WO2024060929A1 - Photoacoustic measuring device and film thickness measuring method - Google Patents
Photoacoustic measuring device and film thickness measuring method Download PDFInfo
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- WO2024060929A1 WO2024060929A1 PCT/CN2023/114745 CN2023114745W WO2024060929A1 WO 2024060929 A1 WO2024060929 A1 WO 2024060929A1 CN 2023114745 W CN2023114745 W CN 2023114745W WO 2024060929 A1 WO2024060929 A1 WO 2024060929A1
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- detection
- position sensor
- dimensional position
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- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000001514 detection method Methods 0.000 claims abstract description 249
- 238000005259 measurement Methods 0.000 claims abstract description 86
- 230000005284 excitation Effects 0.000 claims abstract description 50
- 230000003287 optical effect Effects 0.000 claims description 43
- 238000002310 reflectometry Methods 0.000 claims description 21
- 230000008859 change Effects 0.000 claims description 19
- 238000000691 measurement method Methods 0.000 claims description 12
- 238000003384 imaging method Methods 0.000 claims description 8
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- 238000004364 calculation method Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000010895 photoacoustic effect Methods 0.000 description 4
- 210000001747 pupil Anatomy 0.000 description 3
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
Definitions
- the invention relates to the field of detection, and in particular to a photoacoustic measuring device and a film thickness measuring method.
- the photoacoustic measurement mechanism in the prior art is mainly based on the following: short pulse laser is irradiated on the surface of the film sample, and the film sample absorbs photons to generate thermoelastic deformation, forming a deformation zone on the surface; thermoelastic deformation generates sound waves that propagate on the solid surface and inside; longitudinal sound waves
- the first echo signal is generated when it propagates to the interface (specifically, such as the substrate or the junction between the membrane and the membrane); the first echo signal reaches the upper surface, causing further changes in the deformation; the echo signal rebounds after hitting the upper surface. After the rebound hits the interface, a second echo signal is generated; the second echo signal reaches the upper surface, causing the bulge shape to change again.
- the echo signal may also include more than three times. The time interval between echoes reaching the upper surface can be obtained through the detection system, from which the thickness of the film sample can be calculated.
- the existing detection system can only detect changes in material reflectivity.
- the reflectivity of the material itself changes slightly (such as inert metal material Cu), or when the material structure or surface roughness changes (such as the surface roughness of metal materials after chemical mechanical polishing)
- the thickness is larger (or Cu line array, etc.)
- the material reflectivity change magnitude is low, and it is impossible to obtain a high signal-to-noise ratio photoacoustic signal that can be used to extract film thickness information.
- the purpose of this invention is to provide a method that directly measures the beam displacement at the pupil caused by beam deflection by adding a position sensitive detector/device (PSD) to the detection optical path, and then obtains the time when the echo reaches the upper surface, and calculates Film thickness value.
- PSD position sensitive detector/device
- the present invention provides a photoacoustic measurement device, including a light emitter, a controller, an image acquisition component and a detection component; the light emitter is used to generate excitation light and detection light;
- the excitation light is projected to the measurement area of the object to be measured along the optical path of the excitation light, and the detection light is projected to the measurement area along the optical path of the detection light.
- the excitation light forms an acoustic wave in the object to be measured, and the sound wave It is transmitted back to the surface of the measured object through the interface in the measured object and produces deformation in the measurement area;
- the detection component is used to receive the detection beam reflected by the measured object and generate an output signal,
- the detection component includes a one-dimensional position sensor or a two-dimensional position sensor to at least obtain the offset of the reflected detection beam, wherein the one-dimensional position sensor and the two-dimensional position sensor are switchable or replaceable during the measurement process. ;
- the image acquisition component is used to acquire images of the excitation light and detection light spots on the surface of the object to be measured; the controller is used to receive the image to determine the excitation light spot and the detection light spot. the relative orientation of the position on the surface of the measured object, and control the detection component to select the one-dimensional position sensor or the two-dimensional position sensor according to the relative orientation; the controller is also used to select the one-dimensional position sensor or the two-dimensional position sensor according to the relative orientation.
- the output signal of the detection component is used to obtain the parameters to be measured of the object to be measured.
- the corresponding position sensor is selected, which further improves the accuracy of the obtained offset and improves the signal-to-noise ratio.
- controlling the detection component to select the one-dimensional position sensor or the two-dimensional position sensor according to the relative orientation includes: if the relative orientation is along the x direction or the y direction, the detection component The component selects a one-dimensional position sensor, and the detection surface of the one-dimensional position sensor is long The direction of the edge corresponds to said relative orientation;
- the detection component selects a two-dimensional position sensor, and the directions of the two sides of the detection surface of the two-dimensional position sensor correspond to the x-direction and the y-direction respectively, or the detection component selects two one-dimensional position sensors, and the directions of the long sides of the detection surfaces of the two one-dimensional position sensors are mutually orthogonal; wherein the x-direction and the y-direction are two mutually orthogonal directions on the surface of the object to be measured.
- the one-dimensional position sensor includes two output terminals, and the two-dimensional position sensor includes four output terminals;
- the detection surface of the one-dimensional position sensor is a rectangular photosensitive surface or consists of two square photosensitive surfaces of the same size; the detection surface of the two-dimensional position sensor is a square photosensitive surface or consists of four identical photosensitive surfaces distributed in a 2 ⁇ 2 array. It consists of a square photosensitive surface.
- a further embodiment discloses a photoacoustic measurement device that obtains the offset from the output signal of the one-dimensional position sensor, including:
- ⁇ is the offset
- I1 and I2 are the output signals of the two output ends of the one-dimensional position sensor respectively
- L is the effective distance between the two output ends or the diameter of the reflected detection light beam.
- the offset is obtained from the output signal of the two-dimensional position sensor, including:
- ⁇ x and ⁇ y are the components of the offset in the x direction and the y direction respectively
- I 1 , I 2 , I 3 and I 4 are respectively the output signals of the four output terminals of the two-dimensional position sensor
- I 1 and I 2 , I 3 and I 4 are respectively the output signals of two adjacent output terminals corresponding to the y direction
- I 1 and I 4 , I 2 and I 3 are respectively the output signals of two adjacent output terminals corresponding to the x direction.
- the output signal of the output terminal L x is the effective distance between the two output terminals corresponding to the output signals I 1 and I 4 respectively or the diameter of the reflected detection beam, L y is the corresponding The effective distance between the two output terminals or the diameter of the reflected detection beam.
- a photoacoustic measurement device is disclosed, and the detection component further includes a photodetector to obtain changes in light intensity caused by changes in reflectivity of the object to be measured;
- the reflected detection beam passes through the spectroscopic component and is received by the photodetector and the one-dimensional position sensor or the two-dimensional position sensor respectively.
- a photoacoustic measurement device is further disclosed, wherein the reflected detection light beam is received by the photodetector after passing through an imaging unit, and the magnification of the imaging unit is 1:1; the detection light received by the one-dimensional position sensor or the two-dimensional position sensor is a parallel light beam.
- the disclosed photoacoustic measurement device determines the light splitting ratio of the light splitting component based on the one-dimensional position sensor or the two-dimensional position sensor and the saturation power of the photodetector, and the The power of the detection light received by the one-dimensional position sensor, the two-dimensional position sensor, and the photodetector reaches saturation power.
- photoelectric detectors you can switch between two measurement modes, material reflectivity measurement and drum deflection measurement. To cope with different measurement conditions, you can choose the measurement method with greater responsiveness for testing, and obtain higher results. The signal-to-noise ratio and system repeatability measurement accuracy.
- the present invention also provides a film thickness measurement method, which is applied to the photoacoustic measurement equipment of the first aspect, including: acquiring the excitation light and the detection light at different time delays, The output signal of the detection component;
- the controller controls an optical retarder to adjust the optical path difference between the excitation light and the detection light to achieve adjustment of different time delays.
- the optical retarder is arranged in the optical path of the excitation light and/or the detection light. light path;
- the detection signal includes the detection beam offset, or includes the detection beam offset and the change in light intensity caused by the change in reflectivity of the measured object;
- the time interval in the time domain of the detection signal is obtained, and the film thickness of the object to be measured is obtained based on the time interval.
- the time interval corresponds to the time interval between the sound waves reaching the surface of the object to be measured twice before and after.
- obtaining the film thickness of the object under test based on the time interval includes: obtaining a first time interval based on the offset of the detection beam, and calculating first film thickness;
- the obtained first film thickness or the second film thickness is used as the film thickness of the measured object; or,
- the obtained average value of the first film thickness and the second film thickness is regarded as the film thickness of the measured object.
- Figure 1 is a schematic diagram of the architecture of a detection component according to an embodiment of the present invention.
- Figure 2 is a schematic diagram of the detection component structure of an embodiment of the present invention.
- Figure 3 is a schematic diagram of the detection component structure of an embodiment of the present invention.
- Figure 4 is a schematic diagram of an embodiment of a photoacoustic measurement device of the present invention.
- Figure 5 is a schematic diagram of the basic structure of the photoacoustic detection principle of the present invention.
- Figure 6 is a schematic diagram of an embodiment of a photoacoustic measurement device of the present invention.
- Figure 7 is a schematic diagram of an embodiment of a photoacoustic measurement device of the present invention.
- Figure 8 is a schematic diagram of multiple embodiments of the position sensor of the present invention.
- Figure 9 is a schematic flow chart of the film thickness measurement method of the present invention.
- Figure markings 000-laser; 120-beam splitter; 130-chopper; 140-beam combiner; 210-first reflector; 220-optical delay; 230-second reflector; 250-first condenser; 270-second condenser; 260-collimator; 300-square beam splitter; 310-first light-splitting component; 320 second light-splitting component; 400-position sensor; 420-photodetector; 410-first phase-locked amplifier; 411-second phase-locked amplifier; 800-object to be measured; 810-bulge on sample surface; 510-excitation beam; 520-detection beam; 500-image acquisition component; 610-one-dimensional position sensor; 620-two-dimensional position sensor.
- a and/or B can mean: A exists alone, A and B exist simultaneously, and B exists alone, Where A and B can be singular or plural.
- the character "/" generally indicates that the related objects are in an "or” relationship.
- words such as “exemplarily” or “for example” are used to represent examples, illustrations or explanations. Any embodiment or design described as “exemplary” or “for example” in the embodiments of the invention is not to be construed as preferred or advantageous over other embodiments or designs. Rather, the use of the words “exemplarily” or “for example” is intended to present the relevant concepts in a concrete manner.
- the embodiment of the present invention provides a photoacoustic measurement device.
- the beam emitted by the laser 000 is divided into an excitation beam 510 and a detection beam 520 by the beam splitter 120.
- the excitation light optical path is provided with a chopper 130.
- the detection light optical path is provided with a first reflecting mirror 210, an optical retarder 220 and a second reflecting mirror 230.
- the excitation beam 510 and the detection beam 520 are focused on the surface of the object 800 by the second condenser 270 after passing through the beam combiner 140, and the detection light reflected by the sample surface is received by the detection component.
- the detection component includes a position sensor 400 and a lock-in amplifier 410.
- the structural arrangement of the detection component can adopt any technical solution in the creative embodiments of the present invention.
- the detection component as shown in Figures 1-3 can be used. Structural settings; among them, different structural settings of the detection component are replaceable or switchable.
- PSD Position Sensing Detector
- the beam displacement at the pupil caused by the deflection of the detection beam 520 is directly measured, and then the time for the echo to reach the upper surface is obtained and calculated Film thickness value.
- the bulge-deflected light beam generated by the surface of the object 800 is collimated into parallel light by the collimator 260.
- a position sensor 400 is placed on the back focal plane of the collimator 260 in Figure 4.
- the excitation light and detection light beams are focused on the surface of the object to be measured through a condenser mirror.
- the sound waves generated by the photoacoustic effect propagate between the film layers.
- the stress and strain will cause local bulges on the surface of the material on the order of picometers - bulges 810 on the sample surface.
- the incident detection light converges to the position where the bulges cause a large surface tilt, that is, a bulge 810 is generated.
- the maximum position of the first derivative/gradient of the bulge morphology is described in FIG. 5.
- the optical element is located between the measurement area and the position sensor 400 .
- the reflected detection light beam is collimated by the collimating mirror 260 and then received by the position sensor 400 .
- the sound wave generated by the photoacoustic effect propagates longitudinally, will be reflected at the interface and then return to the sample surface.
- the detection light beam is reflected by the sample surface, which is generally approximate to mirror reflection.
- the detection light beam follows the route shown by the dotted line. Propagation (see Figure 5); when the sound wave generated by the photoacoustic effect reaches the sample surface, the sample surface again generates local surface bulges, that is, the size of the bulge 810 on the sample surface changes, thereby causing the position of the detection beam to deviate relative to the excitation beam.
- the offset of the detection beam is directly obtained through the position sensor 400. Based on the changing trend of the offset of the detection beam, the time for the echo to reach the upper surface of the sample is obtained to calculate the film thickness.
- the surface convexity causes the surface where the detection light focus point is tilted. Assume that the tilt angle of the sample surface convexity is ⁇ , and the entire reflected detection light beam is deflected 2 ⁇ , as shown by the solid line in Figure 5.
- f is the focal length of the collimating lens 260.
- the photoacoustic measurement device as shown in Figure 6, the detection component includes a photodetector 420 and a position sensor 400, the photoacoustic measurement device also includes a spectroscopic component 300, and the After the detection beam passes through the light splitting component, it is divided into two parts. One part is received by the photodetector 420 and the other part is received by the position sensor 400 .
- the detection light beam is bulged and deflected after passing through the surface of the sample to be measured. As shown in Figure 6, it is collimated into parallel light through the collimating mirror 260.
- a planar beam splitter is placed behind the collimating mirror 260.
- the specific placement position of the device 300 and the planar light splitting device 300 can be near the back focal plane of the collimating mirror 260.
- the specific splitting ratio can be designed and adjusted according to the saturation power of the detector corresponding to the two-channel light.
- the default splitting here is 50:50, allowing photoelectric detection.
- the power of the optical signals received by the detector 420 and the position sensor 400 are both close to their respective saturation powers.
- the spectroscopic device 300 splits the detection beam into two: one beam is focused on the photodetector 420 through the focusing lens 250 and is used to measure changes in material reflectivity; the other beam is directly incident on the photosensitive surface of the position sensor 400 for measuring Measure the detection beam deflection caused by the bulge. Both measurement modes can obtain the time when the echo reaches the upper surface, which can be used to calculate the film thickness value on the surface of the object to be measured.
- the detection beam is split into two by the spectroscopic device 300, one of the beams is focused on the photodetector 420 through the focusing lens for measuring the change in material reflectivity, and the other beam is directly incident on the photosensitive surface of the position sensor 400 for measuring Measure the deflection/displacement of the detection beam caused by the bulge.
- Both measurement modes can obtain the time when the echo reaches the upper surface and calculate the film thickness value. It depends on the material of the sample to be tested, surface roughness and geometric structure, etc. Different quantities can be selected. test method.
- the application of two measurement modes makes the measurement equipment more universal and can be used to measure film thickness of different materials. It has a high signal-to-noise ratio in a variety of measurement scenarios and obtains film thickness with higher accuracy. .
- the photoacoustic measurement equipment includes the spectroscopic optical element, specifically The square beam splitter 300 in Figure 6 is used to divide the detection beam into two parts. One part passes through the square beam splitter 300 and is received by the photodetector 420, and the other part is reflected by the square beam splitter 300 and is The position sensor 400 receives a lock-in amplifier for respectively receiving the output signal of the photodetector and the output signal of the position sensor. Switch between the two measurement modes at will to cope with different measurement conditions and choose the measurement method with greater responsiveness for testing to obtain higher signal-to-noise ratio and system repeatability measurement accuracy.
- the photoacoustic measurement equipment can achieve two types of measurements through the square beam splitter 300 and subsequent detection devices (photodetector 420 and position sensor 400). model.
- the two sets of output signals generated can be connected to the signal input terminals of the dual-channel lock-in amplifier respectively, or connected to two lock-in amplifiers respectively.
- the host computer 900 can directly control the dual-channel lock-in amplifier through the communication interface, or establish connections with the two lock-in amplifiers respectively.
- a lock-in amplifier 410 or 411 the system can be switched between the material reflectance measurement mode and the deflection measurement mode through the control program.
- the collimator 260 and the condenser 270 form a Kepler beam expansion system to image the object 800.
- the scale of the focused light spot is between several and tens of microns.
- the size of the light spot on the photosensitive surface/image plane of the photodetector is consistent with the size of the light spot on the surface of the sample to be measured.
- the size of the photosensitive surface of the photodetector is generally in the order of mm. Even if the light beam is partially deflected due to system vibration, environmental disturbance, sample bulging and other factors, according to the imaging principle, the position and size of the light spot on the imaging plane will not change.
- the signal size is not affected by these disturbance factors and has good robustness.
- the photoacoustic signal can be measured by the reflectivity measurement mode; some materials, such as Cu, have a metal film surface with a large roughness after chemical mechanical grinding, or special structures such as Cu line arrays, and the amplitude of the material reflectivity signal change is low, so the deflection measurement mode can be used for photoacoustic signal measurement.
- the deflection measurement mode can have strong signal amplitude for most materials, so it can be adapted to most working conditions.
- any noise source that affects the direction of the beam will have a noisy impact on the deflection data, such as the impact on the pointing stability of the light source, the impact of mechanical vibration on individual reflectors, etc.
- the two measurement modes can be switched.
- the photoacoustic measurement equipment also includes a first condenser optical element, specifically the first condenser lens 250 in Figure 7.
- the first condenser mirror 250 is located between the square beam splitter 300 and the photodetector 420
- the collimating mirror 260 is located between the measurement area of the measured object 800 and the square beam splitter 300 .
- the photoacoustic measurement equipment also includes a light source component, specifically the laser 000 in Figure 7, and a spectroscopic optical component, specifically as shown in Figure 7 Middle beam splitter 120, the light source component is used to provide a source beam.
- the source beam is divided into two parts after passing through the spectroscopic optical component, one part is the excitation beam 510, and the other part is the detection beam 520.
- the photoacoustic measurement equipment also includes a light combining optical component, specifically a beam combiner 140 in Figure 7.
- the light combining optical component is used to combine the excitation beam and the detection beam into one, and combine the two.
- a light beam of one is projected to the measurement area of the object to be measured, specifically the object to be measured 800 in Figure 7 .
- the photoacoustic measurement device also includes a chopper optical component, specifically the chopper 130 in Figure 7.
- a chopper optical component specifically the chopper 130 in Figure 7.
- the optical chopper component It is located in the optical path of the excitation light, specifically between the beam splitter 120 and the beam combiner 140 in Figure 7. After the excitation beam passes through the chopper optical component, it is received by the beam combiner 140.
- the optical chopper component is used to To modulate the excitation light
- the chopper 130 can be an acousto-optic modulator or an electro-optic modulator; it also includes an optical retarder 220 disposed in the optical path of the detection light, and the optical retarder 220 is located between the beam splitter 120 and the beam combiner 140 During this time, the detection beam passes through the optical retarder 220 and is received by the beam combiner 140.
- the optical retarder 220 is used to phase delay the detection beam; a first reflector 210 and a second reflector are also provided in the detection optical path.
- Mirror 230 the first reflecting mirror 210 is located between the beam splitter 120 and the optical retarder 220 , and the second reflecting mirror 230 is located between the optical retarder 220 and the beam combiner 140 .
- the photoacoustic measurement equipment provided in the above embodiments also includes a controller and an image acquisition component (not shown in Figures 4 and 6-7), wherein the detection component is used to receive the detection beam reflected by the object to be measured and generate an output signal,
- the position sensor includes a one-dimensional position sensor or a two-dimensional position sensor to at least obtain the offset of the reflected detection beam, wherein the one-dimensional position sensor and the two-dimensional position sensor are switchable or replaceable during the measurement process.
- Image acquisition component 500 as shown in Figure 1, Figure 2, and Figure 3, is used to obtain Obtain the image of the excitation light and the detection light spot on the surface of the object to be measured; the controller is used to receive the image to determine the excitation light spot and the detection light spot on the surface of the object to be measured.
- the relative orientation of the position can be understood as the relative orientation is the direction from the center of mass of one light spot to the center of mass of another light spot on the surface of the object to be measured.
- the controller can obtain two images based on the image of the excitation light spot and the image of the detection light spot. The centroid of the light spot can then determine the relative orientation.
- the detection component includes a one-dimensional position sensor 610, as shown in Figure 1 or 2; the detection component can also include a photodetector 420 and a one-dimensional position sensor 610, as shown in Figure 2; the detection component can also be configured to include a Two-dimensional position sensor 620, as shown in Figure 3 .
- the controller controls the detection component to select the one-dimensional position sensor 610 or the two-dimensional position sensor 620, that is, according to the relative orientation, the detection component is set to two one-dimensional positions as shown in Figure 1 or 2
- the sensor 610 may be configured as a two-dimensional position sensor 620 as shown in Figure 3; as shown in Figure 1, two one-dimensional position sensors 610 are provided, wherein the direction of the long side of the detection surface of the two one-dimensional position sensors orthogonal to each other; the controller is also used to obtain the parameters to be measured of the object to be measured according to the output signal of the detection component.
- the technical effect of selecting the corresponding position sensor according to the relative orientation it can select the appropriate position sensor according to the direction of the offset, improve the accuracy of obtaining the offset, and improve the signal-to-noise ratio.
- the solution provided by the above embodiment can enable the position sensor to accurately match the deflection direction of the detection beam, thereby further improving the accuracy of the obtained offset of the detection beam, thereby improving the film thickness measurement accuracy.
- controlling the detection component to select the one-dimensional position sensor 610 according to the relative orientation includes: if the relative orientation is along the x direction or the y direction, the detection component selects the one-dimensional position sensor. 610, and the direction of the long side of the detection surface of the one-dimensional position sensor 610 corresponds to the relative orientation; if the relative orientation is not along the x direction or the y direction, the detection component selects a two-dimensional position sensor, and the The directions of the two sides of the detection surface of the two-dimensional position sensor correspond to the x direction and the y direction respectively, or the detection component selects two one-dimensional position sensors, and the detection surfaces of the two one-dimensional position sensors The directions of the long sides are orthogonal to each other.
- the coordinate system of the detection surface of the position sensor corresponds to the coordinate system of the surface of the measured object.
- a local coordinate system O-XYZ is established on the surface of the measured object 800, where the x direction and the y direction are two mutually orthogonal directions on the surface of the object to be measured, z is the direction perpendicular to the surface of the object to be measured;
- the detection surface of the position sensor 400 establishes a coordinate system O'-X'Y'Z', where the x' direction Corresponds to the x direction, and the y' direction corresponds to the y direction.
- the images of the excitation light spot and the detection light spot on the surface 800 of the object to be measured are obtained by the image acquisition component 500, and the relative orientations of the local coordinate system O-XYZ where the two spots are located are obtained.
- the direction from the centroid of the detection light spot to the centroid of the excitation light spot is For example, it can be X+/X-/Y+/Y-.
- the detection beam behind the collimator 260 is in the local coordinate system O'-X'Y'Z' of the position sensor 400, and the deflection direction corresponds to '-/Y'+/Y'-, select matching position sensor device design according to different relative orientations, and obtain beam deflection information and film thickness information.
- the above solution improves the accuracy of the acquired detection beam offset.
- the relative orientation is along x (X+/X-) or y (Y+/Y-).
- the detection component includes at least one one-dimensional position sensor, wherein the direction of the long side of the detection surface of the at least one one-dimensional position sensor corresponds to the relative orientation, that is,
- the detection component shown in Figure 1 may include two one-dimensional position sensors, or may include one position sensor (not shown in the figure).
- the relative orientation is not along x or y.
- the detection light is received by two one-dimensional position sensors after splitting.
- the two one-dimensional position sensors respectively obtain the components of the offset in the two orthogonal directions, and the actual offset can be obtained.
- the relative orientation is not along x or y, and the offset of the reflected detection light can be obtained by a two-dimensional position sensor.
- the reflected detection light 520 is set on the propagation path.
- a spectroscopic component 310 After passing through the first spectroscopic component 310, a part of the detection light is reflected by the first spectroscopic component 310 to the image acquisition component 500 to obtain the detection light spot image.
- the detection light transmitted through the first spectrometry component 310 continues to propagate and is captured by a second spectrophotometer.
- the dimensional position sensor 620 receives.
- the image acquisition component 500 also receives the excitation light beam to obtain an image of the excitation light spot.
- the structure of the detection component as shown in Figure 1 or the structure of the detection component as shown in Figure 3 can be improved, and a photoelectric detector is provided in the detection system to receive the partially reflected detection beam, so that the detection component can also It can detect changes in surface reflectivity of the object being measured.
- a photoelectric detector is provided in the detection system to receive the partially reflected detection beam, so that the detection component can also It can detect changes in surface reflectivity of the object being measured.
- the structure of the detection component shown is improved.
- the reflected detection light 520 passes through the first spectroscopic component 310 during propagation, and a part of the light beam is reflected by the first spectroscopic component 310 to the image acquisition component 500 to obtain the detection light.
- the detection light transmitted through the first spectroscopic component 310 propagates to the second spectroscopic component 320, the detection light reflected by the second spectroscopic component 320 is received by the photodetector 420, and the detection light transmitted by the second spectroscopic component 320 passes through the square
- the beam splitter 300 is then divided into two parts, which are respectively received by two one-dimensional position sensors 610.
- the image acquisition component 500 also receives the excitation light beam to obtain an image of the excitation light spot.
- the photodetector disclosed in FIG. 2 above can also be applied to the detection component shown in FIG. 3 .
- the detection component structures disclosed in the above embodiments can be applied to photoacoustic measurement equipment.
- the beam center of mass of the detection beam will deflect to different directions in the local coordinate system O'-X'Y'Z' of the position sensor.
- the deflection direction of the detection beam in the local coordinate system of the position sensor is the X' positive position
- the deflection direction of the detection beam in the local coordinate system of the position sensor is the X' negative position X'-; a similar situation also applies to the Y direction.
- the detection component selects a two-dimensional position sensor, and the two sides of the detection surface of the two-dimensional position sensor The directions correspond to the x direction and the y direction respectively, or the detection component selects two one-dimensional position sensors, and the directions of the long sides of the detection surfaces of the two one-dimensional position sensors are orthogonal to each other.
- the photosensitive surface of the position sensor in the photoacoustic measurement device has several deformation designs, wherein the position sensor is shown in FIG8 , one embodiment is composed of photoelectric detector elements with square/rectangular photosensitive surfaces, or, in another embodiment, the position sensor is composed of two photoelectric detector elements with square photosensitive surfaces of equal size arranged side by side in an axisymmetric manner, or, in another embodiment, the position sensor is composed of four photoelectric detector elements with square photosensitive surfaces of equal size arranged in a center-symmetrical manner.
- Different position sensor design schemes can be applied to different measurement scenarios while taking into account the detection accuracy and response speed of the position sensor, and, in the measurement process, according to the detection
- the actual direction/relative orientation of the beam deflection the equipment automatically selects/matches the appropriate layout of the detection components, further improving the detection accuracy of the beam deflection, thereby improving the signal-to-noise ratio of the photoacoustic measurement and improving the measurement accuracy of the film thickness.
- the embodiment of the present invention also discloses a photoacoustic measurement device, the one-dimensional position sensor 610 includes two output terminals, and the two-dimensional position sensor 620 includes four output terminals; the one-dimensional position sensor 610 includes two output terminals;
- the detection surface of the two-dimensional position sensor 610 is a rectangular photosensitive surface, as in case B in Figure 8, or is composed of two square photosensitive surfaces of the same size as in case C in Figure 8;
- the detection surface of the two-dimensional position sensor 620 is A square photosensitive surface as in case A in Figure 8, or consisting of four square photosensitive surfaces of the same size distributed in a 2 ⁇ 2 array as in case D in Figure 8.
- the photoacoustic measurement device obtains the offset from the output signal of the one-dimensional position sensor 610, including:
- ⁇ is the offset
- I 1 and I 2 are the output signals of the two output terminals of the one-dimensional position sensor respectively
- L is the effective distance between the two output terminals or the diameter of the reflected detection beam.
- the two photosensitive surface structures are shown in C in Figure 8.
- L is the spot diameter on the detection surface (the diameter of the reflected detection beam), and the calculation is more accurate.
- the spot diameter is the diameter in the direction, which is the length direction of the rectangular photosensitive surface in the one-dimensional position sensor 610, that is, the X direction shown in C in Figure 8, or two squares of the same size in the one-dimensional position sensor 610
- the position sensor of a single rectangular photosensitive surface is shown as B in Figure 8.
- L is the effective distance between the photocurrent output terminals, and the calculation is more accurate.
- the photoacoustic measurement device obtains the offset from the output signal of the two-dimensional position sensor 620, including:
- ⁇ x and ⁇ y are the components of the offset in the x direction and y direction respectively
- I 1 , I 2 , I 3 and I 4 are respectively the output signals of the four output terminals of the two-dimensional position sensor
- I 1 and I 2 , I 3 and I 4 are respectively the output signals of two adjacent output terminals corresponding to the y direction
- I 1 and I 4 , I 2 and I 3 are respectively the output signals of two adjacent output terminals corresponding to the x direction
- L x is the effective distance between the two output terminals corresponding to the output signals I 1 and I 4 respectively or the detection of the reflection
- the diameter of the beam, Ly y is the effective distance between the two output terminals corresponding to the output signals I 1 and I 2 respectively or the diameter of the reflected detection beam.
- the detection component also includes a photodetector 420 to obtain the light intensity change caused by the reflectivity change of the object to be measured; the reflected detection beam is received by the photodetector 420 and the one-dimensional position sensor 610 or the two-dimensional position sensor 620 respectively after passing through the light splitting component (not shown in the figure).
- the reflected detection beam is received by the photodetector after passing through an imaging unit, and the magnification of the imaging unit (Kepler type) is 1:1, that is, the spot size of the detection beam on the surface of the object to be measured is consistent with its spot size on the detection surface of the photodetector.
- the detection light received by the one-dimensional position sensor or the two-dimensional position sensor is a parallel light beam. Specifically, select a matching position sensor design according to the different deflection directions of the detection beam. The offset in the X' direction and the +/- offset can be measured. If you need to choose, the photocurrent differential signal can be used to feed back the detection beam in X'.
- the position sensor design of the direction offset ⁇ Thickness value, the calculation principle here is the same as the material reflectivity echo calculation method.
- the selection of a position sensor design mainly considers two aspects: position detection sensitivity/accuracy; and detector bandwidth.
- position detection sensitivity/accuracy generally the larger the photosensitive surface, the larger the junction capacitance of the photodetector and the smaller the bandwidth of the photodetector.
- the saturated optical power that the detector can receive will also increase with the increase of the photosensitive area.
- the signal-to-noise ratio of the photoelectric signal also increases.
- the position detection accuracy of the position sensor will also increase.
- An appropriate position sensor design can be selected based on the requirements for detection bandwidth and detection position accuracy under actual working conditions.
- the position sensor design is shown in Figure 8A, consisting of a square photosensitive It is composed of a surface photodetector element and is a two-dimensional position sensor.
- the length of the position sensor in the x direction is Lx
- the length in the y direction is Ly
- Lx and Ly are the lengths of the photosensitive surface in the x and y directions respectively - corresponding to the effective distance between the photocurrent output ends.
- the position sensor design scheme is B in Figure 8, which is a one-dimensional position sensor, consisting of a photodetector element with a long and narrow rectangular photosensitive surface.
- the length of the one-dimensional position sensor in the x direction is Lx>Ly.
- the X-direction offset can be obtained.
- the length of the one-dimensional position sensor in the y direction Ly>Lx can be used to obtain the offset in the Y direction.
- the position sensor is a one-dimensional position sensor.
- the specific design scheme is shown in Figure 8 as case C. It consists of two photodetector elements with square photosensitive surfaces of equal size, which can detect the offset in the X direction. Rotate this design 90 degrees to obtain a dual photodetector element design in the Y direction, which can detect the offset in the Y direction.
- the deflection amount of the detection beam in the X direction can be calculated, and then the angular deflection size of the detection beam and the time when the deflection occurs can be calculated. between.
- the conversion formula between the photocurrent and the beam offset ⁇ in the x direction can be expressed as where L is the diameter of the detection light spot in the x direction.
- the one-dimensional position sensor shown in Figure 8C is rotated 90 degrees, and the conversion formula of the photocurrent and the offset ⁇ of the detection beam in the y-direction can be expressed as where L is the diameter of the detection light spot in the y direction.
- the position sensor is a two-dimensional position sensor.
- the design scheme is in case D in Figure 8.
- the photocurrent can be used to calculate the offset of the detection beam in the X/Y direction, and then calculate the angular deflection of the detection beam and the time when the deflection occurs.
- the offset amount of the detection beam in the X/Y direction can be calculated, and then Calculate the angle deflection of the detection beam and the time when the deflection occurs.
- Lx is the diameter of the light spot in the x direction
- Ly is the diameter of the light spot in the y direction.
- the position sensor design is shown in Figure 8 B and Figure 8 C. They are both unidirectional position detection designs that can measure the deflection of the bulge in one direction. Two position sensors can also be combined to detect deflection in any direction.
- the design solution is simplified, the subsequent circuit design requirements are reduced, it is easy to implement and the cost is low.
- the design scheme B in Figure 8 is compared to the design scheme C in Figure 8.
- the photosensitive surface area is larger, the junction capacitance is large, and the photocurrent is large, so the position accuracy is high, but the bandwidth is low.
- the position sensor design is shown in Figure 8 A and Figure 8 D, which can realize position detection in both X/Y directions and can measure deflection in both directions of the bulge, that is, it can detect deflection in any direction, reducing the impact of excitation light spots and detection light spots.
- the relative orientation requirements that is, both X/Y directions are applicable, which enhances the flexibility of the equipment and has high system integration, but requires higher requirements for subsequent circuit design.
- the present invention also provides a film thickness measurement method, as shown in Figure 9.
- the film thickness measurement method is applied to the photoacoustic measurement equipment disclosed in the aforementioned embodiments, and includes:
- Step 100 Obtain the output signal of the detection component under different time delays of the excitation light and the detection light;
- Step 200 The controller controls an optical retarder to adjust the optical path difference between the excitation light and the detection light to achieve adjustment of different time delays.
- the optical retarder is arranged in the optical path of the excitation light and/or The optical path of the detection light;
- Step 300 acquiring a detection signal based on the output signal, wherein the detection signal includes the detection beam offset, or includes the detection beam offset and a light intensity change caused by a reflectivity change of the object being measured;
- Step 400 Obtain the time interval in the time domain of the detection signal, and obtain the film thickness of the object to be measured based on the time interval.
- the time interval corresponds to the time when the sound wave reaches the surface of the object to be measured twice before and after. time interval.
- obtaining the film thickness of the measured object based on the time interval includes:
- Step 1000 Obtain the first time interval based on the offset of the detection beam, and calculate the first film thickness
- Step 2000 Obtain the second time interval based on the change in light intensity caused by the change in reflectivity of the measured object, and calculate the second film thickness;
- Step 3000 Use the obtained first film thickness or the second film thickness as the film thickness of the measured object; or, use the average value of the obtained first film thickness and the second film thickness As the film thickness of the measured object.
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Abstract
A photoacoustic measuring device, comprising: a light emitter (000), a controller, an image acquisition part (500), and a detection part (400, 420, 610, 620). The light emitter (000) is used for generating excitation light and detection light. The detection part (400, 420, 610, 620) comprises a one-dimensional position sensor (610) or a two-dimensional position sensor (620), and is used for receiving a detection beam reflected by a measured object (800), to obtain at least an offset of the reflected detection beam. The image acquisition part (500) is used for acquiring an image of light spots of the excitation light and the detection light on the surface of the measured object (800). The controller is used for: receiving the image to determine the relative orientation of an excitation light spot and a detection light spot on the surface of the measured object (800), and according to the relative orientation, controlling the detection part (400, 420, 610, 620) to select the one-dimensional position sensor (610) or the two-dimensional position sensor (620); and acquiring parameters to be measured of the measured object (800). A photoacoustic signal having a higher signal-to-noise ratio is obtained by the position detector (400, 420, 610, 620), so that higher repeated measurement precision for film thickness is obtained. Also disclosed is a film thickness measuring method.
Description
交叉引用cross reference
本申请要求2022年09月22日提交的申请号为2022111571237的中国申请的优先权。上述申请的内容以引用方式被包含于此。This application claims priority to the Chinese application with application number 2022111571237 submitted on September 22, 2022. The contents of the above application are incorporated herein by reference.
本发明涉及检测领域,尤其涉及一种光声测量设备及膜厚测量方法。The invention relates to the field of detection, and in particular to a photoacoustic measuring device and a film thickness measuring method.
现有技术中的光声测量机理主要基于如下:短脉冲激光照射在膜样品表面,膜样品吸收光子产生热弹性变形,表面形成形变区;热弹性变形产生声波在固体表面及内部传播;纵向声波传播到界面(具体如基底或膜与膜的交界处)产生第一次回声信号;第一次回声信号到达上表面,使形变形貌进一步发生变化;回声信号碰到上表面后又回弹,回弹碰到界面后产生第二次回声信号;第二次回声信号到达上表面,使鼓包形貌再次发生变化,当然回声信号也可能包括三次以上。通过探测系统可以获取回声到达上表面的时间间隔,由此可计算得到膜样品厚度值。The photoacoustic measurement mechanism in the prior art is mainly based on the following: short pulse laser is irradiated on the surface of the film sample, and the film sample absorbs photons to generate thermoelastic deformation, forming a deformation zone on the surface; thermoelastic deformation generates sound waves that propagate on the solid surface and inside; longitudinal sound waves The first echo signal is generated when it propagates to the interface (specifically, such as the substrate or the junction between the membrane and the membrane); the first echo signal reaches the upper surface, causing further changes in the deformation; the echo signal rebounds after hitting the upper surface. After the rebound hits the interface, a second echo signal is generated; the second echo signal reaches the upper surface, causing the bulge shape to change again. Of course, the echo signal may also include more than three times. The time interval between echoes reaching the upper surface can be obtained through the detection system, from which the thickness of the film sample can be calculated.
现有的探测系统仅可探测材料反射率变化,当材料本身反射率变化较小(如惰性金属材料Cu),或者材料结构或者表面粗糙度发生变化时(如化学机械研磨后金属材料表面粗糙度较大时,或者Cu线阵列等),材料反射率变化量级较低,无法得到能够用于提取膜厚信息的高信噪比光声信号。The existing detection system can only detect changes in material reflectivity. When the reflectivity of the material itself changes slightly (such as inert metal material Cu), or when the material structure or surface roughness changes (such as the surface roughness of metal materials after chemical mechanical polishing) When the thickness is larger (or Cu line array, etc.), the material reflectivity change magnitude is low, and it is impossible to obtain a high signal-to-noise ratio photoacoustic signal that can be used to extract film thickness information.
因此,有必要提供一种新型的光声测量设备及膜厚测量方法以解决现有技术中存在的上述问题。Therefore, it is necessary to provide a new type of photoacoustic measurement equipment and film thickness measurement method to solve the above problems existing in the existing technology.
发明内容Contents of the invention
本发明的目的在于提供一种通过在探测光路中加入位置传感器件(Position sensitive detector/device,PSD),直接量测光束偏转导致的光瞳处光束位移量,进而获取回声到达上表面时间,计算膜厚值。The purpose of this invention is to provide a method that directly measures the beam displacement at the pupil caused by beam deflection by adding a position sensitive detector/device (PSD) to the detection optical path, and then obtains the time when the echo reaches the upper surface, and calculates Film thickness value.
为实现上述目的,第一方面,本发明提供一种光声测量设备,包括光发射器、控制器、图像采集部件和探测部件;所述光发射器用于产生激发光和探测光;In order to achieve the above objects, in a first aspect, the present invention provides a photoacoustic measurement device, including a light emitter, a controller, an image acquisition component and a detection component; the light emitter is used to generate excitation light and detection light;
所述激发光沿激发光光路投射至被测物的测量区域,所述探测光沿探测光的光路投射至所述测量区域,所述激发光在所述被测物中形成声波,所述声波经所述被测物中的界面回传至所述被测物表面并在所述测量区域中产生形变;所述探测部件,用于接收所述被测物反射的探测光束并产生输出信号,所述探测部件包括一维位置传感器或二维位置传感器,以至少得到所述反射的探测光束偏移量,其中,所述一维位置传感器和二维位置传感器在测量过程中可切换或可替代;The excitation light is projected to the measurement area of the object to be measured along the optical path of the excitation light, and the detection light is projected to the measurement area along the optical path of the detection light. The excitation light forms an acoustic wave in the object to be measured, and the sound wave It is transmitted back to the surface of the measured object through the interface in the measured object and produces deformation in the measurement area; the detection component is used to receive the detection beam reflected by the measured object and generate an output signal, The detection component includes a one-dimensional position sensor or a two-dimensional position sensor to at least obtain the offset of the reflected detection beam, wherein the one-dimensional position sensor and the two-dimensional position sensor are switchable or replaceable during the measurement process. ;
所述图像采集部件,用于获取所述激发光和所述探测光在所述被测物表面光斑的图像;所述控制器,用于接收所述图像,以确定激发光光斑和探测光光斑在所述被测物表面上位置的相对方位,并根据所述相对方位,控制所述探测部件选择所述一维位置传感器或所述二维位置传感器;所述控制器,还用于根据所述探测部件的输出信号,获取所述被测物的待测参数。The image acquisition component is used to acquire images of the excitation light and detection light spots on the surface of the object to be measured; the controller is used to receive the image to determine the excitation light spot and the detection light spot. the relative orientation of the position on the surface of the measured object, and control the detection component to select the one-dimensional position sensor or the two-dimensional position sensor according to the relative orientation; the controller is also used to select the one-dimensional position sensor or the two-dimensional position sensor according to the relative orientation. The output signal of the detection component is used to obtain the parameters to be measured of the object to be measured.
通过加入设计的位置传感器,材料反射率响应较小的材料,可以通过位置传感器得到更高信噪比的光声信号,从而获得更高膜厚重复测量精度,增强系统鲁棒性。并且,根据测量时激发光光斑和探测光光斑的相对方位,选择对应的位置传感器,进一步提高了获取的偏移量的精度,提高了信噪比。By adding a designed position sensor, materials with a smaller material reflectivity response can obtain photoacoustic signals with a higher signal-to-noise ratio through the position sensor, thereby obtaining higher film thickness repeat measurement accuracy and enhancing system robustness. Moreover, according to the relative orientation of the excitation light spot and the detection light spot during measurement, the corresponding position sensor is selected, which further improves the accuracy of the obtained offset and improves the signal-to-noise ratio.
进一步的实施例中,根据所述相对方位,控制所述探测部件选择所述一维位置传感器或所述二维位置传感器,包括:若所述相对方位沿着x方向或y方向,所述探测部件选择一维位置传感器,并且所述一维位置传感器的探测面长
边的方向与所述相对方位相对应;In a further embodiment, controlling the detection component to select the one-dimensional position sensor or the two-dimensional position sensor according to the relative orientation includes: if the relative orientation is along the x direction or the y direction, the detection component The component selects a one-dimensional position sensor, and the detection surface of the one-dimensional position sensor is long The direction of the edge corresponds to said relative orientation;
若所述相对方位不沿x方向或y方向,所述探测部件选择二维位置传感器,并且所述二维位置传感器的探测面的两个边的方向分别与x方向和y方向相对应,或者,所述探测部件选择两个一维位置传感器,并且两个所述一维位置传感器的探测面长边的方向相互正交;其中,x方向与y方向为所述被测物表面内相互正交的两个方向。在进一步的实施例中,所述一维位置传感器包括两个输出端,所述二维位置传感器包括四个输出端;If the relative orientation is not along the x-direction or the y-direction, the detection component selects a two-dimensional position sensor, and the directions of the two sides of the detection surface of the two-dimensional position sensor correspond to the x-direction and the y-direction respectively, or the detection component selects two one-dimensional position sensors, and the directions of the long sides of the detection surfaces of the two one-dimensional position sensors are mutually orthogonal; wherein the x-direction and the y-direction are two mutually orthogonal directions on the surface of the object to be measured. In a further embodiment, the one-dimensional position sensor includes two output terminals, and the two-dimensional position sensor includes four output terminals;
所述一维位置传感器的探测面为长方形光敏面或者由两个相同大小的方形光敏面组成;所述二维位置传感器的探测面为方形光敏面或者由以2×2阵列分布的四个相同大小的方形光敏面组成。The detection surface of the one-dimensional position sensor is a rectangular photosensitive surface or consists of two square photosensitive surfaces of the same size; the detection surface of the two-dimensional position sensor is a square photosensitive surface or consists of four identical photosensitive surfaces distributed in a 2×2 array. It consists of a square photosensitive surface.
进一步地实施例公开了,一种光声测量设备,由所述一维位置传感器的输出信号,得到所述偏移量,包括:
A further embodiment discloses a photoacoustic measurement device that obtains the offset from the output signal of the one-dimensional position sensor, including:
A further embodiment discloses a photoacoustic measurement device that obtains the offset from the output signal of the one-dimensional position sensor, including:
其中,δ为所述偏移量,I1和I2分别为所述一维位置传感器两个输出端的输出信号,L为两个输出端之间的有效距离或者所述反射的探测光束的直径。Wherein, δ is the offset, I1 and I2 are the output signals of the two output ends of the one-dimensional position sensor respectively, and L is the effective distance between the two output ends or the diameter of the reflected detection light beam.
进一步地公开的一种实施例所述的光声测量设备,由所述二维位置传感器的输出信号,得到所述偏移量,包括:
According to a further disclosed embodiment of the photoacoustic measurement device, the offset is obtained from the output signal of the two-dimensional position sensor, including:
According to a further disclosed embodiment of the photoacoustic measurement device, the offset is obtained from the output signal of the two-dimensional position sensor, including:
其中,δx和δy分别为所述偏移量在x方向和y方向上的分量,I1、I2、I3和I4分别为所述二维位置传感器四个输出端的输出信号,I1和I2、I3和I4分别为与y方向相对应的两个相邻输出端的输出信号,I1和I4、I2和I3分别为与x方向相对应两个相邻输出端的输出信号,Lx为输出信号I1和I4分别对应的两个输出端之间的有效距离或者所述反射的探测光束的直径,Ly为输出信号I1和I2分别对应的两个输出端之间有效距离或者所述反射的探测光束的直径。
Among them, δ x and δ y are the components of the offset in the x direction and the y direction respectively, I 1 , I 2 , I 3 and I 4 are respectively the output signals of the four output terminals of the two-dimensional position sensor, I 1 and I 2 , I 3 and I 4 are respectively the output signals of two adjacent output terminals corresponding to the y direction. I 1 and I 4 , I 2 and I 3 are respectively the output signals of two adjacent output terminals corresponding to the x direction. The output signal of the output terminal, L x is the effective distance between the two output terminals corresponding to the output signals I 1 and I 4 respectively or the diameter of the reflected detection beam, L y is the corresponding The effective distance between the two output terminals or the diameter of the reflected detection beam.
在一些实施例中,公开了一种的光声测量设备,所述探测部件还包括光电探测器,以获取所述被测物反射率变化引起的光强变化;In some embodiments, a photoacoustic measurement device is disclosed, and the detection component further includes a photodetector to obtain changes in light intensity caused by changes in reflectivity of the object to be measured;
所述反射的探测光束经过分光部件后分别被所述光电探测器和所述一维位置传感器或所述二维位置传感器接收。The reflected detection beam passes through the spectroscopic component and is received by the photodetector and the one-dimensional position sensor or the two-dimensional position sensor respectively.
在还有一些实施例中,进一步公开了一种的光声测量设备,所述反射的探测光束经成像单元后被所述光电探测器接收,所述成像单元的放大倍率为1:1;所述一维位置传感器或所述二维位置传感器接收的探测光为平行光束。In some other embodiments, a photoacoustic measurement device is further disclosed, wherein the reflected detection light beam is received by the photodetector after passing through an imaging unit, and the magnification of the imaging unit is 1:1; the detection light received by the one-dimensional position sensor or the two-dimensional position sensor is a parallel light beam.
一种可能的实施例中,公开的光声测量设备,由所述一维位置传感器或所述二维位置传感器和所述光电探测器的饱和功率确定所述分光部件的分光比例,并且所述一维位置传感器、所述二维位置传感器、所述光电探测器接收的探测光的功率达到饱和功率。通过使用光电探测器,可以在两种量测模式,材料反射率量测和鼓包偏转量测中任意切换,应对不同量测工况,选择响应度更大的量测方式进行测试,获得更高的信噪比及系统重复测量精度。In a possible embodiment, the disclosed photoacoustic measurement device determines the light splitting ratio of the light splitting component based on the one-dimensional position sensor or the two-dimensional position sensor and the saturation power of the photodetector, and the The power of the detection light received by the one-dimensional position sensor, the two-dimensional position sensor, and the photodetector reaches saturation power. By using photoelectric detectors, you can switch between two measurement modes, material reflectivity measurement and drum deflection measurement. To cope with different measurement conditions, you can choose the measurement method with greater responsiveness for testing, and obtain higher results. The signal-to-noise ratio and system repeatability measurement accuracy.
第二方面,本发明还提供了一种膜厚测量方法,所述测量方法应用于前述第一方面的光声测量设备,包括:获取所述激发光和所述探测光在不同时间延迟下,所述探测部件的输出信号;In a second aspect, the present invention also provides a film thickness measurement method, which is applied to the photoacoustic measurement equipment of the first aspect, including: acquiring the excitation light and the detection light at different time delays, The output signal of the detection component;
所述控制器控制光学延迟器以调节所述激发光和所述探测光的光程差,以实现不同时间延迟的调节,所述光学延迟器设置在所述激发光光路和/或所述探测光光路;The controller controls an optical retarder to adjust the optical path difference between the excitation light and the detection light to achieve adjustment of different time delays. The optical retarder is arranged in the optical path of the excitation light and/or the detection light. light path;
基于所述输出信号,获取探测信号,所述探测信号包括所述探测光束偏移量,或者包括所述探测光束偏移量和所述被测物反射率变化引起的光强变化;Based on the output signal, a detection signal is obtained, the detection signal includes the detection beam offset, or includes the detection beam offset and the change in light intensity caused by the change in reflectivity of the measured object;
获取所述探测信号时域上的时间间隔,基于所述时间间隔获得所述被测物的膜厚,所述时间间隔对应于所述声波前后两次到达所述被测物表面的时间间隔。The time interval in the time domain of the detection signal is obtained, and the film thickness of the object to be measured is obtained based on the time interval. The time interval corresponds to the time interval between the sound waves reaching the surface of the object to be measured twice before and after.
再进一步地公开实施例中的一种测量方法,基于所述时间间隔获得所述被测物的膜厚包括:基于所述探测光束偏移量,得到第一时间间隔,并计算得到
第一膜厚;To further disclose a measurement method in the embodiment, obtaining the film thickness of the object under test based on the time interval includes: obtaining a first time interval based on the offset of the detection beam, and calculating first film thickness;
基于所述被测物反射率变化引起的光强变化,得到第二时间间隔,并计算得到第二膜厚;Based on the change in light intensity caused by the change in reflectivity of the measured object, a second time interval is obtained, and the second film thickness is calculated;
将得到的所述第一膜厚或者所述第二膜厚作为所述被测物的膜厚;或者,The obtained first film thickness or the second film thickness is used as the film thickness of the measured object; or,
将得到的所述第一膜厚和所述第二膜厚的平均值作为所述被测物的膜厚。The obtained average value of the first film thickness and the second film thickness is regarded as the film thickness of the measured object.
关于上述第二方面的有益效果可以参见上述第一方面中的描述。Regarding the beneficial effects of the above second aspect, please refer to the description in the above first aspect.
图1为本发明一种实施例的探测部件架构示意图;Figure 1 is a schematic diagram of the architecture of a detection component according to an embodiment of the present invention;
图2为本发明一种实施例的探测部件构架示意图;Figure 2 is a schematic diagram of the detection component structure of an embodiment of the present invention;
图3为本发明一种实施例的探测部件构架示意图;Figure 3 is a schematic diagram of the detection component structure of an embodiment of the present invention;
图4为本发明一种光声测量设备实施方式的示意图;Figure 4 is a schematic diagram of an embodiment of a photoacoustic measurement device of the present invention;
图5为本发明光声检测原理的基础构架示意图;Figure 5 is a schematic diagram of the basic structure of the photoacoustic detection principle of the present invention;
图6为本发明一种光声测量设备实施方式的示意图;Figure 6 is a schematic diagram of an embodiment of a photoacoustic measurement device of the present invention;
图7为本发明一种光声测量设备实施方式的示意图;Figure 7 is a schematic diagram of an embodiment of a photoacoustic measurement device of the present invention;
图8为本发明的位置传感器多个实施例的示意图;Figure 8 is a schematic diagram of multiple embodiments of the position sensor of the present invention;
图9为本发明的膜厚测量方法流程示意图。Figure 9 is a schematic flow chart of the film thickness measurement method of the present invention.
附图标记:000-激光器;120-分束器;130-斩波器;140-合束器;210-第一反射镜;220-光学延迟器;230-第二反射镜;250-第一聚光镜;270-第二聚光镜;260-准直镜;300-方形分束器;310-第一分光部件;320第二分光部件;400-位置传感器;420-光电探测器;410-第一锁相放大器;411-第二锁相放大器;800-被测物;810-样品表面鼓包;510-激发光束;520-探测光束;500-图像采集部件;610-一维位置传感器;620-二维位置传感器。Figure markings: 000-laser; 120-beam splitter; 130-chopper; 140-beam combiner; 210-first reflector; 220-optical delay; 230-second reflector; 250-first condenser; 270-second condenser; 260-collimator; 300-square beam splitter; 310-first light-splitting component; 320 second light-splitting component; 400-position sensor; 420-photodetector; 410-first phase-locked amplifier; 411-second phase-locked amplifier; 800-object to be measured; 810-bulge on sample surface; 510-excitation beam; 520-detection beam; 500-image acquisition component; 610-one-dimensional position sensor; 620-two-dimensional position sensor.
下面结合本发明实施例中的附图,对本发明实施例中的技术方案进行描述。其中,在本发明实施例的描述中,以下实施例中所使用的术语只是为了描述特定实施例的目的,而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样,单数表达形式“一种”、“所述”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式,除非其上下文中明确地有相反指示。还应当理解,在本申请以下各实施例中,“至少一个”、“一个或多个”是指一个或两个以上(包含两个)。术语“和/或”,用于描述关联对象的关联关系,表示可以存在三种关系;例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B的情况,其中A、B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。The technical solutions in the embodiments of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention. Among them, in the description of the embodiments of the present invention, the terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a," "the," "above," "the" and "the" are intended to also include, for example, "a "or more" unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, "at least one" and "one or more" refer to one or more than two (including two). The term "and/or" is used to describe the relationship between associated objects, indicating that there can be three relationships; for example, A and/or B can mean: A exists alone, A and B exist simultaneously, and B exists alone, Where A and B can be singular or plural. The character "/" generally indicates that the related objects are in an "or" relationship.
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此,在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例,而是意味着“一个或多个但不是所有的实施例”,除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”,除非是以其他方式另外特别强调。术语“连接”包括直接连接和间接连接,除非另外说明。“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。Reference in this specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Therefore, the phrases "in one embodiment", "in some embodiments", "in other embodiments", "in other embodiments", etc. appearing in different places in this specification are not necessarily References are made to the same embodiment, but rather to "one or more but not all embodiments" unless specifically stated otherwise. The terms “including,” “includes,” “having,” and variations thereof all mean “including but not limited to,” unless otherwise specifically emphasized. The term "connected" includes both direct and indirect connections unless otherwise stated. “First” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features.
在本发明实施例中,“示例性地”或者“例如”等词用于表示作例子、例证或说明。本发明实施例中被描述为“示例性地”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言,使用“示例性地”或者“例如”等词旨在以具体方式呈现相关概念。In the embodiments of the present invention, words such as “exemplarily” or “for example” are used to represent examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the invention is not to be construed as preferred or advantageous over other embodiments or designs. Rather, the use of the words "exemplarily" or "for example" is intended to present the relevant concepts in a concrete manner.
本发明的实施例提供了一种光声测量设备,如图4所示,激光器000发射的光束被分束器120分为激发光束510和探测光束520,激发光光路设置有斩波器130,探测光光路设置有第一反射镜210、光学延迟器220和第二反射镜230,
激发光束510和探测光束520经合束器140后被第二聚光镜270聚焦在被测物800表面,被样品表面反射的探测光被探测部件接收。探测部件包括位置传感器400和锁相放大器410,其中探测部件的结构设置可以采用本发明创造实施例中任何一种技术方案,示例性的,可以采用如附图1-3中所示的探测部件的结构设置;其中,探测部件不同的结构设置之间是可替换或者切换的。通过在探测光路的光瞳处加入位置传感器(Position Sensing Detector,PSD),如图4中400,直接量测探测光束520偏转导致的光瞳处光束位移量,进而获取回声到达上表面时间,计算膜厚值。经过被测物800表面产生鼓包偏转过的光束,经由准直镜260准直为平行光,在准直镜如图4中260的后焦面放置一个位置传感器400。The embodiment of the present invention provides a photoacoustic measurement device. As shown in Figure 4, the beam emitted by the laser 000 is divided into an excitation beam 510 and a detection beam 520 by the beam splitter 120. The excitation light optical path is provided with a chopper 130. The detection light optical path is provided with a first reflecting mirror 210, an optical retarder 220 and a second reflecting mirror 230. The excitation beam 510 and the detection beam 520 are focused on the surface of the object 800 by the second condenser 270 after passing through the beam combiner 140, and the detection light reflected by the sample surface is received by the detection component. The detection component includes a position sensor 400 and a lock-in amplifier 410. The structural arrangement of the detection component can adopt any technical solution in the creative embodiments of the present invention. As an example, the detection component as shown in Figures 1-3 can be used. Structural settings; among them, different structural settings of the detection component are replaceable or switchable. By adding a Position Sensing Detector (PSD) at the pupil of the detection light path, such as 400 in Figure 4, the beam displacement at the pupil caused by the deflection of the detection beam 520 is directly measured, and then the time for the echo to reach the upper surface is obtained and calculated Film thickness value. The bulge-deflected light beam generated by the surface of the object 800 is collimated into parallel light by the collimator 260. A position sensor 400 is placed on the back focal plane of the collimator 260 in Figure 4.
示例性的,如图5所示,激发光和探测光光束经过聚光镜射聚焦在被测物表面上,由激发光而激发光声作用后,光声作用产生的声波,在膜层间传播后到达顶层材料和空气界面时,由于应力应变会引起材料表面皮米量级的局部凸起——样品表面鼓包810,此时入射的探测光汇聚到鼓包引起表面倾斜较大的位置处,即产生鼓包形貌的一阶导数/梯度最大位置,一般探测光与激发光聚焦中心位置有微米级的位置偏移,具体偏移量跟激发光的光斑形貌、能量分布及光斑大小相关,准直光学元件位于测量区域与位置传感器400之间,被反射的探测光光束经过准直镜260准直后被位置传感器400接收。For example, as shown in Figure 5, the excitation light and detection light beams are focused on the surface of the object to be measured through a condenser mirror. After the photoacoustic effect is stimulated by the excitation light, the sound waves generated by the photoacoustic effect propagate between the film layers. When reaching the interface between the top material and the air, the stress and strain will cause local bulges on the surface of the material on the order of picometers - bulges 810 on the sample surface. At this time, the incident detection light converges to the position where the bulges cause a large surface tilt, that is, a bulge 810 is generated. The maximum position of the first derivative/gradient of the bulge morphology. Generally, there is a micron-level position offset between the focus center position of the detection light and the excitation light. The specific offset is related to the spot shape, energy distribution and spot size of the excitation light. Collimation The optical element is located between the measurement area and the position sensor 400 . The reflected detection light beam is collimated by the collimating mirror 260 and then received by the position sensor 400 .
光声作用产生的声波纵向传播,在界面处会发生反射后返回样品表面,声波未到达表面时,探测光光束经样品表面反射,一般近似为镜面反射,探测光光束沿如虚线标识所示路线传播(参见图5);当由光声作用产生的声波到达样品表面时,样品表面再次产生局部表面凸起,也即样品表面鼓包810大小发生变化,从而使得探测光束相对于激发光束的位置偏移量发生变化,通过位置传感器400直接获取探测光束偏移量,基于探测光束偏移量的变化趋势进而获取回声到达样品上表面的时间以计算膜厚。The sound wave generated by the photoacoustic effect propagates longitudinally, will be reflected at the interface and then return to the sample surface. When the sound wave does not reach the surface, the detection light beam is reflected by the sample surface, which is generally approximate to mirror reflection. The detection light beam follows the route shown by the dotted line. Propagation (see Figure 5); when the sound wave generated by the photoacoustic effect reaches the sample surface, the sample surface again generates local surface bulges, that is, the size of the bulge 810 on the sample surface changes, thereby causing the position of the detection beam to deviate relative to the excitation beam. When the displacement changes, the offset of the detection beam is directly obtained through the position sensor 400. Based on the changing trend of the offset of the detection beam, the time for the echo to reach the upper surface of the sample is obtained to calculate the film thickness.
表面凸起导致探测光聚焦点所在表面发生倾斜,假定样品表面凸起的倾斜角度为θ,反射的探测光光束整体被偏转2θ,如图5中实线标识所示路线,由
此而形成的偏移量δ可由以下公式表达;
δ=f×tan2θ——公式1;The surface convexity causes the surface where the detection light focus point is tilted. Assume that the tilt angle of the sample surface convexity is θ, and the entire reflected detection light beam is deflected 2θ, as shown by the solid line in Figure 5. The resulting offset δ can be expressed by the following formula;
δ=f×tan2θ——Formula 1;
δ=f×tan2θ——公式1;The surface convexity causes the surface where the detection light focus point is tilted. Assume that the tilt angle of the sample surface convexity is θ, and the entire reflected detection light beam is deflected 2θ, as shown by the solid line in Figure 5. The resulting offset δ can be expressed by the following formula;
δ=f×tan2θ——Formula 1;
其中,f为准直镜260的焦距,通过在准直镜260的后焦面放置位置传感器400,可以量测偏移量,已知准直镜焦距f,可进一步获得鼓包倾斜角度θ。Where, f is the focal length of the collimating lens 260. By placing the position sensor 400 on the back focal plane of the collimating lens 260, the offset can be measured. Knowing the focal length f of the collimating lens, the bulge tilt angle θ can be further obtained.
在一些公开的实施方式中,所述的光声测量设备,如图6所示,所述探测部件包括光电探测器420和位置传感器400,所述光声测量设备还包括分光部件300,所述探测光束经过所述分光部件后,分为二部分,一部分被所述光电探测器420接收,另一部分被所述位置传感器400接收。In some disclosed embodiments, the photoacoustic measurement device, as shown in Figure 6, the detection component includes a photodetector 420 and a position sensor 400, the photoacoustic measurement device also includes a spectroscopic component 300, and the After the detection beam passes through the light splitting component, it is divided into two parts. One part is received by the photodetector 420 and the other part is received by the position sensor 400 .
在还有一些实施例中,经过待测样品表面产生鼓包偏转后的探测光光束,如图6所示,经由准直镜260准直为平行光,在准直镜260的后放置一个平光分光器件300,平光分光器件300的具体放置位置可在准直镜260后焦面附近,具体分光比可根据两路光对应探测器的饱和功率进行设计调整,这里默认50:50分光,使得光电探测器420和位置传感器400接收的光信号的功率均接近各自的饱和功率。In some embodiments, the detection light beam is bulged and deflected after passing through the surface of the sample to be measured. As shown in Figure 6, it is collimated into parallel light through the collimating mirror 260. A planar beam splitter is placed behind the collimating mirror 260. The specific placement position of the device 300 and the planar light splitting device 300 can be near the back focal plane of the collimating mirror 260. The specific splitting ratio can be designed and adjusted according to the saturation power of the detector corresponding to the two-channel light. The default splitting here is 50:50, allowing photoelectric detection. The power of the optical signals received by the detector 420 and the position sensor 400 are both close to their respective saturation powers.
分光器件300将探测光束一分为二:其中一束经聚焦透镜250聚焦在光电探测器420上,用于测量材料反射率变化;另外一束直接入射到位置传感器400的光敏面上,用于量测鼓包引起的探测光束偏转。这两种量测模式都可以获取回声到达上表面时间,用于计算被测物表面的膜厚值。探测光束被分光器件300一分为二后,其中一束经聚焦透镜聚焦在光电探测器420上,用于测量材料反射率变化,另外一束直接入射到位置传感器400的光敏面上,用于量测鼓包引起的探测光束偏转/位移,这两种量测模式都可以获取回声到达上表面时间,计算膜厚值,取决于待测样品材料、表面粗糙度及几何结构等,可选择不同量测方式。应用两种量测模式,使得量测设备的普适性更好,能够应用不同的材料的膜厚测量,在多种测量场景下均具有较高的信噪比,获取膜厚的精度更高。The spectroscopic device 300 splits the detection beam into two: one beam is focused on the photodetector 420 through the focusing lens 250 and is used to measure changes in material reflectivity; the other beam is directly incident on the photosensitive surface of the position sensor 400 for measuring Measure the detection beam deflection caused by the bulge. Both measurement modes can obtain the time when the echo reaches the upper surface, which can be used to calculate the film thickness value on the surface of the object to be measured. After the detection beam is split into two by the spectroscopic device 300, one of the beams is focused on the photodetector 420 through the focusing lens for measuring the change in material reflectivity, and the other beam is directly incident on the photosensitive surface of the position sensor 400 for measuring Measure the deflection/displacement of the detection beam caused by the bulge. Both measurement modes can obtain the time when the echo reaches the upper surface and calculate the film thickness value. It depends on the material of the sample to be tested, surface roughness and geometric structure, etc. Different quantities can be selected. test method. The application of two measurement modes makes the measurement equipment more universal and can be used to measure film thickness of different materials. It has a high signal-to-noise ratio in a variety of measurement scenarios and obtains film thickness with higher accuracy. .
在另一些实施例中,所述的光声测量设备,包括所述分光光学元件,具体
如图6中的方形分束器300,用于将所述探测光束分为二部分,一部分穿过方形分束器300被所述光电探测器420接收,另一部分经过方形分束器300反射被所述位置传感器400接收,锁相放大器,用于分别接收所述光电探测器的输出信号和所述位置传感器的输出信号。在两种量测模式中任意切换,应对不同量测工况,选择响应度更大的量测方式进行测试,获得更高信噪比及系统重复测量精度。In other embodiments, the photoacoustic measurement equipment includes the spectroscopic optical element, specifically The square beam splitter 300 in Figure 6 is used to divide the detection beam into two parts. One part passes through the square beam splitter 300 and is received by the photodetector 420, and the other part is reflected by the square beam splitter 300 and is The position sensor 400 receives a lock-in amplifier for respectively receiving the output signal of the photodetector and the output signal of the position sensor. Switch between the two measurement modes at will to cope with different measurement conditions and choose the measurement method with greater responsiveness for testing to obtain higher signal-to-noise ratio and system repeatability measurement accuracy.
在另一些实施例中,所述的光声测量设备,如图7所示,可以通过方形分束器300以及后续的探测装置(光电探测器420和位置传感器400),分别实现两种量测模式。产生的两组输出信号可以分别接入双通道锁相放大器的信号输入端,或者分别接入两个锁相放大器,上位机900可以通过通讯接口直接控制双通道锁相放大器,或者分别建立与两个锁相放大器410或411的连接,可通过控制程序实现系统在材料反射率量测模式和偏转量测模式两者之间切换。In other embodiments, the photoacoustic measurement equipment, as shown in Figure 7, can achieve two types of measurements through the square beam splitter 300 and subsequent detection devices (photodetector 420 and position sensor 400). model. The two sets of output signals generated can be connected to the signal input terminals of the dual-channel lock-in amplifier respectively, or connected to two lock-in amplifiers respectively. The host computer 900 can directly control the dual-channel lock-in amplifier through the communication interface, or establish connections with the two lock-in amplifiers respectively. By connecting a lock-in amplifier 410 or 411, the system can be switched between the material reflectance measurement mode and the deflection measurement mode through the control program.
准直镜260和聚光镜270形成一组开普勒式扩束系统,对被测物800进行成像。一般聚焦光斑尺度在几个到几十个微米之间,对于反射率量测模式,如果采用1:1放大系统,光斑在光电探测器光敏面/像面大小跟待测样品表面光斑大小一致。此时光电探测器光敏面的尺寸一般为mm量级,光束即使由于系统振动、环境扰动、样品鼓包等因素造成部分光束偏转,根据成像原理,光斑在成像面的位置和大小都不会改变,因此信号大小不受这些扰动因素影响,鲁棒性好。对于大部分材料,如W,Mo等材料,可通过反射率量测模式进行光声信号量测;部分材料,如Cu,在化学机械研磨后具有粗糙度较大的金属膜层表面,或者Cu线阵列等特殊结构,材料反射率信号变化幅值较低,则可采用偏转量测模式进行光声信号测量。The collimator 260 and the condenser 270 form a Kepler beam expansion system to image the object 800. Generally, the scale of the focused light spot is between several and tens of microns. For the reflectivity measurement mode, if a 1:1 magnification system is used, the size of the light spot on the photosensitive surface/image plane of the photodetector is consistent with the size of the light spot on the surface of the sample to be measured. At this time, the size of the photosensitive surface of the photodetector is generally in the order of mm. Even if the light beam is partially deflected due to system vibration, environmental disturbance, sample bulging and other factors, according to the imaging principle, the position and size of the light spot on the imaging plane will not change. Therefore, the signal size is not affected by these disturbance factors and has good robustness. For most materials, such as W, Mo and other materials, the photoacoustic signal can be measured by the reflectivity measurement mode; some materials, such as Cu, have a metal film surface with a large roughness after chemical mechanical grinding, or special structures such as Cu line arrays, and the amplitude of the material reflectivity signal change is low, so the deflection measurement mode can be used for photoacoustic signal measurement.
对于偏转量测模式,可对大部分材料有较强的信号幅值,因此可以适应大多数工况。然而,一切会影响光束方向的噪声源都会对偏转数据形成噪声影响,如光源指向稳定性影响、个别反射镜受机械振动影响等。根据系统的实际情况,如飞秒激光的性能以及待测材料类型,可在两种量测模式间切换。
For the deflection measurement mode, it can have strong signal amplitude for most materials, so it can be adapted to most working conditions. However, any noise source that affects the direction of the beam will have a noisy impact on the deflection data, such as the impact on the pointing stability of the light source, the impact of mechanical vibration on individual reflectors, etc. According to the actual conditions of the system, such as the performance of the femtosecond laser and the type of material to be measured, the two measurement modes can be switched.
在一些实施例中,所述的光声测量设备,如图7所示,所述光声测量设备还包括第一聚光光学元件,具体如图7中第一聚光镜250,所述第一聚光镜250位于所述方形分束器300与所述光电探测器420之间,所述准直镜260位于被测物800的测量区域与所述方形分束器300之间。In some embodiments, the photoacoustic measurement equipment, as shown in Figure 7, also includes a first condenser optical element, specifically the first condenser lens 250 in Figure 7. The first condenser mirror 250 is located between the square beam splitter 300 and the photodetector 420 , and the collimating mirror 260 is located between the measurement area of the measured object 800 and the square beam splitter 300 .
在还有一些实施例中,所述的光声测量设备,如图7所示,所述光声测量设备还包括光源部件,具体如图7中激光器000,和分光光学部件,具体如图7中分束器120,所述光源部件用于提供源光束所述源光束经过所述分光光学部件后分为二部分,一部分为所述激发光束510,另一部分为所述探测光束520。所述光声测量设备还包括合光光学部件,具体如图7中合束器140,所述合光光学部件用于将所述激发光束和所述探测光束合二为一,并将合二为一的光束投射至所述被测物的测量区域,具体如图7中被测物800。In some embodiments, the photoacoustic measurement equipment, as shown in Figure 7, also includes a light source component, specifically the laser 000 in Figure 7, and a spectroscopic optical component, specifically as shown in Figure 7 Middle beam splitter 120, the light source component is used to provide a source beam. The source beam is divided into two parts after passing through the spectroscopic optical component, one part is the excitation beam 510, and the other part is the detection beam 520. The photoacoustic measurement equipment also includes a light combining optical component, specifically a beam combiner 140 in Figure 7. The light combining optical component is used to combine the excitation beam and the detection beam into one, and combine the two. A light beam of one is projected to the measurement area of the object to be measured, specifically the object to be measured 800 in Figure 7 .
在一些实施例中,所述的光声测量设备,如图7所示,所述光声测量设备还包括斩波光学部件,具体如图7中斩波器130,在所述光学斩波部件位于激发光光路,具体如图7中分束器120与合束器140之间,所述激发光束经过所述斩波光学部件之后,被合束器140接收,所述光学斩波部件用于调制所述激发光,斩波器130可以是声光调制器或者电光调制器;还包括设置于探测光光路中的光学延迟器220,光学延迟器220位于分束器120与合束器140之间,所述探测光束经过光学延迟器220之后,被合束器140接收,光学延迟器220用于将所述探测光束产生相位延迟;在探测光路还设置有第一反射镜210和第二反射镜230,第一反射镜210位于所述分束器120与光学延迟器220之间,所述第二反射镜230位于光学延迟器220与合束器140之间。In some embodiments, the photoacoustic measurement device, as shown in Figure 7, also includes a chopper optical component, specifically the chopper 130 in Figure 7. In the optical chopper component It is located in the optical path of the excitation light, specifically between the beam splitter 120 and the beam combiner 140 in Figure 7. After the excitation beam passes through the chopper optical component, it is received by the beam combiner 140. The optical chopper component is used to To modulate the excitation light, the chopper 130 can be an acousto-optic modulator or an electro-optic modulator; it also includes an optical retarder 220 disposed in the optical path of the detection light, and the optical retarder 220 is located between the beam splitter 120 and the beam combiner 140 During this time, the detection beam passes through the optical retarder 220 and is received by the beam combiner 140. The optical retarder 220 is used to phase delay the detection beam; a first reflector 210 and a second reflector are also provided in the detection optical path. Mirror 230 , the first reflecting mirror 210 is located between the beam splitter 120 and the optical retarder 220 , and the second reflecting mirror 230 is located between the optical retarder 220 and the beam combiner 140 .
以上实施例提供的光声测量设备还包括控制器、图像采集部件(图4、6-7中均未示出),其中,探测部件用于接收被测物反射的探测光束并产生输出信号,所述位置传感器包括一维位置传感器或二维位置传感器,以至少得到所述反射的探测光束偏移量,其中,所述一维位置传感器和二维位置传感器在测量过程中可切换或可替代;图像采集部件500,如图1、图2、图3所示,用于获
取所述激发光和所述探测光在所述被测物表面光斑的图像;所述控制器,用于接收所述图像,以确定激发光光斑和探测光光斑在所述被测物表面上位置的相对方位,可以理解地是,相对方位为在被测物表面上,一个光斑质心到另一个光斑质心的方向,控制器根据激发光光斑的图像和探测光光斑的图像,可分别获取两个光斑的质心,进而可以确定所述相对方位。The photoacoustic measurement equipment provided in the above embodiments also includes a controller and an image acquisition component (not shown in Figures 4 and 6-7), wherein the detection component is used to receive the detection beam reflected by the object to be measured and generate an output signal, The position sensor includes a one-dimensional position sensor or a two-dimensional position sensor to at least obtain the offset of the reflected detection beam, wherein the one-dimensional position sensor and the two-dimensional position sensor are switchable or replaceable during the measurement process. ; Image acquisition component 500, as shown in Figure 1, Figure 2, and Figure 3, is used to obtain Obtain the image of the excitation light and the detection light spot on the surface of the object to be measured; the controller is used to receive the image to determine the excitation light spot and the detection light spot on the surface of the object to be measured. The relative orientation of the position can be understood as the relative orientation is the direction from the center of mass of one light spot to the center of mass of another light spot on the surface of the object to be measured. The controller can obtain two images based on the image of the excitation light spot and the image of the detection light spot. The centroid of the light spot can then determine the relative orientation.
探测部件包括设置为一维位置传感器610,如图1或图2所示;探测部件还可以包括光电探测器420和一维位置传感器610,如图2所示;探测部件也可以设置为包括一个二维位置传感器620,如图3所示。The detection component includes a one-dimensional position sensor 610, as shown in Figure 1 or 2; the detection component can also include a photodetector 420 and a one-dimensional position sensor 610, as shown in Figure 2; the detection component can also be configured to include a Two-dimensional position sensor 620, as shown in Figure 3 .
根据所述相对方位,控制器控制探测部件选择所述一维位置传感器610或所述二维位置传感器620,即根据相对方位,探测部件设置为如图1或2所示的两个一维位置传感器610,或者设置为如图3所示的一个二维位置传感器620;如图1所示,设有两个一维位置传感器610,其中,两个一维位置传感器的探测面长边的方向相互正交;所述控制器,还用于根据所述探测部件的输出信号,获取所述被测物的待测参数。根据相对方位选择对应位置传感器的技术效果:能够根据偏移量的方向,选择合适位置传感器,提高获取偏移量的精度,提高信噪比。同时,考虑不同位置传感器的带宽和精度,适应不同测量需求,保证在不同工况条件下,提高测量的精度和测量的效率。在实际测量中,上述实施例提供的方案,能够使得位置传感器精确匹配探测光束的偏转方向,从而进一步提高获取的探测光束的偏移量的精度,进而提高了膜厚测量精度。According to the relative orientation, the controller controls the detection component to select the one-dimensional position sensor 610 or the two-dimensional position sensor 620, that is, according to the relative orientation, the detection component is set to two one-dimensional positions as shown in Figure 1 or 2 The sensor 610 may be configured as a two-dimensional position sensor 620 as shown in Figure 3; as shown in Figure 1, two one-dimensional position sensors 610 are provided, wherein the direction of the long side of the detection surface of the two one-dimensional position sensors orthogonal to each other; the controller is also used to obtain the parameters to be measured of the object to be measured according to the output signal of the detection component. The technical effect of selecting the corresponding position sensor according to the relative orientation: it can select the appropriate position sensor according to the direction of the offset, improve the accuracy of obtaining the offset, and improve the signal-to-noise ratio. At the same time, consider the bandwidth and accuracy of sensors at different positions to adapt to different measurement needs to ensure that the measurement accuracy and measurement efficiency are improved under different working conditions. In actual measurement, the solution provided by the above embodiment can enable the position sensor to accurately match the deflection direction of the detection beam, thereby further improving the accuracy of the obtained offset of the detection beam, thereby improving the film thickness measurement accuracy.
进一步地实施例中,根据所述相对方位,控制所述探测部件选择所述一维位置传感器610,包括:若所述相对方位沿着x方向或y方向,所述探测部件选择一维位置传感器610,并且所述一维位置传感器610的探测面长边的方向与所述相对方位相对应;若所述相对方位不沿x方向或y方向,所述探测部件选择二维位置传感器,并且所述二维位置传感器的探测面的两个边的方向分别与x方向和y方向相对应,或者,所述探测部件选择两个一维位置传感器,并且两个所述一维位置传感器的探测面长边的方向相互正交。
In a further embodiment, controlling the detection component to select the one-dimensional position sensor 610 according to the relative orientation includes: if the relative orientation is along the x direction or the y direction, the detection component selects the one-dimensional position sensor. 610, and the direction of the long side of the detection surface of the one-dimensional position sensor 610 corresponds to the relative orientation; if the relative orientation is not along the x direction or the y direction, the detection component selects a two-dimensional position sensor, and the The directions of the two sides of the detection surface of the two-dimensional position sensor correspond to the x direction and the y direction respectively, or the detection component selects two one-dimensional position sensors, and the detection surfaces of the two one-dimensional position sensors The directions of the long sides are orthogonal to each other.
可以理解的是,位置传感器探测面的坐标系与被测物表面的坐标系相对应,如附图4所示,被测物800表面建立局部坐标系O-XYZ,其中,x方向与y方向为所述被测物表面内相互正交的两个方向,z为垂直于被测物表面的方向;位置传感器400探测面建立坐标系O’-X’Y’Z’,其中,x’方向与x方向相对应,y’方向与y方向相对应。由图像采集部件500获取的在被测物表面800的激发光光斑和探测光光斑图像,得到两个光斑所在局部坐标系O-XYZ的相对方位,以探测光光斑质心到激发光斑质心的方向为例,可为X+/X-/Y+/Y-,准直镜260后的探测光束在位置传感器400的局部坐标系O’-X’Y’Z’中,偏转方向对应为X’+/X’-/Y’+/Y’-,根据不同的相对方位选择匹配的位置传感器器件设计,可以获得光束偏转信息及膜厚信息。以上方案提高了获取的探测光束偏移量的精度。It can be understood that the coordinate system of the detection surface of the position sensor corresponds to the coordinate system of the surface of the measured object. As shown in Figure 4, a local coordinate system O-XYZ is established on the surface of the measured object 800, where the x direction and the y direction are two mutually orthogonal directions on the surface of the object to be measured, z is the direction perpendicular to the surface of the object to be measured; the detection surface of the position sensor 400 establishes a coordinate system O'-X'Y'Z', where the x' direction Corresponds to the x direction, and the y' direction corresponds to the y direction. The images of the excitation light spot and the detection light spot on the surface 800 of the object to be measured are obtained by the image acquisition component 500, and the relative orientations of the local coordinate system O-XYZ where the two spots are located are obtained. The direction from the centroid of the detection light spot to the centroid of the excitation light spot is For example, it can be X+/X-/Y+/Y-. The detection beam behind the collimator 260 is in the local coordinate system O'-X'Y'Z' of the position sensor 400, and the deflection direction corresponds to '-/Y'+/Y'-, select matching position sensor device design according to different relative orientations, and obtain beam deflection information and film thickness information. The above solution improves the accuracy of the acquired detection beam offset.
相对方位沿x(X+/X-)或y(Y+/Y-),探测部件包括至少一个一维位置传感器,其中,至少一个一维位置传感器探测面长边的方向与相对方位相对应,即可以是图1中所示的探测部件包括两个一维位置传感器,也可以是包括一个一个位置传感器(图中未示出)。相对方位不沿x或y,探测光经过分束后分别被两个一维位置传感器接收,两个一维位置传感器分别获取偏移量两个正交方向的分量,可以得到实际偏移量。The relative orientation is along x (X+/X-) or y (Y+/Y-). The detection component includes at least one one-dimensional position sensor, wherein the direction of the long side of the detection surface of the at least one one-dimensional position sensor corresponds to the relative orientation, that is, The detection component shown in Figure 1 may include two one-dimensional position sensors, or may include one position sensor (not shown in the figure). The relative orientation is not along x or y. The detection light is received by two one-dimensional position sensors after splitting. The two one-dimensional position sensors respectively obtain the components of the offset in the two orthogonal directions, and the actual offset can be obtained.
在还有一些的实施例中,相对方位不沿x或y,反射探测光的偏移量可以由一个二维位置传感器获取,如图3所示,反射的探测光520在传播路径上设置第一分光部件310,经过第一分光部件310,一部分探测光被第一分光部件310反射至图像采集部件500以获取探测光光斑图像,透射经过第一分光部件310的探测光继续传播,被一个二维位置传感器620接收,此外,图像采集部件500也接收激发光光束以获取激发光光斑的图像。In some embodiments, the relative orientation is not along x or y, and the offset of the reflected detection light can be obtained by a two-dimensional position sensor. As shown in Figure 3, the reflected detection light 520 is set on the propagation path. A spectroscopic component 310. After passing through the first spectroscopic component 310, a part of the detection light is reflected by the first spectroscopic component 310 to the image acquisition component 500 to obtain the detection light spot image. The detection light transmitted through the first spectrometry component 310 continues to propagate and is captured by a second spectrophotometer. The dimensional position sensor 620 receives. In addition, the image acquisition component 500 also receives the excitation light beam to obtain an image of the excitation light spot.
一种可能的实施例中,可以针对如图1所示探测部件结构或者如图3所示的探测部件结构进行改进,在探测系统设置光电探测器,接收部分反射的探测光束,使得探测部件还可以探测被测物表面反射率变化。示例性的,对图1所
示的探测部件结构进行改进,如图2所示,反射的探测光520在传播的过程中,经过第一分光部件310,一部分光束被第一分光部件310反射至图像采集部件500以获取探测光光斑图像,透射经过第一分光部件310的探测光传播至第二分光部件320,被第二分光部件320反射的探测光被光电探测器420接收,被第二分光部件320透射的探测光经过方形分束器300后分为两部分,分别被两个一维位置传感器610接收,此外,图像采集部件500也接收激发光光束以获取激发光光斑的图像。类似的,上述图2公开的光电探测器的也可以应用于图3所示的探测部件。显然,以上实施例公开的探测部件结构,均可以应用于光声测量设备。In a possible embodiment, the structure of the detection component as shown in Figure 1 or the structure of the detection component as shown in Figure 3 can be improved, and a photoelectric detector is provided in the detection system to receive the partially reflected detection beam, so that the detection component can also It can detect changes in surface reflectivity of the object being measured. As an example, for Figure 1 The structure of the detection component shown is improved. As shown in Figure 2, the reflected detection light 520 passes through the first spectroscopic component 310 during propagation, and a part of the light beam is reflected by the first spectroscopic component 310 to the image acquisition component 500 to obtain the detection light. Spot image, the detection light transmitted through the first spectroscopic component 310 propagates to the second spectroscopic component 320, the detection light reflected by the second spectroscopic component 320 is received by the photodetector 420, and the detection light transmitted by the second spectroscopic component 320 passes through the square The beam splitter 300 is then divided into two parts, which are respectively received by two one-dimensional position sensors 610. In addition, the image acquisition component 500 also receives the excitation light beam to obtain an image of the excitation light spot. Similarly, the photodetector disclosed in FIG. 2 above can also be applied to the detection component shown in FIG. 3 . Obviously, the detection component structures disclosed in the above embodiments can be applied to photoacoustic measurement equipment.
根据探测光束实际聚焦位置与激发光聚焦中心位置在样品所在局部坐标系O-XYZ的相对方位,探测光束的光束质心将在位置传感器局部坐标系O’-X’Y’Z’偏转到不同方向,可为X’+/X’-/Y’+/Y’-。当探测光光斑在激发光的光斑的X正向位置X+,探测光束在位置传感器局部坐标系的偏转方向即为X’正向位置X’+;当探测光光斑在激发光的光斑的X负向位置X-,探测光束在位置传感器局部坐标系的偏转方向即为X’负向位置X’-;类似的情况也适用于Y向。According to the relative orientation of the actual focus position of the detection beam and the focus center position of the excitation light in the local coordinate system O-XYZ where the sample is located, the beam center of mass of the detection beam will deflect to different directions in the local coordinate system O'-X'Y'Z' of the position sensor. , can be X'+/X'-/Y'+/Y'-. When the detection light spot is at the positive X position X+ of the excitation light spot, the deflection direction of the detection beam in the local coordinate system of the position sensor is the X' positive position To the position X-, the deflection direction of the detection beam in the local coordinate system of the position sensor is the X' negative position X'-; a similar situation also applies to the Y direction.
一种可能的实施例中,光声测量设备,若所述相对方位不沿x方向或y方向,所述探测部件选择二维位置传感器,并且所述二维位置传感器的探测面的两个边的方向分别与x方向和y方向相对应,或者,所述探测部件选择两个一维位置传感器,并且两个所述一维位置传感器的探测面长边的方向相互正交。In a possible embodiment of the photoacoustic measurement device, if the relative orientation is not along the x direction or the y direction, the detection component selects a two-dimensional position sensor, and the two sides of the detection surface of the two-dimensional position sensor The directions correspond to the x direction and the y direction respectively, or the detection component selects two one-dimensional position sensors, and the directions of the long sides of the detection surfaces of the two one-dimensional position sensors are orthogonal to each other.
在还有一些实施方式中,所述的光声测量设备中位置传感器的光敏面有几种变形设计,其中所述位置传感器如图8所示,一种实施例由正方形/长方形光敏面的光电探测器元件组成,或者,还有一种实施例所述位置传感器由两个同等大小的正方形光敏面的光电探测器元件为轴对称并排组成,或者,再还有一种实施例所述位置传感器由四个同等大小的正方形光敏面的光电探测器元件为中心对称排列组成。不同的位置传感器设计方案,可以应用于不同的量测场景,同时兼顾位置传感器的探测精度和响应速度,并且,在量测过程中,根据探测
光束偏转的实际方向/相对方位,设备自动选择/匹配合适的探测部件的布局,进一步提高了探测光束偏转的探测精度,从而提高了光声测量的信噪比,提高了膜厚的测量精度。In some other embodiments, the photosensitive surface of the position sensor in the photoacoustic measurement device has several deformation designs, wherein the position sensor is shown in FIG8 , one embodiment is composed of photoelectric detector elements with square/rectangular photosensitive surfaces, or, in another embodiment, the position sensor is composed of two photoelectric detector elements with square photosensitive surfaces of equal size arranged side by side in an axisymmetric manner, or, in another embodiment, the position sensor is composed of four photoelectric detector elements with square photosensitive surfaces of equal size arranged in a center-symmetrical manner. Different position sensor design schemes can be applied to different measurement scenarios while taking into account the detection accuracy and response speed of the position sensor, and, in the measurement process, according to the detection The actual direction/relative orientation of the beam deflection, the equipment automatically selects/matches the appropriate layout of the detection components, further improving the detection accuracy of the beam deflection, thereby improving the signal-to-noise ratio of the photoacoustic measurement and improving the measurement accuracy of the film thickness.
在本申请的一些实施例中,本发明实施例还公开了光声测量设备,所述一维位置传感器610包括两个输出端,所述二维位置传感器620包括四个输出端;所述一维位置传感器610的探测面为长方形光敏面,如图8中的情形B,或者由两个相同大小的方形光敏面组成如图8中的情形C;所述二维位置传感器620的探测面为方形光敏面如图8中的情形A,或者由以2×2阵列分布的四个相同大小的方形光敏面组成如图8中的情形D。In some embodiments of the present application, the embodiment of the present invention also discloses a photoacoustic measurement device, the one-dimensional position sensor 610 includes two output terminals, and the two-dimensional position sensor 620 includes four output terminals; the one-dimensional position sensor 610 includes two output terminals; The detection surface of the two-dimensional position sensor 610 is a rectangular photosensitive surface, as in case B in Figure 8, or is composed of two square photosensitive surfaces of the same size as in case C in Figure 8; the detection surface of the two-dimensional position sensor 620 is A square photosensitive surface as in case A in Figure 8, or consisting of four square photosensitive surfaces of the same size distributed in a 2×2 array as in case D in Figure 8.
在本申请的更进一步的一些实施例中,光声测量设备,由所述一维位置传感器610的输出信号,得到所述偏移量,包括:
In some further embodiments of the present application, the photoacoustic measurement device obtains the offset from the output signal of the one-dimensional position sensor 610, including:
In some further embodiments of the present application, the photoacoustic measurement device obtains the offset from the output signal of the one-dimensional position sensor 610, including:
其中,δ为所述偏移量,I1和I2分别为所述一维位置传感器两个输出端的输出信号,L为两个输出端之间的有效距离或者所述反射的探测光束的直径。两个光敏面结构的图8中C所示,L为探测面上的光斑直径(反射的探测光束的直径),计算更准确。光斑直径为该方向上的直径,该方向为一维位置传感器610中长方形光敏面的长度方向,即图8中C所示的X方向,或者,一维位置传感器610中两个相同大小的方形组成的长方形光敏面的长度方向。单个长方形光敏面的位置传感器,如图8中B所示,L为光电流输出端之间的有效距离,计算更准确。Wherein, δ is the offset, I 1 and I 2 are the output signals of the two output terminals of the one-dimensional position sensor respectively, and L is the effective distance between the two output terminals or the diameter of the reflected detection beam. . The two photosensitive surface structures are shown in C in Figure 8. L is the spot diameter on the detection surface (the diameter of the reflected detection beam), and the calculation is more accurate. The spot diameter is the diameter in the direction, which is the length direction of the rectangular photosensitive surface in the one-dimensional position sensor 610, that is, the X direction shown in C in Figure 8, or two squares of the same size in the one-dimensional position sensor 610 The length direction of the rectangular photosensitive surface. The position sensor of a single rectangular photosensitive surface is shown as B in Figure 8. L is the effective distance between the photocurrent output terminals, and the calculation is more accurate.
在本申请的还有一些实施例中,光声测量设备,由所述二维位置传感器620的输出信号,得到所述偏移量,包括:
In some embodiments of the present application, the photoacoustic measurement device obtains the offset from the output signal of the two-dimensional position sensor 620, including:
In some embodiments of the present application, the photoacoustic measurement device obtains the offset from the output signal of the two-dimensional position sensor 620, including:
其中,δx和δy分别为所述偏移量在x方向和y方向上的分量,I1、I2、I3和
I4分别为所述二维位置传感器四个输出端的输出信号,I1和I2、I3和I4分别为与y方向相对应的两个相邻输出端的输出信号,I1和I4、I2和I3分别为与x方向相对应两个相邻输出端的输出信号,Lx为输出信号I1和I4分别对应的两个输出端之间的有效距离或者所述反射的探测光束的直径,Ly为输出信号I1和I2分别对应的两个输出端之间有效距离或者所述反射的探测光束的直径。Among them, δ x and δ y are the components of the offset in the x direction and y direction respectively, I 1 , I 2 , I 3 and I 4 are respectively the output signals of the four output terminals of the two-dimensional position sensor, I 1 and I 2 , I 3 and I 4 are respectively the output signals of two adjacent output terminals corresponding to the y direction, I 1 and I 4 , I 2 and I 3 are respectively the output signals of two adjacent output terminals corresponding to the x direction, L x is the effective distance between the two output terminals corresponding to the output signals I 1 and I 4 respectively or the detection of the reflection The diameter of the beam, Ly y, is the effective distance between the two output terminals corresponding to the output signals I 1 and I 2 respectively or the diameter of the reflected detection beam.
在本申请的一种可能的情况下,光声测量设备,所述探测部件还包括光电探测器420,以获取所述被测物反射率变化引起的光强变化;所述反射的探测光束经过分光部件后分别被所述光电探测器420和所述一维位置传感器610或所述二维位置传感器620接收(图中未示出)。进一步的实施例中的光声测量设备,所述反射的探测光束经成像单元后被所述光电探测器接收,所述成像单元(开普勒式)的放大倍率为1:1,即探测光束在被测物表面的光斑尺寸与其在光电探测器探测面的光斑尺寸一致。In one possible case of the present application, the photoacoustic measurement device, the detection component also includes a photodetector 420 to obtain the light intensity change caused by the reflectivity change of the object to be measured; the reflected detection beam is received by the photodetector 420 and the one-dimensional position sensor 610 or the two-dimensional position sensor 620 respectively after passing through the light splitting component (not shown in the figure). In the photoacoustic measurement device in a further embodiment, the reflected detection beam is received by the photodetector after passing through an imaging unit, and the magnification of the imaging unit (Kepler type) is 1:1, that is, the spot size of the detection beam on the surface of the object to be measured is consistent with its spot size on the detection surface of the photodetector.
所述一维位置传感器或所述二维位置传感器接收的探测光为平行光束。具体根据探测光束的不同偏转方向选择匹配的位置传感器设计方案,以X’方向的偏移,+/-偏移均可被测量,需选择可通过光电流差分信号,反馈出探测光束在X’方向的偏移量δX‘的位置传感器设计方案,进而通过上述公式1计算出样品表面倾斜角度θ,同时,根据差分信号中探测光束偏转引起的反射率变化出现的时间位置,可以计算出膜厚值,此处计算原理与材料反射率回声计算方法相同。The detection light received by the one-dimensional position sensor or the two-dimensional position sensor is a parallel light beam. Specifically, select a matching position sensor design according to the different deflection directions of the detection beam. The offset in the X' direction and the +/- offset can be measured. If you need to choose, the photocurrent differential signal can be used to feed back the detection beam in X'. The position sensor design of the direction offset δ Thickness value, the calculation principle here is the same as the material reflectivity echo calculation method.
在本申请的还有一些实施例中,位置传感器设计方案的选择主要考虑两方面:位置探测敏感度/精度;探测器带宽。同种探测器材料,一般感光面越大,光电探测器的结电容就越大,光电探测器的带宽就越小,与此同时,探测器能够接收的饱和光功率也会随感光面积的增大而增大,光电信号的信噪比也随之升高,另外随可接受光斑面积变大,位置传感器位置探测精度也会升高。可根据实际工况对探测带宽和探测位置精度的要求,选择合适的位置传感器设计方案。In some embodiments of the present application, the selection of a position sensor design mainly considers two aspects: position detection sensitivity/accuracy; and detector bandwidth. For the same detector material, generally the larger the photosensitive surface, the larger the junction capacitance of the photodetector and the smaller the bandwidth of the photodetector. At the same time, the saturated optical power that the detector can receive will also increase with the increase of the photosensitive area. As the size increases, the signal-to-noise ratio of the photoelectric signal also increases. In addition, as the acceptable light spot area becomes larger, the position detection accuracy of the position sensor will also increase. An appropriate position sensor design can be selected based on the requirements for detection bandwidth and detection position accuracy under actual working conditions.
在另一些实施例中,位置传感器设计方案如图8中A,由一个方形光敏
面的光电探测器元件组成,为二维位置传感器,位置传感器在x方向上的长度Lx,在y方向上的长度为Ly,其中Ly=Lx。单个探测面,四个角分别有一个pin引脚导出光电流,基于光电流可计算得到探测光束在X/Y方向偏移量大小,进而计算出探测光束角度偏转大小及偏转发生的时间。光电流与探测光束在x和y方向的偏移量δx与δy转化公式可表达为
其中,Lx和Ly分别为光敏面在x和y方向上的长度——对应光电流输出端之间的有效距离。In other embodiments, the position sensor design is shown in Figure 8A, consisting of a square photosensitive It is composed of a surface photodetector element and is a two-dimensional position sensor. The length of the position sensor in the x direction is Lx, and the length in the y direction is Ly, where Ly=Lx. There is a pin on each of the four corners of a single detection surface to derive photocurrent. Based on the photocurrent, the offset of the detection beam in the X/Y direction can be calculated, and then the angular deflection of the detection beam and the time when the deflection occurs can be calculated. The conversion formula of the offset δx and δy between the photocurrent and the detection beam in the x and y directions can be expressed as Among them, Lx and Ly are the lengths of the photosensitive surface in the x and y directions respectively - corresponding to the effective distance between the photocurrent output ends.
在另一些实施例中,位置传感器设计方案如图8中B,为一维位置传感器,由一个狭长的长方形光敏面的光电探测器元件组成,一维位置传感器在x方向上的长度Lx>Ly,可得到X方向偏移量。将此设计旋转90度可获得Y方向的长方形光敏面的光电探测器元件,一维位置传感器在y方向上的长度Ly>Lx,可得到Y方向偏移量。In other embodiments, the position sensor design scheme is B in Figure 8, which is a one-dimensional position sensor, consisting of a photodetector element with a long and narrow rectangular photosensitive surface. The length of the one-dimensional position sensor in the x direction is Lx>Ly. , the X-direction offset can be obtained. Rotate this design 90 degrees to obtain a photodetector element with a rectangular photosensitive surface in the Y direction. The length of the one-dimensional position sensor in the y direction Ly>Lx can be used to obtain the offset in the Y direction.
对于单个探测面的设计方案,如图8B所示,两个X方向的pin引脚导出光电流,光电流与探测光束在x方向偏移量δ转化公式可表达为其中L为光敏面在x方向上的长度——光电流输出端之间的有效距离。Y向设计中,将图8B所示的一维位置传感器旋转90度,光电流与探测光束在y方向偏移量δ转化公式,可表达为其中L为光敏面在y方向上的长度——光电流输出端之间的有效距离。For the design of a single detection surface, as shown in Figure 8B, two pins in the X direction derive photocurrent. The conversion formula between the photocurrent and the offset δ of the detection beam in the x direction can be expressed as Where L is the length of the photosensitive surface in the x direction - the effective distance between the photocurrent output terminals. In the Y-direction design, the one-dimensional position sensor shown in Figure 8B is rotated 90 degrees, and the conversion formula of the photocurrent and the offset δ of the detection beam in the y-direction can be expressed as Where L is the length of the photosensitive surface in the y direction - the effective distance between the photocurrent output terminals.
在另一些实施例中,位置传感器为一维位置传感器,具体设计方案如图8中C情形,由两个同等大小的方形光敏面的光电探测器元件组成,可探测X方向偏移量。将此设计旋转90度可获得Y方向的双光电探测器元件设计,可以探测Y方向偏移量。In other embodiments, the position sensor is a one-dimensional position sensor. The specific design scheme is shown in Figure 8 as case C. It consists of two photodetector elements with square photosensitive surfaces of equal size, which can detect the offset in the X direction. Rotate this design 90 degrees to obtain a dual photodetector element design in the Y direction, which can detect the offset in the Y direction.
可根据探测光敏面1和探测光敏面2得到的光电流值I1与I2的差值,探测光束在X方向偏移量大小,进而计算出探测光束角度偏转大小及偏转发生的时
间。光电流与光束在x方向偏移量δ转化公式可表达为其中L为探测光光斑在x方向上的直径。Y向设计中,将图8C所示的一维位置传感器旋转90度,光电流与探测光束在y方向偏移量δ转化公式可表达为其中L为探测光光斑在y方向上的直径。According to the difference between the photocurrent values I 1 and I 2 obtained from the detection photosensitive surface 1 and the detection photosensitive surface 2, the deflection amount of the detection beam in the X direction can be calculated, and then the angular deflection size of the detection beam and the time when the deflection occurs can be calculated. between. The conversion formula between the photocurrent and the beam offset δ in the x direction can be expressed as where L is the diameter of the detection light spot in the x direction. In the Y-direction design, the one-dimensional position sensor shown in Figure 8C is rotated 90 degrees, and the conversion formula of the photocurrent and the offset δ of the detection beam in the y-direction can be expressed as where L is the diameter of the detection light spot in the y direction.
在另一些实施例中,位置传感器为二维位置传感器,设计方案如图8中D情形,2×2阵列分布的四个探测光敏面,四个角分别有一个pin引脚导出光电流,基于光电流可计算得到探测光束在X/Y方向偏移量大小,进而计算出探测光束角度偏转大小及偏转发生的时间。可根据探测光敏面1、探测光敏面2、探测光敏面3、探测光敏面4得到的光电流值/光电压值的差值,可计算得到探测光束在X/Y方向偏移量大小,进而计算出探测光束角度偏转大小及偏转发生的时间。光电流与探测光束在x和y方向的偏移量δx与δy转化公式,可表达为其中,Lx为光斑在x方向上的直径,Ly为光斑在y方向上的直径。In other embodiments, the position sensor is a two-dimensional position sensor. The design scheme is in case D in Figure 8. There are four detection photosensitive surfaces distributed in a 2×2 array, and each of the four corners has a pin to derive the photocurrent. Based on The photocurrent can be used to calculate the offset of the detection beam in the X/Y direction, and then calculate the angular deflection of the detection beam and the time when the deflection occurs. According to the difference between the photocurrent value/photovoltage value obtained by detecting photosensitive surface 1, detecting photosensitive surface 2, detecting photosensitive surface 3, and detecting photosensitive surface 4, the offset amount of the detection beam in the X/Y direction can be calculated, and then Calculate the angle deflection of the detection beam and the time when the deflection occurs. The conversion formula of the offset δx and δy between the photocurrent and the detection beam in the x and y directions can be expressed as Among them, Lx is the diameter of the light spot in the x direction, and Ly is the diameter of the light spot in the y direction.
位置传感器设计如图8中B、图8中C所示,均为单方向位置探测设计方案,能够量测鼓包单方向的偏转,也可以两个位置传感器组合,以探测任意方向的偏转,该设计方案简化、对后续电路设计要求降低,易于实现且成本较低。其中,如图8中B的设计方案相对如图8中C的设计方案,光敏面面积较大,结电容大,光电流大因此位置精度高,但带宽较低。The position sensor design is shown in Figure 8 B and Figure 8 C. They are both unidirectional position detection designs that can measure the deflection of the bulge in one direction. Two position sensors can also be combined to detect deflection in any direction. The design solution is simplified, the subsequent circuit design requirements are reduced, it is easy to implement and the cost is low. Among them, the design scheme B in Figure 8 is compared to the design scheme C in Figure 8. The photosensitive surface area is larger, the junction capacitance is large, and the photocurrent is large, so the position accuracy is high, but the bandwidth is low.
位置传感器设计如图8中A、图8中D,可实现X/Y双方向位置探测,可量测鼓包双方向偏转,即可以探测任意方向的偏转,降低了对激发光光斑和探测光光斑的相对方位要求,即X/Y方向均可,增强了设备的灵活性,系统集成度高,但对后续电路设计要求较高。The position sensor design is shown in Figure 8 A and Figure 8 D, which can realize position detection in both X/Y directions and can measure deflection in both directions of the bulge, that is, it can detect deflection in any direction, reducing the impact of excitation light spots and detection light spots. The relative orientation requirements, that is, both X/Y directions are applicable, which enhances the flexibility of the equipment and has high system integration, but requires higher requirements for subsequent circuit design.
本发明还提供了一种膜厚测量方法,如图9所示,所述膜厚测量方法应用于前述实施例公开的光声测量设备,包括:
The present invention also provides a film thickness measurement method, as shown in Figure 9. The film thickness measurement method is applied to the photoacoustic measurement equipment disclosed in the aforementioned embodiments, and includes:
步骤100:获取所述激发光和所述探测光在不同时间延迟下,所述探测部件的输出信号;Step 100: Obtain the output signal of the detection component under different time delays of the excitation light and the detection light;
步骤200:所述控制器控制光学延迟器以调节所述激发光和所述探测光的光程差,以实现不同时间延迟的调节,所述光学延迟器设置在所述激发光光路和/或所述探测光光路;Step 200: The controller controls an optical retarder to adjust the optical path difference between the excitation light and the detection light to achieve adjustment of different time delays. The optical retarder is arranged in the optical path of the excitation light and/or The optical path of the detection light;
步骤300:基于所述输出信号,获取探测信号,所述探测信号包括所述探测光束偏移量,或者包括所述探测光束偏移量和所述被测物反射率变化引起的光强变化;Step 300: acquiring a detection signal based on the output signal, wherein the detection signal includes the detection beam offset, or includes the detection beam offset and a light intensity change caused by a reflectivity change of the object being measured;
步骤400:获取所述探测信号时域上的时间间隔,基于所述时间间隔获得所述被测物的膜厚,所述时间间隔对应于所述声波前后两次到达所述被测物表面的时间间隔。Step 400: Obtain the time interval in the time domain of the detection signal, and obtain the film thickness of the object to be measured based on the time interval. The time interval corresponds to the time when the sound wave reaches the surface of the object to be measured twice before and after. time interval.
在进一步的实施例中的膜厚测量方法,基于所述时间间隔获得所述被测物的膜厚包括:In a further embodiment of the film thickness measurement method, obtaining the film thickness of the measured object based on the time interval includes:
步骤1000:基于所述探测光束偏移量,得到第一时间间隔,并计算得到第一膜厚;Step 1000: Obtain the first time interval based on the offset of the detection beam, and calculate the first film thickness;
步骤2000:基于所述被测物反射率变化引起的光强变化,得到第二时间间隔,并计算得到第二膜厚;Step 2000: Obtain the second time interval based on the change in light intensity caused by the change in reflectivity of the measured object, and calculate the second film thickness;
步骤3000:将得到的所述第一膜厚或者所述第二膜厚作为所述被测物的膜厚;或者,将得到的所述第一膜厚和所述第二膜厚的平均值作为所述被测物的膜厚。Step 3000: Use the obtained first film thickness or the second film thickness as the film thickness of the measured object; or, use the average value of the obtained first film thickness and the second film thickness As the film thickness of the measured object.
虽然在上文中详细说明了本发明的实施方式,但是对于本领域的技术人员来说显而易见的是,能够对这些实施方式进行各种修改和变化。但是,应理解,这种修改和变化都属于权利要求书中所述的本发明的范围和精神之内。而且,在此说明的本发明可有其它的实施方式,并且可通过多种方式实施或实现。
Although the embodiments of the present invention have been described in detail above, it will be obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the invention as described in the claims. Furthermore, the invention described herein is capable of other embodiments and of being practiced or carried out in various ways.
Claims (10)
- 一种光声测量设备,其特征在于,包括:光发射器、控制器、图像采集部件和探测部件;所述光发射器用于产生激发光和探测光;A photoacoustic measurement device, characterized in that it comprises: a light emitter, a controller, an image acquisition component and a detection component; the light emitter is used to generate excitation light and detection light;所述激发光沿激发光光路投射至被测物的测量区域,所述探测光沿探测光的光路投射至所述测量区域,所述激发光在所述被测物中形成声波,所述声波经所述被测物中的界面回传至所述被测物表面并在所述测量区域中产生形变;The excitation light is projected to the measurement area of the object to be measured along the optical path of the excitation light, and the detection light is projected to the measurement area along the optical path of the detection light. The excitation light forms an acoustic wave in the object to be measured, and the sound wave It is transmitted back to the surface of the measured object through the interface in the measured object and generates deformation in the measurement area;所述探测部件,用于接收所述被测物反射的探测光束并产生输出信号,所述探测部件包括一维位置传感器或二维位置传感器,以至少得到所述反射的探测光束偏移量,其中,所述一维位置传感器和二维位置传感器在测量过程中可切换或可替代;The detection component is used to receive the detection beam reflected by the object to be measured and generate an output signal. The detection component includes a one-dimensional position sensor or a two-dimensional position sensor to at least obtain the offset of the reflected detection beam, Wherein, the one-dimensional position sensor and the two-dimensional position sensor are switchable or replaceable during the measurement process;所述图像采集部件,用于获取所述激发光和所述探测光在所述被测物表面光斑的图像;The image acquisition component is used to acquire images of the light spots of the excitation light and the detection light on the surface of the object to be measured;所述控制器,用于接收所述图像,以确定激发光光斑和探测光光斑在所述被测物表面上位置的相对方位,并根据所述相对方位,控制所述探测部件选择所述一维位置传感器或所述二维位置传感器;The controller is configured to receive the image to determine the relative orientation of the excitation light spot and the detection light spot on the surface of the object to be measured, and control the detection component to select the one based on the relative orientation. dimensional position sensor or said two-dimensional position sensor;所述控制器,还用于根据所述探测部件的输出信号,获取所述被测物的待测参数。The controller is also used to obtain the parameters to be measured of the object to be measured based on the output signal of the detection component.
- 如权利要求1所述的光声测量设备,其特征在于,根据所述相对方位,控制所述探测部件选择所述一维位置传感器或所述二维位置传感器,包括:The photoacoustic measurement device according to claim 1, wherein controlling the detection component to select the one-dimensional position sensor or the two-dimensional position sensor according to the relative orientation includes:若所述相对方位沿着x方向或y方向,所述探测部件选择一维位置传感器,并且所述一维位置传感器的探测面长边的方向与所述相对方位相对应;If the relative orientation is along the x-direction or the y-direction, the detection component selects a one-dimensional position sensor, and the direction of the long side of the detection surface of the one-dimensional position sensor corresponds to the relative orientation;若所述相对方位不沿x方向或y方向,所述探测部件选择二维位置传感器,并且所述二维位置传感器的探测面的两个边的方向分别与x方向和y方向相对应,或者,所述探测部件选择两个一维位置传感器,并且两个所述一维位置传 感器的探测面长边的方向相互正交;If the relative orientation is not along the x direction or the y direction, the detection component selects a two-dimensional position sensor, and the directions of the two sides of the detection surface of the two-dimensional position sensor correspond to the x direction and the y direction respectively, or , the detection component selects two one-dimensional position sensors, and the two one-dimensional position sensors The directions of the long sides of the detection surface of the sensor are orthogonal to each other;其中,x方向与y方向为所述被测物表面内相互正交的两个方向。Wherein, the x direction and the y direction are two mutually orthogonal directions on the surface of the object to be measured.
- 如权利要求2所述的光声测量设备,其特征在于,所述一维位置传感器包括两个输出端,所述二维位置传感器包括四个输出端;The photoacoustic measurement device according to claim 2, wherein the one-dimensional position sensor includes two output terminals, and the two-dimensional position sensor includes four output terminals;所述一维位置传感器的探测面为长方形光敏面或者由两个相同大小的方形光敏面组成;所述二维位置传感器的探测面为方形光敏面或者由以2×2阵列分布的四个相同大小的方形光敏面组成。The detection surface of the one-dimensional position sensor is a rectangular photosensitive surface or consists of two square photosensitive surfaces of the same size; the detection surface of the two-dimensional position sensor is a square photosensitive surface or consists of four identical photosensitive surfaces distributed in a 2×2 array. It consists of a square photosensitive surface.
- 如权利要求3所述的光声测量设备,其特征在于,由所述一维位置传感器的输出信号,得到所述偏移量,包括:
The photoacoustic measurement device according to claim 3, wherein the offset is obtained from the output signal of the one-dimensional position sensor, including:
其中,δ为所述偏移量,I1和I2分别为所述一维位置传感器两个输出端的输出信号,L为两个输出端之间的有效距离或者所述反射的探测光束的直径。Wherein, δ is the offset, I 1 and I 2 are the output signals of the two output terminals of the one-dimensional position sensor respectively, and L is the effective distance between the two output terminals or the diameter of the reflected detection beam. . - 如权利要求3所述的光声测量设备,其特征在于,由所述二维位置传感器的输出信号,得到所述偏移量,包括:
The photoacoustic measurement device according to claim 3, wherein the offset is obtained from the output signal of the two-dimensional position sensor, including:
其中,δx和δy分别为所述偏移量在x方向和y方向上的分量,I1、I2、I3和I4分别为所述二维位置传感器四个输出端的输出信号,I1和I2、I3和I4分别为与y方向相对应的两个相邻输出端的输出信号,I1和I4、I2和I3分别为与x方向相对应两个相邻输出端的输出信号,Lx为输出信号I1和I4分别对应的两个输出端之间的有效距离或者所述反射的探测光束的直径,Ly为输出信号I1和I2分别对应的两个输出端之间有效距离或者所述反射的探测光束的直径。Among them, δ x and δ y are the components of the offset in the x direction and the y direction respectively, I 1 , I 2 , I 3 and I 4 are respectively the output signals of the four output terminals of the two-dimensional position sensor, I 1 and I 2 , I 3 and I 4 are respectively the output signals of two adjacent output terminals corresponding to the y direction. I 1 and I 4 , I 2 and I 3 are respectively the output signals of two adjacent output terminals corresponding to the x direction. The output signal of the output terminal, L x is the effective distance between the two output terminals corresponding to the output signals I 1 and I 4 respectively or the diameter of the reflected detection beam, L y is the corresponding The effective distance between the two output terminals or the diameter of the reflected detection beam. - 如权利要求1-5任一项所述的光声测量设备,其特征在于,所述探测部件还包括光电探测器,以获取所述被测物反射率变化引起的光强变化; The photoacoustic measurement equipment according to any one of claims 1 to 5, wherein the detection component further includes a photodetector to obtain changes in light intensity caused by changes in reflectivity of the object to be measured;所述反射的探测光束经过分光部件后分别被所述光电探测器和所述一维位置传感器或所述二维位置传感器接收。The reflected detection beam passes through the spectroscopic component and is received by the photodetector and the one-dimensional position sensor or the two-dimensional position sensor respectively.
- 如权利要求6所述的光声测量设备,其特征在于,所述反射的探测光束经成像单元后被所述光电探测器接收,所述成像单元的放大倍率为1:1;The photoacoustic measurement equipment according to claim 6, wherein the reflected detection beam is received by the photodetector after passing through an imaging unit, and the magnification of the imaging unit is 1:1;所述一维位置传感器或所述二维位置传感器接收的探测光为平行光束。The detection light received by the one-dimensional position sensor or the two-dimensional position sensor is a parallel light beam.
- 如权利要求6所述的光声测量设备,其特征在于,由所述一维位置传感器或所述二维位置传感器和所述光电探测器的饱和功率确定所述分光部件的分光比例,并且所述一维位置传感器、所述二维位置传感器、所述光电探测器接收的探测光的功率达到饱和功率。The photoacoustic measurement device according to claim 6, wherein the light splitting ratio of the light splitting component is determined by the saturation power of the one-dimensional position sensor or the two-dimensional position sensor and the photodetector, and the The power of the detection light received by the one-dimensional position sensor, the two-dimensional position sensor, and the photodetector reaches saturation power.
- 一种膜厚测量方法,其特征在于,所述膜厚测量方法应用于如权利要求1-8任一项所述的光声测量设备,包括:A film thickness measurement method, characterized in that the film thickness measurement method is applied to the photoacoustic measurement equipment according to any one of claims 1 to 8, including:获取所述激发光和所述探测光在不同时间延迟下,所述探测部件的输出信号;Obtain the output signal of the detection component under different time delays of the excitation light and the detection light;所述控制器控制光学延迟器以调节所述激发光和所述探测光的光程差,以实现不同时间延迟的调节,所述光学延迟器设置在所述激发光光路和/或所述探测光光路;The controller controls an optical retarder to adjust the optical path difference between the excitation light and the detection light to achieve adjustment of different time delays. The optical retarder is arranged in the optical path of the excitation light and/or the detection light. light path;基于所述输出信号,获取探测信号,所述探测信号包括所述探测光束偏移量,或者包括所述探测光束偏移量和所述被测物反射率变化引起的光强变化;Based on the output signal, a detection signal is obtained, the detection signal includes the detection beam offset, or includes the detection beam offset and the change in light intensity caused by the change in reflectivity of the measured object;获取所述探测信号时域上的时间间隔,基于所述时间间隔获得所述被测物的膜厚,所述时间间隔对应于所述声波前后两次到达所述被测物表面的时间间隔。The time interval in the time domain of the detection signal is obtained, and the film thickness of the object to be measured is obtained based on the time interval. The time interval corresponds to the time interval between the sound waves reaching the surface of the object to be measured twice before and after.
- 如权利要求9所述的膜厚测量方法,其特征在于,基于所述时间间隔获得所述被测物的膜厚包括:The film thickness measurement method of claim 9, wherein obtaining the film thickness of the measured object based on the time interval includes:基于所述探测光束偏移量,得到第一时间间隔,并计算得到第一膜厚; Based on the offset of the detection beam, a first time interval is obtained, and a first film thickness is calculated;基于所述被测物反射率变化引起的光强变化,得到第二时间间隔,并计算得到第二膜厚;Based on the change in light intensity caused by the change in reflectivity of the measured object, a second time interval is obtained, and the second film thickness is calculated;将得到的所述第一膜厚或者所述第二膜厚作为所述被测物的膜厚;或者,The obtained first film thickness or the second film thickness is used as the film thickness of the measured object; or,将得到的所述第一膜厚和所述第二膜厚的平均值作为所述被测物的膜厚。 The obtained average value of the first film thickness and the second film thickness is regarded as the film thickness of the measured object.
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Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5377006A (en) * | 1991-05-20 | 1994-12-27 | Hitachi, Ltd. | Method and apparatus for detecting photoacoustic signal |
US5781294A (en) * | 1991-12-24 | 1998-07-14 | Hitachi, Ltd. | Method and apparatus for detecting photoacoustic signal to detect surface and subsurface information of the specimen |
CN104215431A (en) * | 2014-09-25 | 2014-12-17 | 中国工程物理研究院应用电子学研究所 | Rapid tilting mirror performance testing device |
CN209147825U (en) * | 2018-11-12 | 2019-07-23 | 宋一兵 | A kind of laser facula and echo tracking monitoring device |
CN110488247A (en) * | 2019-08-20 | 2019-11-22 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of two dimension MEMS scanning galvanometer laser radar system |
CN113406009A (en) * | 2021-06-23 | 2021-09-17 | 电子科技大学 | Photoacoustic signal matched filtering-based metal material thermal diffusivity measurement method |
CN114279346A (en) * | 2021-12-18 | 2022-04-05 | 上海精测半导体技术有限公司 | Optical measurement device, optical measurement method, and photoacoustic film thickness measurement system |
CN114295064A (en) * | 2021-12-18 | 2022-04-08 | 上海精测半导体技术有限公司 | Optical measurement device, optical measurement method, and photoacoustic film thickness measurement system |
CN114543689A (en) * | 2022-02-25 | 2022-05-27 | 上海精测半导体技术有限公司 | Laser beam combining device and method, and photoacoustic measurement device and method |
CN114543690A (en) * | 2022-03-01 | 2022-05-27 | 上海精测半导体技术有限公司 | Optical characteristic modeling method, photoacoustic measurement method and device |
CN115307557A (en) * | 2022-07-14 | 2022-11-08 | 上海精测半导体技术有限公司 | Photoacoustic measurement system and photoacoustic measurement method |
CN115388787A (en) * | 2022-08-15 | 2022-11-25 | 上海精测半导体技术有限公司 | Photoacoustic measurement system |
CN115451843A (en) * | 2022-09-22 | 2022-12-09 | 上海精测半导体技术有限公司 | Photoacoustic measurement equipment and film thickness measurement method |
CN115560683A (en) * | 2022-08-05 | 2023-01-03 | 上海精测半导体技术有限公司 | Photoacoustic measurement system and method for measuring film thickness |
-
2022
- 2022-09-22 CN CN202211157123.7A patent/CN115451843A/en active Pending
-
2023
- 2023-08-24 WO PCT/CN2023/114745 patent/WO2024060929A1/en unknown
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5377006A (en) * | 1991-05-20 | 1994-12-27 | Hitachi, Ltd. | Method and apparatus for detecting photoacoustic signal |
US5781294A (en) * | 1991-12-24 | 1998-07-14 | Hitachi, Ltd. | Method and apparatus for detecting photoacoustic signal to detect surface and subsurface information of the specimen |
CN104215431A (en) * | 2014-09-25 | 2014-12-17 | 中国工程物理研究院应用电子学研究所 | Rapid tilting mirror performance testing device |
CN209147825U (en) * | 2018-11-12 | 2019-07-23 | 宋一兵 | A kind of laser facula and echo tracking monitoring device |
CN110488247A (en) * | 2019-08-20 | 2019-11-22 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of two dimension MEMS scanning galvanometer laser radar system |
CN113406009A (en) * | 2021-06-23 | 2021-09-17 | 电子科技大学 | Photoacoustic signal matched filtering-based metal material thermal diffusivity measurement method |
CN114279346A (en) * | 2021-12-18 | 2022-04-05 | 上海精测半导体技术有限公司 | Optical measurement device, optical measurement method, and photoacoustic film thickness measurement system |
CN114295064A (en) * | 2021-12-18 | 2022-04-08 | 上海精测半导体技术有限公司 | Optical measurement device, optical measurement method, and photoacoustic film thickness measurement system |
CN114543689A (en) * | 2022-02-25 | 2022-05-27 | 上海精测半导体技术有限公司 | Laser beam combining device and method, and photoacoustic measurement device and method |
CN114543690A (en) * | 2022-03-01 | 2022-05-27 | 上海精测半导体技术有限公司 | Optical characteristic modeling method, photoacoustic measurement method and device |
CN115307557A (en) * | 2022-07-14 | 2022-11-08 | 上海精测半导体技术有限公司 | Photoacoustic measurement system and photoacoustic measurement method |
CN115560683A (en) * | 2022-08-05 | 2023-01-03 | 上海精测半导体技术有限公司 | Photoacoustic measurement system and method for measuring film thickness |
CN115388787A (en) * | 2022-08-15 | 2022-11-25 | 上海精测半导体技术有限公司 | Photoacoustic measurement system |
CN115451843A (en) * | 2022-09-22 | 2022-12-09 | 上海精测半导体技术有限公司 | Photoacoustic measurement equipment and film thickness measurement method |
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