WO2024055621A1 - 有机发光显示面板、显示装置以及显示面板的封装方法 - Google Patents

有机发光显示面板、显示装置以及显示面板的封装方法 Download PDF

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Publication number
WO2024055621A1
WO2024055621A1 PCT/CN2023/095088 CN2023095088W WO2024055621A1 WO 2024055621 A1 WO2024055621 A1 WO 2024055621A1 CN 2023095088 W CN2023095088 W CN 2023095088W WO 2024055621 A1 WO2024055621 A1 WO 2024055621A1
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Prior art keywords
touch
binding pin
display panel
shielding
organic light
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Application number
PCT/CN2023/095088
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English (en)
French (fr)
Inventor
耿苗
袁海江
Original Assignee
惠科股份有限公司
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Publication of WO2024055621A1 publication Critical patent/WO2024055621A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/70—OLEDs integrated with inorganic light-emitting elements, e.g. with inorganic electroluminescent elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features

Definitions

  • the present application relates to the field of display technology, and in particular, to an organic light-emitting display panel, a display device, and a packaging method of the display panel.
  • organic electroluminescent displays (Organic Light-Emitting Diode, OLED for short) are displays made using organic electroluminescent diodes.
  • OLED product touch technology occupies a large market.
  • the technology for making touch sensing circuits on OLED covers is relatively mature.
  • the metal touch circuits bound to the touch area are formed on the cover.
  • uneven laser transmittance will lead to uneven sintering problems when encapsulating the packaging layer. This leads to problems such as overflow, bubbles, and cracks in the packaging layer, thus affecting the packaging effect and poor cutting.
  • the area containing the touch binding pins is laser-sintered by increasing the laser energy or reducing the moving speed of the laser head to slow down the problem of uneven sintering.
  • the laser energy is increased and the moving speed of the laser head is reduced, it cannot Precise control allows the energy increase to only exist in the touch binding pin area. Therefore, when the laser energy is increased and located in the normal area, the energy mutation causes the normal area to cause a sudden change in the shape of the packaging layer, making it more likely to cause cracks in the packaging layer, resulting in poor packaging.
  • the purpose of this application is to provide an organic light-emitting display panel, a display device, and a packaging method for a display panel that avoid uneven packaging and improve the packaging effect.
  • an organic light-emitting display panel which includes a cover plate, a substrate and an encapsulation layer.
  • the cover plate is arranged opposite to the substrate; the encapsulation layer is arranged between the cover plate and the substrate;
  • the organic light-emitting display panel further includes a touch circuit, the touch circuit is formed on the cover plate, and a touch binding pin is provided on an edge of the cover plate, and the touch binding pin is connected to the touch screen.
  • the control circuit is connected, and a plurality of shielding terminals are respectively provided on both sides of the touch binding pin; the touch binding pin and the shielding terminal are arranged corresponding to the packaging layer; wherein, a plurality of the shielding terminals
  • the length of the terminal is consistent with the length of the touch binding pin, and the width of the plurality of shielding terminals decreases in a direction away from the touch binding pin.
  • This application also discloses a display device, which includes an outer cover and an organic light-emitting display panel.
  • the outer cover is disposed on one side of the light-emitting surface of the organic light-emitting display panel.
  • This application also discloses a display panel packaging method for packaging organic light-emitting display panels, including the steps:
  • the encapsulation layer in the normal area is sintered according to the first preset laser energy and the first preset movement speed;
  • the laser energy is increased to sinter the packaging layer in the touch-binding pin area
  • a touch binding pin and a blocking terminal located on both sides of the touch binding pin are formed on the cover plate; the laser device is in a normal area, a buffer area and a touch binding pin area.
  • the laser sintering ratio is the same
  • multiple shielding terminals are provided on both sides of the touch binding pins.
  • the length of the multiple shielding terminals is consistent with the length of the touch binding pins, and in the direction away from the touch binding pins, the multiple shielding terminals are
  • the width of the shielding terminal decreases, so that when laser is being used, the energy change or movement speed of the laser head starts to be controlled in the area where the shielding terminal is set, and the shielding terminal whose width decreases in the direction away from the touch binding pin is used to make the shielding terminal
  • the existing area performs an energy buffering function to avoid a large gap caused by sudden changes in laser energy, so that the connection between the non-touch binding pin area and the touch binding pin area is easily caused by the large gap caused by energy mutation. The problem of uneven packaging.
  • Figure 1 is a block diagram structural diagram of the display device of the present application.
  • FIG. 2 is a schematic diagram of the organic light-emitting display panel of the present application.
  • Figure 3 is a schematic cross-sectional structural diagram along section line A-A’ in Figure 2;
  • Figure 4 is a schematic diagram of the arrangement of shielding terminals provided by the first embodiment of the present application.
  • Figure 5 is a schematic cross-sectional structural diagram of an organic light-emitting display panel provided by the second embodiment of the present application.
  • FIG. 6 is a flow chart of the display panel packaging method of the present application.
  • Figure 1 is a schematic block diagram of the display device of the present application.
  • Figure 2 is a schematic structural diagram of the organic light-emitting display panel of the present application.
  • Figure 3 is a schematic cross-sectional structural diagram of Figure 1 along the section line AA'.
  • Figure 4 is a schematic structural diagram of the touch screen of the present application.
  • the present application discloses a display device 10, which includes an outer cover 200 and an organic light-emitting display panel 100.
  • the outer cover 200 is disposed on the One side of the organic light-emitting display panel 100; specifically, with reference to Figures 2-3, it can be seen that the organic light-emitting display panel 100 includes a cover 110, a substrate 120 and an encapsulation layer 130.
  • the cover 110 is arranged opposite to the substrate 120; the encapsulation layer 130 is arranged between the cover 110 and the substrate 120; the organic light-emitting display panel 100 also includes a touch circuit 140, the touch circuit 140 is formed on the cover 110.
  • a touch binding pin 141 is provided on the edge of the cover 110.
  • the touch binding pin 141 is connected to the touch circuit 140.
  • the touch binding pin 141 is connected to the touch circuit 140.
  • a plurality of shielding terminals 150 are respectively provided on both sides of the fixed pin 141; wherein the length of the plurality of shielding terminals 150 is consistent with the length of the touch binding pin 141, and is located along a line away from the touch binding pin. In the direction of the legs 141, the widths of the shielding terminals 150 decrease gradually.
  • this application provides multiple shielding terminals 150 on both sides of the touch binding pins 141.
  • the length of the multiple shielding terminals 150 is consistent with the length of the touch binding pin 141, and the width of the multiple shielding terminals 150 decreases in the direction away from the touch binding pin 141. In this way, when laser processing is performed, the width of the multiple shielding terminals 150 decreases.
  • the area with the shielding terminal 150 can control the energy of the laser head to slowly increase or the laser head to slow down slowly.
  • the shielding terminal 150 whose width decreases in the direction away from the touch binding pin 141 is used to make the area where the shielding terminal 150 exists perform a
  • the energy buffering function prevents a large gap caused by sudden changes in laser energy, making the area where the non-touch binding pin 141 connects with the area of the touch binding pin 141 susceptible to damage due to a large gap in energy mutation. The problem of uneven packaging.
  • the encapsulation layer 130 is made of glass glue. Since the glass glue itself has a certain stability and poor fluidity, it is relatively easy to form when it is coated and encapsulated, and it can also deform after absorbing heat for adhesion and encapsulation. good. Of course, other suitable packaging materials can also be used for packaging, as long as the packaging effect and stability can be guaranteed.
  • the direction of the arrow in Figure 2 is the direction of the preset path of the laser head, and the direction of the arrow in Figure 3 is the irradiation direction of the laser light.
  • the area where the touch binding pin 141 is provided is In the touch binding pin area 180, the area with the shielding terminals 150 is the buffer area 170, and the area without the touch binding pins 141 and the shielding terminals 150 is the normal area 160.
  • the laser light travels along the display panel.
  • the normal area 160 , the buffer area 170 and the touch binding pin area 180 are sintered and packaged around the edge of the packaging layer 130 .
  • the organic light-emitting display panel has four sides, namely e, f, g and h.
  • the touch binding pins and the shielding terminals are extended and arranged in a direction parallel to e and g. That is their length, and the extension arrangement of the touch binding pins and the shielding terminals along the directions f and h is their width.
  • the width of the shielding terminal 150 is represented by a.
  • the adjacent shielding terminals 150 range from the side of the first shielding terminal 150 away from the second shielding terminal 150 to the side of the second shielding terminal 150 close to the second shielding terminal 150.
  • the distance between the sides of one shielding terminal 150 is represented by b, and the distance between two adjacent shielding terminals 150 is represented by c.
  • the width of the blocking terminal 150 adjacent to the touch binding pin 141 is equal to the width of the touch binding pin 141 ;
  • the spacing between pins 141 is equal, adjacent to the shielded terminals
  • the spacing between the adjacent touch binding pins 141 and the shielding terminals 150 is equal.
  • a plurality of the shielding terminals 150 are equal in distance.
  • the width of the terminal 150 decreases according to the first preset value. In this way, the arrangement spacing of the plurality of touch binding pins and the plurality of shielding terminals is equal and uniform. Among them, the first preset value is 10um.
  • a is gradually reduced according to the first preset value, for example: from the maximum Starting from the shielding terminal 150 close to the touch binding pin 141, adjacent to the shielding terminal 150, the first shielding terminal 150 is away from the side of the second shielding terminal 150 to the second shielding terminal 150 close to the first
  • the distance b between the sides of the first shielding terminal 150 is 250um
  • the width a of the first shielding terminal 150 is 130um
  • the distance c between the first shielding terminal 150 and the second shielding terminal 150 is 120um
  • b is the third The sum of the width of the two shielding terminals 150 plus the distance between the second shielding terminal 150 and the third shielding
  • the adjacent shielding terminals 150, b and a are arranged in a manner that the first preset value decreases at the same time. At this time, the edge is away from the touch binding. In the direction of the pins 141, the arrangement between every two adjacent shielding terminals 150 is uniform.
  • the laser light of the laser head performs laser encapsulation on the area of the encapsulation layer 130 according to the preset path, when it reaches the buffer area 170, at this time, two adjacent shielding terminals are blocked in the direction close to the touch binding pin 141.
  • the width of 150 gradually increases.
  • the laser energy of the laser head is a gradually and slowly increasing process, and due to the existence of the evenly arranged shielding terminals 150, when the laser head is moving, the laser light irradiates every place with the shielding terminals 150.
  • the energy of the area is almost the same, that is, the heat absorbed by the glass glue when the laser is illuminated is the same. Therefore, during the packaging process, the area of the non-touch binding pin will not be generated due to sudden changes in the energy of the laser illumination.
  • the energy gap is too large, causing uneven packaging; when the laser light reaches the area of the touch binding pin 141, the energy also increases according to the preset to reach the energy that can securely package the touch binding pin area 180. value, thus making the entire packaging process uniform and stable, avoiding the problem of uneven packaging.
  • the laser illumination energy of the control laser head gradually decreases. At this time, the energy is slowly reduced in the buffer area 170 to avoid energy sudden changes.
  • the situation may lead to sudden changes in the shape of the packaging layer 130, cracks and other problems, and the sealing ratio of each area of the entire packaging process should be made the same as much as possible to improve the overall packaging effect and make the packaging strength high.
  • the energy accumulation can also become larger because the moving time becomes longer.
  • the widths of the plurality of shielding terminals 150 can also be reduced according to the first preset value, and the widths of two adjacent shielding terminals 150 can also be reduced by the first preset value.
  • the pitch of 150 decreases by a second preset value, and the first preset value is equal to the second preset value. That is, a plurality of the shielding terminals 150 are arranged in descending order with the same preset value according to the width of the shielding terminal 150 and the spacing between two adjacent shielding terminals 150. At this time, a is based on the first preset value of 10um.
  • b is the width of the second shielding terminal 150 plus the second shielding terminal 150 and the third shielding terminal.
  • the shielding terminals 150 are arranged relatively densely, so one or two more shielding terminals 150 can be provided in the buffer area 170, and the arrangement of the multiple shielding terminals 150 in a descending manner is relatively uniform, which can also make the A more uniform encapsulation effect can be achieved during laser illumination.
  • the widths of the plurality of shielding terminals 150 decrease according to the first preset value, and the spacing between two adjacent shielding terminals 150 decreases according to the second preset value.
  • the value increases, and the first preset value is equal to the second preset value, a plurality of the shielding terminals 150 can also be arranged in a decreasing width.
  • the spacing between each two shielding terminals 150 is relatively wide, that is, the plurality of shielding terminals 150 are arranged sparsely.
  • the laser illumination passes through each two shielding terminals 150 and shines on the packaging layer 130 There is more energy, and the encapsulation effect with the cover 110 and the substrate 120 is relatively better after being absorbed by the encapsulation layer 130. Since the shielding terminals 150 are still arranged in descending order in the direction away from the touch binding pin 141, they cooperate with the laser head. Finally, the energy or moving speed of the laser head can still be controlled to achieve better packaging uniformity.
  • the material of the blocking terminal 150 is the same as the material of the touch binding pin 141 , and the thickness of the blocking terminal 150 is equal to the thickness of the touch binding pin 141 .
  • the same materials can be made using the same process, thereby saving materials and reducing the manufacturing process; and using the same thickness makes the transmittance of the laser light of the shielding terminal 150 and the touch binding pin 141 consistent when the laser is irradiated, thus preventing the transmission of laser light.
  • the uneven pass rate causes the encapsulation layer 130 to absorb different amounts of light heat, causing uneven encapsulation of the encapsulation layer 130 .
  • the shielding terminal 150 can be made of metal material. Since the touch binding pin 141 is generally made of metal material, the uniformity of light blocking can be achieved, and it is relatively better to increase the energy during laser illumination. Control, just increase the energy in the same proportion.
  • the shielding terminal 150 can also be made of a black matrix, a transparent electrode, or a color resist material. In this case, the material of the shielding terminal 150 is different from the material of the touch binding pin 141, which is beneficial to the device's touch control. Control the detection and identification of bound pin area 180, buffer area 170 and normal area 160 for better control The speed or energy of the laser head movement, thereby making the packaging better.
  • the organic light-emitting display panel 100 further includes an inorganic layer 190.
  • the inorganic layer 190 is disposed between the encapsulation layer 130 and the substrate 120. After the inorganic layer 190 is first formed on the substrate 120, It is also possible to apply the encapsulation layer 130 again.
  • Figure 4 is a schematic diagram of the arrangement of shielding terminals provided by the second embodiment of the present application. As shown in Figure 4, the difference between this embodiment and the first embodiment is that the ones closest to the touch binding pins 141 The side of the shielding terminal 150 close to the touch binding pin 141 is a slope 151, that is, the shielding terminal 150 has a triangular structure.
  • the shielding terminal 150 is made of metal material
  • the metal material itself has a light-blocking effect and also has a certain light-reflecting effect
  • the side close to the touch binding pin 141 is used as the slope 151, which can Properly reflect part of the laser light, and reflect part of the laser light from the bevel 151 to the packaging layer 130 corresponding to the touch binding pin area 180, so that the packaging layer 130 at this location can absorb more laser light heat, thereby increasing the heat at this location.
  • the packaging adhesion of the packaging layer 130 achieves ideal packaging uniformity.
  • the angle between the inclined surface 151 and the side of the cover plate is d, and the slope of the inclined surface 151 is greater than or equal to 45° and less than 90°, that is, 45° ⁇ d ⁇ 90°.
  • the slope of the slope 151 is larger, the amount of laser light that can be reflected to the touch binding pin area 180 will be relatively larger, and at this time, because of the existence of the slope 151, the laser light can be reflected to the touch binding pin area 180 .
  • the fixed pin 141 is then reflected and refracted into the area corresponding to the touch binding pin 141 .
  • a reflective material can also be provided on the slope 151, so that in accordance with the slope of the slope 151, more laser light energy is reflected to the packaging layer 130 corresponding to the touch binding pin area 180. This enables the encapsulation layer 130 in this area to absorb more laser light energy, thereby improving the encapsulation adhesion of the encapsulation layer 130 in this area.
  • the shielding terminal 150 When the shielding terminal 150 is made of a black matrix, a transparent electrode, or a color resist material, the light transmittance of the slope 151 can be reduced along the slope direction of the slope 151 , that is, the closer the slope 151 is to the cover 110 , the smaller the slope is. 151, the light transmittance of the shielding terminal 150 is lower. In this way, the light transmittance is designed differently, and the energy absorption at this position during laser illumination can also be processed uniformly, so that the energy mutation at this position is also a process of gradual increase or decrease, so that it is not easy to cause energy mutation at this position. If it is too large, the shape of the encapsulation layer 130 will suddenly suddenly change seriously, affecting the encapsulation effect.
  • the thickness of the shielding terminal 150 can be set to be relatively thicker than the thickness of the touch binding pin 141, thereby enhancing the light-blocking ability of the shielding terminal 150.
  • the laser light energy absorbed by the buffer area 170 is consistent with the touch binding pin area 180 and the normal area 160, so as to avoid a sudden change in the shape of the packaging layer 130.
  • the shielding terminal 150 closest to the touch binding pin 141 can also be another structure with a slope 151.
  • the slope 151 can be arc-shaped, and the arc-shaped arc surface faces The touch binding pin 141 is conducive to the reflection of laser light; or the shielding terminal 150 can also be a rectangular structure with a slope 151, which can be set according to the actual situation and at the same time coordinate with the energy or movement of the laser light from the laser head speed to achieve better packaging uniformity sex.
  • Figure 6 is a schematic flowchart of the packaging method of the display panel of the present application. As shown in Figure 6, the present application also discloses a packaging method of the display panel, which is used to package the organic light-emitting display panel as described above, including the steps:
  • S2 Use laser equipment to perform laser sintering on the packaging layer of the display panel according to the preset path;
  • a touch binding pin and a blocking terminal located on both sides of the touch binding pin are formed on the cover plate; the laser device is in a normal area, a buffer area and a touch binding pin area.
  • the laser sintering ratio of the area is the same, so that the packaging area of the display panel is evenly packaged after packaging.
  • step 5 the moving speed of the laser head can also be reduced and cooperated with the light-shielding terminal to achieve better packaging effect and good uniformity.
  • the laser energy can also be changed at the same time as the moving speed of the laser head.
  • inventive concept of the present application can be formed into many embodiments, but the length of the application document is limited and cannot be listed one by one. Therefore, on the premise that there is no conflict, there may be differences between or among the above-described embodiments.
  • Technical features can be arbitrarily combined to form new embodiments, and the combination of each embodiment or technical feature will enhance the original technical effect.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种有机发光显示面板(100)、显示装置(10)以及显示面板的封装方法，有机发光显示面板(100)包括盖板(110)、基板(120)、封装层(130)和触控线路(140)，盖板(110)的边缘设置有触控绑定引脚(141)，触控绑定引脚(141)与触控线路(140)连接，触控绑定引脚(141)的两侧分别设多个遮挡端子(150)；触控绑定引脚(141)和遮挡端子(150)与封装层(130)对应设置。

Description

有机发光显示面板、显示装置以及显示面板的封装方法
本申请要求于2022年09月13日提交中国专利局，申请号为CN202211111292.7，申请名称为“有机发光显示面板、显示装置以及显示面板的封装方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种有机发光显示面板、显示装置以及显示面板的封装方法。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术；有机电致发光显示器(Organic Light-Emitting Diode，简称OLED)是利用有机电致发光二极管制成的显示器。
现今OLED产品触控技术占据较大市场。其中OLED盖板上做触控传感线路技术较为成熟。目前触摸电容屏做在封装上的技术中，触摸区绑定的金属触控线路形成在盖板上，对于硬屏在封装层封装时会造成激光透过率不均导致烧结不均问题，从而导致封装层溢宽、气泡、裂纹等问题，从而影响封装效果及切割不良等。
目前通过提高镭射能量或降低激光头移动速度对含有触控绑定引脚区域进行镭射烧结，以减缓烧结不均的问题，但提高镭射能量落在将激光头的移动速度作降速的话，不能精准控制使能量增加只存在于触控绑定引脚区域，因此当提高镭射能量位于正常区域时，能量突变使正常区域会形成封装层形貌突变，更易出现封装层裂纹问题，造成封装不良。
发明内容
本申请的目的是提供一种避免封装不均，且提升封装效果的有机发光显示面板、显示装置以及显示面板的封装方法。
本申请公开了一种有机发光显示面板,包括盖板、基板和封装层，所述盖板与所述基板相对设置；所述封装层设置在所述盖板与所述基板之间；所述有机发光显示面板还包括触控线路，所述触控线路形成在所述盖板上，所述盖板的边缘设置有触控绑定引脚，所述触控绑定引脚与所述触控线路连接，所述触控绑定引脚的两侧分别设多个遮挡端子；所述触控绑定引脚和所述遮挡端子与所述封装层对应设置；其中，多个所述遮挡端子的长度与所述触控绑定引脚的长度一致，且沿远离所述触控绑定引脚的方向，多个所述遮挡端子的宽度递减。
本申请还公开了一种显示装置，包括外盖板以及有机发光显示面板，所述外盖板设置在所述有机发光显示面板的发光面的一侧。
本申请还公开了一种显示面板的封装方法，用于有机发光显示面板的封装，包括步骤：
在盖板和基板之间，对应边缘位置涂布封装层；
采用镭射设备对显示面板的封装层按照预设路径进行镭射烧结；
当检测到镭射设备移动到正常区域时，按照第一预设镭射能量和第一预设移动速度，对正常区域的封装层进行烧结；
当检测到镭射设备移动到缓冲区域时，逐步提高镭射能量和/或逐渐降低移动速度，对缓冲区域的封装层进行烧结；以及
当检测到镭射设备移动到触控绑定引脚区域时，提高镭射能量，对触控绑定引脚区域的封装层进行烧结；
其中，在所述盖板上形成有触控绑定引脚以及位于所述触控绑定引脚两侧的遮挡端子；所述镭射设备在正常区域，缓冲区域和触控绑定引脚区域的镭射烧结比相同
本申请通过在触控绑定引脚的两侧设多个遮挡端子，多个遮挡端子的长度与触控绑定引脚的长度一致，且沿远离触控绑定引脚的方向，多个遮挡端子的宽度递减，这样在进行激光镭射时，在设置有遮挡端子的区域开始控制激光头能量变化或移动速度，利用沿远离触控绑定引脚的方向宽度递减的遮挡端子，使遮挡端子存在的区域进行一个能量缓冲作用，避免激光能量突变产生落差较大，使非触控绑定引脚的区域与触控绑定引脚区域的相接处，容易因能量突变的落差太大产生封装不均的问题。
附图说明
图1是本申请的显示装置的框图结构示意图；
图2是本申请的有机发光显示面板的示意图；
图3是图2沿截面线A-A’的截面结构示意图；
图4是本申请第一实施例提供的遮挡端子的排布示意图；
图5是本申请第二实施例提供的有机发光显示面板的截面结构示意图；
图6是本申请的显示面板的封装方法的流程图。
具体实施方式
图1是本申请的显示装置的框图示意图，图2是本申请的有机发光显示面板的结构示意图，图3是图1沿截面线A-A’的截面结构示意图，图4是本申请的触控绑定引脚和遮挡端子的排布示意图，如图1所示，本申请公开了一种显示装置10，包括外盖板200以及有机发光显示面板100，所述外盖板200设置在所述有机发光显示面板100的一侧；具体的，结合图2-图3可知，所述有机发光显示面板100包括盖板110、基板120和封装层130，所述 盖板110与所述基板120相对设置；所述封装层130设置在所述盖板110与所述基板120之间；所述有机发光显示面板100还包括触控线路140，所述触控线路140形成在所述盖板110上，所述盖板110的边缘设置有触控绑定引脚141，所述触控绑定引脚141与所述触控线路140连接，所述触控绑定引脚141的两侧分别设多个遮挡端子150；其中，多个所述遮挡端子150的长度与所述触控绑定引脚141的长度一致，且沿远离所述触控绑定引脚141的方向，多个所述遮挡端子150的宽度递减。
相对于通过提高镭射能量或降低激光头移动速度对含有触控绑定引脚区域180进行镭射烧结的方案来说，本申请在触控绑定引脚141的两侧设多个遮挡端子150，多个遮挡端子150的长度与触控绑定引脚141的长度一致，且沿远离触控绑定引脚141的方向，多个遮挡端子150的宽度递减，这样在进行激光镭射时，在设置有遮挡端子150的区域开始能够控制激光头能量缓慢增加或激光头进行缓慢降速，利用沿远离触控绑定引脚141的方向宽度递减的遮挡端子150，使遮挡端子150存在的区域进行一个能量缓冲作用，避免激光能量突变产生落差较大，使非触控绑定引脚141的区域与触控绑定引脚141的区域的相接处容易因能量突变的落差太大所带来的封装不均的问题。
其中，所述封装层130为玻璃胶，由于玻璃胶本身具有一定的稳固性，且流动性差，涂布封装的时候本身就比较容易成形，而且吸收热量后也能够发生形变进行粘贴吸附，封装效果好。当然也可以采用其它适合的封装料来进行封装，能够保证封装效果以及稳固性即可。
下面参考附图和可选的实施例对本申请作详细说明。
实施例一：
图2中箭头的方向为激光头的预设路径的方向，图3中箭头的方向为镭射光的照射方向，结合图2-图3所示，设置有触控绑定引脚141的区域为触控绑定引脚区域180，设置有遮挡端子150的区域为缓冲区域170，没有触控绑定引脚141和遮挡端子150的区域则为正常区域160，封装时，镭射光照沿显示面板的正常区域160、缓冲区域170和触控绑定引脚区域180，绕封装层130的边缘一圈进行烧结封装。
如图2所示，所述有机发光显示面板有四条边，分别为e、f、g和h，所述触控绑定引脚和所述遮挡端子沿与e和g平行的方向延伸排布即为它们的长度，所述触控绑定引脚和所述遮挡端子沿f和h的方向延伸排布即为它们的宽度。
如图4所示，所述遮挡端子150的宽度用a表示，相邻所述遮挡端子150，第一个遮挡端子150远离第二个遮挡端子150的侧边到第二个遮挡端子150靠近第一个遮挡端子150的侧边的间距用b表示，相邻的两个所述遮挡端子150之间的间距用c表示。
如图3所示，与所述触控绑定引脚141相邻的所述遮挡端子150的宽度，等于所述触控绑定引脚141的宽度；相邻的所述触控绑定引脚141之间的间距相等，相邻的所述遮挡端子 150之间的间距相等，相邻的所述触控绑定引脚141与所述遮挡端子150之间的间距相等，沿远离所述触控绑定引脚141的方向，多个所述遮挡端子150的宽度按第一预设值递减。这样多个所述触控绑定引脚和多个所述遮挡端子的排布间距都是相等的、均匀的。其中，第一预设值为10um。即沿远离所述触控绑定引脚141的方向，在相邻的两个遮挡端子150的间距c不变的情况下，同时将a按第一预设值逐渐减小，例如：从最靠近所述触控绑定引脚141的遮挡端子150开始,相邻所述遮挡端子150，第一个遮挡端子150远离第二个遮挡端子150的侧边到第二个遮挡端子150靠近第一个遮挡端子150的侧边的间距b为250um，第一个遮挡端子150的宽度a为130um，第一个遮挡端子150和第二个遮挡端子150之间的间距c为120um，那么此时a按第一预设值10um减小，即第二个遮挡端子150的宽度a为130um-10um＝120um，第三个遮挡端子150的宽度a为120um-10um＝110um，那么此时b即为第二个遮挡端子150的宽度加上第二个遮挡端子150和第三个遮挡端子150的间距之和，即120um+120um＝240um，也就是第二个遮挡端子150到第三个遮挡端子150的间距b为250um-10um＝240um，以此类推，相邻的所述遮挡端子150，b和a同时按第一预设值减小的方式排布设置，此时沿远离所述触控绑定引脚141的方向，每两个相邻的遮挡端子150之间的排布等比均匀的。
当激光头的镭射光照按照的预设路径对封装层130的区域进行镭射封装时，到达缓冲区域170时，此时沿靠近所述触控绑定引脚141的方向，相邻两个遮挡端子150的宽度逐渐增加，控制激光头缓慢增加能量时，由于能量等于功率乘以时间，若此时激光头的移动速度不变(即时间不变)，那么沿预设路径，当激光头功率缓慢增加时，激光头到达触控引脚区域的能量缓慢逐渐变大，当到达触控绑定引脚区域180时，激光头的镭射光照最大。但是由于增加激光头的镭射能量是一个逐渐缓慢增加的过程，而由于有均匀排布的遮挡端子150的存在，使得激光头在移动的过程中，镭射光照照射到每一处有遮挡端子150的区域的能量的大小几乎都是相同的，即镭射光照被玻璃胶吸收的热量是相同的，因此使得在封装过程中，非触控绑定引脚的区域不会因为镭射光照能量的突变而产生能量落差太大从而使得封装不均的问题；而当镭射光照到达触控绑定引脚141的区域时，能量也按照预设增加达到能够将触控绑定引脚区域180进行稳固封装的能量值，因此能够使得整个封装过程是均匀的、稳固的，避免封装不均的问题。
相反的，当镭射光照由触控绑定引脚区域180向正常区域160移动时，则控制激光头的镭射光照能量逐渐降低，此时则通过在缓冲区域170缓慢降低能量的方式，避免能量突变的情况而导致封装层130形貌突变，出现裂纹等问题，而且尽可能使得整个封装过程各个区域的封结比相同，提升整个封装效效果，使得封装强度高。
同理，当采用降低激光头的移动速度时，由于移动时间变长，也能够使能量累计变大， 达到均匀的封装效果；另外，在激光头镭射光照能量变化的同时，搭配激光头的移动降速，也是可以的，具体可根据情况来进行设置和配合，在此不作赘述。
另外，本实施例中，沿远离所述触控绑定引脚141的方向，也可以将多个所述遮挡端子150的宽度按第一预设值递减，且相邻两个所述遮挡端子150的间距按第二预设值递减，并且所述第一预设值等于所述第二预设值。即多个所述遮挡端子150，按所述遮挡端子150的宽度和相邻两个所述遮挡端子150的间距同时以相同的预设值递减排列设置，此时a按第一预设值10um减小，即第二个遮挡端子150的宽度a为130um-10um＝120um，第三个遮挡端子150的宽度a即为120um-10um＝110um，第二个遮挡端子150和第三个遮挡端子150之间的间距c按第二预设值10um减小，为120um-10um＝110um，那么此时b即为第二个遮挡端子150的宽度加上第二个遮挡端子150和第三个遮挡端子150的间距之和，即120um+110um＝230um，也就是b为250um-20um＝230um，以此类推，将多个所述遮挡端子150按这种递减方式排列设置，由于b递减的数值稍微较大，此时，遮挡端子150排列相对比较密，那么在缓冲区域170设置的遮挡端子150可以相对设置多一两个，而多个遮挡端子150的排列递减方式也是相对较均匀，也能使得在镭射光照时达到较均匀的封装效果。
当然，沿远离所述触控绑定引脚141的方向，多个所述遮挡端子150的宽度按第一预设值递减，且相邻两个所述遮挡端子150的间距按第二预设值递增，并且所述第一预设值等于所述第二预设值，也同样可以将多个所述遮挡端子150作宽度递减的排列。那么此时，每两个遮挡端子150之间排列间距较宽，即多个所述遮挡端子150排列得较稀疏，当镭射光照时，镭射光照透过每两个遮挡端子150照到封装层130的能量较多，封装层130吸收后与盖板110和基板120的封装效果相对更好，而由于遮挡端子150还是按照沿远离触控绑定引脚141的方向递减排列的，与激光头配合后还是可以通过控制激光头的能量或移动速度来使得封装均匀性较好。
其中，所述遮挡端子150的材料与所述触控绑定引脚141的材料相同，所述遮挡端子150的厚度与所述触控绑定引脚141的厚度相等。材料相同可以利用同一制程进行，从而节约材料，减少制程；而采用相同的厚度，使得镭射光照时，遮挡端子150与触控绑定引脚141的镭射光的透过率是一致的，避免透过率不均而导致封装层130吸收的光照热量不同，使封装层130产生封装不均的问题。
本实施例中，所述遮挡端子150可以为金属材料，由于触控绑定引脚141一般也为金属材料，因此，可以达到挡光的均一性，而且使得镭射光照时若是增加能量相对比较好控制，按相同比例来增加能量即可。当然，所述遮挡端子150也可以采用黑矩阵或透明电极或色阻材料制成，那么此时遮挡端子150的材料与触控绑定引脚141的材料则不同，这样则有利于设备对触控绑定引脚区域180、缓冲区域170以及正常区域160的检测和识别，更好的调控 激光头的移动速度或能量，从而使封装更好。
如图3所示，所述有机发光显示面板100还包括无机层190，所述无机层190设置在所述封装层130与所述基板120之间，先在基板120上形成无机层190后，再涂敷封装层130，这样也是可以的。
实施例二：
图4是本申请第二实施例提供的遮挡端子的排布示意图，如图4所示，本实施例与第一实施例不同的是，最靠近所述触控绑定引脚141的所述遮挡端子150，靠近所述触控绑定引脚141的侧面为斜面151，即该所述遮挡端子150为一个三角形结构。当所述遮挡端子150为金属材料制成时，金属材料本身具有挡光作用，也具有一定的反射光线的作用，而将靠近所述触控绑定引脚141的侧面做为斜面151，能够适当的反射部分的镭射光，将部分镭射光由斜面151反射至触控绑定引脚区域180对应的封装层130，使该位置的封装层130能够吸收的镭射光热量增加，从而增加该位置的封装层130的封装粘附力，达到理想的封装均匀的效果。
其中，所述斜面151与所述盖板侧边的夹角为d，所述斜面151的坡度大于等于45°，小于90°，即45°≤d<90°。当斜面151的坡度越大时，能够将镭射光反射至触控绑定引脚区域180的量相对会多一些，而且此时还可因为斜面151的存在，能够将镭射光反射至触控绑定引脚141上再进行反射折射进入触控绑定引脚141对应的区域内。
而为了反射更多的镭射光能量，还可以在斜面151上设置反射材料，这样配合斜面151的坡度，将更多的镭射光能量反射至触控绑定引脚区域180对应的封装层130，使该区域的封装层130能够吸收到更多的镭射光能量，从而提高该区域的封装层130的封装粘附力。
当所述遮挡端子150采用黑矩阵或透明电极或色阻材料制成时，则可以将所述斜面151的光穿透率沿斜面151的倾斜方向递减，即越靠近盖板110，该具有斜面151的遮挡端子150的光穿透率越低。这样将光穿透率做不同的设计，镭射光照时该位置的能量吸收也能做均匀的处理，使该位置的能量突变也是一个逐渐增加或逐渐减小的过程，从而不易造成该位置能量突变过大而导致封装层130形貌突变严重，影响封装效果。当然，当所述遮挡端子150采用半穿透的材料时，可以将遮挡端子150的厚度设置得相对比触控绑定引脚141的厚度要厚，以此增强遮挡端子150的挡光能力，尽可能的使缓冲区域170吸收的镭射光能量与触控绑定引脚区域180、正常区域160一致，从而避免发生封装层130形貌突变的情况。
另外，本实施例中，最靠近所述触控绑定引脚141的所述遮挡端子150也可以为其它具有斜面151的结构，比如：该斜面151可以为弧形，弧形的弧面朝向触控绑定引脚141，有利于镭射光的反射；或者该遮挡端子150也可以是具有斜面151的矩形结构，具体可根据实际情况来进行设定，同时配合激光头镭射光照的能量或移动速度，来达到更好的封装的均匀 性。
图6是本申请的显示面板的封装方法的流程步骤示意图，如图6所示，本申请还公开了一种显示面板的封装方法，用于如上所述有机发光显示面板的封装，包括步骤：
S1：在盖板和基板之间，对应边缘位置涂布封装层；
S2：采用镭射设备对显示面板的封装层按照预设路径进行镭射烧结；
S3：当检测到镭射设备移动到正常区域时，按照第一预设镭射能量和第一预设移动速度，对正常区域的封装层进行烧结；
S4：当检测到镭射设备移动到缓冲区域时，逐步提高镭射能量和/或逐渐降低移动速度，对缓冲区域的封装层进行烧结；
S5：当检测到镭射设备移动到触控绑定引脚区域时，提高镭射能量，对触控绑定引脚区域的封装层进行烧结；
其中，在所述盖板上形成有触控绑定引脚以及位于所述触控绑定引脚两侧的遮挡端子；所述镭射设备在正常区域，缓冲区域和触控绑定引脚区域区域的镭射烧结比相同，使得封装后该显示面板的封装区域封装均匀。
另外，步骤5中也可以通过降低激光头的移动速度，与遮光端子配合也能够使封装效果更好，均匀性好，当然，也可以通过通过镭射能量变化与激光头的移动速度同时进行。
需要说明的是,本申请的发明构思可以形成非常多的实施例，但是申请文件的篇幅有限，无法一一列出，因而，在不相冲突的前提下,以上描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例，各实施例或技术特征组合之后，将会增强原有的技术效果。
需要说明的是，本方案中涉及到的各步骤的限定，在不影响具体方案实施的前提下，并不认定为对步骤先后顺序做出限定，写在前面的步骤可以是在先执行的，也可以是在后执行的，甚至也可以是同时执行的，只要能实施本方案，都应当视为属于本申请的保护范围。
以上内容是结合具体的可选实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本申请的保护范围。

Claims (17)

  1. 一种有机发光显示面板，包括：
    盖板；
    基板，所述盖板与所述基板相对设置；
    封装层，设置在所述盖板与所述基板之间，其中：所述有机发光显示面板还包括触控线路，所述触控线路形成在所述盖板上，所述盖板的边缘设置有触控绑定引脚，所述触控绑定引脚与所述触控线路连接，所述触控绑定引脚的两侧分别设多个遮挡端子；所述触控绑定引脚和所述遮挡端子与所述封装层对应设置；
    其中，多个所述遮挡端子的长度与所述触控绑定引脚的长度一致，且沿远离所述触控绑定引脚的方向，多个所述遮挡端子的宽度递减。
  2. 根据权利要求1所述的有机发光显示面板，其中，与所述触控绑定引脚相邻的所述遮挡端子的宽度，等于所述触控绑定引脚的宽度；相邻的所述触控绑定引脚之间的间距相等，相邻的所述遮挡端子之间的间距相等，相邻的所述触控绑定引脚与所述遮挡端子之间的间距相等，沿远离所述触控绑定引脚的方向，多个所述遮挡端子的宽度按第一预设值递减。
  3. 根据权利要求1所述的有机发光显示面板，其中，与所述触控绑定引脚相邻的所述遮挡端子的宽度，等于所述触控绑定引脚的宽度；沿远离所述触控绑定引脚的方向，多个所述遮挡端子的宽度按第一预设值递减，且相邻两个所述遮挡端子的间距按第二预设值递减，并且所述第一预设值等于所述第二预设值。
  4. 根据权利要求1所述的有机发光显示面板，其中，与所述触控绑定引脚相邻的所述遮挡端子的宽度，等于所述触控绑定引脚的宽度；沿远离所述触控绑定引脚的方向，多个所述遮挡端子的宽度按第一预设值递减，且相邻两个所述遮挡端子的间距按第二预设值递增，并且所述第一预设值等于所述第二预设值。
  5. 根据权利要求3-4任意一项所述的有机发光显示面板，其中，所述第一预设值和所述第二预设值为10um。
  6. 根据权利要求1所述的有机发光显示面板，其中，所述遮挡端子的材料与所述触控绑定引脚的材料相同，所述遮挡端子的厚度与所述触控绑定引脚的厚度相等。
  7. 根据权利要求6所述的有机发光显示面板，其中，与所述触控绑定引脚相邻的所述遮挡端子中，靠近所述触控绑定引脚的侧面为斜面，所述斜面的坡度大于等于45°，小于90°；
    所述遮挡端子为金属材料制成。
  8. 根据权利要求7所述的有机发光显示面板，其中，所述遮挡端子采用色阻材料制成， 与所述触控绑定引脚相邻的所述遮挡端子中，光穿透率沿所述斜面的倾斜方向递减。
  9. 根据权利要求7所述的有机发光显示面板，其中，所述斜面上设置有反射材料。
  10. 根据权利要求7所述的有机发光显示面板，其中，所述遮挡端子的厚度大于触控绑定引脚的厚度。
  11. 根据权利要求7所述的有机发光显示面板，其中，所述斜面为弧形，所述弧形的弧面朝向所述触控绑定引脚。
  12. 根据权利要求7所述的有机发光显示面板，其中，所述遮挡端子为具有斜面的矩形结构。
  13. 根据权利要求1所述的有机发光显示面板，其中，所述遮挡端子的材料与所述触控绑定引脚的材料不同，所述遮挡端子彩用黑矩阵材料制成。
  14. 根据权利要求1所述的有机发光显示面板，其中，所述有机发光显示面板还包括无机层，所述无机层设置在所述封装层与所述基板之间。
  15. 一种有机发光显示面板，包括：
    盖板；
    基板，所述盖板与所述基板相对设置；
    封装层，设置在所述盖板与所述基板之间，其中：所述有机发光显示面板还包括触控线路，所述触控线路形成在所述盖板上，所述盖板的边缘设置有触控绑定引脚，所述触控绑定引脚与所述触控线路连接，所述触控绑定引脚的两侧分别设多个遮挡端子；所述触控绑定引脚和所述遮挡端子与所述封装层对应设置；
    其中，多个所述遮挡端子的长度与所述触控绑定引脚的长度一致，且沿远离所述触控绑定引脚的方向，多个所述遮挡端子的宽度递减；
    与所述触控绑定引脚相邻的所述遮挡端子的宽度，等于所述触控绑定引脚的宽度；相邻的所述触控绑定引脚之间的间距相等，相邻的所述遮挡端子之间的间距相等，相邻的所述触控绑定引脚与所述遮挡端子之间的间距相等，沿远离所述触控绑定引脚的方向，多个所述遮挡端子的宽度按第一预设值递减；
    所述第一预设值和所述第二预设值为10um；
    所述遮挡端子的材料与所述触控绑定引脚的材料相同，所述遮挡端子的厚度与所述触控绑定引脚的厚度相等。
  16. 一种显示装置，包括外盖板和有机发光显示面板，其中，所述外盖板设置在所述有机发光显示面板的出光面的一侧；所述有机发光显示面板包括盖板、基板、封装层和触控线路，所述盖板与所述基板相对设置；所述封装层设置在所述盖板与所述基板之间；所述触控线路形成在所述盖板上，所述盖板的边缘设置有触控绑定引脚，所述触控绑定引脚与所述触 控线路连接，所述触控绑定引脚的两侧分别设多个遮挡端子；所述触控绑定引脚和所述遮挡端子与所述封装层对应设置；多个所述遮挡端子的长度与所述触控绑定引脚的长度一致，且沿远离所述触控绑定引脚的方向，多个所述遮挡端子的宽度递减。
  17. 一种显示面板的封装方法，用于有机发光显示面板的封装，其中，包括步骤：
    在盖板和基板之间，对应边缘位置涂布封装层；
    采用镭射设备对显示面板的封装层按照预设路径进行镭射烧结；
    当检测到镭射设备移动到正常区域时，按照第一预设镭射能量和第一预设移动速度，对正常区域的封装层进行烧结；
    当检测到镭射设备移动到缓冲区域时，提高镭射能量和/或降低移动速度，对缓冲区域的封装层进行烧结；以及
    当检测到镭射设备移动到触控绑定引脚区域时，提高镭射能量，对触控绑定引脚区域的封装层进行烧结；
    其中，在所述盖板上形成有触控绑定引脚以及位于所述触控绑定引脚两侧的遮挡端子；所述镭射设备在正常区域，缓冲区域和触控绑定引脚区域的镭射烧结比相同。
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