WO2024067316A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2024067316A1
WO2024067316A1 PCT/CN2023/120192 CN2023120192W WO2024067316A1 WO 2024067316 A1 WO2024067316 A1 WO 2024067316A1 CN 2023120192 W CN2023120192 W CN 2023120192W WO 2024067316 A1 WO2024067316 A1 WO 2024067316A1
Authority
WO
WIPO (PCT)
Prior art keywords
branch
circuit board
radiator
electronic device
metal structure
Prior art date
Application number
PCT/CN2023/120192
Other languages
English (en)
French (fr)
Inventor
秦江弘
李肖峰
张琛
吴方彪
王钊
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024067316A1 publication Critical patent/WO2024067316A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the embodiments of the present application relate to the field of terminal technology, and in particular to an electronic device.
  • a cavity antenna can be formed in the electronic device.
  • a heat sink is arranged above the printed circuit board (PCB), and a radio frequency coupling probe is arranged above the PCB board near the inside of the heat sink.
  • a plane is arranged on the surface of the heat sink, and a horizontal part is arranged inside the heat sink near the top of the radio frequency coupling probe, and a curved groove is arranged inside the plane.
  • the heat sink is transformed into a radiating part of the antenna by capacitive coupling, and dual-band resonance is achieved through the coupling gap, so that radiation and heat dissipation are combined into one, which not only meets the performance requirements of the antenna, but also solves the heat dissipation of the electronic device.
  • the antenna structure occupies a large space in the electronic device, which easily affects the layout of other components in the electronic device.
  • An embodiment of the present application provides an electronic device, which can reduce the space occupied by an antenna structure in the electronic device, thereby avoiding interference or influence on the layout of other devices in the electronic device.
  • An embodiment of the present application provides an electronic device, the electronic device at least comprising: a circuit board and a first metal structure; the first metal structure is stacked and spaced with the circuit board; the outer edge of the circuit board is provided with a clearance area facing the inside of the circuit board; and further comprising: a first radiator, the first radiator is located in the clearance area, one end of the first radiator is electrically connected to a first feeding point on the circuit board, and the other end of the first radiator is suspended in the clearance area;
  • It also includes: a second metal structural member; the second metal structural member is located at the outer periphery of the first metal structural member, and at least part of the positive projection of the second metal structural member toward the circuit board is located in the clearance area; one end of the second metal structural member is electrically connected to the first metal structural member, and the other end of the second metal structural member and the first radiator have a first coupling gap in the thickness direction of the circuit board.
  • An electronic device in which a first metal structure is stacked and spaced with a circuit board, a clearance area facing the inside of the circuit board is provided on the outer edge of the circuit board, and a first radiator is provided in the clearance area of the circuit board, one end of the first radiator is electrically connected to a first feeding point on the circuit board, and the other end of the first radiator is suspended in the clearance area, and in addition, a second metal structure is provided on the periphery of the first metal structure, one end of the second metal structure is electrically connected to the first metal structure, and the other end of the second metal structure and the first radiator have a coupling gap in the thickness direction of the circuit board, so that the current on the first radiator is coupled to the second metal structure.
  • the embodiment of the present application utilizes the space on the circuit board to design the antenna (i.e., the first radiator), and the first radiator and the second metal structure generate radiation through gap coupling, which can reduce the space occupied by the antenna structure in the electronic device, and thus can avoid interference or influence on the layout of other devices in the electronic device.
  • an orthographic projection of the first metal structure onto the circuit board is staggered with the clearance area.
  • the clearance area on the circuit board By designing the clearance area on the circuit board to be staggered relative to the orthographic projection of the first metal structure onto the circuit board, It is possible to avoid the formation of a cavity antenna between the antenna in the clearance area and the first metal structure.
  • the distance between the clearance area on the circuit board and the orthographic projection of the first metal structure on the circuit board it is possible to avoid the distance between the clearance area on the circuit board and the orthographic projection of the first metal structure on the circuit board being too large, thereby causing loss or waste of space on the circuit board, thereby avoiding loss and waste of space in the electronic device.
  • the second metal structure includes: a longitudinal branch and a first transverse branch extending on a first plane, and the first plane is perpendicular to the thickness direction of the circuit board; wherein, one end of the longitudinal branch extending on the first plane is electrically connected to the first metal structure, and the other end of the longitudinal branch extending on the first plane is connected to the first transverse branch, and the first transverse branch and the first radiator form the first coupling gap in the thickness direction of the circuit board.
  • it also includes: a second radiator; the second radiator is located in the clearance area, and one end of the second radiator is electrically connected to the second feeding point on the circuit board, and the other end of the second radiator is suspended in the clearance area; the first radiator and the second radiator are spaced apart in the clearance area along the length extension direction of the first lateral branch, and the length extension direction of the first lateral branch is the length extension direction of the positive projection of the first lateral branch on the circuit board.
  • the second metal structure also includes: a second transverse branch; the orthographic projections of the first transverse branch and the second transverse branch on the circuit board are respectively located on both sides of the orthographic projection of the longitudinal branch on the circuit board; the second transverse branch and the second radiator have a second coupling gap in the thickness direction of the circuit board.
  • a second coupling gap can be formed with the second radiator in the thickness direction of the circuit board, thereby ensuring that radiation is generated by coupling between the second transverse branch and the second radiator.
  • the longitudinal branch and the first transverse branch both extend in the thickness direction of the circuit board. For example, they extend to a certain height in the thickness direction of the circuit board to achieve radiation performance requirements such as radiation efficiency and bandwidth.
  • the second transverse branch extends in the thickness direction of the circuit board.
  • it extends to a certain height in the thickness direction of the circuit board to achieve radiation performance requirements such as radiation efficiency and bandwidth. It should be understood that extending in the thickness direction of the circuit board does not mean that the thickness direction of the branch is completely consistent with the thickness direction of the circuit board, but means that the thickness direction of the branch is within a certain acute angle range with the thickness direction of the circuit board, such as within 45 degrees.
  • it also includes: a blocking branch, one end of which is located in the clearance area, and the blocking branch extends between the first radiator and the second radiator, the other end of the blocking branch is grounded through the circuit board, and the blocking branch is spaced from the first radiator and the second radiator respectively.
  • the first radiator and the second radiator can be isolated from each other, avoiding or reducing the mutual interference between the radiation effect of the first radiator and the radiation effect of the second radiator.
  • the blocking branch is electrically connected to the circuit board, so that the grounding of the blocking branch can be achieved.
  • the barrier branch and the longitudinal branch are opposite to each other in the thickness direction of the circuit board with a gap therebetween, and the longitudinal branch and the barrier branch are electrically connected via a conductive structure.
  • the barrier branch nodes are electrically connected to the longitudinal branch nodes via the conductive structure, so that the barrier branch nodes can be electrically connected to the second metal structure.
  • the first radiator includes at least: a first radiating branch; one end of the first radiating branch is electrically connected to the first feeding point, and the other end of the first radiating branch is suspended in the clearance area; and the first coupling gap is formed between the first lateral branch and the first radiating branch.
  • the first radiator By designing the first radiator to include a first radiating branch, a first feeding point is set on the circuit board, the first radiating branch is electrically connected to the first feeding point, and the first feeding point can feed the first radiating branch.
  • a first coupling gap is formed between the first lateral branch and the first radiating branch, which can ensure that radiation is generated through coupling between the first radiating branch and the first lateral branch of the second metal structure.
  • the first radiator also includes: a second radiating branch coupled to the first radiating branch; one end of the second radiating branch is grounded through the circuit board, and the other end of the second radiating branch is suspended in the clearance area; and the first coupling gap is formed between the first lateral branch and at least one of the first radiating branch and the second radiating branch, and a third coupling gap is formed between the first radiating branch and the second radiating branch.
  • the first radiator is designed to include a first radiating branch and a second radiating branch coupled to each other, a first feeding point is arranged on the circuit board, the first radiating branch is electrically connected to the first feeding point, the first feeding point can feed the first radiating branch, and the first lateral branch
  • a first coupling gap is formed between the node and at least one of the first radiation branch node or the second radiation branch node, which can ensure that radiation is generated through coupling between the first lateral branch node of the second metal structure and at least one of the first radiation branch node or the second radiation branch node.
  • a third coupling gap is formed between the first radiation branch and the second radiation branch, which can ensure that radiation is generated by coupling between the first radiation branch and the second radiation branch.
  • the second radiator includes: a third radiating branch; one end of the third radiating branch is electrically connected to the second feeding point, and the other end of the third radiating branch is suspended in the clearance area; and the second coupling gap is formed between the second lateral branch and the third radiating branch.
  • the second radiator By designing the second radiator to include a third radiating branch, a second feeding point is set on the circuit board, the third radiating branch is electrically connected to the second feeding point, and the second feeding point can feed the third radiating branch.
  • a second coupling gap is formed between the second lateral branch and the third radiating branch, which can ensure that radiation is generated through coupling between the third radiating branch and the second lateral branch of the second metal structure.
  • the second radiator also includes: a fourth radiating branch coupled to the third radiating branch; one end of the fourth radiating branch is grounded through the circuit board, and the other end of the fourth radiating branch is suspended in the clearance area; and the second coupling gap is formed between the second lateral branch and at least one of the third radiating branch and the fourth radiating branch.
  • the second radiator By designing the second radiator to include a third radiating branch and a fourth radiating branch that are coupled to each other, a second feeding point is set on the circuit board, the third radiating branch is electrically connected to the second feeding point, and the second feeding point can feed the third radiating branch.
  • a second coupling gap is formed between the second lateral branch and at least one of the third radiating branch or the fourth radiating branch, which can ensure that radiation is generated through coupling between the second lateral branch of the second metal structure and at least one of the third radiating branch or the fourth radiating branch.
  • a fourth coupling gap is formed between the third radiation branch and the fourth radiation branch.
  • the height of the longitudinal branch in the thickness direction of the circuit board is less than or equal to ⁇ /4, where ⁇ is the wavelength corresponding to the center frequency of the minimum resonant frequency band.
  • the transverse branch is higher than the first metal structure in the thickness direction of the circuit board.
  • the second metal structure can further dissipate heat on the basis of the heat dissipation of the first metal structure.
  • the length of the second transverse branch is greater than the length of the first transverse branch.
  • the frequencies corresponding to the first transverse branch and the second transverse branch can be different, so as to cover different frequency bands of the antenna, thereby stimulating more performance of the antenna.
  • the length of the first transverse branch and the second transverse branch can be regarded as the length of the positive projection on the circuit board.
  • the width of the clearance area in the first direction is greater than or equal to 3 mm; wherein the first direction is the direction of the length extension of the longitudinal branch, and the length extension direction of the longitudinal branch is the length extension direction of the orthographic projection of the longitudinal branch on the circuit board.
  • it also includes: electronic components; the electronic components are located between the circuit board and the first metal structure; a recessed sink is provided on the side of the first metal structure facing the circuit board, and the electronic components are in contact with a side of the sink facing the circuit board.
  • the electronic component By providing a sinking platform recessed toward the circuit board on the first metal structure, the electronic component contacts a surface of the sinking platform facing the circuit board, thereby shortening the electrical connection path between the electronic component and the first metal structure.
  • it further includes: a shielding frame; the shielding frame is located at the periphery of the electronic component to separate the electronic component from the at least one antenna; and the shielding frame is connected to the first metal structure on a side facing the first metal structure.
  • the shielding frame can separate the electronic components from the antenna structure, thereby preventing the electronic components from affecting the radiation performance of the antenna, and also preventing the radiation of the antenna from causing adverse interference to the performance of the electronic components.
  • the first metal structure and the second metal structure are heat sinks; and the electronic components are heat generating components.
  • the structure of the heat sink can be used to form an antenna, and the heat sink can be transformed into a radiating part of the antenna, so that radiation and heat dissipation are combined into one, which not only meets the performance requirements of the antenna, but also can provide Heat dissipation of heat generating components also solves the heat dissipation problem of electronic devices, thereby saving antenna costs to a certain extent.
  • the embodiment of the present application does not need to destroy the structure of the heat sink itself when forming the antenna, and thus does not affect the heat dissipation performance of the heat sink.
  • the electronic device is a customer premises device.
  • the electronic device is a customer premises device.
  • FIG1 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG2A is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG2B is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG2C is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG3 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG4 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG5 is a top view of an electronic device provided by an embodiment of the present application.
  • FIG6 is a top view of an electronic device provided by an embodiment of the present application.
  • FIG7 is a schematic diagram of a partial structure of the electronic device shown in FIG6 ;
  • FIG8 is a schematic diagram of a partial structure of the electronic device shown in FIG6;
  • FIG9 is a standing wave curve diagram of a first radiator in an electronic device at 4.95G according to an embodiment of the present application.
  • FIG10 is a current distribution diagram of a first radiator in an electronic device under 4.95G according to an embodiment of the present application.
  • FIG11 is a standing wave curve diagram of a second radiator at 1.82G in an electronic device provided in an embodiment of the present application;
  • FIG12 is a current distribution diagram of a second radiator in an electronic device under 1.82G according to an embodiment of the present application.
  • FIG13 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG14 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG15 is a comparison diagram of antenna performance corresponding to different heights of the second metal structure in an electronic device provided by an embodiment of the present application.
  • FIG16 is an antenna pattern of a first radiator when the height of the second metal structure is 0.5 mm in an electronic device provided by an embodiment of the present application;
  • FIG17 is an antenna pattern of a first radiator when the height of the second metal structure is 22.5 mm in an electronic device provided by an embodiment of the present application;
  • FIG18 is an antenna pattern of a second radiator when the height of the second metal structure is 0.5 mm in an electronic device provided by an embodiment of the present application;
  • FIG19 is an antenna pattern of a second radiator when the height of the second metal structure in the electronic device provided by an embodiment of the present application is 22.5 mm;
  • FIG20 is a schematic structural diagram of a circuit board, a first radiator, and a second radiator in an electronic device provided in an embodiment of the present application;
  • FIG21 is a schematic structural diagram of a circuit board, a first radiator, and a second radiator in an electronic device provided in an embodiment of the present application;
  • FIG22 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application.
  • FIG23 is a schematic diagram of a partial structure of the electronic device shown in FIG22;
  • FIG24 is a schematic diagram of a partial structure of the electronic device shown in FIG23;
  • FIG25 is a schematic diagram of a partial structure of the electronic device shown in FIG23;
  • FIG26 is a standing wave curve diagram of a first radiator and a second radiator in an electronic device provided in an embodiment of the present application;
  • FIG27 is a current distribution diagram of a first radiator in an electronic device under 3.8G according to an embodiment of the present application.
  • FIG28 is a current distribution diagram of a second radiator in an electronic device under 1.8G according to an embodiment of the present application.
  • FIG29 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application when the height of the longitudinal branches is 1.5 mm;
  • FIG30 is an antenna radiation pattern when the height of the longitudinal branches in the electronic device provided by one embodiment of the present application is 1.5 mm;
  • FIG31 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application when the height of the longitudinal branches is 13.5 mm;
  • FIG32 is an antenna radiation diagram when the height of the longitudinal branches in the electronic device provided in one embodiment of the present application is 13.5 mm.
  • 140-second metal structure 141-longitudinal branch; 142-first transverse branch;
  • L1-thickness direction of circuit board L2-first direction; D1-first width;
  • H3-first height H4-second height.
  • the embodiments of the present application provide an electronic device, which may include but is not limited to smart speakers, smart door locks, mobile phones, tablet computers, laptop computers, routers, customer premise equipment (Customer Premise Equipment, CPE), Internet of Things (The Internet of Things, IOT) equipment, ultra-mobile personal computers (ultra-mobile personal computers, UMPC), handheld computers, walkie-talkies, netbooks, point of sales (Point of sales, POS) machines, personal digital assistants (personal digital assistant, PDA), wearable devices, virtual reality equipment, wireless USB flash drives, Bluetooth speakers/headphones, or vehicle-mounted front-end devices, driving recorders, security equipment and other mobile or fixed terminals with antennas.
  • CPE Customer Premise Equipment
  • IOT Internet of Things
  • ultra-mobile personal computers ultra-mobile personal computers
  • UMPC ultra-mobile personal computers
  • handheld computers walkie-talkies
  • netbooks point of sales (Point of sales, POS) machines
  • PDA personal digital assistants
  • wearable devices virtual reality equipment, wireless USB flash drives, Bluetooth
  • CPE is taken as the above-mentioned electronic device as an example for description.
  • the specifications of terminal products such as CPE are gradually increasing.
  • the number of CPE built-in antennas has increased significantly, but at the same time, it is limited by the size of the whole machine.
  • the overall layout of the product is becoming more and more compact, and the mutual influence between antennas is increasing, and the antenna performance is deteriorating accordingly.
  • the power consumption of the product has increased significantly.
  • the volume of the radiator has increased accordingly, and the antenna space has been further compressed. Whether it is the increase in the number of antennas or the increase in the volume of the radiator, it will lead to an increase in cost.
  • the loss of antenna performance and the increase in cost under high specifications and small size are one of the pain points that need to be solved for current products.
  • a heat sink is arranged above the printed circuit board (PCB), a radio frequency coupling probe is arranged above the PCB board near the heat sink, a plane is arranged on the surface of the heat sink, and a horizontal part is arranged inside the heat sink near the radio frequency coupling probe, and a curved groove is arranged inside the plane.
  • the heat sink is transformed into a radiating part of the antenna by capacitive coupling, and dual-band resonance is achieved through the coupling gap.
  • the antenna structure occupies a large space in the CPE, which is easy to affect the layout of other devices in the CPE.
  • an embodiment of the present application provides an electronic device, which may be, for example, a CPE, etc.
  • the electronic device at least one clearance area facing the inside of the circuit board is provided on the outer edge of the circuit board, and an antenna is provided in the clearance area of the circuit board, one end of the antenna is electrically connected to the feeding point on the circuit board, and the other end of the antenna is suspended in the clearance area.
  • at least one second metal structure is provided on the periphery of the first metal structure, one end of each second metal structure is electrically connected to the outer edge of the first metal structure, and the other end of each second metal structure has a coupling gap with the antenna in the thickness direction of the circuit board, so that the antenna is coupled to the second metal structure.
  • the embodiment of the present application utilizes the space on the circuit board to design the antenna, and radiation is generated by coupling between the antenna and the second metal structure, which can reduce the space occupied by the antenna structure in the electronic device, and thus can avoid interference or influence on the layout of other devices in the electronic device.
  • the antenna provided in this application is suitable for using one or more of the following MIMO (Multi-in Multi-out, multiple-in-multi-out) Electronic devices that use long-term evolution (LTE) communication technology: for example, Wi-Fi communication technology, 5G communication technology, SUB-6G communication technology, and other MIMO communication technologies in the future.
  • MIMO communication technology refers to an antenna system that uses multiple antennas at both the transmitting and receiving ends to form multiple channels between the transmitting and receiving ends, and has extremely high spectrum utilization efficiency.
  • CPE may include more or fewer components, or combine certain components, or separate certain components, or arrange components differently.
  • an embodiment of the present application provides an electronic device 100, which may be, for example, a CPE, a speaker, a mobile phone, or a computer.
  • the electronic device 100 may at least include: a circuit board 110 and a first metal structure 120 , wherein the first metal structure 120 is stacked and spaced apart from the circuit board 110 , and at least one clearance area 111 is provided on the outer edge of the circuit board 110 , and the clearance area 111 is recessed inwardly toward the circuit board 110 .
  • the clearance area 111 is a non-metal area on the circuit board 110.
  • the clearance area 111 may also be referred to as a hollow area.
  • the electronic device 100 may further include: a first radiator 131, wherein the first radiator 131 may be located in the clearance area 111, and one end of the first radiator 131 is electrically connected to a first feeding point 112 (see FIG. 7 ) on the circuit board 110, and the other end of the first radiator 131 is suspended in the clearance area 111.
  • the clearance area 111 can be used as a clearance area
  • the first radiator 131 can be a printed pattern, a trace, a conductive sheet or a conductive strip, etc., which is not limited in the embodiment of the present application.
  • a support plate 111a may be further provided in the clearance area 111.
  • one side of the support plate 111a is connected to the circuit board 110, and the other side of the support plate 111a is connected to the first radiator 131 and the second radiator 132.
  • the support plate 111a and the circuit board 110 are formed of the same substrate.
  • the support plate 111a is used to support the first radiator 131 and the second radiator 132 to prevent the first radiator 131 and the second radiator 132 from being separated from the clearance area 111.
  • the support plate 111a may be made of an insulating material.
  • the electronic device 100 may further include: a second metal structural member 140.
  • the second metal structural member 140 may be located on the periphery of the first metal structural member 120, and at least a portion of the positive projection of the second metal structural member 140 toward the circuit board 110 may be located in the clearance area 111.
  • One end of each second metal structural member 140 is electrically connected to the first metal structural member 120, and the other end of each second metal structural member 140 has a first coupling gap 151 with the first radiator 131 in the thickness direction L1 of the circuit board, so that the first radiator 131 is coupled to the second metal structural member 140.
  • the embodiment of the present application utilizes the space on the circuit board 110 to design the antenna, and the antenna (such as the first radiator 131) and the second metal structure 140 generate radiation through coupling, which can reduce the space occupied by the antenna structure in the electronic device 100, thereby avoiding interference or influence on the layout of other devices in the electronic device 100.
  • the second metal structure 140 and the first radiator 131 can achieve miniaturized broadband coverage while ensuring omnidirectional coverage of the directional pattern, that is, the embodiment of the present application can achieve high radiation performance for the electronic device 100 under small size and high heat dissipation capacity.
  • the first metal structure 120 and the second metal structure 140 may be heat sinks, the electronic components may be heat generating components, and the electronic components are in contact with the first metal structure 120 on the side facing the circuit board 110. At this time, the first metal structure 120 can provide good heat dissipation for the electronic components.
  • the first metal structure 120 and the second metal structure 140 may also be metal structures such as metal shells, which is not limited in the embodiment of the present application.
  • the first metal structure 120 when the first metal structure 120 is a radiator, the first metal structure 120 may be, for example, a flat radiator, and the material used for the flat radiator may be aluminum.
  • the structure of the heat sink can be used to form an antenna.
  • the second metal structural member 140 provides the dual functions of radiation and heat dissipation, converting the heat sink into a radiating part of the antenna, so that radiation and heat dissipation are combined into one, which not only meets the performance requirements of the antenna.
  • the heat sink can dissipate heat for heat-generating components, and also solves the heat dissipation problem of the electronic device 100, thereby saving the antenna cost to a certain extent.
  • the antenna can be implemented in a limited design space, effectively saving the antenna design space inside the electronic device 100.
  • the electronic device 100 as a CPE as an example, the embodiment of the present application can save a lot of space for designing antennas in the CPE by utilizing the internal space of the CPE to form an antenna, and can also save the cost of manufacturing the antenna to a certain extent.
  • the antenna provided in the embodiment of the present application does not require additional slots to be made on the heat sink, so that the structure of the heat sink itself does not need to be destroyed when forming the antenna, thereby not affecting the heat dissipation performance of the heat sink.
  • the orthographic projection of the first metal structure 120 onto the circuit board 110 may be staggered with the clearance area 111.
  • the clearance area 111 on the circuit board 110 By designing the clearance area 111 on the circuit board 110 to be relatively staggered with the orthographic projection of the first metal structure 120 on the circuit board 110, it is possible to avoid the formation of an antenna between the antenna at the clearance area 111 and the first metal structure 120.
  • the distance between the outer edge of the orthographic projection of the first metal structure 120 on the circuit board 110 and the clearance area 111 may be less than or equal to 10 mm.
  • the distance between the outer edge of the orthographic projection of the first metal structural part 120 on the circuit board 110 and the clearance area 111 can be 10mm, 9mm, 8mm, 7mm, 6mm, 5mm, 4mm, 3mm, 2mm, 1mm or an intermediate value between any two adjacent values, and the embodiments of the present application are not limited to this.
  • the distance between the outer edge of the positive projection of the first metal structure 120 on the circuit board 110 and the clearance area 111 can be flexibly set according to the needs of the actual application scenario, for example, it can be set according to the actual antenna form and frequency, and the embodiment of the present application does not limit this.
  • the second metal structure 140 may include: a longitudinal branch 141 extending on a first plane and a first transverse branch 142, wherein the first plane is perpendicular to the thickness direction of the circuit board.
  • One end of the longitudinal branch 141 extending on the first plane is electrically connected to the first metal structure 120, and the other end of the longitudinal branch 141 extending on the first plane is connected to the first transverse branch 142, and the first transverse branch 142 may form a first coupling gap 151 with the first radiator 131 in the thickness direction L1 of the circuit board.
  • the electrical connection between the second metal structure 140 and the first metal structure 120 can be achieved.
  • a first coupling gap 151 in the thickness direction L1 of the circuit board By forming a first coupling gap 151 in the thickness direction L1 of the circuit board through the first transverse branch 142 of the second metal structure 140 and the corresponding first radiator 131, it can be ensured that radiation is generated through coupling between the first transverse branch 142 and the corresponding first radiator 131.
  • the longitudinal branch 141 and the first transverse branch 142 both extend in the thickness direction of the circuit board, for example, to a certain height in the thickness direction of the circuit board.
  • the electronic device 100 may further include: a second radiator 132, the second radiator 132 may be located in the clearance area 111, and one end of the second radiator 132 is electrically connected to the second feeding point 113 on the circuit board 110, and the other end of the second radiator 132 is suspended in the clearance area 111.
  • the first radiator 131 and the second radiator 132 are arranged at intervals along the length extension direction of the first transverse branch 142 in the clearance area 111, and the length extension direction of the first transverse branch 142 is the length extension direction of the orthographic projection of the first transverse branch 142 on the circuit board.
  • the second metal structure 140 may also include: a second transverse branch 143 extending on the first plane, and the first transverse branch 142 and the second transverse branch 143 on the circuit board can be respectively located on both sides of the orthographic projection of the longitudinal branch 141 on the circuit board.
  • the first transverse branch 142 and the first radiator 131 form a first coupling gap 151 in the thickness direction L1 of the circuit board
  • the second transverse branch 143 and the second radiator 132 form a second coupling gap 152 in the thickness direction L1 of the circuit board (see Figure 4).
  • the second transverse branch 143 extends in the thickness direction of the circuit board, for example, extends to a certain height in the thickness direction of the circuit board.
  • extending in the thickness direction of the circuit board does not mean that the thickness direction of the branch is completely consistent with the thickness direction of the circuit board, but means that the thickness direction of the branch and the thickness direction of the circuit board are within a certain acute angle range, such as within 45 degrees.
  • the size of the first coupling gap 151 (i.e., the first gap H1) can be 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm or the middle value of any two adjacent values
  • the size of the second coupling gap 152 (i.e., the second gap H2) can be 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm or the middle value of any two adjacent values, and the embodiment of the present application is not limited to this.
  • the first transverse branch 142 can form a first coupling gap 151 with the first radiator 131 in the thickness direction L1 of the circuit board, thereby ensuring that the first transverse branch 142 and the first radiator 131 generate radiation through coupling.
  • the second transverse branch 143 can form a second coupling gap 152 with the second radiator 132 in the thickness direction L1 of the circuit board, thereby ensuring that the second transverse branch 143 and the second radiator 132 generate radiation through coupling.
  • the height of the first transverse branch 142 and the second transverse branch 143 in the thickness direction L1 of the circuit board may be higher than the height of the first metal structure 120 in the thickness direction L1 of the circuit board.
  • the second metal structure 140 is designed to include a longitudinal branch 141, a first transverse branch 142, and a second transverse branch 143 extending on a first plane, wherein the first plane is perpendicular to the thickness direction of the circuit board.
  • the longitudinal branch 141, the first transverse branch 142, and the second transverse branch 143 together form a T-shaped structure as shown in FIG7.
  • the embodiment of the present application can expand the two-dimensional antenna structure into a three-dimensional structure to achieve a miniaturized design of the antenna.
  • the second metal structure 140 in a T-shaped structure can couple and utilize its height in the thickness direction L1 of the circuit board to expand the current distribution from a plane to a three-dimensional structure, thereby being able to help achieve good control of the directional pattern.
  • the second metal structure 140 can be designed to include a longitudinal branch 141 and a first transverse branch 142, and the longitudinal branch 141 and the first transverse branch 142 together form an L-shaped structure (not shown in the figure), or the second metal structure 140 can be designed to include a longitudinal branch 141 and a second transverse branch 143, and the longitudinal branch 141 and the second transverse branch 143 together form an L-shaped structure (see FIG. 2B ), and the embodiment of the present application does not limit this.
  • the L-shaped structure can be understood as an L-shaped structure formed by the positive projection of the circuit board.
  • the length of the second transverse branch 143 may be greater than the length of the first transverse branch 142.
  • the frequencies corresponding to the first transverse branch 142 and the second transverse branch 143 can be different, so as to cover different frequency bands of the antenna, thereby stimulating more performance of the antenna.
  • the length of the first transverse branch 142 and the second transverse branch 143 can be regarded as the length of the positive projection on the circuit board.
  • the electronic device 100 may further include: a blocking branch 133, wherein one end of the blocking branch 133 is located in the clearance area 111, the blocking branch 133 extends between the first radiator 131 and the second radiator 132, and the other end of the blocking branch 133 is grounded through the circuit board 110.
  • the blocking branch 133 may have a gap 1331 between the first radiator 131 and the second radiator 132, respectively.
  • the blocking branch 133 extending between the first radiator 131 and the second radiator 132 may include the blocking branch 133 being located between one end of the first radiator 131 and one end of the second radiator 132, or may include the blocking branch 133 passing between one end of the first radiator 131 and one end of the second radiator 132 and extending outward.
  • the blocking branch 133 By designing the blocking branch 133 between the first radiator 131 and the second radiator 132, the first radiator 131 and the second radiator 132 can be isolated, thereby avoiding or reducing the mutual interference between the radiation effect of the first radiator 131 and the radiation effect of the second radiator 132.
  • the blocking branch 133 is electrically connected to the circuit board 110, so that the grounding of the blocking branch can be achieved.
  • the blocking branch 133 and the longitudinal branch 141 may be opposite to each other in the thickness direction L1 of the circuit board and have a gap 1332, and the longitudinal branch 141 and the blocking branch 133 are electrically connected via the conductive structure 160.
  • the blocking branch and the longitudinal branch 141 are electrically connected via the conductive structure 160, so that the electrical connection between the blocking branch and the second metal structure 140 can be achieved.
  • the conductive structure 160 may be conductive foam, or conductive glue, or other conductive devices such as metal springs.
  • the conductive foam, conductive glue and metal springs can all play a role in electrically connecting the longitudinal branches 141 and the barrier branches 133.
  • the specific structure of the first radiator 131 may include but is not limited to the following two possible implementations:
  • the first radiator 131 may include at least: a first radiating branch 1311, a first feeding point 112 is provided on the circuit board 110, one end of the first radiating branch 1311 is electrically connected to the first feeding point 112, and the other end of the first radiating branch 1311 is electrically connected to the first feeding point 112. It is suspended in the clearance area 111 , and a first coupling gap 151 may be formed between the first transverse branch 142 and the first radiation branch 1311 .
  • the first radiating branch 1311 is electrically connected to the first feeding point 112, and the first feeding point 112 can feed the first radiating branch 1311.
  • a first coupling gap 151 is formed between the first lateral branch 142 and the first radiating branch 1311, which can ensure that radiation is generated through coupling between the first radiating branch 1311 and the first lateral branch 142 of the second metal structure 140.
  • the first radiator 131 may include: a first radiating branch 1311 and a second radiating branch 1312, wherein the second radiating branch 1312 is coupled to the first radiating branch 1311, a first feeding point 112 is provided on the circuit board 110, one end of the first radiating branch 1311 is electrically connected to the first feeding point 112, and the other end of the first radiating branch 1311 is suspended in the clear area 111, one end of the second radiating branch 1312 is electrically connected to the circuit board 110, and the other end of the second radiating branch 1312 is suspended in the clear area 111.
  • a first coupling gap 151 may be formed between the first transverse branch 142 and at least one of the first radiation branch 1311 and the second radiation branch 1312.
  • the first coupling gap 151 may be formed between the first transverse branch 142 and the first radiation branch 1311, or the first coupling gap 151 may be formed between the first transverse branch 142 and the second radiation branch 1312, or the first coupling gap 151 may be formed between the first transverse branch 142 and the first radiation branch 1311 and the second radiation branch 1312.
  • the first radiating branch 1311 is electrically connected to the first feeding point 112, and the first feeding point 112 can feed the first radiating branch 1311.
  • a first coupling gap 151 is formed between the first lateral branch 142 and at least one of the first radiating branch 1311 or the second radiating branch 1312, which can ensure that radiation is generated through coupling between the first lateral branch 142 of the second metal structure 140 and at least one of the first radiating branch 1311 or the second radiating branch 1312.
  • the first feeding point 112 can be set on the second metal structure 140. At this time, the first feeding point 112 feeds the second metal structure 140, and the first radiator 131 and the second radiator 132 serve as coupled radiators.
  • the antenna can be a monopole antenna, a loop antenna (LOOP), an inverted F-shaped antenna (IFA) or a planar inverted F-shaped antenna (Planar Inverted F-shaped Antenna).
  • the first feeding point 112 may be a metal spring, a probe or a conductive cable, etc., so that the first radiation branch 1311 can be fed by the metal spring, the probe or the conductive cable, etc. It should be noted that the embodiment of the present application does not limit the specific formation method of the first feeding point 112, nor is it limited to the above example, as long as it can play the role of feeding connection.
  • the number of first feeding points 112 corresponding to the first radiating branch 1311 may be one, two, three or more, that is, the first radiating branch 1311 may be fed through one first feeding point 112, or, the first radiating branch 1311 may be fed through two first feeding points 112 at the same time, or, the first radiating branch 1311 may be fed through three first feeding points 112 at the same time, or, the first radiating branch 1311 may be fed through more first feeding points 112 at the same time, and the embodiment of the present application is not limited to this.
  • the second radiation branch 1312 may be located at the periphery of the first radiation branch 1311.
  • the coupling area between the second radiation branch 1312 and the first radiation branch 1311 can be increased.
  • the second radiation branch 1312 is arranged around the periphery of the first radiation branch 1311, so that the first radiator 131 can realize an omnidirectional design, so that the first radiator 131 can realize omnidirectional radiation in the horizontal plane, and the regulation of the directivity pattern of the first radiator 131 and the optimization of the isolation can be realized by adjusting the size of the first lateral branch 142.
  • a third coupling gap 153 may be formed between the first radiation branch 1311 and the second radiation branch 1312 , so that it is possible to ensure that radiation is generated by coupling between the first radiation branch 1311 and the second radiation branch 1312 .
  • the specific structure of the second radiator 132 may include but is not limited to the following two possible implementations:
  • the second radiator 132 may include: a third radiating branch 1321, a second feeding point 113 is arranged on the circuit board 110, one end of the third radiating branch 1321 is electrically connected to the second feeding point 113, and the other end of the third radiating branch 1321 is suspended in the clearance area 111, and a second coupling gap 152 may be formed between the second lateral branch 143 and the third radiating branch 1321.
  • the third radiating branch 1321 is electrically connected to the second feeding point 113, and the second feeding point 113 can feed the third radiating branch 1321.
  • a second coupling gap 152 is formed between the second lateral branch 143 and the third radiating branch 1321, which can ensure that radiation is generated through coupling between the third radiating branch 1321 and the second lateral branch 143 of the second metal structure 140.
  • the second radiator 132 may include: a third radiating branch 1321 and a fourth radiating branch ( FIG. (not shown in the figure), wherein the fourth radiating branch is coupled to the third radiating branch 1321, a second feeding point 113 is provided on the circuit board 110, one end of the third radiating branch 1321 is electrically connected to the second feeding point 113, and the other end of the third radiating branch 1321 is suspended in the clear area 111, one end of the fourth radiating branch is electrically connected to the circuit board 110, and the other end of the fourth radiating branch is suspended in the clear area 111.
  • a second coupling gap 152 may be formed between the second transverse branch 143 and at least one of the third radiation branch 1321 and the fourth radiation branch.
  • the second coupling gap 152 may be formed between the second transverse branch 143 and the third radiation branch 1321, or the second coupling gap 152 may be formed between the second transverse branch 143 and the fourth radiation branch, or the second coupling gap 152 may be formed between the second transverse branch 143 and the third radiation branch 1321 and the fourth radiation branch.
  • the third radiating branch 1321 is electrically connected to the second feeding point 113, and the second feeding point 113 can feed the third radiating branch 1321.
  • a second coupling gap 152 is formed between the second lateral branch 143 and the third radiating branch 1321 or at least one of the fourth radiating branches, which can ensure that radiation is generated through coupling between the second lateral branch 143 of the second metal structure 140 and at least one of the third radiating branch 1321 or the fourth radiating branch.
  • the second feeding point 113 can be a metal spring, a probe or a conductive cable, etc., so that the third radiation branch 1321 can be fed by the metal spring, the probe or the conductive cable, etc. It should be noted that the embodiment of the present application does not limit the specific formation method of the second feeding point 113, nor is it limited to the above example, as long as it can play the role of feeding connection.
  • the number of second feeding points 113 corresponding to the third radiating branch 1321 may be one, two, three or more, that is, the third radiating branch 1321 may be fed through one second feeding point 113, or the third radiating branch 1321 may be fed through two second feeding points 113 at the same time, or the third radiating branch 1321 may be fed through three second feeding points 113 at the same time, or the third radiating branch 1321 may be fed through more second feeding points 113 at the same time, and the embodiment of the present application is not limited to this.
  • the fourth radiation branch may be located at the periphery of the third radiation branch 1321.
  • the coupling area between the fourth radiation branch and the third radiation branch 1321 can be increased.
  • the fourth radiation branch is arranged around the periphery of the third radiation branch 1321, so that the second radiator 132 can realize an omnidirectional design, so that the second radiator 132 can realize omnidirectional radiation in the horizontal plane, and the regulation of the directivity pattern of the second radiator 132 and the optimization of the isolation can be realized by adjusting the size of the second lateral branch 143.
  • a fourth coupling gap (not shown in the figure) may be formed between the third radiation branch 1321 and the fourth radiation branch, so that it is possible to ensure that radiation is generated by coupling between the third radiation branch 1321 and the fourth radiation branch.
  • the first radiator 131 and the second radiator 132 can be the structures shown in Figures 7 and 8, wherein the first radiator 131 can include a first radiation branch 1311 and a second radiation branch 1312, and the first radiator 131 can cover 2.2GHz-5GHz, and the second radiator 132 can include a third radiation branch 1321, and the second radiator 132 can cover 1.7GHz-2.7GHz.
  • Figures 9 and 10 show standing waves of the first radiator 131 and current distribution diagrams at 4.95 GHz.
  • the first transverse branches 142 and the longitudinal branches 141 of the second metal structure 140, as partial radiators of the first radiator 131, can generate a new ⁇ /4 fundamental mode at 4.95 GHz, thereby expanding the bandwidth of the first radiator 131.
  • the working modes at the four resonance points of 2.3 GHz, 3 GHz, 4.2 GHz and 4.95 GHz in FIG. 9 are simulated.
  • currents of a frequency band including 2.3 GHz, a frequency band including 3 GHz, a frequency band including 4.2 GHz and a frequency band including 4.95 GHz are fed to the first feeding point respectively, and then the current distribution on each radiation branch is observed.
  • the simulation test shows that at the 2.3 GHz resonance point, the left-hand mode generated by the second radiation branch 1312 is mainly a left-hand mode, and the electrical length of the second radiation branch 1312 can be ⁇ /8- ⁇ /4.
  • the ⁇ /4 fundamental mode generated by the first radiation branch 1311 is mainly a ⁇ /4 fundamental mode, and the sum of the electrical lengths of the first radiation branch 1311 is ⁇ /4.
  • the third-order mode generated by the first radiation branch 1311 and the second radiation branch 1312 is mainly a third-order mode, and the sum of the electrical lengths of the first radiation branch 1311 and the second radiation branch 1312 is 3 ⁇ /8-3 ⁇ /4.
  • the ⁇ /4 fundamental mode is mainly generated by the first transverse branch 142 and the longitudinal branch 141.
  • the sum of the electrical lengths of the first transverse branch 142 and the longitudinal branch 141 is ⁇ /4, wherein ⁇ is the wavelength corresponding to the center frequency of the resonance frequency.
  • ⁇ is the wavelength corresponding to the center frequency of the resonance frequency.
  • the center frequency of the resonance frequency is 3 GHz, and therefore ⁇ is 3 GHz.
  • FIG. 11 and 12 show the standing wave of the second radiator 132 and the current distribution diagram at 1.8 GHz.
  • the working modes at the resonance points of 1.8 GHz and 2.6 GHz in FIG. 11 are simulated.
  • currents of 1.8 GHz and 2.6 GHz are injected into the second feeding point, respectively, and then the current distribution on each radiation branch is observed.
  • the simulation test shows that at the 1.8 GHz resonance point, the left-hand mode is mainly generated by the second transverse branch 143 and the longitudinal branch 141, and the sum of the electrical lengths of the second transverse branch 143 and the longitudinal branch 141 can be ⁇ /8- ⁇ /4.
  • the ⁇ /4 fundamental mode is mainly generated by the third radiation branch 1321, and the electrical length of the third radiation branch 1321 can be ⁇ /4.
  • ⁇ is the center frequency of the resonance frequency, for example, in FIG. 11, ⁇ can be 1.8 GHz.
  • the height of the longitudinal branch 141 in the thickness direction L1 of the circuit board can be less than or equal to ⁇ /4, where ⁇ can be the wavelength corresponding to the center frequency point of the minimum resonant frequency band.
  • the height of the longitudinal branch 141 in the thickness direction L1 of the circuit board can be 0.5mm-22.5mm.
  • the height of the longitudinal branch 141 in the thickness direction L1 of the circuit board shown in FIG. 13 i.e., the first height H3
  • the height of the longitudinal branch 141 in the thickness direction L1 of the circuit board shown in FIG. 14 i.e., the second height H4.
  • the isolation degree of the longitudinal branch 141 between the first radiator 131 and the second radiator 132 can be increased, thereby reducing the degree of mutual interference between the first radiator 131 and the second radiator 132.
  • the height of the longitudinal branch 141 in the thickness direction L1 of the circuit board can be 0.5mm, 2mm, 4mm, 6mm, 8mm, 10mm, 12mm, 14mm, 16mm, 18mm, 20mm, 22mm, 22.5mm or an intermediate value between any two adjacent values, etc., which is not limited to the embodiments of the present application.
  • the isolation between the first radiator 131 and the second radiator 132 can be increased from 8 dB to 15 dB.
  • FIG16, FIG17, FIG18 and FIG19 for the antenna radiation patterns of different heights of the longitudinal branch 141 in the thickness direction L1 of the circuit board at the same frequency, as the height of the longitudinal branch 141 in the thickness direction L1 of the circuit board increases, the reverse effect of the first transverse branch 142 and the second transverse branch 143 of the second metal structure 140 on the antenna radiation pattern gradually increases.
  • the width of the clearance area 111 in the first direction L2 may be greater than or equal to 3 mm, wherein the first direction L2 may be the direction in which the length of the longitudinal branch 141 extends, and the length of the longitudinal branch 141 extends in the direction in which the longitudinal branch 141 is projected on the circuit board.
  • the width of the clearance area 111 in the direction in which the length of the longitudinal branch 141 extends may be reduced to 3 mm.
  • the width of the clearance area 111 in the first direction L2 may be between 3 mm and 15 mm.
  • the width of the clearance area 111 in the first direction L2 may be 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm or an intermediate value between any two adjacent values, etc., and the embodiments of the present application are not limited to this.
  • the width of the clearance area 111 in the first direction L2 (i.e., the second width D2) in Figure 21 is smaller than the width of the clearance area 111 in the first direction L2 (i.e., the first width D1) in Figure 20.
  • the use area of the circuit board 110 can be saved to a certain extent, thereby leaving more accommodation space for the electronic device 100.
  • the width of the clearance area 111 in Figure 21 in the first direction L2 is half the width of the clearance area 111 in Figure 20 in the first direction L2, that is, the size of the clearance area 111 in Figure 21 is reduced to 50% of the size of the clearance area 111 in Figure 20, but the structure shown in Figure 21 can still achieve the radiation performance of the antenna.
  • the first radiator 131 and the second radiator 132 may be structures as shown in FIG22 and FIG23, wherein the first radiator 131 may include a first radiating branch 1311, and the second radiator 132 may include a third radiating branch 1321.
  • the first transverse branch 142 and the first radiating branch 1311 may form a coupling gap in the thickness direction L1 of the circuit board
  • the second transverse branch 143 and the third radiating branch 1321 may form a coupling gap in the thickness direction L1 of the circuit board.
  • Figures 26 and 27 show standing waves of the first radiator 131 and current distribution diagrams at 4.95 GHz.
  • simulation tests are performed on the working modes at the resonance points of 3.8 GHz and 5 GHz in FIG. 26 .
  • Currents of 3.8 GHz and 5 GHz are injected into the first feeding point respectively, and then the current distribution on each radiation branch is observed.
  • the simulation test shows that at the 3.8 GHz resonance point, the left-hand mode is mainly generated by the first transverse branch 142 and the longitudinal branch 141, and the sum of the electrical lengths of the first transverse branch 142 and the longitudinal branch 141 can be ⁇ /8- ⁇ /4.
  • the ⁇ /4 fundamental mode is mainly generated by the first radiation branch 1311, and the sum of the electrical lengths of the first radiation branch 1311 is ⁇ /4.
  • ⁇ is the center frequency of the resonance frequency, for example, in FIG26, ⁇ can be 3.8 GHz.
  • the working modes at the resonance points of 1.8 GHz and 2.5 GHz in FIG. 26 are simulated.
  • currents of 1.8 GHz and 2.5 GHz are respectively injected into the second feeding point, and then the current distribution on each radiation branch is observed.
  • the simulation test shows that at the 1.8 GHz resonance point, the left-hand mode is mainly generated by the second transverse branch 143 and the longitudinal branch 141, and the sum of the electrical lengths of the second transverse branch 143 and the longitudinal branch 141 can be ⁇ /8- ⁇ /4.
  • the ⁇ /4 fundamental mode is mainly generated by the third radiation branch 1321, and the electrical length of the third radiation branch 1321 can be ⁇ /4.
  • ⁇ is the center frequency of the resonance frequency, for example, in FIG. 26, ⁇ can be 2.5 GHz.
  • the height of the longitudinal branch 141 in the thickness direction L1 of the circuit board can be less than or equal to ⁇ /4, where ⁇ can be the wavelength corresponding to the center frequency of the minimum resonant frequency band.
  • the height of the longitudinal branch 141 in the thickness direction L1 of the circuit board can be 0.5mm-22.5mm.
  • the electronic device 100 may further include: a shielding frame 170, wherein the shielding frame 170 may be located at the periphery of the electronic components to separate the electronic components from at least one antenna, and the side of the shielding frame 170 facing the first metal structure 120 may be connected to the first metal structure 120.
  • the shielding frame 170 can separate the electronic components from the antenna structure and the modules (such as chips and other devices) on the circuit board 110 while having a heat dissipation function, thereby preventing the electronic components from affecting the radiation performance of the antenna and the working performance of the chip, and also preventing the radiation of the antenna from causing adverse interference to the performance of the electronic components, and eliminating cavity clutter and interference leakage to a certain extent.
  • the electronic device 100 may further include: electronic components (not shown in the figure), which may be located between the circuit board 110 and the first metal structure 120, and a concave sink (not shown in the figure) may be provided on the side of the first metal structure 120 facing the circuit board 110, and the electronic components are in contact with the side of the sink facing the circuit board 110.
  • a concave sink (not shown in the figure) may be provided on the side of the first metal structure 120 facing the circuit board 110, and the electronic components are in contact with the side of the sink facing the circuit board 110.
  • the number of antennas in the electronic device 100 can be more.
  • the antennas in the electronic device 100 can achieve coverage of more antenna modes.
  • the devices or elements referred to or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application.
  • the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

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Abstract

本申请实施例提供一种电子设备，包括电路板以及第一金属结构件；第一金属结构件与所述电路板层叠且间隔设置；电路板的外边缘设有朝向电路板内的净空区域，第一辐射体位于净空区域处，且第一辐射体的一端与电路板上的第一馈电点电连接，第一辐射体的另一端悬空在净空区域处；第二金属结构件位于第一金属结构件的外周，且第二金属结构件朝向电路板的正投影的至少部分位于净空区域处；每个第二金属结构件的一端与第一金属结构件电连接，每个第二金属结构件的另一端与第一辐射体在电路板的厚度方向上具有第一耦合间隙。这样，能够减小天线结构在电子设备中的占用空间，进而能够避免对其它器件在电子设备内的布局造成干涉或者影响。

Description

电子设备
本申请要求于2022年10月01日提交中国专利局、申请号为202211214970.2、申请名称为“电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及终端技术领域，特别涉及一种电子设备。
背景技术
随着通信技术的不断发展，手机和电脑等电子设备的无线性能受到越来越多的关注，因而，天线技术在电子设备上的应用愈加广泛，需求也越来越高。
以电子设备为手机为例，一般在手机上的不同空间位置设计有不同的天线结构，具体地，可以根据实际场景需求，通过在手机空间内不同位置布局不同的谐振天线，以满足不同场景下的天线需求。相关技术中，电子设备内可以形成有腔体天线。具体地，电子设备中，印制电路板(Printed Circuit Board，PCB)的上方设置有散热器，PCB板的上方靠近散热器的内部设置有射频耦合探针，散热器的表面设置有平面，而且，散热器的内部靠近射频耦合探针的上方设置有水平部分，平面的内部设置有曲线回形槽，采用电容耦合的方式，将散热器转变为天线的一个辐射部分，并通过耦合缝隙实现双频段谐振，使得辐射和散热结合为一体，不仅满足了天线的性能要求，也解决了电子设备的散热。
然而，上述设计方案中，天线结构在电子设备中的占用空间较大，容易影响其它器件在电子设备内的布局。
发明内容
本申请实施例提供一种电子设备，能够减小天线结构在电子设备中的占用空间，进而能够避免对其它器件在电子设备内的布局造成干涉或者影响。
本申请实施例提供一种电子设备，该电子设备至少包括：电路板以及第一金属结构件；所述第一金属结构件与所述电路板层叠且间隔设置；所述电路板的外边缘设有朝向所述电路板内的净空区域；还包括：第一辐射体，所述第一辐射体位于所述净空区域处，且所述第一辐射体的一端与所述电路板上的第一馈电点电连接，所述第一辐射体的另一端悬空在所述净空区域处；
还包括：第二金属结构件；所述第二金属结构件位于所述第一金属结构件的外周，且所述第二金属结构件朝向所述电路板的正投影的至少部分位于所述净空区域处；所述第二金属结构件的一端与所述第一金属结构件电连接，所述第二金属结构件的另一端与所述第一辐射体在所述电路板的厚度方向上具有第一耦合间隙。
本申请实施例提供的电子设备，该电子设备中，第一金属结构件与电路板层叠且间隔设置，通过在电路板的外边缘设有朝向电路板内的净空区域，并在电路板的净空区域处设置有第一辐射体，第一辐射体的一端与电路板上的第一馈电点电连接，第一辐射体的另一端悬空在净空区域处，另外，在第一金属结构件的外周设置有第二金属结构件，第二金属结构件的一端与第一金属结构件电连接，第二金属结构件的另一端与第一辐射体在所述电路板的厚度方向上具有耦合间隙，以使得第一辐射体上的电流耦合到第二金属结构件上，这样，相比于现有技术中在电子设备内设计独立的天线结构，本申请实施例利用电路板上的空间设计天线(即第一辐射体)，第一辐射体与第二金属结构件之间通过间隙耦合产生辐射，能够减小天线结构在电子设备中的占用空间，进而能够避免对其它器件在电子设备内的布局造成干涉或者影响。
在一种可能的实现方式中，所述第一金属结构件朝向所述电路板上的正投影与所述净空区域相互错开。
通过将电路板上的净空区域位置设计为与第一金属结构件朝向电路板上的正投影相对错开设置，能 够避免净空区域处的天线与第一金属结构件之间形成腔体天线，另外，通过限定电路板上的净空区域与第一金属结构件在所述电路板上的正投影之间的距离，能够避免电路板上的净空区域与第一金属结构件在所述电路板上的正投影之间的距离过大，对电路板上的空间造成损失或浪费，进而能够避免对电子设备内的空间造成损失和浪费。
在一种可能的实现方式中，所述第二金属结构件包括：在第一平面上延伸的纵向枝节以及第一横向枝节，所述第一平面与所述电路板的厚度方向垂直；其中，所述纵向枝节在所述第一平面上延伸的一端与所述第一金属结构件电连接，所述纵向枝节在所述第一平面上延伸的另一端与所述第一横向枝节相连，所述第一横向枝节与所述第一辐射体在所述电路板的厚度方向上形成所述第一耦合间隙。
通过第二金属结构件的纵向枝节与第一金属结构件电连接，能够实现第二金属结构件与第一金属结构件之间的电连接，通过第二金属结构件的第一横向枝节与第一辐射体在电路板的厚度方向上形成第一耦合间隙，进而确保第一横向枝节与第一辐射体之间通过耦合产生辐射。
在一种可能的实现方式中，还包括：第二辐射体；所述第二辐射体位于所述净空区域处，且所述第二辐射体的一端与所述电路板上的第二馈电点电连接，所述第二辐射体的另一端悬空在所述净空区域处；所述第一辐射体和所述第二辐射体在所述净空区域处沿着所述第一横向枝节的长度延伸方向间隔设置，所述第一横向枝节的长度延伸方向为所述第一横向枝节在所述电路板的正投影的长度延伸方向。
在一种可能的实现方式中，所述第二金属结构件还包括：第二横向枝节；所述第一横向枝节和所述第二横向枝节在所述电路板的正投影分别位于所述纵向枝节在所述电路板的正投影的两侧；所述第二横向枝节与所述第二辐射体在所述电路板的厚度方向上具有第二耦合间隙。
通过设计第二横向枝节，能够与第二辐射体在电路板的厚度方向上形成第二耦合间隙，进而能够确保第二横向枝节与第二辐射体之间通过耦合产生辐射。
在一种可能的实现方式中，所述纵向枝节以及所述第一横向枝节均在所述电路板的厚度方向上延伸。例如，在电路板的厚度方向上延伸一定的高度，以实现辐射的效率和带宽等辐射性能的要求。
在一种可能的实现方式中，所述第二横向枝节在所述电路板的厚度方向上延伸。例如，在电路板的厚度方向上延伸一定的高度，以实现辐射的效率和带宽等辐射性能的要求。应可理解，在电路板的厚度方向上延伸，并不是指枝节的厚度方向与电路板的厚度方向完全一致，而是指，枝节的厚度方向与电路板的厚度方向在一定的锐角范围内，例如45度内。
在一种可能的实现方式中，还包括：隔挡枝节，所述隔挡枝节的一端位于所述净空区域中，且所述隔挡枝节延伸于所述第一辐射体和所述第二辐射体之间，所述隔挡枝节的另一端通过所述电路板接地，且所述隔挡枝节分别与所述第一辐射体和所述第二辐射体之间具有间隔。
通过在第一辐射体和第二辐射体之间设计隔挡枝节，能够对第一辐射体和第二辐射体之间产生隔离，避免或减轻第一辐射体的辐射效应与第二辐射体的辐射效应之间产生相互干扰。另外，隔挡枝节与电路板电连接，能够实现隔挡枝节的接地。
在一种可能的实现方式中，所述隔挡枝节与所述纵向枝节在所述电路板的厚度方向上相对且具有间隙，所述纵向枝节与所述隔挡枝节之间通过导电结构电连接。
隔挡枝节与纵向枝节之间通过导电结构电连接，能够实现隔挡枝节与第二金属结构件之间的电连接。
在一种可能的实现方式中，所述第一辐射体至少包括：第一辐射枝节；所述第一辐射枝节的一端与所述第一馈电点电连接，所述第一辐射枝节的另一端悬空在所述净空区域处；且所述第一横向枝节与所述第一辐射枝节之间形成所述第一耦合间隙。
通过将第一辐射体设计为包括第一辐射枝节，在电路板上设置第一馈电点，第一辐射枝节与第一馈电点电连接，第一馈电点能够对第一辐射枝节进行馈电，另外，第一横向枝节与第一辐射枝节之间形成第一耦合间隙，能够确保第一辐射枝节与第二金属结构件的第一横向枝节之间通过耦合产生辐射。
在一种可能的实现方式中，所述第一辐射体还包括：与所述第一辐射枝节耦合相连的第二辐射枝节；所述第二辐射枝节的一端通过所述电路板接地，所述第二辐射枝节的另一端悬空在所述净空区域处；且所述第一横向枝节与所述第一辐射枝节和所述第二辐射枝节中的至少一个之间形成所述第一耦合间隙，所述第一辐射枝节与所述第二辐射枝节之间形成第三耦合间隙。
通过将第一辐射体设计为包括耦合相连的第一辐射枝节和第二辐射枝节，在电路板上设置第一馈电点，第一辐射枝节与第一馈电点电连接，第一馈电点能够对第一辐射枝节进行馈电，另外，第一横向枝 节与第一辐射枝节或者第二辐射枝节中的至少一者之间形成第一耦合间隙，能够确保第二金属结构件的第一横向枝节与第一辐射枝节或者第二辐射枝节中的至少一者之间通过耦合产生辐射。
另外，第一辐射枝节与第二辐射枝节之间形成第三耦合间隙，能够确保第一辐射枝节与第二辐射枝节之间通过耦合产生辐射。
在一种可能的实现方式中，所述第二辐射体包括：第三辐射枝节；所述第三辐射枝节的一端与所述第二馈电点电连接，所述第三辐射枝节的另一端悬空在所述净空区域处；且所述第二横向枝节与所述第三辐射枝节之间形成所述第二耦合间隙。
通过将第二辐射体设计为包括第三辐射枝节，在电路板上设置第二馈电点，第三辐射枝节与第二馈电点电连接，第二馈电点能够对第三辐射枝节进行馈电，另外，第二横向枝节与第三辐射枝节之间形成第二耦合间隙，能够确保第三辐射枝节与第二金属结构件的第二横向枝节之间通过耦合产生辐射。
在一种可能的实现方式中，所述第二辐射体还包括：与所述第三辐射枝节耦合相连的第四辐射枝节；所述第四辐射枝节的一端通过所述电路板接地，所述第四辐射枝节的另一端悬空在所述净空区域处；且所述第二横向枝节与所述第三辐射枝节和所述第四辐射枝节中的至少一个之间形成所述第二耦合间隙。
通过将第二辐射体设计为包括耦合相连的第三辐射枝节和第四辐射枝节，在电路板上设置第二馈电点，第三辐射枝节与第二馈电点电连接，第二馈电点能够对第三辐射枝节进行馈电，另外，第二横向枝节与第三辐射枝节或者第四辐射枝节中的至少一者之间形成第二耦合间隙，能够确保第二金属结构件的第二横向枝节与第三辐射枝节或者第四辐射枝节中的至少一者之间通过耦合产生辐射。
在一种可能的实现方式中，所述第三辐射枝节与所述第四辐射枝节之间形成第四耦合间隙。
通过第三辐射枝节与第四辐射枝节之间形成第四耦合间隙，能够确保第三辐射枝节与第四辐射枝节之间通过合产生辐射。
在一种可能的实现方式中，所述纵向枝节在所述电路板的厚度方向上的高度小于等于λ/4，所述λ为最小谐振频段的中心频点对应的波长。通过增加纵向枝节在所述电路板的厚度方向上的高度，能够增加纵向枝节对第一辐射体和第二辐射体之间的隔离度。
在一种可能的实现方式中，所述横向枝节在所述电路板的厚度方向上高于所述第一金属结构件。通过将横向枝节在所述电路板的厚度方向上的高度设计为高于第一金属结构件在所述电路板的厚度方向上的高度，能够第二金属结构件能够在第一金属结构件进行散热的基础上起到进一步散热的效果。
在一种可能的实现方式中，所述第二横向枝节的长度大于所述第一横向枝节的长度。通过将第二横向枝节的长度设计大于第一横向枝节的长度，能够使得第一横向枝节和第二横向枝节所对应的频率不相同，以覆盖天线的不同频段，从而能够激发天线的更多性能。应可理解，第一横向枝节和第二横向枝节的长度可以看做是在所述电路板的正投影的长度。
在一种可能的实现方式中，所述净空区域在第一方向上的宽度大于等于3mm；其中，所述第一方向为所述纵向枝节的长度延伸的方向，所述纵向枝节的长度延伸方向为所述纵向枝节在所述电路板的正投影的长度延伸方向。
在一种可能的实现方式中，还包括：电子元器件；所述电子元器件位于所述电路板和所述第一金属结构件之间；所述第一金属结构件上朝向所述电路板的一侧设置有凹陷的沉台，所述电子元器件与所述沉台朝向所述电路板的一面相接触。
通过在第一金属结构件上设置有朝向电路板凹陷的沉台，电子元器件与沉台朝向电路板的一面相接触，能够缩短电子元器件与第一金属结构件之间的电连接路径。
在一种可能的实现方式中，还包括：屏蔽框；所述屏蔽框位于所述电子元器件的外周，以将所述电子元器件与所述至少一个天线分隔开；且所述屏蔽框朝向所述第一金属结构件的一侧与所述第一金属结构件相连。
通过在电子元器件的外周设置有屏蔽框，屏蔽框能够将电子元器件与天线结构分隔开，避免电子元器件对天线的辐射性能产生影响，同时也能够避免天线的辐射对电子元器件的使用性能造成不良干涉。
在一种可能的实现方式中，所述第一金属结构件和所述第二金属结构件为散热器；所述电子元器件为发热元器件。
通过将散热器作为第一金属结构件和第二金属结构件，能够利用散热器的结构形成天线，将散热器转变为天线的一个辐射部分，使得辐射和散热结合为一体，不仅满足了天线的性能要求，散热器能够给 对发热元器件进行散热，也解决了电子设备的散热问题，从而能够在一定程度上起到节约天线成本的作用。另外，相比于现有技术中需要在散热器上进行开槽实现双频段谐振，本申请实施例形成天线时无需破坏散热器其本身的结构，进而不会影响散热器的散热性能。
在一种可能的实现方式中，所述电子设备为客户前置设备。通过利用客户前置设备内部空间形成天线，能够在很大程度上节省在客户前置设备内设计天线的空间，同时还能够在一定程度上起到节约制作天线成本的作用。
结合附图，根据下文描述的实施例，示例性实施例的这些和其它方面、实施形式和优点将变得显而易见。但应了解，说明书和附图仅用于说明并且不作为对本申请实施例的限制的定义，详见随附的权利要求书。本申请实施例的其它方面和优点将在以下描述中阐述，而且部分将从描述中显而易见，或通过本申请实施例的实践得知。此外，本申请实施例的各方面和优点可以通过所附权利要求书中特别指出的手段和组合得以实现和获得。
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图1为本申请一实施例提供的电子设备的结构示意图；
图2A为本申请一实施例提供的电子设备的结构示意图；
图2B为本申请一实施例提供的电子设备的结构示意图；
图2C为本申请一实施例提供的电子设备的结构示意图；
图3为本申请一实施例提供的电子设备的结构示意图；
图4为本申请一实施例提供的电子设备的结构示意图；
图5为本申请一实施例提供的电子设备的俯视图；
图6为本申请一实施例提供的电子设备的俯视图；
图7为图6所示的电子设备的部分结构示意图；
图8为图6所示的电子设备的部分结构示意图；
图9为本申请一实施例提供的电子设备中第一辐射体在4.95G下的驻波曲线图；
图10为本申请一实施例提供的电子设备中第一辐射体在4.95G下的电流分布图；
图11为本申请一实施例提供的电子设备中第二辐射体在1.82G下的驻波曲线图；
图12为本申请一实施例提供的电子设备中第二辐射体在1.82G下的电流分布图；
图13为本申请一实施例提供的电子设备的结构示意图；
图14为本申请一实施例提供的电子设备的结构示意图；
图15为本申请一实施例提供的电子设备中第二金属结构件在不同高度下对应的天线性能对比图；
图16为本申请一实施例提供的电子设备中第二金属结构件的高度为0.5mm时第一辐射体的天线方向图；
图17为本申请一实施例提供的电子设备中第二金属结构件的高度为22.5mm时第一辐射体的天线方向图；
图18为本申请一实施例提供的电子设备中第二金属结构件的高度为0.5mm时第二辐射体的天线方向图；
图19为本申请一实施例提供的电子设备中第二金属结构件的高度为22.5mm时第二辐射体的天线方向图；
图20为本申请一实施例提供的电子设备中电路板、第一辐射体以及第二辐射体的结构示意图；
图21为本申请一实施例提供的电子设备中电路板、第一辐射体以及第二辐射体的结构示意图；
图22为本申请一实施例提供的电子设备的结构示意图；
图23为图22所示的电子设备的部分结构示意图；
图24为图23所示的电子设备的部分结构示意图；
图25为图23所示的电子设备的部分结构示意图；
图26为本申请一实施例提供的电子设备中第一辐射体以及第二辐射体的驻波曲线图；
图27为本申请一实施例提供的电子设备中第一辐射体在3.8G下的电流分布图；
图28为本申请一实施例提供的电子设备中第二辐射体在1.8G下的电流分布图；
图29为本申请一实施例提供的电子设备中纵向枝节的高度为1.5mm时的结构示意图；
图30为本申请一实施例提供的电子设备中纵向枝节的高度为1.5mm时的天线方向图；
图31为本申请一实施例提供的电子设备中纵向枝节的高度为13.5mm时的结构示意图；
图32为本申请一实施例提供的电子设备中纵向枝节的高度为13.5mm时的天线方向图。
附图标记说明：
100-电子设备；            110-电路板；              111-净空区域；
111a-支撑板；             112-第一馈电点；          113-第二馈电点；
120-第一金属结构件；      131-第一辐射体；          1311-第一辐射枝节；
1312-第二辐射枝节；       132-第二辐射体；          1321-第三辐射枝节；
133-隔挡枝节；            1331-间隔；               1332-间隙；
140-第二金属结构件；      141-纵向枝节；            142-第一横向枝节；
143-第二横向枝节；        151-第一耦合间隙；        152-第二耦合间隙；
153-第三耦合间隙；        160-导电结构；            170-屏蔽框；
L1-电路板的厚度方向；     L2-第一方向；             D1-第一宽度；
D2-第二宽度；             H1-第一间隙；             H2-第二间隙；
H3-第一高度；             H4-第二高度。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请，下面将结合附图对本申请实施例的实施方式进行详细描述。
本申请实施例提供一种电子设备，可以包括但不限于为智能音箱、智能门锁、手机、平板电脑、笔记本电脑、路由器、客户前置设备(Customer Premise Equipment，CPE)、物联网(The Internet of Things，IOT)设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、手持计算机、对讲机、上网本、销售点(Point of sales，POS)机、个人数字助理(personal digital assistant，PDA)、可穿戴设备、虚拟现实设备、无线U盘、蓝牙音响/耳机、或车载前装、行车记录仪、安防设备等具有天线的移动或固定终端。
其中，本申请实施例中，以CPE为上述电子设备为例进行说明。
随着5G移动通信技术的普及，CPE等终端产品的规格逐渐增加。例如，为了进一步的增加CPE的可实现功能，CPE内置天线的数量大幅度增加，但同时受限于整机尺寸的限制，产品整体布局越来越紧凑，天线间的相互影响越来越大，天线性能随之恶化。与此同时，由于规格的提高，产品功耗显著增大，为解决发热问题，散热器体积随之增大，天线空间进一步压缩。而无论是天线数量的增多，还是散热器体积的增大，都会导致成本的增加。高规格小尺寸下天线性能的损失与成本的提升是当前产品兹待解决的痛点问题之一。
具体地，相关技术中，CPE中，印制电路板(Printed Circuit Board，PCB)的上方设置有散热器，PCB板的上方靠近散热器的部位设置有射频耦合探针，散热器的表面设置有平面，而且，散热器的内部靠近射频耦合探针的上方设置有水平部分，平面的内部设置有曲线回形槽，采用电容耦合的方式，将散热器转变为天线的一个辐射部分，并通过耦合缝隙实现双频段谐振。但是，该方案中，天线结构在CPE中的占用空间较大，容易影响其它器件在CPE内的布局。
基于此，本申请实施例提供一种电子设备，该电子设备例如可以为CPE等，该电子设备中，通过在电路板的外边缘设有至少一个朝向电路板内的净空区域，并在电路板的净空区域处设置有天线，天线的一端与电路板上的馈电点电连接，天线的另一端悬空在净空区域处，另外，在第一金属结构件的外周设置有至少一个第二金属结构件，每个第二金属结构件的一端与第一金属结构件的外边缘电连接，每个第二金属结构件的另一端与天线在电路板的厚度方向上具有耦合间隙，以使得天线上的耦合到第二金属结构件上，这样，相比于现有技术中在电子设备内设计独立的天线结构，本申请实施例利用电路板上的空间设计天线，天线与第二金属结构件之间通过耦合产生辐射，能够减小天线结构在电子设备中的占用空间，进而能够避免对其它器件在电子设备内的布局造成干涉或者影响。
需要说明的是，本申请提供的天线适用于采用以下一种或多种MIMO(Multi-in Multi-out，多进多 出)通信技术的电子设备：例如，长期演进(long term evolution，LTE)通信技术、Wi-Fi通信技术、5G通信技术、SUB-6G通信技术以及未来其他MIMO通信技术等。MIMO通信技术指的是在发送端和接收端都使用多根天线，在收发之间构成多个信道的天线系统，具有极高的频谱利用效率。
可以理解的是，本申请实施例示意的结构并不构成对CPE的具体限定。在本申请另一些实施例中，CPE可以包括更多或更少的部件，或者组合某些部件，或者拆分某些部件，或者不同的部件布置。
下面分别以不同的实施例为例，并结合附图对该电子设备的具体结构进行介绍(以下各实施例不突出通信网络的需求，仅以频率大小说明天线的工作特性)。
参照图1和图2A所示，本申请实施例提供一种电子设备100，该电子设备100例如可以为CPE、音箱、手机或者电脑等，具体地，参照图1和图2A所示，该电子设备100至少可以包括：电路板110以及第一金属结构件120，其中，第一金属结构件120与电路板110层叠且间隔设置，电路板110的外边缘设有至少一个净空区域111，且净空区域111朝向电路板110向内凹陷。
可以理解的是，净空区域111为电路板110上的非金属区域。在一个实施例中，净空区域111也可以称为镂空区域。
该电子设备100还可以包括：第一辐射体131，其中，第一辐射体131可以位于净空区域111处，而且，第一辐射体131的一端与电路板110上的第一馈电点112(参见图7所示)电连接，第一辐射体131的另一端悬空在净空区域111处。
可以理解的是，“悬空”为不与其它导电结构连接的意思，即第一辐射体131的另一端与电子设备100内的其它导电结构之间无任意直接电连接关系。
可以理解的是，净空区域111可以作为净空区域，第一辐射体131可以为印制图案(pattern)、走线、导电片或者导电条等，本申请实施例对此并不加以限定。
而且，在一种可能的实现方式中，参见图2C所示，净空区域111内还可以设置有支撑板111a。在一个实施例中，支撑板111a的一侧与电路板110相连，支撑板111a的另一侧与第一辐射体131以及第二辐射体132相连。在一个实施例中，支撑板111a与电路板110为同一块基板形成。支撑板111a用于支撑第一辐射体131以及第二辐射体132，避免第一辐射体131以及第二辐射体132相对于净空区域111发生脱离。其中，支撑板111a可以为绝缘材料。
另外，参见图3所示，该电子设备100还可以包括：第二金属结构件140，第二金属结构件140可以位于第一金属结构件120的外周，且第二金属结构件140朝向电路板110的正投影的至少部分可以位于净空区域111处，每个第二金属结构件140的一端与第一金属结构件120电连接，每个第二金属结构件140的另一端与第一辐射体131在电路板的厚度方向L1上具有第一耦合间隙151，以使得第一辐射体131上的耦合到第二金属结构件140上。
这样，相比于现有技术中在电子设备100内设计独立的天线结构，本申请实施例利用电路板110上的空间设计天线，天线(例如第一辐射体131)与第二金属结构件140之间通过耦合产生辐射，能够减小天线结构在电子设备100中的占用空间，进而能够避免对其它器件在电子设备100内的布局造成干涉或者影响。也就是说，第二金属结构件140与第一辐射体131之间在保证方向图全向覆盖的前提下，能够实现小型化的宽带覆盖，即本申请实施例能够在小尺寸以及高散热能力下实现对电子设备100的高辐射性能。
在本申请实施例中，第一金属结构件120和第二金属结构件140可以为散热器，电子元器件可以为发热元器件，电子元器件与第一金属结构件120朝向电路板110的一面相互接触，此时，第一金属结构件120能够为电子元器件提供良好散热的效果。当然，在其它的一些实施例中，第一金属结构件120和第二金属结构件140还可以为金属外壳等金属结构，本申请实施例对此并不加以限定。
需要说明的是，在本申请实施例中，第一金属结构件120为散热器时，第一金属结构件120例如可以为平板散热器，平板散热器所采用的材质可以为铝。
通过将散热器作为第一金属结构件120和第二金属结构件140，能够利用散热器的结构形成天线，第二金属结构件140同时提供辐射和散热的双重功能，将散热器转变为天线的一个辐射部分，使得辐射和散热结合为一体，不仅满足了天线的性能要求，散热器能够给对发热元器件进行散热，也解决了电子设备100的散热问题，从而能够在一定程度上起到节约天线成本的作用。
在一定程度上，该天线可以在有限的设计空间内实现，有效节省了电子设备100内部的天线设计空 间。以电子设备100为CPE为例，本申请实施例通过利用CPE内部空间形成天线，能够在很大程度上节省在CPE内设计天线的空间，同时还能够在一定程度上起到节约制作天线成本的作用。
另外，相比于现有技术中需要在散热器上进行开槽实现双频段谐振，本申请实施例所提供的天线无需在散热器上额外开槽，因而形成天线时无需需要破坏散热器其本身的结构，进而不会影响散热器的散热性能。
可以理解的是，在本申请实施例中，如图4或图5所示，第一金属结构件120朝向电路板110上的正投影可以与净空区域111相互错开。通过将电路板110上的净空区域111位置设计为与第一金属结构件120在电路板110上的正投影相对错开设置，能够避免净空区域111处的天线与第一金属结构件120之间形成天线。
另外，第一金属结构件120在电路板110上的正投影的外边缘与净空区域111之间的距离可以小于或者等于10mm。通过限定电路板110上的净空区域111与第一金属结构件120在电路板110上的正投影之间的距离，能够避免电路板110上的净空区域111与第一金属结构件120在电路板110上的正投影之间的距离过大，对电路板110上的空间造成损失或浪费，进而能够避免对电子设备100内的空间造成损失和浪费。
需要说明的是，第一金属结构件120在电路板110上的正投影的外边缘与净空区域111之间的距离可以为10mm、9mm、8mm、7mm、6mm、5mm、4mm、3mm、2mm、1mm或者任意相邻两个值的中间值，本申请实施例对此并不加以限定。
当然，第一金属结构件120在电路板110上的正投影的外边缘与净空区域111之间的距离具体可以根据实际应用场景的需求进行灵活设定，例如可以根据实际的天线形式和频率进行设定，本申请实施例对此并不加以限定。
如图4所示，在本申请实施例中，第二金属结构件140可以包括：在第一平面上延伸的纵向枝节141以及第一横向枝节142，其中，第一平面与电路板的厚度方向垂直。纵向枝节141在第一平面上延伸的一端与第一金属结构件120电连接，纵向枝节141在该第一平面上延伸的另一端与第一横向枝节142相连，第一横向枝节142可以与第一辐射体131在电路板的厚度方向L1上形成第一耦合间隙151。
通过第二金属结构件140的纵向枝节141与第一金属结构件120电连接，能够实现第二金属结构件140与第一金属结构件120之间的电连接，通过第二金属结构件140的第一横向枝节142与对应的第一辐射体131在电路板的厚度方向L1上形成第一耦合间隙151，能够确保第一横向枝节142与对应的第一辐射体131之间通过耦合产生辐射。
在一个实施例中，纵向枝节141以及第一横向枝节142均在电路板的厚度方向上延伸。例如，在电路板的厚度方向上延伸一定的高度。
可以理解的是，如图6至图8所示，在本申请实施例中，该电子设备100还可以包括：第二辐射体132，第二辐射体132可以位于净空区域111处，而且，第二辐射体132的一端与电路板110上的第二馈电点113电连接，第二辐射体132的另一端悬空在净空区域111处。第一辐射体131和第二辐射体132在净空区域111处沿着第一横向枝节142的长度延伸方向间隔设置，第一横向枝节142的长度延伸方向为第一横向枝节142在电路板的正投影的长度延伸方向。
另外，第二金属结构件140还可以包括：在第一平面上延伸的第二横向枝节143，第一横向枝节142和第二横向枝节143在电路板的正投影可以分别位于纵向枝节141在电路板的正投影的两侧，此时，第一横向枝节142与第一辐射体131在电路板的厚度方向L1上形成第一耦合间隙151，第二横向枝节143与第二辐射体132在电路板的厚度方向L1上形成第二耦合间隙152(参见图4所示)。
在一个实施例中，第二横向枝节143在电路板的厚度方向上延伸。例如，在电路板的厚度方向上延伸一定的高度。
应可理解，在电路板的厚度方向上延伸，并不是指枝节的厚度方向与电路板的厚度方向完全一致，而是指，枝节的厚度方向与电路板的厚度方向在一定的锐角范围内，例如45度内。
需要说明的是，在本申请实施例中，第一耦合间隙151的尺寸(即第一间隙H1)可以为0.05mm，0.1mm，0.15mm，0.2mm、0.25mm或者任意相邻两个值的中间值，第二耦合间隙152的尺寸(即第二间隙H2)可以为0.05mm，0.1mm，0.15mm，0.2mm、0.25mm或者任意相邻两个值的中间值，本申请实施例对此并不加以限定。
通过将第二金属结构件140中横向枝节的数量设计为两个(即第一横向枝节142和第二横向枝节143)，将电路板110的净空区域111处的天线数量也设计为两个(即第一辐射体131和第二辐射体132)，在极小净空下即可实现宽带双天线共体设计。这样，第一横向枝节142能够与两个天线中的第一辐射体131在电路板的厚度方向L1上形成第一耦合间隙151，进而能够确保第一横向枝节142与第一辐射体131之间通过耦合产生辐射。第二横向枝节143能够与两个天线中的第二辐射体132在电路板的厚度方向L1上形成第二耦合间隙152，进而能够确保第二横向枝节143与第二辐射体132之间能够通过耦合产生辐射。
另外，在一些实施例中，继续参照图4所示，第一横向枝节142和第二横向枝节143在电路板的厚度方向L1上的高度可以高于第一金属结构件120在电路板的厚度方向L1上的高度。通过将第一横向枝节142和第二横向枝节143在电路板的厚度方向L1上的高度设计为高于第一金属结构件120在电路板的厚度方向L1上的高度，第二金属结构件140能够在第一金属结构件120进行散热的基础上，起到进一步散热的效果。
另外，当第二金属结构件140设计为包括在第一平面上延伸的纵向枝节141、第一横向枝节142以及第二横向枝节143，其中，该第一平面与电路板的厚度方向垂直。在一个实施例中，纵向枝节141、第一横向枝节142和第二横向枝节143共同形成如图7所示的T字型结构，例如，在电路板的正投影形成T字型结构此时，本申请实施例能够将二维天线结构扩展为三维结构，以实现天线的小型化设计。而且，呈T字型结构的第二金属结构件140耦合利用其在电路板的厚度方向L1上的高度，能够将电流分布从平面扩展至立体，从而能够有助于实现对方向图的良好调控。
当然，在其它的一些实施例中，第二金属结构件140可以设计为包括纵向枝节141以及第一横向枝节142，纵向枝节141和第一横向枝节142共同形成L字型结构(图中未示出)，或者，第二金属结构件140可以设计为包括纵向枝节141以及第二横向枝节143，纵向枝节141和第二横向枝节143共同形成L字型结构(参见图2B所示)，本申请实施例对此并不加以限定。在一个实施例中，L字型结构可以理解为电路板的正投影形成的L字型结构。
如图7所示，在本申请实施例中，第二横向枝节143的长度可以大于第一横向枝节142的长度。通过将第二横向枝节143的长度设计大于第一横向枝节142的长度，能够使得第一横向枝节142和第二横向枝节143所对应的频率不相同，以覆盖天线的不同频段，从而能够激发天线的更多性能。在一个实施例中，第一横向枝节142和第二横向枝节143的长度可以看作是在电路板上的正投影的长度。
在本申请实施例中，参照图8所示，该电子设备100还可以包括：隔挡枝节133，其中，隔挡枝节133的一端位于净空区域111中，隔挡枝节133延伸于第一辐射体131和第二辐射体132之间，隔挡枝节133的另一端通过电路板110接地。而且，隔挡枝节133可以分别与第一辐射体131和第二辐射体132之间具有间隔1331。
可以理解的是，隔挡枝节133延伸于第一辐射体131和第二辐射体132之间可以包括隔挡枝节133位于第一辐射体131一端和第二辐射体132的一端之间，也可以包括隔挡枝节133从第一辐射体131一端和第二辐射体132的一端之间穿过并向外延伸。
通过在第一辐射体131和第二辐射体132之间设计隔挡枝节133，能够对第一辐射体131和第二辐射体132之间产生隔离，避免或减轻第一辐射体131的辐射效应与第二辐射体132的辐射效应之间产生相互干扰。另外，隔挡枝节133与电路板110电连接，能够实现隔挡枝节的接地。
隔挡枝节133与纵向枝节141可以在电路板的厚度方向L1上相对且具有间隙1332，纵向枝节141与隔挡枝节133之间通过导电结构160电连接。隔挡枝节与纵向枝节141之间通过导电结构160电连接，能够实现隔挡枝节与第二金属结构件140之间的电连接。
在本申请实施例中，导电结构160可以为导电泡棉，或者，导电结构160可以为导电胶，或者，导电结构160可以为金属弹片等其它导电器件。导电泡棉、导电胶和金属弹片均能起到电连接纵向枝节141与隔挡枝节133的作用。
需要说明的是，在本申请实施例中，第一辐射体131的具体结构可以包括但不限于以下两种可能的实现方式：
一种可能的实现方式为：第一辐射体131至少可以包括：第一辐射枝节1311，电路板110上设置有第一馈电点112，第一辐射枝节1311的一端与第一馈电点112电连接，第一辐射枝节1311的另一端 悬空在净空区域111处，而且，第一横向枝节142与第一辐射枝节1311之间可以形成第一耦合间隙151。
这样，第一辐射枝节1311与第一馈电点112电连接，第一馈电点112能够对第一辐射枝节1311进行馈电，另外，第一横向枝节142与第一辐射枝节1311之间形成第一耦合间隙151，能够确保第一辐射枝节1311与第二金属结构件140的第一横向枝节142之间通过耦合产生辐射。
另一种可能的实现方式为：参见图8所示，第一辐射体131可以包括：第一辐射枝节1311以及第二辐射枝节1312，其中，第二辐射枝节1312与第一辐射枝节1311耦合相连，电路板110上设置有第一馈电点112，第一辐射枝节1311的一端与第一馈电点112电连接，第一辐射枝节1311的另一端悬空在净空区域111处，第二辐射枝节1312的一端与电路板110电连接，第二辐射枝节1312的另一端悬空在净空区域111处。
而且，第一横向枝节142与第一辐射枝节1311和第二辐射枝节1312中的至少一个之间可以形成第一耦合间隙151。示例性地，可以是第一横向枝节142与第一辐射枝节1311之间形成第一耦合间隙151，或者，可以是第一横向枝节142与第二辐射枝节1312之间形成第一耦合间隙151，或者，还可以是第一横向枝节142与第一辐射枝节1311和第二辐射枝节1312之间共同形成第一耦合间隙151。
这样，第一辐射枝节1311与第一馈电点112电连接，第一馈电点112能够对第一辐射枝节1311进行馈电，另外，第一横向枝节142与第一辐射枝节1311或者第二辐射枝节1312中的至少一者之间形成第一耦合间隙151，能够确保第二金属结构件140的第一横向枝节142与第一辐射枝节1311或者第二辐射枝节1312中的至少一者之间通过耦合产生辐射。
其中，在一些实施例中，可以将第一馈电点112设置在第二金属结构件140上，此时，第一馈电点112对第二金属结构件140进行馈电，第一辐射体131和第二辐射体132作为耦合辐射体。第二金属结构件140馈电时，天线可以为单极子天线、环天线(LOOP)、倒F型天线(Inverted F-shaped Antenna，IFA)或者平面倒F型天线(Planar Inverted F-shaped Antenna，平面倒F型天线)。
可以理解的是，在本申请实施例中，第一馈电点112可以为金属弹片、探针或者导电线缆等，这样，即可通过金属弹片、探针或者导电线缆等对第一辐射枝节1311进行馈电。需要说明的是，本申请实施例对第一馈电点112的具体形成方式并不加以限定，也不限于上述示例，只要能起到馈电连接的作用即可。
另外，在本申请实施例中，第一辐射枝节1311所对应的第一馈电点112的数量可以为一个、两个、三个或者更多个，也就是说，第一辐射枝节1311可以是通过一个第一馈电点112进行馈电，或者，第一辐射枝节1311可以是同时通过两个第一馈电点112进行馈电，或者，第一辐射枝节1311可以是同时通过三个第一馈电点112进行馈电，或者，第一辐射枝节1311可以是同时通过更多个第一馈电点112进行馈电，本申请实施例对此并不加以限定。
其中，在一些实施例中，参见图8所示，第二辐射枝节1312可以位于第一辐射枝节1311的外周。通过将第二辐射枝节1312设置在第一辐射枝节1311的外周，能够增大第二辐射枝节1312与第一辐射枝节1311之间的耦合面积。而且，第二辐射枝节1312围设在第一辐射枝节1311的外周，能够使得第一辐射体131实现全向设计，这样，第一辐射体131能够实现水平面的全向辐射，通过调整第一横向枝节142的尺寸即可实现对第一辐射体131的方向图的调控以及对隔离度的优化。
另外，第一辐射枝节1311与第二辐射枝节1312之间可以形成有第三耦合间隙153，这样，能够确保第一辐射枝节1311与第二辐射枝节1312之间通过耦合产生辐射。
同样，需要说明的是，在本申请实施例中，第二辐射体132的具体结构可以包括但不限于以下两种可能的实现方式：
一种可能的实现方式为：参见图7和图8所示，第二辐射体132可以包括：第三辐射枝节1321，电路板110上设置有第二馈电点113，第三辐射枝节1321的一端与第二馈电点113电连接，第三辐射枝节1321的另一端悬空在净空区域111处，而且，第二横向枝节143与第三辐射枝节1321之间可以形成第二耦合间隙152。
这样，第三辐射枝节1321与第二馈电点113电连接，第二馈电点113能够对第三辐射枝节1321进行馈电，另外，第二横向枝节143与第三辐射枝节1321之间形成第二耦合间隙152，能够确保第三辐射枝节1321与第二金属结构件140的第二横向枝节143之间通过耦合产生辐射。
另一种可能的实现方式为：第二辐射体132可以包括：第三辐射枝节1321以及第四辐射枝节(图 中未示出)，其中，第四辐射枝节与第三辐射枝节1321耦合相连，电路板110上设置有第二馈电点113，第三辐射枝节1321的一端与第二馈电点113电连接，第三辐射枝节1321的另一端悬空在净空区域111处，第四辐射枝节的一端与电路板110电连接，第四辐射枝节的另一端悬空在净空区域111处。
而且，第二横向枝节143与第三辐射枝节1321和第四辐射枝节中的至少一个之间可以形成第二耦合间隙152。示例性地，可以是第二横向枝节143与第三辐射枝节1321之间形成第二耦合间隙152，或者，可以是第二横向枝节143与第四辐射枝节之间形成第二耦合间隙152，或者，还可以是第二横向枝节143与第三辐射枝节1321和第四辐射枝节之间共同形成第二耦合间隙152。
这样，第三辐射枝节1321与第二馈电点113电连接，第二馈电点113能够对第三辐射枝节1321进行馈电，另外，第二横向枝节143与第三辐射枝节1321或者第四辐射枝节中的至少一者之间形成第二耦合间隙152，能够确保第二金属结构件140的第二横向枝节143与第三辐射枝节1321或者第四辐射枝节中的至少一者之间通过耦合产生辐射。
可以理解的是，在本申请实施例中，第二馈电点113可以为金属弹片、探针或者导电线缆等，这样，即可通过金属弹片、探针或者导电线缆等对第三辐射枝节1321进行馈电。需要说明的是，本申请实施例对第二馈电点113的具体形成方式并不加以限定，也不限于上述示例，只要能起到馈电连接的作用即可。
另外，在本申请实施例中，第三辐射枝节1321所对应的第二馈电点113的数量可以为一个、两个、三个或者更多个，也就是说，第三辐射枝节1321可以是通过一个第二馈电点113进行馈电，或者，第三辐射枝节1321可以是同时通过两个第二馈电点113进行馈电，或者，第三辐射枝节1321可以是同时通过三个第二馈电点113进行馈电，或者，第三辐射枝节1321可以是同时通过更多个第二馈电点113进行馈电，本申请实施例对此并不加以限定。
其中，在一些实施例中，第四辐射枝节可以位于第三辐射枝节1321的外周。通过将第四辐射枝节设置在第三辐射枝节1321的外周，能够增大第四辐射枝节与第三辐射枝节1321之间的耦合面积。而且，第四辐射枝节围设在第三辐射枝节1321的外周，能够使得第二辐射体132实现全向设计，这样，第二辐射体132能够实现水平面的全向辐射，通过调整第二横向枝节143的尺寸即可实现对第二辐射体132的方向图的调控以及对隔离度的优化。
另外，第三辐射枝节1321与第四辐射枝节之间可以形成第四耦合间隙(图中未示出)，这样，能够确保第三辐射枝节1321与第四辐射枝节之间通过耦合产生辐射。
在实际应用场景中，第一辐射体131和第二辐射体132可以为图7和图8所示的结构，其中，第一辐射体131可以包括第一辐射枝节1311和第二辐射枝节1312，第一辐射体131能够覆盖2.2GHz-5GHz，第二辐射体132可以包括第三辐射枝节1321，第二辐射体132能够覆盖1.7GHz-2.7GHz。
此处需要说明的是，在一些实施例中，图9和图10示出了第一辐射体131的驻波以及在4.95GHz下的电流分布图。第二金属结构件140的第一横向枝节142和纵向枝节141作为第一辐射体131的部分辐射体，能够在4.95GHz下产生一个新的λ/4基模模式，从而能够扩展第一辐射体131的带宽。
其中，本申请实施例中，对图9中四个谐振点2.3GHz、3GHz、4.2GHz和4.95GHz处的工作模式进行仿真试验，例如，分别向第一馈电点馈入包含2.3GHz的频段、包含3GHz的频段、包含4.2GHz的频段和包含4.95GHz的频段的电流，然后观察各个辐射枝节上的电流分布，经仿真试验得出，在2.3GHz谐振点处，主要为第二辐射枝节1312产生的左手模式，第二辐射枝节1312的电长度可以为λ/8-λ/4。在3GHz谐振点处，主要为第一辐射枝节1311产生的λ/4基模模式，第一辐射枝节1311的电长度之为λ/4。在4.2GHz谐振点处，主要为第一辐射枝节1311和第二辐射枝节1312产生的三次模式，第一辐射枝节1311和第二辐射枝节1312的电长度之和为3λ/8-3λ/4。在4.95GHz谐振点处，主要为第一横向枝节142和纵向枝节141产生的λ/4基模模式，第一横向枝节142和纵向枝节141的电长度之和为λ/4，其中，λ为谐振频率的中心频点对应的波长，例如，本申请实施例中，谐振频率的中心频点为3GHz，因此，λ为3GHz。
图11和图12示出了第二辐射体132的驻波以及在1.8GHz下的电流分布图。第二金属结构件140的第二横向枝节143和纵向枝节141作为第二辐射体132的部分辐射体，形成了三维的单极子以及具有寄生辐射结构的辐射体，能够在1.82GHz下产生一个新的λ/4基模模式，从而能够扩展第二辐射体132的带宽。
其中，本申请实施例中，对图11中的谐振点1.8GHz、2.6GHz处的工作模式进行仿真试验，例如，分别向第二馈电点溃入1.8GHz、2.6GHz的电流，然后观察各个辐射枝节上的电流分布，经仿真试验得出，在1.8GHz谐振点处，主要为第二横向枝节143和纵向枝节141产生的左手模式，第二横向枝节143和纵向枝节141电长度之和可以为λ/8-λ/4。在2.6GHz谐振点处，主要为第三辐射枝节1321产生的λ/4基模模式，第三辐射枝节1321的电长度可以为λ/4。其中，λ为谐振频率的中心频点，例如图11中可以为λ可以为1.8GHz。
在上述实施例的基础上，可以理解的是，纵向枝节141在电路板的厚度方向L1上的高度可以小于等于λ/4，其中，λ可以为最小谐振频段的中心频点对应的波长。
在一些实施例中，纵向枝节141在电路板的厚度方向L1上的高度可以为0.5mm-22.5mm。利用纵向枝节141在电路板的厚度方向L1上的高度的设计自由度，能够便于调控天线的方向图。例如，图13中所示的纵向枝节141在电路板的厚度方向L1上的高度(即第一高度H3)大于图14中所示的纵向枝节141在电路板的厚度方向L1上的高度(即第二高度H4)。通过增加纵向枝节141在电路板的厚度方向L1上的高度，能够增加纵向枝节141对第一辐射体131和第二辐射体132之间的隔离度，进而能够减小第一辐射体131与第二辐射体132之间的相互干扰程度。
其中，在一些实施例中，纵向枝节141在电路板的厚度方向L1上的高度可以为0.5mm、2mm、4mm、6mm、8mm、10mm、12mm、14mm、16mm、18mm、20mm、22mm、22.5mm或者任意相邻两个值的中间值等，本申请实施例对此并不加以限定。
具体地，参见图15所示，随着纵向枝节141在电路板的厚度方向L1上的高度从0.5mm提升至22.5mm，第一辐射体131和第二辐射体132之间的隔离度能够从8dB提升至15dB。另外，参见图16、图17、图18以及图19所示，对相同频率下，纵向枝节141在电路板的厚度方向L1上的不同高度的天线方向图，随着纵向枝节141在电路板的厚度方向L1上的高度的增加，第二金属结构件140的第一横向枝节142和第二横向枝节143对天线方向图的反向作用逐渐增强。
在本申请实施例中，净空区域111在第一方向L2上的宽度可以大于等于3mm，其中，第一方向L2可以为纵向枝节141的长度延伸的方向，述纵向枝节141的长度延伸方向为纵向枝节141在电路板的正投影的长度延伸方向。也就是说，净空区域111在纵向枝节141的长度延伸的方向上的宽度可以缩减至3mm。
例如，在一些实施例中，净空区域111在第一方向L2上的宽度可以介于3mm-15mm之间，示例性地，净空区域111在第一方向L2上的宽度可以为3mm、4mm、5mm、6mm、7mm、8mm、9mm、10mm、11mm、12mm、13mm、14mm、15mm或者任意相邻两个值的中间值等，本申请实施例对此并不加以限定。
这里需要说明的是，本申请涉及的数值和数值范围为近似值，受制造工艺的影响，可能会存在一定范围的误差，这部分误差本领域技术人员可以认为忽略不计。
参见图20和图21所示，图21中净空区域111在第一方向L2上的宽度(即第二宽度D2)小于图20中净空区域111在第一方向L2上的宽度(即第一宽度D1)，这样，在布局天线的空间足够的情况下，能够在一定程度上节省电路板110的使用面积，从而能够为电子设备100余留更大的容纳空间。
示例性地，图21中净空区域111在第一方向L2上的宽度为图20中净空区域111在第一方向L2上的宽度的二分之一，即图21中净空区域111的尺寸缩减至图20中净空区域111的尺寸的50％，但图21中所示的结构，依然能够给实现天线的辐射性能。
具体地，在实际应用场景中，第一辐射体131和第二辐射体132可以为图22和图23所示的结构，其中，第一辐射体131可以包括第一辐射枝节1311，第二辐射体132可以包括第三辐射枝节1321。此时，参见图24和图25所示，第一横向枝节142与第一辐射枝节1311在电路板的厚度方向L1上可以形成耦合间隙，第二横向枝节143与第三辐射枝节1321在电路板的厚度方向L1上可以形成耦合间隙。
此处需要说明的是，在一些实施例中，图26和图27示出了第一辐射体131的驻波以及在4.95GHz下的电流分布图。第二金属结构件140的第一横向枝节142和纵向枝节141作为第一辐射体131的部分辐射体，形成了三维的单极子以及具有寄生辐射结构的辐射体，能够在3.8GHz下产生一个新的λ/4基模模式，从而能够扩展第一辐射体131的带宽。
其中，本申请实施例中，对图26中的谐振点3.8GHz、5GHz处的工作模式进行仿真试验，例如， 分别向第一馈电点溃入3.8GHz、5GHz的电流，然后观察各个辐射枝节上的电流分布，经仿真试验得出，在3.8GHz谐振点处，主要为第一横向枝节142和纵向枝节141产生的左手模式，第一横向枝节142和纵向枝节141的电长度之和可以为λ/8-λ/4。在5GHz谐振点处，主要为第一辐射枝节1311产生的λ/4基模模式，第一辐射枝节1311的电长度之为λ/4。λ为谐振频率的中心频点，例如图26中可以为λ可以为3.8GHz。
图28示出了第二辐射体132的驻波以及在1.8GHz下的电流分布图。第二金属结构件140的第二横向枝节143和纵向枝节141作为第二辐射体132的部分辐射体，形成了三维的单极子以及具有寄生辐射结构的辐射体，能够在1.82GHz下产生一个新的λ/4基模模式，从而能够扩展第二辐射体132的带宽。
其中，本申请实施例中，对图26中的谐振点1.8GHz、2.5GHz处的工作模式进行仿真试验，例如，分别向第二馈电点溃入1.8GHz、2.5GHz的电流，然后观察各个辐射枝节上的电流分布，经仿真试验得出，在1.8GHz谐振点处，主要为第二横向枝节143和纵向枝节141产生的左手模式，第二横向枝节143和纵向枝节141电长度之和可以为λ/8-λ/4。在2.5GHz谐振点处，主要为第三辐射枝节1321产生的λ/4基模模式，第三辐射枝节1321的电长度可以为λ/4。其中，λ为谐振频率的中心频点，例如图26中可以为λ可以为2.5GHz。
同样，纵向枝节141在电路板的厚度方向L1上的高度可以小于等于λ/4，其中，λ可以为最小谐振频段的中心频点对应的波长。在一些实施例中，纵向枝节141在电路板的厚度方向L1上的高度可以为0.5mm-22.5mm。通过调节纵向枝节141在电路板的厚度方向L1上的高度，能够改变天线以及电路板110在水平方向及垂直方向上的电流分布比，从而能够有效调控天线的方向图，例如能够对方向图辐射弱场区进行补偿。参见图29至图32所示，当纵向枝节141在电路板的厚度方向L1上的高度从1.5mm增加到13.5mm时，水平方向上的电流强度明显增强，从而能够补偿天线在水平方向上的方向图凹点，使得天线的方向性系数从4.7dBi降低至3.4dBi。
在本申请实施例中，如图3所示，该电子设备100还可以包括：屏蔽框170，其中，屏蔽框170可以位于电子元器件的外周，以将电子元器件与至少一个天线分隔开，而且，屏蔽框170朝向第一金属结构件120的一侧可以与第一金属结构件120相连。通过在电子元器件的外周设置有屏蔽框170，屏蔽框170在具有散热功能的同时，能够将电子元器件与天线结构以及电路板110上的模块(例如芯片等器件)分隔开，避免电子元器件对天线的辐射性能以及芯片的工作性能产生影响，同时也能够避免天线的辐射对电子元器件的使用性能造成不良干涉，并在一定程度上消除腔体杂波及干扰泄露。
在本申请实施例中，该电子设备100还可以包括：电子元器件(图中未示出)，电子元器件可以位于电路板110和第一金属结构件120之间，而且，第一金属结构件120上朝向电路板110的一侧可以设置有凹陷的沉台(图中未示出)，电子元器件与沉台朝向电路板110的一面相接触。通过在第一金属结构件120上设置有朝向电路板110凹陷的沉台，电子元器件与沉台朝向电路板110的一面相接触，能够缩短电子元器件与第一金属结构件120之间的电连接路径。
可以理解的是，本申请实施例中，电子设备100中的天线的数量还可以为更多个。本申请实施例提供的电子设备100中，通过天线数量的增加，电子设备100中天线能够实现更多天线模式的覆盖。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
在本申请实施例或者暗示所指的装置或者元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。在本申请实施例的描述中，“多个”的含义是两个或两个以上，除非是另有精确具体地规定。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请实施例的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“可以包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那 些步骤或单元，而是可可以包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制，尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换，而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例各实施例技术方案的范围。

Claims (20)

  1. 一种电子设备，其特征在于，至少包括：
    电路板以及第一金属结构件；所述第一金属结构件与所述电路板层叠且间隔设置；
    所述电路板的外边缘设有朝向所述电路板内的净空区域；
    还包括：第一辐射体，所述第一辐射体位于所述净空区域处，且所述第一辐射体的一端与所述电路板上的第一馈电点电连接，所述第一辐射体的另一端悬空在所述净空区域处；
    还包括：第二金属结构件；所述第二金属结构件位于所述第一金属结构件的外周，且所述第二金属结构件朝向所述电路板的正投影的至少部分位于所述净空区域处；
    所述第二金属结构件的一端与所述第一金属结构件电连接，所述第二金属结构件的另一端与所述第一辐射体在所述电路板的厚度方向上具有第一耦合间隙。
  2. 根据权利要求1所述的电子设备，其特征在于，所述第一金属结构件朝向所述电路板上的正投影与所述净空区域相互错开。
  3. 根据权利要求1或2所述的电子设备，其特征在于，所述第二金属结构件包括在第一平面上延伸的纵向枝节以及第一横向枝节，所述第一平面与所述电路板的厚度方向垂直；
    其中，所述纵向枝节在所述第一平面上延伸的一端与所述第一金属结构件电连接，所述纵向枝节在所述第一平面上延伸的另一端与所述第一横向枝节相连，所述第一横向枝节与所述第一辐射体在所述电路板的厚度方向上具有所述第一耦合间隙。
  4. 根据权利要求3所述的电子设备，其特征在于，还包括：第二辐射体，所述第二辐射体位于所述净空区域处，且所述第二辐射体的一端与所述电路板上的第二馈电点电连接，所述第二辐射体的另一端悬空在所述净空区域处；
    所述第一辐射体和所述第二辐射体在所述净空区域处沿着所述第一横向枝节的长度延伸方向间隔设置，所述第一横向枝节的长度延伸方向为所述第一横向枝节在所述电路板的正投影的长度延伸方向。
  5. 根据权利要求3或4所述的电子设备，其特征在于，所述第二金属结构件还包括第二横向枝节，所述第一横向枝节和所述第二横向枝节在所述电路板的正投影分别位于所述纵向枝节在所述电路板的正投影的两侧；
    所述第二横向枝节与所述第二辐射体在所述电路板的厚度方向上具有第二耦合间隙。
  6. 根据权利要求3至5中任一项所述的电子设备，其特征在于，所述纵向枝节以及所述第一横向枝节均在所述电路板的厚度方向上延伸。
  7. 根据权利要求5所述的电子设备，其特征在于，所述第二横向枝节在所述电路板的厚度方向上延伸。
  8. 根据权利要求5所述的电子设备，其特征在于，还包括：隔挡枝节，所述隔挡枝节的一端位于所述净空区域中，且所述隔挡枝节延伸于所述第一辐射体和所述第二辐射体之间，所述隔挡枝节的另一端通过所述电路板接地，且所述隔挡枝节分别与所述第一辐射体和所述第二辐射体之间具有间隔。
  9. 根据权利要求8所述的电子设备，其特征在于，所述隔挡枝节与所述纵向枝节在所述电路板的厚度方向上相对且具有间隙，所述纵向枝节与所述隔挡枝节之间通过导电结构电连接。
  10. 根据权利要求3-9任一所述的电子设备，其特征在于，所述第一辐射体至少包括：第一辐射枝节；
    所述第一辐射枝节的一端与所述第一馈电点电连接，所述第一辐射枝节的另一端悬空在所述净空区域处；
    且所述第一横向枝节与所述第一辐射枝节之间形成所述第一耦合间隙。
  11. 根据权利要求10所述的电子设备，其特征在于，所述第一辐射体还包括：与所述第一辐射枝节耦合的第二辐射枝节；
    所述第二辐射枝节的一端通过所述电路板接地，所述第二辐射枝节的另一端悬空在所述净空区域处；
    且所述第一横向枝节与所述第一辐射枝节和所述第二辐射枝节中的至少一个之间形成所述第一耦合间隙，所述第一辐射枝节与所述第二辐射枝节之间形成第三耦合间隙。
  12. 根据权利要求5-9任一所述的电子设备，其特征在于，所述第二辐射体包括：第三辐射枝节；
    所述第三辐射枝节的一端与所述第二馈电点电连接，所述第三辐射枝节的另一端悬空在所述净空区 域处；
    且所述第二横向枝节与所述第三辐射枝节之间形成所述第二耦合间隙。
  13. 根据权利要求3-12任一所述的电子设备，其特征在于，所述纵向枝节在所述电路板的厚度方向上的高度小于等于λ/4，所述λ为最小谐振频段的中心频点对应的波长。
  14. 根据权利要求5-9任一所述的电子设备，其特征在于，所述第一横向枝节和所述第二横向枝节在所述电路板的厚度方向上高于所述第一金属结构件。
  15. 根据权利要求5-9任一所述的电子设备，其特征在于，所述第二横向枝节的长度大于所述第一横向枝节的长度。
  16. 根据权利要求3-15任一所述的电子设备，其特征在于，所述净空区域在第一方向上的宽度大于等于3mm；
    其中，所述第一方向为所述纵向枝节的长度延伸的方向，所述纵向枝节的长度延伸方向为所述纵向枝节在所述电路板的正投影的长度延伸方向。
  17. 根据权利要求1-15任一所述的电子设备，其特征在于，还包括：电子元器件；
    所述电子元器件位于所述电路板和所述第一金属结构件之间；
    所述第一金属结构件上朝向所述电路板的一侧设置有凹陷的沉台，所述电子元器件与所述沉台朝向所述电路板的一面相接触。
  18. 根据权利要求17所述的电子设备，其特征在于，还包括：屏蔽框；所述屏蔽框位于所述电子元器件的外周，以将所述电子元器件与所述至少一个天线分隔开；
    且所述屏蔽框朝向所述第一金属结构件的一侧与所述第一金属结构件相连。
  19. 根据权利要求17或18所述的电子设备，其特征在于，所述第一金属结构件和所述第二金属结构件为散热器；
    所述电子元器件为发热元器件。
  20. 根据权利要求1-19任一所述的电子设备，其特征在于，所述电子设备为客户前置设备。
PCT/CN2023/120192 2022-10-01 2023-09-20 电子设备 WO2024067316A1 (zh)

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