 patterned into an arbitrary shape.
  • a seed layer (not shown) is provided on the bottom insulating layer 2022, and a patterned photoresist is formed on the seed layer.
  • the seed layer in the openings of the photoresist is removed by wet etching or dry etching.
  • a Ni, Au plating layer may be formed on the remaining seed layer by electroless plating.
  • a second external electrode conductor layer 2122 which will become the second external electrode 122, is provided on the insulating layer 2022 on the bottom side.
  • the chip is cut into individual pieces along cut lines C. This produces inductor component 1F as shown in FIG. 8.
  • Modification (First Modification) 11A is a diagram corresponding to a part of the VIII-VIII cross section of FIG. 7 showing a first modified example of the inductor component.
  • the cross-sectional area of each of the two end portions 13e in the extension direction of the first through wiring 13 is larger than the cross-sectional area of the central portion 13m in the extension direction of the first through wiring 13.
  • the cross-sectional area of the first through wiring 13 is the area of a cross section in a direction perpendicular to the bottom surface 100b of the first through wiring 13.
  • the width of the first through wiring 13 in the direction perpendicular to the bottom surface 100b is continuously increased from the central portion 13m toward the two end portions 13e.
  • the cross-sectional area of one end 13e of the first through-hole wiring 13 may be larger than the cross-sectional area of the central portion 13m of the first through-hole wiring 13.
  • the cross-sectional area of at least one end of the second through-hole wiring 14 may be larger than the cross-sectional area of the central portion 13m of the first through-hole wiring 13.
  • FIG. 11B is a diagram corresponding to a part of the cross section taken along the line VIII-VIII in FIG. 7, showing a second modified inductor component.
  • the first through wiring 13 has a conductive layer 13s located on the outer periphery side as viewed from the extending direction of the first through wiring 13, and a non-conductive layer 13u located inside the conductive layer 13s.
  • current mainly flows through the surface of the first through wiring 13 due to the skin effect, so that the Q value is not lowered by providing the conductive layer 13s on the outer periphery side.
  • the non-conductive layer 13u on the inner side stress can be alleviated, and the manufacturing cost can be reduced by not using a conductor.
  • a seed layer is provided on the inner surface of the through hole V of the element body 10 by sputtering or electroless plating. Then, a plating layer is formed on the seed layer by electrolytic plating. In this way, multiple conductive layers 13s such as Ti/Cu/electrolytic Cu or Pd/electroless Cu/electrolytic Cu can be formed on the outer periphery of the first through wiring 13. After that, the inside of the conductive layer 13s is sealed with resin by printing or heat pressing to form a non-conductive layer 13u made of resin. In this way, stress can be relieved by the non-conductive layer 13u inside the first through wiring 13 while current flows through the surface (conductive layer 13s) of the first through wiring 13.
  • the second through wiring 14 may have a conductive layer located on the outer periphery when viewed from the direction in which the second through wiring 14 extends, and a non-conductive layer located inside the conductive layer. Note that the cross-sectional area of each of the two ends in the extension direction of the first through wiring 13 is larger than the cross-sectional area of the center part in the extension direction of the first through wiring 13, but the cross-sectional area of each of the two ends in the extension direction of the first through wiring 13 may be the same as the cross-sectional area of the center part in the extension direction of the first through wiring 13.
  • the present disclosure includes the following aspects. ⁇ 1> an element body including a first main surface and a second main surface opposed to each other; a coil provided on the element body and wound helically along an axis; a first external electrode and a second external electrode provided on the element body and electrically connected to the coil;
  • the axis of the coil is disposed parallel to the first major surface;
  • the coil is a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wires extending from the first coil wiring toward the second coil wiring and arranged along the axis; a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on an opposite side of the axis from the first through wiring, and
  • ⁇ 2> The inductor component according to ⁇ 1>, wherein the first through wiring and the second through wiring are line-symmetric with respect to the axis when viewed in a direction perpendicular to the first main surface.
  • ⁇ 3> The inductor component according to ⁇ 1> or ⁇ 2>, wherein the first through wiring and the second through wiring are, when viewed from the axial direction, symmetrical with respect to a line that is perpendicular to the first main surface and includes the axis.
  • ⁇ 4> The inductor component according to any one of ⁇ 1> to ⁇ 3>, wherein a line edge roughness of the first through wiring is greater than a line edge roughness of the first coil wiring.
  • ⁇ 5> The inductor component according to any one of ⁇ 1> to ⁇ 3>, wherein a line edge roughness of the first through wiring is equal to or smaller than a line edge roughness of the first coil wiring.
  • ⁇ 6> The inductor component according to ⁇ 1>, wherein a width of the first through wiring and a width of the second through wiring are different.
  • the first through wiring has an outer circumferential portion located radially outward of the coil with respect to the first coil wiring and the second coil wiring when viewed in the axial direction,
  • the second coil is a plurality of third coil wirings provided on the first main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the first main surface; a plurality of fourth coil wirings provided on the second main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the second main surface; a plurality of third through wirings extending from the third coil wiring toward the fourth coil wiring and arranged along the second axis; a plurality of fourth through wirings extending from the third coil wiring toward the fourth coil wiring, provided on an opposite side of the second axis from the third through wiring, and arranged along the second axis; the third coil wiring, the third through wiring, the fourth coil wiring, and the fourth through wiring are connected in
  • ⁇ 9> An inductor component as described in ⁇ 8>, wherein, when viewed in the axial direction of the coil, the first through wiring and the second through wiring, and the third through wiring and the fourth through wiring are linearly symmetrical with respect to a center line between the coil and the second coil.
  • ⁇ 11> The inductor component according to ⁇ 9>, wherein the first through wiring and the second through wiring are asymmetrical with respect to a line that is perpendicular to the first main surface and includes the axis, when viewed from the axial direction.
  • the first through wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring; the first external electrode is provided on the first main surface side and overlaps at least a portion of the first connection surface when viewed in a direction perpendicular to the first main surface;
  • ⁇ 14> The inductor component according to ⁇ 13>, wherein a portion of the first connection surface and a portion of the second connection surface overlap when viewed in a direction perpendicular to the first main surface.
  • ⁇ 15> The inductor component according to ⁇ 13> or ⁇ 14>, wherein, when viewed in a direction perpendicular to the first main surface, a center of the first connection surface is closer to the axis than a center of the second connection surface.
  • ⁇ 16> An inductor component described in any one of ⁇ 1> to ⁇ 15>, wherein the first through wiring has a conductive layer located on the outer periphery when viewed from the direction in which the first through wiring extends, and a non-conductive layer located inside the conductive layer.
  • ⁇ 17> An inductor component according to any one of ⁇ 1> to ⁇ 16>, wherein a cross-sectional area of at least one of both ends in the extension direction of the first through wiring is larger than a cross-sectional area of a central portion in the extension direction of the first through wiring.
  • ⁇ 18> The inductor component according to any one of ⁇ 1> to ⁇ 17>, wherein the inductor component has a thickness of 200 ⁇ m or less.
  • ⁇ 19> An inductor component described in any one of ⁇ 1> to ⁇ 18>, wherein, when viewed in a direction perpendicular to the first main surface, the first external electrode and the second external electrode are located inside the outer peripheral surface of the element body.
  • an organic insulator is provided on the first main surface, An inductor component described in any one of ⁇ 1> to ⁇ 19>, wherein the base body is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed in a direction perpendicular to the first main surface.

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218525A (ja) * 2002-01-18 2003-07-31 Fujitsu Ltd 回路基板及びその製造方法
JP2007027649A (ja) * 2005-07-21 2007-02-01 Murata Mfg Co Ltd 積層コイル部品及びその製造方法
JP2008066592A (ja) * 2006-09-08 2008-03-21 Fuji Electric Holdings Co Ltd 薄型磁気部品の製造方法
JP2016515305A (ja) * 2013-03-11 2016-05-26 ボーンズ、インコーポレイテッド ラミネートポリマーを使用するプレーナ磁気技術に関する装置および方法
WO2017212990A1 (ja) * 2016-06-07 2017-12-14 株式会社村田製作所 電子部品、振動板、電子機器および電子部品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218525A (ja) * 2002-01-18 2003-07-31 Fujitsu Ltd 回路基板及びその製造方法
JP2007027649A (ja) * 2005-07-21 2007-02-01 Murata Mfg Co Ltd 積層コイル部品及びその製造方法
JP2008066592A (ja) * 2006-09-08 2008-03-21 Fuji Electric Holdings Co Ltd 薄型磁気部品の製造方法
JP2016515305A (ja) * 2013-03-11 2016-05-26 ボーンズ、インコーポレイテッド ラミネートポリマーを使用するプレーナ磁気技術に関する装置および方法
WO2017212990A1 (ja) * 2016-06-07 2017-12-14 株式会社村田製作所 電子部品、振動板、電子機器および電子部品の製造方法

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