WO2024055140A1 - 涂布模头、涂布装置和涂布方法 - Google Patents

涂布模头、涂布装置和涂布方法 Download PDF

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Publication number
WO2024055140A1
WO2024055140A1 PCT/CN2022/118314 CN2022118314W WO2024055140A1 WO 2024055140 A1 WO2024055140 A1 WO 2024055140A1 CN 2022118314 W CN2022118314 W CN 2022118314W WO 2024055140 A1 WO2024055140 A1 WO 2024055140A1
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WIPO (PCT)
Prior art keywords
coating
lip
temperature
lip portion
temperature control
Prior art date
Application number
PCT/CN2022/118314
Other languages
English (en)
French (fr)
Inventor
王杏
商红武
郑拓
李世松
闫小康
高晓亮
车欢
亢雪峰
Original Assignee
宁德时代新能源科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 宁德时代新能源科技股份有限公司 filed Critical 宁德时代新能源科技股份有限公司
Priority to CN202280087790.4A priority Critical patent/CN118524897A/zh
Priority to PCT/CN2022/118314 priority patent/WO2024055140A1/zh
Publication of WO2024055140A1 publication Critical patent/WO2024055140A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

Definitions

  • the present application relates to the field of coating technology, and more specifically, to a coating die, a coating device and a coating method.
  • This application provides a coating die, a coating device and a coating method, which can improve the consistency of coating.
  • a coating die including a first die and a second die, the first die being connected to the second die and surrounding to form a slit to output slurry;
  • the first die includes a die body, a lip portion and a lip adjustment component; wherein, the lip portion is connected to the die body and is located at the discharge end of the slit; the lip adjustment component It is used to adjust the temperature of the lip portion to control the deformation of the lip portion.
  • the coating die includes a first die and a second die.
  • the first die and the second die are connected and surrounded to form a slit to output the slurry.
  • the first die includes a die body, a lip portion and a lip adjustment component.
  • the lip portion is connected to the die body and located at the discharge end of the slit.
  • the lip adjustment component is used to adjust the temperature of the lip portion to control the lip.
  • the mouth is deformed. When the temperature of the lip changes, the lip can expand or contract, and the lip can deform.
  • the temperature of the lip can be adjusted through the lip adjustment component to control the deformation of the lip, thereby adjusting the gap between the lip and the coated substrate.
  • the gap between the lip and the coated substrate is related to the weight and thickness of the coating. By adjusting the distance between the lip and the substrate, the weight and thickness of the coating can be adjusted, which is beneficial to improving the coating quality. Cloth consistency.
  • the lip adjustment component includes a temperature control element, which is disposed on a surface of the lip and used to adjust the temperature of the lip. In this way, it is convenient to adjust the temperature of the lip through the temperature control element to control the deformation of the lip. Compared with manually adjusting the deformation of the lip, this implementation method is conducive to improving the degree of automation and the accuracy of the deformation of the lip.
  • the temperature control element includes a plurality of temperature control units arranged along the first direction, and the plurality of temperature control units are respectively used to adjust the temperature of multiple areas of the lip,
  • the first direction is the width direction of the coated substrate.
  • the temperature control element is a semiconductor temperature control element.
  • the heating and cooling response time of the semiconductor temperature control element is short and has high adjustment accuracy, which can quickly and accurately control the deformation of the lip.
  • the lip adjustment assembly further includes a temperature sensor, and the temperature sensor is connected to the temperature control element to measure the temperature of the temperature control element. In this way, it is convenient to determine whether to heat up or cool down the temperature control element based on the temperature of the temperature control element measured by the temperature sensor.
  • a coating device including: the coating die in any one of the first aspect and its implementation, a coating measurement unit and a control unit; the coating measurement unit is used to measure The coating information of the coated area of the coated substrate is sent to the control unit; the control unit is used to control the lip adjustment component to adjust the lip adjustment component according to the coating information. The temperature of the lips. In this way, based on the coating information of the coated area, the thickness, width, and consistency of the coating can be judged, so that the lip adjustment component can be controlled to adjust the temperature of the lip according to the coating information to control lip occurrence. deformation.
  • the coating device further includes a back roller, the back roller is used to support the substrate so that the coating die can coat the substrate;
  • the control unit is also configured to: when the coating information is less than the first preset information, control the lip adjustment component to cool down the lip portion and shrink the lip portion to increase the size of the lip. The gap between the mouth and the back roller; when the coating information is greater than the first preset information, the lip adjustment component is controlled to heat the lip so that the lip The lip portion is expanded to reduce the gap between the lip portion and the back roller. In this way, by comparing the coating information with the first preset information, the coating status can be judged, so as to adjust the coating strategy in a timely manner.
  • a coating method is provided, which is applied to a coating device.
  • the coating device includes: the coating die in any one of the first aspect and its implementation, and the method includes: obtaining Coating information of the coated area of the coated substrate; according to the coating information, the lip adjustment component is controlled to adjust the temperature of the lip portion.
  • the lip adjustment component can be controlled to adjust the temperature of the lip according to the coating information to control lip occurrence. deformation.
  • controlling the lip adjustment component to adjust the temperature of the lip according to the coating information includes: when the coating information is less than the first preset information , controlling the lip adjustment component to cool down the lip portion and shrink the lip portion to increase the gap between the lip portion and the back roller supporting the substrate; during the coating When the information is greater than the first preset information, the lip adjustment component is controlled to heat the lip portion and expand the lip portion to reduce the gap between the lip portion and the back roller. Clearance. In this way, by comparing the coating information with the first preset information, the coating status can be judged, so as to adjust the coating strategy in a timely manner.
  • controlling the lip adjustment component to adjust the temperature of the lip according to the coating information includes: controlling the temperature of the lip adjustment component according to the coating information.
  • the temperature control element regulates the temperature of the lip. In this way, it is easy to adjust the temperature of the lip through the temperature control element according to the coating information, which is beneficial to improving the degree of automation.
  • controlling the lip adjustment component to adjust the temperature of the lip according to the coating information includes: controlling multiple components of the temperature control element according to the coating information.
  • a first temperature control unit among the temperature control units regulates the temperature of a first area among a plurality of areas of the lip portion, the plurality of temperature control units are arranged along a first direction, and the first direction is the direction to be painted. The width direction of the cloth base material. In this way, the temperature of a certain area of the lip can be flexibly adjusted through the temperature control unit, thereby realizing the deformation of a certain area of the lip.
  • the temperature control element is a semiconductor temperature control element; and controlling the lip adjustment component to adjust the temperature of the lip portion according to the coating information includes: according to the coating information The information is distributed, and the current of the semiconductor temperature control element is adjusted based on the proportional-integral-derivative algorithm to adjust the temperature of the lip. Since the heating and cooling response time of the semiconductor temperature control element is short and the adjustment accuracy is high, the deformation of the lip can be quickly and accurately controlled using the semiconductor temperature control element.
  • the method before controlling the lip adjustment component to adjust the temperature of the lip portion according to the coating information, the method further includes: obtaining the temperature of the temperature control element. In this way, it is convenient to determine whether the temperature control element is heating up or cooling down based on the current temperature of the temperature control element.
  • the coating information includes at least one of coating thickness, coating width and coating weight of the coated area. In this way, it is convenient to measure the coating information through the measuring device, thereby facilitating the acquisition of the coating information.
  • a coating device including: a memory for storing computer-executable instructions; a processor for accessing the memory and executing the computer-executable instructions to perform a process according to the second aspect and The operations in any of the methods described in any of its possible implementations.
  • a fifth aspect provides a storage medium for storing a computer program.
  • the computing device implements any one of the second aspect and its possible implementations. method.
  • the coating die includes a first die and a second die.
  • the first die and the second die are connected and surrounded to form a slit to output the slurry.
  • the first die includes a die body, a lip portion and a lip adjustment component.
  • the lip portion is connected to the die body and located at the discharge end of the slit.
  • the lip adjustment component is used to adjust the temperature of the lip portion to control the lip.
  • the mouth is deformed. When the temperature of the lip changes, the lip can expand or contract, and the lip can deform.
  • the temperature of the lip can be adjusted through the lip adjustment component to control the deformation of the lip, thereby adjusting the gap between the lip and the coated substrate.
  • the gap between the lip and the coated substrate is related to the weight and thickness of the coating. By adjusting the distance between the lip and the substrate, the weight and thickness of the coating can be adjusted, which is beneficial to improving the coating quality. Cloth consistency.
  • Figure 1 is a schematic diagram of a coating die according to an embodiment of the present application.
  • Figure 2 is a schematic diagram of the first die head according to an embodiment of the present application.
  • Figure 3 is a schematic diagram of coating using a coating die according to an embodiment of the present application.
  • Figure 4 is a schematic diagram of coating according to an embodiment of the present application.
  • Figure 5 is a schematic diagram of a coating die according to an embodiment of the present application.
  • Figure 6 is a side view of the first die head according to an embodiment of the present application.
  • Figure 7 is a schematic diagram of the first die head according to an embodiment of the present application.
  • Figure 8 is a top view of the first die head according to an embodiment of the present application.
  • Figure 9 is a schematic diagram of a lip adjustment assembly according to an embodiment of the present application.
  • Figure 10 is a schematic diagram of a coating device according to an embodiment of the present application.
  • Figure 11 is a schematic diagram of a coating device according to an embodiment of the present application.
  • Figure 12 is a schematic diagram of a coating method according to an embodiment of the present application.
  • Figure 13 is a flow chart of a coating method according to an embodiment of the present application.
  • Figure 14 is a schematic diagram of a coating device according to an embodiment of the present application.
  • Coating is an essential process in the production of batteries, and it is also a key process that affects the safety, capacity and consistency of batteries.
  • the slurry is extruded and sprayed onto the substrate along the gap of the coating die under a certain pressure to complete coating of the substrate.
  • the existing coating die adjusts the coating thickness by adjusting the distance between the lip of the die and the substrate.
  • the distance between the lip and the substrate is usually adjusted by adjusting a mechanical component, such as a screw component, provided on the coating die.
  • This adjustment method has low adjustment accuracy, long response time, poor stability, and is difficult to meet the coating requirements.
  • the coating die includes a first die and a second die.
  • the first die is connected to the second die and surrounded by a slit to output slurry.
  • the first coating die includes a die body, a lip portion and a lip adjustment component.
  • the lip portion is connected to the die body and located at the discharge end of the slit.
  • the lip adjustment component is used to adjust the temperature of the lip portion to adjust the temperature of the lip portion. Control the deformation of the lips. In this way, when the temperature of the lip changes, the lip can expand or contract, so that the lip can deform.
  • the temperature of the lip can be adjusted through the lip adjustment assembly to control the deformation of the lip, thereby adjusting the gap between the lip and the coated substrate.
  • the gap between the lip and the coated substrate is related to the weight and thickness of the coating. By adjusting the distance between the lip and the substrate, the weight and thickness of the coating can be adjusted, which is beneficial to improving the coating quality. Cloth consistency.
  • FIG. 1 is a schematic diagram of a coating die according to an embodiment of the present application
  • FIG. 2 is a schematic diagram of a first die according to an embodiment of the present application.
  • the coating die 10 includes a first die 11 and a second die 12.
  • the first die 11 is connected to and surrounds the second die 12.
  • Slits 13 are formed to output slurry.
  • the first die 11 and the second die 12 extend along a first direction, which is the width direction of the coated substrate, for example, the y direction in FIG. 2 .
  • the slit 13 is parallel to the second direction, and the second direction is the output direction of the slurry, such as the x direction in Figure 1 .
  • the second direction is perpendicular to the first direction.
  • the first die head 11 and the second die head 12 are connected in the third direction.
  • the slit 13 is located between the first die head 11 and the second die head 12 in the third direction.
  • the third direction is connected with the first direction and the second direction. different.
  • the third direction is perpendicular to a plane parallel to the second direction, such as the z direction in Figure 1 .
  • the first die head 11 may be directly connected to the second die head 12 , or may be indirectly connected to the second die head 12 .
  • the coating die 10 may also include a gasket, the first die 11 is connected to the second die 12 through the gasket, and the gasket is located between the first die 11 and the second die 12 along the third direction, The first die 11, the gasket and the second die 12 form a slit 13.
  • the first die head 11 has a first mating surface 101
  • the second die head 12 has a second mating surface 102.
  • the first mating surface 101 and the second mating surface 102 cooperate with each other to realize the first die head 11 and the second die head 12. are connected and form a slit 13.
  • the first die head 11 includes a die head body 111 , a lip portion 112 and a lip adjustment assembly 113 .
  • the lip portion 112 is connected to the die body 111 and is located at the discharge end 131 of the slit 13 .
  • the lip adjustment component 113 is used to adjust the temperature of the lip portion 112 to control the deformation of the lip portion 112 .
  • the die body 111 is the main structure of the first die 11 , and the lip portion 112 is connected to the die body 111 and located at the discharge end 131 of the slit 13 . In this way, the lip portion 112 protrudes from the die body 111 along the output direction of the slurry, so as to facilitate the output of the slurry at the lip portion 112 .
  • the lip portion 112 and the die body 111 may be an integrally formed structure.
  • FIG. 3 is a schematic diagram of coating using a coating die according to an embodiment of the present application
  • FIG. 4 is a schematic diagram of coating according to an embodiment of the present application.
  • the slurry output from the slit 13 is coated on the substrate 20.
  • the x direction in the figure is the output direction of the slurry, and the width direction of the substrate 20 is perpendicular to the paper surface. direction.
  • the lip portion 112 is related to the width s of the slit 13 at the discharge end 131.
  • the width s is the size of the discharge end 131 of the slit 13 along the second direction, or it can also be said that the width s is the size of the first die. 11 and the second die head 12 at the discharge end 131 of the vertical distance.
  • the gap d between the lip 112 and the base material 20 is related to the coating performance, and the gap d is proportional to the thickness t of the slurry coated on the base material 20 . That is to say, the greater the gap d between the lip 112 and the base material 20, the greater the thickness t of the slurry coated on the base material 20, and the greater the weight of the coated base material 20; the lip The smaller the gap d between the portion 112 and the base material 20 is, the smaller the thickness t of the slurry coated on the base material 20 is, and the smaller the weight of the coated base material 20 is.
  • the gap d between the lip portion 112 and the base material 20 may be the vertical distance between the lip portion 112 and the base material 20 .
  • the lip adjustment component 113 is used to adjust the temperature of the lip portion 112.
  • the lip portion 112 will deform accordingly, that is, expand or contract.
  • the lip portion 112 is made of a metal material
  • the lip portion 112 expands in all directions.
  • the lip portion 112 will expand toward the base material 20 , so that the distance d between the lip portion 112 and the base material 20 becomes smaller. In this way, by controlling the deformation of the lip portion 112, the distance between the lip portion 112 and the substrate 20 can be adjusted, thereby adjusting the thickness and weight of the coating.
  • the lip 112 can also expand in the direction closer to the second die 12, so that the width s of the slit 13 at the discharge end 131 becomes smaller, so that the flow rate of the slurry can be adjusted, and thus the coating thickness can be adjusted. consistency.
  • the base material 20 may be a current collector, such as copper foil, aluminum foil, composite metal, etc., or may be other materials. Taking the current collector as an example, a slurry formed of electrode active material is coated on the surface of the current collector, and the membrane formed after drying can be used as a battery electrode. Electrode active materials are divided into positive electrode active materials and negative electrode active materials.
  • the positive electrode active materials can be lithium cobalt oxide, lithium iron phosphate, ternary lithium or lithium manganate, etc., and the negative electrode active materials can be carbon or silicon, etc.
  • the slurry may include an active agent, a binder, a conductive agent, and the like.
  • the lip portion 112 is made of a material that expands with heat and contracts with cold.
  • the lip portion 112 is made of a metal material.
  • the amount of deformation of the lip portion 112 is related to the material of the lip portion 112 itself, and can be determined according to the expansion coefficient of the material.
  • the second die 12 is provided with a lip adjustment assembly 113 , which is used to adjust the temperature of the lip of the second die 12 to control the deformation of the lip of the second die 12 .
  • the coating die 10 includes a first die 11 and a second die 12.
  • the first die 11 and the second die 12 are connected and surrounded to form a slit 13 to output slurry.
  • the first die 11 includes a die body 111 , a lip portion 112 and a lip adjustment component 113 .
  • the lip portion 112 is connected to the die body 111 and is located at the discharge end 131 of the slit 13 .
  • the lip adjustment component 113 is used for The temperature of the lip portion 112 is adjusted to control the deformation of the lip portion 112 . When the temperature of the lip portion 112 changes, the lip portion 112 may expand or contract, so that the lip portion 112 may deform.
  • the temperature of the lip portion 112 can be adjusted through the lip adjustment assembly 113 to control the deformation of the lip portion 112 , thereby adjusting the relationship between the lip portion 112 and the coated substrate.
  • the distance between the lip 112 and the coated substrate 20 is related to the weight, thickness, etc. of the coating. By adjusting the distance between the lip 112 and the substrate 20, the weight, thickness, etc. of the coating can be adjusted. This will help improve coating consistency.
  • Figure 5 is a schematic diagram of a coating die according to an embodiment of the present application.
  • the coating die 10 also includes a feed chamber 121 and a storage chamber 122. After the slurry enters the coating die 10 through the feed chamber 121, it flows into the storage chamber 122, and then can be It enters the slit 13 through the material storage chamber 122 and is output from the discharge end 131 .
  • the feed cavity 121 and the storage cavity 122 can be provided on the second die head 12 or the first die head 11, and can be specifically set according to actual needs. This application does not impose specific restrictions on this.
  • FIG. 6 is a side view of the first die head according to an embodiment of the present application
  • FIG. 7 is a schematic diagram of the first die head according to an embodiment of the present application.
  • the lip adjustment component 113 includes a temperature control element 1131 , which is disposed on the surface of the lip 112 and used to adjust the lip 112 temperature.
  • the lip 112 includes a first surface 1121 and a second surface 1122 .
  • the first surface 1121 is a part of the first mating surface 101, and the first surface 1121 is used to define the slit 13; the second surface 1122 is inclined to the first surface 1121, and the angle between them is an acute angle. 1122 Contact with the external environment.
  • the temperature control element 1131 is disposed on the second surface 1122 of the lip 112 , thus facilitating the installation of the temperature control element 1131 .
  • a cavity is provided inside the lip 112 , and the temperature control element 1131 is disposed in the cavity.
  • a temperature control element 1131 is provided on the surface of the lip 112 , so that the temperature of the lip 112 can be adjusted by the temperature control element 1131 to control the deformation of the lip 112 .
  • this implementation method is conducive to improving the degree of automation and the accuracy of the deformation of the lip portion 112 .
  • the temperature control element 1131 is an entire element, that is, the number of the temperature control element 1131 is 1 and covers the second surface 1122 of the lip 112 . In this way, the installation of the temperature control element 1131 is facilitated and the installation difficulty is reduced.
  • Figure 8 is a top view of the first die head according to an embodiment of the present application.
  • the temperature control element 1131 includes a plurality of temperature control units 1141 arranged along the first direction.
  • the plurality of temperature control units 1141 are respectively used to adjust the temperature of the lip 112 .
  • the first direction is the width direction of the coated substrate 20 among the temperatures in multiple regions.
  • the deformation of a certain area of the lip 112 can be adjusted by adjusting the temperature control element 1141 provided in the area.
  • the temperature control unit 1141 can be replaced without replacing the entire temperature control element 1131, which facilitates maintenance.
  • the temperature of a specific area of the lip 112 can be flexibly adjusted as needed, thereby controlling the deformation of a specific area of the lip 112; in addition, it is also beneficial to temperature control. Repair and replacement of component 1131.
  • the lip portion 112 is a continuous structure, that is, the number of the lip portions 112 of the first die 11 is one.
  • the deformation of the corresponding area of the lip portion 112 can be adjusted by adjusting the correspondingly provided temperature control unit 1141 of the lip portion 112 .
  • arranging the lip portion 112 as a continuous structure can avoid material leakage during coating.
  • the temperature control element 1131 is disposed on the lip 112 by bonding.
  • the temperature control element 1131 is a semiconductor temperature control element.
  • the heating and cooling response time of the semiconductor temperature control element is short and has high adjustment accuracy, which can quickly and accurately control the deformation of the lip.
  • the current of the semiconductor temperature control element can be changed based on a proportional-integral-derivative (PID) algorithm to control the temperature of the semiconductor temperature control element.
  • PID proportional-integral-derivative
  • a current commutation module is provided in the semiconductor temperature control element, and the current commutation module can be controlled to change the direction of the current in the semiconductor temperature control element, thereby controlling the temperature of the semiconductor temperature control element.
  • the semiconductor temperature control element is a semiconductor refrigeration chip (Thermo Electric Cooler, TEC).
  • a semiconductor temperature control element is equipped with an N-type element and a P-type element.
  • the direction of the current for example, changing the direction of the current from an N-type element to a P-type element to from a P-type element to an N-type element, the temperature of the semiconductor can be changed.
  • the heating status of the temperature control element changes from cooling to heating, or from heating to cooling.
  • the lip adjustment component 113 further includes a temperature sensor 1132, which is connected to the temperature control element 113 to measure the temperature of the temperature control element 113.
  • the temperature sensor 1132 is a temperature probe, and the temperature sensor is disposed on the surface of the temperature control element 1131 to measure the temperature of the temperature control element 113 .
  • the temperature sensor 1132 is disposed inside the temperature control element 1131 .
  • FIG. 9 is a schematic diagram of a lip adjustment assembly according to an embodiment of the present application.
  • FIG. 9 shows the smallest unit of the lip adjustment assembly 113.
  • the smallest unit of the lip adjustment assembly 113 includes a temperature control unit 1141 and a temperature sensor 1132.
  • the temperature sensor 1132 can send the measured temperature to the control unit through the wire harness assembly 1133, and the control unit controls the temperature control unit 1141 to increase or decrease the temperature according to the measured temperature.
  • the wiring harness assembly 1133 may be part of the control unit.
  • the lip adjustment assembly 113 includes a wire harness assembly 1133 , that is, the wire harness assembly 1133 is a part of the lip adjustment assembly 113 .
  • control unit may be a controller of the lip adjustment assembly 113 or a controller of a coating device including a coating die.
  • the embodiments of the coating die of the present application are described in detail above with reference to FIGS. 1 to 9 , and the embodiments of the coating device and coating method of the present application will be described in detail below. Similar descriptions of the embodiments of the coating die and the embodiments of the coating device and the coating method may be referred to the description of the embodiments of the coating die, and will not be described again here.
  • FIG 10 is a schematic diagram of a coating device according to an embodiment of the present application.
  • this application provides a coating device 200, including: any possible coating die 10 mentioned above, a coating measurement unit 510 and a control unit 520.
  • the coating measurement unit 510 is used to measure the coating information of the coated area of the coated substrate 20 and send the coating information to the control unit 520; the control unit 520 is used to control the adjustment of the lip adjustment component 113 according to the coating information.
  • the coating measurement unit 510 may be a thickness gauge, a weight gauge, an area density gauge, etc.
  • the control unit 520 may be a programmable controller.
  • Figure 11 is a schematic diagram of a coating device according to an embodiment of the present application.
  • the coating device 200 also includes a back roller 15.
  • the back roller 15 is used to support the substrate 20 so that the coating die 10 can coat the substrate 20; control
  • the unit 520 is also used to: when the coating information is less than the first preset information, control the lip adjustment component 113 to cool down the lip portion 112 and shrink the lip portion 112 to increase the size of the lip portion 112 and the back roller 15 when the coating information is greater than the first preset information, the lip adjustment component 113 is controlled to heat up the lip portion 112 and expand the lip portion 112 to reduce the gap between the lip portion 112 and the back roller 15 the gap between.
  • the lip adjustment component 113 includes a temperature control element 1131, which is disposed on the surface of the lip 112 and used to adjust the temperature of the lip 112; the control unit 520 is also used to: According to the information, the temperature control element 1131 is controlled to adjust the temperature of the lip 112 .
  • the temperature control element 113 includes a plurality of temperature control units 1141 arranged along a first direction.
  • the plurality of temperature control units 1141 are respectively used to adjust the temperature of multiple areas of the lip 112 .
  • the first direction is the width direction of the coated substrate 20; the control unit 520 is also used to: control the first temperature control unit among the plurality of temperature control units 1141 to adjust the first temperature control unit in the plurality of areas of the lip portion 112 according to the coating information.
  • the temperature of an area is the temperature of an area.
  • the temperature control element 1131 is a semiconductor temperature control element; the control unit 520 is also used to adjust the current of the semiconductor temperature control element according to the coating information to adjust the temperature of the lip 112 .
  • the lip adjustment component 113 also includes a temperature sensor 1132.
  • the temperature sensor 1132 is connected to the temperature control element 1131 to measure the temperature of the temperature control element 1131 and send the temperature of the temperature control element 1131 to the control unit. 520;
  • the control unit 520 is also used to obtain the temperature of the temperature control element 1131 before controlling the lip adjustment component 113 to adjust the temperature of the lip portion 112 according to the coating information.
  • the coating information includes at least one of coating thickness, coating width and coating weight of the coated area.
  • Figure 12 is a schematic diagram of a coating method according to an embodiment of the present application. As shown in Figure 12, the embodiment of the present application provides a coating method 300, which is applied to the coating device 200.
  • the coating method 300 includes the following steps.
  • the coating method 300 may be executed by a control unit in the coating device 200 .
  • Step 310 Obtain the coating information of the coated area of the coated substrate 20.
  • Step 320 Control the lip adjustment component 113 to adjust the temperature of the lip portion 112 according to the coating information.
  • step 320 automatic adjustment of the current coating can be realized based on the coating information of the coated area.
  • the thickness, width and consistency of the coating can be judged, so as to facilitate timely control of the lip adjustment component 113 to adjust the temperature of the lip portion 112 based on the coating information. , to control the deformation of the lip 112.
  • step 320 includes: when the coating information is less than the first preset information, controlling the lip adjustment component 113 to cool down the lip portion 112 to shrink the lip portion 112 to increase the lip size.
  • the coating device 200 further includes a back roller 15 , which is used to support the substrate 20 so that the coating die 10 can coat the substrate 20 .
  • the back roller 15 is used to support and transport the substrate 20 . As long as the substrate 20 can be transported and supported, the shape, material, size, etc. of the back roller 15 are not specifically limited in this application.
  • the lip 112 expands when the temperature increases and contracts when the temperature decreases.
  • the first preset information is preset coating-related information, such as coating thickness, width, coating weight, surface density of the coated substrate, etc.
  • the first preset information can be set in advance and stored in the control unit 520 or the storage unit of the coating device 200 .
  • the coating information and the first preset information are similar information, for example, both are coating thickness.
  • the coating status can be judged, so as to promptly adjust the coating strategy, such as adjusting the gap between the coating die 10 and the back roller 15 .
  • step 320 includes: controlling the temperature control element 1131 to adjust the temperature of the lip 112 according to the coating information.
  • the lip adjustment component 113 includes a temperature control element 1131 , which is disposed on the surface of the lip 112 and used to adjust the temperature of the lip 112 .
  • step 320 includes: controlling the first temperature control unit among the plurality of temperature control units 1141 to adjust the temperature of the first region among the plurality of regions of the lip 112 according to the coating information.
  • the temperature control element 1131 includes a plurality of temperature control units 1141 arranged along a first direction.
  • the plurality of temperature control units 1141 are respectively used to adjust the temperature of multiple areas of the lip 112 .
  • the first direction is the coated substrate 20 width direction.
  • the first temperature control unit is disposed in the first area of the lip 112 , where the first temperature control unit is any one of the plurality of temperature control units 1141 .
  • the temperature of a certain area of the lip 112 can be flexibly adjusted through the temperature control unit 1141, thereby achieving deformation of a certain area of the lip 112.
  • the temperature control element 1131 is a semiconductor temperature control element.
  • Step 320 includes: adjusting the current of the semiconductor temperature control element according to the coating information to adjust the temperature of the lip 112 .
  • the heating and cooling response time of the semiconductor temperature control element is short, and it has high adjustment accuracy. At about 0.1°C, the deformation of the lip can be quickly and accurately controlled.
  • semiconductor temperature control components have a large temperature adjustment range of -60 to 300°C, which can take into account both adjustment range and adjustment accuracy.
  • the temperature control element 1131 can also be a resistor or a thermocouple.
  • step 320 it may be determined based on the coating information and the first preset information whether it is necessary to control the deformation of the lip 112. For example, the value of the deformation that needs to occur on the lip 112 is calculated based on the difference between the first preset information and the coating information, and then the temperature T1 that needs to be adjusted by the temperature control element is calculated based on the value of the deformation.
  • the value of the deformation of the lip portion 112 is related to the expansion coefficient of the material of the lip portion 112 .
  • the lip 112 needs to be controlled to shrink to increase the lip. 112 and the back roller 15. At this time, the temperature control element 1131 needs to be controlled to cool down from the current temperature T0 to a lowered temperature value T1 so that the lip 112 shrinks.
  • the coating information of the coated area is greater than the first preset information, for example, the coating thickness of the coated area is greater than the preset coating thickness, it is necessary to control the expansion of the lip 112 to reduce The gap between the small lip 112 and the back roller 15.
  • the temperature control element 1131 needs to be controlled to increase in temperature from the current temperature T0, and the increased temperature value is T1, so that the lip 112 expands.
  • the method 300 before step 320, the method 300 further includes: obtaining the temperature of the temperature control element 1131.
  • the lip adjustment assembly 113 also includes a temperature sensor 1132 , which is connected to the temperature control element 1131 to measure the temperature of the temperature control element 1131 and send the temperature value to the control unit 520 .
  • the temperature of the temperature control element 1131 is obtained before step 320 so that the control unit 520 can control the temperature of the temperature control element 1131 to increase or decrease according to the current temperature T0 of the temperature control element 1131 and the temperature T1 that needs to be adjusted.
  • the temperature of the temperature control element 1131 can be obtained in real time, so as to promptly determine whether the temperature of the temperature control element 1131 meets the requirements for corresponding deformation of the lip 112.
  • the coating information includes at least one of coating thickness, coating width and coating weight of the coated area. In this way, it is convenient to measure the coating information through the measuring device, thereby facilitating the acquisition of the coating information.
  • Figure 13 is a flow chart of a coating method according to an embodiment of the present application. As shown in Figure 13, the coating method includes the following steps.
  • Step 410 Obtain coating information of the coated area of the coated substrate.
  • Step 420 determine whether the coating information is less than the first preset information.
  • step 430 is executed; if the coating information is not less than the first preset information, step 440 is executed.
  • Step 430 control the temperature control element 1131 to cool down the lip 112.
  • the specific value of the temperature control element 1131 that needs to be cooled can be calculated based on the difference between the coating information and the first preset information.
  • step 430 the temperature control element 1131 is controlled to cool down the lip portion 112. In this way, the temperature of the lip portion 112 decreases and the lip portion 112 shrinks, so that the gap between the lip portion 112 and the back roller 15 becomes larger. , the coating thickness becomes larger.
  • Step 440 Determine whether the coating information is greater than the first preset information.
  • step 450 is executed.
  • Step 450 control the temperature control element 1131 to heat the lip 112.
  • step 440 and before step 450 the specific value of the temperature control element 1131 that needs to be raised can be calculated based on the difference between the coating information and the first preset information.
  • step 450 the temperature control element 1131 is controlled to raise the temperature of the lip portion 112. In this way, the temperature of the lip portion 112 increases, the lip portion 112 expands, and the gap between the lip portion 112 and the back roller 15 becomes smaller. Small, the coating thickness becomes smaller.
  • step 420 and step 440 may be performed simultaneously, and step 420 may be performed first or step 440 may be performed first.
  • step 430 or step 450 After step 430 or step 450, return to step 410. In this way, the coating thickness can be monitored and adjusted in real time, which facilitates timely adjustment of the coating strategy and improves coating consistency.
  • Figure 14 is a schematic diagram of a coating device according to an embodiment of the present application.
  • the embodiment of the present application provides a coating device 600, including: a memory 610 for storing computer-executable instructions; a processor 620 for accessing the memory 610 and executing the computer-executable instructions to The operations in the coating method according to any one of the preceding embodiments were performed.
  • the processor 620 in this embodiment of the present application may be an integrated circuit chip that has signal processing capabilities.
  • each step of the above method embodiment can be completed through an integrated logic circuit of hardware in the processor or instructions in the form of software.
  • the above-mentioned processor can be a general-purpose processor, a digital signal processor (Digital Signal Processor, DSP), an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), an off-the-shelf programmable gate array (Field Programmable Gate Array, FPGA) or other available Programmed logic devices, discrete gate or transistor logic devices, discrete hardware components.
  • DSP Digital Signal Processor
  • ASIC Application Specific Integrated Circuit
  • FPGA Field Programmable Gate Array
  • a general-purpose processor may be a microprocessor or the processor may be any conventional processor, etc.
  • the steps of the method disclosed in conjunction with the embodiments of the present application can be directly implemented by a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor.
  • the software module can be located in random access memory, flash memory, read-only memory, programmable read-only memory or electrically erasable programmable memory, registers and other mature storage media in this field.
  • the storage medium is located in the memory, and the processor reads the information in the memory and completes the steps of the above method in combination with its hardware.
  • the memory 610 in the embodiment of the present application may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories.
  • non-volatile memory can be read-only memory (Read-Only Memory, ROM), programmable read-only memory (Programmable ROM, PROM), erasable programmable read-only memory (Erasable PROM, EPROM), electrically removable memory. Erase programmable read-only memory (Electrically EPROM, EEPROM) or flash memory.
  • Volatile memory may be Random Access Memory (RAM), which is used as an external cache.
  • RAM static random access memory
  • DRAM dynamic random access memory
  • DRAM synchronous dynamic random access memory
  • SDRAM double data rate synchronous dynamic random access memory
  • Double Data Rate SDRAM DDR SDRAM
  • enhanced SDRAM ESDRAM
  • Synchlink DRAM SLDRAM
  • Direct Rambus RAM Direct Rambus RAM
  • Embodiments of the present application provide a storage medium for storing a computer program.
  • the computer program When executed by a computing device, the computing device implements the coating method in any one of the preceding embodiments.

Landscapes

  • Coating Apparatus (AREA)

Abstract

本申请提供一种涂布模头，涂布装置和涂布方法。涂布模头包括：第一模头和第二模头，第一模头与第二模头连接并围设形成狭缝以输出浆料；第一模头包括模头本体、唇口部和唇口调节组件；其中，唇口部与模头本体连接且位于狭缝的出料端；唇口调节组件用于调节唇口部的温度以控制唇口部发生形变。本申请的方案可以提高涂布的一致性。

Description

涂布模头、涂布装置和涂布方法 技术领域
本申请涉及涂布技术领域，更为具体地，涉及一种涂布模头、涂布装置和涂布方法。
背景技术
随着环境污染的日益加剧，新能源产业越来越受到人们的关注。在新能源产业中，电池技术是关乎其发展的一项重要因素。
电池技术的发展需要考虑多方面的设计因素，例如，能量密度、循环寿命、安全性能等。涂布是生产电池的极片的关键步骤，涂布质量的好坏影响极片的一致性，进而影响电池的容量、循环性能以及倍率等性能。因此，如何提供一种涂布模头以提高涂布的一致性时一项亟待解决的技术问题。
发明内容
本申请提供了一种涂布模头，涂布装置和涂布方法，可以提高涂布的一致性。
第一方面，提供了一种涂布模头，包括第一模头和第二模头，所述第一模头与所述第二模头连接并围设形成狭缝以输出浆料；所述第一模头包括模头本体，唇口部和唇口调节组件；其中，所述唇口部与所述模头本体连接且位于所述狭缝的出料端；所述唇口调节组件用于调节所述唇口部的温度以控制所述唇口部发生形变。
在本申请实施例中，涂布模头包括第一模头和第二模头，第一模头和第二模头连接并围设形成狭缝以输出浆料。第一模头包括模头本体，唇口部和唇口调节组件，唇口部与模头本体连接且位于狭缝的出料端，唇口调节组件用于调节唇口部的温度以控制唇口部发生形变。唇口部的温度发生变化时，唇口部可以发生膨胀或收缩，从而唇口部可以产生形变。在使用涂布模头进行涂布的过程中，可以通过唇口调节组件调节唇口部的温度以控制唇口部发生形变，从而可以调节唇口部与被涂布的基材之 间的间隙。唇口部与被涂布的基材之间的间隙与涂布的重量、厚度等相关，通过调节唇口部与基材之间的距离可以调节涂布的重量和厚度，进而有利于提高涂布的一致性。
在一种可能的实现方式中，所述唇口调节组件包括温控元件，所述温控元件设置于所述唇口部的表面并用于调节所述唇口部的温度。这样，便于通过温控元件调节唇口部的温度以控制唇口部发生形变。相比于通过人工手动调节唇口部的形变，该实现方式有利于提升自动化程度以及唇口部的形变的精度。
在一种可能的实现方式中，所述温控元件包括沿第一方向设置的多个温控单元，所述多个温控单元分别用于调节所述唇口部的多个区域的温度，所述第一方向为被涂布的基材的宽度方向。通过设置多个温控单元，可以根据需要灵活地调节唇口部的特定区域的温度，从而控制唇口部的特定区域的形变；此外，还有利于温控元件的维修和替换。
在一种可能的实现方式中，所述温控元件为半导体温控元件。半导体温控元件的加热及冷却的响应时间短，并且具有较高的调节精度，可以快速精确地控制唇口部的形变。
在一种可能的实现方式中，所述唇口调节组件还包括测温传感器，所述测温传感器与所述温控元件连接以测量所述温控元件的温度。这样，便于根据测温传感器测量到的温控元件的温度，确定对温控元件进行升温或降温。
第二方面，提供了一种涂布装置，包括：第一方面及其实现方式中的任一项中的涂布模头，涂布测量单元和控制单元；所述涂布测量单元用于测量被涂布的基材的已涂布区域的涂布信息并发送所述涂布信息至所述控制单元；所述控制单元用于根据所述涂布信息控制所述唇口调节组件调节所述唇口部的温度。这样，根据已涂布区域的涂布信息，可以判断涂布的厚度、宽度以及一致性等状况，从而便于根据涂布信息控制唇口调节组件调节唇口部的温度，以控制唇口部发生形变。
在一种可能的实现方式中，所述涂布装置还包括背辊，所述背辊用于支撑所述基材，以使所述涂布模头对所述基材进行涂覆；所述控制单元还用于：在所述涂布信息小于第一预设信息的情况下，控制所述唇口调节组件对所述唇口部降温，使所述唇口部收缩以增大所述唇口部与所述背辊之间的间隙；在所述涂布信息大于所述第一预设信息的情况下，控制所述唇口调节组件对所述唇口部升温，使所述唇口部膨胀 以减小所述唇口部与所述背辊之间的间隙。这样，通过对比涂布信息和第一预设信息，可以判断涂布的状况，以便于及时调整涂布的策略。
第三方面，提供了一种涂布方法，应用于涂布装置，所述涂布装置包括：第一方面及其实现方式中的任一项中的涂布模头，所述方法包括：获取被涂布的基材的已涂布区域的涂布信息；根据所述涂布信息，控制所述唇口调节组件调节所述唇口部的温度。这样，根据已涂布区域的涂布信息，可以判断涂布的厚度、宽度以及一致性等状况，从而便于根据涂布信息控制唇口调节组件调节唇口部的温度，以控制唇口部发生形变。
在一种可能的实现方式中，所述根据所述涂布信息控制所述唇口调节组件调节所述唇口部的温度，包括：在所述涂布信息小于第一预设信息的情况下，控制所述唇口调节组件对所述唇口部降温，使所述唇口部收缩以增大所述唇口部与支撑所述基材的背辊之间的间隙；在所述涂布信息大于所述第一预设信息的情况下，控制所述唇口调节组件对所述唇口部升温，使所述唇口部膨胀以减小所述唇口部与所述背辊之间的间隙。这样，通过对比涂布信息和第一预设信息，可以判断涂布的状况，以便于及时调整涂布的策略。
在一种可能的实现方式中，所述根据所述涂布信息控制所述唇口调节组件调节所述唇口部的温度，包括：根据所述涂布信息，控制所述唇口调节组件的温控元件调节所述唇口部的温度。这样，便于根据涂布信息，通过温控元件调节唇口部的温度，有利于提升自动化程度。
在一种可能的实现方式中，所述根据所述涂布信息控制所述唇口调节组件调节所述唇口部的温度，包括：根据所述涂布信息，控制所述温控元件的多个温控单元中的第一温控单元调节所述唇口部的多个区域中的第一区域的温度，所述多个温控单元沿第一方向设置，所述第一方向为被涂布的基材的宽度方向。这样，可以通过温控单元灵活地调节唇口部的某一区域的温度，从而实现唇口部的某一区域的形变。
在一种可能的实现方式中，所述温控元件为半导体温控元件；所述根据所述涂布信息控制所述唇口调节组件调节所述唇口部的温度，包括：根据所述涂布信息，基于比例-积分-微分算法调节所述半导体温控元件的电流，以调节所述唇口部的温度。由于半导体温控元件的加热及冷却的响应时间短，并且具有较高的调节精度，使用半导体温控元件可以快速精确地控制唇口部的形变。
在一种可能的实现方式中，在所述根据所述涂布信息控制所述唇口调节组件调节所述唇口部的温度之前，所述方法还包括：获取所述温控元件的温度。这样，便于根据温控元件的当前温度，确定温控元件升温或降温。
在一种可能的实现方式中，所述涂布信息包括所述已涂布区域的涂覆厚度、涂覆宽度和涂覆重量中的至少一个。这样，便于通过测量装置测量涂布信息，从而便于涂布信息的获取。
第四方面，提供了一种涂布装置，包括：存储器，用于存储计算机可执行指令；处理器，用于访问所述存储器，并执行所述计算机可执行指令，以进行根据第二方面及其可能的实现方式中任一项所述的方法中的操作。
第五方面，提供了一种存储介质，用于存储计算机程序，当所述计算机程序被计算设备执行时，使得所述计算设备实现第二方面及其可能的实现方式中任一项所述的方法。
在本申请实施例中，涂布模头包括第一模头和第二模头，第一模头和第二模头连接并围设形成狭缝以输出浆料。第一模头包括模头本体，唇口部和唇口调节组件，唇口部与模头本体连接且位于狭缝的出料端，唇口调节组件用于调节唇口部的温度以控制唇口部发生形变。唇口部的温度发生变化时，唇口部可以发生膨胀或收缩，从而唇口部可以产生形变。在使用涂布模头进行涂布的过程中，可以通过唇口调节组件调节唇口部的温度以控制唇口部发生形变，从而可以调节唇口部与被涂布的基材之间的间隙。唇口部与被涂布的基材之间的间隙与涂布的重量、厚度等相关，通过调节唇口部与基材之间的距离可以调节涂布的重量和厚度，进而有利于提高涂布的一致性。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例中所需要使用的附图作简单地介绍，显而易见地，下面所描述的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据附图获得其他的附图。
图1为本申请一实施例的涂布模头的示意图；
图2为本申请一实施例的第一模头的示意图；
图3为本申请一实施例的使用涂布模头进行涂布的示意图；
图4为本申请一实施例的涂布的示意图；
图5为本申请一实施例的涂布模头的示意图；
图6为本申请一实施例的第一模头的侧视图；
图7为本申请一实施例的第一模头的示意图；
图8为本申请一实施例的第一模头的俯视图；
图9为本申请一实施例的唇口调节组件的示意图；
图10为本申请一实施例的涂布装置的示意图；
图11为本申请一实施例的涂布装置的示意图；
图12为本申请一实施例的涂布方法的示意图；
图13为本申请一实施例的涂布方法的流程图；
图14为本申请一实施例的涂布装置的示意图。
在附图中，附图并未按照实际的比例绘制。
具体实施方式
下面结合附图和实施例对本申请的实施方式作进一步详细描述。以下实施例的详细描述和附图用于示例性地说明本申请的原理，但不能用来限制本申请的范围，即本申请不限于所描述的实施例。
在本申请的描述中，需要说明的是，除非另有说明，“多个”的含义是两个以上；术语“上”、“下”、“左”、“右”、“内”、“外”等指示的方位或位置关系仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”、“第三”等仅用于描述目的，而不能理解为指示或暗示相对重要性。“垂直”并不是严格意义上的垂直，而是在误差允许范围之内。“平行”并不是严格意义上的平行，而是在误差允许范围之内。
下述描述中出现的方位词均为图中示出的方向，并不是对本申请的具体结构进行限定。在本申请的描述中，还需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的 普通技术人员而言，可视具体情况理解上述术语在本申请中的具体含义。
本申请中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本申请中字符“/”，一般表示前后关联对象是一种“或”的关系。
随着电池技术的发展，对于电池的要求也越来越高。涂布是生产电池的过程中必不可少的工序，也是影响电池的安全性、容量和一致性的关键工序。在涂布过程中，浆料在一定压力下沿涂布模头的缝隙挤压喷出至基材上，以完成对基材的涂覆。
研究人员经研究发现，现有的涂布模头通过调节模头的唇口与基材之间的距离来调节涂布的厚度。然而，现有的唇口与基材之间的距离，通常通过调节设置在涂布模头上的机械组件，例如螺丝组件，来调节唇口与基材之间的距离。这种调节方式调节精度低，响应时间长，稳定性差，难以满足涂覆的要求。
基于此，本申请提供了一种涂布模头，涂布模头包括第一模头和第二模头,第一模头与第二模头连接并围设形成狭缝以输出浆料。第一涂布模头包括模头本体，唇口部和唇口调节组件，唇口部与模头本体连接且位于狭缝的出料端，唇口调节组件用于调节唇口部的温度以控制唇口部发生形变。这样，唇口部的温度发生变化时，唇口部可以发生膨胀或收缩，从而唇口部可以产生形变。在使用涂布模头进行涂布的过程中，可以通过唇口调节组件调节唇口部的温度以控制唇口部发生形变，从而可以调节唇口部与被涂布的基材之间的间隙。唇口部与被涂布的基材之间的间隙与涂布的重量、厚度等相关，通过调节唇口部与基材之间的距离可以调节涂布的重量和厚度，进而有利于提高涂布的一致性。
图1为本申请一实施例的涂布模头的示意图，图2为本申请一实施例的第一模头的示意图。在本申请一实施例中，如图1和图2所示，涂布模头10包括第一模头11和第二模头12，第一模头11与第二模头12连接并围设形成狭缝13以输出浆料。
第一模头11和第二模头12沿第一方向延伸，第一方向为被涂布的基材的宽度方向，例如，图2中的y方向。
狭缝13平行于第二方向，第二方向为浆料的输出方向，例如图1中的x方向。
可选地，第二方向垂直于第一方向。
第一模头11与第二模头12在第三方向上连接，狭缝13在第三方向上位于第一模头11和第二模头12之间，第三方向与第一方向和第二方向不同。
例如，第三方向垂直于与第二方向平行的平面，例如图1中的z方向。
第一模头11可以与第二模头12直接连接，也可以与第二模头12间接连接。例如，涂布模头10还可以包括垫片，第一模头11通过垫片与第二模头12连接，垫片沿第三方向位于第一模头11和第二模头12之间，第一模头11，垫片和第二模头12形成狭缝13。
第一模头11具有第一配合面101，第二模头12具有第二配合面102，第一配合面101与第二配合面102相互配合以实现第一模头11与第二模头12的连接并形成狭缝13。
如图2所示，第一模头11包括模头本体111，唇口部112和唇口调节组件113。唇口部112与模头本体111连接且位于狭缝13的出料端131，唇口调节组件113用于调节唇口部112的温度以控制唇口部112发生形变。
模头本体111为第一模头11的主体结构，唇口部112与模头本体111连接且位于狭缝13的出料端131。这样，唇口部112沿浆料的输出方向凸出于模头本体111，以便于在唇口部112输出浆料。
可选地，唇口部112与模头本体111可以为一体成型结构。
图3为本申请一实施例的使用涂布模头进行涂布的示意图，图4为本申请一实施例的涂布的示意图。结合图3和图4所示，从狭缝13输出的浆料被涂覆在基材20上，图中的x方向为浆料的输出方向，基材20的宽度方向为垂直于纸面的方向。
唇口部112与狭缝13的在出料端131处的宽度s有关，宽度s为狭缝13的出料端131沿第二方向的尺寸，或者也可以说，宽度s为第一模头11和第二模头12在出料端131处的垂直距离。通过调节宽度s，可以调节浆料的流量等，进而可以调节涂布的一致性。
唇口部112与基材20之间的间隙d与涂布的性能有关，间隙d与涂覆在基材20上的浆料的厚度t成正比。也就是说，唇口部112与基材20之间的间隙d越大，涂覆在基材20上的浆料的厚度t越大，涂布后的基材20的重量越大；唇口部112与基材20之间的间隙d越小，涂覆在基材20上的浆料的厚度t越小，涂布后的基材20的 重量越小。
唇口部112与基材20之间的间隙d可以为唇口部112与基材20之间的垂直距离。
唇口调节组件113用于调节唇口部112的温度，唇口部112的温度发生改变时，唇口部112会相应的发生形变，即膨胀或收缩。例如，在唇口部112为金属材料制成的情况下，当唇口部112的温度升高时，唇口部112沿各个方向均发生膨胀。例如，唇口部112会朝靠近基材20的方向膨胀，从而唇口部112与基材20之间的距离d变小。这样，就可以通过控制唇口部112发生形变，调节唇口部112与基材20之间的距离，从而调节涂布的厚度和重量。再例如，唇口部112还可以朝靠近第二模头12的方向膨胀，从而狭缝13在出料端131处的宽度s变小，从而可以调节浆料的流量，进而可以调节涂布的一致性。
基材20可以为集流体，例如：铜箔、铝箔、复合金属等，也可以为其他材料。以集流体为例，电极活性材料形成的浆料被涂布于集流体的表面，经干燥后形成的膜片可以用作电池极片。电极活性材料分为正极活性材料和负极活性材料，正极活性材料可以是钴酸锂、磷酸铁锂、三元锂或锰酸锂等，负极活性材料可以为碳或硅等。
浆料可以包括活性剂，粘结剂和导电剂等。
唇口部112为热胀冷缩的材料制成，例如唇口部112为金属材料制成。唇口部112发生形变的大小与唇口部112本身的材料有关，可以根据其材料的膨胀系数确定。
可选地，第二模头12设置有唇口调节组件113，唇口调节组件113用于调节第二模头12的唇口部的温度以控制第二模头12的唇口部发生形变。
在本申请实施例中，涂布模头10包括第一模头11和第二模头12，第一模头11和第二模头12连接并围设形成狭缝13以输出浆料。第一模头11包括模头本体111，唇口部112和唇口调节组件113，唇口部112与模头本体111连接且位于狭缝13的出料端131，唇口调节组件113用于调节唇口部112的温度以控制唇口部112发生形变。唇口部112的温度发生变化时，唇口部112可以发生膨胀或收缩，从而唇口部112可以产生形变。在使用涂布模头10进行涂布的过程中，可以通过唇口调节组件113调节唇口部112的温度以控制唇口部112发生形变，从而可以调节唇口部112与被涂布的 基材20之间的距离。唇口部112与被涂布的基材20之间的距离与涂布的重量、厚度等相关，通过调节唇口部112与基材20之间的距离可以调节涂布的重量、厚度等，进而有利于提高涂布的一致性。
图5为本申请一实施例的涂布模头的示意图。可选地，如图5所示，涂布模头10还包括进料腔121和储料腔122，浆料通过进料腔121进入涂布模头10后，流入储料腔122，之后可经由储料腔122进入狭缝13，从而从出料端131输出。
进料腔121和储料腔122可以设置在第二模头12上，也可以设置在第一模头11上，可以根据实际需要具体设置，本申请对此不做具体限制。
图6为本申请一实施例的第一模头的侧视图，图7为本申请一实施例的第一模头的示意图。在本申请一实施例中，结合图2，图6和图7所示，唇口调节组件113包括温控元件1131，温控元件1131设置于唇口部112的表面并用于调节唇口部112的温度。
唇口部112包括第一表面1121和第二表面1122。第一表面1121为第一配合面101的一部分，第一表面1121用于限定狭缝13；第二表面1122与第一表面1121倾斜设置，且二者之间的夹角为锐角，第二表面1122与外界环境接触。
可选地，温控元件1131设置于唇口部112的第二表面1122，这样，便于温控元件1131的安装。
可选地，唇口部112内部设置有空腔，温控元件1131设置于该空腔内。
在该实施例中，唇口部112的表面设置有温控元件1131，这样，便于通过温控元件1131调节唇口部112的温度以控制唇口部112发生形变。相比于通过螺丝组件手动调节唇口部112的形变，该实现方式有利于提升自动化程度以及唇口部112的形变的精度。
可选地，温控元件1131为一个整条的元件，即，温控元件1131的数量为1，且覆盖唇口部112的第二表面1122。这样，便于温控元件1131的安装，有利于减小安装难度。
图8为本申请一实施例的第一模头的俯视图。在本申请一实施例中，结合图2和图8所示，温控元件1131包括沿第一方向设置的多个温控单元1141，多个温控单元1141分别用于调节唇口部112的多个区域的温度，第一方向为被涂布的基材20的宽度方向。
例如，在使用过程中，唇口部112的某一区域的形变与其他区域的形变不一致时，可以通过调节设置在该区域的温控元件1141以调节唇口部112的某一区域的形变。再例如，当某一温控单元1141发生故障时，可以替换该温控单元1141，而不需要替换整个温控元件1131，便于维修。
在该实施例中，通过设置多个温控单元1141，可以根据需要灵活地调节唇口部112的特定区域的温度，从而控制唇口部112的特定区域的形变；此外，还有利于温控元件1131的维修和替换。
可选地，唇口部112为一个连续的结构，即第一模头11的唇口部112的数量为1。在这种情况下，可以通过调节唇口部112的对应设置的温控单元1141调节唇口部112的对应区域的形变。相比于将唇口部112设置为多个部分，将唇口部112设置为一个连续的结构，可以避免在涂布时发生漏料的情况。
可选地，温控元件1131通过粘接的方式设置在唇口部112上。
在本申请一实施例中，温控元件1131为半导体温控元件。
半导体温控元件的加热及冷却的响应时间短，并且具有较高的调节精度，可以快速精确地控制唇口部的形变。
在使用半导体温控元件调节唇口部112的温度时，可以基于比例-积分-微分(Proportion-Integral-Derivative，PID)算法改变半导体温控元件的电流，以控制半导体温控元件的温度。
例如，半导体温控元件内设置有电流换向模块，可以控制电流换向模块以改变半导体温控元件内的电流方向，从而实现对半导体温控元件的温度的控制。例如，半导体温控元件为半导体致冷片(Thermo Electric Cooler，TEC)。
再例如，半导体温控元件内设置有N型元件和P型元件，通过控制电流的方向，例如将电流方向由N型元件流向P型元件改变为由P型元件流向N型元件，可以改变半导体温控元件的发热状况，使其由降温改变为升温，或者由升温改变为降温。
在本申请一实施例中，唇口调节组件113还包括测温传感器1132，测温传感器1132与温控元件113连接以测量温控元件113的温度。
可选地，测温传感器1132为测温探头，测温传感器设置于温控元件1131的表面以测量温控元件113的温度。
可选地，测温传感器1132设置于温控元件1131的内部。
在该实施例中，便于根据测温传感器1132测量到的温控元件1131的温度，确定对温控元件1131进行升温或降温。
图9为本申请一实施例的唇口调节组件的示意图。可选地，在一实施例中，图9示出了唇口调节组件113的最小单元，唇口调节组件113的最小单元包括温控单元1141和测温传感器1132。测温传感器1132可以通过线束组件1133将测量得到的温度发送至控制单元，控制单元根据测量到的温度控制温控单元1141升温或降温。该线束组件1133可以为控制单元的一部分。
可选地，唇口调节组件113包括线束组件1133，也就是说，线束组件1133为唇口调节组件113的一部分。
可选地，控制单元可以为唇口调节组件113的控制器，也可以为包括涂布模头的涂布装置的控制器。
上文结合图1至图9，详细描述了本申请的涂布模头的实施例，下文将详细描述本申请的涂布装置和涂布方法的实施例。涂布模头的实施例与涂布装置和涂布方法的实施例中类似的描述可以参照涂布模头的实施例的描述，在此不再赘述。
图10为本申请一实施例的涂布装置的示意图。如图10所示，本申请提供了一种涂布装置200，包括：上文所述的任一种可能的涂布模头10，涂布测量单元510和控制单元520。涂布测量单元510用于测量被涂布的基材20的已涂布区域的涂布信息并发送涂布信息至控制单元520；控制单元520用于根据涂布信息控制唇口调节组件113调节唇口部112的温度。
涂布测量单元510可以为测厚仪、测重仪、面密度测量仪等。
控制单元520可以为可编程控制器。
图11为本申请一实施例的涂布装置的示意图。如图11所示，在本申请一实施例中，涂布装置200还包括背辊15，背辊15用于支撑基材20，以使涂布模头10对基材20进行涂覆；控制单元520还用于：在涂布信息小于第一预设信息的情况下，控制唇口调节组件113对唇口部112降温，使唇口部112收缩以增大唇口部112与背辊15之间的间隙；在涂布信息大于第一预设信息的情况下，控制唇口调节组件113对唇口部112升温，使唇口部112膨胀以减小唇口部112与背辊15之间的间隙。
在本申请一实施例中，唇口调节组件113包括温控元件1131，温控元件 1131设置于唇口部112的表面并用于调节唇口部112的温度；控制单元520还用于：根据涂布信息，控制温控元件1131调节唇口部112的温度。
在本申请一实施例中，温控元件113包括沿第一方向设置的多个温控单元1141，多个温控单元1141分别用于调节唇口部112的多个区域的温度，第一方向为被涂布的基材20的宽度方向；控制单元520还用于：根据涂布信息，控制多个温控单元1141中的第一温控单元调节唇口部112的多个区域中的第一区域的温度。
在本申请一实施例中，温控元件1131为半导体温控元件；控制单元520还用于：根据涂布信息，调节半导体温控元件的电流，以调节唇口部112的温度。
在本申请一实施例中，唇口调节组件113还包括测温传感器1132，测温传感器1132与温控元件1131连接以测量温控元件1131的温度并将温控元件1131的温度发送至控制单元520；控制单元520还用于：在根据涂布信息控制唇口调节组件113调节唇口部112的温度之前，获取温控元件1131的温度。
在本申请一实施例中，涂布信息包括已涂布区域的涂覆厚度、涂覆宽度和涂覆重量中的至少一个。
图12为本申请一实施例的涂布方法的示意图。如图12所示，本申请实施例提供了一种涂布方法300，应用于涂布装置200，涂布方法300包括以下步骤。
涂布方法300可以由涂布装置200中的控制单元执行。
步骤310，获取被涂布的基材20的已涂布区域的涂布信息。
步骤320，根据涂布信息，控制唇口调节组件113调节唇口部112的温度。
通过步骤320，可以根据已涂布区域的涂布信息，实现当前涂布的自动调节。
在该实施例中，根据已涂布区域的涂布信息，可以判断涂布的厚度、宽度以及一致性等状况，从而便于根据涂布信息及时控制唇口调节组件113调节唇口部112的温度，以控制唇口部112发生形变。
在本申请一实施例中，步骤320包括：在涂布信息小于第一预设信息的情况下，控制唇口调节组件113对唇口部112降温，使唇口部112收缩以增大唇口部112与背辊15之间的间隙d；在涂布信息大于第一预设信息的情况下，控制唇口调节组件113对唇口部112升温，使唇口部112膨胀以减小唇口部112与背辊15之间的间隙d。
在该实施例中，涂布装置200还包括背辊15，背辊15用于支撑基材20， 以使涂布模头10对基材20进行涂覆。
背辊15用于支撑基材20并输送基材20，只要可以实现对基材20的输送和支撑即可，本申请对于背辊15的形状、材质、大小等不作具体限制。
在该实施例中，唇口部112在温度升高时膨胀，在温度降低时收缩。
第一预设信息为预先设置好的涂布的相关信息，例如涂布的厚度、宽度、涂布的重量、涂布后的基材的面密度等。第一预设信息可以提前设置，并存储在涂布装置200的控制单元520或存储单元中。
涂布信息与第一预设信息为同类的信息，例如，都为涂布的厚度。
在该实施例中，通过对比涂布信息和第一预设信息，可以判断涂布的状况，以便于及时调节涂布的策略，例如调节涂布模头10与背辊15之间的间隙。
在本申请一实施例中，步骤320包括：根据涂布信息，控制温控元件1131调节唇口部112的温度。
唇口调节组件113包括温控元件1131，温控元件1131设置于唇口部112的表面并用于调节唇口部112的温度。
这样，便于根据涂布信息，通过温控元件1131调节唇口部112的温度，有利于提升自动化程度。
在本申请一实施例中，步骤320包括：根据涂布信息，控制多个温控单元1141中的第一温控单元调节唇口部112的多个区域中的第一区域的温度。
温控元件1131包括沿第一方向设置的多个温控单元1141，多个温控单元1141分别用于调节唇口部112的多个区域的温度，第一方向为被涂布的基材20的宽度方向。
第一温控单元设置在唇口部112的第一区域，其中，第一温控单元为多个温控单元1141中的任意一个温控单元。
在该实施例中，可以通过温控单元1141灵活地调节唇口部112的某一区域的温度，从而实现唇口部112的某一区域的形变。
在本申请一实施例中，温控元件1131为半导体温控元件。步骤320包括：根据涂布信息，调节半导体温控元件的电流，以调节唇口部112的温度。
半导体温控元件的加热及冷却的响应时间短，并且具有较高的调节精度，在0.1℃左右，可以快速精确地控制唇口部的形变。此外，半导体温控元件具有较大的 温度调节范围，温度调节范围在-60～300℃，能够兼顾调节范围和调节精度。
可选地，温控元件1131还可以为电阻或热电偶。
可选地，在步骤320中，可以根据涂布信息和第一预设信息，确定是否需要控制唇口部112发生形变。例如，根据第一预设信息和涂布信息的差值，计算唇口部112需要发生的形变的值，之后，根据形变的值计算温控元件需要调整的温度T1。唇口部112的形变的值与唇口部112的材料的膨胀系数相关。
在已涂布区域的涂布信息小于第一预设信息的情况下，例如，已涂布区域的涂布厚度小于预设的涂布厚度，需要控制唇口部112发生收缩以增大唇口部112与背辊15之间的间隙。此时，需要控制温控元件1131从当前温度T0进行降温，降低的温度值T1，以使唇口部112收缩。
类似地，在已涂布区域的涂布信息大于第一预设信息的情况下，例如，已涂布区域的涂布厚度大于预设的涂布厚度，需要控制唇口部112发生膨胀以减小唇口部112与背辊15之间的间隙。此时，需要控制温控元件1131从当前温度T0升温，升高的温度值为T1，以使唇口部112膨胀。
在本申请一实施例中，在步骤320之前，方法300还包括：获取温控元件1131的温度。
唇口调节组件113还包括测温传感器1132，测温传感器1132与温控元件1131连接以测量温控元件1131的温度并将该温度值发送至控制单元520。
在该实施例中，在步骤320之前获取温控元件1131的温度，便于控制单元520根据温控元件1131的当前温度T0以及需要调节的温度T1，控制温控元件1131升温或降温。
可选地，在方法300中，可以实时获取温控元件1131的温度，以便于及时确定温控元件1131的温度是否满足使唇口部112发生相应形变的要求。
在本申请一实施例中，涂布信息包括已涂布区域的涂覆厚度、涂覆宽度和涂覆重量中的至少一个。这样，便于通过测量装置测量涂布信息，从而便于涂布信息的获取。
图13为本申请一实施例的涂布方法的流程图。如图13所示，涂布方法包括以下步骤。
步骤410，获取被涂布的基材的已涂布区域的涂布信息。
步骤420，判断涂布信息是否小于第一预设信息。
在涂布信息小于第一预设信息的情况下，执行步骤430；在涂布信息不小于第一预设信息的情况下，执行步骤440。
步骤430，控制温控元件1131对唇口部112降温。
在步骤420之后和步骤430之前，可以根据涂布信息与第一预设信息的差值，计算温控元件1131的需要降温的具体数值。
在步骤430中，通过控制温控元件1131对唇口部112降温，这样，唇口部112的温度降低，唇口部112发生收缩，从而唇口部112与背辊15之间的间隙变大，涂布的厚度变大。
步骤440，判断涂布信息是否大于第一预设信息。
在涂布信息大于第一预设信息的情况下，执行步骤450。
步骤450，控制温控元件1131对唇口部112升温。
在步骤440之后和步骤450之前，可以根据涂布信息与第一预设信息的差值，计算温控元件1131的需要升温的具体数值。
在步骤450中，通过控制温控元件1131对唇口部112升温，这样，唇口部112的温度升高，唇口部112发生膨胀，从而唇口部112与背辊15之间的间隙变小，涂布的厚度变小。
在涂布方法中，步骤420和步骤440可以同步进行，可以先执行步骤420，也可以先执行步骤440。
在步骤430或步骤450之后，返回步骤410。这样，可以实时监控并调整涂布的厚度等，便于及时调整涂布策略，有利于提高涂布的一致性。
图14为本申请一实施例的涂布装置的示意图。如图14所示，本申请实施例提供了一种涂布装置600，包括：存储器610，用于存储计算机可执行指令；处理器620，用于访问存储器610，并执行计算机可执行指令，以进行根据前述实施例中任一项的涂布方法中的操作。
本申请实施例的处理器620可以是一种集成电路芯片，具有信号的处理能力。在实现过程中，上述方法实施例的各步骤可以通过处理器中的硬件的集成逻辑电路或者软件形式的指令完成。上述的处理器可以是通用处理器、数字信号处理器(Digital Signal Processor，DSP)、专用集成电路(Application Specific Integrated  Circuit，ASIC)、现成可编程门阵列(Field Programmable Gate Array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件。可以实现或者执行本申请实施例中的公开的各方法和步骤。通用处理器可以是微处理器或者该处理器也可以是任何常规的处理器等。结合本申请实施例所公开的方法的步骤可以直接体现为硬件译码处理器执行完成，或者用译码处理器中的硬件及软件模块组合执行完成。软件模块可以位于随机存储器，闪存、只读存储器，可编程只读存储器或者电可擦写可编程存储器、寄存器等本领域成熟的存储介质中。该存储介质位于存储器，处理器读取存储器中的信息，结合其硬件完成上述方法的步骤。
本申请实施例的存储器610可以是易失性存储器或非易失性存储器，或可包括易失性和非易失性存储器两者。其中，非易失性存储器可以是只读存储器(Read-Only Memory，ROM)、可编程只读存储器(Programmable ROM，PROM)、可擦除可编程只读存储器(Erasable PROM，EPROM)、电可擦除可编程只读存储器(Electrically EPROM，EEPROM)或闪存。易失性存储器可以是随机存取存储器(Random Access Memory，RAM)，其用作外部高速缓存。通过示例性但不是限制性说明，许多形式的RAM可用，例如静态随机存取存储器(Static RAM，SRAM)、动态随机存取存储器(Dynamic RAM，DRAM)、同步动态随机存取存储器(Synchronous DRAM，SDRAM)、双倍数据速率同步动态随机存取存储器(Double Data Rate SDRAM，DDR SDRAM)、增强型同步动态随机存取存储器(Enhanced SDRAM，ESDRAM)、同步连接动态随机存取存储器(Synchlink DRAM，SLDRAM)和直接内存总线随机存取存储器(Direct Rambus RAM，DR RAM)。应注意，本文描述的系统和方法的存储器旨在包括但不限于这些和任意其它适合类型的存储器。
本申请实施例提供了一种存储介质，用于存储计算机程序，当计算机程序被计算设备执行时，使得计算设备实现前述实施例中任一项的涂布方法。
虽然已经参考优选实施例对本申请进行了描述，但在不脱离本申请的范围的情况下，可以对其进行各种改进并且可以用等效物替换其中的部件。尤其是，只要不存在结构冲突，各个实施例中所提到的各项技术特征均可以任意方式组合起来。本申请并不局限于文中公开的特定实施例，而是包括落入权利要求的范围内的所有技术方案。

Claims (14)

  1. 一种涂布模头(10)，其特征在于，包括：
    第一模头(11)和第二模头(12)，所述第一模头(11)与所述第二模头(12)连接并围设形成狭缝(13)以输出浆料；
    所述第一模头(11)包括模头本体(111)、唇口部(112)和唇口调节组件(113)；其中，
    所述唇口部(112)与所述模头本体(111)连接且位于所述狭缝(13)的出料端(131)；
    所述唇口调节组件(113)用于调节所述唇口部(112)的温度以控制所述唇口部(112)发生形变。
  2. 根据权利要求1所述的涂布模头(10)，其特征在于，所述唇口调节组件(113)包括温控元件(1131)，所述温控元件(1131)设置于所述唇口部(112)的表面并用于调节所述唇口部(112)的温度。
  3. 根据权利要求2所述的涂布模头(10)，其特征在于，所述温控元件(1131)包括沿第一方向设置的多个温控单元(1141)，所述多个温控单元(1141)分别用于调节所述唇口部(112)的多个区域的温度，所述第一方向为被涂布的基材(20)的宽度方向。
  4. 根据权利要求2或3所述的涂布模头(10)，其特征在于，所述温控元件(1131)为半导体温控元件。
  5. 根据权利要求2-4中任一项所述的涂布模头(10)，其特征在于，所述唇口调节组件(113)还包括测温传感器(1132)，所述测温传感器(1132)与所述温控元件(1131)连接以测量所述温控元件(1131)的温度。
  6. 一种涂布装置(200)，其特征在于，包括：如权利要求1所述的涂布模头(10)，涂布测量单元(510)和控制单元(520)；
    所述涂布测量单元(510)用于测量被涂布的基材(20)的已涂布区域的涂布信息并发送所述涂布信息至所述控制单元(520)；
    所述控制单元(520)用于根据所述涂布信息控制所述唇口调节组件(113)调节所述唇口部(112)的温度。
  7. 根据权利要求6所述的涂布装置(200)，其特征在于，所述涂布装置(200)还包括背辊(15)，所述背辊(15)用于支撑所述基材(20)，以使所述涂布模头(10)对所述基材(20)进行涂覆；
    所述控制单元(520)还用于：
    在所述涂布信息小于第一预设信息的情况下，控制所述唇口调节组件(113)对所述唇口部(112)降温，使所述唇口部(112)收缩以增大所述唇口部(112)与所述背辊(15)之间的间隙；
    在所述涂布信息大于所述第一预设信息的情况下，控制所述唇口调节组件(113)对所述唇口部(112)升温，使所述唇口部(112)膨胀以减小所述唇口部(112)与所述背辊(15)之间的间隙。
  8. 一种涂布方法(300)，其特征在于，应用于涂布装置(200)，所述涂布装置(200)包括：如权利要求1所述的涂布模头(10)，所述方法包括：
    获取被涂布的基材(20)的已涂布区域的涂布信息；
    根据所述涂布信息，控制所述唇口调节组件(113)调节所述唇口部(112)的温度。
  9. 根据权利要求8所述的涂布方法(300)，其特征在于，所述根据所述涂布信息控制所述唇口调节组件(113)调节所述唇口部(112)的温度，包括：
    在所述涂布信息小于第一预设信息的情况下，控制所述唇口调节组件(113)对所述唇口部(112)降温，使所述唇口部(112)收缩以增大所述唇口部(112)与支撑所述基材(20)的背辊(15)之间的间隙；
    在所述涂布信息大于所述第一预设信息的情况下，控制所述唇口调节组件(113)对所述唇口部(112)升温，使所述唇口部(112)膨胀以减小所述唇口部(112)与所述背辊(15)之间的间隙。
  10. 根据权利要求8或9所述的涂布方法(300)，其特征在于，所述根据所述涂布信息控制所述唇口调节组件(113)调节所述唇口部(112)的温度，包括：
    根据所述涂布信息，控制所述唇口调节组件(113)的温控元件(1131)调节所述唇口部(112)的温度。
  11. 根据权利要求10所述的涂布方法(300)，其特征在于，所述根据所述涂布信息控制所述唇口调节组件(113)调节所述唇口部(112)的温度，包括：
    根据所述涂布信息，控制所述温控元件(1131)的多个温控单元(1141)中的第一温控单元(1141)调节所述唇口部(112)的多个区域中的第一区域的温度，所述多个温控单元(1141)沿第一方向设置，所述第一方向为被涂布的基材(20)的宽度方向。
  12. 根据权利要求10或11所述的涂布方法(300)，其特征在于，所述温控元件(1131)为半导体温控元件；
    所述根据所述涂布信息控制所述唇口调节组件(113)调节所述唇口部(112)的温度，包括：
    根据所述涂布信息，基于比例-积分-微分算法调节所述半导体温控元件的电流，以调节所述唇口部(112)的温度。
  13. 根据权利要求10-12中任一项所述的涂布方法(300)，其特征在于，在所述根据所述涂布信息控制所述唇口调节组件(113)调节所述唇口部(112)的温度之前，所述方法还包括：
    获取所述温控元件(1131)的温度。
  14. 根据权利要求8-13中任一项所述的涂布方法(300)，其特征在于，所述涂布信息包括所述已涂布区域的涂覆厚度、涂覆宽度和涂覆重量中的至少一个。
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TW202102310A (zh) * 2019-03-28 2021-01-16 日商尼康股份有限公司 塗布裝置、以及噴頭單元
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CN202490752U (zh) * 2012-03-20 2012-10-17 泉州新日成热熔胶设备有限公司 一种可调节出胶量的狭缝式涂布模具
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