WO2024085327A1 - Ultrasonic inspection system - Google Patents

Abstract

The present invention relates to an ultrasonic inspection system for inspecting a wafer flaw, and provides an ultrasonic inspection system comprising: a transfer robot module (110) having an arm unit, which unloads a wafer from a loading module (101) on which wafers are loaded, so as to transfer the wafer to a correct inspection position for an ultrasonic inspection; and an inspection module (130), which has at least one probe unit (131) and performs ultrasonic scanning on the wafer at the correct inspection position, wherein the inspection module (130) includes at least one jig unit (140) that fixes the probe unit (131) to the upper side of the correct inspection position for ultrasonic scanning of the wafer, the jig unit (140) is formed in a multi-channel scheme having first to Nth channels, and first to Nth probe units, each emitting preset frequencies, can be mounted on the first to Nth channels, respectively.

Description

Ultrasound inspection system

The present invention relates to an ultrasonic inspection system that inspects defects by imaging internal voids, peeling, etc. of semiconductors or electronic components.

A technology that acquires internal images of an object to be examined using signals with a frequency in the ultrasonic wave region can identify internal defects without modifying the medical field or manufacturing results targeting internal organs of the body or the fetus during pregnancy. It is used in a variety of fields such as non-destructive testing (NDT).

In the field of non-destructive testing, information on the location of defects is very important in predicting the lifespan and evaluating the health of parts or materials, and accurate and rapid defect detection technology is required. Pulse Echo Technique, one of the conventional non-destructive defect detection technologies, is a technology that detects defects according to the amplitude of energy reflected from defects present inside a non-destructive test object. However, since the amount of reflected energy depends on the surface condition of the reflecting surface, there is a disadvantage in that it is difficult to accurately measure the size of the defect.

On the other hand, the ultrasonic flaw inspection method is gradually increasing in use because it has the advantage of high inspection efficiency due to not only no risk of the inspector being exposed to radiation when handling the inspection equipment, but also excellent inspection sensitivity and fast inspection speed.

This non-destructive testing method using ultrasonic waves generally irradiates ultrasonic waves generated from an ultrasonic transducer, also known as a probe, into the inside of a non-destructive test object in the form of a beam by using electrical energy generated from an ultrasonic flaw detector. The reflected signal reflected from the non-destructive test object and returned to the probe is interpreted as an electrical signal by an ultrasonic flaw detector to determine whether the non-destructive test object is defective and the size of the defect.

However, in the case of the conventional ultrasonic inspection method, only the overall moving distance of the transmitted wave and the diffraction wave generated by it can be measured, and non-destructive measurement such as the location of the defect on the surface of the non-destructive test object and the depth of the defect from the surface of the non-destructive test object. There was a problem in that it was not possible to accurately measure the three-dimensional location of defects inside the test object.

As a prior art, Korean Patent Publication No. 10-2006-0095338, ‘Non-destructive inspection equipment using ultrasonic waves,’ is disclosed. This uses a linear motor to enable movement of the probe in three directions (X, Y, and Z axes) to precisely adjust the angle and distance between the probe (meaning the 'probe' of the present invention) and the inspection object. Start configuration. However, in the prior art, it is difficult to precisely control the position of the probe in three directions, and there is also a limit to inspection efficiency due to the application of a single probe.

(Patent Document 1) Korean Patent Publication No. 10-2006-0095338

The technical problem to be solved by the present invention is to propose a system using a multi-probe unit that can improve the accuracy, reliability, and speed of ultrasonic inspection, which is the biggest problem with the structure using a conventional single probe unit.

In addition, the present invention seeks to propose a system that can perform more accurate position control of the probe unit by breaking away from the conventional three-way control method of the probe unit.

The present invention to solve the above problems is an ultrasonic inspection system that inspects wafer defects, unloading the wafer from the loading module 101 where the wafers are loaded, and moving the wafer to an inspection position for ultrasonic inspection. A transfer robot module 110 equipped with an arm unit for transferring; and an inspection module 130 that includes at least one probe unit 131 and performs ultrasonic scanning on the wafer in the inspection position. Includes, the inspection module 130 includes at least one jig unit 140 that fixes the probe unit 131 to the upper side of the inspection well for ultrasonic scanning of the wafer, wherein the jig unit (140) is formed in a multi-channel manner having first to N-th channels, and is formed so that first to N-th probe units formed to irradiate preset frequencies, respectively, can be mounted on the first to N-th channels, An ultrasonic inspection system is provided.

In addition, the jig unit 140 extends in one direction and is formed so that the first to N-th probe units can be coupled or disengaged, so that the first to N-th probe units can be replaced, with N channels. It includes a mounting portion 141, and the N channel mounting portions 141 may be arranged to be spaced apart along one direction.

In addition, the ultrasonic inspection system includes a scan control module 150 that controls the probe unit 131 and the jig unit 140; It further includes, and the scan control module 150 may be configured to perform ultrasonic scanning on the wafer by checking the number information of the channel mounting portion 141 and the mounting information of the probe unit 131. .

In addition, the jig unit 140 is connected to the driving means 160 and is configured to perform ultrasonic scanning of the wafer while moving in the ±X direction or ±Y direction, and the scan control module 150 is configured to: The movement path of the jig unit 140 can be set through the number information of the channel mounting portions 141 and the mounting information of the probe unit 131.

In addition, the scan control module 150 determines that at least some of the N channel mounting portions 141 are in a mixed state, with inactive channel mounting portions to which no probe units are mounted and active channel mounting portions to which the probe unit 131 is coupled. In this case, ultrasonic scanning of the entire surface of the wafer can be performed by setting the movement path of the jig unit 140 based on the position of the active channel mounting portion.

Additionally, the first to Nth probe units may be configured as a multi-frequency combination in which at least some of the probe units have different set frequencies.

In addition, the first to Nth probe units are formed to have a first or second set frequency, and the probe unit with the first set frequency and the probe unit with the second set frequency alternate along the one direction. It can be placed like this.

Meanwhile, the present invention is an ultrasonic inspection system that inspects wafer defects, and includes an arm that unloads the wafer from the loading module 101 on which the wafers are loaded and transports the wafer to an inspection position for ultrasonic inspection. ) Transfer robot module (110) equipped with a unit; and an inspection module 130 that includes at least one probe unit 131 and performs ultrasonic scanning on the wafer in the inspection position. Includes, the inspection module 130 includes a jig unit 140 that fixes the at least one probe unit 131 to the upper side of the inspection well for ultrasonic scanning of the wafer, wherein the jig unit (140) provides an ultrasonic inspection system that is combined with another jig unit (140) in the ±X direction or ±Y direction to form an extendable jig bar assembly (170).

In addition, the jig unit 140 is equipped with a distilled water spray unit 143 that is coupled to the probe unit 131 and sprays distilled water in a waterfall manner onto the wafer positioned below, The distilled water injection unit 143 is connected to the distilled water supply unit 180 and has a built-in distilled water passage 144 for receiving distilled water, and the first to L jig units 140 are combined to form the jig bar assembly 170. When formed, the distilled water passages 144 provided in each of the first to L jig units 140 may be configured to communicate with each other.

In addition, the jig bar assembly 170 is connected to the driving means 160 and is formed to perform ultrasonic scanning of the wafer while moving in the ±X direction or ±Y direction. When the jig bar assembly 170 moves, it may include a damper unit 171 to cushion vibration.

In addition, the jig bar assembly 170 is controlled by a scan control module 150 that is connected to the driving means 160 and sets the movement path of the jig bar assembly 170, and the scan control module 150 ) can set a streamlined path that curves the moving path in the section where the jig bar assembly 170 moves by changing direction in the ±X direction or ±Y direction.

In addition, the jig bar assembly 170 is connected to the driving means 160 and is formed to be movable in the ±X direction or ±Y direction, and connects the driving means 160 and the jig bar assembly 170. Power transmission unit (172); It further includes, wherein the power transmission unit 172 includes a coupling shaft coupled to the center of gravity side of the jig bar assembly 170, and by coupling with another jig unit 140, the jig bar assembly 170 When the shape of is changed, the coupling axis may be formed to move toward the newly set center of gravity.

By adopting the multi-probe unit method, the present invention can improve the accuracy, reliability, and speed of ultrasonic inspection, which are the biggest problems with the structure using a conventional single probe unit.

In addition, the present invention can perform more accurate position control of the probe unit by breaking away from the conventional three-way control method of the probe unit.

1 is an overall configuration diagram of an ultrasonic inspection system according to an embodiment of the present invention.

Figure 2 is a conceptual diagram dividing the overall configuration of an ultrasonic inspection system according to an embodiment of the present invention by function.

Figure 3 is an overall conceptual diagram of an ultrasonic inspection system according to an embodiment of the present invention.

Figure 4 is a perspective view of an ultrasonic inspection system according to an embodiment of the present invention.

Figure 5 is a perspective view schematically showing the configuration corresponding to the ultrasonic inspection section of Figure 1.

FIG. 6 is a conceptual diagram schematically showing the operation in FIG. 5.

Figure 7 is a conceptual diagram of an ultrasonic inspection system according to the first embodiment of the present invention.

Figure 8 is a schematic diagram of an ultrasonic inspection system according to the first embodiment of the present invention.

Figure 9 is a schematic diagram showing a modified example of the ultrasonic inspection system according to the first embodiment of the present invention.

FIG. 10 is a schematic diagram showing the jig unit of FIG. 9 before and after assembly.

Figure 11 is a schematic diagram schematically showing a state in which the jig units of Figure 10 are combined to form a jig bar assembly.

Figure 12 is a schematic diagram schematically showing the movement path of the probe unit of the ultrasonic inspection system according to the first embodiment of the present invention.

Figure 13 is a schematic diagram schematically showing the streamlining of the movement path of the probe unit of the ultrasonic inspection system according to the first embodiment of the present invention.

Figure 14 is a schematic diagram of an ultrasonic inspection system according to a second embodiment of the present invention.

Figure 15 is a conceptual diagram of a moving assembly in the ultrasonic inspection system according to the third embodiment of the present invention.

Figure 16 is a schematic diagram of the operation of the moving assembly in the ultrasonic inspection system according to the third embodiment of the present invention.

Figure 17 is a schematic diagram showing a modification of Figure 16.

18 to 20 are schematic diagrams for explaining a multi-probe unit of an ultrasonic inspection system according to an embodiment of the present invention.

Figure 21 is a flowchart of an ultrasonic inspection method using an ultrasonic inspection system according to a third embodiment of the present invention.

FIG. 22 is a flowchart showing the specific operation of the moving assembly in FIG. 21.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The description below is only intended to specify embodiments and is not intended to limit or limit the scope of rights according to the present invention. What a person skilled in the art related to the present invention can easily infer from the detailed description and examples of the invention should be construed as falling within the scope of rights according to the present invention.

The terms used in the present invention are described as general terms widely used in the technical field related to the present invention, but the meaning of the terms used in the present invention is the intention of the technician working in the field, the emergence of new technology, examination standards, or precedents. It may vary depending on etc. Some terms may be arbitrarily selected by the applicant, in which case the meaning of the arbitrarily selected terms will be explained in detail. Terms used in the present invention should be construed not only in their dictionary meaning, but in a meaning that reflects the overall context of the specification.

Terms such as 'consists' or 'comprises' used in the present invention should not be interpreted as necessarily including all of the components or steps described in the specification, and if some components or steps are not included, And if additional components or steps are further included, they should also be interpreted as intended from the corresponding terms.

The terms described below are terms defined in consideration of functions in the present invention, and may vary depending on the intentions or practices of users, operators, and designers. Therefore, the definition should be made based on the contents throughout this specification.

The 'subject' used herein includes the wafer that is the subject of inspection, and includes all objects that can be inspected using ultrasonic irradiation. In this application, a wafer having a circular plane is used as an example, but the shape and type of the object under test are not limited thereto, and any object to which the present invention can be applied is applicable.

Hereinafter, an ultrasonic inspection system according to the present invention will be described with reference to the drawings. It is specified in advance that all known means that achieve the same effect and function can be applied to parts/configurations whose descriptions are omitted.

With reference to Figures 1 and 2, the overall configuration and operating principle of the ultrasonic inspection system according to the present invention will be described.

The ultrasonic inspection system can be largely divided into a loading/unloading section and an ultrasonic inspection section, and there is an additional control/image processing section that is operated by a program (or PC).

The 'loading/unloading section' consists of the LPM, loading module (FOUP), and transfer robot module. The transfer robot module places the wafer in the loading module (FOUP) at the start of ultrasonic inspection or at the completion of ultrasonic inspection. It can be placed. In other words, the wafer is shipped (hereinafter referred to as 'unloading') by a transfer robot module formed by a dual arm and placed in the inspection position, and when the ultrasonic inspection is completed, the wafer in the inspection position is placed in the loading module. It can be understood as a concept of warehousing (hereinafter referred to as ‘loading’).

The 'ultrasonic inspection section' can be composed of a wafer aligner, 3-axis linear motion, probe unit, wafer stage (including water bath immersion method), and drying section. After aligning the wafer to the inspection position, ultrasonic inspection is performed using the pulse echo method in the ultrasonic inspection section, and upon completion, the wafer is dried in the drying section.

The 'control/image processing section' can be composed of a linear motion driver, pulser/receiver, ADC (Analog to Digital Conversion), and PC. The linear motion driving unit is configured in a gantry method and can be controlled using a PLC method. Here, the linear motion driver may be performed through feedback control according to the ultrasonic inspection results. This will be described later herein as the X-axis, Y-axis, and Z axis, and all known configurations that perform the same function can be applied.

The pulser unit transmits a square pulse signal to the probe unit, and when the signal reflected by the impedance difference from the defective part of the wafer enters the receiver, the continuous analog signal is converted into a digital signal through the ADC (Analogue to Digital Converter) and transmitted to the PC. Images can be acquired, and ultrasound examinations can be performed through image analysis.

3 and 4, the overall structure of the present invention will be described in detail.

The ultrasonic inspection system according to the present invention may be composed of a transfer robot module 110, an inspection module 130, a scan control module 150, and a scan operation module 290.

The transfer robot module 110 is equipped with an arm unit that unloads the wafers from the loading module 101 on which the wafers are loaded and transfers the wafers to an inspection position for ultrasonic inspection. For quick inspection, the dual arm method can be applied, where the first arm unit (Gripper1 in FIG. 2) moves the wafer, and after the ultrasonic inspection is completed, the second arm unit (Gripper2 in FIG. 2) moves the wafer in the same way. It works. Preferably, the first and second arm units are operated alternately, and while one arm unit is operating, the other arm unit is maintained in a standby state for wafer transfer.

The transfer robot module 110 can stably move the wafer in the loading module 101 to the alignment unit through the arm unit to achieve wafer alignment.

After the alignment is completed, the wafer is transferred again to the inspection module 130 by the transfer robot module 110, and when the ultrasonic inspection is completed, the arm unit moves it to the drying unit and dries it, and when drying is completed, the wafer is transferred to the inspection module 130 by the transfer robot module 110. It is transferred to the loading module (101) by the transfer robot module (110). At this time, after drying, the drying state of the wafer can be checked through a separate sensor unit (not shown).

The inspection module 130 is provided with a probe unit 131, and since the ultrasonic inspection system according to the present invention uses a multi-channel method, a plurality of probe units 131 may be provided. The inspection module 130 performs ultrasonic inspection on the wafer in the current inspection position.

Specifically, the inspection module 130 may be provided with a jig unit 140, a moving assembly 360, and a driving means 160.

The jig unit 140 performs the function of fixing the probe unit 131 above the inspection position for ultrasonic inspection of the wafer. As shown in FIG. 4, it can be arranged to maintain a predetermined height on the probe unit 131 in the inspection position.

The jig unit 140 is a multi-channel type having first to N-th channels, and each channel has first to N-th channel mounting units (141-1 to 141-1) so that probe units (131-1 to 131-N) are mounted. 141-N) is formed. At this time, the probe units (131-1 to 131-N) are configured to be capable of being coupled/uncoupled from the first to N-th channel mounting portions (141-1 to 141-N), so that the state and user Depending on the selection, the optimal probe unit 131 can be installed.

Referring to FIG. 5, each signal generator 132 may be provided. 'Pulser Pre-AMP' may be applied to the signal generator 132. Two probe units (131-1, 131-2) may be provided below the signal generator 132, and an ultrasonic signal is generated from the signal generator 132 connected to a power source (not shown), and the probe unit It is irradiated onto the wafer through (131-1, 131-2) and configured to receive reflected signals.

Referring first to FIG. 7, N channel mounting units 141 may be arranged to be spaced apart along one direction. Here, the one direction refers to the X direction, but it may be formed in the Y direction depending on the arrangement of the jig unit 140.

The scan control module 150 is configured to control the operations of the probe unit 131 and the jig unit 140. At this time, the scan control module 150 is configured to transmit and receive calculation information with the scan calculation module 290 and the focusing calculation module 320, so that feedback control can be performed. The scan control module 150 is configured to control the driving means 160. It is configured to perform ultrasonic inspection on the wafer while moving the jig unit 140 in the ±X direction or ±Y direction, and can control the pulse echo operation of the probe unit 131.

Below, the ultrasonic inspection process will be briefly described based on the single probe unit being installed.

First, an A-scan is performed on the probe unit at the inspection position. A-scan determines defects in the wafer by expressing the size (amplitude) of the ultrasonic echo signal received at a point in the vertical direction of the sample in relation to time. Using a probe unit, the waveform of the echo signal on the time side can be expressed, and the vertical side of the graph represents the signal strength (amplitude) and the horizontal side represents time. In other words, it is a method of checking the change in amplitude over time at a specific reference point. At this time, ultrasonic beam focusing can be achieved by securing the maximum amplitude for the joint surface while slightly moving the Z-axis distance.

A-scan irradiates ultrasonic signals in a vertical direction to the wafer by the probe unit 131. At this time, it is configured to adjust the focusing distance with the maximum amplitude on the bonding surface of the wafer (bonding wafer). After that, gates are set before and after the ultrasonic signal reflection signal of the joint surface. Gates are used to limit the inspection area to a certain section. Here, the focusing distance can be adjusted using the Z-axis part 363 (see FIG. 4).

For example, an I gate (Interface Gate) can be set to remove noise that occurs when the wafer surface is not smooth. In addition, when receiving an echo for a defect, it serves as a scale for determining how much of the defect will be judged as a defect, and an A gate can be set to measure the defect and thickness of the inspection target.

At this time, if a value higher than the A gate is received, it is judged to be a defect, and if a value lower than the A gate is received, the defect can be set to not be recognized by discarding the value.

First, one-dimensional A-Scan data that displays the size of the reflection signal on the time axis from defects generated on the bonding surface inside the wafer is generated using information about the echo signal size (AMP) and time of flight (TOF). do.

At this time, B-Scan data that images a cross section inside the subject can be selectively generated. Each reflection signal received by the probe unit 131 while moving the location determined to be defective at a certain interval is stored in memory and then comprehensively processed to generate C-Scan data of a 3D image. It can be.

C-scan is configured to irradiate ultrasonic signals by setting the X-axis and Y-axis scan areas on the probe unit 131. The jig unit 340 may be configured to irradiate an ultrasonic signal while moving using the

When the wafer under test is a bonding wafer composed of a multi-layer surface, A-scan and C-scan are performed for each multi-layer surface (for example, when composed of N layers), so that the first to Nth layers An image can be formed.

Images of the first to Nth layers are transmitted to the image processing unit 293 of the scan operation module 290, so that scan image information can be calculated in a preset manner. This will be described later.

Referring to FIGS. 6, 10, and 11, a distilled water injection method applicable to the ultrasonic inspection system according to the present invention will be described.

The probe unit 131 applied to the present invention has a structure in which a water holder is combined. This refers to a method in which water is injected from the external distilled water supply unit 180 through two tubes and sprayed like a waterfall from the end to a nozzle in close contact with the lens in the center of the probe unit 131. Referring to FIG. 11, at this time, ultrasonic waves are generated through the lens of the probe unit 131, and the distilled water spray unit 143 and the lens end of the probe unit 131 are completely adhered to each other without an air gap. It is a structure that stably transmits ultrasonic energy in water without losing the energy of the ultrasonic signal. The water used in ultrasonic testing is 'Di water', which means distilled water.

The present invention can be applied to a water immersion method in which the wafer is completely immersed in water, but when applied in a distilled water spray method as described above, resistance to water can be reduced compared to the water immersion method, thereby improving speed, and the wafer can be completely submerged in water. Since it does not need to be submerged, the generation of bubbles that cause noise can be reduced. Additionally, because the degree of freedom of movement of the probe unit 131 increases, more precise ultrasonic inspection is possible.

Each jig unit 140 is provided with a distilled water passage 144, and the distilled water passage 144 is connected to the distilled water supply unit 180, and the supplied distilled water is sprayed downward through the distilled water injection unit 143. . At this time, a flow sensor (not shown) may be provided on the side of the distilled water injection unit 143, and the amount of distilled water injected can be controlled using the flow sensor and the flow valve. The flow valve uses an electronic valve and can be automatically turned on/off.

As will be described later, when a multi-probe unit method with different set frequencies is applied, the flow sensor and flow valve play a very important function. If the set frequency is different, the lens size of the probe unit may vary. When the lens size changes, the amount of distilled water sprayed between the lens and the interface changes, so a flow sensor and flow valve control corresponding to the set frequency are required.

Referring again to FIG. 6, a vacuum chuck and a bubble trap may be provided at the inspection position (also referred to as 'stage') where the wafer is placed. The bubble trap is connected to the water circulation system so that distilled water can be continuously and forcefully circulated. Through this, only bubbles in distilled water can be effectively removed, and contamination of distilled water can be prevented through the water purification function. An air membrane filter (not shown) may be provided.

As an exemplary structure, the bubble trap consists of a tube pipe, an air membrane filter, a water purification filter, and a pump. It is located at the bottom of the wafer stage. When water containing bubbles enters the tube, it passes through the membrane filter, and only the bubbles can be effectively removed through the pump. At this time, since a water purification filter is also included, water contamination can be prevented.

During the ultrasonic inspection process, bubbles are generated and the water containing the bubbles moves through the lower pipe of the water tank surrounding the stage. Clean distilled water from which bubbles have been removed through a bubble trap is injected into the jig unit, and at this time, ultrasonic waves and distilled water are supplied together to ultrasonic inspect the wafer.

For reference, distilled water is used at a rate of 1 to 3 ml or 4 to 10 ml per minute, and can be used separately depending on the size of the probe unit and the test object.

Below, with reference to FIGS. 7 to 13, a first embodiment of the ultrasonic inspection system according to the present invention will be described. Since the main components of the present invention have been described above, redundant description will be omitted.

In the first embodiment, the probe unit 131 is formed in a detachable structure from the jig unit 140. To this end, the jig unit 140 may be formed in a multi-channel manner including first to Nth channels. At this time, first to Nth probe units formed to irradiate preset frequencies can be mounted on the first to Nth channels, respectively. Here, each channel can be understood as a module that includes all the functions necessary to generate ultrasonic signals and receive reflected signals.

As shown in FIG. 7, the jig unit 140 extends in one direction and may be provided with N channel mounting portions 141-1 and 141-2 along one direction. They are spaced apart at preset intervals. The distance needs to be set to a distance that does not interfere with each other's ultrasonic signals and reflected signals. Of course, when the present invention is the distilled water injection type described above, it is preferable that the sprayed distilled water is also configured so as not to interfere.

The scan control module 150, which controls the operation of the probe unit 131 and the jig unit 140, is configured to check the number information of the channel mounting portion 141 and the mounting information of the probe unit 131. This is because the movement path of the jig unit 140 may be set differently depending on the mounting information of the probe unit 131. When the probe units 131 are tightly mounted in the X direction, the moving distance of the jig unit 140 in the X direction may be relatively short. Of course, in this case as well, the moving distance may be set to be the same and the same position of the wafer may be inspected multiple times. For this purpose, the corresponding coordinates of the wafer, which is an object of inspection, can be automatically set according to the mounting information of the probe unit 131. If a defect is found at a specific location, the coordinate information is automatically transmitted to the scan operation module 290 and stored in a memory unit (not shown), enabling tracking and management.

In Figure 7, a dual probe unit 131 is disclosed. The description will be made on the assumption that each probe unit 131 is mounted. The dual probe unit 131 consists of a single probe unit 131 on both sides of the wafer at 180 degrees, and each can be controlled independently. As an example of the operation, in the ultrasonic inspection preparation stage, one probe unit 131 is selected and performed for ultrasonic focusing, and then the probe unit 131 is divided into two halves by 180 degrees and a C-scan is performed simultaneously. Through this, scanning can be performed at a faster speed than ultrasonic inspection of a 200 mm or 300 mm wafer in the conventional single probe unit 131 method, thereby increasing the inspection speed. Taking a 300mm wafer as an example, the reflection signals obtained by being divided by 180 degrees are finally combined to obtain the entire image of the 300mm wafer. This series of processes can be performed in the image processing unit 293 of the scan operation module 290, and this image information is used to determine wafer defect information in a preset manner through the wafer defect determination unit 2931. This includes all information such as type of defect, location of defect, size of defect, etc.

The jig unit 140 is connected to the driving means 160 and is configured to perform ultrasonic inspection on the wafer while moving in the ±X direction or ±Y direction. At this time, the scan control module 150 sets the movement path of the jig unit 140 through the number information of the channel mounting portion 141 and the mounting information of the probe unit 131.

Referring to FIG. 8, the scan control module 150 is in a state in which at least some of the N channel mounting portions 141 are mixed with an inactive channel mounting portion in which no probe unit is mounted and an active channel mounting portion in which the probe unit 131 is coupled. If it is determined, the movement path of the jig unit 140 is set based on the position of the active channel mounting portion. That is, the channel mounting portion 141 can be divided into an inactive channel mounting portion and an active channel mounting portion, and a movement path is created based on the active channel mounting portions (141-1, 141-2, 141-4, and 141-6).

The first to Nth probe units may be composed of a multi-frequency combination in which at least some of the probe units have different set frequencies. That is, it is a structure in which the probe unit 131 with a different set frequency can be freely attached and detached.

The jig unit 140 is connected to the driving means 160 using the power transmission unit 172 as a medium. The power transmission unit 172 may be composed of a coupling shaft extending in the Z-axis direction and a coupling shaft connection portion formed so that the connecting shaft can move in the X-axis and Y-axis directions. Depending on the mounting position of the probe units (131-1, 131-2, 131-4, 131-6) on the N channel mounting portions 141, the center of gravity of the jig unit 140 may vary, and the probe unit ( According to 131), it is preferable that the coupling axis is formed to be movable in order to maintain the balance of the jig unit 140.

As an additional configuration, when a plurality of probe units (131-1, 131-2, 131-4, 131-6) are mounted on the N channel mounting portions 141, the weight of the jig unit 140 may be increased. . Inertia increases due to increased weight, and as vibration occurs when changing direction by the driving means 160, a problem of creating an air gap may occur. A damper unit 171 may be provided to buffer such vibration. In the process of moving the jig unit 140, ultrasonic inspection is performed, so stable movement of the jig unit 140 is very important, and precise ultrasonic inspection can be performed by cushioning the impact through the damper unit 171. there is.

Figure 12 shows the process of performing ultrasonic inspection in the X direction. Depending on the user or administrator, the jig unit 140 may perform ultrasonic inspection while repeatedly moving in the ±X direction. The X-axis scan width (cover area) can be adjusted according to the set frequency, and the scan range can be set in C-scan mode.

In Figure 13, the movement path is shown to be curved in order to minimize vibration applied when changing the direction of the jig unit 140. This setting minimizes vibration when switching vertically in the X or Y direction. The curvature of the streamline path can be set considering the size of the wafer, the set frequency, etc. That is, in a straight direction, vibration is cushioned using the above-described damper unit 171, and in a direction change, a streamlined path is formed to minimize applied vibration. An example of a wired route setting method is as follows. a) Set the primary movement path that straightens the overall path, b) Classify the direction change section among the straightened primary movement paths, c) Wafer area, set frequency of the probe unit, cover area of the probe unit (of each probe unit) Considering the scan area (meaning the scan area), it can be performed in the following order: squaring the direction change section, d) setting the streamlined curve along the diagonal in the squared direction change section, and e) setting the curvature of the streamlined curve. .

Figure 9 shows a jig bar assembly 170 in which a plurality of jig units 140a and 140b are combined. The jig bar assembly 170 may be understood as an extended structure in which a plurality of jig units 140a and 140b are combined in the ±X direction or ±Y direction. Figure 9 illustrates a structure in which two jig units (140a, 140b) are combined in the X direction as an example, but the present invention is not limited to this, and jig units can be combined in both the A structure in which the above jig units are mixed and combined in the X and Y directions is also possible. In this case, the jig bar assembly 170 may be formed as a whole into a 'T-shaped structure'.

Referring to FIG. 9, the jig bar assembly 170 has a structure in which a first jig unit 140a and a second jig unit 140b are combined and extended in the X direction. For their coupling, a first coupling portion 173a is formed at one end of the first jig unit 140a, and a first coupling portion 173a is formed in the direction facing the first coupling portion 173a among the second jig units 140b. Two coupling portions 173b may be formed. For the joint expandability of the jig bar assembly 170, it is preferable that coupling portions are formed at both ends of the individual jig units 140a and 140b, respectively. Figure 10 shows a concept in which when the jig bar assembly 170 is formed, the distilled water flow path 144 is also connected. When the first and second coupling portions 173a and 173b are physically coupled, a fitting structure in which the distilled water flow path 144 through which distilled water flows is connected to each other can be built. Any known structure can be applied to this flow path connecting means.

When a plurality of probe units (131-1, 131-2, 131-4, 131-6) are mounted on the N channel mounting portions 141, multi-frequency combination will be described with reference to FIGS. 18 to 20 first. .

18 (a) to (d) show the form of the jig unit 140 having 2, 3, 4, and 6 channel mounting portions.

Figure 19 shows a jig unit 140 formed to have a first or second set frequency. It shows the structure of the jig unit 140 in which set frequencies of 100 MHz and 200 MHz are arranged alternately. As shown in FIG. 19, when two bonding surfaces exist, 100 MHz is configured to inspect the lower bonding surface, and 200 MHz is configured to inspect the upper bonding surface.

Figure 20 shows an exemplary form of a jig unit 140 having four channel mounting portions. The resolution and penetration distance are different for each set frequency. The higher the set frequency, the higher the resolution, but the ultrasonic penetration distance inside the wafer becomes shorter. In this way, the defect detection efficiency of the joint surface can be increased by securing resolution and ultrasonic penetration distance through a combination of different set frequencies. In the case of a wafer with a multi-layered bonding surface (consisting of first to fourth bonding surfaces), more precise analysis is performed, making it possible to achieve both inspection speed and detection efficiency at the same time. Additionally, in the case of a combination of different set frequencies, independent control may be possible for each channel.

Compared to a single probe unit or a single set frequency, when ultrasonic testing a wafer with a multi-layer bonding surface, the conventional structure requires performing the same ultrasonic test multiple times while changing the set frequency, whereas the ultrasonic test according to the present invention The inspection system can dramatically improve the processing speed of ultrasonic inspection.

The present invention may be configured in combinations other than those shown in FIGS. 20 and 21.

For example, in the case of two probe units, they can be configured as 50/100MHz, 50/200MHz, and 100/300MHz, respectively, and in the case of four probe units, they can be configured as 50/100/50/100MHz and 50/200/50/200MHz. , 100/300/100/300MHz, etc. may be a combination. Additionally, six probe units can be configured at 50/100/50/100/50/100MHz, 50/200/50/200/50/200MHz, 100/300/100/300/100/300MHz, etc.

Referring to Figures 19 and 20, when detecting defects such as voids, cracks, peeling, etc. on two bonding surfaces, the detection efficiency for atypical bonding shapes for the bonding surfaces can be improved through having different set frequencies. . The higher the set frequency, the better the resolution, but the beam size of the ultrasonic signal is small and the ultrasonic penetration distance is short, making it difficult to secure images of various voids and crack shapes with irregular shapes. To solve these difficulties, the detection efficiency for defects of various irregular shapes can be improved by using both high and low set frequencies at the same time.

As an example operation, in dual probe units having different set frequencies, ultrasonic inspection may be performed with a frequency with a high set frequency focused on the joint surface. A high set frequency improves the resolution of the joint surface, and a low frequency has a relatively large ultrasonic beam size, enabling images of various irregular shapes around the joint surface.

Referring to FIG. 11, the present invention will describe a case in which a jig bar assembly 170 in which a plurality of jig units 140 are combined is formed. In FIG. 11, the description will be based on a structure in which a single channel mounting portion is formed in an individual jig unit 140. However, as shown in FIG. 9, it can also be applied to a structure in which a plurality of channel mounting portions are formed in the single jig unit 140.

Each of the individual jig units 140 is provided with a distilled water passage 144, and when the jig units 140 are connected in the X or Y direction, the respective distilled water passages 144 may also be configured to communicate with each other. As a structural example, each of the individual jig units 140 is provided with a flow sensor, and each flow sensor may have a built-in circuit means to transmit an electrical signal. When the individual jig units 140 are physically fastened and connected, they are also electrically connected so that individual flow sensors and flow valves can be controlled.

Hereinafter, a second embodiment of the ultrasonic inspection system according to the present invention will be described with reference to FIG. 14. Descriptions of configurations that overlap with the above-described first embodiment will be omitted.

Referring to FIG. 14, the jig unit 240 applied to the second embodiment is formed in a multi-channel system having first to N-th channels, and the first to N-th channels are formed to irradiate preset frequencies, respectively. The first to Nth probe units 231-1, 231-2, 231-3, and 231-4 are formed so that they can be mounted. Since the first to Nth probe units 231-1, 231-2, 231-3, and 231-4 are formed to be attachable, if replacement or repair of a specific probe unit is necessary, only the corresponding probe unit can be removed. there is.

The jig unit 240 applied to the second embodiment is structured so that the distance between the M and M+1 probe units can be changed in the ±X direction or ±Y direction (where N is a natural number and M is a natural number). is a natural number smaller than N). In Figure 14, the first to fourth probe units (231-1, 231-2, 231-3, and 231-4) are shown, and their respective distances are the first spacing (d1), the second spacing (d2), and the third It can be separated by an interval (d3). Here, the first to third intervals d1, d2, and d3 may be changed.

In addition, when their spacing is changed, the overall center of gravity of the jig unit 240 may change. As in the first embodiment described above, for stable movement of the jig unit 240, a variable power transmission unit It can be formed as (272).

Specifically, the jig unit 240 extends in one direction (the It includes N channel mounting units (241-1, 241-2, 241-3, 241-4). At this time, the N channel mounting units (241-1, 241-2, 241-3, 241-4) are arranged to be spaced apart along one direction, and by changing the distance between neighboring channel mounting units, It is a configuration that can change the distance.

A movement guide unit 245 is mounted on the lower part of the jig unit 240 to adjust the distance between probe units. As an example, the moving guide unit 245 may be formed in a rail manner. The channel mounting parts (241-1, 241-2, 241-3, 241-4) are coupled to be movable on the rail, and the channel mounting parts (241-1, 241-2, 241-3, 241-4) have It is a structure in which probe units (231-1, 231-2, 231-3, 231-4) are mounted and fixed.

In this way, the jig unit 240 applied to the present invention is configured to freely and independently control the spacing between the multi-probe units as needed, so when a defect continuously occurs in a specific sector of the wafer, the jig unit 240 In addition to setting the movement path, changing the position of the probe unit mounted on the jig unit 240 has the effect of performing more precise analysis.

Figure 14 shows the structure of the jig unit 240 extending in the Although the structure is shown, the spacing in the Y direction can also be changed.

The ultrasonic inspection system according to the present invention can provide a system optimized for a configuration in which the spacing of probe units can be changed. The calculation processing and control processing accompanying this can be performed in the scan control module 250.

The scan control module 250 refers to a controller function module that controls the probe unit 231 and the jig unit 240. Various information related to ultrasound examination can be input and configured to feedback control.

Specifically, the scan control module 250 is equipped with area information of the wafer located at the inspection position, information on the number of channel mounting units 241, spacing information between neighboring channel mounting units 241, and each channel mounting unit 241. Ultrasonic inspection can be performed by considering at least one of the set frequency information of the probe unit 231.

As an example, the movement path of the jig unit 240 can be calculated using the above information set. The jig unit 240 is configured to perform ultrasonic inspection on a wafer at an inspection position while moving in the ±X direction or ±Y direction, so the movement path of the jig unit 240 is very important. If the movement path is not properly set, there is a problem that ultrasonic inspection of a specific sector of the wafer may be omitted, or, conversely, excessively redundant inspection of all sectors may be performed, which may significantly reduce the inspection speed.

Accordingly, it is desirable to set the movement path of the jig unit 240 using the area information of the wafer, the number information of the channel mounting portions 241, and the spacing information between the channel mounting portions 241. Using the above information set, the movement range of the jig unit 240 in the X direction and Y direction can be set. Additionally, the ultrasonic inspection system according to the present invention may be equipped with probe units having different set frequencies. Since the characteristics may be different for each set frequency, it is desirable to set the movement path of the jig unit 240 by taking this into consideration.

The ultrasonic inspection system according to the present invention can receive scan information through ultrasonic inspection using the first to Nth probe units, and determine defects in the wafer in a preset manner using the scan information. As described above, after the X-axis and Y-axis scan areas for the wafer are set for each individual probe unit, ultrasonic inspection is performed.

Referring again to FIG. 3, the image processing unit 293 generates scanned images for each probe unit and combines them to generate a scanned image for the entire wafer.

The wafer defect determination unit 2931 uses the scan image received from the image processing unit 293 to determine defects in the wafer. In particular, the wafer defect determination unit 2931 can obtain various information such as the type and location of the defect as well as the presence or absence of the defect.

The ultrasonic inspection system according to the present invention includes a machine learning unit 291 that generates an artificial intelligence model. The machine learning unit 291 includes an artificial intelligence model 2911 created through machine learning. The artificial intelligence model (2911) can be implemented as a deep learning model using CNN (Convolutional Neural Networks).

The machine learning unit 291 can use the artificial intelligence model 2911 to determine in advance the possibility of a defect in any sector of the wafer. In particular, the machine learning unit 291 can determine the possibility that defects will continuously occur in a specific sector of the wafer and cause the relevant sector to undergo intensive ultrasonic inspection.

In order to intensively conduct ultrasonic inspection of the sector, the scan control module 150 receives expected defect sector information for which the possibility of defects in the wafer is determined to be higher than a preset standard, and uses the expected defect sector information to perform an ultrasonic inspection on the channel mounting unit 241. It is configured to adjust the gap between the probe units 231 coupled to.

As an example, using expected defect sector information, the probe unit 231 can be set to be close to the expected defect sector. This means concentrating the existing probe units 231 arranged at equal intervals toward a specific location or moving them toward a specific location. Since a sector in which a defect occurs has a high probability that defects will also occur in sectors adjacent to it, inspection reliability can be improved by intensively inspecting the relevant area.

As another example, the moving speed of the jig unit 240 is controlled based on the defect expected sector information, but when ultrasonic inspection is performed on the position of the expected bonding sector among the wafers, the moving speed of the jig unit 240 is controlled. It can be set to temporarily decrease or repeat movement. This is also to perform more precise ultrasound examination.

As described above, the second embodiment of the ultrasonic inspection system according to the present invention can variably form the gap between probe units. When configured with a multi-probe unit method, if a specific probe unit is determined to have a sensing defect, it is necessary to exclude it.

To this end, the present invention includes a sensing failure determination unit 292 that determines sensing failure of the first to Nth probe units in a preset manner.

As an example of determining a sensing defect, in the process of performing an ultrasonic inspection on a specific sector of a wafer, the specific sector may be configured to undergo the same ultrasonic inspection using a plurality of probe units. When the wafer is placed in the inspection position, coordinates are given to the entire area of the wafer, and ultrasonic inspection is performed using multiple probe units for a specific sector with predetermined coordinates, and conversely, the sensing accuracy of the probe unit is improved. It is to judge. By comparing scan information for a specific sector performed by a plurality of probe units, probe units that provide scan information outside the error range are excluded from performing ultrasonic inspection. At this time, not only the error range but also the number of errors may be configured to be accumulated and stored. In addition, various algorithms for determining defects in the probe unit can be applied.

As an example, when the second probe unit is determined to have a sensing defect, it is difficult to trust the test results of the second probe unit, so the ultrasonic test of the second probe unit is stopped and the first and third probe units are used. 2 Can replace probe unit. The entire wafer area, which was divided based on three probe units, must be redivided based on two probe units, and for this purpose, the scan control module 250 is configured to automatically control the positions of the first and third probe units. It can be.

Hereinafter, a third embodiment of the ultrasonic inspection system according to the present invention will be described with reference to FIGS. 15 to 17.

The third embodiment is a structure including a moving assembly 360.

The moving assembly 360 can move the jig unit 340 in the ±X direction, ±Y direction, and ±Z direction. Figure 4 shows a schematic diagram of an ultrasonic inspection system equipped with a moving assembly 360, which will be referred to together. In the third embodiment, like the first and second embodiments described above, a multi-probe unit method may be applied.

The moving assembly 360 is provided between the channel mounting part and the probe unit coupled to the channel mounting part, and includes a Z-axis fine driving part 364 that finely moves the probe unit in the ±Z direction. Referring to FIG. 15, the ) The object of the combination is distinguished in that it is a composition that moves the object. However, the Z-axis fine drive unit 364 complements the Z-axis motor unit 363, allowing the position of the probe unit to be controlled more precisely. As an example, the Z axis drive unit 363 may be configured to have an operating range of 1 to 100 mm, while the Z axis fine drive unit 364 may operate in a range of 0.1 to 1 mm or 0.01 to 1 mm.

Like the first and second embodiments described above, the third embodiment may also use a multi-probe unit method, and their set frequencies may be different from each other. Since the optimal height of the probe unit varies depending on the set frequency, it can be individually controlled using the Z-axis fine drive unit 364. It is desirable to perform ultrasonic inspection while controlling the heights of all multi-probe units using the Z-axis fine drive unit 364.

The optimal height of the probe unit is related to the focusing of the lens provided in the probe unit. For this purpose, the ultrasonic inspection system according to the present invention includes a focusing operation module 320. The focusing calculation module 320 is used to calculate optimal focusing information from the wafer. Here, optimal focusing information refers to all information or conditions for forming optimal focusing, including focusing distance. As mentioned above, this takes into account the set frequency of each probe unit.

Figure 16 shows that fine control is performed on individual probe units by the Z-axis fine drive unit 364 in the ultrasonic inspection system according to the present invention.

Figure 17 shows a system structure equipped with X-axis fine actuators (3611, 3612) and Y-axis fine actuators (3621, 3622) in addition to the Z axis. The Z-axis micro-drive unit 364 is mainly used to control the focusing of the probe unit, while the It can be operated during the process. Additionally, it may be used to individually align the positions of the probe units according to the size of the wafer or die, and when applied to the structure of the second embodiment, may be used to finely adjust the spacing between probe units.

Hereinafter, with reference to FIGS. 21 and 22, a method using the ultrasonic inspection system according to the present invention will be described.

Referring to FIG. 21, the method according to the present invention includes steps S310 to S350.

Step S310 is a step in which the wafer, which is an object of inspection, is moved to the inspection position by the transfer robot module 110.

Step (S320) is a step in which an A-scan is performed on the vertical cross-section of the wafer using the first to N-th probe units, where each of the first to N-th probe units is applied to the bonding surface or the entire cross-section of the wafer. This is the stage where the focusing distance is set to have maximum amplitude. In other words, when A-scan is performed, the focusing distance optimization process for the surface to be analyzed is performed.

In step S330, in the scan operation module 390, using the first scan information obtained through A-scan, a gate for the ultrasonic reflection signal is set, and the X-axis and Y-axis scan areas for the wafer are set. This is the stage where it becomes possible. This is the step to prepare for C-scan mode by setting the setting frequency and probe unit with the highest amplitude for the reflection signal from the joint surface or inner surface and setting the gate for the reflection signal.

Step (S340) is a step in which a C-scan is performed on the scan area of step (S330), and the ) This is a step in which second scan information for each of the first to Nth probe units is obtained by performing ultrasonic inspection while the first to Nth probe units are moved. That is, ultrasonic inspection is performed on the entire wafer area, and second scan information can be acquired by each individual probe unit. Each probe unit may have a different target scan area, and if there are overlapping areas, one of them may be ignored according to a preset method.

Step S350 is a step in which scan image information for the wafer is calculated based on the second scan information in the image processing unit 293 of the scan operation module 390, and the scan image information for each of the first to Nth probe units is calculated. 2 This is the step of combining scan information into one scan image using a preset method. This is a method that goes through the process of creating and collecting images for each set frequency, and finally displays them as a single scanned image.

Below, we will explain how to control the moving assembly during the ultrasonic inspection process.

The method of controlling the moving assembly includes steps S321 to S323.

Step S321 is a step in which the Z-axis positions of the first to Nth probe units are primarily set using the Z-axis eastern part 363 that moves the jig unit 340 in the ±Z direction.

In step S322, in the process of performing an A-scan on the vertical cross section of the wafer using the first to Nth probe units 331, the focusing operation module 320 provides optimal focusing information for the wafer. This is the stage where is created. As the process of optimizing the ultrasonic amplitude for the focusing distance progresses, optimal focusing information can be generated.

Step S323 is a step in which the first to Nth probe units are finely moved in the ±Z direction by the Z-axis fine drive unit 364 based on optimal focusing information and set to a focusing distance.

Once the focusing distance is finally set in this way, a C-scan can be performed using the

Additionally, in step S323, if there is a probe unit group including at least two probe units with the same set frequency among the first to Nth probe units, A-scan does not need to be performed on all probe units.

An A-scan is performed for only one probe unit of the probe unit group to generate optimal focusing information, and based on the optimal focusing information, the focusing distance can be set for the entire probe unit group at once.

Meanwhile, the present invention can be configured to transmit and receive information by being connected to the machine learning unit 291 of the scan operation module 290. The optimal focusing information is transmitted to the machine learning unit 291 and used as learning data. The Z-axis drive unit 363 and the Z-axis fine drive unit 364 can be operated to automatically set the focusing distance through a large amount of learning data.

In the present invention, the above embodiment is an example and the present invention is not limited thereto. Anything that has substantially the same structure and achieves the same effect as the technical idea described in the claims of the present invention is included in the technical scope of the present invention.

Claims (12)

1. An ultrasonic inspection system that inspects wafer defects,

   A transfer robot module 110 equipped with an arm unit that unloads wafers from a loading module 101 loaded with wafers and transfers the wafers to an inspection position for ultrasonic inspection; and

   It includes an inspection module 130 that has at least one probe unit 131 and performs ultrasonic scanning on the wafer in the inspection position,

   The inspection module 130 is,

   For ultrasonic scanning of the wafer, it includes at least one jig unit 140 that fixes the probe unit 131 above the inspection position,

   The jig unit 140 is,

   It is formed in a multi-channel manner having first to N-th channels, and the first to N-th channels are formed so that first to N-th probe units formed to irradiate preset frequencies can be mounted, respectively,

   Ultrasound inspection system.
2. According to clause 1,

   The jig unit 140 is,

   It includes N channel mounting portions 141 extending in one direction and formed so that the first to Nth probe units can be coupled or disengaged, so that the first to Nth probe units can be replaced,

   The N channel mounting portions 141 are,

   Arranged spaced apart along one direction,

   Ultrasound inspection system.
3. According to clause 2,

   The ultrasonic inspection system is,

   It further includes a scan control module 150 that controls the probe unit 131 and the jig unit 140,

   The scan control module 150,

   Formed to perform ultrasonic scanning on the wafer by checking the number information of the channel mounting portion 141 and the mounting information of the probe unit 131,

   Ultrasound inspection system.
4. According to clause 3,

   The jig unit 140 is,

   It is connected to the driving means 160 and is configured to perform ultrasonic scanning of the wafer while moving in the ±X direction or ±Y direction,

   The scan control module 150,

   Setting the movement path of the jig unit 140 through the number information of the channel mounting portion 141 and the mounting information of the probe unit 131,

   Ultrasound inspection system.
5. According to clause 4,

   The scan control module 150,

   When it is determined that at least some of the N channel mounting portions 141 are in a mixed state, inactive channel mounting portions to which no probe units are mounted and active channel mounting portions to which the probe unit 131 is coupled,

   Formed to perform ultrasonic scanning of the entire surface of the wafer by setting the movement path of the jig unit 140 based on the position of the active channel mounting portion,

   Ultrasound inspection system.
6. According to clause 2,

   The first to Nth probe units are,

   Consisting of a multi-frequency combination, at least some of which are formed to have different set frequencies,

   Ultrasound inspection system.
7. According to clause 6,

   The first to Nth probe units are,

   Formed to have a first or second set frequency,

   The probe unit having the first set frequency and the probe unit having the second set frequency are arranged alternately along the one direction.

   Ultrasound inspection system.
8. An ultrasonic inspection system that inspects wafer defects,

   A transfer robot module 110 equipped with an arm unit that unloads wafers from a loading module 101 loaded with wafers and transfers the wafers to an inspection position for ultrasonic inspection; and

   It includes an inspection module 130 that has at least one probe unit 131 and performs ultrasonic scanning on the wafer in the inspection position,

   The inspection module 130 is,

   For ultrasonic scanning of the wafer, it includes a jig unit 140 that fixes the at least one probe unit 131 to the upper side of the inspection position, wherein the jig unit 140 is aligned with the other jig unit 140. Combined in the X direction or ±Y direction to form an extendable jig bar assembly 170,

   Ultrasound inspection system.
9. According to clause 8,

   In the jig unit 140,

   A distilled water spray unit 143 is coupled to the probe unit 131 and sprays distilled water in a waterfall manner on the wafer positioned below. The distilled water spray unit 143 is a distilled water supply unit. It is connected to (180) and has a built-in distilled water flow path (144) for supplying distilled water,

   When the first to Lth jig units 140 are combined to form the jig bar assembly 170, the distilled water passages 144 provided in each of the first to Lth jig units 140 are configured to communicate with each other. ,

   Ultrasound inspection system.
10. According to clause 9,

    The jig bar assembly 170 is,

    It is connected to the driving means 160 and is configured to perform ultrasonic scanning of the wafer while moving in the ±X direction or ±Y direction,

    Comprising a damper unit 171 to cushion vibration when the jig bar assembly 170 moves in the ±X direction or ±Y direction,

    Ultrasound inspection system.
11. According to clause 10,

    The jig bar assembly 170 is,

    It is controlled by a scan control module 150 that is connected to the driving means 160 and sets the movement path of the jig bar assembly 170,

    The scan control module 150,

    In the section where the jig bar assembly 170 moves by changing direction in the ±X direction or ±Y direction, setting a streamlined path that curves the moving path,

    Ultrasound inspection system.
12. According to clause 8,

    The jig bar assembly 170 is,

    It is connected to the driving means 160 and is formed to be movable in the ± ,

    The power transmission unit 172 is,

    It includes a coupling shaft coupled to the center of gravity side of the jig bar assembly 170,

    When the shape of the jig bar assembly 170 is changed by combining another jig unit 140, the coupling axis is formed to move toward the newly set center of gravity,

    Ultrasound inspection system.

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