WO2024057678A1 - Composition thermoconductrice - Google Patents

Composition thermoconductrice Download PDF

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Publication number
WO2024057678A1
WO2024057678A1 PCT/JP2023/024488 JP2023024488W WO2024057678A1 WO 2024057678 A1 WO2024057678 A1 WO 2024057678A1 JP 2023024488 W JP2023024488 W JP 2023024488W WO 2024057678 A1 WO2024057678 A1 WO 2024057678A1
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WIPO (PCT)
Prior art keywords
thermally conductive
component
boron nitride
conductive composition
nitride particles
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PCT/JP2023/024488
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English (en)
Japanese (ja)
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片石拓海
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富士高分子工業株式会社
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Priority to JP2023552095A priority Critical patent/JP7426545B1/ja
Publication of WO2024057678A1 publication Critical patent/WO2024057678A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

Definitions

  • the present invention relates to a thermally conductive composition suitable for interposing between a heat generating element and a heat radiating element such as an electric component or an electronic component, and a thermally conductive sheet formed using the same.
  • thermally conductive grease is used to improve the adhesion between the heat radiator and the heat radiator, such as a semiconductor.
  • thermally conductive grease has a property of not only high thermal conductivity but also the ability to prevent grease from dripping from between the heating element and the heat radiating element (referred to as ⁇ drop resistance''). is required.
  • Patent Document 1 describes a thermally conductive filler, a polyorganosiloxane resin containing at least one polysiloxane having one curable functional group in the molecule, and a siloxane compound having an alkoxysilyl group and a linear siloxane structure.
  • a composition comprising: Patent Document 2 proposes a thermally conductive silicone composition that includes liquid silicone, a thermally conductive filler, and hydrophobic spherical silica particles, and has improved heat dissipation.
  • Patent Document 3 proposes a thermally conductive silicone composition containing aluminum nitride and alumina having a specific particle size.
  • Patent Documents 4 and 5 propose thermally conductive compositions containing boron nitride and alumina having a specific particle size.
  • the thermally conductive composition of the above-mentioned patent document tends to have a high viscosity, and when the composition is kneaded to form a compound, a strong shearing force is generated, and the shearing force causes large-sized aggregated particles to break up. There was a problem with this. Furthermore, if aggregated particles having a small particle diameter are used to prevent the aggregated particles from breaking, there is a problem in that it is difficult to form a heat conduction path and the thermal conductivity becomes low.
  • the present invention aims to achieve low viscosity when kneading a composition (mixture of constituent components) to form a compound, good kneading workability, and agglomerates with relatively large particle diameters.
  • a thermally conductive composition that facilitates the formation of a good thermally conductive path by particles and can have high thermal conductivity, and a thermally conductive sheet formed using the same.
  • the present invention provides: A thermally conductive composition comprising an organopolysiloxane and a thermally conductive filler, As component A, 100 parts by mass of the addition reaction-curing organopolysiloxane having a kinematic viscosity of 100 to 3,000 mm 2 /s at 25° C.; As component B, 60 to 150 parts by mass of spherical agglomerated boron nitride particles, The C component is amorphous alumina particles with a center particle size D50 of 0.1 to 1 ⁇ m, and some or all of them are R a Si(OR') 4-a (where R is an unsubstituted alumina particle having 8 to 12 carbon atoms).
  • the B component and the C component are the thermally conductive filler
  • the spherical agglomerated boron nitride particles are Spherical agglomerated boron nitride particles (B1) with a central particle diameter D50 of 10 ⁇ m or more and 30 ⁇ m or less, Spherical agglomerated boron nitride particles (B2) having a center particle diameter D50 that is twice or more that of the spherical agglomerated boron nitride particles (B1) and a center particle diameter D50 of more than 30 ⁇ m and less than 100 ⁇ m,
  • the present invention relates to a thermally conductive composition in which the ratio (B2/B1) of the amount of spherical
  • the present invention relates to a thermally conductive sheet in which the thermally conductive composition of the present invention is molded into a sheet shape and cured.
  • the present invention provides a thermally conductive composition containing an organopolysiloxane and a thermally conductive filler, wherein the A component is an addition reaction-curable organopolymer having a kinematic viscosity of 100 to 3,000 mm 2 /s at 25°C.
  • amorphous alumina particles with a center particle diameter D50 of 0.1 to 1 ⁇ m as component C, some or all of which are R a Si(OR') 4-a (wherein, R is an unsubstituted or substituted organic group having 8 to 12 carbon atoms, R' is an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1); Contains 120 to 240 parts by mass of amorphous alumina particles whose surface has been treated with a silane compound or a partially hydrolyzed product thereof.
  • the B component and the C component are the thermally conductive fillers.
  • the spherical agglomerated boron nitride particles include spherical agglomerated boron nitride particles (B1) with a center particle size D50 of 10 ⁇ m or more and 30 ⁇ m or less, and a center particle size D50 that is at least twice that of the spherical agglomerate boron nitride particles (B1), and Spherical agglomerated boron nitride particles (B2) having a particle size D50 of more than 30 ⁇ m and less than 100 ⁇ m.
  • the ratio (B2/B1) of the blending amount of the spherical agglomerated boron nitride particles (B2) to the blending amount of the spherical agglomerated boron nitride particles (B1) is 1.00 to 3.00. Therefore, the viscosity when kneading the mixture of constituent components to form a compound is low, so the workability of kneading is good, and it is easy to form a thermal conductive path by agglomerated particles with a relatively large particle size, making it a thermally conductive sheet. It is possible to provide a thermally conductive composition that can increase the thermal conductivity of. Further, by using the thermally conductive composition of the present invention, a thermally conductive sheet with high thermal conductivity can be provided.
  • FIGS. 1A and 1B are explanatory diagrams showing a method for measuring the thermal conductivity of a sample in one embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing a method of using a thermally conductive sheet in an embodiment of the present invention.
  • the thermally conductive composition of the present invention is a thermally conductive composition containing an organopolysiloxane and a thermally conductive filler (also called “thermally conductive particles”), and contains the following components A, B, and C. include.
  • Component A Addition reaction-curing organopolysiloxane with a kinematic viscosity of 100 to 3,000 mm 2 /s
  • Component B Spherical agglomerated boron nitride particles (thermally conductive filler)
  • Component C Amorphous alumina particles with a central particle diameter D50 of 0.1 to 1 ⁇ m, partially or entirely R a Si(OR') 4-a (where R is unsubstituted or unsubstituted alumina having 8 to 12 carbon atoms).
  • the addition reaction curing type organopolysiloxane has a kinematic viscosity of 100 to 3,000 mm 2 /s.
  • the kinematic viscosity is the kinematic viscosity at 25°C.
  • Addition reaction curing organopolysiloxane is generally a two-part mixture of parts A and B, with one part containing a platinum-based catalyst and the other part containing a crosslinking agent. . Many commercially available products are also available.
  • the kinematic viscosity at 25°C of Part A and the kinematic viscosity of Part B at 25°C are both 100 to 3,000 mm 2 /s, and
  • the preferable kinematic viscosity range of liquid B is also the same as above.
  • the thermally conductive composition of the present invention contains 60 to 150 parts by mass of spherical agglomerated boron nitride particles, which is component B, per 100 parts by mass of component A.
  • Component B is a thermally conductive filler.
  • the content of component B in the thermally conductive composition of the present invention is preferably 65 to 140 parts by mass, more preferably 70 to 130 parts by mass, even more preferably 75 parts by mass, based on 100 parts by mass of component A. ⁇ 120 parts by mass.
  • the spherical agglomerated boron nitride particles include spherical agglomerated boron nitride particles (B1) with a center particle size D50 of 10 ⁇ m or more and 30 ⁇ m or less, and spherical agglomerate boron nitride particles (B1) with a center particle size D50 of 2 times or more of B1 and a center particle size D50 of more than 30 ⁇ m. It consists of spherical agglomerated boron nitride particles (B2) of 100 ⁇ m or less.
  • the ratio (B2/B1) of the blending amount of the spherical agglomerated boron nitride particles (B2) to the blending amount of the spherical agglomerated boron nitride particles (B1) is 1.00 to 3.00.
  • the blending ratio (B2/B1) is preferably 1.20 to 2.80, more preferably 1.40 to 2.60, and still more preferably 1.60 to 2.40.
  • spherical agglomerated boron nitride particles (B1) for example, the product name "PTX25” manufactured by Momentive can be used
  • spherical agglomerated boron nitride particles (B2) for example, the product name "PTX60” manufactured by Momentive can be used.
  • the catalogs for "PTX25” and "PTX60” are available from the Internet URL: https://www.tomo-e.co.jp/upload/newsJA/29SVF8R-newsJA_content-012.pdf.
  • the C component is an amorphous alumina particle with a center particle diameter D50 of 0.1 to 1 ⁇ m, and the amorphous alumina particle is partially or entirely R a Si(OR') 4-a (However, R is an unsubstituted or substituted organic group having 8 to 12 carbon atoms, R' is an alkyl group having 1 to 4 carbon atoms, and a is surface-treated with an alkoxysilane compound represented by 0 or 1) or a partial hydrolyzate thereof. .
  • Component C is a thermally conductive filler.
  • the thermally conductive composition of the present invention contains 120 to 240 parts by mass of component C per 100 parts by mass of component A.
  • the content of component C in the thermally conductive composition of the present invention is preferably 130 to 230 parts by mass, more preferably 140 to 225 parts by mass, and still more preferably 150 to 220 parts by mass, based on 100 parts by mass of component A. Part by mass.
  • amorphous alumina particles of the C component for example, "AKP-30” manufactured by Sumitomo Chemical Co., Ltd. can be used.
  • the catalog for "AKP-30" can be obtained from the Internet URL: https://www.sumitomo-chem.co.jp/products/files/docs/a06008.pdf.
  • the thermally conductive composition of the present invention contains thermally conductive fillers having different central particle sizes. Therefore, the presence of small particles with a relatively small center particle size between large particles with a relatively large center particle size allows the thermally conductive filler to fill in a close-packed state, resulting in a thermally conductive composition.
  • the thermal conductivity of objects can be increased.
  • the particle diameter of the thermally conductive filler is measured by a laser diffraction light scattering method, and D50 (median diameter) of the volume-based cumulative particle size distribution is measured as the central particle diameter D50.
  • An example of this measuring device is a laser diffraction/scattering particle size distribution measuring device LA-950S2 manufactured by Horiba, Ltd.
  • the thermally conductive composition further contains R a Si(OR') 4-a (where R is an unsubstituted or substituted organic group having 8 to 12 carbon atoms, and R' is an unsubstituted or substituted organic group having 1 to 4 carbon atoms) as a viscosity modifier. It is preferable to contain 0.1 to 10 parts by mass of an alkoxysilane compound represented by an alkyl group (a is 0 or 1) or a partial hydrolyzate thereof. Thereby, the viscosity when kneading the composition (mixture of constituent components) to form a compound can be lowered.
  • the thermally conductive filler is R a Si(OR') 4-a (where R is an unsubstituted or substituted organic group having 8 to 12 carbon atoms, R' is an alkyl group having 1 to 4 carbon atoms, and a is 0 or
  • the surface is pretreated with an alkoxysilane compound shown in 1) or a partial hydrolyzate thereof. This allows the viscosity of the composition to be lowered.
  • amorphous alumina particles having a center particle diameter D50 of 0.1 to 1 ⁇ m be subjected to surface pretreatment.
  • alkoxysilane compound examples include octyltrimethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, decyltriethoxysilane, dodecyltrimethoxysilane, and dodecyltriethoxysilane.
  • the alkoxysilane compounds may be used alone or in combination of two or more.
  • a surface treatment agent an alkoxysilane compound and one-terminated silanol siloxane may be used in combination.
  • the surface treatment referred to here includes adsorption in addition to covalent bonding. When surface-treated, the thermally conductive filler has good miscibility with the matrix resin.
  • the alkoxysilane compound is mixed with the thermally conductive filler in advance, and the thermally conductive filler is pretreated with the alkoxysilane compound. It is preferable to add 0.01 to 10 parts by mass of the alkoxysilane compound to 100 parts by mass of the thermally conductive filler.
  • Surface treatment of the thermally conductive filler with an alkoxysilane compound has the effect of making it easier to fill the matrix resin with the thermally conductive filler.
  • Component A is preferably a mixture of an organopolysiloxane having a kinetic viscosity of 400 mm2 /s or more and an organopolysiloxane having a kinetic viscosity of less than 400 mm2 /s, which ensures low viscosity when the composition (mixture of constituent components) is kneaded to form a compound, and also improves workability during kneading.
  • the thermal conductivity of the cured product of the thermally conductive composition is preferably 3.0 W/mK or more and 10.0 W/m K or less, more preferably 3.5 W/mK or more and 10.0 W/m K or less, More preferably, it is 3.5 W/m ⁇ K or more and 9.5 W/m ⁇ K or less, and still more preferably 4.0 W/m ⁇ K or more and 9.0 W/m ⁇ K or less.
  • TIM thermal interface material
  • the specific gravity of the thermally conductive composition is preferably 2.2 or less.
  • the low specific gravity is useful for electronic devices such as personal computers and mobile phones.
  • the thermally conductive composition of the present invention may contain components other than the components A to C and the viscosity modifier, if necessary.
  • heat resistance improvers such as red iron oxide, titanium oxide, and cerium oxide, flame retardants, and flame retardant aids may be added.
  • Organic or inorganic particle pigments may be added for the purpose of coloring or toning.
  • an alkoxy group-containing silicone may be added as a material added for the purpose of surface treatment of the thermally conductive filler.
  • the present invention is a thermally conductive sheet obtained by molding the thermally conductive composition of the present invention into a sheet shape and then curing it. Further, in one embodiment, the present invention is a method for producing a thermally conductive sheet, which includes forming the thermally conductive composition of the present invention into a sheet shape and then curing it.
  • the thermally conductive composition of the present invention when formed into a sheet and cured, is suitable as a thermal interface material (TIM).
  • the sheet forming method may be a rolling method or a press molding method (mold clamping method). Curing is done after sheet forming.
  • Sheet forming is preferably carried out by sandwiching and rolling the thermally conductive composition in the form of a compound between polyethylene terephthalate (PET) films, and curing is preferably carried out by heating at 80 to 150°C for 10 to 120 minutes.
  • the thermal conductivity of the thermally conductive sheet (cured product) is preferably 3.0 W/mK or more and 10.0 W/m K or less, more preferably 3.5 W/mK or more and 10.0 W/m K or less, and Preferably it is 3.5 W/m ⁇ K or more and 9.5 W/m ⁇ K or less, and even more preferably 4.0 W/m ⁇ K or more and 9.0 W/m ⁇ K or less.
  • the present invention also relates to the use of the thermally conductive sheet of the present invention, in which the thermally conductive sheet of the present invention is interposed between a heat generating element and a heat radiating element.
  • the heating element include an electronic component such as a semiconductor element, or an electric component
  • examples of the heat radiator include a heat spreader, a heat sink, and the like.
  • Thermal conductive sheet 11b radiates heat generated by electronic components 13 such as semiconductor elements, is fixed to the main surface of heat spreader 12 facing electronic component 13, and is sandwiched between electronic component 13 and heat spreader 12. be done. Further, the thermally conductive sheet 11a is sandwiched between the heat spreader 12 and the heat sink 15. The thermally conductive sheets 11a and 11b together with the heat spreader 12 constitute a heat radiating member that radiates heat from the electronic component 13.
  • the heat spreader 12 includes, for example, a rectangular plate-like body having a main surface facing the electronic component 13, and a side wall erected along the outer periphery of the main surface of the rectangular plate-like body.
  • a heat conductive sheet 11b is arranged on the main surface of a rectangular plate-shaped body surrounded by side walls, and a heat sink 15 is provided on the opposite surface of the main surface via the heat conductive sheet 11a.
  • the electronic component 13 is, for example, a semiconductor element such as a BGA, and is mounted on the wiring board 14.
  • thermal conductivity of the thermally conductive composition was measured using a hot disc (according to ISO/CD 22007-2). As shown in FIG. 1A, this thermal conductivity measuring device 1 is constructed by sandwiching a polyimide film sensor 2 between two samples 3a and 3b, applying constant power to the sensor 2 to generate a constant amount of heat, and measuring the temperature rise value of the sensor 2. Analyze thermal properties.
  • the sensor 2 has a tip 4 with a diameter of 7 mm, and has a double spiral structure of electrodes, as shown in FIG. 1B, with an applied current electrode 5 and a resistance value electrode (temperature measurement electrode) 6 arranged at the bottom. has been done.
  • the thermal conductivity is calculated using the following formula (Equation 1).
  • thermally conductive sheet (cured product) was used for samples 3a and 3b.
  • the kinematic viscosity is the kinematic viscosity at 25° C. measured by an Ubbelohde viscometer, including the catalog values of Examples.
  • ⁇ Workability during production of thermally conductive composition (compound)> By adding other additives to the organopolysiloxane and thermally conductive filler and mixing them using a kneader (Hibismix 2P-1 model, manufactured by PRIMIX Co., Ltd.) so as to have the composition shown in Table 1. , a thermally conductive composition (compound) is produced. The workability at this time was judged by the following evaluation.
  • A When stirring is performed at a rotational speed of 25 rpm, the time required from the start of stirring to the completion of compounding and stirring is within 30 minutes. Since stirring can be completed in a short time, aggregated particles are less likely to break up.
  • B When stirring was performed at a rotational speed of 25 rpm, the time required from the start of stirring to the completion of compounding and stirring was 31 minutes or more. Long-term stirring is required, and aggregated particles tend to break up. When the composition (mixture of constituent components) is kneaded to form a compound, the viscosity is high and kneading for a long time is required, so the aggregated particles are easily broken and the thermal conductivity is low.
  • C When stirring is performed at a rotation speed of 25 rpm, the composition (mixture of constituent components) does not become a compound that can be easily molded into a thermally conductive sheet (silicone gel sheet).
  • Examples 1 to 3 1.
  • Raw material component (A component) (1) Addition reaction curing type organopolysiloxane A liquid (trade name "CF5036A” manufactured by Dow-Toray) with a kinematic viscosity of 450 mm 2 /s at 25°C and an addition reaction with a kinematic viscosity of 350 mm 2 /s at 25°C
  • a curable organopolysiloxane liquid B (trade name "CF5036B” manufactured by Dow Toray Industries, Inc.) was used.
  • Viscosity modifier decyltrimethoxysilane was used. 2. Mixing method The organopolysiloxane liquid A, the organopolysiloxane liquid B, a thermally conductive filler, and a viscosity modifier were mixed to form a thermally conductive composition (compound). This compound was sandwiched between polyester (PET) films and rolled through rolls to form a sheet, and then heated at 100° C. for 310 minutes to obtain a cured silicone sheet (thermally conductive sheet). The thickness of the obtained cured silicone sheet was 2 mm.
  • PET polyester
  • thermoly conductive composition compound
  • a thermally conductive sheet were produced in the same manner as in Example 1, except that each component was added in the amounts shown in Table 1.
  • Table 1 The compositions and evaluation results of the thermally conductive compositions of Examples 1 to 3 and Comparative Examples 1 to 5 are summarized in Table 1 below.
  • the thermally conductive composition of the present invention is suitable as a thermally conductive material (thermal interface material) interposed between a heat generating body and a heat radiating body of electric/electronic parts, etc.

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Abstract

Une composition thermoconductrice selon la présente invention contient : en tant que composant A, 100 parties en masse d'un organopolysiloxane durcissable par addition qui présente une viscosité cinématique variant de 100 à 3000 mm2/s à 25 °C ; en tant que composant B, 60 à 150 parties en masse de particules de nitrure de bore agrégées sphériques ; et, en tant que composant C, 120 à 240 parties en masse de particules d'alumine amorphe qui présentent un diamètre médian D50 variant de 0,1 à 1 µm, et dont une partie ou la totalité sont traitées en surface avec un composé alcoxysilane qui est représenté par la formule RaSi(OR')4-a (où R représente un groupe organique non substitué ou substitué comportant 8 à 12 atomes de carbone ; R' représente un groupe alkyle comportant 1 à 4 atomes de carbone ; et a est égal à 0 ou 1) ou un produit d'hydrolyse partielle du composé alcoxysilane. Les particules de nitrure de bore agrégées sphériques comprennent : des particules de nitrure de bore agrégées sphériques (B1) qui présentent un diamètre médian D50 variant de 10 à 30 µm ; et des particules de nitrure de bore agrégées sphériques (B2) qui présentent un diamètre médian D50 supérieur à 30 µm, mais inférieur ou égal à 100 µm, le diamètre médian D50 n'étant pas inférieur à deux fois le diamètre médian D50 des particules B1.
PCT/JP2023/024488 2022-09-15 2023-06-30 Composition thermoconductrice WO2024057678A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011144234A (ja) * 2010-01-13 2011-07-28 Denki Kagaku Kogyo Kk 熱伝導性樹脂組成物
JP2015006980A (ja) * 2013-05-27 2015-01-15 三菱化学株式会社 窒化ホウ素凝集粒子、凝集ｂｎ粒子含有樹脂組成物及び放熱シート
WO2021187609A1 (fr) * 2020-03-19 2021-09-23 デンカ株式会社 Feuille de dissipation de chaleur et méthode de fabrication d'une feuille de dissipation de chaleur
JP7015424B1 (ja) * 2021-01-25 2022-02-02 富士高分子工業株式会社 熱伝導性シリコーングリース組成物及びその製造方法
JP7047199B1 (ja) * 2021-04-08 2022-04-04 富士高分子工業株式会社 熱伝導性グリース組成物
WO2022158029A1 (fr) * 2021-01-25 2022-07-28 富士高分子工業株式会社 Composition de graisse de silicone thermoconductrice et procédé de production associé

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011144234A (ja) * 2010-01-13 2011-07-28 Denki Kagaku Kogyo Kk 熱伝導性樹脂組成物
JP2015006980A (ja) * 2013-05-27 2015-01-15 三菱化学株式会社 窒化ホウ素凝集粒子、凝集ｂｎ粒子含有樹脂組成物及び放熱シート
WO2021187609A1 (fr) * 2020-03-19 2021-09-23 デンカ株式会社 Feuille de dissipation de chaleur et méthode de fabrication d'une feuille de dissipation de chaleur
JP7015424B1 (ja) * 2021-01-25 2022-02-02 富士高分子工業株式会社 熱伝導性シリコーングリース組成物及びその製造方法
WO2022158029A1 (fr) * 2021-01-25 2022-07-28 富士高分子工業株式会社 Composition de graisse de silicone thermoconductrice et procédé de production associé
JP7047199B1 (ja) * 2021-04-08 2022-04-04 富士高分子工業株式会社 熱伝導性グリース組成物

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