WO2024078608A1 - 麦克风组件及电子设备 - Google Patents
麦克风组件及电子设备 Download PDFInfo
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- WO2024078608A1 WO2024078608A1 PCT/CN2023/124452 CN2023124452W WO2024078608A1 WO 2024078608 A1 WO2024078608 A1 WO 2024078608A1 CN 2023124452 W CN2023124452 W CN 2023124452W WO 2024078608 A1 WO2024078608 A1 WO 2024078608A1
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- diaphragm
- back plate
- microphone assembly
- fixedly connected
- air
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- 239000000758 substrate Substances 0.000 claims description 27
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 2
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 2
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
Definitions
- the embodiments of the present application relate to, but are not limited to, a microphone assembly and an electronic device.
- the microphone chip is sometimes subjected to large external air pressure shocks, and the diaphragm is greatly deformed under the force. Stress concentration occurs along the diaphragm's fixed support boundary, causing the diaphragm to rupture along the fixed support boundary and causing product failure. Therefore, corresponding air release structures are currently set for the diaphragm in the microphone assembly.
- an embodiment of the present application provides a microphone assembly, the microphone assembly comprising at least one diaphragm, a back plate arranged corresponding to the at least one diaphragm, and at least one air release column having one end fixedly connected to the back plate;
- an edge portion of the other end of the at least one air relief column is spaced apart from the diaphragm by a preset distance to form at least one air relief groove.
- the plurality of air release grooves divide the diaphragm into a deformation zone and a non-deformation zone, and the non-deformation zone is fixedly connected to the back plate;
- each of the air leakage grooves increases in a direction perpendicular to the thickness of the diaphragm, thereby increasing the amount of air leakage.
- the deformation zone is a middle area of the diaphragm
- the air relief grooves are evenly arranged in the circumferential direction of the diaphragm.
- the at least one deflation column comprises a main body portion and the edge portion;
- One end of the main body is fixedly connected to the back plate, and the other end is fixedly connected to the edge portion.
- the main body includes a bottom portion fixedly connected to the back plate and a A side portion is provided and connected to the bottom portion, and the bottom portion and the side portion form a cavity.
- the main body portion includes a top portion fixedly connected to the edge portion and a side portion arranged around the top portion and connected to the top portion;
- the side portion is fixedly connected to the back plate, and the side portion, the top portion and the back plate form a cavity;
- the at least one air release column further includes at least one support column located in the cavity and fixedly connected to the back plate, and the main body is coated on the outer surface of the support column.
- the back plate is provided with at least one sound hole corresponding to the at least one air leakage groove;
- the projection of the air relief groove partially overlaps with the corresponding projection of the sound hole.
- the air relief groove is a polygonal ring structure, and on a plane perpendicular to the thickness direction of the diaphragm, a projection of a portion of the edge area of the polygonal ring structure overlaps with the projection of the back pole plate, and a projection of another portion overlaps with the projection of the sound hole.
- an anti-sticking structure is provided on the surface of one side of the diaphragm close to the back plate.
- an anti-sticking structure is provided on the surface of the back plate on one side close to the diaphragm.
- the microphone assembly further comprises: a substrate, the substrate having a cavity penetrating the substrate in a thickness direction, the sound hole on the back plate being connected to the cavity, and the back plate being fixedly connected to a side surface of the substrate through at least one first support member;
- the back plate comprises a first insulating layer connected to the first support member, a conductive layer located on a surface of the first insulating layer away from the substrate, and a second insulating layer covering the first insulating layer and the conductive layer, wherein the second insulating layer is fixedly connected to the diaphragm through at least one second support member;
- the at least one air leakage column is fixedly connected to the back plate through the second insulating layer.
- the microphone assembly further comprises: a substrate, the substrate having a cavity penetrating the substrate in a thickness direction, the diaphragm being fixedly connected to a side surface of the substrate via at least one first support member, and the at least one air relief groove being in communication with the cavity;
- the back plate comprises a first insulating layer fixedly connected to the diaphragm through at least one second supporting member and a conductive layer located on a surface of the first insulating layer away from the diaphragm;
- the at least one air leakage column is fixedly connected to the back plate through the first insulating layer.
- an embodiment of the present application further provides an electronic device, wherein the electronic device comprises the microphone assembly described in any embodiment provided by the present invention.
- FIG1 is a schematic diagram of the structure of a microphone assembly provided in Embodiment 1 of the present application.
- FIG2 is a top view of a microphone assembly provided in Embodiment 1 of the present application.
- FIG3 is a schematic diagram of the structure of a microphone assembly provided in Embodiment 2 of the present application.
- FIG4 is a schematic diagram of the structure of a microphone assembly provided in Embodiment 3 of the present application.
- FIG5 is a schematic diagram of the structure of a microphone assembly provided in Embodiment 4 of the present application.
- air bleed structures There are two types of air bleed structures. One is to design a through hole on the diaphragm. When the diaphragm is subjected to a large impact force, the air pushed by the pressure will enter the back cavity of the package from the air bleed hole, increasing the air volume in the back cavity. The air bleed volume of this structure cannot be adjusted. When the pressure continues to act on the diaphragm, the air volume in the back cavity increases, and it is more difficult to compress the back cavity when the diaphragm is deformed, which is equivalent to the diaphragm stiffness becoming larger, reducing the stress concentration caused by the diaphragm deformation.
- the hole-shaped air bleed structure will cause a large change in the low-frequency sensitivity of the microphone, affecting the product signal-to-noise ratio; the other is to open an air bleed seam on the diaphragm, and corresponding to the position of the air bleed seam, the diaphragm has an air bleed structure that can swing up and down.
- the air bleed structure works at normal sound pressure, the air bleed structure is closed, and the low-frequency sensitivity changes little.
- the air bleed structure vibrates, and the air bleed volume can be adjusted.
- this air bleed structure may cause the diaphragm to tear when the sound pressure is high, thereby causing The entire product will fail.
- the present application discloses a microphone assembly and an electronic device, wherein the microphone assembly includes a diaphragm, a back plate arranged corresponding to the diaphragm, and at least one air leakage column fixedly connected to the back plate at one end; at least one air leakage groove corresponding to the at least one air leakage column is arranged on the diaphragm, and the other end of the air leakage column extends into the corresponding air leakage groove, and the air leakage groove and the corresponding air leakage column form an air leakage structure.
- the back plate is fixedly connected to the air leakage column, so that the strength of the air leakage column is higher than that of the diaphragm, and the connection strength with the back plate is higher, and when the air pressure of the gas introduced into the microphone assembly is large, the damage of the air leakage column will not affect the cracking of the diaphragm, thereby improving the reliability of the microphone assembly;
- only the corresponding air leakage groove is provided on the diaphragm, and the vibration of the diaphragm changes the distance between the air leakage groove and the air leakage column in the thickness direction of the diaphragm and in the thickness direction perpendicular to the diaphragm, so that as the air pressure of the gas introduced into the microphone assembly changes, the distance between the two changes, thereby changing the air leakage amount, and there is no need to provide an air leakage structure that can vibrate up and down on the diaphragm, thereby avoiding the tearing of the diaphragm when the air pressure of the
- this embodiment provides a microphone assembly, which includes a diaphragm 101, a back plate 102 arranged corresponding to the diaphragm 101, and at least one air release column 103 with one end fixedly connected to the back plate 102;
- an edge portion 1032 at the other end of at least one air relief column 103 is spaced apart from the diaphragm 101 by a preset distance to form at least one air relief groove 1011 .
- the air relief groove 1011 and the corresponding air relief column 103 form an air relief structure.
- the air pressure is too high, after the diaphragm 101 is deformed, the gas flows from the gap between the air relief groove 1011 and the corresponding air relief column 103 to the rear cavity, increasing the air volume of the rear cavity to balance the pressure of the front and rear cavities, thereby improving the mechanical reliability of the product.
- the back plate 102 is fixedly connected to the air leakage column 103, so that the strength of the air leakage column 103 is higher than that of the diaphragm 101, and the connection strength with the back plate 102 is higher, and when the air pressure of the gas introduced into the microphone assembly is large, the damage of the air leakage column 103 will not affect the cracking of the diaphragm 101, thereby improving the reliability of the microphone assembly;
- only the corresponding air leakage groove 1011 is provided on the diaphragm 101, and in the direction perpendicular to the thickness of the diaphragm 101, the vibration of the diaphragm 101 changes the air leakage groove
- the width of 1011 changes the amount of air leakage, and there is no need to set an air leakage structure that can vibrate up and down on the diaphragm 101, thereby avoiding the tearing of the diaphragm 101 when the air pressure of the gas introduced into the microphone assembly.
- a plurality of air release grooves 1011 divide the diaphragm 101 into a deformation area 1012 and a non-deformation area 1013 , and the non-deformation area 1013 is fixedly connected to the back plate 102 ;
- each air leakage groove 1011 increases in a direction perpendicular to the thickness of the diaphragm 101, thereby increasing the amount of air leakage.
- the multiple air leakage columns 103 and multiple corresponding air leakage grooves 1011 divide the diaphragm 101 into a deformation zone 1012 and a non-deformation zone 1013. Furthermore, the area surrounded by the multiple air leakage grooves 1011 is the deformation zone 1012. Thus, after the gas is introduced into the microphone assembly, the diaphragm 101 is deformed in the direction toward the back plate 102, and only the deformation zone 1012 is deformed.
- each air leakage groove 1011 increases in the thickness direction of the diaphragm 101 and in the direction perpendicular to the thickness of the diaphragm 101, thereby increasing the air leakage amount.
- the air leakage amounts of the multiple air leakage grooves 1011 can change with the air pressure of the gas introduced into the microphone assembly.
- the deformation zone 1012 is the middle area of the diaphragm 101;
- the air relief grooves 1011 are evenly arranged in the circumferential direction of the diaphragm 101 .
- the middle area of the diaphragm 101 is usually the area with the largest deformation amount. Therefore, the deformation zone 1012 is set to the middle area of the diaphragm 101, thereby improving the sensitivity of the microphone assembly.
- the air release grooves 1011 are evenly arranged in the circumferential direction of the diaphragm 101, so that the air release position of the diaphragm 101 is more uniform, avoiding the diaphragm 101 from cracking due to the large impact force on a certain area of the diaphragm 101 when the air pressure of the gas transmitted into the microphone assembly is large.
- At least one deflation column 103 includes a main body portion 1031 and an edge portion 1032;
- One end of the main body 1031 is fixedly connected to the back plate 102 , and the other end is fixedly connected to the edge portion 1032 .
- the edge portion 1032 is located in the corresponding air release groove 1011 and is spaced apart from the diaphragm 101 by a preset distance.
- each of the gas relief columns 103 includes a main body 1031 and an edge portion 1032. Furthermore, the edge portion 1032 is located in the corresponding gas relief groove 1011. The main body 1031 is located between the diaphragm 101 and the back plate 102. The edge portion 1032 is located in the corresponding gas relief groove 1011 and is spaced a preset distance from the diaphragm 101.
- the gas is introduced into the microphone assembly, the gas is discharged in the thickness direction and vertical direction of the diaphragm 101. In the thickness direction of the diaphragm 101 , the distances between the edge portions 1032 and the corresponding air release grooves 1011 are increased, thereby changing the amount of air entering the rear cavity.
- the main body 1031 includes a bottom 10311 fixedly connected to the back plate 102 and a side 10312 arranged around the bottom 10311 and connected to the bottom 10311 , and the bottom 10311 and the side 10312 form a cavity.
- the main body 1031 includes a bottom 10311 fixedly connected to the back plate 102 and a side portion (10312) arranged around the bottom 10311 and connected to the bottom 10311.
- the bottom 10311 and the side 10312 form a cavity, which reduces the weight of the deflated column 103, thereby reducing the pressure on the back plate 102.
- the other side of the cavity is a non-enclosed structure, so that when the gas pressure entering the microphone assembly is relatively high, the cavity can share part of the pressure, thereby avoiding a large impact force on the diaphragm 101 and causing damage to the diaphragm 101.
- the bottom 10311 and the side 10312 are formed of the same material and preparation process as the diaphragm 101.
- At least one sound hole 1021 corresponding to at least one air release groove 1011 is provided on the back plate 102;
- the projection of the air relief groove 1011 partially overlaps with the projection of the corresponding sound hole 1021 .
- the air vent groove 1011 is a polygonal ring structure. On a plane perpendicular to the thickness direction of the diaphragm 101 , a portion of the projection of the edge area of the polygonal ring structure overlaps with the projection of the back plate 102 , and another portion of the projection overlaps with the projection of the sound hole 1021 .
- each side of the air relief groove 1011 is arc-shaped, and the shape of the air relief groove 1011 is formed by six arcs.
- the specific shape of the air relief groove 1011 is not limited in this embodiment.
- an anti-sticking structure 104 is provided on the surface of one side of the diaphragm 101 close to the back plate 102 , and/or an anti-sticking structure 104 is provided on the surface of one side of the back plate 102 close to the diaphragm 101 .
- An anti-sticking structure 104 is provided, and the anti-sticking structure 104 can be provided on the surface of the side of the diaphragm 101 close to the back plate 102, or on the surface of the side of the back plate 102 close to the diaphragm 101, or on the surface of the side of the diaphragm 101 close to the back plate 102 and on the surface of the side of the back plate 102 close to the diaphragm 101.
- the anti-sticking structure 104 can be in various forms, for example, it can be a dot-shaped structure or a conical structure, which is not limited in this embodiment.
- the microphone assembly includes a substrate 105, the substrate 105 has a cavity 1051 penetrating the substrate 105 in the thickness direction, the sound hole 1021 on the back plate 102 is connected to the cavity, and the back plate 102 is fixedly connected to one side surface of the substrate 105 through the first support member 106;
- the back plate 102 includes a first insulating layer 1022 connected to the first support member 106 and a conductive layer 1023 located on a surface of the first insulating layer 1022 away from the substrate 105 ;
- the back plate 102 is provided with a covering conductive layer 1023 and a second insulating layer 1024 covering the first insulating layer 1022 and the conductive layer 1023, and the second insulating layer 1024 is fixedly connected to the diaphragm 101 through a second support member 107;
- At least one air leakage column 103 is fixedly connected to the back plate 102 through the second insulating layer 1024 .
- it is a forward sound structure, that is, after the gas is transmitted into the microphone assembly, it directly acts on the diaphragm 101, and then passes through the gap between the air relief groove 1011 and the air relief column 103 and enters the cavity 1051 through the sound hole 1021 on the back plate 102.
- the main body 1031 includes a top 10313 fixedly connected to the edge 1032 and a side 10312 arranged around the top 10313 and connected to the top 10313; the side 10312 is fixedly connected to the back plate 102, and the side 10312, the top 10313 and the back plate 102 form a cavity; at least one leak column 103 also includes a support column 1033 located in the cavity and fixedly connected to the back plate 102, the main body 1031 is coated on the outer surface of the support column 1033, and the main body 1031 supports it through the support column 1033, thereby improving the strength of the leak column 103 and avoiding the probability of the leak column 103 being ineffective. Furthermore, the top 10313 and the side 10312 are formed of the same material and preparation process as the diaphragm 101, and the support column 1033 and the second support member 107 are formed of the same material and preparation process.
- the microphone assembly includes a substrate 105, the substrate 105 has a cavity 1051 penetrating the substrate 105 in the thickness direction, the diaphragm 101 is fixedly connected to a side surface of the substrate 105 through a first support member 106, and at least one air relief groove 1011 is connected to the cavity;
- the back plate 102 includes a first insulating layer 1022 fixedly connected to the diaphragm 101 through a second support member 107 and a conductive layer 1023 located on a surface of the first insulating layer 1022 away from the diaphragm 101;
- At least one air leakage column 103 is fixedly connected to the back plate 102 through the first insulating layer 1022 .
- it is a rear-sound structure, that is, after the gas is transmitted into the microphone assembly and enters the cavity 1051, it directly acts on the diaphragm 101, and then passes through the gap between the air relief groove 1011 and the air relief column 103 and passes through the sound hole 1021 on the back plate 102.
- the main body 1031 includes a top 10313 fixedly connected to the edge 1032 and a side 10312 arranged around the top 10313 and connected to the top 10313; the side 10312 is fixedly connected to the back plate 102, and the side 10312, the top 10313 and the back plate 102 form a cavity; at least one leak column 103 also includes a support column 1033 located in the cavity and fixedly connected to the back plate 102, the main body 1031 is covered on the outer surface of the support column 1033, and the main body 1031 supports it through the support column 1033, thereby improving the strength of the leak column 103 and avoiding the probability of the leak column 103 being ineffective. Furthermore, the top 10313 and the side 10312 are formed of the same material and preparation process as the diaphragm 101, and the support column 1033 and the second support member 107 are formed of the same material and preparation process.
- Embodiment 1 please refer to the description of Embodiment 1 and Embodiment 3, and all the beneficial effects of Embodiment 1 can be achieved, which will not be repeated here.
- This embodiment provides an electronic device, including a microphone assembly as described in any one of Embodiments 1 to 4.
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Abstract
一种麦克风组件及电子设备，麦克风组件包括至少一个振膜(101)，与振膜(101)对应设置的背极板(102)以及一端与背极板(102)固定连接的至少一个泄气柱(103)；在垂直于振膜(101)的厚度方向上，至少一个泄气柱(103)的另一端的边缘部(1032)与振膜(101)间隔预设距离从而形成至少一个泄气槽(1011)。
Description
本申请要求于2022年10月13日提交中国专利局、申请号为202222701591.8、发明名称为“麦克风组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
本申请实施例涉及但不限于一种麦克风组件及电子设备。
麦克风芯片在封装和使用过程中有时会遭受到外界大的气压冲击，振膜受力发生大的变形，沿着振膜固支边界会有应力集中，导致振膜沿着固支边界破裂，引起产品失效，由此，目前在麦克风组件中均对振膜设置了对应的泄气结构。
第一方面，本申请的实施例提供一种麦克风组件，所述麦克风组件包括至少一个振膜，与所述至少一个振膜对应设置的背极板以及一端与所述背极板固定连接的至少一个泄气柱；
在垂直于所述振膜的厚度方向上，所述至少一个泄气柱的另一端的边缘部与所述振膜间隔预设距离从而形成至少一个泄气槽。
可选的，所述泄气柱以及所述泄气槽均为多个；
多个所述泄气槽将所述振膜分为变形区以及非变形区，所述非变形区与背极板固定连接；
在所述变形区发生形变时，在垂直于所述振膜的厚度方向上，每一所述泄气槽的宽度增大从而增大泄气量。
可选的，所述变形区为所述振膜的中间区域；
所述泄气槽在所述振膜的周向上均匀排布。
可选的，所述至少一个泄气柱包括主体部以及所述边缘部；
所述主体部的一端与所述背极板固定连接，另一端与所述边缘部固定连接。
可选的，所述主体部包括与所述背极板固定连接的底部以及环绕所述底部
设置的且与所述底部连接的侧部，所述底部与所述侧部形成空腔。
可选的，所述主体部包括与所述边缘部固定连接的顶部以及环绕所述顶部设置的且与所述顶部连接的侧部；
所述侧部与所述背极板固定连接，并且所述侧部、所述顶部与背极板形成空腔；
所述至少一个泄气柱还包括位于所述空腔内且与所述背极板固定连接的至少一个支撑柱，所述主体部包覆在所述支撑柱的外表面。
可选的，所述背极板上设置有与所述至少一个泄气槽对应的至少一个声孔；
在垂直于所述振膜的厚度方向的平面上，所述泄气槽的投影与对应的所述声孔的投影部分重叠。
可选的，其中所述泄气槽为多边形环状结构，在垂直于所述振膜的厚度方向的平面上，所述多边形环状结构的边缘区域的其中一部分的投影与所述背极板的投影重叠，另一部分的投影与所述声孔的投影重叠。
可选的，所述振膜的靠近所述背极板的一侧表面上设置有防粘结构。
可选的，所述背极板的靠近所述振膜的一侧表面上设置有防粘结构。
可选的，所述的麦克风组件还包括：基底，所述基底具有在厚度方向上贯穿所述基底的腔体，所述背极板上的声孔与所述腔体连通，所述背极板通过至少一个第一支撑件与所述基底的一侧表面固定连接；
所述背极板包括与所述第一支撑件连接的第一绝缘层、位于所述第一绝缘层的远离所述基底的一侧表面上的导电层以及覆盖在所述第一绝缘层和所述导电层上的第二绝缘层，所述第二绝缘层通过至少一个第二支撑件与所述振膜固定连接；
其中，所述至少一个泄气柱通过所述第二绝缘层与所述背极板固定连接。
可选的，所述的麦克风组件还包括：基底，所述基底具有在厚度方向上贯穿所述基底的腔体，所述振膜通过至少一个第一支撑件与所述基底的一侧表面固定连接，所述至少一个泄气槽与所述腔体连通；
所述背极板包括通过至少一个第二支撑件与振膜固定连接的第一绝缘层以及位于所述第一绝缘层的远离所述振膜一侧的表面的导电层；
其中，所述至少一个泄气柱通过所述第一绝缘层与所述背极板固定连接。
第二方面，本申请的实施例还提供一种电子设备，所述电子设备包括本发明提供的任意一实施例所述的麦克风组件。
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例一提供的麦克风组件的结构示意图；
图2为本申请实施例一提供的麦克风组件的俯视图；
图3为本申请实施例二提供的麦克风组件的结构示意图；
图4为本申请实施例三提供的麦克风组件的结构示意图；
图5为本申请实施例四提供的麦克风组件的结构示意图。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
泄气结构包括两种，一种是在振膜上设计出通孔，当振膜承受大的冲击力时，被压力推动的空气会从泄气孔中进入到封装体的后腔，使得后腔中的空气体积增大，这种结构的泄气量无法调整，当压力持续作用在振膜上时，由于后腔的空气体积增大，振膜变形时对后腔压缩更加困难，相当于振膜刚度变大，减少了振膜变形引起的应力集中，孔状的泄气结构会导致麦克风低频灵敏度变化大，影响产品信噪比；另一种是在振膜上开设泄气缝，并且对应于泄气缝的位置，振膜上具有可以上下摆动的泄气结构，当振膜在正常声压工作时，泄气结构闭合，低频灵敏度变化小，当芯片受到大的冲击力时，泄气结构振动，能够调节泄气量，但是这种泄气结构可能会在声压较大时导致振膜撕裂，进而使
得整个产品失效。
本申请公开了一种麦克风组件及电子设备，其中麦克风组件包括振膜，与振膜对应设置的背极板以及一端与背极板固定连接的至少一个泄气柱；振膜上设置有与至少一个泄气柱对应的至少一个泄气槽，泄气柱的另一端延伸至对应的泄气槽内，泄气槽与对应的泄气柱组成了泄气结构，一方面，背极板与泄气柱固定连接由此，泄气柱的强度比振膜高，并且与背极板的连接强度更高，并且传入麦克风组件中的气体的气压较大时，泄气柱的损坏不会影响到振膜的开裂，从而提高了麦克风组件的可靠性；另一方面，振膜上只开设相应的泄气槽即可，在振膜的厚度方向以及垂直于振膜的厚度方向上，振膜的振动改变了泄气槽与泄气柱之间的间距，从而随着传入麦克风组件中的气体的气压的改变，二者之间的间距改变，从而改变了泄气量，并且无需在振膜上设置可以上下振动的泄气结构，避免了在传入麦克风组件中的气体的气压时，振膜的撕裂。
下面将结合附图以及具体实施例对本申请中的压力传感结构及电子设备做详细阐述。
实施例一
如图1所示，本实施例提供一种麦克风组件，该麦克风组件包括振膜101，与振膜101对应设置的背极板102以及一端与背极板102固定连接的至少一个泄气柱103；
在垂直于振膜101的厚度方向上，至少一个泄气柱103的另一端的边缘部1032与振膜101间隔预设距离从而形成至少一个泄气槽1011。
在本实施例中，泄气槽1011与对应的泄气柱103组成了泄气结构，当气压过大时，振膜101变形后，气体从泄气槽1011和对应的泄气柱103之间的缝隙流到后腔，增加后腔的空气体积，来平衡前后腔的压力，来提高产品的机械可靠性。
在本实施例中，一方面，背极板102与泄气柱103固定连接由此，泄气柱103的强度比振膜101高，并且与背极板102的连接强度更高，并且传入麦克风组件中的气体的气压较大时，泄气柱103的损坏不会影响到振膜101的开裂，从而提高了麦克风组件的可靠性；另一方面，振膜101上只开设相应的泄气槽1011即可，在垂直于振膜101的厚度方向上，振膜101的振动改变了泄气槽
1011的宽度，从而改变了泄气量，并且无需在振膜101上设置可以上下振动的泄气结构，避免了在传入麦克风组件中的气体的气压时，振膜101的撕裂。
进一步地，泄气柱103以及泄气槽1011均为多个；
多个泄气槽1011将振膜101分为变形区1012以及非变形区1013，非变形区1013与背极板102固定连接；
变形区1012在发生形变时，在垂直于振膜101的厚度方向上，每一泄气槽1011的宽度增大从而增大泄气量。
在本实施例中，如图1所示，泄气柱103的数量为多个，同时对应的泄气槽1011的数量均为多个，多个泄气槽1011将振膜101分为变形区1012以及非变形区1013，进一步地，由多个泄气槽1011环绕的区域为变形区1012，由此，在气体传入到麦克风组件后，振膜101朝向背极板102的方向发生形变，并且只有变形区1012发生形变，变形区1012在发生形变时，在振膜101的厚度方向以及垂直于振膜101的厚度方向上，每一泄气槽1011的宽度增大从而增大泄气量，从而使得多个泄气槽1011的泄气量均可以随着传入到麦克风组件的气体的气压改变。
进一步地，变形区1012为振膜101的中间区域；
泄气槽1011在振膜101的周向上均匀排布。
在本实施例中，振膜101的中间区域通常为形变量较大的区域，因此，变形区1012设置为振膜101的中间区域，从而提高了麦克风组件的灵敏度，并且，泄气槽1011在振膜101的周向上均匀排布，使得振膜101的泄气位置更加均匀，避免传入麦克风组件的气体的气压较大时对振膜101的某一区域的冲击力较大导致的振膜101开裂。
进一步地，至少一个泄气柱103包括主体部1031以及边缘部1032；
主体部1031的一端与背极板102固定连接，另一端与边缘部1032固定连接，边缘部1032位于对应的泄气槽1011内并与振膜101间隔预设距离。
在本实施例中，每一个泄气柱103均包括主体部1031以及边缘部1032，进一步地，边缘部1032位于对应的泄气槽1011内，主体部1031位于振膜101与背极板102之间，边缘部1032位于对应的泄气槽1011内并与振膜101间隔预设距离，并且当气体传入到麦克风组件后，在振膜101的厚度方向以及垂直
于振膜101的厚度方向上，边缘部1032位于对应的泄气槽1011之间的距离均增大，从而改变进入后腔的进气量。
进一步地，主体部1031包括与背极板102固定连接的底部10311以及环绕底部10311设置的且与底部10311连接的侧部10312，底部10311与侧部10312形成空腔。
在本实施例中，主体部1031包括与背极板102固定连接的底部10311以及环绕底部10311设置的且与底部10311连接的侧部(10312)，底部10311与侧部10312形成空腔，减轻了泄气柱103的重量，从而减少了对背极板102的压力，空腔的另一侧为非封闭结构，从而在传入麦克风组件的气体的气压较大了，空腔能够分担一部分气压，避免对振膜101造成较大的冲击力从而导致的振膜101的损坏。进一步地，底部10311与侧部10312与振膜101采用相同的材料以及制备工艺形成。
进一步地，背极板102上设置有与至少一个泄气槽1011对应的至少一个声孔1021；
在垂直于振膜101的厚度方向的平面上，泄气槽1011的投影与对应的声孔1021的投影部分重叠。
进一步地，泄气槽1011为多边形环状结构，在垂直于振膜101的厚度方向的平面上，多边形环状结构的边缘区域的其中一部分的投影与背极板102的投影重叠，另一部分的投影与声孔1021的投影重叠。
在本实施例中，如图1所示，当振膜101在大声压下变形时，振膜101的变形区1012对应的泄气槽1011的边缘，一部分和声孔1021接触，一部分和背极板102接触，这样相比于圆形规则的边界，当气压较大使得振膜101的变形区1012出现较大形变时，振膜101的泄气槽1011边界没有完全覆盖住声孔1021，仍可通过声孔1021来平衡前后腔的声压，降低产品失效率。
示例性地，如图2所示，泄气槽1011为的每条边均为弧形，通过六个弧形组成了泄气槽1011的形状，本实施例对此泄气槽1011的具体形状不做限定。
进一步地，振膜101的靠近背极板102的一侧表面上设置有防粘结构104，和/或，背极板102的靠近振膜101的一侧表面上设置有防粘结构104。
在本实施例中，为了避免振膜101与背极板102的接触导致的产品失效，
设置了防粘结构104，防粘结构104既可以设置在振膜101的靠近背极板102的一侧表面上，也可以设置在背极板102的靠近振膜101的一侧表面上，还可以设置在振膜101的靠近背极板102的一侧表面上和背极板102的靠近振膜101的一侧表面上。防粘结构104的形式可以有多种，示例性地，可以为点状结构，还可以为锥形结构，本实施例对此不做限定。
进一步地，麦克风组件包括基底105，基底105具有在厚度方向上贯穿基底105的腔体1051，背极板102上的声孔1021与腔体连通，背极板102通过第一支撑件106与基底105的一侧表面固定连接；
背极板102包括与第一支撑件106连接的第一绝缘层1022以及位于第一绝缘层1022的远离基底105的一侧表面上的导电层1023；
背极板102上设置有覆盖导电层1023以及覆盖在第一绝缘层1022和导电层1023上的第二绝缘层1024，第二绝缘层1024通过第二支撑件107与振膜101固定连接；
其中，至少一个泄气柱103通过第二绝缘层1024与背极板102固定连接。
在本实施例中，为前进音结构，也即是，气体传入到麦克风组件后直接作用到振膜101上，而后穿过泄气槽1011与泄气柱103之间的缝隙后通过背极板102上的声孔1021进入到腔体1051内。
实施例二
与实施例一不同的是，如图3所示，主体部1031包括与边缘部1032固定连接的顶部10313以及环绕所述顶部10313设置的且与所述顶部10313连接的侧部10312；侧部10312与背极板102固定连接，并且侧部10312、顶部10313与背极板102形成空腔；至少一个泄气柱103还包括位于空腔内且与背极板102固定连接的支撑柱1033，所述主体部1031包覆在支撑柱1033的外表面，主体部1031通过支撑柱1033对其进行支撑，从而提高了泄气柱103的强度，避免泄气柱103的效概率。进一步地，顶部10313与侧部10312与振膜101采用相同的材料以及制备工艺形成，支撑柱1033与第二支撑件107采用相同的材料以及制备工艺形成。
本实施例的其他技术细节参见实施例一的描述，并且能够实现实施例一的全部有益效果，在此不再赘述。
实施例三
与实施例一不同的是，如图4所示，在本实施例中麦克风组件包括基底105，基底105具有在厚度方向上贯穿基底105的腔体1051，振膜101通过第一支撑件106与基底105的一侧表面固定连接，至少一个泄气槽1011与腔体连通；
背极板102包括通过第二支撑件107与振膜101固定连接的第一绝缘层1022以及位于第一绝缘层1022的远离振膜101一侧的表面的导电层1023；
其中，至少一个泄气柱103通过第一绝缘层1022与背极板102固定连接。
在本实施例中，为后进音结构，也即是，气体传入到麦克风组件后，进入到腔体1051后，直接作用到振膜101上，而后穿过泄气槽1011与泄气柱103之间的缝隙后通过背极板102上的声孔1021。
本实施例的其他技术细节参见实施例一的描述，并且能够实现实施例一的全部有益效果，在此不再赘述。
实施例四
与实施例三不同的是，如图5所示，主体部1031包括与边缘部1032固定连接的顶部10313以及环绕所述顶部10313设置的且与所述顶部10313连接的侧部10312；侧部10312与背极板102固定连接，并且侧部10312、顶部10313与背极板102形成空腔；至少一个泄气柱103还包括位于空腔内且与背极板102固定连接的支撑柱1033，所述主体部1031包覆在所述支撑柱1033的外表面，主体部1031通过支撑柱1033对其进行支撑，从而提高了泄气柱103的强度，避免泄气柱103的效概率。进一步地，顶部10313与侧部10312与振膜101采用相同的材料以及制备工艺形成，支撑柱1033与第二支撑件107采用相同的材料以及制备工艺形成。
本实施例的其他技术细节参见实施例一以及实施例三的描述，并且能够实现实施例一的全部有益效果，在此不再赘述。
实施例五
本实施例提供一种电子设备，包括如实施例一至实施例四中任一实施例的麦克风组件。
以上对本申请实施例所提供的压力传感结构及电子设备进行了详细介绍，
本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。
上文仅为本发明的较佳实施例而已，并非用来限定本发明实施的范围，凡依本发明权利要求范围所述的形状、构造、特征及精神所为的均等变化与修饰，均应包括于本发明的权利要求范围内。
Claims (13)
- 一种麦克风组件，其中，所述麦克风组件包括：至少一个振膜，与所述至少一个振膜对应设置的背极板以及一端与所述背极板固定连接的至少一个泄气柱；在垂直于所述振膜的厚度方向上，所述至少一个泄气柱的另一端的边缘部与所述振膜间隔预设距离从而形成至少一个泄气槽。
- 如权利要求1所述的麦克风组件，其中，所述泄气柱以及所述泄气槽均为多个；多个所述泄气槽将所述振膜分为变形区以及非变形区，所述非变形区与背极板固定连接；在所述变形区发生形变时，在垂直于所述振膜的厚度方向上，每一所述泄气槽的宽度增大从而增大泄气量。
- 如权利要求2所述的麦克风组件，其中，所述变形区为所述振膜的中间区域；所述泄气槽在所述振膜的周向上均匀排布。
- 如权利要求1所述的麦克风组件，其中，所述至少一个泄气柱包括主体部以及所述边缘部；所述主体部的一端与所述背极板固定连接，另一端与所述边缘部固定连接。
- 如权利要求4所述的麦克风组件，其中，所述主体部包括与所述背极板固定连接的底部以及环绕所述底部设置的且与所述底部连接的侧部，所述底部与所述侧部形成空腔。
- 如权利要求4所述的麦克风组件，其中，所述主体部包括与所述边缘部固定连接的顶部以及环绕所述顶部设置的且与所述顶部连接的侧部；所述侧部与所述背极板固定连接，并且所述侧部、所述顶部与背极板形成空腔；所述至少一个泄气柱还包括位于所述空腔内且与所述背极板固定连接的至少一个支撑柱，所述主体部包覆在所述支撑柱的外表面。
- 如权利要求1至6项中任一项所述的麦克风组件，其中，所述背极板上设置有与所述至少一个泄气槽对应的至少一个声孔；在垂直于所述振膜的厚度方向的平面上，所述泄气槽的投影与对应的所述声孔的投影部分重叠。
- 如权利要求7所述的麦克风组件，其中，所述泄气槽为多边形环状结构，在垂直于所述振膜的厚度方向的平面上，所述多边形环状结构的边缘区域的其中一部分的投影与所述背极板的投影重叠，另一部分的投影与所述声孔的投影重叠。
- 如权利要求1至8项中任一项所述的麦克风组件，其中，所述振膜的靠近所述背极板的一侧表面上设置有防粘结构。
- 如权利要求1至9中任一项所述的麦克风组件，其中，所述背极板的靠近所述振膜的一侧表面上设置有防粘结构。
- 如权利要求1至10中任一项所述的麦克风组件，其中，所述麦克风组件还包括：基底，所述基底具有在厚度方向上贯穿所述基底的腔体，所述背极板上的声孔与所述腔体连通，所述背极板通过至少一个第一支撑件与所述基底的一侧表面固定连接；所述背极板包括与所述第一支撑件连接的第一绝缘层、位于所述第一绝缘层的远离所述基底的一侧表面上的导电层以及覆盖在所述第一绝缘层和所述导电层上的第二绝缘层，所述第二绝缘层通过至少一个第二支撑件与所述振膜固定连接；其中，所述至少一个泄气柱通过所述第二绝缘层与所述背极板固定连接。
- 如权利要求1至10中任一项所述的麦克风组件，其中，所述麦克风组件还包括：基底，所述基底具有在厚度方向上贯穿所述基底的腔体，所述振膜通过至少一个第一支撑件与所述基底的一侧表面固定连接，所述至少一个泄气槽与所述腔体连通；所述背极板包括通过至少一个第二支撑件与振膜固定连接的第一绝缘层以及位于所述第一绝缘层的远离所述振膜一侧的表面的导电层；其中，所述至少一个泄气柱通过所述第一绝缘层与所述背极板固定连接。
- 一种电子设备，其中，所述电子设备包括如权利要求1至12中任一项所述的麦克风组件。
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| CN209218393U (zh) * | 2018-09-26 | 2019-08-06 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
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| CN215529301U (zh) * | 2021-04-25 | 2022-01-14 | 瑞声声学科技(深圳)有限公司 | 一种电容式mems麦克风 |
| US11259106B1 (en) * | 2020-11-06 | 2022-02-22 | Fortemedia, Inc. | Mems device with dynamic valve layer |
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| US20220182769A1 (en) * | 2020-12-07 | 2022-06-09 | Db Hitek Co., Ltd. | Mems microphone and method of manufacturing the same |
| CN218217616U (zh) * | 2022-10-13 | 2023-01-03 | 苏州敏芯微电子技术股份有限公司 | 麦克风组件及电子设备 |
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| CN209218393U (zh) * | 2018-09-26 | 2019-08-06 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
| US11259106B1 (en) * | 2020-11-06 | 2022-02-22 | Fortemedia, Inc. | Mems device with dynamic valve layer |
| US20220182769A1 (en) * | 2020-12-07 | 2022-06-09 | Db Hitek Co., Ltd. | Mems microphone and method of manufacturing the same |
| CN112995869A (zh) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | Mems芯片及其制作方法、mems麦克风模组和电子设备 |
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| CN218217616U (zh) * | 2022-10-13 | 2023-01-03 | 苏州敏芯微电子技术股份有限公司 | 麦克风组件及电子设备 |
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