WO2024066985A1 - 通信方法及设备 - Google Patents

通信方法及设备 Download PDF

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Publication number
WO2024066985A1
WO2024066985A1 PCT/CN2023/117260 CN2023117260W WO2024066985A1 WO 2024066985 A1 WO2024066985 A1 WO 2024066985A1 CN 2023117260 W CN2023117260 W CN 2023117260W WO 2024066985 A1 WO2024066985 A1 WO 2024066985A1
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WIPO (PCT)
Prior art keywords
communication
rate
standard
condition
communication information
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PCT/CN2023/117260
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English (en)
French (fr)
Inventor
吴超
刘进
刘光明
王厚新
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华为技术有限公司
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Publication of WO2024066985A1 publication Critical patent/WO2024066985A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received

Definitions

  • the embodiments of the present application relate to the field of communication technology, and in particular, to a communication method and device.
  • Ethernet communication protocol IEEE 802.3 series standards
  • Ethernet communication protocol is easily affected by the quality of cables. For example, due to the aging, misalignment, or disconnection of cables in pipes, the network speed will decrease, or even disconnection will lead to inability to connect, affecting the user's network connection performance.
  • the present application provides a communication method and device.
  • the technical solution provided by the present application is that when the device determines that the communication information transmission rate of the first standard does not meet the first condition, it can switch to the second standard to transmit communication information, improve the impact of cable quality on transmission performance, and achieve improved network communication performance.
  • a communication method is provided, which is applied to a communication system including a first device and a second device, wherein the first device and the second device are connected via a network cable.
  • the method includes: the first device determines a first rate at which first communication information is transmitted via a first standard. When the first rate satisfies a first condition, the first device determines to send the first communication information to the second device via the first standard. When the first rate does not satisfy the first condition, the first device determines to send the first communication information to the second device via a second standard.
  • the first standard is Ethernet communication
  • the second standard is Orthogonal Frequency Division Multiplexing (OFDM) modulation communication.
  • OFDM Orthogonal Frequency Division Multiplexing
  • the multiple standards use different protocol types or different modulation methods.
  • the communication information is, for example, a modulation waveform transmitted between the first device and the second device.
  • the first device and the second device are compatible with the communication of the first modulation and the second modulation, and can adaptively switch the first modulation and the second modulation according to the transmission rate to ensure the quality of network communication.
  • a first device includes a switch circuit structure for switching a first path corresponding to a first standard and a second path corresponding to a second standard.
  • the switch circuit structure is respectively connected to multiple interfaces of multiple different standards, and the multiple interfaces include a first interface of a first standard and a second interface of a second standard.
  • multiple interfaces of multiple different standards are integrated on the same chip, or multiple interfaces of multiple different standards are distributed on multiple chips that communicate with each other.
  • the SoC chip of the first device includes an Ethernet physical layer interface (such as a first interface of the first standard) and an OFDM modulation physical layer interface (such as a second interface of the second standard).
  • the first device includes two SoC chips that communicate with each other, namely SoC chip 1 and SoC chip 2, and the first interface and the second interface are respectively distributed on SoC chip 1 and SoC chip 2.
  • SoC chip 1 includes the first interface
  • SoC chip 2 includes the second interface.
  • SoC chip 1 includes the first interface and the second interface
  • SoC chip 2 includes the first interface, etc.
  • the network cable includes multiple pairs of twisted pairs
  • the switch circuit structure includes multiple switches, and the multiple switches correspond one-to-one to the multiple pairs of twisted pairs.
  • the first device is configured with 4 switches corresponding to the 4 pairs of twisted-pair cables respectively.
  • the first device includes one or more transformers, and the one or more transformers are used to combine the receiving and sending paths corresponding to the first communication information of the second standard into a second path.
  • the second interface of the chip realizes bidirectional communication with the transformer through the transmitting port TX and the receiving port RX, and the transformer combines the receiving and transmitting paths corresponding to the transmitting port TX and the receiving port RX of the second interface into a second path between the transformer and the switch.
  • the network cable includes multiple pairs of twisted pair cables
  • the first communication information sent by the first device to the second device through the second standard includes a first electrical signal
  • the first electrical signal includes multiple sub-signals
  • the multiple pairs of twisted pair cables and the multiple sub-signals correspond one-to-one
  • each pair of twisted pair cables in the multiple pairs of twisted pair cables is used to transmit the corresponding sub-signal.
  • the first device modulates the data to be transmitted into an electrical signal for communication through OFDM modulation technology.
  • the first device uses MIMO technology to simultaneously send electrical signals on two or more pairs of twisted pairs among multiple pairs of twisted pairs to increase data transmission bandwidth.
  • the first device uses MIMO technology to simultaneously send four sub-signals corresponding to the first electrical signal on four pairs of twisted pairs.
  • the number of transformers is a first number
  • the number of sub-signals is a second number
  • the second number is n times the first number
  • n is a positive integer
  • the second interface on the chip in the first device supports dual-channel MIMO communication.
  • the number of transformers in the first device is 2, transformer 0 and transformer 1.
  • the transformer and the sub-signal may also be in a one-to-one, many-to-one, or one-to-many relationship.
  • the first device determines to send the first communication information to the second device through the second standard, including: when the first rate does not meet the first condition, the first device determines the second rate for transmitting the first communication information through the second standard. If the second rate meets the second condition, the first device determines to send the first communication information to the second device through the second standard.
  • the first condition includes that the first rate is greater than or equal to the target rate, and the second condition includes that the second rate is greater than the first rate.
  • the first device determines to switch to the second standard, if the second rate of transmitting the first communication information can be greater than the first rate of transmitting the first communication information through the first standard, the first device can switch to the second standard. Otherwise, the first device continues to send the first communication information to the second device through the first standard to reduce the power consumption of the standard switching.
  • the method further includes: the first device and the second device negotiate the first rate and/or the second rate.
  • the first device and the second device determine the first rate and the second rate through negotiation to determine whether to switch between the first standard and the second standard.
  • the method when the first rate satisfies the first condition, after the first device determines to send the first communication information to the second device through the first standard, the method further includes: the first device determines that the rate of sending the first communication information is reduced to a third rate, and the third rate does not satisfy the first condition. The first device determines to send the first communication information to the second device through the second standard.
  • the first device may also switch to OFDM modulation communication (ie, the second standard) to improve the communication quality.
  • OFDM modulation communication ie, the second standard
  • a communication device is provided.
  • the communication device is a first device, and the first device and the second device are connected via a network cable.
  • the first device includes: a processor and a memory, the memory is coupled to the processor, the memory is used to store computer program code, and the computer program code includes computer instructions.
  • the processor reads the computer instructions from the memory, the first device executes: the first device determines a first rate for transmitting first communication information through a first standard. When the first rate meets a first condition, the first device determines to send the first communication information to the second device through the first standard. When the first rate does not meet the first condition, the first device determines to send the first communication information to the second device through a second standard.
  • a first device includes a switch circuit structure for switching a first path corresponding to a first standard and a second path corresponding to a second standard.
  • the switch circuit structure is connected to multiple interfaces of multiple different standards respectively, and the multiple interfaces include a first interface of a first standard and a second interface of a second standard.
  • multiple interfaces of multiple different standards are integrated on the same chip, or multiple interfaces of multiple different standards are distributed on multiple chips that communicate with each other.
  • the network cable includes multiple pairs of twisted pairs
  • the switch circuit structure includes multiple switches
  • the multiple switches correspond one-to-one to the multiple pairs of twisted pairs.
  • the first device includes one or more transformers, and the one or more transformers are used to combine the receiving and sending paths corresponding to the first communication information of the second standard into a second path.
  • the network cable includes multiple pairs of twisted pair cables
  • the first communication information sent by the first device to the second device through the second standard includes a first electrical signal
  • the first electrical signal includes multiple sub-signals
  • the multiple pairs of twisted pair cables and the multiple sub-signals correspond one-to-one
  • each pair of twisted pair cables in the multiple pairs of twisted pair cables is used to transmit the corresponding sub-signal.
  • the number of transformers is a first number
  • the number of sub-signals is a second number
  • the second number is n times the first number
  • n is a positive integer
  • the first device determines to send the first communication information to the second device through the second standard, including: when the first rate does not meet the first condition, the first device determines the second rate for transmitting the first communication information through the second standard. If the second rate meets the second condition, the first device determines to send the first communication information to the second device through the second standard.
  • the first condition includes that the first rate is greater than or equal to the target rate, and the second condition includes that the second rate is greater than the first rate.
  • the processor when the processor reads the computer-readable instructions from the memory, it also enables the first device to perform the following operations: the first device and the second device negotiate the first rate and/or the second rate.
  • the first device when the first rate satisfies the first condition, after the first device determines to send the first communication information to the second device through the first standard, when the processor reads the computer-readable instruction from the memory, the first device is also caused to perform the following operations: the first device determines that the rate of sending the first communication information is reduced to a third rate, and the third rate does not satisfy the first condition. The first device determines to send the first communication information to the second device through the second standard.
  • the first standard is Ethernet communication
  • the second standard is orthogonal frequency division multiplexing OFDM modulation communication
  • the present application provides a communication device having the function of implementing the communication method described in the first aspect and any possible implementation thereof.
  • the function can be implemented by hardware, or by hardware executing corresponding software.
  • the hardware or software includes one or more modules corresponding to the above functions.
  • the present application provides a computer-readable storage medium.
  • the computer-readable storage medium stores a computer program (also referred to as an instruction or code), which, when executed by a communication device, enables the communication device to execute the method of the first aspect or any one of the implementations of the first aspect.
  • the present application provides a computer program product.
  • the computer program product When the computer program product is executed on a communication device, the communication device executes the method of the first aspect or any one of the implementations of the first aspect.
  • the present application provides a circuit system, the circuit system comprising a processing circuit, and the processing circuit is configured to execute the method of the first aspect or any one of the embodiments of the first aspect.
  • the present application provides a chip system comprising at least one processor and at least one interface circuit, wherein the at least one interface circuit is used to perform transceiver functions and send instructions to the at least one processor, and when the at least one processor executes the instructions, the at least one processor executes the method of the first aspect or any one of the embodiments of the first aspect.
  • FIG1 is a schematic diagram of a communication system to which a communication method is applied according to an embodiment of the present application
  • FIG2 is a schematic diagram of the hardware structure of a first device provided in an embodiment of the present application.
  • FIG3 is a schematic diagram of the structure of a first device and a second device provided in an embodiment of the present application;
  • FIG4 is a schematic diagram of a channel provided in an embodiment of the present application.
  • FIG5 is a schematic diagram of the structure of an OFDM modulation interface supporting two-way MIMO communication provided in an embodiment of the present application
  • FIG6 is a schematic diagram of the structure of an OFDM modulation interface supporting four-way MIMO communication provided in an embodiment of the present application
  • FIG. 7 is a schematic diagram of a flow chart of a communication method provided in an embodiment of the present application.
  • FIG8 is a second schematic flow chart of a communication method provided in an embodiment of the present application.
  • FIG9 is a schematic diagram of a third flow chart of a communication method provided in an embodiment of the present application.
  • FIG10 is a schematic diagram of the structure of a communication device provided in an embodiment of the present application.
  • references to "one embodiment” or “some embodiments” etc. described in this specification mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements “in one embodiment”, “in some embodiments”, “in some other embodiments”, “in some other embodiments”, etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean “one or more but not all embodiments", unless otherwise specifically emphasized in other ways.
  • the terms “including”, “comprising”, “having” and their variations all mean “including but not limited to”, unless otherwise specifically emphasized in other ways.
  • connection includes direct connection and indirect connection, unless otherwise specified. "First” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • the words “exemplarily” or “for example” are used to indicate examples, illustrations or explanations. Any embodiment or design described as “exemplarily” or “for example” in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as “exemplarily” or “for example” is intended to present related concepts in a specific way.
  • Ethernet is a local area network (LAN) networking technology.
  • IEEE 802.3 protocol specified by the Institute of Electrical and Electronics Engineers (IEEE) provides the technical standard for Ethernet.
  • the IEEE 802.3 protocol specifies the content including the connection of the physical layer, electrical signals and the media access layer protocol. In other words, the IEEE 802.3 protocol specifies the cable type and signal processing method used in the local area network.
  • the IEEE 802.3 protocol stipulates that data can be transmitted between interconnected devices at a rate of 10Mbps-10Gbps (10Mbps, 100Mbps, 1Gbps, 2.5Gbps, 5Gbps, 10Gbps).
  • the data transmission rate between interconnected devices is limited by the network cables between the interconnected devices. The faster the transmission rate, the higher the specification of the network cable is required.
  • Network cables are generally made of metal (such as copper) or glass and are used to transmit network information.
  • twisted pair can also be called network cable, which can be divided into shielded twisted pair (STP) and unshielded twisted pair (UTP).
  • STP shielded twisted pair
  • UTP unshielded twisted pair
  • the common network cable is unshielded twisted pair, which consists of four pairs of thin copper wires, each pair of copper wires is twisted together, each copper wire is wrapped with a colored plastic insulation layer, and then the whole is wrapped with a layer of plastic jacket.
  • the connector of the unshielded twisted pair is RJ-45 connector.
  • switches switch hubs
  • home distributed routers generally support Ethernet interfaces (for example, interfaces corresponding to RJ-45 connectors). Users use multiple network ports on switches or routers to build home networks, support high-speed network communications within the home, and support the deployment of distributed Wi-Fi hotspots.
  • the network cables in the home network may have been deployed for a long time without being replaced, resulting in changes in the properties of the copper wires in the network cables, such as cable aging, miswiring, and disconnection. This in turn causes the channel quality of the network cables to deteriorate, making it impossible to support Gigabit Ethernet (GE) or higher-speed negotiation modes, making it difficult for the network cables to work at the target communication rate or even unable to connect, affecting the user's network connection performance.
  • GE Gigabit Ethernet
  • Wi-Fi bandwidth is also constantly improving, especially Wi-Fi 6 and Wi-Fi 7, which have reached more than 2Gbps.
  • the data transmission method in home networks which uses network cables as interconnection media and Ethernet protocol as transmission protocol, has become the bandwidth bottleneck of home networks.
  • 2.5GE and above specifications have not been popularized in home networks due to high requirements for network cable specifications and cost.
  • the Ethernet protocol has weak adaptive capabilities and can only select specific working modes among 10Mbps, 100Mbps, 1000Mbps, etc.
  • the speed levels under different working modes vary greatly. For example, if the channel capacity of the network cable between interconnected devices is less than 1000Mbps, the interconnected devices using the Ethernet protocol can only work in 100Mbps mode and obtain a 100Mbps rate.
  • the embodiment of the present application provides a communication method, which supports an interface based on orthogonal frequency division multiplexing (OFDM) modulation technology communication, and improves the impact of cable quality on transmission performance.
  • OFDM modulation technology has a very flexible rate adaptation mechanism, which can approach the maximum capacity of the channel and improve network communication performance.
  • Fig. 1 is a schematic diagram of a communication system to which the communication method provided in an embodiment of the present application is applied. As shown in Fig. 1 , the communication system includes a first device 100 and a second device 200 .
  • the first device 100 or the second device 200 may be, for example, a switch, a router, etc.
  • the present application does not limit the specific type of the first device 100 or the second device 200.
  • the first device 100 and the second device 200 are both routers.
  • the first device 100 and the second device 200 can be configured as a parent-child router, such as the first device 100 is a parent router and the second device 200 is a child router.
  • the line between the first device 100 and the second device 200 may be a network cable.
  • the network cable may be a shielded twisted pair cable.
  • the network cable may be an unshielded twisted pair cable.
  • FIG2 shows a schematic diagram of a hardware structure of the first device 100 .
  • the first device 100 includes at least one processor 21, a memory 22, and a network interface 23.
  • the memory 22 may also be included in the processor 21.
  • the first device 100 may also include a wireless communication circuit 24.
  • Processor 21 can be a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of the program of the present application.
  • CPU central processing unit
  • ASIC application-specific integrated circuit
  • the memory 22 is used to store instructions and data.
  • the processor 21 can call the instructions or data stored in the memory 22 to perform related operations, such as forward error correction encoding and modulating electrical signals on the data so that the data can be carried by the electrical signals.
  • the electrical signals can be demodulated and decoded to obtain the data carried by the electrical signals.
  • the memory 22 can exist independently, or the memory 22 can be integrated with the processor 21.
  • the network interface 23 may include at least one wired network interface, which may be configured to be connected to other devices, such as the second device 200 , via a network cable.
  • the first device 100 can be connected to the Internet through a network cable while being connected to other devices through a network cable.
  • the first device 100 can be connected to the Internet through a network provided by a telecommunications operator. That is, in this example, the wired network interface of the first device 100 can be connected to a network interface provided by a telecommunications operator through a network cable, and then connected to the Internet.
  • the first device 100 may further include a wireless communication circuit 24.
  • the wireless communication circuit 24 may be configured to communicate via a wireless local area network standard such as a Wi-Fi network.
  • the wireless communication circuit 24 may be one or more devices integrating at least one communication processing module.
  • the wireless communication circuit 24 may receive electromagnetic waves via an antenna 241, frequency modulate and filter the electromagnetic wave signals, perform demodulation and decoding to extract data, and send the data to the processor 21.
  • the wireless communication circuit 24 may also receive data to be sent from the processor 21, encode and modulate it, frequency modulate it, amplify it, and convert it into electromagnetic waves for radiation via the antenna 241.
  • the structure illustrated in the above embodiment of the present application is only a limitation of a possible implementation form of the first device 100.
  • the first device 100 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently.
  • the components shown in the figure can be implemented in hardware, software, or a combination of software and hardware.
  • the first device 100 and the second device 200 in the embodiment of the present application may be implemented by different devices.
  • the devices may have the same, similar or somewhat different hardware structures.
  • the second device 200 may also have the hardware structure shown in FIG. 2 .
  • the communication resources between devices may include frequency domain resources, and the frequency domain resources may be used during the communication process to modulate the data to be transmitted into an electrical signal.
  • the communication frequency band of the frequency domain resources can be divided into multiple orthogonal subcarriers, and the modulation order of each subcarrier is adaptively adjusted according to the credible noise ratio.
  • the channel adaptability in OFDM modulation technology is stronger. During the communication process, it can approach the maximum capacity of the channel to increase the data transmission bandwidth.
  • the first device 100 or the second device 200 is configured with an Ethernet communication path and a communication path modulated by OFDM technology.
  • communication can be based on Ethernet, or the data to be transmitted can be modulated into an electrical signal by OFDM modulation technology. Then, in the case of poor Ethernet communication quality, OFDM modulation communication can be switched.
  • OFDM modulation technology adaptive modulation technology can be used to approach the network channel capacity and increase the communication bandwidth.
  • an Ethernet physical layer (PHY) interface and an OFDM modulation physical layer interface are configured on the system on chip (SoC) in the first device 100 or the second device 200.
  • SoC system on chip
  • the communication path connected through the Ethernet physical layer interface and the communication path connected through the OFDM modulation physical layer interface are switched into one communication path through an analog switch, and then converted through a network port transformer to achieve communication with other devices through a network interface.
  • the conversion of the network port transformer can protect circuits such as virtual switches from being damaged by network interface surges.
  • the switch shown in FIG3 is, for example, a double-pole double-throw (DPDT).
  • DPDT double-pole double-throw
  • the first device 100 or the second device 200 can first realize inter-device communication through a communication path accessed by a common Ethernet physical layer interface. Afterwards, when it is determined that the current Ethernet communication quality is poor, the communication path accessed by the OFDM modulation physical layer interface can be switched through DPDT to realize inter-device communication.
  • DPDT double-pole double-throw
  • the first device 100 or the second device 200 may first determine whether the opposite device supports communication using the OFDM modulation technology. If it supports communication using the OFDM modulation technology, the communication interface may be switched. For example, the first device 100 determines that the current Ethernet communication quality is poor, such as the data transmission rate is less than the target communication rate, or it cannot be connected, and determines that the opposite second device 200 supports communication using the OFDM modulation technology. Then, the first device 100 may switch to use the OFDM modulation physical layer interface for communication through DPDT.
  • the embodiment of the present application adopts the OFDM modulation technology of adaptive modulation to modulate the data to be transmitted into an electrical signal.
  • the channel adaptability is strong, which can approach the actual channel capacity and improve the communication bandwidth.
  • the solution of the embodiment of the present application can be closer to the actual channel capacity.
  • the device has both Ethernet communication capability and OFDM modulation communication capability, thereby improving the compatibility of the device in different usage scenarios.
  • the above describes the communication method between devices by taking the example of switching the Ethernet physical layer interface and the OFDM modulation physical layer interface between the first device 100 and the second device 200.
  • the following describes the data transmission scheme of a single device in detail by taking the first device 100 as an example.
  • NXT near-end cross talk
  • FEST far-end cross talk
  • the device may use multiple-input multiple-output (MIMO) technology to simultaneously send electrical signals on two or more pairs of twisted pairs among multiple pairs of twisted pairs to increase the data transmission bandwidth.
  • MIMO multiple-input multiple-output
  • the crosstalk between two or more pairs of twisted pairs is just the cross-channel between the transmitter and the receiver.
  • the receiver can convert the crosstalk between two or more pairs of twisted pairs into signal gain through a channel equalization algorithm.
  • the receiving side can use a minimum mean square error (MMSE) algorithm to equalize the electrical signal and convert the crosstalk into signal gain.
  • MMSE minimum mean square error
  • the network cable includes a plurality of twisted pairs, such as the plurality of twisted pairs including twisted pair E1 and twisted pair E2.
  • MIMO technology is used to transmit electrical signals simultaneously on twisted pair E1 and twisted pair E2.
  • the transmitting port of twisted pair E1 is TX1, the receiving port is RX1, and the channel is channel H1.
  • the transmitting port of twisted pair E2 is TX2, the receiving port is RX2, and the channel is channel H2.
  • the crosstalk from twisted pair E1 to twisted pair E2 is relative to the cross channel H3, and the crosstalk from twisted pair E2 to twisted pair E1 is relative to the cross channel H4. Therefore, the receiving end can use a channel equalization algorithm to convert the crosstalk between twisted pair E1 and twisted pair E2 into signal gain.
  • the network cable is an unshielded twisted pair cable, which is composed of four pairs of thin copper wires, each pair of copper wires is twisted together (that is, the network cable is a 4-core network cable) as an example to illustrate the device data transmission process.
  • the network cable includes copper wire 1-copper wire 8.
  • copper wire 1 and copper wire 2 form a pair of copper wires, corresponding to the communication between switch 1 and the network port transformer;
  • copper wire 4 and copper wire 5 form a pair of copper wires, corresponding to the communication between switch 2 and the network port transformer;
  • copper wire 3 and copper wire 6 form a pair of copper wires, corresponding to the communication between switch 3 and the network port transformer;
  • copper wire 7 and copper wire 8 form a pair of copper wires, corresponding to the communication between switch 4 and the network port transformer.
  • the OFDM modulation physical layer interface on the SoC supports dual-channel MIMO communication, and forms two pairs of differential pairs switching with the Ethernet physical layer interface, and the other two pairs of differential pairs serve as backup communication paths. In this way, when any pair of differential pairs is intact, the device can achieve OFDM modulation communication with the opposite device.
  • the OFDM modulation physical layer interface uses MIMO communication technology to connect transformer 0 and transformer 1 to form a dual-path MIMO communication. Afterwards, the dual-path MIMO communication of the OFDM modulation physical layer interface and the communication of the Ethernet physical layer interface can be switched through switch 1, switch 2, switch 3, and switch 4.
  • the transmitting port TX 0 and the receiving port RX 0 of the OFDM modulation physical layer interface respectively establish communication connections with a pair of windings of transformer 0 to realize one MIMO communication in the dual-path MIMO communication.
  • a pair of windings at the other end of transformer 0 respectively establish communication connections with switch 1 and switch 2.
  • the communication path between transformer 0 and switch 1 and the communication path between transformer 0 and switch 2 are backup communication paths for each other, and the data transmitted on the two communication paths are the same. In this way, when data transmission on any of the communication paths fails, the device can also complete data transmission through another communication path, thereby increasing the fault tolerance rate of data transmission of this MIMO communication and ensuring communication quality.
  • the transmitting port TX 1 and the receiving port RX 1 of the OFDM modulation physical layer interface respectively establish communication connections with a pair of windings of transformer 1 to realize the other MIMO communication in the dual-path MIMO communication.
  • a pair of windings at the other end of transformer 1 respectively establish communication connections with switch 3 and switch 4.
  • the communication path between transformer 1 and switch 3 and the communication path between transformer 1 and switch 4 are backup communication paths for each other, and the data transmitted on the two communication paths are the same. In this way, when data transmission on any of the communication paths fails, the device can also complete data transmission through another communication path, which also increases the fault tolerance rate of data transmission of this MIMO communication and ensures the communication quality.
  • the device uses MIMO technology to communicate in the OFDM modulation physical layer interface, which can avoid crosstalk and increase data transmission bandwidth.
  • MIMO communication through two-way MIMO communication, communication path backup is achieved, increasing the fault tolerance of data transmission and improving communication quality.
  • the device data transmission process is described by still taking the network cable as an unshielded twisted pair cable (ie, the network cable is a 4-core network cable) as an example.
  • the OFDM modulation physical layer interface on the SoC supports four-way MIMO communication, and implements the switching of four pairs of differential pairs with the Ethernet physical layer interface, which can achieve the highest OFDM modulation performance transmission in the 4-core network cable. That is, each MIMO communication channel is connected to a different switch, and the implementation corresponds to the Ethernet communication channel.
  • the OFDM modulation physical layer interface connects transformer 0, transformer 1, transformer 2, and transformer 3 through MIMO communication technology to form four-way MIMO communication. Afterwards, through switch 1, switch 2, switch 3, and switch 4, the four-way MIMO communication of the OFDM modulation physical layer interface can be switched, or the communication of the Ethernet physical layer interface can be switched.
  • the device uses MIMO technology to communicate in the OFDM modulation physical layer interface, which can avoid crosstalk and increase data transmission bandwidth.
  • the 4-core network cable is fully utilized for communication, effectively improving transmission performance.
  • a line driver may be provided on the line between the OFDM modulation physical layer interface and the transformer to amplify the electrical signal. Specifically, when the electrical signal sent by the line between the OFDM modulation physical layer interface and the transformer passes through the line driver, the line driver may amplify the electrical signal, thereby increasing the ability of the electrical signal to pass through the transformer and be transmitted to other devices through the network cable.
  • the SoC may use OFDM modulation technology to modulate the data to be transmitted to obtain a telecommunication
  • the electrical signal is amplified by the line driver on the line between the OFDM modulation physical layer interface and the transformer, and then the electrical signal is sent out through the transformer.
  • Figure 7 is a flow chart of a communication method provided in an embodiment of the present application. As shown in Figure 7, the method includes the following steps.
  • S701 The first device starts up and begins an Ethernet communication negotiation process.
  • devices in current home network communication, office network communication and other scenarios generally support Ethernet communication. Therefore, after the first device is powered on and started, it can default to using Ethernet communication to perform communication negotiation with the second device.
  • the SoC in the first device 100 after the SoC in the first device 100 is powered on, it selects to use the Ethernet physical layer interface for communication through a switch and starts the Ethernet communication negotiation process with the second device 200.
  • the SoC of the second device 200 selects to use the Ethernet physical layer interface for Ethernet communication negotiation with the first device 100 through a switch.
  • the first device and the second device negotiate the communication rate according to the target communication rate. If the negotiated communication rate is greater than or equal to the target communication rate, it can be determined that the negotiated communication rate meets the communication rate setting condition. If the negotiated communication rate is less than the target communication rate, it can be determined that the negotiated communication rate does not meet the communication rate setting condition.
  • the first device and the second device negotiate the GE mode, that is, the target communication rate is 1000Mbps. Afterwards, after the negotiation is completed, the communication rate is determined to be 1000Mbps. Then, the first device can determine that the negotiated communication rate meets the communication rate setting condition, and can execute the following step S703. Alternatively, after the negotiation is completed, the communication rate is determined to be 100Mbps. Then, the first device can determine that the negotiated communication rate does not meet the communication rate setting condition, and can execute the following step S704.
  • the first device cannot connect due to abnormal network cables, such as aging, misalignment, or disconnection of the piped cable. Then, the first device may also determine that the negotiated communication rate does not meet the communication rate setting condition. Then, the first device may execute the following step S704.
  • S703 The first device determines to communicate with the second device using Ethernet.
  • the first device and the second device after the first device and the second device complete the Ethernet communication negotiation, it is determined that the Ethernet negotiation communication rate meets the communication rate setting condition. Then, the first device and the second device can communicate using Ethernet.
  • the SoC in the first device 100 uses the communication path of the Ethernet physical layer interface through the switch, and after conversion by the network port transformer, performs Ethernet communication with the second device 200 through the network interface.
  • the SoC in the second device 200 uses the communication path of the Ethernet physical layer interface through the switch, and after conversion by the network port transformer, performs Ethernet communication with the first device 100 through the network interface.
  • the first device determines that the Ethernet negotiated communication rate between the first device and the second device does not meet the communication rate setting condition, such as the negotiated communication rate is less than the target communication rate, and determines that the first device supports OFDM modulation communication. Then, the first device can interact through Ethernet to determine whether the second device also supports OFDM modulation communication. If the second device supports OFDM modulation communication, the first device can determine whether it can switch to OFDM modulation communication, that is, execute step S705. Alternatively, if the second device does not support OFDM modulation communication, the first device can determine to continue to negotiate the Ethernet communication rate with the second device and use Ethernet for communication, that is, return to execute the above step S703.
  • the SoC chip in the first device 100 is configured with an OFDM modulation physical layer interface, it can be determined that the first device 100 supports OFDM modulation communication.
  • the SoC chip in the second device 200 is configured with an OFDM modulation physical layer interface, it can be determined that the second device 200 supports OFDM modulation communication.
  • the first device 100 can interact through Ethernet to determine that the second device 200 supports OFDM modulation communication.
  • the negotiated communication rate not meeting the communication rate setting condition includes a situation where the Ethernet connection cannot be made. Then, when the first device supports OFDM modulation communication, during the process of the first device and the second device negotiating the Ethernet communication rate, the first device can directly switch to OFDM modulation communication after determining that the Ethernet connection cannot be made to the second device. Similarly, when the second device supports OFDM modulation communication, during the Ethernet communication rate negotiation between the first device and the second device, after the second device determines that it cannot connect to the first device via Ethernet, it can also directly switch to OFDM modulation communication.
  • the first device and the second device may try to establish a communication connection through OFDM modulation communication after determining that they cannot connect to the peer device through Ethernet, and then they may negotiate the OFDM modulation communication rate, that is, execute step S705.
  • the first device and the second device may execute the above step S703, try again to use Ethernet communication, and negotiate the Ethernet communication rate; or, determine that the communication connection with the peer device cannot be established this time.
  • step S705 The first device determines that the OFDM communication rate meets a preset condition. If yes, execute step S706; if no, execute step S703.
  • the first device may predict whether the communication rate after the first device and the second device switch to OFDM modulation communication can meet a preset condition.
  • the preset condition includes, for example, that the predicted OFDM modulation communication rate is greater than the Ethernet communication rate. If the preset condition is met, OFDM modulation communication may be selected, i.e., step S706 is executed. If the preset condition is not met, Ethernet communication may be selected.
  • step S706 is executed.
  • step S703 is executed.
  • the first device may first switch to the OFDM modulation physical layer interface, perform OFDM channel negotiation estimation with the second device, and determine the OFDM modulation communication rate. Thus, the first device may determine whether the OFDM modulation communication rate meets the preset condition.
  • the first device may continue to use the Ethernet physical layer interface, and predict the communication rate after switching to use the OFDM modulation physical layer interface for communication through a preset software model. Thus, the first device may determine whether the OFDM modulation communication rate meets the preset condition.
  • S706 The first device determines to communicate with the second device using orthogonal frequency division multiplexing modulation.
  • the first device may switch to use the OFDM modulation physical layer interface to implement OFDM modulation communication with the second device.
  • the SoC of the first device 100 switches to use the OFDM modulation physical layer interface through a switch.
  • an OFDM modulation communication connection is established with the second device 200 through the network interface.
  • the communication path of the network interface of the second device 200 is converted through the network port transformer, it is connected to the OFDM modulation physical layer interface of the SoC through a switch, thereby realizing OFDM modulation communication between the first device 100 and the second device 200.
  • the OFDM modulation physical layer interface of the first device 100 or the second device 200 may support two-way MIMO communication as shown in FIG. 5 , or support four-way MIMO communication as shown in FIG. 6 .
  • the device can improve the impact of cable quality on transmission performance by supporting OFDM modulation physical layer interface.
  • the flexible rate adaptation mechanism of OFDM modulation technology can be used to achieve the maximum capacity of the channel to improve network communication performance.
  • the device's OFDM modulation physical layer interface supports MIMO communication, which can further improve network communication performance.
  • the OFDM modulation physical layer interface of the device supports two-way MIMO communication, and the OFDM modulation communication rate of 4-core network cable communication can reach 1Gbps, while the Ethernet communication rate is 100Mbps. Therefore, in the process of 4-core network cable communication, the OFDM modulation communication rate can achieve nearly 10 times the performance improvement compared to the Ethernet communication rate.
  • the OFDM modulation physical layer interface of the device supports four-way MIMO communication, and the OFDM modulation communication rate of 8-core network cable communication can reach 3Gbps, while the Ethernet communication rate is 1000Mbps. Therefore, during the 8-core network cable communication process, the OFDM modulation communication rate can achieve nearly 3 times the performance improvement compared to the Ethernet communication rate.
  • the communication quality of the device deteriorates during Ethernet communication, it can also switch to OFDM modulation communication to improve the communication quality.
  • step S801 may be further included.
  • the first device determines that the Ethernet communication rate does not meet the communication rate setting condition. If yes, execute the above step S704; if no, execute step S703.
  • the first device can determine whether the second device supports OFDM modulation communication. Further, in the case of determining that the second device supports OFDM modulation communication, the first device can predict whether the communication rate after switching OFDM modulation communication can meet the preset conditions, such as whether it is greater than the current Ethernet communication rate. If the preset conditions are met, the first device can switch to OFDM modulation communication.
  • the first device may directly determine whether to switch to OFDM modulation communication based on whether the second device supports OFDM modulation communication.
  • the first device after the first device is powered on, it has determined that the second device supports OFDM modulation communication. Then, after determining that the Ethernet communication rate does not meet the communication rate setting condition, the first device can directly predict whether the communication rate after switching to OFDM modulation communication can meet the preset condition.
  • the first device may maintain the Ethernet communication.
  • the SoC of the first device 100 can monitor the Ethernet communication quality during Ethernet communication. If the communication quality decreases, the SoC can determine whether it is necessary to switch to use OFDM modulation physical layer interface through a switch to achieve switching to use OFDM modulation communication.
  • the first device and the second device are compatible with Ethernet communication and OFDM modulation communication, thereby achieving adaptive communication mode switching and ensuring network communication quality.
  • Figure 9 is a flow chart of another communication method provided in an embodiment of the present application. As shown in Figure 9, the method includes the following steps.
  • a first device determines a first rate for transmitting first communication information using a first standard.
  • the first device and the second device are connected via a network cable.
  • the first device can transmit communication information via multiple standards.
  • the first standard is, for example, Ethernet communication.
  • the first device can also transmit communication information via a second standard, and the second standard is, for example, OFDM modulation communication.
  • the multiple standards use different protocol types or different modulation methods.
  • the communication information is, for example, a modulation waveform transmitted between the first device and the second device.
  • both the first device and the second device are configured with network interfaces, and the first device and the second device are connected via a network cable between the network interfaces.
  • the first device includes one or more chips (such as SoC).
  • Multiple different standards of the first device may correspond to multiple interfaces, such as the multiple interfaces include a first interface of a first standard and a second interface of a second standard.
  • the multiple interfaces may be integrated on the same chip, or multiple interfaces of multiple different standards are distributed on multiple chips that communicate with each other.
  • the SoC chip includes an Ethernet physical layer interface (such as a first interface of a first standard) and an OFDM modulation physical layer interface (such as a second interface of a second standard).
  • Ethernet physical layer interface is used to support the communication of the first standard of the first device
  • OFDM modulation physical layer interface is used to support the communication of the second standard of the first device.
  • the first device includes two SoC chips that communicate with each other, namely SoC chip 1 and SoC chip 2, and the first interface and the second interface are respectively distributed on SoC chip 1 and SoC chip 2.
  • SoC chip 1 includes the first interface
  • SoC chip 2 includes the second interface.
  • SoC chip 1 includes the first interface and the second interface
  • SoC chip 2 includes the second interface.
  • SoC chip 1 includes the first interface
  • SoC chip 2 includes the first interface and the second interface.
  • the embodiments of the present application do not limit the distribution of multiple interfaces of multiple different formats on multiple chips that communicate with each other.
  • the first device includes a switch circuit structure
  • the switch circuit structure is used to switch a first path corresponding to the first standard and a second path corresponding to the second standard.
  • the switch circuit structure is respectively connected to multiple interfaces of multiple different standards.
  • the first device includes a switch, a first path exists between the switch and the Ethernet physical layer interface, a second path exists between the switch and the OFDM modulation physical layer interface, and the switch is used to switch between the first path and the second path.
  • the network cable between the first device and the second device includes multiple pairs of twisted pairs, wherein the switch circuit structure includes multiple switches, and the multiple switches correspond one-to-one to the multiple pairs of twisted pairs.
  • the first device is configured with four switches corresponding to the four pairs of twisted-pair cables respectively.
  • the first communication information sent by the first device to the second device via the second standard includes a first electrical signal
  • the first electrical signal includes multiple sub-signals
  • the multiple pairs of twisted pairs correspond to the multiple sub-signals one-to-one
  • each pair of twisted pairs in the multiple pairs of twisted pairs is used to transmit a corresponding sub-signal.
  • the first device uses OFDM modulation technology to modulate the data to be transmitted into an electrical signal for communication.
  • the first device uses MIMO technology to simultaneously send electrical signals on two or more pairs of twisted pairs among multiple pairs of twisted pairs to increase data transmission bandwidth. For example, as shown in FIG6 , the first device uses MIMO technology to simultaneously send four sub-signals corresponding to the first electrical signal on four pairs of twisted pairs.
  • the first device includes one or more transformers, and the one or more transformers are used to combine the receiving and sending paths corresponding to the first communication information of the second standard into a second path.
  • the communication between the SoC chip and the transformer through the OFDM modulation physical layer interface can use a common receiving and transmitting port and use a common path for transmission; or the receiving and transmitting ports can be separated and transmitted in different paths.
  • the receiving and transmitting ports of the OFDM modulation physical layer interface of the SoC chip are separated, and the receiving and transmitting communications with the transformer are in different paths. If the OFDM modulation physical layer interface realizes bidirectional communication with transformer 0 through the transmitting port TX0 and the receiving port RX0, transformer 0 combines the receiving and transmitting paths corresponding to the transmitting port TX0 and the receiving port RX0 of the OFDM modulation physical layer interface into the second path between transformer 0 and switch 1.
  • the number of transformers is a first number
  • the number of sub-signals is a second number
  • the second number is n times the first number
  • n is a positive integer
  • the OFDM modulation physical layer interface on the SoC chip in the first device supports two-way MIMO communication.
  • the number of transformers in the first device is 2, transformer 0 and transformer 1.
  • n is 2, and the number of sub-signals is twice the number of transformers.
  • the OFDM modulation physical layer interface on the SoC in the first device supports four-way MIMO communication.
  • the number of transformers in the first device is 4, transformer 0, transformer 1, transformer 2, and transformer 3.
  • the second number of sub-signals and the first number of transformers are not limited to the above n-fold relationship.
  • the transformers and sub-signals may also be in a one-to-one, many-to-one, or one-to-many relationship.
  • the first device after the first device is powered on, it may first determine to transmit communication information through the first standard. For example, the first device first selects the standard corresponding to the Ethernet physical layer interface through the switch circuit structure for communication. Afterwards, the first device determines the first rate of communication under the first standard. Optionally, the first device and the second device negotiate the first rate of communication information transmitted in the first standard.
  • step S902 The first device determines whether the first rate meets the first condition. If yes, execute step S903; if no, execute step S904.
  • S903 The first device sends first communication information to the second device through the first standard.
  • S904 The first device sends first communication information to the second device through the second standard.
  • steps S902-S904 after the first device determines the first rate for communication under the first standard, it first determines whether the first rate satisfies the first condition, such as whether the first rate is greater than or equal to the target rate. If the first rate satisfies the first condition, the first device may determine to send the first communication information to the second device through the first standard. If the first rate does not satisfy the first condition, the first device may determine to send the first communication information to the second device through the second standard.
  • the first device determines a second rate for transmitting the first communication information through the second standard. If the second rate meets the second condition, the first device determines to send the first communication information to the second device through the second standard.
  • the second condition for example, includes that the second rate is greater than the first rate.
  • the first device negotiates with the second device the first rate for transmitting the communication information through the second standard.
  • the first device determines to switch to the second standard, if the second rate of transmitting the first communication information can be greater than the first rate of transmitting the first communication information through the first standard, the first device can switch to the second standard. Otherwise, the first device keeps sending the first communication information to the second device through the first standard to reduce the power consumption of the standard switching.
  • the first device selects the first mode through the Ethernet physical layer interface through the switch circuit structure.
  • the first device communicates in the second standard through the OFDM modulation physical layer interface and negotiates the first communication rate with the second device.
  • the first device switches to the second standard communication through the OFDM modulation physical layer interface through the switch circuit structure and negotiates the second communication rate with the second device.
  • the second rate meets the second condition, the first communication information is sent to the second device through the second standard.
  • the first device determines to send the first communication information to the second device through the first standard. Afterwards, if the first device determines that the rate of sending the first communication information is reduced to a third rate, and the third rate does not satisfy the first condition, then the first device may determine to send the first communication information to the second device through the second standard.
  • the first device and the second device are compatible with the communication of the first modulation and the second modulation, and can adaptively switch the first modulation and the second modulation according to the transmission rate, thereby improving the impact of cable quality on transmission performance and ensuring network communication quality.
  • Figure 10 is a schematic diagram of the structure of a communication device provided in an embodiment of the present application.
  • the communication device 1000 may include: a processing unit 1001 and a transceiver unit 1002.
  • the communication device 1000 may be used to implement the functions of the first device involved in the above method embodiment.
  • the processing unit 1001 is used to support the communication device 1000 to execute S701-S706 in Figure 7; and/or, to support the communication device 1000 to execute S801 in Figure 8; and/or, to support the communication device 1000 to execute S901 and S902 in Figure 9.
  • the transceiver unit 1002 is used to support the communication device 1000 to execute S701, S703 and S706 in Figure 7; and/or to support the communication device 1000 to execute S903 and S904 in Figure 9.
  • the transceiver unit may include a receiving unit and a sending unit, and may be implemented by a transceiver or a transceiver-related circuit component, and may be a transceiver or a transceiver module.
  • the operations and/or functions of each unit in the communication device 1000 are respectively to implement the corresponding process of the communication method described in the above method embodiment, and all relevant contents of each step involved in the above method embodiment can be referred to the functional description of the corresponding functional unit, and for the sake of brevity, they will not be repeated here.
  • the communication device 1000 shown in Figure 10 may further include a storage unit (not shown in Figure 10), in which a program or instruction is stored.
  • a storage unit not shown in Figure 10
  • the processing unit 1001 and the transceiver unit 1002 execute the program or instruction
  • the communication device 1000 shown in Figure 10 can execute the communication method described in the above method embodiment.
  • the technical effects of the communication device 1000 shown in FIG. 10 may refer to the technical effects of the communication method described in the above method embodiment, which will not be described in detail here.
  • the technical solution provided in the present application may also be a functional unit or chip in the communication device, or a device used in conjunction with the communication device.
  • An embodiment of the present application also provides a chip system, including: a processor, the processor is coupled to a memory, the memory is used to store programs or instructions, when the program or instructions are executed by the processor, the chip system implements the method in any of the above method embodiments.
  • the processor in the chip system may be one or more.
  • the processor may be implemented by hardware or by software.
  • the processor may be a logic circuit, an integrated circuit, etc.
  • the processor may be a general-purpose processor implemented by reading software code stored in a memory.
  • the memory in the chip system may also be one or more.
  • the memory may be integrated with the processor or may be separately arranged with the processor, which is not limited in the embodiments of the present application.
  • the memory may be a non-transient processor, such as a read-only memory ROM, which may be integrated with the processor on the same chip or may be arranged on different chips respectively.
  • the embodiments of the present application do not specifically limit the type of memory and the arrangement of the memory and the processor.
  • the chip system can be a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a system on chip (SoC), a central processor unit (CPU), a network processor (NP), a digital signal processor (DSP), a microcontroller unit (MCU), a programmable logic device (PLD) or other integrated chips.
  • FPGA field programmable gate array
  • ASIC application specific integrated circuit
  • SoC system on chip
  • CPU central processor unit
  • NP network processor
  • DSP digital signal processor
  • MCU microcontroller unit
  • PLD programmable logic device
  • each step in the above method embodiment can be completed by an integrated logic circuit of hardware in a processor or by instructions in the form of software.
  • the method steps disclosed in the embodiments of the present application can be directly embodied as being executed by a hardware processor, or by a combination of hardware and software modules in a processor.
  • An embodiment of the present application also provides a computer-readable storage medium, in which a computer program is stored.
  • the computer program When the computer program is run on a computer, the computer executes the above-mentioned related steps to implement the communication method in the above-mentioned embodiment.
  • the embodiment of the present application also provides a computer program product.
  • the computer program product When the computer program product is run on a computer, the computer is enabled to execute the above-mentioned related steps to implement the communication method in the above-mentioned embodiment.
  • an embodiment of the present application further provides a device.
  • the device may be a component or a module, and the device may include one or more processors and a memory connected to each other.
  • the memory is used to store a computer program. When the computer program is executed by one or more processors, the device performs the communication method in each of the above method embodiments.
  • the device, computer-readable storage medium, computer program product or chip provided in the embodiments of the present application are all used to execute the corresponding methods provided above. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding methods provided above, and will not be repeated here.
  • the steps of the method or algorithm described in conjunction with the disclosed content of the embodiments of the present application can be implemented in hardware or by a processor executing software instructions.
  • the software instructions can be composed of corresponding software modules, and the software modules can be stored in random access memory (RAM), flash memory, read-only memory (ROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), registers, hard disks, mobile hard disks, read-only compact disks (CD-ROMs) or any other form of storage medium known in the art.
  • An exemplary storage medium is coupled to a processor so that the processor can read information from the storage medium and write information to the storage medium.
  • the storage medium can also be a component of the processor.
  • the processor and the storage medium can be located in an application specific integrated circuit (ASIC).
  • ASIC application specific integrated circuit
  • the disclosed method can be implemented in other ways.
  • the device embodiments described above are merely schematic.
  • the division of the modules or units is only a logical function division, and there may be other division methods in actual implementation; for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of modules or units, which can be electrical, mechanical or other forms.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.
  • Computer-readable storage media include, but are not limited to, any of the following: USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks or optical disks, and other media that can store program codes.

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Abstract

本申请提供通信方法及设备，涉及通信技术领域。本申请设备在确定第一制式的通信信息传输速率不满足第一条件的情况下，能够切换至第二制式传输通信信息，改善线缆质量对传输性能的影响，实现网络通信性能的提升。该方法应用于包括第一设备和第二设备的通信系统中，第一设备和第二设备之间通过网线连接。该方法包括：第一设备确定通过第一制式传输第一通信信息的第一速率。在第一速率满足第一条件的情况下，第一设备确定通过第一制式向第二设备发送第一通信信息。在第一速率不满足第一条件的情况下，第一设备确定通过第二制式向第二设备发送第一通信信息。

Description

通信方法及设备
本申请要求于2022年09月28日提交国家知识产权局、申请号为202211193033.3、发明名称为“通信方法及设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及通信技术领域，尤其涉及一种通信方法及设备。
背景技术
在家庭网络中，不同设备间一般通过网线，按照以太网通信协议(IEEE 802.3系列标准)进行数据传输，为用户提供网络服务。
但是，以太网通信协议易受到线缆质量的影响。比如，由于穿管线缆老化、错线、断线等异常，会导致网速下降，甚至导致断线无法连接，影响用户网络连接性能。
发明内容
为了解决上述的技术问题，本申请提供了一种通信方法及设备。本申请提供的技术方案，设备在确定第一制式的通信信息传输速率不满足第一条件的情况下，能够切换至第二制式传输通信信息，改善线缆质量对传输性能的影响，实现网络通信性能的提升。
为了实现上述的技术目的，本申请提供了如下技术方案：
第一方面，提供一种通信方法，应用于包括第一设备和第二设备的通信系统中，第一设备和第二设备之间通过网线连接。该方法包括：第一设备确定通过第一制式传输第一通信信息的第一速率。在第一速率满足第一条件的情况下，第一设备确定通过第一制式，向第二设备发送第一通信信息。在第一速率不满足第一条件的情况下，第一设备确定通过第二制式，向第二设备发送第一通信信息。
一些示例中，第一制式为以太网通信，第二制式为正交频分复用OFDM调制通信。
可选的，多个制式采用的协议类型不同、或调制方式不同。可选的，通信信息例如为第一设备和第二设备之间传输的调制波形等。
如此，第一设备和第二设备兼容第一调制和第二调制的通信，能够根据传输速率，实现自适应的切换第一调制和第二调制，保证网络通信质量。
根据第一方面，第一设备包括开关电路结构，开关电路结构用于切换第一制式对应的第一通路和第二制式对应的第二通路。
根据第一方面，或者以上第一方面的任意一种实现方式，开关电路结构分别连接多个不同制式的多个接口，多个接口包括第一制式的第一接口和第二制式的第二接口。
根据第一方面，或者以上第一方面的任意一种实现方式，多个不同制式的多个接口集成在同一芯片，或者，多个不同制式的多个接口分布在相互通信的多个芯片上。
示例性，第一设备的SoC芯片包括以太网物理层接口(如第一制式的第一接口)和OFDM调制物理层接口(如第二制式的第二接口)。或者，第一设备包括两个相互通信的SoC芯片，分别为SoC芯片1和SoC芯片2，第一接口和第二接口分别分布在SoC芯片1和SoC芯片2上。如SoC芯片1包括第一接口，SoC芯片2包括第二接口。或者，SoC芯片1包括第一接口和第二接口，SoC芯片2包括第一接口等。
根据第一方面，或者以上第一方面的任意一种实现方式，网线包括多对双绞线，开关电路结构包括的开关数量为多个，多个开关与多对双绞线一一对应。
示例性的，CAT5及以上的网线中存在4对双绞线，第一设备配置有4个开关，分别对应于4对双绞线。
根据第一方面，或者以上第一方面的任意一种实现方式，第一设备包括一个或多个变压器，一个或多个变压器用于将第二制式的第一通信信息对应的收、发通路合路为第二通路。
例如，芯片的第二接口通过发送端口TX和接收端口RX实现与变压器之间的双向通信，变压器将第二接口的发送端口TX和接收端口RX对应的收、发通路合路为变压器与开关之间的第二通路。
根据第一方面，或者以上第一方面的任意一种实现方式，网线包括多对双绞线，第一设备通过第二制式向第二设备发送的第一通信信息包括第一电信号，第一电信号包括多路子信号，多对双绞线和多路子信号一一对应，多对双绞线中的每对双绞线用于传输对应的子信号。
示例性的，第一设备通过OFDM调制技术，将待传输数据调制为电信号进行通信。第一设备采用MIMO技术，在多对双绞线中的两对或更多对双绞线上同时发送电信号，以提高数据传输带宽。例如，第一设备采用MIMO技术，在4对双绞线上同时发送第一电信号对应的4路子信号。
根据第一方面，或者以上第一方面的任意一种实现方式，变压器的数量为第一数量，子信号数量为第二数量，第二数量为第一数量的n倍，n为正整数。
示例性的，第一设备中的芯片上的第二接口支持双路MIMO通信。第一设备中的变压器的数量为2，变压器0和变压器1。第一设备的网线中存在4对双绞线，对应的子信号数量为4。那么，n为2，子信号数量是变压器数量的2倍。
可选的，变压器和子信号也可以为一对一，多对一，一对多的关系。
根据第一方面，或者以上第一方面的任意一种实现方式，在第一速率不满足第一条件的情况下，第一设备确定通过第二制式，向第二设备发送第一通信信息，包括：在第一速率不满足第一条件的情况下，第一设备确定通过第二制式传输第一通信信息的第二速率。若第二速率满足第二条件，第一设备确定通过第二制式，向第二设备发送第一通信信息。
根据第一方面，或者以上第一方面的任意一种实现方式，第一条件包括第一速率大于或等于目标速率，第二条件包括第二速率大于第一速率。
也就是说，第一设备在确定切换第二制式后，传输第一通信信息的第二速率能够大于通过第一制式传输第一通信信息的第一速率，第一设备可切换第二制式。否则，第一设备保持通过第一制式向第二设备发送第一通信信息，降低制式切换的功耗。
根据第一方面，或者以上第一方面的任意一种实现方式，方法还包括：第一设备和第二设备协商第一速率和/或第二速率。
示例性的，第一设备和第二设备通过协商，确定第一速率和第二速率，以确定是否切换第一制式和第二制式。
根据第一方面，或者以上第一方面的任意一种实现方式，在第一速率满足第一条件的情况下，第一设备确定通过第一制式，向第二设备发送第一通信信息之后，方法还包括：第一设备确定发送第一通信信息的速率降低为第三速率，第三速率不满足第一条件。第一设备确定通过第二制式，向第二设备发送第一通信信息。
示例性，第一设备在以太网通信(即第一制式)过程中，若通信质量下降，同样可切换为OFDM调制通信(即第二制式)，以改善通信质量。
第二方面，提供一种通信设备。该通信设备为第一设备，第一设备与第二设备之间通过网线连接。该第一设备包括：处理器和存储器，存储器与处理器耦合，存储器用于存储计算机程序代码，计算机程序代码包括计算机指令，当处理器从存储器中读取计算机指令，使得第一设备执行：第一设备确定通过第一制式传输第一通信信息的第一速率。在第一速率满足第一条件的情况下，第一设备确定通过第一制式，向第二设备发送第一通信信息。在第一速率不满足第一条件的情况下，第一设备确定通过第二制式，向第二设备发送第一通信信息。
根据第二方面，第一设备包括开关电路结构，开关电路结构用于切换第一制式对应的第一通路和第二制式对应的第二通路。
根据第二方面，或者以上第二方面的任意一种实现方式，开关电路结构分别连接多个不同制式的多个接口，多个接口包括第一制式的第一接口和第二制式的第二接口。
根据第二方面，或者以上第二方面的任意一种实现方式，多个不同制式的多个接口集成在同一芯片，或者，多个不同制式的多个接口分布在相互通信的多个芯片上。
根据第二方面，或者以上第二方面的任意一种实现方式，网线包括多对双绞线，开关电路结构包括的开关数量为多个，多个开关与多对双绞线一一对应。
根据第二方面，或者以上第二方面的任意一种实现方式，第一设备包括一个或多个变压器，一个或多个变压器用于将第二制式的第一通信信息对应的收、发通路合路为第二通路。
根据第二方面，或者以上第二方面的任意一种实现方式，网线包括多对双绞线，第一设备通过第二制式向第二设备发送的第一通信信息包括第一电信号，第一电信号包括多路子信号，多对双绞线和多路子信号一一对应，多对双绞线中的每对双绞线用于传输对应的子信号。
根据第二方面，或者以上第二方面的任意一种实现方式，变压器的数量为第一数量，子信号数量为第二数量，第二数量为第一数量的n倍，n为正整数。
根据第二方面，或者以上第二方面的任意一种实现方式，在第一速率不满足第一条件的情况下，第一设备确定通过第二制式，向第二设备发送第一通信信息，包括：在第一速率不满足第一条件的情况下，第一设备确定通过第二制式传输第一通信信息的第二速率。若第二速率满足第二条件，第一设备确定通过第二制式，向第二设备发送第一通信信息。
根据第二方面，或者以上第二方面的任意一种实现方式，第一条件包括第一速率大于或等于目标速率，第二条件包括第二速率大于第一速率。
根据第二方面，或者以上第二方面的任意一种实现方式，当处理器从存储器中读取计算机可读指令，还使得第一设备执行如下操作：第一设备和第二设备协商第一速率和/或第二速率。
根据第二方面，或者以上第二方面的任意一种实现方式，在第一速率满足第一条件的情况下，第一设备确定通过第一制式，向第二设备发送第一通信信息之后，当处理器从存储器中读取计算机可读指令，还使得第一设备执行如下操作：第一设备确定发送第一通信信息的速率降低为第三速率，第三速率不满足第一条件。第一设备确定通过第二制式，向第二设备发送第一通信信息。
根据第二方面，或者以上第二方面的任意一种实现方式，第一制式为以太网通信，第二制式为正交频分复用OFDM调制通信。
第二方面以及第二方面中任意一种实现方式所对应的技术效果，可参见上述第一方面及第一方面中任意一种实现方式所对应的技术效果，此处不再赘述。
第三方面，本申请提供一种通信设备，该通信设备具有实现如上述第一方面及其中任一种可能的实现方式中所述的通信方法的功能。该功能可以通过硬件实现，也可以通过硬件执行相应地软件实现。该硬件或软件包括一个或多个与上述功能相对应的模块。
第三方面以及第三方面中任意一种实现方式所对应的技术效果，可参见上述第一方面及第一方面中任意一种实现方式所对应的技术效果，此处不再赘述。
第四方面，本申请提供一种计算机可读存储介质。计算机可读存储介质存储有计算机程序(也可称为指令或代码)，当该计算机程序被通信设备执行时，使得通信设备执行第一方面或第一方面中任意一种实施方式的方法。
第四方面以及第四方面中任意一种实现方式所对应的技术效果，可参见上述第一方面及第一方面中任意一种实现方式所对应的技术效果，此处不再赘述。
第五方面，本申请提供一种计算机程序产品，当计算机程序产品在通信设备上运行时，使得通信设备执行第一方面或第一方面中任意一种实施方式的方法。
第五方面以及第五方面中任意一种实现方式所对应的技术效果，可参见上述第一方面及第一方面中任意一种实现方式所对应的技术效果，此处不再赘述。
第六方面，本申请提供一种电路系统，电路系统包括处理电路，处理电路被配置为执行第一方面或第一方面中任意一种实施方式的方法。
第六方面以及第六方面中任意一种实现方式所对应的技术效果，可参见上述第一方面及第一方面中任意一种实现方式所对应的技术效果，此处不再赘述。
第七方面，本申请提供一种芯片系统，包括至少一个处理器和至少一个接口电路，至少一个接口电路用于执行收发功能，并将指令发送给至少一个处理器，当至少一个处理器执行指令时，至少一个处理器执行第一方面或第一方面中任意一种实施方式的方法。
第七方面以及第七方面中任意一种实现方式所对应的技术效果，可参见上述第一方面及第一方面中任意一种实现方式所对应的技术效果，此处不再赘述。
附图说明
图1为本申请实施例提供的一种通信方法应用的通信系统的示意图；
图2为本申请实施例提供的第一设备的硬件结构示意图；
图3为本申请实施例提供的第一设备和第二设备的结构示意图；
图4为本申请实施例提供的信道示意图；
图5为本申请实施例提供的OFDM调制接口支持双路MIMO通信的结构示意图；
图6为本申请实施例提供的OFDM调制接口支持四路MIMO通信的结构示意图；
图7为本申请实施例提供的通信方法流程图示意图一；
图8为本申请实施例提供的通信方法流程图示意图二；
图9为本申请实施例提供的通信方法流程图示意图三；
图10为本申请实施例提供的通信设备的结构示意图。
具体实施方式
下面结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述。其中，在本申请实施例的描述中，以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“所述”、“上述”、“该”和“这一”旨在包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。还应当理解，在本申请以下各实施例中，“至少一个”、“一个或多个”是指一个或两个以上(包含两个)。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。术语“连接”包括直接连接和间接连接，除非另外说明。“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
在本申请实施例中，“示例性地”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性地”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性地”或者“例如”等词旨在以具体方式呈现相关概念。
以太网(ethernet)是一种局域网(local area network，LAN)组网技术。电气与电子工程师协会(institute of electrical and electronics engineers，IEEE)指定的IEEE 802.3协议给出了以太网的技术标准。IEEE 802.3协议规定了包括物理层的连线、电信号和介质访问层协议在内的内容。也就是说，IEEE 802.3协议规定了局域网所采用的电缆类型和信号处理方式等内容。
IEEE 802.3协议规定了，互联设备之间可以以10Mbps-10Gbps(10Mbps、100Mbps、1Gbps、2.5Gbps、5Gbps、10Gbps)的速率传送数据。其中，在IEEE 802.3协议中，互联设备之间的数据传输速率受互联设备之间的网络电缆的限制。越快的传输速率，需要越高规格的网络电缆。
网络电缆一般由金属(例如铜)或玻璃制造而成，用来传递网络信息。常用的网络电缆有三种:双绞线、同轴电缆和光纤。其中，双绞线也可以称为网线，可以分为屏蔽双绞线(shielded twisted pair，STP)与非屏蔽双绞线(unshielded twisted pair，UTP)。常见的网线为非屏蔽双绞线，其由四对细铜线组成，每对铜线都绞合一起，每根铜线都外裹带色的塑料绝缘层，然后整体包有一层塑料外套。非屏蔽双绞线的接头为RJ-45接头。
以太网技术及网线由于其低成本、高可靠性、性能及普及性成为家庭网络中最为流行和广泛使用的技术和介质。其中，交换机(switch hub)及家庭分布式路由器普遍支持以太网接口(例如，对应于RJ-45接头的接口)，用户使用交换机或者路由器上的多网口搭建家庭网络，支持家庭内的高速网络通信，支持分布式Wi-Fi热点的布放。
由于网线的布线及拆除繁琐，家庭网络中的网线可能已部署了很长时间而没有更换，导致了网线中的铜线性质变化，如出现线缆老化、错线、断线等异常，进而导致网线的信道质量变差，造成无法支持千兆以太网(gigabit ethernet，GE)或更高速率的协商模式，使得网线难以工作在目标通信速率，甚至无法连接，影响用户网络连接性能。
目前，电信运营商提供的带宽已经进行Gbps时代，家庭接入带宽已达到1Gbps甚至更高。并且，Wi-Fi带宽也在不断提升，特别是，Wi-Fi 6、Wi-Fi 7的带宽已经达到2Gbps以上。
而家庭网络中以网线为互联介质，采用以太网协议为传输协议的数据传输方式，已成为家庭网络的带宽瓶颈。2.5GE及以上规格由于对网线规格要求高及成本等原因未在家庭网络中普及。
另外，以太网协议自适应能力弱，只能在10Mbps、100Mbps、1000Mbps等模式间选择具体工作模式，不同工作模式下的速率档位差异大。比如，互联设备之间的网线的信道容量在不足1000Mbps的情况下，采用以太网协议的互联设备只能工作在100Mbps模式下，获得100Mbps速率。
由此，本申请实施例提供一种通信方法，支持基于正交频分复用(orthogonal frequency division multiplexing，OFDM)调制技术通信的接口，改善线缆质量对传输性能的影响。并且，OFDM调制技术有非常灵活的速率自适应机制，可以逼近信道的最大容量，实现网络通信性能的提升。
图1为本申请实施例提供的通信方法应用的通信系统的示意图。如图1所示，该通信系统包括第一设备100和第二设备200。
可选的，第一设备100或第二设备200例如可以为交换机、路由器等设备。本申请对第一设备100或第二设备200的具体类型不作限制。
比如，第一设备100和第二设备200均为路由器。其中，可将第一设备100和第二设备200配置为子母路由器，如第一设备100为母路由器、第二设备200为子路由器。
在一些实施例中，第一设备100和第二设备200之间的线路可以为网线。在一些示例中，该网线可以为屏蔽双绞线。在另一些示例中，该网线可以为非屏蔽双绞线。
示例性的，图2示出了第一设备100的一种硬件结构示意图。
第一设备100包括至少一个处理器21，存储器22，以及网络接口23。其中，在一些可能的实现方式里，存储器22还可以包括于处理器21中。示例性的，第一设备100还可以包括无线通信电路24。
处理器21可以是一个通用中央处理器(central processing unit，CPU)，微处理器，特定应用集成电路(application-specific integrated circuit，ASIC)，或一个或多个用于控制本申请方案程序执行的集成电路。
存储器22用于存储指令和数据。处理器21可以调用存储器22存储的指令或数据，执行相关操作，例如对数据进行前向纠错编码和调制电信号，使得数据可以被电信号承载。再例如，可以解调电信号和译码，以获取电信号所承载的数据。存储器22可以是独立存在，存储器22也可以和处理器21集成在一起。
网络接口23可以包括至少一个有线网络接口，该有线网络接口可被配置为通过网线连接到其他设备，如第二设备200。
在一些实施例中，第一设备100在通过网线连接其他设备的同时，还可以通过网线连接到因特网。
示例性的，第一设备100可以通过电信运营商提供的网络，连接到因特网。即在该示例中，第一设备100的有线网络接口可以通过网线连接到电信运营商提供的网络接口，进而连接到因特网。
在一些实施例中，第一设备100还可以包括无线通信电路24。无线通信电路24可以被配置为经由例如Wi-Fi网络等无线局域网标准进行通信。无线通信电路24可以是集成至少一个通信处理模块的一个或多个器件。无线通信电路24可以经由天线241接收电磁波，将电磁波信号调频以及滤波处理，进行解调译码提取到数据，并将数据发送到处理器21。无线通信电路24还可以从处理器21接收待发送的数据，对其进行编码调制，调频，放大，经天线241转为电磁波辐射出去。
可以理解的是，上述本申请实施例示意的结构只是第一设备100的一种可能实现形式的限定。在本申请另一些实施例中，第一设备100可以包括比图示更多或更少的部件，或者组合某些部件，或者拆分某些部件，或者不同的部件布置。图示的部件可以以硬件，软件或软件和硬件的组合实现。
可选的，本申请实施例中的第一设备100和第二设备200可以通过不同的设备实现，不同的 设备可以具有相同、相似或具有一定差异性的硬件结构。比如，第二设备200也可具有如图2所示的硬件结构。
在一些实施例中，设备间的通信资源可以包括频域资源，在通信过程中可使用频域资源，将待传输数据调制为电信号。例如，在OFDM调制技术中，可将频域资源的通信频段划分为多个正交子载波，各个子载波可信噪比自适应调整调制阶数。相比于以太网的脉冲幅度调制(pulse amplitude modulation，PAM)技术，OFDM调制技术中的信道自适应能力更强，在通信过程中，可以逼近信道的最大容量，以提升数据传输带宽。
基于此，在第一设备100或第二设备200在配置有以太网通信通路的同时，还配置通过OFDM技术调制的通信通路。这样，设备间通信过程中，可基于以太网进行通信，也可通过OFDM调制技术，将待传输数据调制为电信号进行通信。那么，在以太网通信质量较差的情况下，可切换使用OFDM调制通信。使用OFDM调制技术时，可以采用自适应调制技术来逼近网络信道能力，提升通信的带宽。
示例性的，如图3所示，第一设备100或第二设备200中的系统芯片(system on chip，SoC)上配置有以太网物理层(physical layer，PHY)接口和OFDM调制物理层接口。其中，将通过以太网物理层接口连接的通信通路和通过OFDM调制物理层接口连接的通信通路通过模拟开关(switch)切换为一路通信通路，再经由网口变压器转换后，通过网络接口实现与其他设备间的通信。其中，设备通信过程中，通过网口变压器的转换，可保护虚拟开关等电路不受网络接口浪涌的侵害。
可选的，如图3所示的开关例如为双刀双掷(double-pole double-throw，DPDT)。这样，第一设备100或第二设备200可先通过常用的以太网物理层接口接入的通信通路实现设备间通信。之后，在确定当前以太网通信质量较差时，可通过DPDT切换通过OFDM调制物理层接口接入的通信通路实现设备间通信。
可选的，在切换使用OFDM调制物理层接口前，第一设备100或第二设备200可先确定对端设备是否支持OFDM调制技术的通信，若支持OFDM调制技术的通信，可切换通信接口。比如，第一设备100确定当前以太网通信质量较差，如数据传输速率小于目标通信速率，或无法连接，并且确定对端的第二设备200支持OFDM调制技术的通信。那么，第一设备100可通过DPDT切换使用OFDM调制物理层接口进行通信。
如此，本申请实施例采用自适应调制的OFDM调制技术，将待传输的数据调制为电信号，信道自适应性能力强，能逼近实际信道容量，提升通信带宽，相比以太技术中不同速率等级，本申请实施例的方案更能逼近信道实际能力。
并且，通过在设备中配置开关切换能力，使得设备同时具有以太网通信能力和OFDM调制通信能力，提升设备在不同使用场景中的兼容性。
以上对第一设备100和第二设备200之间通过切换以太网物理层接口和OFDM调制物理层接口通信为例，对设备间的通信方法进行介绍。以下以第一设备100为例，对单个设备的数据传输方案进行详细介绍。
在一些实施例中，网线中存在多对差分线(即双绞线)。例如，CAT5及以上的网线中存在4对双绞线。若采用以太网协议，则对多双绞线存在串扰(cross talk)。例如，在以太网协议中，多对双绞线之间存在近端串扰(near end cross talk，NEXT)和远端串扰(far-end cross talk，FEST)。因此，在以太网技术中，当两对或更多对双绞线进行数据传输时，需要额外的串扰抵消算法实现多对双绞线间的串扰。
对此，在本申请实施例中，设备可采用多入多出(multiple-input multiple-output，MIMO)技术，在多对双绞线中的两对或更多对双绞线上同时发送电信号，以提高数据传输带宽。其中，对于MIMO技术而言，两对或更多对双绞线间的串扰只是发送端和接收端的交叉信道。由此，接收端可以通过信道均衡算法将两对或更多对双绞线间的串扰转换为信号收益。可选的，接收侧可以采用最小均方误差(minimum mean square error，MMSE)算法对电信号进行均衡，将串扰转换为信号收益。
示例性的，如图4所示，设定网线包括多个双绞线，如该多个双绞线包括双绞线E1和双绞线 E2。其中，采用MIMO技术，在双绞线E1和双绞线E2上同时传输电信号。其中，双绞线E1的发送端口为TX1，接收端口为RX1，信道为信道H1。双绞线E2的发送端口为TX2，接收端口为RX2，信道为信道H2。那么在MIMO技术中，双绞线E1到双绞线E2的串扰相对于交叉信道H3，双绞线E2到双绞线E1的串扰相对于交叉信道H4。由此，接收端可以采用信道均衡算法，双绞线E1和双绞线E2间的串扰转换为信号收益。
示例性的，如图5所示，以网线为非屏蔽双绞线，其由四对细铜线组成，每对铜线都绞合一起(即该网线为4芯网线)为例，对设备数据传输过程进行说明。如网线中包括铜线1-铜线8。其中，铜线1和铜线2组成一对铜线，对应于开关1和网口变压器之间的通信；铜线4和铜线5组成一对铜线，对应于开关2和网口变压器之间的通信；铜线3和铜线6组成一对铜线，对应于开关3和网口变压器之间的通信；铜线7和铜线8组成一对铜线，对应于开关4和网口变压器之间的通信。
如图5所示，SoC上的OFDM调制物理层接口支持双路MIMO通信，与以太网物理层接口组成两对差分对切换，另两对差分对作为备份通信通路。这样，在任一对差分对完好的情况下，该设备可与对端设备实现OFDM调制通信。
具体的，如OFDM调制物理层接口通过MIMO通信技术，连接变压器0和变压器1，组成双路MIMO通信。之后，通过开关1、开关2、开关3、以及开关4可实现切换OFDM调制物理层接口的双路MIMO通信与以太网物理层接口的通信。
其中，OFDM调制物理层接口的发送端口TX 0和接收端口RX 0分别与变压器0的一对绕组建立通信连接，实现双路MIMO通信中的一路MIMO通信。变压器0的另一端的一对绕组分别与开关1和开关2建立通信连接。那么，变压器0和开关1之间的通信通路、与变压器0和开关2之间的通信通路互为备份通信通路，两条通信通路上传输的数据相同。这样，在其中任一条通信通路上的数据传输失败时，设备也可通过另一条通信通路完成数据传输，增大这一路MIMO通信的数据传输的容错率，保证通信质量。
此外，OFDM调制物理层接口的发送端口TX 1和接收端口RX 1分别与变压器1的一对绕组建立通信连接，实现双路MIMO通信中的另一路MIMO通信。变压器1的另一端的一对绕组分别与开关3和开关4建立通信连接。那么，变压器1和开关3之间的通信通路、与变压器1和开关4之间的通信通路互为备份通信通路，两条通信通路上传输的数据相同。这样，在其中任一条通信通路上的数据传输失败时，设备也可通过另一条通信通路完成数据传输，同样增大这一路MIMO通信的数据传输的容错率，保证通信质量。
如此，设备在OFDM调制物理层接口采用MIMO技术进行通信，能够避免串扰，提高数据传输带宽。并且，通过双路MIMO通信，实现通信通路的备份，增大数据传输的容错率，以提升通信质量。
又示例性的，如图6所示，仍以网线为非屏蔽双绞线(即该网线为4芯网线)为例，对设备数据传输过程进行说明。
如图6所示，SoC上的OFDM调制物理层接口支持四路MIMO通信，与以太网物理层接口实现4对差分对的切换，能够实现4芯网线中最高OFDM调制性能的传输。即，每一路MIMO通信通路均接入不同的开关，实现均对应于以太网通信通路。
如图6所示，OFDM调制物理层接口通过MIMO通信技术，连接变压器0、变压器1、变压器2、以及变压器3，组成四路MIMO通信。之后，通过开关1、开关2、开关3、以及开关4，可实现切换OFDM调制物理层接口的四路MIMO通信，或切换以太网物理层接口的通信。
如此，设备在OFDM调制物理层接口采用MIMO技术进行通信，能够避免串扰，提高数据传输带宽。并且，通过四路MIMO通信，充分利用4芯网线进行通信，有效提高传输性能。
在一些实施例中，OFDM调制物理层接口和变压器之间的线路上可以设置有线路驱动(line driver)，用于放大电信号。具体而言，当OFDM调制物理层接口和变压器之间的线路发送的电信号，经过线路驱动时，线路驱动可以放大该电信号，增大该电信号通过变压器，经过网线传输到其他设备的能力。
示例性的，如图5所示，SoC可以采用OFDM调制技术，对待传输数据进行调制，得到电信 号。之后，通过OFDM调制物理层接口与变压器之间的线路上的线路驱动放大该电信号后，通过变压器该电信号发送出去。
以上对设备中基于OFDM调制物理层接口的MIMO通信的实现方式进行介绍。以下对设备间的具体通信过程进行详细介绍。
示例性的，图7为本申请实施例提供的一种通信方法的流程示意图。如图7所示，该方法包括如下步骤。
S701、第一设备启动，并开始以太网通信协商流程。
在一些实施例中，目前家庭网络通信、办公网络通信等场景中的设备，普遍支持以太网通信。因此，第一设备在上电启动后，可先默认采用以太网通信方式，与第二设备进行通信协商。
示例性的，如图3所示，第一设备100中的SoC上电后，通过开关，选择使用以太网物理层接口进行通信，开始与第二设备200进行以太网通信协商流程。相应的，第二设备200的SoC，通过开关，选择使用以太网物理层接口与第一设备100进行以太网通信协商。
S702、第一设备和第二设备的以太网协商通信速率满足通信速率设定条件。若是，执行步骤S703；若否，执行步骤S704。
在一些实施例中，在以太网通信协商过程中，第一设备和第二设备会按照目标通信速率进行通信速率的协商。若协商的通信速率大于或等于目标通信速率，可确定协商通信速率满足通信速率设定条件。若协商的通信速率小于目标通信速率，可确定协商通信速率不满足通信速率设定条件。
比如，第一设备和第二设备进行GE模式的协商，即目标通信速率为1000Mbps。之后，在协商完成后，确定的通信速率为1000Mbps。那么，第一设备可确定协商通信速率满足通信速率设定条件，可执行下述步骤S703。或者，在协商完成后，确定的通信速率为100Mbps。那么，第一设备可确定协商通信速率不满足通信速率设定条件，可执行下述步骤S704。
在一些实施例中，第一设备由于网线异常，如穿管线缆老化、错线、断线等异常，导致出现无法连接的异常。那么，第一设备也可确定协商的通信速率不满足通信速率设定条件。那么，第一设备可执行下述步骤S704。
S703、第一设备确定和第二设备采用以太网通信。
在一些实施例中，第一设备和第二设备以太网通信协商完成后，确定以太网协商通信速率满足通信速率设定条件。那么，第一设备和第二设备可采用以太网进行通信。
示例性的，如图3所示，第一设备100中的SoC通过开关，使用以太网物理层接口的通信通路，经由网口变压器的转化后，通过网络接口与第二设备200进行以太网通信。相应的，第二设备200中的SoC通过开关，使用以太网物理层接口的通信通路，经由网口变压器的转化后，通过网络接口与第一设备100进行以太网通信。
S704、双端设备均支持正交频分复用调制通信。若是，执行步骤S705；若否，执行步骤S703。
在一些实施例中，第一设备在确定与第二设备之间以太网协商通信速率不满足通信速率设定条件，如协商的通信速率小于目标通信速率，并确定第一设备支持OFDM调制通信。那么，第一设备可通过以太网交互，确定第二设备是否同样支持OFDM调制通信。如果第二设备支持OFDM调制通信，那么第一设备可确定是否可切换至OFDM调制通信，即执行步骤S705。或者，如果第二设备不支持OFDM调制通信，那么第一设备可确定继续与第二设备进行以太网通信速率协商，采用以太网进行通信，即返回执行上述步骤S703。
示例性的，如图3所示，第一设备100中的SoC芯片配置有OFDM调制物理层接口，那么可确定第一设备100支持OFDM调制通信。同样的，第二设备200中的SoC芯片配置有OFDM调制物理层接口，那么可确定第二设备200支持OFDM调制通信。第一设备100在确定与第二设备200协商的通信速率小于目标通信速率后，可通过以太网交互，确定第二设备200支持OFDM调制通信。
在另一些实施例中，协商通信速率不满足通信速率设定条件包括无法通过以太网连接的情况。那么，在第一设备支持OFDM调制通信的情况下，在第一设备和第二设备进行以太网通信速率协商的过程中，第一设备确定无法通过以太网连接到第二设备后，可直接切换至OFDM调制通信。 同样的，在第二设备支持OFDM调制通信的情况下，在第一设备和第二设备进行以太网通信速率协商的过程中，第二设备确定无法通过以太网连接到第一设备后，也可直接切换至OFDM调制通信。
这样，在第一设备和第二设备均支持OFDM调制通信的情况下，第一设备和第二设备在确定无法通过以太网连接到对端设备后，可尝试通过OFDM调制通信建立通信连接，那么可协商OFDM调制通信速率，即执行步骤S705。在第一设备和第二设备任一设备不支持OFDM调制通信的情况下，第一设备和第二设备无法完成OFDM调制通信速率的协商，那么可执行上述步骤S703，再次尝试采用以太网通信，进行以太网通信速率的协商；或者，确定此次未能与对端设备建立通信连接。
S705、第一设备确定正交频分复用调制通信速率满足预设条件。若是，执行步骤S706；若否，执行步骤S703。
在一些实施例中，第一设备可预测第一设备和第二设备切换至OFDM调制通信后的通信速率是否能够满足预设条件。其中，预设条件例如包括预测的OFDM调制通信速率大于以太网通信速率。若满足预设条件，可选择OFDM调制通信，即执行步骤S706。若不满足预设条件，可选择以太网通信。
比如，第一设备确定切换至OFDM调制通信后的通信速率大于当前可确定的以太网通信速率，那么第一设备可切换至OFDM调制通信。即，执行步骤S706。
又比如，第一设备确定切换至OFDM调制通信后的通信速率小于或等于当前可确定的以太网通信速率，那么第一设备可切换至以太网通信。即，执行步骤S703。
一些示例中，第一设备可先切换至OFDM调制物理层接口，与第二设备进行OFDM信道协商估计，确定OFDM调制通信速率。从而第一设备可确定OFDM调制通信速率是否满足预设条件。
另一些示例中，第一设备可保持使用以太网物理层接口，通过预设软件模型，预测切换使用OFDM调制物理层接口通信后的通信速率。从而第一设备可确定OFDM调制通信速率是否满足预设条件。
S706、第一设备确定和第二设备采用正交频分复用调制通信。
在一些实施例中，第一设备确定OFDM调制通信速率满足预设条件，那么第一设备可切换使用OFDM调制物理层接口与第二设备实现OFDM调制通信。
示例性的，如图3所示，第一设备100的SoC，通过开关，切换使用OFDM调制物理层接口。第一设备100的OFDM调制物理层接口的通信通路经由网口变压器转换后，通过网络接口与第二设备200建立OFDM调制通信连接。相应的，第二设备200通过网络接口的通信通路经由网口变压器转换后，通过开关，接入到SoC的OFDM调制物理层接口，从而实现第一设备100和第二设备200的OFDM调制通信。
可选的，第一设备100或第二设备200的OFDM调制物理层接口可支持如图5所示的双路MIMO通信，或者支持如图6所示的四路MIMO通信。
如此，设备通过支持OFDM调制物理层接口，改善线缆质量对传输性能的影响。并且，利用OFDM调制技术灵活的速率自适应机制，实现逼近信道的最大容量，以提升网络通信性能。
此外，设备的OFDM调制物理层接口支持MIMO通信，可进一步提升网络通信性能。
比如，设备的OFDM调制物理层接口支持双路MIMO通信，4芯网线通信的OFDM调制通信速率可达到1Gbps，以太网通信速率为100Mbps。那么，在4芯网线通信过程中，OFDM调制通信速率相比于以太网通信速率能够获得近10倍性能的提升。
又比如，设备的OFDM调制物理层接口支持四路MIMO通信，8芯网线通信的OFDM调制通信速率可达到3Gbps，以太网通信速率为1000Mbps。那么，在8芯网线通信过程中，OFDM调制通信速率相比于以太网通信速率能够获得近3倍性能的提升。
在一些场景中，设备在以太网通信过程中，若通信质量下降，同样可切换为OFDM调制通信，以改善通信质量。
示例性的，如图8所示，在步骤S703之后，还可包括步骤S801。
S801、第一设备确定以太网通信速率不满足通信速率设定条件。若是，执行上述步骤S704；若否，执行步骤S703。
在一些实施例中，第一设备和第二设备在通过以太网通信的过程中，确定以太网通信速率下降，以至于不满足通信速率设定条件，如通信速率小于目标通信速率。那么，第一设备可确定第二设备是否支持OFDM调制通信。进而在确定第二设备支持OFDM调制通信的情况下，第一设备可预测切换OFDM调制通信后的通信速率是否能够满足预设条件，如是否大于当前以太网通信速率。若满足预设条件，第一设备可切换OFDM调制通信。
可选的，第一设备如果在之前已经确定过第二设备是否支持OFDM调制通信。那么在确定以太网通信速率不满足通信速率设定条件之后，第一设备可直接基于第二设备是否支持OFDM调制通信的情况，确定是否切换OFDM调制通信。
比如，第一设备在上电启动后，已确定第二设备支持OFDM调制通信。那么，此次第一设备在确定以太网通信速率不满足通信速率设定条件后，可直接预测切换OFDM调制通信后的通信速率是否能够满足预设条件。
在一些实施例中，第一设备和第二设备在通过以太网通信的过程中，确定以太网通信速率满足通信速率设定条件，如通信速率大于或等于目标通信速率。那么，第一设备可保持以太网通信。
示例性的，如图3所示，第一设备100的SoC在以太网通信过程中，可监测以太网通信质量。若通信质量下降，SoC可确定是否需要通过开关切换使用OFDM调制物理层接口，以实现切换使用OFDM调制通信。
如此，第一设备和第二设备兼容以太网通信和OFDM调制通信，从而实现自适应的通信模式切换，保证网络通信质量。
示例性的，图9为本申请实施例提供的又一种通信方法的流程示意图。如图9所示，该方法包括如下步骤。
S901、第一设备确定通过第一制式传输第一通信信息的第一速率。
其中，第一设备和第二设备之间通过网线连接。可选的，第一设备可通过多种制式传输通信信息。其中，第一制式例如为以太网通信。第一设备还可以通过第二制式传输通信信息，第二制式例如为OFDM调制通信。
可选的，多个制式采用的协议类型不同、或调制方式不同。可选的，通信信息例如为第一设备和第二设备之间传输的调制波形等。
示例性的，如图3所示，第一设备和第二设备均配置有网络接口，第一设备和第二设备通过网络接口间的网线连接。
在一些实施例中，第一设备中包括一个或多个芯片(如SoC)。第一设备的多个不同制式可对应于多个接口，如该多个接口包括第一制式的第一接口和第二制式的第二接口。其中，该多个接口可集成在同一芯片，或者，多个不同制式的多个接口分布在相互通信的多个芯片上。
示例性，如图3所示，SoC芯片包括以太网物理层接口(如第一制式的第一接口)和OFDM调制物理层接口(如第二制式的第二接口)。例如，太网物理层接口用于支持第一设备的第一制式的通信，OFDM调制物理层接口用于支持第一设备的第二制式的通信。
或者，比如第一设备包括两个相互通信的SoC芯片，分别为SoC芯片1和SoC芯片2，第一接口和第二接口分别分布在SoC芯片1和SoC芯片2上。如SoC芯片1包括第一接口，SoC芯片2包括第二接口。或，SoC芯片1包括第一接口和第二接口，SoC芯片2包括第二接口。或，等SoC芯片1包括第一接口，SoC芯片2包括第一接口和第二接口。本申请实施例不限制多个不同制式的多个接口在相互通信的多个芯片上的分布方式。
在一些实施例中，第一设备包括开关电路结构，开关电路结构用于切换第一制式对应的第一通路和第二制式对应的第二通路。可选的，开关电路结构分别连接多个不同制式的多个接口。
示例性的，如图3所示，第一设备中包括开关，该开关和以太网物理层接口之间存在第一通路，该开关和OFDM调制物理层接口之间存在第二通路，该开关用于切换第一通路和第二通路。
在一些实施例中，第一设备和第二设备之间的网线包括多对双绞线。其中，开关电路结构包括的开关数量为多个，多个开关与多对双绞线一一对应。
示例性的，如图6所示，CAT5及以上的网线中存在4对双绞线，第一设备配置有4个开关，分别对应于4对双绞线。
在一些实施例中，第一设备通过第二制式向第二设备发送的第一通信信息包括第一电信号，第一电信号包括多路子信号，多对双绞线和多路子信号一一对应，多对双绞线中的每对双绞线用于传输对应的子信号。
示例性的，第一设备通过OFDM调制技术，将待传输数据调制为电信号进行通信。第一设备采用MIMO技术，在多对双绞线中的两对或更多对双绞线上同时发送电信号，以提高数据传输带宽。例如，如图6所示，第一设备采用MIMO技术，在4对双绞线上同时发送第一电信号对应的4路子信号。
在一些实施例中，第一设备包括一个或多个变压器，这一个或多个变压器用于将第二制式的第一通信信息对应的收、发通路合路为第二通路。
示例性的，SoC芯片通过OFDM调制物理层接口和变压器之间的通信，可以收、发共用端口，使用共同通路传输；也可以收、发端口分开，分别在不同的通路传输。例如，如图6所示，SoC芯片的OFDM调制物理层接口的收、发端口分开，和变压器之间的收、发通信分别在不同的通路。如OFDM调制物理层接口通过发送端口TX0和接收端口RX0实现与变压器0之间的双向通信，变压器0将OFDM调制物理层接口的发送端口TX0和接收端口RX0对应的收、发通路合路为变压器0与开关1之间的第二通路。
一些示例中，变压器的数量为第一数量，子信号数量为第二数量，第二数量为第一数量的n倍，n为正整数。
示例性的，如图5所示，第一设备中的SoC芯片上的OFDM调制物理层接口支持双路MIMO通信。第一设备中的变压器的数量为2，变压器0和变压器1。第一设备的网线中存在4对双绞线，对应的子信号数量为4。那么，n为2，子信号数量是变压器数量的2倍。
又示例性的，如图6所示，第一设备中的SoC上的OFDM调制物理层接口支持四路MIMO通信。第一设备中变压器的数量为4，变压器0、变压器1、变压器2、以及变压器3。第一设备的网线中存在4对双绞线，对应的子信号数量为4。那么，n为1，子信号数量是变压器数量的1倍。
可选的，子信号的第二数量和变压器的第一数量也不局限于上述n倍的关系。变压器和子信号也可以为一对一，多对一，一对多的关系。
在一些实施例中，第一设备在上电启动后，可先确定通过第一制式传输通信信息。如第一设备先通过开关电路结构选择以太网物理层接口对应的制式进行通信。之后，第一设备确定在该第一制式下通信的第一速率。可选的，第一设备和第二设备协商第一制式传输通信信息的第一速率。
S902、第一设备确定第一速率是否满足第一条件。若是，执行步骤S903；若否，执行步骤S904。
S903、第一设备通过第一制式向第二设备发送第一通信信息。
S904、第一设备通过第二制式向第二设备发送第一通信信息。
在一些实施例中，在步骤S902-步骤S904中，第一设备确定在第一制式下通信的第一速率后，先确定该第一速率是否满足第一条件，如第一速率是否大于或等于目标速率。若第一速率满足第一条件，那么第一设备可确定通过第一制式，向第二设备发送第一通信信息。若第一速率不满足第一条件，那么第一设备可确定通过第二制式，向第二设备发送第一通信信息。
可选的，在第一速率不满足第一条件的情况下，第一设备确定通过第二制式传输第一通信信息的第二速率。若第二速率满足第二条件，第一设备确定通过第二制式，向第二设备发送第一通信信息。其中，第二条件例如包括第二速率大于第一速率。可选的，第一设备在确定第一速率不满足第一条件后，与第二设备协商第二制式传输通信信息的第一速率。
也就是说，第一设备在确定切换第二制式后，传输第一通信信息的第二速率能够大于通过第一制式传输第一通信信息的第一速率，第一设备可切换第二制式。否则，第一设备保持通过第一制式向第二设备发送第一通信信息，以降低制式切换的功耗。
示例性的，如图6所示，第一设备通过开关电路结构，选择通过以太网物理层接口的第一制 式通信，与第二设备协商通信的第一速率。在第一速率不满足第一条件的情况下，第一设备通过开关电路结构，切换通过OFDM调制物理层接口的第二制式通信，与第二设备协商通信的第二速率。在第二速率满足第二条件的情况下，选择通过第二制式向第二设备发送第一通信信息。
在一些实施例中，在第一速率满足第一条件的情况下，第一设备确定通过第一制式，向第二设备发送第一通信信息。之后，如第一设备确定发送第一通信信息的速率降低为第三速率，第三速率不满足第一条件。那么，第一设备可确定通过第二制式，向第二设备发送第一通信信息。
如此，第一设备和第二设备兼容第一调制和第二调制的通信，能够根据传输速率，实现自适应的切换第一调制和第二调制，改善线缆质量对传输性能的影响，保证网络通信质量。
以上结合图3-图9详细说明了本申请实施例提供的通信方法。以下结合图10详细说明本申请实施例提供的通信设备。
在一种可能的设计中，图10为本申请实施例提供的通信设备的结构示意图。如图10所示，通信设备1000可以包括：处理单元1001和收发单元1002。通信设备1000可用于实现上述方法实施例中涉及的第一设备的功能。
可选地，处理单元1001，用于支持通信设备1000执行图7中的S701-S706；和/或，用于支持通信设备1000执行图8中的S801；和/或，用于支持通信设备1000执行图9中的S901和S902。
可选地，收发单元1002，用于支持通信设备1000执行图7中的S701、S703以及S706；和/或，用于支持通信设备1000执行图9中的S903和S904。
其中，收发单元可以包括接收单元和发送单元，可以由收发器或收发器相关电路组件实现，可以为收发器或收发模块。通信设备1000中的各个单元的操作和/或功能分别为了实现上述方法实施例中所述的通信方法的相应流程，上述方法实施例涉及的各步骤的所有相关内容均可以援引到对应功能单元的功能描述，为了简洁，在此不再赘述。
可选地，图10所示的通信设备1000还可以包括存储单元(图10中未示出)，该存储单元中存储有程序或指令。当处理单元1001和收发单元1002执行该程序或指令时，使得图10所示的通信设备1000可以执行上述方法实施例中所述的通信方法。
图10所示的通信设备1000的技术效果可以参考上述方法实施例中所述的通信方法的技术效果，此处不再赘述。
除了以通信设备1000的形式以外，本申请提供的技术方案也可以为通信设备中的功能单元或者芯片，或者与通信设备匹配使用的装置。
本申请实施例还提供一种芯片系统，包括：处理器，所述处理器与存储器耦合，所述存储器用于存储程序或指令，当所述程序或指令被所述处理器执行时，使得该芯片系统实现上述任一方法实施例中的方法。
可选地，该芯片系统中的处理器可以为一个或多个。该处理器可以通过硬件实现也可以通过软件实现。当通过硬件实现时，该处理器可以是逻辑电路、集成电路等。当通过软件实现时，该处理器可以是一个通用处理器，通过读取存储器中存储的软件代码来实现。
可选地，该芯片系统中的存储器也可以为一个或多个。该存储器可以与处理器集成在一起，也可以和处理器分离设置，本申请实施例并不限定。示例性地，存储器可以是非瞬时性处理器，例如只读存储器ROM，其可以与处理器集成在同一块芯片上，也可以分别设置在不同的芯片上，本申请实施例对存储器的类型，以及存储器与处理器的设置方式不作具体限定。
示例性地，该芯片系统可以是现场可编程门阵列(field programmable gate array，FPGA)，可以是专用集成芯片(AP设备plication specific integrated circuit，ASIC)，还可以是系统芯片(system on chip，SoC)，还可以是中央处理器(central processor unit，CPU)，还可以是网络处理器(network processor，NP)，还可以是数字信号处理电路(digital signal processor，DSP)，还可以是微控制器(micro controller unit，MCU)，还可以是可编程控制器(programmable logic device，PLD)或其他集成芯片。
应理解，上述方法实施例中的各步骤可以通过处理器中的硬件的集成逻辑电路或者软件形式的指令完成。结合本申请实施例所公开的方法步骤可以直接体现为硬件处理器执行完成，或者用处理器中的硬件及软件模块组合执行完成。
本申请实施例还提供一种计算机可读存储介质，该计算机可读存储介质中存储有计算机程序，当该计算机程序在计算机上上运行时，使得计算机执行上述相关步骤，以实现上述实施例中的通信方法。
本申请实施例还提供一种计算机程序产品，当该计算机程序产品在计算机上运行时，使得计算机执行上述相关步骤，以实现上述实施例中的通信方法。
另外，本申请实施例还提供一种装置。该装置具体可以是组件或模块，该装置可包括相连的一个或多个处理器和存储器。其中，存储器用于存储计算机程序。当该计算机程序被一个或多个处理器执行时，使得装置执行上述各方法实施例中的通信方法。
其中，本申请实施例提供的装置、计算机可读存储介质、计算机程序产品或芯片均用于执行上文所提供的对应的方法。因此，其所能达到的有益效果可参考上文所提供的对应的方法中的有益效果，此处不再赘述。
结合本申请实施例公开内容所描述的方法或者算法的步骤可以硬件的方式来实现，也可以是由处理器执行软件指令的方式来实现。软件指令可以由相应地软件模块组成，软件模块可以被存放于随机存取存储器(random access memory，RAM)、闪存、只读存储器(read only memory，ROM)、可擦除可编程只读存储器(erasable programmable ROM，EPROM)、电可擦可编程只读存储器(electrically EPROM，EEPROM)、寄存器、硬盘、移动硬盘、只读光盘(CD-ROM)或者本领域熟知的任何其它形式的存储介质中。一种示例性的存储介质耦合至处理器，从而使处理器能够从该存储介质读取信息，且可向该存储介质写入信息。当然，存储介质也可以是处理器的组成部分。处理器和存储介质可以位于专用集成电路(AP设备plication specific integrated circuit，ASIC)中。
通过以上的实施方式的描述，本领域技术人员可以清楚地了解到，为描述的方便和简洁，仅以上述各功能模块的划分进行举例说明。实际应用中，可以根据需要而将上述功能分配由不同的功能模块完成；即将装置的内部结构划分成不同的功能模块，以完成以上描述的全部或者部分功能。上述描述的系统，装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的方法，可以通过其它的方式实现。以上所描述的装置实施例仅仅是示意性的。例如，所述模块或单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式；例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，模块或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
计算机可读存储介质包括但不限于以下的任意一种：U盘、移动硬盘、只读存储器(read-only memory，ROM)、随机存取存储器(random access memory，RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何在本申请揭露的技术范围内的变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (16)

  1. 一种通信方法，其特征在于，应用于包括第一设备和第二设备的通信系统中，所述第一设备和所述第二设备之间通过网线连接，所述方法包括：
    所述第一设备确定通过第一制式传输第一通信信息的第一速率；
    在所述第一速率满足第一条件的情况下，所述第一设备确定通过所述第一制式，向所述第二设备发送所述第一通信信息；
    在所述第一速率不满足第一条件的情况下，所述第一设备确定通过第二制式，向所述第二设备发送所述第一通信信息。
  2. 根据权利要求1所述的方法，其特征在于，所述第一设备包括开关电路结构，所述开关电路结构用于切换所述第一制式对应的第一通路和所述第二制式对应的第二通路。
  3. 根据权利要求2所述的方法，其特征在于，所述开关电路结构分别连接多个不同制式的多个接口，所述多个接口包括所述第一制式的第一接口和所述第二制式的第二接口。
  4. 根据权利要求3所述的方法，其特征在于，所述多个不同制式的多个接口集成在同一芯片，或者，所述多个不同制式的多个接口分布在相互通信的多个芯片上。
  5. 根据权利要求2-4任一项所述的方法，其特征在于，所述网线包括多对双绞线，所述开关电路结构包括的开关数量为多个，多个开关与所述多对双绞线一一对应。
  6. 根据权利要求2-5任一项所述的方法，其特征在于，所述第一设备包括一个或多个变压器，所述一个或多个变压器用于将所述第二制式的所述第一通信信息对应的收、发通路合路为所述第二通路。
  7. 根据权利要求6所述的方法，其特征在于，所述网线包括多对双绞线，所述第一设备通过所述第二制式向所述第二设备发送的所述第一通信信息包括第一电信号，所述第一电信号包括多路子信号，所述多对双绞线和所述多路子信号一一对应，所述多对双绞线中的每对双绞线用于传输对应的子信号。
  8. 根据权利要求7所述的方法，其特征在于，所述变压器的数量为第一数量，所述子信号数量为第二数量，所述第二数量为所述第一数量的n倍，n为正整数。
  9. 根据权利要求1-8任一项所述的方法，其特征在于，所述在所述第一速率不满足第一条件的情况下，所述第一设备确定通过第二制式，向所述第二设备发送所述第一通信信息，包括：
    在所述第一速率不满足所述第一条件的情况下，所述第一设备确定通过所述第二制式传输所述第一通信信息的第二速率；
    若所述第二速率满足第二条件，所述第一设备确定通过第二制式，向所述第二设备发送所述第一通信信息。
  10. 根据权利要求9所述的方法，其特征在于，所述第一条件包括所述第一速率大于或等于目标速率，所述第二条件包括所述第二速率大于所述第一速率。
  11. 根据权利要求9或10所述的方法，其特征在于，所述方法还包括：
    所述第一设备和所述第二设备协商所述第一速率和/或所述第二速率。
  12. 根据权利要求1-11任一项所述的方法，其特征在于，所述在所述第一速率满足第一条件的情况下，所述第一设备确定通过所述第一制式，向所述第二设备发送所述第一通信信息之后，所述方法还包括：
    所述第一设备确定发送所述第一通信信息的速率降低为第三速率，所述第三速率不满足所述第一条件；
    所述第一设备确定通过所述第二制式，向所述第二设备发送所述第一通信信息。
  13. 根据权利要求1-12任一项所述的方法，其特征在于，所述第一制式为以太网通信，所述第二制式为正交频分复用OFDM调制通信。
  14. 一种通信设备，其特征在于，包括：处理器和存储器，所述存储器与所述处理器耦合，所述存储器用于存储计算机程序代码，所述计算机程序代码包括计算机指令，当所述处理器从所述存储器中读取所述计算机指令，使得所述通信设备执行如权利要求1-13中任意一项所述的方法。
  15. 一种计算机可读存储介质，其特征在于，所述计算机可读存储介质包括计算机程序，当 所述计算机程序在通信设备上运行时，使得所述通信设备执行如权利要求1-13中任意一项所述的方法。
  16. 一种计算机程序产品，其特征在于，当所述计算机程序产品在计算机上运行时，使得所述计算机执行如权利要求1-13中任意一项所述的方法。
PCT/CN2023/117260 2022-09-28 2023-09-06 通信方法及设备 WO2024066985A1 (zh)

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US6285659B1 (en) * 1997-09-10 2001-09-04 Level One Communications, Inc. Automatic protocol selection mechanism
US9001872B1 (en) * 2012-11-07 2015-04-07 Aquantia Corp. Flexible data transmission scheme adaptive to communication channel quality
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CN214544305U (zh) * 2021-01-27 2021-10-29 深圳市东微智能科技股份有限公司 网络传输装置及网络传输设备

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US6285659B1 (en) * 1997-09-10 2001-09-04 Level One Communications, Inc. Automatic protocol selection mechanism
US9001872B1 (en) * 2012-11-07 2015-04-07 Aquantia Corp. Flexible data transmission scheme adaptive to communication channel quality
US20170048085A1 (en) * 2015-08-13 2017-02-16 Marvell World Trade Ltd. Ethernet and OFDM Multiplexing on UTP Cable
CN214544305U (zh) * 2021-01-27 2021-10-29 深圳市东微智能科技股份有限公司 网络传输装置及网络传输设备

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