WO2024080021A1 - コンデンサ、コンデンサバンク、及び、コンデンサ用外装ケース - Google Patents

コンデンサ、コンデンサバンク、及び、コンデンサ用外装ケース Download PDF

Info

Publication number
WO2024080021A1
WO2024080021A1 PCT/JP2023/031701 JP2023031701W WO2024080021A1 WO 2024080021 A1 WO2024080021 A1 WO 2024080021A1 JP 2023031701 W JP2023031701 W JP 2023031701W WO 2024080021 A1 WO2024080021 A1 WO 2024080021A1
Authority
WO
WIPO (PCT)
Prior art keywords
capacitor
hook
exterior case
shaped portion
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/031701
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
章治 岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2024551293A priority Critical patent/JP7816550B2/ja
Publication of WO2024080021A1 publication Critical patent/WO2024080021A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

Definitions

  • the present invention relates to a capacitor, a capacitor bank, and an exterior case for a capacitor.
  • Patent Document 1 discloses a chip-type electronic component that has plate-shaped metal terminals that are extended from a resin-coated electronic component body and formed by bending the electronic component body at multiple locations along the outer surface of the electronic component body, and that has protrusions on the bottom surface of the electronic component body only at the periphery of the plate-shaped metal terminal or at the portion where the terminal tip is in contact, and that is configured so that the protrusions are flush with the surface of the plate-shaped metal terminal.
  • electrical and electronic components used in on-board applications such as power conversion devices for electric vehicles are naturally required to be energy-efficient, but at the same time, because they are used in on-board applications, they are also required to have high vibration and shock resistance. Therefore, electrical and electronic components used in on-board applications need to be firmly fixed to the object on which they are mounted.
  • smoothing capacitors used in DC-Links of electric systems are relatively large and heavy, so they need to be firmly fixed to the object on which they are mounted.
  • the chip-type electronic component described in Patent Document 1 As shown in FIG. 4 of Patent Document 1, a protrusion provided on the bottom surface of the electronic component body is fixed to the wiring board, which is the mounting object, via an adhesive.
  • the chip-type electronic component described in Patent Document 1 has room for improvement in terms of making it difficult for the adhesion between the protrusion and the adhesive to come off when vibration, impact, etc. are applied, i.e., in terms of improving vibration and impact resistance.
  • the present invention has been made to solve the above problems, and aims to provide a capacitor that can improve vibration and shock resistance when mounted on an object to be mounted. Another aim of the present invention is to provide a capacitor bank having the above capacitor. Furthermore, the present invention aims to provide an outer casing for a capacitor to be used with the above capacitor.
  • the capacitor of the present invention comprises a capacitor element having a body and an external electrode provided on an end face of the body, a pull-out terminal electrically connected to the external electrode, an exterior case in which the capacitor element is housed so that the pull-out terminal protrudes outward, and a filling resin filled inside the exterior case so as to embed the capacitor element, the exterior surface of the exterior case including a mounting surface that faces the mounting object in a first direction when the pull-out terminal is electrically connected to the mounting object, and the exterior case has a hook-shaped portion extending from the mounting surface.
  • the capacitor bank of the present invention is characterized by comprising the capacitor of the present invention and the mounting object to which the lead terminal of the capacitor is electrically connected.
  • the capacitor outer case of the present invention is an outer case for a capacitor for storing a capacitor element having a base body and an external electrode provided on an end face of the base body and a pull-out terminal electrically connected to the external electrode, the capacitor element being housed therein such that the pull-out terminal protrudes outward,
  • the outer surface of the outer case includes a mounting surface that faces the mounting object in a first direction when the pull-out terminal is electrically connected to the mounting object, and the outer case has a hook-shaped portion extending from the mounting surface.
  • the present invention provides a capacitor that can improve vibration and shock resistance when mounted on an object to be mounted.
  • the present invention also provides a capacitor bank having the above capacitor.
  • the present invention provides an exterior case for the capacitor that can be used with the above capacitor.
  • FIG. 1 is a schematic perspective view of an example of a capacitor according to a first embodiment of the present invention.
  • FIG. 2 is a schematic diagram showing the capacitor shown in FIG. 1 as viewed from the second outer surface side of the exterior case.
  • FIG. 3 is a schematic perspective view of one example of the capacitor element shown in FIGS. 1 and 2.
  • FIG. 4 is a schematic diagram showing an example of a cross section of the capacitor element shown in FIG. 3 taken along line a1-a2.
  • FIG. 5 is a schematic perspective view of an example of the capacitor bank according to the first embodiment of the present invention.
  • FIG. 6 is a schematic diagram showing the capacitor bank shown in FIG. 5 as viewed from the second outer surface side of the exterior case.
  • FIG. 1 is a schematic perspective view of an example of a capacitor according to a first embodiment of the present invention.
  • FIG. 2 is a schematic diagram showing the capacitor shown in FIG. 1 as viewed from the second outer surface side of the exterior case.
  • FIG. 3 is a schematic perspective view
  • FIG. 7 is a schematic perspective view showing a step of mounting a capacitor on an object in the manufacturing process of the capacitor bank shown in FIGS. 5 and 6.
  • FIG. 8 is a schematic perspective view of an example of a capacitor according to the second embodiment of the present invention.
  • FIG. 9 is a schematic diagram showing the capacitor shown in FIG. 8 as viewed from the second outer surface side of the exterior case.
  • FIG. 10 is a schematic perspective view of an example of a capacitor bank according to a second embodiment of the present invention.
  • FIG. 11 is a schematic diagram showing the capacitor bank shown in FIG. 10 as viewed from the second outer surface side of the exterior case.
  • FIG. 12 is a schematic perspective view showing a step of mounting a capacitor on an object in the manufacturing process of the capacitor bank shown in FIGS.
  • FIG. 12 is a schematic perspective view showing a step of mounting a capacitor on an object in the manufacturing process of the capacitor bank shown in FIGS.
  • FIG. 13 is a schematic diagram showing an example of a capacitor bank according to another embodiment of the present invention as viewed from the second outer surface side of the exterior case.
  • FIG. 14 is a schematic diagram showing a modified example of the capacitor bank shown in FIG. 13 as viewed from the second outer surface side of the exterior case.
  • the capacitor of the present invention is not limited to the configurations below, and may be modified as appropriate without departing from the gist of the present invention.
  • a combination of multiple individual preferred configurations described below also constitutes the present invention.
  • each embodiment will be referred to simply as “the capacitor of the present invention,” “the capacitor bank of the present invention,” and “the outer case for a capacitor of the present invention.”
  • a film capacitor is shown as an example of a capacitor of the present invention.
  • the capacitor of the present invention can also be applied to capacitors other than film capacitors.
  • the capacitor of the present invention comprises a capacitor element having a body and an external electrode provided on an end face of the body, a pull-out terminal electrically connected to the external electrode, an exterior case in which the capacitor element is housed so that the pull-out terminal protrudes outward, and a filling resin filled inside the exterior case so as to embed the capacitor element, the exterior surface of the exterior case including a mounting surface that faces the mounting object in a first direction when the pull-out terminal is electrically connected to the mounting object, and the exterior case has a hook-shaped portion extending from the mounting surface.
  • the capacitor bank of the present invention is characterized by comprising the capacitor of the present invention and the mounting object to which the lead terminal of the capacitor is electrically connected.
  • the capacitor outer case used in the capacitor of the present invention described below is also one aspect of the present invention. That is, the capacitor outer case of the present invention is an outer case for a capacitor that stores a capacitor element having a body and an external electrode provided on an end face of the body, and a pull-out terminal electrically connected to the external electrode, so that the pull-out terminal protrudes outward, and is characterized in that the outer surface of the outer case includes a mounting surface that faces the mounting object in a first direction when the pull-out terminal is electrically connected to the mounting object, and the outer case has a hook-shaped portion extending from the mounting surface.
  • the hook-shaped portion protrudes beyond the entire mounting surface of the outer case in the first direction.
  • the pull-out terminal protrudes beyond the entire mounting surface of the outer case in the first direction.
  • the outer end of the hook-shaped portion is located at the same height as the outer end of the pull-out terminal relative to the mounting surface of the outer case in the first direction.
  • FIG. 1 is a schematic diagram showing an oblique view of an example of a capacitor according to a first embodiment of the present invention.
  • FIG. 2 is a schematic diagram showing the capacitor shown in FIG. 1 as viewed from the second outer surface side of the exterior case.
  • the capacitor 1A shown in Figures 1 and 2 has a capacitor element 10 (see Figure 3 described later), a first lead terminal 20a, a second lead terminal 20b, an exterior case 30A, and a filling resin 40.
  • the first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other.
  • FIG. 3 is a schematic diagram showing an oblique view of an example of the capacitor element shown in FIGS. 1 and 2.
  • FIG. 4 is a schematic diagram showing an example of a cross section of the capacitor element shown in FIG. 3 taken along line a1-a2.
  • the capacitor element 10 shown in Figures 3 and 4 has a body 11, a first external electrode 12a, and a second external electrode 12b.
  • the element body 11 is a wound body in which the first metallized film 13a and the second metallized film 13b are wound in a stacked state in the first direction D1.
  • the capacitor 1A or more specifically, the capacitor element 10 is a wound-type film capacitor in which the metallized films are stacked and wound.
  • capacitor 1A or more specifically, capacitor element 10
  • capacitor element 10 may be a laminated film capacitor in which metallized films are laminated.
  • element body 11 has a flat cross-sectional shape when viewed in a cross section perpendicular to the winding axis direction of element body 11 (third direction D3 in FIG. 3). More specifically, it is preferable that element body 11 has a cross-sectional shape pressed into a flat shape such as an ellipse or oval, and that the cross-sectional shape of element body 11 is thinner than when it is a perfect circle.
  • Whether the base body has been pressed to have a flat cross-sectional shape can be confirmed, for example, by checking whether or not there are press marks on the base body.
  • the capacitor element 10 may have a cylindrical winding axis.
  • the winding axis is disposed on the central axis of the first metallized film 13a and the second metallized film 13b in the wound state, and serves as the winding axis when winding the first metallized film 13a and the second metallized film 13b.
  • the first metallized film 13a has a first dielectric film 14a and a first metal layer 15a.
  • the first dielectric film 14a has a first principal surface 14aa and a second principal surface 14ab that face each other in the first direction D1.
  • the first metal layer 15a is provided on the first main surface 14aa of the first dielectric film 14a. More specifically, the first metal layer 15a is provided on the first main surface 14aa of the first dielectric film 14a so as to reach one side edge of the first dielectric film 14a in the third direction D3, but not to reach the other side edge of the first dielectric film 14a.
  • the second metallized film 13b has a second dielectric film 14b and a second metal layer 15b.
  • the second dielectric film 14b has a first main surface 14ba and a second main surface 14bb that face each other in the first direction D1.
  • the second metal layer 15b is provided on the first main surface 14ba of the second dielectric film 14b. More specifically, the second metal layer 15b is provided on the first main surface 14ba of the second dielectric film 14b so as not to reach one side edge of the second dielectric film 14b in the third direction D3, but to reach the other side edge of the second dielectric film 14b.
  • the adjacent first metallized films 13a and second metallized films 13b are shifted in the third direction D3 so that the end of the first metal layer 15a that reaches the side edge of the first dielectric film 14a is exposed on one end surface of the element body 11, and the end of the second metal layer 15b that reaches the side edge of the second dielectric film 14b is exposed on the other end surface of the element body 11.
  • the first metallized film 13a protrudes toward the first external electrode 12a relative to the second metallized film 13b.
  • the second metallized film 13b protrudes toward the second external electrode 12b relative to the first metallized film 13a.
  • the first metal layer 15a is connected to the first external electrode 12a and is not connected to the second external electrode 12b.
  • the second metal layer 15b is connected to the second external electrode 12b and is not connected to the first external electrode 12a.
  • the adjacent first metallized film 13a and second metallized film 13b are shifted in the third direction D3 as described above, so that in the adjacent first dielectric film 14a and second dielectric film 14b, the first dielectric film 14a having the first metal layer 15a on the first main surface 14aa protrudes toward the first external electrode 12a relative to the second dielectric film 14b having the first metal layer 15a not provided on its main surface.
  • the second dielectric film 14b having the second metal layer 15b on the first main surface 14ba protrudes toward the second external electrode 12b relative to the first dielectric film 14a having the second metal layer 15b not provided on its main surface.
  • the element body 11 is formed by winding the first metallized film 13a and the second metallized film 13b in a stacked state in the first direction D1, and therefore can be said to include the first dielectric film 14a, the first metal layer 15a, the second dielectric film 14b, and the second metal layer 15b in the first direction D1. It can also be said that the element body 11 is a wound body formed by winding the first dielectric film 14a, the first metal layer 15a, the second dielectric film 14b, and the second metal layer 15b in the first direction D1.
  • the first main surface 14aa of the first dielectric film 14a and the second main surface 14bb of the second dielectric film 14b face each other in the first direction D1
  • the second main surface 14ab of the first dielectric film 14a and the first main surface 14ba of the second dielectric film 14b face each other in the first direction D1.
  • the first metallized film 13a and the second metallized film 13b are wound in a state in which they are stacked in the first direction D1.
  • the first metallized film 13a and the second metallized film 13b are wound in a state in which they are stacked in the first direction D1, so that the second metallized film 13b is on the inside of the first metallized film 13a, and more specifically, the first metal layer 15a is on the inside of the first dielectric film 14a, and the second metal layer 15b is on the inside of the second dielectric film 14b. That is, in the element body 11, the first metal layer 15a and the second metal layer 15b face each other with the first dielectric film 14a or the second dielectric film 14b sandwiched between them.
  • the first metal layer 15a may be provided with a fuse portion.
  • the fuse portion provided in the first metal layer 15a is, for example, a portion of the first metal layer 15a that connects a divided electrode portion in which the portion facing the second metal layer 15b is divided into multiple portions, and an electrode portion that does not face the second metal layer 15b.
  • Examples of electrode patterns of the first metal layer 15a provided with a fuse portion include the electrode patterns disclosed in JP 2004-363431 A and JP 5-251266 A.
  • the second metal layer 15b may also be provided with a fuse portion, similar to the first metal layer 15a.
  • the first dielectric film 14a may contain a curable resin as a main component.
  • the main component means the component with the highest weight percentage, preferably the component with a weight percentage greater than 50% by weight.
  • the curable resin may be a thermosetting resin or a photocurable resin.
  • thermosetting resin means a resin that can be cured by heat, but the curing method is not limited. Therefore, thermosetting resin also includes resins that can be cured by methods other than heat (for example, light, electron beam, etc.) so long as they are heat-curable. Also, depending on the material, a reaction may be initiated due to the reactivity of the material itself, and resins that proceed to cure without necessarily being subjected to heat from the outside are also considered to be thermosetting resins. The same applies to photocurable resins, and so long as they are light-curable, they also include resins that can be cured by methods other than light (for example, heat, etc.).
  • the curable resin is preferably made of a cured product of a first organic material having a hydroxyl group (OH group) and a second organic material having an isocyanate group (NCO group).
  • the curable resin is made of a cured product having a urethane bond obtained by reacting the hydroxyl group of the first organic material with the isocyanate group of the second organic material.
  • FT-IR Fourier transform infrared spectrophotometer
  • the first dielectric film 14a may contain at least one of a hydroxyl group and an isocyanate group.
  • the first dielectric film 14a may contain either a hydroxyl group or an isocyanate group, or may contain both a hydroxyl group and an isocyanate group.
  • Examples of the first organic material include phenoxy resin, polyvinyl acetoacetal resin, polyvinyl butyral resin, etc.
  • the second organic material examples include aromatic polyisocyanates such as diphenylmethane diisocyanate (MDI) and tolylene diisocyanate (TDI), and aliphatic polyisocyanates such as hexamethylene diisocyanate (HDI).
  • aromatic polyisocyanates such as diphenylmethane diisocyanate (MDI) and tolylene diisocyanate (TDI)
  • aliphatic polyisocyanates such as hexamethylene diisocyanate (HDI).
  • HDI hexamethylene diisocyanate
  • the second organic material multiple types of organic materials may be used in combination.
  • the first dielectric film 14a may contain a thermoplastic resin as a main component.
  • thermoplastic resins examples include polypropylene, polyethersulfone, polyetherimide, polyarylate, etc.
  • the first dielectric film 14a may contain additives to impart various functions.
  • Additives include, for example, leveling agents to impart smoothness.
  • the additive preferably has a functional group that reacts with a hydroxyl group and/or an isocyanate group and forms part of the crosslinked structure of the cured product.
  • examples of such additives include resins having at least one functional group selected from the group consisting of a hydroxyl group, an epoxy group, a silanol group, and a carboxyl group.
  • the second dielectric film 14b may contain a thermosetting resin as a main component, a photocurable resin as a main component, or a thermoplastic resin as a main component.
  • the second dielectric film 14b may also contain an additive, like the first dielectric film 14a.
  • compositions of the first dielectric film 14a and the second dielectric film 14b may be different from each other, but are preferably the same.
  • the thickness of the first dielectric film 14a and the second dielectric film 14b is preferably 1 ⁇ m or more and 10 ⁇ m or less, and more preferably 3 ⁇ m or more and 5 ⁇ m or less.
  • the thicknesses of the first dielectric film 14a and the second dielectric film 14b may be different from each other, but it is preferable that they are the same.
  • the thickness of the dielectric film is measured using an optical thickness gauge.
  • the first dielectric film 14a and the second dielectric film 14b are each preferably produced by forming a resin solution containing the resin material as described above into a film and then curing it by heat treatment.
  • Examples of materials that can be used to form the first metal layer 15a and the second metal layer 15b include metals such as aluminum, zinc, titanium, magnesium, tin, and nickel.
  • compositions of the first metal layer 15a and the second metal layer 15b may be different from each other, but are preferably the same.
  • the thickness of the first metal layer 15a and the second metal layer 15b is preferably 5 nm or more and 40 nm or less.
  • the thicknesses of the first metal layer 15a and the second metal layer 15b may be different from each other, but are preferably the same.
  • the thickness of the metal layer is measured by observing a cross section of the metallized film along the first direction using a transmission electron microscope (TEM).
  • TEM transmission electron microscope
  • the first metal layer 15a and the second metal layer 15b are preferably formed by depositing a metal such as that described above onto the main surfaces of the first dielectric film 14a and the second dielectric film 14b, respectively.
  • the first external electrode 12a is provided on one end surface of the element body 11. More specifically, the first external electrode 12a is connected to the first metal layer 15a by contacting the end of the first metal layer 15a exposed on one end surface of the element body 11. On the other hand, the first external electrode 12a is not connected to the second metal layer 15b.
  • the second external electrode 12b is provided on the other end surface of the element body 11. More specifically, the second external electrode 12b is connected to the second metal layer 15b by contacting the end of the second metal layer 15b exposed on the other end surface of the element body 11. On the other hand, the second external electrode 12b is not connected to the first metal layer 15a.
  • the constituent materials of the first external electrode 12a and the second external electrode 12b include metals such as zinc, aluminum, tin, and zinc-aluminum alloys.
  • compositions of the first external electrode 12a and the second external electrode 12b may be different from each other, but are preferably the same.
  • the first external electrode 12a and the second external electrode 12b are preferably formed by spraying a metal such as that described above onto one end face and the other end face of the body 11, respectively.
  • the first pull-out terminal 20a is electrically connected to the first external electrode 12a (see Figures 3 and 4).
  • the first pull-out terminal 20a is electrically connected to the first external electrode 12a via a joining member such as solder.
  • the second pull-out terminal 20b is electrically connected to the second external electrode 12b (see Figures 3 and 4).
  • the second pull-out terminal 20b is electrically connected to the second external electrode 12b via a joining member such as solder.
  • the first pull-out terminal 20a and the second pull-out terminal 20b are each used as terminals for electrically connecting the capacitor element 10 to an object to be mounted when the capacitor 1A is mounted to the object to be mounted.
  • the capacitor 1A When the first and second pull-out terminals 20a and 20b are welded to the mounting object, the capacitor 1A, and in particular the capacitor element 10, can be more firmly fixed to the mounting object than when the first and second pull-out terminals 20a and 20b are fixed to the mounting object by screw fastening, solder joining, etc.
  • the connection resistance between the first pull-out terminal 20a and the mounting object, and the connection resistance between the second pull-out terminal 20b and the mounting object can be reduced. This improves the conductivity between the capacitor 1A and the mounting object.
  • Welding methods that are used include, for example, laser welding and resistance welding.
  • Laser welding in particular, has the advantage over other welding methods of being able to weld in a short time by using localized heating, which reduces welding distortion.
  • the constituent material of the first pull-out terminal 20a and the second pull-out terminal 20b may be, for example, a metal such as copper, oxygen-free copper, aluminum, or an alloy containing at least one of these.
  • the constituent material of the first pull-out terminal 20a and the second pull-out terminal 20b is preferably copper or oxygen-free copper.
  • the constituent material of the first pull-out terminal 20a and the second pull-out terminal 20b is a copper-based material
  • oxygen-free copper copper: 99.96% by weight or more
  • tough pitch copper copper: 99.90% by weight or more
  • phosphorus deoxidized copper copper: 99.90% by weight or more, phosphorus: 0.015% by weight or more, 0.040% by weight or less
  • etc. may be used.
  • the first pull-out terminal 20a and the second pull-out terminal 20b may each have a plate-like shape or a linear (rod-like) shape, for example.
  • the first pull-out terminal 20a and the second pull-out terminal 20b may each have a shape with a partially bent portion.
  • the capacitor element 10 (see Figures 3 and 4) is housed inside the exterior case 30A so that the first pull-out terminal 20a and the second pull-out terminal 20b protrude toward the outside.
  • the capacitor element 10 is stored in the center of the interior of the outer case 30A while being separated from the inner surface of the outer case 30A.
  • one capacitor element 10 is stored inside one exterior case 30A, but multiple capacitor elements 10 may be stored inside one exterior case 30A.
  • the shape of the exterior case 30A is, for example, a cylindrical shape with a bottom and an opening 31 at one end in the second direction D2, as shown in Figures 1 and 2.
  • the outer surface of the exterior case 30A includes a first outer surface 32 facing the opening 31 in the second direction D2, and a second outer surface 33 (in the example shown in Figures 1 and 2, four outer surfaces are included) extending from the first outer surface 32 toward the opening 31 in the second direction D2.
  • Examples of the exterior case 30A include a resin case, a metal case, etc.
  • the exterior case 30A is a resin case
  • the resin that constitutes the resin case include liquid crystal polymer (LCP), polyphenylene sulfide, polybutylene terephthalate, etc.
  • LCP liquid crystal polymer
  • the resin case contains a liquid crystal polymer.
  • the liquid crystal polymer contained in the resin case may be, for example, a liquid crystal polymer having p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid groups in its skeleton.
  • liquid crystal polymers formed from polycondensates using various components such as phenol, phthalic acid, and ethylene terephthalate can also be used.
  • Liquid crystal polymers can also be classified into types I, II, and III, but the material used is the same as the liquid crystal polymer formed from the above-mentioned components.
  • the resin case preferably further contains an inorganic filler in addition to the liquid crystal polymer.
  • the inorganic filler contained in the resin case can be a material that is stronger than the liquid crystal polymer.
  • the inorganic filler is preferably a material that has a higher melting point than the liquid crystal polymer, and more preferably a material with a melting point of 680°C or higher.
  • the shape of the inorganic filler is not particularly limited, and examples include a shape having a longitudinal direction such as a fiber shape or a plate shape.
  • As an inorganic filler of such a shape multiple types of inorganic materials may be used in combination.
  • the resin case contains at least one of a fibrous inorganic material and a plate-shaped inorganic material as the inorganic filler.
  • a filler being fibrous means that the relationship between the longitudinal dimension in the longitudinal direction and the cross-sectional diameter in a cross section perpendicular to the longitudinal direction is longitudinal dimension/cross-sectional diameter ⁇ 5 (i.e., the aspect ratio is 5:1 or more).
  • the cross-sectional diameter is the longest distance between two points on the circumference of the cross section. If the cross-sectional diameter varies in the longitudinal direction, the measurement is taken at the point where the cross-sectional diameter is largest.
  • a filler being plate-like means that the relationship between the cross-sectional diameter of the face with the largest projected area and the maximum height in the direction perpendicular to this cross section is cross-sectional diameter/maximum height ⁇ 3.
  • the inorganic filler has a portion oriented from the first outer surface 32 toward the opening 31 on the second outer surface 33 of the exterior case 30A and a portion oriented toward the adjacent second outer surface 33, and is dispersed inside the exterior case 30A.
  • the size of the inorganic filler is preferably 5 ⁇ m or more in diameter and 50 ⁇ m or more in length.
  • the inorganic filler is dispersed throughout the exterior case 30A without agglomeration.
  • inorganic fillers examples include inorganic materials such as fibrous glass filler, plate-like talc or mica. Of these, it is preferable for the inorganic filler to contain fibrous glass filler as the main component.
  • the resin case contains another resin (e.g., polyphenylene sulfide) instead of the liquid crystal polymer, it is preferable that the resin case further contains an inorganic filler as described above.
  • another resin e.g., polyphenylene sulfide
  • the resin case is manufactured by a method such as injection molding.
  • the exterior case 30A is a metal case
  • the metal that constitutes the metal case include simple metals such as aluminum, magnesium, iron, stainless steel, and copper, and alloys that contain at least one of these simple metals. Of these, it is preferable that the metal case contains aluminum or an aluminum alloy.
  • the metal case is manufactured by a method such as impact molding.
  • the filling resin 40 is filled inside the exterior case 30A so as to embed the capacitor element 10.
  • the capacitor element 10 is held inside the exterior case 30A.
  • the filled resin 40 is filled between the capacitor element 10 and the exterior case 30A, more specifically, between the outer surface of the capacitor element 10 and the inner surface of the exterior case 30A. Furthermore, inside the exterior case 30A, the filled resin 40 is filled not only between the capacitor element 10 and the exterior case 30A, but also in the area from the opening 31 of the exterior case 30A to the capacitor element 10.
  • the filling resin 40 it is preferable to appropriately select a resin with low moisture permeability from the viewpoint of suppressing the infiltration of moisture into the capacitor element 10, and examples thereof include epoxy resin, silicone resin, urethane resin, etc.
  • examples of the hardener for the epoxy resin include an amine hardener, an imidazole hardener, etc.
  • the filling resin 40 only the above-mentioned resin may be used, but in order to improve strength, a resin to which a reinforcing agent has been added may also be used.
  • reinforcing agents include silica and alumina.
  • the thickness of the filling resin 40 at the opening 31 of the exterior case 30A is large.
  • the thickness of the filling resin 40 at the opening 31 of the exterior case 30A is preferably sufficiently large within the range that allows for the volume (physical size) of the entire capacitor 1A, and specifically, is preferably 2 mm or more, and more preferably 4 mm or more.
  • the thickness of the filling resin 40 for the capacitor element 10 is made larger on the opening 31 side of the exterior case 30A than on the first outer surface 32 side by arranging the capacitor element 10 on the opening 31 side of the exterior case 30A inside the exterior case 30A.
  • the thickness of the filling resin 40 is measured, for example, using a soft X-ray device if it is in a non-destructive state, and using a length measuring device such as a caliper if it is in a destructive state.
  • the relationship between the height of the outer case 30A and the height of the filled resin 40 in the second direction D2 is such that the thickness of the filled resin 40 at the opening 31 of the outer case 30A is as large as possible, and may be up to a position on the inside of the outer case 30A, may be just about to the top, or may overflow slightly due to surface tension.
  • the outer surface of the exterior case 30A includes a mounting surface 34 that faces the mounting object in the first direction D1 when the first pull-out terminal 20a and the second pull-out terminal 20b are electrically connected to the mounting object.
  • the outer surface of the exterior case 30A includes the mounting surface 34 as part of the second outer surface 33.
  • the exterior case 30A has hook-shaped portions 35Aa, 35Ab, and 35Ac, each extending from the mounting surface 34.
  • hook portion 35Aa, hook portion 35Ab, and hook portion 35Ac each protrude beyond the entire mounting surface 34 of exterior case 30A in the first direction D1.
  • the hooked portion 35Aa, the hooked portion 35Ab, and the hooked portion 35Ac each protrude in the first direction D1 from the entire mounting surface 34 of the outer case 30A, so that when the capacitor 1A is mounted on the mounting object, a gap can be provided between the mounting surface 34 of the outer case 30A and the mounting object. Furthermore, when the capacitor 1A is mounted on the mounting object, the gap provided between the mounting surface 34 of the outer case 30A and the mounting object can be used as a placement location for a connection member such as an underfill adhesive (e.g., an adhesive containing an epoxy resin). By placing the connection member between the mounting surface 34 of the outer case 30A and the mounting object, the capacitor 1A, and in particular the outer case 30A, can be firmly fixed to the mounting object, as described below.
  • an underfill adhesive e.g., an adhesive containing an epoxy resin
  • the first pull-out terminal 20a and the second pull-out terminal 20b each protrude beyond the entire mounting surface 34 of the exterior case 30A in the first direction D1.
  • the first pull-out terminal 20a and the second pull-out terminal 20b each protrude from the entire mounting surface 34 of the outer case 30A in the first direction D1
  • the hook-shaped portion 35Aa, the hook-shaped portion 35Ab, and the hook-shaped portion 35Ac each protrude from the entire mounting surface 34 of the outer case 30A in the first direction D1, which in turn makes it easy to provide a gap between the mounting surface 34 of the outer case 30A and the mounting object when the capacitor 1A is mounted on the mounting object.
  • the gap provided between the mounting surface 34 of the outer case 30A and the mounting object can be used as a location for a connecting member such as an underfill adhesive, so that the capacitor 1A, and in particular the outer case 30A, can be firmly fixed to the mounting object by the connecting member.
  • the distance in the first direction D1 between mounting surface 34 of outer case 30A and the object to be mounted can be controlled by the protruding dimensions in the first direction D1 of hook portion 35Aa, hook portion 35Ab, hook portion 35Ac, first pull-out terminal 20a, and second pull-out terminal 20b relative to mounting surface 34 of outer case 30A.
  • the outer end of the hook-shaped portion 35Aa is located at the same height as the outer end of the first pull-out terminal 20a relative to the mounting surface 34 of the outer case 30A.
  • the distance between the outer end of the hook-shaped portion 35Aa and the mounting surface 34 of the outer case 30A is the same as the distance between the outer end of the first pull-out terminal 20a and the mounting surface 34 of the outer case 30A.
  • the outer end of the hook-shaped portion 35Aa is located at the same height as the outer end of the second pull-out terminal 20b relative to the mounting surface 34 of the outer case 30A.
  • the distance between the outer end of the hook-shaped portion 35Aa and the mounting surface 34 of the outer case 30A is the same as the distance between the outer end of the second pull-out terminal 20b and the mounting surface 34 of the outer case 30A.
  • the outer end of the hook-shaped portion 35Ab is located at the same height as the outer ends of the first pull-out terminal 20a and the second pull-out terminal 20b relative to the mounting surface 34 of the exterior case 30A.
  • the outer end of the hook-shaped portion 35Ac is located at the same height as the outer ends of the first pull-out terminal 20a and the second pull-out terminal 20b relative to the mounting surface 34 of the exterior case 30A.
  • the outer ends of the hook-shaped portions 35Aa, 35Ab, and 35Ac are located at the same height as the outer ends of the first pull-out terminal 20a and the second pull-out terminal 20b relative to the mounting surface 34 of the exterior case 30A.
  • the outer ends of hook portion 35Aa, hook portion 35Ab, and hook portion 35Ac are located at the same height relative to the mounting surface 34 of the exterior case 30A.
  • the outer ends of the first pull-out terminal 20a and the second pull-out terminal 20b are located at the same height relative to the mounting surface 34 of the exterior case 30A.
  • the outer end of the hook in the first direction means the end of the hook in the first direction that is farther from the center of the exterior case in the first direction. The same applies to the outer end of the pull-out terminal in the first direction.
  • the tips of hooked portions 35Aa, 35Ab, and 35Ac are each bent in a direction perpendicular to the first direction D1 (a direction including the second direction D2 and the third direction D3).
  • the tip of at least one hook selected from the group consisting of hook 35Aa, hook 35Ab, and hook 35Ac faces the center of the mounting surface 34 of the exterior case 30A in a direction perpendicular to the first direction D1 (a direction including the second direction D2 and the third direction D3).
  • the tips of the hook-shaped portions 35Aa and 35Ab each face toward the center of the mounting surface 34 of the exterior case 30A in a third direction D3 that is perpendicular to the first direction D1.
  • the tips of the hook-shaped portions 35Aa and 35Ab face toward the center of the mounting surface 34 so as to approach each other in the third direction D3.
  • the tip of the hook-shaped portion 35Ac faces toward the center of the mounting surface 34 of the exterior case 30A in the second direction D2 perpendicular to the first direction D1.
  • the tip of at least one hook selected from the group consisting of hook 35Aa, hook 35Ab, and hook 35Ac faces the first pull-out terminal 20a and the second pull-out terminal 20b in a direction perpendicular to the first direction D1 (including the second direction D2 and the third direction D3).
  • the tip of the hook-shaped portion 35Ac faces the first pull-out terminal 20a and the second pull-out terminal 20b in the second direction D2 perpendicular to the first direction D1.
  • Hooked portion 35Aa, hooked portion 35Ab, and hooked portion 35Ac may each have a shape in which the tip of a plate-shaped portion is bent into a hook shape, or a shape in which the tip of a linear (rod-shaped) portion is bent into a hook shape.
  • hook-shaped portion 35Aa, hook-shaped portion 35Ab, and hook-shaped portion 35Ac may be the same as each other, may be different from each other, or may be partially different.
  • hook portion 35Aa, hook portion 35Ab, and hook portion 35Ac are not particularly limited.
  • the hook-shaped portion 35Aa and the hook-shaped portion 35Ab are positioned so as to overlap when viewed from the third direction D3, but the hook-shaped portion 35Aa and the hook-shaped portion 35Ab may be positioned so as to be offset in the second direction D2.
  • the hook-shaped portion 35Ac when viewed from the third direction D3, the hook-shaped portion 35Ac is located on the opposite side of the first and second pull-out terminals 20a and 20b in the second direction D2 (opposite the opening 31) relative to the hook-shaped portion 35Aa and the hook-shaped portion 35Ab, but the hook-shaped portion 35Ac may be located on the first and second pull-out terminals 20a and 20b side (the opening 31 side) in the second direction D2 relative to the hook-shaped portion 35Aa and the hook-shaped portion 35Ab.
  • hook portion 35Aa, hook portion 35Ab, and hook portion 35Ac do not protrude from outer case 30A when viewed from first direction D1.
  • the mounting area of the capacitor 1A can be reduced compared to when the hook-shaped portion 35Aa, the hook-shaped portion 35Ab, and the hook-shaped portion 35Ac protrude from the outer case 30A.
  • the hook-shaped portion 35Aa, the hook-shaped portion 35Ab, and the hook-shaped portion 35Ac do not protrude from the outer case 30A, for example, when multiple capacitors 1A are arranged in a direction perpendicular to the first direction D1 (including the second direction D2 and the third direction D3) and mechanically connected, adjacent capacitors 1A are less likely to interfere with each other compared to when the hook-shaped portion 35Aa, the hook-shaped portion 35Ab, and the hook-shaped portion 35Ac protrude from the outer case 30A.
  • At least one hook portion selected from the group consisting of hook portion 35Aa, hook portion 35Ab, and hook portion 35Ac may protrude from exterior case 30A when viewed from first direction D1.
  • the hook-shaped portion 35Aa, the hook-shaped portion 35Ab, and the hook-shaped portion 35Ac are electrically insulated from the first pull-out terminal 20a and the second pull-out terminal 20b.
  • the hook-shaped portion 35Aa, the hook-shaped portion 35Ab, and the hook-shaped portion 35Ac are electrically insulated from the capacitor element 10 to which the first pull-out terminal 20a and the second pull-out terminal 20b are electrically connected.
  • hook portion 35Aa, hook portion 35Ab, and hook portion 35Ac When mounting capacitor 1A on an object to be mounted, it is preferable to connect hook portion 35Aa, hook portion 35Ab, and hook portion 35Ac to the object to be mounted.
  • the exterior case 30A is a resin case, it is preferable to fuse (weld) the hooked portion 35Aa, the hooked portion 35Ab, and the hooked portion 35Ac to the object to be mounted.
  • the exterior case 30A is a metal case, it is preferable to weld the hook portion 35Aa, the hook portion 35Ab, and the hook portion 35Ac to the object to be mounted.
  • the outer ends of hook-shaped portion 35Aa, hook-shaped portion 35Ab, and hook-shaped portion 35Ac are located at the same height relative to mounting surface 34 of outer case 30A in first direction D1, but the outer ends of hook-shaped portion 35Aa, hook-shaped portion 35Ab, and hook-shaped portion 35Ac may be located at different heights relative to mounting surface 34 of outer case 30A in first direction D1, or may be located at different heights in parts.
  • the outer ends of the first pull-out terminal 20a and the second pull-out terminal 20b are located at the same height relative to the mounting surface 34 of the outer case 30A in the first direction D1, but the outer ends of the first pull-out terminal 20a and the second pull-out terminal 20b may be located at different heights relative to the mounting surface 34 of the outer case 30A in the first direction D1.
  • three hook-shaped portions extend from the mounting surface 34 of the exterior case 30A, but the number of hook-shaped portions extending from the mounting surface 34 of the exterior case 30A is not particularly limited. In other words, the number of hook-shaped portions extending from the mounting surface 34 of the exterior case 30A may be only one, or may be multiple.
  • capacitor bank of the present invention An example of a capacitor bank of the present invention is described below as a capacitor bank of embodiment 1 of the present invention having a capacitor of embodiment 1 of the present invention.
  • a space is provided between the mounting surface of the exterior case and the mounting object, and a connecting member is provided in the space so as to contact the tip of the hook-shaped portion.
  • FIG. 5 is a schematic diagram showing an oblique view of an example of a capacitor bank according to embodiment 1 of the present invention.
  • FIG. 6 is a schematic diagram showing the capacitor bank shown in FIG. 5 as viewed from the second outer surface side of the exterior case.
  • the capacitor bank 100A shown in Figures 5 and 6 has a capacitor 1A and an object to be mounted 50A.
  • Examples of the mounting object 50A include a substrate, a bus bar, etc.
  • the mounting object 50A is electrically connected to the first pull-out terminal 20a and the second pull-out terminal 20b of the capacitor 1A.
  • the mounting object 50A is a bus bar
  • the first pull-out terminal 20a and the second pull-out terminal 20b may be electrically connected to separate bus bars.
  • the first pull-out terminal 20a and the second pull-out terminal 20b are preferably welded to the mounting object 50A.
  • hook portion 35Aa, hook portion 35Ab, and hook portion 35Ac are connected to the mounting object 50A.
  • the exterior case 30A is a resin case, it is preferable that the hook-shaped portion 35Aa, the hook-shaped portion 35Ab, and the hook-shaped portion 35Ac are fused (welded) to the mounting object 50A.
  • the exterior case 30A is a metal case, it is preferable that the hook-shaped portion 35Aa, the hook-shaped portion 35Ab, and the hook-shaped portion 35Ac are welded to the mounting object 50A.
  • a space S is provided between the mounting surface 34 of the exterior case 30A and the mounting object 50A.
  • the hooked portion 35Aa, the hooked portion 35Ab, the hooked portion 35Ac, the first pull-out terminal 20a, and the second pull-out terminal 20b protrude from the entire mounting surface 34 of the exterior case 30A in the first direction D1. Therefore, when the capacitor 1A is mounted on the mounting object 50A, a space S is provided between the mounting surface 34 of the exterior case 30A and the mounting object 50A.
  • the exterior case 30A is supported on the mounting object 50A at hooked portions 35Aa, 35Ab, and 35Ac, i.e., a so-called three-point support. This makes it easier to maintain a space S between the mounting surface 34 of the exterior case 30A and the mounting object 50A even if the exterior case 30A is subjected to vibration, shock, or the like.
  • connection member 60 is provided in the space S so as to contact the tips of the hook-shaped portions 35Aa, 35Ab, and 35Ac. In other words, the tips of the hook-shaped portions 35Aa, 35Ab, and 35Ac are bent toward the connection member 60.
  • the connection member 60 is provided in the space S, so that the connection member 60 comes into contact with the mounting surface 34 of the exterior case 30A and the mounting object 50A.
  • the capacitor 1A and the mounting object 50A are connected via the connection member 60. Therefore, in the capacitor bank 100A, the capacitor 1A, and in particular the exterior case 30A, are firmly fixed to the mounting object 50A.
  • the connection member 60 is provided in the space S so as to contact the tips of the hook-shaped portions 35Aa, 35Ab, and 35Ac, so that the connection member 60 penetrates into each of the hook-shaped portions 35Aa, 35Ab, and 35Ac, thereby exerting a remarkable anchor effect. Therefore, in the capacitor bank 100A, the above-mentioned anchor effect increases the fastening force between each of the hook-shaped portions 35Aa, 35Ab, and 35Ac and the connection member 60, so that the capacitor 1A, and in particular the exterior case 30A, is sufficiently firmly fixed to the mounting object 50A.
  • the distance in the first direction D1 between the mounting surface 34 of the outer case 30A and the mounting object 50A i.e., the dimension of the space S in the first direction D1
  • the dimension in the first direction D1 of the connection member 60 provided in the space S can also be controlled by the protruding dimensions in the first direction D1 of the hook-shaped portion 35Aa, the hook-shaped portion 35Ab, the hook-shaped portion 35Ac, the first pull-out terminal 20a, and the second pull-out terminal 20b relative to the mounting surface 34 of the outer case 30A.
  • the anchor effect described above increases the adhesive strength between each of the hook-shaped portions 35Aa, 35Ab, and 35Ac and the connecting member 60, so that the capacitor 1A, and in particular the exterior case 30A, is sufficiently firmly fixed to the mounting object 50A even if not many connecting members 60 are provided. Therefore, in the capacitor bank 100A, as described above, the adhesive strength between each of the hook-shaped portions 35Aa, 35Ab, and 35Ac and the connecting member 60 is increased, which contributes to reducing the amount of connecting member 60 used.
  • connection member 60 is provided in an area roughly surrounded by hooked portions 35Aa, 35Ab, and 35Ac when viewed from the first direction D1, but the position of the connection member 60 is not particularly limited to the area shown in Figures 5 and 6.
  • the connection member 60 may extend further outward from the area shown in Figures 5 and 6 in a direction perpendicular to the first direction D1 (a direction including the second direction D2 and the third direction D3).
  • connection member 60 is provided in one location, but the connection member 60 may be provided in multiple locations.
  • connection member 60 such as an underfill adhesive is provided in the space S, but in addition to the connection member 60, a heat dissipation member such as a heat dissipation paste may also be provided in the space S. If a heat dissipation member is provided in the space S, it becomes easier to achieve the desired heat dissipation performance of the capacitor 1A.
  • the capacitor bank 100A has one capacitor 1A, but the number of capacitors 1A that the capacitor bank 100A has is not particularly limited. In other words, the number of capacitors 1A that the capacitor bank 100A has may be only one, or may be multiple.
  • Figure 7 is a schematic diagram showing an oblique view of the process of mounting a capacitor to an object during the manufacturing process of the capacitor bank shown in Figures 5 and 6.
  • a connection member 60 may be provided in advance on the mounting surface 34 of the exterior case 30A of the capacitor 1A so as to contact the tips of the hook-shaped portions 35Aa, 35Ab, and 35Ac, and then the capacitor 1A may be mounted on the mounting object 50A.
  • a space S is provided between the mounting surface 34 of the exterior case 30A and the mounting object 50A, and the connection member 60 is provided in the space S so as to contact the tips of the hook-shaped portions 35Aa, 35Ab, and 35Ac.
  • connection members 60 may be provided in advance on the mounting object 50A and then the capacitor 1A may be mounted on the mounting object 50A, or the connection members 60 may be provided in advance on both the mounting surface 34 of the exterior case 30A and the mounting object 50A and then the capacitor 1A may be mounted on the mounting object 50A.
  • the connection members 60 may be provided in the space S provided between the mounting surface 34 of the exterior case 30A and the mounting object 50A.
  • the outer end of the hook-shaped portion is located farther from the mounting surface of the exterior case than the outer end of the pull-out terminal.
  • the capacitor of embodiment 2 of the present invention is similar to the capacitor of embodiment 1 of the present invention.
  • FIG. 8 is a schematic diagram showing an oblique view of an example of a capacitor according to embodiment 2 of the present invention.
  • FIG. 9 is a schematic diagram showing the capacitor shown in FIG. 8 as viewed from the second outer surface side of the exterior case.
  • the exterior case 30B has a hook-shaped portion 35B extending from the mounting surface 34.
  • the hook-shaped portion 35B protrudes beyond the entire mounting surface 34 of the exterior case 30B in the first direction D1.
  • the outer end of the hook-shaped portion 35B is located farther from the mounting surface 34 of the outer case 30B than the outer end of the first pull-out terminal 20a.
  • the distance between the outer end of the hook-shaped portion 35B and the mounting surface 34 of the outer case 30B is greater than the distance between the outer end of the first pull-out terminal 20a and the mounting surface 34 of the outer case 30B.
  • the outer end of the hook-shaped portion 35B is located farther from the mounting surface 34 of the outer case 30B than the outer end of the second pull-out terminal 20b.
  • the distance between the outer end of the hook-shaped portion 35B and the mounting surface 34 of the outer case 30B is greater than the distance between the outer end of the second pull-out terminal 20b and the mounting surface 34 of the outer case 30B.
  • the outer end of the hook-shaped portion 35B is located farther from the mounting surface 34 of the exterior case 30B than the outer ends of the first pull-out terminal 20a and the second pull-out terminal 20b.
  • capacitor bank of the present invention Another example of a capacitor bank of the present invention is described below as a capacitor bank of embodiment 2 of the present invention having a capacitor of embodiment 2 of the present invention.
  • the hook-shaped portion is hooked onto a hole, recess, or edge of the mounting object.
  • the capacitor bank of embodiment 2 of the present invention is similar to the capacitor bank of embodiment 1 of the present invention.
  • FIG. 10 is a schematic diagram showing an oblique view of an example of a capacitor bank according to embodiment 2 of the present invention.
  • FIG. 11 is a schematic diagram showing the capacitor bank shown in FIG. 10 as viewed from the second outer surface side of the exterior case.
  • the capacitor bank 100B shown in Figures 10 and 11 has a capacitor 1B and an object to be mounted 50B.
  • the mounting object 50B has a hole 51 that penetrates in the first direction D1.
  • the hook-shaped portion 35B is hooked into the hole portion 51 of the mounting object 50B.
  • the hook-shaped portion 35B is hooked into the hole 51 of the mounting object 50B, so that the capacitor 1B, and in particular the exterior case 30B, is firmly fixed to the mounting object 50B. This improves the vibration and shock resistance when the capacitor 1B is mounted on the mounting object 50B, i.e., when the capacitor bank 100B is in the state where it is mounted.
  • the hook-shaped portion 35B is hooked into the hole 51 of the mounting object 50B, but if the mounting object 50B has a recess recessed in the first direction D1, the hook-shaped portion 35B may be hooked into the recess of the mounting object 50B. Alternatively, the hook-shaped portion 35B may be hooked onto the edge of the mounting object 50B.
  • a space S is provided between the mounting surface 34 of the exterior case 30B and the mounting target 50B.
  • a connecting member 60 is provided in the space S so as to contact the hook-shaped portion 35B.
  • the connection member 60 is provided in the space S, so that the connection member 60 comes into contact with the mounting surface 34 of the exterior case 30B and the mounting object 50B.
  • the capacitor 1B and the mounting object 50B are connected via the connection member 60. Therefore, in the capacitor bank 100B, the hook-shaped portion 35B is hooked into the hole portion 51 of the mounting object 50B, and therefore the capacitor 1B, and in particular the exterior case 30B, is sufficiently firmly fixed to the mounting object 50B.
  • connection members 60 are provided in the space S so as to contact the hooked portions 35B, and an anchor effect is exerted by the connection members 60 biting into the hooked portions 35B. Therefore, in the capacitor bank 100B, the above-mentioned anchor effect increases the fastening force between the hooked portions 35B and the connection members 60, so that the capacitor 1B, and in particular the exterior case 30B, is sufficiently firmly fixed to the mounting object 50B.
  • connection member 60 is provided in the space S between the mounting surface 34 of the exterior case 30B and the mounting object 50B so as to contact the hook-shaped portion 35B, the vibration and shock resistance is sufficiently improved when the capacitor 1B is mounted on the mounting object 50B, i.e., when the capacitor bank 100B is in the state where it is mounted.
  • the anchor effect described above increases the fastening strength between the hook-shaped portions 35B and the connecting members 60, so that even if not many connecting members 60 are provided, the capacitor 1B, and in particular the exterior case 30B, are sufficiently firmly fixed to the mounting object 50B. Therefore, in the capacitor bank 100B, as described above, the increased fastening strength between the hook-shaped portions 35B and the connecting members 60 contributes to reducing the amount of connecting members 60 used.
  • a space S is provided between the mounting surface 34 of the exterior case 30B and the mounting object 50B, but the space S does not have to be provided between the mounting surface 34 of the exterior case 30B and the mounting object 50B.
  • the hook-shaped portion 35B is hooked into the hole portion 51 of the mounting object 50B, so that the capacitor 1B, and in particular the exterior case 30B, is firmly fixed to the mounting object 50B.
  • connection member 60 such as an underfill adhesive is provided in the space S, but in addition to the connection member 60, a heat dissipation member such as a heat dissipation paste may also be provided in the space S.
  • the hook-shaped portion 35B is hooked into the hole 51 of the mounting object 50B, and thus the capacitor 1B, particularly the exterior case 30B, is firmly fixed to the mounting object 50B. Therefore, the space S does not need to be provided with a connection member 60 for further firmly fixing the exterior case 30B to the mounting object 50B, and a heat dissipation member may be provided instead of the connection member 60.
  • FIG. 12 is a schematic diagram showing an oblique view of the process of mounting a capacitor to an object during the manufacturing process of the capacitor bank shown in FIGS. 10 and 11.
  • the hook-shaped portion 35B of the exterior case 30B of the capacitor 1B may be inserted into the hole 51 of the mounting object 50B in the first direction D1 (see the arrow extending in the first direction D1 in Figure 12) and then slid in the second direction D2 (see the arrow extending in the second direction D2 in Figure 12) to mount the capacitor 1B on the mounting object 50B. This causes the hook-shaped portion 35B to be hooked into the hole 51 of the mounting object 50B as shown in Figures 10 and 11.
  • a connecting member 60 may be provided in advance on the mounting surface 34 of the exterior case 30B of the capacitor 1B so as to contact the hook-shaped portion 35B, and then the capacitor 1B may be mounted on the mounting object 50B.
  • connection members 60 may be provided in advance on the mounting object 50B and then the capacitor 1B may be mounted on the mounting object 50B, or the connection members 60 may be provided in advance on both the mounting surface 34 of the exterior case 30B and the mounting object 50B and then the capacitor 1B may be mounted on the mounting object 50B.
  • the connection members 60 may be provided in the space S provided between the mounting surface 34 of the exterior case 30B and the mounting object 50B.
  • FIG. 13 is a schematic diagram showing an example of a capacitor bank according to another embodiment of the present invention as viewed from the second outer surface side of the exterior case.
  • the exterior case 30C has a hook-shaped portion 35C.
  • the hook-shaped portion 35C protrudes in the first direction D1 from a portion of the mounting surface 34 of the exterior case 30C. More specifically, as shown in FIG. 13, a recess recessed in the first direction D1 is provided in a portion of the mounting surface 34 of the exterior case 30C. At the same time, the hook-shaped portion 35C extends from the bottom surface of the recess in the mounting surface 34 of the exterior case 30C so as to fit in the recess in the mounting surface 34 of the exterior case 30C in the first direction D1.
  • the hook-shaped portion 35C protrudes in the first direction D1 from a portion of the mounting surface 34 of the exterior case 30C (the bottom surface of the recess in the mounting surface 34), but does not protrude from another portion of the mounting surface 34 of the exterior case 30C (the surface other than the recess in the mounting surface 34).
  • the outer end of the hook-shaped portion 35C is located at the same height as the surface other than the recess on the mounting surface 34 of the exterior case 30C.
  • Capacitor bank 100C is similar to capacitor bank 100A except as described above.
  • FIG. 13 shows a state in which the outer end of the hook-shaped portion is located at the same height as the surface of the mounting surface of the exterior case other than the recess in the first direction, but the outer end of the hook-shaped portion may be located at a different height in the first direction than the surface of the mounting surface of the exterior case other than the recess.
  • FIG. 14 is a schematic diagram showing a modified example of the capacitor bank shown in FIG. 13 as viewed from the second outer surface side of the exterior case.
  • the exterior case 30D has a hook-shaped portion 35D.
  • the hook-shaped portion 35D protrudes beyond a portion of the mounting surface 34 of the exterior case 30D in the first direction D1.
  • the outer end of the hook-shaped portion 35D is located at a different height than the surfaces other than the recessed portion of the mounting surface 34 of the exterior case 30D. More specifically, as shown in FIG. 14, the entire hook-shaped portion 35D fits into the recessed portion of the mounting surface 34 of the exterior case 30D so as to be located at a height inside the surfaces other than the recessed portion of the mounting surface 34 of the exterior case 30D in the first direction D1.
  • the pull-out terminal protrudes from the entire mounting surface of the exterior case in the first direction, but the pull-out terminal may protrude from a portion of the mounting surface of the exterior case in the first direction, or may not protrude from the mounting surface of the exterior case.
  • an embodiment in which the pull-out terminal does not protrude from the mounting surface of the exterior case in the first direction includes an embodiment in which the surface of the pull-out terminal that abuts against the mounting object when mounting the capacitor on the mounting object is located at the same height as the mounting surface of the exterior case in the first direction.
  • the capacitor of the present invention can improve the vibration and shock resistance when mounted on an object, making it particularly useful as a smoothing capacitor for automotive applications where high vibration and shock resistance is required.
  • the capacitor bank of the present invention is capable of improving the vibration and shock resistance when the capacitor of the present invention is mounted on an object to be mounted, and is therefore useful for power conversion devices (e.g., inverters) for in-vehicle applications that require particularly high vibration and shock resistance.
  • power conversion devices e.g., inverters
  • a capacitor element having an element body and external electrodes provided on end faces of the element body; A lead terminal electrically connected to the external electrode; an exterior case in which the capacitor element is housed so that the lead-out terminal protrudes outward; a filling resin filled inside the exterior case so as to embed the capacitor element, an outer surface of the exterior case includes a mounting surface that faces the mounting object in a first direction when the lead-out terminal is electrically connected to the mounting object;
  • the capacitor is characterized in that the exterior case has a hook-shaped portion extending from the mounting surface.
  • ⁇ 6> The capacitor according to any one of ⁇ 1> to ⁇ 5>, wherein a tip of the hook-shaped portion faces a center of the mounting surface of the exterior case in a direction perpendicular to the first direction.
  • ⁇ 7> The capacitor according to any one of ⁇ 1> to ⁇ 6>, wherein a tip of the hook-shaped portion faces the lead-out terminal in a direction perpendicular to the first direction.
  • ⁇ 8> The capacitor according to any one of ⁇ 1> to ⁇ 7>, wherein the hook-shaped portion does not protrude from the outer case when viewed from the first direction.
  • a space is provided between the mounting surface of the exterior case and the mounting object, The capacitor bank according to ⁇ 9>, wherein a connecting member is provided in the space so as to contact the tip of the hook-shaped portion.
  • Reference Signs List 1A, 1B, 1C, 1D Capacitor 10 Capacitor element 11 Body 12a First external electrode 12b Second external electrode 13a First metallized film 13b Second metallized film 14a First dielectric film 14aa First main surface 14ab of first dielectric film Second main surface 14b of first dielectric film Second dielectric film 14ba First main surface 14bb of second dielectric film Second main surface 15a of second dielectric film First metal layer 15b Second metal layer 20a First lead terminal 20b Second lead terminal 30A, 30B, 30C, 30D Outer case 31 Opening 32 First outer surface 33 of outer case Second outer surface 34 of outer case Mounting surface 35Aa, 35Ab, 35Ac, 35B, 35C, 35D of outer case Hook-shaped portion 40 Filling resin 50A, 50B Mounting object 51 Hole 60 Connection members 100A, 100B, 100C, 100D Capacitor bank D1 First direction D2 Second direction D3 Third direction S Space

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2023/031701 2022-10-14 2023-08-31 コンデンサ、コンデンサバンク、及び、コンデンサ用外装ケース Ceased WO2024080021A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024551293A JP7816550B2 (ja) 2022-10-14 2023-08-31 コンデンサ、コンデンサバンク、及び、コンデンサ用外装ケース

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022165506 2022-10-14
JP2022-165506 2022-10-14

Publications (1)

Publication Number Publication Date
WO2024080021A1 true WO2024080021A1 (ja) 2024-04-18

Family

ID=90669528

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/031701 Ceased WO2024080021A1 (ja) 2022-10-14 2023-08-31 コンデンサ、コンデンサバンク、及び、コンデンサ用外装ケース

Country Status (2)

Country Link
JP (1) JP7816550B2 (https=)
WO (1) WO2024080021A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008010494A (ja) * 2006-06-27 2008-01-17 Nichicon Corp 電子部品
JP2014116444A (ja) * 2012-12-10 2014-06-26 Panasonic Corp ケースモールド型コンデンサ
JP2017005116A (ja) * 2015-06-10 2017-01-05 トヨタ自動車株式会社 部品ケースの固定構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008010494A (ja) * 2006-06-27 2008-01-17 Nichicon Corp 電子部品
JP2014116444A (ja) * 2012-12-10 2014-06-26 Panasonic Corp ケースモールド型コンデンサ
JP2017005116A (ja) * 2015-06-10 2017-01-05 トヨタ自動車株式会社 部品ケースの固定構造

Also Published As

Publication number Publication date
JPWO2024080021A1 (https=) 2024-04-18
JP7816550B2 (ja) 2026-02-18

Similar Documents

Publication Publication Date Title
US20250104912A1 (en) Capacitor, capacitor bank, and outer case for capacitor
CN1322633C (zh) 具有压入保持压配合端子的配线基板的电子设备
US6515844B1 (en) Electronic part
US8315031B2 (en) Case mold type capacitor
US10986741B2 (en) Electronic control device
CN100423370C (zh) 压配合端子及具有压入保持该压配合端子的配线基板的电子设备
JP7816550B2 (ja) コンデンサ、コンデンサバンク、及び、コンデンサ用外装ケース
WO2025047126A1 (ja) コンデンサモジュール
US11456117B2 (en) Capacitor
WO2025047029A1 (ja) コンデンサ
JP7698692B2 (ja) コンデンサ
US20210375532A1 (en) Coil component and electronic device
CN113963950A (zh) 一种电容器母排及电容器
WO2025047116A1 (ja) コンデンサモジュール
JP7839292B2 (ja) コンデンサ
EP2306798A1 (en) Transmission control apparatus and mechanically and electrically integrated type electronic control apparatus
WO2025100175A1 (ja) 電子部品実装構造、電子部品、及び、電子部品用外装ケース
JP2025153832A (ja) コンデンサモジュール
WO2024079967A1 (ja) コンデンサ
JP2026068220A (ja) コンデンサモジュール
JP2026068219A (ja) コンデンサモジュール
JP2026068221A (ja) コンデンサモジュール
JP2026068218A (ja) コンデンサモジュール
JP6082180B2 (ja) 車両用電子式モジュール
CN111463583B (zh) 具有焊接导体间的氰基丙烯酸酯胶层的电连接组件及方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23877029

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2024551293

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 23877029

Country of ref document: EP

Kind code of ref document: A1