WO2024066370A1 - 一种马达基座及其制造方法 - Google Patents

一种马达基座及其制造方法 Download PDF

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Publication number
WO2024066370A1
WO2024066370A1 PCT/CN2023/093042 CN2023093042W WO2024066370A1 WO 2024066370 A1 WO2024066370 A1 WO 2024066370A1 CN 2023093042 W CN2023093042 W CN 2023093042W WO 2024066370 A1 WO2024066370 A1 WO 2024066370A1
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WO
WIPO (PCT)
Prior art keywords
overlapping
conductive terminal
overlapping portion
motor base
hole
Prior art date
Application number
PCT/CN2023/093042
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English (en)
French (fr)
Inventor
徐国炜
Original Assignee
苏州昀冢电子科技股份有限公司
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Publication of WO2024066370A1 publication Critical patent/WO2024066370A1/zh

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • H02K15/14—Casings; Enclosures; Supports
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/08—Insulating casings
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/22—Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes

Definitions

  • the present invention relates to the technical field of camera modules, and in particular to a motor base used in the field of electronic equipment and a manufacturing method thereof.
  • Existing motors and their motor bases usually include an insulating base, a metal circuit molded into the insulating base, electronic components welded to the metal circuit, a coil formed by winding or assembled by mounting, and a magnetic structure that interacts with the coil.
  • the metal circuit includes a plurality of conductive terminals, and usually one end of the conductive terminal is used as a solder pin end to connect to the electronic component, and the other end of the conductive terminal is used as a pin end to extend out of the motor base and connect to external components. If there are more electronic components, the number of conductive terminals required is correspondingly more, and it is impossible to arrange more conductive terminals in a limited space.
  • the object of the present invention is to provide a motor base and a manufacturing method thereof, which can avoid the conductive terminal from being unable to be formed due to excessive bending times, thereby saving the wiring space of the conductive terminal.
  • a motor base comprising an insulating base, a metal circuit arranged on the insulating base and an electronic component welded to the metal circuit, the metal circuit comprising a plurality of conductive terminals, the conductive terminals comprising a first conductive terminal, a second conductive terminal and a third conductive terminal located between the first conductive terminal and the second conductive terminal, each of the conductive terminals comprising a soldering foot end for soldering the electronic component and a connecting section extending from the soldering foot end, the first conductive terminal comprising a bridging portion and a first overlapping portion extending from the bridging portion, the second conductive terminal comprising a second overlapping portion extending from a corresponding connecting section, the bridging portion of the first conductive terminal spans across the third conductive terminal from the corresponding connecting section so that the first overlapping portion and the second overlapping portion overlap, overlap and are fixedly connected, the insulating base is injection molded and at
  • the electronic component includes at least two different electronic components, and the soldering feet of the first conductive terminal and the second conductive terminal correspond to two different electronic components for soldering respectively; only one of the first conductive terminal and the second conductive terminal is provided with a pin end extending from the corresponding connecting section out of the insulating base to be electrically connected to an external circuit, so that the first conductive terminal and the second conductive terminal share the same pin end.
  • the insulating base includes a plurality of plastic blocks which are once-injected and cover the metal circuit, the solder pin end, the first overlap portion and the second overlap portion are exposed on the same surface of the corresponding plastic block, and the insulating base also includes a plurality of plastic blocks which are twice-injected and cover the metal circuit.
  • the circuit and the plastic body of the plurality of plastic blocks, the plurality of plastic blocks are vertically arranged and located in different vertical planes, and the different electronic components are positioned in different plastic blocks and exposed to the corresponding plastic blocks.
  • the connecting section of the second conductive terminal extends from the corresponding solder foot end and continuously spans at least three planes, and the connecting section spans from the vertical plane where the corresponding solder foot end is located to the horizontal plane where the bottom surface of the plastic body is located, and then spans to the vertical plane where the solder foot end of the first conductive terminal is located.
  • the position where the second overlapping portion overlaps the first overlapping portion is defined as an overlapping overlapping area
  • the second conductive terminal is connected and fixed to the bridging portion by soldering
  • at least one of the first overlapping portion and the second overlapping portion has an opening for accommodating tin material in the overlapping overlapping area.
  • first conductive terminal and the second conductive terminal are surface-plated with gold in the overlapping area to form a gold-plated area, and the gold-plated area covers the upper surface of the first conductive terminal corresponding to the overlapping area, the lower surface opposite to the upper surface, the inner wall of the opening, and the upper wall of the second conductive terminal relatively close to the lower surface of the first conductive terminal.
  • the first overlapping portion opens the opening in the overlapping overlapping area, and the opening is defined as a retaining through hole.
  • the retaining through hole is provided with an opening end away from the second conductive terminal and a resting end close to the second conductive terminal. The size of the opening end is smaller than that of the resting end, and the tin material is contained in the retaining through hole.
  • the second overlapping portion is provided with a bulge protruding from the upper wall into the retaining through hole, and the tin material is contained in the retaining through hole and concentrated on the bulge.
  • the first overlapping portion is provided with the opening in the overlapping overlapping area
  • the opening of the first overlapping portion is defined as a holding through hole
  • the holding through hole is provided away from the second guide
  • the second overlapping portion opens the opening in the overlapping area
  • the opening of the second overlapping portion is defined as a receiving hole
  • the receiving hole of the second overlapping portion is connected with the retaining through hole in the overlapping area
  • the tin material is received in the retaining through hole and the receiving hole.
  • the size of the opening end is larger than the size of the abutting end
  • the size of the accommodating hole is larger than the size of the abutting end
  • the size of the open end is larger than that of the abutting end, the retaining through hole and the accommodating hole are staggered and interconnected, the size of the side of the accommodating hole close to the first overlapping portion is smaller than the size of the side of the accommodating hole away from the first overlapping portion, and the tin material is accommodated in the retaining through hole and the accommodating hole.
  • first conductive terminal and the second conductive terminal are both provided with wavy concave-convex structures on the lower surface and the upper wall in the overlapping area, and the concave-convex structure on the lower surface and the concave-convex structure on the upper wall extend in different directions, and the tin material is accommodated in the concave-convex structure between the opening and the lower surface and the upper wall.
  • the area of the first overlapping portion is smaller than the area of the second overlapping portion
  • the first overlapping portion has an annular structure
  • the annular structure is hollowed out to form the opening
  • the opening of the annular structure is defined as a retaining through hole
  • the inner wall is defined as a first inner wall of the retaining through hole
  • the outer wall of the annular structure is set as an outer wall surface
  • the tin material is at least accommodated in the opening along the second overlapping portion.
  • the second overlap portion is provided with the opening, and the opening is defined as a receiving hole.
  • the first overlap portion is punched into the receiving hole of the second overlap portion within the overlapping overlap area, and the first overlap portion is welded and fixed to the second overlap portion.
  • the position where the second overlapping portion overlaps the first overlapping portion is defined as an overlapping overlapping region, and the first overlapping portion and the second overlapping portion are riveted in the overlapping overlapping region.
  • the first overlapping portion is provided with a protruding portion protruding downward
  • the second overlapping portion is provided with a receiving hole for receiving the protruding portion in the overlapping overlapping area.
  • the position where the second overlap portion overlaps the first overlap portion is defined as an overlapping overlap area
  • the first overlap portion is arranged to overlap parallel to the second overlap portion in the overlapping overlap area
  • the first overlap portion and the second overlap portion are connected and fixed by resistance welding, laser welding or riveting.
  • the position where the second overlapping portion overlaps the first overlapping portion is defined as an overlapping overlapping region, the first overlapping portion wraps around the second overlapping portion in the overlapping overlapping region, and the first overlapping portion is in contact and connected with the second overlapping portion.
  • the bridging portion is integrally bent and extended from the connecting section of the first conductive terminal; or the bridging portion and the connecting section are separately arranged, the connecting section of the first conductive terminal is also provided with a third overlapping portion, and the bridging portion is also provided with a fourth overlapping portion, and the third overlapping portion and the fourth overlapping portion overlap, overlap, and are fixedly connected.
  • the thickness of the bridging portion is smaller than the thickness of the connecting section of the first conductive terminal and the thickness of the second conductive terminal.
  • the portion of the bridge portion that does not overlap with the first conductive terminal and the second conductive terminal is provided with an insulating coating at least on a side facing the third conductive terminal, so that the bridge portion is directly attached to the third conductive terminal.
  • a plastic block is injection molded outside the metal circuit, the overlapping portion of the bridge portion with the first conductive terminal and the second conductive terminal is exposed to the plastic block, and the portion of the bridge portion not overlapping with the first conductive terminal and the second conductive terminal is covered by the plastic block.
  • a method for manufacturing a motor base comprising the following steps:
  • the first step is to provide a metal circuit having a plurality of conductive terminals, wherein the conductive terminals include a first conductive terminal, a second conductive terminal, and a third conductive terminal located between the first conductive terminal and the second conductive terminal, each of the conductive terminals includes a solder foot end and a connecting section extending from the solder foot end, the first conductive terminal includes a bridge portion connected to the connecting section and a first overlapping portion extending from the bridge portion, the second conductive terminal includes a second overlapping portion extending from the corresponding connecting section, the bridge portion spans across the third conductive terminal from the corresponding connecting section, so that the first overlapping portion overlaps with the second overlapping portion;
  • the second step is to define the area where the second overlapping portion overlaps the first overlapping portion as an overlapping area, and to fix the first overlapping portion and the second overlapping portion in the overlapping area;
  • the third step is to position the electronic component at the corresponding soldering foot end and perform soldering
  • the fourth step is to injection mold an insulating base on the metal circuit.
  • a pin fixture is provided to pin-jointly locate the overlapping overlapped area of the first conductive terminal and the second conductive terminal, and a plastic block is injection molded on the metal circuit at one time, and the solder foot end, the first overlapped portion and the second overlapped portion are exposed to the same surface of the corresponding plastic block.
  • the fixed connection is performed by tin soldering.
  • the first overlap portion and the second overlap portion are firstly tinned in the overlapping overlap area, and then soldered in a reflow furnace to complete the fixed connection.
  • At least one of the first overlapping portion and the second overlapping portion has an opening for accommodating tin material in the overlapping area.
  • the bridge portion is integrally bent and extended from the connecting section of the first conductive terminal; or the bridge portion and the connecting section are separately provided, the connecting section of the first conductive terminal is further provided with a third overlapping portion, and the bridge portion is further provided with a fourth overlapping portion.
  • the first overlapping portion and the fourth overlapping portion are overlapped and fixedly connected with the second overlapping portion and the third overlapping portion respectively.
  • first overlapping portion and the second overlapping portion are overlapped in parallel, and the fixed connection is performed by laser welding, and the first overlapping portion and the second overlapping portion are laser welded.
  • the fixed connection adopts a riveting connection method
  • the first overlapping portion is provided with a protrusion protruding downward in the overlapping overlapping area
  • the second overlapping portion is provided with a receiving hole for accommodating the protrusion in the overlapping overlapping area.
  • the fixed connection adopts a riveting connection method, and the first overlapping portion wraps around the second overlapping portion in the overlapping overlapping area and is fixedly connected to the second overlapping portion.
  • the bridging portion of the first conductive terminal in the motor base spans across the third conductive terminal from the corresponding connecting section so that the first overlapping portion and the second overlapping portion of the second conductive terminal overlap and are fixedly connected, thereby avoiding the failure of a single conductive terminal to be formed due to excessive bending times, improving the forming yield of the conductive terminal, and saving the wiring space of the conductive terminal.
  • FIG. 1 is a perspective view of a motor base according to a first embodiment of the present invention.
  • FIG. 2 is a three-dimensional schematic diagram of FIG. 1 viewed from another direction.
  • FIG. 3 is an exploded perspective view of the motor base according to the first embodiment of the present invention.
  • FIG. 4 is a further exploded perspective view of FIG. 3 .
  • FIG. 5 is a schematic diagram of a first retaining wall of the plastic block in FIG. 3 at an angle.
  • FIG. 6 is a schematic diagram of the first retaining wall of the plastic block in FIG. 3 from another angle.
  • FIG. 7 is a partially enlarged view of FIG. 4 .
  • FIG. 8 is a top view of the metal circuit in FIG. 4 .
  • FIG9 is a cross-sectional view along line A-A in FIG8 .
  • FIG. 10 is a partially enlarged view of FIG. 9 .
  • FIG. 11 is an enlarged cross-sectional view of an overlapping region in a second embodiment of the present invention.
  • FIG. 12 is an enlarged view of a cross-sectional view of an overlapping region in a third embodiment of the present invention.
  • FIG. 13 is an enlarged view of a cross-sectional view of an overlapping region in a fourth embodiment of the present invention.
  • FIG. 14 is an enlarged cross-sectional view of an overlapping region in a fifth embodiment of the present invention.
  • FIG. 15 is a perspective schematic diagram of the overlapping area in the sixth embodiment of the present invention.
  • FIG. 16 is an enlarged view of a cross-sectional view of an overlapping region in a sixth embodiment of the present invention.
  • FIG. 17 is a perspective schematic diagram of the overlapping area in the seventh embodiment of the present invention.
  • FIG. 18 is an enlarged view of a cross-sectional view of an overlapping region in a seventh embodiment of the present invention.
  • FIG. 19 is a plan view of a motor base according to an eighth embodiment of the present invention.
  • Figure 20 is a cross-sectional view along line B-B in Figure 19.
  • FIG. 21 is a partially enlarged view of FIG. 20 .
  • FIG. 22 is a perspective schematic diagram of the overlapping areas in the ninth embodiment of the present invention.
  • FIG. 23 is an enlarged view of a cross-sectional view of an overlapping region in a ninth embodiment of the present invention.
  • FIG. 24 is a perspective schematic diagram of the overlapping area in the tenth embodiment of the present invention.
  • 25 is an enlarged view of a cross-sectional view of an overlapping region in a tenth embodiment of the present invention.
  • FIG. 26 is a perspective view of a metal circuit in the eleventh embodiment of the present invention.
  • FIG. 27 is an enlarged view of the overlapping area in FIG. 26 .
  • motor base 100 metal circuit 1; first conductive terminal 11, 11A, 11B, 11C, 11D, 11F, 11G, 11H, 11I, 11J, 11K; first lap portion 110, 110A, 110B, 110C, 110D, 110F, 110G, 110H, 110I, 110J, 110K; retaining through hole 111, 111B, 111C, 111D, 111H, 1110I; open end 1111, 1111B, 1111C, 1111D, 1111H ; abutment end 1112, 1112B, 1112C, 1112D, 1112H; raised portion 111F; bent portion 111G; first inner wall 1113, 1113B, 1113C, 1113D, 1113H, 1111I; outer wall surface 1112I; concave-convex structure 13H; annular structure 111I; upper surface 112, 112B, 112C, 112D, 112H, 112I; lower surface 113, 113
  • connection should be understood in a broad sense, and a person skilled in the art can understand the specific meaning of the above term in the present invention according to specific circumstances.
  • the conductive terminals in the motor base 100 of the present invention include two first conductive terminals, a second conductive terminal and a third conductive terminal located between the first conductive terminal and the second conductive terminal.
  • a plastic block 4 is injected to achieve mutual positioning, and is directly fixed and connected by welding or riveting to facilitate the electrical connection of the first conductive terminal and the second conductive terminal.
  • the motor base 100 does not need to bend across the line multiple times by only one conductive terminal to connect different electronic components 2, but two conductive terminals with relatively short conductive paths are set for connection processing, thereby achieving local fixed connection and electrical connection.
  • the technical solution of the present application can avoid the inability to form a conductive terminal due to excessive bending times, and can also enable different electronic components 2 to be connected to the same pin end, thereby saving the wiring space of the conductive terminal.
  • the overlapping of the two conductive terminals increases the contact area between the two, and the electrical connection performance after the connection processing is better. At least one of the first conductive terminal and the second conductive terminal is bent in three directions, which increases the strength of the motor base 100.
  • the motor base 100 includes an insulating base 3, the metal circuit 1 provided on the insulating base 3, and the electronic component 2 welded to the metal circuit 1.
  • the insulating base 3 includes a plurality of plastic blocks 4 that are once injection molded and cover the metal circuit 1, and a plastic body 31 that is twice injection molded and covers at least the metal circuit 1 and the plurality of plastic blocks 4.
  • the electronic component 2 is positioned on the plastic block 4 and exposed to the plastic block 4.
  • the electronic component 2 refers to an electronic component such as an IC chip or a Hall element or a capacitor or an inductor.
  • Each of the conductive terminals includes a soldering foot end 15 for soldering the electronic component 2 and a connecting section connecting the soldering foot end 15.
  • the metal circuit 1 includes at least two conductive terminals that are connected to different electronic components 2 and are spaced apart and at least one third conductive terminal located between the two conductive terminals, and one of the two conductive terminals has a connection to the connecting section and A pin end 14 is exposed outside the insulating base 3, and the two conductive terminals share the pin end 14.
  • the two conductive terminals are respectively defined as a first conductive terminal and a second conductive terminal.
  • the first conductive terminal is respectively defined as a first conductive terminal 11, 11A, 11B, 11C, 11D, 11F, 11G, 11H, 11I, 11J, 11K in all the following embodiments.
  • the second conductive terminal is respectively defined as a second conductive terminal 12, 12A, 12B, 12C, 12D, 12F, 12G, 12H, 12I, 12J, 12K in all the following embodiments
  • the third conductive terminal is respectively defined as a third conductive terminal 13, 13K in the following embodiments.
  • Only one of the first conductive terminal and the second conductive terminal is provided with a pin end 14 extending from the corresponding connecting section out of the insulating base 3 to be electrically connected to an external circuit, so that the first conductive terminal and the second conductive terminal share the same pin end 14.
  • the external circuit is a control circuit outside the motor base 100, which is used to transmit an electrical signal to the metal circuit 1 in the motor base 100.
  • the first conductive terminal and the second conductive terminal both include a lap joint extending from the connecting section, the lap joint of the first conductive terminal is defined as a first lap joint, and the lap joint of the second conductive terminal is defined as a second lap joint.
  • the first conductive terminal also includes a bridging portion connecting the first overlapping portion and the corresponding connecting section, and the bridging portion is a cross-over structure that is provided on the first conductive terminal and crosses the third conductive terminal.
  • the bridging portion spans the third conductive terminal from the corresponding connecting section so that the first overlapping portion and the second overlapping portion overlap and are fixedly connected.
  • the position where the second overlapping portion overlaps the first overlapping portion is defined as an overlapping overlapping region R.
  • the insulating base 3 is injection molded and coated and fixed outside the two conductive terminals, and the overlapping overlapping region R is exposed to the plastic block 4 of the insulating base 3.
  • the first overlapping portions belonging to different first conductive terminals 11, 11A, 11B, 11C, 11D, 11F, 11G, 11H, 11I, 11J, 11K are first overlapping portions 110, 110A, 110B, 110C, 110D, 110F, 110G, 110H, 110I, 110J, 110K, respectively, and the first overlapping portions belonging to different second conductive terminals 12, 12A, 12B, 12
  • the second overlapping parts of C, 12D, 12F, 12G, 12H, 12I, 12J, and 12K are respectively second overlapping parts 120, 120A, 120B, 120C, 120D/120F, 120G/120H, 120I, 120J, and 120K
  • the connecting sections belonging to different first conductive terminals 11, 11K are respectively connecting sections 17, 17K
  • the bridging parts belonging to different first conductive terminals 11, 11K are respectively 18, 18K.
  • the plastic body 31 is secondary injection molded on the metal circuit 1 and the plastic block 4.
  • the plurality of plastic blocks 4 are located on different planes perpendicular to the plastic body 31.
  • the electronic components 2 are respectively positioned on and exposed to the plastic blocks 4 on different planes.
  • the soldering feet 15 of the conductive terminals are all soldered to the electronic components 2 and are also required to be positioned on and exposed to the plastic blocks 4 on different planes.
  • the soldering feet 15, the first overlapping portion, and the second overlapping portion are all exposed on the same surface of the corresponding plastic block 4.
  • the plastic block 4 includes a first retaining wall 41 perpendicular to the bottom surface of the plastic body 31, a second retaining wall 42 perpendicular to the bottom surface of the plastic body 31 and adjacent to the first retaining wall 41, and a third retaining wall 43 perpendicular to the bottom surface of the plastic body 31 and parallel to the first retaining wall 41 and connected to the second retaining wall 42.
  • the plane where the first retaining wall 41 is located is the first plane P1
  • the plane where the second retaining wall 42 is located is the second plane P2
  • the plane where the third retaining wall 43 is located is the third plane P3
  • the plane where the bottom surface of the plastic body 31 is located is the fourth plane P4.
  • Coils 5 are arranged on the first retaining wall 41, the second retaining wall 42 and the third retaining wall 43, wherein two coils 5 are installed on the first retaining wall 41 and the second retaining wall 42 to prevent shaking during video recording, and one coil 5 is installed on the third retaining wall 43 to drive zoom.
  • One of the electronic components 2 is welded to the welding foot end 15 of the first conductive terminal held by the first retaining wall 41, and the other electronic component 2 is welded to the welding foot end 15 of the second conductive terminal held by the second retaining wall 42.
  • the electronic component 2 is also welded to the second conductive terminal held by the third retaining wall 43.
  • the connecting section 17 of the second conductive terminal extends from the corresponding solder foot end 15 and continuously spans at least three planes, and the connecting section 17 spans from the vertical plane where the solder foot end of the second conductive terminal is located to the horizontal plane where the bottom surface of the plastic body is located, and then spans to the vertical plane where the solder foot end of the first conductive terminal is located.
  • the connecting section 17 of the second conductive terminal spans from the second plane P2 to the fourth plane P4, and then spans to the first plane P1, thereby completing the overlapping of the two conductive terminals. Since the second overlapping portion needs to span to the fourth plane P4, the second conductive terminal is also provided with a cross section 16 fixed to the insulating base 3, which can strengthen the strength of the motor base 100 while achieving the span.
  • the materials of the first conductive terminal and the second conductive terminal can be selected to be the same or different.
  • the material of the first conductive terminal is copper
  • the material of the second conductive terminal is stainless steel.
  • the thickness of the first conductive terminal and the second conductive terminal can also be different.
  • the thickness of the first conductive terminal is designed to be greater than the thickness of the second conductive terminal. In this way, the overall thickness after the overlap of the two can be reduced, and the subsequent injection molding thickness of the insulating base 3 can be reduced.
  • the thickness of the first conductive terminal made of copper is 0.08 mm
  • the thickness of the second conductive terminal made of stainless steel is 0.05 mm.
  • a positioning jig is used to relatively position the overlapping overlap region R of the two, and the relative positioning of the two conductive terminals is achieved by injection molding the plastic block 4 at one time.
  • the specific positioning jig can be a pin jig.
  • the pin jig is removed, and the plastic block 4 forms a recessed hole S corresponding to the overlapping overlap region R.
  • the overlapping overlap region R of the first overlapping portion of the first conductive terminal and the second overlapping portion of the second conductive terminal is exposed to the plastic block 4 on the opposite side of the recessed hole S.
  • the plastic block 4 has a hole for The carrying slot 410 for carrying the electronic component 2 is further recessed to form a recessed slot 4101.
  • the top surface of the solder leg end 15 of the conductive terminal is exposed to the bottom surface of the recessed slot 4101, so as to facilitate the electrical welding of the electronic component 2 and the solder leg end 15 disposed in the carrying slot 410. Since the thickness of the overlapping overlapping region R is greater than the thickness of the solder leg end 15 after the first and second overlapping portions overlap each other, the top surface of the overlapping portion is higher than the top surface of the solder leg end 15.
  • the carrying slot 410 is provided with a step portion 411 protruding from the bottom wall of the carrying slot 410.
  • the step portion 411 corresponds to the overlapping overlapping region R to cover the first and second overlapping portions.
  • the two conductive terminals have been overlapped by means of cross-line bending, in order to further enhance the fixing and electrical connection performance, the overlapping overlap region R of the two conductive terminals needs to be further electrically connected.
  • the following describes in detail how to further electrically connect the two conductive terminals through the introduction of embodiments 1 to 11 of the present application.
  • the two conductive terminals are subsequently fixedly connected and electrically connected.
  • the specific fixed connection and electrical connection processing methods can be selected from tinning and reflow furnace welding (also known as SMT welding), resistance welding, laser welding, etc.
  • some mechanical fixing processing methods such as riveting and stamping can also be used to achieve mutual fixation and electrical connection between the two.
  • soldering i.e., surface mount welding technology (SMT welding technology)
  • SMT welding technology surface mount welding technology
  • the tin material 6 is positioned in the overlapping overlap area R of the two conductive terminals.
  • at least one of the first overlap part or the second overlap part is provided with an opening for accommodating the tin material 6 in the overlapping overlap area R.
  • the first conductive terminal and the second conductive terminal are tinned in the overlapping overlap area R and are welded in a reflow furnace, and then the plastic body 31 is injection molded for a second time.
  • the surface of the overlapping region R of the first conductive terminal and the second conductive terminal is plated with gold to form a gold-plated region (unnumbered), and then tin is plated on the outside of the gold-plated region through a welding process to achieve welding fixation.
  • the gold-plated region can isolate the copper metal of the conductive terminal from the air to prevent oxidation of the conductive terminal.
  • the gold-plated region specifically covers the upper surface within the overlapping region R of the first conductive terminal and the lower surface arranged opposite to the upper surface, the inner wall of the opening, and the upper wall of the second conductive terminal arranged relatively close to the lower surface of the first conductive terminal. Since the wettability and ductility of gold are better than other metals, when the tin material 6 is applied in the opening, the tin material 6 is more easily adsorbed in the gold-plated region.
  • the specific embodiments of using surface mount soldering technology (SMT soldering technology) to achieve soldering fixation between two conductive terminals include 6 kinds, which are respectively the first to sixth embodiments.
  • the first overlapping portion 110 of the first conductive terminal 11 is provided with the opening in the overlapping overlapping region R, and the opening is defined as a retaining through hole 111.
  • the inner wall is defined as a first inner wall 1113 provided with the retaining through hole 111.
  • the retaining through hole 111 is provided with an opening end 1111 away from the second conductive terminal 12, a contact end 1112 close to the second conductive terminal 12, and the first inner wall 1113.
  • the first overlapping portion 110 is provided with the upper surface 112 and the lower surface 113 in the overlapping overlapping region R.
  • the second overlapping portion 120 of the second conductive terminal 12 has an upper wall 121 provided opposite to the lower surface 113.
  • the gold-plated area is provided on the upper surface 112, the lower surface 113, the first inner wall 1113, and the upper wall 121, so that the tin material 6 is more easily in full contact with the retaining through hole 111, and stable welding between the overlapping portions of the two conductive terminals is achieved.
  • the size of the open end 1111 of the retaining through hole 111 is designed to be smaller than the size of the abutting end 1112. During the process of applying the tin material 6, the tin material 6 is less likely to fall from the retaining through hole 111, thereby ensuring the welding effect between the two conductive terminals and enhancing the electrical connection performance.
  • the first overlapping portion 110B of the first conductive terminal 11B and the second overlapping portion 120B of the second conductive terminal 12B are both provided with the opening in the overlapping overlapping region R, the opening of the first overlapping portion 110B is defined as the retaining through hole 111B, and the inner wall is defined as the first inner wall 1113B provided for the retaining through hole 111B.
  • the retaining through hole 111B is provided with an open end 1111B away from the second conductive terminal 12B, a resting end 1112B close to the second conductive terminal 12B, and the first inner wall 1113B.
  • the size of the open end 1111B is designed to be larger than the size of the resting end 1112B.
  • the opening of the second overlapping portion 120B is defined as a receiving hole 121B communicating with the retaining through hole 111B.
  • the inner wall of the second overlapping portion 120B is defined as a second inner wall 122B provided for the receiving hole 121B.
  • the size of the receiving hole 121B is larger than the size of the abutting end 1112B.
  • the gold-plated area is arranged on the upper surface 112B, the lower surface 113B, the first inner wall 1113B, the second inner wall 122B and the upper wall 123B of the first conductive terminal 11B, so that the tin material 6 can more easily fully contact the holding through hole 111B and the receiving hole 121B, and better realize the welding between the overlapping parts of the two conductive terminals. Since the second overlapping portion 120B of the second conductive terminal 12B is recessed downward to form the accommodating hole 121B, the tin material 6 can enter the accommodating hole 121B after passing through the retaining through hole 111B. On the basis of the capacity of the retaining through hole 111B, the ability to accommodate the tin material 6 can be further improved. Moreover, since the size of the accommodating hole 121B is larger than the size of the abutting end 1112B, the tin material 6 can be clamped in the accommodating hole 121B and is not easy to fall off.
  • the first overlapping portion 110C of the first conductive terminal 11C is provided with the opening in the overlapping overlapping region R.
  • the opening is defined as a retaining through hole 111C.
  • the inner wall is defined as a first inner wall 1113C provided with the retaining through hole 111C.
  • the retaining through hole 111C is provided with an open end 1111C away from the second conductive terminal 12C and a resting end 1112C close to the second conductive terminal 12C.
  • the size of the open end 1111C is designed to be smaller than the size of the abutting end 1112C.
  • the second overlapping portion 120C of the second conductive terminal 12C is provided with a convex hump 1211C protruding from the upper wall 121C into the retaining through hole 111C, and the tin material 6 is accommodated in the retaining through hole 111C and concentratedly distributed in the peripheral area of the convex hump 1211C.
  • the convex hump 1211C is provided on the second overlapping portion 120C.
  • the first conductive terminal 11C and the second conductive terminal 12C can be initially positioned, the positioning effect in the process can be optimized and the welding fixing effect can be enhanced.
  • the contact area between the tin material 6 and the first overlapping portion 110C and the second overlapping portion 120C can be further increased, so that the contact area is larger and the contact is more sufficient.
  • the gold-plated area is arranged on the upper surface 112C, the lower surface 113C, the first inner wall 1113C, the outer area of the convex bump 1211C and the upper wall 121C of the first conductive terminal 11C, so that the tin material 6 can more easily and fully contact the retaining through hole 111C to achieve welding between the overlapping parts of the two conductive terminals.
  • the first overlapping portion 110D of the first conductive terminal 11D and the second overlapping portion 120D of the second conductive terminal 12D are both provided with the opening in the overlapping overlapping region R, and the opening of the first overlapping portion 110D is defined as a retaining through hole 111D.
  • the inner wall is defined as a first inner wall 1113D provided with the retaining through hole 111D.
  • the retaining through hole 111D is provided with an open end 1111D away from the second conductive terminal 12D, a resting end 1112D close to the second conductive terminal 12D, and the first inner wall 1113D.
  • the size of the open end 1111D is designed to be larger than the size of the resting end 1112D to facilitate the entry of the tin material 6.
  • the opening of the second overlapping portion 120D is defined as a receiving hole 122D that is staggered and partially connected to the retaining through hole 111D.
  • the inner wall of the receiving hole 122D is defined as a second inner wall 1221D.
  • the size of the receiving hole 122D near the first overlapping portion 110D is smaller than the size of the receiving hole 122D away from the first overlapping portion 110D, that is, the receiving hole 122D is a tapered structure in the direction close to the first overlapping portion 110D, and the tin material 6 enters through the holding through hole 111D and is held in the holding through hole 111D and the receiving hole 122D.
  • the amount of tin material 6 even if the first conductive There is a connecting portion between the terminal 11D and the second conductive terminal 12D, and the tin material 6 will not drip out of the receiving hole 122D.
  • the gold-plated area is arranged on the upper surface 112D, the lower surface 113D, the first inner wall 1113D, the second inner wall 1221D and the upper wall 121D of the first conductive terminal 11D, so that the tin material 6 can more easily fully contact the holding through hole 111D and the receiving hole 122D, so as to realize welding between the overlapping parts of the two conductive terminals.
  • the first overlapping portion 110H of the first conductive terminal 11H is provided with the opening in the overlapping overlapping region R, the opening is defined as a retaining through hole 111H, and the inner wall is defined as a first inner wall 1113H provided in the retaining through hole 111H.
  • the retaining through hole 111H is provided with an open end 1111H away from the second conductive terminal 12H, a resting end 1112H close to the second conductive terminal 12H, and the first inner wall 1113H.
  • the size of the open end 1111H is designed to be larger than the size of the resting end 1112H to facilitate the entry of the tin material 6.
  • the first conductive terminal 11H and the second conductive terminal 12H are both provided with a wavy concavo-convex structure 13H on the lower surface 113H and the upper wall 121H in the overlapping region R, and the concavo-convex structure 13H of the lower surface 113H and the concavo-convex structure 13H of the upper wall 121H extend in different directions, and the tin material 6 enters from the retaining through hole 111H and is accommodated in the concavo-convex structure 13H between the retaining through hole 111H and the lower surface 113H and the upper wall 121H.
  • the lower surface 113H and the upper wall 121H are both provided with mutually displaced and embedded wavy concavo-convex structures 13H, a point-to-point contact form is formed, making the positioning contact between the two more reliable, and a certain gap is formed between the wavy concavo-convex structures 13H, which is more convenient for sufficient soldering when the tin material 6 is soldered.
  • the gold-plated area is disposed on the upper surface 112H, the lower surface 113H, the first inner wall 1113H and the upper wall 121H of the first conductive terminal 11H, so that the tin material 6 can more easily fully contact the retaining through hole 111H to achieve welding between the overlapping portions of the two conductive terminals.
  • the area of the first lap portion 110I of the first conductive terminal 11I is smaller than the area of the second conductive terminal 12I.
  • the first overlap portion 110I has an annular structure 111I, and the annular structure 111I is hollow to form the opening.
  • the opening of the annular structure 111I is defined as a retaining through hole 1110I, and the inner wall is defined as a first inner wall 1111I provided with the retaining through hole 1110I.
  • the outer wall of the annular structure 111I is defined as an outer wall surface 1112I.
  • the second overlap portion 120I is provided on one side of the annular structure 111I, and the tin material 6 covers the annular structure 111I along the second overlap portion 120I, and is fully accommodated in the outer wall surface 1112I of the annular structure 111I and the retaining through hole 1110I, thereby strengthening the full contact between the tin material 6 and the two conductive terminals and ensuring the welding effect.
  • the gold-plated area is arranged on the upper surface 112I, the lower surface 113I, the outer wall surface 1112I, the first inner wall 1111I and the upper wall 121I of the first conductive terminal 11I located in the overlapping overlapping area R, so that the tin material 6 can more easily and fully contact the annular structure 111I and the upper wall 121I of the second overlapping portion 120I, thereby realizing welding between the first overlapping portion 110I and the second overlapping portion 120I of the two conductive terminals.
  • the electronic component 2 and the solder foot end 15 are welded by surface mount welding (SMT-Surface Mounting Technology). Since the welding of the metal circuit 1 and the electronic component 2 requires an SMT welding process, in the first to sixth embodiments of the present application, the tinning material 6 and the pre-positioning action can be first performed in the opening of the first conductive terminal and/or the second conductive terminal, and then the mutual welding and fixing can be completed by the welding process of the electronic component 2, and there is no need to add an independent welding process to the first conductive terminal and the second conductive terminal.
  • SMT-Surface Mounting Technology surface mount welding
  • the first overlapping portion 110F is provided with a protruding portion 111F protruding downward by cold heading
  • the second overlapping portion 120F is provided with a receiving hole 122F for accommodating the protruding portion 111F in the overlapping overlapping area R.
  • the riveting fixing method requires an additional riveting fixing process compared to the welding fixing method of the first to sixth embodiments of the present application.
  • the riveting fixing method can achieve a fixed connection and an electrical connection between the two at one time.
  • the mechanical fixing method can specifically adopt mechanical fixing methods such as crimping fixing, clamping fixing, etc., so as to achieve electrical connection while achieving fixed connection.
  • the first overlapping part 110A of the first conductive terminal 11A is arranged in parallel and overlapped with the second overlapping part 120A of the second conductive terminal 12A in the overlapping overlap area R.
  • the overlapping overlap areas R of the two conductive terminals are further connected and fixed to each other by resistance welding or laser welding.
  • the welding and fixing methods of resistance welding or laser welding need to provide additional targeted welding processes relative to the welding and fixing methods of the first to sixth embodiments of the present application.
  • some common ones such as motor bases without other electronic components that need to be welded, there is no need to pre-position the welding pin ends for welding with the electronic components. Therefore, welding can be achieved first and then the injection molding of the plastic base 3 can be completed. Compared with the need to inject the plastic block 4 and the plastic body 31 in batches, the injection molding process can be saved.
  • a stamping and welding process can also be used.
  • the first overlapping portion 110G of the first conductive terminal 11G is stamped to the second conductive terminal in the overlapping overlap region R. 12G, and then further welded and fixed.
  • the bridge portion of the first conductive terminal 11G has a bending portion 111G, so that the first overlap portion 110G and the second overlap portion 120G are located in the same plane.
  • the first overlap portion 110G located in the accommodating hole 122G of the second overlap portion 120G is stamped, the first overlap portion 110G is directly tensioned and fixed with the second overlap portion 120G after deformation and expansion, and then welded and fixed, thereby strengthening the direct contact between the two and enhancing the electrical connection performance.
  • a pair of oppositely arranged clamping blocks 1101G are provided on the first overlap portion 110G, and a pair of clearance notches 1221G are provided on the second overlap portion 120G relative to the clamping blocks 1101G.
  • the clamping block 1101G cooperates with the clearance notch 1221G, and after the first overlapping portion 110G is deformed and expanded, the first overlapping portion 110G is difficult to be separated from the receiving hole 122G provided in the second overlapping portion 120G.
  • the first lap portion 110J of the first conductive terminal 11J wraps the second lap portion 120J of the second conductive terminal 12J in the overlapping lap region R by cold heading and riveting, so that the two are mechanically fixed and electrically connected at the same time.
  • the first lap portion 110J includes a main body 111J arranged parallel to the second lap portion 120J and a first bending section 112J and a second bending section 113J formed by bending and wrapping from both sides of the main body 111J to the second lap portion 120J.
  • the main body 111J, the first bending section 112J and the second bending section 113J wrap and fix the second lap portion 120J, and then connect and fix the two by cold heading.
  • the bridge portion is bent and extended from the connecting section of the first conductive terminal in one piece or is provided separately from the connecting section. Integrally bent and extended; in one of the eleventh embodiments of the present application, the bridge portion 18K and the connecting section 17K of the first conductive terminal 11K are separately provided, and the two are also fixed to each other and electrically connected by overlapping.
  • the bridge portion 18K and the connecting section 17K of the first conductive terminal 11K are separately provided, which can further reduce the bending of the conductive terminal on the one hand, facilitate the spatial span of the first conductive terminal 11K relative to the third conductive terminal 13K, and minimize the path of the first conductive terminal 11K; on the other hand, since the bridge portion 18K can be regarded as an additional metal material segment relative to the first conductive terminal 11K, a different material and a different material thickness from the first conductive terminal 11K and the second conductive terminal 12K can be selected, and then the resistivity of the conductive path can be adjusted while more flexibly controlling the welding method between the first conductive terminal 11K and the second conductive terminal 12K, further enhancing the electrical connection effect between the two conductive terminals.
  • the first overlapping portion 110K is electrically connected to the second overlapping portion 120K of the second conductive terminal 12K through a bridge portion 18K.
  • the bridge portion 18K makes the first overlapping portion 110K overlap and overlap the second overlapping portion 120K by crossing the third conductive terminal 13K.
  • the connecting section 17K of the first conductive terminal 11K is further provided with a third overlapping portion 171K, and the bridge portion 18K is further provided with a fourth overlapping portion 181K.
  • the first overlapping portion 110K and the fourth overlapping portion 181K of the first conductive terminal 11K are respectively located at two ends of the bridge portion 18K.
  • the third overlapping portion 171K and the fourth overlapping portion 181K overlap and overlap and are fixed and electrically connected.
  • the thickness of the bridge portion 18K is less than the thickness of the connecting section 17K of the first conductive terminal 11K and the second conductive terminal 12K, and while achieving electrical connection, the injection molding thickness of the subsequent plastic block 4 can be reduced.
  • the provision of the bridge portion 18K reduces the bending of the second conductive terminal 12K, increases the overlap fixing points and reduces the path of the conductive terminal.
  • the portion of the bridge portion 18K that does not overlap with the first conductive terminal 11K and the second conductive terminal 12K is provided with an insulating coating (not marked) on at least one side facing the third conductive terminal 13K so that the bridge portion 18K is directly attached to the third conductive terminal 13K to prevent short circuits and further reduce the subsequent injection molding thickness of the plastic block 4.
  • the metal circuit 1 is externally injection molded with a plastic block 4, and the portion of the bridge portion 18K overlapping with the first conductive terminal 11K (the fourth overlapping portion 181K) and the portion overlapping with the second conductive terminal 12K (the first overlapping portion 110K) are exposed to the plastic block 4, and the portion of the bridge portion 18K that is not overlapping with the first conductive terminal 11K and the second conductive terminal 12K is covered by the plastic block 4.
  • the bridge portion 18K is separated from the first conductive terminal 11K, the material of the bridge portion 18K can be changed. If the resistance caused by the first conductive terminal 11K crossing the line is large, the impedance of the entire metal circuit 1 can be adjusted by changing the material of the bridge portion 18K.
  • the fixed connection and electrical connection method of the bridge portion 18K with the first conductive terminal 11K and the second conductive terminal 12K can be selected from any one of the above first embodiment to the tenth embodiment.
  • the present invention also relates to a method for manufacturing a motor base 100, which specifically comprises the following steps:
  • the first step is to provide a metal circuit 1 having a plurality of conductive terminals, wherein the conductive terminals include a first conductive terminal, a second conductive terminal and a third conductive terminal located between the first conductive terminal and the second conductive terminal, each of the conductive terminals includes a solder foot end 15 and a connecting section extending from the solder foot end, the first conductive terminal includes a bridge portion connected to the connecting section and a first overlapping portion extending from the bridge portion, the second conductive terminal includes a second overlapping portion extending from the corresponding connecting section, the bridge portion extends from the connecting section corresponding to the first conductive terminal across the third conductive terminal so that the first overlapping portion overlaps with the second overlapping portion;
  • the second step is to form a plurality of plastic blocks 4 for holding the metal circuit 1 by injection molding at one time, and the solder foot end 15 and the overlapping portion are exposed on the plastic block 4; after the first conductive terminal and the second conductive terminal are overlapped and arranged, a pin jig is used to top-jointly position the first conductive terminal and the second conductive terminal, so as to facilitate injection molding of the plastic block 4 at the periphery of the overlapping portion at one time;
  • the third step is to position a plurality of electronic components 2 on the corresponding plastic blocks 4 and weld them to the corresponding soldering pin ends 15;
  • Step 4 define the area where the second overlapping portion and the first overlapping portion overlap as an overlapping overlapping area, and perform a fixed connection process on the first overlapping portion and the second overlapping portion in the overlapping overlapping area, wherein the fixed connection process is selected from any one of surface mount welding, riveting, laser welding or resistance welding;
  • At least one of the first overlapping portion and the second overlapping portion is provided with an opening in the overlapping overlapping region R for accommodating the tin material 6 .
  • the first overlap portion and the second overlap portion are arranged to overlap in parallel in the overlapping overlap area so as to facilitate laser welding or resistance welding of the first overlap portion and the second overlap portion.
  • the first overlap portion and the second overlap portion are riveted and fixed in the overlapping overlap area.
  • the first overlap portion is provided with a protrusion 111F protruding downward by cold heading
  • the second overlap portion is provided with a receiving hole 122F in the overlapping overlap area to accommodate the protrusion.
  • the first overlap portion wraps around the second overlap portion by riveting, which is specifically achieved by cold heading riveting.
  • the first conductive terminal 11K can also be separately provided with a bridge part 18K.
  • the bridge portion 18K is provided separately from the connecting section 17K of the first conductive terminal 11K.
  • the connecting section 17K of the first conductive terminal 11K is also provided with a third overlapping portion 171K, and the two ends of the bridge portion 18K are provided with a first overlapping portion 110K and a fourth overlapping portion 181K respectively.
  • the fourth overlapping portion 181K of the bridge portion 18K overlaps, overlaps, fixes and connects with the third overlapping portion 171K of the first conductive terminal 11K, and the first overlapping portion 110K of the bridge portion 18K overlaps, overlaps, fixes and connects with the second overlapping portion 120K of the second conductive terminal 12K, thereby realizing indirect electrical connection between the first conductive terminal 11K and the second conductive terminal 12K.
  • the fixing and electrical connection method of the bridge portion 18K with the second overlapping portion 120K and the third overlapping portion 171K can adopt the above-mentioned soldering, resistance welding, laser welding or riveting, etc., which will not be repeated here.
  • the bridging portion of the first conductive terminal in the motor base 100 spans across the third conductive terminal from the connecting section corresponding to the first conductive terminal so that the first overlapping portion and the second overlapping portion are overlapped and fixedly connected, thereby avoiding the inability to form the conductive terminal due to excessive bending times of a single conductive terminal, improving the forming yield of the conductive terminal, saving the wiring space of the conductive terminal, and the overlapping of the two conductive terminals makes the contact area between the two larger and the electrical connection performance better.
  • At least one of the first and second overlapping portions of the first and second conductive terminals is provided with an opening to promote full contact between the tin material 6 and the first and second overlapping portions, thereby enhancing the welding effect.
  • the portions of the first and second overlapping portions of the first and second conductive terminals that are in contact with the tin material 6 are both provided with a gold-plated area to further enhance full contact between the tin material and the first and second overlapping portions, thereby enhancing the welding effect.
  • the plastic block 4 corresponds to the first and second overlapping portions of the first and second conductive terminals or the first and fourth overlapping portions of the bridge portion 18K and the second and third overlapping portions of the second and first conductive terminals.
  • a step portion 411 is protruded in the bearing groove 410, and the step portion 411 covers the first and second overlapping portions or the outer edge areas of the third and fourth overlapping portions, so that only the welding area in the overlapping overlapping area R is exposed to the plastic block 4, thereby strengthening the fixing effect of the first and fourth overlapping portions overlapping with the second and third overlapping portions respectively.
  • the connecting section 17 of the second conductive terminal extends from the corresponding solder foot end 15 and continuously spans at least three planes, which can strengthen the strength of the motor base 100 while achieving the span between the corresponding pin end 14 and the solder foot end 15 of the conductive terminal.

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Abstract

本发明是涉及一种马达基座及其制造方法，马达基座包括绝缘底座、设于所述绝缘底座的金属电路及焊接于所述金属电路的电子元件，金属电路包括若干导电端子，导电端子包括第一导电端子、第二导电端子以及位于两者之间的第三导电端子，每一所述导电端子包括焊接电子元件的焊脚端及自焊脚端延伸的连接段，第一导电端子的桥接部自对应的连接段横跨第三导电端子进而使得第二导电端子的第二搭接部与第一搭接部重叠搭接并固定连接，避免了单一导电端子折弯次数过多而导致的无法成型，提高了导电端子的成型良率，节约了导电端子的布线空间。

Description

一种马达基座及其制造方法 技术领域
本发明涉及一种摄像头模组技术领域，尤其是涉及一种电子设备领域用的马达基座及其制造方法。
背景技术
现有的马达及其马达基座，通常包括绝缘底座、注塑于绝缘底座内的金属电路、与金属电路焊接的电子元件、绕线形成的或者贴装组装的线圈及与线圈相互作动的磁性结构等组件。金属电路包括多个导电端子，通常导电端子的一端作为焊脚端连接电子元件，导电端子的另一端作为引脚端伸出马达基座与外部部件连接。若电子元件较多，需要的导电端子的数量相应较多，在有限的空间内无法排布较多的导电端子。
为了克服上述问题，可将不同的电子元件连接至同一根导电端子，并通过同一引脚端伸出马达基座与外部部件连接，即，需要将两个间隔的导电端子进行连接，使得不同的电子元件连接至同一根导电端子。但由于电子元件需要根据功能需求设置于不同的位置，相对较为分散，因此为了能够同时连接不同位置的不同电子元件，需要将该导电端子折弯很多次才能连接不同的电子元件，导电端子不仅路径较长，且导电端子折弯次数过多会导致无法成型，或者即便可以成型也无法避免在制程中容易被折弯折断，导致产品制造良率下降。
因此，确有必要提供一种新的马达基座及其制造方法，以克服上述缺陷。
发明内容
本发明的目的在于提供一种马达基座及其制造方法，可以避免导电端子折弯次数过多而无法成型，节约导电端子的布线空间。
本发明的目的通过以下技术方案一来实现：一种马达基座，包括绝缘底座、设于所述绝缘底座的金属电路及焊接于所述金属电路的电子元件，所述金属电路包括若干导电端子，所述导电端子包括第一导电端子、第二导电端子以及位于第一导电端子和第二导电端子之间的第三导电端子，每一所述导电端子包括焊接所述电子元件的焊脚端及自所述焊脚端延伸的连接段，所述第一导电端子包括桥接部以及自所述桥接部延伸设置的第一搭接部，所述第二导电端子包括自对应连接段延伸设置的第二搭接部，所述第一导电端子的所述桥接部自对应的所述连接段横跨所述第三导电端子进而使得所述第一搭接部与所述第二搭接部重叠搭接并固定连接，所述绝缘底座注塑成型并至少包覆固定在所述第一导电端子和第二导电端子外。
进一步，所述电子元件包括至少两个不同的电子元件，所述第一导电端子、所述第二导电端子的所述焊脚端分别对应焊接两个不同的所述电子元件；所述第一导电端子和所述第二导电端子二者中仅一个设有自对应的所述连接段延伸出所述绝缘底座以与外部电路电性连接的引脚端，以使所述第一导电端子和第二导电端子共用相同的所述引脚端。
进一步，所述绝缘底座包括一次注塑成型并包覆所述金属电路的若干塑胶块，所述焊脚端、所述第一搭接部及所述第二搭接部暴露于对应的所述塑胶块的同一表面，所述绝缘底座还包括二次注塑成型并包覆所述金属 电路和若干所述塑胶块的塑胶本体，若干所述塑胶块竖直设置并位于不同的竖直平面，不同的所述电子元件定位于不同的所述塑胶块并暴露于对应的所述塑胶块。
进一步，所述第二导电端子的所述连接段自对应的所述焊脚端延伸并连续跨越至少三个平面，所述连接段自对应的所述焊脚端所在的所述竖直平面跨越至所述塑胶本体的底面所在的水平平面，再跨越至所述第一导电端子的所述焊脚端所在的所述竖直平面。
进一步，所述第二搭接部与所述第一搭接部重叠搭接的位置定义为重叠搭接区域，所述第二导电端子与所述桥接部通过焊锡方式连接固定，并且所述第一搭接部和所述第二搭接部中的至少之一者于所述重叠搭接区域开设容纳锡料的开孔。
进一步，所述第一导电端子及所述第二导电端子于所述重叠搭接区域进行表面镀金以形成镀金区域，所述镀金区域覆盖所述重叠搭接区域对应的所述第一导电端子的上表面、与所述上表面相对的下表面、所述开孔设有的内壁及与所述第一导电端子的所述下表面相对靠近的所述第二导电端子的上壁。
进一步，所述第一搭接部于所述重叠搭接区域开设所述开孔，所述开孔定义为固持通孔，所述固持通孔设有远离所述第二导电端子的开口端和靠近所述第二导电端子的贴靠端，所述开口端的尺寸小于所述贴靠端的尺寸，锡料容纳于所述固持通孔内。
进一步，所述第二搭接部自所述上壁向所述固持通孔内凸设有凸包，所述锡料容纳于所述固持通孔内并集中于所述凸包。
进一步，所述第一搭接部于所述重叠搭接区域开设所述开孔，所述第一搭接部的所述开孔定义为固持通孔，所述固持通孔设有远离所述第二导 电端子的开口端和靠近所述第二导电端子的贴靠端，所述第二接搭接部于所述重叠搭接区域开设所述开孔，所述第二搭接部的所述开孔定义为容纳孔，所述第二搭接部的所述容纳孔于所述重叠搭接区域内与所述固持通孔连通，所述锡料容纳于所述固持通孔与所述容纳孔内。
进一步，所述开口端的尺寸大于所述贴靠端的尺寸，所述容纳孔的尺寸大于所述贴靠端的尺寸。
进一步，所述开口端的尺寸大于所述贴靠端的尺寸，所述固持通孔与所述容纳孔错位设置且相互连通，所述容纳孔靠近所述第一搭接部的一侧的尺寸小于所述容纳孔远离所述第一搭接部的一侧的尺寸，所述锡料容纳于所述固持通孔与所述容纳孔。
进一步，所述第一导电端子与所述第二导电端子于所述重叠搭接区域内的所述下表面及所述上壁均设有波浪状的凹凸结构，且所述下表面的凹凸结构与所述上壁的凹凸结构的延伸方向不同，所述锡料容纳于所述开孔与所述下表面及上壁之间的所述凹凸结构中。
进一步，所述第一搭接部的面积小于所述第二搭接部的面积，所述第一搭接部具有环形结构，所述环形结构中空设置以形成所述开孔，所述环形结构的所述开孔定义为固持通孔，所述内壁定义为所述固持通孔设置的第一内壁，所述环形结构的外壁设置为外壁面，所述锡料沿着所述第二搭接部至少收容于所述开孔。
进一步，所述第二搭接部开设有所述开孔，所述开孔定义为容纳孔，所述第一搭接部于所述重叠搭接区域内冲压至所述第二搭接部的所述容纳孔内，所述第一搭接部焊接固定于所述第二搭接部。
进一步，所述第二搭接部与所述第一搭接部重叠搭接的位置定义为重叠搭接区域，所述第一搭接部与所述第二搭接部于所述重叠搭接区域铆接 固定，所述第一搭接部向下凸设有凸起部，所述第二搭接部于所述重叠搭接区域设有收容所述凸起部的容纳孔。
进一步，所述第二搭接部与所述第一搭接部重叠搭接的位置定义为重叠搭接区域，所述第一搭接部于所述重叠搭接区域与所述第二搭接部平行重叠设置，所述第一搭接部与第二搭接部通过电阻焊或激光焊或铆接的方式连接固定。
进一步，所述第二搭接部与所述第一搭接部重叠搭接的位置定义为重叠搭接区域，所述第一搭接部于所述重叠搭接区域内包裹所述第二搭接部，所述第一搭接部与所述第二搭接部接触连接。
进一步，所述桥接部自所述第一导电端子的所述连接段一体弯折延伸；或者所述桥接部与所述连接段分开设置，所述第一导电端子的所述连接段还设有第三搭接部，所述桥接部还设有第四搭接部，所述第三搭接部与所述第四搭接部重叠搭接并固定连接。
进一步，所述桥接部的厚度小于所述第一导电端子的连接段及所述第二导电端子的厚度。
进一步，所述桥接部未与所述第一导电端子及所述第二导电端子重叠搭接的部分，至少于朝向所述第三导电端子的一侧面设有绝缘涂层，以使所述桥接部直接贴靠在所述第三导电端子上。
进一步，于所述金属电路外注塑塑胶块，所述桥接部与所述第一导电端子和所述第二导电端子重叠搭接的部分暴露于所述塑胶块，所述桥接部未与所述第一导电端子及所述第二导电端子重叠搭接的部分包覆于所述塑胶块。
本发明的目的通过以下技术方案二来实现：一种马达基座的制造方法，包括如下步骤：
第一步，提供具有若干导电端子的金属电路，所述导电端子包括第一导电端子、所述第二导电端子以及位于所述第一导电端子和所述第二导电端子之间的第三导电端子，每一所述导电端子包括焊脚端及自所述焊脚端延伸的连接段，所述第一导电端子包括与所述连接段连接的桥接部以及自所述桥接部延伸设置的第一搭接部，所述第二导电端子包括自对应所述连接段延伸设置的第二搭接部，所述桥接部自对应的所述连接段横跨所述第三导电端子，进而使得所述第一搭接部与所述第二搭接部重叠搭接；
第二步，将所述第二搭接部与所述第一搭接部重叠搭接的区域定义为重叠搭接区域，于所述重叠搭接区域将所述第一搭接部及所述第二搭接部进行固定连接；
第三步，将电子元件定位于对应的所述焊脚端并进行焊接；
第四步，于所述金属电路注塑成型绝缘底座。
进一步，在第二步之前，提供顶针治具顶接定位所述第一导电端子和所述第二导电端子的所述重叠搭接区域，一次注塑成型塑胶块于所述金属电路，且所述焊脚端、所述第一搭接部及所述第二搭接部暴露于对应的所述塑胶块的同一表面。
进一步，所述固定连接采用锡焊接方式，在第二步之前，先将所述第一搭接部和所述第二搭接部于所述重叠搭接区域内进行点锡料，然后过回焊炉进行焊接以完成所述固定连接。
进一步，所述第一搭接部和所述第二搭接部中的至少之一者于所述重叠搭接区域开设容纳锡料的开孔。
进一步，所述桥接部自所述第一导电端子的所述连接段一体弯折延伸；或者所述桥接部与所述连接段分开设置，所述第一导电端子的连接段还设有第三搭接部，所述桥接部还设有第四搭接部，在第二步之中，同时 将所述第一搭接部和所述第四搭接部分别对应与第二搭接部和所述第三搭接部重叠搭接并进行固定连接。
进一步，所述第一搭接部与所述第二搭接部平行重叠搭接，所述固定连接采用激光焊接方式，将所述第一搭接部与所述第二搭接部进行激光焊。
进一步，所述固定连接采用铆接连接方式，所述第一搭接部于所述重叠搭接区域向下凸设有凸起部，所述第二搭接部于所述重叠搭接区域设有收容所述凸起部的容纳孔。
进一步，所述固定连接采用铆接连接方式，所述第一搭接部于所述重叠搭接区域内包裹所述第二搭接部并且与所述第二搭接部固定连接。
本发明中，马达基座中第一导电端子的桥接部自对应的连接段横跨所述第三导电端子进而使得所述第一搭接部与第二导电端子的所述第二搭接部重叠搭接并固定连接，避免了单一导电端子折弯次数过多而导致的无法成型，提高了导电端子的成型良率，节约了导电端子的布线空间。
附图说明
图1为本发明的第一实施方式中的马达基座的立体示意图。
图2为图1自另一方向看的立体示意图。
图3为本发明的第一实施方式中的马达基座的立体分解图。
图4为图3的进一步的立体分解图。
图5为图3中塑胶块的第一挡墙的一角度示意图。
图6为图3中塑胶块的第一挡墙的另一角度示意图。
图7为图4中的部分放大图。
图8为图4中的金属电路的俯视图。
图9为图8中沿A-A线的剖视图。
图10为图9中的部分放大图。
图11为本发明的第二实施方式中的重叠搭接区域的剖视图的放大图。
图12为本发明的第三实施方式中的重叠搭接区域的剖视图的放大图。
图13为本发明的第四实施方式中的重叠搭接区域的剖视图的放大图。
图14为本发明的第五实施方式中的重叠搭接区域的剖视图的放大图。
图15为本发明的第六实施方式中的重叠搭接区域的立体示意图。
图16为本发明的第六实施方式中的重叠搭接区域的剖视图的放大图。
图17为本发明的第七实施方式中的重叠搭接区域的立体示意图。
图18为本发明的第七实施方式中的重叠搭接区域的剖视图的放大图。
图19为本发明的第八实施方式中的马达基座的俯视图。
图20为图19中沿B-B线的剖视图。
图21为图20中的部分放大图。
图22为本发明的第九实施方式中的重叠搭接区域的立体示意图。
图23为本发明的第九实施方式中的重叠搭接区域的剖视图的放大图。
图24为本发明的第十实施方式中的重叠搭接区域的立体示意图。
图25为本发明的第十实施方式中的重叠搭接区域的剖视图的放大图。
图26为本发明的第十一实施方式中的金属电路的立体图。
图27为图26中的重叠搭接区域的放大图。
主要元件符号说明
请参考如下附图标号说明，马达基座100；金属电路1；第一导电端子11，11A，11B，11C，11D，11F，11G，11H，11I，11J，11K；第一搭接部110，110A，110B，110C，110D，110F，110G，110H，110I，110J，110K；固持通孔111，111B，111C，111D，111H，1110I；开口端1111，1111B，1111C，1111D，1111H；贴靠端1112，1112B，1112C，1112D，1112H；凸起部111F；折弯部111G；第一内壁1113，1113B，1113C，1113D，1113H，1111I；外壁面1112I；凹凸结构13H；环形结构111I；上表面112，112B，112C，112D，112H，112I；下表面113，113B，113C，113D，113H，113I；主体部111J；第一折弯段112J；第二折弯段113J；第二导电端子12，12A，12B，12C，12D，12F，12G，12H，12I，12J，12K；第二搭接部120，120A，120B，120C，120D，120F，120G，120H，120I，120J，120K；上壁121，123B，121C，121D，121H，121I；容纳孔122D，122F，122G；第二内壁122B，1221D；凸包1211C；凹槽121B；第三导电端子13，13K；卡接块1101G；让位缺口1221G；引脚端14；焊脚端15；横跨段16；连接段17，17K；第三搭接部171K；桥接部18，18K；第四搭接部181K；电子元件2；绝缘底座3；塑胶本体31；塑胶块4；第一挡墙41；承载槽410；凹陷槽4101；台阶部411；第二挡墙42；第三挡墙43；线圈5；锡料6；重叠搭接区域R；凹孔S；第一平面P1；第二平面P2；第三平面P3；第四平面P4。
具体实施方式
在本发明的描述中，需要说明的是，术语“上”、“下”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或组件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“连接”应做广义理解，对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
本发明中马达基座100中的导电端子包括两个相互间隔设置的第一导电端子、第二导电端子及位于所述第一导电端子和所述第二导电端子之间的第三导电端子，第一导电端子跨线折弯后横跨所述第三导电端子进而与第二导电端子重叠搭接后，进行一次注塑成型塑胶块4实现相互定位，并通过焊接或铆接的方式直接固定连接以便于所述第一导电端子和所述第二导电端子的电性连接。采用本发明的技术方案，马达基座100无需仅通过一个导电端子多次跨线弯折以连接不同的电子元件2，而是设置两个相对导电路径较短的导电端子进行连接处理，进而实现局部固定连接和电性连接，在本实施方式中，因第一导电端子和所述第二导电端子相互固定及电性连接，二者可以共用引脚端14。因此，本申请技术方案一方面可以避免一根导电端子折弯次数过多而导致的无法成型，又能使得不同的电子元件2连接至同一引脚端，进而节约了导电端子的布线空间。两个所述导电端子重叠搭接使得两者之间接触面积较大，连接处理后的电连接性能较优，且第一导电端子及第二导电端子中至少其中之一跨越三个方向弯折，增加了马达基座100的强度。
请参阅图1至图27，所述马达基座100包括绝缘底座3、设于所述绝缘底座3的所述金属电路1及焊接于所述金属电路1的电子元件2。所述绝缘底座3包括一次注塑成型并包覆所述金属电路1的若干塑胶块4及二次注塑成型并至少包覆所述金属电路1和所述若干塑胶块4的塑胶本体31。所述电子元件2定位于所述塑胶块4并暴露于所述塑胶块4。在本发明中，电子元件2指的是IC芯片或霍尔元件或电容或电感等电子元器件。每一所述导电端子均包括焊接所述电子元件2的焊脚端15及连接所述焊脚端15的连接段。在本申请的实施方式中，所述金属电路1至少包括连接不同的所述电子元件2且间隔设置的两个导电端子及位于所述两个导电端子之间的至少一第三导电端子，两个导电端子的其中之一具有连接所述连接段且 暴露于所述绝缘底座3外的引脚端14，且两导电端子共用所述引脚端14。在本申请以下实施方式一至十一中，两个所述导电端子分别定义为第一导电端子及第二导电端子，具体的，第一导电端子在以下全部实施方式中，分别定义为第一导电端子11，11A，11B，11C，11D，11F，11G，11H，11I，11J，11K。第二导电端子在以下全部实施方式中，分别定义为第二导电端子12，12A，12B，12C，12D，12F，12G，12H，12I，12J，12K，第三导电端子在下述实施例中，分别定义为第三导电端子13，13K。所述第一导电端子和所述第二导电端子二者中仅一个设有自对应的所述连接段延伸出所述绝缘底座3以与外部电路电性连接的引脚端14，以使所述第一导电端子和第二导电端子共用相同的引脚端14。所述外部电路为马达基座100外的控制电路，用以将电信号传递至所述马达基座100中的金属电路1。为了使第一导电端子和第二导电端子实现引脚端14共用，第一导电端子和第二导电端子均包括自所述连接段延伸设置的搭接部，所述第一导电端子的所述搭接部定义为第一搭接部，所述第二导电端子的所述搭接部定义为第二搭接部。
由于两导电端子之间具有第三导电端子，为了便于二者相对第三导电端子的跨越搭接，两导电端子的至少其中之一导电端子需要设置跨越第三导电端子的跨越结构以与另一导电端子实现重叠搭接。在本申请的实施方式中，所述第一导电端子还包括连接所述第一搭接部及对应的所述连接段的桥接部，所述桥接部即设置于第一导电端子的跨越第三导电端子的跨越结构。所述桥接部自对应的所述连接段横跨所述第三导电端子进而使得所述第一搭接部与所述第二搭接部重叠搭接并固定连接。所述第二搭接部与所述第一搭接部重叠搭接的位置定义为重叠搭接区域R。所述绝缘底座3注塑成型并包覆固定在所述两导电端子外，所述重叠搭接区域R暴露于所述绝缘底座3的所述塑胶块4。
在本申请以下实施方式一至十一中，分属于不同第一导电端子11，11A，11B，11C，11D，11F，11G，11H，11I，11J，11K的第一搭接部分别为第一搭接部110，110A，110B，110C，110D，110F，110G，110H，110I，110J，110K，分属于不同第二导电端子12，12A，12B，12C，12D，12F，12G，12H，12I，12J，12K的第二搭接部分别为第二搭接部120，120A，120B，120C，120D/120F，120G/120H，120I，120J，120K，分属于不同第一导电端子11，11K的连接段分别为连接段17，17K，分属于不同第一导电端子11，11K的桥接部分别为18，18K。
所述塑胶本体31二次注塑成型于所述金属电路1和所述塑胶块4，所述若干塑胶块4位于垂直于所述塑胶本体31的不同平面，所述电子元件2分别定位于且暴露于不同平面的所述塑胶块4，进而所述导电端子的焊脚端15均焊接所述电子元件2，也均需定位于且暴露于不同平面的所述塑胶块4。所述焊脚端15、所述第一搭接部及所述第二搭接部暴均露于对应的所述塑胶块4的同一表面。在本申请的实施方式中，所述塑胶块4包括垂直于所述塑胶本体31底面的第一挡墙41、垂直于所述塑胶本体31底面并邻接垂直于所述第一挡墙41的第二挡墙42及垂直于所述塑胶本体31底面并与所述第一挡墙41平行的连接所述第二挡墙42的第三挡墙43。其中所述第一挡墙41所在平面为第一平面P1，所述第二挡墙42所在平面为第二平面P2，所述第三挡墙43所在平面为第三平面P3，所述塑胶本体31底面所在平面为第四平面P4。所述第一挡墙41、所述第二挡墙42及所述第三挡墙43上均设置有线圈5，其中所述第一挡墙41和所述第二挡墙42上安装有两个所述线圈5，用以在摄像时防止抖动，所述第三挡墙43上安装有一个所述线圈5，用于驱动变焦。其中一所述电子元件2焊接于所述第一挡墙41固持的所述第一导电端子的所述焊脚端15，另一所述电子元件2焊接于所述第二挡墙42固持的所述第二导电端子的所述焊脚端15。当然在其他实施方式中，亦有所述电子元件2焊接于所述第三挡墙43固持的所述第二导电端子 的所述焊脚端15，只需要满足第二导电端子的第二搭接部跨越三个方向与所述第一搭接部重叠搭接。在本发明中，所述第二导电端子的所述连接段17自对应的所述焊脚端15延伸并连续跨越至少三个平面，所述连接段17自所述第二导电端子的所述焊脚端所在的竖直平面跨越至所述塑胶本体的底面所在的水平平面，再跨越至所述第一导电端子的所述焊脚端所在的竖直平面。具体地，所述第二导电端子的所述连接段17自所述第二平面P2跨越至所述第四平面P4，再跨越至第一平面P1，从而完成两个导电端子的重叠搭接。由于第二搭接部需要跨越至第四平面P4，故所述第二导电端子还设置有固持于所述绝缘底座3的横跨段16，可在实现跨越的同时加强所述马达基座100的强度。
在本申请的实施方式中，所述第一导电端子和所述第二导电端子的材质可以选择相同或者不同。在本实施方式中，具体地，所述第一导电端子的材质为铜，所述第二导电端子的材质为不锈钢。在本申请的实施方式中，所述第一导电端子与所述第二导电端子的厚度也可以不同，例如，将所述第一导电端子的厚度设计为大于所述第二导电端子的厚度，如此，能够减小二者重叠搭接后的整体厚度，进而可以减小后续绝缘底座3的注塑厚度。在本申请的实施方式中，铜材质的所述第一导电端子的厚度为0.08毫米，不锈钢材质的所述第二导电端子的厚度为0.05毫米。
在本实施方式中，所述第一导电端子和第二导电端子重叠搭接设置后，使用定位治具对二者的重叠搭接区域R进行相对定位，并通过一次注塑成型所述塑胶块4实现对于两导电端子的相对定位，在本实施方式中，具体的定位治具可以选择顶针治具。注塑成型所述塑胶块4后，移除顶针治具，所述塑胶块4对应所述重叠搭接区域R形成凹孔S，第一导电端子的第一搭接部和第二导电端子的第二搭接部的所述重叠搭接区域R于所述凹孔S的对侧暴露于所述塑胶块4。所述塑胶块4于所述凹孔S的对侧开设有用于 承载电子元件2的承载槽410，所述承载槽410进一步凹陷设置有凹陷槽4101，所述导电端子的焊脚端15的顶表面暴露于所述凹陷槽4101的底表面，以便于设于所述承载槽410中的所述电子元件2与所述焊脚端15电性焊接。由于第一、二搭接部相互重叠搭接后，重叠搭接区域R的厚度大于焊脚端15的厚度，使得搭接部的顶面高于焊脚端15的顶面，为了便于所述塑胶块4包覆部分重叠搭接区域R并且暴露二者电连接区域承载槽410设有突出于所述承载槽410底壁的台阶部411，所述台阶部411对应所述重叠搭接区域R以包覆所述第一、第二搭接部。
在本申请中，虽然两个导电端子已经通过跨线弯折的方式重叠在一起，但为了进一步加强固定及电连接性能，需将两导电端子的重叠搭接区域R进行进一步的电连接处理。以下通过对本申请的实施方式一至十一的介绍，对如何进行两个导电端子进一步的电连接处理进行详细说明。
具体请参考图1至图27，两个所述导电端子在跨线弯折搭接之后，再对两个导电端子进行后续的固定连接及电连接处理，具体的固定连接及电连接处理方式可以选择点锡料且过回焊炉焊接(也称SMT焊接)、电阻焊焊、激光焊等处理方式。除了以上举例说明的焊接处理方式，还可以采用一些铆接、冲压等机械固定处理方式来实现两者的相互固定及电连接。
本申请第一至第六实施方式，具体选择采用锡焊即表面贴片焊接技术(SMT焊接技术)实现两个导电端子之间的固定连接及电连接。具体的，在两个导电端子的重叠搭接区域R进行点锡料6定位，为了便于锡料6与焊接区域的充分接触覆盖，所述第一搭接部或第二搭接部中的至少之一者于所述重叠搭接区域R开设有容纳锡料6的开孔。注塑成型所述塑胶块4后，所述第一导电端子和所述第二导电端子于所述重叠搭接区域R点锡料6并过回焊炉焊接处理，然后再二次注塑成型所述塑胶本体31。可以理解，在焊接工艺过程中，为了避免焊接后产生吃锡不良或者接触不良的问题， 所述第一导电端子和所述第二导电端子的重叠搭接区域R表面镀金以形成镀金区域(未标号)，然后再在镀金区域外侧通过焊接工艺进行镀锡以实现焊接固定。镀金区域可以隔绝导电端子的铜金属与空气，避免导电端子发生氧化。镀金区域具体覆盖所述第一导电端子的所述重叠搭接区域R内的上表面及与所述上表面相对设置的下表面、所述开孔设有的内壁及与所述第一导电端子的所述下表面相对靠近设置的所述第二导电端子的上壁。由于金的湿润性及延展性相较于其他金属而言较佳，故在所述开孔内点锡料6时，锡料6更容易吸附在镀金区域中。本申请的实施方式中，采用表面贴片焊接技术(SMT焊接技术)实现两个导电端子之间的焊接固定的具体实施方式，共包括6种，且分别为第一至第六实施方式。
本申请其中一第一实施方式中，请参阅图1至图10，所述第一导电端子11的所述第一搭接部110于所述重叠搭接区域R开设有所述开孔，所述开孔定义为固持通孔111。所述内壁定义为所述固持通孔111设置的第一内壁1113。所述固持通孔111设置有远离所述第二导电端子12的开口端1111及靠近所述第二导电端子12的贴靠端1112以及所述第一内壁1113。并且所述第一搭接部110于所述重叠搭接区域R内设置有所述上表面112及所述下表面113。而第二导电端子12的所述第二搭接部120具有与所述下表面113相对设置的上壁121。所述镀金区域设置在所述上表面112、下表面113、第一内壁1113以及上壁121，以使锡料6更容易与所述固持通孔111充分接触，实现两个导电端子的搭接部之间的稳定焊接。同时，本申请第一实施方式中，将所述固持通孔111的所述开口端1111的尺寸设计为小于所述贴靠端1112的尺寸，在点锡料6的过程中，锡料6更不易从所述固持通孔111掉落，进而保证了两个导电端子之间的焊接效果，加强了电连接性能。
本申请其中一第二实施方式中，请参阅图11，所述第一导电端子11B的所述第一搭接部110B及所述第二导电端子12B的所述第二搭接部120B于所述重叠搭接区域R均开设有所述开孔，所述第一搭接部110B的所述开孔定义为所述固持通孔111B，所述内壁定义为所述固持通孔111B设置的第一内壁1113B。所述固持通孔111B设有远离所述第二导电端子12B的开口端1111B、靠近所述第二导电端子12B的贴靠端1112B及所述第一内壁1113B。在第二实施方式中，将所述开口端1111B的尺寸设计为大于所述贴靠端1112B的尺寸。所述第二搭接部120B的所述开孔定义为与所述固持通孔111B连通的容纳孔121B。所述第二搭接部120B的所述内壁定义为所述容纳孔121B设置的第二内壁122B。所述容纳孔121B的尺寸大于所述贴靠端1112B的尺寸。如此设置，可以使得锡料6更易进入到所述固持通孔111B内，并且容纳于所述固持通孔111B与所述容纳孔121B内。镀金区域设置在所述第一导电端子11B的所述上表面112B、下表面113B、第一内壁1113B、第二内壁122B以及所述上壁123B，以使锡料6更容易充分接触所述固持通孔111B和所述容纳孔121B，更好的实现两个导电端子的搭接部之间的焊接。由于所述第二导电端子12B的所述第二搭接部120B向下凹陷形成所述容纳孔121B，锡料6可以在通过固持通孔111B后进入所述容纳孔121B内，可以在固持通孔111B的容量的基础上，进一步提升容纳锡料6的能力，且由于容纳孔121B的尺寸大于所述贴靠端1112B的尺寸，可以使锡料6卡持于所述容纳孔121B中不易掉落。
本申请其中一第三实施方式中，请参阅图10，所述第一导电端子11C的所述第一搭接部110C于所述重叠搭接区域R开设有所述开孔。所述开孔定义为固持通孔111C。所述内壁定义为所述固持通孔111C设置的第一内壁1113C。所述固持通孔111C设有远离所述第二导电端子12C的开口端1111C和靠近所述第二导电端子12C的贴靠端1112C，在第三实施方式中， 将所述开口端1111C的尺寸设计为小于所述贴靠端1112C的尺寸。所述第二导电端子12C的所述第二搭接部120C自所述上壁121C向所述固持通孔111C内凸设有凸包1211C，所述锡料6容纳于所述固持通孔111C内并集中分布于所述凸包1211C的外围区域。在所述第二搭接部120C上设置所述凸包1211C，一方面可以将所述第一导电端子11C和第二导电端子12C进行初定位，优化制程中的定位效果并且加强焊接固定效果，另一方面在焊锡时，可以进一步增加锡料6与第一搭接部110C和第二搭接部120C的接触面积，使接触面积更大，接触更加充分。镀金区域设置在所述第一导电端子11C的所述上表面112C、下表面113C、第一内壁1113C、所述凸包1211C的外围区域以及所述上壁121C，以使锡料6更容易充分接触所述固持通孔111C，实现两个导电端子的搭接部之间的焊接。
本申请其中一第四实施方式中，请参阅图13，所述第一导电端子11D的所述第一搭接部110D及所述第二导电端子12D的所述第二搭接部120D于所述重叠搭接区域R均开设有所述开孔，所述第一搭接部110D的所述开孔定义为固持通孔111D。所述内壁定义为所述固持通孔111D设置的第一内壁1113D。所述固持通孔111D设有远离所述第二导电端子12D的开口端1111D、靠近所述第二导电端子12D的贴靠端1112D及所述第一内壁1113D。在第四实施方式中，将所述开口端1111D的尺寸设计为大于所述贴靠端1112D的尺寸以便于所述锡料6的进入。所述第二搭接部120D的所述开孔定义为与所述固持通孔111D错位设置且部分连通的容纳孔122D。所述容纳孔122D的所述内壁定义为第二内壁1221D。所述容纳孔122D靠近所述第一搭接部110D的一侧的尺寸小于所述容纳孔122D远离所述第一搭接部110D的一侧的尺寸，也即所述容纳孔122D在靠近第一搭接部110D的方向上为渐缩结构，所述锡料6通过固持通孔111D进入并且容纳于所述固持通孔111D与所述容纳孔122D内。通过控制锡料6的量，即便所述第一导电 端子11D和所述第二导电端子12D之间有连通部分，锡料6也不会自所述容纳孔122D滴出来。镀金区域设置在所述第一导电端子11D的所述上表面112D、下表面113D、第一内壁1113D、第二内壁1221D以及所述上壁121D，以使锡料6更容易充分接触所述固持通孔111D与所述容纳孔122D，实现两个导电端子的搭接部之间的焊接。
本申请其中一第五实施方式中，请参阅图14，所述第一导电端子11H的所述第一搭接部110H于所述重叠搭接区域R开设有所述开孔，所开孔定义为固持通孔111H，所述内壁定义为所述固持通孔111H设有的第一内壁1113H。所述固持通孔111H设有远离所述第二导电端子12H的开口端1111H、靠近所述第二导电端子12H的贴靠端1112H及所述第一内壁1113H。在第五实施方式中，将所述开口端1111H的尺寸设计为大于所述贴靠端1112H的尺寸以便于所述锡料6的进入。所述第一导电端子11H与所述第二导电端子12H于所述重叠搭接区域R内的所述下表面113H及所述上壁121H均设有波浪状的凹凸结构13H，且所述下表面113H的凹凸结构13H与所述上壁121H的凹凸结构13H的延伸方向不同，所述锡料6自所述固持通孔111H进入并且容纳于所述固持通孔111H与所述下表面113H及上壁121H之间的所述凹凸结构13H中。由于所述下表面113H及所述上壁121H均设有相互错位嵌入的波浪状的凹凸结构13H，形成了点对点的接触形式，使二者之间的定位接触更加可靠，并且波浪状的凹凸结构13H之间形成了一定间隙，更加便于在点焊锡料6时充分爬锡。镀金区域设置在所述第一导电端子11H的所述上表面112H、下表面113H、第一内壁1113H以及所述上壁121H，以使锡料6更容易充分接触所述固持通孔111H，实现两个导电端子的搭接部之间的焊接。
本申请其中一第六实施方式中，请参阅图15至图16，所述第一导电端子11I的所述第一搭接部110I的面积小于所述第二导电端子12I的所述第 二搭接部120I的面积。所述第一搭接部110I具有环形结构111I，所述环形结构111I中空设置以形成所述开孔，所述环形结构111I的所述开孔定义为固持通孔1110I，所述内壁定义为所述固持通孔1110I设置的第一内壁1111I。所述环形结构111I的外壁定义为外壁面1112I。所述第二搭接部120I设置于所述环形结构111I的一侧，所述锡料6沿着所述第二搭接部120I包覆所述环形结构111I，且充分收容于所述环形结构111I的外壁面1112I及所述固持通孔1110I内，如此加强了锡料6与两导电端子的充分接触，保障了焊接效果。镀金区域设置在所述第一导电端子11I位于所述重叠搭接区域R内的所述上表面112I、下表面113I、所述外壁面1112I、所述第一内壁1111I以及所述上壁121I，以使锡料6更容易充分接触环形结构111I及第二搭接部120I的上壁121I，实现两个导电端子的第一搭接部110I与第二搭接部120I之间的焊接。
在本发明第一至第六实施方式中，所述电子元件2与所述焊脚端15的焊接方式为表面贴装焊接(SMT-Surface Mounting Technology，又称表面贴装技术)。由于金属电路1与电子元件2进行焊接需要进行一次SMT焊接工序，在本申请第一至第六实施方式中，可于第一导电端子和/或第二导电端子的开孔内先行进行点锡料6及预定位动作，然后再借由电子元件2的焊接工序一并完成相互焊接固定，进而无需额外对第一导电端子和第二导电端子增加独立的焊接处理工序。
在本申请的其他实施方式中，为了实现在重叠搭接区域R的两个导电端子的搭接部的固定连接及电连接处理，除了上述通过点锡料6然后进行SMT焊接的处理方式之外，还可以通过机械固定的方式实现二者之间的机械固定并且同时达成电性导通。本申请其中一第七实施方式中，请参阅图17至图18，所述第一导电端子11F的所述第一搭接部110F与所述第二导电端子12F的所述第二搭接部120F于所述重叠搭接区域R采用机械铆接固 定的方式进行固定连接，更具体的为采用冷镦铆接方式。通过冷镦的方式使所述第一搭接部110F向下凸设有凸起部111F，所述第二搭接部120F于所述重叠搭接区域R设有收容所述凸起部111F的容纳孔122F。在本申请第七实施方式中，铆接固定方式相对于本申请第一至第六实施方式的焊接固定方式而言，需要额外增加一道铆接固定工序。但铆接固定方式可以一次性实现二者之间的固定连接及电连接。在其他实施方式中，机械固定的方式具体还可以采用例如压接固定、卡接固定等机械固定方式，以便于在实现固定连接的同时实现电连接。
在本申请的其他实施方式中，为了实现在重叠搭接区域R的两个导电端子的搭接部的固定及电连接处理，除了上述通过点锡料6然后进行SMT焊接固定的固定手段之外，还可以采用其他焊接工艺来实现。在本申请其中一第八实施方式中，请参阅图19至图21，所述第一导电端子11A的所述第一搭接部110A于所述重叠搭接区域R与所述第二导电端子12A的所述第二搭接部120A平行重叠搭接设置。具体地，进一步将所述两个导电端子的重叠搭接区域R通过电阻焊或激光焊的方式相互连接固定。因为电阻焊无法利用过回焊炉的焊接工序，电阻焊或者激光焊的焊接固定方式相对于本申请第一至第六实施方式的焊接固定方式而言，需要额外提供针对性的焊接工艺。但针对一些普通的，例如没有设置其他需要焊接的电子元件的马达基座，则因为没有提前定位与电子元件焊接的焊脚端的需求，因此可以先实现先焊接再一次完成塑胶底座3的注塑成型，相较需要分次注塑塑胶块4和塑胶本体31，则可以节省注塑工艺。
在本申请的其他实施方式中，为了实现在重叠搭接区域R的两个导电端子的搭接部的固定及电连接处理，还可以通过冲压焊接工艺来实现。在本申请第九实施方式中，请参阅图22至图23，所述第一导电端子11G的所述第一搭接部110G于所述重叠搭接区域R内冲压至所述第二导电端子 12G的所述第二搭接部120G开设的容纳孔122G内，再进一步进行焊接固定。在冲压的过程中，所述第一导电端子11G的桥接部具有一折弯部111G，使得所述第一搭接部110G和所述第二搭接部120G位于同一个平面。冲压位于所述第二搭接部120G的所述容纳孔122G内的所述第一搭接部110G时，所述第一搭接部110G变形膨胀后直接与所述第二搭接部120G张紧固定接触，然后再进行焊接固定，进而可以加强两者的直接接触，增强电连接性能。所述第一搭接部110G上设有一对相对设置的卡接块1101G，所述第二搭接部120G上相对所述卡接块1101G设置有一对让位缺口1221G。所述卡接块1101G与所述让位缺口1221G相互配合，在所述第一搭接部110G变形膨胀后，是的所述第一搭接部110G难以从所述第二搭接部120G设置的容纳孔122G内脱离出来。于其他实施方式中，在第二搭接部120G跨线弯折重叠于所述第一搭接部110G之后，为了进一步加强两者之间的电连接接性能，可在第一搭接部110G及第二搭接部120G的结构上作出其他相应改变，以增强两者之间的连接固定。
在本申请其中一第十实施方式中，请参阅图24至图25，所述第一导电端子11J的所述第一搭接部110J于所述重叠搭接区域R内通过冷镦铆接的方式包裹所述第二导电端子12J的所述第二搭接部120J，使得两者实现机械固定的同时实现电性连接。具体的，所述第一搭接部110J包括平行于所述第二搭接部120J设置的主体部111J及自所述主体部111J的两侧向所述第二搭接部120J弯折包裹形成的第一折弯段112J和第二折弯段113J。所述主体部111J、所述第一折弯段112J和所述第二折弯段113J将所述第二搭接部120J包裹固定，再利用冷镦方式将二者连接固定。
在本申请的实施方式中，所述桥接部自所述第一导电端子的所述连接段一体弯折延伸或者与所述连接段分开设置。本申请的以上实施方式，也即第一至第十实施方式中，所述桥接部自所述第一导电端子的所述连接段 一体弯折延伸；本申请的其中一第十一实施方式中，所述桥接部18K与所述第一导电端子11K的所述连接段17K分体设置，且二者也采用重叠搭接的方式实现相互固定及电连接。第一导电端子11K的桥接部18K与连接段17K分体设置，一方面可以进一步减小导电端子的弯折，便于实现第一导电端子11K相对第三导电端子13K的空间跨越，尽可能缩减第一导电端子11K的路径；另一方面，由于桥接部18K可以视为相对第一导电端子11K附加金属材料段，因此可以选择与第一导电端子11K和第二导电端子12K不同的材料及不同的材料厚度，进而可以在调整导电路径的电阻率的同时，更加灵活的控制与第一导电端子11K和二导电端子12K之间的焊接方式，进一步增强两导电端子之间的电连接效果。
请参阅图26至图27，所述第一搭接部110K与所述第二导电端子12K的所述第二搭接部120K通过桥接部18K电连接。所述桥接部18K通过横跨所述第三导电端子13K的方式使得所述第一搭接部110K重叠搭接于所述第二搭接部120K。所述第一导电端子11K的所述连接段17K还设有第三搭接部171K，所述桥接部18K还设有第四搭接部181K，所述第一导电端子11K的第一搭接部110K与所述第四搭接部181K分别位于所述桥接部18K的两端。所述第三搭接部171K与所述第四搭接部181K重叠搭接并固定及电连接。在本实施方式中，所述桥接部18K的厚度小于所述第一导电端子11K的连接段17K及所述第二导电端子12K的厚度，在实现电性连接的同时，可以减小后续的塑胶块4的注塑厚度。所述桥接部18K的设置，使得第二导电端子12K减少了折弯，增加了搭接固定点以减小导电端子的路径。所述桥接部18K未与所述第一导电端子11K及所述第二导电端子12K重叠搭接的部分，至少于朝向所述第三导电端子13K的一侧面设有绝缘涂层(未标识)以使所述桥接部18K直接贴靠在所述第三导电端子13K上，防止发生短路现象，且能够进一步减小后续的塑胶块4的注塑厚度。于所 述金属电路1外注塑塑胶块4，所述桥接部18K与所述第一导电端子11K重叠搭接的部分(第四搭接部181K)及与所述第二导电端子12K重叠搭接的部分(第一搭接部110K)暴露于所述塑胶块4，所述桥接部18K未与所述第一导电端子11K及所述第二导电端子12K重叠搭接的部分被包覆于所述塑胶块4。另外，由于桥接部18K为分体于所述第一导电端子11K，故桥接部18K的材料可以改变。如果第一导电端子11K跨线时，造成的电阻较大，可以通过改变桥接部18K的材料来调整整个金属电路1的阻抗。可以理解，在本实施方式中，桥接部18K与第一导电端子11K和第二导电端子12K的固定连接和电性连接方式可以选择以上第一实施方式到第十的实施方式中的任意一种。
本发明还涉及一种制造马达基座100的制造方法，具体包括以下步骤：
第一步，提供具有若干导电端子的金属电路1，所述导电端子包括第一导电端子、所述第二导电端子以及位于第一导电端子和第二导电端子之间的第三导电端子，每一所述导电端子包括焊脚端15及自所述焊脚端延伸的连接段，所述第一导电端子包括与所述连接段连接的桥接部以及自所述桥接部延伸设置的第一搭接部，所述第二导电端子包括自对应所述连接段延伸设置的第二搭接部，所述桥接部自对应第一导电端子的连接段横跨所述第三导电端子进而使得所述第一搭接部与所述第二搭接部重叠搭接；
第二步，一次注塑成型以形成固持所述金属电路1的若干塑胶块4，且所述焊脚端15及所述搭接部暴露于所述塑胶块4；所述第一导电端子和第二导电端子重叠搭接设置后，具体使用顶针治具顶接定位所述第一导电端子和所述第二导电端子，以便于一次注塑成型所述塑胶块4于所述搭接部外围；
第三步，将若干电子元件2定位于对应的所述塑胶块4并与对应的所述焊脚端15进行焊接；
第四步，将所述第二搭接部与所述第一搭接部重叠搭接的区域定义为重叠搭接区域，于所述重叠搭接区域，将所述第一搭接部及所述第二搭接部进行固定连接处理，所述固定连接处理处理方式选择表面贴装焊接、铆压、激光焊接或电阻焊接中的任意之一；
第五步，于所述金属电路1及塑胶块4外二次注塑成型塑胶本体31以形成绝缘底座3，进而形成马达基座100。
其中，如在第四步中，对第一搭接部和第二搭接部进行表面贴装焊接处理，将所述第一搭接部及第二搭接部于所述重叠搭接区域R内进行点焊锡料6，并过回焊炉进行焊接。
当两个导电端子选择通过表面贴装焊接方式固定连接时，所述第一搭接部和所述第二搭接部中的至少之一者于所述重叠搭接区域R开设容纳锡料6的开孔。
当两个导电端子选择通过激光焊或电阻焊的方式固定连接时，于所述重叠搭接区域内令所述第一搭接部与所述第二搭接部平行重叠设置，以便于将所述第一搭接部与所述第二搭接部进行激光焊或电阻焊。
当两个导电端子选择通过铆接的方式固定连接时，于所述重叠搭接区域内令所述第一搭接部与所述第二搭接部铆接固定，具体通过冷镦的方式使所述第一搭接部向下凸设有凸起部111F，所述第二搭接部于所述重叠搭接区域设有收容所述凸起部的容纳孔122F。
当两个导电端子选择通过铆接的方式固定连接时，于所述重叠搭接区域内，通过铆接使所述第一搭接部包裹所述第二搭接部，具体地采用冷镦铆接的方式实现。
在将两个导电端子的搭接部通过焊接、激光焊或电阻焊的方式连接固定的同时，第一导电端子11K还可以分体设置桥接部18K，具体的，所述 桥接部18K与所述第一导电端子11K的所述连接段17K分开设置。此时，所述第一导电端子11K的所述连接段17K还设有第三搭接部171K，所述桥接部18K的两端分别设有第一搭接部110K和第四搭接部181K。所述桥接部18K的所述第四搭接部181K与所述第一导电端子11K的所述第三搭接部171K重叠搭接并固定及连接，所述桥接部18K的所述第一搭接部110K与所述第二导电端子12K的所述第二搭接部120K重叠搭接并固定及连接，进而实现第一导电端子11K和所述第二导电端子12K的间接电连接。而所述桥接部18K与第二搭接部120K及第三搭接部171K的固定及电连接方式，又可采用上述焊锡、电阻焊、激光焊或铆压等方式，此处不再赘述。
本发明中，马达基座100中第一导电端子的桥接部自对应第一导电端子的连接段横跨所述第三导电端子进而使得所述第一搭接部与所述第二搭接部重叠搭接并固定连接，避免了单一导电端子折弯次数过多而导致的导电端子无法成型，提高了导电端子的成型良率，节约了导电端子的布线空间，而且所述两个导电端子重叠搭接使得两者之间接触面积较大，电连接性能优。
本发明中的第一至第六实施方式中，第一、二导电端子的第一、二搭接部相对定位后，利用电子元件2的焊接工序同时完成相对电连接，可以进一步减少焊接工序，简化制程。
本发明中的第一至第六实施方式中，第一、二导电端子的第一、二搭接部中至少其一设置开孔，以促进锡料6与第一、二搭接部的充分接触，加强焊接效果。第一、二导电端子的第一、二搭接部的与锡料6接触的部分均设置镀金区域，以进一步加强锡料与第一、二搭接部的充分接触，加强焊接效果。
本发明中，塑胶块4对应第一、二导电端子的第一、二搭接部或者对应桥接部18K的第一、四搭接部与第二、一导电端子的第二、三搭接部于 承载槽410内凸设台阶部411，台阶部411包覆第一、二搭接部或者连同第三、四搭接部的外沿区域仅使重叠搭接区域R内的焊接区域暴露于所述塑胶块4，进而加强第一、四搭接部分别与第二、三搭接部搭接的固定效果。
本发明中，所述第二导电端子的所述连接段17自对应的所述焊脚端15延伸并连续跨越至少三个平面，可在实现导电端子的对应引脚端14与焊脚端15间位置跨越的同时加强所述马达基座100的强度。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明实施例技术方案的范围。
以上所述仅为本发明的部分实施方式，不是全部的实施方式，本领域普通技术人员通过阅读本发明说明书而对本发明技术方案采取的任何等效的变化，均为本发明的权利要求所涵盖。

Claims (29)

  1. 一种马达基座，包括绝缘底座、设于所述绝缘底座的金属电路及焊接于所述金属电路的电子元件，所述金属电路包括若干导电端子，所述导电端子包括第一导电端子、第二导电端子以及位于第一导电端子和第二导电端子之间的第三导电端子，每一所述导电端子包括焊接所述电子元件的焊脚端及自所述焊脚端延伸的连接段，其特征在于：所述第一导电端子包括桥接部以及自所述桥接部延伸设置的第一搭接部，所述第二导电端子包括自对应连接段延伸设置的第二搭接部，所述第一导电端子的所述桥接部自对应的所述连接段横跨所述第三导电端子进而使得所述第一搭接部与所述第二搭接部重叠搭接并固定连接，所述绝缘底座注塑成型并至少包覆固定在所述第一导电端子和第二导电端子外。
  2. 如权利要求1所述的马达基座，其特征在于：所述电子元件包括至少两个不同的电子元件，所述第一导电端子、所述第二导电端子的所述焊脚端分别对应焊接两个不同的所述电子元件；所述第一导电端子和所述第二导电端子二者中仅一个设有自对应的所述连接段延伸出所述绝缘底座以与外部电路电性连接的引脚端，以使所述第一导电端子和第二导电端子共用相同的所述引脚端。
  3. 如权利要求2所述的马达基座，其特征在于：所述绝缘底座包括一次注塑成型并包覆所述金属电路的若干塑胶块，所述焊脚端、所述第一搭接部及所述第二搭接部暴露于对应的所述塑胶块的同一表面，所述绝缘底座还包括二次注塑成型并包覆所述金属电路和若干所述塑胶块的塑胶本体，若干所述塑胶块竖直设置并位于不同的竖直平面，不同的所述电子元件定位于不同的所述塑胶块并暴露于对应的所述塑胶块。
  4. 如权利要求3所述的马达基座，其特征在于：所述第二导电端子的所述连接段自对应的所述焊脚端延伸并连续跨越至少三个平面，所述连接段自对应的所述焊脚端所在的所述竖直平面跨越至所述塑胶本体的底面所在的水平平面，再跨越至所述第一导电端子的所述焊脚端所在的所述竖直平面。
  5. 如权利要求4所述的马达基座，其特征在于：所述第二搭接部与所述第一搭接部重叠搭接的位置定义为重叠搭接区域，所述第二导电端子与所述桥接部通过焊锡方式连接固定，并且所述第一搭接部和所述第二搭接部中的至少之一者于所述重叠搭接区域开设容纳锡料的开孔。
  6. 如权利要求5所述的马达基座，其特征在于：所述第一导电端子及所述第二导电端子于所述重叠搭接区域进行表面镀金以形成镀金区域，所述镀金区域覆盖所述重叠搭接区域对应的所述第一导电端子的上表面、与所述上表面相对的下表面、所述开孔设有的内壁及与所述第一导电端子的所述下表面相对靠近的所述第二导电端子的上壁。
  7. 如权利要求6所述的马达基座，其特征在于：所述第一搭接部于所述重叠搭接区域开设所述开孔，所述开孔定义为固持通孔，所述固持通孔设有远离所述第二导电端子的开口端和靠近所述第二导电端子的贴靠端，所述开口端的尺寸小于所述贴靠端的尺寸，锡料容纳于所述固持通孔内。
  8. 如权利要求7所述的马达基座，其特征在于：所述第二搭接部自所述上壁向所述固持通孔内凸设有凸包，所述锡料容纳于所述固持通孔内并集中于所述凸包。
  9. 如权利要求6所述的马达基座，其特征在于：所述第一搭接部于所述重叠搭接区域开设所述开孔，所述第一搭接部的所述开孔定义为固持通孔，所述固持通孔设有远离所述第二导电端子的开口端和靠近所述第二导 电端子的贴靠端，所述第二接搭接部于所述重叠搭接区域开设所述开孔，所述第二搭接部的所述开孔定义为容纳孔，所述第二搭接部的所述容纳孔于所述重叠搭接区域内与所述固持通孔连通，所述锡料容纳于所述固持通孔与所述容纳孔内。
  10. 如权利要求9所述的马达基座，其特征在于：所述开口端的尺寸大于所述贴靠端的尺寸，所述容纳孔的尺寸大于所述贴靠端的尺寸。
  11. 如权利要求9所述的马达基座，其特征在于：所述开口端的尺寸大于所述贴靠端的尺寸，所述固持通孔与所述容纳孔错位设置且相互连通，所述容纳孔靠近所述第一搭接部的一侧的尺寸小于所述容纳孔远离所述第一搭接部的一侧的尺寸，所述锡料容纳于所述固持通孔与所述容纳孔。
  12. 如权利要求6所述的马达基座，其特征在于：所述第一导电端子与所述第二导电端子于所述重叠搭接区域内的所述下表面及所述上壁均设有波浪状的凹凸结构，且所述下表面的凹凸结构与所述上壁的凹凸结构的延伸方向不同，所述锡料容纳于所述开孔与所述下表面及上壁之间的所述凹凸结构中。
  13. 如权利要求6所述的马达基座，其特征在于：所述第一搭接部的面积小于所述第二搭接部的面积，所述第一搭接部具有环形结构，所述环形结构中空设置以形成所述开孔，所述环形结构的所述开孔定义为固持通孔，所述内壁定义为所述固持通孔设置的第一内壁，所述环形结构的外壁设置为外壁面，所述锡料沿着所述第二搭接部至少收容于所述开孔。
  14. 如权利要求5所述的马达基座，其特征在于：所述第二搭接部开设有所述开孔，所述开孔定义为容纳孔，所述第一搭接部于所述重叠搭接区域内冲压至所述第二搭接部的所述容纳孔内，所述第一搭接部焊接固定于所述第二搭接部。
  15. 如权利要求1所述的马达基座，其特征在于：所述第二搭接部与所述第一搭接部重叠搭接的位置定义为重叠搭接区域，所述第一搭接部与所述第二搭接部于所述重叠搭接区域铆接固定，所述第一搭接部向下凸设有凸起部，所述第二搭接部于所述重叠搭接区域设有收容所述凸起部的容纳孔。
  16. 如权利要求1所述的马达基座，其特征在于：所述第二搭接部与所述第一搭接部重叠搭接的位置定义为重叠搭接区域，所述第一搭接部于所述重叠搭接区域与所述第二搭接部平行重叠设置，所述第一搭接部与第二搭接部通过电阻焊或激光焊或铆接的方式连接固定。
  17. 如权利要求1所述的马达基座，其特征在于：所述第二搭接部与所述第一搭接部重叠搭接的位置定义为重叠搭接区域，所述第一搭接部于所述重叠搭接区域内包裹所述第二搭接部，所述第一搭接部与所述第二搭接部接触连接。
  18. 如权利要求1所述的马达基座，其特征在于：所述桥接部自所述第一导电端子的所述连接段一体弯折延伸；或者所述桥接部与所述连接段分开设置，所述第一导电端子的所述连接段还设有第三搭接部，所述桥接部还设有第四搭接部，所述第三搭接部与所述第四搭接部重叠搭接并固定连接。
  19. 如权利要求18所述的马达基座，其特征在于：所述桥接部的厚度小于所述第一导电端子的连接段及所述第二导电端子的厚度。
  20. 如权利要求18所述的马达基座，其特征在于：所述桥接部未与所述第一导电端子及所述第二导电端子重叠搭接的部分，至少于朝向所述第三导电端子的一侧面设有绝缘涂层，以使所述桥接部直接贴靠在所述第三导电端子上。
  21. 如权利要求20所述的马达基座，其特征在于：于所述金属电路外注塑塑胶块，所述桥接部与所述第一导电端子和所述第二导电端子重叠搭接的部分暴露于所述塑胶块，所述桥接部未与所述第一导电端子及所述第二导电端子重叠搭接的部分包覆于所述塑胶块。
  22. 一种马达基座的制造方法，其特征在于，包括如下步骤：
    第一步，提供具有若干导电端子的金属电路，所述导电端子包括第一导电端子、所述第二导电端子以及位于所述第一导电端子和所述第二导电端子之间的第三导电端子，每一所述导电端子包括焊脚端及自所述焊脚端延伸的连接段，所述第一导电端子包括与所述连接段连接的桥接部以及自所述桥接部延伸设置的第一搭接部，所述第二导电端子包括自对应所述连接段延伸设置的第二搭接部，所述桥接部自对应的所述连接段横跨所述第三导电端子，进而使得所述第一搭接部与所述第二搭接部重叠搭接；
    第二步，将所述第二搭接部与所述第一搭接部重叠搭接的区域定义为重叠搭接区域，于所述重叠搭接区域将所述第一搭接部及所述第二搭接部进行固定连接；
    第三步，将电子元件定位于对应的所述焊脚端并进行焊接；
    第四步，于所述金属电路注塑成型绝缘底座。
  23. 如权利要求22所述的马达基座的制造方法，其特征在于：在第二步之前，提供顶针治具顶接定位所述第一导电端子和所述第二导电端子的所述重叠搭接区域，一次注塑成型塑胶块于所述金属电路，且所述焊脚端、所述第一搭接部及所述第二搭接部暴露于对应的所述塑胶块的同一表面。
  24. 如权利要求23所述的马达基座的制造方法，其特征在于：所述固定连接采用锡焊接方式，在第二步之前，先将所述第一搭接部和所述 第二搭接部于所述重叠搭接区域内进行点锡料，然后过回焊炉进行焊接以完成所述固定连接。
  25. 如权利要求24所述的马达基座的制造方法，其特征在于：所述第一搭接部和所述第二搭接部中的至少之一者于所述重叠搭接区域开设容纳锡料的开孔。
  26. 如权利要求22所述的马达基座的制造方法，其特征在于：所述桥接部自所述第一导电端子的所述连接段一体弯折延伸；或者所述桥接部与所述连接段分开设置，所述第一导电端子的连接段还设有第三搭接部，所述桥接部还设有第四搭接部，在第二步之中，同时将所述第一搭接部和所述第四搭接部分别对应与第二搭接部和所述第三搭接部重叠搭接并进行固定连接。
  27. 如权利要求22所述的马达基座的制造方法，其特征在于：所述第一搭接部与所述第二搭接部平行重叠搭接，所述固定连接采用激光焊接方式，将所述第一搭接部与所述第二搭接部进行激光焊。
  28. 如权利要求22所述的马达基座的制造方法，其特征在于：所述固定连接采用铆接连接方式，所述第一搭接部于所述重叠搭接区域向下凸设有凸起部，所述第二搭接部于所述重叠搭接区域设有收容所述凸起部的容纳孔。
  29. 如权利要求22所述的马达基座的制造方法，其特征在于：所述固定连接采用铆接连接方式，所述第一搭接部于所述重叠搭接区域内包裹所述第二搭接部并且与所述第二搭接部固定连接。
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